KR101245837B1 - Socket device for testing a ic package - Google Patents

Abstract

PURPOSE: A socket apparatus for a semiconductor package test is provided to pressurizes a contact pin in a transverse direction by an up and down driving of a working body portion, and implement an electrical contact by contacting the contact pin to the side bottom part of a solder ball center and a wiping action. CONSTITUTION: A plurality of contact pins(500) is corresponded to each solder ball of a semiconductor package(10) on a one-to-one basis. The bottom part of the contact pin is inserted into a fixing body portion(100). The upper part of the contact pin is inclined and located toward the solder ball. The contact pin is pressurized in a transverse direction by a downward movement of the semiconductor package which is pressurized by a latch(400) and an upward movement of a working body portion(600). Therefore, the solder ball of the contact pin and the semiconductor package is contacted.

Description

Socket device for testing a semiconductor package

The present invention relates to a socket device for testing a semiconductor package, and more particularly to a socket device for testing a semiconductor package that can provide a means for obtaining a stable electrical contact with the solder ball of the semiconductor package.

In general, a microchip (IC package) is manufactured by integrating high density electronic circuits on a circuit board, and thus, a process of checking whether the microchip works properly before assembling it into a product is required.

This inspection work is carried out by assembling the chip into the inspection socket device, the socket device is provided with a plurality of contact pins in contact with the chip terminal, the chip terminal and the contact probe is in contact with the electricity is applied to the chip using the inspection device. Will be tested.

In particular, due to the rapid growth of IT devices, package miniaturization and thinning are accelerating, and accordingly, the pitch is becoming finer, and commercialization of 0.3 mm pitch devices is becoming visible. However, in order to stably test such fine pitch devices, strict tolerance management in packages and sockets is essential, but due to the limitations of package tolerance and shape management due to the characteristics of semiconductor manufacturing process, it is difficult to proportionally decrease compared to conventional fine pitch packages of 0.5 mm or more. In addition, due to the minute environmental changes, the electrical requirements are also more sensitive.

Therefore, in order to stably test a fine pitch package smaller than 0.4 mm, it is urgent to develop a socket device for testing a semiconductor package that has a structure that can flexibly accommodate the geometrical tolerance region of the ultra fine pitch package.

In addition, the test socket device is not complicated in the connection path of the signal transmitted to the terminal of the semiconductor device, it is preferable to minimize the components so that the electrical connection characteristics are not degraded.

Currently, a socket device for testing a semiconductor package is variously disclosed. For example, the present applicant has disclosed a socket device for testing a BGA type semiconductor package in Korean Patent Publication No. 10-1007660 (Registration Date: 2011.01.05). The patent discloses a socket device capable of making stable electrical contact with a solder ball by contact pins having two pin heads provided symmetrically.

As another example, Korean Patent Publication No. 10-2007-0073233 (published: 2007.07.10) shows a test socket for a BGA package that minimizes damage to solder balls, reduces solder ball contamination, and improves fine pitch response. .

Specifically, referring to FIG. 1, the conventional test sockets are as follows.

1 (a) and (b) show examples of operations of a socket device for testing a semiconductor package according to the related art, and show various types of contact probes for electrical connection with solder balls.

Referring to FIG. 1A, a plurality of solder balls 11 are disposed on a bottom surface of a BGA type semiconductor package 10. The socket device is provided with a contact 20 consisting of a pair of arms for electrical contact with the solder ball 11, the upper end of the arm is provided with a contact protrusion 21 to face each other. The contact 20 is an electrical connection is made by the contact protrusion 21 is in contact with the side of the solder ball 11 while only two arms or one arm is closed inward after the package is seated in the socket device.

However, in the conventional socket device, the contact between the solder ball 11 and the contact protrusion 21 is made by the structure in which the contact protrusion 21 pinches the side of the solder ball 11, and thus the solder ball 11 Since the contact force between the contact protrusion 21 and the contact protrusion 21 depends only on the contact 20, it is necessary to secure stable electrical contact characteristics according to the change in the environment or condition caused by mechanical tolerance management or the surface state of the solder ball (such as foreign matter). There is a limit.

As another example, referring to FIG. 1B, a contact pin 30 is provided below the solder ball 11 so as to be in electrical contact with the solder ball 11 in order to inspect the semiconductor package. 30 is formed on the upper end of the contact protrusion 31 is in contact with the solder ball (11). In such a socket device, the semiconductor package 10 is pressed by a latch (not shown) to electrically connect the solder ball 11 and the contact protrusion 31.

However, the socket device of such a structure makes contact with the semiconductor package terminal and the contact pin always at a constant position. Therefore, when foreign matter is attached to the package terminal, there is a problem that good contact is not made between the terminal and the contact pin. .

As described above, the socket device for testing a semiconductor package has to ensure stable electrical contact between the solder ball and the contact pin that electrically connects the test device to the solder ball in order to increase inspection reliability. There are limitations in securing stable characteristics due to tolerances, and in particular, due to the miniaturization and thinning of the package, there is a limitation in the conventional technology alone in dealing with the flexible and effective geometrical marginal tolerance area of the (ultra) fine pitch package.

The present invention is to solve the problems of the prior art, the wiping during the contact between the solder ball and the contact pin to prevent contact failure by the oxide film or foreign matter on the surface of the solder ball during the contact of the solder ball and the contact pin of the semiconductor package. By providing a wiping action, the present invention provides a socket device for testing a semiconductor package that enables stable electrical contact between solder balls and contact pins.

In accordance with another aspect of the present invention, there is provided a socket device for testing a semiconductor package, the test socket device for testing a BGA type semiconductor package having a plurality of solder balls, comprising: a fixed body part; A cover part elastically supported on an upper portion of the fixed body part to be assembled to be movable up and down; An adapter in which the semiconductor package is seated and provided between the fixed body part and the cover part and assembled to be movable up and down; A latch provided in the fixed body portion to press down the upper portion of the semiconductor package seated on the adapter in association with vertical movement of the cover portion; A plurality of contact pins provided to correspond to the solder balls of the semiconductor package one-to-one, the lower end being inserted into the fixed body part and the upper end being eccentric with respect to the solder ball to be in contact with the solder ball by elastic deformation; Assembled so as to be movable up and down between the fixed body portion and the adapter, it is achieved by a working body portion formed with a plurality of head holes so that each is inserted through one-to-one correspondence with the contact pins.

Preferably, in the present invention, the upper end portion of the contact pin has an inclined surface with respect to the longitudinal direction, and more preferably, the upper end portion of the contact pin is formed to further protrude projections facing the solder ball And, more preferably, the projection is characterized in that the two projections are provided symmetrically in the longitudinal direction of the contact pin.

Preferably in the present invention, the contact pin is a fine line of a straight line (fine line), characterized in that it has a bending section or a curved section to be eccentrically positioned in the headhole.

Preferably, in the present invention, a plurality of ball cups are formed on the surface on which the semiconductor package is seated so that each solder ball is inserted into and seated, and each ball cup has an upper end portion of the contact pin inserted therein. Communicate with a second head hole formed to be in contact with each solder ball, more preferably, the ball cup is provided to be rotationally symmetrical with respect to the longitudinal direction, and the second head hole is eccentric with respect to the ball cup and is formed in communication. It features.

In the socket device for testing a semiconductor package according to the present invention, a contact pin provided in a one-to-one correspondence with a solder ball disposed on a bottom surface of a semiconductor package while pressing a semiconductor package seated on an adapter from an upper side thereof is transversely driven by vertical movement of an operating body part. It is pressurized to make contact with the lower side of the center of the solder ball and make electrical contact by the wiping action, so it is possible to secure stable electrical contact characteristics regardless of mechanical tolerance conditions or surface conditions of the solder ball. have.

Figure 1 (a) (b) is a view showing the operation examples of the socket device for testing a semiconductor package of the prior art,
2 is an overall perspective view of a socket device for testing a semiconductor package according to the present invention;
3 is an exploded perspective view of a socket device for testing a semiconductor package according to the present invention;
4 is a longitudinal sectional view showing a main configuration of a socket device for testing a semiconductor package according to the present invention;
5 is an enlarged view of a portion A of FIG. 4;
6 is an enlarged view of a portion B of FIG. 4;
7 is a front view showing a preferred example of the contact pin in the socket device for testing a semiconductor package according to the present invention;
8 illustrates a preferred arrangement of contact pins in contact with a semiconductor package in the socket device for testing a semiconductor package according to the present invention;
9 (a), (b), (c) and (d) are views for explaining an operation example of the socket device for testing a semiconductor package according to the present invention;
10A, 10B and 10C are diagrams for explaining a contact state between a contact pin and a solder ball in the socket device for testing a semiconductor package according to the present invention;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is an overall perspective view of a socket device for testing a semiconductor package according to the present invention, and FIG. 3 is an exploded perspective view of the socket device for testing a semiconductor package according to the present invention.

2 and 3, the socket device for testing a semiconductor package of the present invention includes a fixed body part 100, a cover part 200, an adapter 300, a latch 400, a contact pin 500, and an operation. A test is performed on a BGA type semiconductor package having solder balls, including a body portion 600.

The fixed body part 100 is a rectangular frame structure in which the component parts of the socket device are assembled, and fixedly support the contact pin 500, and the cover part 200, the adapter 300, and the working body part ( 600 is assembled to move up and down, the latch 400 is rotatably coupled.

On the other hand, the fixing body portion 100 may have a variety of forms for fixing and supporting the contact pin 500, as shown in Figure 3, the base 110 and the base (110) through which the contact pin 500 is assembled 110 may be provided by the stopper 120 and the lead guide 130 to be assembled to the lower portion to securely support the contact pin 500.

The cover part 200 has a rectangular frame structure that is open to allow the semiconductor package to pass therethrough, and is elastically supported on the upper part of the fixed body part 100 to be assembled to allow vertical operation.

As illustrated in FIG. 3, a first spring 201 is provided at each of four corners between the cover part 200 and the base 110, so that the cover part 200 is elastic on the fixed body part 100. Supported up and down movement is possible. On the other hand, it can be clearly understood that the fixing body portion 100 and the cover portion 200 may be formed with a spring receiving hole or a spring guide protrusion so that the first spring 201 is fixed and assembled.

The adapter 300 is elastically supported on the upper portion of the fixed body portion 100 to move upward and downward, and the semiconductor package 10 is seated. As illustrated in FIG. 3, four second springs 301 are interposed between the adapter 300 and the base 110 so that the adapter 300 is elastically supported on the fixed body part 100 to move upward and downward. Do. On the other hand, it can be clearly understood that the fixing body portion 100 and the adapter 300 may be provided with a spring receiving hole or a spring guide protrusion so that the second spring 301 is fixed and assembled.

In addition, the position or number of the spring for elastically supporting the cover part 200 or the adapter 300 on the fixed body part 100 can be variously changed, and also the cover part 200 on the fixed body part 100. ) And the adapter 300 may be provided with a coupling protrusion and a coupling groove formed therein in order to assemble integrally to move up and down within a certain range.

The latch 400 is provided on the fixed body part 100 so as to press down the upper portion of the semiconductor package 10 seated on the adapter 300 in conjunction with the vertical movement of the cover part 200.

As illustrated in FIG. 3, the latch 400 is symmetrically provided with two latch arms 410 for pressing the semiconductor package 10, and the latch arms 410 and the link 421 are connected to each other to form a base ( A first hinge pin 420 rotatably coupled to the first hinge pin coupling portion 111 of the 110 and a second hinge pin coupling portion 202 of the cover portion 200 provided at a rear end of the latch arm 410. It may be composed of a second hinge pin (430) rotatably coupled to).

 The latch 400 configured as described above has a second hinge pin 430 coupled to the cover part 200 according to the vertical movement of the cover part 200 while the first hinge pin 420 is hinged to the base 110. As the) moves up and down, the latch arm 410 may press the semiconductor package 10 or release the pressurized state by using the first hinge pin 420 as the rotation axis. For example, when the cover part 200 moves downward, the second hinge pin 430 is also lowered while the latch arm 410 is opened to the outside by using the first hinge pin 420 as the rotation axis (pressure release). On the contrary, when the cover part 200 is moved upward, the second hinge pin 430 is moved upward while the latch arm 410 rotates the first hinge pin 420 to the rotation axis so that the latch arm 410 is rotated. The semiconductor package 10 is pressed.

The contact pin 500 has a lower end inserted into and fixed to the stationary body part 100 to be in electrical contact with the solder balls of the semiconductor package 10 according to the up and down positions of the operating body part 600. It may be provided as a fine line having a straight line having a contact pin (10) by the transverse pressing force provided by the operating body portion 600 and the downward movement of the semiconductor package 10 by the latch 400 ( 500) The upper pin head and the solder ball may be in electrical contact as pinching and wiping are sequentially performed together. The electrical contact operation of the contact pin and the solder ball accompanying this wiping will be described in detail with reference to the accompanying drawings.

The operating body 600 is provided to be movable up and down between the fixed body 100 and the adapter 300, the head hole 610 is formed so as to correspond to the contact pins 500 one-to-one, respectively. . On the other hand, the head hole 610 provided in the working body 600 is contact pin 500 by the inner wall surface of the head hole 610 according to the up and down position of the working body 600 in the state in which the contact pin 500 is inserted Can be pressurized or released in the transverse direction.

On the other hand, although not described in detail in this embodiment, the cover portion 200, the adapter 300 and the operating body 600 is assembled to be movable up and down relative to the fixed body portion 100 to guide the smooth vertical movement It can be clearly understood that each component may be provided with various types of guide members for guiding the up and down movement.

For example, as illustrated in FIG. 2, a guide groove 102 formed in an inlet is provided at an outer side surface of the base constituting the fixed body part 100, and a guide groove 102 is provided in the cover part 200. As the guide protrusion 210 is engaged, the guide protrusion 210 may be guided by the guide groove 102 so that the cover 200 may be vertically moved with respect to the fixed body 100.

Next look at the main components of the present invention in more detail.

4 is a longitudinal cross-sectional view illustrating a main configuration of a socket device for testing a semiconductor package according to the present invention, FIG. 5 is an enlarged view of portion A of FIG. 4, and FIG. 6 is an enlarged view of portion B of FIG. 4. Meanwhile, only one contact pin is shown for clarity, but it should be understood that the same contact pins are provided in one-to-one correspondence with the solder balls of the semiconductor package.

4 and 5, the adapter 300 is a semiconductor package 10 is seated, the upper surface on which the adapter 300 is seated corresponding to a plurality of solder balls 11 one-to-one correspond to the solder ball 11 is inserted A plurality of ball cups 310 are formed, and the ball cups 310 communicate with the second head holes 320 of the lower surface of the adapter 300.

The shape of the ball cup 310 need not be limited to a particular shape, but preferably, the ball cup 310 may have a cylindrical or conical shape that is rotationally symmetrical with respect to the longitudinal direction, and in particular, the second head hole 320 It is eccentrically positioned and communicated with the ball cup 310.

Therefore, in the semiconductor package 10 seated on the adapter 300, the solder balls 11 are seated in the ball cup 310, and contact pins are formed through the bottom of the second head hole 320 communicating with the ball cup 310. The upper end of the 500 may be in contact with the contact pin 500 and the solder ball 11.

As described above, the adapter 300 is provided with a ball cup 310 corresponding to the solder ball 11 of the semiconductor package 10 one-to-one on the upper surface on which the semiconductor package is seated so that the solder ball 11 is inserted. It is possible to prevent miss loading and damage to the semiconductor package during the process of mounting.

On the other hand, the working body 600 is coupled to move up and down on the base 110, one-to-one correspondence with the contact pins 500, the head hole 610 is formed so that each contact pin 500 is inserted through do. The head hole 610 is formed to have a narrow cross-sectional area from the bottom to the top. More preferably, the inner wall surface 611 has an asymmetric structure of the inner wall surfaces facing each other about the contact pin 500. According to the position (height) of the working body 600, the upper end of the contact pin 500 is pressurized or released in the transverse direction by the inner wall surface 611 of the head hole 610.

For example, in FIG. 5, the inner wall surface of the head hole 610 is formed of a first inner wall surface 611a and a second inner wall surface 611b facing each other while having an asymmetrical structure. When moved upward, the contact pin 500 is supported by the first inner wall surface 611a of the head hole 610 to be pressed in the transverse direction toward the solder ball 11, and the operating body 600 is conversely downward. In this case, the second inner wall surface 611b of the head hole 610 may push the contact pin 500 in the opposite direction to the solder ball 11 to release the pressure in the lateral direction.

In addition, the upper end of the contact pin 500 (also referred to as “pin head” in the present invention) may have a bending section or a curved section, and a bending section or a curved section of the contact pin 500 may include a head hole 610. Pressurized by the inner wall surface 611 in the () can be pressed in the lateral direction. In the present embodiment, as illustrated in FIG. 5, the upper end of the contact pin 500 has a bending section 510.

Referring to FIG. 6, the base 110, the stopper 120, and the lead guide 130 constituting the fixed body part have a structure capable of fixing and supporting the lower end of the contact pin 500, and of the contact pin 500. For fixing, the lower end of the contact pin 500 may have a bending section or a curved section.

In detail, as illustrated in FIG. 6, the base 110 includes a first through hole 113 through which the contact pin 500 penetrates, and a second through hole in the stopper 120 and the lead guide 130, respectively. The 121 and the third through hole 131 are formed. Therefore, the second bending section 520 provided at the bottom of the contact pin 500 may be caught between the base 110 and the stopper 120 so that the bottom of the contact pin 500 may be fixed.

The lower end of the contact pin 500 protruding through the third through hole 131 of the lead guide 130 is connected to an inspection device (not shown) to inspect the semiconductor package.

7 is a front view showing a preferred example of a contact pin in the socket device for testing a semiconductor package according to the present invention, wherein the contact pin 500 is provided by a straight fine line 501 having a general elasticity. The upper end portion may be provided with a bending section 520 at the lower end to be fixed to the bending section 510 and the fixed body so that the elastic body is interlocked with the working body.

Preferably, the section in which contact with the solder ball on the top of the contact pin 500 has an inclined surface 521 with respect to the longitudinal direction (ie, the longitudinal direction of the contact pin), and more preferably, the protrusion 522 protruding from the solder ball. ) May be added. In particular, the protrusion 522 may be provided by two protrusions provided symmetrically in the longitudinal direction of the contact pin. Meanwhile, in the present invention, the inclined surface angle or the protrusion formed on the upper end of the contact pin may be provided in various ways.

8 is a view illustrating a preferred arrangement of contact pins in contact with a semiconductor package in the socket device for testing a semiconductor package according to the present invention.

As illustrated in FIG. 8, the contact pins 500 are divided into two groups symmetrical with each other according to the eccentric position of the pin head and the solder ball 11 around the socket device (for example, the fixed body part) of the present invention. The two contact pin groups 500a and 500b, which are divided into 500a and 500b, may be disposed to face each other. Preferably, two contact pin groups 500a and 500b disposed opposite to each other may have eccentric positions of upper ends (pinheads) of the contact pins 500. Make it the opposite direction.

As such, the contact pins inserted into and fixed to the base are arranged to face each other in the vertical or horizontal direction with respect to the center of the socket device, so that the solder balls 11 of the semiconductor package 10 are in contact with the contact pins. 10) The left and right balance is maintained without any phenomenon in one direction, so that stable contact can be made.

9A, 9B, and 9D are views for explaining an operation example of the socket device for testing a semiconductor package according to the present invention.

Hereinafter, an operation example of the socket package for semiconductor package test according to the present invention will be described with reference to FIG. 9.

9 (a) is a view showing an initial state before the semiconductor package 10 is mounted, for convenience of description, the adapter seated on the semiconductor package 10 is shown only the ball cup 310, the working body 600 Is illustrated as the inner wall surface 611 of the head hole through which the contact pin 500 is inserted.

Next, as shown in (b) of FIG. 9, after the semiconductor package 10 is seated on the adapter, the adapter 400 descends from the moment when the latch 400 operates to touch the upper portion of the semiconductor package 10. At the same time, as the working body 600 moves upward, the contact pin 500 is pressed by the inner wall surface 611 in the lateral direction toward the solder ball 11.

Referring to FIG. 9C, the adapter 400 continues to move downward by the latch 400, and the contact pin 500 is laterally pressed by the operating body 600 to contact the contact pin 500. Contact is made between the solder balls 11. In this process, the protrusions protruding from the contact pins 500 are in contact with the surface of the solder ball 11 while pinching is made in the lateral direction and the surface of the solder ball 11 is continuously lowered by the pressing force of the latch 400. Initiate wiping in the longitudinal direction.

FIG. 9D is a view illustrating a state in which contact between the contact pin 500 and the solder ball 11 is completed. In the state in which the semiconductor package 10 is pressed by the latch 400, the contact pin 500 may be formed. The contact pin 500 and the solder ball 11 are firmly brought into contact with each other by completing the pinching force in the lateral direction by the operating body 600 and the wiping in the longitudinal direction by the latch 400. Therefore, the oxide film or the foreign matter surrounding the surface of the solder ball 11 is removed, thereby making the electrical connection stable.

10A and 10B are diagrams for explaining a contact state between a contact pin and a solder ball in the socket device for testing a semiconductor package according to the present invention.

10A is a view showing a planar state of a contact pin in contact with the solder ball 11, and two protrusions 522a and 522b protrude from the upper end of the contact pin 500 in a symmetrical manner. . Therefore, the protrusions 522a and 522b of the contact pin 500 penetrate the oxide film on the surface by a wiping action and enable stable electrical contact with the solder balls 11.

10 (b) shows a contact mark 11a generated on the surface of the solder ball 11 in contact with the contact pin, and the solder ball 11 corresponds to the wiping section WD while contacting the protrusion of the contact pin. The contact mark 11a of length is formed.

On the other hand, the contact section (ie, the wiping section) of the contact pin and the solder ball may be generated in the section below the center CL of the solder ball.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

10 semiconductor package 11: solder ball
100: fixed body portion 200: cover portion
300: adapter 310: ball cup
320: second head hole 400: latch
500: contact pin 600: working body
610: headhole

Claims (8)

In the test socket device for testing a BGA type semiconductor package having a plurality of solder balls,
A fixed body part;
A cover part elastically supported on an upper portion of the fixed body part to be assembled to be movable up and down;
An adapter in which the semiconductor package is seated and provided between the fixed body part and the cover part and assembled to be movable up and down;
A latch provided in the fixed body portion to press down the upper portion of the semiconductor package seated on the adapter in association with vertical movement of the cover portion;
A plurality of contact pins provided to correspond to the solder balls of the semiconductor package one-to-one, the lower end being inserted into the fixed body part and the upper end being eccentric with respect to the solder ball to be in contact with the solder ball by elastic deformation;
It is assembled so as to move up and down between the fixed body portion and the adapter, including a working body portion formed with a plurality of head holes to be inserted through each one in one-to-one correspondence with the contact pins,
The socket for a semiconductor package test, characterized in that the contact pin is laterally pressed by the upward movement of the operating body portion by the latch and the contact of the contact pin and the solder ball of the semiconductor package by the latch. Device. The socket device for testing a semiconductor package according to claim 1, wherein an upper end portion of the contact pin has an inclined surface with respect to the longitudinal direction. The socket device for testing a semiconductor package according to claim 1 or 2, wherein the upper end portion of the contact pin further includes a protrusion formed to protrude from the solder ball. The socket device for testing a semiconductor package according to claim 3, wherein the protrusion is two protrusions provided symmetrically in the longitudinal direction of the contact pin. The socket device of claim 1, wherein the contact pin has a straight line and has a bending section or a curved section so as to be eccentrically positioned in the head hole. According to claim 1, The adapter has a plurality of ball cups are formed so that each solder ball is inserted into a seat on the surface on which the semiconductor package is seated, each ball cup can be contacted with each solder ball is inserted into the upper end of the contact pin Socket device for testing a semiconductor package, characterized in that the communication with the second head hole formed to. The socket device of claim 6, wherein the ball cup is provided to be rotationally symmetrical with respect to the longitudinal direction, and the second head hole is eccentrically formed in communication with the ball cup. The socket for testing a semiconductor package according to claim 1, wherein the contact pins are arranged in at least two groups so as to be symmetrical to each other, and the eccentric positions of the solder balls at the upper ends of the contact pins of the opposing groups are opposite to each other. Device.

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