JP6593071B2 - Electronic component conveying device and electronic component inspection device - Google Patents

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects electrical characteristics of an electronic component such as a semiconductor element is known. This electronic component inspection apparatus is configured to classify electronic components according to inspection results. The classification includes “examination result good”, “examination result defect”, “re-examination required (see, for example, Patent Document 1)” and the like.

JP 2000-258507 A

  In the case of “re-inspection required”, the corresponding electronic component must be set again in the electronic component inspection apparatus in a state where it is placed on the tray (mounting member). This has been troublesome for the operator. Further, depending on the accuracy of the setting operation, the electronic component may be displaced on the tray or the electronic component may be detached from the tray.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport device of the present invention includes a transport unit capable of transporting a placement member on which an electronic component is placed,
The transport unit includes a cover unit that covers a mounting surface on which the electronic component of the mounting member is mounted;
It has an engaging part engageable with the above-mentioned mounting member, It is characterized by the above-mentioned.

  According to the present invention, the mounting member can be stably conveyed by the engagement of the engaging portion. Moreover, since the cover which covers a mounting surface is provided, a cover member will cover an electronic component in the state in which the electronic component was mounted in the mounting member. Thereby, it can prevent that an electronic component detaches | leaves from a mounting member. Therefore, the electronic component can be stably conveyed along with the mounting member.

In the electronic component transport device of the present invention, a plurality of the engaging portions are provided,
Each of the engaging portions is preferably movable in different directions in a direction parallel to the placement surface.

  Due to the engagement of the two engaging portions, the mounting member can be transported more stably. Further, since the engaging portion is configured to be movable, the engaging portion can be engaged and released.

  In the electronic component conveying apparatus according to the present invention, it is preferable that the engaging portion has a claw shape having a concave portion recessed in a direction parallel to the placement surface.

  Thereby, a part of mounting member enters in a recessed part, and the state which the engaging part engaged can be maintained stably.

  In the electronic component transport device according to the present invention, it is preferable that, among the engaging portions, the engaging portions configured to be able to approach and separate from each other engage with the placement member when approaching.

  Thereby, for example, when the transport unit approaches the placement member, the respective engaging units can approach each other in a separated state. Therefore, when the transport unit approaches the placement member, the engaging unit can be prevented from obstructing the approach.

In the electronic component transport device of the present invention, each of the engaging portions is operated by a cylinder that is operated by being supplied with a working fluid.
In a state where the working fluid is not supplied, it is preferable that the engaging portions are in an approaching state.

  Thereby, for example, even if a malfunction occurs in the cylinder and the operation is stopped unintentionally, the engaging portion is brought into a close state. Therefore, even if a malfunction occurs in the cylinder in the engaged state, it is possible to prevent the mounting member from being unintentionally detached from the transport unit.

In the electronic component transport device of the present invention, the mounting member is a rectangle having a long side and a short side when viewed in a plane from a direction orthogonal to the mounting surface,
The engaging portion preferably engages with the short side of the mounting member.

  Thereby, the wobble at the time of conveyance of a mounting member can be suppressed compared with the case where an engaging part engages with a long side.

  In the electronic component transport device of the present invention, it is preferable that the cover portion has a hole in a portion that comes into contact with the electronic component.

  Thereby, the area where the cover part is in contact with the electronic component can be reduced. Therefore, for example, vibration transmitted from the transport unit to the electronic component can be suppressed.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the cover portion has a protruding portion at a portion that comes into contact with the electronic component.

  Thereby, an electronic component can be pressed against a mounting member by a protrusion part. Therefore, the electronic component can be stably conveyed along with the mounting member.

In the electronic component transport device according to the aspect of the invention, it is preferable that at least a portion of the cover that is in contact with the electronic component is made of a conductive material.
As a result, the electronic component can be prevented or suppressed from being charged.

  In the electronic component conveying apparatus of the present invention, the conductive material is preferably a conductive resin.

  Since the conductive resin material has a lower hardness than, for example, a metal material, the electronic component can be prevented or suppressed from being damaged.

In the electronic component transport apparatus according to the present invention, it is preferable that the cover portion can contact the mounting surface.
Thereby, the stability in an engagement state can be improved more.

  In the electronic component transport apparatus according to the present invention, it is preferable that the transport unit includes a biasing unit that biases the cover unit toward the placement surface.

  Thereby, an engaging part can engage with a mounting member in the biased state. Therefore, the stability in the engaged state can be further increased.

In the electronic component conveying apparatus of the present invention, it is preferable that a plurality of the urging portions are provided.
Thereby, a mounting member can be urged | biased in several places. Therefore, the stability in the engaged state can be further increased.

  In the electronic component transport device of the present invention, each of the urging portions is arranged so that the shape formed by connecting the arrangement positions of the urging portions with line segments in a plan view of the placement surface is a rectangle. It is preferable.

  Thereby, a mounting member can be urged | biased in several places. Therefore, the stability in the engaged state can be further increased.

  In the electronic component conveying apparatus of the present invention, it is preferable that the cover portion is configured to be movable toward the placement surface, and the movable range is 2 mm or more and 4 mm or less.

  Thereby, when a cover part is pressed by the mounting part, a part of pressing force can be escaped. Therefore, it can prevent that a cover part is pressed by the force more than necessary to a mounting part. As a result, the impact applied to the mounting member and the electronic component can be reduced.

  In the electronic component transport apparatus according to the present invention, it is preferable that the transport unit has a buffer unit that reduces an impact applied from a direction intersecting with the placement surface.

  Thereby, the conveyance part can relieve the impact which arises when a cover part and a mounting member contact | abut. Therefore, the impact applied to the mounting member and the electronic component can be reduced.

The electronic component inspection apparatus of the present invention includes a transport unit capable of transporting a placement member on which an electronic component is placed,
An inspection unit for inspecting the electronic component,
The transport unit includes a cover unit that covers a mounting surface on which the electronic component of the mounting member is mounted;
It has an engaging part engageable with the above-mentioned mounting member, It is characterized by the above-mentioned.

  According to the present invention, the mounting member can be stably conveyed by the engagement of the engaging portion. Moreover, since the cover which covers a mounting surface is provided, a cover member will cover an electronic component in the state in which the electronic component was mounted in the mounting member. Thereby, it can prevent that an electronic component detaches | leaves from a mounting member. Therefore, the electronic component can be stably conveyed along with the mounting member.

FIG. 1 is a schematic perspective view of an electronic component inspection apparatus according to an embodiment of the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing a normal operation state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a schematic plan view sequentially showing the retest operation state of the electronic component inspection apparatus shown in FIG. FIG. 4 is a schematic plan view sequentially illustrating the retest operation state of the electronic component inspection apparatus shown in FIG. FIG. 5 is a schematic plan view sequentially showing the retest operation state of the electronic component inspection apparatus shown in FIG. FIG. 6 is a schematic plan view sequentially showing the retest operation state of the electronic component inspection apparatus shown in FIG. FIG. 7 is a schematic plan view sequentially showing the retest operation state of the electronic component inspection apparatus shown in FIG. FIG. 8 is a schematic plan view sequentially showing the retest operation state of the electronic component inspection apparatus shown in FIG. FIG. 9 is a perspective view showing the tray transport mechanism (transport unit) shown in FIG. FIG. 10 is a cross-sectional view showing the tray transport mechanism (transport section) shown in FIG. FIG. 11 is a cross-sectional view showing the tray transport mechanism (transport section) shown in FIG. FIG. 12 is a cross-sectional view showing the tray transport mechanism (transport section) shown in FIG. FIG. 13 is a front view of the connecting portion shown in FIG. 9 and shows a state where the tray transport mechanism (transport portion) is raised. FIG. 14 is a side view of the connecting portion shown in FIG. 9 and shows a state where the tray transport mechanism (transport portion) is raised. FIG. 15 is a front view of the connecting portion shown in FIG. 9 and shows a state in which the tray transport mechanism (transport portion) is lowered. FIG. 16 is a side view of the connecting portion shown in FIG. 9 and shows a state where the tray transport mechanism (transport portion) is lowered. FIG. 17 is a diagram for explaining the operation of the upstream side positioning unit and the downstream side positioning unit, and is a diagram illustrating a state in which the transport unit is positioned above the second position. FIG. 18 is a diagram for explaining the operation of the upstream positioning unit and the downstream positioning unit, and is a diagram illustrating a state where the transport unit is lowered. FIG. 19 is a diagram for explaining the operation of the upstream side positioning unit and the downstream side positioning unit, and is a diagram illustrating a state in which the transport unit is positioned above the first position. FIG. 20 is a diagram for explaining the operation of the upstream positioning unit and the downstream positioning unit, and is a diagram illustrating a state where the transport unit is lowered. FIG. 21 is a perspective view showing a tray transport mechanism (transport section) of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 22 is a cross-sectional view showing a tray transport mechanism (transport section) of the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 23 is a diagram showing an upstream positioning portion and a downstream positioning portion of the electronic component inspection apparatus (fourth embodiment) of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic perspective view of an electronic component inspection apparatus according to an embodiment of the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing a normal operation state of the electronic component inspection apparatus shown in FIG. 3 to 8 are schematic plan views sequentially showing the retest operation state of the electronic component inspection apparatus shown in FIG. FIG. 9 is a perspective view showing the tray transport mechanism (transport unit) shown in FIG. FIG. 10 is a cross-sectional view showing the tray transport mechanism (transport section) shown in FIG. FIG. 11 is a cross-sectional view showing the tray transport mechanism (transport section) shown in FIG. FIG. 12 is a cross-sectional view showing the tray transport mechanism (transport section) shown in FIG. FIG. 13 is a front view of the connecting portion shown in FIG. 9 and shows a state where the tray transport mechanism (transport portion) is raised. FIG. 14 is a side view of the connecting portion shown in FIG. 9 and shows a state where the tray transport mechanism (transport portion) is raised. FIG. 15 is a front view of the connecting portion shown in FIG. 9 and shows a state in which the tray transport mechanism (transport portion) is lowered. FIG. 16 is a side view of the connecting portion shown in FIG. 9 and shows a state where the tray transport mechanism (transport portion) is lowered. FIG. 17 is a diagram for explaining the operation of the upstream side positioning unit and the downstream side positioning unit, and is a diagram illustrating a state in which the transport unit is positioned above the second position. FIG. 18 is a diagram for explaining the operation of the upstream positioning unit and the downstream positioning unit, and is a diagram illustrating a state where the transport unit is lowered. FIG. 19 is a diagram for explaining the operation of the upstream side positioning unit and the downstream side positioning unit, and is a diagram illustrating a state in which the transport unit is located above the first position. FIG. 20 is a diagram for explaining the operation of the upstream positioning unit and the downstream positioning unit, and is a diagram illustrating a state where the transport unit is lowered.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered. Further, in the path where the electronic component is conveyed, at the time of normal inspection (at the time of initial inspection), the side where the electronic component is supplied is also referred to as “upstream side”, and the side where the electronic component is discharged is also referred to as “downstream side”. .

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIGS. 1 and 2 includes, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), a CIS (CMOS This is a device for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as an image sensor. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component conveyance apparatus that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 800. In addition, the inspection apparatus 1 includes a monitor 300, an operation panel 700, and a signal lamp 400.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged (the lower side in FIG. 2) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is arranged (FIG. 2 is used as the back side.

  The tray supply area A1 is usually a material supply unit to which a tray (mounting member) 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  Here, as shown in FIGS. 10 to 12, the tray 200 has a rectangular plate shape, and a plurality of recesses 202 are formed on one surface side. The IC device 90 is disposed in the recess 202. Further, the tray 200 has a shape in which the edge 201 on the short piece side protrudes outward. The “mounting surface” of the tray 200 includes the upper surface of the tray 200 and the inner surface of the recess 202 in this specification.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11 </ b> A is a moving unit that can move the tray 200 in both the positive and negative directions in the Y direction together with the IC devices 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, from the supply area A2 to the tray supply area A1.

In the supply area A2, a temperature adjusting unit 12 and a device transport head 13 are provided.
The temperature adjustment unit 12 is a member that can collectively cool and heat a plurality of IC devices 90 and is sometimes referred to as a “soak plate”. With the soak plate, the IC device 90 before being inspected by the inspection unit 16 can be cooled or heated in advance and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the tray transport mechanism 11A is transported to one of the temperature adjustment units 12.

  The device transport head 13 is supported so as to be movable in the X and Y directions and further in the Z direction within the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 and a device transport head 17 are provided. In addition, a device supply unit 14 that moves so as to straddle the supply region A2 and the inspection region A3 and a device recovery unit 18 that moves so as to straddle the inspection region A3 and the recovery region A4 are also provided.

  The device supply unit 14 is a moving unit on which the temperature-adjusted IC device 90 is placed and can transport (move) the IC device 90 to the vicinity of the inspection unit 16, and is referred to as a “supply shuttle plate”. Sometimes. The device supply unit 14 is supported so as to be movable in the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14. In the device supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be cooled or heated to adjust the IC device 90 to a temperature suitable for inspection.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be cooled or heated to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the Y direction within the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. The device transport head 17 can also cool or heat the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

  The device collection unit 18 is a moving unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and can transport (move) the IC device 90 to the collection region A4. Sometimes called a “plate”. The device collection unit 18 is supported so as to be movable in the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19 and a device transport head 20 are provided. Also, an empty tray 200 is usually prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the collection area A4. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction. The empty trays 200 are also placement units on which the IC devices 90 are placed, and three empty trays 200 are arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

  The device transport head 20 is supported so as to be movable in the X and Y directions and further in the Z direction within the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  Further, a tray transport mechanism (mounting member transport robot) 15 is provided so as to straddle the supply region A2 and the recovery region A4. The tray transport mechanism 15 is a moving unit that can move the tray 200 in both the positive and negative directions in the X direction.

  With this tray transport mechanism 15, for example, an empty tray 200 from which all IC devices 90 have been removed in the supply area A2 can be transported to the positive side in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  Further, the tray transport mechanism 15 can transport the empty tray 200 carried in from the tray removal area A5 to the X direction positive side in the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  Further, tray transport mechanisms 22A and 22B for transporting the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving unit that can move the tray 200 in both the positive and negative directions in the Y direction. Thereby, for example, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a moving unit that can move an empty tray 200 for collecting the IC device 90 to the positive side in the Y direction, that is, from the tray removal area A5 to the collection area A4.

  As described above, in the inspection apparatus 1, the transport unit 23 that can transport the tray 200 serves as a tray transport mechanism 11A that is a loader that transports the tray 200 in the Y direction between the tray supply region A1 and the supply region A2, and the collection region. A tray transport mechanism 22A that is an unloader that transports the tray 200 in the Y direction between the A4 and the tray removal area A5, and a tray transport mechanism that transports the tray 200 in the X direction between the supply area A2 and the collection area A4. 15 are provided. Thereby, for example, the throughput (the number of IC devices 90 transported per unit time) can be improved as compared with the case where the transport of the tray 200 in the X direction and the Y direction is performed by one transport mechanism.

  The control unit 800 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, and tray conveyance mechanism 22A, 22B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  The operator can set or confirm the operating conditions of the inspection apparatus 1 via the monitor 300. The monitor 300 includes a display screen (display unit) 301 configured by, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the inspection apparatus 1. As shown in FIG. 1, on the right side of the tray removal area A5 in the figure, there is provided a mouse table 600 on which a mouse used for operating a screen displayed on the monitor 300 is placed.

  An operation panel 700 is disposed on the lower right side in FIG. The operation panel 700 commands the inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state or the like of the inspection apparatus 1 by a combination of colors that emit light. The signal lamp 400 is arranged on the upper part of the inspection apparatus 1. Note that the inspection device 1 has a built-in speaker 500, and the operation state of the inspection device 1 can also be notified by the speaker 500.

  As shown in FIG. 2, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by the first partition wall 61, and the supply area A2 and the inspection area A3 are separated. The partition wall is partitioned by the second partition wall 62, the inspection region A3 and the collection region A4 are partitioned by the third partition wall 63, and the recovery region A4 and the tray removal region A5 are partitioned by the fourth partition wall 64. ing. These partition walls have a function of maintaining the airtightness of each region. Furthermore, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74.

  As described above, in the inspection apparatus 1, the IC devices 90 are classified and collected in the collection area A4 for each inspection result in the inspection unit 16. This classification includes, for example, “good inspection result”, “bad inspection result”, and “retest required”. In the present embodiment, among the three types of trays 200 in which the IC devices 90 in FIGS. 3 to 8 are classified, they may be referred to as “tray 200A”, “tray 200B”, and “tray 200C” in order from the left side. In the inspection apparatus 1, as an example, the tray 200 </ b> A is allocated as a tray 200 for “good inspection result”, the tray 200 </ b> B is allocated as a tray 200 for “bad inspection result”, and the tray 200 </ b> C is allocated as a tray 200 for “re-examination required”.

  Hereinafter, a case where the IC device 90 on the tray 200C is re-inspected, that is, an auto-retest function will be described with reference to FIGS.

  The inspection before the reinspection is referred to as “first inspection”, and the reinspection is referred to as “second inspection”. Therefore, the first inspection and the second inspection are the same inspection. The cause of the re-inspection (retest) is, for example, that the inspection result cannot be judged as “good” or “bad” due to poor contact between the terminals of the inspection unit 16 and the IC device 90 at the time of inspection.

  In the inspection apparatus 1, a first position P1, a second position P2, a third position P3, and a fourth position P4 that are different from each other are set. The first position P1 is set in the supply area A2. The second position P2 is set in the collection area A4. The third position P3 is a position where the tray 200 on which the IC device 90 before the first inspection is placed is set in the tray supply region A1. The fourth position P4 is set in the tray removal area A5, and is a position where the tray 200 (the tray 200C) on which the IC device 90 after the first inspection is placed is arranged before the second inspection. .

  As shown in FIG. 1, both the tray supply area A1 and the tray removal area A5 are exposed to the outside of the inspection apparatus 1. For this reason, the third position P3 and the fourth position P4 are also set outside the inspection apparatus 1. Accordingly, for example, when the tray 200 is to be taken out from the third position P3 or the fourth position P4 while the inspection apparatus 1 is performing the re-inspection operation, the removal operation becomes easy.

  The IC devices 90 for one lot to be subjected to the first inspection are stacked at the third position P3 and are transported in the inspection apparatus 1 as described above (see FIG. 2). It is in the state shown in. As shown in FIG. 3, a plurality of IC devices 90 are placed on the tray 200A in the tray removal area A5, but there is still a space where the IC devices 90 can be placed. Further, as many IC devices 90 as possible are placed on the tray 200C in the fourth position P4 of the tray removal area A5, that is, the tray 200C is filled with the plurality of IC devices 90. Yes.

  As shown in FIG. 4, the tray transport mechanism 22A constituting the transport unit 23 transports the tray 200C on which the IC device 90 is placed from the fourth position P4 to the second position P2.

  Next, as shown in FIG. 5, the tray transport mechanism 15 (transport unit 23) transports from the second position P2 to the first position P1.

  Next, as shown in FIG. 6, the tray transport mechanism 11A (transport unit 23) transports the first position P1 to the third position P3. The tray 200C shown in FIGS. 3 to 6 is transported until all trays 200C at the fourth position P4 are transported to the third position P3.

  Next, as shown in FIG. 7, the tray transport mechanism 11A transports one tray 200C located at the third position P3 and takes it out into the supply area A2. Further, the tray 200A in the tray removal area A5 is transported into the collection area A4 by the tray transport mechanism 22A and is stopped at the transport destination.

  Next, as shown in FIG. 8, the IC device 90 on the tray 200 </ b> C is transported to the collection area A <b> 4 by the device collection unit 18 in the same manner as the first inspection. It is assumed that the IC device 90 is “inspection result good”. The device transport head 20 transports and places the IC device 90 on the device recovery unit 18 to an empty space of the tray 200A in the recovery area A4, that is, an empty pocket formed in the tray 200A.

  As described above, when reinspection is desired, the tray 200C on which the IC device 90 to be inspected is placed is transported from the fourth position P4 to the third position P3 by the transport unit 23. Can do. Thereby, it will be in the state which can start reexamination. Conventionally, the tray 200 </ b> C on which the IC device 90 is placed is disposed from the fourth position P <b> 4 to the third position P <b> 3 through, for example, an operator's hand. However, in the inspection apparatus 1, it is possible to efficiently transport the tray 200 </ b> C by saving the operator's trouble by the automatic transport by the transport unit 23. Thereby, re-inspection can be performed quickly.

Next, the tray transport mechanism 15 will be described in detail.
As shown in FIGS. 9 to 16, the tray transport mechanism 15 includes a transport mechanism main body 3 and a connecting portion 4 that connects the transport mechanism main body 3 to a drive source (not shown). In addition, it does not specifically limit as a drive source, For example, the mechanism which has a ball screw and a linear guide and moves the conveyance mechanism main body 3 to a X direction and a Y direction can be used.

  As shown in FIG. 9, the transport mechanism main body 3 includes a base material 31 fixed to the connecting portion 4, and a hand portion 32 configured to be slidable with respect to the base material 31 and capable of gripping the tray 200. ing.

  The base material 31 is comprised with the sheet metal which makes | forms the elongate plate shape extended in a Y direction. Moreover, the edge part 313 of each long side of the base material 31 is bent so as to protrude to the −Z side. The hand portion 32 is inserted inside the bent edge portions 313 so that the hand portion 32 can slide in the Y direction.

  The base material 31 is formed with a slit 311 extending in the Y direction, and a bolt 312 is inserted into the slit 311. The bolt 312 fixes the base material 31 and the hand portion 32. When the bolt 312 is loosened, the base material 31 and the hand portion 32 are slidable in the Y direction, and when the bolt 312 is tightened, sliding between the base material 31 and the hand portion 32 is restricted. Become. Thereby, the position with respect to the base material 31 of the hand part 32 can be adjusted. That is, the length of the transport mechanism body 3 in the Y direction can be adjusted.

  As shown in FIGS. 9 to 12, the hand portion 32 is provided on the base portion 321 slidably inserted into the base material 31, two bar members 322 fixed to the base portion 321, and the bar member 322. The absorber 323, the cover member 5 fixed to each bar 322 via the absorber 323, the grip 8 for gripping the tray 200, and the pin (convex portion) fixed to the base 321 via the connecting bar 325 101.

  The base 321 is formed of a long sheet metal extending in the Y direction. Further, the edge 324 on each long side of the base 321 is bent so as to protrude to the −Z side. A bar 322 is fixed to each of the bent edges 324 of the base 321.

  Each bar 322 is arranged in parallel to each other along the Y direction. Further, both end portions 326 are bent to the bar 322 so as to protrude to the −Z side. Further, a total of four absorbers 323 are provided in the vicinity of both ends 326 of each bar 322, two each.

  Each absorber 323 is configured to be extendable and contractible in the Z direction. The absorber 323 has an urging portion on the inner side and is connected to the cover member 5.

  In addition, the range in which the absorber 323 expands and contracts is preferably 2 mm or more and 4 mm or less, and more preferably 2.5 mm or more and 3.5 mm or less. Thereby, the movable range of the Z direction of the cover member 5 can be made into the said numerical value range. Therefore, when the cover member 5 is pressed against the tray 200, part of the pressing force can be effectively released. As a result, it is possible to prevent the cover member 5 from being pressed against the tray 200 with an excessive force. Accordingly, the impact applied to the tray 200 and the IC device 90 can be reduced.

  The connecting rod 325 is provided along the X direction. In addition, the + X side end of the connecting rod 325 is fixed to the upper portion of the base 321, and the −X side end protrudes to the −X side from the base 321. A rod-shaped pin 101 is fixed to the lower side of the protruding end portion on the −X side. For this reason, the pin 101 is provided so as to protrude to the −Z side.

  The cover member 5 is a member that covers the tray 200 when the grip portion 8 grips the tray 200. The cover member 5 has a two-layer structure having a metal layer 51 and a conductive resin layer 52. The conductive resin layer 52 and the metal layer 51 are laminated in this order from the lower side.

  The metal layer 51 has a relatively high hardness and is responsible for enhancing the rigidity of the cover member 5 as a whole. The constituent material of the metal layer 51 is not particularly limited, and various metal materials such as stainless steel, aluminum, aluminum alloy, and the like can be used.

  On the other hand, the conductive resin layer 52 is a part in contact with the tray 200 and the IC device 90. The conductive resin layer 52 includes a resin layer 521 and conductive fillers 522 dispersed in the resin layer 521. For this reason, the conductive resin layer 52 has a lower hardness than the metal layer 51. Therefore, it is possible to prevent the tray 200 and the IC device 90 from being damaged as compared with the case where the metal layer 51 directly contacts the tray 200 and the IC device 90.

  Furthermore, the conductive resin layer 52 has conductivity. As a result, the electrons can be removed when they come into contact with the charged IC device 90. Therefore, it is possible to prevent the IC device 90 from being charged.

  The constituent material of the resin layer 521 is not particularly limited, and for example, acrylic, urethane, polyester, epoxy, polyvinyl chloride, melanin, polyimide, and the like can be used.

  In addition, the constituent material of the conductive filler 522 is not particularly limited, and examples thereof include zinc oxide, titanium oxide, tin oxide, indium oxide, and antimony oxide.

  As shown in FIGS. 9 to 12, the grip 8 has two arms 81, a cylinder 82 that drives each arm 81, and a spring 83 that connects each arm 81.

  The arm 81 includes a long portion 811 and a claw member 812 that is suspended from one end of the long portion 811. In each arm 81, the long portion 811 is arranged in the same straight line along the Y direction, and the other end portion, that is, the end portion opposite to the claw member 812 is formed by the cylinder 82 and the spring 83. It is connected.

  The lower end portion of each claw member 812 has a claw shape having a recess 813 that opens in a direction facing each other. The edge 201 of the tray 200 can enter the recess 813 of the claw member 812. That is, the claw member 812 can be engaged with the tray 200 in a state in which each arm 81 approaches. In this engaged state, the tray 200 is gripped by each arm 81. Therefore, the tray 200 can be stably conveyed.

  The cylinder 82 moves each arm 81 along the Y direction by supplying and discharging the working fluid. The upper part of the cylinder 82 is fixed to the base 321.

  In a state where the working fluid is supplied to the cylinder 82, each arm 81 is moved and operated in the direction of separating. On the other hand, when the working fluid is discharged from the cylinder 82 in a state where the arms 81 are separated from each other, the arms 81 are moved in the approaching direction.

  The spring 83 is constituted by a tension spring having both ends connected to each arm 81. Thereby, each arm 81 will be in the state pulled in the direction which approaches mutually irrespective of the approach state which approached, and the separated state which separated. Therefore, for example, even when the operation of the cylinder 82 is stopped unintentionally, the arms 81 are brought close to each other. As a result, even if a problem occurs in the cylinder 82 while the tray 200 is gripped, the tray 200 can be continuously gripped, and the tray 200 can be prevented from being unintentionally detached (dropped) from the arm 81. it can.

Next, the operation of the tray transport mechanism 15 will be described.
FIG. 10 is a diagram illustrating a state in which the tray transport mechanism 15 is located above the second position P2. As described above, the IC device 90 for re-inspection is placed on the tray 200 arranged at the second position P2. In this state, as shown by a two-dot chain line in FIG. 10, each arm 81 is in an approaching state.

  Then, by supplying the working fluid to the cylinder 82 from this approaching state, as shown by the solid line in FIG. 10, each arm 81 is moved and operated in the separating direction, and is brought into the separating state.

  As shown in FIG. 11, the tray transport mechanism 15 is lowered in the separated state. This lowering is performed until the bent end of the bar 322 comes into contact with the edge of the tray 200. Thereby, as will be described later, the hand unit 32 can stably hold the tray 200. Further, in this contacted state, the cover member 5 is in contact with the upper surface of the tray 200 and the IC device 90 and covers the upper surface of the tray 200.

  As described above, the cover member 5 is located below the end of the bar 322 before the contact state. For this reason, as the tray transport mechanism 15 is lowered, the cover member 5 first comes into contact with the upper surface of the tray 200. At this time, the impact of contact between the cover member 5 and the tray 200 is absorbed by the absorber 323. Therefore, the impact applied to the tray 200 and the IC device 90 can be reduced. Further, in the engaged state, the cover member 5 is biased to the tray 200, so that the tray 200 can be transported more stably.

  In particular, as shown in FIG. 9, four absorbers 323 are provided and are arranged near the corners of the cover member 5. That is, when viewed from the Z direction, the four absorbers 323 are arranged in a rectangular shape. For this reason, an impact can be absorbed as evenly as possible.

  In addition, as shown in FIG. 11, when the tray transport mechanism 15 is lowered, the arms 81 are moved in different directions and are in a separated state until they come into contact with each other. Thereby, it is possible to prevent the claw member 812 from coming into contact with the tray 200 and hindering the processing when the tray transport mechanism 15 is lowered.

  Next, as shown in FIG. 12, the working fluid is discharged from the cylinder 82 to bring the arms 81 into an approaching state. In this approaching state, the edge of the tray 200 enters and engages in the recess 813 of the claw member 812. Accordingly, each arm 81 can grip the tray 200.

  Then, the transport mechanism main body 3 is raised and moved in the −X direction to move the tray 200 to the first position P1. During this movement, the upper surface of the tray 200 held by each arm 81 is covered with the cover member 5. Thereby, it is possible to prevent the IC device 90 from being detached from the tray 200. Therefore, the IC device 90 and the tray 200 can be stably conveyed.

  Furthermore, as shown in FIG. 9, in the inspection apparatus 1, the tray transport mechanism 15 is configured to grip (engage) the short side of the tray 200. For this reason, compared with the case where the tray conveyance mechanism 15 grips a long side, the tray 200 can be conveyed stably.

  As shown in FIGS. 9 and 13 to 16, the connecting portion 4 includes a base portion 41 connected to a drive source, a cylinder 42, a support plate 43 that supports the cylinder 42, and a connecting plate fixed to the base portion 41. 44, 45, an absorber (buffer part) 46 provided on the connecting plate 44, and an absorber (buffer part) 47 provided on the connecting plate 45.

  The base 41 is provided on the first plate-like portion 411 arranged along the X direction and the Y direction, and the edge on the + Y side of the first plate-like portion 411, and is arranged along the X direction and the Z direction. And a second plate-like portion 412. A support plate 43 is suspended from the lower surface of the first plate-like portion 411.

  The cylinder 42 has a piston rod 421 and is configured such that the piston rod 421 protrudes and retracts in the Z direction when a working fluid is supplied or discharged. Further, the base 31 of the transport mechanism body 3 is connected to the piston rod 421. Thereby, the raising / lowering operation of the conveyance mechanism main body 3 can be performed by supplying or discharging the working fluid.

  As shown in FIGS. 9-16, the connection board 44 has comprised the elongate plate shape extended in a Z direction. In addition, a protruding portion 441 that protrudes in a plate shape in the + Y direction is formed on the upper portion of the connecting plate 44. The protrusion 46 is provided with an absorber 46.

  Further, the connecting plate 44 has two protrusions 442 and 443. The protrusion 442 is provided in the vicinity of the lower end of the connecting plate 44, and the protrusion 443 is provided in the vicinity of the upper end, that is, in the vicinity of the protruding portion 441. As shown in FIGS. 13 and 15, the protrusion 442 abuts a later-described protrusion 451 when the transport mechanism body 3 is lifted, and can restrict the transport mechanism body 3 from being lifted further. On the other hand, the protrusion 443 can abut a protrusion 451 described later when the transport mechanism body 3 is lowered, and can restrict the transport mechanism body 3 from being further lowered.

  The connecting plate 45 has a long plate shape extending in the Z direction. The connecting plate 45 is disposed on the −X side of the connecting plate 44 and is shifted to the + Y side from the connecting plate 44. The connecting plate 45 has an upper end fixed to the second plate-like portion 412 of the base 41.

  In addition, a protruding portion 451 protruding in a plate shape in the + Y direction is provided at the lower end portion of the connecting plate 45. An absorber 47 is provided on the protruding portion 451. Further, the protruding portion 451 has a portion 452 protruding to the connecting plate 44 side. This portion 452 is a portion with which the absorber 46 abuts.

  In such a connecting portion 4, when the transport mechanism main body 3 is in the raised state as shown in FIGS. 13 and 14, the absorber 47 can contact the base material 31 and absorb the impact when the contact is made. it can. Further, in the state where the transport mechanism main body 3 is lowered as shown in FIGS. 15 and 16, the absorber 46 is in contact with the upper part of the base material 31, and the impact when the contact is made can be absorbed.

  Thus, according to the connection part 4, the impact accompanying raising / lowering of the conveyance mechanism main body 3 can be relieved. Therefore, when the transport mechanism body 3 is moved up and down, it is possible to reduce the impact applied to the tray 200. As a result, the impact applied to the IC device 90 can be reduced, and the IC device 90 is unintentionally removed from the tray 200. Can be more effectively prevented.

  Here, as shown in FIGS. 9 and 17 to 20, the inspection apparatus 1 includes an upstream positioning portion 10 </ b> A and a downstream positioning portion 10 </ b> B.

  10 A of upstream positioning parts are comprised by the pin 101 mentioned above and the guide hole (concave part) 102A in which the pin 101 is inserted.

  102 A of guide holes are provided in the wall part 103 located in the -X side among a pair of wall parts (regulation member) 103,104 which opposes the 1st position P1 through a X direction.

The wall portions 103 and 104 extend across the inside and outside of the inspection apparatus 1 along the Y direction. The wall portions 103 and 104 prevent the tray 200 arranged in the first position P1 from shifting in the X direction and guide the movement of the tray 200 in the Y-axis direction by the tray transport mechanism 11A. is there.
The wall portions 103 and 104 and the region between them constitute a first arrangement portion.

  The downstream positioning portion 10B includes the pin 101 described above and a guide hole 102 (concave portion) B into which the pin 101 is inserted.

The wall portions (regulating members) 105 and 106 extend across the inside and outside of the inspection apparatus 1 along the Y direction. The wall portions 105 and 106 prevent the tray 200 disposed in the second position P2 from being displaced in the X direction and guide the movement of the tray 200 in the Y-axis direction by the tray transport mechanism 22A. is there.
The wall portions 105 and 106 and the region between them constitute a second arrangement portion.

  Next, the operation of the upstream side positioning unit 10A and the downstream side positioning unit 10B will be described along with the operation of the tray transport mechanism 15. Below, the case where the tray 200 is conveyed from the 2nd position P2 to the 1st position P1 is demonstrated using FIGS.

  FIG. 17 is a diagram illustrating a state in which the tray 200 is disposed at the second position P2. In the state shown in FIG. 17, the tray transport mechanism 15 is located above the second position P2.

  FIG. 18 is a view of the tray 200 gripped by lowering the tray transport mechanism 15 from the state shown in FIG. During the lowering, the pins 101 of the tray transport mechanism 15 are inserted while being guided by the guide holes 102B. Thereby, the tray transport mechanism 15 can be positioned with respect to the second position P2. Therefore, the tray 200 can be accurately gripped by operating the hand portion 32 in this positioned state.

  Next, as illustrated in FIG. 19, the tray transport mechanism 15 moves above the first position P <b> 1 while holding the tray 200. Then, as shown in FIG. 20, the tray transport mechanism 15 is lowered while holding the tray 200. During this lowering, the pin 101 is inserted while being guided by the guide hole 102A. Thereby, the tray transport mechanism 15 can be positioned with respect to the first position P1. Then, in this positioned state, the tray 200 can be accurately placed at the first position P1 by releasing the grip of the tray 200 of the hand unit 32.

  In addition, when the pin 101 is not inserted into the guide holes 102 </ b> A and 102 </ b> B and collides with the walls 103 and 105, the operation of the tray transport mechanism 15 may be stopped.

  Thus, according to the inspection apparatus 1, for example, the positioning between the first position P1 and the tray transport mechanism 15 and the positioning between the second position P2 and the tray transport mechanism 15 are insufficient. Therefore, it is possible to prevent the tray transport mechanism 15 from being lowered. Therefore, it is possible to prevent the tray transport mechanism 15 and the walls 103, 104, 105, and 106 from colliding with each other.

  In addition, the tray 200 can be accurately transported from the second position P2 to the first position P1 because the placement operation such as gripping or releasing the tray 200 is performed in the positioned state.

  In the inspection apparatus 1, the tray transport mechanism 15 and the first position P1 can be positioned by a simple method of inserting the pin 101 into the guide hole 102A, and the pin 101 is inserted into the guide hole 102B. With this simple configuration, the tray transport mechanism 15 and the second position P2 can be positioned.

  Further, as shown in FIG. 17, the separation distance between the wall portion 103 and the wall portion 104, that is, the width W1 of the first position P1 is the separation distance between the wall portion 105 and the wall portion 106, ie, the second distance. It is smaller than the position width W2. The width W1 is not less than 136 mm and not more than 137 mm, and the width W2 is not less than 136.5 mm and not more than 137.5 mm. This is a specification of a conventional apparatus that does not have an auto-retest function.

  In such specifications of the conventional apparatus, when the tray 200 is transported from the second position P2 to the first position P1 having a narrow width, the positioning by the upstream positioning unit 10A is particularly advantageous.

  Further, as described above, the guide hole 102 </ b> A of the upstream positioning portion 10 </ b> A is provided in the −X side wall portion 103 among the wall portions 103 and 104. Further, the guide hole 102 </ b> B of the downstream positioning portion 10 </ b> B is provided in the wall portion 105 on the −X side among the wall portions 105 and 106. The inspection apparatus 1 is generally designed with reference to the upstream side in the transport direction of the IC device 90, that is, the end on the −X side. For this reason, the cumulative error of the design tends to increase as the distance increases toward the + X side. In the inspection apparatus 1, by arranging the guide hole 102A in the -X side wall portion 103 and the guide hole 102B in the -X side wall portion 105, it is possible to suppress an accumulated design error as much as possible. Therefore, the pin 101 can be accurately and smoothly inserted into the guide holes 102A and 102B.

Second Embodiment
FIG. 21 is a perspective view showing a tray transport mechanism (transport section) of the electronic component inspection apparatus (second embodiment) of the present invention.

Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to this drawing. However, the description will focus on differences from the above-described embodiment, and the same matters will be described. Is omitted.
This embodiment is the same as the first embodiment except that the configuration of the cover member is different.

  As shown in FIG. 21, in the tray transport mechanism 15A of the inspection apparatus 1A, the cover member 5A has a net shape formed by weaving strands made of a metal material. In other words, when viewed as a whole of the cover member 5A, the cover member 5A has a shape in which a large number of holes are provided at a position where the cover member 5A comes into contact.

  According to such a cover member 5A, the area where the cover member 5A is in contact with the IC device 90 can be reduced. Therefore, for example, even if vibration occurs with the movement of the tray transport mechanism 15, it is possible to suppress the vibration from being transmitted to the IC device 90 via the cover member 5A.

<Third Embodiment>
FIG. 22 is a cross-sectional view showing a tray transport mechanism (transport section) of the electronic component inspection apparatus (third embodiment) of the present invention.

Hereinafter, the third embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and the same matters will be described. Is omitted.
This embodiment is the same as the first embodiment except that the configuration of the cover member is different.

  As shown in FIG. 22, in the tray transport mechanism 15 </ b> B of the inspection apparatus 1 </ b> B, the cover member 5 </ b> B has a plurality of protrusions (protrusions) 53 that protrude on the lower surface. As shown in FIG. 22, the protrusion 53 is provided at a position where it comes into contact with the IC device 90 when the tray transport mechanism 15 grips the tray 200. Further, the protrusion 53 has a smaller area than the IC device 90 when viewed from the Z direction.

According to such a cover member 5B, the area where the cover member 5B and the IC device 90 abut can be made smaller than in the first embodiment. Therefore, for example, even if vibration occurs with the movement of the tray transport mechanism 15B, it is possible to suppress the vibration from being transmitted to the IC device 90 via the cover member 5B. Furthermore, since the protrusion 53 can press the IC device 90, the IC device 90 can be transported more stably.
<Fourth embodiment>
FIG. 23 is a diagram showing an upstream positioning portion and a downstream positioning portion of the electronic component inspection apparatus (fourth embodiment) of the present invention.

Hereinafter, the fourth embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and the same matters will be described. Is omitted.
This embodiment is the same as the first embodiment except that the configuration of the wall portion is different.

  As shown in FIG. 23, in the inspection apparatus 1 </ b> C, an inclined surface (guide portion) 103 a that is inclined with respect to the Z-axis is provided on the edge portion on the + X side of the wall portion 103. An inclined surface (guide portion) 104 a that is inclined with respect to the Z axis is provided at the −X side edge of the wall portion 104. An inclined surface (guide portion) 105 a that is inclined with respect to the Z axis is provided at the + X side edge of the wall portion 105. An inclined surface (guide portion) 106 a that is inclined with respect to the Z axis is provided at the −X side edge of the wall portion 106.

  Since the walls 103 to 106 are tapered as described above, the following advantages are obtained. As shown by a two-dot chain line in FIG. 23, when the tray 200 is arranged at the first position P1, the position of the tray 200 is shifted to the −X side, and the end portion of the tray 200 on the −X side is the inclined surface 103a. Even if it abuts, as shown by the arrow in the figure, it is guided by the inclined surface 103a, and the tray 200 is disposed at the first position P1.

  As described above, according to the inspection apparatus 1C, even if the positioning of the first position P1 and the tray 200 is slightly shifted, the tray 200 can be disposed at the first position P1. Therefore, the tray 200 can be arranged more accurately at the first position P1.

  Note that the present invention is not limited to the case shown in the figure, and for example, the same effect as described above can be obtained also when the inclined surface 104a of the wall 104 and the IC device 90 are in contact with each other. In addition, the inclined surfaces 105a and 106a can exhibit the same function as described above even when the tray 200 is arranged at the second position P2.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Moreover, in each said embodiment, although the two engaging parts each engage with the long side of a mounting member, in this invention, it is not limited to this, For example, each engages with a short side It may be a thing.

  Moreover, in each said embodiment, although the two engaging parts are provided, in this invention, it is not limited to this, Three or more may be sufficient. For example, when four engaging parts are provided, it is preferable that each engaging part engages with two long sides and two short sides of a mounting member, respectively.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus, 1A ... Inspection apparatus, 1B ... Inspection apparatus, 1C ... Inspection apparatus, 3 ... Conveyance mechanism main body, 31 ... Base material, 311 ... Slit, 312 ... Bolt, 313 ... Edge, 32 ... Hand part, 321 ... Base, 322 ... Bar, 323 ... Absorber, 324 ... Edge, 325 ... Connection rod, 326 ... Both ends, 4 ... Connection, 41 ... Base, 411 ... First plate, 412 ... Second plate Part, 42 ... cylinder, 421 ... piston rod, 43 ... support plate, 44 ... coupling plate, 441 ... projection, 442 ... projection, 443 ... projection, 45 ... coupling plate, 451 ... projection, 452 ... part, 46 ... Absorber, 47 ... absorber, 5 ... cover member, 5A ... cover member, 5B ... cover member, 51 ... metal layer, 52 ... conductive resin layer, 521 ... resin layer, 522 ... conductive filler, 53 ... projection, 8 ... Gripping part, 8 ... arm, 811 ... long part, 812 ... claw member, 813 ... recess, 82 ... cylinder, 83 ... spring, 10A ... upstream positioning part, 10B ... downstream positioning part, 11A ... tray transport mechanism, 11B ... tray transport Mechanism, 12 ... Temperature adjustment unit, 13 ... Device conveyance head, 14 ... Device supply unit, 15 ... Tray conveyance mechanism, 15A ... Tray conveyance mechanism, 15B ... Tray conveyance mechanism, 16 ... Inspection unit, 17 ... Device conveyance head, 18 DESCRIPTION OF SYMBOLS ... Device collection | recovery part, 19 ... Collection | recovery tray, 20 ... Device conveyance head, 22A ... Tray conveyance mechanism, 22B ... Tray conveyance mechanism, 23 ... Conveyance part, 61 ... 1st partition, 62 ... 2nd partition, 63 ... 3rd Partition wall 64 ... Fourth partition wall 70 ... Front cover 71 ... Side cover 72 ... Side cover 73 ... Rear cover 74 ... Top cover 90 ... I Device 101 ... Pin 102A ... Guide hole 102B ... Guide hole 103 ... Wall portion 103a ... Inclined surface 104 ... Wall portion 104a ... Inclined surface 105 ... Wall portion 105a ... Inclined surface 106 ... Wall portion 106a ... inclined surface, 200 ... tray, 200A ... tray, 200B ... tray, 200C ... tray, 201 ... edge, 202 ... recess, 300 ... monitor, 301 ... display screen, 400 ... signal lamp, 500 ... speaker, 600 ... Mouse table, 700 ... Operation panel, 800 ... Control unit, A1 ... Tray supply area, A2 ... Supply area, A3 ... Inspection area, A4 ... Collection area, A5 ... Tray removal area, P1 ... First position, P2 ... 2nd position, P3 ... 3rd position, P4 ... 4th position

Claims (13)

A transport unit for transporting the mounting member on which the electronic component is mounted;
The transport portion includes a cover portion that covers a placement surface on which the electronic component of the placement member is placed , an engagement portion that is a claw having a recessed portion that is recessed at a position that engages with the placement member, An electronic component conveying apparatus having The engaging portion has a first engaging portion and a second engaging portion,
2. The electronic component transport device according to claim 1, wherein the first engagement portion and the second engagement portion move in different directions on an axis parallel to the placement surface. The engaging section, the electronic component transporting apparatus according to claim 1 or 2 engages close before placing member. The mounting member has a long side and a short side in a plan view from a direction orthogonal to the mounting surface,
The engaging section, the electronic component transporting apparatus according to claims 1 to engage the short sides of the placement section member any one of the three. The cover portion, the electronic component transporting apparatus according to any one of the electronic component and the abutment to claims 1 and has a hole in position 4. The cover portion, the electronic component transporting apparatus according to any one of the electronic component and 4 claims 1 and has a protrusion abutting position. The cover part, the electronic component abutting portion, the electronic component transporting apparatus according to any one of claims 1, which is a material having conductivity 6. The electronic component conveying apparatus according to claim 7 , wherein the conductive material is a conductive resin. The cover portion, the electronic component conveying device according to any one of claims 1 to 8 into contact with the mounting surface. The transport unit, the electronic component transporting apparatus according to any one of claims 1 to 9 having a biasing portion which biases said cover portion to said mounting face. The cover unit is moved toward the front mounting surface, the movable range, 2 mm or more, the electronic component conveying device according to any one of claims 1 1 0 is 4mm or less. The transport unit, the electronic component conveying device according to any one of claims 1 1 1 having a buffer portion for alleviating the impact applied to the mounting surface. A transport unit for transporting a mounting member on which an electronic component is mounted;
An inspection unit for inspecting the electronic component,
The transport portion includes a cover portion that covers a placement surface on which the electronic component of the placement member is placed , an engagement portion that is a claw having a recessed portion that is recessed at a position that engages with the placement member, An electronic component inspection apparatus.

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