TWI490970B - A pallet handling device, and an electronic component testing device provided with the device - Google Patents

Description

Pallet handling device, and electronic component testing device having the same

The present invention relates to a tray transfer device for transporting a tray that can accommodate various electronic components (hereinafter collectively referred to as IC components) such as a semiconductor integrated circuit component, and an electronic component test device having the same.

In the manufacturing process of the IC component, an electronic component test device is used to test the performance or function of the IC component in the packaged state. A handler constituting the electronic component testing device includes a loading portion, a chamber portion, an unloading portion, and a housing portion.

The loading unit moves the IC component from the guest tray to the test tray and carries the test tray into the chamber. Furthermore, the client tray is a tray for storing IC components before or after the test, and the IC components before the test are supplied from the previous program to the processor in a state of being stored in the guest tray, and the tested IC components are stored in the IC device. The tray is in the state of being sent from the processor to the next program. On the other hand, the test tray is a dedicated tray that is circulated and transported inside the processor.

After the IC component is placed in the test tray, the IC component is subjected to high temperature or low temperature thermal stress, and then the IC component is pressed to the test socket provided on the test head. In this state, a tester constituting the electronic component testing device performs the test of the IC component through the test head.

The unloading unit carries out the test tray in which the tested IC component is housed from the chamber portion, and transports the IC component to the guest tray corresponding to the test result, thereby performing classification into the types of good or defective products.

The storage unit supplies the guest tray in which the IC component before the test is stored to the loading unit, and receives the guest tray in which the tested IC component is housed from the unloading unit.

The accommodating portion includes: a storage device that stores a plurality of guest trays in a stacked state, a lifting device that supplies the front tray to the loading/unloading portion or the unloading portion by moving the guest tray up and down, and a tray at the guest tray A pallet handling device that moves between the storage and lifting device.

When the passenger tray carried on the lifting device is exchanged, the pallet handling device must move back and forth between the storage and lifting device, and thus it is easy to become a bottleneck program. In particular, when the number of IC components (simultaneous measurement numbers) that can be simultaneously tested in the electronic component testing apparatus increases, it is inevitable that the exchange operation of the guest tray is required to be accelerated, and thus the above tendency becomes more remarkable.

An object of the present invention is to provide a tray transfer device and an electronic component test device capable of shortening an exchange operation.

According to the present invention, there is provided a tray transporting apparatus for transporting a tray capable of accommodating electronic components to be tested, comprising: a storage device for storing the tray; a holding device for holding the tray; and a storage device for temporarily storing the tray; At least one transport device that transports the tray between the storage device, the holding device, and the storage device; and a control device that controls the operation of the transport device (see Patent Application No. 1).

In the above invention, although it is not particularly limited, it is preferable that the storage device is a storage plate that is held by the conveying device and held and temporarily stores the tray.

In the above invention, it is preferable that the holding device includes: a first holding device that holds the pre-test tray in which the electronic component to be tested before the test is stored; and a second holding device that holds the test in the holding device. The completed test tray of the tested electronic component; the storage device is disposed between the first holding device and the second holding device (see claim 2).

In the above invention, it is not particularly limited, but it is preferable that the moving distance of the tray from the holding device to the tray of the storage device is shorter than the storage device from the holding device to the storage device. The moving distance of the tray (see item 3 of the patent application).

In the above invention, it is preferable that the storage device includes: a first storage device that stores a pre-test tray in which the electronic component to be tested before the test is stored; and a second storage device that stores and stores the test. The completed test tray of the tested electronic component; the third storage device stores an empty tray that does not contain the tested electronic component (see item 4 of the patent application scope).

In the above invention, it is preferable that the at least one transport device includes first and second transport devices that can independently transport the tray, and the control device controls the first and second transport devices. The first conveying device transports the tray between the first storage device, the first holding device, the storage device, and the third storage device; and the second conveying device stores the tray in the storage device The second holding device and the second storage device are transported between the third storage devices (see item 5 of the patent application).

In the above invention, it is preferable that the control device controls the first and second conveying devices such that the first conveying device stores the electronic component to be tested before the test. The pre-test tray is transported from the first storage device to the first holding device, and the empty tray of the tested electronic component that has not been tested is transported from the first holding device to the storage device; the second transport device The empty tray in which the electronic component to be tested is not stored is transported from the storage device or the third storage device to the second holding device, and the test tray containing the tested electronic component to be tested is stored from the second The holding device is transported to the second storage device (see item 6 of the patent application).

In the above invention, it is preferable that the control device controls the first and second conveying devices such that the second conveying device stores the tested electronic component to be tested. The test tray is transported from the second holding device to the storage device; the first transport device transports the tested tray from the storage device to the first holding device or the first storage device (see the patent application scope) 7 items).

In the above invention, it is preferable that the first and second holding devices move the tray in the first direction, and the first and second conveying devices can move the tray along the tray. The first direction and the second direction different from the first direction are independently moved; the first, the second, and the third storage devices are disposed along the second direction; and the first to the first In the storage device, the first and second holding devices and the storage device are located in the first direction (see item 8 of the patent application).

In the above invention, it is preferable that the first conveying device has a plurality of first gripping portions that can grip the tray, and the plurality of first gripping portions can follow the first direction. It moves independently and can move integrally along the second direction (see item 9 of the patent application).

In the above invention, it is preferable that the second transport device has a plurality of second grip portions that can grip the tray, and the plurality of second grip portions can follow the first And the second direction is independently moved (see item 10 of the patent application scope).

In the above invention, it is preferable that the first and the second gripping portions are capable of gripping a plurality of the trays; the storage device and the holding device are capable of holding a plurality of the trays (see Apply for patent coverage item 11).

(2) According to the present invention, there is provided an electronic component testing apparatus for electrically contacting an input and output terminal of a tested electronic component with a contact portion of a test head to perform a test of the electronic component to be tested, which comprises the above-described pallet handling device (See item 12 of the patent application scope).

Although it is not particularly limited in the above invention, it is preferable that the loading unit includes the loading unit for moving the electronic component to be tested from the tray to the second tray, and the testing unit for loading the unit from the loading unit. The test electronic component is pressed to the contact portion of the test head in a state of being carried on the second tray; the unloading portion moves the tested electronic component to be tested from the second tray to the tray corresponding to the test result; The tray transporting device supplies the tray containing the electronic component to be tested before the test to the loading portion, and the tray containing the tested electronic component to be tested is taken out from the unloading portion (see the patent application scope) Item 13).

In the present invention, by temporarily placing the tray in the storage device, the number of movements to the storage device can be reduced, and thus the exchange operation of the tray can be shortened.

Embodiments of the present invention will be described below with reference to the drawings.

1 is a schematic cross-sectional view showing an electronic component testing apparatus of the present embodiment, FIG. 2 is a perspective view showing the electronic component testing apparatus of FIG. 1, and FIG. 3 is a view showing processing of a pallet in the electronic component testing apparatus of FIG. 1. Conceptual illustration.

Further, Fig. 3 is a view for explaining a method of processing a tray in an electronic component testing device, and actually includes a portion in which elements arranged in the vertical direction are displayed in a plane. Therefore, its mechanical (stereo) configuration is illustrated in Figure 2.

The electronic component testing device of the present embodiment is a device for testing (checking) whether an IC component is properly operated in a state where a high temperature or a low temperature temperature is applied to an IC component, and classifying the IC component according to the test result, It consists of a processor 1, a test head 5 and a test device 6. From the test of the IC component of the electronic component test apparatus, the IC component is transferred from the client tray KST to the test tray TST, and is carried in a state of being carried on the test tray TST.

Therefore, the processor 1 of the present embodiment has the following configuration: as shown in FIGS. 1 to 3, the storage unit 200 houses the client tray KST carrying the IC component before the test or the IC component after the test; The unit 300 moves the IC element transferred from the storage unit 200 to the test tray TST and feeds it into the empty chamber unit 100; applies predetermined thermal stress to the IC element, and presses the IC element to the test while being stored in the test tray TST. The empty chamber portion 100 of the head 5; the unloading portion 400 carries out the tested IC components from the empty chamber portion 100, sorts them, and simultaneously moves them to the guest tray KST.

The test stand 50 provided on the test head 5 is connected to the test device 6 through the electric wire 7 shown in FIG. At the time of IC component test, the IC component electrically connected to the test socket 50 is connected to the test device 6 through the electric wire 7, and the test signal is transmitted and received between the IC component and the test device 6. As shown in Fig. 1, a space 8 is provided in a portion of the lower portion of the processor 1, and the test head 5 is disposed in a replaceable manner in the space 8, and is formed on the main base (substrate) 101 of the processor 1. The opening 101a can electrically contact the IC component and the test socket 50 on the test head 5. When the type of the IC component is changed, the test stand 50 on the test head 5 is replaced with a test stand of a type suitable for the exchange.

The following is a detailed description of each part of the processor 1.

<Storage part 200>

Fig. 4 is an exploded perspective view showing the storage used in the electronic component testing apparatus of Fig. 1, and Fig. 5 is a perspective view showing the passenger tray used in the electronic component testing apparatus of Fig. 1, and Fig. 6 is a first drawing. Front view of the storage unit of the electronic component testing device, Fig. 7 is a side view showing the storage unit of Fig. 6, and Fig. 8 is a front view showing the first transfer arm of the tray conveying device in the storage unit of Fig. 6 9 is a front view showing a second transfer arm of the tray transfer device in the storage unit of FIG. 6, and FIG. 10 is a block diagram showing a control system of the storage unit of the electronic component test device shown in FIG. 1.

As shown in the second and sixth figures, the storage unit 200 includes: storage 211 to 213 for storing the client tray KST; lifting devices 220A and 220B for holding the client tray KST and lifting the container; and storing the client tray in the storage 211 to 211 A tray transporting device 230 that is transported between 213 and the lifting devices 220A and 220B.

As shown in FIGS. 2 and 3, the storage unit 200 includes a pre-test storage 211 for storing the client tray KST for storing the IC components before the test, and a test storage 212 for storing and arranging the IC components classified according to the test results. The client tray KST; the empty tray storage 213 stores the client tray KST without the empty IC components.

As shown in Fig. 4, these storages 211 to 213 include a frame-shaped tray support frame 214, and a lifting table 215 which can be accessed from the lower portion of the tray support frame 214 and which can be raised and lowered. In the tray support frame 214, a plurality of client trays KST are stacked, and the stacked client trays KST are moved up and down by the lift table 215.

In the present embodiment, as shown in FIG. 5, in the guest tray KST, 60 storage units 91 for accommodating IC components are arranged in 10 rows and 6 columns, but actually there are various types depending on the types of IC components. The way the variants are configured.

The storage 211 to 213 have the same structure. Therefore, the appropriate number of the number of the pre-test IC storage 211, the test-complete IC storage 212, and the empty pallet storage 213 can be set as needed.

In the present embodiment, as shown in Fig. 2, the pre-test IC storage 211, the test-complete IC storage 212, and the empty pallet storage 213 are arranged side by side in the X-axis direction. As shown in FIGS. 2 and 3, one storage STK-B is provided in the storage unit 200 as the pre-test IC storage 211. On the other hand, seven storage units STK-1, STK-2, ..., STK-7 are provided in the storage unit 200 as the test completion IC storage 212, which can be classified into seven types of storage corresponding to the results of the test. That is to say, in addition to the difference between good and bad products, the good products can be divided into high-speed products, medium-speed products, low-speed products, or defective products can be divided into those who need to be tested.

Further, in the storage unit 200, two storage STK-Es are provided between the STK-4 and the STK-5 as the empty tray storage 213. In this STK-E, the stacking storage can be sent to the passenger tray KST which is open to the window portion 406 of the unloading portion 400.

As shown in Fig. 6, the electronic component testing device of the present embodiment has two first lifting devices 220A and five second lifting devices 220B.

One of the first lifting and lowering devices 220A is provided in each of the two window portions 306 of the main base 101 in which the loading unit 300 is opened. On the other hand, the unloading unit 400 is opened to the five window portions 406 of the main base 101, and one second lifting device 220B is provided.

As shown in Fig. 7, each of the lifting devices 220A and 220B is configured by a Z-axis rail 221 that is suspended from the main base 101, and a platform 222 that is provided on the Z-axis rail 221 and that can be raised and lowered. The platform 222 can be moved up and down between the first predetermined position H ₁ and the second predetermined position H ₂ by an actuator not shown.

The first predetermined position H ₁ is an upper limit of the Z-axis direction of the platform 222. When the platform 222 is at the first predetermined position H ₁ , the window portion 306 (or the window portion 406) is transmitted so that the client tray KST faces the loading. Part 300 (or unloading unit 400).

On the other hand, the second predetermined position H ₂ is the lower limit of the Z-axis direction of the stage 222, and the reception of the guest tray KST with the tray conveyance device 230 is performed while the stage 222 is at the second predetermined position H ₂ . transfer.

In this way, the lifting device 220A, 220B can hold the guest tray KST on the platform 222 and lift it up, so that the client tray KST can be in the storage portion 200 and the loading portion 300 (or the unloading portion 400). Move between.

As shown in FIGS. 6 and 7, the tray transporting device 230 includes an X-axis rail 231 disposed between the main base 101 and the storage 211 along the X-axis direction, and a first transport arm provided on the X-axis rail 231. 240 and the second transport arm 250. The first transfer arm 240 and the second transfer arm 250 can be independently moved in the X-axis direction on the X-axis rail 231 by an actuator (not shown).

As shown in Fig. 8, the first transfer arm 240 includes a base portion 241 that is disposed in the X-axis direction and that is movable in the X-axis direction, two Z-axis rails 242 and 245 that are fixed to the base portion 241, and a Z-axis rail 242 that is disposed on the Z-axis rail 242. 245 can move the two holding heads 243, 246 along the Z-axis direction, respectively. In addition, in the eighth figure, the state in which the first holding head 243 has been lowered is shown, and the state in which the second holding head 246 has been raised is displayed. Further, the first transfer arm 240 can also move in the Y-axis direction.

Each of the holding heads 243 and 246 can be moved independently of each other in the Z-axis direction by an actuator (not shown). Further, since the two holding heads 243 and 246 are attached to the same base portion 241 by the Z-axis rails 242 and 245, they cannot be independently moved in the horizontal direction.

Further, the holding heads 243 and 246 are respectively disposed with the opening and closing type holding claws 244 and 247 for holding the client tray KST downward. In the present embodiment, the holding heads 243, 246 are capable of holding two guest trays KST at the same time. Further, the number of the client trays KST in which the holding heads 243 and 246 are simultaneously held is not particularly limited.

The first transport arm 240 transports the passenger tray KST containing the pre-test IC component from the pre-test storage 211 to the first elevating device 220A, and removes the empty passenger tray KST that does not accommodate the IC component from the first lifting device. The 220A is transported to the storage board 290.

Usually, the first holding head 243 of the first transfer arm 240 transports the guest tray KST in which the IC element before the test is stored, from the pre-test storage 211 to the first lifting device 220A, and the second holding head 246 is not stored. The empty passenger tray KST of the IC component is transported from the first lifting device 220A to the storage plate 290.

On the other hand, as shown in FIG. 9, the second transfer arm 250 includes two movable heads 260 and 270 provided on the X-axis rail 241. The first and second movable heads 260 and 270 are moved independently of each other in the X-axis direction by an actuator (not shown). Further, each of the movable heads 260 and 270 of the second transfer arm 250 may move in the Y-axis direction.

The first movable head 260 includes a first base portion 261 that is movable in the X-axis direction of the X-axis rail 241, a first Z-axis rail 262 that is fixed to the first base portion 261, and a Z-axis rail 262 that can be disposed along the Z-axis. The first holding head 263 that moves in the axial direction. Further, in Fig. 9, the state in which the first holding head 263 has been lowered is shown.

The first holding head 263 can be moved in the Z-axis direction by an actuator (not shown). Further, the first holding head 263 is provided with an opening and closing type first holding claw 264 for holding the passenger tray KST downward. In the present embodiment, the first holding head 263 can hold the two client trays KST at the same time. Further, the number of the guest trays KST that the first holding heads 263 hold at the same time is not particularly limited.

Similarly, the second movable head 270 includes a second base portion 271 that is movable in the X-axis direction of the X-axis rail 241, a second Z-axis rail 272 that is fixed to the second base portion 271, and a Z-axis rail 272 that can be disposed on the Z-axis rail 272. The second holding head 273 that moves in the Z-axis direction. In addition, in the ninth figure, the state in which the second holding head 273 has been lowered is shown.

The second holding head 273 can be moved in the Z-axis direction by an actuator (not shown). Further, in the second holding head 273, the opening and closing type first holding claws 274 for holding the client tray KST are disposed downward. In the present embodiment, the second holding head 273 can hold the two client trays KST at the same time. Further, the number of the passenger trays KST that are simultaneously held by the second holding head 273 is not particularly limited.

The second transport arm 250 transports the client tray KST, which does not have the empty IC component, from the storage plate 290 or the empty tray storage 213 to the second lifting device 220B, and stores the client tray KST in which the tested IC component is housed. The second lifting device 220B is transported to the test completed storage 212.

As shown in FIG. 10, the tray transport device 230 is connected to the control device 280. The control device 280 transmits a control signal to each actuator (not shown) included in the tray transport device 230, whereby the first transport arm 240 and the second transport arm 250 can be controlled.

Further, the lifting devices 220A and 220B are also connected to the control device 280, and the control device 280 transmits control signals to the respective actuators (not shown) of the lifting devices 220A and 220B, whereby the lifting operation of the platform 222 can be controlled. .

The tray conveying device 230 of this embodiment has a height position M ₁ which allows the holding heads 243, 246, 263, and 273 to horizontally move without moving into the platform 222 of the lifting devices 220A, 220B as shown in Figs. 6 and 7. M ₂ (hereinafter simply referred to as moving possible positions M ₁ , M ₂ ). The first movement possible position M ₁ is located between the first predetermined position H ₁ and the second predetermined position H ₂ of the lifting and lowering devices 220A and 220B. On the other hand, the second movement possible position M ₂ is located between the second predetermined position H ₂ of the lifting and lowering devices 220A and 220B and the storages 211 to 213. In the present embodiment, between the storages 211 to 213 and the platform 222 located at the second predetermined position H ₂ , a space of a size that allows the holding heads 243, 246, 263, and 273 to pass is formed.

In the present embodiment, the first transfer arm 240 and the second transfer arm 250 have any one of the holding heads 243, 246, 263, and 273, and can be horizontally moved at any one of the possible movement positions M ₁ and M ₂ . mobile. In particular, in the first transport arm 240, the holding heads 243 and 246 are horizontally placed in a state where the both holding heads 243 and 246 are located at the first movement possible position M ₁ (or the second movement possible position M ₂ ). Moving in the direction, or placing one of the holding heads 243 at the first movement possible position M ₁ (or the second movement possible position M ₂ ) and the other holding head 246 at the second movement possible position M ₂ (or the first movement) In the state of the possible position M ₁ ), both of the holding heads 243 and 246 can be moved in the horizontal direction.

Further, for example, while the lifting devices 220A and 220B are moving up and down, the holding heads 243, 246, 263, and 273 at the second movement possible position M ₂ can be horizontally moved to move to the storages 211 to 213, and the lifting device 220A. Regardless of the position of the platform 222 of 220B, the holding heads 243, 246, 263, and 273 can be moved in the horizontal direction.

Further, in the present embodiment, as shown in Fig. 6, the storage unit 200 has a storage plate 290 for temporarily storing the client tray KST. The storage plate 290 is formed of a plate-shaped element, and the tray tray device 230 is placed on the storage plate 290 by the tray conveyance device 230, and the storage tray 290 can hold the guest tray KST. In the storage plate 290 of this embodiment, six guest trays KST can be stacked and held. In addition, the storage plate of the present invention may be any shape that can be placed on the tray transport device, and is not particularly limited to a plate shape.

The storage plate 290 is disposed between the first movement possible position M ₁ and the second movement possible position M _{2 of the} tray conveyance device 230, and is disposed between the first lifting device 220A and the second lifting device 220B, and is located in the test storage. 212 above the STK-3. In the present embodiment patterns, the transfer arm 240 by a first distance from the guest KST pallet positioned at the second predetermined movement position H of the lifting device ₂ 222 220A to the storage platform plate 290 is shorter than the first by The carrying arm 240 moves the guest tray KST from the platform 222 to the empty tray storage 213. Furthermore, in the moving distance of the above-described guest tray in the present invention, the moving distance in all directions is included.

<Loading unit 300>

Fig. 11 is an exploded perspective view showing the test tray used in the electronic component testing device shown in Fig. 1.

The above-described guest tray KST is transported from the pre-test storage 211 to the first lifting device 220A by the tray transport device 230, and then transported from the lower side of the main base 101 to the opening in the loading unit by the first lifting device 220A. Two window portions 306 of the main base 101 of 300.

Further, in the loading unit 300, the component conveying device 310 temporarily transfers the IC components stacked in the guest tray KST to the aligner 305, thereby correcting the mutual positional relationship between the IC components. The component handling device 310 then transfers the IC component transferred to the aligner 305 to the test tray TST parked in the loading section 300.

The test tray TST, as shown in Fig. 11, is arranged in parallel and equally spaced in the square frame 12, the two sides of the pallet 13 and the side 12a of the square frame 12 opposite the pallet 13 respectively The mounting sheets 14 are protruded at equal intervals. The insert accommodating portion 15 is formed between the pallets 13 or between the pallets 13 and the sides 12a by the two mounting pieces 14.

Each of the insert accommodating portions 15 can accommodate one insert 16 which is provided in the floating state in the mounting sheet 14 by using the fastener 17. Therefore, the mounting holes 19 for attaching the insert 16 to the mounting piece 14 are formed at both end portions of the insert 16. This insert 16, as shown in Fig. 11, is provided with 64 rows and arranged in 4 rows and 16 columns.

Further, each of the inserts 16 has the same shape and the same size, and the IC elements are housed in the individual inserts 16 respectively. The shape of the component housing portion 18 of the insert 16 is determined in accordance with the shape of the IC component to be housed, and is a square concave shape in the example shown in FIG.

Returning to Fig. 2, the loading unit 300 has a component transporting device 310 that moves the IC component from the client tray KST to the test tray TST. The component conveying device 310 includes two Y-axis rails 311 that are stretched along the Y-axis direction on the apparatus main base 101, a movable arm 312 that can move in the Y-axis direction on the Y-axis rail 311, and the movable arm 312 The arm 312 supports a movable head 313 that is movable in the X-axis direction, and a plurality of adsorption pads (not shown) that are disposed downward from the movable head 313. The adsorption pad can be moved up and down by an actuator not specifically shown, and a plurality of IC components can be moved from the client tray KST to the test tray TST at a time.

Further, as shown in FIGS. 2 and 3, an aligner 305 is provided between the client tray KST and the test tray TST. Although not specifically illustrated, the aligner 305 has a relatively deep recess, the periphery of which is surrounded by an inclined surface. Therefore, the IC component placed on the test tray TST from the client tray KST can accurately determine the mutual positional relationship of the IC components by falling into the aligner 305 before being moved to the test tray TST. The IC component can be accurately transferred to the test tray TST.

When all of the inserts 16 of the test tray TST carry the IC components, the test tray TST is moved into the chamber portion 100 by the tray circulation device 102.

On the other hand, when all the IC components stored in the client tray KST are transferred to the test tray TST, the first lifting device 220A lowers the empty tray and delivers it to the first transport arm 240 of the tray transport device 230. 1 The transport arm 240 temporarily stores the empty tray in the storage plate 290. When the guest tray KST located in the window portion 406 is filled with the IC device, the second transport arm 250 of the tray transport device 230 transports the empty tray from the storage plate 290 to the second lifting device 220B.

<room 100>

The test tray TST described above is loaded into the chamber unit 100 after the IC unit is loaded in the loading unit 300, and each IC element is tested in the state of being carried by the test tray TST.

As shown in FIGS. 2 and 3, the chamber portion 100 is constituted by applying a desired high temperature or low temperature thermal stress to the soaking chamber 110 placed on the IC component of the test tray TST; The IC element in the state in which the thermal stress is applied in 110 is in contact with the test chamber 120 in contact with the test head 5; the heat removal chamber 130 from which the thermal stress is removed from the IC element that has finished the test.

As shown in FIG. 2, the soaking chamber 110 is disposed to protrude above the test chamber 120. Further, as shown in the conceptual diagram of Fig. 3, the inside of the soaking chamber 110 is provided with a vertical conveying device, and during the period before the test chamber 120 is vacated, the plurality of test trays TST are held by the vertical conveying device while being in standby. . Mainly, the high-temperature or low-temperature thermal stress of about 55 to 150 degrees Celsius in the standby is applied to the IC element.

In the test chamber 120, a test head 5 is provided at a central portion thereof. As shown in the conceptual diagram of FIG. 3, the test tray TST is transported to the upper side of the test head 5 by a horizontal transport device, which is pressed by a pressing device (not shown). The IC component is pressed to the test socket 50 on the test head 5. Thereby, the input/output terminal of the IC component is electrically contacted with the contact pin of the test head 5, and in this state, the tester 6 performs the test of the IC component through the test head 5.

The result of the test is stored in the memory device of the electronic component testing device corresponding to the identification number indicating the test tray TST and the number of the IC component allocated in the test tray TST.

The heat removal chamber 130 is also arranged to protrude above the test chamber 120 like the soaking chamber 110. As shown in the conceptual diagram of Fig. 3, a vertical conveyance device is provided. In the heat removal chamber 130, when the IC element is subjected to a high temperature in the soaking chamber 110, the IC element is cooled and returned to room temperature by air blowing, and the temperature-recovered IC element is carried out to the unloading unit 400. . On the other hand, when the soaking chamber 110 applies a low temperature to the IC element, the IC element is heated and returned to a temperature at which no condensed water is generated by a warm air or a heater, and then the temperature-recovered IC element is carried out to the temperature. Unloading unit 400.

In the upper portion of the soaking chamber 110, an inlet for carrying the test tray TST from the main base 101 is formed. On the other hand, at the upper portion of the heat removal chamber 130, an outlet for carrying out the test tray TST to the main base 101 is formed. Further, on the main base 101, a tray circulation device 102 is provided for passing the test tray TST from the chamber portion 100 through the inlets and the outlets. For example, the tray circulation device 102 is configured to convey the test tray TST by a rotary roller or the like. The test tray TST carried out from the heat removal chamber 130 is returned to the heat equalizing chamber 110 through the unloading unit 400 and the loading unit 300 by the tray circulation device 102.

<Unloading unit 400>

In the unloading unit 400, the tested IC component is transported from the test tray TST carried out from the heat removing chamber 130 and sorted to the guest tray KST corresponding to the test result.

As shown in FIG. 2, five window portions 406 are formed on the main base 101 of the unloading portion 400. The window portion 406 is disposed such that the passenger tray KST that has been transported from the storage portion 200 by the second lifting device 220B faces the unloading portion 400.

The unloading unit 400 has two component sorting devices 410 for moving the tested IC components from the test tray TST to the guest tray KST. Like the component handling device 310, the component sorting device 410 has a Y-axis rail 411, a movable arm 412, and a movable head 413, which can simultaneously move a plurality of IC components from the test tray TST to the guest tray KST.

As shown in FIGS. 6 and 7, a second lifting device 202B for raising and lowering the guest tray KST is provided below each window portion 406. Here, the passenger tray KST that is loaded with the IC component that has been tested is stacked and lowered, and the full tray is received by the second transport arm 250 of the tray transport device 230, and the second transport arm 250 transports the fully loaded tray to the corresponding tray. The test 212 of the test results is completed.

Further, in the present embodiment, the window portion 406 at five places is formed in the unloading portion 400, so that five types (test results) can be distinguished in real time. On the other hand, in the case of six or more types, the five types of client trays KST corresponding to the high frequency of occurrence are always located in the window portion 406, and the type having a low frequency is temporarily placed in the buffer portion 405 ( Referring to Fig. 3), at a specific point in time, the guest tray KST corresponding to the category may be called to the window portion 406.

Next, a method of transporting the passenger tray in the storage unit of the present embodiment will be described.

12A to 12M are schematic front views showing a first example of a method of transporting a client tray in a storage unit according to an embodiment of the present invention, and FIGS. 13A to 13K are views showing the handling of a passenger tray in a storage unit according to an embodiment of the present invention. A schematic front view of the second example of the method.

Further, in the drawings 12A to 13K, the hatched guest tray indicates the tray in which the IC component is housed, and the guest tray without the hatching indicates the empty tray in which the IC component is not housed. Further, the description of the drawings and the following description do not limit the window portions 306 and 406 of the tray conveyance start point and the conveyance destination.

First, a method of transporting the empty tray KST _e from the window portion 306 of the loading unit 300 to the window portion 406 of the unloading unit 400 by the tray transport device 230 using the storage plate 290 will be described with reference to FIGS. 12A to 12M.

In addition, in the drawings 12A to 12M, for the sake of easy understanding, only the program for transporting the empty tray from the conveyance operation of the tray by using the storage plate 290 is shown and illustrated, and in the actual conveyance operation, the conveyance arm 240, The 250 and the lifting devices 220A and 220B simultaneously and independently carry out the handling of the plurality of passenger trays.

The component transfer device 310 of the loading unit 300 moves all of the IC components from the guest tray located in the second window portion 306 on the left side of FIG. 12A to the test tray. As shown in the figure, the guest tray is Empty tray KST _e without IC components. When the guest tray is the empty tray KST _e , as shown in Fig. 12B, the first lifting device 220A holding the empty tray KST _e is lowered to the second predetermined position H ₂ . Furthermore, the empty tray KST _{e is} stacked on the guest tray KST _f of the fully loaded IC component.

Then, as shown in FIG. 12C, the first transfer arm 240 is horizontally moved, and the second holding head 246 is positioned above the lowered first lifting device 220A. Then, as shown in Fig. 12D, the second holding head 246 is lowered, and the empty tray KST _{e is} received from the first lifting device 220A.

Then, as shown in FIG. 12E, the second holding head 246 holds the empty tray KST _e and rises to the first movement possible position M ₁ . Thereby, the full loading tray KST _f is exposed on the stage 222 of the first lifting device 220A.

Followed, as section 12F shown in FIG., The first transfer arm 240 moves the first possible the _horizontal position M is moved, so that the second holding head 246 is located in use above the storage plate 290, and then, the second holding head 246 lowered, The empty tray KST _{e is} placed on the storage plate 290.

When the storage plate 290 is not provided, the first transfer arm 240 must transport the empty tray KST _e to the empty tray storage 213. On the other hand, in the present embodiment, by temporarily storing the empty tray KST _e in the storage plate 290, the number of accesses of the first transfer arm 240 to the storages 211 to 213 is reduced, so that the exchange of the passenger tray can be shortened. . Further, when the storage tray 290 is fully loaded with the guest tray, the first transport arm 240 may move the empty tray KST _e to the empty tray storage 213.

Then, as shown in Fig. 12G, the second holding head 246 of the first transfer arm 240 is raised to the first movement possible position M ₁ , and as shown in Fig. 12H, the first transfer arm 240 is horizontally moved from the storage plate 290. And the upper portion of the first lifting device 220A is retracted.

At the same time, as shown in FIG., The second transfer arm 250 to the first movable head 260 may be moved horizontally on a position M ₁ of the first movement, stop plate 290 above the storage. Further, as shown in the figure, the second lifting device 220B disposed in the fourth window portion 406 from the right in the drawing starts to descend. Further, the guest tray held by the second lifting device 220B is loaded with the IC component by the component sorting device 410 of the unloading unit 400, and becomes the full-load tray KST _f .

Then, as shown in FIG. 12I, the first holding head 263 of the first movable head 260 is lowered, and the empty tray KST is received from the storage plate 290. Further, the second lifting device 220B is lowered to the second predetermined position H ₂ , and the lowered first lifting device 220A starts to rise.

Then, as shown in FIG. 12J, the first holding head 263 of the first movable head 260 holds the empty tray KST _e and rises to the first movement possible position M ₁ . Further, the first lifting device 220A, rises to a predetermined first position H _1, KST _f loaded tray 306 through the window portion 300 facing the loading unit. The component transporting device 310 of the loading unit 300 restarts the shifting operation of the IC component from the full loading tray KST _f before the test.

Then, as shown in FIG. 12K, the first movable head 260 is horizontally moved above the lowered second lifting device 220B, the first holding head 263 is lowered, and the empty tray KST _{e is} placed on the second lifting device 220B. on. At this time, the empty tray KST is stacked on the full-load tray KST _{f which} is originally held on the platform 222 of the second lifting device 220B.

Then, as shown in FIG. 12L, the first holding head 263 is raised to the first movement possible position M1, and the first movable head 260 is horizontally moved and retracted from above the second lifting device 220B.

Followed, as shown on FIG. 12M, the second lifting device 220B rises to a predetermined first position H _1, the face of the empty tray KST _e unloading unit 400 through the window portion 406. The component classifying means 410 of the unloading section 400 restarts moving the tested IC component to the empty tray KST _{e again} .

Further, when the storage plate 290 is not provided, the empty tray is supplied from the empty tray storage 213 to the second lifting device 220B by the first or second movable heads 260 and 270.

Next, referring to the drawings 13A to 13K, it is explained that the tray tray device 230 is used to transport the client tray KST _r containing the IC component that has to be retested from the window portion 406 of the unloading unit 400 to the loading unit 300. Method of window portion 306.

In addition, in the drawings 13A to 13K, for the sake of easy understanding, only the program for transporting the retest tray from the transport operation of the tray is taken and illustrated, and the transport arm 240 is transported during the actual transport operation. The 250 and the lifting devices 220A and 220B simultaneously and independently carry out the handling of the plurality of passenger trays. Further, in order to efficiently perform the transport operation of the retest tray described below, the second transport arm 250 can move the retest tray from the platform 222 of the second lifting device 220B located at the second predetermined position H ₂ to the storage board. The moving distance of 290 is shorter than the moving distance of the second transport arm 250 to move the retest tray from the platform 222 to the pre-test storage 211. Furthermore, in the moving distance of the above-described retest tray in the present invention, the moving distance in all directions is included.

When the IC component that has to be tested is placed in the guest tray located in the first window portion 406 from the right in FIG. 13A, as shown in FIG. 13B, the second lifting device 220B is lowered to the second predetermined position H ₂ . Further, the retest tray KST _{r is} stacked on the empty tray KST _e where the IC component is not housed.

Then, as shown in FIG. 13C, the first movable head 260 of the second transfer arm 250 is horizontally moved above the lowered first lift device 220A. At the same time, in order to avoid interference with the first movable head 260, the second movable head 270 also moves horizontally.

Then, the first holding head 263 of the first movable head 260 is lowered, and the retest tray KST _{r is} received from the second lifting and lowering device 220B.

Followed by the first holding head 263, as section 13E shown in FIG, holding the same time and then the test tray KST _r, up to the first movement may position M _1, the first movable head 260 is horizontally moved such that the first holding head 263 Located above the storage plate 290. Thereby, the first movable head 260 is retracted from above the second lifting device 220B, and the empty tray KST _e is exposed on the stage 222 of the second lifting device 220B.

Then, the first holding head 263 is lowered to the second movement possible position M ₂ , and the retest tray KST _{r is} placed on the storage plate 290. At the same time, the second first lifting device 220A starts to descend from the right in Fig. 13E.

Then, as shown in FIG. 13F, the first lifting device 220A is lowered to the second predetermined position H ₂ , and the first movable head 260 is raised to the first movement possible position M ₁ . Further, the lowered second lifting device 220B rises to the first predetermined position H ₁ . Classification element portion 400 of the unloading means 410 IC elements will have resumed again tested into the empty tray KST _e.

Then, as shown in FIG. 13G, the first movable head 260 is horizontally moved to be retracted from above the storage plate 290. Further, the first transfer arm 240 is moved in the horizontal direction so that the second holding head 246 is positioned above the storage plate 290.

Then, as shown in Fig. 13H, the second holding head 246 is lowered, and the retest tray KST _{r is} received from the storage plate 290. In the case where the storage plate 290 is not provided, the first transfer arm 240 and the second transfer arm 250 must respectively access the test completed storage 212 in which the retest tray is stored. On the other hand, in the present embodiment, by temporarily storing the retest tray on the storage plate 290, the number of accesses to the storage is reduced, so that the exchange work of the guest tray can be shortened.

Then, as shown in FIG. 131, the second holding head 246 holds the retest tray KST _r and rises to the first movement possible position M ₁ , and further, the first transfer arm 240 moves horizontally so that the second holding head 246 is located above the descending first lifting device 220A. Then, the second holding head 246 is lowered, and the retest tray KST _{r is} placed on the stage 222 of the first lifting device 220A.

Followed, as first shown in FIG. 13J, the second head holder 246 rises to move the first possible position after M _1, a first transfer arm 240 is retracted from the upper side 220A of the first lifting device.

Followed, as first shown in FIG. 13K, 220A of the first lifting device rises to a predetermined first position H _1, and then the test tray KST _r 306 through the window portion 300 facing the loading unit. The component handling device 310 of the loading unit 300 moves the IC component from the retest tray KST _r to the test tray TST in order to retest the IC component.

Further, when the first lifting device 220A is fully loaded with the client tray KST, the first transport arm 240 may move the retest tray KST _r to the pre-test storage 211. Further, the first transport arm 240 may transport the retest tray KST _r from the storage plate 290 to the first elevating device 220A by using the first holding head 243.

As described above, in the present embodiment, by temporarily storing the client tray KST on the storage board 290, the number of times the tray transport device 230 moves to the storages 211 to 213 can be reduced, and the passengers in the window portions 306 and 406 can be shortened. The exchange time of the end tray KST.

The above-described embodiments are described to facilitate the understanding of the present invention and are not intended to limit the present invention. Therefore, each element disclosed in the above embodiments includes all design changes or equivalents belonging to the technical field of the present invention.

1‧‧‧Processing machine

5‧‧‧Test head

50‧‧‧ test seat

6‧‧‧Testing device

7‧‧‧Wire

8‧‧‧ Space

91‧‧‧ 收纳 department

100‧‧‧ Empty Room

101‧‧‧Main base (substrate)

101a‧‧‧ openings

200‧‧‧ Storage Department

211~213‧‧ ‧ warehousing

214‧‧‧Tray support box

215‧‧‧ lifting platform

220A, 220B‧‧‧ lifting device

222‧‧‧ platform

230‧‧‧Tray handling device

231‧‧‧X-axis orbit

240‧‧‧1st carrying arm

243‧‧‧1st holding head

246‧‧‧2nd holding head

250‧‧‧2nd carrying arm

260‧‧‧1st movable head

263‧‧‧1st holding head

270‧‧‧2nd movable head

273‧‧‧2nd holding head

280‧‧‧Control device

290‧‧‧keeping board

300‧‧‧Loading Department

306‧‧‧ Window Department

400‧‧‧Unloading Department

406‧‧‧ Window Department

Fig. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention.

Fig. 2 is a perspective view showing the electronic component testing device of Fig. 1.

Fig. 3 is a conceptual diagram showing the processing of the tray in the electronic component testing device of Fig. 1.

Fig. 4 is an exploded perspective view showing the storage used in the electronic component testing apparatus of Fig. 1.

Fig. 5 is a perspective view showing a passenger tray used in the electronic component testing device of Fig. 1.

Fig. 6 is a front elevational view showing the storage portion of the electronic component testing device of Fig. 1.

Fig. 7 is a side view showing the storage portion of Fig. 6.

Fig. 8 is a front elevational view showing the first transfer arm of the tray transporting device in the storage unit of Fig. 6.

Fig. 9 is a front elevational view showing the second transfer arm of the tray transporting device in the storage unit of Fig. 6.

Fig. 10 is a block diagram showing a control system of the storage unit of the electronic component testing device shown in Fig. 1.

Fig. 11 is an exploded perspective view showing the test tray used in the electronic component testing device shown in Fig. 1.

Fig. 12A is a schematic front view (1) showing a first example of a method of transporting a passenger tray in a storage unit according to an embodiment of the present invention.

Fig. 12B is a schematic front view (part 2) showing a first example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 12C is a schematic front view (No. 3) showing a first example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 12D is a schematic front view (fourth) showing a first example of the method of transporting the client tray in the storage unit according to the embodiment of the present invention.

Fig. 12E is a schematic front view (fifth) showing a first example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 12F is a schematic front view (sixth) showing a first example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 12G is a schematic front view (No. 7) showing a first example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 12H is a schematic front view (eighth) showing a first example of the method of transporting the client tray in the storage unit according to the embodiment of the present invention.

Fig. 12I is a schematic front view (ninth) showing a first example of the method of transporting the client tray in the storage unit according to the embodiment of the present invention.

Fig. 12J is a schematic front view (No. 10) showing a first example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 12K is a schematic front view (11) showing a first example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 12L is a schematic front view (12) showing a first example of the method of transporting the client tray in the storage unit according to the embodiment of the present invention.

Fig. 12M is a schematic front view (13) showing a first example of the method of transporting the client tray in the storage unit according to the embodiment of the present invention.

Fig. 13A is a schematic front view (1) showing a second example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 13B is a schematic front view (part 2) showing a second example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 13C is a schematic front view (No. 3) showing a second example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 13D is a schematic front view (fourth) showing a second example of the method of transporting the client tray in the storage unit according to the embodiment of the present invention.

Fig. 13E is a schematic front view (fifth) showing a second example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 13F is a schematic front view (sixth) showing a second example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 13G is a schematic front view (No. 7) showing a second example of the method of transporting the client tray in the storage unit according to the embodiment of the present invention.

Fig. 13H is a schematic front view (eighth) showing a second example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

Fig. 13I is a schematic front view (ninth) showing a second example of the method of transporting the client tray in the storage unit according to the embodiment of the present invention.

Fig. 13J is a schematic front view (No. 10) showing a second example of the method of transporting the client tray in the storage unit according to the embodiment of the present invention.

Fig. 13K is a schematic front view (11) showing a second example of the method of transporting the passenger tray in the storage unit according to the embodiment of the present invention.

1. . . Processor

5. . . Test head

6. . . Test device

7. . . wire

8. . . space

101. . . Main base (substrate)

101a. . . Opening

50. . . Test stand

Claims (10)

A tray handling device for transporting a tray for accommodating electronic components to be tested, comprising: a plurality of storage devices for storing the tray; a plurality of holding devices for holding the tray and moving the tray in an up and down direction a single storage device for temporarily storing the tray; a plurality of transport devices for moving the tray in the vertical direction and the left-right direction, and transporting the tray between the storage device, the holding device, and the storage device; a control device for controlling the operation of the conveying device; the storage device comprising: a first storage device for storing a pre-test tray containing the tested electronic component before the test; and a second storage device for storing and storing the tested test The test tray of the electronic component; the third storage device stores the empty tray without the electronic component to be tested; the holding device includes: a first holding device, holding the pre-test tray, or holding the quilt before the storage test Testing the empty tray with the electronic component removed; the second holding device holds and stores the tested test The empty tray electronic component or holding the test tray is completed; a plurality of conveying means comprising a first conveying can each independently of the tray 1 and the second conveying device; the first, the second, and the third storage devices are disposed along the left-right direction; and the first and second storage devices are vertically and vertically oriented with respect to the first to third storage devices. The holding device and the storage device are located above; the storage device is disposed between the first holding device and the second holding device in the left-right direction; and the control device controls the first and the second conveying device to The first transport device transports the empty tray from the first holding device to the storage device, and the second transport device transports the empty tray from the storage device or the third storage device to the second holding device. According to the tray conveying device of the first aspect of the invention, the distance from the first holding device to the tray of the storage device by the first conveying device lowered to the lowest limit position is shorter than The moving distance of the first conveying device from the holding device to the tray of the third storage device at the lowest limit position. The tray transporting device according to claim 1, wherein the control device controls the first and second transporting devices such that the first transporting device has the tray in the first storage device and the first 1 transporting between the holding device, the storage device, and the third storage device; the second conveying device between the storage device, the second holding device, the second storage device, and the third storage device Handling. The tray transporting device according to claim 1, wherein the control device controls the first and the second transporting device such that: The first transport device transports the pre-test tray from the first storage device to the first holding device, and the second transport device transports the tested tray from the second holding device to the second storage device. The tray transporting device according to claim 1, wherein the control device controls the first and second transporting devices such that the second transporting device stores the electronic component to be tested that needs to be retested. Re-testing the tray and transporting the tray from the second holding device to the storage device; the first conveying device transporting the re-test tray from the storage device to the first holding device or the first storage device; the first holding device The retest tray is held or the retest tray is stored in the first storage device. The tray conveying device according to claim 1, wherein the first conveying device has a plurality of first gripping portions that can grip the tray, and the plurality of first gripping portions are independently movable in the vertical direction And, it is possible to move integrally in the left-right direction. The tray transporting device according to claim 6, wherein the second transporting device has a plurality of second gripping portions that can grip the tray, and the plurality of second gripping portions can be vertically and horizontally Move independently. In the tray transporting device according to Item 7, the first and second gripping portions are capable of gripping a plurality of the trays; and both the storage device and the holding device are capable of holding a plurality of the trays. An electronic component testing device for electrically contacting an input and output terminal of a tested electronic component with a contact portion of a test head to perform testing of the tested electronic component, which includes any one of claims 1 to 8 The tray handling device. The electronic component testing apparatus according to claim 9, comprising: a loading unit that moves the electronic component to be tested from the tray to the second tray; and a testing unit that moves the loading unit from the loading unit The test electronic component is pressed to the contact portion of the test head in a state of being carried on the second tray; the unloading portion moves the tested electronic component to be tested from the second tray to the tray corresponding to the test result; The tray transporting device supplies the tray containing the electronic component to be tested before the test to the loading unit, and the tray containing the tested electronic component to be tested is taken out from the unloading portion.