KR20160119538A - Test socket - Google Patents

Abstract

The present invention relates to a semiconductor chip test socket. More particularly, the semiconductor chip test socket comprises: a base which includes a center opening; a cover which is coupled to the base, wherein the cover is coupled to be movable in a vertical direction with respect to the base, and includes an opening into which a semiconductor chip is inserted; an adapter which is inserted into the center opening of the base and includes a plurality of contact pin accommodating parts; a cover spring which is disposed between the base and the cover and applies elasticity between the base and the cover; a latch system which moves to an opening position and a supporting portion according to the vertical movement of the cover; and a plurality of contact pins which are disposed under the adapter and are exposed through the contact pin accommodating parts. When the cover is positioned upward by the cover spring, the latch system is positioned at the supporting position to press and support the semiconductor chip mounted on the adapter, and when the cover is moved downward by an external force, the latch system is positioned at the opening position to expose the semiconductor chip through the opening, wherein the latch system comprises: a cover shaft which is connected to at least one side of the cover; a latch having one end hinged to the cover shaft; and a latch plate which is connected to the other end of the latch and presses the semiconductor chip mounted on the adapter. The latch moves up and down according to the vertical movement of the cover and pivots around the cover shaft.

Description

Semiconductor chip test socket {TEST SOCKET}

The present invention relates to a semiconductor chip test socket, and more particularly, to a semiconductor chip test socket having a base having a central opening; A cover coupled to the base, movably coupled to the base in a vertical direction, and having an opening for inserting the semiconductor chip; An adapter inserted into the center opening of the base and having a semiconductor chip and a plurality of contact pin receiving portions; A cover spring disposed between the base and the cover for applying elasticity between the base and the cover; A latch system that moves to an open and support position in accordance with the upward and downward movement of the cover; And a plurality of contact pins disposed under the adapter and exposed through the contact pin receiving holes, wherein the latch system is configured to press the semiconductor chip mounted on the adapter when the cover is positioned at the top by the cover spring, And the latch system is located at an open position where the semiconductor chip is exposed through the opening when the cover is moved downward by an external force, And a latch plate coupled to the other end of the latch to press a semiconductor chip mounted on the adapter, wherein the latch is configured to move up and down And a semiconductor chip test socket configured to pivot around the cover shaft A.

The semiconductor device is subjected to a manufacturing process and then an inspection for determining the electrical performance is performed. The performance test of the semiconductor device is carried out with a semiconductor test socket formed so as to be in electrical contact with a terminal of the semiconductor device inserted between the semiconductor device and the test circuit board. In addition to the inspection of semiconductor devices, semiconductor test sockets are also used in a burn-in test process during the manufacturing process of semiconductor devices.

In the semiconductor testing process, since the semiconductor is mounted in a test socket, it is very important to reliably achieve mounting of the semiconductor to such a socket.

Conventionally, a latch system or the like for achieving support by using a member having elasticity has been used. However, when the mounting and support of the socket is achieved by merely using elasticity, the elasticity is likely to be deteriorated when repeated use is performed This leads to poor support of the semiconductor and maintenance of the position, which may result in lowering of the reliability of the test.

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SUMMARY OF THE INVENTION The present invention has been conceived to solve the above-mentioned problems, and an object of the present invention is to provide a base having a center opening; A cover coupled to the base, movably coupled to the base in a vertical direction, and having an opening for inserting the semiconductor chip; An adapter inserted into the center opening of the base and having a semiconductor chip and a plurality of contact pin receiving portions; A cover spring disposed between the base and the cover for applying elasticity between the base and the cover; A latch system that moves to an open and support position in accordance with the upward and downward movement of the cover; And a plurality of contact pins disposed under the adapter and exposed through the contact pin receiving holes, wherein the latch system is configured to press the semiconductor chip mounted on the adapter when the cover is positioned at the top by the cover spring, And the latch system is located at an open position where the semiconductor chip is exposed through the opening when the cover is moved downward by an external force, And a latch plate coupled to the other end of the latch to press a semiconductor chip mounted on the adapter, wherein the latch is configured to move up and down And a semiconductor chip test socket configured to pivot around the cover shaft It is used.

A semiconductor chip test socket according to an embodiment of the present invention includes: a base having a center opening; A cover coupled to the base, movably coupled to the base in a vertical direction, and having an opening for inserting the semiconductor chip; An adapter inserted into the center opening of the base and having a semiconductor chip and a plurality of contact pin receiving portions; A cover spring disposed between the base and the cover for applying elasticity between the base and the cover; A latch system that moves to an open and support position in accordance with the upward and downward movement of the cover; And a plurality of contact pins disposed under the adapter and exposed through the contact pin receiving holes,

The latch system is disposed at a supporting position for pressing and supporting the semiconductor chip mounted on the adapter when the cover is positioned at the upper portion by the cover spring. When the cover moves downward due to external force, Wherein the semiconductor chip is located in an open position to expose the semiconductor chip,

The latch system includes a cover shaft connected to at least one side of the cover, a latch having one end hinged to the cover shaft, and a latch plate connected to the other end of the latch and pressing the semiconductor chip mounted on the adapter In addition,

The latch is vertically moved in accordance with the upward and downward movement of the cover and is configured to pivot around the cover shaft.

Preferably, the cover spring is configured to apply elasticity to the cover so that the latch plate maintains the raised position with respect to the base when the external force is not applied, so that the latch plate fixes and presses the semiconductor chip.

Preferably, the latch is configured such that one end connected to the cover shaft moves up and down according to the upward and downward movement of the cover, and pivots about the cover shaft while the central opening is opened as the cover is lowered, So that the latch plate is pivoted about the cover shaft and pivots in a direction in which the latch plate stands up and covers the upper portion of the semiconductor chip as the cover is lifted so that the cover And is configured to pivot about a shaft, and to pivot so that the latch plate is laid across.

Preferably, the base has a latch shaft extending in a direction transverse to the latch, the latch having a latching portion formed with a predetermined groove in a lower surface thereof, And one end of the latch connected to the cover shaft is lowered and the latch is engaged with the latch shaft when the latch is pivoted in the direction in which the latch plate is pivoted. And as the latch is pivoted in a direction in which the latch plate stands up, the latch latch detaches from the latch shaft and is unlocked.

Preferably, the latch is bent in a downward direction and has a convex shape in which a lower surface is convex, and the latch latch portion is formed so that the groove is recessed in a diagonal direction with respect to the curved lower surface.

Preferably, the latch system includes a torsion spring that maintains a displacement trajectory of the latch to achieve engagement and disengagement between the latch latch and the latch shaft, the latch being disposed at the other end of the latch, And a latch plate shaft connecting the latch plate and the latch, wherein the base has a torsion spring shaft on which the torsion spring is mounted, and the torsion spring is mounted on the latch plate shaft and the cover shaft As shown in Fig.

Preferably, a lift cam is formed on an upper portion of the base to support the latch so as to support a vertical displacement and a turning of the latch.

A semiconductor chip test socket according to an embodiment of the present invention includes: a base having a center opening; A cover coupled to the base, movably coupled to the base in a vertical direction, and having an opening for inserting the semiconductor chip; An adapter inserted into the center opening of the base and having a semiconductor chip and a plurality of contact pin receiving portions; A cover spring disposed between the base and the cover for applying elasticity between the base and the cover; A latch system that moves to an open and support position in accordance with the upward and downward movement of the cover; And a plurality of contact pins disposed under the adapter and exposed through the contact pin receiving hole, wherein one end of the latch system is pivotally connected to one side of the cover, And a latch plate connected to the other end of the latch and pressing the semiconductor chip mounted on the adapter through the central opening, wherein the latch includes a latch latch portion having a predetermined groove formed on a lower surface thereof Wherein the base has a latch shaft extending in a direction transverse to the latch and the cover is raised so that one end of the latch rises and the latch rotates in a direction in which the latch plate lies, And the cover is lowered to be engaged with the cover shaft One end of the connected latch is lowered, and the latch is detached from the latch shaft as the latch is pivoted in a direction in which the latch plate stands up.

The semiconductor chip test socket according to the present invention can reliably support and maintain the semiconductor chip mounted in the socket including the latch system that moves up and down and swings in accordance with the vertical movement of the cover. Therefore, the possibility of occurrence of defects in the test process of the semiconductor chip is lowered, and the test reliability can be improved.

Further, as the latches constituting the latch system are fastened and unclamped by the latch latches and the latch shafts, the latch system can reliably maintain the position of the semiconductor chip mounted on the adapter. That is, the position of the semiconductor chip mounted on the adapter can be appropriately maintained as the latch system maintains the closed position.

1 is a view showing a semiconductor chip test socket according to the present invention.
2 is a view illustrating a semiconductor chip mounted on a semiconductor chip test socket according to the present invention.
3 is an exploded view of the structure of a semiconductor chip test socket according to the present invention.
4 to 7 are views showing the operation of the semiconductor chip test socket according to the present invention.
8 to 9 are views showing operation of the semiconductor chip test socket according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Spatially relative terms such as " lower ", "upper ", " side ", and the like are used to easily describe one member or components and other members or components Spatially relative terms should be understood to include, in addition to the directions shown in the drawings, terms that include different orientations of the elements at the time of use or operation. For example, when reversing a member shown in the figure, Quot; upper "of the other member may be placed" lower " of the other member. Thus, by way of example, the term "upper" may include both downward and upward directions. , So that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, "comprises" and / or "comprising " do not exclude the presence or addition of one or more other members other than the recited member.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

In the drawings, the thickness and size of each part are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

On the other hand, the terms indicating orientation and orientation used in this specification are not necessarily limited to specific positions and orientations. In other words, the upper, lower, or upward and downward directions are concepts described with reference to the drawings, indicating the orientation of the semiconductor chip test socket 1 according to the present invention and other directions and positions according to the orientation of each member ≪ / RTI >

FIG. 1 is a view showing a semiconductor chip test socket 1 according to the present invention, FIG. 2 is a view showing a semiconductor chip mounted on a semiconductor chip test socket 1 according to the present invention, FIG. FIGS. 4 to 7 are views showing the operation of the semiconductor chip test socket 1 according to the present invention, and FIGS. 8 to 9 show the operation of the semiconductor chip test socket 1 according to the present invention In the semiconductor chip test socket 1 according to the first embodiment of the present invention.

Referring to the drawings, a semiconductor chip test socket 1 according to an embodiment of the present invention includes a base 10 having a center opening; A cover 20 coupled to the base 10 and movably coupled to the base 10 in a vertical direction and having a center opening for inserting the semiconductor chip; An adapter 30 inserted into the central opening of the base 10 and having a semiconductor chip and a plurality of contact pins 60 receptacles; A cover spring disposed between the base 10 and the cover 20 for applying elasticity between the base 10 and the cover 20; A latch system (50) that moves to an open and support position in accordance with the upward and downward movement of the cover (20); And a plurality of contact pins (60) disposed under the adapter (30) and exposed through the contact pin (60) receiving hole, wherein the latch system (50) When the cover 20 is moved downward by an external force, the semiconductor chip 40 is positioned at a position where the semiconductor chip mounted on the adapter 30 is pressed and supported by the semiconductor chip 40, Wherein the latch system includes a cover shaft connected to at least one side of the cover, a latch having one end hinged to the cover shaft, And a latch plate 130 connected to the other end of the latch 120 and pressing the semiconductor chip mounted on the adapter 30. The latch 120 is configured to move the cover 20 up and down And at the same time, the cover shaft 110 is moved upward and downward, It is configured to pivot to the center.

The base 10 constitutes a lower portion of the semiconductor chip test socket 1 and is configured to have a central opening so that the adapter 30 can be disposed in the center portion. The shape of the central opening may have a shape corresponding to the shape of the adapter 30 and the semiconductor chip, and may have a rectangular shape, for example, as shown in the figure.

The cover 20 is disposed on the upper portion of the base 10 and coupled to the base 10 so as to be movable up and down with respect to the base 10. The cover 20 also has a central opening so that the semiconductor chip penetrates through the semiconductor chip test socket 1 like the base 10. The shape of the central opening portion may also have a shape corresponding to the shape of the semiconductor chip, and may have a rectangular shape, for example, as shown in the drawing.

A cover spring (40) is disposed between the base (10) and the cover (20). The cover spring 40 may be, for example, a plurality of springs arranged in the outer frame portion as shown in the figure. The cover spring 40 applies elastic force between the base 10 and the cover 20 so that the base 10 and the cover 20 maintain a predetermined position by elasticity do.

An adapter 30 is disposed in the center opening of the base 10. The adapter 30 is a member for allowing the semiconductor chip to be placed substantially on the mounting surface, and may have a mounting surface having a predetermined area. A plurality of contact pins 60 to be described later are accommodated in the adapter 30 and the contact pins 60 are accommodated in the accommodating portion and the contact pins 60 are exposed. A plurality of predetermined through holes may be formed so that the contact pins 60 are electrically connected.

As described above, the cover 20 is vertically movable with respect to the base 10, and is provided with a latch system 50 that moves to the open and support positions in accordance with the upward and downward movement of the cover 20 . The latch system 50 is composed of several members, and is displaced in accordance with the upward and downward movement of the cover 20. A detailed description of the latch system 50 will be described later.

As described above, the adapter 30 accommodates a plurality of contact pins 60. The contact pin 60 is disposed under the adapter 30 and is electrically connected to the semiconductor chip as the semiconductor chip is mounted on the adapter 30 by being exposed through the contact pin 60 receiving hole.

Meanwhile, the semiconductor chip test socket 1 according to the present invention may be provided with a predetermined pin lead guide 70 for supporting, guiding and protecting the contact pin 60, but the present invention is not limited thereto.

Hereinafter, the specific configuration and operation of the latch system 50 will be described in detail.

The latch system 50 is located at a support position for pressing and supporting the semiconductor chip mounted on the adapter 30 when the cover 20 is positioned at the upper portion by the cover spring 40, When the cover 20 moves downward, it is positioned at an open position where the semiconductor chip is exposed through the opening.

That is, the latch system 50 is configured to be pivotable, and its position is determined according to the position of the cover 20.

As shown in the figure, when the cover 20 is resiliently received by the cover spring 40, the latch system 50 is laid down to press the semiconductor chip mounted on the adapter 30 And is located at a supporting position. Here, to lie down is not necessarily limited to a case where the user lie on the exact horizontal plane.

Next, when the cover 20 receives an external force to overcome the elasticity of the cover spring 40 and moves downward to be positioned at a lower portion thereof, the latch system 50 stands upright so that the semiconductor chip is exposed through the opening portion. As shown in FIG. Here, standing up is not necessarily limited to the case of standing exactly perpendicularly.

Here, the member lying or standing up here may not be referred to as the entire latch system 50, but may be regarded as corresponding to the latching 120 described below belonging to the latch system 50. The details are as follows.

The latch system 50 includes a cover shaft 110 connected to at least one side of the cover 20, a latch 120 hinged to one end of the cover shaft 110, And a latch plate 130 connected to the other end for pressing a semiconductor chip mounted on the adapter 30. The latch 120 moves up and down in accordance with the upward and downward movement of the cover 20, And is configured to pivot around the cover shaft (110).

The cover shaft 110 is connected to at least one side of the cover 20 and functions as a member for specifying a rotational axis and an end position of a latch 120 described later. Since the cover shaft 110 serves as a central axis of the pivot movement of the latch system 50, the latch system 50 is disposed at a position where the cover shaft 110 is disposed. For example, the cover shaft 110 may be disposed on opposite sides of the cover 20. Accordingly, the latch system 50 can be formed on two sides of the cover 20 which are connected to both sides of the cover 20 and oppose each other.

One end of the latch 120 is connected to the cover shaft 110. The latch 120 is a member having a predetermined length so that the latch system 50 can be turned as the cover shaft 110 is pivoted. On the other hand, as described above, as the cover shaft 110 is connected to one side of the cover 20 and one side of the latch 120 is pivotally connected to the cover shaft 110, And the latch system 50 is also moved up and down. That is, the latch system 50 can be moved up and down according to the upward and downward movement of the cover 20, and can be turned around the cover shaft 110.

A predetermined latch plate 130 is disposed at the other end of the latch 120. The latch plate 130 performs the function of the substantial latch system 50 by pressing and positioning the semiconductor chip mounted on the adapter 30. [ Meanwhile, the latch plate 130 is connected to the other end of the latch 120, so that it can move up and down together with the latch system 50 and turn.

A cover spring 40 is disposed between the base 10 and the cover 20. The cover spring 40 exerts an elastic force between the base 10 and the cover 20, 40 maintains the position of the cover 20 raised relative to the base 10 in the absence of external force. As described above, in this state, the latch system 50 horizontally presses and fixes the semiconductor chip, so that the latch plate 130 fixes the position by fixing and pressing the semiconductor chip.

The swinging and up-and-down movement of the latch system 50 is caused by the movement of the cover 20 and the swinging and up-and-down movement of the latch system 50 is controlled by the rotation of the latch 120 It is consistent with movement. That is, as with the latch system 50, the latch 120 moves up and down one end of the cover 20 connected to the cover shaft 110 in accordance with the upward and downward movement of the cover 20, When the cover 20 is lowered, the central opening is opened and the adapter 30 is exposed to pivot about the cover shaft 110 to receive the semiconductor chip, When the cover 20 is lifted up, the latch plate 130 pivots about the cover shaft 110 so as to fix and press the upper part of the semiconductor chip by the cover 20, And the latch plate 130 is configured to be pivoted.

One end of the latch 120 connected to the cover shaft 110 moves up and down together with the upward and downward movement of the cover 20 as shown by an arrow A in FIG. Possibly as shown by the arrow B as the latch 120 is connected.

The upper portion of the base 10 in contact with the latch 120 is brought into contact with the latch 120 to achieve a vertical displacement of the latch 120, And a lift cam 170 for supporting the turning. That is, as shown in the drawing, the lift cam 170 can support the bottom of the latch 120 to achieve the turning of the latch 120 so that the latch 120 rotates properly.

The semiconductor chip test socket 1 according to the present invention is capable of reliably supporting and holding the semiconductor chip mounted in the socket including the latch system 50 that moves up and down in accordance with the vertical movement of the cover 20 have. Therefore, the possibility of occurrence of defects in the test process of the semiconductor chip is lowered, and the test reliability can be improved.

Preferably, the base 10 has a latch shaft 140 extending in a direction transverse to the latch 120, and the latch 120 includes a latch catch 150 The cover 20 is lifted and one end of the latch 120 connected to the cover shaft 110 rises and the latch 120 rotates in a direction in which the latch plate 130 lies Accordingly, the latch shoe part 150 is engaged with the latch shaft 140 so that the cover 20 is lowered and one end of the latch 120 connected to the cover shaft 110 is lowered, As the latch 120 is pivoted in a direction in which the plate 130 stands up, the latch latch part 150 is disengaged from the latch shaft 140 and is disengaged.

A predetermined latch is formed on the lower surface of the latch 120, so that a predetermined latch latch 150 is provided. A latch shaft 140 is formed on the base 10 so that the latch latch 150 can be hooked. The latch catch 150 and the latch shaft 140 have shapes corresponding to each other so that the latch catch 150 is disposed at a proper position so that the latch shaft 140 The movement of the latch 120 can be restricted. The latch shaft 140 is formed on the base 10 such that when the latch system 50 is positioned in the closed position the latch shaft 140 and the latch latch 150 are engaged, Keep this closed position fixed.

Whether the latch shaft 140 and the latch latch 150 are engaged or not is determined according to the position of the latch 120. That is, when the cover 120 is lifted up and one end of the latch 120 connected to the cover shaft 110 rises and the latch 120 rotates in a direction in which the latch plate 130 lies, The latch 20 is engaged with the latch shaft 140 and the cover 20 is lowered so that one end of the latch 120 connected to the cover shaft 110 is lowered, The latch latch 150 may be disengaged from the latch shaft 140 as the latch 120 is pivoted in a direction in which the latch 130 is upright.

Such engagement and disengagement between the latch shaft 140 and the latch latch 150 is achieved by one end of the latch 120 being connected by the cover 20 and the cover shaft 110. [ 4 to 7, the latch 120 is not simply pivoted, but is rotated at the same time as one end is moved up and down, so that the distance between the latch latch portion 150 and the latch shaft 140 Tightening and disengagement can be achieved. That is, when the cover 20 is lowered while the latch shaft 140 and the latch latch 150 are engaged, the latch latch 150 is disengaged from the latch shaft 140, And the latch shaft 140 is released, and then the latch system 50 is moved to the open position.

As the latch latch 150 and the latch shaft 140 are formed, the latch system 50 can reliably maintain the position of the semiconductor chip mounted on the adapter 30. [ That is, the position of the semiconductor chip mounted on the adapter 30 can be appropriately maintained as the latch system 50 maintains the closed position.

Preferably, the latch 120 is curved in a downward direction to have a convex shape with a convex lower surface, and the latch latch part 150 is formed such that the groove is recessed in a diagonal direction with respect to the curved lower surface . That is, since the latch 120 has a curved shape and a groove is formed on the lower surface of the latch 120, the latch latch 150 is fastened and fastened between the latch latch 150 and the latch shaft 140, Release can be made easily.

8 and 9, the latch system 50 maintains a displacement trajectory of the latch 120 to maintain the displacement trajectory of the latch 120 between the latch latch 150 and the latch shaft 140, And a torsion spring 160 for achieving engagement and disengagement. The latch 120 has a latch plate shaft 180 disposed at the other end of the latch 120 and connecting the latch plate 130 and the latch 120. The base The torsion spring 160 has a torsion spring 160 on which the torsion spring 160 is installed and the torsion spring 160 is elastically biased about the torsion spring shaft 190 with respect to the latch plate shaft 180 and the cover shaft 110. [ .

The torsion spring 160 applies elasticity to both ends of the latch 120 with respect to the torsion spring shaft 190 so that the latch 120 is elastically received and displaced so that the displacement orbit of the latch 120, That is, by keeping the locus constant, the engagement and disengagement between the latch latch portion 150 and the latch shaft 140 can be constantly achieved.

A semiconductor chip test socket (1) according to an embodiment of the present invention comprises: a base (10) having a central opening; A cover (20) coupled to the base (10) and movably coupled with the base (10) in a vertical direction and having an opening for inserting the semiconductor chip; An adapter 30 inserted into the central opening of the base 10 and having a semiconductor chip and a plurality of contact pins 60 receptacles; A cover spring disposed between the base 10 and the cover 20 for applying elasticity between the base 10 and the cover 20; A latch system (50) that moves to an open and support position in accordance with the upward and downward movement of the cover (20); And a plurality of contact pins (60) disposed under the adapter (30) and exposed through the contact pin (60) receiving holes, wherein the latch system (50) And a latch 120 connected to the other end of the latch 120 so as to be vertically moved and pivotally moved in accordance with the upward and downward movement of the cover 20, And a latch plate 130 for pressing the mounted semiconductor chip and the latch 120 has a latch latch 150 having a predetermined groove formed on a lower surface thereof, The cover 120 is lifted so that one end of the latch 120 is lifted and the latch 120 is lifted up by the latch 120 The latch shaft 140 is rotated in a direction The cover 20 is lowered so that one end of the latch 120 connected to the cover shaft 110 is lowered and the latch plate 130 is pulled up in a direction in which the latch plate 130 stands up, The latch latch portion 150 is disengaged from the latch shaft 140 as the latch lever 120 rotates.

As the latch latch 150 and the latch shaft 140 are formed, the latch system 50 can reliably maintain the position of the semiconductor chip mounted on the adapter 30. [ That is, the position of the semiconductor chip mounted on the adapter 30 can be appropriately maintained as the latch system 50 maintains the closed position.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

1: Semiconductor chip test socket
10: Base
20: cover
30: Adapter
40: Cover spring
50: latch system
60: contact pin
70: Pin lead guide
110: Cover shaft
120: latch
130: Latch plate
140: LATCH SHAFT
150: latch latch
160: Torsion spring
170: lift cam
180: Latch plate shaft
190: Torsion spring shaft

Claims (8)

In a semiconductor chip test socket,
A base having a central opening;
A cover coupled to the base, movably coupled to the base in a vertical direction and having an opening for inserting the semiconductor chip;
An adapter inserted in a central opening of the base and having a plurality of contact pin receptacles;
A cover spring disposed between the base and the cover for applying elasticity between the base and the cover;
A latch system that moves to an open and support position in accordance with the upward and downward movement of the cover;
And a plurality of contact pins disposed under the adapter and exposed through the contact pin receiving holes,
The latch system includes:
When the cover is positioned at the upper portion by the cover spring, the cover is located at a supporting position for pressing and supporting the semiconductor chip mounted on the adapter,
The semiconductor chip is exposed through the opening when the cover moves downward due to an external force,
The latch system includes:
A cover shaft connected to at least one side of the cover,
A latch having one end hinged to the cover shaft,
And a latch plate connected to the other end of the latch and pressing the semiconductor chip mounted on the adapter,
The latch
Wherein the semiconductor chip is vertically moved in accordance with the vertical movement of the cover and is turned around the cover shaft. The method according to claim 1,
The cover spring
Wherein the cover holds the raised position with respect to the base in the absence of an external force so as to apply elasticity to the cover so that the latch plate fixes the semiconductor chip. The method according to claim 1,
The latch
One end connected to the cover shaft moves up and down according to the up-and-down movement of the cover, and turns around the cover shaft,
The cover plate is pivoted about the cover shaft so that the latch plate is uprighted so that the center opening is opened and the adapter is exposed to receive the semiconductor chip as the cover is lowered,
Wherein the latch plate pivots about the cover shaft so that the latch plate covers the upper portion of the semiconductor chip and pivots so that the latch plate is laid on the latch plate as the cover rises. The method of claim 3,
The base includes:
And a latch shaft extending in a direction across the latch,
The latch
And a latching portion having a predetermined groove formed on a lower surface thereof,
The cover is lifted and one end of the latch connected to the cover shaft rises and the latch is engaged with the latch shaft as the latch is pivoted in a direction in which the latch plate lies,
The cover is lowered and one end of the latch connected to the cover shaft is lowered and the latch latch is disengaged from the latch shaft as the latch is pivoted in a direction in which the latch plate stands up. The method of claim 4,
The latch
The lower surface is curved in a downward direction,
Wherein the latch latch portion is formed such that the groove is recessed in a diagonal direction with respect to the curved lower surface. The method of claim 5,
The latch system includes:
And a torsion spring that maintains a displacement trajectory of the latch to achieve engagement and disengagement between the latch latch portion and the latch shaft,
The latch includes a latch plate shaft disposed at the other end of the latch and connecting the latch plate and the latch,
Wherein the base has a torsion spring shaft on which the torsion spring is mounted,
The torsion spring,
And applies elasticity to the latch plate shaft and the cover shaft about the torsion spring shaft. The method according to claim 1,
On the upper portion of the base,
And a lift cam which abuts on a lower surface of the latch to support a vertical displacement and rotation of the latch. In a semiconductor chip test socket,
A base having a central opening;
A cover coupled to the base, movably coupled to the base in a vertical direction, and having an opening for inserting the semiconductor chip;
An adapter inserted in a central opening of the base and having a plurality of contact pin receptacles;
A cover spring disposed between the base and the cover for applying elasticity between the base and the cover;
A latch system that moves to an open and support position in accordance with the upward and downward movement of the cover;
And a plurality of contact pins disposed under the adapter and exposed through the contact pin receiving holes,
The latch system includes:
A latch having one end pivotally connected to one side of the cover and moving up and down and pivoting in accordance with the upward and downward movement of the cover,
And a latch plate connected to the other end of the latch and pressing the semiconductor chip mounted on the adapter through the central opening,
The latch has a latching portion formed with a predetermined groove on a lower surface thereof,
The base having a latch shaft extending in a direction across the latch,
The cover is lifted and one end of the latch is lifted and the latch latch is engaged with the latch shaft as the latch is pivoted in a direction in which the latch plate is laid down,
The cover is lowered and one end of the latch connected to the cover shaft is lowered and the latch latch is disengaged from the latch shaft as the latch is pivoted in a direction in which the latch plate stands up.

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