JP4947467B2 - Electronic component testing apparatus and electronic component testing method - Google Patents

Description

  The present invention relates to an electronic component testing apparatus and method for testing various electronic components (hereinafter, referred to as ICs) such as semiconductor integrated circuit elements, and in particular, considering self-heating of electronic components during testing. The present invention relates to an electronic component test apparatus and method capable of performing a test at an accurate temperature.

  In the manufacturing process of a semiconductor device or the like, a test apparatus for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing an IC chip under normal temperature, a temperature condition higher or lower than normal temperature is known. This is because, as a characteristic of the IC chip, it is necessary to ensure that it operates well even at room temperature, high temperature or low temperature.

  In this type of electronic component testing apparatus, the upper part of the test head is covered with a chamber to form a sealed space, the interior of the chamber is kept at a constant temperature environment such as normal temperature, high temperature or low temperature, and the IC chip is mounted on the test head. Then, the IC chip is pressed against the test head and electrically connected thereto to perform the test. By such a test, the IC chip is well tested and classified into at least a good product and a defective product.

  However, with the recent increase in the speed and integration of IC chips, the amount of self-heating during operation tends to increase, and this amount of self-heating tends to increase even during testing. For example, some types of IC chips generate self-heating of 30 watts.

  For this reason, for example, when a high temperature test of about 125 ° C. is performed, the amount of heat due to self-heating is applied to the IC chip in addition to this amount of heat, which may cause the temperature of the IC chip to exceed its allowable limit. Further, even in the normal temperature test and the low temperature test, even if the inside of the chamber is maintained at a constant temperature, the self-heating amount of the IC chip is generated, so that it becomes difficult to perform the test at the target test temperature.

  However, it is also considered that a sensor for detecting the temperature of the IC chip is provided in the immediate vicinity of the IC chip and the actual temperature of the IC chip detected by this sensor is fed back to the temperature application device. Even if it is provided in the immediate vicinity of the chip, there is a limit, and the thermal resistance between the IC chip and the temperature sensor cannot be made zero. Therefore, the true temperature of the IC chip cannot be detected as long as an external sensor is used.

  The present invention has been made in view of such problems of the prior art, and an electronic component testing apparatus and method capable of performing a test at an accurate temperature in consideration of the self-heating of the electronic component during the test. The purpose is to provide.

In order to achieve the above object, an electronic component test apparatus according to the present invention connects a plurality of contact parts to which a plurality of electronic devices under test are respectively connected, and a plurality of electronic devices under test to the plurality of contact parts, respectively. As described above, the electronic devices under test are tested during the testing of the electronic devices under test through the plurality of pushers that press the plurality of electronic devices under test in the direction of the contact portion and the air holes formed in the plurality of pushers, respectively. Temperature-controlled gas supply means for blowing temperature-controlled gas around the component, a sealed chamber that integrally covers the plurality of contact portions, the plurality of pushers, and the plurality of electronic components to be tested; the circulating a temperature control gas inside the chamber, the plurality of blowing devices for temperature control for the a predetermined temperature the electronic component to be tested, application temperature of the to be tested electronic component And applying a temperature control means for controlling the data related to the actual temperature of the device under test including the self-heating of the electronic device to be tested by the input of the test signal, and the temperature storing means for storing previously obtained And an applied temperature sending means for sending data related to the actual temperature of the electronic device under test stored in the temperature storage means to the applied temperature control means when sending the test signal. In the apparatus, the applied temperature control means is a temperature to be circulated in the chamber by the temperature adjustment blower device based on data related to the actual temperature of the electronic device under test sent from the applied temperature sending means. The temperature of the gas to be adjusted and the temperature of the temperature adjusting gas blown around the electronic device to be tested through the air blowing hole by the temperature adjusting gas supply means, And controlling by considering the self-heating of the test the electronic components.

Further, the electronic component testing method according to the present invention uses the above-described electronic component testing apparatus to press the terminal of the electronic device under test against the contact portion of the test head and apply a predetermined temperature to the electronic device under test. In the electronic component testing method for sending a test signal to the electronic device under test for testing, relating to the actual temperature of the electronic device under test including self-heating of the electronic device under test by the input of the test signal The data to be obtained is obtained in advance, and the applied temperature to the electronic device under test is feedforward controlled in consideration of the self-heating of the electronic device under test based on the data related to the actual temperature.

In this electronic component testing apparatus and method, data relating to the actual temperature of the electronic component under test under each test condition is obtained in advance and sent according to the test flow, so that noise such as thermal resistance is not added. If the true temperature of the electronic component under test or the data related to it is obtained, the test can be performed at the desired accurate temperature considering the self-heating of the electronic component during the test, and the reliability of the test results Will improve.

  In addition, according to the present invention, so-called feedforward control can be performed. Therefore, if the target temperature is sent in advance, the time from when the electronic device under test is delivered until the target temperature is reached. Can be shortened.

  Incidentally, data related to the actual temperature of the electronic device under test from the applied temperature sending means is sent to the applied temperature control means, and the temperature applying means is controlled by the control signal from this applied temperature control means, and the device under test is The temperature applied to the electronic component is set to an appropriate value.

  The data related to actual temperature in the above invention is intended to include temperature control patterns and the like in addition to actual temperature data.

  In the above invention, the installation place of the temperature storing means and the applied temperature sending means is not particularly limited, and can be provided in a handler that handles the electronic device under test, or a test signal is sent to the contact portion to send the electronic device under test. It can also be provided in a tester for testing. Further, these temperature calculation means and applied temperature control means can be configured as separate devices.

  In particular, when these temperature storage means and applied temperature sending means are provided in the tester, it is more preferable to incorporate them into an operation command program for a handler that handles the electronic device under test from the tester. By doing so, the operation command process becomes remarkably simple and accurate, and it is possible to cope with only the change or addition of software without newly installing, changing or modifying the hardware.

In the above SL invention, specific configurations of the temperature application means for applying the device under test to a predetermined temperature is not particularly limited, include everything. The applied temperature includes all of high temperature, normal temperature, and low temperature.

  The electronic device under test applied in the present invention is not particularly limited and includes all types of electronic components, but the effect is particularly remarkable when applied to an IC or the like having a very large amount of self-heating during operation.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First Embodiment FIG. 1 is a block diagram showing a first embodiment of an electronic device testing apparatus according to the present invention, and FIG. 2 is a cross-sectional view showing a test chamber section according to the same embodiment (cross-section along line II-II in FIG. FIG. 3 is a plan view showing a method of handling the IC under test used in the electronic component testing apparatus. FIG. 3 is a view for understanding the method of handling the IC under test in the electronic component testing apparatus of the present embodiment, and actually shows the members arranged in the vertical direction in plan view. There is also a part.

  The electronic component test apparatus 1 according to the present embodiment tests (inspects) whether or not an IC operates properly at a normal temperature in which a high or low temperature stress is applied to the IC under test or in which no temperature stress is applied. An apparatus for classifying ICs according to results, as shown in FIG. 1, sequentially transporting ICs to be tested to IC sockets provided in the test head 5, and classifying ICs to be tested that have been tested according to test results. The handler 3 for executing the operation of storing in a predetermined tray, the tester 7 for sending a test signal and testing the IC under test based on the response signal, and the interface between the handler 3 and the tester 7 having an IC socket. And the test head 5. The tester 7 and the test head 5 are electrically connected via a signal line such as a cable C1, and the handler 3 and the tester 7 are also electrically connected via a signal line such as a cable C2.

  In the operation test in a state where the temperature stress is applied, the test is performed on the test tray TST transported in the handler 3 from the tray (hereinafter, also referred to as the customer tray KST) on which many ICs to be tested are mounted. Implemented by replacing the IC. Since the structure of any of the trays KST and TST is not particularly limited, detailed illustration thereof is omitted, and schematically shown in FIG.

  As shown in FIG. 3, the handler 3 of this embodiment stores an IC under test to be tested from now on, an IC storage unit 200 that classifies and stores tested ICs, and is sent from the IC storage unit 200. A loader unit 300 that feeds an IC under test into the chamber unit 100, a chamber unit 100 including the test head 5, and an unloader unit 400 that classifies and extracts the tested ICs that have been tested in the chamber unit 100. Yes.

  The IC storage unit 200 is provided with a pre-test IC stocker for storing the IC under test before the test, and a tested IC stocker for storing the IC under test classified according to the test results. In the example shown in FIG. 2, two stockers STK-B are provided in the pre-test stocker, two empty stockers STK-E to be sent to the unloader unit 400 are provided next thereto, and eight stockers STK are provided in the tested IC stocker. −1, STK-2,..., STK-8 are provided, and can be sorted and stored in up to eight categories according to the test results.

  The above-described customer tray KST is carried from below to the window 306 of the loader unit 300 by a tray transfer arm (not shown) provided at the upper part of the IC storage unit 200. Then, in the loader unit 300, the ICs to be tested loaded on the customer tray KST are once transferred to a precursor 305 by an XY transport device (not shown). After correcting the position, the IC under test transferred to the precicer 305 is reloaded onto the test tray TST stopped at the loader unit 300 using the XY transport device again.

  The test tray TST described above is loaded into the chamber portion 100 after the ICs to be tested are loaded by the loader unit 300, and each IC under test is tested in a state of being mounted on the test tray TST.

  The chamber section 100 includes a constant temperature bath 101 that applies a target high or low temperature thermal stress to the IC under test loaded on the test tray TST, and the IC under test that has been subjected to the thermal stress in the constant temperature bath 101. A test chamber 102 is brought into contact with the contact pin of the test head, and a heat removal tank 103 is used to remove a given thermal stress from the IC under test tested in the test chamber 102.

  As conceptually shown in FIG. 3, the constant temperature bath 101 is provided with a vertical transfer device, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 102 is empty. To do. Mainly during this standby, high or low temperature thermal stress is applied to the IC under test.

  A test head 5 is arranged in the center of the test chamber 102, a test tray TST is carried on the test head 5, and the input / output terminal HB of the IC under test is electrically connected to the contact pin 51 of the test head 5. The test is performed by bringing them into contact (see FIG. 1). On the other hand, the test tray TST for which the test has been completed is removed by the heat removal tank 103, and after the temperature of the IC is returned to room temperature, it is discharged to the unloader section 400.

  The test tray TST discharged from the heat removal tank 103 is returned to the constant temperature bath 101 via the unloader unit 400 and the loader unit 300.

  The unloader section 400 is also provided with an XY transport apparatus having the same structure as the XY transport apparatus provided in the loader section 300. From the test tray TST carried out to the unloader section 400 by this XY transport apparatus. The tested IC is transferred to the customer tray KST.

  As shown in FIG. 1, the unloader unit 400 is provided with two pairs of windows 406 and 406 arranged so that the customer tray KST conveyed to the unloader unit 400 faces from below. Although not shown, an elevating table for elevating and lowering the customer tray KST is provided below each window 406. Here, the tested ICs to be tested are reloaded and become full. The customer tray KST is loaded and lowered, and the full tray is transferred to the tray transfer arm described above.

  Incidentally, in the handler 3 of this embodiment, although the maximum number of categories that can be sorted is eight, only a maximum of four customer trays KST can be arranged in the window 406 of the unloader unit 400, which is supplemented. For this purpose, a buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and ICs of a category that rarely occur are temporarily stored in the buffer unit 405.

Next, the internal structure of the test chamber 102 will be described with reference to FIG.
The pushers 30 shown in FIG. 2 are provided on the upper side of the test head 5 corresponding to the number of socket guides 40. Each pusher 30 is fixed to the lower end of the adapter 62, and each adapter 62 is elastically held by the match plate 60.

  The match plate 60 is mounted on the test head 5 so that the test tray TST can be inserted between the pusher 30 and the socket guide 40. 5 or Z is attached to the drive plate 72 of the Z-axis drive device 70 so as to be movable, and is configured to be exchangeable together with the adapter 62 and the pusher 30 in accordance with the shape of the IC 2 to be tested.

  Note that the test tray TST is conveyed between the pusher 30 and the socket guide 40 from the direction perpendicular to the paper surface (X-axis) in FIG. Further, as a means for transporting the test plate TST inside the chamber 100, a transport roller or the like is used. When the test tray TST is transported, the drive plate of the Z-axis drive device 70 rises along the Z-axis direction. A sufficient gap for inserting the test tray TST is formed between the pusher 30 and the socket guide 40.

  A number of pressing portions 74 corresponding to the adapters 62 are fixed to the lower surface of the drive plate 72 disposed inside the test chamber 102 so that the upper surface of the adapter 62 held by the match plate 60 can be pressed. Yes. A drive shaft 78 is fixed to the drive plate 72, and the drive shaft 78 is connected to a pressure cylinder (not shown). The pressure cylinder is composed of, for example, a pneumatic cylinder, and can move the drive shaft 78 up and down along the Z-axis direction to press the upper surface of the adapter 62. The pressing portion 74 includes an individual pressing pressure cylinder and a pressing rod. After the drive plate 72 approaches the match plate 60, the individual pressing cylinder is driven to depress the pressing rod. You may press the upper surface of the adapter 62 separately.

  As shown in FIG. 1, a pusher 31 for pressing the IC 2 to be tested is provided at the center of the pusher 30 attached and fixed to the lower end of each adapter 62. Further, as shown in the figure, a socket 50 having a plurality of contact pins (contact portions) 51 is fixed to the lower side of the socket guide 40, and this contact pin 51 is moved upward by a spring (not shown). Is spring-biased. Therefore, even if the IC 2 to be tested is pressed, the contact pin 51 is retracted to the upper surface of the socket 50, while the contact pin 51 is in contact with all the terminals of the IC 2 to be tested even if the IC 2 is pressed with a slight inclination. It can be done.

  In the present embodiment, in the test chamber 102 configured as described above, as shown in FIG. 1, a temperature control blower 90 is mounted inside a sealed casing 80 that configures the test chamber 102. The temperature control blower 90 includes a fan 92, a heater 94, and a nozzle 96 that injects liquid nitrogen. The fan 92 sucks air inside the casing and discharges it into the casing 80 through the heater 94. The inside of 80 is heated to a predetermined temperature condition (for example, room temperature to 160 ° C.). Further, liquid nitrogen is sprayed from the nozzle 96 and discharged into the casing 80 by the fan 92, whereby the inside of the casing 80 is cooled to a predetermined temperature condition (for example, −60 ° C. to room temperature).

  The hot air or cold air generated by the temperature control blower 90 flows along the Y-axis direction in the upper part of the casing 80 and descends along the casing side wall opposite to the device 90, and the match plate 60 and the test head 5. It returns to the apparatus 90 through the clearance gap between them and circulates inside the casing.

  In the present embodiment, in the handler 3 having the test chamber 102 provided with such a temperature control air blower 90, the pusher 31 of each pusher 30 is formed with a first air blow hole 110 along its axis. Yes. The lower end opening of the first blower hole 110 is opened substantially at the center of the lower end surface of the presser 31, and the lower end surface of the presser 31 extends in the radial direction around the lower end opening of the first blower hole 110. A radial groove is formed. These radial grooves communicate with the first blower hole 110, but the lower end opening of the first blower hole 110 is completely closed even when the lower end surface of the presser 31 comes into contact with the IC 2 under test. It has the function to prevent.

  The upper opening of the first air hole 110 is open to the upper surface of the pusher 30 and communicates with the inside of the second air hole 116 through a hollow part inside the adapter 62. In the case of the adapter 62 having no hollow portion, the second air blowing hole 116 and the first air blowing hole are formed when the second air blowing hole 116 extends in the axial direction and the upper surface of the pusher 30 is attached to the lower surface of the adapter 62. 110 is directly connected.

  The upper end opening of the second air hole 116 formed in the adapter 62 is in airtight communication with the lower end opening of the third air hole 118 formed in the pressing portion 74 via a seal member such as an O-ring. ing. As shown in FIG. 2, the 3rd ventilation hole 118 formed in each press part 74 is connected to the air distributor 121 via the ventilation tube, and this air distributor 121 is arrange | positioned outside the test chamber 102. As shown in FIG. The temperature control air (temperature control gas) supplied from the temperature control means 124 through the blower tube is distributed to the first blower holes 110 of the pushers 30.

  The air distributor 121 may have, for example, a flow control valve, and may individually control the amount of air that blows the temperature-controlled air around each IC 2 to be tested through each air hole 110. The air distributor 121 may contain a cooling element or a heater, and the temperature of the temperature-controlled air blown out from the first blower hole 110 of each pusher 30 toward the IC 2 to be tested. It may be individually adjustable for each IC2.

  The temperature control unit 124 is sequentially connected to the blast amount control unit 126, the drying unit 128, and the air supply unit 130.

  The air supply means 130 has a blower such as a fan or a compressor, and blows air outside the test chamber 102 to the drying means 128. The drying unit 128 is a general device for generating dry air, and dries the air supplied from the air supply unit 130. The blower amount control means 126 is a device that controls the total blown amount of air blown from the first blower hole 110 of the pusher 30 located inside the test chamber 102, and includes a flow control valve that is electronically controlled. The temperature control means 124 is a device for generally controlling the temperature of the temperature-controlled air blown out from the first air blowing hole 110 of the pusher 30 toward the IC chip 2.

  The temperature-controlled air thus temperature-controlled is blown around the IC 2 under test through the blower tube 122, the distributor 121, the blower holes 118, 116 and 110, and the radial groove.

  In particular, the electronic component test apparatus 1 according to the present embodiment uses the temperature sensitive element 2D built in the IC 2 under test to detect the actual temperature during the test of the IC 2 under test.

  As shown in the block diagram of FIG. 1, for example, an element such as a diode is a temperature sensitive element 2D in which a signal characteristic with respect to temperature is uniquely determined. Therefore, when the response signal is read by the tester 7, the temperature sensitive element 2D. An output signal from an input / output terminal (including a ground terminal) HB electrically connected to the IC is also read, and the actual temperature of the IC under test is thereby calculated.

  For this reason, the electric signal of the input / output terminal HB corresponding to the temperature sensitive element 2D is taken in from the contact pin 51 of the test head 5 to the temperature calculating means 501 provided in the tester 7 via the cable C1. The temperature calculation means 501 stores a calculation program for calculating the actual temperature from the diode characteristics of the temperature sensitive element 2D of the IC 2 under test. This time, the actual temperature of the IC under test obtained by this is calculated by the cable. It is sent to the applied temperature control means 502 of the handler 3 via C2 (for example, GP-IB system or RS232C system).

  Since the capture of the electrical signal related to the temperature sensitive element 2D from the test head 5 to the tester 7 is achieved by adding the electrical signal capture command of the temperature sensitive element 2D to the test program set in the tester 7, It can be implemented without changing hardware. Also, the temperature data sent from the tester 7 to the handler 3 can be changed on the software such as being incorporated during the communication between the tester 7 and the handler 3 that is normally executed, and this is also implemented without changing the hardware. can do.

  Since the temperature data input to the applied temperature control means 502 is the temperature of the IC under test itself, it is determined whether or not this value is within the temperature range set as the test condition. If so, a command signal for entering the temperature condition is sent to the temperature applying means 503.

  The temperature application unit 503 shown in FIG. 1 corresponds to a temperature adjustment device including the temperature adjustment blower 90 shown in FIG. 2, the air supply unit 130, the drying unit 128, the blower amount control unit 126 and the temperature control unit 124. . However, the specific configuration of these temperature application means is not particularly limited, and only the temperature adjusting blower 90 may be used, or conversely, only the temperature adjusting device may be used. Moreover, the temperature application apparatus of another structure may be sufficient. In short, since the gist of the present invention is to directly detect the temperature of the IC under test by using the temperature sensitive element 2D built in the IC under test, other configurations are particularly limited. Never happen.

Next, the operation will be described.
In the test chamber 102 in the chamber section 100, the IC under test is transported to the upper part of the test head 5 while being mounted on the test tray TST.

  When the test tray TST stops at the test head 5, the Z-axis drive device 70 begins to descend, and the IC under test 2 is pressed against the contact pin 51 by the pressing element 31, and the test is started.

  Although the IC under test 2 may self-heat due to various test signals sent from the tester 7, in this embodiment, an electric signal from the temperature sensitive element 2D of the IC under test 2 is taken into the temperature calculation means 501 of the tester 7, The actual temperature of the IC under test 2 is calculated from the captured electric signal and the characteristics of the temperature sensitive element 2D. The obtained temperature is sent to the applied temperature control means 502 of the handler 3, from which the temperature applying means 503 is controlled to maintain the IC 2 under test at an appropriate temperature.

Second Embodiment The present invention is not limited to the above-described embodiment, and can be variously modified. FIG. 4 is a block diagram showing another embodiment of the present invention.

  In this example, a temperature storing means 504 is provided in the tester 7 instead of using the temperature sensitive element 2D built into the IC 2 under test as a temperature sensor of the IC 2 under test.

  The temperature storage means 504 measures in advance the actual temperature when the target IC under test is tested under the target test conditions. When a test signal is sent from the tester 7 to the test head 5, a temperature control value corresponding to the corresponding test step is added to the operation communication program sent from the tester 7 to the handler 3. The program itself incorporating this temperature control value corresponds to the temperature storage means 504 and the applied temperature sending means 505 of the present invention.

  By measuring the temperature of the IC under test obtained in advance using the temperature sensitive element 2D of the IC under test as in the first embodiment, the actual temperature of the IC under test is the same as in the first embodiment. Can be detected accurately, and the reliability of the test results is improved.

  In this embodiment, since so-called feedforward control can be performed, if the target temperature is sent in advance before the IC under test is transported, the purpose of the test after the electronic component under test is carried in can be obtained. It is possible to shorten the time until the temperature is reached.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  As described above, according to the present invention, since the true temperature of the electronic device under test can be detected without introducing noise such as thermal resistance, the test can be performed at the target accurate temperature. Reliability of test results is improved.

  In addition, according to the present invention, so-called feedforward control can be performed. Therefore, if the target temperature is sent in advance, the time from when the electronic device under test is delivered until the target temperature is reached. Can be shortened.

It is a block diagram which shows 1st Embodiment of the electronic component test apparatus of this invention. It is sectional drawing which shows the structure in the test chamber in the electronic component testing apparatus of FIG. 3 is a flowchart of a tray showing a method of handling an IC under test in the electronic component testing apparatus of FIG. It is a block diagram which shows 2nd Embodiment of the electronic component testing apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus 3 ... Handler 100 ... Chamber part 102 ... Test chamber 5 ... Test head 7 ... Tester 2 ... IC (electronic device under test)

Claims (4)

A plurality of contact portions to which a plurality of electronic devices under test are respectively connected;
A plurality of pushers for pressing the plurality of electronic devices under test in the direction of the contact portions so as to connect the plurality of electronic devices under test to the plurality of contact portions,
Temperature control gas supply means for blowing temperature-controlled gas around the electronic device under test during the test of the electronic device under test through the air holes formed in the plurality of pushers,
A sealed chamber that integrally covers the periphery of the plurality of contact portions, the plurality of pushers, and the plurality of electronic components to be tested;
A temperature control blower that circulates a temperature control gas inside the chamber and sets the plurality of electronic devices under test to a predetermined temperature;
Applied temperature control means for controlling the applied temperature to the electronic device under test;
The data that relate to the actual temperature of the device under test including the self-heating of the electronic device to be tested by the input of the test signal, and the temperature storing means for storing previously obtained,
An electronic component testing device comprising: an applied temperature sending means for sending data relating to an actual temperature of the electronic device under test stored in the temperature storing means to the applied temperature control means when sending the test signal In
The applied temperature control means includes
Based on the data related to the actual temperature of the electronic device under test sent from the applied temperature sending means,
The temperature of the temperature control gas circulated inside the chamber by the temperature control blower;
The temperature of the temperature control gas blown around the electronic device under test through the air blowing hole by the temperature control gas supply means,
An electronic component testing apparatus that controls the electronic component under test in consideration of self-heating . 2. The electronic component test according to claim 1, wherein the temperature storing means and the applied temperature sending means are provided in a tester that sends a test signal to the contact portion and tests the electronic device under test. apparatus. 2. The electronic component testing apparatus according to claim 1, wherein the temperature storing means and the applied temperature sending means are included in an operation command program for a handler that handles the electronic device under test from the tester. Using the electronic component test apparatus according to any one of claims 1 to 3, a terminal of the electronic device under test is pressed against a contact portion of a test head, and a predetermined temperature is applied to the electronic device under test. In the method for testing an electronic component for performing a test by sending a test signal to the electronic device under test,
Obtain in advance data related to the actual temperature of the electronic device under test including self-heating of the electronic device under test due to the input of the test signal,
A test method for an electronic component , wherein feed-forward control of the temperature applied to the electronic device under test is performed in consideration of self-heating of the electronic device under test using data relating to the actual temperature.

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