JP2017116369A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device that can prevent an external force from being applied to a placed member.SOLUTION: An inspection device 1 includes a first structure 51 having a recess 511 capable of storing a socket 4 on which an IC device 90 serving as an electronic component is placed, and a second structure 52 being constituted so as to be able to be disposed in the first structure 51 and covering the recess 511. Further, the second structure 52 is not brought into contact with the socket 4 in a state of being disposed in the first structure 51.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, for example, an electronic component inspection apparatus that inspects electrical characteristics of electronic components such as IC devices is known. This electronic component inspection apparatus includes an electronic device for transporting an IC device to a mounting member of an inspection unit. A parts conveying device is incorporated. When inspecting the IC device, the IC device gripped by the gripping portion of the electronic component transport apparatus is placed on the mounting member. And a holding part presses an IC device toward a mounting member. Thereby, the plurality of terminals of the IC device are pressed against the plurality of probe pins provided on the mounting member, and the terminals of the IC device and the probe pins come into contact with each other and are electrically connected.

  In the electronic component inspection apparatus described in Patent Document 1, the mounting member (socket) is configured to be covered with a socket guide that guides the grip portion. The socket guide has a guide pin that guides the grip portion when the grip portion presses the electronic component. The guide pin is inserted into the guide hole of the grip portion, thereby positioning the socket guide and the grip portion.

JP 2003-28923 A

  However, the electronic component transport device described in Patent Document 1 is configured such that when the gripping portion presses the IC device, the gripping portion presses the socket guide. Further, since the socket guide and the mounting member are in contact with each other, the pressing force with which the gripping part presses the socket guide is transmitted to the mounting member. Depending on the degree of this pressing force, the mounting member may be deformed.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

The electronic component transport device of the present invention includes a first structure having a recess capable of accommodating a placement member on which an electronic component is placed;
A second structure that can be disposed in the first structure and covers the recess,
When the second structure is disposed on the first structure, the second structure does not contact the mounting member.

  Thereby, when an external force is applied to the second structure, it is possible to prevent the external force from being transmitted to the mounting member. Therefore, it is possible to prevent the mounting member from being damaged.

In the electronic component transport device of the present invention, it is preferable that the depth of the concave portion is larger than the thickness of the mounting member.
Thereby, it can prevent that a mounting member and a 2nd structure contact.

In the electronic component transport device according to the present invention, it is preferable that a gap is formed between the second structure and the mounting member.
Thereby, it can prevent that a mounting member and a 2nd structure contact.

In the electronic component transport apparatus according to the present invention, it is preferable that the electronic component transport apparatus includes a positioning unit that positions the first structure and the second structure.
Thereby, positioning with a 1st structure and a 2nd structure can be performed.

In the electronic component transport apparatus according to the present invention, it is preferable that the electronic component transport apparatus includes a positioning portion that positions the second structure and the mounting member.
Thereby, positioning with a 2nd structure and a mounting member can be performed.

  In the electronic component transport device of the present invention, it is preferable that the second structure body can cover one of the concave portions.

  Thereby, the size of the second structure can be reduced. Therefore, even when an external force is applied to the second structure, deformation can be made difficult.

In the electronic component transport device of the present invention, the first structure has a plurality of the recesses,
It is preferable that the second structure body can collectively cover the plurality of concave portions.

  Thereby, the number of 2nd structures can be reduced. Therefore, the assembly work of the first structure and the second structure can be simplified.

In the electronic component transport device of the present invention, the mounting member is to be screwed,
The second structure body is preferably provided with a tool insertion hole through which a tool used for screwing can be inserted.

  Thereby, in the state which covered the recessed part with the 2nd structure, screwing of a mounting member can be performed using a tool.

In the electronic component transport device of the present invention, the electronic component transport device has a base material on which the first structure is placed,
It is preferable that the first structure has a positioning portion for positioning with respect to the base material.
Thereby, positioning with a 1st structure and a base material can be performed.

In the electronic component conveying apparatus of the present invention, the electronic component conveying device has a conveying unit for conveying the electronic component,
It is preferable that the second structure has a positioning unit that performs positioning with respect to the transport unit.
Thereby, positioning with a 2nd structure and a conveyance part can be performed.

In the electronic component conveying apparatus of the present invention, it is preferable that the mounting member is disposed in an inspection area where the electronic component is inspected.
Thereby, it can prevent that external force is added to the mounting member in a test | inspection area | region.

The electronic component inspection apparatus of the present invention includes a first structure having a recess capable of accommodating a placement member on which an electronic component is placed;
A second structure that can be disposed in the first structure and covers the recess;
An inspection unit for inspecting the electronic component,
When the second structure is disposed on the first structure, the second structure does not contact the mounting member.

  Thereby, when an external force is applied to the second structure, it is possible to prevent the external force from being transmitted to the mounting member. Therefore, it is possible to prevent the mounting member from being damaged.

FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a cross-sectional view showing a mounting member, a first structure, and a second structure provided in the inspection section shown in FIG. FIG. 3 is a cross-sectional view showing a process of assembling the mounting member, the first structure, and the second structure shown in FIG. FIG. 4 is a cross-sectional view showing a process of assembling the mounting member, the first structure, and the second structure shown in FIG. FIG. 5 is a cross-sectional view showing a process of assembling the mounting member, the first structure, and the second structure shown in FIG. 6 is a cross-sectional view showing a process of assembling the mounting member, the first structure, and the second structure shown in FIG. FIG. 7 is a cross-sectional view of an inspection unit provided in the second embodiment of the electronic component inspection apparatus of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a cross-sectional view showing a mounting member, a first structure, and a second structure provided in the inspection section shown in FIG. 3-6 is sectional drawing which shows the process of assembling the mounting member shown in FIG. 2, a 1st structure, and a 2nd structure.

  In the following, for convenience of explanation, as shown in FIGS. 1 to 6 (the same applies to FIG. 7), the three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball Grid Array) package and an LGA (Land Grid Array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component conveyance apparatus that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 80. In the inspection apparatus 1, from the tray supply area A1 to the tray removal area A5, the area from the supply area A2 to which the IC device 90 is conveyed to the collection area A4 can also be referred to as “convey area (convey area)”.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are disposed (the lower side in FIG. 1) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is disposed (see FIG. 1). 1 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (mounting member) 200 in which a plurality of uninspected IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjusting unit (soak plate) 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature adjustment unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and can heat or cool the plurality of IC devices 90. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided.

  The device supply unit 14 is a mounting unit on which the temperature-adjusted IC device 90 is mounted, and can transport the IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. The

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, and includes a socket (mounting member) 4 on which the IC device 90 is mounted and a socket guide 5 that covers the socket 4. Yes. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the inspection area A3. The device transport head 17 includes a head main body 171 and a hand portion 172 that can suck and grip the IC device 90 (see FIG. 2). Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16.

  The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and can transport the IC device 90 to the collection region A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 includes any one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism (second conveyance device) 21A are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the collection area A4. In the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. The empty trays 200 are also placement units on which the IC devices 90 are placed, and three empty trays 200 are arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21A is a mechanism for transporting an empty tray 200 carried in from the tray removal area A5 in the recovery area A4 in the X direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21A is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

  The configurations of the tray transport mechanisms 15 and 21A are not particularly limited. For example, the tray transport mechanisms 15 and 21A include a suction member that sucks the tray 200 and a support mechanism such as a ball screw that supports the suction member so as to be movable in the X direction. Is mentioned.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The control unit 80 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, tray conveyance mechanism 21A, and tray conveyance mechanisms 22A and 22B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  In the inspection apparatus 1 as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. Thereby, the temperature of the IC device 90 is kept constant while being transported.

  As shown in FIG. 1, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by a first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region. Further, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, side covers 71 and 72, and a rear cover 73.

  The supply area A2 is a first chamber R1 defined by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear cover 73. A plurality of IC devices 90 in an uninspected state are carried into the first chamber R1 together with the tray 200.

  The inspection area A3 is a second chamber R2 defined by the second partition wall 62, the third partition wall 63, and the rear cover 73. In the second chamber R2, an inner partition 66 is disposed on the inner side of the rear cover 73.

  The collection area A4 is a third chamber R3 defined by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the rear cover 73. A plurality of IC devices 90 that have been inspected are carried into the third chamber R3 from the second chamber R2.

  As shown in FIG. 1, the side cover 71 is provided with a first door (left first door) 711 and a second door (left second door) 712. By opening the first door 711 and the second door 712, for example, maintenance in the first chamber R1, release of jam in the IC device 90, and the like (hereinafter collectively referred to as “work”) can be performed. The first door 711 and the second door 712 are so-called “folding doors” that open and close in opposite directions. In addition, when working in the first chamber R1, movable parts such as the device transport head 13 in the first chamber R1 are stopped.

  Similarly, the side cover 72 is provided with a first door (right first door) 721 and a second door (right second door) 722. By opening the first door 721 and the second door 722, for example, work in the third chamber R3 can be performed. The first door 721 and the second door 722 are also so-called “folding doors” that open and close in opposite directions. Further, during the work in the third chamber R3, the movable part such as the device transport head 20 in the third chamber R3 stops.

  The rear cover 73 is also provided with a first door (back side first door) 731, a second door (back side second door) 732, and a third door (back side third door) 733. By opening the first door 731, for example, work in the first chamber R <b> 1 can be performed. By opening the third door 733, for example, work in the third chamber R3 can be performed. Further, the inner partition 66 is provided with a fourth door 75. Then, by opening the second door 732 and the fourth door 75, for example, work in the second chamber R2 can be performed. The first door 731, the second door 732, and the fourth door 75 open and close in the same direction, and the third door 733 opens and closes in the opposite direction to these doors. Further, during the work in the second chamber R2, the movable parts such as the device transport head 17 in the second chamber R2 are stopped.

  Next, the configuration of the inspection unit 16 will be described in detail. As shown in FIG. 2, the inspection unit 16 includes a test board (base material) 2, a reinforcing material 3, a socket (mounting member) 4, and a socket guide 5.

  The test board 2 is composed of a wiring board and is electrically connected to the control unit 80. The test board 2 supports the socket 4 and the socket guide 5. Further, the test board 2 has a plurality of screw holes 21 and screw holes 22 penetrating in the thickness direction.

  The reinforcing material 3 increases the strength of the test board 2 and is made of a material having high rigidity, such as a metal material. The reinforcing member 3 is provided with a plurality of screw holes 31 and screw holes 32.

  The socket 4 has a plate shape and is a member disposed on the upper surface of the test board 2 and has a recess 41 in which the IC device 90 is accommodated. The socket 4 is provided with probe pins (not shown) that are electrically connected to the terminals of the IC device 90 in the recess 41. The IC device 90 is connected to the test board 2 via the probe pins. Electrically connected. Thus, the IC device 90 can be inspected via the probe pin.

  The socket 4 has a plurality of screw holes 42 through which the screws 6 are inserted and a plurality of guide holes 43 into which guide pins (mounting member positioning portions) 9 are inserted. In such a socket 4, the screw 6 is inserted into the screw hole 42, the screw hole 21, and the screw hole 31 to be screwed. Thereby, the socket 4 can be fixed to the test board 2.

  The socket guide 5 shown in FIG. 2 is a member that positions the device transport head 17 with respect to the socket 4. The socket guide 5 includes a first structure 51 and a second structure 52 that are arranged so as to surround the periphery of the socket 4.

  The first structure 51 is a frame member that is disposed on the upper surface of the test board 2 via an insulating spacer 50. For this reason, it can prevent that the test board 2 and the 1st structure 51 will be in an energized state. The 1st structure 51 has the recessed part 511 penetrated in the thickness direction. The recess 511 can accommodate the socket 4. For this reason, in the storage state in which the socket 4 is stored in the recess 511, the first structure 51 is disposed so as to surround the socket 4. The inspection apparatus 1 may be configured such that the insulating spacer 50 is omitted and an insulating layer is provided on the lower surface of the first structure 51.

  Moreover, the edge part of the 1st structure 51 becomes the protrusion part 512 protruded to the upper side in FIG. The protruding portion 512 is provided with a plurality of guide pins (conveying head positioning portions) 40. The guide pin 40 is inserted into a guide hole 173 provided in the head main body 171 of the device transport head 17. Thereby, the socket guide 5 can be positioned with respect to the device transport head 17.

  The first structure 51 is provided with a plurality of screw holes 513 on the inner side of the protruding portion 512 and on the outer side of the concave portion 511. The screw hole 513 is formed penetrating in the thickness direction of the first structure 51. Thereby, it is possible to communicate with the screw hole 22 of the test board 2 and the screw hole 32 of the reinforcing member 3. Thereby, the screw 7 can be inserted into the screw hole 513, the screw hole 22, and the screw hole 32, and the first structure 51 can be screwed to the test board 2.

  The first structure 51 is provided with a plurality of installation holes 514 provided between the recesses 511 and the screw holes 513. A guide pin (socket guide positioning portion) 10 is installed in the installation hole 514.

  The first structure 51 is provided with a plurality of screw holes 515 between the recess 511 and the installation hole 514. The screw 8 is inserted into the screw hole 515, and the first structure 51 and the second structure 52 can be fixed.

  The second structure 52 is a plate-like lid member disposed on the first structure 51 so as to cover the recess 511. The second structure 52 has a guide pin (hand positioning part) 30 that protrudes upward. When the IC device 90 is inspected, the device transport head 17 can be positioned with respect to the second structure 52 by inserting the guide pins 30 into the guide holes 174 of the device transport head 17.

  The second structure 52 has a through hole 521 that opens upward, a plurality of tool insertion holes 522 provided outside the through hole 521, and a plurality of screw holes provided outside the tool insertion hole 522. 523 is formed.

  The through hole 521 is provided at the center of the second structure 52. Further, the through hole 521 has a size that allows the IC device 90 and the tip of the hand portion 172 of the device transport head 17 to be inserted.

  As shown in FIG. 2, the tool insertion holes 522 are provided at positions corresponding to the screw holes 42 of the socket 4 in the assembled state in which the first structure 51 and the second structure 52 are assembled. That is, the tool insertion hole 522 is located above the screw hole 42 in the assembled state. Further, the tool insertion hole 522 has a size that allows a tool 300 such as a screwdriver to be screwed by rotating the screw 6 to be inserted (see FIG. 6).

  Further, the second structure 52 is provided with positioning holes 524 and 525 that open downward. A plurality of positioning holes 524 and 525 are provided.

  The positioning hole 524 is provided between the tool insertion hole 522 and the screw hole 523. The positioning hole 524 can position the second structure 52 and the socket 4 by inserting the guide pin 9.

  The positioning hole 525 is provided outside the screw hole 523. The positioning hole 525 can position the first structure 51 and the second structure 52 by inserting the guide pin 10.

  Here, as shown in FIG. 2, the depth (minimum depth) D of the recess 511 is larger than the thickness (maximum thickness) T of the IC device 90. For this reason, it can prevent that the socket 4 and the 2nd structure 52 contact in an assembly state.

  When the IC device 90 is inspected, the hand portion 172 of the device transport head 17 indicated by a two-dot chain line in FIG. 2 presses the IC device 90 downward, and the device transport head 17 has the second structure. The body 52 is pressed downward. In the inspection apparatus 1, as described above, the socket 4 and the second structure 52 are not in contact with each other. That is, a gap S is formed between the socket 4 and the second structure 52. Thereby, it is possible to prevent the pressing force that the hand portion 172 of the device transport head 17 presses the second structure 52 from being applied to the socket 4. Therefore, deformation of the socket 4 due to excessive external force applied to the socket 4 can be prevented.

  Further, since the inspection apparatus 1 has a configuration in which one IC device 90 is disposed in the recess 511, the size of the recess 511 when viewed from the Z-axis direction can be made as small as possible. Thereby, the magnitude | size of the 2nd structure 52 can be made small. Therefore, although depending on the constituent material of the second structure 52, even if an external force is applied to the second structure 52, it can be made difficult to deform. As a result, the contact between the second structure 52 and the socket 4 can be more effectively prevented.

  Next, a procedure for attaching the socket 4 and the socket guide 5 to the test board 2 will be described.

  First, as shown in FIG. 3, the socket 4 is arranged on the upper surface of the test board 2, and temporary screws are secured using screws 6. At this time, the tip end of the screw 6 is separated from the bottom of the screw hole 31 (hereinafter, this state is referred to as “temporary screwing state”). That is, the screw 6 is turned to the point before the screwing is completed. By setting the temporary screwing state, the socket 4 can move slightly in the XY plane. That is, the socket 4 can play.

  Next, as shown in FIG. 4, the first structure 51 is installed on the upper surface of the test board 2 so that the socket 4 is accommodated in the recess 511. Then, the screw 7 is turned into the screw hole 513 of the first structure 51, the screw hole 22 of the test board 2, and the screw hole 32 of the reinforcing member 3, and the first structure 51 is moved with respect to the test board 2. Secure with screws. At this time, the screw 7 functions as a positioning portion (base material positioning portion), and the first structure 51 can be fixed to the test board 2 and positioned.

  Next, as shown in FIG. 5, the second structure 52 is fixed to the first structure 51. At this time, it is preferable to insert the guide pin 10 into the installation hole 514 of the first structure 51 and insert the guide pin 9 into the guide hole 43 of the socket 4 in advance. Then, the second structure 52 is moved closer to the first structure 51 so that the guide pin 9 is inserted into the positioning hole 524 and the guide pin 10 is inserted into the positioning hole 525. Accordingly, the second structure 52 can be positioned with respect to the first structure 51 and the second structure 52 can be positioned with respect to the socket 4.

  In particular, at the time of this positioning, as described above, the socket 4 is in a temporary screwed state and can move slightly in the XY plane. Thereby, the position of the socket 4 can be finely adjusted, and the guide pin 9 can be inserted into the positioning hole 524 of the second structure 52.

  In this positioning state, the screw 8 is inserted and turned into the screw hole 523 of the second structure 52 and the screw hole 515 of the first structure 51. Thereby, the 2nd structure 52 can be fixed with respect to the 1st structure 51 with a positioning state.

  Further, in the inspection apparatus 1, when the device transport head 17 places the IC device 90 in the socket 4, first, the guide pins 40 are inserted into the guide holes 173 to perform primary positioning. Next, when the guide pin 30 is inserted into the guide hole 174, the guide pin 30 is inserted into the guide hole 174 of the hand portion 172, and the secondary positioning is performed. At the time of this secondary positioning, since the hand portion 172 is in a floating state, the guide pin 30 can be easily inserted into the guide hole 174.

  Next, as shown in FIG. 6, the screw 6 in a temporarily screwed state is turned using a tool 300. As a result, the socket 4 can be fixed (mainly fixed) to the test board 2. Since the second structure 52 is provided with a tool insertion hole 522 through which the tool 300 can be inserted, the screw 6 can be turned in with the second structure 52 fixed to the first structure 51. it can.

Second Embodiment
FIG. 7 is a cross-sectional view of an inspection unit provided in the second embodiment of the electronic component inspection apparatus of the present invention.

  Hereinafter, the third embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and the same matters will be described. Is omitted.

This embodiment is the same as the first embodiment except that the configuration of the first structure is different.
As shown in FIG. 7, the inspection unit 16 of the inspection apparatus 1A includes a first structure 51A and a second structure 52A.

  The first structure 51 </ b> A has a plurality of recesses 511. One socket 4 is housed in each recess 511. In the first structure 51 </ b> A, the portion 516 between the recesses 511 functions as a support portion that contacts and supports the second structure 52.

  In the second structure 52A, two through holes 521 are provided corresponding to the respective recesses 511. In addition, a total of four tool insertion holes 522 are provided, two for each of the recesses 511. In addition, a total of four positioning holes 524 are provided corresponding to the respective recesses 511, two each. Further, a total of four guide pins 30 are provided corresponding to each recess 511, two each.

  Thus, in the inspection apparatus 1A, the two concave portions 511 are collectively covered with one second structure 52A. Thereby, for example, the number of the second structures 52A can be reduced as compared with the configuration in which each of the recesses 511 is covered with the two second structures 52A. Therefore, the assembly work of the first structure 51A and the second structure 52A can be simplified.

  In particular, the portion 516 between the concave portions 511 functions as a support portion that supports the second structure 52A. Accordingly, even when the second structure 52A is pressed by the device transport head 17 during the inspection, it can be prevented from being deformed. Therefore, it can prevent more effectively that the 2nd structure 52A contacts the socket 4. FIG.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus, 1A ... Inspection apparatus, 2 ... Test board, 3 ... Reinforcement material, 31 ... Screw hole, 32 ... Screw hole, 4 ... Socket, 41 ... Recessed part, 42 ... Screw Hole 43... Guide hole 5. Socket guide 5 A Socket socket 50. Insulating spacer 51 51 First structure 51 A First structure 511 Recess 512 Projection, 513 ... Screw hole, 514 ... Installation hole, 515 ... Screw hole, 516 ... Part, 52 ... Second structure, 52A ... Second structure, 521 ... Through hole, 522 ... ... tool insertion hole, 523 ... screw hole, 524 ... positioning hole, 525 ... positioning hole, 6 ... screw, 7 ... screw, 8 ... screw, 9 ... guide pin, 10 ... guide pin, 11A ... Tray transport mechanism, 11B ... Tray transport mechanism, 12 ... Temperature adjustment , 13... Device transfer head, 14... Device supply unit, 15... Tray transfer mechanism, 16 .. Inspection unit, 17... Device transfer head, 171. Guide hole, 174... Guide hole, 18... Device recovery section, 19... Recovery tray, 20... Device transfer head, 21... Screw hole, 21 A. ... Tray transfer mechanism, 22B ... Tray transfer mechanism, 30 ... Guide pin, 40 ... Guide pin, 61 ... First partition, 62 ... Second partition, 63 ... Third partition, 64 ... First 4 partition walls, 65 ... fifth partition wall, 66 ... inner partition wall, 70 ... front cover, 71 ... side cover, 711 ... first door, 712 ... second door, 72 ... side cover, 721 ... ... First door, 722 ... second door 73 ... rear cover 731 ... first door 732 ... second door 733 ... third door 75 ... fourth door 80 ... control unit 90 ... IC device 200 ... tray, 300 ... tool, A1 ... tray supply area, A2 ... supply area, A3 ... inspection area, A4 ... collection area, A5 ... tray removal area, D ... depth, T ... ... Thickness, R1 ... first chamber, R2 ... second chamber, R3 ... third chamber, S ... gap

Claims (12)

A first structure having a recess capable of accommodating a placement member on which an electronic component is placed;
A second structure that can be disposed in the first structure and covers the recess,
The electronic component transport apparatus according to claim 1, wherein the second structure body does not contact the mounting member when the second structure body is disposed in the first structure body.   The electronic component transport apparatus according to claim 1, wherein a depth of the recess is greater than a thickness of the mounting member.   The electronic component transport apparatus according to claim 1, wherein a gap is formed between the second structure and the mounting member.   The electronic component transport apparatus according to claim 1, further comprising a positioning unit that positions the first structure and the second structure.   5. The electronic component carrying device according to claim 1, further comprising a positioning portion that positions the second structure and the mounting member.   The electronic component transport apparatus according to claim 1, wherein the second structure body can cover one of the recesses. The first structure has a plurality of the recesses,
6. The electronic component carrying device according to claim 1, wherein the second structure body can cover the plurality of concave portions at a time. The mounting member is to be screwed,
The electronic component conveying apparatus according to any one of claims 1 to 7, wherein a tool insertion hole into which a tool used for screwing is inserted is provided in the second structure. A substrate on which the first structure is placed;
The electronic component conveying apparatus according to any one of claims 1 to 8, wherein the first structure includes a positioning portion that positions the base member. A transport unit for transporting the electronic component;
The electronic component transport apparatus according to claim 1, wherein the second structure includes a positioning unit that performs positioning with respect to the transport unit.   The electronic component transport apparatus according to claim 1, wherein the placement member is disposed in an inspection area where the electronic component is inspected. A first structure having a recess capable of accommodating a placement member on which an electronic component is placed;
A second structure that can be disposed in the first structure and covers the recess;
An inspection unit for inspecting the electronic component,
The electronic component inspection apparatus according to claim 1, wherein the second structure does not contact the mounting member when the second structure is disposed in the first structure.

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