KR101969214B1 - Semiconductor device pick-up module and apparatus testing semiconductor devices having the same - Google Patents

Semiconductor device pick-up module and apparatus testing semiconductor devices having the same Download PDF

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Publication number
KR101969214B1
KR101969214B1 KR1020170048058A KR20170048058A KR101969214B1 KR 101969214 B1 KR101969214 B1 KR 101969214B1 KR 1020170048058 A KR1020170048058 A KR 1020170048058A KR 20170048058 A KR20170048058 A KR 20170048058A KR 101969214 B1 KR101969214 B1 KR 101969214B1
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KR
South Korea
Prior art keywords
semiconductor
test socket
test
connection terminals
vacuum
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KR1020170048058A
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Korean (ko)
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KR20180115564A (en
Inventor
정라파엘
김지훈
Original Assignee
주식회사 이노비즈
정라파엘
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Priority to KR1020170048058A priority Critical patent/KR101969214B1/en
Publication of KR20180115564A publication Critical patent/KR20180115564A/en
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Publication of KR101969214B1 publication Critical patent/KR101969214B1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks

Abstract

An element pickup module for picking up a semiconductor element from a shuttle on which semiconductor elements are loaded for performing an electrical inspection on the semiconductor element in a test handler is disclosed. The element pickup module includes an upper test socket having a plurality of upper element connection terminals electrically connected to connection terminals formed on a top surface of a semiconductor element by vacuum suction of a semiconductor element on a lower surface thereof, And a control unit for vacuum-sucking the semiconductor device and controlling signal transmission between the upper test socket and the semiconductor device. As described above, since the element pickup module has element connection terminals that can be connected to the semiconductor element, it can pick up the semiconductor element by vacuum suction and provide the inspection signal to the picked up semiconductor element.

Description

TECHNICAL FIELD [0001] The present invention relates to a device pickup module and a semiconductor device testing device including the same.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element pickup module for inspecting semiconductor devices and a semiconductor device test apparatus having the same. To an element pickup module for inspecting electrical characteristics of semiconductor elements by providing test signals to the semiconductor elements and a semiconductor device test apparatus having the element pickup module.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices thus formed can be manufactured into finished products through a dicing process, a bonding process, and a packaging process .

These semiconductor devices can be judged as good or defective through electrical characteristic inspection. A semiconductor device test apparatus including a test handler for handling semiconductor devices and a tester for testing semiconductor devices may be used for the electrical property test.

The semiconductor devices may have external connection terminals, and an electrical inspection process may be performed in a state where the external connection terminals and the tester are electrically connected. The test handler may have a plurality of test sockets having contact pins electrically connected to terminals for external connection of semiconductor elements.

The test handler can be divided into a test handler for performing an inspection process on general memory devices and a test handler for performing an inspection process on LSI (Large Scale Integrated circuit) devices. Examples of test handlers for performing the inspection process on LSI devices are disclosed in Korean Patent Laid-Open Nos. 10-2011-0113554 and 10-2011-0113928.

A test handler for an LSI device includes a shuttle for receiving and transporting a plurality of semiconductor devices for inspecting electrical characteristics, a test board for electrically connecting the semiconductor devices and the tester, and a test board for picking up the semiconductor devices from the shuttle, Up unit for connecting the pick-up unit to the pick-up unit.

Specifically, the test board is provided with a test socket. The test socket receives an inspection signal for inspecting the semiconductor device from the tester, transfers the signal to the semiconductor device, and transmits the signal output from the semiconductor device to the tester in response to the inspection signal. The test socket has a plurality of connection terminals to be connected to the terminals for external connection of the semiconductor element, and the semiconductor element can be transferred to the test socket side by the pick-up unit.

The pick-up unit picks up the semiconductor element mounted on the shuttle by vacuum suction, places the picked-up semiconductor element on the test socket, and presses the semiconductor element toward the test socket to closely contact the test socket to connect the test socket and the semiconductor element .

Generally, external connection terminals are formed on the lower surface of the memory element and the LSI element. In the electrical characteristics test for a semiconductor device, connection terminals of the test socket are electrically connected to external connection terminals formed on the lower surface of the semiconductor device for electrical connection between the semiconductor device and the test socket. The pick-up unit brings the semiconductor element into close contact with the test socket for stable connection between the connection terminals of the test socket and the terminals for external connection of the semiconductor element.

However, recently, in order to increase the degree of integration of LSI devices, LSI devices having external connection terminals formed on the upper surface of the device have also been produced. When the terminals for external connection are formed on both the lower surface and the upper surface of the semiconductor element, electrical characteristics should be inspected through the terminals formed on the upper surface as well as the terminals formed on the lower surface of the semiconductor element.

Therefore, a test socket capable of being connected to the terminals formed on the lower surface of the semiconductor element and a test socket capable of being connected to the terminals formed on the upper surface are needed. In addition, it is necessary to turn over the semiconductor device so that the top surface of the semiconductor device is turned downward after the electrical characteristics are inspected through the terminals formed on the lower surface of the semiconductor device, and the electrical characteristics should be inspected through the terminals formed on the upper surface of the semiconductor device.

As described above, the semiconductor device having external connection terminals formed on both the upper surface and the lower surface is more complicated than the semiconductor device having the elements formed on the lower surface only. This increases the time required for electrical inspection. In addition, since a separate test socket corresponding to the upper surface of the semiconductor element and equipment for vertically inverting the semiconductor element are required, the facility cost is increased and the facility area is increased.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an element pickup module which can pick up a semiconductor element and can be connected to a semiconductor element together with the element pickup module and a semiconductor element testing apparatus having the element pickup module.

According to an aspect of the present invention, there is provided a device handler for picking up a semiconductor device from a shuttle on which semiconductor devices are mounted in order to perform an electrical inspection of the semiconductor device, An upper test socket having a plurality of element connection terminals electrically connected to the connection terminals formed on the upper surface of the semiconductor element by vacuum adsorption of the element; and an upper test socket coupled to the upper portion of the upper test socket, And a control unit for controlling signal transmission between the upper test socket and the semiconductor device.

According to embodiments of the present invention, the control unit comprises: a vacuum nozzle coupled to the upper test socket and providing a vacuum for adsorbing the semiconductor element; a vacuum nozzle coupled to the vacuum nozzle and connected to a vacuum pump, And an individual vacuum flow path provided to the vacuum nozzle.

According to embodiments of the present invention, the control unit includes: a floating block coupled to an upper portion of the upper test socket; and a semiconductor device coupled to the floating block and adsorbed to the upper test socket, And an air cylinder damper for reducing an impact applied to the semiconductor element when it is brought into contact with another member.

According to embodiments of the present invention, the element upper connection terminals are located in a region where the semiconductor element is disposed on the lower surface of the upper test socket, and may be connected to connection terminals located on the upper surface of the semiconductor element .

According to another aspect of the present invention, there is provided a semiconductor device testing apparatus including a plurality of element lower connection terminals and a plurality of upper socket connection terminals connected to connection terminals formed on a lower surface of a semiconductor device, A lower test socket for electrically connecting the semiconductor device to a tester for providing an inspection signal for electrical inspection of the semiconductor device; and a device pickup module for picking up the semiconductor device, And a contact press unit for picking up the semiconductor element from the shuttle on which the semiconductor devices are loaded and loading the lower semiconductor device into the lower test socket. Specifically, the element pickup module includes: a plurality of element connection terminals electrically connected to connection terminals formed on the upper surface of the semiconductor element, the semiconductor element being vacuum-adsorbed on a lower surface thereof; An upper test socket having a plurality of lower socket connection terminals; a lower test socket coupled to an upper portion of the upper test socket for vacuum-sucking the semiconductor device and transmitting signals between the upper test socket and the semiconductor device, And a control unit for controlling signal transmission between the sockets.

According to embodiments of the present invention, the contact press unit may include: a contact press head having a plurality of the element pickup modules and disposed so as to face the lower test socket; A press body detachably coupled to the contact press head and connected to a vacuum pump to provide a vacuum for adsorbing the semiconductor element to the plurality of element pickup modules; a semiconductor body coupled to the press body and adsorbed to the upper test socket; And a vertically moving member for vertically moving the press body to bring the element into contact with the lower test socket. Here, the lower test socket may be provided in plurality corresponding to the plurality of element pickup modules.

According to embodiments of the present invention, the control unit may include: a floating block coupled to an upper portion of the upper test socket; a semiconductor device coupled to the floating block and adsorbed to the upper test socket, And an air cylinder damper for reducing an impact applied to the semiconductor device upon contact of the lower test socket.

According to the embodiments of the present invention as described above, the element pickup module includes upper element connection terminals that can be connected to the semiconductor element and lower socket connection terminals that can be connected to the lower test socket, And may be electrically connected to the semiconductor device. Accordingly, since the semiconductor device testing apparatus can be connected to the semiconductor devices on both the upper and lower surfaces of the semiconductor device, it is possible to inspect the circuit unit connected to the upper surface connection terminals of the semiconductor device while the semiconductor device is loaded in the lower test socket, It is possible to carry out all the tests on the circuit portion connected to the test circuit. As a result, the semiconductor device testing apparatus does not need to further include a device for vertically inverting the semiconductor device, so that the manufacturing cost can be reduced, the inspection process time can be shortened, and the facility area can be minimized.

1 is a schematic view for explaining a semiconductor device testing apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic perspective view for explaining the contact press unit shown in Fig. 1. Fig.
3 is a schematic perspective view showing an example of the arrangement of the contact press unit shown in Fig.
Figs. 4 and 5 are schematic side views for explaining the up / down operation of the contact press head shown in Fig.
FIGS. 6 and 7 are schematic partial perspective views for explaining the coupling relationship between the contact press head and the press body shown in FIG. 2. FIG.
FIG. 8 is a schematic perspective view for explaining the element pickup module shown in FIG. 2. FIG.
9 is a schematic plan view for explaining the upper test socket shown in FIG.
Figs. 10 and 11 are schematic longitudinal sectional views for explaining the contact press head shown in Fig.
FIGS. 12 and 13 are schematic side views for explaining the process of testing the electrical characteristics of the semiconductor element test apparatus shown in FIG.
14 is a schematic cross-sectional view for explaining the arrangement relationship between the lower and upper test sockets and semiconductor devices shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

1 is a schematic view for explaining a semiconductor device testing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a semiconductor device testing apparatus 400 according to an embodiment of the present invention can be used to examine electrical characteristics of semiconductor devices. For example, the semiconductor device testing apparatus 400 may provide an electrical inspection signal to the semiconductor device and analyze a signal output from the semiconductor device in response to the inspection signal to check the electrical performance of the semiconductor device can do.

Specifically, the semiconductor device testing apparatus 400 includes an interface unit 100 for electrically connecting a semiconductor device to a tester (not shown), a semiconductor device 100 for picking up the semiconductor device from a shuttle (not shown) To the interface unit (100).

The interface unit 100 may include a lower test socket 110 electrically connected to the tester and a socket guide 120 for guiding the position of the lower test socket 110.

The lower test socket 110 includes a plurality of element lower connection terminals 112 (see FIG. 14) for electrically connecting to the semiconductor devices picked up by the contact press unit 300, To the semiconductor device, and to provide the tester with a signal output from the semiconductor device corresponding to the inspection signal. In particular, the lower element connection terminals 112 of the lower test socket 110 may be connected to the connection terminals 14 (see FIG. 14) formed on the lower surface of the semiconductor element.

1, the interface unit 100 may include a plurality of the lower test sockets 110, and the lower test sockets 110 may include a plurality of the lower test sockets 110, And may be provided corresponding to the semiconductor elements picked up in the semiconductor device 300.

The lower test sockets 110 are coupled to the socket guide 120 and the socket guide 120 guides the position of the lower test sockets 110.

Meanwhile, the contact press unit 300 may be disposed on the upper side of the interface unit 100.

The contact press unit 300 is vertically and horizontally movable and picks up waiting semiconductor devices from the shuttle and transfers them to the interface unit 100 for electrical characteristics inspection.

In particular, the contact press unit 300 may be electrically connected to the semiconductor element through connection terminals formed on the upper surface of the semiconductor element. The contact press unit 300 not only transports the semiconductor device and is in close contact with the lower test socket 110 but also is electrically connected to the semiconductor device to provide the inspection signal to the semiconductor device, Thereby providing a signal output from the semiconductor device to the tester. Accordingly, the semiconductor device testing apparatus 400 can more easily test the electrical characteristics of semiconductor devices having connection terminals formed on both the upper and lower surfaces thereof.

Hereinafter, the configuration of the contact press unit 300 will be described in detail with reference to the drawings.

FIG. 2 is a schematic perspective view for explaining the contact press unit shown in FIG. 1, FIG. 3 is a schematic perspective view showing an example of the arrangement of the contact press unit shown in FIG. 2, and FIGS. And is a schematic side view for explaining the up / down operation of the contact press head shown in the figure.

Referring to FIGS. 1 to 3, the contact press unit 300 may have a columnar shape as shown in FIG. 2, vacuum picking up semiconductor elements from the shuttle, picking up the semiconductor elements, (100). ≪ / RTI > 3, the plurality of contact press units 300 may be arranged side by side so as to be movable in the horizontal direction, as shown in FIG. 3, in order to increase the efficiency of the inspection process. .

2 to 4, the contact press unit 300 includes a contact press which can vacuum pick up the semiconductor device loaded on the shuttle and pick up the semiconductor device and face the interface unit 100 (see FIG. 1) A press body 302 disposed on the upper side of the contact press head 301 and a vertical movement member coupled to the press body 302 and vertically moving the press body 302 303).

The contact press head 301 can vacuum adsorb the semiconductor device on the lower surface and can be coupled to the lower portion of the press body 302.

The press body 302 may have a columnar shape, and the vertically moving member 303 may be coupled. The vertically moving member 303 can vertically move the press body 302 so that the contact press head 301 coupled to the press body 302 can be moved in the vertical direction .

In an embodiment of the present invention, the vertically moving member 303 may have a crank structure as shown in FIGS. The crankshaft 30 of the vertically moving member 303 is coupled to the bracket 304 to fix the vertically moving member 304 to the bracket 304 and is coupled to a motor (not shown). The vertically-moving member 303 may convert the rotational motion of the motor into a linear motion to move the press body 302 upward as shown in FIG. 4 or downward as shown in FIG. As a result, the contact press head 301 coupled to the press body 302 moves vertically to pick up the semiconductor device from the shuttle or to load the lower test socket 100 (see FIG. 1) Can be brought into close contact with the test socket 110 (see FIG. 1), and the semiconductor device can be unloaded from the lower test socket 110.

In an embodiment of the present invention, the contact press head 301 may be detachably coupled to the press body 302 for easy replacement depending on the type of semiconductor element.

6 and 7 are schematic partial perspective views for explaining the engagement relationship between the contact press head and the press body shown in FIG. 2, and FIG. 6 is a perspective view of the contact press head 301 coupled to the press body 302 And FIG. 7 shows a state in which the contact press head 301 and the press body 302 are disengaged.

6 and 7, the contact press head 301 may be coupled to the press body 302 using a spring catch 305 rather than a screw connection. Accordingly, the contact press head 301 can be easily replaced and the replacement time can be shortened.

The contact press head 301 includes an element pickup module 200 that can vacuum-adsorb the semiconductor element and be electrically connected to the semiconductor element, and the element pick-up module 200 coupled to the lower surface of the element press- And a head plate 310 coupled to the press body 302 by a plurality of actuators (not shown).

The contact press head 301 may include a plurality of the element pickup modules 200 and a plurality of element pickup modules 200 may be mounted on the lower surface of the head plate 310. In this case, Lt; / RTI >

The element pickup module 200 may vacuum-absorb the semiconductor element by using a vacuum to transfer the semiconductor element, and may be electrically connected to the semiconductor element and the lower test socket 110 (see FIG. 1).

Hereinafter, the configuration of the element pickup module 200 will be described in detail with reference to the drawings.

FIG. 8 is a schematic perspective view for explaining the element pickup module shown in FIG. 2, and FIG. 9 is a schematic plan view for explaining the upper test socket shown in FIG. Here, FIG. 8 shows the contact press head 301 shown in FIG. 2 inverted up and down to clearly show the configuration of the element pickup module 200.

8 and 9, the element pickup modules 200 may be provided corresponding to the lower test sockets 110 (see FIG. 1), may be arranged in a matrix form, And may be electrically connected to the device.

In an embodiment of the present invention, the contact press head 301 includes eight element pickup modules 200, but the number of the element pickup modules 200 is not limited thereto.

The element pickup module 200 includes an upper test socket 210 on which a semiconductor element can be vacuum-adsorbed and can be electrically connected to the semiconductor device and the lower test socket 110, And a control unit 220 for controlling signal transmission between the semiconductor device 210 and the semiconductor device and signal transmission between the upper test socket 210 and the lower test socket 110.

Specifically, the upper test socket 210 provides the test signal output from the tester to the semiconductor device, and transmits a signal output from the semiconductor device to the tester in response to the test signal. The upper test socket 210 includes a plurality of element upper connection terminals 212 that can be electrically connected to connection terminals 12 (see FIG. 14) formed on the upper surface of the semiconductor device, And a plurality of lower socket connecting terminals 214 for connecting the lower socket connecting terminals.

9, the upper element connection terminals 212 are located in an element region DA where the semiconductor elements are disposed on the lower surface of the upper test socket 210, And is connected to connection terminals formed on the upper surface of the semiconductor element to connect the semiconductor element to the upper test socket. For convenience of explanation, the connection terminals formed on the upper surface of the semiconductor element are called upper surface connection terminals, and the connection terminals formed on the lower surface are called lower surface connection terminals.

The lower socket connection terminals 214 may be electrically connected to the lower test socket 110 and may be located outside the device area DA on the lower surface of the upper test socket 210. The lower socket connection terminals 214 may receive the inspection signal from the lower test socket 110 and may output a signal output from the upper surface connection terminals of the semiconductor device in response to the inspection signal, (110).

The upper test socket 210 may include a plurality of guide portions 216 for guiding the position of the semiconductor device. As shown in FIG. 9, the guide portions 216 protrude from the lower surface of the upper test socket 210 and may be disposed to surround the device region DA.

The control unit 220 may be coupled to the upper portion of the upper test socket 210. The control unit 220 vacuum-adsorbs the semiconductor device and fixes the semiconductor device on the lower surface of the upper test socket 210 and applies an impact applied to the semiconductor device at the time of contact between the semiconductor device and the lower test socket 110 .

Hereinafter, the configuration of the control unit 220 will be described in detail with reference to the drawings.

10 and 11 are schematic longitudinal sectional views for explaining the contact press head shown in FIG. 8, and FIG. 10 shows the components for vacuum adsorption of the semiconductor element in the contact press head 301 , And FIG. 11 shows components for absorbing the shock applied to the semiconductor device at the contact press head 301.

9, 10 and 11, the control unit 220 includes a vacuum nozzle 221 coupled to the upper test socket 210 and providing a vacuum for adsorbing the semiconductor device, And an individual vacuum passage 222 coupled to the vacuum nozzle 221 and connected to a vacuum pump (not shown) to provide a vacuum provided from the vacuum pump to the vacuum nozzle 221.

As shown in FIG. 9, the vacuum nozzle 221 may be coupled to a lower surface of the upper test socket 210 to be exposed to the outside.

10, the individual vacuum passage 222 is connected to a main vacuum passage 22 formed in the press body 302 through a head vacuum passage 312 formed in the head plate 310, The main vacuum passage 22 may be connected to the vacuum pump.

The control unit 220 includes a floating block 223 coupled to an upper portion of the upper test socket 210 and a floating block 223 coupled to the floating block 223, And an air cylinder damper 224 for reducing an impact applied to the semiconductor element during contact between the semiconductor element adsorbed on the test socket 210 and the lower test socket 110 (see FIG. 1). 11, the air cylinder damper 224 is connected to a head air passage 314 formed in the head plate 310, and the head air passage 314 is connected to a main air passage 314 formed in the press body 302 And can be connected to the air flow path 24. The main air passage 24 is connected to an air supply device and the air cylinder damper 224 can receive air through the main air passage 24 and the head air passage 314 .

12 and 13 are schematic side views for explaining a process of inspecting the electrical characteristics of the semiconductor device of the semiconductor device test apparatus shown in FIG. 1, and FIG. 14 is a cross-sectional view of the lower and upper test sockets And is a schematic cross-sectional view for explaining the arrangement relationship of the semiconductor elements.

4, 5, and 12, first, the contact press unit 300 picks up the semiconductor elements loaded on the shuttle and then moves to the upper side of the interface unit 100.

Specifically, after the contact press unit 300 moves to the upper side of the shuttle, the vertical moving member 303 of the contact press unit 300 presses the press body 302 of the contact press unit 300 downward The contact press head 301 is brought into contact with the semiconductor elements loaded on the shuttle, and the contact press head 301 picks up the semiconductor elements. At this time, the semiconductor element 10 to be inspected is vacuum-adsorbed to each of the element pickup modules 200. Next, the vertically moving member 303 vertically moves the press body 302 upward, and the contact press unit 300 moves horizontally toward the interface unit 100 to move the contact press head 301 to the position shown in FIG. 12 Is disposed on the upper side of the interface unit 100 as shown in FIG. At this time, each of the element pickup modules 200 is located on the upper side of the corresponding lower test socket 110.

Referring to FIGS. 5, 13 and 14, the press body 302 is vertically moved downward by the vertically-moving member 303, and the contact press head 301 is moved to the interface Unit 100 as shown in Fig. 14, the semiconductor device 10 is loaded into the lower test socket 110 and the semiconductor device 10 is mounted on the upper test socket 210, And the lower test socket (110).

That is, when the element pickup module 200 vacuum-adsorbs the semiconductor device 10 from the shuttle, the upper surface connection terminals 12 of the semiconductor device 10 are connected to the upper test socket The semiconductor device 10 and the upper test socket 210 are electrically connected to each other by contacting the element upper connection terminals 212 of the semiconductor device 210. [

The element pickup module 200 loads the semiconductor element 10 into the lower test socket 110 while vacuuming the semiconductor element 10 and presses the semiconductor element 10 to perform the lower test And is brought into close contact with the socket 110. At this time, the lower connection terminals 14 of the semiconductor element 10 are brought into contact with the element lower connectors 112 of the lower test socket 100, so that the semiconductor element 10, (110) are electrically connected. The lower socket connection terminals 214 of the upper test socket 210 contact the upper socket connection terminals 114 of the lower test socket 110 so that the upper test socket 210, The lower test socket 110 is also electrically connected.

After the semiconductor device 10 and the upper and lower test sockets 210 and 110 are electrically connected to each other, the test signal output from the tester is transmitted through the upper and lower test sockets 210 and 110 And is provided to the semiconductor device 10. At this time, the lower test socket 110 connects an inspection signal provided from the tester to the semiconductor element 10 through the element lower connection terminals 112 and the lower connection terminals 14 of the semiconductor element 10 And transmits it to the upper test socket 210 through the upper socket connection terminals 114 and the lower socket connection terminals 214. The upper test socket 210 receives an inspection signal received from the lower test socket 110 through the upper connection terminals 212 of the element and the upper surface connection terminals 12 of the semiconductor element 10, (10).

The semiconductor device 10 receiving the inspection signal transmits an output signal corresponding to the inspection signal to the upper test socket 210 through the upper surface connection terminals 12 and the upper element connection terminals 212 And transmits the test signal to the lower test socket 110 through the connection terminals 14 and the element lower connection terminals 112.

The upper test socket 210 transmits an output signal received from the semiconductor device 10 to the lower test socket 110 through the lower socket connection terminals 214 and the upper socket connection terminals 114. [ do.

The lower test socket 110 transmits an output signal directly received through the device lower connection terminals 112 from the semiconductor device 10 and an output signal received via the upper test socket 210 to the tester do.

As described above, the element pickup module 200 includes the element upper connecting terminals 212 that can be connected to the semiconductor element 10, thereby picking up the semiconductor element 10, And may be electrically connected to the device 10. The semiconductor device testing apparatus 400 can be connected to the semiconductor device 10 on both the upper and lower sides of the semiconductor device 10 so that the semiconductor device 10 is loaded on the lower test socket 110 The inspection of the circuit portion connected to the upper surface connection terminals 12 of the semiconductor element 10 and the inspection of the circuit portion connected to the connection terminals 14 can be performed. As a result, since the semiconductor device testing apparatus 400 does not need to further include a device for vertically inverting the semiconductor device 10, the manufacturing cost can be reduced, the inspection process time can be shortened, Can be minimized.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that.

10: Semiconductor device 12: upper surface connection terminal
14: lower connection terminal 100: interface unit
110: Lower test socket 112: Device lower connection terminal
114: upper socket connection terminal 120: socket guide
200: Element pickup module 210: Upper test socket
212: element upper connecting terminal 214: lower socket connecting terminal
216: guide part 220: control unit
221: Vacuum nozzle 222: Individual vacuum flow path
223: Floating block 224: Air cylinder damper
300: contact press unit 301: contact press head
302: Press body 303: Vertically movable member
310: head plate 312: head vacuum line
314: head air channel 400: semiconductor device test apparatus

Claims (8)

An upper test socket having a plurality of element connection terminals electrically connected to connection terminals formed on an upper surface of the semiconductor element, the semiconductor element being fixed to a lower surface thereof; And
And a control unit coupled to the upper test socket and capable of fixing the semiconductor device and controlling the upper test socket to control signal transmission between the upper test socket and the semiconductor device,
Wherein the upper element connection terminals are located in a region where the semiconductor element is disposed on a lower surface of the upper test socket and are connected to connection terminals located on an upper surface of the semiconductor element.
The method according to claim 1,
The control unit includes:
A vacuum nozzle coupled to the upper test socket and providing a vacuum for adsorbing the semiconductor device; And
And an individual vacuum flow path coupled to the vacuum nozzle and connected to the vacuum pump to provide the vacuum to the vacuum nozzle.
The method according to claim 1,
The control unit includes:
A floating block coupled to an upper portion of the upper test socket; And
And an air cylinder damper positioned on the upper side of the floating block and coupled to the floating block to reduce an impact applied to the semiconductor element when the semiconductor element sucked by the upper test socket is brought into contact with another member. Device pickup module.
delete A tester for providing an inspection signal for electrical inspection of the semiconductor device and a tester for providing a test signal for electrically testing the semiconductor device are electrically and electrically connected to each other, A lower test socket for connecting to the test socket; And
And a contact press unit having an element pickup module for picking up the semiconductor element and capable of being disposed on the upper side of the lower test socket and picking up the semiconductor element from the shuttle on which the semiconductor elements are loaded and transferring the semiconductor element to the lower test socket ,
The element pickup module includes:
An upper test socket having a plurality of element upper connection terminals fixed to the lower surface of the semiconductor element and electrically connected to connection terminals formed on an upper surface of the semiconductor element; And
And a control unit coupled to the upper test socket and capable of fixing the semiconductor device and controlling the upper test socket to control signal transmission between the upper test socket and the semiconductor device,
Wherein the upper element connection terminals are located in a region where the semiconductor element is disposed on a lower surface of the upper test socket and are connected to connection terminals located on an upper surface of the semiconductor element.
6. The semiconductor device test apparatus according to claim 5, wherein the upper test socket vacuum-adsorbs the semiconductor element on a lower surface thereof. 6. The method of claim 5,
The contact press unit includes:
A contact press head having a plurality of element pickup modules and arranged to face the lower test socket;
A press body disposed above the contact press head and detachably coupled to the contact press head and connected to a vacuum pump to provide a vacuum for adsorbing the semiconductor element to the plurality of element pickup modules; And
And a vertically movable member coupled to the press body and vertically moving the press body to bring the semiconductor device adsorbed on the upper test socket into close contact with the lower test socket,
Wherein a plurality of lower test sockets are provided corresponding to the plurality of element pickup modules.
6. The method of claim 5,
The control unit includes:
A floating block coupled to an upper portion of the upper test socket; And
And an air cylinder damper disposed on the upper side of the floating block and coupled to the floating block to reduce the impact applied to the semiconductor element when the lower test socket is in contact with the semiconductor element adsorbed to the upper test socket. A semiconductor device testing apparatus.
KR1020170048058A 2017-04-13 2017-04-13 Semiconductor device pick-up module and apparatus testing semiconductor devices having the same KR101969214B1 (en)

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