KR200171480Y1 - Device heat protection apparatus for semiconductor device tester - Google Patents

Abstract

The present invention relates to an element heat dissipation device of a semiconductor device inspector that emits a large amount of heat generated instantaneously from an element when inspecting electrical characteristics of a manufactured device in a test part of a handler. It is to maximize the area of the heat radiation member.

To this end, in the test section of the device inspector configured to connect the lead 3a of the device 3 suspended from the carrier module 10 to the socket pin 4 as the lifting plate 11 descends, the lifting plate 11. The guide block 12 is fixed to the), the pusher 14 is elastically installed by the elastic member 15 so as to be able to lift and lower the guide block, and the pusher is coupled to the pusher, so as to lift and lower the lifting plate by its own weight It consists of the 1st heat radiation member 18 connected with the upper surface of an element.

Description

Device radiator of semiconductor device tester

The present invention relates to a device heat dissipation device of a semiconductor device inspector that emits a lot of instantaneous heat generated from the device to the outside when inspecting the electrical characteristics of the manufactured device in the test section of the handler. The upper surface of the device is to maximize the area of the heat radiation member is connected.

In recent years, the thickness of semiconductor devices has gradually become thinner according to the trend of lighter and shorter parts, and a representative one of them is a thin small outline package (TSOP).

The TSOP has a thickness of about 1 mm, and when the impact is applied to the upper or lower surface due to carelessness or the like during the test process for inspecting the electrical characteristics of the device manufactured in the manufacturing process, the characteristics of the device are deteriorated and the impact is applied. In extreme cases, the molded chip is broken, so care must be taken not to impact the device during transfer or testing within the handler.

In addition, since the high temperature heat is generated in the center of the device (where the chip is located) during the test, there is a concern that the electrical characteristics may be changed. Since a problem that needs to be implemented again occurs, a means for rapidly dissipating high temperature heat generated from the device during the test must be devised.

1A to 2B are longitudinal cross-sectional views for explaining the operation of the conventional apparatus, in which a pusher 2 made of metal is fixed to the lifting plate 1, and the leads 3a of the element 3 are socketed on both sides of the pusher. Sapphire (5) is pressed to the pin (4) side is fixed, the upper side of the pusher (2) a plurality of heat dissipation fin (6) made of stainless (SUS) material for heat dissipating heat generated from the device to the outside Is formed.

Therefore, when the element 3 is loaded in the cavity 7a of the carrier module 7 and moved to the upper portion of the socket 8 as shown in FIGS. 1A and 1B, the socket 8 rises and the lifting plate (1) is lowered by the lifting means as shown in Figs. 2A and 2B.

Accordingly, when the sapphire 5 fixed to both sides of the pusher 2 presses the lead 3a of the element 3, the lead 3a of the element is closely connected while deforming the socket pin 4, so that the electrical Characteristic inspection becomes possible.

In the above operation, the guide pin 9 fixed to the elevating plate 1 is inserted into the guide hole 7b formed in the carrier module 7 to position the sapphire 5 so that the lead of the element 3 can be positioned. Press (3a) correctly.

However, this conventional apparatus has the following problems.

First, the bottom surface of the pusher 2 must be closely connected to the top surface of the element 3, so that heat transfer for heat dissipation is made to the heat dissipation fin 6 side, but the lead 3a of the element 3 is not allowed to contact the socket pin 4. At this time, since the sapphire 5 is connected to the lead 3a, the upper surface of the element cannot be closely connected to the bottom surface of the pusher 2.

In other words, when the bottom surface of the pusher 2 is configured to be connected to the top surface of the device 3, the pusher may pressurize the device to damage the device, and the high temperature heat generated by the device during the test may be quickly transmitted to the outside. Since it is impossible to dissipate heat, the quality of the product is frequently judged to be defective. Therefore, the retesting of the device determined to be defective is required to be repeated.

Second, when the pusher 2 is precisely processed and the bottom surface of the pusher is closely connected to the top surface of the device 3, the heat transfer path is long with the heat dissipation fin 6 formed on the top of the device and the pusher, and stainless steel has a relatively low heat transfer rate. The heat radiation efficiency was reduced.

Third, since it is determined that the defective device 3 produced through various processes is a defective product, the yield is lowered.

The present invention devised to solve such a problem in the prior art, the heat dissipation member is configured to be directly connected to the upper surface of the device when the lead and the socket pin of the device is electrically connected to the heat generated during the test to the outside quickly Its purpose is to enable heat dissipation.

According to an aspect of the present invention for achieving the above object, in the test section of the device inspector configured to be connected to the socket pin of the lead of the element suspended on the carrier module as the lifting plate is lowered, the guide block fixed to the lifting plate, and Element heat dissipation of a semiconductor device inspector comprising a pusher elastically installed by an elastic member so as to elevate the guide block, and a first heat dissipation member coupled to the pusher so as to be movable up and down and connected to the upper surface of the device by its own weight when the lifting plate descends. An apparatus is provided.

1A to 2B are longitudinal cross-sectional views for explaining the operation of the conventional apparatus.

1A and 1B are diagrams illustrating a state in which a device is loaded in a carrier module

2a and 2b is a state in which the pusher is lowered to contact the lead of the device to the socket pin

3 is an exploded perspective view showing the main part of the present invention

4a and 4b is a longitudinal cross-sectional view for explaining the operation of the present invention,

4A is a state diagram in which a device is loaded in a carrier module

4B is a state in which the pusher is lowered to contact the lead of the device to the socket pin

Explanation of symbols for main parts of the drawings

10 carrier module 12 guide block

14 pusher 18 first heat dissipation member

20: second heat dissipation member 20b: heat dissipation fin

Hereinafter, the present invention will be described in more detail with reference to FIGS. 3 to 4B showing one embodiment as follows.

Figure 3 is an exploded perspective view showing the main portion of the present invention and Figures 4a and 4b is a longitudinal cross-sectional view for explaining the operation of the present invention, the carrier module 10 applied to the present invention is a cavity (cavity) (10a) formed on the bottom In the patent application No. 60,662 filed by the applicant in 1996 as a type (type) in which the element (3) is suspended in the process between, the detailed structure and description thereof will be omitted.

According to the present invention, the guide block 12 is fixed to the elevating plate 11 by the bolt 13 and the pusher 14 is elastically installed by the elastic member 15 such as a coil spring so that the pusher 14 can be lifted and lowered. In this case, the pusher 14 is not separated from the guide block 12 by the support piece 17 fixed to the pusher.

The pusher 14 elastically installed in the guide block 12 has a first heat dissipation member 18 connected to an upper surface of the element 3 by its own weight during a test to be lifted and pulled up and coupled to the first heat dissipation member ( On the upper side of 18), a stopper 19 is fixed to prevent the first heat dissipation member 18 from being pushed out of the pusher 14 when the elevating plate 11 is located at the top dead center.

The reason why the first heat dissipation member 18 is installed in the pusher 14 in such a way as to be able to move up and down is that the pusher 14 is lowered to be connected to the upper surface of the device 3 to check the electrical characteristics of the device. This is to prevent the phenomenon that the impact is applied to the upper surface of the element 3 by the first heat radiation member 18 in advance.

In order to more quickly dissipate the high temperature generated in the center of the device 3 to the outside during the test, in the present invention, the first heat dissipation member 18 is formed with a through hole 20a formed in the center so as to be exposed to the inside of the cavity 10a. 2 The heat dissipation member 20 is fixed in the recess 10b of the carrier module 20 so that the bottom surface is exposed to the inside of the cavity 10a and the heat dissipation fin 20b formed at the top thereof is exposed to the outside.

The material of the first and second heat dissipation members 18 and 20 applied to the present invention is aluminum (Al) having good thermal conductivity and relatively low cost.

Referring to the operation of the present invention configured as described above are as follows.

First, in the state in which the elevating plate 11 is located at the top dead center, the pusher 14 is pulled out downward by the elastic member 15 to the maximum, and the first heat dissipation member coupled to the pusher 14 so as to be lifted and lowered ( 18) is withdrawn as far down as possible by its own weight.

In this state, when the element 3 for the performance inspection is loaded on the bottom surface of the carrier module 10, the top surface of the device is in close contact with the bottom surface of the second heat dissipation member 20 fixed to expose the inside of the cavity 10a. do.

In this state, when the carrier provided with the plurality of carrier modules 10 reaches the upper portion of the socket which is the test point as shown in FIG. 4A, the lifting plate (3) for contacting the lead 3a of the element 3 to the socket pin 4 is provided. 11) will fall.

When the elevating plate 11 descends as described above, the carrier module is lowered while the bottom surface of the pusher 14 is connected to the top surface of the carrier module 10, so that the bottom surface of the carrier module is connected to the top surface of the socket 8.

If the elevating plate 11 continues to descend in this state, the elastic member 15 provided between the guide block 12 and the pusher 14 is compressed, so that the first heat dissipation member 18 installed in the pusher is exposed downward. The upper surface of the element 3 is smoothly connected by its own weight.

If the bottom surface of the pusher 14 is connected to the upper surface of the second heat dissipation member 20 and the lifting plate continues to descend while the first heat dissipation member 18 is connected to the upper surface of the element 3, the elastic member 15 Pusher 14 is elastically installed by the pressing the carrier module 10 toward the socket 8 side, so that the lead 3a and the socket pin 4 of the element 3 is elastically connected as shown in FIG. This makes it possible to inspect the electrical characteristics of the device.

At this time, the elastic member provided between the guide block 12 and the pusher 14 even if the elevating plate 11 is lowered more than the set amount so that the lead 3a of the element 3 is more closely connected with the socket pin 4. As the 15 is compressed, the pusher 14 no longer descends.

High temperature generated when high temperature heat is generated in the center of the device when conducting electrical characteristic inspection of the device while the lead 3a of the device 3 is closely connected to the socket pin 4 by the above operation. The heat is rapidly radiated to the outside through the heat dissipation fins 20b of the first heat dissipation member 18 connected to the center of the upper surface and the second heat dissipation member 20 connected to the outer circumferential surface.

As described above, the present invention has the following advantages.

First, the first and second heat dissipation members 18 and 20 having good thermal conductivity are connected to the upper surface of the device when inspecting the electrical characteristics of the device 3 to quickly dissipate the high temperature heat generated during the test to the outside. As a result, the performance of the device can be accurately determined by a single test, thereby eliminating the need to repeat the device retest, thereby improving productivity.

Second, since heat transfer paths of the first and second heat dissipation members 18 and 20 are minimized, heat dissipation efficiency is maximized.

Third, as compared with the conventional apparatus, the possibility of judging a good device as a defective product is significantly reduced, so that the yield is improved.

Fourth, since the external force is not applied to the center of the device 3 when the test is performed, it is possible to prevent the phenomenon that the electrical characteristics change.

Claims (3)

As the lifting plate 11 descends, the lid 3a of the element 3 suspended from the carrier module 10 is fixed to the lifting plate 11 in the test section of the device inspector configured to be connected to the socket pin 4. The guide block 12, the pusher 14 elastically installed by the elastic member 15 so as to be lifted and lowered to the guide block, and coupled to the pusher so as to be able to lift and lower the lifting plate. And a first heat dissipation member (18) connected to each other. The method of claim 1, A through hole 20a is formed in the center to expose the first heat dissipation member 18 to the inside of the cavity 10a, and a bottom surface thereof is exposed to the inside of the cavity, and the heat dissipation fin 20b formed on the upper portion is exposed to the outside. An element heat dissipation device of a semiconductor device inspector, wherein the heat dissipation member 20 is fixed in the recessed groove 10b of the carrier module. The method according to claim 1 or 2, The first and second heat dissipation members (18) (20) is an element heat dissipation device of a semiconductor device inspector is made of aluminum having good thermal conductivity.