WO2006075391A1

WO2006075391A1 - Electronic component testing apparatus

Info

Publication number: WO2006075391A1
Application number: PCT/JP2005/000412
Authority: WO
Inventors: Makoto Sagawa; Hisao Hayama; Toshio Goto
Original assignee: Advantest Corporation
Priority date: 2005-01-14
Filing date: 2005-01-14
Publication date: 2006-07-20
Also published as: TW200632344A; TWI388855B

Abstract

An electronic component testing apparatus is provided for testing an IC device (IC) by pressing the IC device (IC) to a contact part (310) of a test head (300). The electronic component testing apparatus is provided with a pusher (20) for moving the IC device (IC) close to and apart from the contact part (310). The pusher (20) is provided with a plurality of pressing parts (23a) for pressing one IC device (IC) at a multitudes of points and presses the IC device (IC) by being deformed to follow the upper plane shape of the IC device (IC).

Description

Specification

Electronic component testing equipment

Technical field

The present invention relates to an electronic component test apparatus for testing various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices typically).

Background art

[0002] In an electronic component testing apparatus called a handler, a large number of IC devices accommodated in a tray are transported into a rack and applied to each IC device while applying high or low temperature stress. The input / output terminals are brought into electrical contact with the contact portion of the test head, and the electronic component test apparatus main body (hereinafter also referred to as a tester) performs the test. When the test is completed, each IC device is also delivered with the test head power and placed on the tray, so that it is sorted into non-defective products, defective products, and categories.

[0003] Generally, an electronic component test apparatus (hereinafter also referred to as a memory IC test apparatus) that is a test target of an IC device for memory (hereinafter also referred to as a memory IC) that requires a relatively long test time. In order to secure a large number of simultaneous measurements, such as 32 and 64, the electronic component test starts from a tray (hereinafter also referred to as a customer tray) for storing the pre-test Z-tested memory IC. A large number of memory ICs are placed on the tray (hereinafter also referred to as a test tray) that is circulated through the equipment before the test, and the memory ICs are mounted on the test tray while the memory ICs are mounted on the test tray. The test is performed by pressing the test head simultaneously with the pusher. After the test, the memory IC is transferred to the customer tray according to the test result. In the memory IC testing apparatus configured as described above, when the memory IC is pressed against the test head, the pressing force of the pusher is in surface contact with the upper surface of the memory IC.

[0004] Also, an electronic component test device (hereinafter referred to as a logic IC test device) intended for a logic IC device (hereinafter also referred to as a logic IC) that requires a shorter test time than a memory IC. )), A relatively small number of logic ICs, such as 4 or 8, are attracted and held simultaneously by the contact arm, and the test is performed by simultaneously pressing the logic ICs against the test head by the contact arm. Is done. Test for logic ICs with this configuration Even in the device, when the logic IC is pressed against the test head, the pressing surface of the contact arm comes into surface contact with the top surface of the logic IC.

[0005] When the IC device is pressed by the pusher contact arm of the electronic component testing apparatus as described above, manufacturing variations such as warpage and unevenness occur on the upper surface of the IC device. The pressing surface and the upper surface of the IC device are in partial contact, resulting in stress concentration in the IC device. Such stress concentration may cause mechanical cracks in IC devices and damage them.

Disclosure of the invention

[0006] An object of the present invention is to provide an electronic component testing apparatus capable of suppressing the occurrence of mechanical stress and cracks when pressing an electronic device under test.

In order to achieve the above object, according to the present invention, there is provided an electronic component testing apparatus for testing an electronic device under test by pressing the electronic device under test against a contact portion of a test head. A pressing means for moving the electronic component toward and away from the contact portion is provided, and the pressing means presses the electronic device under test while deforming so as to follow the shape of the upper surface of the electronic device under test. An electronic component test apparatus having a pressing portion capable of performing the above is provided (see claim 1).

In the present invention, when the input / output terminal of the electronic device under test is brought into contact with the contact portion of the test head, the pressing portion is deformed so as to follow the shape of the upper surface of the electronic device under test. To press the electronic component under test.

[0008] As a result, even if there is a manufacturing variation such as warpage or unevenness in the electronic device under test, the electronic device under test is pressed evenly, so that mechanical stress and cracking are suppressed during pressing. It becomes possible to do.

[0009] Further, in the present invention, since the pressing portion presses while following the shape of the upper surface of the electronic device under test, highly accurate management of the stroke amount of the pressing means for the electronic device under test at the time of pressing is unnecessary. Become.

[0010] When the pressing part and the upper surface of the electronic device under test are in partial contact, the thermal conductivity is good at the contacted part, whereas the thermal conductivity is poor at the non-contacted part. It becomes. In contrast, in the present invention, the pressing portion is deformed so as to follow the shape of the upper surface of the electronic device under test. In addition, since the pressing portion is entirely in contact with the upper surface of the electronic device under test, in addition to the above-described advantages, high-precision temperature control of the electronic device under test at the time of pressing becomes possible.

[0011] In the above invention, although not particularly limited, it is preferable that the pressing means has a plurality of pressing portions that press the one electronic device under test at a plurality of points (see claim 2).

[0012] In this way, by pressing one electronic component under test with multiple points by a plurality of pressing portions, in addition to the above-mentioned advantages, for example, upper and lower such as FSCSP (Folded Stacked Chip Size Package) Even when pressing an electronic device under test with input / output terminals formed on both sides, the electronic device under test does not cause the input / output terminals formed on the upper surface of the electronic device under test to be connected by the pressing portion. Parts can be easily pressed.

[0013] Also, when pressing an electronic device under test having a special terminal arrangement, such as an input / output terminal formed only at the center or outer periphery of the lower surface, the electronic device under test can be easily handled. Can be pressed.

[0014] Therefore, it is possible to provide an electronic component testing apparatus that is compatible with various types of electronic components under test and has excellent product compatibility (flexibility).

[0015] Although not particularly limited in the above invention, it is preferable that each of the pressing portions can be expanded and contracted by force toward the electronic device under test (see claim 3), and each of the pressing portions is compatible with each other. More preferably, they can be stretched independently of each other (see claim 4).

Although not particularly limited in the above invention, each pressing portion includes a contact member that contacts the electronic device under test and an elastic force that urges the contact member toward the electronic device under test. And a member (see claim 5).

[0017] As a specific configuration of the pressing means, the pressing means further includes a holding portion for holding the pressing portions so as to project the plurality of pressing portions toward the electronic device under test. The elastic member is preferably interposed between the holding portion and the abutting member (see claim 6). In this case, it is preferable that the contact member, the elastic member, and the holding portion are also configured with a metal material force (see claim 7). Thereby, good thermal conductivity between the pressing means and the electronic device under test can be secured.

[0018] As a more specific configuration of the pressing means, the contact member is preferably a shaft member or a spherical member (see claim 8), and the elastic member is the shaft member or the front member. Preferably, the coil member is coaxial with the spherical member (see claim 9), or the elastic member is a coil spring disposed concentrically with the shaft member (claim). (See Section 10). Each of the pressing portions accommodates a housing space formed in the holding portion so as to accommodate a part of the contact member and the elastic member, or a part of the contact member and the elastic member. Preferably, it further includes at least one of a tubular member to be formed (see claim 11).

[0019] As another specific configuration of the pressing unit, the pressing unit includes a holding unit that holds the pressing unit so as to project the plurality of pressing units toward the electronic component to be tested. In addition, it is preferable that each of the pressing portions includes a shaft member that holds the holding portion so as to extend and contract toward the electronic device under test side (see claim 12).

[0020] In this case, each of the pressing portions further includes a pressure applying unit that applies a fluid pressure to the shaft member toward the electronic device under test side. (See claim 13).

[0021] Further, in the case of claim 12 or 13, it is preferable that the shaft member and the holding member are also configured with a metal material force (see claim 14). Thereby, better thermal conductivity between the pressing means and the electronic device under test can be ensured.

[0022] As yet another specific configuration of the pressing unit, the pressing unit includes a holding unit that holds the pressing unit so as to project the plurality of pressing units toward the electronic component to be tested. Furthermore, it is preferable that each of the pressing portions includes an elastic member that can be elastically deformed (see claim 15). In this case, the elastic member is preferably made of a synthetic resin material, and the synthetic resin material preferably contains a powder made of a material having a higher thermal conductivity than the synthetic resin material. (See Section 16). Thereby, better thermal conductivity between the pressing means and the electronic device under test can be ensured.

[0023] In the above invention, although not particularly limited, it is preferable that the holding portion force of the pressing portion protrudes and the protruding portion V is detachable from the pressing means! reference). Although not limited in the above invention, the pressing means is preferably replaceable with other pressing means (see claim 18). As a result, it becomes possible to easily and quickly respond to the exchange of the types of electronic components under test in the electronic component test equipment. The

Brief Description of Drawings

FIG. 1 is a side view showing an entire electronic component testing apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the electronic device test apparatus shown in FIG.

[FIG. 3] FIG. 3 is a flowchart of a tray showing a method of handling an IC device in the electronic component test apparatus of FIG.

FIG. 4 is a perspective view showing a structure of IC stock force of the electronic device test apparatus of FIG. 1.

FIG. 5 is a perspective view showing a customer tray used in the electronic device test apparatus shown in FIG. 1.

FIG. 6 is a cross-sectional view of the main part in the measurement tank of the electronic device test apparatus of FIG.

FIG. 7 is a cross-sectional view showing a Z-axis drive device in the measurement tank of the electronic component testing apparatus in FIG. 1.

FIG. 8 is a partially exploded perspective view showing a test tray used in the electronic component testing apparatus of FIG.

FIG. 9 is an exploded perspective view showing the structure of the insert, the contact guide, and the contact portion of the electronic device test apparatus shown in FIG.

FIG. 10 is a cross-sectional view showing a pusher structure of the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 11 is an arrow view along the line XI-XI in FIG.

FIG. 12 is a cross-sectional view showing a state where the pusher of FIG. 10 presses the IC device against the contact portion.

FIG. 13A is a cross-sectional view showing the structure of the pressing portion in the first embodiment of the present invention, and is a cross-sectional view of the main part of the collar portion of FIG.

FIG. 13B is a cross-sectional view showing a first modification of the structure of the pressing portion in the first embodiment of the present invention.

FIG. 13C is a cross-sectional view showing a second modification of the structure of the pressing portion in the first embodiment of the present invention. FIG. 13D is a cross-sectional view showing a third modification of the structure of the pressing portion in the first embodiment of the present invention.

FIG. 13E is a cross-sectional view showing a fourth modification of the structure of the pressing portion in the first embodiment of the present invention.

FIG. 13F is a cross-sectional view showing a fifth modification of the structure of the pressing portion in the first embodiment of the present invention.

[FIG. 14A] FIG. 14A is a cross-sectional view showing a first principle of the arrangement of pushers in the first embodiment of the present invention.

[FIG. 14B] FIG. 14B is a cross-sectional view showing the second nourission of the pusher arrangement in the first embodiment of the present invention.

[FIG. 14C] FIG. 14C is a cross-sectional view showing a third principle of the arrangement of the pushers in the first embodiment of the present invention.

[FIG. 14D] FIG. 14D is a cross-sectional view showing a fourth principle of the arrangement of the pushers in the first embodiment of the present invention.

FIG. 14E is a cross-sectional view showing a fifth normalization of the pusher arrangement in the first embodiment of the present invention.

FIG. 15 is a plan view showing an electronic device test apparatus according to a second embodiment of the present invention.

FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG.

FIG. 17 is a side view showing the structure of the contact arm of the electronic device test apparatus according to the second embodiment of the present invention.

FIG. 18 is an arrow view along the line AA in FIG.

FIG. 19 is a side view showing a contact arm in which the state force of FIG.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0026] [First embodiment]

FIG. 1 is a side view showing the entire electronic component testing apparatus according to the first embodiment of the present invention, and FIG. Is a perspective view showing the IC device handling method, FIG. 4 is a perspective view showing a structure of IC stock force of the apparatus, and FIG. 5 is a perspective view showing a customer tray used in the apparatus. Fig. 6, Fig. 6 is a cross-sectional view of the main part in the measuring tank of the apparatus, Fig. 7 is a cross-sectional view showing the Z-axis drive device in the measuring tank of the apparatus of Fig. 1, and Fig. 8 shows a test tray used in the apparatus. FIG. 9 is a partially exploded perspective view, and FIG. 9 is an exploded perspective view showing the structure of the insert, contact guide, and contact portion of the apparatus shown in FIG.

[0027] FIG. 3 is a view for understanding the method of handling the IC device in the electronic component testing apparatus according to the present embodiment. Actually, the members arranged side by side in the vertical direction are planar. There is also a part shown in. Therefore, its mechanical (three-dimensional) structure will be explained with reference to FIG.

[0028] An electronic component test apparatus 100 according to the present embodiment is a test apparatus for a memory IC in which a memory IC is a test object, and applies high-temperature or low-temperature heat stress to an IC device (indicated by reference numeral IC in the figure). This is a device that tests (inspects) whether or not an IC device operates properly when applied, and classifies the IC device according to the test result. The operation test in the state where the thermal stress is applied is performed by replacing the IC device on the test tray TST transported in the apparatus 100 from the customer tray KST in which many IC devices to be tested are mounted. .

Therefore, as shown in FIG. 1 and FIG. 3, the electronic component test apparatus 100 according to the present embodiment stores IC devices to be tested from now on, and classifies and stores tested ICs. The test was performed in the IC storage unit 120, the loader unit 130 for sending the IC device supplied from the IC storage unit 120 to the chamber unit 110, the chamber unit 110 including the test head 300, and the chamber unit 110. The unloader unit 140 that classifies and extracts the tested IC devices is also configured.

The test head 300 included in the chamber section 110 is provided with a large number of contact sections 310 on the upper surface, and each contact section 310 is electrically connected to the tester 400 via a cable 450. In the test, the IC device in contact with the contact portion 310 is electrically connected to the tester 400 through the cable 450, and the IC device is tested by inputting / outputting an electric signal from the tester 400. [0031] A control device that mainly controls the handler 100 is built in the lower part of the handler 100, but as shown in FIG. In this space 101, the test head 300 is replaceably disposed, and the IC device is brought into contact with the contact portion 310 on the test head 300 through the opening portion 102a (see FIG. 6) formed in the device base 102 of the handler 100. Is possible.

Hereinafter, each part of the electronic component testing apparatus 100 will be described.

First, the IC storage unit 120 will be described.

[0034] As shown in FIGS. 2 and 3, the IC storage unit 200 stores a pre-test IC stocker 121 for storing pre-test IC devices, and IC devices classified according to the test results. And a tested IC stocker 122.

[0035] As shown in Fig. 4, the pre-test IC stocker 121 and the tested IC stocker 122 have a frame-like tray support member 123 and the lower force of the tray support frame 123 also enters and extends upward. And an elevator 124 capable of moving up and down. A plurality of customer trays KST (see FIG. 5) are stacked and supported on the tray support frame 123, and only the stacked customer trays KST can be moved up and down by the elevator 124.

[0036] The pre-test IC stocker 121 holds and holds the customer tray KST in which the IC devices to be tested are stored, while the tested IC stocker 122 finishes the test. Customer trays KST with appropriate classification of IC devices are stacked and held.

[0037] Since the pre-test IC stocker 121 and the tested IC stocker 122 have the same structure, the numbers of the pre-test IC stocker 201 and the tested IC stopper 122 are appropriately set as necessary. I can do it.

[0038] In the example shown in Figs. 2 and 3, two stockers STK-B are provided for the pre-test stock force 121, and two empty stocks STK-E sent to the unloader section 140 are provided next to the stocker STK-B. At the same time, 8 stockers STK-1, STK-2, ..., STK-8 are provided in the tested IC stocker 122, and can be sorted and stored in up to 8 categories according to the test results. Yes. In other words, in addition to non-defective products and defective products, the non-defective products are classified into high-speed, medium-speed, low-speed, or defective products that require retesting. [0039] Next, the loader unit 130 will be described.

[0040] The above-described customer tray KST is carried from the lower side of the device base 102 to the window 133 of the loader unit 130 by the tray transfer arm 125 provided between the IC storage unit 120 and the device substrate 102. Then, in this loader unit 130, the IC device loaded in the customer tray KST is transferred to the precursor 132 by the XY moving device 131, and the mutual position of the IC device is corrected here. The IC device transferred to 132 is transferred again to the test tray TST stopped at the loader unit 130 using the XY moving device 131 again.

[0041] The IC device is transferred from the customer tray KST to the test tray TST. As shown in FIG. 2, the XY moving device 131 includes two rails 131a installed on the upper part of the device base 102 and the two rails 131a. The movable arm 131b that can reciprocate between the test tray TST and the customer tray KST by this rail 131a (this direction is the Y direction), and is supported by the movable arm 131b, and along the movable arm 131b, the X direction Movable head 131c.

[0042] The movable head 131c of the XY moving device 131 is mounted with a suction head facing downward, and the suction head moves while sucking air to suck the IC device from the customer tray KST. Transfer the IC device to the test tray TST. For example, about 8 of these suction heads are mounted on the movable head 131c, and 8 IC devices can be loaded onto the test tray TST at a time.

[0043] Incidentally, in the general customer tray KST, the recess 1S for holding the IC device is formed to be relatively larger than the shape of the IC device, so that the customer tray KST is stored in the stored state. The position of IC devices varies greatly. Therefore, when the IC device is carried in this state, it is difficult to accurately drop it into the IC receiving recess formed in the test tray TST. For this reason, in the electronic component test apparatus 100 of the present embodiment, an IC device position correcting means called a “preciser 132” is provided between the installation position of the customer tray KST and the test tray TST. The precursor 132 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Therefore, when the IC device adsorbed by the suction head is dropped into the recess, the inclined surface The drop position of the IC device is Will be corrected. As a result, the mutual position of the eight IC devices is accurately determined, and the IC devices formed on the test tray TST are picked up again by the suction head and loaded onto the test tray TST. IC devices can be transshipped with high precision into the receiving recess.

[0044] Next, the chamber section 110 will be described.

[0045] The test tray TST described above is loaded into the chamber section 110 after the IC devices are loaded by the loader section 130, and each IC device is tested while being mounted on the test tray TST.

[0046] The chamber section 110 is configured to apply a target high temperature or low temperature thermal stress to the IC device loaded on the test tray TST, and the thermal stress is applied in the thermostatic chamber 111. Measurement chamber (test chamber) 112 that brings the IC device in contact with the test head 300, and a heat removal chamber (unsoak chamber) that removes applied thermal stress from the IC device tested in the test chamber 112 And is composed of. In addition, it is preferable that the heat removal tank 113 is thermally disconnected from the thermostat 111 and the measurement tank 112. Actually, a predetermined thermal stress is applied to the region between the thermostat 111 and the measurement tank 112, and the heat removal tank 113 is removed. The heat bath 113 is referred to as a chamber portion 110 for the sake of convenience.

[0047] The thermostatic chamber 111 is disposed so as to protrude upward from the test chamber 112. As conceptually shown in FIG. 3, a vertical transport device is provided in the thermostatic chamber 111, and a plurality of test trays TST are transported by the vertical transport until the measurement bath 112 is empty. Wait while being supported by the device. Mainly, high-temperature or low-temperature thermal stress is applied to IC devices during this standby.

[0048] In the measuring tank 112, the test head 300 is arranged at the center thereof, and the test tray TST is carried on the test head 300, and the input / output terminals of the IC device are electrically connected to the contact pins 311 of the test head 300. The test is carried out by contact with each other.

As shown in FIG. 6, a temperature adjusting blower 60 is provided inside a sealed casing 50 constituting the measuring tank 112. The temperature adjusting blower 60 includes a fan 61, a heater 62, and a nozzle 63 for injecting liquid nitrogen. The fan 61 sucks in air inside the casing 50 and passes through the heater 62 or the nozzle 63. Casing 50 The inside of the casing 50 is brought into a predetermined temperature condition (high temperature or low temperature) by blowing hot air or cold air inside. Thereby, the inside of the casing 50 can be maintained at a high temperature of, for example, about 160 ° C at room temperature, or at a low temperature of, for example, about 60 ° C-room temperature. The internal temperature of the casing 80 is detected by, for example, the temperature sensor 51, and the air volume of the fan 61, the heat amount of the heater 62, the discharge amount of the nozzle 63, etc. so that the inside of the casing 80 is maintained at a predetermined temperature. Is controlled.

[0050] As shown in FIG. 6, the hot air or the cold air generated by the temperature adjustment blower 60 flows along the Y-axis direction in the upper part of the casing 50, and the temperature adjustment blower 60 is installed. It descends along the side wall of the casing opposite to the wall, and passes through the gap between the match plate 10 and the test head 300 and returns to the temperature adjustment blower 60 to circulate inside the casing 50. It becomes.

[0051] On the upper part of the casing 50 of the measurement tank 112, a Z-axis drive device 40 is provided. A heat insulating material 52 is attached to the inner wall of the casing 50. As shown in FIG. 7, the two pairs of drive shafts 42 penetrate through the casing 50 and extend above the casing 50, and their upper ends are connected to the upper plate 43. A pair of bearings 53 are fixed to the upper part of the casing 50, and these bearings 53 allow the drive shaft 42 to move in the Z-axis direction.

A ball screw adapter 43a is fixed to a substantially central portion of the upper plate 43. The adapter 43a is formed with a female screw, and the female screw is engaged with the male screw of the main drive shaft 44. The lower end of the main drive shaft 44 is rotatably held by a rotary bearing 54 embedded in the casing 50, and its upper end is rotatably held by a rotary bearing 45a attached to the support frame 45! RU

[0053] The support frame 45 is mounted on the upper portion of the casing 50 by a support rod 45b.

The upper end of the main drive shaft 44 protrudes upward from the support frame 45, and the first pulley 46a is fixed to that portion. Further, a second pulley 46b is disposed at an upper portion of the support frame 45 with a predetermined distance from the first pulley 46a, and these are connected by a power transmission belt 46c.

[0054] The rotation shaft of the second pulley 46b is connected to the gear box 47a, and the gear box 47a The second pulley 46b is rotated by being connected to the rotating shaft of the stepping motor 47 and rotating the rotating shaft of the stepping motor 47. When the second pulley 46b is rotationally driven, the rotational force is transmitted to the first pulley 46a via the belt 46c, and the first pulley 46a rotates. When the first pulley 46a rotates, the main drive shaft 44 also rotates. As a result, the adapter 43a converts the rotational motion of the drive shaft 44 into linear motion, and moves the upper plate 43 along the Z-axis direction. Move. When the upper plate 43 moves, the driving force is transmitted to the driving plate 41 via the driving shaft 42, and the driving plate 41 is moved along the Z-axis direction. The rotation speed of the stepping motor 47 is detected by the encoder 48, and the control device 49 controls the drive of the stepping motor 47 based on the detection result.

[0055] A plurality of convex portions 41a are provided on the lower surface of the drive plate 41 so as to correspond to the arrangement of the plurality of pushers 20 held by the match plate 10, and in the Z-axis direction of the drive plate 41. By the movement along, it is possible for each convex part 41a to press the pusher 20 respectively.

[0056] Similarly to the thermostatic chamber 111, the heat removal tank 113 is arranged so as to protrude upward from the test chamber 112, and a vertical transfer device is provided as conceptually shown in FIG. In the heat removal tank 113, when a high temperature is applied in the thermostat 111, the IC device is cooled by blowing air to return to room temperature, and when a low temperature is applied in the thermostat 111, the IC device is heated. After returning to a temperature at which condensation does not occur by heating with wind or a heater, the IC device with the heat removed is carried out to the unloader unit 140.

[0057] An inlet-side opening for carrying the test tray TST from the apparatus substrate 102 is formed in the upper part of the thermostatic chamber 111, and the test tray TST is carried out to the apparatus substrate 102 in the upper part of the heat removal tank 113. An outlet side opening is formed. The apparatus substrate 102 is provided with a test tray transfer apparatus 114 for taking in and out the test tray TST through these openings. The test tray conveying device 114 is constituted by, for example, a rotating roller. The test tray TT carried out of the heat removal tank 113 by the test tray transfer device 114 is returned to the thermostatic chamber 111 via the unloader unit 140 and the loader unit 130.

FIG. 8 is an exploded perspective view showing the structure of the test tray TST used in the present embodiment.

This test tray TST has a rectangular frame 35 and a plurality of bars 36 arranged in parallel and at equal intervals. A plurality of mounting pieces 37 are formed at equal intervals on both sides of the crosspieces 36 and on the side 35a of the frame 35 facing the crosspieces 36, respectively. The insert receiving portion 38 is configured by partitioning between the crosspieces 36 or between the crosspiece 36 and the side 35a by the mounting piece 37.

[0059] Each insert accommodating portion 38 can accommodate one insert 30. The accommodated insert 30 is attached to the two attachment pieces 37 using the fastener 39 in a floating state. . Therefore, mounting holes 33 for mounting pieces 37 are formed at both ends of the insert 30. For example, about 4 X 16 such inserts 30 are attached to one test tray TST.

[0060] As shown in Fig. 9, each insert 30 is formed with an IC housing portion 31 for housing an IC device in a substantially central portion. By dropping the IC device here, the IC device is placed in the test tray TST. Will be loaded. In addition, a guide hole 32 into which the guide pin 24 of the pusher 20 and the guide bush 321 of the contact guide 320 are inserted is also formed at the center of both ends of the insert 30. Although detailed illustration is omitted, for example, the guide hole 32 has a small-diameter hole in which the upper half is positioned by inserting the guide pin 24 of the pusher base 21 and the lower half is a guide bush 321 of the contact guide 320. Is a large-diameter hole in which positioning is performed. Further, mounting holes 33 to the mounting pieces 37 of the test tray TST are formed at both end corners of the insert 30.

[0061] Each insert 30 has the same shape and the same size, and one IC device is accommodated in each insert 30. The IC accommodating portion 31 of the insert 30 is set according to the shape of the IC device to be accommodated, and is a rectangular recess in the example shown in FIG.

A plurality of contact portions 310 are provided on the upper surface of the test head 300 so as to correspond to the arrangement of the test trays TST.

[0063] Each contact portion 310 has a plurality of contact pins 311 provided at a number and a pitch corresponding to the input / output terminals of the IC device, and each contact pin 311 is attached by a spring (not shown) or the like. Is biased in the direction. Therefore, even if the IC device is pressed, the contact bin 311 moves back to the upper surface of the contact portion 310, while the contact pin 311 can contact all the terminals of the IC device. [0064] On each contact portion 310, a contact guide 320 is provided in order to ensure highly accurate positioning of the pusher 20 and the insert 30. On both sides of the contact guide 320, two guide pins 24 formed on the pusher 20 are inserted, and guide bushes 321 for positioning between the two guide pins 24 are provided. Further, the contact guide 320 is formed with four stopper portions 322 for defining the lower limit of the pusher 20.

FIG. 10 is a cross-sectional view showing the structure of the pusher of the electronic component test apparatus according to the first embodiment of the present invention, FIG. 11 is a cross-sectional view taken along line X-XI in FIG. 10, and FIG. FIG. 13A is a cross-sectional view of the main part of the heel part of FIG. 10, showing a state in which the pusher presses the IC device against the contact part.

As shown in FIG. 6, pushers 20 are provided above the test head 300 corresponding to the number of contact portions 310. As shown in FIG. 10, the pusher 20 in the present embodiment includes a pusher base 21 having a flat plate shape and a pusher block 22 having a convex shape, and the convex portion force of the pusher block 22. A pusher block 22 is attached to the pusher base 21 so as to protrude downward through a through-hole formed in the portion. Both the pusher base 21 and the pusher block 22 are made of a material having excellent thermal conductivity such as a metal material.

Then, guide pins 24 inserted into the guide holes 31 of the insert 30 and the guide bushes 321 of the contact guide 320 are provided at both lower ends of the pusher base 21. In addition, stopper pins 25 are provided at the lower four corners of the pusher base 21 so as to abut against the stagger portion 322 of the contact guide 320 and define a lower limit when the pusher 20 is moved downward by driving the ¾ axis drive device 40. Being! /

Further, as shown in FIG. 13A, the pusher 20 in this embodiment has a large number of pressing portions 23a so that the tip surface force of the convex portion of the pusher block 22 also protrudes toward the IC device under test. Is retained.

[0069] Each pressing portion 23a includes a metal coil spring 23al accommodated in an accommodation hole 22a formed in the pusher block 22, and a metal plunger 23a2 also accommodated in the accommodation hole 22a. Coil spring 23al and plunger 23a2 are coaxial Has been placed.

[0070] The coil spring 23a1 is fixed at its upper end to the upper end of the accommodation hole 22a and at its lower end is fixed to the upper end of the plunger 23a2. Each receiving hole 22a is formed so as to be smaller than the diameter inside the diametric force of the opening at the front end face of the pusher block 22. The plunger 23a2 is arranged so that its lower end protrudes from the housing portion 22a so as to be able to face the IC device under test, and the upper end of the plunger 23a2 is urged toward the IC device under test by the coil spring 23a 1. It can be locked to the lower end of the receiving hole 22a.

[0071] The plunger 23a2 of each pressing portion 23a projects a certain amount of the opening force of the receiving hole 22a of the pusher block 22, and when the pusher 20 presses the IC device, the IC device is pressed by the elastic force of the coil spring 23al. However, it can be expanded and contracted independently of each other so as to follow the shape of the top surface of the IC device.

[0072] This allows the IC device to be pressed evenly even if there are manufacturing variations such as unevenness or warpage on the upper surface of the IC device, so the mechanical stress generated in the IC device during pressing And cracks can be greatly suppressed.

[0073] Further, since each pressing portion 23a presses while following the shape of the upper surface of the IC device, high-precision management of the stroke amount of the Z-axis driving device 40 at the time of pressing becomes unnecessary.

[0074] Furthermore, since each pressing portion 23a is in total contact with the upper surface of the IC device during pressing, high-precision temperature control of the IC device during pressing is possible.

[0075] Further, by configuring the coil spring 23a1 and the plunger 23a2 with a metal material, it is possible to ensure better thermal conductivity between the pusher 20 and the IC device.

[0076] The tip shape of each plunger 23a2 that contacts the IC device is not limited to the tapered shape as shown in FIG. 13A. For example, the shape is a flat circular shape, a circular shape expanded in a flange shape, or the like. However, it is possible to appropriately set a shape capable of ensuring the desired thermal conductivity.

[0077] If necessary, the portion of the plunger 23a2 that protrudes from the pusher block 22 (protruding portion) is connected to the main body side (the pusher) of the plunger 23a2 by a method such as screw tightening. It is also possible to have a structure that allows the force to be removed and attached to the pusher block 22!

Thus, as a first advantage, it is possible to easily cope with different types of IC devices, for example, by replacing the protrusions with different lengths. The second advantage is that it can be easily applied to IC devices with special input / output terminal arrangements as shown in Fig. 14D and Fig. 14E, which will be described later, by attaching and detaching the protrusions according to the IC device terminal arrangement. It is possible to respond.

FIGS. 13B to 13F are cross-sectional views showing first, first and fifth modified examples of the structure of the pressing portion in the first embodiment of the present invention.

[0080] As shown in FIG. 13B, the pressing portion 23b of the first modification is configured such that only the metal plunger 23bl accommodated in the accommodation hole 22a has a force, and the lower end portion of the plunger 23bl extends from the accommodation hole 22a. It is arranged so as to protrude and face the IC device under test, and its upper end can be locked to the lower end of the accommodation hole 22a.

[0081] The plunger 23b1 of each pressing portion 23a protrudes from the accommodating hole 22a of the pusher block 22 by a predetermined amount, and when the pusher 20 presses the IC device, the IC device is pressed against the IC device by its own weight. It can be expanded and contracted independently of each other so as to follow the shape of the upper surface.

[0082] This allows the IC device to be pressed evenly even if there are manufacturing variations such as unevenness or warpage on the top surface of the IC device, so that mechanical stress that occurs in the IC device during pressing can be reduced. And cracks can be greatly suppressed. In addition, high-precision temperature control of the IC device becomes possible at the same time that high-precision management of the stroke amount is not required during pressing.

[0083] Furthermore, by configuring the plunger 23bl with a metal material, it is possible to ensure better thermal conductivity between the pusher 20 and the IC device.

[0084] It should be noted that by adding a ring or the like to each plunger 23bl, the weight of the plunger 23bl may be managed to optimize the different pressing force for each type of IC device.

[0085] Further, if necessary, the protruding portion of the plunger 23bl may be detachable from the main body side of the plunger 23bl.

[0086] As shown in FIG. 13C, the pressing portion 23c of the second modified example is a metal accommodated in the accommodation hole 22a. The coil spring 23cl is made of a metal and the metal plunger 23c2 is also housed in the housing hole 22a. The coil spring 23c1 and the plunger 23c2 are concentrically arranged.

[0087] The coil spring 23c1 is fixed at its upper end to the upper end of the plunger 23c2, and its lower end is fixed to the lower end of the receiving hole 22a. The plunger 23c2 is received at its lower end. It protrudes from the part 22a and is arranged so as to face the IC device under test, and is biased by the coil spring 23cl toward the IC device under test side.

[0088] The plunger 23c2 of each pressing portion 23c protrudes from the receiving hole 22a of the pusher block 22 by a predetermined amount, and when the pusher 20 presses the IC device, the IC device is pressed by the elastic force of the coil spring 23c 1. However, they can expand and contract independently from each other so as to follow the shape of the top surface of the IC device.

[0089] This allows the IC device to be pressed evenly even if there are manufacturing irregularities such as unevenness or warpage on the upper surface of the IC device. And cracks can be greatly suppressed. In addition, high-precision temperature control of the IC device becomes possible at the same time that high-precision management of the stroke amount is not required during pressing.

[0090] Further, by forming the coil spring 23cl and the plunger 23c2 of a metal material, it is possible to ensure better thermal conductivity between the pusher 20 and the IC device.

[0091] Note that, if necessary, the protruding portion of the plunger 23c2 may be configured to be detachable from the main body side of the plunger 23c2.

[0092] As shown in FIG. 13D, the pressing portion 23d of the third modified example includes a cylindrical tube 23dl communicating with the accommodation hole 22b formed in the pusher block 22, and the accommodation hole 22b and the tube 23dl. The metal coil spring 23d2 accommodated in the tube, the metal Bonole 23d3 accommodated in the tube 23dl, and the force are configured.

[0093] Each accommodation hole 22b is opened with the same diameter without becoming smaller at the tip surface of the pusher block 22. The tube 23dl is continuously connected to the accommodation hole 22b, has substantially the same diameter as the accommodation hole 22b, and has a lower end opened in a tapered shape. Co The spring 23d2 is fixed at its upper end to the upper end of the receiving hole 22b and is in contact with the ball 23d3 at its lower end. The ball 23d3 is arranged so that the lower end of the ball 23d3 protrudes from the opening force of the tube 23dl so as to face the IC device under test, and the tube 23d2 is urged toward the IC device under test by the coil spring 23d2. It can be locked to the reduced diameter part.

[0094] The ball 23d3 of each pressing portion 23d protrudes from the tube 23dl by a predetermined amount. When the pusher 20 presses the IC device, the IC device is pressed while pressing the IC device by the elastic force of the coil spring 23d2. It can be expanded and contracted independently of each other so as to follow the shape of the upper surface of the plate.

[0095] This allows the IC device to be pressed evenly even if there are manufacturing irregularities such as irregularities and warpage on the top surface of the IC device, so the mechanical stress generated on the IC device during pressing And cracks can be greatly suppressed. In addition, high-precision temperature control of the IC device becomes possible at the same time as high-precision management of the stroke amount becomes unnecessary during pressing.

[0096] Furthermore, unnecessary force generated in the planar direction of the IC device for some reason during pressing is reduced by the rotation of the ball 23d3. As a result, the positional deviation in the planar direction with respect to the contact portion 310 can be eliminated. I can do it.

[0097] Further, by forming the coil spring 23d2 and the ball 23d3 from a metal material, it is possible to ensure better thermal conductivity between the pusher 20 and the IC device.

[0098] As shown in FIG. 13E, the pressing portion 23e of the fourth modified example is sealed in the housing space 22c and the metal plunger 23el housed in the housing space 22c formed in the pusher block 22. And the lower end of the plunger 23el protrudes from the accommodating space 22c and is disposed so as to face the IC device under test. At the same time, its upper end can be locked to the lower end of the accommodation space 23c.

[0099] One accommodating space 22c is formed over the entire convex portion of the pusher block 22 so as to be shared by all the pressing portions 23e held by the pusher block 22, and this accommodating space 22c A number of openings are formed according to the plunger 23el that also projects force. In addition, the receiving space 22c is formed with a pressure receiving rod 22d communicating with a pressure source 500 provided outside, and a pressurized fluid to which a desired pressure is applied is passed from the pressure source 500 through the pressure receiving port 22d. It is possible to receive. Each plunger 23el can be locked to the lower end of the accommodation space 22c while its upper end is accommodated in the accommodation space 22c through the opening. In addition, each opening is provided with an oil seal structure (not shown) to prevent the pressurized fluid sealed in the accommodation space 22c from leaking through the opening. Each plunger 23el can receive a desired pressure of the pressurized fluid force sealed in the accommodation space 22c at its upper end.

[0100] The plunger 23el of each pressing portion 23e protrudes a predetermined amount of the opening force of the accommodating space 22c while substantially the same pressure is applied by the pressurized fluid, and the pusher 20 presses the IC device. In addition, the IC device can be expanded and contracted independently of each other so as to follow the shape of the upper surface of the IC device while pressing the IC device by the pressure that receives the liquid force sealed in the accommodation space 22c.

[0101] This allows the IC device to be pressed evenly even if there are manufacturing irregularities such as irregularities and warpage on the top surface of the IC device. And cracks can be greatly suppressed. In addition, high-precision temperature control of the IC device is possible at the same time as high-precision management of the stroke amount is not required during pressing.

[0102] Further, by configuring the plunger 23el with a metal material, it is possible to ensure better thermal conductivity between the pusher 20 and the IC device.

[0103] The pressurized fluid sealed in the accommodation space 22c may be not only a liquid but also a gas, depending on the pressing force, thermal conductivity, etc. required between the pusher 20 and the IC device. It can be set as appropriate.

[0104] Further, if necessary, the protruding portion of the plunger 23el may be detachable from the main body side of the plunger 23el.

[0105] As shown in Fig. 13F, the pressing portion 23f of the fifth modification is an elastic member 23fl provided so that the tip surface force of the convex portion of the pusher block 22 also protrudes toward the IC device under test. It is composed of. The elastic member 23fl is made of an elastically deformable synthetic resin material. When good thermal conductivity is required between the pusher 20 and the IC device, this synthetic resin material has higher thermal conductivity than the synthetic resin material such as metal material and carbon black, and has a material strength. It may contain a powder consisting of.

[0106] The elastic member 23fl of each pressing portion 23f can be elastically deformed independently of each other so as to follow the shape of the upper surface of the IC device when the pusher 20 presses the IC device.

[0107] This allows the IC device to be pressed evenly even if there are manufacturing irregularities such as irregularities and warpage on the top surface of the IC device, so the mechanical stress that occurs in the IC device during pressing And cracks can be greatly suppressed. In addition, high-precision temperature control of the IC device becomes possible at the same time as high-precision management of the stroke amount becomes unnecessary during pressing.

[0108] Furthermore, it is possible to ensure better thermal conductivity between the pusher 20 and the IC device by including the elastic member 23fl with a powder having higher thermal conductivity than the synthetic resin material. .

[0109] It should be noted that the protruding portion of the elastic member 23fl may be detachable from the main body side of the elastic member 23fl as necessary.

[0110] As another modification of the pressing portion, for example, in the pressing portion 23a shown in Fig. 13A, the plunger 23a2 may be replaced with an elastic member 23fl shown in Fig. 13F.

FIGS. 14A to 14E are cross-sectional views showing the first, first, and fifth variations of the arrangement of the pressing portions in the first embodiment of the present invention.

[0112] As shown in Fig. 14A, the first array noiration is an array of pressing portions 23a in the case of pressing the upper surface of a smooth IC device without irregularities and input / output terminals formed. . In this case, a plurality of pressing parts 2 should be distributed evenly over the entire top surface of the IC device.

Place Oa on the tip of pusher block 22.

[0113] As shown in FIG. 14B, the second arrangement nomination is an arrangement of the pressing portions 23a when pressing the uneven upper surface of the IC device. In this case, the plurality of pressing portions 20a are arranged on the front end surface of the pusher block 22 so as to be uniformly distributed over the entire upper surface of the IC device. [0114] When the unevenness formed on the upper surface of the IC device is relatively small, it can be used practically by the pressing portions 23a and 23f. On the other hand, when the unevenness is relatively large, it is possible to adopt an arrangement configuration in which the length and elastic force of each pressing portion 23a are changed in accordance with the uneven shape on the upper surface of the IC device.

[0115] As shown in FIG. 14C, the third array nomination has a prohibited portion that cannot be partially pressed, such as an upper surface where the input / output terminals of the IC device are partially formed. This is an arrangement of the pressing portions 23a. In this case, by arranging and configuring the pressing portion so as to avoid the input / output terminals formed on the upper surface, it becomes easy to obtain a uniform pressing force distribution with respect to the upper surface of the IC device.

[0116] As shown in Fig. 14D, the fourth arrangement norelation is an arrangement of the pressing portions 23a in the case where the input / output terminals press the upper surface of the IC device formed only in the central portion. In this case, each pressing portion 20a is arranged on the tip surface of the pusher block 22 so that it is uniformly distributed only in the upper surface portion facing the portion where the input / output terminals are formed (that is, only in the central portion of the upper surface). Deploy. This makes it possible to easily achieve a uniform pressure distribution corresponding to the arrangement of the input / output terminals of the IC device.

[0117] As shown in FIG. 14E, the fifth array nomination is an array of pressing portions 23a when the input / output terminals press the upper surface of the IC device formed only on the outer peripheral portion. In this case, the plurality of pressing portions 23a are arranged on the tip surface of the pusher block 22 so as to be uniformly distributed only on the upper surface portion facing the portion where the input / output terminals are formed (that is, only on the outer peripheral portion of the upper surface). To place. This makes it possible to easily achieve a uniform pressure distribution corresponding to the arrangement of the input / output terminals of the IC device.

[0118] By adopting the various arrangements as described above, it is possible to cause manufacturing irregularities such as warpage and unevenness on the upper surface of the IC device, and to form input / output terminals on the upper surface side. Even under various constraints such as when the I / O terminals on the bottom side are arranged in a special arrangement, it is easy to obtain a uniform pressure distribution corresponding to the arrangement of the I / O terminals of the IC device The mechanical stress and cracks that occur in the IC device when pressed can be greatly suppressed.

[0119] Of course, the pressing portions 23b-23f, which are the first, first and fifth modified examples only by the pressing portion 23a, It can also be arranged according to the first array layout.

[0120] A large number of pushers 20 (for example, 32 or 64, etc.) having the above-described configuration are configured so that the upper end peripheral edge of the pusher block 22 engages with the open peripheral edge of the match plate 10, thereby It is held on the match plate 10 in an arrangement corresponding to the contact part 310 on the 300.

[0121] The match plate 10 is positioned at the upper portion of the test head 300, and the drive plate of the Z-axis drive device 40 so that the test tray TST can be inserted between the pusher 20 and the contact portion 310. The pushers 20 supported by the match plate 10 and held by the match plate 10 can be moved simultaneously in the Z-axis direction by driving the Z-axis drive device 40.

[0122] Next, the unloader unit 140 will be described.

[0123] The unloader unit 140 is also provided with an XY moving device 141 having the same structure as the XY moving device 131 provided in the loader unit 130. The test tray TST force carried to the unloader unit 140 by the XY moving device 141 is provided. Tested IC devices are transferred to the customer tray KST.

[0124] As shown in FIG. 2, a pair of windows arranged on the device board 102 of the unloader unit 140 so that the customer tray KST carried to the unloader unit 140 faces the upper surface of the device board 102. There are two pairs of parts 143.

[0125] Although not shown, an elevating table for elevating the customer tray KST is provided below each window 143. Here, the tested IC devices are reloaded. The full customer tray KST is loaded and lowered, and this full tray is transferred to the tray transfer arm 125.

Incidentally, in the electronic device test apparatus 100 according to the present embodiment, although the maximum number of categories that can be sorted is eight, only four customer trays KST are arranged in the window 143 of the unloader unit 140. I can't. Therefore, the categories that can be sorted in real time are limited to 4 categories. Generally, good products are classified into three categories: high-speed response devices, medium-speed response devices, and low-speed response devices, and four categories are sufficient, including defective products. Like those that do not belong to these categories! / There is a tendency to finish.

[0127] As described above, when an IC device classified into a category other than the category assigned to the four customer trays KST arranged in the window 143 of the unloader unit 140 is generated, one IC from the unloader unit 140 is generated. The customer tray KST is returned to the IC storage unit 120. Instead, the customer tray KST that should store the newly generated category IC device is transferred to the unloader unit 140, and the IC device is stored. However, if the customer train KST is replaced during the sorting process, the sorting process must be interrupted during that time, and there is a problem when the throughput decreases. For this reason, in the electronic component testing apparatus 100d according to the present embodiment, a notch unit 142 is provided between the test tray TST of the unloader unit 140 and the window unit 143, and an IC of a category in which the buffer unit 142 rarely generates force. Try to save the device temporarily.

[0128] For example, the buffer unit 142 is provided with a capacity that can store about 20-30 IC devices, and a memory for storing each of the IC categories stored in each IC storage position of the buffer unit 142 is provided. The category and position of the IC device temporarily stored in the noffer unit 142 is stored for each IC device. Then, at the time of sorting work or when the buffer unit 142 becomes full, the customer tray KST of the category to which the IC device holding the nota unit 142 belongs is called from the IC storage unit 120 and accommodated in the customer tray KST. To do. At this time, there may be multiple categories of IC devices that are temporarily stored in the noffer unit 142. In such a case, when calling the customer tray KST, a plurality of force stagger trays KST can be connected to the unloader unit 140 window. Call 143.

[0129] Next, the operation will be described.

[0130] The IC device is mounted on the test tray TST, that is, mounted on the test tray TST shown in FIG. 8, more specifically, each IC device has an IC capacity of the insert 30 shown in FIG. After being dropped into the part 31, it is heated to a predetermined temperature in the thermostatic chamber 111 and then conveyed into the test chamber 112.

[0131] When the test tray TST on which the IC device is mounted stops above the test head 300, the Z-axis drive device 40 is driven, and the protrusion 41a provided on the drive plate 41 moves the pusher 20 downward. For pusher 20, stopper pin 25 is connected to stopper 322 of contact guide 320. It descends until it comes into contact.

[0132] When the pusher 20 is lowered in this way, the plurality of pressing portions 23a from which the tip force of the pusher block 22 protrudes abuts against and presses the upper surface of the IC device. At this time, since each pressing portion 23a can be expanded and contracted independently of each other, even when manufacturing variations such as unevenness and warpage occur on the upper surface of the IC device, the IC The IC device is pressed evenly following the shape of the upper surface of the device. As a result, mechanical stress and cracking on the IC device during pressing are greatly suppressed.

In this state, an electrical signal is input from the tester 400 to the IC device via the contact pin 311 of the test head 300. The response signal output from the IC device is sent to the tester 400 through the test head 300, thereby testing the performance and function of the IC device.

[0134] When the test of the IC device is completed, the Z-axis drive device 40 is driven to raise the match plate 10. Then, the XY moving device 141 transports the tested IC device mounted on the test tray TST and stores it in the customer tray KST according to the test result.

[0135] Here, the test object is, for example, an IC device having a smooth upper surface, an IC device having irregularities or input / output terminals formed on the upper surface, or an input / output terminal formed only in the center or outer periphery. In the case of changing to an IC device, each pusher 22 can be tested by replacing it with a pusher with specifications corresponding to the IC device after replacement of the product type, such as the first to fifth array variations. It can easily cope with the exchange of IC device types.

[Second Embodiment]

15 is a plan view showing an electronic device testing apparatus according to the second embodiment of the present invention, FIG. 16 is a cross-sectional view taken along the line XVI-XVI of FIG. 15, and FIG. 17 is an electronic device according to the second embodiment of the present invention. 18 is a side view showing the structure of the contact arm of the component testing device, FIG. 18 is a side view along the AA line of FIG. 17, and FIG. 19 is a side view of the contact arm in which the state force of FIG. is there.

The electronic component test apparatus 200 according to the second embodiment of the present invention is a logic IC test apparatus for which a logic IC is a test object. As shown in FIG. It is possible to test logic ICs (indicated by symbol IC in the figure) using tester 300 and test head 400. Become. Test head 300 and tester 400 are connected via cable 450. Then, the electronic component testing apparatus 200 presses the IC device before the test mounted on the supply tray 202 against the contact part 310 of the test head 300 by the XY moving devices 204 and 205, and connects the test head 300 and the cable 450 to each other. After that, the tester 450 executes the IC device test, and the IC device for which the test has been completed is stored in the classification tray 203 according to the test result.

In this electronic component testing apparatus 200, an apparatus substrate 209 is provided, and XY moving devices 204 and 205 are provided on the substrate 209. Further, an opening 210 is formed in the apparatus substrate 209. As shown in FIG. 16, the IC device through the opening 210 is connected to the contact 310 of the test head 300 disposed on the back side of the handler 200. Is pressed.

[0139] One XY moving device 204 provided on the device substrate 209 was attached to the mounting base 204c by rails 204a and 204b provided along the X-axis direction and the Y-axis direction, respectively. The IC suction device 204d is configured to be movable from the classification tray 203 to the supply tray 202, the empty tray 201, the heat plate 206, and the two buffer sections 208. Further, the IC suction device 204d has a pad. Can be moved in the Z-axis direction (that is, in the vertical direction) by a Z-axis direction actuator (not shown). Two IC devices 204d provided on the mounting base 204c can adsorb, convey and release two IC devices at a time.

[0140] On the other hand, the other XY moving device 205 has a contact arm 205d force attached to the attachment base 205c by rails 205a and 205b provided along the X-axis direction and the Y-axis direction, respectively. The region between 208 and the test head 300 is configured to be movable, and a suction pad 205j (see FIG. 17) is provided at the tip of the contact arm 205d. The two contact arms 205d provided on the mounting base 205c can suck, convey, press and release two IC devices at a time.

[0141] Note that the mounting base 205c of the XY moving device 205 moves up and down in the Z-axis direction. Including the actuator, the entire mounting base 205c holding the two contact arms 205d can move toward and away from the contact portion 310.

[0142] In particular, the contact arm 205d according to the present embodiment has a mounting base 2 as shown in FIG.

It has an arm main body 205e connected to 05c and a product type corresponding unit 205h designed according to the type of IC device to be tested.

[0143] A heater 205f is embedded in the arm main body 205e of the contact arm 205d, so that the temperature of the attracted and held IC device can be maintained. In addition, a temperature sensor 205g is embedded in the arm main body 205e, so that the arm main body 20

By detecting the temperature of 5e, the temperature of the IC device is indirectly detected and the heater 205f is turned on.

Used for ZOFF control.

[0144] A large number of pressing portions 205i are held in a substantially central portion of the product type corresponding portion 205h of the contact arm 205d so as to protrude downward.

Each pressing portion 205i has the same configuration as the pogo pin type pressing portion 23a described with reference to FIG. 13A in the first embodiment, and a detailed description of the pressing portion 205i is omitted here. Of course, as the pressing portion 205i, the pressing portions 23b-23f of the first, first, and fifth modifications described in the first embodiment may be adopted.

[0146] Since the contact arm 205d of the present embodiment is provided with the suction pad 205j, as shown in FIG. 18, the plurality of pressing portions 205i are arranged so as to avoid the suction pad 205j. It is arranged around 205j.

[0147] The suction pad 20¾ has two functions: a function of sucking and holding an IC device and a function of pressing the IC device.

[0148] In this suction pad 20¾, the suction surface protrudes slightly toward the IC device side from the tip of each pressing portion 205i, and before each pressing portion 205i presses the IC device, the suction pad 20

¾ can hold IC devices by suction. The suction pad 20¾ itself may be moved up and down.

[0149] Further, the suction pad 20¾ is made of, for example, a synthetic resin material and the like, and the pressing portion 2

It is preferable to have the same elastic characteristics as the coil springs (not shown) that make up 05i. Yes. Here, it is preferable that the negative pressure supplied to the suction pad 205j is a strong V and negative pressure so that the IC device does not fall off.

[0150] In the contact arm 205d having such a configuration, the IC device can be sucked and held by the suction pad 20¾ in a state where each pressing portion 205i first presses the IC device. Further, in a state where each pressing portion 205i presses the IC device, it is possible to press the IC device together with each pressing portion 205i while holding the IC device by suction pad 20¾.

[0151] In FIG. 18, except for avoiding the region of the suction pad 20¾, as in the first array norelation described in FIG. 14A of the first embodiment, there are no irregularities, input / output terminals, etc. The arrangement in the case of pressing the upper surface of the IC device is shown. However, the arrangement is not particularly limited to this, and pressing according to the second to fifth arrangements described in the first embodiment while avoiding the suction pad 20¾. The parts 205i may be arranged.

[0152] Further, in this embodiment, the type corresponding part 205h of the contact arm 205d is detachable. Depending on the shape of the IC device to be sucked and held, the required pressing accuracy, heat conduction performance, etc. It can be exchanged with the product type department.

For example, when the required pressing accuracy is high, a product type corresponding unit 205h including a large number of pressing units 205i as shown in FIG. 17 may be used. On the other hand, when the pressure is not required to be so high, it is of the type that does not include the pressing part 205i and presses the IC device by surface contact with the flat surface 205m around the suction pad 2051 as shown in FIG. Use the product type 2 05k.

[0154] Next, the operation will be described.

The pre-test IC device mounted on the supply tray 202 of the electronic component test apparatus 200 is sucked and held by the XY moving device 204 and transferred to the recess 206a of the heat plate 206. Here, since the IC device is heated to a predetermined temperature by being left on the heat plate 206 for a predetermined time, the XY moving device 204 that transferred the IC device before the temperature increase from the supply tray 202 to the heat plate 206 is After releasing the IC device, the IC device that is left on the heat plate 206 and heated to a predetermined temperature is adsorbed and transferred to the buffer unit 208 as it is.

[0156] The buffer unit 208 to which the IC device is transferred moves to the right end of the rail 208a. In addition, as shown in FIG. 17, the IC device is sucked and held by each contact arm 205d of the XY moving device 205, and the IC device is contacted through the opening 210 of the device substrate 209 until the IC device contacts the contact portion 310. The contact arm 205d moves downward toward the test head 300.

[0157] When the contact arm 205d is lowered and the IC device comes into contact with the contact part 310, the plurality of pressing parts 205i protruding downward from the product type corresponding part 205h press the upper surface of the IC device. At this time, since each pressing portion 205i can be expanded and contracted independently of each other, even when the upper surface of the IC device is warped, the pressing device 205i is uniformly conformed to the shape of the upper surface of the IC device. Since it is pressed, mechanical stress and cracks that occur during pressing can be greatly suppressed.

[0158] Further, since each pressing portion 205i presses while following the shape of the upper surface of the IC device, highly accurate management of the stroke amount of the contact arm 205d with respect to the IC device at the time of pressing becomes unnecessary.

[0159] Furthermore, since the plurality of pressing portions 205i are in uniform contact with the upper surface of the IC device as a whole when pressed, high-precision temperature control of the IC device during pressing is possible.

[0161] When the IC device test is completed, the contact arm 205d moves up, and the tested IC device is transferred via the buffer unit 208 and the XY moving device 204, and stored in the classification tray 203 according to the test result. .

[0162] Here, the test object was, for example, an IC device having a smooth upper surface, an IC device having unevenness or input / output terminals formed on the upper surface, or an input / output terminal formed only at the center or outer periphery. When changing to an IC device, the type corresponding part 205h of each contact arm 205d corresponds to the IC device after the type change as in the first to fifth array layouts described in the first embodiment, for example. By exchanging it with one that has the pressed part, it is possible to easily cope with the exchange of the IC device type to be tested. [0163] In addition, when the test object is changed from, for example, an IC device that requires high pressing accuracy to an IC device that does not require that much accuracy, the type corresponding part 205h of each contact arm 205d is By exchanging with the type corresponding to 205k corresponding to the IC device after the type change, it is possible to easily deal with the type change of the IC device.

[0164] The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment includes all design changes and equivalents belonging to the technical scope of the present invention.

Claims

The scope of the claims

[1] An electronic component testing apparatus for testing an electronic device under test by pressing the electronic device under test against a contact portion of a test head,

A pressing means for moving the electronic device under test toward and away from the contact part;

The electronic component testing apparatus having a pressing portion capable of pressing the electronic device under test while being deformed so as to follow the shape of the upper surface of the electronic device under test.

2. The electronic component testing apparatus according to claim 1, wherein the pressing means has a plurality of pressing portions that press one electronic component under test at a plurality of points.

[3] The electronic component testing apparatus according to [2], wherein each of the pressing portions is extendable toward the electronic component under test.

4. The electronic component testing apparatus according to claim 3, wherein the pressing portions are extendable and contractable independently of each other.

[5] Each of the pressing portions is

A contact member that contacts the electronic device under test;

5. The electronic component testing apparatus according to claim 4, further comprising: an elastic member that urges the abutting member toward the electronic component to be tested.

[6] The pressing means further includes a holding portion that holds the pressing portions so as to project the plurality of pressing portions toward the electronic device under test side.

6. The electronic component testing apparatus according to claim 5, wherein the elastic member is interposed between the holding portion and the contact member.

7. The electronic component testing apparatus according to claim 6, wherein the contact member, the elastic member, and the holding portion are made of a metal material.

8. The electronic component test apparatus according to claim 6, wherein the contact member is a shaft member or a spherical member.

9. The electronic component testing apparatus according to claim 8, wherein the elastic member is a coil spring disposed coaxially with the shaft member or the spherical member.

[10] The coil member is arranged such that the elastic member is concentrically arranged with the shaft member. 9. The electronic component testing apparatus according to claim 8, wherein

[11] Each pressing portion accommodates a housing space formed in the holding portion so as to accommodate a part of the contact member and the elastic member, or a part of the contact member and the elastic member. 11. The electronic component testing apparatus according to claim 8, further comprising at least one of accommodating tubular members.

[12] The pressing means further includes a holding portion that holds the pressing portions so as to project the plurality of pressing portions toward the electronic device under test side.

5. The electronic component testing apparatus according to claim 4, wherein each of the pressing portions includes a shaft member that holds the holding portion so as to extend and contract toward the electronic device under test side.

13. The electronic component testing apparatus according to claim 12, wherein each pressing portion further includes a pressure applying unit that applies fluid pressure to the shaft member toward the electronic device under test.

14. The electronic component testing apparatus according to claim 12, wherein the shaft member and the holding member are also configured with a metal material force.

[15] The pressing means further includes a holding portion that holds the pressing portions so as to project the plurality of pressing portions toward the electronic device under test side.

5. The electronic component testing apparatus according to claim 4, wherein each pressing portion includes an elastic member that can be elastically deformed.

[16] The elastic member is made of a synthetic resin material,

16. The electronic component testing apparatus according to claim 15, wherein the synthetic resin material contains a powder made of a material having higher thermal conductivity than the synthetic resin material.

17. The electronic component testing apparatus according to claim 6, wherein a protruding portion protruding from the holding portion of the pressing portion is detachable from the pressing means.

18. The electronic component testing apparatus according to claim 11, wherein the pressing means is replaceable with other pressing means.