GB2290176B - Mounting apparatus for ball grid array device - Google Patents

Mounting apparatus for ball grid array device

Info

Publication number
GB2290176B
GB2290176B GB9509228A GB9509228A GB2290176B GB 2290176 B GB2290176 B GB 2290176B GB 9509228 A GB9509228 A GB 9509228A GB 9509228 A GB9509228 A GB 9509228A GB 2290176 B GB2290176 B GB 2290176B
Authority
GB
United Kingdom
Prior art keywords
mounting apparatus
grid array
ball grid
array device
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9509228A
Other versions
GB9509228D0 (en
GB2290176A (en
Inventor
Wayne Kay Pfaff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/258,348 external-priority patent/US5419710A/en
Application filed by Individual filed Critical Individual
Priority to GB9614530A priority Critical patent/GB2302769B/en
Priority to GB9620175A priority patent/GB2303003B/en
Priority to GB9619782A priority patent/GB2303002B/en
Publication of GB9509228D0 publication Critical patent/GB9509228D0/en
Publication of GB2290176A publication Critical patent/GB2290176A/en
Application granted granted Critical
Publication of GB2290176B publication Critical patent/GB2290176B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB9509228A 1994-06-10 1995-05-05 Mounting apparatus for ball grid array device Expired - Fee Related GB2290176B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB9614530A GB2302769B (en) 1994-06-10 1995-05-05 Method of mounting a ball grid array device
GB9620175A GB2303003B (en) 1994-06-10 1995-05-05 Mounting apparatus for ball grid array device
GB9619782A GB2303002B (en) 1994-06-10 1995-05-05 Ball grid array device and apparatus for mounting it

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/258,348 US5419710A (en) 1994-06-10 1994-06-10 Mounting apparatus for ball grid array device
US08/382,487 US5611705A (en) 1994-06-10 1995-02-01 Mounting apparatus for ball grid array device

Publications (3)

Publication Number Publication Date
GB9509228D0 GB9509228D0 (en) 1995-06-28
GB2290176A GB2290176A (en) 1995-12-13
GB2290176B true GB2290176B (en) 1997-07-02

Family

ID=26946583

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9509228A Expired - Fee Related GB2290176B (en) 1994-06-10 1995-05-05 Mounting apparatus for ball grid array device

Country Status (5)

Country Link
US (1) USRE39418E1 (en)
JP (3) JP3862303B2 (en)
DE (1) DE19521137A1 (en)
FR (1) FR2721145A1 (en)
GB (1) GB2290176B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0780028B1 (en) * 1994-09-06 1998-04-15 The Whitaker Corporation Ball grid array socket
US5859538A (en) * 1996-01-31 1999-01-12 Hewlett-Packard Company Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both
JP3676523B2 (en) * 1996-10-22 2005-07-27 株式会社エンプラス Contact pin and electrical connection device
US6294920B1 (en) * 1999-06-07 2001-09-25 Wayne K. Pfaff Test mounting for surface mount device packages
DE10053745B4 (en) * 2000-10-30 2004-07-15 Heigl, Helmuth, Dr.-Ing. Device and method for contacting one or more connections on an electronic component
US6969270B2 (en) * 2003-06-26 2005-11-29 Intel Corporation Integrated socket and cable connector
KR100675343B1 (en) * 2004-12-20 2007-01-29 황동원 Socket for integrated circuit used in test and burn-in
JP4769538B2 (en) * 2005-02-22 2011-09-07 富士通セミコンダクター株式会社 Contactor for electronic parts and contact method
JP4729346B2 (en) * 2005-06-30 2011-07-20 株式会社エンプラス Socket for electrical parts
JP4802059B2 (en) * 2006-07-27 2011-10-26 株式会社エンプラス Socket for electrical parts
US7972159B2 (en) * 2008-08-26 2011-07-05 Hon Hai Precision Ind. Co., Ltd. Electrical connector for test socket
TWM360464U (en) * 2008-11-10 2009-07-01 Hon Hai Prec Ind Co Ltd Electrical connector
US8622764B2 (en) * 2011-02-09 2014-01-07 Intel Corporation Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
KR101419364B1 (en) 2012-09-11 2014-07-16 주식회사 아이에스시 Insert for handler
KR101860792B1 (en) 2018-02-28 2018-05-25 (주)퀀텀테크 Socket for testing semiconductor

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2152300A (en) * 1983-12-27 1985-07-31 Itt Zero-insertion force electrical connector
GB2229050A (en) * 1987-12-21 1990-09-12 Wells Electronics Electrical socket for securing component leads
EP0457443A2 (en) * 1990-05-14 1991-11-21 Yamaichi Electronics Co., Ltd. Connector
EP0503810A2 (en) * 1991-03-15 1992-09-16 Yamaichi Electronics Co., Ltd. Connector for leadless IC package
EP0527578A1 (en) * 1991-08-13 1993-02-17 Yamaichi Electronics Co., Ltd. Connector for electric part
GB2274212A (en) * 1992-12-25 1994-07-13 Yamaichi Electronics Co Ltd Sockets for testing I.C. packages
EP0613335A1 (en) * 1993-02-24 1994-08-31 Texas Instruments Incorporated Socket apparatus for IC package testing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4420205A (en) * 1981-09-14 1983-12-13 Augat Inc. Low insertion force electronic component socket
US4739257A (en) * 1985-06-06 1988-04-19 Automated Electronic Technology, Inc. Testsite system
US5073117A (en) * 1989-03-30 1991-12-17 Texas Instruments Incorporated Flip-chip test socket adaptor and method
US5281160A (en) * 1991-11-07 1994-01-25 Burndy Corporation Zero disengagement force connector with wiping insertion
US5247250A (en) * 1992-03-27 1993-09-21 Minnesota Mining And Manufacturing Company Integrated circuit test socket
US5291062A (en) * 1993-03-01 1994-03-01 Motorola, Inc. Area array semiconductor device having a lid with functional contacts

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2152300A (en) * 1983-12-27 1985-07-31 Itt Zero-insertion force electrical connector
GB2229050A (en) * 1987-12-21 1990-09-12 Wells Electronics Electrical socket for securing component leads
EP0457443A2 (en) * 1990-05-14 1991-11-21 Yamaichi Electronics Co., Ltd. Connector
EP0503810A2 (en) * 1991-03-15 1992-09-16 Yamaichi Electronics Co., Ltd. Connector for leadless IC package
EP0527578A1 (en) * 1991-08-13 1993-02-17 Yamaichi Electronics Co., Ltd. Connector for electric part
GB2274212A (en) * 1992-12-25 1994-07-13 Yamaichi Electronics Co Ltd Sockets for testing I.C. packages
EP0613335A1 (en) * 1993-02-24 1994-08-31 Texas Instruments Incorporated Socket apparatus for IC package testing

Also Published As

Publication number Publication date
JP3862303B2 (en) 2006-12-27
GB9509228D0 (en) 1995-06-28
DE19521137A1 (en) 1995-12-14
JP2007108179A (en) 2007-04-26
GB2290176A (en) 1995-12-13
JP4156002B2 (en) 2008-09-24
FR2721145A1 (en) 1995-12-15
USRE39418E1 (en) 2006-12-05
JPH0850975A (en) 1996-02-20
JP2004309496A (en) 2004-11-04
JP4170259B2 (en) 2008-10-22

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990505