TWI534437B - Electronic device testing equipment for integrated high and low temperature test and its detection method - Google Patents

Description

Electronic component testing device integrating high and low temperature test and detection method thereof

The invention relates to an electronic component detecting device and a detecting method thereof for integrating high and low temperature testing, in particular to an electronic component detecting device suitable for high temperature, normal temperature and low temperature testing.

In general, electronic components are inevitably operated in extreme weather conditions, such as low-temperature cold zone climates or high-temperature tropical climates. However, when the electronic components are in a high temperature or low temperature state, whether they can operate normally is one of the focuses of electronic component manufacturers and the general consumer.

Furthermore, in order to test whether electronic components can operate normally under different temperature environments, the testers of electronic components have developed the relevant testing equipment with great enthusiasm. Please refer to FIG. 5 together. FIG. 5 is a conventional electronic component low temperature detecting device. As shown in the figure, in the lower left side of the figure, there is a component carrying tray 80 to be tested, which carries a plurality of electronic components E to be tested, and a carrying device (not shown) responsible for carrying the electronic component E to be tested will be treated. The electronic component E is transported to a feed shuttle 81. Next, the incoming shuttle 81 moves below a test station 82, while the first and second transfer arms 83, 84 carry the electronic component E to the sliding transfer devices 85, 86 above the test station 82. Then, the slide transfer devices 85, 86 move into the pre-cooling zones 90, 91 to lower the temperature of the electronic component E.

Next, when the temperature of the electronic component E drops to a predetermined temperature, the sliding transfer devices 85, 86 move to a position above the test station 82, and the first and second transfer arms 83, 84 place the cooled electronic component E on Test station 82 and test it. When the test is completed, the first and second transfer arms 83, 84 carry the measured electronic component E to the discharge shuttle 87 again, and the discharge shuttle 87 leaves the test station 82 and moves to be adjacent to The component carrier disk 88 is measured and the measured electronic component E is transported to the component carrier disk 88 by a handling device (not shown).

It can be seen that in the above-mentioned conventional electronic component low-temperature detecting device, a considerable number of transfer devices are required, including a handling device for the wafer to be tested, a handling device for measuring the wafer, a feeding shuttle 81, first and second. The transport arms 83, 84, the sliding transfer devices 85, 86, and the delivery shuttle 87, etc., not only cause the cost of the present, but also the excessive handling process prolongs the entire test time course and improves the handling. The chance of damage to electronic components caused by carelessness. Furthermore, the load carrying capacity of the pre-cooling zones 90, 91 is also limited due to the transfer device relationship. Moreover, the entire equipment is divided into two places by the two pre-cooling zones 90, 91, and the cooling pipeline is pulled too long, which may affect the cooling efficiency.

The main object of the present invention is to provide an electronic component detecting device and a detecting method thereof for integrating high and low temperature testing, which can significantly simplify the hardware requirements of the wafer handling device, simplify the handling steps in the wafer testing process, and effectively shorten the wafer. Carrying distances to greatly improve the overall test efficiency.

Another object of the present invention is to provide an integrated high and low temperature The tested electronic component detecting device and the detecting method thereof can greatly increase the number of temperature-controlled wafers by directly feeding the wafer carrying tray to be tested into the temperature control region and temperature-regulating the wafer through the wafer temperature control module , thereby improving detection efficiency. Moreover, the wafer temperature control module of the present invention is simply disposed in a temperature control zone, which can effectively simplify the pipeline of the temperature control fluid and improve the temperature regulation efficiency of the wafer.

In order to achieve the above object, an electronic component detecting device for integrating high and low temperature testing includes: a temperature control zone, a detection zone, a carrier tray conveying device, a feed carrier, a discharge carrier, and A wafer handling device. Wherein, a temperature control module is disposed in the temperature control zone; a test station is disposed in the detection zone; the carrier disk transport device is configured to transport a wafer carrier disk to be tested to the temperature control zone, and the wafer carrier disk to be tested is carried At least one wafer; the infeed carrier carries at least one wafer between the detection zone and the temperature control zone; the discharge carrier carries at least one wafer away from the detection zone; and the wafer handling device carries at least one wafer Between the wafer carrier to be tested and the wafer temperature control module, between the wafer temperature control module and the incoming carrier, between the incoming carrier and the test station, and between the test station and the discharge carrier Between the deliverers. Accordingly, the arrangement of the present invention can not only simplify the wafer handling process, increase the number of temperature-controlled wafers, and shorten the temperature control fluid pipeline, and the wafer temperature control module in the temperature control region of the present invention can realize various types. Temperature control, including high temperature, low temperature, and room temperature.

Preferably, the temperature control zone of the present invention is further provided with a drying module for driving the air humidity inside the temperature control zone to be lower than the air humidity outside the temperature control zone. However, the setting of this drying module is mainly Avoid condensation or even ice on the wafer or temperature control area during low temperature testing.

Furthermore, the wafer handling apparatus of the present invention may include a first pick-and-place mechanism and a second pick-and-place mechanism; wherein the first pick-and-place mechanism is disposed in the temperature control zone and is configured to carry at least one wafer on the wafer to be tested a carrier tray, a wafer temperature control module, and a feed carrier; and a second pick and place mechanism disposed in the detection area for carrying at least one wafer on the infeed carrier, the test station, and the discharge carrier Between the deliverers. In other words, the present invention can be provided with separate pick-and-place mechanisms in the temperature control zone and the detection zone to improve the overall test efficiency.

In addition, the feed carrier and the discharge carrier of the present invention can be respectively moved to the corresponding two sides or the same side of the test bench. In addition, the wafer temperature control module of the present invention may include a temperature control platform and a temperature control pressure block, and the temperature control pressure block is disposed above the temperature control platform and can be moved up and down to approach or away from the temperature control platform. Accordingly, the present invention can control the temperature of the wafer by means of a temperature control platform and a temperature-controlled compact block to sandwich the wafer to improve the efficiency of temperature control.

Furthermore, the feed carrier and the discharge carrier of the present invention may each include a temperature adjustment unit for regulating or maintaining at least one wafer carried by the feed carrier and the discharge carrier. temperature. In other words, the present invention can not only use the wafer temperature control module to raise or lower the temperature of the wafer, but the feed carrier can also maintain the temperature of the wafer through the temperature adjustment unit, and the discharge carrier can also pass through the temperature adjustment unit. The wafer is returned to temperature.

In order to achieve the foregoing object, the present invention integrates high and low temperature measurement The method for detecting an electronic component includes the following steps: firstly, providing a wafer carrier to be tested to a temperature control zone, wherein the wafer carrier to be tested carries at least one wafer and regulates the temperature of at least one of the wafers; Loading at least one wafer to a feed carrier; then, the feed carrier transports at least one wafer to a detection zone, and a test station is disposed in the detection zone; and at least one wafer is transferred to the test bench, and The test is performed; and, after the test is completed, at least one wafer is transferred from the test station to a discharge carrier. Accordingly, the detection method provided by the present invention can effectively reduce the transfer step of wafer detection and greatly improve the detection efficiency.

The temperature control zone of the present invention may be provided with a wafer temperature control module; and the temperature control step of the wafer may be performed by a wafer temperature control module. In addition, the detection area of the present invention may be provided with two pick-and-place devices, and each pick-and-place device sequentially performs at least one wafer transfer to the test station, and transfers at least one wafer to a discharge load from the test station. The steps of the transmitter. Accordingly, the present invention can significantly improve the detection efficiency by cyclically replacing the pick-and-place and transfer by the two pick-and-place devices.

Preferably, when at least one wafer is transferred to the test bench and tested, the pick-and-place device waits for the test on the test bench before the subsequent transfer operation. In other words, the pick-and-place device of the present invention adopts a coherent action, and the wafer is transferred from the material carrier to the test bench for testing, and the same or the same batch of wafers are transferred to the discharge carrier. Thereby simplifying the wafer mounting process. In addition, when one of the pick-and-place devices transfers at least one wafer to the test station, the other pick-and-place device transfers at least one wafer to a discharge carrier from the test station. Accordingly, the transfer operation between the two pick-and-place devices of the present invention is mutually connected and alternated, and the package can be made Including the feed carrier, the test bench, and the discharge carrier reduce the idle waiting time to greatly improve the detection efficiency.

[study]

80‧‧‧Parts to be tested

81‧‧‧Intake shuttle

82‧‧‧ test station

83‧‧‧First carrying arm

84‧‧‧Second carrying arm

85, 86‧‧‧Sliding transfer device

87‧‧‧Output shuttle

88‧‧‧Measured component carrier

90, 91‧‧‧Pre-cooling zone

E‧‧‧Electronic components to be tested

[this creation]

1‧‧‧temperature control area

11‧‧‧ wafer temperature control module

110‧‧‧temperature control platform

111‧‧‧temperature control compact

12‧‧‧Drying module

2‧‧‧Loading tray conveying device

3‧‧‧ wafer carrier to be tested

31‧‧‧Measured wafer carrier

4‧‧‧Detection area

41‧‧‧ test bench

411‧‧‧ test seat

5‧‧‧Feed carrier

6‧‧‧Discharge carrier

51, 61‧‧‧ Temperature adjustment unit

7‧‧‧ wafer handling device

71‧‧‧First pick and place mechanism

711‧‧ ‧ nozzle

72‧‧‧Second pick and place mechanism

721, 722‧‧‧ pick and place device

C‧‧‧ wafer

Sa‧‧ classified area

1 is a top plan view of a first preferred embodiment of the present invention.

Figure 2 is a side elevational view of a temperature control zone in accordance with a first preferred embodiment of the present invention.

Figure 3 is a side elevational view of the detection zone of the first preferred embodiment of the present invention.

Figure 4 is a top plan view of a second preferred embodiment of the present invention.

Fig. 5 is a conventional low temperature detecting device for electronic components.

The electronic component detecting device and the detecting method thereof for integrating the high and low temperature test of the present invention are described in detail in the present embodiment, and it is to be noted that in the following description, like elements will be denoted by the same reference numerals.

1 and FIG. 2, FIG. 1 is a top plan view of a first preferred embodiment of the present invention, and FIG. 2 is a side view of a temperature control zone 1 of a first preferred embodiment of the present invention. The figure shows a temperature control zone 1 in which a two-wafer temperature control module 11 and a drying module 12 are disposed. The temperature control module 11 includes a temperature control platform 110 and a temperature control block 111, and the temperature control block 111 is disposed above the temperature control platform 110 and can be lifted to approach or away from the temperature control. The platform 110 and the wafer are temperature-controlled by the temperature control platform 110 and the temperature-controlled compact block 111 to increase the efficiency of the temperature control. In this embodiment, the temperature control platform 110 and the temperature control block 111 may include a heater and/or a cooler, such as a resistance heater or a Thermo Electric Cooling (TEC). but The present invention is not limited thereto, and may be subjected to a normal temperature test; in other words, the present invention can perform three kinds of temperature state tests, including high temperature, normal temperature, and low temperature tests.

Furthermore, in the present embodiment, the drying module 12 includes a dry gas supply device for supplying dry gas into the temperature control zone 1 to drive the air humidity inside the temperature control zone 1 to be lower than the temperature control zone 1 Air humidity. However, the setting of the drying module 12 is mainly to prevent condensation or even freezing of the parts in the wafer C or the temperature control zone 1 in response to the low temperature test. In addition, as shown in the figure, there is a carrier tray transporting device 2 for transporting a wafer carrier disk 3 to be tested into the temperature control zone 1, and the wafer carrier disk 3 to be tested carries a plurality of wafers C. In the present embodiment, the carrier tray transport device 2 can be a conveyor belt, a conveyor track, or other equivalent carrier device.

In addition, as shown in FIG. 1, a feed carrier 5 can carry the wafer C between the detection zone 4 and the temperature control zone 1, and a discharge carrier 6 can carry the wafer C that has been tested. Leave the detection zone 4 and go to a classification area Sa. The feed carrier 5 and the discharge carrier 6 respectively include a temperature adjustment unit 51, 61 for regulating or maintaining the wafer C carried by the feed carrier 5 and the discharge carrier 6. The temperature. For example, if the embodiment is to perform the low temperature test, the temperature adjusting unit 51 of the feeding carrier 5 can be a cooler to ensure that the wafer C remains in the carrying process of the infeed carrier 5. The originally scheduled temperature; on the other hand, the discharge carrier 6 can be a heater so that the tested wafer C can be warmed up as soon as possible.

Further, a test stand 41 is provided in the detection zone 4 of the present invention, which includes three test sockets 411 for mainly placing the wafer C and performing wafer inspection. However, the feed carrier 5 and the discharge carrier of the embodiment The 6 series are respectively moved on the corresponding two sides of the test stand 41, that is, the feed carrier 5 and the discharge carrier 6 are respectively disposed on the upper and lower sides of the test stand 41. In addition, the classification area Sa includes a plurality of wafer carrier trays 31 and a sorting and picking device (not shown). The wafer carrier tray 31 may include a good wafer carrier tray and a defective wafer carrier tray.

That is to say, the sorting and picking device (not shown) in the sorting area Sa can classify the wafer C into the measured wafer carrier 31 according to the detection result. In this case, it is particularly worth mentioning that the temperature control area 1, the detection area 4, and the classification area Sa are all virtual areas on the machine platform in this embodiment, and there is no obvious physical space division; however, the present invention Not limited to this, an outer cover can also be provided on the temperature control zone 1 to maintain good temperature control effect and drying effect.

Referring to FIG. 1, FIG. 2 and FIG. 3 together, FIG. 3 is a side view of the detection area of the first preferred embodiment of the present invention. As shown in the figure, in the present embodiment, the wafer transfer device 7 includes a first pick-and-place mechanism 71 and a second pick-and-place mechanism 72. The first pick-and-place mechanism 71 is disposed in the temperature control zone 1 and is used to carry the wafer C between the wafer carrier 3 to be tested, the wafer temperature control module 11 , and the incoming carrier 5 . Further, the first pick-and-place mechanism 71 is responsible for taking out and transporting the wafer C from the wafer carrier 3 to be tested to the wafer temperature control module 11, and the wafer C from the wafer temperature control module after being temperature-controlled. 11 is transported to the feed carrier 5. However, the first pick-and-place mechanism 71 shown in FIG. 2 includes only one nozzle 711. However, the present invention is not limited thereto, and a plurality of sets of nozzles 711 may be provided to increase the number of pick-and-place.

Moreover, the second pick-and-place mechanism 72 is disposed in the detection area 4, The second pick-and-place mechanism 72 includes two pick-and-place devices 721, 722, and the two pick-and-place devices 721, 722 are used to carry the wafer C in turn on the infeed carrier 5, the test station 41, and the discharge carrier. Between 6. Further, the second pick-and-place mechanism 72 is responsible for taking out the wafer C from the material carrier 5 and transporting it into the test socket 411 of the test bench 41, and testing the wafer C that has been tested from the test bench 41. The 411 is transported to the discharge carrier 6.

The detection flow of the first preferred embodiment of the present invention will be described in detail below. First, the carrier tray transporting device 2 transports a wafer carrier tray 3 to be tested into a temperature control zone 1, and the first pick-and-place mechanism 71 takes out the wafer C from the wafer carrier tray 3 to be tested and transports it to the wafer temperature control module 11 The wafer C is temperature-regulated, such as heated or cooled, by the wafer temperature control module 11. When the wafer reaches a predetermined temperature, the first pick-and-place mechanism 71 transports the temperature-controlled wafer C from the wafer temperature control module 11 to the feed carrier 5.

Next, the feed carrier 5 carries the wafer C into the detection zone 4. At this time, the temperature adjustment unit 51 of the feed carrier 5 continuously cools the wafer C so that the wafer does not return to temperature during the transfer process. Then, the pick-and-place device 721 transfers the wafer C to the test socket 411 on the test stand 41, and the test stand 41 starts the test, and the pick-and-place device 721 waits on the test stand 41. Preferably, the pick-and-place device 721 acts as a crimping mechanism at this time to press against the wafer C to ensure that the wafer C is indeed in electrical contact with the contacts on the test station 41. After the test is completed, the pick-and-place device 721 removes the wafer C from the test socket 411 of the test stand 41 to the discharge carrier 6, and the discharge carrier 6 transfers the measured wafer to the sorting area Sa for sorting. Of course, the temperature adjustment unit 51 of the discharge carrier 6 will be responsible for the partial temperature recovery of the wafer C during the transfer process.

In this embodiment, when the pick-and-place device 721 and the pick-and-place device The 722 system is set to perform the transfer task in sequence in a staggered manner. That is, when the test is completed and the pick-and-place device 722 is responsible for removing the wafer C from the test socket 411 of the test stand 41 to the discharge carrier 6, the other pick-and-place device 721 is responsible for carrying the wafer C from the incoming material. The device 5 is transferred to the test socket 411 on the test stand 41. In addition, when the wafer C transported by the pick-and-place device 721 is being tested, the pick-and-place device 722 places the wafer C on the discharge carrier 6 and then moves to the feed carrier 5 to absorb the test sample. The wafer C is ready to be moved to the test station 41 for testing. Accordingly, the two pick-and-place devices 721, 722 are cyclically replaced for pick-and-place and transfer without any idle waiting time, which can significantly improve the detection efficiency.

Please refer to FIG. 4 again. FIG. 4 is a top plan view of a second preferred embodiment of the present invention. As shown in the figure, the main difference between the second embodiment of the present invention and the first embodiment is that the material carrier 5 and the discharge carrier 6 of the first embodiment are disposed on the test bench 41, The lower two sides, and the feed carrier 5 of the second embodiment are provided on the upper side of the test stand 41 in the same manner as the discharge carrier 6. In other words, in the second embodiment, the feed carrier 5 and the discharge carrier 6 respectively move the same side of the test stand 41, whereby the feed carrier 5 and the discharge carrier 6 can share one Carrying the track, in addition to reducing hardware costs, can also simplify the machine configuration.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1‧‧‧temperature control area

11‧‧‧ wafer temperature control module

12‧‧‧Drying module

2‧‧‧Loading tray conveying device

3‧‧‧ wafer carrier to be tested

31‧‧‧Measured wafer carrier

4‧‧‧Detection area

41‧‧‧ test bench

411‧‧‧ test seat

5‧‧‧Feed carrier

6‧‧‧Discharge carrier

51, 61‧‧‧ Temperature adjustment unit

C‧‧‧ wafer

Sa‧‧ classified area

Claims (12)

An electronic component detecting device integrating high and low temperature testing comprises: a temperature control zone in which a wafer temperature control module is disposed; a detection zone in which a test bench is disposed; and a carrier disk conveying device for conveying a wafer carrier to be tested to the temperature control zone, the wafer carrier to be tested carries at least one wafer; a feed carrier carrying the at least one wafer in the detection zone and the temperature control zone a discharge carrier that carries the at least one wafer away from the detection zone; and a wafer transfer device for carrying the at least one wafer on the wafer carrier to be tested and the wafer temperature control module Between the wafer temperature control module and the feed carrier, between the feed carrier and the test station, and between the test station and the discharge carrier. The electronic component testing device for integrating high and low temperature testing according to claim 1, wherein the temperature control zone is further provided with a drying module for driving the air humidity inside the temperature control zone to be lower than the temperature. Air humidity outside the control area. The electronic component testing device for integrating high and low temperature testing according to the first aspect of the invention, wherein the wafer handling device comprises a first pick-and-place mechanism and a second pick-and-place mechanism; the first pick-and-place mechanism is disposed on The temperature control area is configured to carry the at least one wafer between the wafer carrier to be tested, the wafer temperature control module, and the infeed carrier; the second pick and place mechanism is disposed in the detection area And used to carry the at least one The wafer is between the infeed carrier, the test station, and the discharge carrier. The electronic component testing device for integrating high and low temperature testing according to claim 1, wherein the infeed carrier and the discharge carrier are respectively moved on opposite sides of the test bench. The electronic component testing device for integrating high and low temperature testing according to claim 1, wherein the loading carrier and the discharging carrier respectively move the same side of the testing platform. The electronic component testing device for integrating high and low temperature testing according to claim 1, wherein the wafer temperature control module comprises a temperature control platform and a temperature control pressure block, wherein the temperature control pressure block is set at the temperature Above the control platform and can be raised and lowered to approach or away from the temperature control platform. The electronic component testing device for integrating high and low temperature testing according to claim 1, wherein the feeding carrier and the discharging carrier respectively comprise a temperature adjusting unit for regulating or maintaining the feeding The temperature of the at least one wafer carried by the carrier and the discharge carrier. An electronic component detecting method for integrating high and low temperature testing includes the following steps: (A) providing a wafer carrier to be tested to a temperature control zone, the wafer carrier to be tested carrying at least one wafer, and regulating the at least one wafer (B) transferring the at least one wafer to a feed carrier; (C) the feed carrier transporting the at least one wafer to a detection zone, wherein a test station is disposed in the detection zone; Transferring the at least one wafer to the test bench and testing; And (E) after the test is completed, transferring the at least one wafer to the discharge carrier from the test bench. An electronic component detecting method for integrating high and low temperature testing according to claim 8 is characterized in that: a temperature control module is disposed in the temperature control region; and the step (A) is controlled by the wafer temperature control module. The temperature of a wafer. An electronic component detecting method for integrating high and low temperature testing according to claim 8 of the patent application, wherein the detecting area is provided with two pick and place devices, and each of the picking and placing devices sequentially performs the step (D) and the step ( E). An electronic component detecting method for integrating high and low temperature testing according to claim 10, wherein in the step (D), when the two pick and place devices transfer the at least one wafer to the test bench, Step (E) is performed after waiting for the test on the test bench. An electronic component detecting method for integrating high and low temperature testing according to claim 11, wherein when one of the pick-and-place devices is in the step (D), the other pick-and-place device performs the step (E).