JP3862303B2 - Ball grid array device mounting device - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to an apparatus for mounting and testing electronic devices. More specifically, the present invention relates to an electronic device mounting apparatus including a socket apparatus that holds and electrically connects input / output terminals of a ball grid array apparatus during testing and burn-in.
[0002]
[Prior art]
Advances in microelectronic technology tend to develop device chips that can perform more functions in less space. Since the number of electrical interconnections required for circuits within a chip between the chip and external circuits to communicate with the outside world increases, the physical space for this interconnection must be reduced. In order to make electrical contact between the chip and external circuitry, the circuit chip is usually housed in a housing or package that supports interconnect leads, pads, etc. on one or more external surfaces. ing. In order to shorten the overall length of the leads from the chip to the external circuit and form an appropriate space between the input / output terminals of the package, a high pin count device is attached to the package, and the input / output terminals are It is arranged in a grid pattern on one side of the package. The terminals may be in the form of pins protruding from the package (usually described as a pin grid array or PGA) or in the form of contact pads on the surface of the package. In order to physically fix the chip to the substrate and to electrically connect between pads on the surface of the substrate such as a circuit board to which the package is to be attached and between similar interconnection pads, solder etc. When the droplet is dropped, it is fixed to each terminal pad of the device package. Since the solder droplets form spherical protrusions on the terminal pads, such a device is called a ball grid array (BGA) device.
[0003]
The term “ball grid array device” is generally applied to device packages with substantially spherical contacts protruding from one side, but the term also applies to other structures. The For example, a bare (uncoated) chip may be provided with a grid array of spherical contacts for mounting in a package. However, at some point during manufacture, bare chips with spherical contacts are often described as ball grid array devices. Similarly, the finished chip may be provided with terminal pads on one surface and spherical interconnects formed on the terminal pads. The chip is then inverted and attached directly to the corresponding pattern of interconnect pads on the substrate. When heated, the spherical solder flows again, forming an electrical and physical connection. This process (sometimes referred to as “flip chip” technology) clearly uses so-called ball grid array devices. Therefore, in this specification, “ball grid array” and “ball grid array device” are a plurality of elements arranged in a substantially grid pattern on one side, such as a device package, flip chip, and bare die. Any structure that forms a generally spherical connection is meant. The ball terminals are substantially spherical and are arranged in a predetermined pattern on one surface of the device package. Since the ball terminals are substantially spherical and are substantially uniform in size, the geometric center of each ball terminal is spaced from the surface of the device package. The ball terminal depends from the package, and the geometric center of the ball terminal is substantially in a plane parallel to the surface of the device package from which the ball terminal depends. This plane (or a plane corresponding to each ball terminal) is referred to herein as the center, center line, or center extension line of the ball terminal.
[0004]
Many electronic devices undergo burn-in testing during the manufacturing process or at some stage after fabrication. To perform a burn-in test, the device must be attached to and removed from the test fixture. With the fixture, each terminal of the input / output terminals is electrically connected, and the function of the device is tested and evaluated. In many cases, devices are exposed not only to electrical stress but also to harsh environmental conditions (eg, heat, etc.) in order to verify the integrity and functional integrity of the finished device. To perform an effective burn-in test, the device is mounted in a fixture that can be quickly and easily inserted and removed without damaging the device, device package or sophisticated ball terminals. It must be able to be taken out. However, a feature of the ball grid array device that makes it attractive as a device structure (e.g., very small contacts densely placed on a hidden surface) is the ability to fit in a test socket without damaging the device structure. It is extremely difficult to install securely.
[0005]
In the conventional test socket construction, the ball grid array is placed on an interconnect substrate having interconnect pads in the array corresponding to the ball grid array pattern. The ball grid array device is placed on the substrate such that the terminal balls are in individual contact with the interconnect pads on the test substrate. However, in order to perform the test, the ball grid array device must be maintained in the proper position and orientation, so that the device can be entraped using a lid or cover to align the ball grid array with the interconnect pads. Maintain contact. Unfortunately, the trap lid prevents proper circulation of cooling air around the device, thus eliminating the use of a heat sink even if the device is designed to operate only in conjunction with a particular heat sink. Such lids or covers are difficult to operate, can damage the device and prevent automated loading and unloading of test sockets.
[0006]
[Problems to be solved by the invention]
The present invention eliminates the disadvantages of the prior art by providing an opening at the top of the mounting housing or socket. A lid, cover, etc. are not required. Thus, the top surface of the device is used to attach to the heat sink during testing and is open to cooling air and the like. Furthermore, since the socket, ie the top surface of the mounting housing, is open, the device to be tested can be inserted or removed by an automated process without the risk of damaging the device or the mounting device.
[0007]
[Means for Solving the Problems]
The ball grid array device mounting apparatus of the present invention comprises: (a) a ball grid array device; On the top A supporting member to support; (b) It is arranged below the support member A base member; (c) disposed on the base member; for A moving plate adapted to move laterally; (d) an interconnection end fixed to the base member; A shape that applies laterally downward pressure by contacting the terminal balls of the ball grid array device from the side. A plurality of elongate contact members having a free end; and (e) a free end of the contact member from a side relative to a terminal ball of the ball grid array device; To apply lateral downward pressure In order to contact, the position of the moving plate to the base member for A moving means for moving in the horizontal direction is provided.
To further illustrate, in the present invention, the socket or mounting housing includes a support member, the top surface of the support member having a plurality of windows for receiving an array of interconnect terminal balls depending from the surface of the ball grid array package. It has been established. Socket is also It is arranged below the support member A plurality of contact pins or fingers that include a base member and extend in the axial direction are fixed. One end of each finger penetrates the base and serves as an attachment end, and is soldered to a burn-in board or the like. The opposite end of each finger Said It has entered one of the windows. The central part of each finger (between the free end and the base) passes through a hole in a bending plate attached between the base and the support member. The bending plate can be fixed, or the free end of the contact finger can be used as a window. for To move the support member for It may be movable in the lateral direction. The end of each free end is bent so as to deviate from the axis of the finger, and a contact tip is formed at the tip of the free end. The fingers are mounted such that when in the open state, the free ends of the contact fingers are located near one side of each window. When the ball grid array device is placed on the top surface of the support member, the terminal balls protrude or hang down into the window. In the preferred embodiment, a cam is used to move the bending plate laterally, moving the free ends of all contact fingers simultaneously and uniformly in the same direction. For this reason, the end is forced to the terminal ball To apply lateral downward pressure to Touched to close the window. The tip of each finger (off the finger axis) is located near the top of the window.
[0008]
[Action]
When the finger is moved by the moving plate, the end is Center of terminal ball Above position To touch. The fingers are in electrical contact with each ball individually. Finger Each Between the center of the ball and the face of the device from which it hangs Time The ball above To apply lateral downward pressure to As they come into contact, the fingers hold the balls of each window and trap the ball grid array device. The ball grid array device is held in place by the edges, center The ball size may vary within a predetermined range without affecting the trapping effect of the contact fingers.
[0009]
【The invention's effect】
Due to the simplicity of construction and operation, the socket device of the present invention can be made from a wide range of materials. Since the top of the socket is open, using an automated process for socket loading and unloading will not damage the device or socket, the top surface of the device may be exposed to a cooling atmosphere, and / or Alternatively, it can be attached to a heat sink. The features and advantages of the present invention will be readily understood from the following detailed description and drawings in conjunction with the appended claims.
[0010]
[Explanation of Examples]
As used herein, the terms "mounting housing" and "socket" are used interchangeably and are devices for receiving a ball grid array in electrical contact with each of the ball grid array terminal balls. Or used to represent a device. In the drawings, similar elements are denoted by the same reference numerals.
[0011]
The use state of the ball grid array device (10) provided with the mounting housing of the present invention is shown in FIG. The ball grid array device (10) has a bottom surface (11) (see FIG. 3), and a plurality of spherical terminals (12) are formed on the bottom surface. The terminal (12) is formed by piling up solder at a predetermined position on a mounting pad or the like (not shown) on the surface (11) of the device. Various methods for forming such terminal balls are known and do not form part of this invention. By these methods, a substantially spherical body is made (see FIG. 7) and hangs down from the lower surface (11) of the ball grid array device. The terminal ball (12) is usually formed by applying solder and heating, and contracting into a ball shape by surface tension. Regardless of the fabrication method, the spherical terminals protruding from the surface of the ball grid array device shall be referred to as terminal balls or ball terminals.
[0012]
The terminal balls (12) are provided in a predetermined grid pattern on the lower surface of the ball grid array device (10). In order to accommodate the ball grid array device, the mounting housing of the present invention uses an upper support member (22) through which a plurality of windows (23) pass. The window (23) is formed in a grid pattern corresponding to the grid pattern of the ball terminals (12). In order to accommodate ball grid array devices of different dimensions, spacers (35) of various sizes are detachably arranged on the upper surface (24) of the support member (22). Spacers (35) form the perimeter of each particular ball grid array device, with the ball grid array device on the top surface (24). for Position the ball grid array device so that it does not move laterally. Thus, by the spacer (35), each ball grid array can be arranged so that the ball terminal (12) hanging from its lower surface (11) is aligned with the window (23) in position and direction, Also, the size and shape of the ball grid array package can be changed as required.
[0013]
In the preferred embodiment shown in FIG. 1, the socket of the present invention is formed from a plurality of plate-like elements (discussed in detail below), which comprise a single box-like housing (100) open at the top and bottom. Is housed inside. As shown in FIGS. 4, 5 and 6, the housing includes a base member (21), and the base member has a plurality of positions substantially coincident with the window (23) of the support member (22). A hole (30) is formed. Each hole (30) has a shoulder (31) inside (see FIG. 6). An elongated contact finger (40) is disposed in each hole (30). In the preferred embodiment, the elongate contact fingers are axially elongate members and are formed from an elastic conductive material, such as, for example, nickel coated steel. The center part (43) of the contact finger (40) has a wide width, and shoulders (45) and (46) are formed at both ends thereof. Therefore, when the contact finger (40) is inserted into the base member (21), the tail (41) passes through the hole (30) and the shoulder (46) is above the shoulder (31). On. A trap plate (25) having a hole (32) and a shoulder (33) corresponding to the hole (30) is fixed to the base member (21) and the shoulder (33). The upper part (44) of each contact finger (40) passes through the hole (32), the shoulder (33) of the hole (32) and the shoulder (45) of the enlarged central part (44) of the contact finger. Contact. Thus, the contact finger (40) is inserted into place in the base member (21) by the trap plate (25) and held firmly.
[0014]
The lower end of the contact finger (40) protrudes from the lower surface of the base member (21) and constitutes an input / output end. The tail part (41) may be fixed in a suitable circuit board, burn-in board or the like. Alternatively, other means that can be in electrical contact with the circuit of the support medium may be used.
[0015]
The upper part (44) above the central part (43) of the contact finger (40) passes through the hole (54) of the moving plate (28), and its free end (42) terminates at the window part (23). ing. In a preferred embodiment, the free end (42) of each finger (40) is sufficiently elongated and has a substantially central axis that enters the window (23) substantially perpendicular to the support surface (24). Formed into a shaft having ing. However, the tip (42a) bends and deviates from the central axis and extends through the window (23) towards the support surface (24) but does not cross the window (23) or surface (24). . In order to obtain the best results, it is desirable that the tip (42a) be as close to the surface (24) as possible without penetrating the surface (24). However, the tip (42a) center Even beyond
Just do it.
[0016]
In the preferred embodiment, each window (23) has a small recess (23a) that houses the end (42) of the contact finger (40). As shown in FIGS. 4, 5 and 6, the moving plate (28) is disposed between the trap plate (25) and the support member (22), but is not attached to the housing. for The reciprocating motion in the lateral direction is free. Since the central portion (43) of the contact finger (40) is firmly held between the base member (21) and the trap plate (25), the lateral movement of the moving plate (28) causes the contact finger ( The free end (42) of 40) also moves laterally.
[0017]
A rotatable cam (50) passes horizontally through the mounting housing near one end surface of the moving plate. The cam (50) is attached to one end of the housing (100) by a retainer (53). The opposite end of the cam (50) is controlled by a lever (52). When the lever (52) moves in the first direction, the protrusion (51) of the cam (50) moves and contacts the end surface (29) of the plate (28). In this manner, the moving plate (28) moves in the same direction (leftward in FIG. 4) by the rotation of the cam (50) (counterclockwise in FIG. 4). Due to the movement of the moving plate (28), the free end (42) also moves in the same direction, so that the free end (42) escapes from the recess (23a) and moves in a direction crossing the window (23). It will be appreciated that the rotating cam (50) is a desirable means for moving the plate (28). As other means for moving the cam relative to each other, a wedge-shaped member, a ratchet, a plunger, a rack-pinion, or the like can be used. As used herein, the terms “cam” and “cam plate” refer to the top (44) of the contact finger to the support member (22). for It shall mean any mechanical structure that can be moved laterally.
[0018]
The position of the upper part (44) of the contact finger (40) when the housing is open is shown in FIG. In this position, the contact finger (40) is relaxed or forced into the open position by a moving plate. If necessary, a spring (not shown) is placed between the housing (100) and the opposite end (29) of the plate (28), with the free end (42) in the recess (23a). You can be sure to get in. Thus, the ball grid array device can be positioned by ball terminals (12) depending in the window (23) simply by placing it in the appropriate position. Since the free end (42) is retracted into the recess (23a), the ball terminal (12) easily enters the window (23). For this reason, no kind of pressure is applied to any part of the ball grid array device (10) or the hanging ball terminal (12). Furthermore, no force (force other than gravity) is applied to any part of the socket from the electronic device package or the ball terminal. When the plate (28) is moved by the protrusion (51) (to the left in FIG. 4), the free end (42) of the contact finger (40) is suspended from the ball terminal (12) in the window (23). Towards the ball terminal, it moves uniformly and simultaneously to contact the ball terminal.
[0019]
As best shown in FIG. 2 and illustratively shown in FIG. 7, the free end (42) of the contact finger (40) enters the window (23) near the surface (24). Do not exceed the surface (24). Further, the free end (42) is bent so that the tip (42a) is deflected from the vertical axis of the pin (40) toward the ball terminal (12), and the tip (42a) of the contact finger (40) ) To form a cup or hook. As shown in FIG. 7, the free end portion (42) has a tip end (42a) that is connected to the ball terminal (12). center It extends beyond. For example, FIG. 7 shows the relative position when the tip (42a) is in contact with the ball terminal when the nominal size of the ball is 0.030 inches. The nominal ball size of 0.030 inches may vary from about 0.035 to about 0.024 inches in diameter. Thus, the ball contacts may vary slightly with variations in ball dimensions. However, as shown in FIG. 7, the free end (42) has a tip (42a) that exceeds the extended center line (horizontal line passing through the center of the ball terminal (12)) by at least 0.001 inch to 0.002 inch or more. The contact of the tip part (42a) of the contact finger (40) is about 5 degrees beyond the extended center line of the ball terminal (12). In this way, since the ball grid array device is trapped and horizontal movement by the spacer (35) is prevented, the pressure acting on the ball terminal (12) by the tip (42a) of the contact finger (40) is lateral. Force component and a small downward force component. The ball grid array device (10) is thus trapped and fixed against the upper surface (24) of the support member (22) by the lateral downward pressure acting on the ball terminal (12) from the contact finger (40). The
[0020]
When the housing is closed, the relative positions of the mounting housing elements and the ball grid array are shown in FIG. It should be noted that the protrusion (51) of the cam (50) biases the moving plate (28) in the left direction of FIG. The tip (42a) of the contact finger (40) moves in the same direction until it contacts the surface of the ball terminal (12). As the moving plate (28) moves further to the left, the central portion (44) of each contact finger (40) deflects until approximately 35 grams of contact pressure is applied to each ball terminal. The tip (42a) of the contact finger (40) is connected to each ball terminal (12). center This pressure securely locks the entire ball grid array device near the top surface (24) of the mounting housing, and each contact finger (40) is in electrical contact with the ball terminal (12), The electrical function etc. can be inspected. However, a pressure in the range of about 35 grams is insufficient to damage or drop the ball terminal (12).
[0021]
After inspection, burn-in or other processes are applied to the ball grid array device (10), simply moving the lever (52) in the opposite direction will release the device and contact finger (40) (if included) Further, the moving plate (28) is forcibly moved in the opposite direction by the spring), and the tip end portion (42a) enters the recess (23). In the case of the apparatus of the present invention, when the ball grid array device is mounted for performing a burn-in test, the force inserted into the socket is completely zero. The test device need only be placed on the top surface of the mounting housing using gravity. During insertion or removal, no force of any kind acts on the device package or ball terminal (12).
[0022]
In the embodiment described above, the moving plate (28) moves laterally by cam action, and moves the free end (42) of the contact finger (40) to contact the terminal ball (12). However, other configurations can be used to move the terminal ball (12) with respect to the free end (42) of the contact finger.
[0023]
In the embodiment shown in FIGS. 8 and 9, the moving plate (28) is maintained in a fixed position, and when the upper support member (22) is moved laterally, the ball terminal (12) is simultaneously moved to the free end of the contact finger. In physical contact with the part (42). In this embodiment, the top (44) of each contact finger (40) passes through the hole (54) of the moving plate (28). The hole (54) is positioned with respect to the hole (32) to bias the free end (42) of the contact finger in a direction away from the center of the hole (32). As shown in FIGS. 8 and 9, the contact finger is bent in the opposite direction at the portion passing through the moving plate (28), and the hole (54) of the moving plate (28) has an end portion (42) in the direction of curvature. Is positioned so as to be biased.
[0024]
It will be observed that the free end (42) is located in the recess (23a) of the window (23) when the socket is in the open position. However, as described with respect to the embodiment in which the moving plate (28) moves the contact finger by cam action, when the upper support member (22) moves to the right in FIG. 42) is in contact with the free end (42a) at the same time. Those skilled in the art will be able to use other configurations to perform the desired relative movement from the above description.
[0025]
When the socket is in the closed position, each of the tips (42a) of the contact fingers (40) has a lateral downward force acting on the ball terminal approximately 5 degrees above its centerline. Since the pressure acting from each finger is limited, there is no possibility of damaging the ball terminal (12). Similarly, when the contact finger (40) is returned to the open position (or the upper plate is moved), the ball grid array device (10) can be removed simply by gravity, or a vacuum pencil, etc. It can also be removed using. It should be noted that the present invention not only nulls the force for insertion and removal, but does not apply any pressure to the ball grid array device other than the terminal balls (12). In fact, since no lid or cover is used, the entire upper surface of the ball grid array device is exposed. Cooling air may be circulated thereon, and a heat sink may be provided. Furthermore, since the test apparatus can be easily loaded by moving vertically using gravity, the test apparatus of the present invention can easily perform loading and unloading by an automated apparatus.
[0026]
It should be particularly noted that in all configurations of the present invention, all reactive forces caused by contact between the device and the socket are in the body of the socket housing and are not transmitted to the burn-in board. is there. Contact finger end (42) to terminal ball (12) for Opening (or closing) the socket by moving it requires substantial force. For example, the force required to contact is the force applied from each finger (42) to each terminal ball (12), typically about 1 ounce. For device packages with 1000 or more terminal balls, the total contact force is greater than 62 pounds. This force is a substantial force to be taken into account, because a burn-in board or the like includes a large number of sockets, and each socket is repeatedly loaded and unloaded. However, since the contact fingers are moved simultaneously with respect to the ball terminal by rotation of the cam, all the forces for opening and closing (and the reaction force in the opposite direction) are in the socket. Furthermore, the contact fingers each individually contact only one ball terminal. Thus, only about 1 ounce force acts on one terminal on any terminal. Virtually no force is applied to the device package or support burn-in substrate. Instead, all forces (and reaction forces) acting are in the socket housing.
[0027]
It will be appreciated that the materials used to make the mounting housing of the present invention can vary as needed depending on the application. Similarly, the physical size and shape of the elements can be adjusted to accommodate a specific ball grid array device. For example, the illustrated contact finger 40 is an axially elongated metal piece, but can be cut or stamped from a flat ribbon material. However, the fingers (40) may be formed from wire rods and may be formed in various shapes without departing from the principles of the invention. Similarly, if desired, the fingers may be secured in the socket using suitable means. If the socket is used for burn-in, a heat resistant material should be used. The preferred embodiment is particularly attractive when used in a hostile environment because few moving parts are used and the opening and closing function can be easily automated. Thus, the preferred embodiment is very reliable and functional in repeated use.
[0028]
As will be appreciated from the foregoing description, the principles of the invention may be employed in a variety of forms to obtain many of the advantages of the disclosed features. Therefore, it should be understood that the disclosure herein is merely exemplary, even though numerous features and advantages of the present invention have been described in conjunction with details of the structure and function of the invention. Various changes and modifications may be made in detail, particularly in size, shape and arrangement of parts, without departing from the scope and spirit of the invention as defined in the claims.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view illustrating an assembled state of a preferred embodiment of a ball grid array device having a mounting housing of the present invention.
FIG. 2 is an enlarged view of a part of the upper surface of the mounting housing of FIG.
3 is an enlarged view showing a part of the surface of the ball grid array of the ball grid array device of FIG. 1. FIG.
4 is a partial cross-sectional view of the mounting housing device taken along line 2-2 of FIG. 1, showing the position of the contact fingers when the mounting housing is in the open position.
FIG. 5 is a partial cross-sectional view of the mounting housing device along line 2-2 of FIG. 1, showing the position of the contact fingers when the ball grid array is inserted into the socket and the socket is in the closed position.
6 is a partial cross-sectional view of the mounting housing of FIG. 1 taken along line 4-4 of FIG.
FIG. 7 is an illustration showing the relationship between the ends of the contact fingers used in the present invention and the terminal balls of balls of various nominal dimensions protruding from the surface of the ball grid array device.
8 is a partial cross-sectional view of another embodiment of the mounting housing device shown in FIG. 1, wherein the moving plate is maintained in a fixed state and an upper support member is used to move the ball grid array device with respect to the contact fingers. ing.
FIG. 9 is a partial cross-sectional view of the device of FIG. 8, showing the relative position of the contact fingers and the end of the ball grid array device when the socket is in the closed position.
[Explanation of symbols]
(10) Ball grid array device
(12) Terminal ball
(21) Base member
(22) Support member
(23) Windows
(25) Trap plate
(28) Moving plate
(40) Contact finger
(50) Cam
(100) Housing

Claims (27)

A device for mounting a ball grid array device comprising:
(a) a support member for placing and supporting the ball grid array device on the upper surface ;
(b) a base member disposed below the support member;
(c) disposed in said base member movable plate to be moved laterally against the said base member;
(d) a plurality of elongated contacts fixed to the base member and having interconnected ends and free ends shaped to apply laterally downward pressure by laterally contacting the terminal balls of the ball grid array device; Members; and
(e) In order to bring the free end of the contact member into contact with the terminal balls of the ball grid array device so as to apply a laterally downward pressure from the side , the position of the moving plate is brought into contact with the base member. moving means for moving laterally against;
Ball grid array device mounting device. The free end of the contact member is formed in a shaft-like to have a substantially central axis, the apparatus according tip of the free end to claim 1 which is bent so that off the substantially central axis.   The apparatus according to claim 1, wherein the moving means moves the moving plate in contact with the moving plate.   The apparatus according to claim 1, wherein the moving means moves the support member in contact with the support member. Apparatus according to claim 3 which comprises a spring means for moving laterally against the moving plate to the base member. Apparatus according to the moving plate in claim 4 which comprises a spring means for urging laterally against the base member. Tip of the free end of the contact member, between the center and the base surface of the device to which the terminal ball protrudes downward of the terminal balls arranged on the support member, it is contacted with the terminal ball The device according to claim 1, wherein the device has entered the support member as far as possible.   A spacer that is removably secured to an upper surface of the support member, the spacer comprising at least a portion of a periphery of a ball grid array device to be disposed on the support member. The device described. A device for mounting a ball grid array device comprising:
(a) a support member for placing and supporting the ball grid array device on the upper surface ;
(b) a base member disposed below the support member;
(c) a plurality of elongated contacts fixed to the base member and having interconnected ends and free ends shaped to apply laterally downward pressure by laterally contacting the terminal balls of the ball grid array device Members; and
(d) means for moving the free end of the contact member to separate the free end of the contact member so as to apply laterally downward pressure to the side of the terminal balls of the ball grid array device;
Ball grid array device mounting device.   The spacer may be detachably fixed to the upper surface of the support member, and the spacer constitutes at least a part of the periphery of the ball grid array device to be disposed on the support member. The device described. A combination of a ball grid array device and a mounting device,
(a) The ball grid array device includes a first surface and a plurality of protrusions projecting downward from the first surface in a predetermined pattern, each of which forms a geometric center with a predetermined distance from the first surface. Having a terminal ball; and
(b) The mounting device is
(i) a support member for placing and supporting the ball grid array device on the upper surface ;
(ii) a base member disposed below the support member;
(iii) said arranged on the base member, moving plate to be moved laterally against the said base member;
(iv) fixed to the base member and having an interconnecting end and a free end, the free end being disposed on the support member, the first surface of the ball grid array device and the terminal ball A plurality of elongated contact members that terminate between the geometric center and are configured to apply laterally downward pressure to the terminal ball by contacting the terminal ball laterally ;
A combination of ball grid array device and mounting device. The free end of the contact member is formed in a shaft-like to have a substantially central axis A combination according to claim 11 tip of the free end which is bent so that off the substantially central axis. The combination of claim 11, which comprises means for moving against the free end portion of said contact member to said support member. It said means for moving is comprises a rotatable cam which is adjacent to the moving plate, when the cam is rotated, the combination of claim 11 wherein the moving plate to move laterally against the support member.   15. A combination as claimed in claim 14, wherein the means for moving includes a spring arranged to bias the moving plate laterally of the support member. It said means for moving is comprises a rotatable cam which is adjacent to the support member, when the cam is rotated, the combination of claim 13 wherein the support member to move laterally against the moving plate.   17. A combination as claimed in claim 16, wherein the means for moving includes a spring arranged to bias the support means laterally of the moving plate. A method of attaching a ball grid array device in which a plurality of terminal balls protrude from one surface, comprising:
(a) One end of the elongated contact member is moved by moving the end of the ball grid array device in a shape that applies a laterally downward pressure by contacting the terminal ball of the ball grid array device from the side. Deploying the end of the at one position;
(b) placing the ball grid array device on the upper surface of the support member; and
(c) moving one end of the elongate contact member to the other position and bringing the end of the contact member into contact with the hanging terminal ball so as to apply a downward pressure in the lateral direction; Holding the device against the upper surface of the support member;
A method of mounting a ball grid array device.   19. The method of claim 18, comprising configuring at least a portion of the periphery of a ball grid array device disposed on the top surface by removably attaching a spacer to the top surface of the support member. A device for mounting a ball grid array device comprising:
(a) when the ball grid array device is disposed, so as to receive the terminal balls projecting downward from one surface of the ball grid array device, supporting a plurality of windows are formed in a pattern corresponding to the ball A support member having a surface;
(b) a base member disposed below the support member;
(c) having the supporting member of the window substantially corresponding hole, the disposed between the base member and the support member, the moving plate to be moved laterally against the said support member ;
(d) fixed to the base member, having an interconnecting end and a free end shaped to apply laterally downward pressure by making lateral contact with the terminal balls of the ball grid array device ; A plurality of elongate contact members, wherein the portion protrudes through the aperture of the moving plate and the free end is disposed within the window of the support member; and
(e) Forcibly contact the free end of the contact member between the base surface from which the terminal ball protrudes downward and the center of the terminal ball so as to apply a lateral downward pressure to the terminal ball. to, moving means for moving laterally against the position of the moving plate to the support member;
Ball grid array device mounting device. Apparatus according to the contact free end of the member is formed in a shaft-like to have a substantially central axis, said free end tip according to claim 20 which is bent so that off the substantially central axis.   The apparatus of claim 21, wherein the tip of the contact member enters the window of the support member, but does not penetrate the window.   The distal end of the free end of the contact member has the terminal ball between the center of the terminal ball disposed in the window of the support member and the base surface of the device from which the terminal ball protrudes downward. The device of claim 21, wherein the device has entered the support member window to a position where it can be contacted. A device for mounting a ball grid array device comprising:
(a) When the ball grid array device is disposed , a plurality of windows are formed in a pattern corresponding to the terminal balls so as to receive the terminal balls protruding downward from one surface of the ball grid array device. A support member having a support surface;
(b) a base member disposed below the support member;
(c) a biasing means having a hole substantially corresponding to the window of the support member and disposed between the base member and the support member;
(d) fixed to the base member, having an interconnecting end and a free end shaped to apply laterally downward pressure by making lateral contact with the terminal balls of the ball grid array device ; parts are through holes of said biasing means projecting, free end portion is formed in the shaft shape having a substantially central axis, the tip of the free end said bends so that deviates from the generally central shaft support member A plurality of elongate contact members located in the windows of
(e) means for moving the free end of the contact member, laterally against the window of the support member to contact to apply a transverse downward pressure to the terminal ball;
Ball grid array device mounting device.   25. The apparatus of claim 24, wherein a tip of the contact member enters into the window of the support member but does not penetrate the window. A method of attaching a ball grid array device in which a plurality of terminal balls protrude from one surface, comprising:
(a) providing a support member with an upper surface and disposing a plurality of windows on the upper surface in a preselected pattern;
(b) a one end of the elongated contact member, the ends of the shape imparting lateral downward pressure by contact from the side to the terminal balls of the ball grid array device, one of said each window Deploying at a location adjacent to the side of;
(c) step the pin ball hanging put in the window, placing the ball grid array device on the upper surface of the support plate; and
(d) moving one end of the elongate contact member so that the end of the contact member contacts the terminal ball hanging in the window so as to apply a lateral downward pressure to the ball grid array; Holding the device against the top surface;
A method of mounting a ball grid array device having   27. The method of claim 26 including the step of configuring at least a portion of the periphery of a ball grid array device disposed on the top surface by removably attaching a spacer to the top surface of the support member.

Images