KR20060024875A - Station block of solder ball attaching apparatus - Google Patents

Abstract

The present invention relates to a station block of a solder ball attaching device. The station block according to the present invention is provided with a vacuum suction force through the vacuum suction passage in the block body, the lifting guide located inside the block body is moved up and down by the elastic force and the vacuum suction force of the spring, the vacuum sucker formed on the lifting guide is It can protrude completely above the block body, move up and down and adhere to the package strip by vacuum suction. The station block of the present invention improves the flatness of the package strip and improves the precision of the flux coating process and the solder ball attaching process by preventing the vacuum leakage caused by the package warpage when fixing the package strip.

Solder Ball Attaching Apparatus, Station Block, Vacuum Sucker, Elevating Guide

Description

Station block of solder ball attaching apparatus

1 is a cross-sectional view showing a station block according to the prior art.

2 is a cross-sectional view illustrating a problem associated with a station block in the solder ball attaching apparatus according to the prior art.

3A is a plan view schematically illustrating a station block according to an embodiment of the present invention.

FIG. 3B is a cross-sectional view taken along line IIIB-IIIB of FIG. 3A.

4A and 4B are cross-sectional views illustrating a structure and an operating state of a station block according to an exemplary embodiment of the present invention, and FIG. 4A shows a state where the vacuum sucker is raised and FIG. 4B shows a state where the vacuum sucker is lowered.

5A to 5C are cross-sectional views sequentially illustrating an operation process of a station block in an apparatus for attaching solder balls according to an embodiment of the present invention.

<Description of Reference Symbols Used in Drawings>

10, 40: station block

11, 41: block body 12, 42: vacuum sucker

13, 43: vacuum suction path 14, 44: vacuum suction direction                 

20: strip picker 21: strip suction plate

30: package strip 31: wiring board

32: molded resin 45: guide groove

46: elevating guide 47: spring

The present invention relates to a semiconductor package manufacturing apparatus, and more particularly, to an apparatus for attaching a solder ball, which is an external connection terminal of a package, to a wiring board.

In order to use an integrated circuit device manufactured on a semiconductor wafer in an electronic product, the integrated circuit device must be cut and separated by a chip unit and then packaged. The semiconductor package is not only for physically supporting the integrated circuit chip and protecting it from the external environment but also for providing an electrical connection path to the integrated circuit chip. Today's packaging technologies are becoming increasingly important to determine the price, performance and reliability of semiconductor products.

There are many types of semiconductor packages. One of them is to attach the integrated circuit chip to one side of the wiring board and to place solder balls on the opposite side to be used as external connection terminals of the package. As such, the surface arrangement of the solder balls has various advantages such as an increase in the number of input / output pins, an increase in package mounting density, and a shortening of an electrical signal transmission path. Accordingly, the application of solder balls is becoming common in ball grid arrays (BGAs), system in packages (SIPs), multi chip packages (MCPs), and the like, which are recently expanding in use.

There are several methods of forming solder balls on a wiring board, a representative one of which is a solder ball attach method. The solder ball attachment method uses flux pins to apply flux to the land pattern of the wiring board, and solder balls are attached onto the flux using a ball attachment mechanism, and then reflow ( It is a method of melting solder balls through reflow.

On the other hand, as the size of solder balls is smaller than 0.3 mm and the number of solder balls used in one package is increasing to 200 or more, the flux coating process and the solder ball attaching process require higher precision. Doing. However, as the thickness of the package decreases and the area of the molded resin increases, warpage of the package cannot be avoided. Thus, maintaining package strip planarity, which is essential for flux application and solder ball attachment, is becoming increasingly difficult.

The warpage of the package refers to the package being bent up and down due to temperature change due to the difference in thermal expansion coefficient between the package components such as mold resin, wiring board, integrated circuit chip, chip adhesive, and the like. Such warpage phenomenon is particularly increased as the thickness of the package becomes thinner and the area of the mold resin becomes wider, which causes problems in the flux coating process and the solder ball attaching process.

The solder ball attaching device is equipped with a strip picker for absorbing strip-shaped packages and transporting them to the process position, and a station block for fixing and flattening the package strip before proceeding. have. Among these, process problems caused by package warping are particularly caused by station blocks.

1 is a cross-sectional view of a station block 10 according to the prior art. Referring to FIG. 1, the station block 10 includes a block body 11 and a vacuum sucker 12. A vacuum suction path 13 is formed inside the block body 11 and is connected to a vacuum pump (not shown). The vacuum sucker 12 is open in the middle and is through the vacuum suction passage 13. Reference numeral 14 denotes a vacuum suction direction.

The station block 10 having such a configuration causes a problem in the process of fixing the package strip. 2 is a cross-sectional view for explaining a problem associated with the station block 10 in the solder ball attaching apparatus according to the prior art.

Referring to FIG. 2, the strip picker 20 sucks the package strip 30 through the strip suction plate 21 and transfers it to the process position. In the package strip 30, a mold resin 32 is formed on one surface of the wiring board 31. The station block 10 adsorbs and fixes the mold resin 32 of the package strip 30 through the vacuum sucker 12 to form solder balls on the opposite side of the wiring board 31.

However, as described above, when the bending phenomenon occurs in the package strip 30, the vacuum sucker 12 and the mold resin 32 do not come into close contact with each other, and a vacuum leakage phenomenon occurs (a portion indicated by reference numeral A). . This vacuum leakage phenomenon not only leads to a weakening of the holding force on the package strip 30, but also makes it impossible to properly perform the function of flattening the package strip 30. Therefore, it acts as a cause which causes a problem in a flux application | coating process and a solder ball attachment process.

The present invention has been made to solve the above problems in the prior art, an object of the present invention is to improve the flatness of the package strip and flux coating by preventing vacuum leakage due to the package bending phenomenon when fixing the package strip It is to provide a station block of a solder ball attachment device that can improve the precision of the process and the solder ball attachment process.

In order to achieve this object, the present invention provides a station block having a vacuum sucker capable of fully protruding upward of the block body and capable of lifting and lowering.

The station block of the solder ball attachment device according to the present invention comprises a block body having a vacuum suction path provided therein that provides a vacuum suction force; An elevating guide positioned in the block body and capable of elevating movement up and down by a predetermined displacement; A vacuum sucker is formed above the lifting guide and includes a vacuum sucker that can completely protrude upward of the block body by the lifting guide and is capable of lifting up and down by a predetermined displacement. The vacuum sucker is provided in the vacuum suction path. It is characterized by being in close contact with a predetermined object by the vacuum suction force.                     

In the station block of the solder ball attachment device according to the present invention, the block body may include a guide groove formed on the inner wall, the lifting guide is sandwiched between the guide groove and the lifting movement is possible along the guide groove It features.

In addition, the station block of the solder ball attachment device according to the invention may further comprise a spring installed in the guide groove, the lifting guide is placed on the spring and the lifting movement is possible by the elastic force and the vacuum suction force of the spring It is characterized by.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

In describing the embodiments, descriptions of technical contents which are well known in the technical field to which the present invention belongs and are not directly related to the present invention will be omitted. This is to more clearly communicate without obscure the subject matter of the present invention by omitting unnecessary description.

For the same reason, some components in the accompanying drawings are exaggerated, omitted, or schematically illustrated, and the size of each component does not entirely reflect the actual size. The same or corresponding components in each drawing are given the same reference numerals.

Example

As is well known, the manufacturing process of packages is carried out in batches with several packages arranged in strips or matrices, rather than individual packages. Therefore, it is preferable that the station block of the solder ball attaching device also has an arrangement form according to the shape of the package strip.

3A is a plan view schematically illustrating a station block 40 according to an embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along line IIIB-IIIB of FIG. 3A. As shown in FIGS. 3A and 3B, the vacuum sucker 42 of the station block 40 has a shape arranged to fit the shape of a package strip.

Each station block 40 shown in FIG. 3 has a structure as shown in FIG. 4A and 4B are cross-sectional views showing the structure and operating state of the station block 40 according to the embodiment of the present invention. FIG. 4A is a state in which the vacuum sucker 42 is raised, and FIG. 4B is a vacuum sucker 42. Each of these lowered states is shown.

4A and 4B, the station block 40 includes a block body 41, an elevating guide 46 inserted into the block body 41, and an elevating guide 46. It is composed of a vacuum sucker 42 formed in.

The block body 41 may be formed using a material such as an alloy, and a vacuum suction passage 43 is formed inside the block body 41. The vacuum suction path 43 is connected to a vacuum pump (not shown) to provide suction force by vacuum. Reference numeral 44 designates the vacuum suction direction.

A guide groove 45 is formed in a portion of the inner wall of the block body 41, and a spring 47 is installed in the guide groove 45. The lifting guide 46 located inside the block body 41 (that is, the vacuum suction path 43) is placed above the spring 47 at the same time both ends thereof are sandwiched between the guide grooves 45. Therefore, when no external force is applied, the lifting guide 46 is pushed upward to the top of the guide groove 45 by the elastic force of the spring 47 as shown in FIG. 4A.

The vacuum sucker 42 is formed above the lifting guide 46. The center of the vacuum sucker 42 and the elevating guide 46 is open in the vertical direction and is through the vacuum suction path 43. Therefore, the vacuum suction force provided through the vacuum suction path 43 can be transmitted to the object (that is, the package strip) in close contact with the vacuum sucker 42. The vacuum sucker 42 is preferably formed of an elastic material such as rubber so as not to damage the adhesion object.

When no external force is applied, the vacuum sucker 42 projects upward of the block body 41 by the elastic force of the spring 47 as shown in FIG. 4A. However, since the vacuum suction force acts when the object comes into close contact with the vacuum sucker 42, the lifting guide 46 and the vacuum sucker 42 compress the spring 47 while the guide groove 45 is compressed as shown in FIG. 4B. Descends.

5A to 5C are described in detail how the station block 40 acts on a package strip in which warpage has occurred. 5A through 5C are cross-sectional views sequentially illustrating an operation process of the station block 40 in the solder ball attaching apparatus according to the exemplary embodiment of the present invention.

Referring to FIG. 5A, the package strip 30 having the mold resin 32 formed on the wiring board 31 is transferred to the process position by the strip picker 20 while being fixed to the strip suction plate 21. The mold resin 32 of the package strip 30 is then placed on the vacuum sucker 42 of the station block 40. At this time, since the vacuum sucker 42 completely protrudes upward from the block body 41, the vacuum sucker 42 and the mold resin 32 can be closely adhered to each other, thereby preventing the vacuum leakage phenomenon. Compared with the prior art, since the conventional vacuum sucker 12 is fixed to the block body 11, as shown in Figs. 1 and 2, the vacuum sucker 12 and the mold resin 32 between There is a limit to the adhesion, and a vacuum leakage phenomenon occurs accordingly.

Subsequently, referring to FIG. 5B, a vacuum suction force is applied to the lower portion of the package strip 30 through the vacuum sucker 42 and the strip picker 20 descends to apply pressure to the upper portion of the package strip 30. Accordingly, the vacuum sucker 42 and the lifting guide 46 are lowered along the guide groove 45 while compressing the spring 47. Through this operation, the adhesion between the vacuum sucker 42 and the mold resin 32 is further improved, and the flatness of the package strip 30 is gradually improved.

As shown in FIG. 5C, when the vacuum sucker 42 and the lifting guide 46 are lowered to the maximum compressed state of the spring 47, the flatness of the package strip 30 becomes even better. Therefore, the precision of the flux application process and solder ball attachment process performed to the upper surface side of the wiring board 31 can be improved significantly.

As described above, the station block of the solder ball attachment device according to the present invention is provided with a vacuum sucker having a structure that can be completely protruded above the block body and can be moved up and down by a certain displacement up and down. Thus, close contact between the vacuum sucker and the package strip is enabled and the vacuum leakage phenomenon can be effectively prevented. In addition, the flatness of the package strip can be improved to improve the precision of the flux coating process and the solder ball attaching process.

The station block of the solder ball attachment device according to the present invention can effectively cope with manufacturing process defects, such as a thin package, an array mold package, and the like, which are particularly prone to warpage, and can greatly increase package production efficiency.

In the present specification and drawings, preferred embodiments of the present invention have been disclosed, and although specific terms have been used, these are merely used in a general sense to easily explain the technical contents of the present invention and to help the understanding of the present invention. It is not intended to limit the scope. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein.

For example, the size, shape of the station block, the shape of the vacuum sucker, the position of formation and the number of vacuum suckers according to the present invention are not limited to those illustrated in the specification and the drawings, and the present invention further provides a package strip using vacuum pressure. Applicable to all means used to transport, fasten.

Claims (3)

A block body formed therein with a vacuum suction path providing a vacuum suction force; An elevating guide positioned in the block body and capable of elevating movement up and down by a predetermined displacement; Is formed above the elevating guide, by the elevating guide includes a vacuum sucker which can be completely protruded upward of the block body and is capable of elevating movement up and down by a certain displacement, And the vacuum sucker is in close contact with a predetermined object by a vacuum suction force provided by the vacuum suction path. According to claim 1, The block body includes a guide groove formed on the inner wall, The lift guide is a station block of the solder ball attachment device, characterized in that the guide groove is inserted between the guide groove and the lifting movement. The method of claim 2, Further comprising a spring installed in the guide groove, The lifting guide is placed on the spring and the station block of the solder ball attachment device, characterized in that the lifting movement is possible by the elastic force and the vacuum suction force of the spring.

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