JP2018029040A - Socket for electrical component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electrical component in which the height of a pressing member can be adjusted according to the thickness of an electrical component to be evaluated and the adjustment means ensures a space in a cover part.SOLUTION: In an IC socket 100, a slidable sliding member 70 is provided between a cover body 40 of a cover 30 and a pressing member 50. The relative position of the cover body 40 and the pressing member 50 is adjusted in a manner that the sliding member 70 is slid, and the pressing height of the pressing member 50 is adjusted.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a socket for an electric component that is disposed on a wiring board and accommodates the electric component in order to test an electric component such as a semiconductor device (hereinafter referred to as “IC package”).

  Conventionally, as a socket for an electrical component, a base module (for example, a socket body) that accommodates an electrical component (for example, a semiconductor device, an IC package, etc.) and a base module are closed so that the base module can be rotated. There has been proposed a cover including a cover, a base module, and a lock mechanism for fixing the cover and pressing an electrical component.

  In this electrical component socket, after the electrical component is received in the base module, the cover is closed and locked to the base module, so that the terminal of the electrical component is placed on the contact pin disposed on the base module with a predetermined pressing force. This electrical component can be evaluated by making contact.

  Depending on the type of this electrical component, the length in the pressing direction of the electrical component (thickness of the electrical component) may differ, and the electrical component cannot be pressed properly depending on the height position of the pressing surface of the cover that presses the electrical component. There is a case. Therefore, there are cases where the contact pins arranged on the base module and the terminals of the electrical components cannot be properly contacted. Therefore, even if the electrical components have different heights, it is important to appropriately contact the contact pins and the electrical component terminals by pressing the cover.

  Here, as a conventional technique, a technique is known in which an operation lever that is rotatable about a rotation shaft and has an eccentric cam is provided on a side surface of a cover. By rotating this operation lever, the pressing member of the cover presses the electric component (see, for example, Patent Document 1). A method of evaluating a plurality of electric parts having different thicknesses by allowing a plurality of heights of the pressing member to be set by the operation lever having the eccentric cam can be considered.

  When an electrical component having a different thickness is evaluated using the electrical component socket, the standby position of the operation lever is selected and rotated so that the height of the pressing member is suitable for the height of the electrical component. Thus, the electronic component is pressed with an appropriate pressing force, and the terminals of the electrical component and the contact pins disposed on the base module can be appropriately brought into contact with each other.

Japanese Patent Application No. 2015-125984

  However, in the socket for electric parts provided with the operation lever having the eccentric cam described in Patent Document 1, the eccentric cam and the operation lever are provided, so that the side portion of the cover takes up space. Therefore, in the case where a heat sink is provided on the pressing member of the cover, the arrangement area of the heat sink is reduced, and it may be difficult to dissipate the electrical components.

  Therefore, the present invention can evaluate electric parts having different thicknesses and can secure a cover arrangement area even if a member to be operated for adjusting the height of the pressing member is provided. It is an object to provide a socket for electrical parts.

  In view of the above problems, the invention according to claim 1 is an electrical component socket that is disposed on a wiring board and accommodates an electrical component having a terminal, and is disposed on the wiring substrate. A socket body that accommodates the electrical component; and a cover that is pivotally provided on the socket body. The cover includes a cover body that is pivotally provided on the socket body, and a cover that is closed. A pressure member that sometimes presses the electrical component; and a slide member that is slidably provided between the cover body and the pressure member, and the cover body and the pressure member are slid by sliding the slide member. A position adjusting means for adjusting a relative position of the cover main body and the pressing member in a direction in which the members oppose each other is provided.

  According to a second aspect of the present invention, in addition to the configuration of the first aspect, the position adjusting means is rotatably held by the slide member, and is a rolling member that rolls on the pressing member. And a first part and a second part that are provided on the pressing member and have different heights in the direction in which the cover main body and the pressing member face each other, the sliding member is slid, and the rolling member is The position of the pressing member is adjusted by riding on the first part or the second part.

  According to a third aspect of the invention, in addition to the configuration of the first or second aspect, the slide member is formed in a substantially U-shaped plate shape, and the substantially U-shaped plate members are opposed to each other. A plurality of rolling members of the position adjusting means are respectively held on both sides of the plate.

  Furthermore, in the invention according to claim 4, in addition to the structure according to any one of claims 1 to 3, the height of the first part is lower than the second part, and the first part and the second part A protrusion higher than the surface of the second part is provided at a position between.

  According to a fifth aspect of the present invention, in addition to the configuration according to any one of the first to fourth aspects, the cover body includes a rotating member and a pressing member that are rotatably provided on the socket body. An elastic member for biasing the pressing member is provided between the rotating member and the interposed member.

  According to the first aspect of the invention, the electrical component socket can secure the cover installation area more than when the operating lever having the eccentric cam is provided by the slide member. When the heat sink is provided, it is possible to increase the arrangement area as compared with the conventional one.

  According to the second aspect of the present invention, when the height of the pressing member is adjusted, the rolling member includes a high part and a low part (first part or second part) provided in the pressing member. By being able to roll between and move, the slide member can be stably slid.

  Furthermore, according to the invention described in claim 3, it is formed of a substantially U-shaped plate material, and a plurality of rolling members are respectively held on both of the opposing plate sides of the plate material. As a result, the slide member is held between the cover body and the pressing member at both sides of the plate side, and each rolling member moves between the first part and the second part, so that it is stable. And slide smoothly.

  According to the invention of claim 4, the protrusion provided at a position between the first part and the second part has the rolling member on the surface of the second part that is higher than the first part. Try to stop it. Therefore, while the electrical component is being evaluated, if the force is not applied to slide the sliding member, the rolling member can be prevented from inadvertently moving to another part. Contact failure of the provided wiring board can be prevented.

  Furthermore, according to the fifth aspect of the present invention, when an excessive pressing force is applied by pressing the electrical component, the elastic member provided between the rotating member and the interposition member of the cover main body causes the elasticity. Since the interposition member moves in the height direction to escape upward against the biasing force of the member, it is possible to make the pressing force to the electrical component appropriate.

It is a perspective view of the state which opened the cover and the lock lever of the socket for electrical components which concerns on embodiment of this invention, and opened the socket main body. It is a perspective view of the state where the socket main part of the socket for electric parts concerning the embodiment was closed with a cover and a lock lever. It is an exploded view of the cover concerning the embodiment. In the electrical component socket according to the embodiment, (a) is a plan view of the electrical component socket when the rolling member is positioned at the first portion of the pressing member, and (b) is the rolling member is the first. It is a top view of the socket for electrical components when located in 2 parts. In the electrical component socket according to the embodiment, (a) is a plan view showing the position of the slide member when the rolling member is located at the first portion of the pressing member, and (b) is the rolling member. It is a top view which shows the position of a slide member when it is located in the 2nd site | part of a press member. 4A is a cross-sectional view taken along the line AA of the electrical component socket in the state of FIG. 4A, and FIG. 4B is an electrical component socket in the state of FIG. It is sectional drawing by CC line | wire. 4A is a cross-sectional view of the electrical component socket in the state shown in FIG. 4A, taken along line B-B, and FIG. 4B is an electrical component socket in the state shown in FIG. It is sectional drawing by DD line.

  Embodiments of the present invention will be described below.

  1 to 7 show an embodiment of the present invention.

  The IC socket 100 as the “electrical component socket” according to this embodiment is arranged on the wiring board 2 as shown in FIGS. Further, the IC package 1 as an “electrical component” is accommodated, and the electrodes of the wiring board 2 and the terminals of the IC package 1 are electrically connected. For example, it is used for a burn-in test of the IC package 1 or the like.

  The IC package 1 of this embodiment has a rectangular shape in plan view, and has a package main body having a predetermined thickness. A plurality of spherical terminals protrude in a matrix shape on the lower surface of the package main body. ing.

  On the other hand, the IC socket 100 is fixed to the wiring board 2 as shown in FIGS. 7A and 7B, and as shown in FIG. 1, the socket body 10 that houses the IC package 1, and the socket body 10. Is provided so as to be rotatable about a shaft 17, and is provided so as to be rotatable about a shaft 30 provided on the socket body 10 and a cover 30 that opens and closes a floating plate 16 to be described later and presses the IC package 1. And a lock mechanism 20 that presses and fixes the cover 30 that is closed when it is rotated downward.

  As shown in FIG. 1, the socket body 10 includes a frame member 13 formed in a substantially square shape and a contact pin arrangement unit 11 provided inside the frame member 13. As shown in FIGS. 7A and 7B, the contact pin arrangement unit 11 holds the IC package 1 in a state where it is biased to the upper side of the upper plate 14, the lower plate 15, and the upper plate 14. And a floating plate 16 as an “accommodating portion”.

  In addition, although not shown in the drawing, contact is made with a plurality of upper through holes provided in the upper plate 14, a lower through hole provided in the lower plate 15, and a plurality of through holes provided in the floating plate 16. Pins are inserted and held, whereby a plurality of contact pins are arranged in a matrix. The contact pins are in contact with the lower surfaces of the terminals of the IC package 1 and are electrically connected to the electrodes of the wiring board 2.

  Further, as shown in FIG. 1, the socket body 10 is provided with a shaft 17 provided at an edge portion of the frame member 13 for rotating the cover 30, and an edge facing the shaft 17. The part is provided with a shaft 18 for rotating a lock lever 22 of a lock mechanism 20 described later. Further, the socket body 10 is provided with a locking portion 12 that locks the lock lever 22 by locking a locked portion 23 provided on a lock lever 22 of the lock mechanism 20 described later on the side of the shaft 17. It has been.

  On the other hand, as shown in FIG. 3, the cover 30 is provided with a cover body 40 that is rotatably provided on the socket body 10, and a pressing member 50 that is provided on the lower side of the cover body 40 and presses the IC package 1. The slide member 70 slidably provided between the cover main body 40 and the pressing member 50 and the slide member 70 are slid to adjust the relative positions of the cover main body 40 and the pressing member 50 in the height direction. The position adjusting means 90 is configured to adjust the height of the pressing member 50.

  As shown in FIG. 3, the cover main body 40 includes a rotation member 41 and an interposition member 42.

  The rotating member 41 is formed of a substantially rectangular frame. The rotation member 41 is provided with a shaft insertion hole (not shown), and the shaft 17 of the socket body 10 is inserted and held in the shaft insertion hole. 41 is configured to be rotatable. Furthermore, an engaged portion 91 that is engaged with a latch portion 25 of the lock mechanism 20 to be described later is provided on an edge portion of the rotating member 41 that faces the edge portion of the rotating portion.

  In addition, the interposition member 42 is formed of a substantially rectangular frame and is attached below the rotating member 41.

  Further, as shown in FIGS. 6A and 6B, the rotating member 41 is provided with a plurality of cylindrical recesses 48 in the rotating member 41, and the interposed member 42 includes As shown in FIGS. 6A and 6B, a plurality of cylindrical recesses 49 are provided. As shown in FIGS. 6 (a) and 6 (b), a coil spring 47 is disposed inside the opposing recesses 48 and 49, and as shown in FIGS. 3 and 6 (a) and 6 (b), The guide pin 44 is inserted into the insertion hole 93 of the rotating member 41 from the insertion hole 45 of the interposed member 42, and the interposed member 42 is attached to the rotating member 41 so as to be movable up and down.

  On the other hand, as shown in FIG. 3, the pressing member 50 is formed by a substantially rectangular parallelepiped box 62 and a plate-like flange 61 having a larger area than the outer periphery of the box 62. As shown in FIGS. 1 to 3 and the like, the box 62 is provided with a fin-shaped heat sink 54 that dissipates heat generated by the IC package 1 that is in electrical contact with the electrodes of the wiring board 2. . Further, as shown in FIG. 1, a pressing portion 58 that presses the IC package 1 is provided at the center of the back surface of the flange portion 61, which is formed by a substantially rectangular parallelepiped convex portion.

  As shown in FIG. 3 and FIGS. 6A and 6B, the flange portion 61 is formed with a concave portion, and a rolling member 72 held by a slide member 70 described later is used for rolling. A moving portion 60 is provided, and a first portion 51 having a low height surface and a second portion 52 having a high height surface are provided inside the rolling portion 60.

  Further, at the position between the first part 51 and the second part 52, as shown in FIGS. 3, 6A and 6B, a protrusion 57 having a height higher than the surface of the second part 52 is provided. Is provided.

  On the other hand, as shown in FIG. 3, the slide member 70 is formed in a substantially U shape by a plate material. The inner frame is configured to be larger than the outer periphery of the box 62 of the pressing member 50. Two holes 75 are provided in each of the opposing plate sides 79 of the substantially U-shaped slide member 70, and a cylindrical rolling member 72 is rotatably held in these holes 75, respectively. Yes. Further, one central portion 80 of each of the plate sides 79 is provided with one knob 80 extending outwardly of the cover 30 and further upward. When the slide member 70 is slid by holding the knob 80, the rolling member 72 rolls on the rolling portion 60 of the pressing member 50, and the slide member 70 is moved to FIGS. 4 (a) and 5 (a). It is configured to slide to the left as shown in FIG. 4 and to the right as shown in FIGS. 4B and 5B.

  When the slide member 70 is slid to the left as shown in FIG. 5A, the rolling member 72 is positioned on the surface of the first portion 51 of the pressing member 50 as shown in FIG. As shown in FIG. 7A, the relative position between the pressing member 50 and the cover main body 40 can be adjusted to adjust the height H1 of the pressing portion 58. When the slide member 70 is slid to the right as shown in FIG. 5B, the rolling member 72 is positioned on the surface of the second portion 52 as shown in FIG. ), The height H2 of the pressing portion 58 can be adjusted.

  Thus, the position adjustment means 90 of the height of the pressing member 50 is comprised by these rolling members 72 and the 1st site | part 51 and the 2nd site | part 52 of the rolling part 60. FIG.

  Further, in the vicinity of the base of the plate side 79 of the slide member 70, as shown in FIG. 3 and FIGS. 6A and 6B, a substantially gourd-shaped positioning hole for inserting the tip end portion of the positioning pin 71 is provided. 74 is provided. After the positioning pin 71 is pulled out from the positioning hole 74 and the slide member 70 is slid to the left and right, the slide pin 70 is moved to an arbitrary position and fixed by inserting the positioning pin 71 into the positioning hole 74 again. It is configured to be able to.

  On the other hand, in order to insert the positioning pin 71, a circular insertion hole 77 is provided in the vicinity of the engaged portion 91 of the rotating member 41 as shown in FIG. A circular insertion hole 78 is provided in the vicinity of 49.

  Then, as shown in FIGS. 6A and 6B, the positioning pin 71 is inserted from the top of the insertion hole 77 in the order of the insertion hole 78 and the positioning hole 74. Further, as shown in FIG. 6A or 6B, a stopper 81 is provided at the insertion portion of the positioning pin 71, and a coil spring 46 is disposed between the stopper 81 and the rotating member 41. Accordingly, the positioning pin 71 is configured to move in a direction opposite to the direction in which the positioning pin 71 is pulled out.

  As shown in FIG. 3, the slide member 70 is provided with a long hole 76 for inserting the guide pin 55. The long hole 76 is configured such that the slide member 70 can slide when the guide pin 55 is inserted.

  On the other hand, as shown in FIG. 3, the pressing member 50 is provided with a circular insertion hole 56 for inserting the guide pin 55, and the interposition member 42 of the cover main body 40 has a circular insertion hole 56. ) And (b), an insertion hole 59 is provided for inserting and locking the tip of the guide pin 55. Then, the guide pin 55 is inserted into the elongated hole 76 of the slide member 70 and the insertion hole 59 of the interposition member 42 from below the insertion hole 56 of the pressing member 50 and locked, so that the pressing member 50 is used as the cover 30. The slide member 70 and the cover main body 40 are integrated.

  Moreover, the lock mechanism 20 has the latch part 25 which engages the to-be-engaged part 91 of the lock lever 22 and the rotation member 41, as shown in FIG.1 and FIG.2. The lock lever 22 is formed of a substantially rectangular frame larger than the outer periphery of the cover 30 and is provided on the socket body 10 so as to be rotatable about the shaft 18. The lock lever 22 is provided with a locked portion 23 that is locked to the locking portion 12 of the socket body 10.

  Thereby, the cover 30 is rotated downward to close the socket body 10, and the engaged portion 91 of the rotating member 41 is engaged with the latch portion 25. Then, by rotating the lock lever 22 downward, the latch portion 25 moves downward to push the engaged portion 91, and the IC package in which the pressing portion 58 of the pressing member 50 is housed in the socket body 10. It is comprised so that 1 may be pressed. In this state, the locked portion 23 of the lock lever 22 is locked and fixed to the locking portion 12 of the socket body 10.

  The evaluation procedure of the IC package 1 using the IC socket 100 according to this embodiment will be described separately for a case where the thickness is thick and a case where the thickness is thin.

  First, when the IC package 1 to be evaluated is thick, the positioning pin 71 is pulled up to make the slide member 70 slidable, the knob 80 is picked up and moved to the left, and the slide member 70 is moved as shown in FIG. Slide to the left. And the rolling member 72 rolls on the rolling part 60 of the pressing member 50, and moves to the surface of the 1st site | part 51 with low height, as shown to Fig.6 (a).

  Further, the IC package 1 is accommodated on the floating plate 16 provided in the socket body 10 of the IC socket 100.

  Then, the cover 30 is rotated downward to close the socket body 10, and the engaged portion 91 is engaged by the latch portion 25. Thereafter, the lock lever 22 is rotated downward, the latch portion 25 is moved downward, and the cover 30 is pushed in. As a result, the pressing portion 58 presses the IC package 1. In this state, the locked portion 23 of the lock lever 22 is locked to the locking portion 12 of the socket body 10 to fix the lock lever 22. .

  At this time, the height of the pressing portion 58 of the pressing member 50 is adjusted to the height H1 as shown in FIG. Therefore, it is possible to obtain a predetermined pushing amount suitable for the thickness of the IC package 1. Then, the IC package 1 can be appropriately pressed through the pressing member 50, and the contact pressure between the terminals of the IC package 1 and the contact pins can be ensured. In this state, the IC package 1 is energized for evaluation.

  On the other hand, when the IC package 1 to be evaluated is thin, first, the positioning pin 71 is pulled up so that the slide member 70 can be slid, the knob 80 is picked up and moved to the right, as shown in FIG. Slide the slide member 70 to the right. Thereby, the rolling member 72 rolls on the rolling part 60 of the pressing member 50 and moves to the surface of the second portion 52 having a high height, as shown in FIG.

  Then, the IC package 1 is pressed in the same procedure as when the IC package 1 is thin.

  At this time, the height of the pressing portion 58 of the pressing member 50 is adjusted to the height H2, as shown in FIG. Therefore, it can be adjusted to a predetermined pressing amount suitable for the thickness of the IC package 1, and the contact pressure between the terminals of the IC package 1 and the contact pins provided on the floating plate 16 can be ensured. In this state, the IC package 1 is energized for evaluation.

  At this time, the slide member 70 can secure the location of the cover 30 than the IC socket provided with the operation lever having the eccentric cam, and the area of the heat sink 54 provided on the pressing member 50 is increased. be able to.

  When the thin IC package 1 is evaluated by energization, the rolling member 72 is held on the surface of the second portion 52 by the projection 57 higher than the surface of the second portion 52 of the pressing member 50. Therefore, the rolling member 72 is inadvertently rolled from the surface of the second portion 52 having a high height to the surface of the first portion 51 having a low height without applying a force to slide the slide member 70. The height of the pressing portion 58 of the pressing member 50 can be prevented from changing.

  Furthermore, in this embodiment, when the slide member 70 is slid, the slide member 70 is moved from the first portion 51 having a low height by the rolling member 72 rolling the rolling portion 60. It can ride on the low 2nd site | part 52, and can be made to slide smoothly.

  Further, since the slide member 70 is formed of a substantially U-shaped plate material, the slide member 70 is held between the cover body 40 and the pressing member 50 at both portions of the substantially U-shaped opposing plate sides 79. Moreover, since the two rolling members 72 respectively provided on both plate sides 79 roll, they can slide stably in parallel.

  Furthermore, in this embodiment, when the IC package 1 is pressed, it is attached by the coil spring 47 provided in the inside of the recesses 48 and 49 of the rotating member 41 of the cover main body 40 and the interposed member 42. The interposition member 42 can move upward against the force. Therefore, the pressing amount of the IC package 1 can be made appropriate, and the terminals of the IC package 1 and the contact pins can be appropriately pressed.

  In this embodiment, the position adjusting means 90 is such that the rolling member 72 is provided on either the surface of the first portion 51 of the pressing member 50 or the surface of the second portion 52 having a height different from that of the first portion 51. It is comprised so that the height of the press part 58 may be adjusted by being rolled and located.

  However, the present invention is not limited to the above-described configuration. For example, in the embodiment, the pressing member 50 is provided with the rolling portion 60, and the first portion 51 and the second portion 52 having different heights are formed inside the rolling portion 60. Instead of the provided configuration, there may be a rolling part of the rolling member 72 on the lower surface of the cover body 40, and two parts having different heights may be provided on the rolling part. In addition, the pressing member 50 is provided with a recess capable of rotatably holding the rolling member 72, the slide member 70 is provided with a rolling portion where the rolling member 72 rolls, and the height of the rolling portion is different. May be provided.

  Further, in this embodiment, the rolling member 72 is provided as one of the configurations of the position adjusting means 90. However, instead of the rolling member 72, the slide member 70 is provided with a first height higher than the surface of the first portion 51. A movable protrusion may be provided on the surface of the two parts 52.

  Moreover, although the 1st site | part 51 and the 2nd site | part 52 which differ in height in the height direction are provided in the pressing member 50 in the rolling part 60, height differs from the 1st site | part 51 and the 2nd site | part 52. A plurality of parts may be further provided. When this configuration is adopted, the position of the pressing height of the pressing member 50 that matches the height of the IC package 1 can be set, and the IC package 1 can be pressed through the pressing member 50 with an appropriate pressing force. Is possible.

  Furthermore, the pressing member 50 is provided with a step formed by the first portion 51 and the second portion 52 inside the rolling portion 60, but the height is not limited to the shape of the step. The part should just be formed, for example, it is a slope and the processus | protrusion which fastens the rolling member 72 there may be provided.

  In this embodiment, the slide member 70 is formed of a substantially U-shaped plate member 73, but may be a substantially U-shaped bar member, a substantially rectangular frame member, or the like. Further, the slide member 70 is provided with a hole 75 in order to hold the rolling member 72 in a rotatable manner, but may be a concave portion in which the rolling member 72 can be held in a rotatable manner.

  Furthermore, in this embodiment, the coil spring 47 is provided inside the recesses 48 and 49 of the rotating member 41 and the interposition member 32, but a rubber member may be provided instead.

  In this embodiment, one type of IC package is evaluated, but a plurality of types of IC packages can be evaluated simultaneously.

  Furthermore, in the above-described embodiment, the present invention is applied to the IC socket 100 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices.

  Moreover, each said embodiment is an illustration of this invention, and it cannot be overemphasized that this invention is not meant to be limited only to each said embodiment.

1 …… IC package 10 …… Socket body 11 …… Floating plate 20 …… Lock mechanism 30 …… Cover 40 …… Cover body 41 …… Rotating member 42 …… Interposition member 47 …… Coil spring (elastic member)
50 …… Pressing member 51 …… First part 52 …… Second part 54 …… Heat sink 57 …… Protrusion between the first part and the second part 58 …… Pressing part 70 …… Sliding member 72 …… Rolling Member 90 ... Position adjusting means 100 ... IC socket

Claims (5)

An electrical component socket disposed on a wiring board and containing an electrical component having a terminal,
A socket body disposed on the wiring board and containing the electrical components; and a cover rotatably provided on the socket body;
The cover includes a cover main body rotatably provided on the socket main body,
A pressing member that presses the electrical component when the cover is closed;
A slide member slidably provided between the cover body and the pressing member;
And a position adjusting means for adjusting a relative position of the cover body and the pressing member in a direction in which the cover body and the pressing member face each other by sliding the slide member. Socket for electrical parts. The position adjusting means;
A rolling member that is rotatably held by the slide member and rolls on the pressing member, and a first portion that is provided on the pressing member and has different heights in the direction in which the cover body and the pressing member face each other. And a second part,
2. The electrical component according to claim 1, wherein the position of the pressing member is adjusted by sliding the sliding member and riding the rolling member on the first part or the second part. socket.   The slide member is formed of a substantially U-shaped plate material, and a plurality of the rolling members of the position adjusting means are respectively held on both opposite sides of the U-shaped plate material. The socket for electrical parts according to claim 1 or 2.   The height of the first part is lower than the second part, and a protrusion higher than the surface of the second part is provided at a position between the first part and the second part. The socket for electrical components according to any one of 1 to 3.   The cover main body includes a rotating member rotatably provided on the socket main body and an interposition member that presses the pressing member, and the pressing member is provided between the rotating member and the interposition member. 5. The electrical component socket according to claim 1, wherein an elastic member is provided.

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