JP2002043007A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket, capable of coping with a burn-in test or the problems such as small and slight contact pressure of a socket for packaging accompanying the tendency toward high densification for a semiconductor element, and a fine electrode, while being small-sized and simple in constitution. SOLUTION: This IC socket opens and closes pressure contact connection between an IC device mounted by vertical motion of a cover where an operating cam face is formed. A curved groove shaft guide part is provided on the cover, and a lateral groove is formed in the socket body. A connecting member where an engagement part with the operating cam face is formed on one side, and a connecting member formed on the other end side, is fitted to both of the shaft guide part of the cover and the long groove of the socket body, and is supported by shaft a integral with it. A pressing member having a pressing part is supported on an interlocking member by the integral shaft, and a spring resiliently pressing in the pressing direction is disposed between the pressing member and the linking member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection IC socket used as a jig for inspecting and mounting an IC device such as an IC package or an element, and more particularly to an IC socket such as an IC package or an element. The present invention relates to an IC socket that can be inserted into and removed from above a cover that is vertically movable on a socket, and that is connected to a circuit board by vertically moving the cover.

[0002]

2. Description of the Related Art Generally, a burn-in test is performed on an IC device after its manufacture. At this time, the IC device is mounted on an IC socket having a mounting table and heated under a predetermined condition to test electrical characteristics. .

In recent years, as an IC device, the density of a semiconductor element has been increased, and a BGA in which solder balls for connection are arranged in an array or matrix as electrodes.
(Ball Grid Array) or LGA (Land Grid A) without solder balls
(Rray) and the like, and further, a wafer (Wafer) and a CSP (Chip Size).
(Package) and the like are under development.
For these packages, etc., ICs for electrical characteristic inspection for testing the quality of these IC devices, such as high-precision positioning technology and precise application of delicate contact pressure to each electrode (contact). Sockets are needed.

Conventionally, as an IC socket for a leadless IC, an electrode (contact) of an IC device is placed on a free end of the pin using a contact pin in the socket and pressed to obtain the contact pressure. In order to maintain the pressed contact state, a holding cover is openably and closably attached to one end of the socket body, and the cover is closed and held by a lock member provided at the other end to hold the IC device and reduce the contact pressure. 2. Description of the Related Art There is known an IC socket of a press cover type having a configuration for securing it.

However, each time the IC is inserted into or removed from the socket, the presser cover must be opened and closed together with the operation of engaging and disengaging the lock member, and there is a problem that the working efficiency is significantly reduced. On the other hand, work automation is generally performed, but the configuration in which the presser cover is opened and closed together with the operation of engaging and disengaging the lock member has a problem that such automation cannot be easily accommodated. The presser cover that opens and closes with one end as a support shaft is
Because it is difficult to push vertically into the device, various sockets have been proposed in which the holding cover is doubled so that the inner cover acts to push vertically into the IC device. However, in this case, the mechanism becomes complicated, and there is also a problem in automation as well as a problem of high cost.

Further, a cover whose upper part is open is disposed on the socket body so as to be movable up and down, and the IC device is mounted on the IC device mounting base of the socket which can be connected to a circuit board. A so-called open-top type IC socket is also known, in which the IC device is mounted on an open part and releases the operating force on the cover to hold the IC device placed on the IC device mounting base and make a circuit connection. I have. Such open-top type IC
According to the socket, there is a feature that the IC device can be inserted and removed from above, and automation can be easily performed together with the cover operation.

[0007]

An open-top type IC socket suitable for a leadless IC is disclosed, for example, in Japanese Patent Application Laid-Open No. Sho 62-128463. In this socket, an IC device is mounted on a connector base provided with a large number of conductive contacts through the opening of a lid-shaped actuator member having an open top.
The above-mentioned I is provided by a latch arranged in a free floating state.
The device C is pressed and fixed. However, in the case of this socket, the IC mounted on the connector base
The device is pressed and fixed by a free-floating latch. The fixing mechanism is unstable, and there has been a problem that it is difficult to properly perform crimp connection with a fine connection contact.

Japanese Patent Application Laid-Open No. 8-185944 discloses that a mounted IC device is pressed by a holding lever, and
There is disclosed a socket having a configuration in which a pressing lever moves away when a device is inserted or removed. That is, in this socket, the holding lever extends laterally under the cover and is supported in a horizontal direction, and one end of the lever is link-coupled to the cover so as to move up and down following the up and down movement of the cover. Is moved up and down in the opposite direction with the up and down movement of the cover to press the upper surface of the IC device and
A device for holding the device, wherein when the cover is lowered, the holding lever slidably supported back and forth through the link connecting portion is moved so as to be separated from the IC device. It is.

In the case of such a socket, the holding lever of the IC device is supported under the cover so as to extend in the horizontal direction. Therefore, the size of the socket as the socket must be increased. When performing the burn-in test by mounting them individually, there is a problem that the sockets cannot be arranged in large numbers on the test circuit board and the test efficiency is poor, and the pressing force of the presser lever is pushed upward from the cover. Due to the resiliency of the moving spring, there is a problem that the crimping force with the fine connecting contact becomes unstable and the delicate crimping connection is not properly performed.

[0010] The present invention provides a recent increase in the density of semiconductor devices,
The object of the present invention is to solve the above-mentioned problems of the related art with respect to miniaturization of the contact pressure of a socket for a burn-in test or mounting, etc., due to the trend of miniaturization of electrodes, etc. An object of the present invention is to provide an IC socket which can appropriately cope with a small and delicate socket having a small contact pressure.

[0011]

In order to achieve the above object, an IC socket according to the present invention comprises an IC for mounting an IC device to be connected to an external circuit (mainly a test circuit).
A cover having an operating cam surface and an open top is mounted on a socket body disposed on a board of the external circuit so as to be vertically movable, and the IC is mounted according to the vertical movement of the cover. An IC that opens and closes a crimp connection between an IC device mounted on a table and an external circuit disposed below the IC device
A socket, wherein the cover further includes a shaft guide formed by a curved groove, and a laterally elongated groove is formed in the socket body; A supporting member having a connecting portion and a connecting portion formed on the other end side, the supporting shaft integrally provided is supported by fitting and engaging the shaft guide portion of the cover and the long groove of the socket body together. A pressing member having a pressing portion is supported by the connecting member by an integral support shaft, and further, an elastic member such as a spring member that elastically presses in the pressing direction of the pressing member is provided between the pressing member and the connecting member. It is arranged.

Thus, in the socket of the present invention, when the cover is pushed down, the support shaft of the connecting member is fitted and engaged with the shaft guide portion of the cover and the long groove of the main body, and the engagement portion is moved. As it is pushed along the working cam surface of the cover, the linking member is also pivoted about the bearing shaft. Accordingly, the pressing member supported on the connecting member is elastically biased in the pressing direction by the elastic member, and integrally rotates while being elastically pressed by the connecting portion of the connecting member.
The device mounting section is open.

[0013] Therefore, if the IC device is housed in the inner carrier or the like and mounted on the mounting portion from the upper opening, the pressing force of the cover is released, and the cover is returned upward, the connecting member is reversed. , The engaging portion is released from the operation cam surface, and the bearing shaft moves toward the mounting portion. Accordingly, the holding portion of the holding member moves from the position where the holding member is retracted to the range concerned, and finally holds the IC device from above the edge of the IC device. A crimp connection to an external circuit is made.

Further, if the holding member is supported by the connecting member in the vertical direction by fitting a long hole and a shaft, the holding member can be held in accordance with different thicknesses of IC devices to be mounted. The member moves up and down, so that the pressing portion can appropriately perform the pressing operation.

Further, the loading of the IC device into a predetermined IC mounting table is performed by preparing in advance inner carriers respectively corresponding to various thicknesses and sizes of the IC device, and storing the inner carriers in respective suitable ones. At this time, preferably, the mounting portion of the pressing member is directly mounted on the inner carrier having the same internal height as the thickness of the IC device so that the upper surface of the IC device is the same as the storage portion height of the inner carrier. Because the IC device is pressed together with the inner carrier without pressing only the IC device, the stored IC
Since no excessive pressing force or amount of pressing is applied to the device, it is extremely effective in protecting IC devices.

Further, the linking member is placed in a free state in the rotating direction. However, if necessary, the load of the pressing member itself or the pressing portion is slightly increased, and an extremely small rotational biasing force in the pressing direction is set. Should occur, or
At the bearing shaft portion of the connecting member, a very small spring biasing force is applied to the pressing member in the direction of the operating cam surface of the engaging portion so as to apply a small rotational force to the pressing member in the pressing direction. With this, the linking member rotates and moves along the operation cam surface according to the vertical movement of the cover, and appropriately presses and releases the IC device on which the holding portion of the holding member is mounted.
Can be evacuated.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic external perspective view of an IC socket according to an embodiment of the present invention, and FIG. 2 is a partially cutaway perspective view of the IC socket with a cover removed. A cover 2 is disposed on the socket body 1 so as to be movable in the vertical direction, is pushed up by a coil spring (not shown), and is locked by a stopper 3 in a predetermined positional relationship.

The cover 2 is formed with a curved shaft guide groove 4 serving as a shaft guide portion symmetrically on one of the opposite side surfaces left and right, with its lower part being opened, and locking portions 5 at four corners. The provided groove 6 is formed. An operating cam surface 7 is formed on the other opposing side surface so as to curve inward from the top. Further, a regulating portion 8 is formed facing the lower portion of the operation cam surface 7 at a constant interval, and an opening 9 is formed on the upper surface. On the side surface of the socket body 1, a laterally long groove 10 is formed at a position related to the shaft guide groove 4 of the cover 2, and the center portion is opened to mount the IC device or the mounting portion 11 of the inner carrier 21 shown in FIG. Are formed.

FIG. 3 is a perspective view of a pressing block in which the linking member 12 and the pressing member 13 are combined, and an upper portion of the linking member 12 serves as an engaging portion for engaging with the operating cam surface 7 of the cover 2. A joint shaft 14 is provided, and projections 15 are formed outward on both sides thereof. A support shaft 16 is provided in the middle part and both ends protruding therefrom are provided with a laterally long groove 10 of the main body 1 and a cover 2 as shown in FIG.
Are engaged with each other in the shaft guide groove 4. In addition, the lower end forms a receiving surface by the connecting portion 17.

The holding member 13 has a holding portion 18 at one end, and the other end is fitted and supported by a supporting shaft 19 in a vertically long groove 20 of the connecting member 12 (see FIG. 4). A left turning force (upper in FIG. 3) is given by a spring 21 disposed between the member 12 and the pressing member 13.

FIG. 5 shows the inner carrier 22, which is suitable for the size and thickness of the IC device.
It is mounted on the C device mounting section 11.

Next, the operation of the IC socket of the present invention having the above configuration will be described. The IC socket of the present invention is in the state of the right half before pushing down the cover 2 as shown in FIG. 4 for explanation of operation. In this state, the lowermost part of the operation cam surface 7 of the cover 2 is connected to the connecting member 12. Has not yet come into contact with the engagement shaft 14 of the head. However, the upper left and right protrusions 15 of the connecting member 12 are in contact with the restricting portion 8. Therefore, the holding member 1
8 is integrated with the linking member 12 in a state where the spring 8 is turned leftward in the figure by a spring 21 and pressed against the linking portion 17. At this time,
The support shaft 16 of the connecting member 12 is connected to the shaft guide groove 4 in FIG.
And at the bottom and near the center of the working range of the slot 10, respectively. The support shaft 19 of the holding member 13 is located below the long groove 20 in FIG.

Next, when the cover 2 is pushed down manually or automatically, as shown in the left half of FIG. 4, the operating cam surface 7 of the cover 2 is pushed down, and the engaging shaft 14 of the connecting member 12 It moves along the cam surface 7 to the top of the working range. At this time, at the same time, the support shaft 16 of the connecting member 12 is
Are guided by the shaft guide groove 4 and also by the long groove 10, and move to the positions farthest from the uppermost portion and the center thereof, respectively. Accordingly, the holding member 13 supported on the linking member 12 also moves integrally.

If the shape of the curved surface of the operating cam surface 7 and the shape of the guide surface of the shaft guide groove 4 are appropriately set, the movement of the engagement shaft 14 of the connecting member 12 and Since the movement of the bearing shaft 16 is regulated,
The cam surface 7 and the groove 4 are set so that the pressing portion 18 of the integral pressing member 13 once moves upward from within the range of the IC device mounting portion 11 and then retreats outside the range.

Since the holding portion 18 is retracted from the IC device mounting portion 11 in the state where the cover 2 is pushed down, the IC device is loaded from the opening 9 of the cover 2 as it is or into the inner carrier 22 shown in FIG. If the cover 2 is manually or automatically inserted into the inside and mounted on the IC device mounting section 11 and then the pressing of the cover 2 is released, the connecting member 12 and the like return to the state shown in the right half of FIG. In the process, the holding member 13 moves in the opposite direction to the above-described evacuation movement, and the holding section 18 enters the area of the IC device and the inner carrier 22 mounted from the evacuation position, and then descends to move the IC device and Hold down the inner carrier 22.

At this time, the pressing force of the pressing portion 18 is
Since the force is only 1, an appropriate pressing force can be easily obtained by appropriately setting the elastic force of the spring 21 according to the type of the IC device. When the mounted IC device or the inner carrier 22 is taken out, the pressing portion 18 is once attached to the I
After being lifted away from the C device or the inner carrier 22, the device is retracted from the mounting area, so that there is no adverse effect on the IC device and the like.

Further, the engaging shaft 14 of the connecting member 12 may be separated from the operating cam surface 7 when the pressing portion 18 presses, but the separation of the engaging shaft 14 is restricted at the pressing position. Since the restricting portion is provided, the press-fitting action of the pressing portion 18 is properly performed without the connecting member 12 escaping backward. Further, only a pushing-up spring force (not shown) acts on the cover 2, and when the cover 2 is pushed down, no force from the linking member 12 acts and the pushing-down force is small. When the thickness of the IC device or the inner carrier to be mounted is large, the support shaft 19 of the holding member 13 moves in the long groove 20 to easily absorb the difference between the length and the vertical direction with respect to the IC device. It becomes possible to apply pressure.

If the pivoting action of the linking member 12 is unstable, the load on the pressing member 13 itself or the pressing portion 18 is slightly increased in advance if necessary, so that an extremely small Or a very small spring biasing force is applied at the support shaft 16 of the linking member 12 to apply a rotating force to the working cam surface 7 of the engagement shaft 14. A small rotational force in the pressing direction is applied to the pressing member 13. As a result, the linking member 12 pivotally moves along the operation cam surface 7 according to the vertical movement of the cover 2, and the pressing portion 1 of the pressing member 13.
8 can be properly pressed, opened, and retracted with respect to the IC device to which the IC device 8 is attached.

[0029]

According to the present invention, miniaturization of the contact pressure of a socket for a burn-in test or mounting, etc., due to the recent trend of high density of semiconductor elements and miniaturization of electrodes, etc. With a simple configuration, the contact pressure is small,
An IC socket that can properly cope with a delicate socket can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic external perspective view of an IC socket according to an embodiment of the present invention.

FIG. 2 is a perspective view in which a part of the socket is cut away.

FIG. 3 is a perspective view of a holding block including a connecting member and a holding member of the socket.

FIG. 4 is an operation explanatory view showing a cross section in a state where the cover of the socket is opened on the right half and a state where the cover is pushed down on the left half.

FIG. 5 is a perspective view showing an example of an inner carrier.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Socket main body 12 Connecting member 2 Cover 13 Pressing member 3 Stopper 14 Engagement shaft 4 Axis guide groove 15 Projection 5 Locking part 16 Support shaft 6 Groove 17 Connecting part 7 Working cam surface 18 Pressing part 8 Restriction part 19 Support shaft 9 Opening Reference Signs List 20 long groove 10 long groove 21 spring 11 mounting part 22 inner carrier

Claims (5)

[Claims] 1. A cover having an upper opening having an operating cam surface and being mounted vertically movably on a socket body in which a mounted IC device and an external circuit are connected by crimping. The cover is further provided with a shaft guide portion and a long groove in the socket body, respectively, and the operating cam is provided on one end side of the IC socket. A connecting member having an engaging portion for engaging with the surface, a connecting portion on the other end side, a supporting shaft formed, and the supporting shaft fitted and supported by the shaft guide portion of the cover and the long groove of the main body; An elastic member having a pressing portion and pressing the pressing portion in the pressing direction is disposed between the connecting member and a pressing member supported by a supporting shaft on the connecting member; Linked by downward movement of An IC socket characterized in that a supporting shaft of a member moves in a long groove together with a shaft guide portion, and the pressing portion of the pressing member is released from the IC device after releasing the pressing action of the mounted IC device. 2. The IC socket according to claim 1, wherein the support of the holding member to the connecting member is performed by fitting a support shaft into an elongated groove in a vertical direction. 3. The mounting of the IC device on the IC socket main body is such that the IC device is mounted in an inner carrier mounted on a predetermined portion of the socket main body and is pressed and fixed by a pressing portion of the pressing member. The IC socket according to claim 1 or 2, wherein the IC socket is formed. 4. The cover is provided with a restricting portion for restricting an engaging portion of the connecting member to follow an operating cam surface of the cover at least at a final stage of the downward movement of the cover. The IC socket according to claim 1, 2, or 3. 5. The connecting member is provided with a biasing force in a direction in which an engaging portion of the connecting member is engaged with an operating cam surface of the cover. The described IC socket.