CN1486430A - Pusher and electronic part-testing apparatus with the same - Google Patents
Pusher and electronic part-testing apparatus with the same Download PDFInfo
- Publication number
- CN1486430A CN1486430A CNA018218601A CN01821860A CN1486430A CN 1486430 A CN1486430 A CN 1486430A CN A018218601 A CNA018218601 A CN A018218601A CN 01821860 A CN01821860 A CN 01821860A CN 1486430 A CN1486430 A CN 1486430A
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- China
- Prior art keywords
- thruster
- chip
- electronic unit
- jut
- experiment
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/58—Testing of lines, cables or conductors
- G01R31/59—Testing of lines, cables or conductors while the cable continuously passes the testing apparatus, e.g. during manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Abstract
Pusher and electronic part-testing apparatus with the same to test electronic parts without generating damages such as cracks, chips or the like to the electronic parts by connecting contacts of the electronic parts to connecting terminals of sockets without applying a load concentratedly to a part where an adhering substance adheres even when the adhering substance such as a particle or the like adheres to faces to be pressed of the electronic parts. A sharpened projecting part (312) is set to a face (311) of a pusher block (31) which is opposite to the face (211) to be pressed of a body part (21) of an IC chip (2).
Description
Technical field
The present invention relates in the experiment of electronic units such as IC chip, be used to push the thruster that is installed in the electronic unit on the socket and possess this angle of rake electronic unit experimental provision.
Background technology
In the manufacture process of semiconductor device etc., must need the electronic unit experimental provision of the performance of electronic units such as the final produced IC chip of experiment or function etc.As an example of such electronic unit experimental provision, the IC testing apparatus of known performance that IC equipment such as experiment IC chip are arranged under all temps conditions such as low temperature, high temperature and function etc.
For example, as following, used the IC equipment experiment of IC testing apparatus.Being pushed equipment, the splicing ear of IC socket is contacted with the outside terminal that quilt is tested IC equipment by after the conveyance of experiment IC equipment is above the measuring head that the IC socket has been installed by experiment IC.Consequently, being tested IC equipment is electrically connected with main device by IC socket, measuring head and cable and experiment.Then, by being applied the test signal that offers measuring head by the main device of experiment by cable to testing IC equipment, and, measure by the electrical specification of experiment IC equipment by the answer signal that measuring head and cable are read from quilt experiment IC equipment with main device transmission to experiment.
In the experiment of the IC equipment that has used IC testing apparatus, when pushing by experiment IC equipment, because possessing the thruster of thruster piece descends, make the press surface of thruster piece contact, and applied pressing force to testing IC equipment towards the splicing ear direction of IC socket with the face of being pressed of being tested IC equipment.
But, on by the face that is pressed of experiment IC equipment, adhered under the situation of small pieces such as silicon relic, the press surface of thruster piece contacts with the face of being pressed of being tested IC equipment, if to being applied pressing force by experiment IC equipment, then bearing a heavy burden concentrates on the part that these small pieces adhere to, and just might make by the generation of experiment IC equipment to split or broken damage.Especially, just might cause damage to exposed die self being mounted in exposed die on the substrate by experiment IC equipment not under the situation by the IC equipment of mould resin sealing.
Summary of the invention
The object of the present invention is to provide a kind of thruster and electronic unit experimental provision, even on by the face that is pressed of experiment electronic unit, be attached with under the situation of small pieces such as silicon relic, also can not make by the experiment electronic unit and split or broken equivalent damage ground, to applied pressing force by the experiment electronic unit towards the splicing ear direction of socket.
(1) in order to address the above problem, angle of rake being characterised in that provided by the present invention is the thruster that is used for pushing the main part that is installed in the electronic unit on the socket, at the face relative, be provided with jut from above-mentioned electronic unit to the splicing ear direction of above-mentioned socket that to push with the face that is pressed of above-mentioned electronic unit.
In thruster of the present invention, " main part of electronic unit " is meant the component materials except outside terminal or the part of electronic unit, for example, at electronic unit is under the situation of IC chip, is installed in the mould resin etc. that exposed die on the substrate, sealing be installed in the exposed die of substrate and all is comprised in " main part of electronic unit ".In addition, " face that is pressed of electronic unit " is meant in the outside of electronic unit, applied the outside of pressing force by thruster, for example, be under the situation of area array type IC chip of surface installing types such as BGA (ball grid) type, LGA (plane grid array) type at electronic unit, just become " face that is pressed of electronic unit " with being provided with as opposite face such as the face of the soldering dish of outside terminal and bonding pad etc.
In thruster of the present invention, because by being set at the jut on the face relative with the face that is pressed of this electronic unit, the main part that is installed in the electronic unit on the socket is pushed, even so be attached with small pieces such as silicon relic on the face that is pressed of electronic unit, the probability that thruster contacts with above-mentioned small pieces is also very low.In addition, even supposing angle of rake jut contacts with the attachment of the face that is pressed of electronic unit, but between the face that is pressed of electronic unit and relative with this face that is pressed angle of rake, owing to the existence of jut has formed the space, therefore can make contact with angle of rake jut and above-mentioned attachment that quilt is upspring moves to above-mentioned space.Thus, can prevent that above-mentioned attachment is sandwiched in the state between the face of being pressed of angle of rake jut and electronic unit.Therefore, by thruster of the present invention, even on the face that is pressed of electronic unit, be attached with under the situation of small pieces such as silicon relic, also can preventing bears a heavy burden concentrates on the part that these small pieces adhere to, can not cause and split or broken equivalent damage ground, electronic unit is applied pressing force towards the splicing ear direction of socket electronic unit.
In thruster of the present invention, be set at the not special restriction of material of the jut on the face relative, but it is desirable to rubber-like material (for example rubber, plastics etc.) with the face that is pressed of electronic unit.If the material of jut is the rubber-like material, even then on the face that is pressed of electronic unit, be attached with under the situation of small pieces such as silicon relic, at jut with when above-mentioned attachment contacts, thrust oneself produces distortion, can alleviate the pressing force that is applied on the above-mentioned attachment, thereby can prevent to split or broken equivalent damage with electronic unit being caused when above-mentioned attachment contacts at jut.
The electronic unit that can push by thruster of the present invention is not defined as the electronic unit that can push its main part, thruster of the present invention can suitably be used to the area array type IC chip of surface installing types such as BGA (sphere grid array) type, LGA (plane grid array) type, wherein CSP (chip size packages) type IC chip particularly.
In thruster of the present invention, be set at the not special restriction such as shape, number, position of the jut on the face relative, but it is desirable to form described later with the face that is pressed of electronic unit.
(2) in thruster of the present invention, it is desirable to above-mentioned jut and be pointed shape.
In such thruster, because the jut of pushing the main part of electronic unit is pointed shape, so even the attachment on the face that is pressed of angle of rake jut and electronic unit contacts, its contact area is also very little.Thus, the above-mentioned attachment that has contacted with angle of rake jut only has been applied in local pressing force, above-mentioned attachment is upspring from angle of rake jut, easily to moving in the space that forms between the face that is pressed of electronic unit and relative with this face that is pressed angle of rake.Therefore, by such thruster, can prevent effectively that above-mentioned attachment is sandwiched in the state between the face of being pressed of angle of rake jut and electronic unit.
In such thruster, the shape of jut is not particularly limited in pointed shape, can list cone shape, pyramidal shape, aciculiform shape etc. as the shape of jut.In addition, in such thruster, " pointed shape " is meant the shape that attenuates towards front end (towards pushing direction), except comprising the shape that front end comes to a point, also comprises the shape of front end band fillet, the shape that front end is the plane etc.
(3) in thruster of the present invention, it is desirable to above-mentioned jut and be set on the position corresponding to the outside terminal of above-mentioned electronic unit.
In such thruster, with when the splicing ear of each self-corresponding socket is connected, can apply necessary pressing force by being arranged on the locational jut corresponding with each outside terminal of electronic unit at each outside terminal that makes electronic unit.So if use such thruster to push electronic unit, the outside terminal that then can positively realize electronic unit is connected with the splicing ear of socket.
In such thruster, jut that will be whole all is not arranged on the position corresponding with the outside terminal of electronic unit, the number of jut can be lacked than the number of the outside terminal of electronic unit also can be many, but it is desirable in the position corresponding with all outside terminals of electronic unit protrusion member is set all.
(4) in thruster of the present invention, it is desirable to be provided with the elastomeric element material that makes above-mentioned jut have elastic potential energy on the direction pushing of above-mentioned electronic unit.
Be provided with in thruster under the situation of a plurality of juts, each jut may produce scale error.So if each jut produces scale error, then the pressing force that applies to the face of being pressed of electronic unit by each jut might be inhomogeneous.To this, in such thruster, owing to be provided with the elastomeric element material that makes above-mentioned jut have elastic potential energy on the direction pushing of above-mentioned electronic unit, so can absorb the scale error of each jut by this resilient material, can make the pressing force that is applied on the face that is pressed of electronic unit by each jut even.That is, in such thruster, the stroke management by each jut and the loading management of each jut can make the pressing force that is applied on the face that is pressed of electronic unit by each jut even.
(5) electronic unit experimental provision provided by the present invention is characterised in that and possesses thruster of the present invention.
In electronic unit experimental provision of the present invention, even on the face that is pressed of electronic unit, be attached with under the situation of small pieces such as silicon relic, also can preventing bears a heavy burden concentrates on the part that these small pieces adhere to, can be not electronic unit do not caused and split or broken equivalent damage ground applies pressing force towards the splicing ear direction to electronic unit, the outside terminal of electronic unit is connected with the splicing ear of socket, carries out the experiment of electronic unit.
Description of drawings
Fig. 1 is the whole outboard profile of IC testing apparatus of showing an embodiment of electronic unit experimental provision of the present invention.
Fig. 2 is an oblique view of showing the processor of same IC testing apparatus.
Fig. 3 is the process flow diagram of showing by the pallet of the disposal route of experiment IC.
Fig. 4 shows that the IC of same experimental provision lays in the oblique view of the structure of device.
Fig. 5 is an oblique view of showing the user tray that is used for same IC testing apparatus.
Fig. 6 is the interior major part sectional view of test cabinet of same IC testing apparatus.
Fig. 7 is an exploded perspective view of showing the part of the test pallet that is used to same IC testing apparatus.
Fig. 8 is an exploded perspective view of showing near the structure the socket of measuring head of same IC testing apparatus.
Fig. 9 is the angle of rake exploded perspective view of same IC device.
Figure 10 is near the sectional view of socket of same IC device.
Figure 11 is the sectional view of the state after the thruster decline of showing among Figure 10.
Figure 12 is illustrated in the state of attachment has been adhered in thruster decline front and back at the face of being pressed of IC chip sectional view.
Figure 13 is a sectional view of showing another embodiment of angle of rake jut.
Embodiment
Below, embodiments of the invention are described with reference to the accompanying drawings.
Fig. 1 is the whole outboard profile of IC testing apparatus of showing an embodiment of electronic unit experimental provision of the present invention.Fig. 2 is an oblique view of showing the processor of same IC testing apparatus.Fig. 3 is the process flow diagram of showing by the pallet of the disposal route of experiment IC.Fig. 4 shows that the IC of same experimental provision lays in the oblique view of the structure of device.Fig. 5 is an oblique view of showing the user tray that is used for same IC testing apparatus.Fig. 6 is the interior major part sectional view of test cabinet of same IC testing apparatus.Fig. 7 is an exploded perspective view of showing the part of the test pallet that is used to same IC testing apparatus.Fig. 8 is an exploded perspective view of showing near the structure the socket of measuring head of same IC testing apparatus.Fig. 9 is the angle of rake exploded perspective view of same IC device.Figure 10 is near the sectional view of socket of same IC device.Figure 11 is the sectional view of the state after the thruster decline of showing among Figure 10.Figure 12 is illustrated in the state of attachment has been adhered in thruster decline front and back at the face of being pressed of IC chip sectional view.
And then Fig. 3 is the figure for the disposal route of being tested IC of understanding the relevant IC testing apparatus of present embodiment, in fact also has and shows up and down the part of configured parts material side by side in the plane.Therefore, (3 dimension) structure of this machinery is described with reference to Fig. 2.
The one-piece construction of the IC testing apparatus of present embodiment at first, is described.
As shown in Figure 1, the IC testing apparatus 10 of present embodiment possesses processor 1, experiment 5 and experiment with main device 6.Processor 1 performed action is successively will be as IC chip (example of the electronic unit) conveyance of the electronic unit of needs experiments to the socket of the contact portion 9 that is arranged on measuring head 5 upsides, and the IC chip that classification will test end according to experimental result is saved in the pallet of regulation.
The socket of contact portion 9 is electrically connected with main device 6 with experiment by measuring head 5 and cable 7, and the IC chip that releasably is installed on the socket also is electrically connected with main device 6 with experiment by measuring head 5 and cable 7.Be installed in IC chip on the socket and be applied in the experiment electric signal of sending with main device 6 from experiment, the answer signal of reading from the IC chip is sent to by cable 7 tests with main device 6, thus the performance of IC chip and function etc. is experimentized.
Mainly be built-in with the control device of processor controls 1 in the bottom of processor 1, another part is provided with space segment 8.Dispose the measuring head 5 that can freely exchange in this space segment 8, can on the socket of the contact portion 9 that is set at measuring head 5 upsides, load and unload the IC chip by the through hole that is formed on the processor 1.
IC testing apparatus 10 is to be used under state of temperature higher than normal temperature (high temperature) or low temperature state (low temperature) device that the IC chip as the electronic unit of needs experiment is experimentized, as shown in Figures 2 and 3, processor 1 possesses by calibration cell 101, test cabinet 102 and removes the chamber 100 that heat channel 103 constitutes.As shown in Figure 6, the contact portion 9 that is set at the upside of measuring head shown in Figure 15 is inserted into the inside of test cabinet 102, there the IC chip is experimentized.
As shown in Figures 2 and 3, the processor 1 of IC testing apparatus 10 is by the IC chip that will experimentize after preserving, and the classification IC that preserves the IC chip that experiment finishes preserves parts 200, will constitute from the unloading parts 400 that the loading part 300 of chamber component 100, the chamber component 100 that comprises measuring head 5, classification take out the IC chip that the experiment of having carried out experiment chamber component 100 finishes of being sent into by experiment IC chip that IC preserves that parts 200 send.And then, in the inside of processor 1, in test pallet, take in and conveyance IC chip.
Being saved to processor 1 IC chip before is stored among the user tray KST shown in Figure 5 mostly, under this state, preserving parts 200 to the IC of Fig. 2 and processor 1 shown in Figure 3 supplies with, there, the IC chip is relayed in processor 1 by the test pallet TST (with reference to Fig. 7) of conveyance from user tray KST.In the inside of processor 1, as shown in Figure 3, the IC chip is loaded on the test pallet TST and moves, and is applied in the thermal stimulus of high temperature or low temperature, and whether experiment (inspection) regular event, and classifies corresponding to this experimental result.Below, the inside to processor 1 is elaborated individually.
The part 1 explanation is preserved the part that parts 200 are associated with IC.
The experiment of as shown in Figure 2, in IC preserves parts 200, be provided with IC deposit device 201 before the experiment of preserving the IC chip before the experiment, preserving the IC chip that has been classified corresponding to the experimental result IC deposit device 202 that finishes.
As shown in Figure 4, before the experiment IC deposit device 201 and experiment finish the pallet that IC deposit device 202 possesses the frame shape support frame 203, be installed in this pallet support frame 203 the bottom and can be to the lifter 204 of top lifting.Pallet supports frame 203 to support a plurality of overlapping user tray KST, and moves up and down this overlapping user tray KST by 204 of lifters.
IC deposit device 201 middle levels stack the user tray KST that puts and support to preserve the IC chip that after this will experimentize before experiment shown in Figure 2.In addition, stack and put and support to preserve that experiment finishes and the user tray KST of the IC chip that has been classified in finish IC deposit device 202 middle levels of experiment.
And then IC deposit device 201 and the experiment IC deposit device 202 that finishes has roughly the same structure before the experiment, thereby the part of IC deposit device 201 before the experiment can be used as the experiment IC deposit device 202 that finishes, otherwise also can.Therefore, can easily change the number and the number of testing the IC deposit device 202 that finishes of the preceding IC deposit of experiment device 201 as required.
As shown in Figures 2 and 3, in the present embodiment, be provided with 2 deposit device STK-B and be used as testing preceding IC deposit device 201.Be provided with 2 deposit device STK-E that are sent to the sky of unloading parts 400 on the next door of deposit device STK-B and be used as testing the IC deposit device 202 that finishes.In addition, it the next door, also be provided with 8 deposit device STK-1, STK-2 ... STK-8 is used as testing the IC deposit device 202 that finishes, and its structure can be preserved maximum 8 kinds according to the experimental result classification.That is, beyond certified products and unacceptable product, it is at a high speed, middling speed, low speed to be divided into responsiveness in certified products, or in unacceptable product, tell need test again etc.
The part that the part 2 explanation is associated with loading part 300.
As shown in Figure 2, the pallet that is incorporated in IC deposit device 201 before the experiment shown in Figure 4 supports the user tray KST in the frame 203 to preserve tray conveying arm 205 between parts 200 and the device substrate 105 by the window part 306 from the downside conveyance of device substrate 105 to loading part 300 by being set at IC.Then, in this loading part 300, the IC chip of being tested that is placed among the user tray KST is temporarily arrived position adjuster 305 by conveyance by X-Y carrying device 304, after this has adjusted by the mutual alignment of experiment IC chip, utilize X-Y carrying device 304 that being replaced by experiment IC chip in the position adjuster 305 is stored among the test pallet TST that stops in the loading part 300 again.
As shown in Figure 2, will by experiment IC chip from user tray KST replace the X-Y carrying device 304 that is stored in the test pallet TST possess 2 guide rails 301 being erected at device substrate 105 tops, can be along these 2 guide rails 301 back and forth moveable arm 302 of (with this direction as the Y direction) motion, moving head 303 that can move at directions X along moveable arm 302 of supporting by this moveable arm 302 between test pallet TST and user tray KST.
On the moving head 303 of X-Y carrying device 304 adsorption head is installed down, while attract air to move by this adsorption head, is tested the IC chip to be picked up from user tray KST, replacement is stored among the test pallet TST.Adsorption head such about 8 for example is being installed on the moving head 303, then once 8 can be being replaced by experiment IC chips and be stored among the test pallet TST.
The part that the explanation of the 3rd part is associated with chamber 100.
After will being deposited into by experiment IC chip by loading part 300, above-mentioned test pallet TST is admitted in the chamber 100, under being loaded in the state that deserves among the test pallet TST each is tested the IC chip and tests.
As shown in Figures 2 and 3, chamber 100 by the calibration cell 101 that is applied the thermostimulation of target high temperature or low temperature by experiment IC chip in leaving test pallet TST in, will be in the state that has been applied in thermostimulation in this calibration cell 101 under be installed to test cabinet 102 on the socket on the measuring head 5 by experiment IC chip, from test cabinet 102, having carried out constituting except that heat channel 103 of thermostimulation that being removed by experiment IC chip of test apply.
In removing heat channel 103, in calibration cell 101, applied under the situation of high temperature, by being blowed wind and cool to room temperature to testing the IC chip, and in calibration cell 101, applied under the situation of low temperature, to being blowed warm braw or make it be returned to the not temperature of dewfall degree with heating such as well heaters by experiment IC chip.Then, being arrived by the conveyance of experiment IC chip behind this heat extraction unloaded parts 400.
As shown in Figure 2, the calibration cell 101 of chamber 100 and remove heat channel 103 and be configured outstandingly from the top of test cabinet 102.In addition, shown in Figure 13 generalities like that, in calibration cell 101, be provided with vertical carrying device, till 102 free time of test cabinet, a plurality of test pallet TST are being supported to wait for by vertical carrying device.In the wait process, mainly to being applied high temperature or low temperature thermostimulation by experiment IC chip.
As shown in Figure 6, in test cabinet 102, the bottom disposes measuring head 5 in the central, and test pallet TST can be by conveyance to measuring head 5.There, all IC chips 2 of being supported by test pallet TST shown in Figure 7 are electrically contacted successively with measuring head 5, come all the IC chips 2 in the test pallet TST are experimentized.On the other hand, the test pallet TST that experiment finishes is heat extraction in removing heat channel 103, and IC chip 2 is discharged to Fig. 2 and unloading parts 400 shown in Figure 3 after its temperature turns back to room temperature.
In addition, as shown in Figure 2, be formed with separately on calibration cell 101 and the top of removing heat channel 103 be used for the inlet test pallet TST sent into from device substrate 105 with opening portion, be used for test pallet TST is passed out to the outlet opening portion of device substrate 105.On device substrate 105, be equipped with and be used for making the test pallet carrying device 108 of test pallet TST from these opening portions discrepancy.These carrying devices 108 are made of for example swing roller etc.Be arranged on test pallet carrying device 108 on the device substrate 105 by this, returned calibration cell 101 via unloading parts 400 and loading part 300 by foldback from removing the test pallet TST that heat channel 103 discharges.
Fig. 7 is an exploded perspective view of showing the structure of the test pallet TST that is used for present embodiment.This test pallet TST has rectangular frame 12, and is parallel and equally spaced be provided with a plurality of supports 13 on this framework 12.Inboard at the limit 12a of the both sides of these supports 13 and the framework 12 parallel with these supports 13 equally spaced is formed with a plurality of outstanding installation sheets 14 separately.By be arranged between these supports 13 and support 13 and limit 12a between a plurality of installation sheets 14 in 2 inboard relative installation sheets 14, formation respectively embeds storage member 15.
Embed 1 embedded part 16 can laying in the storage member 15 separately, this embedded part 16 is to be installed on 2 installation sheets 14 with the on-fixed state with fastener 17 at each.The for example such embedded part 16 about 16 * 4 is installed on 1 test pallet TST.By being received in this embedded part 16, will be placed among the test pallet TST by experiment IC chip 2 by experiment IC chip 2.And then, as Figure 10～shown in Figure 13, the IC chip 2 that becomes the experimental subjects of present embodiment be as the soldering dish of outside terminal 22 below the rectangular main part 21 that is arranged in rectangle, the IC chip of promptly so-called BGA type.
As Fig. 8 and shown in Figure 10, in the embedded part 16 of present embodiment, formed the IC storage means of depositing by the rectangle of experiment IC chip 2 19.In the lower end of IC storage means 19, have the opening of the outside terminal 22 that exposes IC chip 2, be provided with the IC holding member 195 of support IC chip 2 at the peripheral part of this opening.
Middle body in the both sides of embedded part 16, be formed with register pin 32 and each guide hole 20 of thruster base 34, be formed with the erection opening 21 of the installation sheet 14 that is used for test pallet TST in the angle part of the both sides of embedded part 16 since the guide pin bushing 411 that inserts socket guide rod 41 up and down.
As Figure 10 and shown in Figure 11, guide hole 20 is the holes that are used for locating.For example, the internal diameter in the hole of the guide hole 20 in left side is than under the little situation of the guide hole 20 on right side in for location map, in the guide hole 20 in left side, half register pin 32 that partly inserts thruster base 34 is located thereon, inserts the guide pin bushing 411 of socket guide rod 41 in its latter half and locatees.On the other hand, the guide pin bushing 411 of the register pin 32 of the guide hole 20 on right side, thruster base 34 and socket guide rod 41 becomes loose chimerism among the figure.
As shown in Figure 8, on measuring head 5, dispose socket 50.In test pallet TST shown in Figure 7, for example can be with corresponding to 3 of every row on line direction, the number of being tested IC chip 2 (4 row * 4 row) the configuration socket 50 that adds up to 4 row, if but the size of socket 50 is one by one diminished, then can be simultaneously tested for all IC chips 2 that test pallet TST shown in Figure 7 is kept, also can on measuring head 5, dispose the socket 50 of 4 row * 16 row.
As shown in Figure 8, be provided with socket 40 on the socket 50,, expose in order to make the probe 44 (example of the splicing ear of socket) that is arranged on the socket 40, and socket guide rod 41 is fixed on the socket 40 as Figure 10 and shown in Figure 11.The probe 44 of socket 40 is configured on the position corresponding to the outside terminal 22 of IC chip 2 with the number corresponding to the outside terminal 22 of IC chip 2, and by scheme outer spring be endowed upward to elastic potential energy.In the both sides of socket guide rod 41, inserted 2 register pins 32 that are formed on the thruster base 34, and be provided with the guide pin bushing 411 that is used to position between these 2 register pins 32.
Corresponding to the number of socket 40, be provided with thruster shown in Figure 9 30 at the upside of measuring head 5.As shown in Figure 6, each thruster 30 elasticity remains on the match plate 60.Match plate 60 is mounted to such an extent that be positioned at the top of measuring head 5, and makes can insert test pallet TST between thruster 30 and socket 40.Remain on thruster 30 on this match plate 60 with respect to the drive plate (driving body) 72 of measuring head 5 or Z axial brake device 70, can move freely in Z-direction.And then, in Fig. 6, test pallet TST from the direction (X-axis) of vertical paper by conveyance to thruster 30 and the socket 40.Use conveyance with cylinder etc. as the carrying device of the 100 inner conveyance test pallet TST in the chamber.In conveyance mobile test pallet TST, the drive plate of Z axial brake device 70 rises along Z-direction, forms the sufficient gap that can insert test pallet TST between thruster 30 and socket 40.
As shown in Figure 6, below the drive plate 72 that is configured in test cabinet 102 inside, be fixed with pressing component 74, can push top (the guiding the top of thruster base 35) of the thruster 30 that remains on the match plate 60 corresponding to the number of thruster 30.On drive plate 72, be fixed with driving shaft 78, on driving shaft 78, link the drive source (not shown) that motor etc. is arranged, driving shaft 78 is moved up and down along Z-direction, can push thruster 30.
And then, the shape of the IC chip 2 that cooperation should be tested and the socket number of measuring head 5 (number of Ce Shi IC chip 2 simultaneously) etc., match plate 60 and thruster 30 can freely exchange together.So, by with freely exchange match plate 60, can general Z axial brake device.In the present embodiment, pressing component 74 and thruster 30 are corresponding one to one, but for example, are changed to a half at the socket number of measuring head 5, by exchange match plate 60, can make pressing component 74 and thruster 30 with 2 pairs 1 correspondences.
As shown in Figure 9, thruster 30 has: be installed in the guiding thruster base 35, the thruster base 34 that move up and down along Z-direction on the above-mentioned Z axial brake device, be installed in thruster piece 31 on the thruster base 34, be set at the spring 36 (example of elastomeric element material) between guiding thruster base 35 and the thruster piece 31.
As shown in Figure 9, guiding thruster base 35 and thruster base 34 are fixed by bolt, in the both sides of thruster base 34, are provided with the guide hole 20 of embedded part 16 and are inserted into the register pin 32 of the guide pin bushing 411 of socket guide rod 41.In addition, in thruster 34, be provided with the limiter guide rod 33 that is used for deserving to limit when thruster base 34 descends by the Z axial brake device lower limit, because this limiter guide rod 33 is docked on the limiter face 412 of socket guide rod 41, so determined the reference dimension of the lower position of thruster 30, thus, thruster 30 can not destroy IC chip 2 ground that are installed on the socket 40 and pushes with suitable pressure.
As shown in Figure 9, thruster piece 31 is inserted in the through hole of the central authorities that are arranged on thruster base 34, between thruster piece 31 and guiding thruster base 35, and the pad 37 that spring 36 is installed and installs as required.Spring 36 is the compression springs that make thruster piece 31 have elastic potential energy on the direction of pushing the IC chip 2 that is installed on the socket 40 (downward direction in Figure 10 and Figure 11), has corresponding to the elasticity coefficient at the benchmark loading of IC chip 2.
In addition, the benchmark of pad 37 regulating springs 36 under installment state is long and the initial loading of regulating action on thruster piece 31.That is, under the situation of the spring 36 that uses identical elasticity coefficient, become big by pad 37 being installed, being made the initial loading that acts on thruster piece 31.And then in Fig. 9, pad 37 is installed between spring 36 and the thruster piece 31, but because benchmark length that can regulating spring 36 is just enough, for example guides between thruster base 35 and the spring 36 so also can be installed in.
In the situation of use as the spring 36 of elastomeric element material of the present invention, can prepare the spring of a plurality of kinds in advance with different mutually elasticity coefficient, and corresponding in the middle of these, using suitable spring at the benchmark loading of being tested the IC chip.In addition, also can be used as the structure that a plurality of springs can be installed side by side of thruster piece 31, corresponding at the benchmark loading of IC chip 2 and select these installation number.
As shown in figure 10, on thruster piece 31, on the rectangular surfaces 311 relative, be provided with conical jut 312 with the face that is pressed 211 (with the face of the face opposition side that is provided with outside terminal 22) of the body part 21 of IC chip 2.
Be connected with the probe 33 of socket 40 in order to make by the outside terminal 22 of experiment IC chip 2, as shown in figure 10, IC chip 2 is stored in the IC of embedded part 16 storage means 19, below the main part 21 that keeps IC chips 2 by IC holding member 195 in the marginal portion of (being provided with the face of outside terminal 22), the outside terminal 22 that makes IC chip 2 partly exposes from the lower ending opening of IC storage means 19.
Be installed on the socket guide rod 41 by the embedded part 16 that will deposit IC chip 2 like this, IC chip 2 is installed on the socket 40.Under this state, drive the Z axial brake device, push thruster 30.So, the thruster piece 31 of thruster 30 is pressed into the main part 21 of IC chip 2 on the socket 40 as shown in figure 11, its result, and the outside terminal 22 of IC chip 2 is connected with the probe 44 of socket 40.At this moment, the probe 44 of socket 40 is upward to having elastic potential energy and retreating into simultaneously in the socket 40, the fore-end of probe 44 a little bur in outside terminal 22.
If push the main part 21 of IC chip 2 with thruster piece 31, then shown in Figure 12 (c), between the face 311 of the face that is pressed 211 of the main part 21 of IC chip 2 and the thruster piece 31 relative, owing to the existence of jut 312 forms space R with the face of being pressed 211.So, on the face that is pressed 211 of the main part 21 that is installed in the IC chip 2 on the socket 40, as shown in figure 12, under the situation that has attachment S such as silicon relic, if push IC chip 2 with thruster 30, then shown in Figure 12 (b), attachment S contacts with jut 312 on being set at thruster piece 31.Because jut 312 is pointed shape,, apply local power to attachment S so jut 312 contacts (perhaps small area of contact ground contact) with attachment S point.Thus, the attachment S that contacts with jut 312 is flicked, and shown in Figure 12 (c), R moves to the space.Thus, can prevent to apply concentrated load, IC chip 2 is not produced split and broken equivalent damage, and on IC chip 2, apply pressing force towards probe 44 directions of socket 40 to the part of having adhered to attachment S.
In addition,, attachment S and jut 312 discontiguous situations are arranged also, even in this case, because there is space R in attachment S, so can't produce splitting and broken equivalent damage of the IC chip 2 that causes because of attachment S according to the position of attachment S.
Because the material of jut 312 is rubber-like materials, so when jut 312 contacts with attachment S, jut 312 oneself is out of shape, the pressing force that applies to attachment S can be alleviated, thereby splitting and broken equivalent damage of the IC chip 2 that when jut 312 contacts with attachment S, can produce can be prevented.
Even produce each other under the situation of scale error at the jut 312 that is arranged on the thruster piece 31 of thruster 30, the direction of pushing at IC chip 2 has elastic potential energy by spring 36 owing to each jut 312, so when pushing IC chip 2, can absorb the scale error of each jut 312 by spring 36, and can make the pressing force on the face that is pressed 211 that is applied to the IC chip even by each jut 312.That is, the stroke management by each jut 312 and the loading management of each jut 312 can make the pressing force that is applied on the face that is pressed 211 of IC chip by each jut 312 even.
In the present embodiment, in above-mentioned such chamber that constitutes 100, as shown in Figure 6,, temperature adjustment air-supply arrangement 90 is installed in the inside of the airtight shell 80 that constitutes test cabinet 102.Temperature adjustment has fan 92, heat-exchanging part 94 with air-supply arrangement 90, by utilizing the air of fan 92 suction casing inside, again by the spue inside of shell 80 of heat-exchanging part 94, makes the inside of shell 80 remain on the temperature conditions (high temperature or low temperature) of regulation.
Temperature adjustment is under the situation of high temperature in shell inside with the heat-exchanging part 94 of air-supply arrangement 90, have the heat release that makes heating medium circulation structure with heat exchanger or electrothermal heater etc., can for make the shell inner sustain about for example room temperature～160 ℃ high temperature and sufficient heat is provided.In addition, be under the situation of low temperature in shell inside, heat-exchanging part 94 has refrigerant round-robin such as the making liquid nitrogen heat absorption structure with heat exchanger etc., can for make the shell inner sustain for example-60 ℃～low temperature about room temperature and absorb sufficient heat.For example detect the internal temperature of shell 80 by temperature sensor 82, the air quantity of control fan 92 and the heat of heat-exchanging part 94 etc., the inner sustain that makes shell 80 is in set point of temperature.
Hot blast that produces with the heat-exchanging part 94 of air-supply arrangement 90 by temperature adjustment or cold wind flow to shell 80 along Y direction top, descend along shell side wall again with device 90 opposition sides, gap by between match plate 60 and the measuring head 5 turns back to device 90, thereby in the shell inner loop.
The part that the explanation of the 4th part is associated with unloading parts 400.
In Fig. 2 and unloading parts 400 shown in Figure 3, be provided with and be arranged on the X-Y carrying device 404 of X-Y carrying device 304 same structures on the loading part 300, by this X-Y carrying device 404, the IC chip replacement that test finishes is stored in user tray KST from the test pallet TST that is transported unloading parts 400.
As shown in Figure 2, on the device substrate 105 of unloading parts 400, make by conveyance to the user tray KST that should unload parts 400 be in device substrate 105 above and a pair of window part 406,406 that disposes is two pairs of settings.
In addition, omitted diagram, but at the downside of each window part 406, be provided with the lifting table that is used for making user tray KST lifting,, replace and deposit the quilt experiment IC chip that experiment finishes at this, when having piled, loading user tray KST and descending, with full pallet transfer to tray conveying arm 205.
The above example just recorded and narrated of Shuo Ming embodiment in order to understand the present invention easily, the content that the present invention is not limited to put down in writing.So, show that each key element in the above-described embodiments can comprise all design alterations and the equipollent that belongs in the record scope of the present invention.
For example, be arranged on the shape of the jut 312 on the thruster piece 31 of thruster 30, can contacting, or change in the scope of the little face contact of contact area with attachment S point.For example, the shape of jut 312 can be to be beyond the cone shapes such as pyramidal shape, needle-like, can also be pointed shape.As shown in figure 13, shape at jut 312 is under the situation of needle-like, because the space R that forms between the face 311 of the face that is pressed 211 of the main part 21 of IC chip 2 and the thruster piece 31 relative with the face of being pressed 211 becomes big, so when jut 312 contacted with attachment S, attachment S moved to space S easily.In addition, the shape at thrust 312 is under the situation of needle-like the probability step-down that jut 312 contacts with attachment S (that is, attachment S is from uprising with regard to the probability that is present in the R of space at first).
In addition, the chamber type that IC testing apparatus 10 is not limited to illustrate in the above-described embodiments for example, also can be no chamber type, hot plate type.
According to thruster of the present invention and electronic unit experimental provision, even adhering on the face that is pressed of electronic unit under the situation of small pieces such as silicon relic, electronic unit is produced split and broken equivalent damage ground, to the pressing force that is applied by the experiment electronic unit towards the splicing ear direction of socket.
Claims (5)
1. a thruster is the thruster that is used for pushing the main part that is installed in the electronic unit on the socket, it is characterized in that:
On the face relative with the face that is pressed of above-mentioned electronic unit, setting can be pushed the jut of above-mentioned electronic unit to the splicing ear direction of above-mentioned socket.
2. thruster according to claim 1 is characterized in that: above-mentioned jut is pointed shape.
3. according to claim 1 or the described thruster of claim 2, it is characterized in that: above-mentioned jut is set on the position corresponding with the outside terminal of above-mentioned electronic unit.
4. according to any described thruster of claim 1～3, it is characterized in that: be provided with the elastomeric element material that makes above-mentioned jut have elastic potential energy on the direction pushing of above-mentioned electronic unit.
5. an electronic unit experimental provision is characterized in that: any described thruster that possesses claim 1～4.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP001934/01 | 2001-01-09 | ||
| JP001934/2001 | 2001-01-09 | ||
| JP2001001934A JP2002207063A (en) | 2001-01-09 | 2001-01-09 | Pusher and electronic part-testing apparatus with the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1486430A true CN1486430A (en) | 2004-03-31 |
| CN1278130C CN1278130C (en) | 2006-10-04 |
Family
ID=18870510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB018218601A Expired - Fee Related CN1278130C (en) | 2001-01-09 | 2001-12-26 | Pusher and electronic part-testing apparatus with the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2002207063A (en) |
| KR (1) | KR100747076B1 (en) |
| CN (1) | CN1278130C (en) |
| TW (1) | TWI224198B (en) |
| WO (1) | WO2002056040A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104096684A (en) * | 2013-04-03 | 2014-10-15 | 泰克元有限公司 | Sorting Machine For Testing Semiconductor Components |
| CN106405369A (en) * | 2015-07-31 | 2017-02-15 | 精工爱普生株式会社 | Electronic component transportation device and electronic component inspection device |
| CN106903066A (en) * | 2013-07-26 | 2017-06-30 | 泰克元有限公司 | For the impeller component of the matching disc of testing, sorting machine |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG145539A1 (en) * | 2004-03-09 | 2008-09-29 | Micron Technology Inc | Integrated circuit (ic) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
| JP4928496B2 (en) * | 2008-05-09 | 2012-05-09 | 株式会社アドバンテスト | Pusher block |
| KR101830284B1 (en) * | 2011-10-06 | 2018-02-21 | 삼성전자주식회사 | Contact apparatus and equipment for testing semiconductor device using it |
| KR101624981B1 (en) * | 2014-12-29 | 2016-05-30 | (주) 네스텍코리아 | Socket For Testing Electronics |
| JP2017116369A (en) * | 2015-12-24 | 2017-06-29 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0694790A (en) * | 1992-09-16 | 1994-04-08 | Matsushita Electric Ind Co Ltd | Inspecting device for electronic part |
| JPH0815371A (en) * | 1994-07-04 | 1996-01-19 | Fujitsu Ltd | Method and mechanism for measuring ic |
-
2001
- 2001-01-09 JP JP2001001934A patent/JP2002207063A/en not_active Withdrawn
- 2001-12-26 WO PCT/JP2001/011477 patent/WO2002056040A1/en active Application Filing
- 2001-12-26 KR KR1020037009027A patent/KR100747076B1/en not_active IP Right Cessation
- 2001-12-26 CN CNB018218601A patent/CN1278130C/en not_active Expired - Fee Related
- 2001-12-28 TW TW090133033A patent/TWI224198B/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104096684A (en) * | 2013-04-03 | 2014-10-15 | 泰克元有限公司 | Sorting Machine For Testing Semiconductor Components |
| CN106903066A (en) * | 2013-07-26 | 2017-06-30 | 泰克元有限公司 | For the impeller component of the matching disc of testing, sorting machine |
| CN106903066B (en) * | 2013-07-26 | 2019-06-21 | 泰克元有限公司 | The impeller component of matching disc for testing, sorting machine |
| CN106405369A (en) * | 2015-07-31 | 2017-02-15 | 精工爱普生株式会社 | Electronic component transportation device and electronic component inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002056040A1 (en) | 2002-07-18 |
| JP2002207063A (en) | 2002-07-26 |
| KR20030068577A (en) | 2003-08-21 |
| TWI224198B (en) | 2004-11-21 |
| CN1278130C (en) | 2006-10-04 |
| KR100747076B1 (en) | 2007-08-07 |
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