TW200632344A - Electronic component testing device - Google Patents

Electronic component testing device

Info

Publication number
TW200632344A
TW200632344A TW095100759A TW95100759A TW200632344A TW 200632344 A TW200632344 A TW 200632344A TW 095100759 A TW095100759 A TW 095100759A TW 95100759 A TW95100759 A TW 95100759A TW 200632344 A TW200632344 A TW 200632344A
Authority
TW
Taiwan
Prior art keywords
electronic component
testing device
component testing
component
pressing
Prior art date
Application number
TW095100759A
Other languages
Chinese (zh)
Other versions
TWI388855B (en
Inventor
Makoto Sagawa
Hisao Hamaya
Toshio Goto
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200632344A publication Critical patent/TW200632344A/en
Application granted granted Critical
Publication of TWI388855B publication Critical patent/TWI388855B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Abstract

An electronic component testing device for testing an IC component (IC) by pressing the IC component (IC) to a contact portion (310) of a test head (300). The electronic component testing device includes a pusher (20) for moving the IC component (IC) close to or apart from the contact portion (310). The pusher (20) is provided with a plurality of pressing portions (23a) for pressing one IC device (IC) at a multitudes of points and presses the IC device (IC) by being deformed to follow the upper plane shape of the IC device (IC).
TW095100759A 2005-01-14 2006-01-09 Electronic component testing device TWI388855B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/000412 WO2006075391A1 (en) 2005-01-14 2005-01-14 Electronic component testing apparatus

Publications (2)

Publication Number Publication Date
TW200632344A true TW200632344A (en) 2006-09-16
TWI388855B TWI388855B (en) 2013-03-11

Family

ID=36677427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100759A TWI388855B (en) 2005-01-14 2006-01-09 Electronic component testing device

Country Status (2)

Country Link
TW (1) TWI388855B (en)
WO (1) WO2006075391A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9772373B2 (en) * 2014-03-25 2017-09-26 Advantest Corporation Handler apparatus, device holder, and test apparatus
TWI794985B (en) * 2021-09-16 2023-03-01 鴻勁精密股份有限公司 Connecting mechanism, testing device, and processing machine

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2854901B2 (en) * 1989-12-13 1999-02-10 富士通株式会社 IC package characteristic test apparatus and test method
JP2927585B2 (en) * 1991-09-30 1999-07-28 アンリツ株式会社 Transporting and fixing device for electronic component sorting device
JPH0618615A (en) * 1992-07-03 1994-01-28 Matsushita Electron Corp Inspecting apparatus for electronic part
JP3376958B2 (en) * 1999-05-25 2003-02-17 日本電気株式会社 Contactor for IC socket
JP2003043105A (en) * 2001-08-02 2003-02-13 Fujitsu Media Device Kk Suction pressurizing method of measurement object in characteristic test for it and suction pressurizing pad
JP2003168532A (en) * 2001-11-29 2003-06-13 Texas Instr Japan Ltd Semiconductor device socket and installation method of semiconductor device on socket

Also Published As

Publication number Publication date
TWI388855B (en) 2013-03-11
WO2006075391A1 (en) 2006-07-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees