JP4054465B2 - Electronic component testing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component testing apparatus that tests an electronic component such as an IC chip at a predetermined temperature. More specifically, even when the electronic component self-heats during a test, the ambient temperature of the electronic component is always maintained at a set temperature. The present invention also relates to an electronic component testing apparatus that can test an electronic component with high reliability at a desired set temperature.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device or the like, a test apparatus for testing a part such as an IC chip manufactured finally is required. As one type of such a test apparatus, an apparatus for testing an IC chip under a high temperature, a normal temperature, or a low temperature lower than the normal temperature is known. This is because, as a characteristic of the IC chip, it is necessary to ensure that it operates well even at high temperature, normal temperature or low temperature.
[0003]
In such a test apparatus, the upper part of the test head is covered with a chamber, the inside is made a sealed space, and the IC chip is transported onto the test head, where the IC chip is pressed and connected to the test head, The test is performed at a high temperature, normal temperature, or low temperature within a certain temperature range. By such a test, the IC chip is well tested and at least divided into a good product and a defective product.
[0004]
[Problems to be solved by the invention]
However, with the recent increase in the speed and integration of IC chips, self-heating during operation increases, and even during IC chip testing, even if the interior of the chamber is maintained at a constant temperature, It has become difficult to test IC chips at test temperatures. For example, some types of IC chips can generate as much as 30 watts of self-heating. When testing an IC chip having a large amount of self-heating, the ambient temperature of the IC chip rises due to self-heating regardless of how much the chamber is kept at a constant temperature. It has become difficult to test chips. When the IC chip cannot be tested at the specified test temperature, there is a problem that the reliability of the test is lowered.
[0005]
In particular, in the high temperature test, when the IC chip has a large self-heating, even if the set temperature in the chamber is 80 ° C, the actual IC chip device temperature becomes 90 ° C due to the self-heating of the IC chip. Becomes considerably larger than the set temperature. Therefore, conventionally, in consideration of self-heating of the IC chip, the correction value (10 ° C.) is determined in advance, and the set temperature in the chamber is set to 70 ° C., which is about 10 ° C. lower than 80 ° C., for example. During the test, the test is performed on the assumption that the temperature of the IC chip is set to 80 ° C. according to the test specifications.
[0006]
However, it is difficult to determine the correction value in advance when the amount of self-heating is very large due to high integration of IC chips or when the test time is long. It is difficult to accurately control the test temperature.
[0007]
The present invention has been made in view of such a situation, and even if an electronic component self-heats during a test, the ambient temperature of the electronic component is always maintained at a set temperature, and the electronic component can be highly reliable at a desired set temperature. An object of the present invention is to provide an electronic component testing apparatus that can be tested.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, an electronic component test apparatus according to the present invention includes a connection terminal to which an electronic component to be tested is detachably connected, and the electronic component is connected to the connection terminal. The temperature control gas supply means for blowing the temperature-controlled gas around the electronic component during the test of the electronic component through the pusher pressed toward the connection terminal and the blower hole formed in the pusher And a sealed chamber that integrally covers the periphery of the connection terminal, the pusher, and the electronic component, and a temperature control blower that sets the interior of the chamber to a predetermined temperature for testing the electronic component. The temperature control gas supplied by the temperature control gas supply means is temperature-controlled to a temperature equal to or lower than the predetermined temperature set by the temperature control blower .
[0009]
The pusher preferably includes a temperature sensor capable of detecting the temperature of the electronic component and / or the ambient temperature of the electronic component. The temperature sensor is not particularly limited, and is a contact temperature sensor such as a thermocouple or a thermistor that detects the temperature by contacting the portion to be measured, or a radiation thermometer that can detect the temperature in a non-contact manner. Any of the non-contact temperature sensors may be used.
[0010]
The temperature control gas supply means controls the temperature and / or the air flow rate for controlling the temperature and / or the air flow rate of the temperature control gas supplied to the periphery of the electronic component during the test of the electronic component based on the temperature data from the temperature sensor. It is preferable to have a control means.
[0011]
It is preferable that the temperature control gas supply means has a drying means for previously drying the temperature control gas supplied to the periphery of the electronic component.
[0013]
The temperature control gas supplied from the temperature control gas supply means to the periphery of the electronic component is preferably air whose temperature is adjusted by taking out part of the air present in the chamber.
[0014]
The electronic component testing apparatus according to the present invention includes an adapter to which the pusher is fixed, a match plate that elastically holds the adapter, and a pressing portion that releasably contacts the upper surface of the adapter, and the pusher is connected to the connection unit. A drive plate that moves in a terminal direction, and the match plate is disposed on the connection terminal so as to be exchangeable according to the type of electronic component, and the drive plate is arranged above and below the match plate. It is arranged so that it can move in a direction, and a blower hole formed in the pusher communicates with a blower hole formed in the adapter, and a blower hole formed in the adapter is connected to the drive plate. It is configured to be able to communicate with the air blowing hole formed in the pressing portion as appropriate.
[0015]
It is preferable that a seal member for sealing a connection portion between the air blowing holes is attached to a contact portion between the pressing portion of the drive plate and the adapter.
[0016]
[Action]
Usually, when a high temperature test, a normal temperature test, or a low temperature test of an electronic component such as an IC chip is performed, the electronic component becomes hot due to self-heating, and the ambient temperature of the electronic component becomes higher than the set temperature. However, in the electronic component testing apparatus according to the present invention, the temperature-controlled gas is directly blown around the electronic component through the blower hole formed in the pusher. The temperature control gas is, for example, dry air, and is set to, for example, a temperature according to the test specification or a temperature obtained by adding a control value to the temperature. For example, in the case of a high-temperature test with a test specification of 80 ° C., air conditioned to a temperature of 80 ° C. or lower is used for the electronic component so that the electronic component under test is maintained at 80 ° C. Spray directly around. During the test, by detecting the temperature of the electronic component, the temperature and / or air volume of the temperature control gas blown to the electronic component is adjusted so that the electronic component has a temperature that meets the test specifications. It is preferable to adjust the temperature control gas and / or the air volume for each electronic component. This is because even if the electronic components to be tested are the same, the temperature may change depending on the position of the electronic components in the chamber.
[0017]
As described above, in the electronic component test apparatus according to the present invention, the electronic component is always tested in a state close to the set temperature (temperature according to the test specifications), and the reliability of the test is improved.
[0018]
Further, in the present invention, the temperature of the electronic component and / or the ambient atmosphere temperature of the electronic component is detected by the temperature sensor, and the temperature of the blowing gas and / or the blowing amount is controlled based on the temperature data from the temperature sensor. In addition, stabilization and uniformity of temperature control can be achieved, and unnecessary air blowing is eliminated, contributing to energy saving.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on embodiments shown in the drawings.
FIG. 1 is a cross-sectional view of an essential part of an IC test apparatus according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing an example of a structure near a socket in a test head of the IC test apparatus, and FIGS. FIG. 5 is an overall side view of the IC test apparatus, FIG. 6 is a perspective view of the handler shown in FIG. 5, FIG. 7 is a flowchart of the tray showing how the IC under test is routed, and FIG. 9 is a perspective view showing a structure of an IC stocker of the IC test apparatus, FIG. 9 is a perspective view showing a customer tray used in the IC test apparatus, and FIG. 10 is a partially exploded perspective view showing a test tray used in the IC test apparatus. is there.
[0020]
First, an overall configuration of an IC test apparatus as an electronic component test apparatus according to an embodiment of the present invention will be described.
As shown in FIG. 5, the IC test apparatus 10 according to the present embodiment includes a handler 1, a test head 5, and a test main apparatus 6.
The handler 1 sequentially carries the IC chips to be tested to the IC socket provided in the test head 5, sorts the IC chips that have been tested according to the test result, and stores them in a predetermined tray.
[0021]
The IC socket provided in the test head 5 is connected to the test main device 6 through the cable 7, and the IC chip detachably attached to the IC socket is connected to the test main device 6 through the cable 7 for testing. The IC chip is tested by a test signal from the main device 6.
[0022]
A control device that mainly controls the handler 1 is built in the lower portion of the handler 1, but a space portion 8 is provided in part. The test head 5 is replaceably disposed in the space portion 8, and an IC chip can be attached to an IC socket on the test head 5 through a through hole formed in the handler 1.
[0023]
The IC test apparatus 10 is an apparatus for testing an IC chip as an electronic component to be tested at room temperature, a temperature state higher than room temperature (high temperature) or a lower temperature state (low temperature). As shown in FIGS. 6 and 7, it has a chamber 100. The chamber 100 is used to test a constant temperature bath 101 for applying a desired high or low temperature thermal stress to the IC chip to be tested, and an IC chip in a state where the thermal stress is applied in the constant temperature bath 101. It has a test chamber 102 and a heat removal tank 103 for removing thermal stress from the IC chip tested in the test chamber 102. The upper portion of the test head 5 shown in FIG. 5 is inserted into the test chamber 102 as shown in FIG. 1, and the IC chip 2 is tested there.
[0024]
FIG. 7 is a view for understanding the method of routing the test IC chip in the IC test apparatus of the present embodiment, and actually shows the members arranged in the vertical direction in plan view. There is also a part. Therefore, the mechanical (three-dimensional) structure can be understood mainly with reference to FIG.
[0025]
As shown in FIGS. 6 and 7, the handler 1 of the IC test apparatus 10 of the present embodiment stores an IC chip to be tested from now on, and also classifies and stores tested IC chips, A loader unit 300 for sending an IC chip to be tested sent from the IC storage unit 200 to the chamber unit 100, a chamber unit 100 including a test head, and an unloader for classifying and extracting tested ICs that have been tested in the chamber unit 100 Part 400. Inside the handler 1, the IC chip is accommodated in a tray and conveyed.
[0026]
A large number of IC chips before being accommodated in the handler 1 are accommodated in the customer tray KST shown in FIG. 9, and in this state, the IC chips are supplied to the IC accommodating portion 200 of the handler 1 shown in FIGS. The IC chip 2 is transferred from the customer tray KST to the test tray TST (see FIG. 10) conveyed in the handler 1. Inside the handler 1, as shown in FIG. 7, the IC chip moves on the test tray TST, is subjected to high temperature or low temperature stress, and is tested (inspected) for proper operation. Categorized according to the test results.
Hereinafter, the inside of the handler 1 will be described in detail individually.
[0027]
IC storage unit 200
As shown in FIG. 6, the IC storage unit 200 includes a pre-test IC stocker 201 that stores pre-test IC chips, and a tested IC stocker 202 that stores IC chips classified according to the test results. It is provided.
[0028]
As shown in FIG. 8, the pre-test IC stocker 201 and the tested IC stocker 202 can enter a frame-like tray support frame 203 and enter the lower part of the tray support frame 203 and move up and down. And an elevator 204. A plurality of customer trays KST are stacked and supported on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.
[0029]
In the pre-test IC stocker 201 shown in FIG. 6, a customer tray KST storing an IC chip to be tested is stacked and held. The tested IC stocker 202 holds and holds a customer tray KST containing the IC chips classified after the test.
[0030]
Since the pre-test IC stocker 201 and the tested IC stocker 202 have substantially the same structure, the pre-test IC stocker 201 can be used as the tested IC stocker 202 and vice versa. is there. Therefore, the number of pre-test IC stockers 201 and the number of tested IC stockers 202 can be easily changed as necessary.
[0031]
In the embodiment shown in FIGS. 6 and 7, two stockers STK-B are provided as the pre-test stocker 201. Next to the stocker STK-B, two empty stockers STK-E to be sent to the unloader unit 400 are provided as the tested IC stocker 202. Next to that, eight stockers STK-1, STK-2,..., STK-8 are provided as tested IC stockers 202, and sorted into a maximum of eight categories according to the test results and stored. It is configured so that it can. That is, in addition to good products and defective products, the non-defective products are classified into high-speed, medium-speed, low-speed, or defective products that require retesting.
[0032]
Loader unit 300
The customer tray KST accommodated in the tray support frame 203 of the pre-test IC stocker 201 shown in FIG. 8 includes a tray transfer arm 205 provided between the IC storage unit 200 and the apparatus substrate 105 as shown in FIG. As a result, it is carried from the lower side of the apparatus substrate 105 to the window part 306 of the loader part 300. Then, in the loader unit 300, the IC chips to be tested loaded on the customer tray KST are once transferred to the precursor 305 by the XY transport device 304, where the mutual positions of the IC chips to be tested are corrected. After that, the IC chip to be tested transferred to the precursor 305 is transferred again to the test tray TST stopped at the loader unit 300 by using the XY transport device 304 again.
[0033]
As shown in FIG. 6, the IC transfer device 304 that reloads the IC chips to be tested from the customer tray KST to the test tray TST includes two rails 301 installed on the upper portion of the device substrate 105, and these two rails. A movable arm 302 that can reciprocate between the test tray TST and the customer tray KST by 301 (this direction is referred to as a Y direction), is supported by the movable arm 302, and moves in the X direction along the movable arm 302. And a movable head 303 that can be used.
[0034]
A suction head is mounted downward on the movable head 303 of the XY transport device 304. The suction head moves while sucking air, so that the IC chip to be tested is sucked from the customer tray KST. The IC chip to be tested is transferred to the test tray TST. For example, about eight such suction heads are attached to the movable head 303, and eight IC chips to be tested can be loaded onto the test tray TST at a time.
[0035]
In the general customer tray KST, the recess for holding the IC chip to be tested is formed to be relatively larger than the shape of the IC chip to be tested, so that it is stored in the customer tray KST. The positions of the IC chips to be tested have a large variation. Accordingly, when the IC chip to be tested is sucked by the suction head and directly transferred to the test tray TST in this state, it is difficult to accurately drop the IC chip into the IC storage recess formed in the test tray TST. For this reason, in the handler 1 of the present embodiment, an IC chip position correcting means called a “preciser 305” is provided between the installation position of the customer tray KST and the test tray TST. Since this precise 305 has a relatively deep recess, and the periphery of this recess is surrounded by an inclined surface, if the IC chip to be tested adsorbed by the suction head is dropped into this recess, the slope is inclined. The drop position of the IC chip under test is corrected on the surface. As a result, the mutual positions of the eight IC chips to be tested are accurately determined, and the IC chips to be tested whose positions have been corrected are again sucked by the suction head and transferred to the test tray TST to form the test tray TST. The IC chip to be tested can be transshipped with high accuracy into the formed IC housing recess.
[0036]
Chamber 100
The above-described test tray TST is loaded into the chamber 100 after the IC chips to be tested are loaded by the loader unit 300, and each IC chip to be tested is tested while being mounted on the test tray TST.
[0037]
The chamber 100 includes a thermostatic chamber 101 that applies a target high or low temperature thermal stress to the IC chip to be tested loaded on the test tray TST, and the IC chip to be tested in a state where the thermal stress is applied in the thermostatic chamber 101. Is made up of a test chamber 102 that contacts the test head, and a heat removal tank 103 that removes the applied thermal stress from the IC chip under test in the test chamber 102.
[0038]
In the heat removal tank 103, when a high temperature is applied in the thermostatic chamber 101, the IC chip to be tested is cooled to the room temperature by blowing air, and when low temperature is applied in the thermostatic tank 101, the IC chip to be tested is heated with warm air. Or, it is heated with a heater or the like and returned to a temperature at which condensation does not occur. Then, the IC chip to be tested after heat removal is carried out to the unloader unit 400.
[0039]
As shown in FIG. 6, the thermostatic bath 101 and the heat removal bath 103 of the chamber 100 are arranged so as to protrude upward from the test chamber 102. Further, as shown conceptually in FIG. 7, the constant temperature bath 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 is empty. Wait while. Mainly during this standby, high or low temperature thermal stress is applied to the IC chip under test.
[0040]
As shown in FIG. 7, the test head 102 is disposed at the lower center of the test chamber 102, and the test tray TST is carried on the test head 5. Here, all the IC chips 2 held by the test tray TST shown in FIG. 10 are brought into electrical contact with the test head 5 simultaneously or sequentially, and all the IC chips 2 in the test tray TST are tested. On the other hand, the test tray TST for which the test has been completed is removed by the heat removal tank 103, and after the temperature of the IC chip 2 is returned to room temperature, it is discharged to the unloader section 400 shown in FIGS.
[0041]
In addition, as shown in FIG. 6, an inlet opening for feeding the test tray TST from the apparatus substrate 105 to the upper part of the constant temperature bath 101 and the heat removal tank 103, and for sending the test tray TST to the apparatus substrate 105 Each of the outlet openings is formed. On the apparatus substrate 105, a test tray transfer device 108 for taking in and out the test tray TST from these openings is mounted. These conveying devices 108 are constituted by rotating rollers, for example. The test tray TST discharged from the heat removal tank 103 by the test tray transfer device 108 provided on the apparatus substrate 105 is returned to the thermostatic chamber 101 via the unloader unit 400 and the loader unit 300.
[0042]
FIG. 10 is an exploded perspective view showing the structure of the test tray TST used in the present embodiment. The test tray TST has a rectangular frame 12, and a plurality of bars 13 are provided on the frame 12 in parallel and at equal intervals. A plurality of attachment pieces 14 are formed on both sides of the crosspieces 13 and inside the side 12a of the frame 12 parallel to the crosspieces 13 so as to protrude at equal intervals in the longitudinal direction. Each insert storage portion 15 is constituted by two mounting pieces 14 facing each other among the plurality of mounting pieces 14 provided between the bars 13 and between the bars 13 and the side 12a.
[0043]
Each insert storage portion 15 stores one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. For this purpose, attachment holes 21 for attachment pieces 14 are formed at both ends of the insert 16. For example, about 16 × 4 inserts 16 are attached to one test tray TST.
[0044]
Each insert 16 has the same shape and the same size, and the IC chip 2 to be tested is accommodated in each insert 16. The IC accommodating portion 19 of the insert 16 is determined according to the shape of the IC chip 2 to be accommodated, and is a rectangular recess in the example shown in FIG.
[0045]
Here, if the IC chips 2 to be tested connected to the test head 5 at a time are IC chips 2 to be tested arranged in 4 rows × 16 columns as shown in FIG. A total of four IC chips 2 to be tested arranged in every other row. That is, in the first test, a total of 16 IC chips 2 to be tested arranged every third row from the first row are connected to the connection terminals 51 of the sockets 50 of the test head 5 as shown in FIG. And test. In the second test, the test tray TST is moved by one row, the IC chips to be tested arranged every third row from the second row are tested in the same manner, and this is repeated four times to obtain all the IC chips to be tested. 2 is tested. The result of this test is stored in the control device of the handler 1 at an address determined by, for example, the identification number assigned to the test tray TST and the number of the IC chip 2 to be tested allocated inside the test tray TST.
[0046]
As shown in FIG. 2, on the test head 5, the number of sockets 50 corresponding to a total of four columns of IC chips 2 to be tested (for example, every third row in the row direction) in the test tray TST shown in FIG. (4 rows × 4 columns). If the size of each socket 50 can be reduced, the test head 5 has 4 on the test head 5 so that all the IC chips 2 held on the test tray TST shown in FIG. Rows × 16 columns of sockets 50 may be arranged.
[0047]
As shown in FIG. 2, one socket guide 40 is mounted for each socket 50 on the top of the test head 5 in which the socket 50 is disposed. The socket guide 40 is fixed with respect to the socket 50.
[0048]
On the test head 5, the test tray TST shown in FIG. 10 is conveyed, and the number corresponding to the interval between the IC chips 2 to be tested at one time (in the test tray TST, the total is every three rows). A total of 16 inserts 16 in four rows are positioned on the corresponding socket guides 40.
[0049]
The pushers 30 shown in FIG. 2 are provided on the upper side of the test head 5 corresponding to the number of socket guides 40. As shown in FIG. 1, each pusher 30 is fixed to the lower end of the adapter 62. Each adapter 62 is elastically held on the match plate 60. The match plate 60 is mounted on the test head 5 so that the test plate TST can be inserted between the pusher 30 and the socket guide 40. The match plate 60 is movably attached to the test head 5 or the drive plate 72 of the Z-axis drive device 70, and together with the adapter 62 and the pusher 30 according to the shape of the IC chip 2 to be tested, etc. It has a replaceable structure. The test plate TST is conveyed between the pusher 30 and the socket guide 40 from the direction perpendicular to the paper surface (X axis) in FIG. As a means for transporting the test plate TST inside the chamber 100, a transport roller or the like is used. When the test tray TST is transported, the drive plate of the Z-axis drive device 70 is raised along the Z-axis direction, and the test tray TST is sufficiently inserted between the pusher 30 and the socket guide 40. Clear gaps are formed.
[0050]
As shown in FIG. 1, the number of pressing portions 74 corresponding to the adapter 62 is fixed to the lower surface of the drive plate 72 disposed inside the test chamber 102, and the adapter 62 held on the match plate 60. The upper surface of the can be detachably pressed. A drive shaft 78 is fixed to the drive plate 72, and the drive shaft 78 is connected to a common pressure cylinder (not shown). The common pressure cylinder is composed of, for example, a pneumatic cylinder, and the upper surface of the adapter 62 can be pressed by moving the drive shaft 78 up and down along the Z-axis direction. The pressing portion 74 includes an individual pressing pressure cylinder and a pressing rod. After the drive plate 72 approaches the match plate 60, the individual pressing cylinder is driven to depress the pressing rod. You may press the upper surface of the adapter 62 separately.
[0051]
As shown in FIGS. 3 and 4, a pusher 31 for pressing the IC chip to be tested is formed at the center of the pusher 30 fixedly attached to the lower end of each adapter 62, and guide holes of the insert 16 are formed on both sides thereof. 20 and a guide pin 32 to be inserted into the guide bush 41 of the socket guide 40 are provided. In addition, a stopper guide 33 is provided between the presser 31 and the guide pin 32 for restricting the lower limit when the pusher 30 moves downward by the Z-axis drive device 70 (see FIG. 1). The stopper guide 33 comes into contact with the stopper surface 42 of the socket guide 40 to determine the lower limit position of the pusher that is pressed with an appropriate pressure that does not destroy the IC chip 2 to be tested.
[0052]
As shown in FIG. 10, each insert 16 is attached to the test tray TST using a fastener 17, and as shown in FIGS. 2 to 4, the guide pins 32 and sockets of the pusher 30 described above are provided on both sides thereof. The guide bush 41 of the guide 40 has a guide hole 20 inserted from above and below.
[0053]
As shown in FIG. 4 showing the lowered state of the pusher 30, the left guide hole 20 is a positioning hole and has a smaller inner diameter than the right guide hole 20. Therefore, the guide pin 32 of the pusher 30 is inserted into the upper half of the left guide hole 20 for positioning, and the guide bush 41 of the socket guide 40 is inserted into the lower half for positioning. . 3 and 4, the right guide hole 20, the guide pin 32 of the pusher 30, and the guide bush 41 of the socket guide 40 are loosely fitted.
[0054]
As shown in FIGS. 3 and 4, an IC accommodating portion 19 is formed in the center of the insert 16, and the IC chip to be tested is placed on the test tray TST shown in FIG. Will be loaded.
[0055]
As shown in FIGS. 3 and 4, two guide pins 32 formed on the pusher 30 are inserted on both sides of the socket guide 40 fixed to the test head 5, and between these two guide pins 32. A guide bush 41 for positioning is provided, and the guide bush 41 on the left side in the figure performs positioning with the insert 16 as described above.
[0056]
As shown in FIG. 4, a socket 50 having a plurality of connection terminals 51 is fixed to the lower side of the socket guide 40, and the connection terminals 51 are spring-biased upward by a spring not shown. Yes. Therefore, even if the IC chip to be tested is pressed, the connection terminals 51 are retracted to the upper surface of the socket 50, while the connection terminals are connected to all the terminals of the IC chip 2 even if the IC chip 2 to be tested is pressed slightly inclined. 51 can come into contact.
[0057]
In the present embodiment, in the chamber 100 configured as described above, as shown in FIG. 1, a temperature control blower 90 is mounted inside a sealed casing 80 that configures the test chamber 102. The temperature control blower 90 includes a fan 92 and a heat exchanging portion 94. The air inside the casing is sucked by the fan 92 and discharged to the inside of the casing 80 through the heat exchanging portion 94. Set to predetermined temperature conditions (high or low temperature).
[0058]
The heat exchanging portion 94 of the temperature control blower 90 is configured by a heat dissipation heat exchanger or an electric heater through which a heating medium flows when the inside of the casing is heated to a high temperature. A sufficient amount of heat can be provided to maintain a high temperature of about ° C. When the inside of the casing is cooled, the heat exchanging portion 94 is constituted by a heat exchanger for heat absorption in which a refrigerant such as liquid nitrogen circulates, and the inside of the casing is, for example, about −60 ° C. to room temperature. It is possible to absorb a sufficient amount of heat to maintain a low temperature. The internal temperature of the casing 80 is detected by, for example, the temperature sensor 82, and the air volume of the fan 92 and the heat volume of the heat exchanging portion 94 are controlled so that the inside of the casing 80 is maintained at a predetermined temperature.
[0059]
In the following description, it is assumed that the inside of the test chamber 102 is kept at a high temperature of about 80 ° C. and the high temperature test of the IC chip 2 is performed.
[0060]
The warm air generated through the heat exchanging portion 94 of the temperature control blower 90 flows along the Y-axis direction in the upper part of the casing 80 and descends along the casing side wall opposite to the device 90. 5 is returned to the apparatus 90 through a gap between the casing 5 and the inside of the casing.
[0061]
In the present embodiment, in the IC test apparatus 10 having the test chamber 102 provided with such a temperature control blower 90, as shown in FIGS. 3 and 4, the pusher 31 of each pusher 30 has its axial core. The 1st ventilation hole 110 is formed along. The lower end opening of the first blower hole 110 is opened substantially at the center of the lower end surface of the presser 31. A plurality of radial grooves 112 extending in the radial direction are formed on the lower end surface 31 a of the pressing element 31 with the lower end opening of the first blower hole 110 as the center. These radial grooves 112 communicate with the first air hole 110. The radial groove 112 is a blowing passage groove for preventing the lower end opening of the first blowing hole 110 from being completely closed even when the lower end surface 31a of the pressing element 31 contacts the IC chip 2. is there.
[0062]
Further, a temperature sensor 114 is mounted in the inside of the pressing element 31 and in the vicinity of the intersection between the first air blowing hole 110 and the radial groove 112. The temperature sensor 114 includes a contact temperature sensor such as a thermocouple or a non-contact temperature sensor such as a radiation thermometer, and detects the temperature of the IC chip 2 itself or the ambient temperature of the IC chip. ing. The temperature data detected by the temperature sensor 114 is sent to the control device, and based on the temperature data, the operations of the air distributor 121, the temperature control means 124, the air flow control means 126 and the like which will be described later are controlled. Yes.
[0063]
As shown in detail in FIG. 4, the upper end opening of the first air blowing hole 110 is opened with respect to the upper surface of the pusher 30. The upper end opening of the first air hole 110 communicates with the inside of the second air hole 116 via a hollow portion 62 a formed inside the adapter 62. The substantially sealed hollow portion 62a is formed when the upper surface of the pusher 30 is attached to the lower surface of the adapter 62, but does not necessarily need to be completely sealed. In the case of the adapter 62 that does not have the hollow portion 62a, when the second air blowing hole 116 extends in the axial direction and the upper surface of the pusher 30 is attached to the lower surface of the adapter 62, the second air blowing hole 116 and the first air blowing The hole 110 is directly connected.
[0064]
An O-ring groove is formed on the upper surface of the adapter 62 located around the upper end opening of the second air hole 116 formed in the adapter 62, and an O-ring 120 as a seal member is formed in the O-ring groove. Is attached. The O-ring 120 is elastically crushed between the lower surface of the pressing portion 74 and the upper surface of the adapter 62, and the upper end opening of the second air blowing hole 116 is formed in the pressing portion 74. 3 Air-tight communication with the lower end opening of the air blowing hole 118 is performed. In FIG. 4, for ease of illustration, the lower surface of the pressing portion 74 is separated from the upper surface of the adapter 62, but the pressing element 31 of the pusher 30 presses the IC chip 2 toward the connection terminal 51 of the socket. In the test state, the lower surface of the pressing portion 74 is actually in contact with the upper surface of the adapter 62 and pressing. Of course, the 3rd ventilation hole 118 and the 2nd ventilation hole 116 are connected in the state.
[0065]
As shown in FIG. 1, the 3rd ventilation hole 118 currently formed in each press part 74 is connected to the air distributor 121 via the ventilation tube. The air distributor 121 distributes the temperature-adjusted air (temperature-adjusted gas) supplied from the temperature control means 124 disposed outside the test chamber 102 to the first air holes 110 of the pushers 30. Device. The air distributor 121 may have, for example, a flow control valve, and may individually control the amount of air blown through the air blowing holes 110 to the surroundings of the IC chips 2. The air distributor 121 may incorporate a cooling element, a heater, or the like, and the temperature of the temperature-controlled air blown out from the first air hole 110 of each pusher 30 toward the IC chip 2 is changed to each IC chip. It may be adjustable individually for every two.
[0066]
In this embodiment, the air distributor 121 is mounted on the upper surface of the drive plate 72, and each air distributor 121 is a temperature arranged outside the casing 80 of the test chamber 102 via the blower tube 122. It is connected to the control means 124. In some cases, the air distributor 121 may also be disposed outside the casing 80. Or conversely, the temperature control means 124 may be arranged inside the casing 80. However, since the inside of the casing 80 is maintained at a high temperature, it is preferable that at least the temperature control means 124 is disposed outside the casing 80.
[0067]
The temperature control means 124 is sequentially connected to the overall air flow control means 126, the drying means 128, and the air supply means 130. In the present embodiment, the temperature control means 124, the entire blast amount control means 126, the drying means 128, and the air supply means 130 constitute the temperature control gas supply means of the present invention. The temperature control gas supply means of the present invention may include the distributor 121 shown in FIG. 1 and other members.
[0068]
The air supply means 130 has a blower such as a fan or a compressor, and blows air outside the test chamber 102 to the drying means 128. The drying unit 128 is a general device for generating dry air, and dries the air supplied from the air supply unit 130. The total air volume control means 126 is a device that controls the total air volume that is blown from the first air hole 110 of the pusher 30 located inside the test chamber 102, and is configured by a flow control valve that is electronically controlled. . The temperature control means 124 is a device for generally controlling the temperature of the temperature-controlled air blown out from the first air blowing hole 110 of the pusher 30 toward the IC chip 2.
[0069]
The temperature-controlled air thus adjusted in temperature is blown around the IC chip 2 through the blower tube 122, the distributor 121, the blower holes 118, 116 and 110, and the radial groove 112.
[0070]
Unloader unit 400
The unloader unit 400 shown in FIGS. 6 and 7 is also provided with XY transport devices 404 and 404 having the same structure as the XY transport device 304 provided in the loader unit 300, and the XY transport devices 404 and 404. As a result, the tested IC chips are transferred from the test tray TST carried out to the unloader unit 400 to the customer tray KST.
[0071]
As shown in FIG. 6, the device substrate 105 of the unloader unit 400 has a pair of windows 406 and 406 arranged so that the customer tray KST conveyed to the unloader unit 400 faces the upper surface of the device substrate 105. It has been opened.
[0072]
Although not shown, an elevating table for elevating and lowering the customer tray KST is provided below each window portion 406. Here, the tested IC chips to be tested are reloaded to fill up. The lowered customer tray KST is loaded and lowered, and this full tray is transferred to the tray transfer arm 205.
[0073]
Incidentally, in the handler 1 of the present embodiment, although the maximum number of categories that can be sorted is eight, only a maximum of four customer trays KST can be arranged in the window 406 of the unloader unit 400. Therefore, the categories that can be sorted in real time are limited to four categories. In general, non-defective products are classified into three categories: high-speed response devices, medium-speed response devices, and low-speed response devices. In addition to these, four categories are sufficient, but retesting is required, for example. Categories that do not belong to these categories, such as things, may occur.
[0074]
As described above, when an IC chip to be tested classified into a category other than the category assigned to the four customer trays KST (see FIGS. 8 and 9) arranged in the window 406 of the unloader unit 400 is generated, One customer tray KST is returned from the unloader unit 400 to the IC storage unit 200, and a customer tray KST in which a newly generated IC chip of a newly generated category is stored is transferred to the unloader unit 400 instead. An IC chip may be stored. However, if the customer tray KST is replaced during the sorting operation, the sorting operation must be interrupted during that time, resulting in a problem that the throughput is reduced. For this reason, in the handler 1 of the present embodiment, a buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and a test IC chip of a category that rarely occurs is provided in the buffer unit 405. I keep it temporarily.
[0075]
For example, the buffer unit 405 is provided with a capacity for storing about 20 to 30 IC chips to be tested, and a memory for storing the categories of IC chips stored in the respective IC storage positions of the buffer unit 405 is provided. The category and position of the IC chip under test temporarily stored in the unit 405 are stored for each IC chip under test. Then, at the time of sorting work or when the buffer unit 405 is full, the customer tray KST of the category to which the IC chip under test stored in the buffer unit 405 belongs is called from the IC storage unit 200 and stored in the customer tray KST. To do. At this time, the IC chips to be tested temporarily stored in the buffer unit 405 may cover a plurality of categories. In such a case, when calling the customer tray KST, a plurality of customer trays KST are transferred to the window of the unloader unit 400 at a time. Calling the unit 406 is sufficient.
[0076]
Operation of the test apparatus 10 Normally, as shown in FIG. 1, when performing a high temperature test of the IC chip 2 inside the test chamber 102, the IC chip 2 becomes high temperature due to self-heating, and the surroundings of the IC chip 2 The temperature becomes higher than the set temperature.
[0077]
On the other hand, in the IC test apparatus 10 according to the present embodiment, the air taken in by the air supply means 130 is supplied to the drying means 128, the blower volume control means 126, and the temperature control means 124 to adjust the temperature. The air whose temperature is adjusted in this way is dry air, for example, to bring the temperature according to the test specifications or the temperature of the IC chip 2 detected by the temperature sensor 114 (see FIGS. 3 and 4) close to the set temperature. The temperature is set. For example, in the case of a high-temperature test with a test specification of 80 ° C., the temperature is adjusted to a temperature of 80 ° C. or lower so that the IC chip 2 under test is maintained at 80 ° C.
[0078]
In this embodiment, the temperature-controlled air thus temperature-controlled is directly blown around each IC chip 2 via the blower tube 122, the distributor 121, the blower holes 118, 116 and 110, and the radial groove 112. During the test, the temperature of each IC chip 2 is detected by the temperature sensor 114, so that the temperature of the temperature control gas blown to each IC chip 2 and the temperature of each IC chip 2 are equal to the test specifications. Alternatively, the air volume may be finely adjusted by the distributor 121. Even if all the IC chips 2 to be tested are the same, as shown in FIG. 1, there is a flow of air by the temperature control blower 90 inside the test chamber 102, depending on the position of the IC chip 2 in the chamber. This is because the temperature of the IC chip 2 during the test can be considered to change.
[0079]
Thus, in the electronic component testing apparatus 10 according to the present embodiment, the IC chip 2 is always tested in a state close to the set temperature (temperature according to the test specifications), and the reliability of the test is improved.
[0080]
Further, in the present embodiment, the temperature of the IC chip 2 and / or the ambient atmosphere temperature of the IC chip 2 is detected by the temperature sensor 114, and the temperature of the temperature-controlled air and / or the temperature control air is sent based on the temperature data from the temperature sensor 114. By controlling the air volume, the temperature control can be stabilized and made uniform, and unnecessary air blowing can be eliminated, contributing to energy saving.
[0081]
Other Embodiments The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention.
[0082]
For example, in the test apparatus 10 according to the above-described embodiment, the air supply unit 130 supplies the air existing outside the test chamber 102 to the drying unit 128, the air volume control unit 126, and the temperature control unit 124, thereby controlling the temperature. The temperature-controlled air is blown around the IC chip 2 through the blower tube 122, the distributor 121 and the blower holes 118, 116 and 110. However, in the present invention, the air supply means 130 supplies the air present in the test chamber 102 to the drying means 128, the air flow control means 126, and the temperature control means 124, and the temperature is adjusted. Air may be blown around the IC chip 2 through the blower tube 122, the distributor 121 and the blower holes 118, 116 and 110. In this case, since the air inside the test chamber 102 is circulated and used, the energy required for temperature control can be reduced, which contributes to energy saving.
[0083]
Further, the temperature control gas supply means used in the electronic device test apparatus according to the present invention is required to have at least the temperature control means 124 shown in FIG. 1, and the blast amount control means 126, the drying means 128, and the air supply means 130. Any one or more of the distributors 121 may be omitted or replaced with an alternative device.
[0084]
Furthermore, in the present invention, air is preferable as the gas blown out from the first blower hole 110 of the pusher 30 toward the IC chip, but in some cases, a gas other than air may be used.
[0085]
Furthermore, in the above-described embodiment, as shown in FIGS. 6 and 7, the chamber 100 includes the thermostatic bath 101, the test chamber 102, and the heat removal bath 103, but in the test apparatus according to the present invention, The constant temperature bath 101 and / or the heat removal bath 103 can be omitted. Further, the specific structure of the test apparatus according to the present invention is not limited to the illustrated embodiment. Furthermore, the electronic component to be tested by the test apparatus according to the present invention is not limited to an IC chip.
[0086]
【The invention's effect】
As described above, according to the present invention, even when an electronic component self-heats during a test, the ambient temperature of the electronic component is always maintained at a set temperature, and the electronic component can be highly reliable at a desired set temperature. An electronic component test apparatus that can be tested can be provided.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an essential part of an IC test apparatus according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view showing an example of a structure near a socket in a test head of the IC test apparatus.
FIG. 3 is a cross-sectional view of the vicinity of the socket shown in FIG. 2 and shows a state before the pusher presses the IC chip.
4 is a cross-sectional view of the vicinity of the socket shown in FIG. 2, showing a state in which the pusher is pressing the IC chip.
FIG. 5 is an overall side view of the IC test apparatus.
FIG. 6 is a perspective view of the handler shown in FIG.
FIG. 7 is a flow chart of a tray showing a method for routing an IC under test.
FIG. 8 is a perspective view showing a structure of an IC stocker of the IC test apparatus.
FIG. 9 is a perspective view showing a customer tray used in the IC test apparatus.
FIG. 10 is a partially exploded perspective view showing a test tray used in the IC test apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Handler 2 ... IC chip 5 ... Test head 6 ... Main apparatus 10 for a test ... IC test apparatus (electronic component test apparatus)
16 ... Insert 30 ... Pusher 40 ... Socket guide 50 ... Socket 51 ... Connection terminal 60 ... Match plate 62 ... Adapter 70 ... Z-axis drive device 72 ... Drive plate 74 ... Pressing part 80 ... Casing 90 ... Temperature control air blower 100 ... Chamber DESCRIPTION OF SYMBOLS 101 ... Constant temperature bath 102 ... Test chamber 103 ... Heat removal tank 110 ... 1st ventilation hole 112 ... Radius groove 114 ... Temperature sensor 116 ... 2nd ventilation hole 118 ... 3rd ventilation hole 120 ... O-ring 121 ... Air distributor 122 ... Blow tube 124 ... Temperature control means 126 ... Flow rate control means 128 ... Drying means 130 ... Air supply means TST ... Test tray

Claims (7)

A connection terminal to which an electronic component to be tested is detachably connected;
A pusher for pressing the electronic component in the direction of the connection terminal so as to connect the electronic component to the connection terminal;
A temperature control gas supply means for blowing a temperature-adjusted gas around the electronic component during the test of the electronic component through the blower hole formed in the pusher ;
A sealed chamber that integrally covers the periphery of the connection terminal, pusher, and electronic component;
The interior of the chamber, anda temperature control blower for a predetermined temperature for testing said electronic component,
The temperature control gas supplied by the temperature control gas supply means is temperature-adjusted to a temperature equal to or lower than the predetermined temperature set by the temperature control blower .   The electronic component testing apparatus according to claim 1, wherein the pusher includes a temperature sensor capable of detecting a temperature of the electronic component and / or an ambient temperature of the electronic component.   The temperature control gas supply means controls the temperature of the temperature control gas supplied to the periphery of the electronic component during the test of the electronic component and / or the amount of blown air based on the temperature data from the temperature sensor. The electronic component testing apparatus according to claim 2, further comprising a means.   The electronic component test apparatus according to claim 1, wherein the temperature control gas supply unit includes a drying unit that pre-drys the temperature control gas supplied to the periphery of the electronic component. Temperature control gas supplied around the electronic component from said temperature control gas supplying means to claim 4, wherein the removed part of the air present in the interior of the chamber is air with temperature regulation The electronic component testing apparatus described. An adapter to which the pusher is fixed;
A match plate for elastically holding the adapter;
Having a pressing part that releasably contacts the upper surface of the adapter, and a drive plate that moves the pusher toward the connection terminal
The match plate is arranged on the connection terminal so as to be exchangeable according to the type of electronic component,
On the upper part of the match plate, the drive plate is arranged to be movable in the vertical direction,
The blower hole formed in the pusher communicates with the blower hole formed in the adapter, and the blower hole formed in the adapter is formed in the pressing portion of the drive plate. The electronic component testing apparatus according to any one of claims 1 to 5 , wherein the electronic component testing apparatus is configured to be able to communicate with each other as appropriate. The electronic component testing apparatus according to claim 6 , wherein a seal member that seals a connection portion between the air blowing holes is attached to a contact portion between the pressing portion of the drive plate and the adapter.

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