JP2024031666A - socket - Google Patents

Abstract

There is a technical problem of reducing the size of the socket for high-density mounting of the socket on a board, and at the same time suppressing or avoiding damage to an IC chip due to contact with a pressing member. SOLUTION: A socket 1 has an IC chip 9 mounted on a mounting part 21 and is movable up and down with respect to a base 2 that supports a plurality of contact members 99 electrically connected to the IC chip 9. an operating member 3 which is provided in the mount portion 21 and shaped to allow the introduction of the IC chip 9 into the mounting portion 21; and a pivot member 4 which pivots with respect to the base 2 in conjunction with the vertical movement of the operating member 3. and, in conjunction with the pivoting of the pivot member 4, between a contact position where the IC chip 9 contacts the upper surface of the IC chip 9 mounted on the mounting portion 21 and a retracted position which is diagonally upwardly away from the contact position toward the outside of the socket. It includes a pressing member 5 that moves while maintaining a constant posture. [Selection diagram] Figure 9

Description

TECHNICAL FIELD The present disclosure relates to sockets, and particularly to sockets for testing IC chips.

In addition to electrical connection between the IC chip and the socket, sockets for testing IC chips are also required to be miniaturized. For example, in Patent Document 1, when the pressure pad is placed in the pressing position, the pivot shaft of the pressure pad is placed in a close position, and when the pressure pad is placed in the release position, the pivot shaft of the pressure pad is placed in the close position. An IC socket is disclosed that includes a remotely disposed support member.

Further, there are also problems such as lateral displacement of the IC chip and damage to the IC chip (for example, scratches on the surface of the IC chip) due to physical contact between the IC chip and the socket when the IC chip is pressed down. For example, Patent Document 2 discloses an IC test handler equipped with a clamping device that can suppress the amount of lateral deviation of an IC during the IC clamping process and prevent the occurrence of terminal contact defects even in ICs having back terminals with a narrow terminal pitch. ing. The IC holding part always moves in the same position in a circular arc trajectory by the parallel link mechanism, and when it comes into contact with the IC, no diagonally downward force is applied to the IC, and the amount of lateral displacement of the IC is suppressed.

Patent Document 3 discloses a socket that uses a latch plate to protect the top surface of a semiconductor device from contact scratches. The latch plate prevents the tip of the latch member from directly contacting the BGA and pushes the BGA downward in the vertical direction.

Japanese Patent Application Publication No. 2004-325393 Japanese Patent Application Publication No. 2004-184173 Japanese Patent Application Publication No. 2009-140629

There is a technical problem of reducing the size of the socket for high-density mounting of the socket on the board while suppressing or avoiding damage to the IC chip due to contact with the pressing member.

A socket according to one aspect of the present disclosure includes a base on which an IC chip is mounted on a mounting portion and supports a plurality of contact members electrically connected to the IC chip, and a socket that is provided to be movable up and down with respect to the base. An operating member shaped to allow the introduction of an IC chip into the mounting portion, a pivoting member that pivots relative to the base in conjunction with the vertical movement of the operating member, and a pivoting member that pivots in conjunction with the pivoting of the pivoting member. Then, a pressing member is moved while maintaining a constant posture between a contact position where it contacts the top surface of the IC chip mounted on the mounting section and a retracted position where it is diagonally upward and away from the contact position toward the outside of the socket. include.

In some embodiments, the push member is located above the pivot member when in the retracted position.

In some embodiments, the push member is disposed entirely within the contour of the socket when in the retracted position.

In some embodiments, the certain orientation is a substantially horizontal orientation.

In some embodiments, the pressing member includes a metal heat dissipating member and, when in the contact position, contacts the upper surface of the IC chip with the lower surface of the heat dissipating member. A heat radiating member may be mounted on the pressing member so as to be elastically displaceable in the vertical direction.

In some embodiments, the pressing member includes a contact member capable of contacting the upper surface of the IC chip, and the contact member is elastically displaceable in the vertical direction.

In some embodiments, at least one upper link connects the upper end of the pressing member to the operating member; and at least one upper link connects the lower end of the pressing member to the operating member and is parallel to the upper link. The device further includes a lower link, and the pressing member, the operating member, the upper link, and the lower link constitute a parallel link. The lower link may have a pair of the pivot member at a position between the pair of the lower link and the pressing member and the pair of the lower link and the operating member. The pivot member has a lower end rotatably supported by the base, an upper end rotatably connected to the lower link, and a pivot member protruding outwardly from the socket between the lower end and the upper end to receive a force from the operating member. It may have a protrusion. The top dead center of the pressing member can be defined based on the interference between the upper link and the pressing member. The bottom dead center of the pressing member can be defined based on the interference between the lower link and the base.

In some embodiments, the pushing member is biased toward a guide included in the base by a resilient member at the free end of the pivoting member, and the posture of the pushing member is constant based on contact between the pushing member and the guide. is maintained.

In some embodiments, the pushing member has a guide protrusion pivotally mounted at the free end of the pivot member and engaged with a guide groove provided in the base, the guide groove being , is formed in an arc shape for a constant posture of the pressing member. The bottom dead center of the pressing member can be defined based on the interference between the pressing member and the base.

A method for electrically connecting an IC chip to a socket according to another aspect of the present disclosure includes lowering an operating member of the socket, which is provided to be movable up and down with respect to a base of the socket, against an upward bias by an elastic member. In one step, the pivoting member pivots toward the outside of the socket in conjunction with the lowering of the operating member, and in response to the pivoting of the pivoting member, it is pressed to an upper position diagonally upward away from the lower position. A first step in which the member moves while maintaining a constant posture, and a second step in which the IC chip is mounted on the mounting portion of the base through an opening formed in the operating member after the first step. include.

A socket according to another aspect of the present disclosure includes a base on which an IC chip is mounted on a mounting portion and supports a plurality of contact members electrically connected to the IC chip, and a socket that is provided to be movable up and down with respect to the base. an operating member shaped to allow introduction of the IC chip into the mounting section; and a first position, each of which moves diagonally upward toward the outside of the socket from the first position in conjunction with the vertical movement of the operating member. The device includes first and second pressing members that move while maintaining a constant posture between second positions separated from each other, and that contact the upper surface of the IC chip mounted on the mounting portion at the first position. Each of the pressing members includes a heat radiation member in which radiation fins are arranged at predetermined intervals, and when the first and second pressing members are in the first position, the radiation fins of the first pressing member and the second pressing member are in contact with each other when viewed from the side of the socket. The radiation fin portions of the member are arranged alternately.

According to one aspect of the present disclosure, it is possible to reduce the size of the socket while suppressing or avoiding damage to the IC chip due to contact with the pressing member.

FIG. 2 is a schematic top view of an IC chip testing board in which a large number of sockets are mounted on the board at high density according to one aspect of the present disclosure. FIG. 3 is a schematic perspective view of the socket in a closed state; FIG. 3 is a schematic perspective view of the socket in an open state; FIG. 3 is a schematic side view of the socket in a closed state; FIG. 3 is a schematic side view of the socket in an open state; FIG. 3 is a schematic top view of the socket in a closed state; FIG. 3 is a schematic top view of the socket in an open state; FIG. 7 is a schematic cross-sectional view of the socket in a closed state taken along a two-dot chain line CX1 in FIG. 6; 8 is a schematic cross-sectional view of the socket in an open state taken along a two-dot chain line CX1 in FIG. 7. FIG. FIG. 6 is a schematic diagram showing that the pressing member moves diagonally upward toward the outside of the socket from a contact position to a retracted position in a fixed posture in the socket. 8 is a schematic cross-sectional view of the socket in an open state taken along a two-dot chain line CX2 in FIG. 7. FIG. FIG. 3 is a schematic top view showing that the contact surface of the pressing member overlaps a predetermined area of the IC chip. 13 is a schematic top view showing that a predetermined area of the IC chip and a contact surface of a pressing member overlap in a manner different from that shown in FIG. 12. FIG. FIG. 7 is a schematic diagram showing that the stop position of the pressing member can be set by a collision between the pressing member and the base. FIG. 3 is a schematic cross-sectional view of another socket in a closed state; FIG. 3 is a schematic cross-sectional view of another socket in an open state; FIG. 7 is a schematic cross-sectional view of yet another socket in a closed state. FIG. 7 is a schematic cross-sectional view of yet another socket in an open state; FIG. 3 is a schematic diagram illustrating setting the top dead center of the pressing member by causing interference between the pressing member and the first link. FIG. 7 is a schematic top view of a socket according to a modified example. 21 is a schematic cross-sectional view of the socket taken along the dashed line in FIG. 20. FIG.

Hereinafter, various embodiments and features according to the present disclosure will be described with reference to the drawings. Those skilled in the art can combine each embodiment and/or each feature without needing excessive explanation, and can also understand the synergistic effect of this combination. Duplicate explanations between embodiments will be omitted in principle. The reference drawings are primarily for the purpose of describing the invention and are simplified for ease of drawing. Each feature is not only effective for the socket disclosed in this specification and the method for electrically connecting the same to an IC chip, but also to various other sockets not disclosed in this specification and the method for electrically connecting the same to an IC chip. It is understood as a universal feature that also applies to electrical connection methods.

As shown in FIG. 1, the sockets 1 are two-dimensionally mounted with high density on the upper surface of the test board 8. An IC chip is mounted on the socket 1 and connected to a testing device via wiring on a testing board 8. By supplying input signals such as clock signals and test signals to the IC chip (via the test board 8 and the socket 1), output signals are obtained from the IC chip (via the socket 1 and the test board 8), and the output signals of the IC chip are obtained. A test can be performed (eg, to determine whether the output signal pattern matches the correct signal pattern). A good electrical connection between the socket 1 and the IC chip mounted thereon is a prerequisite for correct determination of the quality of the IC chip. The test board 8 has an upper surface that is parallel to a plane defined by the X-axis and the Y-axis and perpendicularly intersects with the Z-axis, and is used for electrical connection between the socket 1 and an external test device. wiring (surface wiring and/or internal wiring).

In FIG. 1, the sockets 1 are arranged at a predetermined pitch P1 in the X-axis direction, and are arranged at a predetermined pitch P2 in the Y-axis direction, and the predetermined pitch P1 and the predetermined pitch P2 are equal. Note that each socket 1 has a first width parallel to the X-axis and a second width parallel to the Y-axis, and the first width and the second width are equal. When the first width and the second width of the socket 1 are different, the predetermined pitch P1 and the predetermined pitch P2 can also be made different. As can be seen from the description below, the socket 1 is adapted to high-density arrangement on the test board 8, and in short, when the socket 1 is viewed from above, the pressing member described below comes out from the outer shape of the socket 1. do not have. Note that the outer shape of the socket 1 is determined by the outer shape of the operating member, which will be described later, when the socket 1 is viewed from above, but is not limited thereto.

In this specification, "socket outward" means the direction from the inside position of the socket 1 to the outside position of the socket 1 when the socket 1 is viewed from above, as indicated by the arrow D1 shown in FIG. is orthogonal to one side of the (for example, rectangular) outer shape of the socket 1. The inside of the socket means the direction from the outside position of the socket 1 to the inside position of the socket 1 when the socket 1 is viewed from above, as indicated by the arrow D2 shown in FIG. For example, perpendicular to one side of the rectangular shape.

FIG. 2 is a schematic perspective view of the socket 1 in a closed state. FIG. 3 is a schematic perspective view of the socket 1 in an open state. FIG. 4 is a schematic side view of the socket 1 in a closed state. FIG. 5 is a schematic side view of the socket 1 in an open state. FIG. 6 is a schematic top view of the socket 1 in a closed state. FIG. 7 is a schematic top view of the socket 1 in an open state. FIG. 8 is a schematic cross-sectional view of the socket 1 in the closed state taken along the two-dot chain line CX1 in FIG. FIG. 9 is a schematic cross-sectional view of the socket 1 in an open state along the two-dot chain line CX1 in FIG.

The socket 1 includes a base 2, an operating member 3, a pivot member 4, and a pressing member 5. The base 2 is constructed from one or more resin parts, and is typically an assembly of a plurality of resin parts. Similarly, the operating member 3 is constructed from one or more resin parts and is provided so as to be movable up and down with respect to the base 2. When the operating member 3 is pushed down, the socket 1 assumes the open state shown in FIG. 3 as a deformed state. In the open state, the IC chip 9 can be mounted on the socket 1, and the IC chip 9 can also be taken out from the socket 1. Note that the IC chip 9 can be transported using a suction tool or the like. The IC chip 9 is mounted on the socket 1 when the socket 1 is open, and then the socket 1 is closed, thereby electrically connecting the socket 1 and the IC chip 9.

The base 2 has a mounting part 21 on which the IC chip 9 is mounted, and a base wall 22 provided around the mounting part 21. It supports a plurality of contact members 99 (see also FIG. 10 in addition to FIGS. 8 and 9) electrically connected to the bumps formed on the lower surface of the . The mounting section 21 has a mounting surface 21a on which the IC chip 9 is mounted. The mounting surface 21a is typically a flat surface perpendicular to the Z-axis, but may have irregularities such as through holes or slits for the contact members 99, or recesses corresponding to bumps on the lower surface of the IC chip 9. You can also.

The base wall 22 of the base 2 extends upward from the mounting surface 21a (or a plane including this) of the mounting section 21, thereby (at least partially) defining the arrangement space for the IC chip 9 on the mounting surface 21a. . The inner wall surface of the base wall 22 can function as a guide surface that guides the movement of the IC chip 9 that is transported onto the mounting surface 21a by a transport device such as a suction chuck. Note that the base wall 22 is provided partially or locally around the entire periphery of the mounting surface 21a to avoid interference with the pivot member 4, which will be described later. In the illustrated example, the base wall 22 has four wall portions corresponding to the four sides defining the rectangular outer shape of the mounting surface 21a, and a cutout or opening 23 is formed in each of the wall portions facing each other in the Y-axis direction. has been done. The cutout or opening 23 has the same meaning as a space in which the base wall 22 is not formed. The cutout or opening 23 allows the pivot member 4 to pivot through a large pivot angle.

Each contact member 99 may be an assembly of a pair of pin members. Preferably, the distance between the pair of pin members (particularly their upper ends) changes in conjunction with the vertical movement of the operating member 3, so that the bumps of the IC chip 9 can be held between the pin members. When the operating member 3 is at the initial position (top dead center), the distance between the upper end of one pin member and the upper end of the other pin member is minimum. As the operating member 3 descends, the distance between the upper ends of the pin members increases. When the operating member 3 is at the lowest position (bottom dead center), the distance between the upper ends of the pin members is maximum. By opening and closing the contact member 99 in this manner, collision between the contact member 99 and the bumps on the lower surface of the IC chip 9 when the IC chip 9 is mounted is avoided. Note that the opening/closing adjustment of the pin member in conjunction with the vertical movement of the operating member 3 can be realized using a member that moves in the horizontal direction in accordance with the vertical movement of the operating member 3. Other configurations of contact members may also be employed. For example, a contact member configured to make contact with a lead terminal provided on the outer periphery of the IC chip 9 instead of with a bump may also be employed.

The number and arrangement of the contact members 99 supported by the base 2 can be varied depending on the number and position of bumps on the IC chip 9 (or the number and position of lead terminals). Typically, the contact members 99 are arranged (for example, linearly) along a side that defines the outer periphery of the mounting section 21 (or a side of the IC chip 9 mounted on the mounting section 21) when viewed from above. Ru. Other contact member arrangements are also possible.

The operating member 3 is provided to be movable up and down with respect to the base 2, and preferably engages with the base 2 so as to be slidable in the up and down direction (moveable in a straight line). For example, one of the base 2 and the operating member 3 is provided with a guide protrusion that extends in the vertical direction, and the other is provided with a groove into which the guide protrusion fits, and this engagement stabilizes the operating member 3 with respect to the base 2. It can be moved up and down. Furthermore, the operating member 3 is shaped to allow the IC chip 9 to be introduced into the mounting section 21. Typically, the operating member 3 is a frame-shaped or cylindrical member having an opening 35 that allows the introduction of the IC chip 9, and is at least partially connected to a hollow cylinder 33 surrounding the base 2 in a plane perpendicular to the vertical direction. It has an opening 35 defined by a hollow cylinder 33 .

In the illustrated example, the hollow cylinder 33 includes four walls provided on the outer periphery of the four walls of the base wall 22 of the base 2 described above. Similar to the base wall 22 of the base 2, the hollow cylinder 33 has a notch 34 in each wall portion facing each other in the Y-axis direction. Notch 34 may be formed to allow pivoting of lower link 62, which will be described below. The notch or opening 23 of the base 2 and the notch 34 of the hollow cylinder 33 are positioned adjacent to each other in the inside and outside directions of the socket and communicate with each other, so that the IC chip 9 in the socket 1 or the heat radiating member 52 (described later) is cooled (heat radiated) by air. )can do. Note that the hollow cylinder 33 has a protrusion 36 that extends upward and protrudes into the notch 34, and lower links 62, which will be described later, are provided on both sides of the protrusion 36.

In this embodiment, the socket 1 further includes a pivot member 4 and a pressing member 5. The pivot member 4 pivots relative to the base 2 in conjunction with the vertical movement of the operating member 3. In conjunction with the pivoting of the pivoting member 4, the pressing member 5 moves between a contact position (see FIG. 8) where it contacts the top surface of the IC chip 9 mounted on the mounting section 21 and an oblique direction toward the outside of the socket from the contact position. It moves while maintaining a constant posture between the upwardly separated retracted positions (see FIG. 9). According to this embodiment, damage to the IC chip 9 upon contact with the pressing member 5 can be suppressed or avoided while reducing the size of the socket 1. Note that the movement of the pressing member 5 diagonally upward from the contact position toward the retracted position can be understood based on the pressing member 5 placed at the contact position, but if This can also be understood by comparing it with the mounted IC chip 9.

The pivot member 4 is pivotally supported by the base 2 and pivots in conjunction with the vertical movement of the operating member 3. The pivoting member 4 is configured to obtain a force along the horizontal direction (orthogonal to the up-down direction) from the vertical movement of the operating member 3 (in other words, displacement of a part thereof (for example, the upper end portion 4b) along the horizontal direction). Pivot. In particular, the pivot member 4 pivots outward from the socket when the operating member 3 is lowered, and pivots into the socket when the operating member 3 is raised. For this purpose, the pivot member 4 can be biased to pivot outwardly from the socket by means of a not shown spring. Note that the pivot shaft of the pivot member 4 is located at a predetermined position on the base 2 (unlike the embodiments of FIGS. 15 to 18 described later, it does not move in the vertical direction).

The pivot member 4 can be shaped in various ways, but is preferably bent in at least one place. In the illustrated example (see FIG. 9), the pivot member 4 is rotatably connected to a lower end portion 4a rotatably supported by the base 2 and a lower link 62, which will be described later, and in the closed state, a spring of the operating member is applied to the pivot member 4. The socket has an upper end 4b installed to receive the force, and a protrusion 4c projecting outward from the socket between the lower end 4a and the upper end 4b to receive the force from the operating member 3. The pivot member 4 is bent at one point between the lower end 4a and the upper end 4b, and a protrusion 4c is formed on the outer corner side of the bend. The protruding portion 4c is formed as a convex portion including a pair of gently sloped surfaces. The upper end 4b is movable about the pivot axis of the lower end 4a between a position outside the socket (see FIG. 9) and a position inside the socket (see FIG. 8). The protruding portion 4c is provided to prevent the pivoting member 4 from pivoting when the pressing member 5 is in the contact position due to interference between the protruding portion 4c and the operating member 3 (inner wall surface). This is because there is a possibility that the pivoting member 4 may pivot unintentionally depending on the balance of the forces applied to the operating member 3 and the pressing member 5.

Although not necessarily limited to this, in order to move the pressing member 5 between the contact position and the retracted position while maintaining a constant posture, the pressing member 5 itself may be configured as a parallel link (one link among four links). It can be used as In this case, the socket 1 includes at least one (preferably a pair) upper link 61 that connects the upper end 4b of the pressing member 5 to the operating member 3, and connects the lower end 4a of the pressing member 5 to the operating member 3. However, it can further include at least one (preferably a pair) lower link 62 provided in parallel with the upper link 61. The pressing member 5, the operating member 3, the upper link 61, and the lower link 62 constitute a parallel link. By supporting this parallel link with the pivoting member 4, the pressing member 5 can be moved between the contact position and the retracted position in conjunction with the vertical movement of the operating member 3. Note that the lower link 62 may have a pair with the pivot member 4 at a position between the pair of the lower link 62 and the pressing member 5 and the pair of the lower link 62 and the operating member 3.

The pressing member 5 extends in the vertical direction parallel to the wall of the hollow cylinder 33 of the operating member 3. The pair of the pressing member 5 and the upper link 61 (the second pair J2) is located above the pair of the pressing member 5 and the lower link 62 (the first pair J1), and these pairs are arranged on the same perpendicular line (Fig. 8). The pair of the upper link 61 and the operating member 3 (the fourth pair J4) is located above the pair of the lower link 62 and the operating member 3 (the third pair J3), and these pairs are arranged on the same perpendicular line. The vertical distance between the first pair and the second pair is equal to the vertical distance between the third pair and the fourth pair. The distance between the first pair and the third pair is equal to the distance between the second pair and the fourth pair. Typically, the distance between the first pair and the third pair is longer than the vertical distance between the first pair and the second pair. Note that the shaft provided in the third pair J3 passes through the protrusion 36 of the above-mentioned operating member 3 and extends along the X-axis.

When the operating member 3 begins to descend against the biasing force of the spring for the operating member 3, the lower link 62 begins to pivot outward from the socket with respect to its pivot axis in the operating member 3. 62 can also be said to pivot outward from the socket around the pivot axis (connection shaft S3) of the upper end portion 4b of the pivot member 4). At the same time that lower link 62 begins to pivot, upper link 61 also begins to pivot outward from the socket about its pivot axis. Similarly, the pressing member 5 starts moving from the contact position to the retracted position. When the operating member 3 descends to a position (near the protrusion 4c or below) that allows the pivoting member 4 to pivot outward from the socket, the pivoting member 4 starts pivoting outward from the socket.

As the above-mentioned upper link 61, lower link 62, and pivoting member 4 continue to pivot, the pressing member 5 moves to a retracted position diagonally upwardly away from the IC chip 9, as shown in FIG. The IC chip 9 can be inserted into and removed from the socket 1 without being hindered by the pressing member 5. When in the retracted position, the pressing member 5 may be located above the pivot member 4 and/or may be located offset to the outside of the socket with respect to the pivot axis of the pivot member 4 (arrow D3 in FIG. 9). (See the offset amount indicated by ). This makes it possible to ensure a sufficient opening width for mounting or removing the IC chip 9 in the open socket 1 .

The entire pressing member 5 can be accommodated within the outer shape of the socket 1 when in the retracted position. This allows the open socket 1 to remain small in size. The outer shape of the socket 1 can be determined by the outer shape of the operating member 3 when the socket 1 is viewed from above. If the pressing member 5 moves excessively toward the outside of the socket, the size of the socket 1 in the open state will increase, making it difficult to implement high-density mounting of the socket 1 on the test board 8 (i.e. , it becomes necessary to arrange the sockets 1 at a larger pitch).

When the pressing member 5 is in the retracted position, like the pressing member 5, the upper link 61 and the lower link 62 are also located directly above the operating member 3 (for example, the wall of the hollow cylinder 33), and/or (when viewed from above) can be accommodated within the outer shape of the socket 1 (when Similarly, when the pressing member 5 is in the retracted position, a portion of the pivoting member 4 (e.g., the upper end portion 4b and the protruding portion 4c) is also located directly above the operating member 3 (e.g., the wall of the hollow cylinder 33), and /Or it can be accommodated within the outer shape of the socket 1 (when viewed from above).

For stable operation of the parallel links, when the pressing member 5 is in the retracted position, it is desirable that the upper and lower links 61 and 62 be slightly inclined inward of the socket with respect to the vertical direction; For this purpose, a projection can be provided (for example on the base 2) that limits the angle of the upper or lower links 61, 62 (with respect to the vertical direction).

As an option, the pressing member 5 can be used to dissipate heat from the IC chip 9. The pressing member 5 includes a main body 51 and a metal heat dissipating member 52 in some cases. When the pressing member 5 is in the contact position, the heat dissipating member 52 directly contacts the IC chip 9, promoting heat dissipation. Additionally, when the pressing member 5 is in the contact position, the socket 1 (briefly, the base 2 and the operating member 3) is shaped so that the heat dissipating member 52 can be seen in side view (for example, as shown in FIG. 4). The notch or opening 23 and the notch 34 are formed as shown in FIG. Thereby, the heat radiating member 52 can be effectively cooled by air blowing.

The heat dissipation member 52 can be shaped in various ways, but preferably includes a plurality of heat dissipation fins 53 extending in the vertical direction and a connecting plate 54 in which the plurality of heat dissipation fins 53 are connected (preferably at their lower ends). include. The radiation fins 53 may be arranged parallel to each other at predetermined intervals. A ventilation path is defined between adjacent radiation fins 53 in the arrangement direction of radiation fins 53 . At least when the pressing member 5 is in the contact position, the connecting plate 54 may be provided so as to face the mounting surface 21a of the mounting portion 21 of the base 2 in parallel. When the pressing member 5 is in the contact position, the pressing member 5 contacts the upper surface of the IC chip 9 with the lower surface of the heat dissipating member 52 (for example, the connecting plate 54). Thereby, the heat generated in the IC chip 9 during the inspection of the IC chip 9 can be efficiently dissipated.

In some cases, when two pressing members 5 arranged opposite to each other as a pair in the socket are both in the contact position (first position), the heat dissipation fins 53 of one pressing member 5 and the pressing member of the other press in the side view of the socket. The radiation fins 53 of the member 5 are arranged alternately. In other words, the arrangement of the heat radiation fins 53 of the other pressing member 5 is offset in the lateral direction with respect to the arrangement of the radiation fins 53 of one pressing member 5 . This facilitates cooling of the heat radiation fins 53 by the air blow. Note that the offset of the arrangement of the heat dissipating fins 53 may be observable through the ventilation hole (for example, the above-mentioned notch 34) of the operating member 3.

The heat dissipating member 52 is often harder than the main body 51 due to the material difference between metal and resin, and therefore the top surface of the IC chip 9 is easily damaged. If the heat dissipation member 52 is mounted in the pressing member 5 so as to be elastically displaceable in the vertical direction, damage to the IC chip 9 upon contact can be more reliably or sufficiently avoided. For example, the pressing member 5 further includes a spring (not shown) that biases the heat dissipating member 52 downward with respect to the main body 51. When the pressing member 5 descends and the heat dissipating member 52 comes into contact with the IC chip 9, the heat dissipating member 52 can be displaced upward against the bias of the spring, and the force applied to the IC chip 9 is reduced. Ru. Note that the member provided to be elastically displaceable in the vertical direction is not limited to the heat radiation member 52, and may be replaced with another member (for convenience, referred to as a contact member) as long as it contacts the upper surface of the IC chip 9.

As already shown in the drawings referred to above, the width of the socket 1 can be increased in one direction (for example, the X-axis direction) with respect to the two X and Y-axis directions when the socket 1 is viewed from above. This increases the contact area between the pressing member 5 (for example, the heat dissipating member 52) and the IC chip 9. It is promoted to press the IC chip 9 with more uniform force and/or to dissipate heat more evenly.

In order to stably support the horizontally elongated pressing member 5, additional parallel links may be employed in addition to the above-mentioned parallel links. Briefly, the socket 1 includes a pair of upper links 61 and 63 provided to sandwich the pressing member 5 or a part thereof in the width direction of the socket 1 (for example, the X-axis direction), and For example, it may include a pair of lower links 62 and 64 provided to sandwich the pressing member 5 or a portion thereof in the X-axis direction). That is, at one end of the pressing member 5 in the X-axis direction, the upper end of the pressing member 5 is (rotatably) attached to the upper link 61, and the lower end of the pressing member 5 is (rotatably) attached to the lower link 62. . At the other end of the pressing member 5 in the X-axis direction, the upper end of the pressing member 5 is (rotatably) attached to an upper link 63, and the lower end of the pressing member 5 is (rotatably) attached to a lower link 64. As shown in the figure, it is desirable to position the lower link 62 closer to the widthwise center of the socket 1 than the upper link 61 and to position the lower link 64 closer to the widthwise center of the socket 1 than the upper link 63. A large notch 34 can be formed in the.

The socket 1 may include a pair of pivot members 41, 42 for individually supporting the pair of parallel links mentioned above. Although a common connection shaft S3 can be used for the pair of the pivot member 41 and the lower link 62 and the pair of the pivot member 42 and the lower link 64, this is not necessarily the case. The pivot member 41 may be positioned closer to the center of the socket 1 in the width direction than the lower link 62 in order to make the socket 1 more compact. Similarly, the pivot member 42 may be positioned closer to the widthwise center of the socket 1 than the lower link 64 is.

An upper shaft S1 passing through the pressing member 5 or a portion thereof can be bridged between the upper link 61 and the upper link 63. The upper shaft S1 is rotatable relative to the pressing member 5 (eg, its main body 51). Similarly, a lower shaft S2 passing through the pressing member 5 or a portion thereof can be bridged between the lower link 62 and the lower link 64. The lower shaft S2 is rotatable relative to the pressing member 5 (eg, its main body 51). In this way, the pressing member 5 can move in a more stable posture. Note that the upper shaft S1 and the lower shaft S2 extend along the X axis similarly to the connecting shaft S3.

The heat dissipation member 52 (for example, each heat dissipation fin 53 extending in the vertical direction) has an upper slot 56 extending in the vertical direction into which the upper shaft S1 is inserted, and a lower slot 57 extending in the vertical direction into which the lower shaft S2 is inserted. By forming this, it is possible to elastically displace the heat dissipation member 52 in the vertical direction in the pressing member 5 as described above, and it is promoted that the pressing force is applied from the pressing member 5 to the IC chip 9 with an optimal force. . Typically, the upper and lower slots 56, 57 open in an elliptical shape that is elongated in the vertical direction, but other opening shapes are also possible.

Although a shaft (see dotted line in FIG. 2) can be used to couple the operating member 3 and each link 61 to 64, other methods are also possible. Although a shaft (see shaft S9 in FIG. 8) can be used to couple the base 2 and the pivot member 4, other methods are also possible. Other methods include rotatable fitting of a convex portion and a concave portion, a bearing, and the like.

The socket 1 may be mirror-symmetrically configured with respect to the center plane PL of the socket 1 (see FIG. 2). Thereby, one socket 1 can have two pressing members 5 corresponding to two opposing sides of the rectangular outer shape of the socket 1. As described above, each pressing member 5 can move between the contact position and the retracted position in conjunction with the vertical movement of the operating member 3 (see FIG. 10). When each pressing member 5 includes a heat dissipating member 52, heat dissipation from the IC chip 9 is further promoted. Note that a configuration in which only one pressing member 5 is provided corresponding to one side of the rectangular outer shape of the socket 1 is also envisioned. Similarly, a configuration in which four pressing members 5 are provided corresponding to the four sides of the rectangular outer shape of the socket 1 is also envisioned. If the outer shape of the socket 1 is pentagonal or hexagonal, it is also possible to provide five or six pressing members 5 as described above.

As described above, based on the vertical movement of the operating member 3, the pressing member 5 can be moved diagonally upward from the contact position to the retracted position in a constant posture along the outside of the socket (see FIG. 10), and as a result, the socket 1 transitions from the closed state to the open state. As shown in FIGS. 10 and 11, in addition to the pressing member 5, a latch 7 may be additionally provided to press down the IC chip 9. The latch 7 is pivotally supported by the base 2, as shown in FIG. 11, and is located between the pivot members 41, 42 in the illustrated example. Note that the latch 7 is narrower than the pressing member 5 in the X-axis direction. The latch 7 is constantly biased by a spring to pivot (about its pivot axis in the base 2) into the socket. The latch 7 has a pressing portion 71 for pressing the IC chip 9 and a biased portion 72 biased upward by a spring on both sides of its pivot shaft. When the operating member 3 is lowered, the biased portion 72 of the latch 7 is pushed down by the operating member 3, and the latch 7 pivots outward from the socket against the biasing force of the spring. In this way, in the same way as releasing the pressure by the pressing member 5, the depression of the IC chip 9 by the latch 7 can be released by lowering the operating member 3.

As shown in FIG. 12, when the heat generating areas 91 and 92 in the IC chip 9 are known in advance, the heat dissipating member 52 of the pressing member 5 can be selectively brought into contact with each of the heat generating areas 91 and 92 as a target area. Note that the heat generating regions 91 and 92 are regions that generate more heat than other parts of the IC chip (for example, the peripheral region) when the IC chip 9 is in operation. FIG. 13 shows an example in which two heat radiating members 52 are assigned to one heat generating region 93 of the IC chip 9. In this manner, the position, size, and shape of the pressing member 5 (or heat dissipating member 52) in the socket 1 can be changed depending on the position and range of the heat generating region 93 in the IC chip 9.

As the operating member 3 rises, the pressing member 5 descends and reaches the bottom dead center. The bottom dead center of the pressing member 5 can be defined based on the interference between the pressing member 5 and the base 2. For this purpose, a first stopped portion 58 can be provided on the pressing member 5 (for example, the main body 51) as shown in FIG. When the pressing member 5 is in the contact position, the stopped portion 58 comes into contact with the base 2 (for example, the upper surface of the base wall 22), and the stopping position (bottom dead center) of the pressing member 5 is defined, whereby the IC chip The contact position of the pressing member 5 with respect to the pressing member 9 is optimized. For example, the pressing member 5 is prevented from pressing down the IC chip 9 excessively. The stopped portion 58 may be provided near the second pair J2 of the upper link 61 and the pressing member 5 (for example, adjacent to the inside of the socket). The restrained portion 58 can also be provided on other components such as the heat radiating member 52, the upper link 61, or the lower link 62. In some cases, the bottom dead center of the pressing member 5 is defined based on the interference between the lower link 62 and the base 2. In order to sufficiently restrain the restrained portion 58 by the base 2, the base 2 may be provided with a protrusion that protrudes inward of the socket to the extent that it does not impede attachment and detachment of the IC chip 9.

It is not essential to employ parallel links to maintain a constant posture of the pressing member 5. This point will be briefly explained with reference to FIGS. 15 to 18. 15 and 16, the pressing member 5 is biased toward the guide plate 110 of the base 2 by the spring 120 at the free end of the pivoting member 4, and based on the contact between the pressing member 5 and the guide plate 110, The posture of the pressing member 5 is maintained constant. The guide plate 110 is a part of the base 2 and is provided directly above the base wall 22 described above. Therefore, even if the guide plate 110 is provided, there is no problem in mounting and removing the IC chip 9 into the socket 1. More specifically, the guide plate 110 has a guide surface 111 along which the pressing member 5 slides. The guide surface 111 includes a curved surface that follows the pivot trajectory of the free end of the pivot member 4 . Of course, guides other than guide plate 110 can also be employed.

In the case shown in FIGS. 17 and 18, the pressing member 5 is a guide protrusion that is swingably attached to the free end of the pivot member 4 and that engages with guide grooves 211 and 212 provided in the base 2. 511 and 512, and the guide grooves 211 and 212 are formed in an arc shape for a certain posture of the pressing member 5. The guide grooves 211 and 212 are formed on the inner wall surface of the guide plate 110 included in the base 2. The guide grooves 211 and 212 may be formed to curve along the pivot locus of the free end of the pivot member 4 . The guide protrusions 511 and 512 are protrusions that protrude outward from the socket. Other configurations are also possible.

In the embodiments shown in FIGS. 15 to 18, the pivot shaft of the pivot member 4 moves up and down in conjunction with the up and down movement of the operating member 3. Further, the pivot member 4 has engagement protrusions that engage with guide grooves 211 and 212 provided in the base 2, thereby stabilizing its pivot posture. It is also possible to provide the pivot member 4 in other ways.

As the operating member 3 descends, the pressing member 5 rises and reaches the top dead center. The posture of the pressing member 5 at the top dead center can be defined based on the interference between the pressing member 5 and the upper links 61 and 63. For example, as shown in FIG. 19, a second stopped portion 59 can be provided on the pressing member 5 (for example, the main body 51). When the pressing member 5 is in the retracted position (top dead center), the stopped portion 59 contacts the upper link 63 to prevent rotation of the pressing member 5, and the posture of the pressing member 5 is maintained. The pressing member 5 is not moved further outside the socket by external forces, and a possible stack of parallel links is avoided in this case. To be sure, if the upper links 61, 63 and the lower links 62, 64 are arranged on the same perpendicular line, there is a possibility that the parallel links will not operate normally. As mentioned above, when the pressing member 5 is in the retracted position, it is desirable that the upper and lower links 61 and 62 be slightly inclined inward of the socket with respect to the vertical direction.

FIG. 20 is a schematic top view of a socket according to a modified example. FIG. 21 is a schematic cross-sectional view of the socket taken along the dashed line in FIG. 20. As can be seen from FIGS. 20 and 21, the protrusion length of the protrusion 4c is set such that the operation member 3 collides with the protrusion 4c when the operation member 3 is raised. In the process of the operating member 3 rising, the operating member 3 collides with the protrusion 4c of the pivoting member 4 and pushes it upward, and in response, the pivoting member 4 pivots inward of the socket. As a result, it becomes more reliable that the pressing member 5 descends and reaches the contact position.

Various modifications to the embodiments and features may be made by those skilled in the art in light of the above teachings. The method of assembling the socket 1 can be understood by those skilled in the art by referring to the drawings of the present application, and detailed description thereof will be omitted.

1: Socket 2: Base 3: Operating member 4: Pivoting member 4a: Lower end portion 4b: Upper end portion 4c: Projecting portion 5: Pressing member 7: Latch 8: Inspection board 9: IC chip

21: Mounting part 21a: Mounting surface 22: Base wall 23: Opening

33: Hollow cylinder 34: Notch 35: Opening

41: Pivoting member 42: Pivoting member

51: Main body 52: Heat dissipation member 53: Heat dissipation fin 54: Connection plate

56: Upper slot 57: Lower slot

61: Upper link 62: Lower link 63: Upper link 64: Lower link

71 : Pressing part 72 : Forced part

91: Heat generating area 92: Heat generating area 93: Heat generating area

99: Contact member

Claims (20)

a base on which an IC chip is mounted on a mounting portion and supports a plurality of contact members electrically connected to the IC chip;
an operating member provided to be movable up and down with respect to the base and shaped to allow introduction of the IC chip into the mounting section;
a pivoting member that pivots relative to the base in conjunction with the vertical movement of the operating member;
interlocking with the pivoting of the pivoting member, between a contact position where the IC chip contacts the top surface of the IC chip mounted on the mounting section and a retracted position where the contact position is diagonally upward and away from the contact position toward the outside of the socket. A socket that includes a pressing member that moves while maintaining a constant posture. The socket according to claim 1, wherein the pressing member is located above the pivoting member when in the retracted position. The socket according to claim 1, wherein the pressing member is disposed entirely within the outer shape of the socket when in the retracted position. The socket according to claim 1, wherein the fixed orientation is a substantially horizontal orientation. 2. The socket according to claim 1, wherein the pressing member includes a metal heat radiating member, and when in the contact position, the lower surface of the heat radiating member contacts the upper surface of the IC chip. The socket according to claim 1, wherein the pressing member includes a contact member capable of contacting the upper surface of the IC chip, and the contact member is elastically displaceable in the vertical direction. at least one upper link connecting the upper end of the pressing member to the operating member; and at least one lower link connecting the lower end of the pressing member to the operating member and provided parallel to the upper link. The socket according to any one of claims 1 to 6, further comprising: a parallel link configured by the pressing member, the operating member, the upper link, and the lower link. The socket according to claim 7, wherein a bottom dead center of the pressing member is defined based on interference between the lower link and the base. The socket according to claim 7, wherein the lower link has a pair with the pivot member at a position between a pair of the lower link and the pressing member and a pair of the lower link and the operating member. The pivot member has a lower end rotatably supported by the base, an upper end rotatably connected to the lower link, and a protrusion projecting outward from the socket between the lower end and the upper end. The socket according to claim 7, having: The socket according to claim 10, wherein the protrusion length of the protrusion is set such that the pivoting member collides with the protrusion when the operating member is raised. The socket according to claim 7, wherein the posture of the pressing member at the top dead center is maintained based on interference between the upper link and the pressing member. The at least one upper link includes a pair of upper links provided to sandwich the pressing member or a part thereof in the width direction of the socket,
The socket according to claim 7, wherein the at least one lower link includes a pair of lower links provided to sandwich the pressing member or a portion thereof in the width direction of the socket. An upper shaft passing through the pressing member or a part thereof is spanned between the pair of upper links,
The socket according to claim 13, wherein a lower shaft passing through the pressing member or a portion thereof is bridged between the pair of lower links. The heat radiating member is mounted in the pressing member so as to be elastically displaceable in the vertical direction,
The socket of claim 14, wherein the heat dissipation member includes an upper slot extending in the vertical direction into which the upper shaft is inserted, and a lower slot extending in the vertical direction into which the lower shaft is inserted. The pressing member is urged toward a guide included in the base by an elastic member at a free end of the pivoting member, and the posture of the pressing member is maintained constant based on contact between the pressing member and the guide. 7. A socket according to any one of claims 1 to 6. The pressing member has a guide protrusion that is swingably attached to the free end of the pivoting member and that engages with a guide groove provided in the base, and the guide groove is configured to support the pressing member. 7. A socket according to any one of claims 1 to 6, wherein the socket is arcuately shaped for the fixed position of the socket. The socket according to any one of claims 1 to 6, wherein a bottom dead center of the pressing member is defined based on interference between the pressing member and the base. a base on which an IC chip is mounted on a mounting portion and supports a plurality of contact members electrically connected to the IC chip;
an operating member provided to be movable up and down with respect to the base and shaped to allow introduction of the IC chip into the mounting section;
Each moves while maintaining a constant posture between a first position and a second position diagonally upwardly away from the first position toward the outside of the socket in conjunction with the vertical movement of the operating member, and comprising first and second pressing members that contact the top surface of the IC chip mounted on the mounting section at a first position;
Each of the first and second pressing members includes a heat radiating member in which heat radiating fins are arranged at predetermined intervals,
When the first and second pressing members are in the first position, the radiating fins of the first pressing member and the radiating fin portions of the second pressing member are alternately arranged in a side view of the socket. . A method for electrically connecting an IC chip to a socket, the method comprising:
The first step is to lower the operating member of the socket, which is provided to be vertically movable with respect to the base of the socket, against the upward bias of the elastic member, and in conjunction with the lowering of the operating member, the socket is directed outward. a pivoting member, and a pressing member moving to an upper position diagonally upwardly away from a lower position in response to the pivoting of the pivoting member, while maintaining a constant posture. process and
After the first step, the method includes a second step of mounting an IC chip on a mounting portion of the base through an opening formed in the operating member.