TW201930169A - Electric components conveying device and electric component inspection device capable of easily adjusting positioning of carrying surface of carrying portion with electric components carried on carrying surface - Google Patents

Abstract

This invention provides an electric components conveying device and an electric component inspection device capable of easily adjusting the positioning of the carrying surface of the carrying portion with the electric components carried on the carrying surface. The electric components conveying device of this invention is characterized in comprising: a carrying portion having a carrying surface for carrying the electric components and conveying the electric components between a first position and a second position different from the first position; a first abutting portion having a first abutting point capable of being abutted against the electric components carried on the carrying surface; a second abutting portion having a second abutting point capable of being abutted against the electric components carried on the carrying surface at a position different from the first abutting point and separated from the first abutting point; and, a mechanism portion capable of moving the first abutting portion relative to the second abutting portion; wherein, the separated distance between the first abutting point at the first position and the second abutting point, i.e. the first separated distance, is longer than the separated distance between the first abutting point at the second position and the second abutting point, i.e. the second separated distance.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

Conventionally, there has been known a device that transports electronic components such as a module IC (Integrated Circuit), for example (see, for example, Patent Document 1). The device described in Patent Document 1 includes: a carrier that transfers electronic parts; a carrier transfer device that transfers the carrier from a loading position to an unloading position; and a positioning device of the carrier that accurately positions the carrier The ground is further positioned at the loading and unloading positions, so that the electronic components can be accurately loaded on or unloaded from the carrier. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-162272

[Problems to be solved by the invention]

In the device described in Patent Document 1 described above, even when the carrier can be positioned, when the pocket on the carrier cannot be positioned accurately, there are also cases when the electronic part is transferred to the socket. The parts do not come into contact with the sockets correctly, so that the electronic parts cannot be inspected correctly. [Technical means to solve the problem]

Such an object is achieved by the present invention described below. The present invention has been made in order to solve the above-mentioned problems, and can be implemented as follows.

The electronic component transfer device of the present invention is characterized by comprising: a transfer unit that transfers electronic components; and a mounting unit that has a mounting surface on which the electronic components are mounted, and is supported so as to be movable on the mounting surface to mount the above A first position of the electronic component and a second position different from the first position, and the electronic component is transported between the first position and the second position; a driving portion that moves the placement portion; The abutting portion has a first abutting point capable of abutting on the electronic component placed on the aforesaid mounting surface; the second abutting portion has a second abutting point, and the second abutting point can be in contact with A position at which the first abutment point is different is in contact with the electronic component placed on the placement surface, and is separated from the first abutment point; and a drive mechanism section that causes the first abutment section to be separated from the first abutment point 2 the contact portion moves relatively; and the separation distance between the first contact point at the first position and the second contact point, that is, the first separation distance, is longer than the first contact at the second position The separation distance between the point and the second abutting point is the second Separation distance.

Thereby, regardless of the position between the first contact point and the second contact point where the electronic component is placed at the first position, the electronic component can be guided to the target placement position at the second position. Therefore, when the electronic component is transported to the socket, the electronic component can contact the socket correctly, and the electronic component can be accurately inspected.

In the electronic component transfer device of the present invention, it is preferable that the driving mechanism is a mechanism, and the mechanism is configured to be provided with an external force to actuate the mechanism in conjunction with the movement of the mounting portion, and to be mounted on the mounting portion. The movement of the parts causes the first abutting part and the second abutting part to move relatively. Accordingly, the first contact portion and the second contact portion can be easily separated.

In the electronic component conveying device of the present invention, it is preferable to include a force imparting portion that imparts the external force that moves the mechanism portion when the placing portion is in the first position, and the mechanism portion has a receiving force. The pressure receiving portion is disposed on the placing portion and receives the external force from the force applying portion.

With this, the external force can be sufficiently received by the self-force applying portion, and the first contact portion and the second contact portion can be separated from each other.

In the electronic component transfer device of the present invention, it is preferable that the force imparting portion has a protruding portion, and the pressure receiving portion can receive the external force from the protruding portion. Thereby, the 1st contact part and the 2nd contact part can be separated quickly.

In the electronic component transfer device of the present invention, it is preferable that the external force is received from the protruding portion by the pressure receiving portion, the first separation distance becomes longer than the second separation distance, and the mechanism portion has a spring pushing portion, The pushing portion pushes the first contact portion or the second contact portion in a direction in which the first contact point and the second contact point approach.

As a result, the second separation distance can be set between the first contact point and the second contact point, so that the electronic components on the mounting surface can be positioned and transported to the second position while maintaining the original state. until.

In the electronic component conveying device of the present invention, it is preferable that the mechanism portion includes a restricting portion that restricts a limit at which the first contact point approaches the second contact point. Thereby, the second separation distance can be maintained constant.

In the electronic component conveying device of the present invention, it is preferable that the first contact portion is formed of a small piece or a frame, and the second contact portion is formed of a small piece or a frame.

With this, for example, when both the first abutment portion and the second abutment portion are composed of small pieces, the mechanism portion can be reduced when the first abutment portion and the second abutment portion are relatively moved. Therefore, the relative movement can be smoothly performed.

The electronic component conveying device of the present invention is characterized by including a conveying section having a holding section for holding the electronic components and conveying the electronic components; and a placing section having a mounting surface on which the electronic components are placed, and The support is movable to a first position and a second position different from the first position, and the electronic part is transported between the first position and the second position; a driving part that moves the mounting part; 1 abutment portion having a first abutment point capable of abutting on the electronic component placed on the mounting surface; and a second abutment portion having a second abutment point and the second abutment point The electronic part placed on the mounting surface may be abutted at a position different from the first contact point, and may be separated from the first contact point; the holding portion may be in a state close to the mounting surface. The separation distance between the first contact point and the second contact point, that is, the first separation distance is longer than the first contact point and the second contact point in a state where the holding portion is separated from the mounting surface. The second separation distance .

Thereby, at the first position, the maximum separation distance (first separation distance) between the first contact point and the second contact point becomes. Therefore, even when the accuracy of the position adjustment of the placement portion at the first position is not so high, the electronic component can pass between the first contact point and the second contact point with a margin, thereby , Is guided to the mounting surface. As a result, the electronic component is placed on the mounting surface. In addition, the operation of maintaining the accuracy of the position adjustment of the placement section at the first position to a high degree of accuracy is omitted, and therefore, although the position adjustment operation of the placement section does not take much time, the electronic component transfer device can also be adequate Withstand the transportation of electronic parts. In this way, according to the present invention, the positioning adjustment of the mounting surface of the mounting portion and the electronic components mounted on the mounting surface can be easily performed.

The electronic component inspection device of the present invention is characterized by including: a conveying section that conveys electronic components; and a placing section that has a mounting surface on which the above-mentioned electronic components are placed, and is supported so as to be movable to the above-mentioned electronic components. The first position on the mounting surface and the second position different from the first position, the electronic component is transported between the first position and the second position; a driving part that moves the mounting part; a first abutment The abutting portion has a first abutting point capable of abutting on the electronic component placed on the aforesaid mounting surface; the second abutting portion has a second abutting point, and the second abutting point can be in contact with The position where the first contact point is different is in contact with the electronic component placed on the mounting surface, and is separated from the first contact point; a drive mechanism unit, which causes the first contact point to be separated from the second contact point The contact part moves relatively; and the inspection part can inspect the electronic component; the separation distance between the first contact point and the second contact point at the first position, that is, the first separation distance is longer than the first The above first abutment point at position 2 Separation distance between the second abutment point that is separated from the second distance.

Thereby, at the first position, the maximum separation distance (first separation distance) between the first contact point and the second contact point becomes. Therefore, even when the accuracy of the position adjustment of the placement portion at the first position is not so high, the electronic component can pass between the first contact point and the second contact point with a margin, thereby , Is guided to the mounting surface. As a result, the electronic component is placed on the mounting surface. In addition, the operation of maintaining the accuracy of the position adjustment of the placement section at the first position to a high degree of accuracy is omitted, and therefore, although the position adjustment operation of the placement section does not take much time, the electronic component transfer device can also be adequate Ground to withstand the transportation of electronic parts. In this way, according to the present invention, the positioning adjustment of the mounting surface of the mounting portion and the electronic components mounted on the mounting surface can be easily performed.

In addition, the electronic component can be transported to the inspection section, so that the inspection of the electronic component can be performed by the inspection section. In addition, electronic parts after inspection can be transported from the inspection section.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.

<First Embodiment> Hereinafter, a first embodiment of an electronic component transfer device and an electronic component inspection device according to the present invention will be described with reference to FIGS. 1 to 5. In the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are the X axis, the Y axis, and the Z axis. The XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is also referred to as "Y direction (second direction)", and a direction parallel to the Z axis is also It is called "Z direction (third direction)". In addition, the direction to which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, the "horizontal" mentioned in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than ± 5 °) with respect to the level. In addition, in FIG. 1 (the same applies to FIGS. 6 to 8 and FIGS. 11 to 14), the upper side, that is, the positive side in the Z direction is referred to as “up” or “upper”, and the lower side, that is, the Z direction is negative The side is called "down" or "below." The left side in FIGS. 4 and 5, that is, the negative side in the X direction, is sometimes referred to as “left” or “left,” and the right side, that is, the positive side in the X direction is sometimes referred to as “right” or “right.

The electronic component transfer device 10 of the present invention is a processing machine having the appearance shown in FIG. 1. The electronic component transfer device 10 includes a transfer section 25 that transfers an IC device 90 as an electronic component, and a device supply section 14 that is a mounting section 29 and has a mounting surface 142 on which the IC device 90 (electronic component) is mounted. And the IC device 90 (electronic component) is transported; the driving section 26 moves the device supply section 14 (mounting section 29); the first abutment section 4 has an IC device that can be mounted on the mounting surface 142 90 (electronic component) the first abutment point 41 abutted; the second abutment portion 5 has a second abutment point 51, and the second abutment point 51 may be at a position different from the first abutment point 41 It is in contact with the IC device 90 (electronic component) placed on the mounting surface 142 and is far away from the first contact point 41. The mechanism section 6 as the driving mechanism section is in contact with the device supply section 14 (mounting section 29). The interlocking movement causes the first contact portion 4 and the second contact portion 5 to move relatively. In addition, the device supply section 14 (mounting section 29) is supported to be movable to the first position in the device supply area A2 and the second position in the inspection area A3 which is different from the first position, and may be in the first position. The IC device 90 (electronic component) is transported to and from the second position. In addition, the first separation distance (the first separation distance LX1, the first separation distance LY1), which is the separation distance between the first contact point 41 and the second contact point 51 at the first position, is larger than that at the second position. The second separation distance (the second separation distance LX2, the second separation distance LY2), which is the separation distance between the first contact point 41 and the second contact point 51, is long. As described below, in general, the electronic component transfer device 10 may adjust the position of the supply unit device 14 by a worker by manual operation before shipment. In this case, depending on the skill level of the operator, there is a problem that the accuracy (accuracy) of the position adjustment of the device supply unit 14 varies, or that the position adjustment operation of the device supply unit 14 takes time to improve its position accuracy. For example, when the accuracy of the position adjustment of the device supply section 14 at the first position is not so high, there is a possibility that the IC device 90 is not placed on the mounting surface 142 of the device supply section 14 and the blockage may occur. Therefore, regarding the electronic component conveying device 10, the maximum separation distance (the first separation distance LX1) between the first contact point 41 and the second contact point 51 is set at the first position. Therefore, even when the accuracy of the position adjustment of the device supply section 14 at the first position is not so high, the IC device 90 can pass through the first contact point 41 and the second contact point 51 with a margin. Thereby, it is guided to the mounting surface 142. As a result, the IC device 90 is placed on the mounting surface 142. In addition, the operation of maintaining the accuracy of the position adjustment of the device supply section 14 at the first position to a high degree of accuracy is omitted. Therefore, although the position adjustment operation of the device supply section 14 does not take much time, the electronic component transfer device 10 It can fully withstand the transportation of the IC device 90. Thus, according to the present invention, the positioning adjustment of the mounting surface 142 of the device supply section 14 and the IC device 90 mounted on the mounting surface 142 can be easily performed.

In order to correctly inspect the IC device 90 (electronic component), the IC device 90 and the inspection section 16 (sockets) must be properly contacted. Based on the position where the IC device 90 and the inspection section 16 are properly contacted, the IC device 90 is placed on The target mounting position (for example, the position of the recessed part 141) of the device supply part 14 (shuttle).

At this time, when the positioning accuracy of the IC device 90 when the IC device 90 is placed on the device supply section 14 is deteriorated, such as the positioning accuracy of the device supply section 14 or the accuracy of the device transfer head 13 (supplying robot), the IC device 90 Will be shifted from the target mounting position and placed. In this state, even if the IC device 90 is transported to the inspection section 16, the IC device 90 will be displaced from the position where the inspection device 16 is in correct contact with the inspection section 16, and cannot be properly contacted with the inspection section 16, so it may not be correctly The risk of inspection.

Here, the so-called positioning accuracy may be set to a maximum offset from the target value, and may also be set to the posture accuracy specified in JIS (Japanese Industrial Standards) B8432.

The second separation distance refers to a distance at which the distance between the first contact point 41 and the second contact point 51 becomes narrower than the first separation distance. The distance is such that the IC device 90 can be guided to the target placement position. And it refers to the distance after adding a margin (gap) to the size of the IC device 90. The gap may be set to 0.25 mm or less, for example.

In addition, the target placement position refers to a target position where the IC device 90 is downloaded to the device supply section 14 in a state immediately before the IC device 90 is transferred to the inspection section 16. After that, the IC device 90 and the inspection unit 16 are in a predetermined position in a manner of a position where the IC device 90 is correctly in contact. For example, it is also possible to set a socket positioning pin around the inspection section 16 and a shuttle positioning pin on the mounting surface 142 of the device supply section 14 so that the distance between the inspection section 16 and the socket positioning pin is far from the shuttle positioning pin. position.

Furthermore, the target placement position may be set to an area (range), for example, to cover the entire area of the IC device 90 to a larger area (range) than the outer shape of the IC device 90, or may be set to be the same as the outer shape of the IC device 90 The size of the area (range). It may be set to a specific point.

The so-called guidance of the IC device 90 to the target placement position may include, for example, the following operations: When the target placement position is set to a larger area (range) than the IC device 90, the IC device 90 is controlled to perform external shape control. At the target mounting position (range); when the target mounting position is set to an area (range) of the same size as the outer shape of the IC device 90, make the outer shape of the IC device 90 consistent with the target mounting position (range); When the target placement position is set to a specific point, the center position or the center of gravity position of the IC device 90 is overlapped with the target placement position (point), so that the IC device 90 becomes a specific angle.

As shown in FIG. 2, the electronic component inspection device 1 according to the present invention includes an electronic component transfer device 10 and further includes an inspection unit 16 for inspecting electronic components. That is, the electronic component inspection apparatus 1 according to the present invention includes a transfer unit 25 that transfers an IC device 90 that is an electronic component, and an IC device 90 (electronic component) device supply unit 14 that is a mounting portion 29 that has a mounting IC The mounting surface 142 of the device 90 (electronic component) carries the IC device 90 (electronic component); the drive portion 26 moves the device supply portion 14 (mounting portion 29); the first abutment portion 4 has a The first contact point 41 is in contact with the IC device 90 (electronic component) placed on the mounting surface 142; the second contact portion 5 has a second contact point 51, and the second contact point 51 may The IC device 90 (electronic component) placed on the mounting surface 142 is abutted at a position different from the first contact point 41, and is far from the first contact point 41; the mechanism section 6, which is in contact with the device supply section 14 ( The first contact portion 4 and the second contact portion 5 are relatively moved in accordance with the movement of the mounting portion 29), and the inspection portion 16 can inspect the IC device 90 (electronic component). In addition, the device supply section 14 (mounting section 29) is supported to be movable to the first position in the device supply area A2 and the second position in the inspection area A3 which is different from the first position, and may be in the first position. The IC device 90 (electronic component) is transported to and from the second position. In addition, the first separation distance (the first separation distance LX1, the first separation distance LY1), which is the separation distance between the first contact point 41 and the second contact point 51 at the first position, is larger than that at the second position. The second separation distance (the second separation distance LX2, the second separation distance LY2), which is the separation distance between the first contact point 41 and the second contact point 51, is long. Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component conveying apparatus 10 can be obtained. In addition, the IC device 90 (electronic component) can be transported to the inspection unit 16, so that the inspection of the IC device 90 can be performed by the inspection unit 16. The IC device 90 after the inspection can be transferred from the inspection unit 16.

Hereinafter, the configuration of each unit will be described in detail. As shown in FIG. 1 and FIG. 2, the electronic component inspection device 1 having the electronic component transfer device 10 transfers electronic components such as BGA (Ball Grid Array) packages, that is, IC devices, and the like during the transfer process. A device for inspecting and testing the electrical characteristics of electronic parts (hereinafter referred to as "inspection"). In the following, for convenience of explanation, a case where an IC device is used as the electronic component will be described as a representative, and it will be referred to as an “IC device 90”. In this embodiment, as an example, the IC device 90 is formed in a flat plate shape and has a square shape in a plan view.

In addition, as the IC device, in addition to the above-mentioned devices, for example, "LSI (Large Scale Integration)", "CMOS (Complementary MOS (Metal Oxide Semiconductor), Complementary Metal Oxide Semiconductor)", "CCD (Charge Coupled Device "or" Module IC "obtained by packaging an IC device into a plurality of modules, or" Quartz Crystal Device "," Pressure Sensor "," Inertial Sensor (Acceleration) Sensor) "," gyro sensor "and" fingerprint sensor ".

The electronic component inspection device 1 (electronic component transfer device 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device recovery area A4, and a tray removal area A5. These areas are partially separated by walls as described below. In addition, the IC device 90 passes through each of the above-mentioned areas in the direction of the arrow α ₉₀ from the tray supply area A1 to the tray removal area A5 in order, and is inspected in the inspection area A3 on the way. In this way, the electronic component inspection device 1 is provided with the following components: the electronic component transfer device 10 having a transfer section 25 that transfers the IC device 90 so as to pass through each area; the inspection section 16 that performs an inspection in the inspection area A3; and Control section 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

The side of the electronic component inspection device 1 where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 becomes the front side, and the side where the inspection area A3 is arranged, that is, the upper side in FIG. 2 is used. As the back side.

In addition, the electronic component inspection apparatus 1 is used by being equipped with a so-called "replacement module" that can be replaced for each type of the IC device 90 in advance. As this replacement module, in this embodiment, for example, there are the following temperature adjustment section 12, a device supply section 14, and a device recovery section 18. The inspection unit 16 also includes a tray 200 and a recovery tray 19 prepared by the user separately from the replacement unit as described above.

The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 are arranged in an unchecked state. The tray supply area A1 may also be referred to as a loading area where a plurality of trays 200 can be stacked and mounted. In this embodiment, a plurality of recesses (cavities) are arranged in a matrix in each tray 200. The IC devices 90 can be stored and placed one by one in each recess.

The device supply area A2 is an area up to the plurality of IC devices 90 on the tray 200 transferred from the tray supply area A1 and supplied to the inspection area A3, respectively. Furthermore, a tray transfer mechanism 11A and a tray transfer mechanism 11B are provided, and the trays 200 are transferred one by one in the horizontal direction so as to span the tray supply area A1 and the device supply area A2. The tray conveying mechanism 11A is a part of the conveying section 25, and can move the tray 200 toward the positive side of the Y direction with respect to each IC device 90 placed on the tray 200, that is, in the direction of the arrow α _{11A in} FIG. 2. Thereby, the IC device 90 can be stably fed into the device supply area A2. The tray conveyance mechanism 11B can move the empty tray 200 toward the negative side in the Y direction, that is, in the direction of the arrow α _{11B in} FIG. 2. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

In the device supply area A2, a temperature adjustment section (English expression: soap plate, Chinese expression (one example): temperature equalizing plate) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. A device supply unit 14 is also provided that moves across the device supply area A2 and the inspection area A3.

The temperature adjustment unit 12 is called a "temperature equalizing plate", and is used to mount a plurality of IC devices 90, and the mounted IC devices 90 can be heated or cooled together. With the temperature equalizing plate, the IC device 90 before the inspection by the inspection unit 16 can be heated or cooled in advance, and adjusted to a temperature suitable for the inspection.

Such a temperature adjustment unit 12 is fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment section 12 can be stably adjusted. The temperature adjustment unit 12 is grounded.

In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment sections 12.

The device transfer head 13 is a holding portion that holds and transfers the IC device 90 and is supported to be movable within the device supply area A2. The device transfer head 13 is also a part of the transfer unit 25, and is responsible for transferring the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the temperature adjustment unit 12 and the following device supply unit Transfer of IC devices 90 between 14. In FIG. 2, the movement in the X direction of the device transfer head 13 is indicated by an arrow α _13X , and the movement in the Y direction of the device transfer head 13 is indicated by an arrow α _13Y .

The device supply section 14 is called a “supply shuttle board” or simply a “supply shuttle”, and is a mounting section 29 on which the temperature-adjusted IC device 90 is placed, and the IC device 90 can be transported to Near inspection section 16.

The device supply unit 14 is supported to be reciprocable (movable) in the X direction, that is, in the direction of the arrow α ₁₄ between the device supply region A2 and the inspection region A3. With this, the device supply section 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection section 16 of the inspection area A3. After the IC device 90 is removed by the device transfer head 17 in the inspection area A3, Return to the device supply area A2 again.

In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the negative side in the Y direction is sometimes referred to as a “device supply unit 14A”, and the device supply unit 14 is on the positive side in the Y direction. The device supply section 14 is referred to as a "device supply section 14B". The IC device 90 on the temperature adjustment section 12 is transported to the device supply section 14A or the device supply section 14B in the device supply region A2. The device supply unit 14 is configured to heat or cool the IC device 90 placed on the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 temperature-adjusted by the temperature-adjustment part 12 can maintain the temperature-adjusted state, and can carry it to the vicinity of the inspection part 16 of the inspection area A3. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all the IC devices 90 are removed, to the positive side in the X direction, that is, in the direction of arrow α ₁₅ in the device supply area A2. After the transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, an inspection section 16 for inspecting the IC device 90 and a device transfer head 17 are provided.

The device transfer head 17 is a part of the transfer section 25 and, similarly to the temperature adjustment section 12, is configured to heat or cool the held IC device 90. Thereby, the IC device 90 which maintains the said temperature adjustment state can be hold | maintained, and the IC device 90 can be conveyed in the inspection area A3 in the state which maintained the said temperature adjustment state.

Such a device transfer head 17 is supported to be able to reciprocate in the Y direction and the Z direction in the inspection area A3, and is a part of a mechanism called an "indexing arm". Thereby, the device transfer head 17 can lift the IC device 90 from the device supply section 14 carried in from the device supply area A2, and transfer and place the IC device 90 on the inspection section 16.

In FIG. 2, the Y-direction reciprocating movement of the device transfer head 17 is indicated by an arrow α _17Y . The device transfer head 17 is supported to be reciprocable in the Y direction, but it is not limited to this, and may be supported to be reciprocable in the X direction. In the configuration shown in FIG. 2, two device transfer heads 17 are arranged in the Y direction, and the device transfer heads 17 on the negative side in the Y direction are sometimes referred to as “device transfer heads 17A” and the Y direction The device transfer head 17 on the front side is referred to as a "device transfer head 17B". The device transfer head 17A may be responsible for transferring the IC device 90 from the device supply unit 14A to the inspection unit 16 in the inspection area A3, and the device transfer head 17B may be responsible for transferring the IC device 90 from the device supply unit 14B to the inspection unit in the inspection area A3 Transfer of 16.

The inspection unit 16 (socket) can mount an IC device 90 as an electronic component and check the electrical characteristics of the IC device 90. The inspection portion 16 has a recessed portion for accommodating and placing the IC device 90, and a plurality of probe pins are provided at the bottom of the recessed portion. In addition, the terminals of the IC device 90 and the probe pins can be conductively connected, that is, in contact, whereby the inspection of the IC device 90 can be performed. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a tester connected to the inspection section 16.

Such an inspection unit 16 can heat or cool the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection, similarly to the temperature adjustment unit 12.

The device recovery area A4 is an area for recovering a plurality of IC devices 90 that are inspected in the inspection area A3 and the inspection has ended. In this device recovery area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. In addition, a device recovery unit 18 is also provided that moves across the inspection area A3 and the device recovery area A4. An empty tray 200 is also prepared in the device recovery area A4.

The device recovery section 18 is an IC device 90 that is placed in the inspection section 16 and has been inspected and can be transported to the device recovery area A4, and is called a "recycling shuttle" or simply "recycling" shuttle". The device recovery section 18 may be a part of the transport section 25.

The device recovery unit 18 is supported so as to be able to reciprocate between the inspection area A3 and the device recovery area A4 in the X direction, that is, in the direction of the arrow α ₁₈ . In the configuration shown in FIG. 2, the device recovery unit 18 is arranged in the Y direction in the same manner as the device supply unit 14. The device recovery unit 18 on the negative side in the Y direction may be referred to as “device recovery”. The device recycling unit 18 on the positive side in the Y direction is referred to as a "device recycling unit 18B". The IC device 90 on the inspection section 16 is carried and placed in the device recovery section 18A or the device recovery section 18B. In addition, the transfer of the IC device 90 from the inspection section 16 to the device recovery section 18A is performed by the device transfer head 17A, and the transfer from the inspection section 16 to the device recovery section 18B is performed by the device transfer head 17B. The device recovery unit 18 is also grounded in the same manner as the temperature adjustment unit 12 or the device supply unit 14.

The collection tray 19 is used to mount the IC device 90 that has been inspected by the inspection unit 16 and is fixed so as not to move within the device collection area A4. Thereby, even if the device recovery area A4 where a relatively large number of movable parts such as the device transfer head 20 are disposed, the inspected IC device 90 is stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

In addition, three empty trays 200 are also arranged along the X direction. The empty tray 200 is also used to mount IC devices 90 that have been inspected by the inspection unit 16. Then, the IC device 90 on the device recovery section 18 moved to the device recovery area A4 is transported and placed in any one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transfer head 20 has a portion which is supported so as to be movable in the X direction and the Y direction within the device recovery area A4, and is also movable in the Z direction. The device transfer head 20 is a part of the transfer unit 25 and can transfer the IC device 90 from the device collection unit 18 to the collection tray 19 or the empty tray 200. In FIG. 2, the movement in the X direction of the device transfer head 20 is indicated by an arrow α _20X , and the movement in the Y direction of the device transfer head 20 is indicated by an arrow α _20Y .

The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction, that is, in the direction of arrow α ₂₁ in the device recovery area A4. After the transfer, the empty tray 200 is disposed at a position where the IC device 90 is collected, that is, it can be any of the three empty trays 200 described above.

The tray removal area A5 is a material removal section for recovering and removing the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

In addition, a tray transfer mechanism 22A and a tray transfer mechanism 22B are provided to move the tray 200 in the Y direction one by one across the device recovery area A4 and the tray removal area A5. The tray conveying mechanism 22A is a part of the conveying section 25, and is a moving section that can reciprocate the tray 200 in the Y direction, that is, the direction of the arrow α _22A . Thereby, the inspected IC device 90 can be transferred from the device recovery area A4 to the tray removal area A5. In addition, the tray conveyance mechanism 22B can move the empty tray 200 for recovering the IC device 90 toward the positive side in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4.

The control unit 800 can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, the device recovery unit 18, Operations of the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B, and the like. As shown in FIG. 3, the control unit 800 includes at least one processor, that is, a CPU (Central Processing Unit) and a memory unit. The CPU can perform, for example, various judgments and various commands. The memory section stores, for example, various programs such as a program for transferring the IC device 90 from the tray supply area A1 to the tray removal area A5. The control unit 800 may be built in the electronic component inspection device 1 (electronic component transfer device 10), or may be installed in an external device such as an external computer. In addition, for example, an external device may communicate with the electronic component inspection device 1 via a cable or the like, perform wireless communication, or connect to the electronic component inspection device 1 via a network (for example, the Internet). The CPU and the memory unit can be integrated into, for example, a single unit. The CPU can also be built into the electronic component inspection device 1, the memory unit can be installed on an external computer such as an external computer, or the memory unit can be built into the electronic component Inspecting device 1, the CPU is installed in an external device such as an external computer.

The operator can set or confirm the operating conditions and the like of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 includes a display screen 301 composed of, for example, a liquid crystal screen, and is arranged on the upper portion of the front side of the electronic component inspection device 1. As shown in FIG. 1, on the right side in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse is provided. This mouse is used when the screen displayed on the monitor 300 is operated.

The monitor 300 is provided with an operation panel 700 in the lower right of FIG. 1. The operation panel 700 instructs the electronic component inspection apparatus 1 separately from the monitor 300 to a desired operator.

In addition, the signal lamp 400 can report the operation state of the electronic component inspection device 1 and the like by a combination of the colors of light emission. The signal lamp 400 is arranged on the upper part of the electronic component inspection device 1. Furthermore, a speaker 500 is built in the electronic component inspection device 1, and the operating state of the electronic component inspection device 1 or the like may be reported through the speaker 500.

Regarding the electronic component inspection device 1, the tray supply area A1 and the device supply area A2 are separated by a first partition wall 231, the device supply area A2 and the inspection area A3 are separated by a second partition wall 232, and the inspection area A3 and the device are recycled The areas A4 are separated by a third partition wall 233, and the device recovery area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The device supply region A2 and the device recovery region A4 are also separated by a fifth partition wall 235.

The outermost package of the electronic component inspection device 1 is covered by a cover, which includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

As described above, the device supply section 14 is supported so as to be reciprocable in the X direction between the device supply area A2 and the inspection area A3. The device supply unit 14 includes a device supply unit 14A and a device supply unit 14B. The device supply unit 14A and the device supply unit 14B have the same configuration except that they are arranged differently. Therefore, the device supply unit 14A will be representatively described below.

As shown in FIG. 3, the device supply portion 14A is formed in a plate shape and has a plurality of recessed portions 141 for accommodating the IC devices 90 one by one. In the configuration shown in FIG. 3, the recesses 141 are arranged in four along the X direction and two in the Y direction. However, the number and arrangement of the recesses 141 are not limited to this. As shown in FIGS. 4 and 5, the bottom surface of each recessed portion 141 becomes a mounting surface 142 on which the IC device 90 is mounted. In addition, the depth of each concave portion 141 is not particularly limited. For example, when the IC device 90 is a BGA (Ball Grid Array) device, it is preferably a depth that is hidden from the solder ball (terminal), that is, soldering. The balls have the same diameter (height). Thereby, the light of the detection sensor (optical sensor) of the presence or absence of the IC device 90 in the detection recess 141 can be prevented from being reflected to the solder ball, thereby preventing the detection accuracy of the detection sensor from being lowered.

Furthermore, in this embodiment, the device supply unit 14A has a recessed portion forming member 143 in which one recessed portion 141 is formed, and a plurality of the recessed portion forming members 143 are arranged. Each recessed part forming member 143 is fixed via two bolts 901.

In addition, the device supply unit 14A can be moved by the driving unit 26 between a first position that is a stop position in the device supply region A2 and a second position that is a stop position in the inspection region A3. In the first position (see FIG. 4), the IC device 90 is placed on the recessed portion 141 of the device supply portion 14A via the device transfer head 13. At the second position, the IC device 90 is removed from the recessed portion 141 by the device transfer head 17A. The removed IC device 90 is inspected by the inspection unit 16.

The drive section 26 is disposed below the device supply section 14A, and has a configuration including, for example, a motor, a ball screw connected to the motor and connected to the device supply section 14A, and a linear guide connected to the device supply section 14A. With this configuration, the device supply portion 14A can be smoothly reciprocated in the X direction, that is, between the first position and the second position.

As shown in FIG. 3, the electronic component inspection device 1 (electronic component transfer device 10) includes a positioning unit 3A for positioning the IC device 90 in each recessed portion 141 of the device supply portion 14A, a force transmission unit 27, and a component supply unit. When the portion 14A is in the first position, a force imparting portion 28 that imparts an external force to the mechanism portion 6 of the positioning unit 3A via the force transmitting unit 27.

The positioning unit 3A is disposed on the device supply portion 14A corresponding to each of the recesses 141. In the configuration shown in FIG. 3, four positioning units are arranged along the X direction and four are arranged along the Y direction. There are two configurations. Furthermore, the number and arrangement of the positioning units 3A are not limited to this.

The force transmission unit 27 is located on the device supply portion 14A, and is located on the negative side in the X direction than the positioning unit 3A. In the configuration shown in FIG. 3, two force transmission units 27 are arranged in the Y direction. In addition, the force transmission unit 27 is not limited to the number of arrangements and the arrangement aspect shown in FIG. 3. In addition, the force transmission unit 27 may be omitted depending on, for example, the number and arrangement of the positioning units 3A.

Each force transmission unit 27 includes a base portion 271 formed in a plate shape, a cover portion 272 disposed on the base portion 271, and a push rod 273 disposed between the base portion 271 and the cover portion 272 and formed in a rod shape; and a spring. The pushing portion 274 pushes the push rod 273 toward the negative side in the X direction.

The base portion 271 is fixed to the device supply portion 14A. The cover portion 272 is formed in a plate shape smaller than the base portion 271 and is fixed to the base portion 271. A groove 275 through which the push rod 273 is inserted is formed on the surface of the cover portion 272 on the side of the base portion 271.

The push rod 273 may be guided to the groove 275 and slide in the X direction. Both ends of the push rod 273 protrude from the cover portion 272, respectively. In addition, an end portion on the negative side in the X direction of the push rod 273 is a flange portion 276 having an enlarged outer diameter.

The elastic pushing portion 274 is formed by a coil spring, and the push rod 273 is inserted through. The ejection portion 274 is compressed between the flange portion 276 and the cover portion 272 of the push rod 273. Thereby, the push rod 273 can be pushed toward the negative side in the X direction.

The force imparting portion 28 includes two projecting portions 281 that project toward the positive side in the X direction, and a supporting portion 282 that supports the projecting portions 281 together.

The two protruding portions 281 are arranged along the Y direction. Of the two protrusions 281, the protrusion 281 on the negative side in the Y direction can abut against the pusher 273 of the force transmission unit 27 on the same side as the protrusion 281, and further push the pusher 273 toward the positive side in the X direction. Pressure. Similarly, the protruding portion 281 on the positive side in the Y direction can abut against the push rod 273 of the force transmission unit 27 on the same side as the protruding portion 281, and further push the push rod 273 toward the positive side in the X direction. Each protruding portion 281 is formed in a columnar shape, and is supported by the support portion 282 such that the central axis thereof is parallel to the X direction. In addition, the shape of each protruding portion 281 is not limited to a columnar shape.

The support portion 282 includes: two leg portions 283 which are arranged separately in the Y direction; and a bridge portion 284 which is erected between the two leg portions 283. Each leg portion 283 is fixed in the device supply region A2.

The bridge portion 284 is formed in a long plate shape extending in the Y direction. Further, each protruding portion 281 is fixed midway in the lengthwise direction of the bridging portion 284.

As described above, the electronic component inspection apparatus 1 includes eight positioning units 3A that position the IC device 90 in each recessed portion 141 of the device supply portion 14A. Each positioning unit 3A has the same configuration except that the positioning locations are different. Therefore, one positioning unit 3A will be described below as a representative.

As shown in FIGS. 4 and 5, the positioning unit 3A includes: a first abutment portion 4 having a first abutment point 41 capable of abutting the IC device 90 placed on the mounting surface 142; and a second abutment The part 5 has a second contact point 51 which can be in contact with the IC device 90 placed on the mounting surface 142 at a position different from the first contact point 41 and away from the first contact point 51. The abutment point 41 and the mechanism portion 6 move the first abutment portion 4 and the second abutment portion 5 relatively in cooperation with the movement of the device supply portion 14A. In addition, the positioning unit 3A may include a recess forming member 143.

The first contact portion 4 is located on the right side with respect to the recessed portion 141. The first contact portion 4 is composed of a small piece or a frame (a small piece in this embodiment). A part of the left edge portion of the first abutment portion 4 is formed in a planar shape facing the IC device 90, and the first abutment portion 4 is a first abutment point 41 that can make point contact, line contact, or surface contact with the IC device 90. In this embodiment, the first contact point 41 includes a first contact point 41X facing the negative side in the X direction, and a first contact point 41Y facing the positive side in the Y direction. In addition, as the first abutment point 41, there are two places, but it is not limited thereto, and there may be one or three places. The shape of the first contact portion 4 in a plan view is not limited to the shape shown in FIG. 4 or FIG. 5.

The first abutment portion 4 having such a structure is rotatably supported by the recessed portion forming member 143 via the rotation support portion 144. The rotation support portion 144 is a cylindrical member that is fixed to the recessed portion forming member 143 and protrudes toward the positive side in the Z direction, and penetrates the first contact portion 4. Thereby, the 1st abutment part 4 can rotate about the rotation support part 144 as a rotation center. In addition, the first contact portion 4 prevents the spin support portion 144 from being detached by the C-ring 145.

The second abutting portion 5 is located on the left side of the recessed portion 141, that is, the intervening recessed portion 141 and the first abutting portion 4 are on the opposite side.

As described above, the first contact portion 4 is composed of a small piece or a frame (a small piece in this embodiment). The second abutting portion 5 is composed of a small piece or a frame (a small piece larger than the first abutting portion 4 in this embodiment). As described above, in the present embodiment, the first abutment portion 4 and the second abutment portion 5 are each constituted by a small piece. This can reduce the burden on the mechanism portion 6 when the mechanism portion 6 moves the first abutment portion 4 and the second abutment portion 5 relative to each other, and thus the relative movement can be smoothly performed. In addition, miniaturization of the positioning unit 3A can be achieved.

A part of the right edge portion of the second abutment portion 5 is formed in a planar shape facing the IC device 90, and the second abutment portion 5 is a second abutment point 51 capable of making point, line, or surface contact with the IC device 90. In this embodiment, the second contact point 51 includes a second contact point 51X facing the positive side in the X direction and a second contact point 51Y facing the negative side in the Y direction. In addition, as the second contact point 51, there are two places, but it is not limited thereto, and there may be one or three places. The shape of the second contact portion 5 in a plan view is not limited to the shape shown in FIG. 4 or FIG. 5.

The second abutting portion 5 having such a configuration is positioned on the recessed portion forming member 143 via two guide pins 146 that are separately arranged in the XY plane direction. The second contact portion 5 is fixed to the recess forming member 143 via two bolts 902.

The first contact portion 4 and the second contact portion 5 can be replaced according to the type of the IC device 90.

As described above, the first contact portion 4 is rotatably supported. Thereby, a closed state where the first abutment portion 4 is close to the second abutment portion 5 and closed between them (see FIG. 4), and the first abutment portion 4 with respect to the second abutment portion 5 can be obtained. The open state of being separated and opened between them (refer to FIG. 5). In addition, the separation distance between the first contact point 41 and the second contact point 51 in the open state shown in FIG. 4, that is, the first separation distance is smaller than the first contact point 41 in the closed state shown in FIG. 5. The second separation distance, which is the separation distance from the second contact point 51, is long. The first separation distance includes a first separation distance LX1 between the first contact point 41X and the second contact point 51X, and a first separation between the first contact point 41Y and the second contact point 51Y. The distance LY1 (see FIG. 4). The second separation distance includes a second separation distance LX2 between the first contact point 41X and the second contact point 51X, and a second separation distance between the first contact point 41Y and the second contact point 51Y. LY2 (see Fig. 5). The first separation distance LX1 is longer than the second separation distance LX2, and the first separation distance LY1 is longer than the second separation distance LY2. Hereinafter, as the "first separation distance between the first contact point 41 and the second contact point 51", the first separation distance LX1 is represented as the "first contact point 41 and the second contact point 51" The second separation distance between them "is represented by the second separation distance LX2. When the device supply unit 14A is located at the first position, it becomes the first separation distance LX1, and when the device supply unit 14A is located at the second position, it becomes the second separation distance LX2.

As shown in FIG. 4, in the first position, the IC device 90 is placed in the recessed portion 141 of the device supply portion 14A. At this time, a first separation distance LX1 is formed between the first contact point 41 and the second contact point 51. Thereby, when the IC device 90 is placed in the recessed portion 141, the space between the first abutting portion 4 and the second abutting portion 5 is widened to the extent that the IC device 90 can pass therethrough, so it can be easily performed. The IC device 90 is placed on the concave portion 141.

However, in general, the electronic component inspection apparatus may adjust the position of the device supply unit 14A by a worker's manual operation before shipment. In this case, due to the skill of the operator, the accuracy (accuracy) of the position adjustment of the device supply section 14A may vary, or the position adjustment of the device supply section 14A may be time-consuming due to the desire to improve the position accuracy. And other issues. For example, when the gap between the recessed portion 141 of the device supply portion 14A and the IC device 90 is about 0.25 mm as before, and the position adjustment accuracy of the device supply portion 14A at the first position is not so high, there are IC devices 90 is not placed in the recessed portion 141 of the device supply portion 14A, and there is a risk of clogging.

Therefore, in the electronic component inspection apparatus 1, the first separation distance LX1 is set between the first contact point 41 and the second contact point 51 at the first position. This allows the IC device 90 to be placed in the recessed portion 141 even when the accuracy of the position adjustment of the device supply portion 14A at the first position is not so high. In addition, the operation of maintaining the accuracy of the position adjustment of the device supply section 14A at the first position to a high precision is omitted. Therefore, although the position adjustment operation of the device supply section 14A does not take much time, the electronic component inspection device 1 The IC device 90 can still be fully handled.

As described above, the electronic component inspection device 1 is configured to easily perform positioning adjustment of the recessed portion 141 of the device supply portion 14A and the IC device 90 placed on the recessed portion 141.

The first contact portion 4 and the second contact portion 5 can be relatively moved by the operation of the mechanism portion 6. In the present embodiment, the mechanism section 6 is configured to move the first abutment section 4 relative to the fixed second abutment section 5, that is, approach and separate. Thereby, the positioning accuracy with respect to the IC device 90 is improved. The mechanism portion 6 is not limited to such a configuration. For example, when the second abutment portion 5 is movably supported, the second abutment portion 5 may be configured relative to the first abutment portion 4. The movement may be configured to move both the first contact portion 4 and the second contact portion 5.

The mechanism section 6 is configured to be provided with an external force to actuate the mechanism section 6 in conjunction with the movement of the device supply section 14A (the mounting section 29). That is, as described above, the electronic component inspection apparatus 1 includes the force imparting portion 28 that applies an external force to actuate the mechanism portion 6 when the device supply portion 14A (the placing portion 29) is in the first position. The mechanism section 6 includes a pressure receiving member 61 that is disposed in the device supply section 14A (the placing section 29) and has a pressure receiving section 611 that receives the external force from the self-force applying section 28. As shown in FIGS. 4 and 5, the pressure-receiving member 61 is a member formed in a rod shape and disposed between the recessed portion forming member 143 and the second contact portion 5. In addition, a groove 52 is formed on the surface of the second contact portion 5 on the side of the recess-forming member 143 through which the pressure-receiving member 61 is inserted. Thereby, the pressure-receiving member 61 can be guided to the groove 52 and slide in the X direction. Both ends of the pressure-receiving member 61 protrude from the second contact portion 5, respectively. In addition, an end portion on the negative side in the X direction of the pressure receiving member 61 is a pressure receiving portion 611 including a flange portion having an enlarged outer diameter. Thereby, the external force can be fully received by the self-force applying part 28.

Thereby, as long as the driving portion of the driving placement portion 29 is provided, and the driving portion for driving the mechanism portion 6 is not separately provided, the first contact portion 4 and the second contact portion 5 can be easily separated. Since it is not necessary to provide a driving section (actuator) for driving the mechanism section 6, it is difficult to provide wiring for driving the actuator, etc. for the mounting section 29 that is not moved. In addition, since there is no need to provide an actuator or a space for wiring, it can be mounted from the rear on a conventional electronic component transfer device that does not have such a space.

Furthermore, the pressure receiving members 61 of the positioning units 3A adjacent to each other in the X direction are arranged on a straight line and are in contact with each other.

As described above, the force imparting portion 28 has a protruding portion 281 that protrudes. When the pressure receiving portion 611 is located at the first position, the pressure receiving portion 611 can receive an external force from the protruding portion 281 toward the positive side in the X direction via the force transmission unit 27. Thereby, as described below, the first contact portion 4 can be rapidly rotated in a direction away from the second contact portion 5.

A cam 612 protruding toward the positive side in the Z direction is provided midway in the length direction of the pressure receiving member 61. The cam 612 is inserted into a cam groove 42 formed on the side opposite to the rotation support portion 144 of the first contact portion 4. The cam groove 42 includes a long hole formed parallel to the first contact point 41X. This allows the pressure receiving member 61 to move in the direction of the external force when the self-force applying portion 28 receives an external force toward the positive side in the X direction, and the cam 612 slides in the cam groove 42 in the direction in which it is formed. Thereby, the first abutment portion 4 can be rotated in the counterclockwise direction in FIG. 4, so that the first abutment portion 4 and the second abutment portion 5 are in an open state.

As described above, in the positioning unit 3A, an external force is received by the pressure-receiving member 61 (the pressure-receiving portion 611) from the self-stressing portion 28 (the protruding portion 281), and the first separation distance LX1 becomes longer than the second separation distance LX2. Thereby, the IC device 90 can pass between the first contact point 41 and the second contact point 51 with a margin, thereby being guided to the recessed portion 141. As a result, the IC device 90 is accurately placed in the recessed portion 141.

As shown in FIG. 4 and FIG. 5, the mechanism portion 6 includes a spring pushing portion 62 which springs the first contact portion in a direction in which the first contact point 41 and the second contact point 51 approach. 4 or the second contact portion 5 (the first contact portion 4 in the present embodiment). The elastic pushing portion 62 is composed of a compression coil spring, and the pressure receiving member 61 is inserted through. The pushing portion 62 is in a compressed state between the pressure receiving portion 611 of the pressure receiving member 61 and the recess forming member 143. Thereby, the 1st contact part 4 can be pushed toward the negative side of X direction via the pressure receiving member 61. When the device supply unit 14A starts moving from the first position to the second position, the external force of the self-force applying unit 28 on the pressure-receiving member 61 is gradually released in accordance with the movement. Then, the external force applied to the pressure receiving member 61 is finally released. At this time, the first abutting portion 4 is rotated in the clockwise direction in FIG. 5 by the elastic pushing force of the elastic pushing portion 62. Thereby, the 1st contact part 4 and the 2nd contact part 5 become a closed state, ie, the 2nd separation distance LX2 is formed between the 1st contact part 4 and the 2nd contact part 5. Thereby, the IC device 90 in the recessed part 141 is positioned, and it is conveyed to the 2nd position in the original state. Then, at the second position of the transfer destination, the IC device 90 is transferred to the inspection section 16 by the device transfer head 17A, and the inspection section 16 performs inspection.

Further, at the first position, after the first contact portion 4 and the second contact portion 5 have reached the first separation distance, the pressure receiving member 61 is separated from the force imparting portion 28 and the first contact portion 4 and the second contact portion 5 Since it is closed, it can be closed when the device supply part 14 (shuttle) moves. That is, when it is assumed that the device supply section 14 (shuttle) moves while the first contact section 4 and the second contact section 5 maintain a first separation distance, there is a case where the device supply section 14 (shuttle) moves. The IC device 90 (electronic component) moves due to acceleration and deceleration, and strongly collides with components such as the first abutment portion 4 or the second abutment portion 5 and the IC device 90 (electronic component) may be damaged. This state does not cause a strong collision, so there is no risk of damage.

In addition, in order to gradually release the external force of the self-force applying portion 28 against the pressure-receiving member 61, the first contact portion 4 and the second contact portion 5 are gradually closed, so there is no first contact portion 4 and the second contact portion 5 The IC device 90 (electronic component) may be strongly collided, and the IC device 90 (electronic component) may be damaged.

As described above, in the electronic component inspection apparatus 1, the positioning unit 3A is driven by the movement of the device supply unit 14A, and the operation of separately providing a dedicated driving source for driving the positioning unit 3A is omitted. Thereby, the structure of the electronic component inspection apparatus 1 can be simplified.

In addition, when the first contact portion 4 and the second contact portion 5 are in a closed state, for example, 0.25 is formed between the first contact point 41 or the second contact point 51 and the IC device 90. Clearance below mm.

In the present embodiment, the ejection portion 62 is configured to eject the first abutment portion 4, but is not limited to this. For example, the second abutment portion 5 may be configured to be rotatably supported. At this time, the second abutting portion 5 is pushed.

When the device supply unit 14A is moved from the first position to the second position, the position where the external force is released to the pressure receiving member 61 may be referred to as a "third position". In the third position, when the device supply unit 14A is moved from the second position to the first position, an external force is applied to the pressure receiving member 61 to start the action.

As shown in FIGS. 4 and 5, the mechanism section 6 includes a restricting section 63 that restricts the approach limit of the first contact point 41 and the second contact point 51. The restriction portion 63 is disposed between the first contact portion 4 and the second contact portion 5 and is fixed to the recessed portion forming member 143. The restricting portion 63 is a cylindrical member protruding toward the positive side in the Z direction. Thereby, when the first abutment portion 4 is rotated from the state shown in FIG. 4 to the state shown in FIG. 5, the abutment portion 63 abuts on the restricting portion 63, and thus the first abutment portion 4 and the second abutment portion 4 In the closed state of the contact portion 5, the second separation distance LX2 is maintained constant. Thereby, the positioning accuracy of the IC device 90 in the recessed portion 141 can also be maintained fixed.

Furthermore, a gap 31 is generated between the first contact portion 4 and the second contact portion 5 in the closed state. The gap 31 is an optical path through which light from a detection sensor (optical sensor) that detects the presence or absence of the IC device 90 in the recess 141 passes.

In addition, two positioning units 7 for positioning the device transfer head 17A in the inspection area A3 are arranged on the recess forming member 143. The two positioning units 7 are disposed on opposite sides of each other with the first contact portion 4 and the second contact portion 5 interposed therebetween. The positioning units 7 have the same configuration except that the positioning locations are different. Therefore, a single positioning unit 7 will be described below as a representative.

The positioning unit 7 includes a positioning block 71 and a positioning pin 72. The positioning block 71 is a member for positioning in the Z direction of the device transfer head 17A, and is fixed to the recess forming member 143 via a bolt 903. When the device transfer head 17A is used to hold the IC device 90, a specific portion of the device transfer head 17A touches the upper surface of the positioning block 71. Thereby, the Z-direction positioning of the device transfer head 17A is performed.

The positioning pin 72 is a member for positioning the XY direction of the device transfer head 17A, and is fixed to the positioning block 71. When the device transfer head 17A holds the IC device 90, the positioning pin 72 is inserted into a guide hole (not shown) of the device transfer head 17A. Thereby, the positioning of the XY direction of the device transfer head 17A is performed, and thus, the IC device 90 can be accurately held in combination with the positioning of the Z direction of the device transfer head 17A.

In the foregoing, the example in which the mechanism portion 6 is provided as the drive mechanism portion has been described, and the modification in which the drive portion 60 is provided as the drive mechanism portion has been described. The driving section 60 is disposed in the device supply section 14A (mounting section 29), and as shown in FIG. 4, the driving section 60 includes a rod-shaped member disposed between the recess forming member 143 and the second abutting section 5 And the actuator 601 shown by the two-dot chain line in FIG. 4. It can also be provided in the device supply part 14 (shuttle) like this FIG. As the actuator 601, for example, a pneumatic cylinder may be used. In this case, a pipe (not shown) is provided.

With this, regardless of the position where the IC device 90 (electronic component) is placed between the first contact point 41 and the second contact point 51 at the first position, the IC device 90 can be placed at the second position. (Electronic parts) Guide to the target placement position. Therefore, when the IC device 90 (electronic component) is transported to the inspection section 16 (socket), the IC device 90 (electronic component) can be correctly contacted with the inspection section 16 (socket), so that the IC device 90 (electronic) can be accurately inspected. Components).

<Second Embodiment> Hereinafter, a second embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 6 to 8. However, the differences from the above embodiment will be mainly described. Matters will be omitted from description.

This embodiment is the same as the first embodiment except that the configuration of the positioning unit is different.

As shown in FIG. 6, in the present embodiment, the positioning unit 3B is configured as a mechanism section 6 having a link mechanism. The mechanism portion 6 includes a pressure receiving member 61 as a first link, a second link 64 rotatably connected to the pressure receiving member 61, and a spring pushing portion that urges the pressure receiving member 61 via the second link 64. 62.

Midway in the longitudinal direction of the pressure-receiving member 61, the four first abutment portions 4 are arranged and fixed at equal intervals.

The second link 64 is also disposed midway in the longitudinal direction of the pressure receiving member 61. In the configuration shown in FIG. 6, the second link 64 is disposed between the first first contact portion 4 and the second first contact portion 4 from the negative side in the X direction. One is also arranged between the third first contact portion 4 and the fourth first contact portion 4 from the negative side in the X direction.

As shown in FIGS. 7 and 8, each of the second links 64 is formed in a long shape, and one end portion 641 of the second link 64 is rotatably supported via a rotation support portion 65. In addition, the other end portion 642 of each second link 64 is connected to the pushing portion 62. Furthermore, in this embodiment, the elastic pushing portion 62 is formed of a tension coil spring, and an end portion of the second link 64 opposite to the other end portion 642 is connected to a columnar shape fixed to the device supply portion 14A. The member 147. As a result, the second link 64 is in a state of being stretched toward the negative side in the X direction by the pusher 62. In addition, one end portion 641 and the other end portion 642 of each second link 64 are rotatably connected to the pressure receiving member 61 via a rotation connection portion 66. Thereby, the pressure receiving member 61 and the first abutting portion 4 are elastically pushed by the elastic pushing portion 62.

When the device supply portion 14A is located at the first position, as shown in FIG. 7, the pressure receiving member 61 is in a state where it resists the elastic thrust of the elastic thrust portion 62, receives the external force to the negative side in the X direction, and moves in the direction. Thereby, the first contact portion 4 and the second contact portion 5 are brought into an open state, that is, the first separation distance LX1 is formed between the first contact point 41X and the second contact point 51X. Thereby, the IC device 90 can pass between the first contact point 41 and the second contact point 51 with a margin, thereby being placed on the mounting surface 142.

When the device supply unit 14A starts moving from the first position to the second position, the external force applied to the pressure receiving member 61 is gradually released in accordance with the movement. Then, the external force applied to the pressure receiving member 61 is finally released. At this time, as shown in FIG. 8, for each first abutting portion 4, the pressure receiving member 61 moves toward the negative side in the X direction by the elastic pushing force of the elastic pushing portion 62 and approaches the second abutting portion 5. Thereby, the 1st contact part 4 and the 2nd contact part 5 become a closed state, ie, the 2nd separation distance LX2 is formed between the 1st contact part 4 and the 2nd contact part 5. Thereby, the IC device 90 on the mounting surface 142 is positioned and transported to the second position while being kept in the original state. At this second position, the IC device 90 is transferred to the inspection section 16 by the device transfer head 17A, and thereafter, the inspection is performed by the inspection section 1.

<Third Embodiment> Hereinafter, a third embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 9 and 10. The differences from the above embodiment will be mainly described, and the same matters will be described. A description thereof will be omitted.

This embodiment is the same as the first embodiment except that the configuration of the positioning unit is different.

As shown in FIGS. 9 and 10, in the positioning unit 3C of this embodiment, the first abutment portion 4 is composed of a small piece or a frame (a frame in this embodiment). The second contact portion 5 is composed of a small piece or a frame (a small piece in this embodiment). The first contact portion 4 made of a frame body has an opening portion 43 formed by opening (through) the inside of the first contact portion 4. Eight openings 43 are formed. In the present embodiment, four openings 43 are arranged in the X direction and two are arranged in the Y direction. It should be noted that the number or form of formation of the openings 43 is not limited to those shown in FIGS. 9 and 10. The shape of each of the openings 43 in a plan view is a square, but the shape is not limited to this. Further, the edge portion of each opening portion 43 on the negative side in the X direction becomes the first contact point 41X, and the edge portion on the positive side of the Y direction becomes the first contact point 41Y. The first contact portion 4 is movable on the device supply portion 14A. This movement is smoothly performed by the cam groove 45 formed in the first contact portion 4 and the cam follower 148 protruding from the device supply portion 14A and inserted into the cam groove 45. On the other hand, one second abutment portion 5 composed of small pieces is arranged inside each of the opening portions 43 and is fixed to the device supply portion 14A. The portion of each second abutment portion 5 that is opposite to the first abutment point 41X where the opening portion 43 of the second abutment portion 5 is disposed becomes the second abutment point 51X, and the first abutment point 41Y. The opposing portion becomes the second contact point 51Y. Furthermore, in this embodiment, the second abutting portion 5 is composed of a small piece, but it is not limited to this, and may be composed of a frame.

The mechanism section 6 includes a cam member 68 that is rotatably supported by the device supply section 14A via a rotation support section 67, a cam follower 69 that is arranged and fixed to the inspection area A3, and a spring pushing section 62 that弹 推 CAM 机构 68. The cam follower 69 is preferably rotatable about the Z axis.

The cam member 68 includes a cam groove 681 into which a cam follower 44 protruding from the first contact portion 4 is inserted. The cam member 68 also has a cam surface 682 for sliding the cam follower 69 when the device supply unit 14A moves to the second position.

The ejection portion 62 can eject the cam member 68 in the clockwise direction around the rotation support portion 67 as a center.

When the device supply portion 14A is located at the first position, as shown in FIG. 9, the cam member 68 is in a state where the first contact portion 4 is stretched toward the upper side in the figure via the cam follower 44. As a result, the first separation distance LX1 is formed between the first contact point 41X and the second contact point 51X. Thereby, the IC device 90 can pass between the first contact point 41 and the second contact point 51 with a margin, thereby being placed on the mounting surface 142.

When the device supply unit 14A is moved to the second position, as shown in FIG. 10, the cam follower 69 slides on the cam surface 682 of the cam member 68. With this, the cam member 68 opposes the elastic thrust of the elastic pushing portion 62. , Rotate counterclockwise in the figure. Thereby, the cam follower 148 slides in the cam groove 45, and thereby the first abutting portion 4 can be moved. Thereby, the second separation distance LX2 is formed between the first contact point 41X and the second contact point 51X, and the IC device 90 on the mounting surface 142 is positioned. Then, the IC device 90 is transferred to the inspection section 16 by the device transfer head 17A, and thereafter, the inspection is performed by the inspection section 16.

The first contact portion 4 and the cam member 68 are configured separately, but are not limited thereto. For example, the first contact portion 4 and the cam member 68 may be integrally formed, that is, the first contact. The part 4 has a cam surface 682.

The cam member 68 is rotated by the cam follower 69, but is not limited to this. For example, the cam member 68 may be connected to a wire such as a wire or a spring and rotated by applying tension to the wire. move. For example, when the wire is a spring, an end portion of the spring on the opposite side to the cam member 68 is connected to the post of the device supply region A2. When the device supply unit 14A moves from the first position to the second position, a force obtained by multiplying the moving distance by the spring constant is applied to the spring as tension. Thereby, the cam member 68 can be rotated, whereby the first contact portion 4 is moved, and the second separation distance LX2 is formed between the first contact point 41X and the second contact point 51X.

<Fourth Embodiment> Hereinafter, a fourth embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 11 to 14. However, the differences from the above embodiment will be mainly described. Matters will be omitted from description.

This embodiment is the same as the first embodiment described above except that the configuration of the device transfer head in the inspection area and the configuration of the positioning unit are different.

The electronic component transfer device 10 of the present invention includes a transfer portion 25 including a device transfer head 17 (device transfer head 17A) having a holding portion 171 that holds an IC device 90 as an electronic component, and an IC device 90 (electronic component). ; The IC device 90 (electronic component) as the mounting portion 29 and the device supply portion 14 (device supply portion 14A) have a mounting surface 142 on which the IC device 90 (electronic component) is mounted, and the IC device 90 (electronic component) is transported. (Parts); driving part 26, which moves the device supply part 14 (mounting part 29); the first abutment part 4, which has abutment with the IC device 90 (electronic part) placed on the mounting surface 142 A first abutment point 41; and a second abutment portion 5 having a second abutment point 51 which can be placed on a mounting surface at a position different from the first abutment point 41 The IC device 90 (electronic component) of 142 is in contact with and is far from the first contact point 41. In addition, the device supply section 14 (mounting section 29) is supported to be movable to the first position in the device supply area A2 and the second position in the inspection area A3 which is different from the first position, and can be moved to the first position. The IC device 90 (electronic component) is transferred between the position and the second position. In addition, the first separation distance (the first separation distance LX1, the first separation distance LY1) that is the separation distance between the first contact point 41 and the second contact point 51 in a state where the holding portion 171 is close to the mounting surface 142. The second separation distance (the second separation distance LX2, the second separation distance LY2), which is the separation distance between the first contact point 41 and the second contact point 51 in a state where the holding portion 171 is farther from the mounting surface 142, is longer. . According to the present invention, the separation distance between the first contact point 41 and the second contact point 51 becomes the largest at the first position (the first separation distance LX1). Therefore, even when the accuracy of the position adjustment of the device supply section 14 at the first position is not so high, the IC device 90 can pass through the first contact point 41 and the second contact point 51 with a margin. Thereby, it is guided to the mounting surface 142. As a result, the IC device 90 is placed on the mounting surface 142. In addition, the operation of maintaining the accuracy of the position adjustment of the device supply section 14 at the first position to a high degree of accuracy is omitted. Therefore, although the position adjustment operation of the device supply section 14 does not take much time, the electronic component transfer device 10 It can fully withstand the transportation of the IC device 90. In this way, in the present invention, the positioning adjustment of the mounting surface 142 of the device supply section 14 and the IC device 90 mounted on the mounting surface 142 can also be easily performed.

As shown in FIG. 11, the device transfer head 17A includes a holding portion 171 that holds the IC device 90 by suction. The holding portion 171 is formed in a cylindrical shape, and the outer diameter of the outer peripheral portion 172 is formed in a tapered shape that gradually decreases toward the downward direction.

As shown in FIG. 12, in the positioning unit 3D, the first abutment portion 4 is composed of two small pieces 46. One of the two small pieces 46 has a first abutment point 41X facing the second abutment point 51X of the second abutment portion 5. In addition, the other small piece 46 has a first contact point 41Y facing the second contact point 51Y of the second contact portion 5.

As shown in FIGS. 13 and 14, each of the small pieces 46 is cantilevered and supported on the device supply portion 14A via a plate spring 47. Thereby, the one small piece 46 is pushed and pushed toward the second contact point 51X, and the other small piece 46 is pushed and pushed toward the second contact point 51Y. The person pushing the small pieces 46 is not limited to the leaf spring 47, and may be, for example, a coil spring.

When the device supply section 14A is at the first position, the IC device 90 is placed on the mounting surface 142 (recessed section 141) of the device supply section 14A by the device transfer head 17A. At this time, as shown in FIG. 13, the holding portion 171 is brought close to the mounting surface 142. As a result, each of the small pieces 46 is pushed against the spring thrust of the leaf spring 47 to the outer peripheral portion 172 of the holding portion 171 together. As a result of this pressing, each of the small pieces 46 is tilted away from the second contact portion 5, and the first contact point 41X and the second contact point 51X become the first separation distance LX1, and the first contact point 41Y The second contact point 51Y becomes the first separation distance LY1. In this state, the IC device 90 can pass between the first abutment point 41 and the second abutment point 51 with a margin, and thus, the IC device 90 is placed on the mounting surface 142. The first separation distance LX1 is longer than the second separation distance LX2, and the first separation distance LY1 is longer than the second separation distance LY2.

Then, after the IC device 90 is mounted, as shown in FIG. 14, the device transfer head 17A is raised, and the holding portion 171 is separated from the mounting surface 142. As a result, each of the small pieces 46 is released from the pressing force from the outer peripheral portion 172 of the holding portion 171 and is erected (returned) toward the second abutting portion 5 by the elastic pushing force of the plate spring 47. Thereby, the second separation distance LX2 is formed between the first contact point 41X and the second contact point 51X, and the second separation distance LY2 is formed between the first contact point 41Y and the second contact point 51Y. At this time, the IC device 90 is positioned on the mounting surface 142.

Thereafter, the device supply unit 14A can be moved to the second position. At the second position, the IC device 90 is transferred to the inspection section 16 by the device transfer head 17A, and thereafter, the inspection is performed by the inspection section 16.

The electronic component transfer device and the electronic component inspection device of the present invention have been described above with reference to the illustrated embodiment. However, the present invention is not limited to this. Each part constituting the electronic component transfer device and the electronic component inspection device can perform the same function. Arbitrary constituent replacement. Moreover, you may add arbitrary structures.

The electronic component transfer device and the electronic component inspection device of the present invention may be combined with any two or more configurations (features) in each of the embodiments described above.

In addition, the present invention may be one in which the driving section moves the mounting section (directly) or indirectly driving the mechanism section, and it also includes a configuration in which a driving section for driving the mechanism section is omitted, as long as the driving section is omitted. Arbitrary composition.

Further, in the first embodiment or the second embodiment, the first contact portion and the second contact portion are configured to be in an open state when an external force is applied to the first position and to be released when the external force is released in the second position. It is closed, but it is not limited to this. For example, the first contact portion and the second contact portion may be configured to be in an open state when no external force is applied to the first position and to be closed when an external force is applied to the second position.

1‧‧‧Electronic parts inspection device

3A‧‧‧Positioning unit

3B‧‧‧ Positioning Unit

3C‧‧‧ Positioning Unit

3D‧‧‧ positioning unit

4‧‧‧ the first abutment

5‧‧‧The second abutment

6‧‧‧ Agency Department

7‧‧‧ positioning unit

10‧‧‧Electronic parts transfer device

11A‧‧‧Tray transfer mechanism

11B‧‧‧Tray transfer mechanism

12‧‧‧Temperature Adjustment Department

13‧‧‧ device transfer head

14‧‧‧Device Supply Department

14A‧‧‧Device Supply Department

14B‧‧‧Device Supply Department

15‧‧‧pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ device transfer head

17A‧‧‧device transfer head

17B‧‧‧ Device Transfer Head

18‧‧‧Device Recycling Department

18A‧‧‧Device Recycling Department

18B‧‧‧Device Recycling Department

19‧‧‧Recycling tray

20‧‧‧ device transfer head

21‧‧‧Tray transfer mechanism

22A‧‧‧Tray transfer mechanism

22B‧‧‧Tray transfer mechanism

25‧‧‧Transportation Department

26‧‧‧Driver

27‧‧‧ Force transmission unit

28‧‧‧ Force giving department

29‧‧‧ placement section

31‧‧‧ Clearance

41‧‧‧The first abutment point

41X‧‧‧The first abutment point

41Y‧‧‧The first abutment point

42‧‧‧ cam groove

43‧‧‧ opening

44‧‧‧ cam follower

45‧‧‧ cam groove

46‧‧‧Section 1

47‧‧‧ leaf spring

51‧‧‧The second abutment point

51X‧‧‧The second contact point

51Y‧‧‧The second contact point

52‧‧‧slot

60‧‧‧Driver

61‧‧‧Compression member

62‧‧‧Bomb Pusher

63‧‧‧Restricted Department

64‧‧‧ 2nd connecting rod

65‧‧‧Swivel support department

66‧‧‧Swivel connection

67‧‧‧Swivel support department

68‧‧‧ cam member

69‧‧‧ cam follower

71‧‧‧ positioning block

72‧‧‧ Locating Pin

90‧‧‧IC device

141‧‧‧concave

142‧‧‧mounting surface

143‧‧‧ recess forming member

144‧‧‧Swivel support department

145‧‧‧C ring

146‧‧‧Guide Pin

147‧‧‧component

148‧‧‧cam follower

171‧‧‧holding department

172‧‧‧ Peripheral Department

200‧‧‧tray

231‧‧‧The first next door

232‧‧‧Next door

233‧‧‧3 next door

234‧‧‧Next door 4

235‧‧‧5th Next Door

241‧‧‧Front cover

242‧‧‧ side cover

243‧‧‧side cover

244‧‧‧ Rear cover

245‧‧‧Top cover

271‧‧‧base

272‧‧‧ Cover

273‧‧‧Put

274‧‧‧Bomb Pusher

275‧‧‧slot

276‧‧‧ flange

281‧‧‧ protrusion

282‧‧‧Support Department

283‧‧‧foot

284‧‧‧Bridge Department

300‧‧‧ monitor

301‧‧‧display

400‧‧‧ signal light

500‧‧‧Speaker

600‧‧‧Mouse Station

601‧‧‧Actuator

611‧‧‧Pressed section

612‧‧‧cam

641‧‧‧ one end

642‧‧‧ the other end

681‧‧‧cam groove

682‧‧‧Cam surface

700‧‧‧ operation panel

800‧‧‧ Control Department

901‧‧‧ bolt

902‧‧‧ Bolt

903‧‧‧ Bolt

A1‧‧‧Tray supply area

A2‧‧‧Device supply area

A3‧‧‧ Inspection area

A4‧‧‧device recycling area

A5‧‧‧Tray removal area

LX1‧‧‧1st separation distance

LX2‧‧‧1st separation distance

LY1‧‧‧Second separation distance

LY2‧‧‧Second separation distance

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

α _11A ‧‧‧ Arrow

α _11B ‧‧‧ Arrow

α _13X ‧‧‧ Arrow

α _13Y ‧‧‧ Arrow

α ₁₄ ‧‧‧arrow

α ₁₅ ‧‧‧arrow

α _17Y ‧‧‧ Arrow

α ₁₈ ‧‧‧ arrow

α _20X ‧‧‧ Arrow

α _20Y ‧‧‧ Arrow

α ₂₁ ‧‧‧ Arrow

α _22A ‧‧‧ Arrow

α _22B ‧‧‧ Arrow

α ₉₀ ‧‧‧ arrow

FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection device of the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is a plan view of a device supply section provided in the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 4 is an enlarged view (open state) of the area [A] surrounded by a one-dot chain line in FIG. 3. FIG. 5 is an enlarged view (closed state) of the area [A] surrounded by a one-dot chain line in FIG. 3. Fig. 6 is a perspective view of a device supply section provided in the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 7 is an enlarged view (open state) of the area [B] surrounded by a one-dot chain line in FIG. 6. FIG. 8 is an enlarged view (closed state) of the area [B] surrounded by a one-dot chain line in FIG. 6. Fig. 9 is a plan view (open state) of a device supply section provided in the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 10 is a plan view (closed state) of a device supply section provided in the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 11 is a perspective view of a device transfer head in a device supply area included in the electronic component inspection apparatus (the fourth embodiment) of the present invention. FIG. 12 is a perspective view (closed state) obtained by enlarging a part of a device supply section included in the electronic component inspection apparatus (the fourth embodiment) of the present invention. FIG. 13 is a perspective view (open state) showing a state in which the device transfer head shown in FIG. 11 approaches the device supply section shown in FIG. 12. FIG. 14 is a perspective view (closed state) showing a state where the device transfer head shown in FIG. 11 is separated from the device supply section shown in FIG. 12.

Claims (7)

An electronic parts conveying device, comprising: a conveying section for conveying electronic parts; and a placing section having a placing surface on which the electronic parts are placed by the conveying section, and moving to the placing surface for placing the above The first position of the electronic component and the second position where the electronic component is removed from the mounting surface; the driving portion supports and moves the mounting portion; the first abutment portion is provided on the mounting surface, And has a first contact point that is in contact with the electronic component placed on the mounting surface; a second contact portion that is provided on the mounting surface and has the above-mentioned electrons that are placed on the mounting surface; A second abutment point for parts abutment; and a drive mechanism section provided on the mounting surface and connected to the first abutment so that the first abutment section and the second abutment section relatively move. And the distance between the first abutment point and the second abutment point is the first separation distance when the placement portion is located at the first position, which is longer than the case where the placement portion is located at the second position. The above first contact point and the above The distance between the second contact points is the second separation distance. For example, in the electronic component transporting device of claim 1, the drive mechanism is a mechanism unit that receives the force in association with the movement of the mounting portion, and makes the first abutting portion oppose the second abutting portion. mobile. For example, the electronic component transporting device of claim 2 includes a force imparting portion that applies the force to the mechanism portion when the placing portion is in the first position, and the mechanism portion has a pressure receiving portion, and the receiving portion The pressing portion is disposed on the placing portion and receives the force from the force applying portion. The electronic component conveying device according to claim 3, wherein the force imparting portion has a protruding portion, and the pressure receiving portion receives the force from the protruding portion. For example, the electronic component conveying device of claim 4, wherein the mechanism portion has a spring pushing portion, and the spring pushing portion is in a manner that the first contact point and the second contact point are close to each other and the separation distance becomes the second separation distance The first abutting portion or the second abutting portion is pushed and pushed, and when the pressure receiving portion receives the force from the protruding portion, the first abutment point is separated from the second abutment point and the separation distance becomes the first In the method of 1 separation distance, the first contact portion is moved. For example, the electronic component transfer device according to claim 5, wherein the mechanism section includes a restriction section that restricts the approach of the first contact point and the second contact point. An electronic parts inspection device, comprising: an inspection unit that inspects electrical characteristics of electronic parts; a transport unit that transports the electronic parts; and a placement unit that has a load on which the electronic parts are placed by the transport unit. The mounting surface is moved to a first position where the electronic component is placed on the mounting surface and a second position where the electronic component is removed from the mounting surface; a driving unit that supports and moves the mounting portion; The abutting portion is provided on the placement surface and has a first abutment point that abuts on the electronic component placed on the placement surface; the second abutment portion is provided on the placement surface, and A second contact point that is in contact with the electronic component placed on the mounting surface; and a driving mechanism portion that is provided on the mounting surface so that the first contact portion is in contact with the second contact The relative movement of the parts is connected to the first abutment part; and the distance between the first abutment point and the second abutment point is the first separation distance when the placing part is located at the first position, Longer than the mounting section In the case of the second position the distance between the first contact point and the second contact point that is separated from the second distance.