KR101245838B1 - Socket device for testing a thin film ic package having an anti-warpage means - Google Patents

Abstract

PURPOSE: A socket device of An LGA(Land Grid Array) type for a test capable of preventing a warpage of a film semiconductor package is provided to prepare a stoppage limit member in an adaptor or a fixing body portion, thereby physically unwarpage the semiconductor package from the opposite direction of the warpage direction of the semiconductor package. CONSTITUTION: A terminal(11) formed in the seating plane of a semiconductor package(10) is inserted into the top plane of an adaptor(300). In order to contact the terminal with a contact pin(500), a plurality of mounting grooves(310) is formed in the adaptor. By a stoppage limit member(116), a fixing body portion limits the down movement of the adaptor in the contact of the terminal of the semiconductor package and the contact pin.

Description

Socket device for testing a thin film IC package having an anti-warpage means}

The present invention relates to a test LG type socket device for preventing warpage of a thin film semiconductor package. In particular, in the LG type socket device in which a thin film type semiconductor package is mounted to test a semiconductor package, the semiconductor package itself is warped. Even if there is a warpage, the present invention relates to a burn-in or test socket device in which a semiconductor package has a high flatness and is settled to have stable electrical signal characteristics and to perform inspection.

In general, microchips are fabricated with high density integrated electronic circuits on a circuit board, and thus require a process of verifying that the microchips work properly before being assembled into a product.

This inspection work is carried out by assembling the chip into the inspection socket device, the socket device is provided with a plurality of contact pins (contact pins) in contact with the chip terminal, the chip terminal and the contact pins are in contact with the electricity to test the chip. do.

In particular, due to the rapid growth of IT devices, package miniaturization and thinning are accelerating, and accordingly, the pitch is becoming finer, and commercialization of 0.3 mm pitch devices is becoming visible. However, in order to stably test such fine pitch devices, strict tolerance management of the package and the socket device is essential, but due to the characteristics of the semiconductor manufacturing process, due to the package tolerance and the limitation of the shape management, the reduction is proportional to the fine pitch package of 0.5 mm or more. Not only is it difficult, but also the electrical requirements are more sensitive to the delicate environmental changes.

On the other hand, as the pitch of the semiconductor package decreases as described above, the thickness of the package becomes thinner, and thus, warpage of the semiconductor package is likely to occur. In particular, the warpage generated in the semiconductor package itself has a problem in that it is difficult to perform a reliable test and unstable electrical contact during the test is mounted on the socket device.

For example, Korean Patent Laid-Open Publication No. 10-2006-0107047 (published date: October 13, 2006) proposes a semiconductor package having improved warpage, and typically, a thermal expansion coefficient of silicon constituting a semiconductor chip in a semiconductor package. In contrast, due to the difference in the coefficient of thermal expansion of the thin film-forming material formed on the circuit surface, which is the active area of the semiconductor chip, a warpage shape that is curved toward the circuit surface is generated. Therefore, the above-mentioned Patent Publication proposes a semiconductor package in which the warpage phenomenon is improved by applying a warpage preventing plate to the semiconductor package.

In addition, the present applicant has proposed a device for the LGA socket in Korean Patent Publication No. 10-2011-0085710 (published date: 2011.07.27.), In the case of pressing the IC package by the latch as the thickness of the IC package becomes thinner A device for a socket that can eliminate contact instability caused by bending of an IC package when the IC package is pressurized by applying a flap structure to cover the surface of the IC package together with the latch is applied to the latch.

The warpage problem of the semiconductor package, which may occur as the semiconductor package is thinned, may cause contact instability between the terminals and the contact pins of the semiconductor package even during the test of the semiconductor package, and thus it may be difficult to secure stable electrical signal characteristics. It will have a big impact on reliability.

1A and 1B are views for briefly explaining an example of an operation of a general socket apparatus for testing a semiconductor package using a LGA or BGA type socket according to the prior art.

Referring to FIG. 1A, a plurality of input / output terminals 11 are provided on a lower surface of the LGA or BGA type semiconductor package 10, and the socket device may include an adapter 20 on which the semiconductor package 10 is seated. The adapter 20 is provided with a latch 40 so that the input / output terminal 11 of the semiconductor package 10 and the contact pin 30 can contact each other.

In the conventional LGA type socket device, the adapter 20 has a structure capable of vertical movement in a free state within a predetermined stroke range (approximately, 0.3 to 0.5 mm).

On the other hand, the normal semiconductor package 10 '(without bending) is seated in the adapter 20 such that the terminal 11 and the inspection device (not shown) are contact pins (POGO pins or spring stamping pins). The semiconductor package is inspected by being electrically contacted through the 30.

On the other hand, when the curved semiconductor package 10 is seated on the adapter 20 and pressed by the latch 40, an overstroke is generated in the bending direction, so that the package input / output terminal 11 is positioned according to the position. Contact force is generated unevenly between the contact pin 30 and the contact is unstable.

For example, as illustrated in (a) and (b) of FIG. 1, when the semiconductor package 10 'has a convex downward bow, it is positioned outside by the degree of warp D1 of the semiconductor package. Overstroke D1 (compression amount larger than normal of contact pin) occurs in contact pin 30a which is located at the center of contact pin 30b, which causes contact force imbalance between contact pins in contact with terminals of the semiconductor package. Is generated and contact instability may cause the electrical signal at the time of inspection of the semiconductor package not to exhibit stable characteristics, or overcompression may damage the input / output terminals or the contact pins of the package, resulting in deterioration of inspection reliability. .

On the other hand, even when the semiconductor package is deflected in the opposite direction, the adapter itself can freely move up and down within a certain stroke range. Therefore, when the pressure is applied by the latch, excessive deficiency occurs due to the deflection. Therefore, the input / output terminal or the contact pin in the center is normal. In contact with the shorter stroke, on the contrary, the larger than normal stroke of the input / output terminals or the contact pins located on the outer side may cause an unbalance of the contact force between the contact pins.

The present invention is to solve the problems of the prior art, even if there is a certain deflection in the inspection target semiconductor package itself to structurally eliminate the contact force imbalance between the contact pins in contact with the semiconductor package to ensure a stable electrical signal characteristics To implement a test LG (LGA) type socket device for preventing warpage of a thin film semiconductor package.

According to an embodiment of the present invention, there is provided a socket type device for testing a semiconductor package according to the present invention. A cover part elastically supported on an upper portion of the fixed body part and assembled to be movable up and down; An adapter on which the semiconductor package is seated and provided between the fixed body portion and the cover portion to move up and down; A latch provided on the fixed body portion to press down the upper portion of the semiconductor package seated on the adapter; In the LG package-type socket device for testing a semiconductor package including a plurality of contact pins which are fixed to the fixed body portion and is in electrical contact with corresponding terminals of the semiconductor package according to the rising / lowering position of the adapter. The adapter has a plurality of mounting grooves formed in the upper surface which is in contact with the bottom surface (seating plane) of the semiconductor package protruding into the bottom surface of the semiconductor package to penetrate and contact the contact pins, the fixed body portion And a stop limiting member to limit downward movement of the adapter upon contact of the terminal of the semiconductor package with the contact pin.

Preferably, the stop limiting member is characterized in that the locking jaw constituting the lower end of the guide groove formed in the fixed body portion to guide the vertical movement of the adapter along the outer edge of the adapter.

Preferably in the present invention, the stop member is characterized in that the protruding projections protruding from the fixed body portion to be in contact with the bottom of the adapter to limit the downward movement of the adapter.

Preferably, in the present invention, the stopping limit member comprises: a locking jaw constituting the lower end of the guide groove formed in the fixed body portion to guide the vertical movement of the adapter along the outer edge of the adapter; It is characterized in that the protruding protrusion is formed in the vertical perpendicular to the bottom of the adapter so as to contact the adapter to limit the downward movement of the adapter, More preferably, the protrusion is in the center of the fixed body portion It is characterized in that at least two are provided.

In the LG type socket device for testing a semiconductor package according to the present invention, a stop member is provided in the adapter or the fixed body so that the semiconductor package is seated and pressed by a latch to restrict downward movement of the adapter which is movable downward. The contact pins, which are in contact with the terminals of the semiconductor package by physically unfolding the semiconductor package in a direction opposite to the bending direction while the semiconductor package is seated on the adapter and pressurized even though the semiconductor package has a predetermined bending, has a uniform contact force as a whole. The contact with the terminal is made, so that there is an effect that can ensure a stable electrical signal characteristics during the inspection of the semiconductor package.

Figure 1 (a) (b) is a view for explaining the operation example of the socket device according to the prior art,
2 is an exploded perspective view of a socket device for testing a semiconductor package according to the present invention;
3 is a longitudinal sectional view showing a main configuration of a socket device for testing a semiconductor package according to the present invention;
Figure 4 (a) (b) (c) is a view for explaining the operation example of the socket device for testing a semiconductor package according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to Figure 2 the socket device of the present embodiment, the fixed body portion 100; A cover part 200 which is elastically supported on the upper part of the fixed body part 100 and assembled to be movable up and down; An adapter 300 mounted on the semiconductor package 10 and provided between the fixed body part 200 and the cover part 200 to move up and down; A latch 400 provided in the fixed body part 100 to press down the upper portion of the semiconductor package 10 seated on the adapter 300; And a plurality of contact pins 500 inserted into and fixed to the fixed body part 100 so as to correspond to respective terminals of the semiconductor package 10 and to be in electrical contact with each other according to a rising / lowering position of the adapter 300.

The fixed body part 100 is a rectangular frame structure in which the components of the socket device are assembled, and the contact pins 500 are fixedly supported, and the cover part 200 and the adapter 300 are movable upward and downward on the upper end. It is assembled, the latch 400 is rotatably coupled.

On the other hand, the fixed body portion 100 may have a variety of forms to securely support the contact pin 500, as shown in Figure 2, the base 110 and the base (110) through which the contact pin 500 is assembled 110 may be provided by the stopper 120 and the lead guide 130 to be assembled to the lower portion to securely support the contact pin 500.

In particular, the fixed body portion 100 in the present invention is characterized in that a stopper member (stopper) is provided to limit the downward movement of the adapter 300 when the terminal of the semiconductor package 10 and the contact pin 500 is in contact It is done.

In the present invention, the stopping limit member provided to limit the downward movement of the adapter 300 to allow the adapter to move only within a predetermined stroke may be provided in various forms.

As illustrated in FIG. 2, the stopping limit member may be provided by one or more protrusions 112 protruding from the base 110 constituting the fixed body part 100, and the protrusions 112. ) Is to support the lower end of the adapter 300, the upper and lower movement of the adapter body 100 in the fixed body portion 100 can limit the downward movement of the adapter 300, the downward stroke range of the adapter 300 of the protrusions 112 Can be determined by the length of the protrusion.

The cover part 200 has a rectangular frame structure that is open to allow the semiconductor package to pass therethrough, and is elastically supported on an upper portion of the fixed body part to be assembled to enable vertical operation.

As illustrated in FIG. 2, the first springs 201 are provided at four corners between the cover part 200 and the base 110, so that the cover part 200 is elastic on the fixed body part 100. Supported up and down movement is possible. On the other hand, it can be clearly understood that the fixing body portion 100 and the cover portion 200 may be formed with a spring receiving hole or a spring guide protrusion so that the first spring 201 is fixed and assembled.

The adapter 300 is elastically supported on the upper portion of the fixed body portion 100 to move upward and downward, and the semiconductor package 10 is seated. As illustrated in FIG. 2, four second springs 301 are interposed between the adapter 300 and the base 110 so that the adapter 300 is elastically supported on the fixed body part 100 to move upward and downward. Do. On the other hand, it can be clearly understood that the fixing body portion 100 and the adapter 300 may be provided with a spring receiving hole or a spring guide protrusion so that the second spring 301 is fixed and assembled.

In particular, in the present invention, the adapter 300 has a horizontal upper seating surface, the upper surface which is in surface contact with the bottom (seating plane) of the semiconductor package 10, such as solder balls protruding from the bottom of the semiconductor package 10 A plurality of penetrating grooves (ball cups) 310 are formed to penetrate the input and output terminals to be seated in the correct position to contact the contact pins 10.

Meanwhile, in the present invention, the position or number of the spring for elastically supporting the cover part 200 or the adapter 300 in the upper part of the fixed body part 100 may be variously changed, and the cover is fixed to the upper part of the fixed body part 100. A coupling protrusion and a coupling groove formed therein may be provided to allow the unit 200 and the adapter 300 to be integrally assembled to enable vertical movement within a predetermined range.

The latch 400 is provided on the fixed body part 100 so as to press down the upper portion of the semiconductor package 10 seated on the adapter 300 in conjunction with the vertical movement of the cover part 200.

As illustrated in FIG. 2, the latch 400 is symmetrically provided with two latch arms 410 for pressing the semiconductor package 10, and the latch arms 410 and the link 421 are connected to each other to form a base ( A first hinge pin 420 rotatably coupled to the first hinge pin coupling portion 111 of the 110 and a second hinge pin coupling portion 202 of the cover portion 200 provided at a rear end of the latch arm 410. It may be composed of a second hinge pin (430) rotatably coupled to).

 The latch 400 configured as described above has a second hinge pin 430 coupled to the cover part 200 according to the vertical movement of the cover part 200 while the first hinge pin 420 is hinged to the base 110. As the) moves up and down, the latch arm 410 may press the semiconductor package 10 or release the pressurized state by using the first hinge pin 420 as the rotation axis. For example, when the cover part 200 is moved downward, the second hinge pin 430 is also lowered while the latch arm 410 is opened when the first hinge pin 420 is rotated outward. On the contrary, when the cover part 200 is moved upward, the second hinge pin 430 is moved upward while the latch arm 410 rotates the first hinge pin 420 to the rotation axis, thereby latching the latch arm 410. Presses the semiconductor package 10.

The contact pin 500 is in contact with each terminal of the semiconductor package 10 to electrically connect the semiconductor package and an inspection device (not shown), and is a known pogo pin used in an LGA type semiconductor package. Or it may be provided by a stamping pin of various structures having an elastic force. For reference, although only one contact pin is illustrated in FIG. 2, a plurality of contact pins are configured to contact each terminal of the semiconductor package.

In FIG. 2, reference numeral 600 denotes an actuator for contacting a contact pin and a solder ball of a BGA type semiconductor package by interworking with the contact pin, and an actuator is not used when a known pogo pin or spring pin is used. You may not.

3 is a longitudinal sectional view showing a main configuration of a socket device for testing a semiconductor package according to the present invention.

As illustrated in FIG. 3, the stopping limit member may be provided by a protrusion protrusion 112 vertically protruding from the base 110, which is a fixed body portion, as mentioned in FIG. 2, and preferably, the base 110. Two or more may be provided in the center of the.

The protrusions 112 may limit the downward movement of the adapter 300 because the distance D2 between the top of the protrusions 112 and the bottom of the adapter 300 becomes a movable stroke range of the adapter.

On the other hand, as another embodiment of the stop limiting member, the guide groove 110a for guiding the vertical movement of the adapter 300 is provided in the base 110 which is a fixed body portion adjacent to the edge bottom portion 300a of the adapter 300. It may be formed, the locking jaw (110b) constituting the lower end of the guide groove (110a) may be provided as a stop limiting member for limiting the downward movement of the adapter (300).

Therefore, the movable stroke range of the adapter 300 is determined by the distance D2 between the locking step 110b provided in the base 110 and the edge bottom portion 300a of the adapter 300, and thus the downward direction of the adapter 300. You can limit your exercise.

(A), (b) and (c) of FIG. 4 are diagrams for explaining an example of the operation of the socket device for testing a semiconductor package according to the present invention.

4 (a) is a view showing a state before the semiconductor package 10 is mounted on the socket device. For convenience of description, reference numeral 116 is a stop limit member for limiting the downward movement of the adapter 300. Reference numeral D2 denotes a downward movable stroke of the adapter 300.

As shown in FIG. 4B, the semiconductor package 10 is seated on the adapter 300, and the latch 400 starts to press the upper portion of the semiconductor package 10 by pressing.

When the semiconductor package 10 is pressed by the latch 400, the semiconductor package 10 and the whole adapter 300 are lowered together, and after the adapter 300 is lowered to a predetermined stroke D2, the adapter 300 is lowered. ) Is supported by the stop limit member 116 provided in the fixed body portion is no longer lowered.

Therefore, even when the adapter 300 is supported by the stop limiting member 116 and is stopped, the latch 400 continues to press the semiconductor package 10 to thereby pressurize the semiconductor package 10. The contact pins 500 contacting the terminals 11 of the semiconductor package are uniform (regardless of position) as the upper surface and the bottom of the package are forced to come into surface contact and are extended in the opposite direction to the bending direction. It is possible to have a stable contact with the terminal 11 while having a contact force.

As described above, the socket device of the present invention contacts the terminals of the semiconductor package by contacting the terminals of the semiconductor package by unfolding the semiconductor package in a direction opposite to the bending direction during the process in which the semiconductor package is seated on the adapter and pressed by the latch even if there is a certain bending. The terminal is in contact with the terminal while having a uniform contact force, thus ensuring stable electrical signal characteristics during inspection.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

10 semiconductor package 11 terminal
100: fixed body portion 200: cover portion
300: adapter 310: seating groove
320: headhole 400: latch
500: contact pin

Claims (5)

A fixed body part; A cover part elastically supported on an upper portion of the fixed body part and assembled to be movable up and down; An adapter on which the semiconductor package is seated and provided between the fixed body portion and the cover portion to move up and down; A latch provided on the fixed body portion to press down the upper portion of the semiconductor package seated on the adapter; In the LG package-type socket device for testing a semiconductor package including a plurality of contact pins which are fixed to the fixed body portion and is in electrical contact with corresponding terminals of the semiconductor package according to the rising / lowering position of the adapter.
The adapter has a plurality of recessed grooves formed in the upper surface which is in contact with the bottom surface (seating plane) of the semiconductor package is formed through the terminal protruding to the bottom surface of the semiconductor package to contact the contact pins,
The fixed body portion of the LG package-type socket device for a semiconductor package test, characterized in that the stop member is provided to limit the downward movement of the adapter when the terminal of the semiconductor package and the contact pin. According to claim 1, wherein the stop member is a semiconductor package test ledges, characterized in that the locking jaw forming a lower end of the guide groove formed in the fixed body portion to guide the vertical movement of the adapter along the outer edge of the adapter A type socket device. The method according to claim 1, wherein the stop member is a protrusion type protrusion for forming a protrusion protruding from the fixed body portion to contact the bottom of the adapter to limit the downward movement of the adapter Socket device. The method of claim 1, wherein the stopping limit member,
A catching jaw configured to form a lower end of the guide recess formed in the fixed body to guide the vertical movement of the adapter along the outer edge of the adapter;
The LG package type socket device for semiconductor package test, characterized in that the projecting protrusion is formed in the vertical body from the fixed body portion to be in contact with the bottom of the adapter to limit the downward movement of the adapter. The method according to claim 3 or claim 4, wherein the at least two protrusion protrusions are provided in the central portion of the fixed body portion of the LG package-type socket device for testing a semiconductor package.

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