TWI713267B - Test socket for use in testing device under test - Google Patents

Abstract

Provided is a test socket that electrically connects a device under test having a plurality of terminals to a test board of a test apparatus. The test socket includes a plurality of contact pins, a pin support, an elastic conductive sheet, a housing, a pusher, and a latch device. The plurality of contact pins are connected to the test board. The pin support is disposed on the test board and holds the plurality of contact pins at a vertical orientation. The elastic conductive sheet is demountably mounted on a top of the pin support, and the device under test is seated on the elastic conductive sheet. The elastic conductive sheet includes a plurality of elastic conduction portions that are contacted with the plurality of terminals and the plurality of contact pins in a vertical direction. The housing is coupled to the pin support and accommodates the elastic conductive sheet. The pusher is coupled to the housing so as to be movable in the vertical direction. The latch device is operably connected to the housing and the pusher, and releasably fixes the device under test to the elastic conductive sheet in interlocking with a movement of the pusher.

Description

Test socket used when testing the device under test

The present invention relates to a test socket for electrically connecting a test device and a test equipment.

A test socket is used in the test procedure for a semiconductor device. The test socket electrically connects a semiconductor device with a test equipment. The test socket is installed on the test equipment and contains the semiconductor device to be tested. The test socket is in contact with the semiconductor device and the test equipment. The test socket transmits the test signal of the test equipment to the semiconductor device, and transmits the reply signal of the semiconductor device to the test equipment.

A burn-in test can be used to test the function of a semiconductor chip by one of the tests on the semiconductor device. In addition, it can be checked whether the semiconductor wafer is abnormally operated at high temperature. During the burn-in test, the semiconductor device is operated in an environment in which a high temperature and a high electric field are applied to the semiconductor device. Therefore, a malfunctioning semiconductor device cannot withstand several conditions during the burn-in test, and therefore malfunctions. A non-defective semiconductor device that has passed the burn-in test can ensure a long service life. Korean Patent Application Publication No. 10-2012-0054548 proposes a test socket that can be used for this kind of burn-in test.

Problems to be solved by the present invention

In a conventional test socket used for a burn-in test, the contact pins made of metal are in direct contact with the terminals of a semiconductor device and the terminals of a test equipment, and the contact pins are joined to the test by soldering The terminal of the device. According to this test socket, the contact pins damage the terminals of the semiconductor device due to the direct contact between the contact pins and the terminals of the semiconductor device, and after many tests have been performed, the contact pins are damaged. To replace the damaged contact pins, the test socket must be separated from the test equipment. Since the contact pins are bonded to the test equipment, it is necessary to apply heat to the test equipment and then separate the contact pins from the test equipment. In addition, it is also necessary to connect unused contact pins to the test equipment. In addition, frequent thermal damage to the test equipment will shorten the service life of the test equipment.

The conventional test socket used for a burn-in test uses relatively long contact pins, and further uses a connector structure to connect the contact pins to a printed circuit board for the burn-in test. Therefore, the signal transmission path between the terminal of the semiconductor device and the test equipment becomes longer, thereby causing deterioration of the test properties.

Therefore, a conventional test socket used for a burn-in test has contact pins that directly contact the semiconductor device. Therefore, conventional test sockets can damage semiconductor devices or contact pins, or damage test equipment. In addition, conventional test sockets increase maintenance costs and do not ensure an easy replacement job. In addition, the conventional test socket used for a burn-in test has a relatively long signal transmission path, and thereby a highly reliable test is not guaranteed.

An embodiment of the present invention provides a test socket that does not damage a device under test and can be reused only by replacing a component. An embodiment of the present invention provides a test socket with the shortest signal transmission path between a device under test and a test device. Means to solve the problem

The embodiment of the present invention relates to a test socket for electrically connecting a test device with a plurality of terminals to a test board of a test equipment. The test socket according to one embodiment includes a plurality of contact pins, a pin support, an elastic conductive plate, a housing, a push plate, and a latch device. The plurality of contact pins are connected to the test board. The pin support is arranged on the test board and holds the plurality of contact pins in a vertical orientation. The elastic conductive plate is detachably mounted on the top of one of the pin supports, and the tested device is placed on the elastic conductive plate. The elastic conductive plate includes a plurality of elastic conductive parts, and the plurality of elastic conductive parts are in contact with the plurality of terminals and the plurality of contact pins in a vertical direction. The shell is coupled to the pin support and accommodates the elastic conductive plate. The push plate is coupled to the housing so as to be movable in the vertical direction. The latch device is operatively connected to the housing and the push plate, and the device under test is releasably fixed to the elastic conductive plate by moving interlocking with one of the push plates.

In one embodiment, the plurality of elastic conductive portions and the plurality of contact pins that contact each other in the vertical direction form a signal transmission path between the plurality of terminals and the test board in the vertical direction .

In one embodiment, the pin support includes a pin block that holds the plurality of contact pins in the vertical orientation, and penetrates the pin block from an upper surface of the pin block to the pin A plurality of pin holes are perforated on the lower surface of one of the blocks, and the plurality of contact pins are respectively assembled to the plurality of pin holes.

In one embodiment, the pin support further includes a support block which is installed on the test board and supports the pin block. The shell is configured to accommodate the elastic conductive plate and the pin block and is releasably coupled to the support block.

In one embodiment, the supporting block includes an upper surface and a plurality of mating protrusions protruding from the upper surface. The housing includes: a lower surface that contacts the upper surface of the support block by surface contact; and a plurality of mating grooves that are recessed from the lower surface, and the plurality of mating protrusions are assembled to the plurality of mating grooves A matching groove.

In one embodiment, the support block may include an elastic engagement portion, and the elastic engagement portion is releasably coupled to the pin block. The support block may include an elastic engaging portion, which is releasably coupled to the housing. The shell can be releasably coupled to the support block by a bolt.

In one embodiment, the elastic conductive plate includes a first mating part, and the pin support includes a second mating part that can be mated with the first mating part. Therefore, the elastic conductive plate is detachably mounted on the pin support by the cooperation of the first matching part and the second matching part. The first mating part may include a mating hole formed in the elastic conductive plate, and the second mating part may include a mating protrusion fitted to the mating hole. The matching hole may have one of a circular shape, a triangular shape, a quadrangular shape, a pentagonal shape, a hexagonal shape, and an oblong shape.

In one embodiment, the elastic conductive plate includes: an elastic insulating part that separates and insulates the plurality of elastic conductive parts in a horizontal direction and is composed of an elastic polymer material; and a frame member , Which supports the elastic insulating part. The casing includes a cover part that protrudes from an upper surface of the casing and covers the frame member.

In one embodiment, the test socket includes a biasing device disposed between the housing and the push plate. The biasing device biases the push plate upward to apply a force to the latch device to push the device under test.

In one embodiment, the latching device is configured to push the device under test toward the elastic conductive plate by interlocking with one of the push plates moving upwards and by moving down with one of the push plates Move the interlock to release the push to the device under test. Effect of the invention

The test socket according to an embodiment of the present invention has an elastic conductive plate arranged between the device under test and the contact pins and connected to both. The elastic conductive plate absorbs the external force generated during the test of the device under test, thereby preventing damage to the contact pins and the test board during the test of the device under test. According to the test socket in one embodiment, when the elastic conductive plate reaches its service life, the elastic conductive plate can be easily replaced at a test site. According to the test socket in one embodiment, the contact pins and the elastic conductive parts that contact each other in the vertical direction form a straight signal transmission path in the vertical direction. Therefore, the test socket has the shortest signal transmission path between the device under test and the test board. According to the test socket in one embodiment, the housing and the pin support are matched with each other and coupled with each other by releasable engagement coupling. Therefore, the shell can accommodate the elastic conductive plate at a minimum height. Therefore, the test socket according to an embodiment can have a compact structure with a reduced height dimension and enable easy and accurate coupling of components. According to the test socket in one embodiment, the elastic conductive plate and the pin support are matched with each other by the mating components, and therefore the test socket achieves easy and accurate alignment of the elastic conductive part and the contact pins.

The embodiments of the present invention are illustrated for the purpose of explaining the technical idea of the present invention. The scope of rights according to the present invention is not limited to the embodiments presented below or detailed descriptions of these embodiments.

Unless otherwise defined, all technical terms and scientific terms in the present invention include meanings or definitions commonly understood by those with ordinary knowledge in the art. All the terms in the present invention are selected for the purpose of explaining the present invention more clearly, and not for limiting the scope of the present invention.

As used in the present invention, expressions such as "including", "including", and "having" should be understood as open-ended terms that may cover other embodiments, unless in phrases or sentences containing such expressions Mentioned otherwise.

Unless otherwise stated, the singular expressions described in the present invention may have a plural meaning, and this will also apply to the singular expressions described in the scope of the patent application.

Expression systems such as “first” and “second” used in the present invention are used to separate plural elements, and are not intended to limit the order or importance of one of the elements.

In the present invention, the description of an element being "connected" or "coupled" to another element should be understood as indicating that an element can be directly connected or coupled to another element, or an element can be connected or coupled to another element via a new element Another element.

In the present invention, the direction indicating terms "upward", "upper", etc. are based on a direction in which a test socket is positioned relative to a test board, and the direction indicating terms "downward", "lower", etc. mean the same One direction opposite to the upward direction or the upper direction. The term "vertical direction" used in the present invention may include an upward direction and a downward direction, but it should not be understood to mean a specific direction between the upward direction and the downward direction.

Hereinafter, each embodiment will be described with reference to the examples shown in the drawings. Similar reference signs in the drawings indicate similar or corresponding elements. In addition, in the following description of each embodiment, the same or corresponding elements may not be repeated. However, even if the elements are not described in detail, these elements are not intended to be excluded in any embodiment.

The embodiments described below and the examples shown in the drawings are for a test socket for electrically connecting a test device and a device under test. The test socket according to the embodiment can be used to electrically connect the test equipment with a test device during testing of the test device. For example, the test socket according to the embodiment can be used to perform a burn-in test on the device under test during the process of manufacturing a semiconductor device. In the burn-in test, thermal stress is applied to the device under test at a high temperature of 80°C to 125°C. During the burn-in test, the device under test is operated in a state where the device under test is subjected to a high temperature and a high electric field. A device under test that cannot withstand the test conditions of the burn-in test will produce a failure. Therefore, a burn-in test can be used to test the device under test that can produce an initial failure. The test examples of the test sockets applicable to the embodiments are not limited to the burn-in test described above.

Figure 1 shows an example of applying a test socket according to an embodiment. Fig. 1 schematically shows a test socket, a test device on which the test socket is placed, and a tested device to be in contact with the test socket. The shapes of the test socket, test equipment, and device under test shown in Figure 1 are only illustrative.

Referring to FIG. 1, a test socket 1000 according to an embodiment is disposed between a test equipment 10 and a device under test 20. To test the device under test 20, the test socket 1000 is in contact with the test device 10 and the device under test 20, and the test device 10 and the device under test 20 are electrically connected to each other. The test socket 1000 receives the device under test 20 therein, and positions the device under test 20 on the test equipment 10. A test of one of the devices under test 20 is performed by the test equipment 10 via the test socket 1000.

The device under test 20 can be a semiconductor package, but is not limited to this. The semiconductor package is a semiconductor device obtained by using a resin material to package a semiconductor IC chip, a plurality of lead frames and a plurality of terminals into a hexahedron form. The semiconductor IC chip can be a memory IC chip or a non-memory IC chip. Pins or solder balls can be used as these terminals. The device under test 20 shown in FIG. 1 has many hemispherical terminals 21 at its bottom side.

The test equipment 10 can be configured to perform a burn-in test on one of the devices under test 20. The test device 10 has a test board 11 with a test socket 1000 mounted thereon. The test board 11 may have a large number of terminals, through which the electrical test signal can be output and the reply signal can be received. The terminal 21 of the tested device 20 is electrically connected to the corresponding terminal of the test board 11 through the test socket 1000. That is, the test socket 1000 electrically connects the terminal 21 of the device under test to the corresponding terminal of the test board 11 in a vertical direction VD, thereby transmitting the electrical test signal and the response signal between the terminal 21 and the test board 11.

Hereinafter, embodiments of the test socket will be described with reference to FIGS. 2 to 7. FIG. 2 is a perspective view showing the test socket according to an embodiment, and FIG. 3 is a cross-sectional view taken along the line 3-3 of FIG. 2. 2 and 3, the test socket 1000 according to an embodiment includes a plurality of contact pins 1100, a pin support 1200, an elastic conductive plate 1300, a housing 1400, a push plate 1500, and a latch Locking device 1600. The test socket 1000 according to an embodiment is an assembly in which one of the aforementioned components is assembled. The test socket 1000 can be detachably installed on the test board 11.

Figure 4 is a partially exploded perspective view of a test socket according to an embodiment. Regarding the contact pins, the pin supports and the elastic conductive plates of the test socket 1000 according to an embodiment, refer to FIGS. 3 and 4.

The plurality of contact pins 1100 are electrically connected to the test board 11 of the test equipment. A plurality of terminal holes 12 are formed in the test board 11, and the plurality of contact pins 1100 are respectively inserted into the plurality of terminal holes 12. The test board 11 may have a printed circuit connected to the respective terminal holes 12. Each contact pin 1100 can be electrically connected to the corresponding terminal hole 12 by welding.

The contact pin 1100 has a connection script body 1111, an upper end portion 1112 and a lower end portion 1113. The connecting script body 1111 is assembled to the pin support 1200, and is held by the pin support 1200 in a vertical orientation. The upper end portion 1112 of the contact pin 1100 slightly protrudes from an upper surface of the pin support 1200, and the lower end portion 1113 of the contact pin 1100 is inserted into the terminal hole 12 of the test board 11. The contact pin 1100 has a circular cross-sectional shape. For another example, the contact pin 1100 may have a square or polygonal cross-sectional shape.

The pin support 1200 can be arranged on the test board 11 of the test equipment or installed on the test board 11. The pin support 1200 is configured to hold the plurality of contact pins 1100 in a vertical orientation. That is, the contact pin 1100 is positioned in the test socket 1000 along a vertical direction VD by the pin support 1200. In one embodiment, the pin support 1200 includes a pin block 1210 and a support block 1220 that can be coupled to each other. In another embodiment, the pin block 1210 and the support block 1220 of the pin support 1200 may be integrally formed. In another embodiment, the pin support 1200 may only include the pin block 1210. In this case, the pin block 1210 can be modified to perform the function of the support block 1220.

The pin block 1210 holds the contact pin 1100 in a vertical orientation. The pin block 1210 is formed into an approximately hexahedral shape, and therefore has a flat upper surface 1211 and a flat lower surface 1212. A plurality of pin holes 1213 are perforated through the pin block 1210, and a part of each contact pin 1100 (for example, the contact body 1111 of the contact pin) is fitted into the plurality of pin holes 1213. A pin hole 1213 is perforated in the vertical direction VD from the upper surface 1211 of the pin block 1210 to the lower surface 1212 of the pin block 1210 through the pin block, and the contact pin 1100 is held in a vertical orientation by the pin hole 1213. In the example shown in FIG. 4, the pin holes 1213 are configured in the form of a pair of matrixes.

In one embodiment, the pin block 1210 includes a mating protrusion 1214 at both end portions positioned along a first horizontal direction HD1 of a horizontal direction HD. The mating protrusion 1214 protrudes from the upper surface 1211 of the pin block 1210. In addition, the pin block 1210 includes on the upper surface 1211 a pair of guiding protrusions 1215 protruding upward from both ends positioned along the first horizontal direction HD1, and the mating protrusion 1214 is located between the pair of guiding protrusions 1215 . The mating protrusion 1214 and the guiding protrusion 1215 function to match the pin block 1210 with the elastic conductive plate 1300.

In one embodiment, the through pin block 1210 has a pair of through holes 1216 formed in the vertical direction VD, and the pin block 1210 has an engaging portion 1217 on one wall surface of the through hole 1216, and the engaging portion 1217 faces the through hole 1216. Inside the hole 1216. Since the engaging portion 1217 of the pin block 1210 can engage with a part of the support block 1220, the pin block 1210 can be detachably coupled to the support block 1220. The pin block 1210 is formed as a single piece with a pin hole 1213 and a through hole 1216 punched therethrough. That is, except for the pin hole 1213 and the through hole 1216, the inside of the pin block 1210 is formed as a solid body. In another embodiment, the pin block 1210 may not have the through hole 1216 and the engaging portion 1217 described above. In this example, the lower surface 1212 of the pin block 1210 and the upper surface of the support block 1220 may be respectively provided with pins and holes that can be assembled with each other.

The supporting block 1220 is formed into an approximately hexahedral shape, and therefore has a flat upper surface 1221 and a flat lower surface 1222. The support block 1220 can be detachably installed on the test board 11 of the test equipment. The support block 1220 has a pair of assembly pins 1223 protruding downward in the lower surface 1222. The assembly pin 1223 is assembled to the assembly hole 13 formed in the test board 11, and thus the support block 1220 can be installed on the test board 11.

The supporting block 1220 includes a plurality of mating protrusions 1224. The mating protrusions 1224 are located at respective corners of the supporting block 1220 and protrude upward from the upper surface 1221. The mating protrusion 1224 plays a role of mating and positioning the supporting block 1220 with the housing 1400. A pair of grooves 1225 are formed in the support block 1220, and a plurality of through holes 1226 are formed from a bottom surface of the groove 1225 to the lower surface of the support block 1220, and the lower end portion 1113 of the contact pin 1100 penetrates in the vertical direction VD Pass through the plurality of through holes 1226. The supporting block 1220 has a pair of positioning pins 1227 protruding upward in the upper surface 1221. The positioning pin 1227 is assembled to a positioning hole (not shown) punched upward in the lower surface 1212 of the pin block 1210, so as to position the pin block 1210 relative to the support block 1220.

The pin block 1210 and the support block 1220 may be releasably coupled to each other, and the support block 1220 and the housing 1400 may be releasably coupled to each other. Such releasable coupling can be achieved by engaging coupling and threaded coupling. In one embodiment, the pin block 1210 and the support block 1220 are coupled to each other by releasable meshing coupling, and the support block 1220 and the housing 1400 are coupled to each other by releasable meshing coupling. The releasable engaging coupling can be achieved by engaging an elastic engaging portion provided in the support block with an engaging portion provided in the pin block and an engaging portion provided in the housing. The elastic engaging portion may include an arm-shaped protruding portion and a wedge-shaped engaging portion arranged at a free end of the protruding portion.

In one embodiment, the supporting block 1220 includes a pair of first elastic engaging portions 1231 and two pairs of second elastic engaging portions 1232 both protruding from the upper surface 1221. Each elastic engaging portion has a shape of an arm protruding upward. Each elastic engaging portion has a wedge-shaped engaging wedge 1233 at its free end that performs an engaging operation. The first elastic engaging portion 1231 passes upward through the through hole 1216 of the pin block 1210, and then engages with the engaging portion 1217 of the pin block 1210 at the engaging wedge 1233 in a releasable manner. Therefore, the pin block 1210 is mounted on the support block 1220 by releasable engagement and coupling. Therefore, with easy manipulation and simple structure, the pin block 1210 can be coupled to the support block 1220. The second elastic engaging portion 1232 engages with a part of the housing 1400 in a releasable manner, thereby achieving a releasable engaging coupling between the supporting block 1220 and the housing 1400.

When testing the device under test 20 (see FIG. 1), the device under test 20 is placed on the elastic conductive plate 1300. The elastic conductive plate 1300 is in contact with both the terminal 21 and the contact pin 1100 of the device under test (see FIG. 1), thereby electrically connecting the terminal 21 and the contact pin 1100 of the device under test. The elastic conductive plate 1300 is detachably coupled to the top of one of the pin supports 1200 (in one embodiment, the upper surface 1211 of the pin block 1210). FIG. 5 is a perspective view showing an elastic conductive plate and a pin block according to an embodiment, and FIG. 6 is an enlarged perspective view showing a part of the elastic conductive plate. For details of the elastic conductive plate according to an embodiment, refer to FIGS. 3 to 6.

Most of the elastic conductive plate 1300 can be made of an elastic polymer material, and the elastic conductive plate 1300 has an elasticity in the vertical direction VD and the horizontal direction HD. If an external force is applied downward to the elastic conductive plate 1300 in the vertical direction VD, the elastic conductive plate 1300 can be deformed in the downward direction and the horizontal direction HD. The external force may be generated by the latch device 1600 pushing the test device toward the elastic conductive plate 1300. Due to this external force, the terminal 21 of the device under test can contact the elastic conductive plate 1300 in the vertical direction VD, and the elastic conductive plate 1300 can contact the contact pin 1100 in the vertical direction VD. If the external force is removed, the elastic conductive plate 1300 can be restored to its original shape.

The elastic conductive plate 1300 includes a plurality of elastic conductive parts 1310. The elastic conductive portion 1310 contacts both the terminals of the device under test and the contact pins 1100 corresponding to the terminals in the vertical direction VD, and electrically connects these terminals and the corresponding contact pins 1100. The elastic conductive portion 1310 is in contact with the terminal 21 of the device under test at its upper end, and is in contact with the upper end of the contact pin 1100 at its lower end. Therefore, the elastic conductive portion 1310 performs electrical conduction corresponding to the vertical direction between the contact pin 1100 of the elastic conductive portion 1310 and the terminal 21. Therefore, the test signal of the test equipment can be transmitted from the test board 11 to the device under test 20 through the contact pin 1100 and the elastic conductive portion 1310, and the response signal of the device under test can be transmitted from the elastic conductive portion 1310 and the contact pin 1100 The terminal 21 is transmitted to the test board 11. The elastic conductive portion 1310 may have a shape of a cylinder extending in the vertical direction VD. In this cylindrical shape, one of the diameters in the middle can be smaller than the diameters of the upper and lower ends. A flat configuration of the elastic conductive portion 1310 can be changed according to a flat configuration of a terminal of the device under test. In an embodiment, the elastic conductive portion 1310 may be configured in a pair of matrix form, but the configuration of the elastic conductive portion is not limited to this.

In one embodiment, the elastic conductive plate 1300 includes an elastic insulating portion 1320, and the elastic insulating portion 1320 separates and insulates the plurality of elastic conductive portions 1310 in the horizontal direction HD. In addition, the elastic conductive plate 1300 includes a frame member 1330. The frame member 1330 is coupled to the elastic insulating portion 1320 along an outer periphery of the elastic insulating portion 1320 and supports the elastic insulating portion 1320. In addition, the elastic conductive plate 1300 may include a terminal guiding member 1340 attached to an upper surface of the elastic insulating portion 1320. The terminal guiding member 1340 may include an insulating film, and a guiding hole 1341 corresponding to each elastic conductive portion 1310 is formed in the terminal guiding member 1340. When the device under test is placed on the elastic conductive plate 1300, the terminal 21 of the device under test (see FIG. 1) can accurately contact the upper end of the elastic conductive portion 1310 while being guided by the guide hole 1341. The elastic conductive plate 1300 according to other embodiments may not include the terminal guide member 1340 described above.

The elastic insulating portion 1320 may form a rectangular elastic area of the elastic conductive plate 1300. The plurality of elastic conductive parts 1310 are insulated by the elastic insulating part 1320 and are spaced apart from each other at an equal interval or an unequal interval in the horizontal direction HD by the elastic insulating part 1320. The elastic insulating portion 1320 is formed as a single elastic body, and the plurality of elastic conductive portions 1310 are embedded in the elastic insulating portion 1320 in a thickness direction (vertical direction VD) of the elastic insulating portion 1320. The elastic insulating portion 1320 composed of an elastic body maintains the elastic conductive portion 1310 in the shape of the elastic conductive portion 1310. The elastic insulating portion 1320 is made of an elastic polymer material, and has an elasticity in the vertical direction VD and the horizontal direction HD.

Specifically, the elastic insulating portion 1320 can be made of a hardened silicone rubber material. For example, the elastic insulating portion 1320 can be formed by injecting liquid silicone rubber into a molding mold used to mold the test socket 1000 and then hardening the liquid silicone rubber. As the liquid silicone rubber material used to mold the elastic insulating part 1320, additive liquid silicone rubber, concentrated liquid silicone rubber, liquid silicone rubber with vinyl or hydroxyl group, etc. For specific examples, the liquid silicone rubber material may include dimethyl silicone rubber, methyl vinyl silicone rubber, methyl phenyl vinyl silicone rubber, and the like. In addition, a silicone rubber material with superior heat resistance properties can be used as the silicone rubber material constituting the elastic insulating portion 1320, so that the test socket according to an embodiment can be applied to a burn-in test.

The elastic conductive portion 1310 includes a plurality of conductive metal particles 1311 that are contacted so as to be conductive in the vertical direction VD. The conductive metal particles 1311 can be formed by coating one surface of a core particle with a highly conductive metal. The core particles may be composed of a metal material such as iron, nickel, cobalt, etc., or may be composed of a resin material having elasticity. Gold, silver, rhodium, platinum, chromium, etc. can be used as highly conductive metals for coating the core particles. The conductive metal particles 1311 that are contacted so as to be conductive in the vertical direction form a conductive path of the elastic conductive portion 1310. The conductive metal particles 1311 can be maintained in the shape of the elastic conductive portion 1310 by the elastic polymer material constituting the elastic insulating portion 1320.

In one embodiment, the elastic conductive plate 1300 is detachably mounted on the top of one of the pin blocks 1210 of the pin support 1200. According to an embodiment, in order to facilitate the positioning of the elastic conductive plate 1300 and the pin block 1210, the elastic conductive plate 1300 and the pin block 1210 are respectively provided with a complementary shape and form a pair of mating components. That is, according to one embodiment, the elastic conductive plate 1300 includes a first mating part, and the pin block 1210 of the pin support includes a second mating part, and the second mating part is complementary to the first mating part A shape and can be matched with the first matching part. Due to the cooperation of the first matching part and the second matching part, the elastic conductive plate 1300 can be detachably coupled to the pin support 1200. In addition, due to the cooperation of the first mating part and the second mating part, the alignment between the elastic conductive part 1310 of the elastic conductive plate 1300 and the contact pin 1100 can be easily and accurately performed.

The first mating part of the elastic conductive plate 1300 may be disposed in the frame member 1330 of the elastic conductive plate 1300. The first mating portion may include a mating hole formed through the elastic conductive plate 1300 in the vertical direction VD. A second mating part complementary to the first mating part may be provided in the upper surface of the pin block 1210. The second mating part may include a mating protrusion having a shape complementary to the mating hole and configured to be fitted to the mating hole.

In one embodiment, as shown in FIGS. 4 and 5, the mating hole of the first mating part includes a pair of mating holes 1351. The fitting hole 1351 is formed in a circular shape. The frame member 1330 of the elastic conductive plate 1300 has a protruding portion 1331 at both ends in the first horizontal direction HD1, and the center of the protruding portion 1331 penetrates the protruding portion 1331 to perforate a matching hole 1351. In addition, in one embodiment, as shown in FIGS. 4 and 5, the mating protrusion of the second mating part includes the pair of mating protrusions 1214. As explained above, the mating protrusions 1214 are formed at both ends of the pin block 1210 in the first horizontal direction HD1. A distance between the mating holes 1351 in the first horizontal direction HD1 corresponds to a distance between the mating protrusions 1214 in the first horizontal direction HD1. A size of the protruding portion 1331 and an interval between the pair of guiding protrusions 1215 are set such that the protruding portion 1331 of the frame member 1330 is fitted between the pair of guiding protrusions 1215. In addition, the mating hole 1351 and the mating protrusion 1214 are formed so as to have a slight tolerance.

When the elastic conductive plate 1300 is installed on the top of the pin support 1200 (specifically, the upper surface 1211 of the pin block 1210), the protruding portion 1331 of the frame member 1330 is guided by the pair of guiding protrusions 1215 While being guided, the fitting protrusion 1214 is fitted to the fitting hole 1351. Therefore, in the state where the elastic conductive portion 1310 is aligned with the contact pin 1100 in the vertical direction and the horizontal direction, the elastic conductive plate 1300 can be placed on the pin block 1210. In addition, since the elastic conductive plate 1300 is maintained on the pin block 1210 by the fitting between the mating hole 1351 and the mating protrusion 1214, the elastic conductive plate 1300 can be easily detached upward from the pin block 1210.

In the state where the elastic conductive plate 1300 is mounted on the upper surface of the pin block 1210, the plurality of elastic conductive portions 1310 respectively contact the corresponding contact pins 1100 in the vertical direction VD. The plurality of contact pins 1100 are positioned in a vertical orientation by the pin block 1210, and are directly electrically connected to the corresponding terminal holes 12 of the test board 11, respectively. In addition, if the device under test 20 (see FIG. 1) is placed on the elastic conductive plate 1300, the terminal 21 of the device under test (see FIG. 1) is in contact with the elastic conductive portion 1310 in the vertical direction VD. Therefore, in the test socket 1000 according to one embodiment, a signal transmission path is formed between the terminal 21 of the device under test and the test board 11 via the elastic conductive portion 1310 and the contact pin 1100 to form a signal transmission path along the vertical direction VD The shape of a straight line. In addition, the signal transmission path along the vertical direction VD is made the shortest path in the test socket 1000. Therefore, the test socket according to an embodiment has the shortest signal transmission path between the device under test 20 and the test board 11 of the test equipment, so as to achieve better transmission of electrical test signals and response signals.

In addition, according to the test socket of one embodiment, in a state where the device under test is in contact with the elastic conductive plate 1300, the device under test 20 is electrically connected to the test board of the test equipment. The elastic conductive plate 1300 does not damage the terminals of the tested device 20 due to the elasticity of the elastic conductive plate 1300. When performing numerous tests on a device under test by using the test socket, repeated contact can damage the components of the test socket. However, since only the test device and the elastic conductive plate are in contact with each other in the test socket according to an embodiment, the elastic conductive plate 1300 can absorb all external forces and prevent the components (for example, contact pins, holding contact Pin support, test board, etc.) cause damage caused by repeated contact. If the elastic conductive plate 1300 is damaged due to numerous tests, the elastic conductive plate 1300 can be easily removed from the pin block 1210 at the test site of one of the tested devices. Therefore, the test socket according to an embodiment can be reused by replacing only the elastic conductive plate 1300, and it is possible to eliminate the separation of the contact pin 1100 from the test board 11 of the test equipment or the separation of the test board 11 One of the heavy industry.

Fig. 7 is a perspective view of another part of the test socket according to an embodiment. With reference to FIGS. 3 and 7, the following describes the housing, the push plate and the latch device of the test socket according to an embodiment.

The housing 1400 may be formed to house the elastic conductive plate 1300, a part of the pin support 1200 (for example, the pin block 1210), and the latch device 1600 therein. The housing 1400 is used as a structure for supporting the push plate 1500 and the latch device 1600. The housing 1400 is formed into a shape of a rectangular frame. The housing 1400 has a plate accommodating portion 1411 formed as a hexahedral opening. In addition, the housing 1400 has an upper surface 1412 and a lower surface 1413. The upper surface 1412 and the lower surface 1413 surround the plate accommodating portion 1411 and are flat. The lower surface 1413 of the housing 1400 can be in contact with the upper surface 1221 of the support block 1220 through surface contact. The pin block 1210 and the elastic conductive plate 1300 are accommodated in the plate accommodating part 1411.

The housing 1400 is releasably coupled to the pin support 1200. In one embodiment, the housing 1400 is detachably mounted on the support block 1220 of the pin support 1200. The housing 1400 includes a matching groove 1421 recessed upward from the lower surface of the housing at each corner thereof. The fitting groove 1421 is formed such that the fitting protrusion 1224 of the supporting block 1220 is fitted to the fitting groove 1421. The mating groove 1421 is formed as a concave portion recessed upward from the lower surface 1413 of the housing 1400, and the mating groove 1421 is located at each corner of the housing 1400. Therefore, as shown in FIG. 2, when the housing 1400 is mounted on the pin support 1200, the mating protrusion 1224 is fitted to the corresponding mating groove 1421, thereby moving the housing 1400 relative to the pin support 1200. Positioning. Since the mating protrusion 1224 is fitted to the mating groove 1421, the housing 1400 can be easily positioned to the pin support 1200. In another embodiment, the supporting block 1220 may include the mating groove described above, and the housing 1400 may include the mating protrusion 1224 described above.

The housing 1400 is releasably mounted on the pin support 1200. For example, the housing 1400 is releasably mounted on the support block 1220 of the pin support 1200. A through hole 1422 is perforated in the vertical direction VD near each corner of the housing 1400, and the housing 1400 has an engaging portion 1423 on a wall surface of the through hole 1422, and the engaging portion 1423 faces the through hole Inside of 1422. The second elastic engaging portion 1232 of the support block passes upward through the through hole 1422, and the engaging wedge 1233 of the second elastic engaging portion 1232 engages with the engaging portion 1423 of the housing 1400. Therefore, the housing 1400 may be releasably coupled to the support block 1220. According to an embodiment, since the housing 1400 is releasably mounted on the support block 1220 by engaging and coupling, the housing 1400 and the pin support 1200 can be coupled to each other with easy manipulation and simple structure.

In one embodiment, the housing 1400 includes a pair of cover portions 1430 located in the plate receiving portion 1411. The pair of cover portions 1430 are respectively located at each end of the plate containing portion 1411 in the first horizontal direction HD1. The cover part 1430 protrudes upward from the upper surface 1412 of the housing 1400 and protrudes toward the inner side of the plate containing part 1411. The cover portion 1430 is formed so as to cover the frame member 1330 of the elastic conductive sheet 1300. In addition, a semicircular cut-out portion 1431 is formed in one of the inner edges of the cover portion 1430. If the housing 1400 is installed on the support block 1220 as shown in FIGS. 2 and 3 to accommodate the elastic conductive plate 1300 and the pin block 1210, the frame member 1330 of the elastic conductive plate 1300 is placed under the cover portion 1430, And the cover part 1430 covers the frame member 1330. In addition, the mating protrusion 1214 of the pin block 1210 is inserted into the cut-out portion 1431. The cover portion 1430 protrudes upward from the upper surface of the housing 1400, and the frame member 1330 of the elastic conductive plate 1300 is placed under the cover portion 1430 and is accommodated in the cover portion 1430. Therefore, the test socket 1000 includes a housing 1400 with a reduced thickness in the vertical direction VD, and therefore can have a more compact structure.

The housing 1400 has a pair of latch accommodating portions 1440 at opposite sides of the plate accommodating portion 1411, the pair of latch accommodating portions 1440 are positioned at a second level orthogonal to the first horizontal direction HD1 The directions HD2 are opposite to each other. The latch accommodating part 1440 is formed as a hole punched through the housing 1400 in the vertical direction VD. A part of the push plate 1500 is located in the latch accommodating part 1440, and a part of the latch device 1600 is received in the latch accommodating part 1440. In a part of the housing 1400 adjacent to the latch accommodating portion 1440, a pair of shaft holes 1441 are perforated through the housing 1400 in the first horizontal direction HD1. A part of the latch device 1600 is fitted to the shaft hole 1441.

When the elastic conductive plate 1300 reaches its predetermined service life, or when the elastic conductive plate 1300 is damaged, the elastic conductive plate 1300 can be easily removed from the test socket 1000. For example, if the engagement wedge 1233 of the second elastic engagement portion 1232 is disengaged from the engagement portion 1423 of the through hole 1422, the housing 1400 can be removed upward from the support block 1220. If the housing 1400 is removed, the elastic conductive plate 1300 matched with the pin block 1210 is exposed. Therefore, the elastic conductive plate 1300 can be easily detached from the pin block 1210. That is, the test socket 1000 of one embodiment achieves easy replacement of the elastic conductive plate 1300.

A pair of slide rails 1451 facing each other in the first horizontal direction HD1 is formed in the housing 1400. The sliding rail 1451 is recessed toward the inner side of the casing 1400 and extends from a lower end of the casing 1400 to an upper end of the casing 1400 in the vertical direction VD. A part of the push plate 1500 is inserted into the slide rail 1451 in a slidable manner. A stopper 1452 protrudes outward from an upper end of each slide rail 1451. The stopper 1452 prevents the push plate 1500 from being separated upward from the housing 1400.

The push plate 1500 is coupled to the housing 1400 so as to be movable in the vertical direction VD and actuates the latch device 1600. The push plate 1500 has a shape of a rectangular frame, like the shape of the housing 1400. The push plate 1500 has the same outer dimensions as one of the outer dimensions of the housing 1400. Therefore, neither of the side surface of the push plate 1500 and the side surface of the housing 1400 will not protrude further than the other.

The push plate 1500 includes a device channel portion 1510. The device passage portion 1510 is formed as an opening punched through the push plate 1500 in the vertical direction VD. The device under test can be placed on the elastic conductive plate 1300 through the device channel portion 1510, and can be removed from the elastic conductive plate 1300 through the device channel portion 1510.

The push plates 1500 include sliding arms 1521 protruding downwards at their respective lower edges opposite to each other in the first horizontal direction HD1. The sliding arm 1521 is formed so as to be assembled to the sliding rail 1451 of the housing 1400. The sliding arm 1521 is assembled to the sliding rail 1451 and slides along the sliding rail 1451 in the vertical direction VD. Due to the sliding coupling between the sliding arm 1521 and the sliding rail 1451, the push plate 1500 can be coupled to the housing 1400 so as to be movable in the vertical direction VD. The sliding arm 1521 has a wedge-shaped engaging portion 1522 protruding inward at its free end. The engaging portion 1522 engages with the stopper 1452, thereby preventing the push plate 1500 from being separated upward from the housing 1400.

The push plate 1500 includes a latch actuating arm 1531 protruding downward at the respective lower edges thereof opposite to each other in the second horizontal direction HD2. The latch actuating arm 1531 is inserted into the latch accommodating portion 1440 of the housing 1400, and moves upward and downward in the latch accommodating portion 1440 as the push plate 1500 moves upward and downward. A shaft hole 1532 is perforated in the first horizontal direction HD1 through each latch actuation arm 1531. A part of the latch device 1600 is fitted to the shaft hole 1532.

The latch device 1600 fixes the device under test to the elastic conductive plate 1300 in a releasable manner. The latch device 1600 is operatively connected to the housing 1400 and the push plate 1500. That is, the latch device 1600 operatively connected to the housing 1400 and the push plate 1500 is associated with the operation of the housing 1400 and the push plate 1500, thereby performing the operation of releasably fixing the device under test.

The latch device 1600 is configured to push the device under test toward the elastic conductive plate 1300 in association with the upward movement of the push plate 1500. The latch device 1600 is configured to release the pushing of the device under test 20 in association with the downward movement of the push plate 1500. In one embodiment, the test socket 1000 includes two latch devices 1600, and the two latch devices 1600 are symmetrically positioned. The latch device 1600 includes a latch 1610, a link arm 1620, a first link shaft 1631, a second link shaft 1632, and a third link shaft 1633.

The latch 1610 contacts the device under test, and pushes the device under test toward the elastic conductive plate 1300 and releases the pushing on the device under test. The latch 1610 has: an operating portion 1611 that applies a rotating force to the operating portion 1611; and a pushing portion 1612 that applies a pushing force caused by the rotating force. The operating part 1611 is located above the latch receiving part 1440 of the housing 1400. The penetrating operation portion 1611 is perforated with a first shaft hole 1613 and a second shaft hole 1614 in the first horizontal direction HD1. The first shaft hole 1613 is positioned inward in the operating portion 1611, and the second shaft hole 1614 is positioned further outward than the first shaft hole 1613. The pushing part 1612 is bent with respect to the operating part 1611. The pushing part 1612 is located in an area of the plate accommodating part 1411 of the housing 1400. The pushing portion 1612 is in contact with an upper surface of one of the devices under test at a free end of the pushing portion 1612.

The link arm 1620 connects the latch 1610 to the housing 1400. A third shaft hole 1621 is perforated in the first horizontal direction HD1 through an upper end of the link arm 1620, and a fourth shaft hole 1622 is perforated in the first horizontal direction HD1 through a lower end of the link arm 1620.

The first link shaft 1631 is coupled to the fourth shaft hole 1622 of the link arm 1620. In addition, the first link shaft 1631 is coupled to the shaft hole 1441 of the housing 1400 in the first horizontal direction HD1. The third link shaft 1633 is coupled to the first shaft hole 1613 of the latch 1610 in a state in which the third link shaft 1633 is coupled to the third shaft hole 1621 of the link arm 1620. Therefore, the operating portion 1611 of the latch 1610 is located in the latch accommodating portion 1440 in a state where the operating portion 1611 is supported by the first link shaft 1631 and the link arm 1620. In addition, the operating portion 1611 is rotatably connected to the first link shaft 1631 through the third shaft hole 1621, the third link shaft 1633 and the fourth shaft hole 1622. The second link shaft 1632 is rotatably coupled to the second shaft hole 1614. In addition, the second link shaft 1632 is coupled to the shaft hole 1532 formed in the latch actuation arm 1531 of the push plate 1500 in the first horizontal direction HD1. Therefore, the operating portion 1611 of the latch 1610 is located in the latch accommodating portion 1440 in a state in which the operating portion 1611 is connected to the latch actuating arm 1531 of the push plate 1500 through the second link shaft 1632.

The housing 1400 is fixed. The first link shaft 1631 coupled to the housing 1400 does not move in the vertical direction, and the operating portion 1611 of the latch 1610 is supported by the fourth shaft hole 1622. Therefore, the latch 1610 can rotate around one of the rotation centers of the fourth shaft hole 1622 via the first link shaft 1631. The push plate 1500 is coupled to the housing 1400 so as to be movable in the vertical direction VD. The operating portion 1611 of the latch 1610 is connected to the push plate 1500 via the second shaft hole 1614 and the second link shaft 1632. The second shaft hole 1614 becomes a point where the push plate 1500 applies a rotational force to the latch 1610. As the push plate 1500 moves upward, the second link shaft 1632 and the second shaft hole 1614 move upward, and at the same time, the operating portion 1611 of the latch 1610 moves upward around the first shaft hole 1613 and the third shaft hole 1621 Spin. With this upward rotation of the operating portion, the pushing portion 1612 of the latch 1610 rotates downward toward the center of the housing 1400, and therefore, the device under test can be pushed toward the elastic conductive plate 1300. As the push plate 1500 moves downward, the second link shaft 1632 and the second shaft hole 1614 move downward. Therefore, the operating portion 1611 of the latch 1610 rotates downwardly toward the outer side of the housing 1400 around the first shaft hole 1613 and the third shaft hole 1621. With this downward rotation of the operating portion, the pushing portion 1612 of the latch 1610 rotates upward toward the outer side of the housing 1400, and thus the pushing on the device under test can be released. Therefore, according to one embodiment, the latch 1610 of the latch device 1600 can be pushed by the test device toward the elastic conductive plate 1300 as the push plate 1500 moves upward, and the latch 1610 can follow the push plate 1500 downward The mobile release pushes the device under test.

In one embodiment, the test socket 1000 may include a biasing device 1700, and the biasing device 1700 always biases the push plate 1500 upward. According to one embodiment, as the push plate 1500 moves upward, the latch 1610 of the latch device 1600 will be pushed by the test device toward the elastic conductive plate 1300. The biasing device 1700 always biases the push plate 1500 upward, and the force pushing the device under test can always be applied to the latching device 1600. The biasing device 1700 may include a compression coil spring 1710. The compression coil spring 1710 can be arranged between the four corners of the housing 1400 and the four corners of the push plate 1500 corresponding to the four corners in the vertical direction VD. For example, an arrangement of the compression coil spring 1710 between the housing 1400 and the push plate 1500 is such that a lower end portion of the compression coil spring 1710 is inserted into a spring hole 1461 provided in the housing 1400, and the compression coil spring An upper part of the 1710 is inserted into a spring hole (not shown) provided in the push plate 1500. The push plate 1500 is always biased upward due to the compression coil spring 1710. Therefore, in the free state of the test socket shown in FIG. 2, the pushing portion 1612 of the latch 1610 is positioned above the plate receiving portion of the housing 1400.

Fig. 8 is a cross-sectional view similar to Fig. 3 and showing the device under test placed on the elastic conductive plate. The following describes an example of operation of the test socket with reference to FIGS. 2 and 8. As shown in FIG. 2, the pair of latches 1610 are positioned in a closed position, and the pushing portion 1612 of the latch 1610 is positioned above the plate receiving portion 1411. If the push plate 1500 is pushed down, the pushing part 1612 of the latch 1610 rotates upwards toward the outer side of the housing 1400 as the push plate 1500 moves downward. Therefore, the device under test 20 can be placed on the elastic conductive plate 1300 through the device channel portion 1510 of the push plate 1500. The downward movement of the push plate 1500 can be performed manually or by an appropriate mechanism provided in the testing equipment. If an external force applied to the push plate 1500 is removed after the device under test is placed on the elastic conductive plate 1300, the push plate 1500 is moved upward by the biasing device 1700. The pushing portion 1612 of the latch 1610 rotates downward toward the inner side of the housing 1400 with the upward movement of the push plate 1500, and then the latch 1610 is positioned in the closed position. At this time, due to the biasing force of the biasing device 1700, the pushing portion 1612 of the latch 1610 can push the tested device 20 toward the elastic conductive plate 1300. In this way, the device under test 20 is fixed on the elastic conductive plate 1300. Then, the test of the device under test 20 can be performed. Referring to FIG. 8, in a test socket according to an embodiment, the device under test 20 is only in contact with the elastic conductive plate 1300, and the elastic conductive plate 1300 absorbs all external forces applied to the device under test 20. In addition, the elastic conductive portion 1310 and the contact pin 1100 that are in vertical contact with each other form the shortest signal transmission path between the device under test 20 and the test board 11, and the signal transmission path is formed in a straight line shape.

In the foregoing embodiment, the support block and the housing are coupled to each other by releasable engagement coupling. The releasable coupling between the support block and the housing can be achieved by threaded coupling using bolts or screws. FIG. 9 is an exploded perspective view of a test socket according to still another embodiment, and shows an example in which the support block and the housing are coupled by using bolts.

Referring to FIG. 9, threaded holes 1228 are respectively formed in the mating protrusion 1224 of the supporting block 1220 in the vertical direction VD, and a bolt 1471 is threadedly coupled to each threaded hole 1228. The through shell 1400 is perforated with a through hole 1424 in the vertical direction VD at a position corresponding to each threaded hole 1228. A groove 1511 is formed in the vertical direction VD at a position corresponding to each through hole 1424 in the device channel portion 1510 of the push plate 1500. The bolt 1471 can be releasably coupled to the threaded hole 1228 of the support block 1220 through the groove 1511 and the through hole 1424. If the bolt 1471 is separated from the threaded hole 1228, the housing 1400 can be easily removed from the supporting block 1220. If the housing 1400 is removed, the exposed elastic conductive plate 1300 can be easily detached from the pin block 1210.

The shape of the mating protrusion of the pin block and the shape of the mating hole of the elastic conductive plate can be modified in various ways. 10A to 10F show examples of various shapes of fitting holes. Referring to FIG. 10A, the fitting hole 1352 may be formed in a triangular shape. The mating protrusion 1214 of the pin block may have a cross-sectional shape corresponding to the triangular shape of the mating hole 1352. Referring to FIG. 10B, the fitting hole 1353 may be formed in a quadrangular shape. The mating protrusion 1214 of the pin block may have a cross-sectional shape corresponding to the quadrilateral shape of the mating hole 1353. Referring to FIG. 10C, the fitting hole 1354 may be formed in a pentagonal shape. The mating protrusion 1214 of the pin block may have a cross-sectional shape corresponding to the pentagonal shape of the mating hole 1354. Referring to FIG. 10D, the fitting hole 1355 may be formed in a hexagonal shape. The mating protrusion 1214 of the pin block may have a cross-sectional shape corresponding to the hexagonal shape of the mating hole 1355. In addition, the mating hole may be formed in an oblong shape, and may be formed in an open shape in the frame member 1330 to exclude a part of the oblong shape. FIG. 10E shows a fitting hole 1356 formed in an oblong shape, and the fitting hole 1356 is formed in an open shape in the frame member 1330 to exclude a part of the oblong shape. As explained above, the mating hole of the first mating part may have one of a circular shape, a triangular shape, a quadrangular shape, a pentagonal shape, a hexagonal shape, and an oblong shape. Fig. 10F shows another example of the mating hole and the mating protrusion. Referring to FIG. 10F, the fitting hole 1357 is formed in a quadrilateral shape recessed from an edge of the frame member 1330. The mating protrusion 1214 of the pin block 1210 has a quadrilateral and a cross-sectional shape. In addition, in the example shown in FIG. 10F, the pin block 1210 has a pair of cylindrical guiding protrusions 1218 near the mating protrusion 1214. In addition, a through hole 1332 into which a cylindrical guide protrusion is inserted is formed in the frame member 1330.

So far, the technical concept of the present invention has been explained with reference to certain embodiments and examples shown in the drawings. However, it should be understood that various substitutions, modifications and changes can be made, which do not deviate from the technical concept and scope of the present invention that can be understood by those with ordinary knowledge in the technical field to which the present invention belongs. In addition, it should be understood that these substitutions, modifications and changes fall within the scope of the attached patent application.

3-3: Line 10: Test equipment 11: Test board 12: Terminal hole 13: Assembly hole 20: Device under test 21: Hemispherical terminal/terminal 1000: Test socket 1100: contact pin 1111: connect script body 1112: upper part 1113: Lower part 1200: pin support 1210: pin block 1211: The upper surface of the pin block 1212: Lower surface of pin block 1213: pin hole 1214: mating protrusion 1215: Guide protrusion 1216: Through hole 1217: meshing part 1218: cylindrical guide protrusion 1220: support block 1221: The upper surface of the support block 1222: Lower surface of support block 1223: Assembly pin 1224: mating protrusion 1225: groove 1226: Through hole 1227: positioning pin 1228: threaded hole 1231: First elastic engagement part 1232: Second elastic engagement part 1233: Wedge engagement wedge/engaging wedge 1300: Elastic conductive plate 1310: elastic conductive part 1311: conductive metal particles 1320: Elastic insulation part 1330: Frame member 1331: protruding part 1332: Through hole 1340: Terminal guide member 1341: Guiding Hole 1351: Mating hole 1352: Mating hole 1353: Mating hole 1354: Mating hole 1355: Mating hole 1356: Mating hole 1357: Mating hole 1400: Shell 1411: plate housing part 1412: Upper surface of the shell 1413: lower surface of the shell 1421: Mating groove 1422: Through hole 1423: meshing part 1424: Through hole 1430: Cover part 1431: Semicircular cut part/cut part 1440: latch housing part 1441: Shaft hole 1451: Slide 1452: stop 1461: spring hole 1471: Bolt 1500: push plate 1510: Device channel part 1511: groove 1521: Sliding arm 1522: Wedge-shaped engagement part / engagement part 1531: Latch actuation arm 1532: Shaft hole 1600: Latch device 1610: latch 1611: Operation part 1612: push part 1613: first shaft hole 1614: second shaft hole 1620: Link arm 1621: third shaft hole 1622: The fourth shaft hole 1631: first connecting rod shaft 1632: second connecting rod shaft 1633: Third Link Shaft 1700: Biasing device 1710: Compression coil spring HD: horizontal direction HD1: first horizontal direction HD2: second horizontal direction VD: vertical direction

Fig. 1 schematically shows an example of applying a test socket according to an embodiment.

Figure 2 is a perspective view of a test socket according to an embodiment.

Fig. 3 is a cross-sectional view taken along line 3-3 of Fig. 2.

Figure 4 is a partially exploded perspective view of a test socket according to an embodiment.

Fig. 5 is a perspective view showing an elastic conductive plate and a pin block according to an embodiment.

FIG. 6 is an enlarged perspective view showing a part of the elastic conductive plate shown in FIG. 5. FIG.

Fig. 7 is a perspective view of another part of a test socket according to an embodiment.

Fig. 8 is a cross-sectional view similar to Fig. 3 and showing a device under test placed on an elastic conductive plate.

Fig. 9 is an exploded perspective view of a test socket according to another embodiment.

Fig. 10A is a perspective view showing an example of a fitting hole of an elastic conductive plate.

FIG. 10B is a perspective view showing another example of a matching hole of an elastic conductive plate.

Fig. 10C is a perspective view showing another example of a matching hole of an elastic conductive plate.

Fig. 10D is a perspective view showing another example of a matching hole of an elastic conductive plate.

Fig. 10E is a perspective view showing another example of a matching hole of an elastic conductive plate.

Fig. 10F is a perspective view showing another example of a matching hole of an elastic conductive plate.

11: Test board

12: Terminal hole

13: Assembly hole

1000: Test socket

1100: contact pin

1111: connect script body

1112: upper part

1113: Lower part

1200: pin support

1210: pin block

1211: The upper surface of the pin block

1212: Lower surface of pin block

1213: pin hole

1214: mating protrusion

1220: support block

1221: The upper surface of the support block

1222: Lower surface of support block

1223: Assembly pin

1226: Through hole

1310: elastic conductive part

1320: Elastic insulation part

1330: Frame member

1400: Shell

1412: Upper surface of the shell

1413: lower surface of the shell

1440: latch housing part

1500: push plate

1510: Device channel part

1531: Latch actuation arm

1600: Latch device

1610: latch

1611: Operation part

1612: push part

1620: Link arm

1631: first connecting rod shaft

1632: second connecting rod shaft

1633: Third Link Shaft

1700: Biasing device

1710: Compression coil spring

HD1: first horizontal direction

HD2: second horizontal direction

VD: vertical direction

Claims (12)

A test socket for electrically connecting a tested device with a plurality of terminals to a test board of a test equipment, which includes: a plurality of contact pins connected to the test board; a pin support, which Is arranged on the test board and holds the plurality of contact pins in a vertical orientation; an elastic conductive plate, the tested device is placed on the elastic conductive plate, and the elastic conductive plate is detachably mounted on the connector One of the foot supports is on the top and includes a plurality of elastic conductive parts, the plurality of elastic conductive parts are in contact with the plurality of terminals and the plurality of contact pins in a vertical direction; a housing coupled to the pins Support and accommodating the elastic conductive plate; a push plate coupled to the housing so as to be movable in the vertical direction; and a latch device operably connected to the housing and the push plate And by moving and interlocking with one of the push plates, the device under test is releasably fixed to the elastic conductive plate, wherein the pin support includes: holding the plurality of contact pins in the vertical orientation A pin block; and a support block installed on the test board and supporting the pin block, wherein the pin block penetrates from an upper surface of the pin block to a lower surface of the pin block A plurality of pin holes are perforated, and the plurality of contact pins are respectively assembled to the plurality of pin holes, and the housing is configured to accommodate the elastic conductive plate and the pin block and is releasable Is coupled to the support block. Such as the test socket of claim 1, wherein the plurality of elastic conductive parts and the plurality of contact pins that contact each other in the vertical direction form a signal between the plurality of terminals and the test board in the vertical direction Transmission path. Such as the test socket of claim 1, wherein the support block includes an upper surface and a plurality of mating protrusions protruding from the upper surface, and wherein the housing includes: a lower surface that contacts the support block by surface contact The upper surface contacts; and a plurality of mating grooves, which are recessed from the lower surface, and the plurality of mating protrusions are assembled to the plurality of mating grooves. Such as the test socket of claim 1, wherein the support block includes an elastic engagement portion, and the elastic engagement portion is releasably coupled to the pin block. Such as the test socket of claim 1, wherein the support block includes an elastic engaging portion, and the elastic engaging portion is releasably coupled to the housing. Such as the test socket of claim 1, wherein the housing is releasably coupled to the support block by a bolt. Such as the test socket of claim 1, wherein the elastic conductive plate includes a first mating part, and the pin block includes a second mating part that can be matched with the first mating part, and wherein the elastic conductive plate is The first mating part and the second mating part cooperate to be detachably mounted on the pin block. Such as the test socket of claim 7, wherein the first matching portion includes a matching hole formed in the elastic conductive plate, and the second matching portion includes a matching protrusion fitted to the matching hole. Such as the test socket of claim 8, wherein the matching hole has one of a circular shape, a triangular shape, a quadrangular shape, a pentagonal shape, a hexagonal shape, and an oblong shape. The test socket of claim 1, wherein the elastic conductive plate includes: an elastic insulating part that separates and insulates the plurality of elastic conductive parts in a horizontal direction and is composed of an elastic polymer material; and A frame member supporting the elastic insulating part, wherein the housing includes a cover part protruding from an upper surface of the housing and covering the frame member. For example, the test socket of claim 1, which further includes a biasing device disposed between the housing and the push plate and biasing the push plate upward to push the latch device under test One force of the device. For example, the test socket of claim 11, wherein the latch device is configured to: push the device under test toward the elastic conductive plate by interlocking with one of the push plates moving upward; and by interlocking with the push plate One of the plates moves down to interlock to release the push on the device under test.

Images