TW202410585A - Socket and IC chip electrical connection method to the socket - Google Patents

Abstract

There is a technical problem of minimizing the size of the socket for high-density mounting of the socket on the substrate and suppressing or avoiding damage to the IC chip caused by contact with the pressing member. The socket 1 includes: a base 2, the IC chip 9 is mounted on the mounting part 21, and supports a plurality of contact members 99 electrically connected to the IC chip 9; the operating member 3 is arranged to move up and down relative to the base 2, The shape is set to allow the IC chip 9 to be introduced into the mounting part 21; the pivot member 4 is linked to the up and down movement of the operating member 3 to pivot relative to the base 2; and the pressing member 5 is connected to the pivot member 4. In conjunction with the pivoting, the IC chip 9 moves in a constant posture between a contact position contacting the upper surface of the IC chip 9 mounted on the mounting portion 21 and a retreat position diagonally upward away from the contact position toward the outside of the socket.

Description

Socket, and method for electrically connecting IC chip to socket

The present invention relates to a socket, and more particularly to a socket for inspecting an IC chip.

In addition to the electrical connection between the IC chip and the socket, sockets used for IC chip inspection are also required to miniaturize the socket itself. For example, Patent Document 1 discloses an IC socket provided with a support member that disposes the pivot axis of the pressure pad at a proximal position when the pressure pad is disposed in a pressing position. When releasing the position, arrange the pivot axis of the pressure pad in the far position.

In addition, there are also issues such as lateral deflection of the IC chip or damage to the IC chip (for example, scratches on the surface of the IC chip) caused by the physical contact between the IC chip and the socket when the IC chip is pressed down. For example, Patent Document 2 discloses an IC test sorting machine (IC Test Handler) equipped with a clamping device that suppresses the lateral deflection of the IC during the IC clamping process, even for narrow terminal pitches. ICs with back terminals can also prevent poor terminal contact from occurring. The IC pressing part moves by the parallel linkage mechanism in such a way that it always draws an arc trajectory with the same posture. When in contact with the IC, the force going diagonally downward does not act on the IC, and the lateral deflection of the IC is suppressed.

Patent document 3 discloses a socket that uses a latch plate to protect the top surface of a semiconductor device from contact damage. The latch plate prevents the front end of the latch member from directly contacting the BGA, and the BGA is pressed down in the vertical direction. [Prior art document] [Patent document]

[Patent Document 1] Japanese Patent Publication No. 2004-325393 [Patent Document 2] Japanese Patent Publication No. 2004-184173 [Patent Document 3] Japanese Patent Publication No. 2009-140629

[Problems to be solved]

There is a technical problem of minimizing the size of the socket for high-density mounting of the socket on the substrate and suppressing or avoiding damage to the IC chip caused by contact with the pressing member. [Means used to solve problems]

One aspect of the socket disclosed herein includes: a base, an IC chip is mounted on a mounting portion, and supports a plurality of contact members electrically connected to the IC chip; an operating member, which is arranged to be movable up and down relative to the base and is shaped in a manner to allow the IC chip to be introduced into the mounting portion; a pivoting member, which is linked to the up and down movement of the operating member and pivots relative to the base; and a pressing member, which is linked to the pivoting of the pivoting member and moves while maintaining a certain posture between a contact position that contacts the top of the IC chip mounted on the mounting portion and a retreat position that moves away from the contact position toward the outside of the socket and obliquely upward.

In some embodiments, the pressing member is located above the pivot member when in the retracted position.

In some embodiments, the pressing member is entirely disposed within the outer shape of the socket when in the retracted position.

In some implementations, a certain posture is a generally horizontal posture.

In some embodiments, the pressing member includes a metal heat dissipation member, and when located at the contact position, the lower surface of the heat dissipation member contacts the upper surface of the IC chip. On the pressing member, the heat dissipation member may be installed to be elastically displaceable in the up and down direction.

In some embodiments, the pressing member includes a contact member that can contact the upper surface of the IC chip, and the contact member is elastically displaceable in the up and down direction.

In some embodiments, it is further provided with: at least one upper link connecting the upper end of the pressing member to the operating member; and at least one lower link connecting the lower end of the pressing member to the operating member, and is configured to be connected to the operating member. The upper connecting rod is parallel; the pressing member, the operating member, the upper connecting rod, and the lower connecting rod constitute a parallel connecting rod. The lower link may have a moving pair with the pivot member at a position between the moving pair of the lower link and the pressing member and the moving pair of the lower link and the operating member. The pivot member may have a lower end rotatably supported by the base, an upper end rotatably connected to the lower link, and a protruding portion that moves between the lower end and the upper end in order to receive force from the operating member. The socket protrudes from the outside. The upper dead center of the pressing member can be specified based on the interference between the upper link and the pressing member. The lower dead center of the pressing member can be specified based on the interference between the lower link and the base.

In some embodiments, the pressing member is urged by the elastic member at the free end of the pivoting member toward the guide part included in the base. Based on the contact between the pressing member and the guide part, the posture of the pressing member is maintained at a certain level. .

In some embodiments, the pressing member has a guide protrusion that is swingably mounted on the free end of the pivot member and engages with a guide groove provided on the base, and the guide groove is formed in an arc shape for a certain posture of the pressing member. The lower dead point of the pressing member can be determined based on the interference between the pressing member and the base.

Another aspect of the present disclosure provides an electrical connection method for an IC chip to a socket, including: a first step of causing the operating member of the socket that is configured to move up and down relative to the base of the socket to resist the upward urging of the elastic member. Descend, and include the step of pivoting the pivoting member toward the outside of the socket in conjunction with the descending of the operating member, and the upper position of the pressing member maintaining a certain posture in response to the pivoting of the pivoting member from the lower position to the diagonally upward position. The step of moving; and the second step is to mount the IC chip on the mounting part of the base through the opening formed in the operating member after the first step.

Another aspect of the socket disclosed herein comprises: a base, an IC chip is mounted on the mounting portion, and supports a plurality of contact members electrically connected to the IC chip; an operating member, which is arranged to be movable up and down relative to the base and is shaped in a manner to allow the IC chip to be introduced into the mounting portion; and first and second pressing members, which are respectively linked to the up and down movement of the operating member and move between a first position and a second position which moves away from the first position toward the outside of the socket and obliquely upward while maintaining a certain posture, and contact the top of the IC chip mounted on the mounting portion at the first position; the first and second pressing members, respectively, are heat dissipation members including heat dissipation blades arranged at predetermined intervals, and when the first and second pressing members are located at the first position, the heat dissipation blades of the first pressing member and the heat dissipation blades of the second pressing member are arranged differently from each other when viewed from the side of the socket. [Effect of invention]

According to one aspect of the present disclosure, a socket is facilitated to be made small in size and damage to the IC chip caused by contact with a pressing member is suppressed or avoided.

Hereinafter, various embodiments and features of the present disclosure will be described with reference to the drawings. A person having ordinary knowledge in the relevant technical field can combine the various embodiments and/or features without excessive explanation, and can also understand the synergistic effect produced by such combination. In principle, repeated explanations between embodiments are omitted. The reference drawings are simplified for the convenience of drawing with the main purpose of describing the invention. Each feature is not only effective for the socket and the method of electrically connecting it to the IC chip disclosed in this specification, but can be understood as a general feature that is also common to various other sockets and the method of electrically connecting them to the IC chip that are not disclosed in this specification.

As shown in FIG. 1 , the sockets 1 are two-dimensionally mounted on the upper surface of the inspection substrate 8 at a high density. The IC chip is mounted on the socket 1 and connected to the inspection device via the wiring of the inspection substrate 8 . By supplying input signals such as clock signals and test signals (via the inspection substrate 8 and the socket 1) to the IC chip and obtaining output signals from the IC chip (via the inspection substrate 8 and the socket 1), the IC chip can be inspected (eg. , determine whether the output signal pattern is consistent with the correct signal pattern). A good electrical connection between the socket 1 and the IC chip mounted therein is a prerequisite for the correct identification of good and bad IC chips. In addition, the inspection substrate 8 has an upper surface parallel to the plane defined by the X-axis and the Y-axis and perpendicularly intersecting the Z-axis, and includes wiring (surface wiring) for electrically connecting the socket 1 and an external inspection device. and/or internal wiring).

In FIG. 1 , the sockets 1 are arranged at a predetermined pitch P1 in the X-axis direction and at a predetermined pitch P2 in the Y-axis direction, and the predetermined pitch P1 is equal to the predetermined pitch P2. In addition, each socket 1 has a first width parallel to the X-axis and a second width parallel to the Y-axis, and the first width is equal to the second width. In the case where the first width and the second width of the socket 1 are different, the predetermined pitch P1 and the predetermined pitch P2 can also be different. As can be understood from the description to be described later, the socket 1 is suitable for high-density configuration on the inspection substrate 8. More specifically, when the socket 1 is viewed from above, the pressing member to be described later does not appear from the outer shape of the socket 1. In addition, although the outer shape of the socket 1 is determined according to the outer shape of the operating member to be described later when the socket 1 is viewed from above, it is not limited to this.

In this specification, "outside of the socket" refers to the direction from the inner side of the socket 1 to the outer side of the socket 1 when the socket 1 is viewed from above, as shown in the arrow D1 of FIG. 1, and is typically perpendicular to one side of the (e.g., rectangular) outer shape of the socket 1. "Inside of the socket" refers to the direction from the outer side of the socket 1 to the inner side of the socket 1 when the socket 1 is viewed from above, as shown in the arrow D2 of FIG. 1, and is typically perpendicular to one side of the (e.g., rectangular) outer shape of the socket 1.

FIG. 2 is a schematic perspective view of the socket 1 in a closed state. FIG. 3 is a schematic perspective view of the socket 1 in an open state. FIG. 4 is a schematic side view of the socket 1 in a closed state. FIG. 5 is a schematic side view of the socket 1 in an open state. FIG. 6 is a schematic top view of the socket 1 in a closed state. FIG. 7 is a schematic top view of the socket 1 in an open state. FIG. 8 is a schematic cross-sectional view of the socket 1 in a closed state along the two-point chain line CX1 in FIG. 6 . FIG. 9 is a schematic cross-sectional view of the socket 1 in the open state along the two-point chain line CX1 in FIG. 7 .

The socket 1 includes a base 2, an operating member 3, a pivot member 4, and a pressing member 5. The base 2 is constructed of one or more resin parts, and is typically an assembly of a plurality of resin parts. Similarly, the operating member 3 is constructed of one or more resin parts and is configured to be movable up and down relative to the base 2. When the operating member 3 is pressed, the socket 1 is deformed and presents an open state shown in FIG. 3. In the open state, an IC chip 9 can be mounted on the socket 1, and the IC chip 9 can be taken out from the socket 1. In addition, the transport of the IC chip 9 can be implemented using a suction device or the like. By mounting the IC chip 9 on the socket 1 when the socket 1 is in the open state and then making the socket 1 into the closed state, the socket 1 is electrically connected to the IC chip 9.

The base 2 has a mounting portion 21 for mounting the IC chip 9, and a base wall 22 disposed around the mounting portion 21, supporting a plurality of contact members 99 (see FIG. 10 in addition to FIG. 8 and FIG. 9) electrically connected to the IC chip 9 (for example, the lead terminals of the IC chip 9 and/or the bumps formed on the bottom of the IC chip 9). The mounting portion 21 has a mounting surface 21a for mounting the IC chip 9. The mounting surface 21a is typically a flat surface orthogonal to the Z axis, and may also be formed as a through hole or slit of the contact member 99, or a concave portion corresponding to the bump on the bottom of the IC chip 9.

The base wall 22 of the base 2 extends upward from the mounting surface 21a (or a plane including the mounting surface 21a) of the mounting portion 21, thereby determining (at least partially) the arrangement space of the IC chip 9 on the mounting surface 21a. The inner wall surface of the base wall 22 can function as a guide surface for guiding the movement of the IC chip 9 that is transported to the mounting surface 21a by a transport device such as a suction chuck. In addition, the base wall 22 is partially or partially provided on the entire circumference of the mounting surface 21a to avoid interference with the pivot member 4 described later. In the illustrated example, the base wall 22 has four wall portions corresponding to the four sides of the mounting surface 21a that determine the rectangular shape, and notches or openings 23 are formed in the wall portions that are opposite in the Y-axis direction. The notch or opening 23 has the same meaning as a space where the base wall 22 is not formed. The notch or opening 23 allows the pivot member 4 to pivot at a larger pivot angle.

Each contact member 99 can be an assembly of a pair of pin members. Preferably, the spacing between a pair of pin members (especially their upper ends) changes in conjunction with the up and down movement of the operating member 3, thereby maintaining the bump of the IC chip 9 between the pin members. When the operating member 3 is at the initial position (top dead center), the spacing between the upper end of the pin member on one side and the upper end of the pin member on the other side becomes the smallest. In response to the descent of the operating member 3, the spacing between the upper ends of the pin members increases. When the operating member 3 is at the lowest position (bottom dead center), the spacing between the upper ends of the pin members becomes the largest. By opening and closing the contact member 99 as described above, the collision between the contact member 99 and the bump on the bottom of the IC chip 9 when the IC chip 9 is mounted is avoided. In addition, the opening and closing adjustment of the pin member linked to the up and down movement of the operating member 3 can be realized by using a member that moves in the horizontal direction corresponding to the up and down movement of the operating member 3. Other contact members can also be used. For example, a contact member that is not for contacting the bump of the IC chip 9 but for contacting the wire terminal arranged on its periphery can also be used.

The number and arrangement of the contact members 99 supported by the base 2 can be changed in various ways according to the number and position of the bumps of the IC chip 9 (or the number and position of the lead terminals). Typically, the contact members 99 are arranged along the edge defining the outer periphery of the mounting portion 21 (or the edge of the IC chip 9 mounted on the mounting portion 21) (for example, in a straight line) in a plan view. Other arrangements of the contact members may also be adopted.

The operating member 3 is provided to be movable up and down relative to the base 2, and is preferably engaged with the base 2 so as to be slidable in the up and down direction (moveable in a straight line). For example, a guide protrusion extending in the up and down direction is provided on one side of the base 2 and the operating member 3, and a groove for the guide protrusion to fit into is formed on the other side. By their engagement, the operating member 3 can face each other. Move up and down steadily on the base 2. Furthermore, the operating member 3 is shaped to allow the IC chip 9 to be introduced into the mounting portion 21 . Typically, the operating member 3 is a frame-shaped or cylindrical member having an opening 35 that allows the IC chip 9 to be introduced, and has a hollow cylinder 33 surrounding the base 2 on a plane orthogonal to the up-down direction, and is at least partially formed by the hollow The opening 35 is defined by the tube 33.

In the illustrated example, the hollow cylinder 33 includes four wall portions arranged on the outer periphery of the four wall portions of the base wall 22 of the base 2 mentioned above. Like the base wall 22 of the base 2, the hollow cylinder 33 has a notch 34 in each wall portion opposite in the Y-axis direction. The notch 34 can be formed to allow the lower connecting rod 62 described later to pivot. The notch or opening 23 of the base 2 and the notch 34 of the hollow cylinder 33 are adjacent to each other in the inside and outside direction of the socket, are positioned, and are spatially connected, so that the IC chip 9 in the socket 1 or the heat dissipation component 52 described later can be cooled (heat dissipated) by air supply. In addition, the hollow cylinder 33 has a protrusion 36 extending upward and protruding into the notch 34, and the lower connecting rod 62 described later is arranged on both sides of it.

In this embodiment, the socket 1 further includes a pivot member 4 and a pressing member 5. The pivot member 4 pivots relative to the base 2 in conjunction with the up-and-down movement of the operating member 3. The pressing member 5 pivots in conjunction with the pivot of the pivot member 4 and moves between a contact position (see FIG. 8 ) where the pressing member contacts the top of the IC chip 9 mounted on the mounting portion 21 and a retreat position (see FIG. 9 ) where the pressing member moves away from the contact position toward the outside of the socket and obliquely upward. According to the above-mentioned embodiment, the socket 1 is made small in size and damage to the IC chip 9 when the pressing member 5 contacts the pressing member 5 is suppressed or avoided. In addition, the movement of the pressing member 5 from the contact position toward the retreat position obliquely upward can be understood based on the pressing member 5 placed at the contact position, and can also be understood in comparison with the mounting surface 21a mounted on the socket 1 or the IC chip 9 mounted on the mounting surface 21a.

The pivot member 4 is pivotally supported by the base 2 and pivots in conjunction with the up and down movement of the operating member 3 . The pivot member 4 is used to obtain a force along the horizontal direction (orthogonal to the up-down direction) from the operating member 3 (in other words, the displacement of a part of it (for example, the upper end 4b) along the horizontal direction). And pivot. In more detail, the pivot member 4 pivots toward the outside of the socket when the operating member 3 descends, and pivots toward the inside of the socket when the operating member 3 ascends. For this purpose, a spring (not shown) can be used to urge the pivoting member 4 toward the outside of the socket. In addition, the pivot axis of the pivot member 4 is located at a predetermined position of the base 2 (unlike the models in Figures 15 to 18 described later, it does not move in the up and down direction).

The pivot member 4 can be shaped in various ways, but it is preferably shaped by bending at least at one place. In the illustrated example (see FIG. 9 ), the pivot member 4 has: a lower end portion 4a supported by the base 2 so as to be rotatable, an upper end portion 4b rotatably connected to the lower connecting rod 62 described later and provided in a closed state to receive force from the spring of the operating member, and a protrusion 4c protruding outward from the socket between the lower end portion 4a and the upper end portion 4b to receive force from the operating member 3. The pivot member 4 is bent at one place between the lower end portion 4a and the upper end portion 4b, and a protrusion 4c is formed on the outer corner side of the bent portion. The protrusion 4c is formed as a convex portion including a pair of gently inclined surfaces. The upper end 4b can move between a position outside the socket (see FIG. 9 ) and a position inside the socket (see FIG. 8 ) relative to the pivot axis of the lower end 4a. The protrusion 4c is provided to prevent the pivot member 4 from pivoting when the pressing member 5 is in the contact position by the interference between the protrusion 4c and the operating member 3 (inner wall surface). This is because the pivot member 4 may pivot accidentally in response to the balance of the force applied to the operating member 3 or the pressing member 5.

Although not necessarily, in order to make the pressing member 5 move between the contact position and the retreat position in a certain posture, the pressing member 5 itself can be used as a connecting rod (one of the four connecting rods) constituting the parallel connecting rod. In this case, the socket 1 can further include: at least one (preferably a pair) upper connecting rod 61 connecting the upper end 4b of the pressing member 5 to the operating member 3, and at least one (preferably a pair) lower connecting rod 62 connecting the lower end 4a of the pressing member 5 to the operating member 3 and arranged parallel to the upper connecting rod 61. The parallel connecting rod is constituted by the pressing member 5, the operating member 3, the upper connecting rod 61, and the lower connecting rod 62. By supporting the parallel link with the pivot member 4, the pressing member 5 can be moved between the contact position and the retreat position in conjunction with the up and down movement of the operating member 3. In addition, the lower link 62 can have a motion pair with the pivot member 4 at a position between the motion pair of the lower link 62 and the pressing member 5 and the motion pair of the lower link 62 and the operating member 3.

The pressing member 5 extends in the vertical direction parallel to the wall of the hollow cylinder 33 of the operating member 3. The pressing member 5 and the upper connecting rod 61 and the moving pair (the second moving pair J2) are arranged above the pressing member 5 and the lower connecting rod 62 and the moving pair (the first moving pair J1), and the above moving pairs are arranged on the same vertical line (see FIG8). The upper connecting rod 61 and the moving pair (the fourth moving pair J4) of the operating member 3 are arranged above the lower connecting rod 62 and the moving pair (the third moving pair J3), and the above moving pairs are arranged on the same vertical line. The vertical distance between the first moving pair J1 and the second moving pair J2 is equal to the vertical distance between the third moving pair J3 and the fourth moving pair J4. The distance between the first motion pair J1 and the third motion pair J3 is equal to the distance between the second motion pair J2 and the fourth motion pair J4. Typically, the distance between the first motion pair J1 and the third motion pair J3 is longer than the vertical distance between the first motion pair J1 and the second motion pair J2. In addition, the shaft provided in the third motion pair J3 passes through the protrusion 36 of the operating member 3 and extends along the X axis.

When the operating member 3 begins to descend against the elastic force of the spring used for the operating member 3, the lower link 62 begins to pivot toward the outside of the socket relative to its pivot axis in the operating member 3 (in addition, it can also be called the lower link 62 ). The lever 62 pivots toward the outside of the socket around the pivot axis (connection axis S3) of the upper end 4b of the pivot member 4). At the same time as the lower link 62 starts to pivot, the upper link 61 also starts to pivot toward the outside of the socket relative to its pivot axis. Similarly, the pressing member 5 starts to move from the contact position toward the retreat position. When the operating member 3 drops to a position that allows the pivoting member 4 to pivot toward the outside of the socket (near the protruding portion 4c or below the protruding portion 4c), the pivoting member 4 starts to pivot toward the outside of the socket.

The above-mentioned pivoting of the upper link 61 , the lower link 62 , and the pivot member 4 continues. As shown in FIG. 9 , the pressing member 5 moves to a retreat position diagonally away from the IC chip 9 , whereby the IC chip The introduction and removal of 9 to the socket 1 can be performed without being hindered by the pressing member 5 . The pressing member 5, when in the retracted position, can be located above the pivoting member 4, and/or offset from the pivot axis of the pivoting member 4 to the outside of the socket (refer to the offset shown by arrow D3 in Figure 9 shift amount). Thereby, a sufficient opening width for mounting or removing the IC chip 9 can be ensured in the open state of the socket 1 .

When the pressing member 5 is in the retracted position, its entirety can be accommodated within the outer shape of the socket 1 . Thereby, the size of the socket 1 in the open state can be maintained small. The outer shape of the socket 1 can be determined by the outer shape of the operating member 3 when the socket 1 is viewed from above. If the pressing member 5 moves excessively toward the outside of the socket, the size of the socket 1 in the open state will become larger, making high-density mounting of the sockets 1 on the inspection substrate 8 difficult (that is, larger pitches must be used) Configure socket 1).

When the pressing member 5 is in the retreat position, the upper connecting rod 61 and the lower connecting rod 62 are also located above and immediately adjacent to the operating member 3 (e.g., the wall of the hollow cylinder 33) and/or can be accommodated in the outer shape of the socket 1 (when viewed from above) as the pressing member 5. Similarly, when the pressing member 5 is in the retreat position, a portion of the pivot member 4 (e.g., the upper end portion 4b and the protruding portion 4c) is also located above and immediately adjacent to the operating member 3 (e.g., the wall of the hollow cylinder 33) and/or can be accommodated in the outer shape of the socket 1 (when viewed from above).

When the pressing member 5 is in the retracted position for stable movement of the parallel links, it is better for the upper link 61 and the lower link 62 to be slightly tilted toward the inside of the socket relative to the up and down direction. For this purpose, it can be (for example, on the base) 2) Provide a protrusion that limits the angle of the upper link 61 or the lower link 62 (relative to the up-down direction).

As an option, the pressing member 5 can be used to dissipate heat from the IC chip 9. The pressing member 5, in some cases, includes a body 51 and a heat dissipation member 52 made of metal. When the pressing member 5 is in the contact position, the heat dissipation member 52 directly contacts the IC chip 9 to promote heat dissipation. In addition, when the pressing member 5 is in the contact position, the socket 1 (in short, the base 2 and the operating member 3) is shaped in a manner that the heat dissipation member 52 can be observed from the side (for example, as shown in FIG. 4, a notch or opening 23 and a notch 34 are formed). In this way, the heat dissipation member 52 can be effectively cooled by air supply.

The heat dissipation member 52 may be shaped in various ways, but preferably includes: a plurality of heat dissipation blades 53 extending in the vertical direction, and a connecting plate 54 connecting the plurality of heat dissipation blades 53 (preferably at their lower ends). The heat dissipation blades 53 may be arranged in parallel with each other at a predetermined interval. A ventilation path is provided between the heat dissipation blades 53 adjacent to each other in the arrangement direction of the heat dissipation blades 53. At least when the pressing member 5 is in the contact position, the connecting plate 54 may be provided in a manner facing the mounting surface 21a of the mounting portion 21 of the base 2 in parallel. When the pressing member 5 is in the contact position, the pressing member 5 contacts the upper surface of the IC chip 9 with the lower surface of the heat dissipation member 52 (e.g., the connecting plate 54). Thereby, the heat generated in the IC chip 9 during the inspection of the IC chip 9 can be dissipated efficiently.

In some cases, when the two pressing members 5 arranged as a pair of opposites in the socket 1 are both in the contact position (the first position), when observing the socket 1 from the side, the heat dissipation blades 53 of one pressing member 5 and The heat dissipation blades 53 of the other pressing member 5 are arranged in a staggered manner. In other words, with respect to the arrangement of the heat dissipation fins 53 of one pressing member 5 , the arrangement of the heat dissipation fins 53 of the other pressing member 5 is set to a position offset in the lateral direction. This promotes cooling of the heat dissipation blades 53 by the air supply. In addition, the offset of the arrangement of the heat dissipation blades 53 can be observed through the ventilation opening of the operating member 3 (for example, the above-mentioned notch 34).

The heat dissipation member 52 is usually harder than the main body 51 due to the material difference between metal and resin, so it is easy to have scratches on the IC chip 9 . As long as the heat dissipation member 52 is installed on the pressing member 5 so as to be elastically displaceable in the up and down direction, damage to the IC chip 9 during contact can be more reliably or sufficiently avoided. For example, the pressing member 5 further includes a spring (not shown) that urges the heat dissipation member 52 downward relative to the body 51 . When the pressing member 5 descends and the heat dissipation member 52 contacts the IC chip 9, the heat dissipation member 52 can resist the urging force of the spring and move upward, and the force exerted on the IC chip 9 is reduced. In addition, the member that is elastically displaceable in the up and down direction is not limited to the heat dissipation member 52. It may also be replaced by other members (for convenience of description, it is called a contact member) under the premise of contacting the upper surface of the IC chip 9.

As shown in the above-referenced drawings, regarding the two X and Y axis directions of the socket 1 when viewed from above, the width of the socket 1 can be made longer in one direction (for example, the X axis direction). Thereby, the contact area between the pressing member 5 (for example, the heat dissipation member 52 ) and the IC chip 9 increases. This facilitates pressing the IC chip 9 with more equal force and/or dissipating heat more evenly.

In order to support the horizontally long pressing member 5 more stably, an additional parallel link may be used in the above-mentioned parallel link. Briefly, the socket 1 may include: a pair of upper links 61 and 63 provided in the width direction of the socket 1 (for example, the X-axis direction) to sandwich the pressing member 5 or a part thereof; A pair of lower links 62 and 64 are provided in the width direction (for example, the X-axis direction) so as to sandwich the pressing member 5 or a part thereof. That is, at one end of the pressing member 5 in the X-axis direction, the upper end of the pressing member 5 is (rotatably) axially connected to the upper link 61 , and the lower end of the pressing member 5 is (rotatably) axially connected to the lower link 62 . At the other end of the pressing member 5 in the X-axis direction, the upper end of the pressing member 5 is (rotatably) axially connected to the upper link 63 , and the lower end of the pressing member 5 is (rotatably) axially connected to the lower link 64 . As shown in the figure, it is preferable to position the lower link 62 closer to the center of the socket 1 in the width direction than the upper link 61 , and to position the lower link 64 closer to the center of the socket 1 than the upper link 63 . Center in the width direction, whereby a larger notch 34 can be formed in the operating member 3 .

The socket 1 may include a pair of pivot members 41 and 42 in order to individually support the pair of parallel links. Although a common connection shaft S3 can be used for the movement pair of the pivot member 41 and the lower link 62 and the movement pair of the pivot member 42 and the lower link 64, this is not necessary. The pivot member 41 can be positioned closer to the center of the socket 1 in the width direction than the lower link 62 in order to reduce the size of the socket 1 . Likewise, the pivot member 42 may be positioned closer to the widthwise center of the socket 1 than the lower link 64 .

An upper shaft S1 through which the pressing member 5 or a part thereof passes may be installed between the upper connecting rod 61 and the upper connecting rod 63. The upper shaft S1 is rotatable relative to the pressing member 5 (for example, its body 51). Similarly, a lower shaft S2 through which the pressing member 5 or a part thereof passes may be installed between the lower connecting rod 62 and the lower connecting rod 64. The lower shaft S2 is rotatable relative to the pressing member 5 (for example, its body 51). In the above manner, the pressing member 5 can be moved in a more stable posture. In addition, the upper shaft S1 and the lower shaft S2 extend along the X-axis in the same manner as the connecting shaft S3.

An upper groove 56 extending in the vertical direction into which the upper shaft S1 is inserted, and a lower groove 57 extending in the vertical direction into which the lower shaft S2 is inserted are formed on the heat dissipation member 52 (for example, each heat dissipation fin 53 extending in the vertical direction). As mentioned above, in the pressing member 5, the heat dissipation member 52 can be elastically displaced in the up and down direction, thereby promoting the downward force to act from the pressing member 5 to the IC chip 9 with optimal intensity. Typically, the upper groove 56 and the lower groove 57 are opened in an elliptical shape that is long in the up-down direction, but other opening shapes may also be adopted.

Although shafts (see the dotted lines in FIG. 2 ) may be used for the kinematic pairing of the operating member 3 and the upper connecting rod 61 , the lower connecting rod 62 , the upper connecting rod 63 , and the lower connecting rod 64 , other methods may also be used. Although shafts (see the shaft S9 in FIG. 8 ) may be used for the kinematic pairing of the base 2 and the pivot member 4 , other methods may also be used. As other methods, rotatable fitting of the convex and concave parts, bearings, etc. may be considered.

The socket 1 can be configured to be line symmetrical with respect to the center plane PL (see FIG. 2 ) of the socket 1 . Thus, one socket 1 can have two pressing members 5 corresponding to the two opposite sides of the rectangular outer shape of the socket 1 . Each pressing member 5 can be moved between the contact position and the retreat position in conjunction with the up and down movement of the operating member 3 as described above (see FIG. 10 ). In the case where each pressing member 5 includes a heat dissipation member 52 , the heat dissipation of the IC chip 9 is further promoted. In addition, a configuration in which only one pressing member 5 is provided corresponding to one side of the rectangular outer shape of the socket 1 is also assumed. Similarly, a configuration in which four pressing members 5 are provided corresponding to the four sides of the rectangular outer shape of the socket 1 is also assumed. If the outer shape of the socket 1 is a pentagon or a hexagon, five or six pressing members 5 can also be provided in the same manner as described above.

As described above, the operating member 3 moves up and down to move the pressing member 5 from the contact position to the retracted position in a certain posture along the outside of the socket and obliquely upward (see Figure 10). As a result, the socket 1 moves from the closed state to the open state. change. As shown in FIGS. 10 and 11 , in addition to the pressing member 5 , a latch 7 may be additionally provided to press down the IC chip 9 . As shown in FIG. 11 , the latch portion 7 is pivotally supported by the base 2 and is located between the pivot members 41 and 42 in the illustrated example. In addition, the latch portion 7 has a smaller width in the X-axis direction than the pressing member 5 . The latch 7 is continuously pressed by the spring (around its pivot axis in the base 2) and pivots toward the inside of the socket. The latch portion 7 has, on both sides of its pivot axis, a pressing portion 71 for pressing the IC chip 9 and a urged portion 72 that is biased upward by a spring. When the operating member 3 descends, the pressed portion 72 of the latch portion 7 is pressed down by the operating member 3, and the latch portion 7 pivots toward the outside of the socket against the biasing force of the spring. As described above, the pressing of the IC chip 9 by the latch portion 7 can be released by lowering the operating member 3 in the same manner as the release of the pressing by the pressing member 5 .

As shown in FIG. 12 , if the heat-generating areas 91 and 92 in the IC chip 9 are known in advance, each heat-generating area 91 and the heat-generating area 92 can be used as a target area to selectively contact the heat dissipation member 52 of the pressing member 5 . In addition, the heat-generating areas 91 and 92 are areas that generate heat more than other parts of the IC chip 9 (for example, peripheral areas) when the IC chip 9 operates. FIG. 13 shows an example in which the IC chip 9 is allocated two heat dissipation members 52 to one heat generating area 93 . As mentioned above, the position, size, and shape of the pressing member 5 (or the heat dissipation member 52 ) in the socket 1 can be changed corresponding to the position and range of the heat-generating area 93 in the IC chip 9 .

In response to the rise of the operating member 3, the pressing member 5 descends to reach the bottom dead center. The bottom dead center of the pressing member 5 can be determined based on the interference between the pressing member 5 and the base 2. For this purpose, a first stopped portion 58 can be provided on the pressing member 5 (for example, the body 51) as shown in FIG. 14. When the pressing member 5 is located at the contact position, the first stopped portion 58 contacts the base 2 (for example, the upper surface of the base wall 22), and the stop position (bottom dead center) of the pressing member 5 is determined, thereby optimizing the contact position of the pressing member 5 relative to the IC chip 9. For example, the situation in which the pressing member 5 excessively presses down the IC chip 9 can be avoided. The first restrained portion 58 may be disposed near the second motion pair J2 of the upper connecting rod 61 and the pressing member 5 (for example, adjacent to the inner side of the socket). The first restrained portion 58 may also be disposed on other components such as the heat dissipation member 52, the upper connecting rod 61 or the lower connecting rod 62. In some cases, the lower dead point of the pressing member 5 is defined based on the interference between the lower connecting rod 62 and the base 2. In order to fully restrain the first restrained portion 58 by the base 2, a protrusion protruding toward the inner side of the socket may also be disposed on the base 2 to the extent that the loading and unloading of the IC chip 9 is not hindered.

It is not necessary to use a parallel link to maintain the pressing member 5 in a certain posture. This point is briefly explained with reference to Figures 15 to 18. In Figures 15 and 16, the pressing member 5 is pressed toward the guide plate 110 of the base 2 by the spring 120 at the free end of the pivot member 4, and the posture of the pressing member 5 is maintained constant due to the contact between the pressing member 5 and the guide plate 110. The guide plate 110 is a part of the base 2 and is arranged above and adjacent to the above-mentioned base wall 22. Therefore, as the guide plate 110 is arranged, there is no problem in the installation and removal of the IC chip 9 to the socket 1. More specifically, the guide plate 110 has a guide surface 111 along which the pressing member 5 slides. The guide surface 111 includes a curved surface along the pivoting track of the free end of the pivoting member 4. Of course, a guide other than the guide plate 110 may also be used.

In the situation shown in Figures 17 and 18, the pressing member 5 is swingably installed on the free end of the pivoting member 4, and has a guide for engaging the guide grooves 211, 212 provided on the base 2 The protrusions 511 and 512 and the guide grooves 211 and 212 are formed in an arc shape in order to maintain a certain posture of the pressing member 5 . The guide grooves 211 and 212 are formed on the inner wall surface of the guide plate 110 included in the base 2 . The guide grooves 211 and 212 may be formed in a curved manner along the pivot trajectory of the free end of the pivot member 4 . The guide protrusions 511 and 512 are protrusions protruding toward the outside of the socket. Other structures can also be used.

In the form shown in FIGS. 15 to 18 , the driving shaft of the pivot member 4 moves up and down in conjunction with the operating member 3 . In addition, the pivot member 4 has an engagement protrusion that engages with the guide grooves 211 and 212 provided in the base 2, thereby stabilizing its pivot posture. The pivot member 4 can also be arranged in other ways.

The pressing member 5 rises to the top dead center by the descent of the operating member 3. The posture of the pressing member 5 at the top dead center can be determined based on the interference between the pressing member 5 and the upper connecting rod 61 and the upper connecting rod 63. For example, a second restrained portion 59 can be provided on the pressing member 5 (for example, the body 51) as shown in FIG. 19. When the pressing member 5 is at the retreat position (top dead center), the second restrained portion 59 contacts the upper connecting rod 63 to prevent the pressing member 5 from rotating, and the posture of the pressing member 5 is maintained. The pressing member 5 will not move further to the outside of the socket due to external force, avoiding the stacking of parallel connecting rods generated in this situation. For safety reasons, if the upper connecting rod 61, the upper connecting rod 63 and the lower connecting rod 62, the lower connecting rod 64 are arranged on the same vertical line, there is a risk of abnormal operation of the parallel connecting rods. As mentioned above, it is preferred that when the pressing member 5 is in the retreat position, the upper connecting rod 61 and the lower connecting rod 62 are slightly inclined toward the inside of the socket relative to the up-down direction.

FIG. 20 is a schematic top view of a socket of a modified example. FIG. 21 is a schematic cross-sectional view of the socket along a dotted line in FIG. 20. As can be seen from FIG. 20 and FIG. 21, the protruding length of the protruding portion 4c is set in such a way that the operating member 3 hits the protruding portion 4c when the operating member 3 rises. During the rising process of the operating member 3, the operating member 3 hits the protruding portion 4c of the movable member 4 and pushes upward, and the movable member 4 correspondingly moves inwardly of the socket. As a result, it becomes more certain that the pressing member 5 descends to the contact position.

According to the above teachings, a person skilled in the art can make various changes to various embodiments and features. The assembly method of the socket 1 can be understood by a person skilled in the art by referring to the drawings of the present invention, and the detailed description thereof is omitted.

1: socket 2: base 3: operating member 4: pivot member 4a: lower end 4b: upper end 4c: protrusion 5: pressing member 7: latch 8: inspection substrate 9: IC chip 21: mounting portion 21a: mounting surface 22: base wall 23: notch or opening 33: hollow cylinder 34: notch 35: opening 36: protrusion 41: pivot member 42: pivot member 51: body 52: heat dissipation member 53: heat dissipation blade 54: connecting plate 56: upper groove 57: lower groove 58: first restrained portion 59: second restrained portion 61: upper connecting rod 62: Lower connecting rod 63: Upper connecting rod 64: Lower connecting rod 71: Pressing part 72: Pressed part 91: Heating area 92: Heating area 93: Heating area 99: Contact member 110: Guide plate 111: Guide surface 120: Spring 211: Guide groove 212: Guide groove 511: Guide protrusion 512: Guide protrusion CX1: Two-point chain CX2: Two-point chain D1: Arrow D2: Arrow D3: Arrow J1: First motion pair J2: Second motion pair J3: Third motion pair J4: Fourth motion pair P1: Predetermined pitch P2: Predetermined pitch PL: Center plane S1: Upper shaft S2: Lower shaft S3: Connecting shaft S9: Shaft

[Fig. 1] is a schematic top view of an IC chip inspection substrate in which many sockets are mounted on the substrate at a high density according to one aspect of the present disclosure. [Figure 2] is a schematic perspective view of the socket in a closed state. [Figure 3] is a schematic perspective view of the socket in the open state. [Fig. 4] is a schematic side view of the socket in a closed state. [Fig. 5] is a schematic side view of the socket in the open state. [Fig. 6] is a schematic top view of the socket in a closed state. [Fig. 7] is a schematic top view of the socket in the open state. [Fig. 8] is a schematic cross-sectional view of the socket in the closed state on the two-point chain line CX1 in Fig. 6. [Fig. [Fig. 9] is a schematic cross-sectional view of the socket in the open state along the two-point chain line CX1 in Fig. 7. [Fig. [Fig. 10] is a schematic diagram showing the pressing member in the socket moving obliquely upward toward the outside of the socket from the contact position to the retreat position in a fixed posture. [Fig. 11] is a schematic cross-sectional view of the socket in the open state along the two-point chain line CX2 in Fig. 7. [Fig. [Fig. 12] is a schematic plan view showing that the contact surface of the pressing member overlaps a predetermined area of the IC chip. [FIG. 13] is a schematic top view showing that the contact surface of a predetermined area of the IC chip and the pressing member overlaps in a manner different from that shown in FIG. 12. [FIG. [Fig. 14] is a schematic diagram showing that the stop position of the pressing member can be set by the collision between the pressing member and the base. [Fig. 15] is a schematic cross-sectional view of another socket in a closed state. [Fig. 16] is a schematic cross-sectional view of another socket in an open state. [Fig. 17] is a schematic cross-sectional view of another socket in a closed state. [Fig. 18] is a schematic cross-sectional view of another socket in the open state. [Fig. 19] is a schematic diagram illustrating the setting of the upper dead center of the pressing member by causing interference between the pressing member and the first link. [Fig. 20] is a schematic plan view of a socket according to a modified example. [Fig. 21] is a schematic cross-sectional view of the socket along a dotted chain line in Fig. 20. [Fig.

1: Socket

2: Base

3: Operation components

4: Pivot components

4a: Lower end

4b: Upper end

4c:Protrusion

5: Press components

51:Ontology

52: Heat dissipation components

9: IC chip

21:Mounting part

21a: Mounting surface

62: Lower connecting rod

99: Contact components

D3: Arrow

S1: upper shaft

S2: lower shaft

S3: connecting shaft

Claims (20)

A socket comprises: a base, an IC chip is mounted on a mounting portion, and supports a plurality of contact members electrically connected to the IC chip; an operating member, which is arranged to be movable up and down relative to the base and is shaped in a manner to allow the IC chip to be introduced into the mounting portion; a pivoting member, which is linked to the up and down movement of the operating member and pivots relative to the base; and a pressing member, which is linked to the pivoting of the pivoting member and moves while maintaining a certain posture between a contact position where the IC chip is mounted on the mounting portion and a retreat position that moves away from the contact position toward the outside of the socket and obliquely upward. A socket as described in request item 1, wherein, The pressing member is located above the pivoting member when in the retracted position. As described in claim 1, the socket, wherein the pressing member is entirely disposed within the outer shape of the socket when in the retreat position. The socket as described in claim 1, wherein, the aforementioned certain posture is a substantially horizontal posture. The socket as described in claim 1, wherein the pressing member includes a heat sink member made of metal, and when located at the contact position, the bottom of the heat sink member contacts the top of the IC chip. As described in claim 1, the socket, wherein the pressing member includes a contact member capable of contacting the upper surface of the IC chip, and the contact member is elastically displaceable in the vertical direction. If the socket is described in any one of claim items 1 to 6, its Further possess: At least one upper link connects the upper end of the pressing member to the operating member; and At least one lower link connects the lower end of the pressing member to the operating member and is arranged parallel to the upper link; The pressing member, the operating member, the upper link, and the lower link constitute a parallel link. As described in claim 7, the socket, wherein, based on the interference between the lower connecting rod and the base, the lower dead point of the pressing member is specified. A socket as described in request item 7, wherein, The lower link has a moving pair with the pivot member at a position between a moving pair of the lower link and the pressing member and a moving pair of the lower link and the operating member. A socket as recited in claim 7, wherein the pivot member comprises: a lower end portion rotatably supported by the base; an upper end portion rotatably connected to the lower connecting rod; and a protrusion protruding outward from the socket between the lower end portion and the upper end portion. As described in claim 10, the protruding length of the protruding portion is set in such a way that the pivot member collides with the protruding portion when the operating member rises. A socket as recited in claim 7, wherein, based on the interference between the upper connecting rod and the pressing member, the posture of the pressing member at the top dead center is maintained. A socket as described in request item 7, wherein, The at least one upper link includes a pair of upper links arranged to sandwich the pressing member or a part thereof in the width direction of the socket, The at least one lower link includes a pair of lower links arranged to sandwich the pressing member or a part thereof in the width direction of the socket. A socket as described in request item 13, wherein: An upper shaft penetrating the pressing member or a part thereof is set between the pair of upper links, A lower shaft extending through the pressing member or a part thereof is disposed between the pair of lower links. A socket as described in request item 14, wherein, The heat dissipation member is mounted on the pressing member so as to be elastically displaceable in the up and down direction, The aforementioned heat dissipation components include: The upper groove extends in the upper and lower directions where the aforementioned upper shaft is inserted; and The lower groove extends in the upper and lower direction where the lower shaft is inserted. Such as the socket described in any one of claim items 1 to 6, wherein, The pressing member is urged toward the guide portion included in the base by an elastic member at the free end portion of the pivoting member. Based on the contact between the pressing member and the guide portion, the posture of the pressing member is maintained constant. A socket as recited in any one of claims 1 to 6, wherein the pressing member has a guide protrusion that is movably mounted on the free end of the pivoting member and engages with a guide groove disposed on the base, and the guide groove is formed into an arc shape for the aforementioned certain posture of the pressing member. A socket as described in any one of claim items 1 to 6, wherein, Based on the interference between the pressing member and the base, the lower dead point of the pressing member is specified. A socket that has: A base, the IC chip is mounted on the mounting part, and supports a plurality of contact members electrically connected to the IC chip; The operating member is disposed to be movable up and down relative to the base, and is shaped to allow the IC chip to be introduced into the mounting portion; and The first and second pressing members respectively move in conjunction with the up and down movements of the aforementioned operating member and maintain a certain posture between the first position and the second position diagonally upward away from the aforementioned first position toward the outside of the socket. The aforementioned first position contact is mounted on the aforementioned IC chip in the aforementioned mounting portion; The aforementioned first and second pressing members respectively include heat dissipation members in which heat dissipation fins are arranged at predetermined intervals. When the first and second pressing members are in the first position, when viewed from the side of the socket, the heat dissipation fins before the first pressing member and the heat dissipation fins before the second pressing member are arranged differently from each other. A method for electrically connecting an IC chip to a socket, including: The first step is to lower the operating member of the socket that is movable up and down relative to the base of the socket against the upward urging force of the elastic member, and includes pivoting the pivoting member toward the outside of the socket in conjunction with the lowering of the operating member. The step of moving, and the step of moving the pressing member in a certain posture from a lower position to an upper position diagonally upward in response to the pivoting of the aforementioned pivot member; and The second step is to mount the IC chip on the mounting portion of the base through the opening formed in the operating member after the first step.