JP2000019221A - Apparatus for testing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a testing apparatus to have an automatic teaching function by detecting the movement amount in one-axis direction of a driving body for moving a pusher pressing an electronic component towards a socket and controlling the movement amount of the driving body on the basis of the detection signal. SOLUTION: The socket 50 is arranged on a test head 5, so that an IC chip 2 can be pressed in a direction to a connection terminal of the socket by a pusher 30. A driving plate 72 moves the pusher in a direction to the socket. A motor moves the driving plate 72 in one-axis direction while pressing the pusher 30 towards the socket. A sensor detects a movement amount of the driving plate 72 and a control apparatus controls the movement amount of the driving plate 72 on the basis of the output signal of the sensor. The movement stroke of the driving plate 72 pressing the IC chip 2 can be automatically changed by an automatic teaching function to match with the type of the IC chip 2, the type of the socket, environment temperature change, etc., thereby reducing the operator's work.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test apparatus for testing an electronic component such as an IC chip.
When performing a test by pressing the electronic component against the socket, the stroke for moving the driver for pressing the electronic component is adjusted by the automatic teaching function according to the type of electronic component, type of socket, and environmental temperature change. The present invention relates to an electronic component test device that can be automatically changed.

[0002]

2. Description of the Related Art In the course of manufacturing semiconductor devices and the like,
A test device for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test device, a device for performing a test at once while pressing a plurality of IC chips against each test socket is known.

In such a test apparatus, a plurality of I
The test tray holding the C chips is conveyed onto the test head, where the IC chips are pressed and connected to the respective sockets of the test head by a pusher, and each IC chip is tested by a test signal from the test head. By such a test, the IC chip is tested in a good connection state with the socket, and is classified into at least a good chip and a defective chip according to the test result.

In such a test apparatus, the pusher is located above the test head until the test tray is conveyed onto the test head, and when the test tray is set on the test head, the driving body is moved to a predetermined position. It is necessary to move in the direction of the test tray with a moving stroke of. In the conventional test apparatus, the driving body is driven by an air cylinder, and the movement of the driving body is stopped by the stopper member of the pusher abutting the stopper surface of the socket guide holding the socket.

[0005]

However, in the conventional test apparatus, since the driving body is driven by an air cylinder, the number of pushers increases when a large number of IC chips are tested at the same time. Required and the air consumption increases. If the amount of air consumed by the air cylinder for moving the driving body increases, the drive control of the air cylinder used in another mechanism of the test apparatus may be adversely affected.

Further, the air cylinder has the highest moving speed at the end of the moving stroke due to its characteristics. Therefore, when the chip terminal comes into contact with the socket terminal, the IC chip is pushed into the socket by the pusher at the highest speed. Press This has an adverse effect from the viewpoint of stable contact between the chip terminal and the socket terminal.

It is also conceivable to drive the driving body by motor driving instead of air cylinder driving. In this case, however, the stroke for moving the pusher is determined by the type of electronic component, the type of socket, and the change in environmental temperature. There was a problem that it was necessary to change it according to the situation.

The present invention has been made in view of such circumstances, and when a test is performed by pressing an electronic component against a socket, a stroke for moving a driver for pressing the electronic component is determined by the type of the electronic component, It is an object of the present invention to provide an electronic component test apparatus having an automatic teaching function that can automatically change according to the type of a socket and a change in environmental temperature.

[0009]

In order to achieve the above object, an electronic component test apparatus according to the present invention comprises: a socket arranged on a test head so that an electronic component to be tested is mounted; A pusher that can press the electronic component in the direction of the connection terminal of the socket, a driving body that moves the pusher in the socket direction, and a drive that moves the driving body in one axis direction so as to press the pusher in the socket direction. A source, a sensor for detecting a moving amount of the driving body, and a control device for controlling a moving amount of the driving body by the driving source based on an output signal from the sensor.

The sensor is not particularly limited. For example, when the driving source is a motor, an encoder for detecting the rotation angle of the rotating shaft of the motor or the driving shaft connected to the rotating shaft is exemplified.

The socket is provided with a socket guide, and the pusher is provided with a stopper member. When the stopper member contacts the stopper surface of the socket guide, the movement of the pusher is reduced. Preferably, it is restricted.

The control device determines whether or not it is time to automatically measure the moving stroke of the driving body. If the first determining means determines that the moving stroke can be automatically measured, the control unit determines whether or not the drive stroke can be automatically measured. A second determining means for activating the source to move the driving body and determine whether the driving body has moved to the movement restriction position; and the second determination means moving the driving body to the movement restriction position. When it is determined that the driving of the driving source is stopped, teaching means for storing data corresponding to a movement stroke of the driving body from the start of the driving source to the stop thereof, and the storage by the teaching means. It is preferable to have a normal control means for controlling the driving source based on data corresponding to the moved stroke.

Preferably, the electronic component is held by a test tray, and the test tray is transported between the pusher and the socket.

The plurality of pushers are fixed to the lower end of an adapter, respectively, and the adapter is elastically held with respect to the match plate, and the match plate is exchangeable according to the type of electronic component. It is preferable that the driver is disposed on a test head, and the driver is disposed on an upper portion of the match plate so as to be vertically movable. In the present invention, the match plate is a plate that holds a pusher and / or an adapter provided corresponding to a component to be tested, and a pusher (including an adapter) provided corresponding to a component to be tested. ) Can also be defined.

The drive source is not particularly limited, but is preferably a motor such as a step motor.

Although the electronic component is not particularly limited, for example, an IC chip such as a memory device is most common.

[0017]

The test apparatus according to the present invention comprises a sensor for detecting a moving amount of a driving body that presses an electronic component toward a connection terminal of a socket, and a moving amount of the driving body by a driving source based on an output signal from the sensor. And a control device for controlling the The control device determines whether it is time to automatically measure the moving stroke of the driving body. Automatic measurement is possible immediately after replacing the socket, test tray, or match plate, etc. to test different types of IC chips, but before the test tray with electronic components placed on it is transported to the test head. The replacement time is exemplified. In addition, other possible automatic measurement times include a lot start timing before the test of the electronic component of the next lot is completed after the test of the electronic component of one lot is completed, or an environmental temperature change immediately after the set temperature is changed. It may be time. These timings can be known from control signals that control the entire test apparatus.

If the control device determines that automatic measurement is possible, the control unit activates the drive source to move the drive body, and determines whether the drive body has moved to the movement limit position.
If the control device determines that the driving body has moved to the movement limit position, the driving of the driving source is stopped, and data corresponding to the moving stroke of the driving body from the start of the driving source until the driving source is stopped is transmitted. Memorize (teaching function).

In the normal control, the control device controls the driving source to drive the driving body based on the data corresponding to the stored moving stroke, and performs a test of the electronic component.

Therefore, in the component testing apparatus according to the present invention, the stroke for moving the driving body for pressing the electronic component is automatically adjusted by the automatic teaching function in accordance with the type of the electronic component, the type of the socket, and the environmental temperature change. Can be changed. As described above, in the component testing apparatus according to the present invention, since the automatic teaching operation can be performed, the work of the operator is reduced. Further, by using a motor as a drive source, air consumption is eliminated. In addition, by driving the motor, the initial driving speed of the driving body can be increased, and furthermore, control for lowering the driving speed at the end of the moving stroke can be performed. As a result, a stable connection between the electronic component and the socket can be achieved while reducing the overall test process time.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. FIG. 1 is a cross-sectional view of a main part of an IC test apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a main part in a test chamber of the IC test apparatus, and FIG. FIG. 4 is a partially exploded perspective view showing a test tray used in the IC test apparatus, FIG. 5 is a cross-sectional view near the socket shown in FIG. 3, and FIG. 6 is a view near the socket of the test head. FIG. 7 is a sectional view showing a state where the pusher is lowered, and FIG.
FIG. 8 is a perspective view of the handler shown in FIG. 7, FIG. 9 is a flowchart of a tray showing a method of handling an IC under test, and FIG. 10 shows the structure of an IC stocker of the IC test apparatus. FIG. 11 is a perspective view showing a customer tray used in the IC test apparatus, and FIG. 12 is a flowchart showing a control flow of the control device shown in FIG.

First, the overall configuration of an IC test apparatus as an electronic component test apparatus according to one embodiment of the present invention will be described. As shown in FIG. 7, the IC test apparatus 10 according to the present embodiment includes a handler 1, a test head 5, and a test main apparatus 6. Handler 1 is the IC to be tested
The chip (an example of an electronic component) is sequentially conveyed to an IC socket provided in the test head 5, and the operation of storing the IC chips, for which the test is completed, in a predetermined tray according to the test result is performed.

The IC socket provided on the test head 5 is
An IC chip, which is connected to the test main device 6 through the cable 7 and is detachably attached to the IC socket, is connected to the test main device 6 through the cable 7, and the IC is output by a test signal from the test main device 6. Test the chip.

A control device for mainly controlling the handler 1 is built in a lower portion of the handler 1, and a space portion 8 is provided in a part thereof. In this space portion 8, the test head 5
The IC chip can be attached to an IC socket on the test head 5 through a through hole formed in the handler 1.

This IC test apparatus 10 is an apparatus for testing an IC chip as an electronic component to be tested at a temperature higher than normal temperature (high temperature) or lower than normal temperature (low temperature). As shown in FIGS. 8 and 9, a chamber 100 is provided. The chamber 100 includes a constant temperature chamber 101 for applying a desired high or low temperature thermal stress to an IC chip to be tested, and a constant temperature chamber 10.
1 has a test chamber 102 for testing an IC chip to which a thermal stress has been applied, and a heat removal tank 103 for removing thermal stress from the IC chip tested in the test chamber 102. The upper part of the test head 5 shown in FIG. 7 is inserted into the test chamber 102 as shown in FIG. 2, where the test of the IC chip 2 is performed.

FIG. 9 is a view for explaining a method of mounting the test IC chip in the IC test apparatus according to the present embodiment. Actually, members arranged in the vertical direction are shown in plan view. There is also a part shown in. Therefore, its mechanical (three-dimensional) structure can be understood mainly with reference to FIG.

As shown in FIGS. 8 and 9, the handler 1 of the IC test apparatus 10 according to the present embodiment stores an IC chip to be tested and an IC storage unit for classifying and storing tested IC chips. 200, a loader unit 300 for sending the IC chip under test sent from the IC storage unit 200 into the chamber unit 100, a chamber unit 100 including a test head, and a tested IC that has been tested in the chamber unit 100. And an unloader section 400 for taking out. Inside the handler 1, the IC chip
It is stored in a tray and transported.

A large number of IC chips before being stored in the handler 1 are stored in the customer tray KST shown in FIG. 11, and in this state, are supplied to the IC storage section 200 of the handler 1 shown in FIGS. Then, the test tray T conveyed in the handler 1 from the customer tray KST
The IC chip 2 is replaced in ST (see FIG. 4). Inside the handler 1, as shown in FIG. 9, the IC chip moves while being placed on the test tray TST, is subjected to high-temperature or low-temperature stress, and is tested (inspected) for proper operation. Are classified according to the test results. Hereinafter, the inside of the handler 1 will be described in detail individually.

IC Storage Unit 200 As shown in FIG. 8, the IC storage unit 200 has
A pre-test IC stocker 201 for storing C chips and a tested IC stocker 202 for storing IC chips classified according to test results are provided.

The pre-test IC stocker 201 and the tested IC stocker 202, as shown in FIG. 10, have a frame-shaped tray support frame 203, which penetrates from the lower portion of the tray support frame 203 and moves upward and downward. And an elevator 204 that enables it. In the tray support frame 203,
A plurality of customer trays KST are stacked and supported,
Only the stacked customer trays KST are moved up and down by the elevator 204.

In the pre-test IC stocker 201 shown in FIG. 8, customer trays KST in which IC chips to be tested are stored are stacked and held. Also,
In the tested IC stocker 202, customer trays KST containing IC chips classified after the test are stacked and held.

Since the pre-test IC stocker 201 and the tested IC stocker 202 have substantially the same structure, the pre-test IC stocker 201 is replaced with the tested IC stocker 201.
It can be used as the stocker 202 and vice versa. Therefore, the number of pre-test IC stockers 201 and the number of tested IC stockers 202 can be easily changed as needed.

In the embodiment shown in FIG. 8 and FIG. 9, two stockers STK-B are provided as the pre-test stockers 201. Next to the stocker STK-B, a tested IC
As the stockers 202, two empty stockers STK-E to be sent to the unloader unit 400 are provided. Also, next to it, eight stockers STK-1, STK-2,..., STK-8 are provided as the tested IC stockers 202, and are sorted and stored in a maximum of eight categories according to test results. It is configured to be able to. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

Loader 300 The customer tray KST accommodated in the tray support frame 203 of the pre-test IC stocker 201 shown in FIG. 10 is provided between the IC storage 200 and the device substrate 105 as shown in FIG. The loaded substrate 300 is transported from the lower side of the device substrate 105 to the window 306 of the loader unit 300 by the tray transfer arm 205. Then, in the loader unit 300, the IC chip under test loaded on the customer tray KST is
Preciser 3 once by the transport device 304
05, where the positions of the IC chips under test are corrected, and then the IC chips under test transferred to the precisor 305 are again stopped on the loader unit 300 using the XY transfer device 304. Test tray TST
Transshipment.

From the customer tray KST to the test tray T
IC transfer device 30 for transferring IC chips under test to ST
As shown in FIG. 8, as shown in FIG. 8, two rails 301 provided on the upper portion of the device substrate 105, and the test tray TST and the customer tray K
It has a movable arm 302 that can reciprocate with the ST (this direction is the Y direction), and a movable head 303 that is supported by the movable arm 302 and that can move in the X direction along the movable arm 302. I have.

The movable head 3 of the XY transport device 304
At 03, a suction head is mounted downward, and the suction head moves while sucking air, thereby sucking the IC chip under test from the customer tray KST, and transferring the IC chip under test to the test tray TST. Transshipment. For example, about eight such suction heads are mounted on the movable head 303, and eight IC chips to be tested can be transferred to the test tray TST at a time.

In a general customer tray KST, the concave portion for holding the IC chip under test is formed to be relatively larger than the shape of the IC chip under test. The position of the IC chip under test in the state where the test is performed has a large variation. Therefore, if the IC chip to be tested is sucked by the suction head in this state and is directly carried to the test tray TST, it is difficult to accurately drop the IC chip into the IC storage recess formed in the test tray TST. Therefore, in the handler 1 of the present embodiment, an IC called a precisor 305 is provided between the installation position of the customer tray KST and the test tray TST.
Means for correcting the position of the chip is provided. The precisor 305 has a relatively deep concave portion, and the peripheral edge of the concave portion is surrounded by an inclined surface. Therefore, when the IC chip to be tested sucked by the suction head is dropped into the concave portion,
The drop position of the IC chip under test is corrected on the inclined surface. As a result, the mutual positions of the eight IC chips to be tested are accurately determined, and the IC chips whose positions have been corrected are sucked again by the suction head and reloaded onto the test tray TST, thereby forming the test tray TST. IC
The IC chip under test can be reloaded into the storage recess with high accuracy.

The chamber 100 test tray TST described above, the IC chip is fed into the chamber 100 after being loaded by the loader portion 300, each of the IC chips are tested while being mounted on the test tray TST .

As shown in FIGS. 8 and 9, the chamber 10
Reference numeral 0 denotes a constant temperature bath 101 for applying a desired high or low temperature thermal stress to the IC chips to be tested loaded on the test tray TST, and the IC chips to be tested in a state where the constant temperature bath 101 has been subjected to the thermal stress. A test chamber 102 for contacting a test head and a test chamber 10
And a heat removal tank 103 for removing a given thermal stress from the IC chip under test tested in Step 2.

In the heat removal tank 103, when a high temperature is applied in the constant temperature bath 101, the IC chip under test is cooled by blowing air to return to room temperature, and when a low temperature is applied in the constant temperature bath 101, the IC chip under test is applied. Is heated with warm air or a heater to return the temperature to a level that does not cause condensation. Then, the heat-removed IC chip under test is carried out to the unloader section 400.

As shown in FIG. 8, a constant temperature bath 101 and a heat removal bath 103 of a chamber 100 are
It is arranged so as to project upward. Further, as shown conceptually in FIG. 9, the constant temperature bath 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 becomes empty. While waiting. Mainly, during this standby, a high-temperature or low-temperature thermal stress is applied to the IC chip under test.

As shown in FIG. 9, the test chamber 102
, A test head 5 is arranged at the lower center thereof, and a test tray TST is carried on the test head 5. In this case, all the IC chips 2 held by the test tray TST shown in FIG.
The test is performed on the chip 2. On the other hand, the test tray TST for which the test has been completed is heat-removed in the heat-removal tank 103,
After the temperature of the C chip 2 is returned to room temperature, it is discharged to the unloader section 400 shown in FIGS.

As shown in FIG. 8, an opening for feeding the test tray TST from the apparatus substrate 105 is provided above the constant temperature bath 101 and the heat removal tank 103, and the test tray TST is placed on the apparatus substrate 105. An outlet opening for sending out is formed. A test tray transport device 108 for inserting and removing the test tray TST from these openings is mounted on the device substrate 105.
These transfer devices 108 are constituted by, for example, rotating rollers. The test tray TST discharged from the heat removal tank 103 by the test tray transport device 108 provided on the device substrate 105 is returned to the constant temperature bath 101 via the unloader unit 400 and the loader unit 300.

FIG. 4 is an exploded perspective view showing the structure of the test tray TST used in this embodiment. The test tray TST has a rectangular frame 12, on which a plurality of crossbars 13 are provided in parallel and at equal intervals. A plurality of mounting pieces 14 are formed on both sides of these bars 13 and on the inside of the side 12a of the frame 12 parallel to the bars 13 so as to project at equal intervals in the longitudinal direction. Each insert storage portion 15 is constituted by two opposed mounting pieces 14 of a plurality of mounting pieces 14 provided between the crosspiece 13 and between the crosspiece 13 and the side 12a.

Each insert storage section 15 has one
Each of the inserts 16 is housed, and the insert 16 is mounted on the two mounting pieces 14 in a floating state using a fastener 17. For this purpose, mounting holes 21 for mounting the mounting pieces 14 are formed at both ends of the insert 16. Such an insert 16 can be, for example, one test tray T
About 16 × 4 pieces are attached to the ST.

The inserts 16 have the same shape and the same dimensions, and the IC chips 2 to be tested are housed in the respective inserts 16. The IC accommodating portion 19 of the insert 16 is determined according to the shape of the IC chip 2 to be accommodated, and is a rectangular recess in the example shown in FIG.

Here, the IC chips 2 to be tested which are connected to the test head 5 at one time are, for example, the IC chips 2 to be tested arranged in 4 rows × 16 columns as shown in FIG. A total of four rows of IC chips 2 to be tested are arranged in every third direction. That is, in the first test, as shown in FIG. 3, a total of 16 IC chips 2 to be tested arranged every
The test is performed by connecting to the contact pins 51 of the socket 50. In the second test, the test tray TST is moved by one row, and the IC chips under test arranged in every third row from the second row are similarly tested, and this test is repeated four times to obtain all the IC chips under test. Test 2. The result of this test is stored in the control device of the handler 1 with an address determined by, for example, the identification number given to the test tray TST and the number of the IC chip 2 to be tested allocated inside the test tray TST.

As shown in FIG. 3, on the test head 5, sockets 50 correspond to the IC chips 2 to be tested in the test tray TST shown in FIG. Are arranged in the specified number (4 rows × 4 columns). Note that if the size of each socket 50 can be reduced, four test chips 5 are placed on the test head 5 so that all the IC chips 2 held in the test tray TST shown in FIG. Sockets 50 of rows × 16 columns may be arranged.

As shown in FIG. 3, one socket guide 40 is mounted for each socket 50 above the test head 5 in which the sockets 50 are arranged. The socket guide 40 is fixed to the socket 50.

The test trays TST shown in FIG. 4 are conveyed onto the test heads 5, and the number of test trays TST shown in FIG.
In the case of T, inserts 16 in a total of four rows every three rows (a total of 16 inserts) are located on the corresponding socket guides 40.

The pushers 30 shown in FIG. 3 are provided above the test head 5 corresponding to the number of the socket guides 40. As shown in FIG. 2, each pusher 30 is fixed to the lower end of the adapter 62. Each adapter 62 is elastically held on the match plate 60. Match plate 60
Is mounted on the test head 5 so that the test plate TST can be inserted between the pusher 30 and the socket guide 40. The pusher 30 held by the match plate 60 is movable in the Z-axis direction with respect to the test head 5 or a driving plate (driving body) 72 of the Z-axis driving device 70. The match plate 60 has a replaceable structure together with the adapter 62 and the pusher 30 according to the shape of the IC chip 2 to be tested. The test plate TS
T is conveyed between the pusher 30 and the socket guide 40 in the direction perpendicular to the paper of FIG. 2 (X axis). As a transport unit of the test plate TST inside the chamber 100, a transport roller or the like is used. When transporting the test tray TST, the Z-axis driving device 7
0 drive plate is raised along the Z-axis direction,
A sufficient gap for inserting the test tray TST is formed between the pusher 30 and the socket guide 40.

As shown in FIGS. 1 and 2, on the lower surface of the drive plate 72 disposed inside the test chamber 102, a number of pressing portions 74 corresponding to the number of the adapters 62 are fixed, and are held by the match plate 60. Adapter 62
Can be pressed. The drive plate 72 includes
The drive shaft 78 is fixed. As will be described later in detail, a motor (drive source) 134 is connected to the drive shaft 78.
The drive shaft 78 is moved up and down along the Z-axis direction so that the adapter 62 can be pressed. In FIG. 2, the pressing portions 74 are arranged in four rows, and the number of the drive shafts 78 is one. However, in the present embodiment, as shown in FIG.
The pressing portions 74 are arranged in eight rows, and the number of drive shafts 78 is also two.
It is a book. However, these numbers are not particularly limited.

At the center of the pusher 30 mounted at the lower end of each adapter 62, as shown in FIGS. 5 and 6, pressers 31 for pressing the IC chip under test are formed, and the inserts 16 of the insert 16 are formed on both sides thereof. A guide pin 32 is provided to be inserted into the guide hole 20 and the guide bush 41 of the socket guide 40. Further, a stopper pin (stopper member) 33 for regulating the lower limit when the pusher 30 is moved downward by the Z-axis driving device 70 is provided between the pressing element 31 and the guide pin 32, The stopper pin 33 is provided on the stopper surface 42 of the socket guide 40.
, The lower limit position of the pusher that presses with an appropriate pressure that does not destroy the IC chip under test 2 is determined.

Each insert 16 is, as shown in FIG.
It is attached to the test tray TST by using a fastener 17, and as shown in FIGS.
The guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 have the guide holes 20 to be inserted from above and below, respectively.

As shown in FIG. 6 showing the lowered state of the pusher 30, the guide hole 20 on the left side in the figure is a hole for positioning and has an inner diameter smaller than that of the guide hole 20 on the right side. Therefore, the guide pin 32 of the pusher 30 is inserted into the upper half of the guide hole 20 on the left side, and positioning is performed.
The guide bush 41 is inserted for positioning. Incidentally, the guide hole 20 on the right side in the figure, the guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 are loosely fitted.

As shown in FIGS. 5 and 6, insert 1
6, an IC accommodating portion 19 is formed. By dropping the IC chip 2 under test therein, the IC chip 2 under test is loaded on the test tray TST shown in FIG.

As shown in FIGS. 5 and 6, two guide pins 32 formed on the pusher 30 are inserted into both sides of the socket guide 40 fixed to the test head 5, and these two guide pins 32 are inserted. A guide bush 41 is provided for positioning between the guide bush 41 and the guide bush 41 on the left side in the drawing, as described above, also performs positioning with the insert 16.

As shown in FIG. 6, a socket 50 having a plurality of contact pins 51 is fixed to the lower side of the socket guide 40. The contact pins 51 are spring-loaded upward by a spring (not shown). It is being rushed.
Therefore, even if the IC chip 2 under test is pressed, the contact pins 51 are retracted to the upper surface of the socket 50, but even if the IC chip 2 under test is pressed with a slight inclination, all the terminals of the IC chip 2 are contacted. The pins 51 can be brought into contact.

In the present embodiment, in the chamber 100 configured as described above, as shown in FIG. 2, a temperature control air blower 90 is mounted inside a closed casing 80 forming a test chamber 102. is there. The temperature control blower 90 has a fan 92 and a heat exchange unit 94,
The air inside the casing is sucked by the fan 92 and discharged into the inside of the casing 80 through the heat exchanging section 94, whereby the inside of the casing 80 is set to a predetermined temperature condition (high or low temperature).

When the inside of the casing is heated to a high temperature, the heat exchanging section 94 of the temperature control blower 90 is constituted by a heat radiating heat exchanger or an electric heater through which a heating medium flows. It is possible to provide a sufficient amount of heat to maintain a high temperature of room temperature to about 160 ° C. When the inside of the casing is to be cooled, the heat exchanging section 94 is constituted by a heat-absorbing heat exchanger or the like in which a refrigerant such as liquid nitrogen circulates. In order to maintain a low temperature, sufficient heat can be absorbed. The internal temperature of the casing 80 is detected by, for example, a temperature sensor 82, and the fan 9 is controlled so that the internal temperature of the casing 80 is maintained at a predetermined temperature.
2 and the amount of heat of the heat exchange unit 94 are controlled.

The hot air or cold air generated through the heat exchange section 94 of the temperature control blower 90 flows in the upper part of the casing 80 along the Y-axis direction, descends along the casing side wall opposite to the apparatus 90, and It returns to the device 90 through the gap between the plate 60 and the test head 5 and circulates inside the casing.

In this embodiment, as shown in FIG. 1, a Z-axis driving device 70 for driving the driving plate 72 is mounted on the upper part of the casing 80. The casing 8
A heat insulating material 84 is attached to the inner wall of No. 0.

As shown in FIG. 1, the pair of drive shafts 78
It extends through casing 80 and above casing 80, and its upper end is connected to upper plate 110. A pair of bearings 112 is provided on the upper part of the casing 80.
Are fixed, and the drive shaft 7 is
8 in the Z-axis direction.

A ball screw adapter 114 is fixed substantially at the center of the upper plate 110. This adapter 1
The female screw 14 is formed with a female screw, and the female screw is screwed to the male screw of the main drive shaft 116. The lower end of the main drive shaft 116 is rotatably held by a rotary bearing 118 embedded in the casing 80, and the upper end is rotatably held by a rotary bearing 120 mounted on a support frame 130. It is.

The support frame 130 includes a support rod 132
And is mounted on the upper part of the casing. Main drive shaft 1
The upper end of 16 protrudes upward from the support frame 130, and a first pulley 122 is fixed to that portion. First
The second pulley 1 is separated from the pulley 122 by a predetermined distance.
26 are arranged on the upper part of the support frame 130, and these are connected by the power transmission belt 124. The rotation shaft of the second pulley 126 is connected to a gear box 128, and the gear box 128 is connected to the rotation shaft of a step motor 134. The rotation of the rotation shaft of the step motor 134 causes the second pulley 126 to rotate. Is designed to rotate. When the second pulley 126 is driven to rotate,
The rotational force is applied to the first pulley 122 via the belt 124.
And the first pulley 122 rotates. When the first pulley 122 rotates, the main drive shaft 116 also rotates. As a result, the adapter 114 converts the rotational force of the drive shaft 116 into a linear motion, and moves the upper plate 110 along the Z-axis direction. When the upper plate 110 moves, the driving force is transmitted to the driving plate 72 via the driving shaft 78, and moves the driving plate 72 along the Z-axis direction.

As shown in FIG. 1, an encoder 136 as a sensor is built in or separately mounted on the motor 134 so that the rotation amount of the rotating shaft of the motor can be measured. An output signal from the encoder 136 is input to the motor control device 140. The motor control device 140 controls driving of the motor 134.

Next, a method of controlling the motor 134 by the motor control device 140 will be described with reference to the flowchart shown in FIG.

As shown in FIG. 12, when the control is started in step S1, the process goes to step S2, and the control device 140 shown in FIG. 1 determines whether or not it is time to automatically measure the movement stroke of the drive plate 72. . The automatic measurement is possible when the socket guide 40 and the test tray TS shown in FIG.
For example, a replacement time immediately after the T or the match plate 60 is replaced and before the test tray TST on which the IC chip 2 is placed is transported to the test head 5 is illustrated. In addition, as for other automatic measurement possible times, one lot of I
The test of C chip 2 is completed, and the next lot of IC chip 2
May be a lot start time before the test is started, or an environmental temperature change time immediately after the set temperature is changed. These timings can be known from control signals that control the entire test apparatus.

In step S2 shown in FIG.
Goes to step S9 when it is determined that automatic measurement is not possible, and goes to step S3 when it is determined that measurement is possible, and starts the motor 134 as a drive source shown in FIG. Let it. As a result, the second pulley 126 rotates and the first pulley 12
2 and main drive shaft 116 rotate, and upper plate 11
0, the drive shaft 78 and the drive plate 78 move down along the Z-axis direction. As a result, the pressing portion 74 of the driving plate 72 comes into contact with the upper surface of the adapter 62 of the match plate 60 as shown in FIG. 2, and the pusher 30 connects the IC chip 2 to the contact pin of the socket 50 as shown in FIG. Press in the direction of 51.

In step S4 shown in FIG. 12, the encoder 136 shown in FIG. 1 measures the rotation angle of the rotation shaft of the motor 134. In step S5 shown in FIG. 12, it is determined whether or not the drive plate 72 shown in FIG.
Judge. When the drive plate 72 is stopped, the stopper pin 33 of the pusher 30 shown in FIGS.
This is a case where the downward movement of the drive plate 72 is restricted by contacting the stopper surface 42 of the socket guide 40. In that case, the operation proceeds to step S6, in which the driving of the motor 134 shown in FIG. 1 is stopped, and if not, steps S4 and S5 are repeated.

Since the downward movement of the drive plate in steps S3 to S6 shown in FIG. 12 is not a downward movement for the test, the moving speed may be extremely lower than the moving speed at the time of the test. . Whether or not the drive plate 72 has stopped can be determined, for example, based on whether or not the load acting on the motor 134 has increased.

Next, in step S7 shown in FIG. 12, a movement stroke Z1 from the start of driving the drive plate 72 to the stop thereof is calculated from the detection signal by the encoder 136 shown in FIG. The signal corresponding to the movement stroke Z1 may be the rotation amount (rotation angle) data of the motor shaft based on the detection signal from the encoder 136 itself.

Next, in step S8 shown in FIG.
Is stored (teaching function) corresponding to the movement stroke Z1 of the drive plate 72 from the start of the motor 134 to the stop thereof.

From step S2 to S9 shown in FIG. 12, the control device 140 shown in FIG. 1 determines whether or not it is the normal test start time. To the control device 14 shown in FIG.
A value of 0 controls the motor 134 to drive the drive plate 72 based on the stored data corresponding to the movement stroke Z1 to perform a normal IC chip test operation.

Unloader unit 400 The unloader unit 400 shown in FIGS. 8 and 9 is also provided with XY transfer units 404, 404 having the same structure as the XY transfer unit 304 provided in the loader unit 300. Y
The unloader unit 400 is provided by the transport devices 404 and 404.
Tested IC chips are transferred from the test tray TST carried out to the customer tray KST.

As shown in FIG. 8, a pair of windows 406 on which the customer tray KST conveyed to the unloader section 400 faces the upper surface of the apparatus board 105 is provided on the apparatus board 105 of the unloader section 400. There are 406 pairs.

Although not shown, a lift table for raising and lowering the customer tray KST is provided below each window 406, and here, the tested IC chips to be tested are reloaded. The customer tray KST which is full is placed on the tray and descends, and the full tray is transferred to the tray transfer arm 205.

Incidentally, in the handler 1 of this embodiment,
Although the maximum number of categories that can be sorted is eight,
Only a maximum of four customer trays KST can be arranged in the window 406 of the unloader unit 400. Therefore, the categories that can be sorted in real time are limited to four categories. In general, good products are classified into three categories: high-speed response elements, medium-speed response elements, and low-speed response elements, and four categories are added to this, including defective products. There may be categories that do not belong to these categories, such as things.

As described above, the window 4 of the unloader 400
06, four customer trays KST (FIG. 10)
And 11), if an IC chip to be tested is classified into a category other than the category assigned to one of the customer trays K from the unloader unit 400.
The ST may be returned to the IC storage unit 200, and instead, the customer tray KST for storing the IC chip under test of the newly generated category may be transferred to the unloader unit 400, and the IC chip under test may be stored. However, if the customer tray KST is replaced during the sorting operation,
During that time, the sorting operation must be interrupted, and there is a problem that the throughput is reduced. For this reason, in the handler 1 of the present embodiment, the buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and an IC chip to be tested of a category which rarely occurs is provided in the buffer unit 405. I keep it temporarily.

For example, 20 to 30
In addition to providing a capacity capable of storing approximately the number of IC chips to be tested, a memory for storing the IC chip categories stored in the respective IC storage positions of the buffer unit 405 is provided. Test I
The category and position of the C chip are stored for each IC chip under test. Then, during the sorting operation or when the buffer unit 405 is full, the customer tray KST of the category to which the IC chip to be tested stored in the buffer unit 405 belongs is called from the IC storage unit 200 and stored in the customer tray KST. I do. At this time, the IC chip under test temporarily deposited in the buffer unit 405 may cover a plurality of categories.
When the customer tray KST is called, a plurality of customer trays KST may be called to the window 406 of the unloader unit 400 at one time.

Operation of Test Apparatus 10 In the test apparatus 10 according to the present embodiment, as shown in FIGS. 1 to 6 and 12, a stroke Z1 for moving a drive plate 72 for pressing the IC chip 2 against the socket 50 is defined as: It can be automatically changed by the automatic teaching function according to the type of the IC chip 2, the type of the socket 50, the type of the socket guide 40, and the environmental temperature change. As described above, the test apparatus 1 according to the present embodiment
In the case of 0, the automatic teaching operation can be performed, so that the work of the operator is reduced. Further, by using the motor 134 as a drive source, air consumption is eliminated.
In addition, by using the motor drive, the initial drive speed of the drive plate 72 can be increased, and furthermore, the drive speed can be reduced at the end of the movement stroke Z1. As a result, the IC chip 2 and the contact pins 51 of the socket 50 are shortened while reducing the overall test process time.
It is possible to achieve a stable connection with.

Other Embodiments The present invention is not limited to the above-described embodiments, and can be variously modified within the scope of the present invention.

For example, the handler 1 used in the test apparatus 10 according to the present invention is not limited to the handler 1 shown in FIGS. 7 to 9, but may be various types of handlers.

The test apparatus 1 according to the embodiment described above
0, the chamber 100, as shown in FIGS.
Is composed of the constant temperature bath 101, the test chamber 102, and the heat removal bath 103, but in the test apparatus according to the present invention, the constant temperature bath 101 and / or the heat removal bath 103 can be omitted.

In the above-described embodiment, as shown in FIGS. 1 and 2, the driving plate 72 is disposed inside the test chamber 102 for performing the high-temperature test or the low-temperature test. The driving plate 72 may be arranged in a region where the operation is performed.

[0086]

As described above, according to the electronic component testing apparatus of the present invention, the stroke for moving the driving body for pressing the electronic component is determined by the type of the electronic component,
It can be automatically changed by the automatic teaching function according to the type of socket and the change in environmental temperature. As described above, in the component testing apparatus according to the present invention, since the automatic teaching operation can be performed, the work of the operator is reduced. Further, by using a motor as a drive source, air consumption is eliminated. In addition, by driving the motor, the initial driving speed of the driving body can be increased, and furthermore, control for lowering the driving speed at the end of the moving stroke can be performed. As a result, a stable connection between the electronic component and the socket can be achieved while reducing the overall test process time.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of an IC test apparatus according to one embodiment of the present invention.

FIG. 2 is a sectional view of a main part in a test chamber of the IC test apparatus.

FIG. 3 is an exploded perspective view showing an example of a structure near a socket in a test head of the IC test apparatus.

FIG. 4 is a partially exploded perspective view showing a test tray used in the IC test apparatus.

FIG. 5 is a sectional view of the vicinity of the socket shown in FIG. 3;

FIG. 6 is a cross-sectional view showing a state where the pusher is lowered near the socket of the test head.

FIG. 7 is an overall side view of the IC test apparatus.

FIG. 8 is a perspective view of the handler shown in FIG. 7;

FIG. 9 is a flowchart of a tray showing a method of handling an IC under test.

FIG. 10 is a perspective view showing a structure of an IC stocker of the IC test apparatus.

FIG. 11 is a perspective view showing a customer tray used in the IC test apparatus.

FIG. 12 is a flowchart showing a control flow of the control device shown in FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Handler 2 ... IC chip 5 ... Test head 6 ... Main test device 10 ... IC test device (electronic component test device) 16 ... Insert 30 ... Pusher 40 ... Socket guide 50 ... Socket 60 ... Match plate 62 ... Adapter 70 ... Z-axis drive device 72 ... drive plate (drive body) 74 ... pressing part 78 ... drive shaft 80 ... casing 100 ... chamber 101 ... constant temperature bath 102 ... test chamber 103 ... heat removal tank 110 ... upper plate 112, 118, 120 ... bearing 116 ... Main drive shaft 122, 126 ... Pulley 124 ... Belt 128 ... Gear box 134 ... Motor (drive source) 136 ... Encoder (sensor) 140 ... Control device TST ... Test tray

Claims (7)

[Claims] 1. A socket disposed on a test head so that an electronic component to be tested is mounted thereon; a pusher capable of pressing the electronic component toward a connection terminal of the socket; A driving body to move; a driving source to move the driving body in one axis direction; a sensor to detect a moving amount of the driving body; and a movement of the driving body by the driving source based on an output signal from the sensor. A control device for controlling the quantity; and an electronic component test device comprising: 2. The socket has a socket guide, and the pusher has a stopper member. The stopper member comes into contact with a stopper surface of the socket guide, so that the pusher is The electronic component test apparatus according to claim 1, wherein movement is restricted. 3. The control device according to claim 1, wherein the first determining unit determines whether or not it is time to automatically measure the moving stroke of the driving body. If the first determining unit determines that the moving stroke can be automatically measured, A second determining unit that activates the driving source to move the driving body, and determines whether the driving body has moved to a movement restriction position; and the second determination unit determines that the driving body is in the movement restriction position. When it is determined that the driving source has been moved to, the starting of the driving source is stopped, and teaching means for storing data corresponding to a moving stroke of the driving body from the start of the driving source to the stop thereof, and the teaching means. The electronic component test apparatus according to claim 1, further comprising: a normal control unit that controls the drive source based on data corresponding to a movement stroke stored by the control unit. 4. The electronic component test apparatus according to claim 1, wherein the electronic component is held by a test tray, and the test tray is transported between the pusher and the socket. 5. A plurality of said pushers are fixed to a lower end of an adapter, respectively, said adapter is elastically held with respect to a match plate, and said match plate is exchangeable according to the type of electronic component. The electronic component test apparatus according to any one of claims 1 to 4, wherein the driver is disposed on the test head, and the driver is disposed on the match plate so as to be vertically movable. 6. The motor according to claim 1, wherein the drive source is a motor.
An electronic component test apparatus according to any one of the above. 7. The electronic component test apparatus according to claim 1, wherein the electronic component is an IC chip.