JP2000171520A - Testing apparatus for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a testing apparatus by which an electronic component can be tested with high reliability at a desired set temperature by a method wherein temperature-regulating air is ventilated in the circumference of the electronic component being tested. SOLUTION: A temperature control means 124, a total-ventilation-amount control means 126, a drying means 128 and an air supply means 130 constitute a temperature-regulating-gas supply means. The air supply means 130 ventilates air at the outside of a test chamber 102 to the drying means 128 so as to dry supplied air. The total-ventilation-amount control means 126 is a device which controls a total ventilation amount ventilated from first ventilation holes 110 in pushers 30 which are situated at the inside of the chamber 102, and it is constituted of an electronically-controlled flow-rate control value or the like. The temperature control means 124 totally controls the temperature of temperature-regulating air which is blown toward IC chips 2 from the first ventilation holes 110 in the pushers 30. In this manner, the temperature- regulating air which is temperature-regulated is ventilated in the circumference of the IC chips 2 via ventilation tubes 122, distributors 121, ventilation holes 118, 116, 110 and a radius groove 112.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component testing apparatus for testing an electronic component such as an IC chip at a predetermined temperature. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component test apparatus capable of always maintaining a temperature at a set temperature and testing electronic components at a desired set temperature with high reliability.

[0002]

2. Description of the Related Art In the course of manufacturing semiconductor devices and the like,
A test device for testing a component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing an IC chip under high temperature, normal temperature, or low temperature lower than normal temperature is known.
This is because, as a characteristic of the IC chip, it is necessary to guarantee that the IC chip operates well even at a high temperature, a normal temperature, or a low temperature.

In such a test apparatus, the upper part of the test head is covered with a chamber, the inside is made a closed space,
The C chip is transported over the test head, where the IC
The test is performed while the chip is connected to the test head by pressing it, and the inside of the chamber is kept at a high, normal or low temperature within a certain temperature range. By such a test, the IC chip is successfully tested, and at least is classified into a good product and a defective product.

[0004]

However, with the recent increase in the speed and integration of IC chips, self-heating during operation has increased, and self-heating has occurred even in IC chip tests. Even if the temperature is maintained, it is becoming difficult to test the IC chip at the original test temperature. For example, some types of IC chips generate as much as 30 watts of self-heating.
When testing an IC chip that generates a large amount of self-heating, the ambient temperature of the IC chip rises due to self-heating, no matter how much the temperature inside the chamber is kept constant.
It has become difficult to test IC chips at a specified test temperature. When the IC chip cannot be tested at the specified test temperature, there is a problem that the reliability of the test is reduced.

[0005] Particularly, in a high-temperature test, if the self-heating of the IC chip is large, the set temperature in the chamber may be 80 °
Even at C, the actual IC chip device temperature becomes 90 ° C. due to the self-heating of the IC chip, and the device temperature becomes considerably higher than the set temperature. Therefore, conventionally, in consideration of self-heating of the IC chip, a correction value (10 ° C.) is determined in advance, and the set temperature in the chamber is set to 70 ° C. which is lower than 80 ° C. by about 10 ° C., for example.
During the test, the test is performed on the assumption that the temperature of the IC chip is set to 80 ° C. according to the test specifications.

However, it is difficult to determine a correction value in advance when the self-heating amount is extremely large due to the high integration of IC chips or when the test time is long. It is difficult to accurately manage the test temperature of the device.

The present invention has been made in view of such circumstances, and even when an electronic component generates heat during a test, the ambient temperature of the electronic component is always maintained at a set temperature, and the electronic component is raised at a desired set temperature. It is an object of the present invention to provide an electronic component test device capable of testing with reliability.

[0008]

In order to achieve the above object, an electronic component test apparatus according to the present invention comprises a connection terminal to which an electronic component to be tested is detachably connected, and an electronic component connected to the connection terminal. A pusher that presses the electronic component in the direction of the connection terminal so that the electronic component is connected, and a temperature controller that is temperature-controlled around the electronic component during a test of the electronic component through a blower hole formed in the pusher. A temperature-regulated gas supply means for blowing gas.

It is preferable that the pusher is provided with a temperature sensor capable of detecting the temperature of the electronic component and / or the ambient temperature of the electronic component. The temperature sensor is not particularly limited, and a contact-type temperature sensor such as a thermocouple or a thermistor that detects a temperature by contacting a portion to be measured, or a radiation thermometer that can detect a temperature in a non-contact manner. Any of the above non-contact type temperature sensors may be used.

[0010] The temperature-regulating gas supply means controls the temperature of the temperature-regulating gas supplied to the periphery of the electronic component and / or the temperature for controlling the amount of air blown during the test of the electronic component based on the temperature data from the temperature sensor. / It is preferable to have an air blowing amount control means.

It is preferable that the temperature control gas supply means includes a drying means for preliminarily drying a temperature control gas supplied to the periphery of the electronic component.

The electronic component test apparatus according to the present invention preferably further includes a sealed chamber that integrally covers the connection terminals, the pusher, and the periphery of the electronic component.

It is preferable that the temperature control gas supplied from the temperature control gas supply means to the periphery of the electronic component is air whose temperature is controlled by extracting a part of air existing in the chamber.

The electronic component testing apparatus according to the present invention has an adapter to which the pusher is fixed, a match plate for elastically holding the adapter, and a pressing portion which comes into contact with the upper surface of the adapter in a releasable manner. And a drive plate for moving the match plate in the direction of the connection terminal, wherein the match plate is disposed on the connection terminal so as to be exchangeable according to the type of electronic component, and the drive plate is provided on the match plate. A plate is disposed so as to be vertically movable, a blow hole formed in the pusher communicates with a blow hole formed in the adapter, and a blow hole formed in the adapter is It is configured so as to be able to communicate appropriately with a blow hole formed in a pressing portion of the drive plate.

[0015] It is preferable that a seal member for sealing a connection portion between the blower holes is mounted on a contact portion between the pressing portion of the drive plate and the adapter.

[0016]

[Function] Normally, high temperature testing of electronic components such as IC chips,
When a normal temperature test or a low temperature test is performed, the electronic component becomes hot due to self-heating, and the ambient temperature of the electronic component becomes higher than the set temperature. However, in the electronic component test apparatus according to the present invention, the temperature-regulated gas whose temperature has been adjusted is directly blown around the electronic component through the ventilation hole formed in the pusher. The temperature control gas is, for example, dry air, and is set to, for example, a temperature according to test specifications or a temperature obtained by adding a control value to the temperature. For example, if the test specification is 8
In the case of a high temperature test at 0 ° C., 80
Air maintained at a temperature of 80 ° C. or lower so that the temperature is maintained at 0 ° C. is directly blown around the electronic components. During the test, by detecting the temperature of the electronic component, the temperature of the temperature control gas and / or the temperature of the temperature control gas blown to the electronic component is adjusted so that the electronic component has the temperature according to the test specification.
Or adjust the air volume. The adjustment of the temperature control gas and / or the air volume is preferably performed for each electronic component. This is because even if the electronic components to be tested are the same, the temperature may change depending on the position of the electronic components in the chamber.

As described above, in the electronic component test apparatus according to the present invention, the electronic component is always tested at a temperature close to the set temperature (the temperature according to the test specification), and the reliability of the test is improved.

In the present invention, the temperature of the electronic component and / or the ambient temperature of the electronic component is detected by a temperature sensor, and the temperature and / or the amount of the blown gas are controlled based on the temperature data from the temperature sensor. by doing,
It is possible to stabilize and uniformize the temperature control, to eliminate unnecessary airflow, and to contribute to energy saving.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. FIG. 1 is a sectional view of an essential part of an IC test apparatus according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing an example of a structure near a socket in a test head of the IC test apparatus, and FIGS. 5 is an overall side view of the IC testing apparatus, and FIG. 6 is a sectional view of FIG.
7, FIG. 7 is a flowchart of a tray showing a method of handling an IC under test, FIG. 8 is a perspective view showing the structure of an IC stocker of the IC test apparatus, and FIG.
FIG. 10 is a perspective view showing a customer tray used in the test apparatus, and FIG. 10 is a partially exploded perspective view showing a test tray used in the IC test apparatus.

First, an overall configuration of an IC test apparatus as an electronic component test apparatus according to one embodiment of the present invention will be described. As shown in FIG. 5, the IC test apparatus 10 according to the present embodiment includes a handler 1, a test head 5, and a test main apparatus 6. Handler 1 is the IC to be tested
The chips are sequentially conveyed to an IC socket provided in the test head 5, and the IC chips subjected to the test are sorted according to the test result and stored in a predetermined tray.

The IC socket provided on the test head 5
An IC chip, which is connected to the test main device 6 through the cable 7 and is detachably attached to the IC socket, is connected to the test main device 6 through the cable 7, and the IC is output by a test signal from the test main device 6. Test the chip.

A control device for mainly controlling the handler 1 is built in a lower portion of the handler 1, but a space portion 8 is provided in a part thereof. In this space portion 8, the test head 5
The IC chip can be attached to an IC socket on the test head 5 through a through hole formed in the handler 1.

This IC test apparatus 10 is an apparatus for testing an IC chip as an electronic component to be tested at room temperature, at a higher temperature state (higher temperature) or at a lower temperature state (low temperature) than the normal temperature. Has a chamber 100 as shown in FIGS. The chamber 100 includes a constant temperature bath 101 for applying a desired high or low temperature thermal stress to an IC chip to be tested, and a constant temperature bath 1.
The test chamber 102 includes a test chamber 102 for testing an IC chip to which a thermal stress has been applied at 01 and a heat removal tank 103 for removing thermal stress from the IC chip tested in the test chamber 102. The upper part of the test head 5 shown in FIG. 5 is inserted into a test chamber 102 as shown in FIG. 1, where the IC chip 2 is tested.

FIG. 7 is a diagram for understanding a method of handling a test IC chip in the IC test apparatus according to the present embodiment. Actually, members arranged in the vertical direction are shown in plan view. There is also a part shown in. Therefore, its mechanical (three-dimensional) structure can be understood mainly with reference to FIG.

As shown in FIGS. 6 and 7, the handler 1 of the IC test apparatus 10 of the present embodiment stores an IC chip to be tested, and an IC storage unit for classifying and storing tested IC chips. 200, a loader unit 300 for sending the IC chip under test sent from the IC storage unit 200 into the chamber unit 100, a chamber unit 100 including a test head, and a tested IC that has been tested in the chamber unit 100. And an unloader section 400 for taking out. Inside the handler 1, the IC chip
It is stored in a tray and transported.

A large number of IC chips before being accommodated in the handler 1 are accommodated in the customer tray KST shown in FIG. 9, and in this state, the IC chips of the handler 1 shown in FIGS.
C storage unit 200, where the customer tray K
Test tray TS conveyed in handler 1 from ST
The IC chip 2 is replaced at T (see FIG. 10). Inside the handler 1, as shown in FIG. 7, the IC chip moves while being placed on the test tray TST, is subjected to high-temperature or low-temperature stress, and is tested (inspected) for proper operation. Are classified according to the test results. Hereinafter, the inside of the handler 1 will be described in detail individually.

IC Storage Unit 200 As shown in FIG. 6, the IC storage unit 200 has
A pre-test IC stocker 201 for storing C chips and a tested IC stocker 202 for storing IC chips classified according to test results are provided.

As shown in FIG. 8, the pre-test IC stocker 201 and the tested IC stocker 202 enter a frame-shaped tray support frame 203, and enter from the lower portion of the tray support frame 203 and move upward and downward. And an elevator 204 that enables it. A plurality of customer trays KST are stacked and supported on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.

The pre-test IC stocker 201 shown in FIG. 6 has a stack of customer trays KST storing IC chips to be tested. Also,
In the tested IC stocker 202, customer trays KST containing IC chips classified after the test are stacked and held.

Since the pre-test IC stocker 201 and the tested IC stocker 202 have substantially the same structure, the pre-test IC stocker 201 is replaced with the tested IC stocker 201.
It can be used as the stocker 202 and vice versa. Therefore, the number of pre-test IC stockers 201 and the number of tested IC stockers 202 can be easily changed as needed.

In the embodiment shown in FIGS. 6 and 7, two stockers STK-B are provided as the pre-test stockers 201. Next to the stocker STK-B, a tested IC
As the stockers 202, two empty stockers STK-E to be sent to the unloader unit 400 are provided. Also, next to it, eight stockers STK-1, STK-2,..., STK-8 are provided as the tested IC stockers 202, and are sorted and stored in a maximum of eight categories according to test results. It is configured to be able to. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

Loader section 300 Tray support frame 2 of pre-test IC stocker 201 shown in FIG.
As shown in FIG. 6, the customer tray KST housed in the IC tray 03 is loaded into the loader unit 3 by a tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105.
The substrate is carried to the window 306 from the lower side of the device substrate 105. Then, in the loader unit 300, the IC chip under test loaded on the customer tray KST is
Preciser 3 once by the transport device 304
05, where the mutual positions of the IC chips under test are corrected, and then the IC chips under test transferred to the precisor 305 are again stopped on the loader unit 300 using the XY transfer device 304. Test tray TST
Transshipment.

From the customer tray KST to the test tray T
IC transfer device 30 for transferring IC chips under test to ST
As shown in FIG. 6, as shown in FIG. 6, two rails 301 provided on the upper portion of the device substrate 105, and the test tray TST and the customer tray K
It has a movable arm 302 that can reciprocate with the ST (this direction is the Y direction), and a movable head 303 that is supported by the movable arm 302 and that can move in the X direction along the movable arm 302. I have.

The movable head 3 of the XY transport device 304
At 03, a suction head is mounted downward, and the suction head moves while sucking air, thereby sucking the IC chip under test from the customer tray KST, and transferring the IC chip under test to the test tray TST. Transshipment. For example, about eight such suction heads are mounted on the movable head 303, and eight IC chips to be tested can be transferred to the test tray TST at a time.

Incidentally, in the general customer tray KST, the recess for holding the IC chip under test is formed relatively larger than the shape of the IC chip under test, so that it is stored in the customer tray KST. The position of the IC chip under test in the state where the test is performed has a large variation. Therefore, if the IC chip to be tested is sucked by the suction head in this state and is directly carried to the test tray TST, it is difficult to accurately drop the IC chip into the IC storage recess formed in the test tray TST. Therefore, in the handler 1 of the present embodiment, an IC called a precisor 305 is provided between the installation position of the customer tray KST and the test tray TST.
Means for correcting the position of the chip is provided. The precisor 305 has a relatively deep concave portion, and the peripheral edge of the concave portion is surrounded by an inclined surface. Therefore, when the IC chip to be tested sucked by the suction head is dropped into the concave portion,
The drop position of the IC chip under test is corrected on the inclined surface. As a result, the mutual positions of the eight IC chips to be tested are accurately determined, and the IC chips whose positions have been corrected are sucked again by the suction head and reloaded onto the test tray TST, thereby forming the test tray TST. IC
The IC chip under test can be reloaded into the storage recess with high accuracy.

The chamber 100 test tray TST described above, the IC chip is fed into the chamber 100 after being loaded by the loader portion 300, each of the IC chips are tested while being mounted on the test tray TST .

The chamber 100 includes a thermostat 101 for applying a desired high-temperature or low-temperature thermal stress to the IC chips to be tested loaded on the test tray TST, and a thermostat to which the thermal stress is applied in the thermostat 101. Test IC
Test chamber 10 for contacting chip with test head
2 and a heat removal tank 10 for removing a given thermal stress from the IC chip under test tested in the test chamber 102
3 is comprised.

In the heat removal tank 103, when a high temperature is applied in the constant temperature bath 101, the IC chip under test is cooled by blowing air to return to room temperature, and when a low temperature is applied in the constant temperature bath 101, the IC chip under test is applied. Is heated with warm air or a heater to return the temperature to a level that does not cause condensation. Then, the heat-removed IC chip under test is carried out to the unloader section 400.

As shown in FIG. 6, a constant temperature bath 101 and a heat removal bath 103 of a chamber 100 are
It is arranged so as to project upward. As shown conceptually in FIG. 7, the thermostatic bath 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 becomes empty. While waiting. Mainly, during this standby, a high-temperature or low-temperature thermal stress is applied to the IC chip under test.

As shown in FIG. 7, the test chamber 102
, A test head 5 is arranged at the lower center thereof, and a test tray TST is carried on the test head 5. Here, all the IC chips 2 held by the test tray TST shown in FIG.
Electrically in contact with all I in the test tray TST.
The test is performed on the C chip 2. On the other hand, the test tray TST that has completed the test is heat-removed in the heat-removal tank 103,
After returning the temperature of the IC chip 2 to room temperature, FIGS.
Are discharged to the unloader section 400 shown in FIG.

As shown in FIG. 6, an entrance opening for feeding the test tray TST from the apparatus substrate 105 is provided above the constant temperature bath 101 and the heat removal tank 103, and the test tray TST is placed on the apparatus substrate 105. An outlet opening for sending out is formed. A test tray transport device 108 for inserting and removing the test tray TST from these openings is mounted on the device substrate 105.
These transfer devices 108 are constituted by, for example, rotating rollers. The test tray TST discharged from the heat removal tank 103 by the test tray transport device 108 provided on the device substrate 105 is returned to the constant temperature bath 101 via the unloader unit 400 and the loader unit 300.

FIG. 10 is an exploded perspective view showing the structure of the test tray TST used in this embodiment. The test tray TST has a rectangular frame 12, on which a plurality of crossbars 13 are provided in parallel and at equal intervals. A plurality of mounting pieces 14 are formed on both sides of these bars 13 and on the inside of the side 12a of the frame 12 parallel to the bars 13 so as to project at equal intervals in the longitudinal direction. Each insert storage portion 15 is constituted by two opposed mounting pieces 14 of a plurality of mounting pieces 14 provided between the crosspiece 13 and between the crosspiece 13 and the side 12a.

Each insert storage section 15 has one
Each of the inserts 16 is housed, and the insert 16 is mounted on the two mounting pieces 14 in a floating state using a fastener 17. For this purpose, mounting holes 21 for mounting the mounting pieces 14 are formed at both ends of the insert 16. Such an insert 16 can be, for example, one test tray T
About 16 × 4 pieces are attached to the ST.

The inserts 16 have the same shape and the same dimensions, and the IC chips 2 to be tested are stored in the respective inserts 16. The IC accommodating portion 19 of the insert 16 is determined according to the shape of the IC chip 2 to be accommodated, and has a rectangular recess in the example shown in FIG.

Here, the IC chip 2 to be tested which is connected to the test head 5 at one time is, as shown in FIG.
If the IC chips under test 2 are arranged in rows × 16 columns,
For example, there are a total of four columns of IC chips 2 to be tested arranged in every three rows in the row direction. That is, in the first test, 1
A total of 16 ICs to be tested arranged every 3 rows from the row
As shown in FIG. 2, the chips 2 are connected to the connection terminals 51 of the socket 50 of the test head 5 and tested.
In the second test, the test tray TST is moved by one row, and the IC chips under test arranged in every third row from the second row are similarly tested, and this test is repeated four times to obtain all the IC chips under test. Test 2. The result of this test is stored in the control device of the handler 1 with an address determined by, for example, the identification number given to the test tray TST and the number of the IC chip 2 to be tested allocated inside the test tray TST.

As shown in FIG. 2, on the test head 5, sockets 50 correspond to, for example, every three columns in the row direction in the test tray TST shown in FIG. Are arranged in the specified number (4 rows × 4 columns). If the size of each socket 50 can be reduced, four test chips 5 are placed on the test head 5 so that all the IC chips 2 held in the test tray TST shown in FIG. Sockets 50 of rows × 16 columns may be arranged.

As shown in FIG. 2, one socket guide 40 is mounted for each socket 50 on the upper part of the test head 5 in which the sockets 50 are arranged. The socket guide 40 is fixed to the socket 50.

The test trays TST shown in FIG. 10 are conveyed onto the test heads 5, and the number of test trays TST shown in FIG.
In the ST, the inserts 16 of a total of 16 inserts in every three rows (a total of four rows) are positioned on the corresponding socket guides 40.

The pushers 30 shown in FIG. 2 are provided above the test head 5 corresponding to the number of the socket guides 40. As shown in FIG. 1, each pusher 30 is fixed to the lower end of the adapter 62. Each adapter 62 is elastically held on the match plate 60. Match plate 60
Is mounted on the test head 5 so that the test plate TST can be inserted between the pusher 30 and the socket guide 40. The match plate 60 is movably mounted on the test head 5 or the drive plate 72 of the Z-axis drive device 70. According to the shape and the like of the IC chip 2 to be tested, the match plate 60 is provided together with the adapter 62 and the pusher 30. It has a replaceable structure. Note that the test plate TST is transported between the pusher 30 and the socket guide 40 in a direction (X-axis) perpendicular to the paper surface of FIG. Chamber 1
As a transporting means of the test plate TST inside 00, a transporting roller or the like is used. Test tray TS
At the time of the transfer movement of T, the drive plate of the Z-axis drive device 70 is raised along the Z-axis direction, and the pusher 30
Between the test guide TST and the socket guide 40
Has a sufficient gap into which is inserted.

As shown in FIG. 1, the test chamber 102
A number of pressing portions 74 corresponding to the number of the adapters 62 are fixed to the lower surface of the driving plate 72 disposed inside the inside, and the upper surface of the adapter 62 held by the match plate 60 can be detachably pressed. is there. A drive shaft 78 is fixed to the drive plate 72, and the drive shaft 78 is connected to a common pressure cylinder (not shown). The common pressure cylinder is constituted by, for example, a pneumatic cylinder or the like, and can move the drive shaft 78 up and down along the Z-axis direction so as to press the upper surface of the adapter 62. The pressing portion 74 is configured by an individual pressing pressure cylinder, a pressing rod, and the like. After the driving plate 72 approaches the match plate 60, the individual pressing cylinder is driven,
The pressing rod may be pressed down to press the upper surface of each adapter 62 individually.

At the center of the pusher 30 fixed to the lower end of each adapter 62, as shown in FIGS.
A pressing element 31 for pressing the IC chip under test is formed, and guide pins 32 to be inserted into the guide hole 20 of the insert 16 and the guide bush 41 of the socket guide 40 are provided on both sides thereof. A stopper guide 33 is provided between the pusher 31 and the guide pin 32 for regulating the lower limit when the pusher 30 moves down by the Z-axis driving device 70 (see FIG. 1). The stopper guide 33 is provided on the stopper surface 4 of the socket guide 40.
2, the lower limit position of the pusher that presses with an appropriate pressure that does not destroy the IC chip under test 2 is determined.

As shown in FIG. 10, each insert 16 is attached to the test tray TST by using a fastener 17, and as shown in FIGS.
The guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 have the guide holes 20 to be inserted from above and below, respectively.

As shown in FIG. 4 showing the lowered state of the pusher 30, the guide hole 20 on the left side in the figure is a hole for positioning and has a smaller inner diameter than the guide hole 20 on the right side. Therefore, the guide pin 32 of the pusher 30 is inserted into the upper half of the guide hole 20 on the left side, and positioning is performed.
The guide bush 41 is inserted for positioning. 3 and 4, the guide hole 20 on the right side, the guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 are loosely fitted.

As shown in FIGS. 3 and 4, insert 1
6, an IC accommodating portion 19 is formed. By dropping the IC chip 2 under test into the IC housing portion 19, the IC chip under test is loaded on the test tray TST shown in FIG.

As shown in FIGS. 3 and 4, two guide pins 32 formed on the pusher 30 are inserted into both sides of the socket guide 40 fixed to the test head 5, and these two guide pins 32 are inserted. A guide bush 41 is provided for positioning between the guide bush 41 and the guide bush 41 on the left side in the drawing, as described above, also performs positioning with the insert 16.

As shown in FIG. 4, a socket 50 having a plurality of connection terminals 51 is fixed to the lower side of the socket guide 40, and the connection terminals 51 are upwardly spring-loaded by a spring (not shown). It is being rushed. Therefore,
Even if the IC chip under test is pressed, the connection terminals 51 are retracted to the upper surface of the socket 50. On the other hand, even if the IC chip 2 under test is pressed with a slight inclination, the connection terminals 51 are connected to all the terminals of the IC chip 2. You can make contact.

In the present embodiment, in the chamber 100 configured as described above, as shown in FIG. 1, a temperature control blowing device 90 is mounted inside a closed casing 80 forming a test chamber 102. is there. The temperature control blower 90 has a fan 92 and a heat exchange unit 94,
The air inside the casing is sucked by the fan 92 and discharged into the inside of the casing 80 through the heat exchanging section 94, whereby the inside of the casing 80 is set to a predetermined temperature condition (high or low temperature).

When the inside of the casing is heated to a high temperature, the heat exchanging section 94 of the temperature adjusting blower 90 is constituted by a heat radiating heat exchanger or an electric heater through which a heating medium flows. It is possible to provide a sufficient amount of heat to maintain a high temperature of room temperature to about 160 ° C. When the inside of the casing is to be cooled, the heat exchanging section 94 is constituted by a heat absorbing heat exchanger or the like in which a refrigerant such as liquid nitrogen circulates. In order to maintain a low temperature, sufficient heat can be absorbed. The internal temperature of the casing 80 is detected by, for example, a temperature sensor 82, and the fan 9 is controlled so that the internal temperature of the casing 80 is maintained at a predetermined temperature.
2 and the amount of heat of the heat exchange unit 94 are controlled.

In the following description, the test chamber 1
02 is kept at a high temperature of about 80 ° C.
The description will be made assuming that the chip 2 is subjected to a high temperature test.

The hot air generated through the heat exchange section 94 of the temperature control blower 90 flows in the upper part of the casing 80 along the Y-axis direction, descends along the casing side wall on the opposite side of the apparatus 90, and It returns to the device 90 through the gap between the test head 5 and the test head 5 and circulates inside the casing.

In this embodiment, as shown in FIGS. 3 and 4, in the IC test apparatus 10 having the test chamber 102 provided with such a temperature control blower 90, the pusher 31 of each pusher 30 has A first ventilation hole 110 is formed along the axis. The lower end opening of the first ventilation hole 110 is opened substantially at the center of the lower end surface of the pressing element 31. A plurality of radial grooves 1 extending in the radial direction around the lower end opening of the first ventilation hole 110 are formed on the lower end surface 31 a of the pressing element 31.
12 are formed. These radial grooves 112 communicate with the first ventilation holes 110. The radial groove 112 is
1 even if the lower end surface 31a of the
This is a ventilation channel for preventing the lower end opening of the first ventilation hole 110 from being completely closed.

A temperature sensor 114 is mounted inside the presser 31 near the intersection of the first air hole 110 and the radial groove 112. This temperature sensor 114
It is composed of a contact type temperature sensor such as a thermocouple or a non-contact type temperature sensor such as a radiation thermometer.
The temperature of itself or the ambient temperature of the IC chip is detected. The temperature data detected by the temperature sensor 114 is sent to a control device, and based on the temperature data, an air distributor 121 and a temperature control
4. The operation of the air volume control means 126 and the like is controlled.

As shown in detail in FIG.
The upper end opening of the pusher 30 is open to the upper surface of the pusher 30. The upper end opening of the first ventilation hole 110 is
It communicates with the inside of the second ventilation hole 116 via a hollow portion 62a formed inside the second air hole 2. The substantially closed hollow portion 62 a is provided with a pusher 3 against the lower surface of the adapter 62.
It is formed when the top surface of the O is attached, but does not have to be completely sealed. The hollow portion 62a
In the case of the adapter 62 which does not have the
Are extended in the axial direction, and when the upper surface of the pusher 30 is attached to the lower surface of the adapter 62, the second air holes 116 and the first air holes 110 are directly connected.

Second ventilation hole 11 formed in adapter 62
6, an O-ring groove is formed on the upper surface of the adapter 62 located around the upper end opening, and the O-ring groove includes:
An O-ring 120 as a sealing member is mounted. O
The ring 120 is elastically crushed between the lower surface of the pressing portion 74 and the upper surface of the adapter 62 when the lower surface of the pressing portion 74 contacts the upper surface of the adapter 62, and the upper end opening of the second ventilation hole 116 is formed in the pressing portion 74. The lower end opening of the blow hole 118 is air-tightly communicated. In FIG. 4, for ease of illustration, the pressing portion 7
4 is separated from the upper surface of the adapter 62, but in a test state in which the pressing element 31 of the pusher 30 presses the IC chip 2 toward the connection terminal 51 of the socket, the lower surface of the pressing portion 74 is actually the adapter. 62 is pressed in contact with the upper surface. Of course, in that state, the third ventilation hole 1
18 and the second ventilation hole 116 communicate with each other.

As shown in FIG. 1, the third ventilation holes 118 formed in each pressing portion 74 are connected to the air distributor 121 via the ventilation tube. The air distributor 121 includes:
This is a device for distributing temperature-regulated air (temperature-regulated gas) supplied from the temperature control means 124 disposed outside the test chamber 102 through a ventilation tube to the first ventilation holes 110 of each pusher 30. This air distributor 121 has, for example, a flow control valve,
The amount of air for blowing the temperature-controlled air around the chip 2 may be individually controlled. Further, the air distributor 121 may include a cooling element or a heater therein, and each pusher 30
The temperature of the temperature-controlled air blown out from the first ventilation hole 110 toward the IC chip 2 may be individually adjustable for each IC chip 2.

In this embodiment, the air distributor 121 is mounted on the upper surface of the drive plate 72, and each air distributor 1
Reference numeral 21 is connected to a temperature control means 124 provided outside the casing 80 of the test chamber 102 via a blower tube 122. In some cases, the air distributor 121 may be arranged outside the casing 80. Or conversely, the temperature control means 124 may be arranged inside the casing 80. However, the casing 8
Since the inside of O is maintained at a high temperature, at least the temperature control means 124 is preferably arranged outside the casing 80.

The temperature control means 124 is sequentially connected to the whole air volume control means 126, the drying means 128 and the air supply means 130. In the present embodiment, the temperature control unit 124, the overall air volume control unit 126, the drying unit 12
The air supply means 8 and the air supply means 130 constitute the temperature control gas supply means of the present invention. Incidentally, the temperature control gas supply means of the present invention,
It may include the distributor 121 shown in FIG. 1 and other members.

The air supply means 130 has a blower such as a fan or a compressor, and blows air outside the test chamber 102 to the drying means 128. Drying means 128
Is a common device for producing dry air,
The air supplied from the air supply means 130 is dried.
The total air volume control means 126 is a device that controls the total air volume blown from the first air holes 110 of the pusher 30 located inside the test chamber 102, and includes an electronically controlled flow control valve and the like. . Temperature control means 124
Is the IC chip 2 from the first air hole 110 of the pusher 30.
This is a device for controlling the temperature of the temperature-controlled air blown out toward the whole.

The temperature-controlled air thus temperature-controlled is supplied to the blower tube 122, distributor 121, blower holes 118 and 11.
The air is blown around the IC chip 2 through 6 and 110 and the radial groove 112.

Unloader unit 400 The unloader unit 400 shown in FIGS. 6 and 7 is also provided with XY transfer units 404, 404 having the same structure as the XY transfer unit 304 provided in the loader unit 300. Y
The unloader unit 400 is provided by the transport devices 404 and 404.
Tested IC chips are transferred from the test tray TST carried out to the customer tray KST.

As shown in FIG. 6, a pair of windows 406, on which the customer tray KST carried to the unloader section 400 is arranged so as to face the upper surface of the apparatus board 105, are formed on the apparatus board 105 of the unloader section 400. There are 406 pairs.

Although not shown, a lifting table for raising and lowering the customer tray KST is provided below each window 406. Here, the tested IC chips to be tested are reloaded. The customer tray KST which is full is placed on the tray and descends, and the full tray is transferred to the tray transfer arm 205.

Incidentally, in the handler 1 of the present embodiment,
Although the maximum number of categories that can be sorted is eight,
Only a maximum of four customer trays KST can be arranged in the window 406 of the unloader unit 400. Therefore, the categories that can be sorted in real time are limited to four categories. In general, good products are classified into three categories: high-speed response elements, medium-speed response elements, and low-speed response elements, and four categories are added to this, including defective products. There may be categories that do not belong to these categories, such as things.

As described above, the window 4 of the unloader 400
When an IC chip to be tested that is classified into a category other than the category assigned to the four customer trays KST (see FIGS. 8 and 9) arranged in the 06 is generated, one customer tray KS is sent from the unloader unit 400.
T is returned to the IC storage unit 200, and instead, the customer tray KST in which the IC chip of the newly generated category to be stored is transferred to the unloader unit 400, and the IC chip under test is stored. However, if the customer tray KST is replaced during the sorting operation, the sorting operation must be interrupted during that time, which causes a problem that the throughput is reduced. For this reason, in the handler 1 of the present embodiment, the buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and an IC chip to be tested of a category which rarely occurs is provided in the buffer unit 405. I keep it temporarily.

For example, 20 to 30
In addition to providing a capacity capable of storing approximately the number of IC chips to be tested, a memory for storing the IC chip categories stored in the respective IC storage positions of the buffer unit 405 is provided. Test I
The category and position of the C chip are stored for each IC chip under test. Then, during the sorting operation or when the buffer unit 405 is full, the customer tray KST of the category to which the IC chip to be tested stored in the buffer unit 405 belongs is called from the IC storage unit 200 and stored in the customer tray KST. I do. At this time, the IC chip under test temporarily deposited in the buffer unit 405 may cover a plurality of categories.
When the customer tray KST is called, a plurality of customer trays KST may be called to the window 406 of the unloader unit 400 at one time.

[0076] effects of the test device 10 generally as shown in Figure 1, in performing the high temperature test of the IC chip 2 in the interior of the test chamber 102, the IC chip 2 is heated to a high temperature by self-heating, the ambient temperature of IC chip 2 However, it becomes higher than the set temperature.

On the other hand, in the IC test apparatus 10 according to the present embodiment, the air taken in by the air supply means 130 is supplied to the drying means 128, the air volume control means 126 and the temperature control means 124 to control the temperature. I have. The air temperature-controlled in this manner is dry air, for example, for bringing the temperature according to the test specifications or the temperature of the IC chip 2 detected by the temperature sensor 114 (see FIGS. 3 and 4) close to the set temperature. Set to temperature. For example, when the test specification is a high temperature test at 80 ° C., the IC chip 2 under test is maintained at 80 ° C.
The temperature is controlled to a temperature of ° C or lower.

In the present embodiment, the temperature-controlled air thus temperature-controlled is supplied to the periphery of each IC chip 2 via the blower tube 122, the distributor 121, the blower holes 118, 116 and 110 and the radial groove 112. Spray directly. In addition,
During the test, the temperature of each IC chip 2 is
The temperature and / or the flow rate of the temperature control gas blown to each IC chip 2 may be finely adjusted by the distributor 121 so that the detection by 14 causes the temperature of each IC chip 2 to be equal to the test specification. . Even if all the IC chips 2 to be tested are the same, as shown in FIG. 1, a flow of air by the temperature control blower 90 exists inside the test chamber 102, and depending on the position of the IC chip 2 in the chamber. This is because the temperature of the IC chip 2 during the test may change.

As described above, in the electronic component test apparatus 10 according to the present embodiment, the IC chip 2 is always tested at a temperature close to the set temperature (temperature according to the test specification), and the reliability of the test is improved.

In this embodiment, the IC chip 2
Temperature and / or the ambient temperature around the IC chip 2 is detected by the temperature sensor 114, and the temperature of the temperature-regulated air and / or the amount of air blown is controlled based on the temperature data from the temperature sensor 114, thereby controlling the temperature. Stabilization and uniformity can be achieved, and unnecessary air blow is eliminated, contributing to energy saving.

Other Embodiments The present invention is not limited to the above-described embodiments, and can be variously modified within the scope of the present invention.

For example, in the test apparatus 10 according to the above-described embodiment, the air present outside the test chamber 102 is supplied by the air supply means 130 to the drying means 128, the blowing amount control means 126, and the temperature control means 124. The temperature of the air is adjusted, and
2, distributor 121 and ventilation holes 118, 116 and 1
The air is blown around the IC chip 2 through 10. However, in the present invention, the air present inside the test chamber 102 is removed by the air supply means 130 so that the drying means 128, the air volume control means 126 and the temperature control
4 to control the temperature, and supply the adjusted temperature air to the blower tube 122, the distributor 121, and the blower holes 118 and 116.
The air may be blown around the IC chip 2 through the steps 110 and 110. In this case, since the air inside the test chamber 102 is circulated and used, energy required for temperature control can be reduced, which contributes to energy saving.

Further, the temperature control gas supply means used in the electronic component test apparatus according to the present invention may have at least the temperature control means 124 shown in FIG. Any one or more of the supply means 130, the distributor 121 and the like may be omitted or replaced with an alternative device.

Further, according to the present invention, the first
As the gas blown out from the blow hole 110 toward the IC chip, air is preferable, but in some cases, a gas other than air may be used.

Further, in the above-described embodiment, FIG.
As shown in FIGS. 7 and 7, the chamber 100 is
1, the test chamber 102, and the heat removal tank 103, but in the test apparatus according to the present invention, the constant temperature bath 101 and / or the heat removal tank 103 can be omitted. Further, the specific structure of the test apparatus according to the present invention is not limited to the illustrated embodiment. Furthermore, the electronic components tested by the test device according to the present invention are not limited to IC chips.

[0086]

As described above, according to the present invention, even when the electronic component self-heats during the test, the ambient temperature of the electronic component is always maintained at the set temperature, and the electronic component is maintained at the desired set temperature. Can be provided with high reliability.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of an IC test apparatus according to one embodiment of the present invention.

FIG. 2 is an exploded perspective view showing an example of a structure near a socket in a test head of the IC test apparatus.

FIG. 3 is a sectional view of the vicinity of the socket shown in FIG. 2, showing a state before a pusher presses an IC chip.

FIG. 4 is a sectional view of the vicinity of the socket shown in FIG. 2, showing a state where a pusher is pressing an IC chip.

FIG. 5 is an overall side view of the IC test apparatus.

FIG. 6 is a perspective view of the handler shown in FIG.

FIG. 7 is a flowchart of a tray showing a method of handling an IC under test.

FIG. 8 is a perspective view showing a structure of an IC stocker of the IC test apparatus.

FIG. 9 is a perspective view showing a customer tray used in the IC test apparatus.

FIG. 10 is a partially exploded perspective view showing a test tray used in the IC test apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Handler 2 ... IC chip 5 ... Test head 6 ... Main test device 10 ... IC test device (electronic component test device) 16 ... Insert 30 ... Pusher 40 ... Socket guide 50 ... Socket 51 ... Connection terminal 60 ... Match plate 62 … Adapter 70… Z-axis drive device 72… drive plate 74… pressing part 80… casing 90… temperature control blower 100… chamber 101… constant temperature tub 102… test chamber 103… heat removal tub 110… first blast hole 112… radius Groove 114 Temperature sensor 116 Second air hole 118 Third air hole 120 O-ring 121 Air distributor 122 Air blow tube 124 Temperature control means 126 Flow control means 128 Drying means 130 Air supply means TST … Test tray

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G003 AA07 AC03 AD02 AD04 AF05 AF06 AG01 AG03 AG11 AG14 AG18 AH05 AH08 4M106 AA04 BA14 CA31 CA60 DG02 DG03 DG23 DG24 DG25 DG28 DG30 DJ26 DJ34

Claims (8)

[Claims] 1. A connection terminal to which an electronic component to be tested is detachably connected, a pusher for pressing the electronic component toward the connection terminal so as to connect the electronic component to the connection terminal, and a pusher formed on the pusher. A temperature control gas supply means for blowing a temperature controlled gas having a temperature controlled around the electronic component during a test of the electronic component through a blower hole formed as described above. 2. The electronic component test apparatus according to claim 1, wherein the pusher includes a temperature sensor capable of detecting a temperature of the electronic component and / or an ambient temperature of the electronic component. 3. The temperature control gas supply means, based on temperature data from the temperature sensor, controls the temperature and / or temperature of the temperature control gas supplied to the periphery of the electronic component during a test of the electronic component.
The electronic component test apparatus according to claim 2, further comprising a temperature air blowing amount control unit that controls an air blowing amount. 4. The electronic component test apparatus according to claim 1, wherein the temperature control gas supply unit includes a drying unit configured to previously dry a temperature control gas supplied around the electronic component. 5. The electronic component test apparatus according to claim 1, further comprising a sealed chamber that integrally covers a periphery of the connection terminal, the pusher, and the electronic component. 6. The temperature control gas supplied from the temperature control gas supply means to the periphery of the electronic component is air whose temperature has been adjusted by extracting a part of air existing inside the chamber. The electronic component test apparatus according to claim 5, wherein 7. An adapter to which the pusher is fixed, a match plate for elastically holding the adapter, and a pressing portion which comes into contact with the upper surface of the adapter so as to be releasable, and moves the pusher in the direction of the connection terminal. A drive plate, wherein the match plate is disposed on the connection terminal so as to be replaceable according to the type of the electronic component, and the drive plate is disposed on the match plate so as to be vertically movable The blower hole formed in the pusher communicates with the blower hole formed in the adapter, and the blower hole formed in the adapter is formed in a pressing portion of the drive plate. The electronic component test apparatus according to any one of claims 1 to 6, wherein the electronic component test apparatus is configured to be able to appropriately communicate with the vent hole. 8. The electronic component test apparatus according to claim 7, wherein a seal member for sealing a connection portion between the blower holes is mounted on a contact portion between the pressing portion of the drive plate and the adapter.