JPH0850975A - Mounting device of ball grid array device - Google Patents

Abstract

PURPOSE: To enable a ball grid array device which should be given a burn-in test to be inserted into and taken out from a test socket without damages. CONSTITUTION: A ball grid array device 10 is installed in a burn-in test socket, on the upper surface of the socket a window 23, which accept ball terminals 12 protruding downwards from the ball grid array are formed. Contact fingers 40 are fixed in a socket base 21. The contact fingers penetrate a bend plate 28 and approach into the windows. When the bend plate moves in the lateral direction in relation to the upper surface of the socket, end parts of contact members move and contact with the ball terminals. The end parts of the contact members are arranged to contact with the ball terminals at the position between the centers of the ball terminals and the surface of the ball grid array device, and the device is held within the socket.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to an apparatus for mounting and testing electronic devices. More specifically, the present invention relates to a socket device that holds and electrically connects input / output terminals of a ball grid array device during testing, burn-in, and the like.

[0002]

2. Description of the Related Art With the progress of microelectronics technology,
There is a trend towards developing device chips that can perform more functions in less space. The physical space for this interconnection must be small because the number of electrical interconnections required for circuitry within the chip between the chip and external circuitry to communicate with the outside world increases. To make electrical contact between the chip and external circuitry, the circuit chip is usually housed in a housing or package that supports interconnecting leads, pads, etc. on one or more external surfaces. ing. A high pin count device is attached to the package to shorten the overall length of the lead from the chip to the external circuit and to form an appropriate space between the input / output terminals of the package. It is arranged in a grid pattern on one side of the package. The terminals may be in the form of pins protruding from the package (typically described as a pin grid array or PGA) or in the form of contact pads on the surface of the package. Chip the substrate (s
ubstrate) and drop solder or the like to make an electrical connection between the pads on the surface of the substrate, such as the circuit board on which the package is to be attached, and between similar interconnect pads. , Fixed to each terminal pad of the device package. Solder droplets form spherical protrusions on the terminal pads, so such devices are known as Ball Grid Arrays (abbreviated as BG).
A) It is called a device.

"A ball grid array device (ball gr
The term "id array device)" generally applies to device packages in which the generally spherical contacts project from one side, but the term also applies to other structures. For example,
Bare (uncoated) chips may be provided with a grid array of spherical contacts for mounting in a package. However, at some point during manufacture, bare chips with spherical contacts are often described as ball grid array devices. Similarly, a finished chip may have terminal pads on one surface with spherical interconnects formed on the terminal pads. The chip is then flipped and attached directly to the corresponding pattern of interconnect pads on the substrate. When heated, the spherical solder reflows, forming electrical and physical connections. This process (sometimes referred to as "flip chip" technology) obviously uses so-called ball grid array devices. Thus, in this specification, "ball grid array" and "ball grid array device" are referred to as a plurality of devices arranged in a substantially grid-like pattern on one side, such as device packages, flip chips and bare dies. It means any structure that forms a substantially spherical connection. The ball terminal has a substantially spherical shape and is arranged in a predetermined pattern on one surface of the device package. Since the ball terminals are generally spherical and are substantially uniform in size, the geometric center of each ball terminal is spaced from the surface of the device package. The ball terminal depends from the package, and the geometric center of the ball terminal is substantially in a plane parallel to the surface of the device package on which the ball terminal depends. This plane (or the plane corresponding to each ball terminal) shall be referred to herein as the center, center line or center extension of the ball terminal.

Many electronic devices are manufactured during the manufacturing process.
Alternatively, a burn-in test is performed at some stage after manufacturing.
To perform a burn-in test, the device must be attached to and removed from the test fixture. The fixture electrically connects each of the input / output terminals to test and evaluate the functionality of the device. In many cases, in addition to being subjected to electrical stress, the device is exposed to harsh environmental conditions (eg, heat) in order to evaluate the finished device and confirm its functional integrity. To perform an effective burn-in test, the device is mounted in a fixture that can be inserted and inserted quickly and easily without damaging the device, device package or delicate ball terminals. It must be able to be taken out. However, a feature of the ball grid array device that makes it attractive as a device structure (e.g., very small contacts densely packed on hidden surfaces) is that the features of the ball grid array device can be accommodated in the test socket without damaging the device structure. It is extremely difficult to attach securely.

In conventional test socket construction, the ball grid array is disposed on an interconnect substrate having interconnect pads in the array corresponding to the ball grid array pattern. The ball grid array device is placed on the substrate such that the terminal balls individually contact the interconnect pads on the test substrate. However, the ball grid array device must be maintained in the proper position and orientation for testing, so a lid or cover is used to entrap the device and align the ball grid array with the interconnect pads. To maintain contact. Unfortunately, the trap lid prevents proper circulation of cooling air around the device, thus precluding the use of heat sinks even when the device is designed to operate only in connection with a particular heat sink. Such lids or covers are difficult to operate, can damage the device, and prevent automated loading and unloading of the test socket.

[0006]

SUMMARY OF THE INVENTION The present invention overcomes the disadvantages of the prior art by providing an opening in the top of the mounting housing or socket. No lid or cover is required. Therefore, the top surface of the device is utilized for attachment to the heat sink during testing and is open to cooling air and the like. Furthermore, since the top surface of the socket, ie the mounting housing, is open, the device to be tested can be inserted or removed by an automated process without the risk of damaging the device or the mounting device.

[0007]

SUMMARY OF THE INVENTION The socket or mounting housing of the present invention comprises a support member for receiving an array of interconnect terminal balls depending from a surface of a ball grid array package on an upper surface of the support member. Several windows have been opened. The socket also includes a base member to which a plurality of axially extending contact pins or fingers are secured. One end of each finger penetrates the base to serve as a mounting end and is soldered to a burn-in board or the like. The opposite end of each finger is one of the windows
One is invading. The central portion of each finger (between the free end and the base) passes through a hole in a flex plate mounted between the base and the support member. The bending plate may be fixed or it may be laterally movable with respect to the support member in order to move the free ends of the contact fingers with respect to the window. The end of each free end is bent out of the axis of the finger to form a contact tip at the tip of the free end. The fingers are mounted such that, in the open state, the free ends of the contact fingers are located near one side of each window. When the ball grid array device is placed on the top surface of the support member, the terminal balls project or dangle into the window. In the preferred embodiment, a cam is used to move the flexion plate laterally, moving the free ends of all contact fingers simultaneously and uniformly in the same direction. Therefore, the end portion is forcibly brought into contact with the terminal ball to close the window. Tip of each finger
The (off-axis of the finger) is located near the top of the window.

[0008]

When the fingers are moved by the bending plate, the ends contact the terminal balls above the center line. The fingers make electrical contact to each ball individually. Because the fingers make contact with the balls above their centerlines (between the center of each ball and the plane of the device on which it depends), the fingers hold the balls in their respective windows and hold the ball grid array device. To trap. The ball grid array device is held in place by the edges and contacts the ball above the centerline,
The size of the ball may vary within a predetermined range without affecting the trapping effect of the contact fingers.

[0009]

Due to its simple structure and operation, the socket device of the present invention can be made from a wide variety of materials. Since the top of the socket is open, the use of automated processes for loading and unloading the socket does not damage the device or the socket, and the top surface of the device can be exposed to a cooling atmosphere, and / or Alternatively, it can be attached to a heat sink. The features and advantages of the present invention will be readily understood from the following detailed description and drawings in connection with the appended claims.

[0010]

[Explanation of Examples] As used herein, the "mounting housing (m
The terms "ounting housing)" and "socket" are used interchangeably and are used to describe a device or apparatus for housing the ball grid array in electrical contact with each of the ball grid array terminal balls. . In the drawings, similar elements are designated by the same reference numerals.

The use state of the ball grid array device (10) provided with the mounting housing of the present invention is shown in FIG. The ball grid array device (10) has a bottom surface (11) (see FIG. 3), and a spherical terminal is provided on the bottom surface.
A plurality of (12) are formed. The terminals (12) are
It is formed by placing solder at a predetermined position on the mounting pad or the like (not shown) of 1). Various methods of forming such a terminal ball are known and do not form part of the present invention. By these methods, a substantially spherical body is formed (see FIG. 7), and the bottom surface of the ball grid array device is formed.
It hangs from (11). The terminal ball (12) is usually formed by placing solder on it, heating it, and shrinking it into a ball shape by surface tension. Regardless of the manufacturing method, the spherical terminals protruding from the surface of the ball grid array device are terminal balls or ball terminals.
terminals).

The terminal balls 12 are provided on the lower surface of the ball grid array device 10 in a predetermined grid pattern. To accommodate the ball grid array device, the mounting housing of the present invention employs an upper support member (22) having a plurality of windows (23) extending therethrough. The window portion (23) is formed in a grid pattern corresponding to the grid pattern of the ball terminal (12). To accommodate different size ball grid array devices,
On the upper surface (24) of the support member (22), spacers (3
5) is detachably installed. Spacers (35) form the perimeter of each particular ball grid array device and position the ball grid array device such that the ball grid array device does not move laterally with respect to the top surface (24). Thus, by the spacer (35), each ball grid array, the ball terminal (12) hanging from the lower surface (11), can be arranged so that the position and direction match the window (23), Further, each size and shape of the ball grid array package can be changed as required.

In the preferred embodiment shown in FIG. 1, the socket of the present invention is formed from a plurality of plate-like elements (discussed in detail below), which elements are a single box-like housing having an open top and bottom. Housed in (100). As shown in FIGS. 4, 5 and 6, the housing includes a base member (21), which is a support member (2).
A plurality of holes (30) are formed at positions substantially corresponding to the window (23) of (2). Each hole (30) has a shoulder portion (31) inside (see FIG. 6). Each hole (30) has an elongated contact finger (4
0) is placed. In the preferred embodiment, the elongate contact fingers are axially elongate members and are formed from a resilient, electrically conductive material such as nickel-coated steel. The central portion (43) of the contact finger (40) is wide and forms shoulder portions (45) (46) at both ends thereof. Therefore, when the contact finger (40) is inserted into the base member (21), the tail portion (41) penetrates through the hole (30),
The shoulder (46) rests on the shoulder (31). A trap plate (25) having a hole (32) and a shoulder portion (33) corresponding to the hole (30) is fixed to the base member (21) and the shoulder portion (33). The upper portion (44) of each contact finger (40) penetrates the hole (32) and the shoulder (3) of the hole (32).
3) is the shoulder (45) of the enlarged central part (44) of the contact finger
Contact with. In this way, the contact fingers (40) are inserted into place in the base member (21) and held securely by the trap plate (25).

The lower ends of the contact fingers (40) project from the lower surface of the base support (22) and form the input / output ends.
The tail portion (41) may be fixed in a suitable circuit board, burn-in board, or the like. Alternatively, other means capable of making electrical contact to the circuitry of the support medium may be used.

The upper portion (44) above the central portion (43) of the contact finger (40) passes through the hole (54) in the flex plate (28),
Its free end (42) terminates in the window (23). In the preferred embodiment, the free end (42) of each finger (40) is sufficiently elongated to define a generally central axis that penetrates the window (23) substantially orthogonal to the support surface (24). However, the tip (42a) bends, deviates from the central axis and extends through the window (23) towards the support surface (24), but not beyond the window (23) or surface (24). . For best results, it is desirable that tip 42a be as close to surface 24 as possible without penetrating surface 24. However, the tip (42a) need only extend beyond the center line of the ball terminal with which it comes into contact.

In the preferred embodiment, each window (23)
Has a small recess (23a) that receives the end (42) of the contact finger (40). As shown in FIGS. 4, 5 and 6, the bending plate (28) is disposed between the trap plate (25) and the supporting member (22), but the housing is free to reciprocate laterally. Is. Contact fingers (40)
The central portion (43) of the base member (21) and the trap plate (2)
5) It is firmly fixed between the bent plates.
The lateral movement of (28) also causes the free ends (42) of the contact fingers (40) to move laterally.

The rotatable cam (50) runs horizontally in the mounting housing near one end surface of the flex plate. The cam (50) has a retainer on one end of the housing (100).
It is attached by (53). The opposite end of the cam (50)
Controlled by lever (52). When the lever (52) moves in the first direction, the protrusion (51) of the cam (50) moves and contacts the end surface (29) of the plate (28). In this way, rotation of the cam (50) (counterclockwise in FIG. 4)
Thus, the bending plate (28) moves in the same direction (leftward in FIG. 4). Due to the movement of the bending plate (28), the free end (4
2) also moves in the same direction, so the free end (42)
Escape from a) and move across the window (23). It will be appreciated that the rotating cam (50) is the preferred means for moving the plate (28). As other means for moving the cams relative to each other, wedge-shaped members, ratchets, plungers, rack-pinions and the like can be used. As used herein, the terms "cam" and "cam plate" refer to the tops (44) of the contact fingers as support members.
(22) shall mean any mechanical structure that can be moved laterally.

The position of the upper portion (44) of the contact finger (40) when the housing is open is shown in FIG. In this position, the contact fingers (40) are in play (relaxe
d) or forced into the open position by a flex plate. If desired, a spring (not shown) may be placed between the housing (100) and the opposite end (29) of the plate (28) with the free end (42) inside the recess (23a). Can be sure to get into. Thus, the ball grid array device can be positioned by the ball terminals (12) depending into the window (23) by simply placing it in the proper position. The free end (42) is retracted into the recess (23a) so that the ball terminal (12) easily enters the window (23).
Therefore, no kind of pressure is applied to any part of the ball grid array device (10) or the depending ball terminal (12). In addition, no force (other than gravity) is exerted by the electronic device package or ball terminals on any part of the socket. When the plate (28) is moved by the protrusion (51) (leftward in FIG. 4), the free end (42) of the contact finger (40) hangs in the window (23) ball terminal (12). To move toward the ball terminals uniformly and simultaneously to contact the ball terminals.

As best shown in FIG. 2 and illustratively in FIG. 7, the free ends (42) of the contact fingers (40) are shown.
Penetrates into the window (23) near the surface (24), but does not cross the surface (24). Further, the free end (42) is bent such that the tip (42a) is deflected from the vertical axis of the pin (40) toward the ball terminal (12), and the tip (42a) of the contact finger (40) is bent. ) To form a cup or hook. As shown in FIG. 7, the tip portion (42a) of the free end portion (42) extends beyond the center line of the ball terminal (12). For example, FIG.
Shows the relative position when the tip size (42a) is in contact with the ball terminal when the nominal size of the ball is 0.030 inch. The nominal ball size of 0.030 inches may vary from about 0.035 inches to about 0.024 inches in diameter. Thus, the ball contacts may vary slightly with variations in ball size. However, as shown in FIG. 7, when the free end (42) tip (42a) exceeds the extended center line (horizontal line passing through the center of the ball terminal (12)) by at least 0.001 inch to 0.002 inch or more. , The contact at the tip (42a) of the contact finger (40) is the ball terminal (12).
About 5 degrees beyond the extended centerline of. in this way,
Since the ball grid array device is trapped and the horizontal movement by the spacer (35) is hindered, the pressure acting on the ball terminal (12) by the tip portion (42a) of the contact finger (40) is a lateral force component. , Has a small downward force component. The ball grid array device (10) is thus trapped and secured against the upper surface (24) of the support member (22) by the lateral downward pressure exerted by the contact fingers (40) on the ball terminals (12). It

The relative positions of the elements of the mounting housing and the ball grid array when the housing is closed are shown in FIG. It should be noted that the protrusion (51) of the cam (50) urges the plate (28) to the left in FIG. The tip portion (42a) of the contact finger (40) moves in the same direction until it comes into contact with the surface of the ball terminal (12). As the flex plate 28 moves further to the left, the central portion 44 of each contact finger 40 flexes until a contact pressure of about 35 grams acts on each ball terminal. The tips (42a) of the contact fingers (40) extend beyond the centerlines of the respective ball terminals (12), so this pressure firmly holds the entire ball grid array device near the top surface (24) of the mounting housing. Once locked, each contact finger (40) makes electrical contact with the ball terminal (12) so that electrical function and the like can be tested. However, pressures in the range of about 35 grams are insufficient to damage or drop the ball terminals (12).

After an inspection, burn-in or other process has been applied to the ball grid array device (10), the device is released by simply moving the lever (52) in the opposite direction and the contact fingers (40) (if included) If
Further, the plate (28) is forcibly moved in the opposite direction by the spring, and the tip portion (42a) is inserted into the recess (23).
In the case of the device of the present invention, when the ball grid array device is mounted to perform the burn-in test, the force to be inserted into the socket is zero. The test device need only be placed on top of the mounting housing using gravity.
No force of any kind acts on the device package or ball terminal (12) during insertion or removal.

In the embodiment described above, the bending plate (2
8) is moved laterally by the cam action, and the contact fingers (4
The free end (42) of 0) is moved into contact with the terminal ball (12). However, using other configurations, the terminal balls
It is also possible to move (12) with respect to the free end (42) of the contact finger.

In the embodiment shown in FIGS. 8 and 9, the flex plate (28) is maintained in a fixed position and the upper support member (22) is maintained.
When is moved laterally, the ball terminals (12) simultaneously come into physical contact with the free ends (42) of the contact fingers. In this example, the top (4
4) penetrates the hole (54) of the bending plate (28). The holes (54)
Positioned with respect to the hole (32) to bias the free end (42) of the contact finger in a direction off center of the hole (32). As shown in FIGS. 8 and 9, the contact finger is bent in the opposite direction at a portion passing through the bending plate (28),
The hole (54) of the bending plate (28) is positioned so as to bias the end portion (42) in the curvature direction.

When the socket is in the open position, the free end (4
It will be observed that 2) is located in the recess (23a) of the window (23). However, as described above with respect to the embodiment in which the bending plate (28) moves the contact fingers by the cam action, when the upper support member (22) moves to the right in FIG. 42) Free end (4
2a) Contact at the same time. One of ordinary skill in the art could, from the above description, use other configurations to effect the desired relative movement.

When the socket is in the closed position, each of the tips 42a of the contact fingers 40 exerts a lateral downward force on the ball terminal about 5 degrees above its centerline. There is no risk of damaging the ball terminals (12) because the pressure exerted by each individual finger is limited. Similarly, when the contact fingers (40) are returned to the open position (or the top plate is moved), the ball grid array device (10) can simply be removed by gravity, or a vacuum pencil or the like can be removed. It can also be used and removed. It should be noted that the present invention not only makes the insertion and removal forces completely zero, but does not exert any pressure on the ball grid array device other than the terminal balls (12). In fact, since no lid or cover is used, the entire top surface of the ball grid array device is exposed. Cooling air may be circulated over it, or a heat sink may be provided. Further, since the test apparatus can be easily loaded by vertically moving it by using gravity, the test apparatus of the present invention can be easily loaded and unloaded by the automated apparatus.

In all configurations of the present invention, any reaction force (reac) generated by contact between the device and the socket.
It should be particularly noted that the tive forces are in the body of the socket housing and are not transferred to the burn-in board. Opening (or closing) the socket by moving the ends (42) of the contact fingers with respect to the terminal ball (12) requires substantial force. For example, the force required to make contact is the force applied from each finger (42) to each terminal ball (12), typically
It's about 1 ounce. For device packages with 1000 or more terminal balls, the total contact force is greater than 62 pounds. This force is a substantial force to take into account, since burn-in boards, etc., contain a large number of sockets, each socket being repeatedly loaded and unloaded. However, since the contact fingers are moved simultaneously with respect to the ball terminal by the rotation of the cam, all the force for opening and closing (and the reaction force in the opposite direction) is in the socket. Furthermore, the fingers individually contact only one ball terminal each. Thus, for any terminal, a force of about 1 ounce will only act on one terminal. Substantially no force acts on the device package or supporting burn-in substrate. Instead, all the acting forces (and reaction forces) are in the socket housing.

It will be appreciated that the materials used to make the mounting housing of the present invention may be varied as desired depending on the application. Similarly, the physical size and shape of the elements can be adjusted to accommodate a particular ball grid array device.
For example, the illustrated contact fingers 40 are axially elongated strips of metal, but can be cut or stamped from flat ribbon material. However, the fingers 40 may be formed from wire or may be formed in various shapes without departing from the principles of the invention. Similarly, if desired, the fingers may be secured within the socket using any suitable means. If the socket is used for burn-in, a refractory material should be used. In its preferred embodiment, few moving parts are used and the opening and closing functions can be easily automated, making it particularly attractive for use in hostile environments. Thus, the preferred embodiment is very reliable and functional in repeated use.

As will be appreciated from the foregoing description, the principles of the invention can be used in various forms to obtain many of the advantages of the disclosed features. Therefore, it should be understood that the numerous features and advantages of the present invention, even though they are set forth with details of the structure and function of the invention, are merely exemplary. Various changes and modifications may be made in details, particularly in size, shape and arrangement of parts without departing from the scope and spirit of the invention as defined by the claims.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an assembled state of a preferred embodiment of a ball grid array device having a mounting housing of the present invention.

FIG. 2 is an enlarged view showing a part of the upper surface of the mounting housing of FIG.

FIG. 3 is an enlarged view showing a part of the surface of the ball grid array of the ball grid array device of FIG.

4 is a partial cross-sectional view of the mounting housing device taken along line 2-2 of FIG. 1, showing the position of the contact fingers when the mounting housing is in the open position.

5 is a partial cross-sectional view of the mounting housing device taken along line 2-2 of FIG. 1 showing the position of the contact fingers when the ball grid array is inserted into the socket and the socket is in the closed position.

6 is a partial cross-sectional view of the mounting housing of FIG. 1 taken along line 4-4 of FIG.

FIG. 7 is an end of a contact finger used in the present invention,
It is explanatory drawing showing the relationship between the terminal ball of the ball of various nominal sizes which protrudes from the surface of a ball grid array device.

FIG. 8 is a partial cross-sectional view of another embodiment of the mounting housing device shown in FIG. 1 with the flex plate maintained stationary and the upper support member used to move the ball grid array device relative to the contact fingers. ing.

9 is a partial cross-sectional view of the device of FIG. 8 showing the relative position of the contact fingers and the ends of the ball grid array device when the socket is in the closed position.

[Explanation of symbols]

 (10) Ball grid array device (12) Terminal ball (21) Base member (22) Support member (23) Window (25) Trap plate (28) Bending plate (40) Contact finger (50) Cam (100) Housing

Claims (22)

[Claims] 1. An apparatus for mounting a ball grid array device, comprising: (a) when the ball grid array device is placed,
A support member having a support surface having a plurality of windows formed in a pattern corresponding to the balls so that the terminal balls projecting downward from one surface of the ball grid array device can be received; (b) a base member; c) a flexure plate having a hole substantially corresponding to the window and disposed between the base member and the support member for lateral movement with respect to the support member; (d) fixed to the base member, A plurality of elongated contact members having interconnecting ends and free ends on opposite sides of the central portion, the central portion projecting through holes in the bending plate, the free ends being located in the windows of the support member. And (e) between the base surface of the terminal ball projecting downward and the center line of the terminal ball, the position of the bending plate is adjusted so as to force the free end of the contact member into contact with the terminal ball. Laterally with respect to Mounting device of a ball grid array devices comprising a; cam for. 2. The apparatus of claim 1, wherein the free end of the contact member has a generally central axis and the tip of the free end is offset from the generally central axis. 3. The device of claim 2, wherein the tip of the contact member penetrates into the window of the support member but does not penetrate the window. 4. The apparatus of claim 1, wherein the cam contacts the flex plate to move the flex plate. 5. The apparatus of claim 1, wherein the cam contacts the support member to move the support member. 6. The apparatus of claim 4 including spring means for moving the flexure plate laterally with respect to the support member. 7. The apparatus of claim 5 including spring means for biasing the flex plate laterally with respect to the support member. 8. The tip of the free end of the contact member contacts the ball terminal between the center of the ball terminal located in the window and the base surface of the device from which the ball terminal projects downward. The device according to claim 2, which has penetrated into the window of the support member to a position where it is possible. 9. A spacer removably secured adjacent to the support surface, the spacer forming at least a portion of a perimeter of a ball grid array device to be disposed on the support surface. The device according to claim 1. 10. An apparatus for mounting a ball grid array device, comprising: (a) when the ball grid array device is placed,
A support member having a support surface having a plurality of windows formed in a pattern corresponding to the balls so that the terminal balls projecting downward from one surface of the ball grid array device can be received; (b) a base member; c) a biasing means having a hole substantially corresponding to the window and arranged between the base member and the support member; (d) fixed to the base member and free from the interconnection ends on both sides of the central part. Has an end portion, the central portion projects through the hole of the urging means, the free end portion forms a substantially central axis, and the free end portion is located in the window of the support member off the central axis. are doing,
An apparatus for mounting a ball grid array device comprising: a plurality of elongated contact members; and (e) means for moving the free ends of the contact members with respect to the window. 11. The apparatus of claim 10, wherein the tip of the contact member penetrates into the window of the support member but does not penetrate the window. 12. A spacer is removably secured adjacent to the support surface, the spacer forming at least a portion of a perimeter of the ball grid array device to be disposed on the support surface. The device according to claim 10. 13. A combination of a ball grid array device and a mounting device, comprising: (a) the ball grid array device projecting downward from the first surface and the first surface in a predetermined pattern, each of the first surface
Has a plurality of ball terminals that form a geometric center at a predetermined distance from the plane; and (b) the mounting device projects downward from the first plane of the (i) ball grid array device. So that it can receive the terminal balls,
A support member having a support surface having a plurality of windows formed in a pattern corresponding to the balls; (ii) a base member; (iii) a hole disposed between the base member and the support member and substantially corresponding to the window. (Iv) having interconnecting ends and free ends on both sides of the central part, the central part projecting through the hole of the bending plate, the free end
Ball grid array device and mounting apparatus disposed in a window of a support member and comprising a plurality of elongated contact members terminating between a first surface of the ball grid array and a geometric center of a terminal ball. Combination of. 14. The combination of claim 13, wherein the free end of the contact member has a generally central axis and the tip of the free end is offset from the generally central axis. 15. The combination of claim 14, wherein the tip of the contact member penetrates into the window of the support member but does not penetrate the window. 16. The combination of claim 13 including means for moving the free end of the contact member with respect to the window. 17. The moving means comprises a rotatable cam adjacent to the flex plate, and when the cam rotates,
17. The combination of claim 16, wherein the flex plate moves laterally with respect to the support member. 18. The combination of claim 17, wherein the moving means comprises a spring arranged to bias the flex plate laterally of the support member. 19. The moving means comprises a rotatable cam adjacent the support member, the support member moving laterally with respect to the flex plate as the cam rotates.
The combination according to 6. 20. The combination of claim 19 wherein the means for moving comprises a spring arranged to bias the support means laterally of the flex plate. 21. A method of mounting a ball grid array device in which a plurality of terminal balls project from one surface, comprising: (a) providing a support plate with a top surface and a plurality of windows on the top surface in a preselected pattern. Disposing; (b) disposing one end of the elongated contact member at a position adjacent to one side of each window; (c) inserting a hanging terminal ball into the window to form a ball grid. Placing the array device on the upper surface of the support plate; and (d) moving one end of the elongated contact member to bring the end of the contact member into contact with a ball terminal depending into a window, A method of mounting the ball grid array device, comprising: holding the ball grid array device against the upper surface; 22. The method of claim 21 including the step of removably attaching spacers to the top surface of the support plate to form at least a portion of the perimeter of the ball grid array device disposed on the top surface.