JP5137965B2 - Conveying device and electronic component handling device - Google Patents

Description

  The present invention relates to an electronic component handling apparatus capable of handling an electronic device under test in order to test an electronic component such as an IC device, and a transport device used therefor.

  In the manufacturing process of electronic components such as IC devices, a test apparatus for testing the finally manufactured electronic components is required. In such a test apparatus, a plurality of IC devices are handled by an electronic component handling apparatus called a handler, and each IC device is brought into electrical contact with the test head in the process to test the main apparatus (tester). Let the test run.

  In the handler, the IC device before the test is generally stored in the stocker while being stored in the customer tray. The loader unit transfers the IC device from the customer tray to the test tray, and the test device is mounted on the test tray. It is transported to the head and used for testing. The tested IC device is unloaded from the test head, and then unloaded from the test tray to a predetermined customer tray according to the test result in the unloader unit. The customer tray containing the tested IC device is moved into the device storage section of the handler by the tray set elevator. The customer tray is transported and stored in each stocker classified into a category such as a non-defective product or a defective product by a tray transport arm provided in the device storage unit.

  Here, when the tested IC device is transferred from the test tray to the customer tray, the IC device may be inclined and mounted in the customer tray storage unit, and the IC device may protrude from the customer tray storage unit. When a conventional tray transport arm transports a customer tray containing a tested IC device, it holds the customer tray so that the customer tray to be transported is covered with a dummy customer tray (dummy tray). Therefore, when the IC device protrudes from the storage portion of the customer tray, the IC devices protruding from the bottom surface of the dummy tray are leveled so that the IC device is stored at a normal position in the storage portion of the customer tray. .

  However, in the above method, depending on how the IC device protrudes, the dummy tray may crush the IC device when the tray transfer arm holds the customer tray. In some cases, two IC devices may be stacked and stored in one storage section of the customer tray, but in this case, the dummy tray also crushes the IC devices. In such a case, there arises a problem that an IC device determined to be a non-defective product as a result of the test is shipped as a non-defective product despite being damaged.

  The present invention has been made in view of such a situation, and an electronic component handling apparatus capable of detecting that an electronic component has protruded from a predetermined position of the tray, and an electronic component having a predetermined position of the tray. An object of the present invention is to provide a transport device and an electronic component handling device that can detect that the electronic component protrudes from the outside and prevent damage to the protruding electronic component.

  In order to achieve the above object, according to the first aspect of the present invention, there is provided an electronic component having an overhang detection means capable of detecting that an electronic component housed in a tray is protruding from a predetermined position during the tray conveyance. A component handling device is provided (Invention 1).

  2ndly, this invention is equipped with the tray holding | maintenance part, and the said tray holding | maintenance part has an electronic component protrusion detection means which can detect that the electronic component accommodated in the tray has protruded from the predetermined position. An electronic component handling apparatus is provided (Invention 2). Examples of the tray holding unit include, but are not limited to, a transport device described later.

  Thirdly, the present invention provides a transport device capable of holding and moving a tray containing electronic components in an electronic component handling apparatus, wherein the main body portion can hold the tray, and the tray held by the main body portion. Detecting the movement of the member in the Z-axis direction and a member attached to the main body so as to be able to move in the Z-axis direction by contacting an electronic component protruding from a predetermined position on the tray The present invention provides a transport device characterized in that the sensor is provided (Invention 3). In this specification, the term “sensor” includes the concept of a switch.

  According to the above invention (Invention 3), when an electronic component protrudes from a predetermined position on the tray (when tilted or stored in a stack), when the tray is held by the transport device, The member contacts the protruding electronic component and moves in the Z-axis direction, and the sensor detects the movement of the member in the Z-axis direction. Thereby, it can be detected that the electronic component protrudes from the predetermined position of the tray. Further, since the member that covers the tray moves in the Z-axis direction in contact with the protruding electronic component, it is possible to prevent the electronic component from being crushed by the member and damaging the electronic component.

  Furthermore, according to the above configuration, even if the same number of sensors as the number of tray storage units is not provided, it is possible to detect the protrusion of electronic components in all the tray storage units with a small number of sensors. The protruding of the electronic component can be detected even for trays having different positions and sizes. Therefore, the transport device is very economical.

  In the said invention (invention 3), it is preferable that the said member is attached with the degree of freedom in the Z-axis direction with respect to the said main-body part (invention 4). According to this invention, when the member comes into contact with the protruding electronic component, the electronic component is hardly loaded, so that the member can reliably prevent the electronic component from being damaged by crushing the electronic component. it can.

  In the said invention (invention 3), the said main-body part may be provided with the support part which supports the said member, and the guide part which guides the movement of the said member in the Z-axis direction (invention 5).

  In the said invention (invention 3), it is preferable that the said conveying apparatus is provided with the holding device which can hold | maintain and release a tray (invention 6).

  In the above invention (Invention 6), the holding device includes a claw member engageable with the tray, the claw member is rotatable about the Z axis, and the claw member is arranged about the Z axis. It is preferable that the tray can be held or released by rotating (Invention 7).

  Fourthly, the present invention is an electronic component handling apparatus capable of handling an electronic device under test in order to perform a test of the electronic component, and is provided with the transport device (Inventions 3 to 7). An electronic component handling apparatus is provided (Invention 8).

  In the said invention (invention 8), the said conveying apparatus may be provided in the storage part which piles up and stores several trays (invention 9).

  In the above invention (Invention 8), when the sensor detects movement of the member in the Z-axis direction, the tray may be moved to a predetermined position (Invention 10), or a warning may be issued. Good (Invention 11) Examples of the predetermined position include a position to be subjected to a retest (a placement position of a tray storing electronic components before the test), a position where an operator can handle the tray, and the like.

  According to the transfer device or the electronic component handling device of the present invention, it is possible to detect that the electronic component protrudes from the predetermined position of the tray, and further, in some cases, prevent the protruding electronic component from being damaged. You can also

1 is an overall side view of an IC device test apparatus including a handler according to an embodiment of the present invention. It is a perspective view of the handler shown in FIG. It is a flowchart of the tray which shows the handling method of the IC device under test. It is the schematic of the device storage part of the handler. It is a perspective view of the customer tray used with the same handler. It is a bottom view of the tray conveyance arm in the same handler. It is a front view of the tray conveyance arm in the same handler, (a) shows a normal state, (b) shows a state where the IC device protrudes.

Explanation of symbols

1 ... Handler (electronic parts handling device)
2 ... IC devices (electronic components)
DESCRIPTION OF SYMBOLS 10 ... IC device (electronic component) test apparatus 20 ... (customer tray) storage part 200 ... (device) storage part 205 ... Tray conveyance arm (conveyance apparatus, tray holding part)
21 ... Arm substrate (main part)
22 ... Claw member 23 ... Guide pin (guide part)
24. Proximity sensor (sensor)
26 ... Support plate (support part)
27 ... Detection plate (member)

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
First, an overall configuration of an IC device testing apparatus including an electronic component handling apparatus (hereinafter referred to as “handler”) according to the present embodiment will be described. As shown in FIG. 1, the IC device test apparatus 10 includes a handler 1, a test head 5, and a test main apparatus 6. The handler 1 sequentially carries IC devices (an example of electronic components) to be tested to a socket provided in the test head 5, classifies the IC devices that have been tested according to the test results, and stores them in a predetermined tray. To do.

  The socket provided in the test head 5 is electrically connected to the test main device 6 through the cable 7, and the IC device detachably attached to the socket is connected to the test main device 6 through the cable 7, The IC device is tested by a test electrical signal from the test main apparatus 6.

  A control device that mainly controls the handler 1 is built in the lower portion of the handler 1, but a space portion 8 is provided in part. The test head 5 is replaceably disposed in the space portion 8, and an IC device can be attached to a socket on the test head 5 through a through hole formed in the handler 1.

  This handler 1 is an apparatus for testing an IC device as an electronic component to be tested at room temperature, a temperature state higher than room temperature (high temperature) or a temperature state lower than room temperature (low temperature). As shown in FIGS. 2 and 3, the chamber 100 includes a thermostatic bath 101, a test chamber 102, and a heat removal bath 103. The upper part of the test head 5 shown in FIG. 1 is inserted into the test chamber 102 where the IC device 2 is tested.

  FIG. 3 is a diagram for understanding the method of handling the test IC device in the handler according to the present embodiment. In practice, the members arranged in the vertical direction are also shown in a plan view. is there. Therefore, the mechanical (three-dimensional) structure can be understood mainly with reference to FIG.

  As shown in FIGS. 2 and 3, the handler 1 of the present embodiment stores a device storage unit 200 that stores IC devices to be tested from now on, and classifies and stores tested IC devices, and a device storage unit 200. A loader unit 300 for feeding an IC device to be tested sent from the chamber unit 100 to the chamber unit 100, a chamber unit 100 including a test head, and an unloader unit 400 for taking out and classifying a tested IC device that has been tested in the chamber unit 100. It is composed of Inside the handler 1, the IC device is accommodated in the test tray TST and conveyed.

  A number of IC devices before being set in the handler 1 are stored in the customer tray KST shown in FIG. 5, and are supplied to the device storage unit 200 of the handler 1 shown in FIGS. The IC device is transferred from the customer tray KST to the test tray TST conveyed in the handler 1. Inside the handler 1, as shown in FIG. 3, the IC device is moved on the test tray TST and tested for proper operation at room temperature or under high or low temperature stress. (Inspected) and classified according to the test results.

  Here, parts related to the device storage unit 200, the loader unit 300, and the unloader unit 400 of the handler 1 will be described.

  As shown in FIG. 2, the device storage unit 200 includes a pre-test device stocker 201 that stores pre-test IC devices, and a tested device stocker 202 that stores IC devices classified according to the test results. It is provided.

  4, the pre-test device stocker 201 is loaded with a customer tray KST storing pre-test IC devices to be tested, and the tested device stocker 202 is classified after finishing the test. A customer tray KST in which the tested IC devices are stored is loaded. The customer tray KST in the present embodiment includes the IC device storage unit 20 of 10 rows × 6 columns as shown in FIG. 5, but the present invention is not limited to this.

  As shown in FIGS. 2 to 4, in this embodiment, two stockers STK-B are provided as the pre-test stocker 201. Next to the stocker STK-B, two empty stockers STK-E to be sent to the unloader unit 400 are provided as the tested device stocker 202. Next to that, eight stockers STK-1, STK-2,..., STK-8 are provided as tested device stockers 202, and sorted into a maximum of eight categories according to test results and stored. It is configured so that it can. In other words, in addition to good products and defective products, it is possible to sort non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. .

  On the other hand, as shown in FIG. 2, the device substrate 105 in the loader unit 300 has three pairs of window portions 306 arranged so that the customer tray KST faces the upper surface of the device substrate 105. As shown in FIG. 4, a tray set elevator 307 for raising and lowering the customer tray KST is provided below each window portion 306. Further, as shown in FIGS. 2 and 4, a tray transfer arm 205 is provided in the upper part of the device storage unit 200.

  The tray transfer arm 205 is movable in the Z-axis direction and the X-axis direction, moves downward from the origin to the Z-axis, holds the customer tray KST loaded on the pre-test device stocker 201, and moves to the Z-axis. After moving upward and returning to the origin, the customer tray KST is moved to the predetermined tray set elevator 307 by moving in the X-axis direction. The tray set elevator 307 raises the received customer tray KST and makes it appear in the window 306 of the loader unit 300.

  Then, in this loader unit 300, the IC devices to be tested loaded on the customer tray KST are once transferred to the precursor 305 by the XY transport device 304, where the mutual positions of the IC devices to be tested are corrected. After that, the IC device under test transferred to the precursor 305 is transferred again to the test tray TST stopped at the loader unit 300 by using the XY transport device 304 again.

  As shown in FIG. 2, the XY transport device 304 that reloads IC devices to be tested from the customer tray KST to the test tray TST has two rails 301 installed on the upper portion of the device substrate 105 and the two rails 301. A movable arm 302 that can reciprocate between the test tray TST and the customer tray KST by the rail 301 (this direction is referred to as a Y-axis direction), and is supported by the movable arm 302 and along the movable arm 302 is an X axis. And a movable head 303 that can move in the direction.

  A suction pad is mounted downward on the movable head 303 of the XY transport device 304. The suction pad moves while sucking air, so that the IC device under test is sucked from the customer tray KST. The IC device under test is transferred to the test tray TST. For example, about eight suction pads are attached to the movable head 303, and eight IC devices to be tested can be transferred to the test tray TST at a time.

  The unloader unit 400 shown in FIGS. 2 and 3 is also provided with XY transport devices 404 and 404 having the same structure as the XY transport device 304 provided in the loader unit 300. In 404, the tested IC devices are transferred from the test tray TST carried out to the unloader unit 400 to the customer tray KST.

  As shown in FIG. 2, the device substrate 105 in the unloader unit 400 has two pairs of windows 406 arranged so that the customer tray KST carried to the unloader unit 400 faces the upper surface of the device substrate 105. It is. As shown in FIG. 4, a tray set elevator 407 for raising and lowering the customer tray KST is provided below each window 406.

  The tray set elevator 407 is lowered by placing a customer tray KST (full tray) filled with the tested IC devices to be tested. The tray transfer arm 205 shown in FIGS. 2 and 4 receives the full tray from the lowered tray set elevator 407, moves in the X-axis direction up to a predetermined tested device stocker 202, and then moves down in the Z-axis. The full tray is placed on the tested device stocker 202, and then moved upward on the Z axis to return to the origin. In this way, the full tray is stored in the tested device stocker 202.

  As shown in FIGS. 2 and 4, in this embodiment, two tray transfer arms 205 are arranged side by side in the X-axis direction. Each tray transfer arm 205 can move independently in the Z-axis direction, but moves in parallel in the X-axis direction.

  As shown in FIGS. 6 and 7, the tray transfer arm 205 is provided at substantially four corners of the arm substrate 21 (corresponding to the main body of the present invention) formed slightly larger than the customer tray KST and the lower surface of the arm substrate 21. The proximity sensor 24 and a detection plate 27 positioned below the proximity sensor 24 are provided. The type of the proximity sensor 24 is not particularly limited. For example, the proximity sensor 24 may be any of a high-frequency oscillation type using electromagnetic induction, a magnetic type using a magnet, and a capacitance type using a change in capacitance. Good.

  The number of proximity sensors 24 in the present embodiment is four, but is not limited to this. In consideration of the manufacturing cost and the like of the tray transfer arm 205, it is preferable that the necessary number is sufficient to detect the protrusion of the IC device 2 in all the storage units 20 of the customer tray KST.

  As shown in FIG. 7, support plates 26 are provided on both lower sides of the arm substrate 21 via block members 25. The support plate 26 is extended toward the center of the arm substrate 21, and the detection plate 27 is supported by the support plate 26 at both sides thereof. Thereby, the detection plate 27 is attached to the arm substrate 21 with a degree of freedom in the Z-axis direction. That is, the detection plate 27 can freely move in the Z-axis direction with the support plate 26 as a lower limit. When the detection plate 27 moves in the Z-axis upward direction with respect to the arm substrate 21, the proximity sensor 24 detects that the detection plate 27 has approached.

  Further, claw members 22 that can rotate around the Z axis are provided at substantially four corners on the lower side of the arm substrate 21, and guide pins 23 are provided in the vicinity of the claw members 22. A cutout 271 is formed in the detection plate 27 at a position corresponding to the guide pin 23. In the present embodiment, the guide pin 23 has a cylindrical shape, and the cutout 271 of the detection plate 27 has a semicircular shape. With this configuration, the detection plate 27 is guided by the guide pin 23 in the notch 271 when moving in the Z-axis direction with respect to the arm substrate 21. Further, the movement of the detection plate 27 with respect to the arm substrate 21 in the XY axis direction is restricted by the guide pins 23.

  The claw member 22 includes a claw 221 in a part of the circumferential direction thereof, and the claw 221 engages with an edge portion of the customer tray KST by holding the customer tray KST by rotating in the closing direction around the Z axis. The claw 221 engaged with the edge of the customer tray KST is released from the edge of the customer tray KST by rotating in the opening direction around the Z axis, and the customer tray KST can be released. .

  In a state where the tray transfer arm 205 holds the customer tray KST by the claw member 22, the detection plate 27 covers the customer tray KST. Thereby, it is possible to prevent the IC device from jumping out of the customer tray KST during the conveyance of the customer tray KST loaded with the IC device.

  As shown in FIG. 7B, the tray transfer arm 205 having the above-described configuration is stored in the storage unit 20 of the customer tray KST with the IC device 2 tilted and the customer with the IC device 2 protruding from the storage unit 20. When the tray KST is held, the detection plate 27 comes into contact with the protruding IC device 2 and moves in the Z-axis upward direction. The proximity sensor 24 detects that the detection plate 27 has approached, and thereby can detect that the IC device 2 protrudes from the storage unit 20 of the customer tray KST. At this time, the detection plate 27 moves in the Z-axis upward direction with almost no load applied to the IC device 2 that is in contact therewith, so that the detection plate 27 crushes the IC device 2 and the IC device 2 is damaged. Can be prevented.

  On the other hand, when two IC devices 2 are stacked and stored in one storage unit 20 of the customer tray KST and the customer tray KST in a state where the IC device 2 protrudes from the storage unit 20 of the customer tray KST is held, In the same manner as described above, it can be detected that the IC device 2 protrudes from the storage unit 20 of the customer tray KST. In addition, it is possible to prevent the detection plate 27 from crushing the IC device 2 and damaging the IC device 2.

  When it is detected that the IC device 2 protrudes from the storage unit 20 of the customer tray KST as described above, the handler 1 uses the tray transfer arm 205 to transfer the customer tray KST to the pre-test device stocker 201, for example. A retest may be performed, or a warning such as sound or light may be issued to notify the operator.

  According to the configuration of the tray transfer arm 205 provided with the detection plate 27, even if the same number of proximity sensors 24 as the number of the storage units 20 of the customer tray KST are not provided, a small number of proximity sensors 24 can be used for the customer tray KST. Any protrusion of the IC device 2 in the storage unit 20 can be detected. Further, the protrusion of the IC device 2 can be detected even for the IC devices 2 of different types, that is, for the customer trays KST having different positions and sizes of the storage units 20. Such a tray transfer arm 205 is extremely economical.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, the proximity sensor 24 may be another type of sensor, such as a contact sensor (switch), as long as it can detect the movement of the detection plate 27 in the Z-axis direction. Further, the number of proximity sensors 24 in the present embodiment is four, but may be one to several or more.

  The present invention is useful for grasping the storage state of the electronic components mounted on the tray.

Claims (9)

In the electronic component handling device, a transport device capable of holding and moving a tray containing electronic components,
A main body that can hold the tray;
A plate member attached to the main body so as to cover the tray held by the main body and to be movable in the Z-axis direction in contact with an electronic component protruding from a predetermined position on the tray;
And a sensor for detecting movement of the plate member in the Z-axis direction. The transport apparatus according to claim 1 , wherein the plate member is attached to the main body portion with a degree of freedom in the Z-axis direction. The transport device according to claim 1 , wherein the main body portion includes a support portion that supports the plate member and a guide portion that guides movement of the plate member in the Z-axis direction. The transport apparatus according to claim 1 , wherein the transport apparatus includes a holding device capable of holding and releasing the tray. The holding device includes a claw member that can be engaged with the tray, the claw member is rotatable about the Z axis, and the tray is moved by rotating the claw member about the Z axis. The transport apparatus according to claim 4 , wherein the transport apparatus can be held or released. An electronic component handling apparatus capable of handling an electronic component under test in order to test an electronic component, comprising the transport device according to any one of claims 1 to 5. apparatus. The electronic component handling device according to claim 6 , wherein the transport device is provided in a storage unit that stacks and stores a plurality of trays. The electronic component handling apparatus according to claim 6 , wherein when the sensor detects movement of the plate member in the Z-axis direction, the tray can be moved to a predetermined position. The electronic component handling apparatus according to claim 6 , wherein a warning is issued when the sensor detects movement of the plate member in the Z-axis direction.

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