TW201827838A - Electronic component conveying device and electronic component inspection device comprising a first carrying member with a first recessed portion, a second carrying member with a second recessed portion, and a conveying portion - Google Patents

Electronic component conveying device and electronic component inspection device comprising a first carrying member with a first recessed portion, a second carrying member with a second recessed portion, and a conveying portion Download PDF

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Publication number
TW201827838A
TW201827838A TW107103047A TW107103047A TW201827838A TW 201827838 A TW201827838 A TW 201827838A TW 107103047 A TW107103047 A TW 107103047A TW 107103047 A TW107103047 A TW 107103047A TW 201827838 A TW201827838 A TW 201827838A
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Taiwan
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electronic component
recessed
mounting
inspection
interval
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TW107103047A
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Chinese (zh)
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高田冬生
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日商精工愛普生股份有限公司
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Priority to JP2017-013920 priority Critical
Priority to JP2017013920A priority patent/JP2018124072A/en
Priority to JP2017064548A priority patent/JP2018169187A/en
Priority to JP2017-064548 priority
Application filed by 日商精工愛普生股份有限公司 filed Critical 日商精工愛普生股份有限公司
Publication of TW201827838A publication Critical patent/TW201827838A/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices

Abstract

The present invention provides an electronic component conveying device and an electronic component inspection device which comprise a second carrying member that is manufactured without increasing processing accuracy. The electronic component conveying device 10 can be provided with a first carrying member with a first recessed portion for mounting the electronic component 90, and provided with a second carrying member which is provided with a second recessed portion for mounting the electronic component 90; and a conveying portion 25, which can convey the electronic component 90 from the first carrying member to the second carrying member; between a first space of the sidewall portion of the first recessed portion and the electronic component 90 when the electronic component 90 is carried by the first recessed portion, under the condition that the center of the first recessed portion and the center of the electronic component 90 overlap in top view, and a second space of the sidewall portion of the second recessed portion and the electronic component 90 when the electronic component 90 is carried by the second recessed portion, under the condition that the center of the second recessed portion and the center of the electronic component 90 overlap in top view, the second space is larger than the first space.

Description

電子零件搬送裝置及電子零件檢查裝置Electronic component transfer device and electronic component inspection device

本發明係關於電子零件搬送裝置及電子零件檢查裝置。The present invention relates to an electronic component transfer device and an electronic component inspection device.

已知一種矩陣狀配置且具有個別地收納複數個電子零件之腔室(凹部)之收納具。於各腔室內將電子零件定位。將處於該定位狀態之電子零件例如藉由機械臂等搬送機構自收納具提起並搬送。 又,自先前以來,已知有例如檢查IC器件等電子零件之電性特性之檢查裝置。此種檢查裝置構成為將電子零件自供給托盤供給至檢查部,進行被供給至檢查部之電子零件之電性特性之檢查,於該檢查結束後,將該電子零件自檢查部回收至回收托盤。或者,將收納於供給托盤之電子零件先轉移至梭,藉由梭將上述電子零件搬送至檢查部附近。於梭設有形成有凹槽之托盤,於該凹槽收納電子零件。 電子零件自供給托盤向梭之托盤之移動係藉由供給機器人執行,但因例如收納於供給托盤之電子零件之配置或供給機器人之控制不良等各種要因,而有電子零件未以正常狀態載置於托盤之凹槽、即以異常狀態(所謂「浮動」狀態)載置之情形。若將電子零件以異常狀態載置於凹槽,則將該電子零件搬送至檢查部時,會有無法由檢查用機器人(測定機器人)保持電子零件、或電子零件因與檢查用機器人之過度接觸而破損之虞。 因此,已知有例如使用載置電子零件之托盤定位裝置之機構(例如參照專利文獻2)。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開平11-198988號公報 [專利文獻2]日本專利特開2000-162272號公報There is known a storage device that is arranged in a matrix and has a cavity (recess) that individually stores a plurality of electronic components. Position electronic components in each chamber. The electronic components in the positioning state are lifted from the storage device by a transport mechanism such as a robot arm and transported. In addition, an inspection device for inspecting the electrical characteristics of electronic components such as IC devices has been known. Such an inspection device is configured to supply electronic parts from a supply tray to an inspection unit, and to inspect the electrical characteristics of the electronic parts supplied to the inspection unit. After the inspection is completed, the electronic parts are recovered from the inspection unit to a collection tray. . Alternatively, the electronic components stored in the supply tray are first transferred to a shuttle, and the electronic components are transferred to the vicinity of the inspection section by the shuttle. The shuttle is provided with a tray formed with a groove, and electronic components are stored in the groove. The movement of electronic parts from the supply tray to the shuttle tray is performed by the supply robot. However, due to various factors such as the arrangement of the electronic parts stored in the supply tray or the control of the supply robot, there are electronic components that are not placed in a normal state. It is placed in the groove of the tray, that is, in an abnormal state (so-called "floating" state). If the electronic component is placed in the groove in an abnormal state, the electronic component may not be held by the inspection robot (measurement robot) when the electronic component is transported to the inspection unit, or the electronic component may be in excessive contact with the inspection robot. The risk of breakage. Therefore, for example, a mechanism using a tray positioning device on which electronic components are placed is known (for example, refer to Patent Document 2). [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 11-198988 [Patent Literature 2] Japanese Patent Laid-Open No. 2000-162272

[發明所欲解決之問題] 然而,於專利文獻1記載之收納具中,需要定位各腔室內之電子零件,故必須盡可能縮小腔室之側壁部與電子零件之間隔(間隙)。該情形時,腔室之加工精度必然變高,因而導致收納具之製造成本(加工成本)亦增加。 又,於專利文獻2記載之檢查裝置中,有無法對載置於凹槽之每個電子零件進行定位之虞。 [解決問題之技術手段] 本發明係用以解決上述問題之至少一部分而完成者,可作為以下形態實現。 本發明之電子零件搬送裝置之特徵在於:可配置具有供載置電子零件之第1凹部之第1載置構件,且具有:第2載置構件,其具有供載置上述電子零件之第2凹部;及搬送部,其可將上述電子零件自上述第1載置構件搬送至上述第2載置構件;於上述第1凹部載置上述電子零件且俯視時上述第1凹部之中心與上述電子零件之中心重疊之情形之上述第1凹部之側壁部與上述電子零件之第1間隔、及於上述第2凹部載置上述電子零件且俯視時上述第2凹部之中心與上述電子零件之中心重疊之情形之上述第2凹部之側壁部與上述電子零件之第2間隔兩者間,以上述第2間隔大於上述第1間隔。 藉此,將電子零件自第1載置構件搬送至第2載置構件時,由於原先位在第1載置構件之第1凹部內之電子零件係被搬送至開口面積大於第1凹部之第2載置構件之第2凹部,故容易進入第2凹部。因此,藉由機械加工(例如切削加工或雷射加工等)對此種第2載置構件之第2凹部進行加工之情形時,可放寬地設定其加工精度而進行加工。藉此,可將第2載置零件盡可能以短交貨期製造、交貨,且,可盡可能地抑制第2載置構件之製造成本,獲得低價之第2載置構件。 本發明之電子零件搬送裝置中,較佳為具有可配置檢查上述電子零件之檢查部之檢查區域,及將上述電子零件自上述第2載置構件搬送至上述檢查部之檢查用搬送部。 藉此,檢查用搬送部可穩定地將電子零件載置於檢查部,藉此,可正確地進行以檢查部對電子零件之檢查。 本發明之電子零件搬送裝置中,較佳為具有對固持於上述檢查用搬送部之上述電子零件進行拍攝之攝像部。 藉此,基於攝像部之拍攝結果,可進行電子零件之位置修正(位置調整),藉此,能以可正確地進行利用檢查部對電子零件之檢查之方式,將電子零件載置於檢查部。 本發明之電子零件搬送裝置中,較佳為可基於上述攝像部之拍攝結果,於上述檢查部載置上述電子零件。 藉此,可進行電子零件之位置修正(位置調整),而將上述電子零件正確地載置於檢查部。 本發明之電子零件搬送裝置中,上述檢查部較佳為具有載置上述電子零件之檢查用凹部;上述第2間隔大於載置有上述電子零件之情形之上述檢查用凹部之側壁部與上述電子零件之間隔。 藉此,將電子零件自第2載置部搬送至檢查部時,在較第2載置構件之第2凹部更窄之檢查用凹部內將電子零件高精度地定位。藉由該定位,可使電子零件與檢查部電性接觸,藉此可正確地進行對電子零件之檢查。 本發明之電子零件搬送裝置中,上述第1間隔較佳為大於載置有上述電子零件之情形之上述檢查用凹部之側壁部與上述電子零件之間隔。 藉此,第1間隔、第2間隔及檢查用凹部之側壁部與電子零件之間隔中,檢查用凹部之側壁部與電子零件之間隔成為最小。藉此,將電子零件搬送至檢查部時,可於檢查用凹部內將電子零件高精度地定位。藉由該定位,可使電子零件與檢查部電性接觸,藉此可正確地進行對電子零件之檢查。 本發明之電子零件搬送裝置中,上述第2載置構件較佳為可移動至上述檢查區域。 藉此,可將電子零件穩定地搬送至檢查區域。 本發明之電子零件搬送裝置中,上述第2凹部之深度較佳為小於上述電子零件之厚度。 藉此,雖亦需視例如搬送部之構造而定,但搬送部與第2載置構件之第2凹部內之電子零件接近,在固持該電子零件時,可防止搬送部與第2載置構件之干擾。 本發明之電子零件搬送裝置中,較佳為上述第1載置構件係預先載置有上述電子零件之供給托盤,上述第2載置構件係可移動地被支持之供給梭。 藉此,第2載置構件可將自第1載置構件即供給托盤搬送而來之電子零件搬送至目的位置。 本發明之電子零件搬送裝置中,較佳為具備溫度調整部,其具有供載置上述電子零件之溫度調整用凹部,調整上述電子零件之溫度;上述第2間隔大於上述溫度調整用凹部中載置有上述電子零件之情形之上述溫度調整用凹部之側壁部與上述電子零件之間隔。 藉此,將電子零件自第1載置構件經由溫度調整部搬送至第2載置構件時,由於原先位在溫度調整部之溫度調整用凹部內之電子零件係被搬送至開口面積大於溫度調整用凹部之第2載置構件之第2凹部,故可容易進入第2凹部。 本發明之電子零件搬送裝置中,於上述溫度調整用凹部載置有上述電子零件之情形之上述溫度調整用凹部之側壁部與上述電子零件之間隔,較佳為大於上述第1間隔。 藉此,將電子零件自第1載置構件經由溫度調整部搬送至第2載置構件時,由於原先位在第1載置構件之第1凹部內之電子零件係被搬送至開口面積大於第1凹部之溫度調整部之溫度調整用凹部,故可容易進入溫度調整用凹部。因此,藉由機械加工(例如切削加工或雷射加工等)對此種溫度調整部之溫度調整用凹部進行加工之情形時,可放寬地設定其加工精度而進行加工。藉此,可將溫度調整部盡可能以短交貨期製造、交貨,且,可盡可能地抑制溫度調整部之製造成本,獲得低價之溫度調整部。 本發明之電子零件搬送裝置中,較佳為:可配置檢查載置於上述第2載置構件後之上述電子零件之檢查部;具有第3載置構件,其具有供載置經上述檢查部檢查之上述電子零件之第3凹部;配置第4載置構件,其具有供載置載置於上述第3載置構件後之上述電子零件之第4凹部;於上述第3凹部載置上述電子零件且俯視時上述第3凹部之中心與上述電子零件之中心重疊之情形之上述第3凹部之側壁部與上述電子零件之第3間隔、及於上述第4凹部載置上述電子零件且俯視時上述第4凹部之中心與上述電子零件之中心重疊之情形之上述第4凹部之側壁部與上述電子零件之第4間隔兩者間,以上述第4間隔大於上述第3間隔。 藉此,將電子零件自第3載置構件搬送至第4載置構件時,由於原先位在第3載置構件之第3凹部內之電子零件係被搬送至開口面積大於第3凹部之第4凹部,故可容易進入第4凹部。 本發明之電子零件搬送裝置中,較佳為上述第3載置構件係可移動地被支持之回收梭,上述第4載置構件係最終載置上述電子零件之回收托盤。 藉此,例如對電子零件進行電性檢查時,可根據其結果將電子零件分類、回收。 本發明之電子零件搬送裝置中,上述第2間隔與上述第1間隔之差較佳為大於上述第4間隔與上述第3間隔之差。 藉此,可將第1間隔與第4間隔設為相同大小,藉此可使用共通之載置構件作為第1載置構件、第4載置構件。 本發明之電子零件搬送裝置中,上述第2載置構件較佳為具備板狀之基部,及較上述基部更薄且具有開口之薄板部。 藉此,由於薄板部係較基部更薄者,故開口之加工變容易,藉此,可根據電子零件之種類準備多品種之薄板部。 本發明之電子零件搬送裝置中,上述第2載置構件較佳為具備進行上述基部與上述薄板部之定位之定位部。 藉此,可進行基部與薄板部之正確組裝。搬送部可順暢地進行裝置對第2凹部之載置(插入)。 本發明之電子零件搬送裝置中,上述薄板部較佳為可對上述基部裝卸。 藉此,可根據電子零件之種類準備複數個薄板部,而從該等之中適當選擇而使用、即安裝於基部。 本發明之電子零件搬送裝置之特徵在於:可配置具有供載置電子零件之第1凹部之第1載置構件,且具有:第2載置構件,其具有供載置上述電子零件之第2凹部;及搬送部,其可將上述電子零件自上述第1載置構件搬送至上述第2載置構件;自與俯視上述電子零件時之方向正交之方向觀察上述電子零件之情形之上述電子零件之長度,小於自與俯視上述第1載置構件時之方向正交之方向觀察上述第1載置構件之情形之上述第1凹部之長度;自與俯視上述第1載置構件之方向正交之方向觀察上述第1載置構件之情形之上述第1凹部之長度,小於自與俯視上述第2載置構件時之方向正交之方向觀察上述第2載置構件之情形之上述第2凹部之長度。 藉此,將電子零件自第1載置構件搬送至第2載置構件時,由於原先位在第1載置構件之第1凹部內之電子零件係被搬送至開口面積大於第1凹部之第2載置構件之第2凹部,故可容易進入第2凹部。因此,藉由機械加工(例如切削加工或雷射加工等)對此種第2載置構件之第2凹部進行加工之情形時,可放寬地設定其加工精度而進行加工。藉此,可將第2載置零件盡可能以短交貨期製造、交貨,又,可盡可能地抑制第2載置構件之製造成本,獲得低價之第2載置構件。 本發明之電子零件檢查裝置之特徵在於:可配置具有載置電子零件之第1凹部之第1載置構件,且具有:第2載置構件,其具有供載置上述電子零件之第2凹部;搬送部,其可將上述電子零件自上述第1載置構件搬送至上述第2載置構件;及可檢查上述電子零件之檢查部;於上述第1凹部載置上述電子零件且俯視時上述第1凹部之中心與上述電子零件之中心重疊之情形之上述第1凹部之側壁部與上述電子零件之第1間隔、及於上述第2凹部載置上述電子零件且俯視時上述第2凹部之中心與上述電子零件之中心重疊之情形之上述第2凹部之側壁部與上述電子零件之第2間隔兩者間,以上述第2間隔大於上述第1間隔。 藉此,將電子零件自第1載置構件搬送至第2載置構件時,由於原先位在第1載置構件之第1凹部內之電子零件被搬送至開口面積大於第1凹部之第2載置構件之第2凹部,故可容易進入第2凹部。因此,藉由機械加工(例如切削加工或雷射加工等)對此種第2載置構件之第2凹部進行加工之情形時,可放寬地設定其加工精度而進行加工。藉此,可將第2載置構件盡可能以短交貨期製造、交貨,且,可盡可能地抑制第2載置構件之製造成本,獲得低價之第2載置構件。 又,可將電子零件搬送至檢查部,藉此,能以檢查部進行對該電子零件之檢查。又,可自檢查部搬送檢查後之電子零件。 本發明之電子零件搬送裝置之特徵在於:具備可載置電子零件之載置面,具有可搬送上述電子零件之載置部,上述載置面之法線方向與重力方向不同。 藉此,可使載置電子零件之載置部相對於重力方向傾斜。藉此,載置於載置面之電子零件以相對於重力方向且循著傾斜方向之方式移動。其結果,可對載置面定位電子零件。 本發明之電子零件搬送裝置中,上述載置面之法線方向較佳為具有搬送上述電子零件之方向之成分及重力方向之成分。 藉此,載置部移動時可將作用於電子零件之慣性力使用於電子零件之移動。 本發明之電子零件搬送裝置中,較佳為具有設有上述載置部之基底構件,上述載置部可載置上述電子零件而相對於上述基底構件傾斜動作。 藉此,可容易使載置部傾斜。 本發明之電子零件搬送裝置中,上述載置部較佳為藉由施加高於大氣壓之壓力之氣體而旋動。 藉此,可容易使載置部旋動。 本發明之電子零件搬送裝置中,上述載置部較佳為具有旋動軸,且以上述旋動軸為中心相對於上述基底構件可旋動地設置。 藉此,由於以旋動軸為中心旋動,故可進而提高載置部之角度設定精度。 本發明之電子零件搬送裝置中,上述基底構件較佳為具有複數個上述載置部,於複數個上述載置部各自載置一個上述電子零件。 藉此,可對載置於載置部之每個電子零件進行定位。 本發明之電子零件搬送裝置中,較佳為具有可供上述電子零件抵接之抵接部,上述載置部可載置上述電子零件而對上述抵接部相對移動,於上述載置面配置有上述電子零件時,上述載置部可接近上述抵接部。 藉此,可於電子零件之移動方向具備抵接部。藉此,能以抵接部阻止電子零件之移動。 本發明之電子零件搬送裝置中,較佳為具有可將上述載置部對上述抵接部相對移動地支持之引導部。 藉此,可容易使載置部移動。 本發明之電子零件搬送裝置之特徵在於具有:可供電子零件抵接之抵接部,及載置部,其具備可載置上述電子零件而對上述抵接部相對移動之載置面,並可搬送上述電子零件;於上述載置面配置有上述電子零件時,上述載置部可接近上述抵接部。 藉此,可使載置電子零件之載置部相對於抵接部移動。藉此,可使載置於載置面之電子零件接近抵接部。其結果,可對載置面定位電子零件。 本發明之電子零件搬送裝置中,較佳為具有設有上述載置部之基底構件,且上述載置部可載置上述電子零件而相對於上述基底構件傾斜動作。 藉此,可使載置部容易傾斜。 本發明之電子零件搬送裝置之特徵在於具有:載置部,其具備可載置電子零件之載置面,並可搬送上述電子零件;及檢查上述電子零件之檢查部;上述載置面之法線方向與重力方向不同。 藉此,可使載置電子零件之載置面相對於重力方向傾斜。藉此,載置於載置面之電子零件以相對於重力方向且循著傾斜方向之方式移動。其結果,可對載置面定位電子零件。[Problems to be Solved by the Invention] However, in the storage device described in Patent Document 1, it is necessary to position the electronic components in each chamber, so the space (gap) between the side wall portion of the chamber and the electronic components must be as small as possible. In this case, the processing accuracy of the cavity is necessarily high, and as a result, the manufacturing cost (processing cost) of the storage container also increases. In addition, the inspection device described in Patent Document 2 may fail to position each electronic component placed in the groove. [Technical means for solving the problem] The present invention has been completed to solve at least a part of the problems described above, and can be implemented in the following forms. The electronic component transporting device of the present invention is characterized in that a first mounting member having a first recessed portion for mounting electronic components can be arranged, and a second mounting member having a second mounting member for mounting the electronic components, A recessed portion; and a transporting portion that can transport the electronic component from the first mounting member to the second mounting member; and when the electronic component is mounted on the first recessed portion and the center of the first recessed portion and the electron are viewed in plan view When the center of the parts overlaps, the side wall portion of the first recessed portion and the first interval of the electronic component, and when the electronic component is placed on the second recessed portion and the center of the second recessed portion overlaps with the center of the electronic component in a plan view In this case, between the side wall portion of the second recessed portion and the second interval of the electronic component, the second interval is larger than the first interval. As a result, when the electronic component is transferred from the first mounting member to the second mounting member, the electronic component originally located in the first recessed portion of the first mounting member is transported to the first opening portion larger than the first recessed portion. Since the second recessed portion of the 2 placing member is easily accessible to the second recessed portion. Therefore, when machining the second recessed portion of the second mounting member by machining (such as cutting or laser machining), the machining accuracy can be set with a wide range of machining. Thereby, the second placement component can be manufactured and delivered with a short lead time as much as possible, and the manufacturing cost of the second placement component can be suppressed as much as possible, and the second placement component having a low price can be obtained. The electronic component transfer device of the present invention preferably includes an inspection area in which an inspection section for inspecting the electronic component can be arranged, and an inspection transport section for transporting the electronic component from the second mounting member to the inspection section. Thereby, the inspection conveyance part can stably mount an electronic component in an inspection part, and by this, an inspection of an electronic part by an inspection part can be performed correctly. In the electronic component conveying device of the present invention, it is preferable that the electronic component conveying device includes an imaging section that images the electronic component held by the inspection conveying section. Thereby, the position of the electronic component can be corrected (position adjusted) based on the photographing result of the imaging unit, and the electronic component can be placed in the inspection unit in such a manner that the inspection of the electronic part by the inspection unit can be accurately performed. . In the electronic component conveying device of the present invention, it is preferable that the electronic component can be placed on the inspection section based on a photographing result of the imaging section. This makes it possible to correct the position of the electronic component (position adjustment), and to correctly place the electronic component in the inspection section. In the electronic component conveying device of the present invention, it is preferable that the inspection section includes a recess for inspection on which the electronic component is placed; and the second interval is larger than a side wall portion of the inspection recess on the case where the electronic component is mounted on the inspection section. Spacing of parts. Accordingly, when the electronic component is transferred from the second mounting portion to the inspection portion, the electronic component is positioned with high accuracy in the inspection recess portion which is narrower than the second recess portion of the second mounting member. By this positioning, the electronic parts can be brought into electrical contact with the inspection section, and thus the inspection of the electronic parts can be performed accurately. In the electronic component conveying device of the present invention, the first interval is preferably larger than a distance between a side wall portion of the inspection recessed portion and the electronic component when the electronic component is placed. Accordingly, among the first interval, the second interval, and the interval between the side wall portion of the inspection recessed portion and the electronic component, the interval between the side wall portion of the inspection recessed portion and the electronic component is minimized. Thereby, when an electronic component is conveyed to an inspection part, an electronic component can be positioned with high precision in the inspection recessed part. By this positioning, the electronic parts can be brought into electrical contact with the inspection section, and thus the inspection of the electronic parts can be performed accurately. In the electronic component transfer device of the present invention, it is preferable that the second placing member is movable to the inspection area. Thereby, the electronic component can be stably transported to the inspection area. In the electronic component transporting device of the present invention, the depth of the second recessed portion is preferably smaller than the thickness of the electronic component. Thereby, although it also depends on the structure of the conveying part, for example, the conveying part is close to the electronic part in the second recess of the second placing member, and the conveying part and the second placing can be prevented when the electronic part is held. Component interference. In the electronic parts conveying device of the present invention, it is preferable that the first placing member is a supply tray on which the electronic parts are placed in advance, and the second placing member is a supply shuttle that is movably supported. Thereby, the 2nd mounting member can transfer the electronic component transferred from the supply tray which is a 1st mounting member to a destination position. In the electronic component conveying device of the present invention, it is preferable to include a temperature adjustment section having a temperature adjustment recess for mounting the electronic component and adjusting the temperature of the electronic component; the second interval is larger than the temperature adjustment recess for loading In a case where the electronic component is provided, a distance between a side wall portion of the temperature adjustment recessed portion and the electronic component. As a result, when electronic components are transferred from the first mounting member to the second mounting member through the temperature adjustment section, the electronic components originally located in the temperature adjustment recess of the temperature adjustment section are transported to the opening area larger than the temperature adjustment. Since the second recessed portion of the second mounting member is used, the second recessed portion can be easily accessed. In the electronic component transporting device of the present invention, the interval between the side wall portion of the temperature adjustment recessed portion and the electronic component when the electronic component is placed in the temperature adjustment recessed portion is preferably larger than the first interval. As a result, when the electronic component is transferred from the first mounting member to the second mounting member via the temperature adjustment unit, the electronic component originally located in the first recess of the first mounting member is transferred to an opening area larger than that of the first mounting member. 1 The temperature adjustment recessed portion of the temperature adjustment portion of the recessed portion can be easily entered into the temperature adjustment recessed portion. Therefore, when machining the temperature-adjusting recessed portion of such a temperature-adjusting portion by machining (for example, cutting or laser processing), the machining accuracy can be set by setting the machining accuracy. Thereby, the temperature adjustment part can be manufactured and delivered with a short lead time as much as possible, and the manufacturing cost of the temperature adjustment part can be suppressed as much as possible, and a low-temperature temperature adjustment part can be obtained. In the electronic component conveying device of the present invention, it is preferable that an inspection section for inspecting the electronic component placed on the second placement member can be arranged; and a third placement member having a section for placing the inspection section on the inspection section. The third recessed part of the above-mentioned electronic component; a fourth mounting member is disposed, which has a fourth recessed portion for mounting the electronic component placed on the third mounting member; and the electronic component is mounted on the third recessed portion When the center of the third recessed part overlaps with the center of the electronic part when viewed from above, the third interval between the side wall portion of the third recessed part and the electronic part, and when the electronic part is placed on the fourth recessed part and viewed from above When the center of the fourth recessed portion overlaps the center of the electronic component, the fourth interval is larger than the third interval between the sidewall portion of the fourth recessed portion and the fourth interval of the electronic component. As a result, when the electronic component is transferred from the third mounting member to the fourth mounting member, the electronic component originally located in the third recessed portion of the third mounting member is transported to the first opening area larger than the third recessed portion. 4 recesses, so you can easily enter the 4th recess. In the electronic component conveying device of the present invention, it is preferable that the third placing member is a collection shuttle movably supported, and the fourth placing member is a collection tray on which the electronic components are finally placed. This makes it possible, for example, to classify and recycle electronic parts based on the results when performing electrical inspections on the electronic parts. In the electronic component transporting device of the present invention, the difference between the second interval and the first interval is preferably larger than the difference between the fourth interval and the third interval. Thereby, the first interval and the fourth interval can be made the same size, and thus a common placing member can be used as the first placing member and the fourth placing member. In the electronic component conveying device of the present invention, the second placing member preferably includes a plate-shaped base portion and a thin plate portion that is thinner than the base portion and has an opening. Thereby, since the thin plate portion is thinner than the base portion, the processing of the opening becomes easy, and thus, various types of thin plate portions can be prepared according to the type of the electronic component. In the electronic component transfer device of the present invention, it is preferable that the second placing member includes a positioning portion that performs positioning of the base portion and the thin plate portion. Thereby, the base portion and the thin plate portion can be correctly assembled. The conveying section can smoothly carry out the device's placement (insertion) of the second recessed section. In the electronic component conveying device of the present invention, the thin plate portion is preferably attachable to and detachable from the base portion. Thereby, a plurality of thin plate portions can be prepared according to the type of the electronic component, and the thin plate portions can be appropriately selected for use, that is, mounted on the base portion. The electronic component transporting device of the present invention is characterized in that a first mounting member having a first recessed portion for mounting electronic components can be arranged, and a second mounting member having a second mounting member for mounting the electronic components, A concave portion; and a conveying portion that can move the electronic component from the first placing member to the second placing member; and the electronic device in which the electronic device is viewed from a direction orthogonal to a direction when the electronic device is viewed from above. The length of the part is shorter than the length of the first recess when the first mounting member is viewed from a direction orthogonal to the direction when the first mounting member is viewed from above; The length of the first recessed portion in the case where the first mounting member is viewed from the intersection direction is shorter than the second portion in the case where the second mounting member is viewed from a direction orthogonal to the direction when the second mounting member is viewed in plan view. The length of the recess. As a result, when the electronic component is transferred from the first mounting member to the second mounting member, the electronic component originally located in the first recessed portion of the first mounting member is transported to the first opening portion larger than the first recessed portion. Since the second recessed part of the 2 placing member can be easily entered into the second recessed part. Therefore, when machining the second recessed portion of the second mounting member by machining (such as cutting or laser machining), the machining accuracy can be set with a wide range of machining. Thereby, the second mounting member can be manufactured and delivered with a short lead time as much as possible, and the manufacturing cost of the second mounting member can be suppressed as much as possible, and the second mounting member having a low price can be obtained. The electronic component inspection device of the present invention is characterized in that a first mounting member having a first recessed portion on which an electronic component is mounted can be arranged, and a second mounting member having a second recessed portion on which the electronic component is mounted. A transporting unit that can transport the electronic component from the first mounting member to the second mounting member; and an inspection unit that can inspect the electronic component; the electronic component is mounted on the first recessed portion and the above is viewed from above When the center of the first recessed portion overlaps with the center of the electronic component, a first interval between the side wall portion of the first recessed portion and the electronic component, and a position of the second recessed portion when the electronic component is placed on the second recessed portion and viewed from above. In a case where the center and the center of the electronic component overlap with each other, the side wall portion of the second recessed portion and the second interval of the electronic component are larger than the first interval by the second interval. As a result, when the electronic component is transferred from the first mounting member to the second mounting member, the electronic component originally located in the first recessed portion of the first mounting member is transferred to the second opening area larger than the first recessed portion. Since the second recessed portion of the mounting member can be easily entered into the second recessed portion. Therefore, when machining the second recessed portion of the second mounting member by machining (such as cutting or laser machining), the machining accuracy can be set with a wide range of machining. Thereby, the second mounting member can be manufactured and delivered with a short lead time as much as possible, and the manufacturing cost of the second mounting member can be suppressed as much as possible, and the second mounting member having a low price can be obtained. In addition, the electronic component can be transported to the inspection unit, whereby the inspection of the electronic component can be performed by the inspection unit. In addition, electronic parts after inspection can be transported from the inspection section. The electronic component transfer device of the present invention is characterized by having a mounting surface on which electronic components can be mounted, and a mounting portion on which the electronic components can be transferred, and the normal direction of the mounting surface is different from the direction of gravity. Thereby, the mounting portion on which the electronic components are mounted can be inclined with respect to the direction of gravity. Thereby, the electronic component mounted on the mounting surface is moved relative to the direction of gravity and in an oblique direction. As a result, the electronic component can be positioned on the mounting surface. In the electronic component transfer device of the present invention, the normal direction of the mounting surface is preferably a component having a direction in which the electronic component is transferred and a component in a direction of gravity. This allows the inertial force acting on the electronic component to be used for the movement of the electronic component when the mounting portion is moved. In the electronic component conveying device of the present invention, it is preferable that the electronic device has a base member provided with the mounting portion, and the mounting portion can mount the electronic component and perform an inclined operation with respect to the base member. This makes it easy to incline the mounting portion. In the electronic component transfer device of the present invention, it is preferable that the mounting portion is rotated by applying a gas pressure higher than atmospheric pressure. Thereby, the mounting portion can be easily rotated. In the electronic component conveying device of the present invention, it is preferable that the mounting portion has a rotation shaft and is rotatably provided with respect to the base member with the rotation shaft as a center. This makes it possible to further increase the accuracy of setting the angle of the mounting portion because the rotation is performed around the rotation axis. In the electronic component transfer device of the present invention, the base member preferably has a plurality of the mounting portions, and each of the plurality of the mounting portions mounts one of the electronic components. Thereby, each electronic component mounted on the mounting portion can be positioned. In the electronic component transporting device of the present invention, it is preferable that the electronic component has a contact portion capable of abutting the electronic component. The mounting portion can mount the electronic component and relatively move the contact portion, and is arranged on the mounting surface. When the electronic component is provided, the placing portion may be close to the abutting portion. Thereby, a contact part can be provided in the moving direction of an electronic component. Thereby, the movement of the electronic component can be prevented by the abutting portion. In the electronic component conveying device of the present invention, it is preferable that the electronic component conveying device includes a guide portion capable of supporting the mounting portion and the abutting portion in a relatively movable manner. This makes it easy to move the mounting portion. The electronic component transporting device of the present invention is characterized by having a contact portion for contacting the electronic components, and a mounting portion, which is provided with a mounting surface on which the electronic components can be mounted to relatively move the contact portion, and The electronic component can be transported. When the electronic component is arranged on the mounting surface, the mounting portion can approach the abutting portion. Thereby, the mounting portion on which the electronic components are mounted can be moved relative to the abutting portion. Thereby, the electronic component mounted on the mounting surface can be brought close to the abutting portion. As a result, the electronic component can be positioned on the mounting surface. In the electronic component conveying device of the present invention, it is preferable that the electronic device has a base member provided with the mounting portion, and the mounting portion can mount the electronic component and perform an inclined operation with respect to the base member. This makes it easy to incline the mounting portion. The electronic component transfer device of the present invention is characterized by having a mounting section having a mounting surface on which electronic components can be mounted, and capable of transporting the electronic components described above; and an inspection section for inspecting the electronic components; The direction of the line is different from the direction of gravity. Thereby, the mounting surface on which the electronic components are mounted can be inclined with respect to the direction of gravity. Thereby, the electronic component mounted on the mounting surface is moved relative to the direction of gravity and in an oblique direction. As a result, the electronic component can be positioned on the mounting surface.

以下,基於隨附圖式所示之較佳實施形態,詳細說明本發明之電子零件搬送裝置及電子零件檢查裝置。 <第1實施形態> 以下,參照圖1~圖14,針對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明。另,以下為了便於說明,如圖1所示,將相互正交之3軸設為X軸、Y軸及Z軸。又,包含X軸與Y軸之XY平面為水平,Z軸為垂直。又,將平行於X軸之方向亦稱為「X方向(第1方向)」,將平行於Y軸之方向亦稱為「Y方向(第2方向)」,亦將平行於Z軸之方向稱為「Z方向(第3方向)」。又,將各方向之箭頭朝向之方向稱為「正」,將其相反方向稱為「負」。又,於本案說明書言及之「水平」並非限定於完全水平,只要不阻礙電子零件之搬送,則亦包含相對於水平略微(例如未達5°左右)傾斜之狀態。又,有將圖1及圖3~圖8中(對於圖13、圖14及圖16~圖18亦同)之上側即Z方向正側稱為「上」或「上方」,將下側即Z方向負側稱為「下」或「下方」之情形。 本實施形態之電子零件搬送裝置10係具有圖1所示之外觀者。本實施形態之電子零件搬送裝置10為處理機,如圖2所示,可配置具有供載置電子零件之凹部(第1凹部)201之托盤(第1載置構件)200A,且具有:器件供給部(第2載置構件)14,其具有供載置電子零件之凹部(第2凹部)141;及器件搬送頭13(搬送部25),其可將電子零件自托盤(第1載置構件)200A搬送至器件供給部(第2載置構件)14;於凹部(第1凹部)201載置電子零件且俯視時凹部(第1凹部)201之中心與電子零件之中心重疊之情形之凹部(第1凹部)201之側壁部203與電子零件之間隙(第1間隙)GP200A ,及於凹部(第2凹部)141載置電子零件且俯視時凹部(第2凹部)141之中心與電子零件之中心重疊之情形之凹部(第2凹部)141之側壁部143與電子零件之間隙(第2間隔)GP14 兩者間,間隙(第2間隔)GP14 大於間隙(第1間隔)GP200A 。 藉此,如後述,將電子零件自托盤200A搬送至器件供給部14時,在托盤200A之凹部201內之電子零件係被搬送至開口面積大於凹部201之器件供給部14之凹部141,故可容易進入凹部141。因此,藉由機械加工(例如切削加工或雷射加工等)對此種器件供給部14之凹部141進行加工之情形時,可放寬設定其加工精度設定而進行加工。藉此,可將器件供給部14盡可能以短交貨期製造、交貨,且,可盡可能地抑制器件供給部14之製造成本,獲得低價之器件供給部14。 又,如圖3及圖5所示,本實施形態之電子零件搬送裝置10中,自與俯視電子零件之方向正交之方向觀察電子零件之情形之電子零件之長度,小於自與俯視托盤200A之方向正交之方向觀察托盤200A之情形之凹部201之長度,且自與俯視托盤200A之方向正交之方向觀察托盤200A之情形之凹部201之長度,小於自與俯視器件供給部14之方向正交之方向觀察器件供給部14之情形之凹部141之長度。 藉此,可獲得具上述優點之電子零件搬送裝置10。另,電子零件(IC器件90)之長度在圖3中之左右方向(X方向)、紙面前後方向(Y方向)之任一方向皆為相同。凹部201之長度在圖3中之左右方向(X方向)、紙面前後方向(Y方向)之任一方向皆為相同。凹部141之長度在圖5中之左右方向(X方向)、紙面前後方向(Y方向)之任一方向皆為相同。 又,如圖2所示,本實施形態之電子零件檢查裝置1具有電子零件搬送裝置10,進而具有檢查電子零件之檢查部16。即,本實施形態之電子零件檢查裝置1可配置具有供載置電子零件之凹部(第1凹部)201之托盤(第1載置構件)200A,且具有:器件供給部(第2載置構件)14,其具有供載置電子零件之凹部(第2凹部)141;器件搬送頭13(搬送部25),其可將電子零件自托盤(第1載置構件)200A搬送至器件供給部(第2載置構件)14;及可檢查電子零件之檢查部16,於凹部(第1凹部)201載置電子零件且俯視時凹部(第1凹部)201之中心與電子零件之中心重疊之情形之凹部(第1凹部)201之側壁部203與電子零件之間隙(第1間隙)GP200A ,及於凹部(第2凹部)141載置電子零件且俯視時凹部(第2凹部)141之中心與電子零件之中心重疊之情形之凹部(第2凹部)141之側壁部143與電子零件之間隙(第2間隔)GP14 兩者間,間隙(第2間隔)GP14 大於間隙(第1間隔)GP200A 。 藉此,可獲得具上述電子零件搬送裝置10之優點之電子零件檢查裝置1。又,可將電子零件搬送至檢查部16,藉此,能夠以檢查部16進行對該電子零件之檢查。又,可自檢查部16搬送檢查後之電子零件。 以下,對於各部之構成詳細說明。 如圖1及圖2所示,具備電子零件搬送裝置10之電子零件檢查裝置1為如下裝置:搬送例如BGA(Ball Grid Array:球狀柵格陣列)封裝即IC器件等之電子零件,於其搬送過程中檢查/試驗(以下簡稱為「檢查」)電子零件之電性特性。另,以下為了便於說明,針對使用IC器件作為上述電子零件之情形為代表進行說明,且將該IC器件設為「IC器件90」。如圖3~圖8所示,本實施形態中,IC器件90具有平板狀之器件本體901,及自器件本體901之下表面突出形成之複數個端子909。器件本體901係例如於俯視時呈正方形者,於內部內置有電性電路(未圖示)。本實施形態中,作為一例,針對器件本體901之俯視時之形狀為正方形之情形進行說明。又,各端子909與上述之電性電路電性連接。 另,作為IC器件,除上述者以外,列舉例如「LSI(Large Scale Integration:大型積體電路)」、「CMOS(Complementary Metal Oxide Semiconductor:互補金屬氧化物半導體)」、「CCD(Charge Coupled Device:電荷耦合裝置)」,或將複數個IC器件模組封裝化而成之「模組IC」、或「水晶器件」、「壓力感測器」、「慣性感測器(加速度感測器)」、「陀螺感測器」、以及「指紋感測器」等。 電子零件檢查裝置1(電子零件搬送裝置10)具備:托盤供給區域A1、器件供給區域A2、檢查區域A3、器件回收區域A4、及托盤去除區域A5,該等區域如後述,以各壁部分隔。且,IC器件90於箭頭方向α90 方向依序經由托盤供給區域A1至托盤去除區域A5之各區域,於中途之檢查區域A3進行檢查。如此,電子零件檢查裝置1具備:電子零件搬送裝置10,其具有以經由各區域之方式搬送IC器件90之搬送部25;於檢查區域A3內進行檢查之檢查部16;及控制部800。又,此外,電子零件檢查裝置1具備監視器300、信號燈400、及操作面板700。 另,電子零件檢查裝置1之配置有托盤供給區域A1及托盤去除區域A5之側、即圖2中之下側為正面側,配置有檢查區域A3之側、即圖2中之上側作為背面側使用。 又,電子零件檢查裝置1係預先搭載並使用按照IC器件90之每個種類進行更換之稱為「更換治具」者。該更換治具中具有供載置IC器件90之載置構件,該載置構件中包含後述之溫度調整部12、器件供給部14、及器件回收部18。又,於載置IC器件90之載置構件中,在如上述之更換治具之外,另具有由使用者準備之托盤200、回收用托盤19及檢查部16。 托盤供給區域A1係供給托盤200之供材部。托盤供給區域A1亦可稱為可堆疊複數個托盤200而搭載之搭載區域。 該托盤200係具有預先載置未檢查狀態之IC器件(電子零件)90之複數個凹部(第1凹部)201之第1載置構件。以下,有時將該托盤200稱為「托盤(供給托盤)200A」。 又,複數個凹部201係矩陣狀配置。如圖3(對於圖8亦同)所示,各凹部201具有底部202、及自底部202立設之側壁部203。本實施形態中,各凹部201之開口形狀(俯視時之形狀)與器件本體901之俯視時之形狀成大致相似之形狀(正方形)。側壁部203呈相對於底部202傾斜之錐狀。且,可於各凹部201逐個收納及載置IC器件90。 於器件供給區域A2配置自托盤供給區域A1搬送而來之托盤200(托盤200A)。托盤200上之複數個IC器件90被搬送、供給至檢查區域A3。另,以跨越托盤供給區域A1與器件供給區域A2之方式,設有將托盤200逐個於水平方向搬送之托盤搬送機構11A、11B。托盤搬送機構11A係搬送部25之一部分,可使托盤200連同載置於該托盤200之IC器件90於Y方向正側、即圖2中之箭頭α11A 方向移動。藉此,可將IC器件90穩定地送入器件供給區域A2。又,托盤供給機構11B係可使空的托盤200於Y方向之負側、即圖2中之箭頭α11B 方向移動之移動部。藉此,可使空的托盤200自器件供給區域A2移動至托盤供給區域A1。 於器件供給區域A2,設有溫度調整部(持溫板(英文記述:soak plate,中文記述(一例):均溫板))12、器件搬送頭13、托盤搬送機構15。又,亦設有以跨越器件供給區域A2與檢查區域A3之方式移動之器件供給部14。 溫度調整部12係具有供載置IC器件(電子零件)90之複數個凹部(溫度調整用凹部)121之載置構件,稱為可將IC器件90一併加熱或冷卻之「持溫板」。可藉由該持溫板,將由檢查部16檢查前之IC器件90預先加熱或冷卻,調整至適於檢查(高溫檢查或低溫檢查)之溫度。 又,複數個凹部121係矩陣狀配置。如圖4所示,各凹部121具有底部122、及自底部122立設之側壁部123。本實施形態中,各凹部121之開口形狀(俯視時之形狀)與器件本體901之俯視時之形狀成大致相似之形狀(正方形)。側壁部123呈相對於底部122傾斜之錐狀,可於各凹部121逐個收納及載置IC器件90。 圖2所示之構成中,溫度調整部12於Y方向配置、固定有2個。且,由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90係被搬送至任一溫度調整部12。另,藉由將作為該載置構件之溫度調整部12固定,可對該溫度調整部12上之IC器件90穩定地調整溫度。又,溫度調整部12接地(Grounding)。 器件搬送頭13係固持IC器件90之固持部,於器件供給區域A2內於X方向及Y方向可移動地被支持,進而亦於Z方向可移動地被支持。該器件搬送頭13亦為搬送部25之一部分,負責自托盤供給區域A1搬入之托盤200與溫度調整部12之間的IC器件90之搬送,及溫度調整部12與後述之器件供給部14之間的IC器件90之搬送。又,省略溫度調整部12對IC器件90之溫度調整之情形時,器件搬送頭13可負責自托盤供給區域A1搬入之托盤200與器件供給部14之間的IC器件90之搬送。另,圖2中,以箭頭α13X 表示器件搬送頭13之X方向之移動,以箭頭α13Y 表示器件搬送頭13之Y方向之移動。 如圖3~圖5所示,器件搬送頭13具有向下方開口且產生吸引力之吸引口131。器件搬送頭13可利用吸引口131之吸引力固持IC器件90。又,器件搬送頭13可藉由解除吸引口131之吸引力而釋放IC器件90。 如上述,第1載置構件即托盤200A係預先載置有IC器件(電子零件)90之供給托盤。器件供給部14係具有供載置自第1載置構件被搬送且經溫度調整部12溫度調整之IC器件(電子零件)90之複數個凹部(第2凹部)141之第2載置構件。該第2載置構件即器件供給部14係可移動地被支持,可將IC器件90搬送至檢查部16附近之稱為「供給用梭板」或簡稱為「供給梭」者。該器件供給部14亦可為搬送部25之一部分。 另,如上述,自托盤(第1載置構件)200A經由溫度調整部12,或省略經由溫度調整部12之IC器件(電子零件)90而向器件供給部(第2載置構件)14之搬送,係藉由器件搬送頭13(搬送部25)進行。 又,複數個凹部141係矩陣狀配置。如圖5所示,各凹部141具有底部142、及自底部142立設之側壁部143。本實施形態中,各凹部141之開口形狀(俯視時之形狀)與器件本體901之俯視時之形狀成大致相似之形狀(正方形)。側壁部143呈相對於底部142傾斜之錐狀。且,可於各凹部141逐個收納及載置IC器件90。 第2載置構件即器件供給部14可自器件供給區域A2移動至檢查區域A3,亦可於其相反方向移動。如此,器件供給部14可沿X方向即箭頭ɑ14 方向於器件供給區域A2與檢查區域A3之間往返移動地被支持。藉此,器件供給部14可將IC器件90自器件供給區域A2穩定地搬送至檢查區域A3之檢查部16附近,且,可於檢查區域A3由搬送頭17卸去IC器件90後再次返回至器件供給區域A2。 圖2所示之構成中,器件供給部14於Y方向配置有2個,有時將Y方向負側之器件供給部14稱為「器件供給部14A」,將Y方向正側之器件供給部14稱為「器件供給部14B」之情形。且,溫度調整部12上之IC器件90係於器件供給區域A2內被搬送至器件供給部14A或器件供給部14B。又,器件供給部14較佳為與溫度調整部12同樣地,構成為可將載置於該器件供給部14之IC器件90加熱或冷卻。藉此,對於經溫度調整部12溫度調整之IC器件90,可維持其溫度調整狀態而搬送至檢查區域A3之檢查部16附近。另,器件供給部14亦與溫度調整部12同樣地接地。 托盤搬送機構15係將經去除所有IC器件90之狀態之空的托盤200在器件供給區域A2內於X方向之正側、即箭頭α15 方向搬送之機構。且,於該搬送後,將空的托盤200由托盤搬送機構11B自器件供給區域A2返回至托盤供給區域A1。 如上述,電子零件檢查裝置1(電子零件搬送裝置10)具有檢查區域A3。該檢查區域A3構成為可配置檢查IC器件(電子零件)90之檢查部16。 又,電子零件檢查裝置1具有器件搬送頭(檢查用搬送部)17,其設置於檢查區域A3,自器件供給部(第2載置構件)14向檢查部16搬送IC器件(電子零件)90。 器件搬送頭17亦可稱為搬送部25之一部分,可固持維持上述之溫度調整狀態之IC器件90,並於檢查區域A3內搬送該IC器件90。該器件搬送頭17可在檢查區域A3內於Y方向及Z方向往返移動地被支持,且為稱為「指標臂」之機構之一部分。藉此,器件搬送頭17可將自器件供給區域A2搬入之器件供給部14上之IC器件90搬送、載置於檢查部16上。另,於圖2中,將器件搬送頭17之Y方向之往返移動以箭頭α17 表示。又,器件搬送頭17可於Y方向往返移動地被支持,但並非限定於此,亦可為於X方向亦可往返移動地被支持。又,圖2所示之構成中,器件搬送頭17於Y方向配置有2個,有時將Y方向負側之器件搬送頭17稱為「器件搬送頭17A」,將Y方向正側之器件搬送頭17稱為「器件搬送頭17B」。器件搬送頭17A可負責於檢查區域A3內將IC器件90自器件供給部14A向檢查部16搬送,器件搬送頭17B可負責於檢查區域A3內將IC器件90自器件供給部14B向檢查部16搬送。 如圖6所示,器件搬送頭17具有向下方開口且產生吸引力之吸引口171。器件搬送頭17藉由利用吸引口171之吸引力而可固持IC器件90。又,器件搬送頭17可藉由解除吸引口171之吸引力而釋放IC器件90。 又,器件搬送頭17較佳為與溫度調整部12同樣地構成為可加熱或冷卻經固持之IC器件90。藉此,可將IC器件90之溫度調整狀態自器件供給部14持續維持至檢查部16。 可於檢查區域A3配置檢查被載置於器件供給部(第2載置構件)14後之IC器件(電子零件)90之檢查部16。檢查部16係具有供載置IC器件(電子零件)90之複數個凹部(檢查用凹部)161且檢查IC器件90之電性特性之載置構件。 複數個凹部161係矩陣狀配置。如圖6所示,各凹部161具有底部162、及自底部162立設之側壁部163。本實施形態中,各凹部161之開口形狀(俯視時之形狀)與器件本體901之俯視時之形狀成大致相似之形狀(正方形)。側壁部163呈相對於底部162傾斜之錐狀。且,可於各凹部161中逐個收納及載置IC器件90。 又,於底部162設有與IC器件90之端子909電性連接之複數個探針引腳169。且,藉由將IC器件90之端子909與探針引腳169電性連接、即接觸,而可進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部16之測試器所具備之檢查控制部中記憶之程式而進行。 另,檢查部16較佳為與溫度調整部12同樣地加熱或冷卻IC器件90,而可將該IC器件90調整成適於檢查之溫度。 又,如圖2所示,電子零件檢查裝置1具有拍攝固持於器件搬送頭(檢查用搬送部)17之IC器件(電子零件)90之攝像部26。攝像部26係以例如CCD(Charge Coupled Device:電荷耦合裝置)攝像機或3維攝像機等各種攝像機構成,其攝像方向係朝上方即Z方向正側設置。作為該攝像部26之設置部位,並未特別限制,可設為例如檢查部16上或其附近。藉此,當固持於器件搬送頭17之IC器件90通過攝像部26時,可將該IC器件90之各端子909自下側一併攝像。 又,於控制部800預先記憶有IC器件90之各端子909之位置資訊。該位置資訊係用以將固持於器件搬送頭17之IC器件90之各端子909確實地與檢查部16之各探針引腳169接觸之各端子909之位置資訊。控制部800基於該位置資訊與攝像部26之攝像結果進行比較,即,將位置資訊與攝像結果進行比較,而可檢測出目前之端子909與可與探針引腳169接觸之位置偏差何種程度,即端子909之位置差(位置偏差量)。且,若以其差量修正器件搬送頭17並使其移動,則能夠在固持於器件搬送頭17之IC器件90之各端子909與檢查部16之各探針引腳169確實接觸之狀態下,將IC器件(電子零件)90載置於檢查部16。 另,攝像部26之設置數不限於1個,亦可為複數個。該情形時,可合成利用各攝像部26拍攝之攝像圖像,基於其而算出器件搬送頭17之修正量。 器件回收區域A4係回收於檢查區域A3經檢查且該檢查結束之複數個IC器件90之區域。於該器件回收區域A4,設置有回收用托托盤19、器件搬送頭20、及托盤搬送機構21。又,亦設有以跨越檢查區域A3與器件回收區域A4之方式移動之器件回收部18。又,於器件回收區域A4亦備有空的托盤200。 器件回收部18係具有供載置於檢查部16經檢查且該檢查結束之IC器件(電子零件)90之複數個凹部(第3凹部)181之第3載置構件。該第3載置構件即器件回收部18可移動地被支持,稱為可將IC器件90搬送至器件回收區域A4之「回收用梭板」或簡稱為「回收梭」。該器件回收部18亦可為搬送部25之一部分。 複數個凹部181係矩陣狀配置。如圖7所示,各凹部181具有底部182、及自底部182立設之側壁部183。本實施形態中,各凹部181之開口形狀(俯視時之形狀)與器件本體901之俯視時之形狀成大致相似之形狀(正方形)。側壁部183呈相對於底部182傾斜之錐狀。且,可於各凹部181中逐個收納及載置IC器件90。 該第3載置構件即器件回收部18可沿X方向即箭頭α18 方向於檢查區域A3與器件回收區域A4之間往返移動地被支持。又,圖2所示之構成中,器件回收部18與器件供給部14同樣地於Y方向配置有2個,將Y方向負側之器件回收部18稱為「器件回收部18A」,將Y方向正側之器件回收部18稱為「器件回收部18B」。且,檢查部16上之IC器件90係被搬送、載置於器件回收部18A或器件回收部18B。另,IC器件90自檢查部16向器件回收部18A之搬送係由器件搬送頭17A負責,自檢查部16向器件回收部18B之搬送係由器件搬送頭17B負責。又,器件回收部18亦與溫度調整部12及器件供給部14同樣地接地。 回收用托盤19係供載置經檢查部16檢查且被載置、搬送至器件回收部18後之IC器件90之載置構件,且固定為不於器件回收區域A4內移動。藉此,即使為配置有較多器件搬送頭20等各種可動部之回收區域A4,亦於回收用托盤19上穩定地載置完成檢查之IC器件90。另,於圖2所示之構成中,回收用托盤19沿X方向配置有3個。又,作為回收用托盤19,亦可使用托盤200。 又,空的托盤200亦沿X方向配置有3個。該空的托盤200係具有供載置經檢查部16檢查且被載置、搬送至器件回收部(第3載置構件)18後之IC器件(電子零件)90之複數個凹部(第4凹部)201之第4載置構件。以下,有時將該托盤200稱為「托盤(回收托盤)200B」之情形。另,與托盤200B同樣地,有時亦將回收用托盤19稱為「第4載置構件」。以下,將托盤200B作為第4載置構件代表性地進行說明。 如上述,第3載置構件即器件回收部18係可移動地被支持之回收梭。且,移動來到器件回收區域A4之器件回收部18上之IC器件90係被搬送、載置於第4載置構件即任一托盤200B(或任一回收用托盤19)。藉此,將IC器件90依每次檢查結果而分類、回收。如此,第4載置構件即托盤200B係最終將IC器件(電子零件)90分類、載置、回收之回收托盤。 器件搬送頭20具有可在器件回收區域A4內於X方向及Y方向移動地被支持、進而亦可於Z方向移動之部分。該器件搬送頭20係搬送部25之一部分,可將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤200。另,於圖2中,將器件搬送頭20之X方向之移動以箭頭α20 表示,將器件搬送頭20之Y方向之移動以箭頭α20Y 表示。 如圖7及圖8所示,器件搬送頭20具有向下方開口且產生吸引力之吸引口2001。器件搬送頭20可藉由吸引口2001之吸引力而固持IC器件90。又,器件搬送頭13可藉由解除吸引口2001之吸引力而釋放IC器件90。 托盤搬送機構21係將自托盤去除區域A5搬入之空的托盤200在回收區域A4內於X方向即箭頭α21 方向搬送之機構。且,於該搬送後,空的托盤200會被配置於回收IC器件90之位置,即,可為上述3個空的托盤200中之任一者。 托盤去除區域A5係將排列有完成檢查狀態之複數個IC器件90之托盤200回收、去除之除材部。於托盤去除區域A5中,可堆疊多個托盤200。 又,以跨越器件回收區域A4與托盤去除區域A5之方式,設置有於Y方向逐片搬送托盤200之托盤搬送機構22A及托盤搬送機構22B。托盤搬送機構22A係搬送部25之一部分,且係可使托盤200於Y方向即箭頭α22A 方向往返移動之移動部。藉此,可將完成檢查之IC器件90自器件回收區域A4搬送至托盤去除區域A5。又,托盤搬送機構22B可將用以回收IC器件90之空的托盤200於Y方向之正側即箭頭α22B 方向移動。藉此,可使空的托盤200自托盤去除區域A5移動至器件回收區域A4。 控制部800可控制例如如下各部之作動:托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、器件供給部14、器件搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、托盤搬送機構22B、及攝像部26等。 操作者可經由監視器300,設定及確認電子零件檢查裝置1之動作條件等。該監視器300具有例如以液晶畫面構成之顯示畫面301,配置於電子零件檢查裝置1之正面側上部。如圖1所示,於托盤去除區域A5之圖中之右側,設有載置滑鼠之滑鼠台600。該滑鼠係於對顯示於監視器300之畫面進行操作時使用。 又,於圖1之右下方,對監視器300配置有操作面板700。操作面板700係與監視器300分開,對電子零件檢查裝置1命令期望之動作者。 又,信號燈400可藉由發光之顏色之組合,報知電子零件檢查裝置1之作動狀態等。信號燈400配置於電子零件檢查裝置1之上部。另,於電子零件檢查裝置1內置有揚聲器500,亦可藉由該揚聲器500,報知電子零件檢查裝置1之作動狀態等。 電子零件檢查裝置1係由第1隔板231分隔托盤供給區域A1與器件供給區域A2之間,由第2隔板232分隔器件供給區域A2與檢查區域A3之間,由第3隔板233分隔檢查區域A3與器件回收區域A4之間,由第4隔板234分隔器件回收區域A4與托盤去除區域A5之間。又,器件供給區域A2與器件回收區域A4之間亦係由第5隔板235分隔。 電子零件檢查裝置1之最外裝係由蓋覆蓋,於該蓋有例如前蓋241、側蓋242、側蓋243、後蓋244及頂蓋245。 而如圖3所示,於托盤200A之凹部201載置IC器件90。且,若為俯視時凹部201之中心與IC器件90之中心重疊之定位狀態,即,IC器件90於凹部201內定中心之情形時,在凹部201之側壁部203與IC器件90之器件本體901之緣部(側面)902之間,形成間隙(第1間隔)GP200A 。間隙GP200A 於圖3中之左右方向(X方向)、紙面前後方向(Y方向)之任一方向皆相同。所謂「間隙GP200A 」是指具有凹部201之側壁部203與IC器件90之緣部902之間的最小距離之部分。藉由形成間隙GP200A ,容易對凹部201取出/放入IC器件90。 又,如圖4所示,於溫度調整部12之凹部121載置IC器件90。且,若為俯視時凹部121之中心與IC器件90之中心重疊之定位狀態,即,IC器件90於凹部121內定中心之情形時,在凹部121之側壁部123與IC器件90之器件本體901之緣部902之間,形成間隙GP12 。間隙GP12 於圖4中之左右方向(X方向)、紙面前後方向(Y方向)之任一方向皆相同。所謂「間隙GP12 」是指具有凹部121之側壁部123與IC器件90之緣部902之間的最小距離之部分。藉由形成間隙GP12 ,容易對凹部121取出/放入IC器件90。 如圖5所示,於器件供給部14之凹部141載置IC器件90。且,若為俯視時凹部141之中心與IC器件90之中心重疊之定位狀態,即,IC器件90於凹部141內定中心之情形時,在凹部141之側壁部143與IC器件90之器件本體901之緣部902之間,形成間隙(第2間隔)GP14 。間隙GP14 於圖5中之左右方向(X方向)、紙面前後方向(Y方向)之任一方向皆相同。所謂「間隙GP14 」是指具有凹部141之側壁部143與IC器件90之緣部902之間的最小距離之部分。藉由形成間隙GP14 ,容易對凹部141取出/放入IC器件90。 如圖6所示,於檢查部16之凹部161載置IC器件90。如上述,IC器件90對檢查部16之載置可藉由將IC器件90之各端子909之位置資訊與攝像部26之攝像結果進行比較,檢測端子909之上述位置之差,以其差量使器件搬送頭17移動而實現。且,若為俯視時凹部161之中心與IC器件90之中心重疊之定位狀態,即,IC器件90於凹部161內定中心之情形時,在凹部161之側壁部163與IC器件90之器件本體901之緣部902之間,形成間隙GP16 。間隙GP16 於圖6中之左右方向(X方向)、紙面前後方向(Y方向)之任一方向皆相同。所謂「間隙GP16 」是指具有凹部161之側壁部163與IC器件90之緣部902之間的最小距離之部分。藉由形成間隙GP16 ,容易對凹部161取出/放入IC器件90。 如圖7所示,於器件回收部18之凹部181載置IC器件90。且,若為俯視時凹部181之中心與IC器件90之中心重疊之定位狀態,即,IC器件90於凹部181內定中心之情形時,在凹部181之側壁部183與IC器件90之器件本體901之緣部902之間,形成間隙(第3間隔)GP18 。間隙GP18 於圖7中之左右方向(X方向)、紙面前後方向(Y方向)之任一方向皆相同。所謂「間隙GP18 」是指具有凹部181之側壁部183與IC器件90之緣部902之間的最小距離之部分。藉由形成間隙GP18 ,容易對凹部181取出/放入IC器件90。 如圖8所示,於托盤200B之凹部201載置IC器件90。且,若為俯視時凹部201之中心與IC器件90之中心重疊之定位狀態,即,IC器件90於凹部201內定中心之情形時,在凹部201之側壁部203與IC器件90之器件本體901之緣部902之間,形成間隙(第4間隔)GP200B 。間隙GP200B 於圖8中之左右方向(X方向)、紙面前後方向(Y方向)之任一方向皆相同。所謂「間隙GP200B 」是指具有凹部201之側壁部203與IC器件90之緣部902之間的最小距離之部分。藉由形成間隙GP200B ,容易對凹部201取出/放入IC器件90。 以上之各定位狀態係用以規定間隙GP200A 、間隙GP12 、間隙GP14 、間隙GP16 、間隙GP18 、及間隙GP200B 之狀態,與實際生產上進行IC器件90之搬送時之IC器件90對於各凹部之載置狀態不同。於圖9中顯示該載置狀態之一例。如圖9所示,將IC器件90藉由器件搬送頭13搬送、載置於器件供給部14之凹部141時,亦可為在凹部141內靠近圖中之左側、即偏頗之狀態。此種偏頗狀態亦可能於托盤200A之凹部201、溫度調整部12之凹部121、檢查部16之凹部161、器件回收部18之凹部181及托盤200B之凹部201產生。 又,上述之各定位狀態係俯視時各凹部之中心與IC器件90之中心重疊之狀態,該重疊程度當然包含完全一致,並且包含例如容許誤差(用以規定GP200A 、間隙GP12 、間隙GP14 、間隙GP16 、間隙GP18 、及間隙GP200B 充分之程度)之範圍內之一致(差異)。 且,該等間隙的大小各不相同。以下,針對間隙GP200A 、間隙GP12 、間隙GP14 、間隙GP16 、間隙GP18 、及間隙GP200B 之大小關係,與滿足該大小關係所產生之作用、效果,參照圖3~圖12進行說明。 如圖3及圖5所示,於托盤(第1載置構件)200A之凹部(第1凹部)201載置有IC器件(電子零件)90之情形之凹部(第1凹部)201之側壁部123與IC器件(電子零件)90之間隙(第1間隙)GP200A ,及於圖5所示之器件供給部(第2載置構件)14之凹部(第2凹部)141載置有IC器件(電子零件)90之情形之凹部(第2凹部)141之側壁部143與IC器件(電子零件)90之間隙(第2間隔)GP14 兩者間,間隙(第2間隔)GP14 大於間隙(第1間隔)GP200A 。 如此,滿足「間隙GP14 >間隙200A 」之關係。藉此,當省略經由溫度調整部12而將IC器件90自托盤200A搬送至器件供給部14時,由於原先位在托盤200A之凹部201內之IC器件90係被搬送至開口面積大於凹部201之器件供給部14之凹部141,故可容易進入凹部141,可防止堵塞(jam)。因此,藉由機械加工(例如切削加工或雷射加工等)對此種器件供給部14之凹部141進行加工之情形時,可放寬設定其加工精度地進行加工。藉此,可將器件供給部14盡可能以短交貨期製造、交貨,且,可盡可能地抑制器件供給部14之製造成本,獲得低價之器件供給部14。另,所謂「堵塞」是指IC器件90對於凹部141無法取出/放入之狀態。 另,間隙GP14 >間隙200A 之情形時,間隙GP14 較佳為例如係間隙GP200A 之1.1倍以上10倍以下,更佳為2倍以上5倍以下。 器件供給部14之凹部(第2凹部)141之深度d14 小於IC器件(電子零件)90之厚度(最大厚度)t90 。藉此,雖亦需視器件搬送頭13之構造而定,但器件搬送頭13接近器件供給部14之凹部141內之IC器件90而固持該IC器件90時,可防止器件搬送頭13與器件供給部14之干擾。 另,深度d14 並未特別限定,較佳為例如厚度t90 之0.2倍以上0.9倍以下,更佳為0.5倍以上0.7倍以下, 如上述,電子零件檢查裝置1(電子零件搬送裝置10)具備溫度調整部12,其具有供載置IC器件(電子零件)90之凹部(溫度調整用凹部)121,調整IC器件(電子零件)90之溫度。 且,如圖4及圖5所示,間隙(第2間隔)GP14 大於凹部(溫度調整用凹部)121中載置有IC器件(電子零件)90之情形之凹部(溫度調整用凹部)121之側壁部123與IC器件(電子零件)90之間隙(間隔)GP12 。如此,滿足「間隙GP14 >間隙GP12 」之關係。藉此,將IC器件90自托盤200A經由溫度調整部12搬送至器件供給部14時,由於原先位在溫度調整部12之凹部121內之IC器件90係被搬送至開口面積大於凹部121之器件供給部14之凹部141,因此更容易進入141。 另,間隙GP14 >間隙GP12 之情形時,間隙GP14 較佳為例如間隙GP12 之1.1倍以上5倍以下,更佳為1.2倍以上2倍以下。 如圖3及圖4所示,於凹部(溫度調整用凹部)121載置有IC器件(電子零件)90之情形之凹部(溫度調整用凹部)121之側壁部123與IC器件(電子零件)90之間隙(間隔)GP12 大於間隙(第1間隔)GP200A 。如此,滿足「間隙GP12 >間隙GP200A 」之關係。藉此,將IC器件90自托盤200A經由溫度調整部12搬送至器件供給部14時,由於原先位在托盤200A之凹部201內之IC器件90係被搬送至開口面積大於凹部201之溫度調整部12之凹部121,因此更容易進入121。因此,藉由機械加工(例如切削加工或雷射加工等)對此種溫度調整部12之凹部121進行加工之情形時,可放寬設定將其加工精度地進行加工。藉此,可將溫度調整部12盡可能以短交貨期製造、交貨,且,可盡可能地抑制溫度調整部12之製造成本,獲得低價之溫度調整部12。 另,間隙GP12 >間隙GP200A 之情形時,間隙GP12 較佳為例如間隙GP200A 之1.1倍以上5倍以下,更佳為1.2倍以上3倍以下。 又,凹部121之深度d12 較佳為小於厚度t90 ,例如為厚度t90 之0.2倍以上0.9倍以下,更佳為0.5倍以上0.7倍以下。 如上述,檢查部16具有供載置IC器件(電子零件)90之凹部(檢查用凹部)161。 且,如圖5及圖6所示,間隙(第2間隔)GP14 大於載置有IC器件(電子零件)90之情形之凹部(檢查用凹部)161之側壁部163與IC器件(電子零件)90之間隙(間隔)GP16 。如此,滿足「間隙GP14 >間隙GP16 」之關係。另,間隙GP14 較佳為例如間隙GP16 之1.1倍以上10倍以下,更佳為5倍以上10倍以下。 又,如圖3及圖6所示,間隙(第1間隔)GP200A 大於載置有IC器件(電子零件)90之情形之凹部(檢查用凹部)161之側壁部163與IC器件(電子零件)90之間隙(間隔)GP16 。如此,滿足「間隙GP200A >間隙GP16 」之關係。另,間隙GP200A 較佳為例如間隙GP16 之1.1倍以上5倍以下,更佳為2倍以上5倍以下。 藉此,間隙GP200A 、間隙GP12 、間隙GP14 、及間隙GP16 中,間隙GP16 為最小,藉此,將IC器件90搬送至檢查部16時,可將IC器件90於凹部161內高精度地定位。藉由該定位,可使IC器件90之各端子909與配置於凹部161內之各探針引腳169接觸,藉此可正確地進行對IC器件90之檢查。 另,檢查部16之深度d16 並未特別限定,較佳為例如厚度t90 之0.2倍以上0.9倍以下,更佳為0.5倍以上0.7倍以下。 如上述,可於檢查區域A3配置檢查載置於器件供給部(第2載置構件)14後之IC器件(電子零件)90之檢查部16。又,電子零件檢查裝置1(電子零件搬送裝置10)具有器件回收部(第3載置構件)18,其具有供載置經檢查部16檢查之IC器件(電子零件)90之複數個凹部(第3凹部)181。再者,於器件回收區域A4配置托盤(第4載置構件)200B,其具有供載置經載置於器件回收部(第3載置構件)18後之IC器件(電子零件)90之複數個凹部(第4凹部)201。 且,如圖7及圖8所示,於器件回收部18之凹部(第3凹部)181載置IC器件(電子零件)90且俯視時凹部(第3凹部)181之中心與IC器件(電子零件)90之中心重疊之定位狀態之情形之凹部(第3凹部)181之側壁部183與IC器件(電子零件)90之間隙(第3間隔)GP18 ,及於凹部(第4凹部)201載置IC器件(電子零件)90而在俯視下凹部(第4凹部)201之中心與IC器件(電子零件)90之中心重疊之定位狀態之情形之凹部(第4凹部)201之側壁部203與IC器件(電子零件)90之間隙(第4間隔)GP200B 兩者間,間隙(第4間隔)GP200B 大於間隙(第3間隔)GP18 。如此,滿足「間隙GP200B >間隙GP18 」之關係。藉此,將IC器件90自器件回收部18搬送至托盤200B時,由於原先位在器件回收部18之凹部181內之IC器件90係被搬送至開口面積大於凹部181之托盤200B之凹部201,因此可容易進入凹部201。 另,器件回收部18之深度d18 並未特別限定,較佳為例如厚度t90 之0.2倍以上0.9倍以下,更佳為0.5倍以上0.7倍以下。 又,如圖6及圖7所示,滿足「間隙GP18 >間隙GP16 」之關係。藉此,將IC器件90自檢查部16搬送至器件回收部18時,由於在檢查部16之凹部161內之IC器件90被搬送至開口面積大於凹部161之器件回收部18之凹部181,因此可容易進入凹部181。因此,藉由機械加工(例如切削加工或雷射加工等)對此種器件回收部18之凹部181進行加工之情形時,可放寬設定其加工精度地進行加工。藉此,可將器件回收部18盡可能以短交貨期製造、交貨,且,可盡可能地抑制器件回收部18之製造成本,獲得低價之器件回收部18。 又,間隙(第2間隔)GP14 與間隙(第1間隔)GP200A 之差大於間隙(第4間隔)GP200B 與間隙(第3間隔)GP18 之差。藉此,可將間隙GP200A 與間隙GP200B 設為相同大小,藉此,可使用共通之托盤200作為托盤200A及托盤200B。 例如IC器件90之器件本體901於俯視時係1邊為5 mm之正方形者之情形時,上述間隙彼此之大小關係較佳為如圖10所示之大小關係。圖10所示之圖表中,GP200A 為0.2 mm,GP12 為0.6 mm,GP14 為1.0 mm,GP16 為0.1 mm,GP18 為0.15 mm,GP200B 為0.2 mm。 又,例如IC器件90之器件本體901於俯視時係為1邊10 mm之正方形者之情形時,上述間隙彼此之大小關係較佳為如圖11所示之大小關係。圖11所示之圖表中,GP200A 為0.3 mm,GP12 為0.6 mm,GP14 為1.0 mm,GP16 為0.1 mm,GP18 為0.2 mm,GP200B 為0.3 mm。 又,例如IC器件90之器件本體901於俯視時係1邊為20 mm之正方形者之情形時,上述間隙彼此之大小關係較佳為如圖12所示之大小關係。圖12所示之圖表中,GP200A 為0.5 mm,GP12 為0.8 mm,GP14 為1.0 mm,GP16 為0.1 mm,GP18 為0.2 mm,GP200B 為0.5 mm。 <第2實施形態> 以下,參照圖13,針對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明,但以與上述實施形態之不同點為中心進行說明,相同事項省略其說明。 本實施形態除了溫度調整部之構成不同以外,與第1實施形態相同。 如圖13所示,本實施形態中,溫度調整部12具備板狀之基部124、及較基部124更薄且具有複數個開口125之薄板部126。 基部124係例如以鋁構成之金屬板。於該基部124形成有複數個經鑽孔加工之孔124a。可對各孔124a插入螺栓128。藉此,可經由螺栓128固定基部124。又,於基部124壓入有2條導銷127。2條導銷127沿Y方向盡可能地隔開配置。 薄板部126係較基部124更薄且以例如不鏽鋼構成之金屬板。作為薄板部126之厚度t126 ,並未特別限定,較佳為例如1 mm以上2 mm以下,更佳為1 mm以上1.2 mm以下。 於該薄板部126貫通形成有複數個開口125。該等開口125係矩陣狀配置,於薄板部126與基部124重疊之狀態下,構成供收納及載置IC器件90之凹部121。 又,於該薄板部126貫通形成有2個導孔126a。藉由對各導孔126a插入基部124上之各導銷127,於薄板部126與基部124重疊之狀態下,完成基部124與薄板部126之定位。如此,於溫度調整部12中,導銷127與導孔126a成為進行基部124與薄板部126之定位之定位部。且,可藉由該定位而進行基部124與薄板部126之正確之組裝。 將此種薄板部126根據IC器件90之種類而準備有例如複數個開口125之大小或開口125之配置狀態不同者。又,薄板部126可對基部124裝卸。藉此,可根據IC器件90之種類更換使用薄板部126。 又,由於薄板部126係較基部124更薄之金屬板,故開口125之加工變容易,藉此可根據IC器件90之種類準備多品種之薄板部126。 <第3實施形態> 以下,參照圖14~圖18,針對本發明之電子零件搬送裝置及電子零件檢查裝置之本實施形態進行說明,但以與上述實施形態之不同點為中心進行說明,相同事項省略其說明。 本實施形態除了器件供給部及器件回收部之各構成不同以外,與第1實施形態相同。另,由於器件供給部之構成與器件回收部之構成為相同構成,故針對器件供給部之構成代表性進行說明。 如圖14所示,本實施形態中,器件供給部(第2載置構件)14具備板狀之基部3、及較基部3更薄且具有開口41之薄板部4。藉此,如後述,由於薄板部4係較基部3更薄者,故開口41之加工變容易,藉此可根據IC器件90之種類準備多品種之薄板部4。 另,如圖16~圖18所示,器件供給部14係藉由線性導軌27而配置於可在Y方向往返移動地被支持之支持基板28上。 基部3係以例如鋁構成之金屬板。如圖16所示,於基部3貫通形成有孔31。且,可對各孔31插入螺栓32。藉此,可將基部3經由螺栓32固定於支持基板28。另,孔31於圖14之構成中係於Y方向隔開形成有2個,但並非限定於此。 如圖18所示,於基部3壓入有2條導銷33。2條導銷33沿X方向盡可能隔開配置(參照圖14)。 薄板部4係較基部3更薄之例如以不鏽鋼構成之金屬板。作為薄板部4之厚度t4 ,並未特別限定,較佳為例如0.2 mm以上2 mm以下,更佳為0.4 mm以上0.8 mm以下。 如圖17所示,於薄板部4貫通形成有複數個開口41。該等開口41係矩陣狀配置(參照圖14及圖15),於薄板部4與基部3重疊之狀態下,構成收納及載置IC器件90之凹部141。 另,如圖16所示,於薄板部4形成有供基部3固定於支持基板28之螺栓32之頭部(螺釘頭)321突出之孔42。藉此,在將薄板部4重疊於基部3之狀態下,防止螺栓32與薄板部4干擾,藉此,將薄板部4穩定地載置於基部3上。 如圖18所示,於薄板部4貫通形成有2個導孔43。藉由對各導孔43插入基部3上之各導銷33,於薄板部4與基部3重疊之狀態下,完成基部3與薄板部4之定位。如此,器件供給部(第2載置構件)14成為具備定位部者,該定位部係以導銷33與導銷33構成,進行基部3與薄板部4之定位。且,可藉由該定位進行基部3與薄板部4之正確之組裝。 此種薄板部4根據IC器件90之種類,例如準備有複數個開口41之大小或開口41之配置狀態不同者。又,薄板部4可對基部3裝卸。藉此,可將薄板部4載置於根據IC器件90之種類更換使用之基部3。 又,由於薄板部4係較基部3更薄之金屬板,故開口41之加工變容易。藉此,可根據IC器件90之種類準備多品種之薄板部4。 又,薄板部4之裝卸係藉由操作2條滾花螺釘(螺栓)44而進行。於薄板部4形成有供各滾花螺釘44之公螺紋部441插通之小孔45(參照圖15),及與小孔45連通之、即連接於小孔45之大孔46(參照圖15)。大孔46位於相對於小孔45之X方向之負側,較滾花螺釘44之頭部(螺釘頭)442之外徑更大。藉此,滾花螺釘44之頭部442自大孔46突出。且,若要將薄板部4固定於基部3,可設為滾花螺釘44之外螺紋部441插通小孔45之狀態,並將滾花螺釘44緊固(參照圖18)。又,若要使薄板部4自基部3脫離,例如使滾花螺釘44僅鬆開導銷33之突出量,將薄板部4提起上述突出量,於該狀態下使其朝X方向之正側移動。藉此,滾花螺釘44之頭部442位於大孔46。且,藉由進而提起薄板部4,而可使薄板部4自基部3脫離。 <第4實施形態> 以下,根據圖19~圖27說明將本發明具體化之一實施形態。 圖19係顯示作為構成本實施形態之電子零件搬送裝置之電子零件檢查裝置之IC處理機2之構造之俯視圖。 IC處理機2具備基底5、安全外罩6、高溫腔室7、供給機器人8、回收機器人9、第1梭47、第2梭48、及複數個輸送帶C1~C6。 基底5於其之上表面搭載有各要素。安全外罩包圍基底5之大區域,於其內部收納有供給機器人8、回收機器人9、第1梭47、及第2梭48。 複數個輸送帶C1~C6以其一端部側位於安全外罩6之外側、另一端位於安全外罩6之內側之方式設置於基底5。各輸送帶C1~C6將收納有複數個作為電子零件之半導體晶片等IC器件T之托盤200自安全外罩6之外側朝安全外罩6之內側搬送,相反的,將托盤200自安全外罩6之內側朝安全外罩6之外側搬送。 供給機器人8係由X軸框FX、第1Y軸框FY1、及供給側機械手單元49構成。回收機器人9係由X軸框FX、第2Y軸框FY2、及回收側機械手單元51構成。X軸框FX配置於X方向。第1Y軸框FY1及第2Y軸框FY2以沿Y方向成互相平行之方式配置,且可相對於X軸框FX朝X方向移動地被支持。且,第1Y軸框FY1及第2Y軸框FY2藉由設置於X軸框FX之未圖示之各個馬達,而沿X軸框FX於X方向往返移動。 於第1Y軸框FY1之下側,可於Y方向移動地支持著供給側機械手單元49。供給側機械手單元49藉由設置於第1Y軸框FY1之未圖示之各個馬達,而沿第1Y軸框FY1於Y方向往返移動。且,供給側機械手單元49例如將收納於輸送帶C1之托盤200之檢查前之IC器件T供給至第1梭47。 於第2Y軸框FY2之下側,可於Y方向移動地支持著回收側機械手單元51。回收側機械手單元51藉由設置於第2Y軸框FY2之未圖示之各個馬達,而沿第2Y軸框FY2於Y方向往返移動。且,回收側機械手單元51例如將供給至第1梭47之檢查後之IC器件T供給至輸送帶C6之托盤200。 於基底5之上表面且供給機器人8與回收機器人9之間,分別與X方向平行配設有第1導軌30A及第2導軌30B。於第1導軌30A配備有可於X方向往返移動之第1梭47。又,於第2導軌30B配備有可於X方向往返移動之第2梭48。 第1梭47具備於X方向較長之大致板狀之基底構件47A。於基底構件47A之底面設有未圖示之導軌軸承,該導軌軸承與第1導軌30A滑接。且,藉由設置於第1梭47之第1梭馬達M1(參照圖26),而沿第1導軌39A往返移動。 於基底構件47A之上表面左側(供給機器人8側),以螺釘等可更換地固著供給側載置部57。 又,於基底構件47A之上表面右側(回收機器人9側),以螺釘等可更換地固著與供給側載置部57相同之回收側載置部34,回收側載置部34與供給側載置部57同樣地載置IC器件T。 第2梭48具備於X方向較長之大致板狀之基底構件48A。於基底構件48A之底面設有未圖示之導軌軸承,該導軌軸承與第2導軌30B滑接。且,藉由設置於第2梭48之第2梭馬達M2(參照圖26),而沿第2導軌30B往返移動。 於基底構件48A之上表面左側(供給機器人8側),以螺釘等可更換地固著與配備於基底構件47A者相同之供給側載置部57,於各供給側載置部57載置IC器件T。又,於基底構件48A之上表面右側(回收機器人9側),以螺釘等可更換地固著與供給側載置部57相同之回收側載置部34而載置IC器件T。 圖20係顯示本實施形態之梭47、48之構造之俯視圖,圖21係顯示本實施形態之梭47、48之構造之前視圖。 如圖20所示,於各梭47、48之上表面中央,可拍攝上方地配備有分別構成第1攝像機之第1及第2梭攝像機37、38。各梭攝像機37、38係自下方拍攝由後述之測定機器人22保持於上方之IC器件T,且輸出其拍攝所得之圖像資料者,於測定機器人22之正下方位置,可一次拍攝保持之IC器件T之整體及其周圍。另,本實施形態中,各梭攝像機37、38為CCD攝像機,但並非限定於此。 於基底5之上表面且各梭47、48之間,設有檢查部23。於檢查部23設有安裝IC器件T之檢查用插座24。 檢查用插座24係用以對所安裝之IC器件T進行電性檢查之插座,於檢查用插座24配備有對應於檢查對象之IC器件T之各連接端子(未圖示)之複數個檢查用接觸端子(未圖示)。且,檢查用插座24藉由使IC器件T之各連接端子與各接觸端子接觸而電性連接並可進行檢查。於高溫腔室7內側,以跨越各梭47、48及檢查用插座24之上方之方式,配備有配設於Y方向之未圖示之導軌。 導軌之下部係可於Y方向往返移動地支持著測定機器人22,且藉由配備於導軌之Y軸馬達MY(參照圖26)使其於Y方向往返移動。即,測定機器人22沿導軌移動而在各梭47、48與檢查用插座24之間相互搬送IC器件T。 詳述如下,測定機器人22取得由各梭47、48供給之IC器件T,將IC器件T配置於檢查用插座24之正上方位置。且,測定機器人22使IC器件T移動至下方,使IC器件T之各連接端子自上方與檢查用插座24之接觸端子抵接,將彈簧銷朝下方下壓,藉此安裝於該檢查用插座24。再者,若安裝於檢查用插座24之IC器件T之電性檢查結束,則測定機器人22拔出安裝於各檢查用插座24之IC器件T,並配置於回收側載置部34之正上方位置。且,於回收側載置部34之正上方位置,測定機器人22使IC器件T移動至下方,而收納於特定之回收側載置部34。 圖22及圖24係顯示本實施形態之載置部57、34之構造之立體圖,圖23及圖25係顯示本實施形態之載置部57、34之構造之前視圖。另,圖22及圖23係顯示載置部57、34之載置面36為傾斜狀態,圖24及圖25係顯示載置部57、34之載置面36為水平狀態。 本實施形態之各載置部57、34具備:具備可載置IC器件T之載置面36之器件載置板58;作為使器件載置板58於X方向旋動之旋動機構之第1彈推彈簧53、旋動軸55、及第1按壓活塞56;作為使器件載置板58於Y方向滑動之滑動機構之第2彈推彈簧54、引導部66、及第2按壓活塞29;限制IC器件T之X方向之移動之IC器件T可抵接之第1抵接部59;及限制IC器件T之Y方向之移動之IC器件T可抵接之第2抵接部35。於各載置部57、34設有成為載置IC器件之位置的基準之基準位置P。於隔著基準位置P之器件載置板58之端邊側,設有第1抵接部59及第2抵接部35。 器件載置板58係以可載置IC器件T之方式形成為扁平之長方體。器件載置板58係由樹脂形成之矩形板狀之構件。器件載置板58係較IC器件之外形大一圈地形成。 基底構件47A、17A具備複數個載置部57、34。於複數個載置部57、34分別載置一個IC器件T。藉此,可將載置於載置部57、34之每個IC器件T進行定位。 載置部57、34具備旋動軸55。載置部57、34能夠以旋動軸55為中心相對於基底構件47A、17A旋動地設置。藉此,由於以旋動軸55為中心旋動,故可進而提高載置部57、34之角度設定精度。器件載置板58經由設置於其下部之旋動軸55而固定於載置部57、34。器件載置板58可以旋動軸55為中心旋動。旋動軸55為載置部57、34於X方向旋動時之中心。 載置面36相對於水平面傾斜。載置面36之法線方向H與重力方向G不同。載置面36之法線方向H相對於鉛垂方向傾斜。載置面36相對於水平面傾斜例如5~10度。載置部57、34之傾斜係藉由第1彈推彈簧53之彈推力而保持。第1彈推彈簧53其一端設置於器件載置板58之下表面,另一端設置於基底構件47A、17A之上表面。其結果,器件載置板58始終以載置部57、34相對於水平面傾斜之方式由第1彈推彈簧53彈推。第1彈推彈簧53於本實施形態中為1個,但亦可設置例如複數個。器件載置板58能夠以使載置面36成為傾斜狀態及水平狀態之方式動作。 載置面36之法線方向H具備搬送IC器件之方向之成分及重力方向之成分。藉此,載置部57、34移動時可將作用於IC器件之慣性力使用於IC器件T之移動。載置面36向與搬送IC器件T之搬送方向相反之方向傾斜。載置面36向基準位置P側傾斜。 器件載置板58於載置IC器件T時,以載置部57、34藉由旋動機構而傾斜之方式動作,且於拾取IC器件T時,以載置部57、34成為水平方向之方式動作。又,器件載置板58於搬送IC器件T時,以載置面36藉由旋動機構傾斜之方式動作。 載置部57、34可載置IC器件而相對於基底構件47A、17A傾斜動作。藉此,可容易使載置部57、34傾斜。 載置部57、34藉由被施加高於大氣壓之壓力的氣體而旋動。藉此,可容易使載置部57、34旋動。高於大氣壓之壓力的氣體例如施加由空氣加壓泵產生之空氣壓,以器件載置板58之載置面36利用空氣壓之作用而傾斜之方式動作。 根據上述實施形態,搬送IC器件T之情形時,藉由將梭47、48自停止狀態位移至搬送狀態時作用於IC器件T之慣性力設為大於作用於IC器件T與載置面36之間的摩擦力,而可將IC器件T移動至第1抵接部59,且使IC器件T接近基準位置P。又,藉由阻止梭47、48自搬送狀態位移至停止狀態時作用於IC器件T之慣性力所致之移動,而可將IC器件T保持於第1抵接部59及基準位置P附近。 又,於將IC器件T載置於載置面36之時點,可使IC器件T沿傾斜而移動至第1抵接部59,使IC器件接近基準位置P。 又,拾取IC器件T之情形時,藉由將載置面36設成水平而可容易進行拾取動作。 具備將載置部57、34可對第2抵接部35相對移動地支持之作為引導部之引導部66。藉此,可容易使載置部57、34傾斜。 器件載置板58可將引導部66作為導件而於Y方向滑動。引導部66係載置部57、34於Y方向滑動時之引導部。 具備可供IC器件T抵接之第2抵接部35。載置部57、34可載置IC器件T而對第2抵接部35相對移動,於載置面36配置有IC器件T時,載置部57、34可接近第2抵接部35。藉此,可於IC器件T之移動方向具備第2抵接部35。藉此,可以第2抵接部35阻止IC器件T之移動。器件載置板58藉由滑動而與第2抵接部35接觸或接近。器件載置板58藉由滑動而使載置之IC器件T接近基準位置P。器件載置板58藉由第2彈推彈簧54之彈推力而與第2抵接部35保持一定之間隙。器件載置板58與第2抵接部35之間隙例如為0.5 mm。器件載置板58可以對第2抵接部35成隔開狀態及接觸狀態之方式動作。第2彈推彈簧54其一端設置於器件載置板58之側面,另一端設置於第2抵接部35之側面。其結果,器件載置板58始終以與第2抵接部35隔開之方式由第2彈推彈簧54彈推。第2彈推彈簧54於本實施形態中為2個,但亦可設置例如一個或複數個。 器件載置板58於載置IC器件T時,以藉由滑動機構而與第2抵接部35隔開之方式動作,且於拾取IC器件T時,以與第2抵接部35接觸或接近之方式動作。 滑動機構被施加由空氣加壓泵產生之空氣壓,利用空氣壓之作用使滑動載置板58滑動。 根據上述實施形態,拾取IC器件T之情形時,藉由使IC器件T滑動至第2抵接部35側,而可使IC器件T接近基準位置P。 於器件載置板58之下表面及側面,存放有可於上下方向及橫方向滑動地構成之各按壓活塞56、29。 於按壓活塞56、29,連接有連通至梭47、48之端面之供氣孔39。於供氣孔39經由梭47、48密接連接有供氣管60(參照圖20及圖21)之終端。且,通過供氣管60自外部對按壓活塞56、29供給壓縮空氣。如圖26所示,供氣管60之始端係經由構成空氣壓電路73之電磁閥V1而連接於構成空氣壓電路73之空氣壓源52。若打開電磁閥V1,則電磁閥V1向供氣管60供給壓縮空氣,若關閉電磁閥V1,則電磁閥V1將供給至供氣管60之壓縮空氣向大氣開放。 因此,若關閉電磁閥V1而自供氣管60供給壓縮空氣,則第1按壓活塞56藉由壓縮空氣之空氣壓朝上方被按壓。且,第1按壓活塞56按壓器件載置板58之下表面。 又,若關閉電磁閥V1而自供氣管60供給壓縮空氣,則第2按壓活塞29藉由壓縮空氣之空氣壓朝橫方向被按壓。且,第2按壓活塞29按壓器件載置板58之側面。另,本實施形態中,按壓活塞56、29係當被供給壓縮空氣則其按壓部高速突出之活塞,例如抽頭活塞。 於上述實施形態中,設有1個各按壓活塞56、29。但不限於此,各按壓活塞56、29亦可為複數個。 根據上述實施形態,搬送時藉由減小作用於IC器件T之外力(慣性力),而可抑制例如IC器件T之引線之損傷。 圖26係顯示本實施形態之IC處理機2之電性構成之方塊圖。 接著,針對IC處理機2用以將IC器件T適當安裝於檢查用插座24之電性構成,參照圖26進行說明。 圖26中,於控制裝置50配備有CPU(中央運算裝置)61、ROM62、RAM63、圖像處理器64及圖像記憶體65等。且,控制裝置50(CPU61)按照記憶於ROM62及RAM63之各種資料及各種控制程式,執行由IC處理機2自供給側載置部57吸附保持並取出幾查前之IC器件T而安裝於檢查用插座24之處理等。本實施形態中,於RAM63中確保有記憶IC器件T之檢查個數之檢查個數計數器用之記憶體。 控制裝置50與輸入輸出裝置70電性連接。輸入輸出裝置70具有各種開關與狀態顯示器,將開始執行各處理之指令信號及用以執行各處理之初始值資料等輸出至控制裝置50。 控制裝置50與Y軸馬達驅動電路71及Z軸馬達驅動電路72分別電性連接。 Y軸馬達驅動電路71輸入來自控制裝置50之控制信號CMY,藉由基於該控制信號CMY產生之驅動信號DMY而驅動控制Y軸馬達MY。又,控制裝置50經由Y軸馬達驅動電路71輸入由Y軸馬達編碼器EMY檢測出之Y軸馬達MY之旋轉量SMY。且,控制裝置50自旋轉量SMY掌握測定機器人22之位置。即,控制裝置50驅動控制Y軸馬達MY,將測定機器人22配置於檢查用插座24之上方位置,及第1或第2梭47、48之上方位置。 Z軸馬達驅動電路72輸入來自控制裝置50之控制信號CMZ,藉由基於該控制信號CMZ產生之驅動信號DMZ而驅動控制Y軸馬達MZ。又,控制裝置50經由Z軸馬達驅動電路72輸入由Z軸馬達編碼器EMZ檢測出之Z軸馬達MZ之旋轉量SMZ。且,控制裝置50自旋轉量SMZ掌握測定機器人22之位置。 控制裝置50與空氣壓電路73電性連接。空氣壓電路73基於自控制裝置50輸入之控制信號CV1,驅動控制電磁閥V1。且,控制裝置50驅動控制電磁閥V1,將供氣管60之供氣孔39切換成空氣壓源52與大氣之任一者。若供氣孔39連接於空氣壓源52,則各載置部57、34之器件載置板58被第1按壓活塞56按壓,各載置面36之法線方向H與重力方向G成為相同。再者,各載置部57、34之器件載置板58被第2按壓活塞29按壓而接近第2抵接部35。 控制裝置50與第1梭驅動電路75及第2梭驅動電路76分別電性連接。 第1梭驅動電路75輸入來自控制裝置50之控制信號CM1,藉由基於該控制信號CM1產生之驅動信號DM1而驅動控制第1梭馬達M1。且,控制裝置50驅動第1梭馬達M1,使第1梭47沿第1導軌30A移動。又,控制裝置50經由第1梭驅動電路75輸入由第1梭編碼器EM1檢測出之第1梭馬達M1之旋轉量SM1。且,控制裝置50自旋轉量SM1掌握第1梭47之位置。 第2梭驅動電路76輸入來自控制裝置50之控制信號CM2,藉由基於該控制信號CM2產生之驅動信號DM2而驅動控制第2梭馬達M2。且,控制裝置50驅動第2梭馬達M2,使第2梭48沿第2導軌30B移動。又,控制裝置50經由第2梭驅動電路76輸入由第2梭編碼器EM2檢測出之第2梭馬達M2之旋轉量SM2。且,控制裝置50自旋轉量SM2掌握第2梭48之位置。 控制裝置50與第1梭攝像機驅動電路77、第2梭攝像機驅動電路78及插座攝像機驅動電路79分別電性連接。 第1梭攝像機驅動電路77基於來自控制裝置50之控制信號C37而驅動控制第1梭攝像機37。且,控制裝置50驅動控制第1梭攝像機37,取得第1梭攝像機37所拍攝之「器件識別處理」用圖像資料GD1。 第2梭攝像機驅動電路78基於來自控制裝置50之控制信號C38而驅動控制第2梭攝像機38。且,控制裝置50驅動控制第2梭攝像機38,取得第2梭攝像機38所拍攝之「器件識別處理」用圖像資料GD1。 插座攝像機驅動電路79基於來自控制裝置50之控制信號C44而驅動控制插座攝像機67。且,控制裝置50驅動控制插座攝像機67,取得插座攝像機67所拍攝之「測定機器人位置識別處理」用圖像資料GD2或「插座識別處理」用圖像資料GD3。 控制裝置50使IC器件T之中心位置與檢查用插座24之中心位置一致,即,進行IC器件T之位置修正。 控制裝置50與攝影裝置驅動電路80分別電性連接。 攝影裝置驅動電路80基於來自控制裝置50之控制信號C40,產生左右方向(X方向)之驅動信號D3X與上下方向(Z方向)之驅動信號D3Z。且,基於驅動信號D3X驅動控制水平馬達M3X,使攝影裝置40(插座攝像機67)於左右方向(X方向)移動。又,基於驅動信號D3Z驅動控制垂直馬達M3Z,使攝影裝置40(插座攝像機67)於上下方向移動。又,控制裝置50經由攝影裝置驅動電路80輸入由水平馬達編碼器E3X檢測出之水平馬達M3X之旋轉量S3X。且,控制裝置50自旋轉量S3X掌握插座攝像機67之左右方向(X方向)之位置。再者,控制裝置50經由攝影裝置驅動電路80輸入由垂直馬達編碼器E3Z檢測出之垂直馬達M3Z之旋轉量S3Z。且,控制裝置50自旋轉量S3Z掌握插座攝像機67之上下方向(Z方向)之位置。 圖27係顯示本實施形態之用以檢查IC器件T而進行搬送處理之流程圖。 接著,針對使用IC處理機2自第1梭47吸附保持IC器件T並載置於檢查用插座24之順序,參照圖27進行說明。此處設為即將開始進行IC器件T之檢查,且於測定機器人22未吸附保持IC器件T。 如圖27所示,首先,若IC器件T之檢查開始,則於步驟S1中,控制裝置50將記錄已檢查IC器件T之次數之檢查個數計數器之記憶體清除為「0」。若將計數器之記憶體清除為「0」,則於步驟S2中,控制裝置50進行插座識別用之處理。 若插座識別用之處理結束,則於步驟S3中,控制裝置50進行測定機器人位置識別用之處理。 若測定機器人位置識別用之處理結束,則於步驟S4中,控制裝置50對第1梭47之供給側載置部57之載置面36之法線方向H與重力方向G不同(載置面36傾斜)之各載置部57、34供給IC器件T,測定機器人22將IC器件T搬送至吸附保持之位置。搬送時載置面36亦維持傾斜狀態。若測定機器人22將IC器件T搬送至吸附保持之位置,則於步驟S5中,控制裝置50控制電磁閥V1,載置面36之法線方向H成為與重力方向G相同。又,控制裝置50控制電磁閥V1,使各載置部57、34接近第2抵接部35。控制裝置50進行器件識別用之處理。 若取得器件識別用之圖像資料GD1,則控制裝置50進行器件識別處理。另,插座識別處理、測定機器人位置識別用之處理、及器件識別處理亦可例如自圖像檢測出各相對坐標及角度偏差。各相對坐標及角度偏差可使用已眾所周知之各種圖像處理技術。 若器件識別用之處理結束,則於步驟S6中,控制裝置50算出記憶於RAM63之、例如基於各相對坐標及角度偏差而用以使IC器件T之中心位置與檢查用插座24之中心位置一致之修正量。 若算出各修正量,則於步驟S7中,控制裝置50將IC器件以測定機器人22搬送至檢查用插座24之上方。 若將IC器件T搬送至檢查用插座24之上方,則於步驟S8中,控制裝置50基於算出之各修正量使測定機器人22移動,進行使IC器件T之中心位置與檢查用插座24之中心位置一致並且使IC器件T之邊的傾斜與檢查用插座24之邊的傾斜一致之位置修正。 若將IC器件T進行位置修正,則於步驟S9中,控制裝置50於檢查用插座24載置IC器件T,進行IC器件T之電性檢查。若IC器件T之電性檢查結束,則於步驟S10中,控制裝置50將吸附噴嘴相對於測定機器人22設為特定之初始位置及特定之初始角度後,藉由測定機器人22將IC器件T自檢查用插座24拔出,使IC器件T載置於第1梭47之回收側載置部34之載置面36之法線方向H與重力方向G不同(載置面36傾斜)之各載置面36。 若將IC器件T回收至回收側載置部34,則於步驟S11中,控制裝置50移動第1梭47,使回收機器人9回收IC器件T。此時,控制裝置50控制電磁閥V1,使載置面36之法線方向H與重力方向G相同。又,控制裝置50控制電磁閥V1,使各載置部57、34接近第2抵接部35。若使回收機器人9回收IC器件T,則於步驟S12中,控制裝置50判斷是否有下一個要檢查之零件。 若無下一個要檢查之零件(步驟S12之NO(否)),控制裝置50結束IC器件T之檢查。另一方面,有接著檢查之零件之情形時(步驟S12之YES(是)),於步驟S13中,控制裝置50對檢查個數計數器加上1後,於步驟S14中判斷是否已檢查特定個數。 未檢查特定個數之情形時(步驟S14之NO(否)),控制裝置50返回至步驟S4,重複IC器件T之搬送與檢查。該情形時,藉由器件識別處理,例如重新算出相對坐標及角度偏差,但由於未進行插座識別處理及測定機器人位置識別處理,故將之前算出並記憶於RAM63之例如各相對坐標及角度偏差使用於修正值之運算。另一方面,已檢查特定個數之情形時(步驟S14之YES(是)),控制裝置50返回至步驟S1,進行插座識別處理、測定機器人位置識別處理及器件識別處理,進行修正值之運算,重複IC器件T之檢查。 又,使用IC處理機2自第2梭48吸附保持IC器件T並載置於檢查用插座24,但該順序與自第1梭47吸附保持IC器件T並載置於檢查用插座24之順序相同,因此省略說明。 根據本實施形態,可使載置IC器件之載置面36相對於重力方向G傾斜。藉此,載置於載置面36之IC器件以相對於重力方向G且循著傾斜方向之方式移動。其結果,可對載置面36定位IC器件T。 又,無需用以將IC器件T收納於如先前之凹槽內之位置調整。對於IC器件T之姿勢之檢測亦可不設置先前之光學感測器。載置部57、34可與複數個品種之IC器件T相容。 <第5實施形態> 圖28係顯示本實施形態之載置部57A、34A之構造之立體圖。以下,一面參照圖28,一面說明本實施形態之載置部57A、34A之構造。 本實施形態之載置部57A、34A與第4實施形態之不同點為,於X方向形成滑動機構,於Y方向形成旋動機構。以下,對與第4實施形態相同之構成構件標註相同符號,此處省略或簡化該等之說明。 本實施形態之載置部57A、34A係於X方向滑動,於Y方向旋動之構造。 <第6實施形態> 圖29係顯示本實施形態之載置部57B、34B之構造之立體圖。以下,一面參照圖29,一面說明本實施形態之載置部57B、34B之構造。 本實施形態之載置部57B、34B與第4實施形態之不同點為,形成於Y方向旋動之旋動機構。以下,對與第4實施形態相同之構成構件標註相同符號,此處省略或簡化該等之說明。 本實施形態之載置部57B、34B係於X方向旋動且亦於Y方向旋動之構造。旋動軸55係載置部57B、34B於X方向及Y方向旋動時之中心。 <第7實施形態> 圖30係顯示本實施形態之載置部57C、34C之構造之立體圖。以下,一面參照圖30,一面說明本實施形態之載置部57C、34C之構造。 本實施形態之載置部57C、34C與第4實施形態之不同點為,形成於X方向旋動之旋動機構。以下,對與第4實施形態相同之構成構件標註相同符號,此處省略或簡化該等之說明。 本實施形態之載置部57C、34C係於X方向滑動且亦於Y方向滑動之構造。器件載置板58可將引導部66作為導件於X方向及Y方向滑動。引導部66係載置部57C、34C於X方向及Y方向滑動時之引導部。 另,實施形態不限於上述,亦可以如下之形態實施。 (變化例1) 上述第4實施形態中,設為具備使器件載置板58於X方向旋動之旋動機構及於Y方向滑動之滑動機構的構造,但亦可為僅有使載置部57、34於X方向旋動之旋動機構,而無使載置部57、34於Y方向滑動之滑動機構的構造。 (變化例2) 上述第4實施形態中,設為具備使器件載置板58於X方向旋動之旋動機構及於Y方向滑動之滑動機構的構造,但亦可為僅有使載置部57、34於Y方向滑動之滑動機構,而無使載置部57、34於X方向旋動之旋動機構的構造。 (變化例3) 上述第5實施形態中,設為具備使器件載置板58於X方向滑動之滑動機構及於Y方向旋動之旋動機構的構造,但亦可為僅有使載置部57、34於X方向滑動之滑動機構,而無使載置部57、34於Y方向旋動之旋動機構的構造。 (變化例4) 上述第5實施形態中,設為具備使器件載置板58於X方向滑動之滑動機構及於Y方向旋動之旋動機構的構造,但亦可為僅有使載置部57、34於Y方向旋動之旋動機構,而無使載置部57、34於X方向滑動之滑動機構的構造。 (變化例5) 上述實施形態中,使滑動載置板58,但亦可使包含載置部之梭47、48整體傾斜。 以上,基於圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置加以說明,但本發明並非限定於此,構成電子零件搬送裝置及電子零件檢查裝置之各部可置換成可發揮相同功能之任意構成者。又,亦可附加其他任意之構成物。 又,本發明之電子零件搬送裝置及電子零件檢查裝置亦可為組合上述各實施形態中之任意2個以上之構成(特徵)者。 又,本實施形態中,針對IC器件之器件本體之俯視時的形狀為正方形之情形進行說明,但並非限定於此。例如,器件本體之俯視時之形狀為長方形或圓形(包含橢圓形)之情形時,於各載置構件之凹部內載置有IC器件時之前後左右方向(Y及X方向)與側壁部相距之間隔,與器件本體之俯視時之形狀為正方形之情形同樣地設定。Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings. <First Embodiment> Hereinafter, a description will be given of this embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention with reference to FIGS. 1 to 14. In addition, for convenience of explanation, as shown in FIG. 1, three axes that are orthogonal to each other are set as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is also referred to as "Y direction (second direction)", and a direction parallel to the Z axis is also referred to It is called "Z direction (third direction)". The direction in which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, the "horizontal" mentioned in the description of the present case is not limited to a complete level, and includes a state inclined slightly (for example, less than about 5 °) with respect to the level as long as it does not hinder the transportation of electronic components. In addition, in FIG. 1 and FIGS. 3 to 8 (the same applies to FIGS. 13, 14, and 16 to 18), the upper side, that is, the positive side in the Z direction is referred to as “up” or “upper”, and the lower side is The negative side of the Z direction is called "down" or "down". The electronic component transfer device 10 according to this embodiment has an appearance as shown in FIG. 1. The electronic component conveying device 10 of this embodiment is a processing machine. As shown in FIG. 2, a tray (first placing member) 200A having a recessed portion (first recessed portion) 201 on which electronic components are placed can be arranged, and has: a device A supply unit (second mounting member) 14 having a recessed portion (second recessed portion) 141 on which electronic components are placed; and a device transfer head 13 (transported portion 25) capable of transferring electronic components from a tray (first mounting portion) The component) 200A is transported to the device supply section (second placing member) 14; when the electronic component is placed in the concave portion (first concave portion) 201 and the center of the concave portion (first concave portion) 201 overlaps with the center of the electronic component in plan view Gap between the side wall portion 203 of the recessed portion (first recessed portion) 201 and the electronic component (first gap) GP200A And the side wall portion 143 of the recessed portion (second recessed portion) 141 and the electronic component when the electronic component is placed on the recessed portion (second recessed portion) 141 and the center of the recessed portion (second recessed portion) 141 overlaps with the center of the electronic component in plan view Clearance (2nd interval) GP14 Gap between the two (second interval) GP14 Greater than the gap (1st interval) GP200A . Therefore, as will be described later, when electronic components are transferred from the tray 200A to the device supply portion 14, the electronic components in the recessed portion 201 of the tray 200A are transferred to the recessed portion 141 of the device supply portion 14 having an opening area larger than that of the recessed portion 201. Easy access to the recess 141. Therefore, when machining the recessed portion 141 of the device supply portion 14 by machining (such as cutting or laser processing), the processing accuracy setting can be relaxed and set. Thereby, the device supply unit 14 can be manufactured and delivered with a short lead time as much as possible, and the manufacturing cost of the device supply unit 14 can be suppressed as much as possible, and the low-cost device supply unit 14 can be obtained. As shown in FIG. 3 and FIG. 5, in the electronic component transporting device 10 of this embodiment, the length of the electronic component when the electronic component is viewed from a direction orthogonal to the direction of the electronic component when viewed from above is shorter than the 200A from the tray when viewed from above. The length of the recessed portion 201 when the tray 200A is viewed in a direction orthogonal to the direction, and the length of the recessed portion 201 when the tray 200A is viewed from a direction orthogonal to the direction in which the tray 200A is viewed is shorter than the direction from the device supply portion 14 when viewed from the top. The length of the concave portion 141 in the case of the device supply portion 14 is observed in an orthogonal direction. Thereby, the electronic component conveying apparatus 10 which has the above-mentioned advantages can be obtained. In addition, the length of the electronic component (IC device 90) is the same in any of the left-right direction (X direction) and the front-back direction (Y-direction) in FIG. 3. The length of the recess 201 is the same in any of the left-right direction (X direction) and the front-back direction (Y-direction) in FIG. 3. The length of the concave portion 141 is the same in any of the left-right direction (X direction) and the front-back direction (Y-direction) in FIG. 5. As shown in FIG. 2, the electronic component inspection device 1 according to this embodiment includes an electronic component transfer device 10 and further includes an inspection unit 16 for inspecting the electronic components. That is, the electronic component inspection device 1 of this embodiment can be provided with a tray (first mounting member) 200A having a recessed portion (first recessed portion) 201 on which electronic components are placed, and having a device supply portion (second mounting member) ) 14, which has a recessed portion (second recessed portion) 141 on which electronic components are placed; and a device transfer head 13 (transported portion 25), which can transfer electronic components from a tray (first mounting member) 200A to the device supply portion ( 2nd placing member) 14; and an inspection part 16 capable of inspecting electronic parts, where the electronic part is placed in the recessed part (first recessed part) 201 and the center of the recessed part (first recessed part) 201 overlaps with the center of the electronic part in a plan view Gap between the side wall portion 203 of the recessed portion (first recessed portion) 201 and the electronic component (first gap) GP200A And the side wall portion 143 of the recessed portion (second recessed portion) 141 and the electronic component when the electronic component is placed on the recessed portion (second recessed portion) 141 and the center of the recessed portion (second recessed portion) 141 overlaps with the center of the electronic component in plan view. Clearance (2nd interval) GP14 Gap between the two (second interval) GP14 Greater than the gap (1st interval) GP200A . Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component conveying apparatus 10 can be obtained. In addition, the electronic component can be transported to the inspection unit 16, whereby the inspection of the electronic component can be performed by the inspection unit 16. In addition, electronic components after inspection can be transported from the inspection unit 16. Hereinafter, the configuration of each part will be described in detail. As shown in FIG. 1 and FIG. 2, the electronic component inspection device 1 provided with the electronic component transfer device 10 is a device that transfers electronic components such as IC devices such as BGA (Ball Grid Array) packages, and the like. Inspection / test (hereinafter referred to as "inspection") the electrical characteristics of electronic parts during transportation. In addition, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component will be described as a representative, and this IC device will be referred to as an "IC device 90". As shown in FIG. 3 to FIG. 8, in this embodiment, the IC device 90 includes a flat plate-shaped device body 901 and a plurality of terminals 909 formed protruding from the lower surface of the device body 901. The device body 901 is, for example, a square in a plan view, and an electrical circuit (not shown) is built in the device body 901. In this embodiment, as an example, a case where the shape of the device body 901 in a plan view is square will be described. Each terminal 909 is electrically connected to the electrical circuit described above. In addition, as the IC device, for example, "LSI (Large Scale Integration)", "CMOS (Complementary Metal Oxide Semiconductor)", and "CCD (Charge Coupled Device: CMOS)" Charge-coupled device) ", or" module IC ", or" crystal device "," pressure sensor "," inertial sensor (acceleration sensor) "packaged with a plurality of IC device modules , "Gyro sensor", and "fingerprint sensor". The electronic component inspection device 1 (electronic component transfer device 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device recovery area A4, and a tray removal area A5. These areas are separated by respective wall portions as described later. . In addition, the IC device 90 is in the direction of the arrow α.90 The direction passes through each of the tray supply area A1 to the tray removal area A5 in order, and inspection is performed in the inspection area A3 in the middle. As described above, the electronic component inspection device 1 includes the electronic component transfer device 10 including a transfer unit 25 that transfers the IC device 90 through each area, an inspection unit 16 that performs an inspection in the inspection area A3, and a control unit 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal light 400, and an operation panel 700. The side of the electronic component inspection device 1 where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and the side where the inspection area A3 is arranged, that is, the upper side in FIG. 2 is the back side. use. In addition, the electronic component inspection apparatus 1 is called a "replacement jig" which is mounted in advance and replaced with each type of the IC device 90. The replacement jig includes a mounting member on which the IC device 90 is mounted, and the mounting member includes a temperature adjustment section 12, a device supply section 14, and a device recovery section 18 described later. The mounting member on which the IC device 90 is mounted includes a tray 200 prepared by a user, a recycling tray 19, and an inspection unit 16 in addition to the jig replacement as described above. The tray supply area A1 is a material supply section that supplies the tray 200. The tray supply area A1 may also be referred to as a mounting area where a plurality of trays 200 can be stacked and mounted. The tray 200 is a first mounting member having a plurality of recesses (first recesses) 201 in which IC devices (electronic parts) 90 in an unchecked state are placed in advance. Hereinafter, this tray 200 may be referred to as a "tray (supply tray) 200A". The plurality of recesses 201 are arranged in a matrix. As shown in FIG. 3 (the same applies to FIG. 8), each recessed portion 201 includes a bottom portion 202 and a side wall portion 203 standing up from the bottom portion 202. In this embodiment, the opening shape (shape in plan view) of each recessed portion 201 is substantially similar to the shape (square shape) in plan view of the device body 901. The side wall portion 203 has a tapered shape inclined with respect to the bottom portion 202. In addition, the IC devices 90 can be housed and placed in each of the recesses 201. A tray 200 (tray 200A) transported from the tray supply area A1 is arranged in the device supply area A2. The plurality of IC devices 90 on the tray 200 are transported and supplied to the inspection area A3. In addition, tray transfer mechanisms 11A and 11B are provided to move the tray 200 horizontally one by one so as to span the tray supply area A1 and the device supply area A2. The tray conveying mechanism 11A is a part of the conveying section 25, and can make the tray 200 together with the IC device 90 placed on the tray 200 on the positive side of the Y direction, that is, the arrow α in FIG. 211A Move in the direction. Thereby, the IC device 90 can be stably fed into the device supply area A2. In addition, the tray supply mechanism 11B allows the empty tray 200 to be on the negative side of the Y direction, that is, the arrow α in FIG. 211B Moving part moving in the direction. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1. In the device supply area A2, a temperature adjustment section (a temperature holding plate (English description: soap plate, Chinese description (one example): temperature equalizing plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. Also, a device supply unit 14 is provided which moves so as to cross the device supply area A2 and the inspection area A3. The temperature adjustment section 12 is a mounting member having a plurality of recesses (temperature adjustment recesses) 121 on which an IC device (electronic component) 90 is placed, and is referred to as a "temperature holding plate" that can heat or cool the IC device 90 together. . By using the temperature holding plate, the IC device 90 before the inspection by the inspection unit 16 can be heated or cooled in advance, and adjusted to a temperature suitable for inspection (high temperature inspection or low temperature inspection). The plurality of recesses 121 are arranged in a matrix. As shown in FIG. 4, each recessed portion 121 has a bottom portion 122 and a side wall portion 123 standing upright from the bottom portion 122. In the present embodiment, the opening shape (shape in plan view) of each recessed portion 121 is substantially similar to the shape (square shape) in plan view of the device body 901. The side wall portion 123 has a tapered shape inclined with respect to the bottom portion 122, and the IC device 90 can be stored and placed in each recessed portion 121 one by one. In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. The IC devices 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A are transferred to any one of the temperature adjustment units 12. In addition, by fixing the temperature adjustment section 12 as the mounting member, the temperature of the IC device 90 on the temperature adjustment section 12 can be stably adjusted. The temperature adjustment unit 12 is grounded. The device transfer head 13 is a holding portion that holds the IC device 90 and is movably supported in the X direction and the Y direction in the device supply area A2, and is also movably supported in the Z direction. The device transfer head 13 is also a part of the transfer unit 25, and is responsible for transferring the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the temperature adjustment unit 12 and the device supply unit 14 described later. The IC device 90 is transported. When the temperature adjustment of the IC device 90 by the temperature adjustment unit 12 is omitted, the device transfer head 13 may be responsible for transferring the IC device 90 between the tray 200 carried in from the tray supply area A1 and the device supply unit 14. In FIG. 2, the arrow α13X The X-direction movement of the device transfer head 13 is indicated by the arrow α13Y The Y-direction movement of the device transfer head 13 is shown. As shown in FIGS. 3 to 5, the device transfer head 13 has a suction port 131 that opens downward and generates an attractive force. The device transfer head 13 can hold the IC device 90 using the attraction force of the suction port 131. In addition, the device transfer head 13 can release the IC device 90 by releasing the attraction of the suction port 131. As described above, the tray 200A as the first mounting member is a supply tray on which IC devices (electronic components) 90 are placed in advance. The device supply section 14 is a second mounting member having a plurality of recessed portions (second recessed portions) 141 for placing an IC device (electronic component) 90 that is carried from the first mounting member and temperature-adjusted by the temperature adjustment portion 12. The device supply unit 14 which is the second mounting member is movably supported, and is referred to as a "supply shuttle" or simply a "supply shuttle" which can carry the IC device 90 to the vicinity of the inspection unit 16. The device supply section 14 may be a part of the transfer section 25. In addition, as described above, from the tray (first mounting member) 200A to the device supply section (second mounting member) 14 via the temperature adjustment section 12 or the IC device (electronic component) 90 passing through the temperature adjustment section 12 is omitted. The transfer is performed by the device transfer head 13 (the transfer unit 25). The plurality of recesses 141 are arranged in a matrix. As shown in FIG. 5, each recessed portion 141 includes a bottom portion 142 and a side wall portion 143 standing from the bottom portion 142. In this embodiment, the opening shape (shape in plan view) of each recessed portion 141 is substantially similar to the shape (square shape) in plan view of the device body 901. The side wall portion 143 has a tapered shape inclined with respect to the bottom portion 142. In addition, the IC devices 90 can be stored and placed one by one in each of the recesses 141. The device supply unit 14 as the second mounting member may be moved from the device supply area A2 to the inspection area A3, or may be moved in the opposite direction. In this way, the device supply unit 14 can move in the X direction, that is, the arrow ɑ14 The direction is supported to move back and forth between the device supply area A2 and the inspection area A3. Thereby, the device supply section 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection section 16 of the inspection area A3, and can return the IC device 90 to the inspection area A3 again by removing the IC device 90 from the transport head 17. Device supply area A2. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the negative side in the Y direction is sometimes referred to as a “device supply unit 14A”, and the device supply unit on the positive side in the Y direction is sometimes referred to. 14 is referred to as a "device supply unit 14B". The IC device 90 on the temperature adjustment section 12 is transported to the device supply section 14A or the device supply section 14B in the device supply region A2. The device supply unit 14 is preferably configured to heat or cool the IC device 90 placed on the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 temperature-adjusted by the temperature adjustment part 12 can be carried to the vicinity of the inspection part 16 of the inspection area A3 while maintaining the temperature adjustment state. The device supply section 14 is also grounded in the same manner as the temperature adjustment section 12. The tray conveying mechanism 15 is an empty tray 200 in a state where all IC devices 90 have been removed, on the positive side of the X direction in the device supply area A2, that is, the arrow α15 Directional transport agency. After the transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. As described above, the electronic component inspection device 1 (electronic component transfer device 10) includes the inspection area A3. The inspection area A3 is configured as an inspection section 16 in which an IC device (electronic component) 90 can be inspected. The electronic component inspection apparatus 1 includes a device transfer head (inspection transfer section) 17, which is provided in the inspection area A3, and transfers IC devices (electronic components) 90 from the device supply section (second mounting member) 14 to the inspection section 16. . The device transfer head 17 can also be referred to as a part of the transfer unit 25, and can hold the IC device 90 that maintains the above-mentioned temperature adjustment state, and transfer the IC device 90 in the inspection area A3. This device transfer head 17 is supported to be able to move back and forth in the Y direction and the Z direction within the inspection area A3, and is a part of a mechanism called an "indicator arm". Thereby, the device transfer head 17 can transfer and place the IC device 90 on the device supply section 14 carried in from the device supply area A2 and place it on the inspection section 16. In FIG. 2, the Y-direction reciprocating movement of the device transfer head 17 is indicated by an arrow α.17 X Means. In addition, the device transfer head 17 is supported to be capable of reciprocating in the Y direction, but is not limited thereto, and may be supported to be capable of reciprocating in the X direction. In the configuration shown in FIG. 2, two device transfer heads 17 are arranged in the Y direction, and the device transfer head 17 on the negative side in the Y direction is sometimes referred to as a “device transfer head 17A”, and the device on the positive side in the Y direction The transfer head 17 is referred to as a "device transfer head 17B". The device transfer head 17A may be responsible for transferring the IC device 90 from the device supply unit 14A to the inspection unit 16 in the inspection area A3, and the device transfer head 17B may be responsible for transferring the IC device 90 from the device supply unit 14B to the inspection unit 16 in the inspection area A3 Transport. As shown in FIG. 6, the device transfer head 17 has a suction port 171 which is opened downward and generates an attractive force. The device transfer head 17 can hold the IC device 90 by using the attraction force of the suction port 171. In addition, the device transfer head 17 can release the IC device 90 by releasing the attraction of the suction port 171. The device transfer head 17 is preferably configured to heat or cool the held IC device 90 in the same manner as the temperature adjustment unit 12. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained from the device supply section 14 to the inspection section 16. An inspection section 16 for inspecting an IC device (electronic component) 90 placed behind the device supply section (second placing member) 14 may be disposed in the inspection area A3. The inspection section 16 is a mounting member having a plurality of recessed portions (inspection recessed portions) 161 on which the IC device (electronic component) 90 is mounted, and the electrical characteristics of the IC device 90 are checked. The plurality of recesses 161 are arranged in a matrix. As shown in FIG. 6, each recessed portion 161 has a bottom portion 162 and a side wall portion 163 standing upright from the bottom portion 162. In this embodiment, the opening shape (shape in plan view) of each recessed portion 161 is substantially similar to the shape (square shape) in plan view of the device body 901. The side wall portion 163 has a tapered shape inclined with respect to the bottom portion 162. In addition, the IC devices 90 can be stored and placed one by one in each of the recesses 161. In addition, a plurality of probe pins 169 electrically connected to the terminal 909 of the IC device 90 are provided at the bottom 162. And, the terminal 909 of the IC device 90 and the probe pin 169 are electrically connected, that is, in contact, so that the inspection of the IC device 90 can be performed. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a tester connected to the inspection section 16. The inspection unit 16 preferably heats or cools the IC device 90 in the same manner as the temperature adjustment unit 12, and can adjust the IC device 90 to a temperature suitable for inspection. As shown in FIG. 2, the electronic component inspection apparatus 1 includes an imaging unit 26 that captures and holds an IC device (electronic component) 90 that is held by a device transfer head (inspection transfer unit) 17. The imaging unit 26 is configured by various cameras such as a CCD (Charge Coupled Device) camera or a 3-dimensional camera, and the imaging direction is provided upward, that is, on the positive side in the Z direction. The location of the imaging unit 26 is not particularly limited, and it may be, for example, on or near the inspection unit 16. Thereby, when the IC device 90 held by the device transfer head 17 passes through the imaging unit 26, each terminal 909 of the IC device 90 can be imaged together from the lower side. In addition, position information of each terminal 909 of the IC device 90 is stored in the control unit 800 in advance. The position information is position information of each terminal 909 of the IC device 90 held on the device transfer head 17 to be in contact with each of the probe pins 169 of the inspection section 16. The control section 800 compares the position information with the imaging result of the imaging section 26 based on the position information, that is, compares the position information with the imaging result, and can detect what is the current position deviation between the terminal 909 and the contact with the probe pin 169 The degree, that is, the position difference (position deviation amount) of the terminal 909. In addition, if the device transfer head 17 is corrected and moved by the difference, it is possible to make sure that the terminals 909 of the IC device 90 held on the device transfer head 17 and the probe pins 169 of the inspection unit 16 are in contact with each other. The IC device (electronic component) 90 is placed on the inspection section 16. The number of the imaging units 26 is not limited to one, and may be plural. In this case, it is possible to synthesize the captured images captured by the imaging units 26 and calculate the correction amount of the device transfer head 17 based on the captured images. The device recovery area A4 is an area recovered from the plurality of IC devices 90 inspected in the inspection area A3 and the inspection is completed. In this device recovery area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. A device recovery unit 18 is also provided that moves across the inspection area A3 and the device recovery area A4. An empty tray 200 is also provided in the device recovery area A4. The device recovery section 18 is a third mounting member having a plurality of recessed portions (third recessed portions) 181 on which the IC device (electronic component) 90 that is placed in the inspection portion 16 and inspected is completed. The third collection member, that is, the device recovery unit 18 is movably supported, and is referred to as a "recycling shuttle" or simply "recycling shuttle" that can transfer the IC device 90 to the device recovery area A4. The device recovery section 18 may be a part of the transport section 25. The plurality of recesses 181 are arranged in a matrix. As shown in FIG. 7, each recessed portion 181 has a bottom portion 182 and a side wall portion 183 standing upright from the bottom portion 182. In this embodiment, the opening shape (shape in plan view) of each recessed portion 181 is substantially similar to the shape (square shape) in plan view of the device body 901. The side wall portion 183 has a tapered shape inclined with respect to the bottom portion 182. In addition, the IC devices 90 can be stored and placed one by one in each of the recesses 181. The device recovery unit 18 as the third mounting member may be an arrow α in the X direction.18 The direction is supported to move back and forth between the inspection area A3 and the device recovery area A4. In the configuration shown in FIG. 2, two device recovery units 18 are arranged in the Y direction similarly to the device supply unit 14. The device recovery unit 18 on the negative side in the Y direction is referred to as a “device recovery unit 18A”, and Y The device recovery section 18 on the positive side is referred to as a “device recovery section 18B”. The IC device 90 on the inspection unit 16 is transported and placed in the device recovery unit 18A or the device recovery unit 18B. In addition, the transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18A is performed by the device transfer head 17A, and the transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18B is performed by the device transfer head 17B. The device recovery unit 18 is also grounded in the same manner as the temperature adjustment unit 12 and the device supply unit 14. The recycling tray 19 is a mounting member for mounting the IC device 90 that has been inspected by the inspection section 16 and is placed and transported to the device recovery section 18, and is fixed so as not to move within the device recovery area A4. Thereby, even in the recovery area A4 in which various movable parts such as a large number of device transfer heads 20 are arranged, the IC devices 90 that have been inspected are stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged in the X direction. As the recovery tray 19, a tray 200 may be used. Three empty trays 200 are also arranged in the X direction. The empty tray 200 has a plurality of recessed portions (fourth recessed portions) in which IC devices (electronic parts) 90 are placed after being inspected by the inspection portion 16 and placed and transported to the device recovery portion (third placing member) 18. ) The fourth mounting member of 201. Hereinafter, this tray 200 may be referred to as a "tray (recycling tray) 200B" in some cases. In addition, similar to the tray 200B, the collection tray 19 may be referred to as a "fourth placing member". Hereinafter, the tray 200B will be representatively described as the fourth mounting member. As described above, the device collection unit 18 as the third mounting member is a collection shuttle that is movably supported. In addition, the IC device 90 moved to the device recovery section 18 in the device recovery area A4 is transported and placed on any of the trays 200B (or any of the recovery trays 19), which is the fourth placement member. As a result, the IC devices 90 are sorted and recovered according to the results of each inspection. In this way, the tray 200B, which is the fourth placing member, is a collection tray that finally sorts, places, and recovers the IC devices (electronic parts) 90. The device transfer head 20 includes a portion that can be moved in the X direction and the Y direction in the device recovery area A4 and can also be moved in the Z direction. The device transfer head 20 is a part of the transfer unit 25 and can transfer the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the X-direction movement of the device transfer head 20 is indicated by an arrow α.20 X Indicates that the Y-direction movement of the device transfer head 20 is indicated by the arrow α20Y Means. As shown in FIGS. 7 and 8, the device transfer head 20 has a suction port 2001 which is opened downward and generates an attractive force. The device transfer head 20 can hold the IC device 90 by the attraction force of the suction port 2001. In addition, the device transfer head 13 can release the IC device 90 by releasing the attraction of the suction port 2001. The tray transfer mechanism 21 is an empty tray 200 that is carried in from the tray removal area A5 in the X direction, that is, the arrow α in the collection area A4.twenty one Directional transport agency. In addition, after the transfer, the empty tray 200 is disposed at a position where the IC device 90 is collected, that is, it may be any of the three empty trays 200 described above. The tray removal area A5 is a material removal section that collects and removes the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, a tray transfer mechanism 22A and a tray transfer mechanism 22B for transferring the tray 200 one by one in the Y direction are provided so as to span the device recovery area A4 and the tray removal area A5. The tray conveying mechanism 22A is a part of the conveying section 25, and can make the tray 200 in the Y direction, which is the arrow α22A Moving part moving in the direction back and forth. Thereby, the completed IC device 90 can be transferred from the device recovery area A4 to the tray removal area A5. In addition, the tray transfer mechanism 22B can place the empty tray 200 for recovering the IC device 90 on the positive side of the Y direction, which is the arrow α.22B Move in the direction. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4. The control unit 800 can control, for example, the operations of the following parts: the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the device transfer mechanism 15, the inspection unit 16, the device transfer head 17, The device recovery unit 18, the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, the tray transfer mechanism 22B, the imaging unit 26, and the like. The operator can set and confirm the operating conditions and the like of the electronic component inspection apparatus 1 through the monitor 300. The monitor 300 includes, for example, a display screen 301 composed of a liquid crystal screen, and is arranged on an upper portion of the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, on the right side in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse is provided. This mouse is used when operating a screen displayed on the monitor 300. An operation panel 700 is disposed on the monitor 300 in the lower right of FIG. 1. The operation panel 700 is separate from the monitor 300 and instructs the electronic component inspection apparatus 1 to a desired operator. In addition, the signal lamp 400 can report the operation state of the electronic component inspection device 1 and the like by a combination of light emitting colors. The signal lamp 400 is arranged on the upper part of the electronic component inspection apparatus 1. In addition, a speaker 500 is built into the electronic component inspection device 1. The speaker 500 may also be used to report the operating state of the electronic component inspection device 1. The electronic component inspection device 1 is partitioned between the tray supply area A1 and the device supply area A2 by a first partition 231, and is separated by a second partition 232 between the device supply area A2 and the inspection area A3, and is partitioned by a third partition 233 A fourth partition 234 separates the inspection area A3 and the device recovery area A4 from the device recovery area A4 and the tray removal area A5. The device supply region A2 and the device recovery region A4 are also separated by a fifth partition plate 235. The outermost part of the electronic component inspection device 1 is covered by a cover, and the cover includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245. As shown in FIG. 3, the IC device 90 is placed on the recess 201 of the tray 200A. In addition, if the center of the recessed portion 201 and the center of the IC device 90 overlap when positioned in a plan view, that is, when the IC device 90 is centered in the recessed portion 201, the side wall portion 203 of the recessed portion 201 and the device body 901 of the IC device 90 A gap (first interval) is formed between the edge portion (side surface) 902200A . Clearance GP200A Any of the left-right direction (X direction) and the front-back direction (Y-direction) in FIG. 3 is the same. "Gap GP200A "" Means a portion having a minimum distance between the side wall portion 203 of the recessed portion 201 and the edge portion 902 of the IC device 90. By forming the gap GP200A It is easy to take out and put the IC device 90 into the recess 201. As shown in FIG. 4, the IC device 90 is placed on the recessed portion 121 of the temperature adjustment portion 12. In addition, if the center of the recessed portion 121 and the center of the IC device 90 overlap when positioned in a plan view, that is, when the IC device 90 is centered in the recessed portion 121, the side wall portion 123 of the recessed portion 121 and the device body 901 of the IC device 90 A gap GP is formed between the edges 90212 . Clearance GP12 Any one of the left-right direction (X direction) and the front-back direction (Y-direction) in FIG. 4 is the same. "Gap GP12 "" Means a portion having a minimum distance between the side wall portion 123 of the recessed portion 121 and the edge portion 902 of the IC device 90. By forming the gap GP12 It is easy to take out and put the IC device 90 into the recess 121. As shown in FIG. 5, the IC device 90 is placed on the recessed portion 141 of the device supply portion 14. Moreover, if the center of the recessed part 141 overlaps with the center of the IC device 90 in a plan view, that is, when the IC device 90 is centered in the recessed part 141, the side wall part 143 of the recessed part 141 and the device body 901 of the IC device 90 A gap (second interval) is formed between the edge portions 90214 . Clearance GP14 Both the left-right direction (X direction) and the front-rear direction (Y-direction) in FIG. 5 are the same. "Gap GP14 "" Means a portion having a minimum distance between the side wall portion 143 of the recessed portion 141 and the edge portion 902 of the IC device 90. By forming the gap GP14 It is easy to take in / out the IC device 90 from the recess 141. As shown in FIG. 6, the IC device 90 is placed on the recessed portion 161 of the inspection portion 16. As described above, the placement of the inspection section 16 by the IC device 90 can be compared with the position information of each terminal 909 of the IC device 90 and the imaging result of the imaging section 26 to detect the difference between the above positions of the terminals 909 and the difference This is achieved by moving the device transfer head 17. Furthermore, if the center of the recessed portion 161 overlaps with the center of the IC device 90 in a plan view, that is, when the IC device 90 is centered within the recessed portion 161, the side wall portion 163 of the recessed portion 161 and the device body 901 of the IC device 90 A gap GP is formed between the edges 90216 . Clearance GP16 Any of the left-right direction (X direction) and the front-back direction (Y-direction) in FIG. 6 is the same. "Gap GP16 "" Means a portion having a minimum distance between the side wall portion 163 of the recessed portion 161 and the edge portion 902 of the IC device 90. By forming the gap GP16 It is easy to take in / out the IC device 90 from the recess 161. As shown in FIG. 7, the IC device 90 is placed on the recessed portion 181 of the device recovery portion 18. In addition, if the center of the recessed portion 181 overlaps with the center of the IC device 90 in plan view, that is, when the IC device 90 is centered within the recessed portion 181, the side wall portion 183 of the recessed portion 181 and the device body 901 of the IC device 90 A gap (third interval) is formed between the edge portions 90218 . Clearance GP18 Any one of the left-right direction (X direction) and the front-back direction (Y-direction) in FIG. 7 is the same. "Gap GP18 "" Means a portion having a minimum distance between the side wall portion 183 of the recessed portion 181 and the edge portion 902 of the IC device 90. By forming the gap GP18 It is easy to take in / out the IC device 90 from the recess 181. As shown in FIG. 8, the IC device 90 is placed on the recess 201 of the tray 200B. In addition, if the center of the recessed portion 201 and the center of the IC device 90 overlap when positioned in a plan view, that is, when the IC device 90 is centered in the recessed portion 201, the side wall portion 203 of the recessed portion 201 and the device body 901 of the IC device 90 A gap (fourth interval) is formed between the edge portions 902200B . Clearance GP200B Both the left-right direction (X direction) and the front-rear direction (Y-direction) in FIG. 8 are the same. "Gap GP200B "" Means a portion having a minimum distance between the side wall portion 203 of the recessed portion 201 and the edge portion 902 of the IC device 90. By forming the gap GP200B It is easy to take out and put the IC device 90 into the recess 201. The above positioning states are used to specify the gap GP200A Gap GP12 Gap GP14 Gap GP16 Gap GP18 , And clearance GP200B This state is different from the placement state of the IC device 90 with respect to each recess when the IC device 90 is transported in actual production. An example of this mounting state is shown in FIG. 9. As shown in FIG. 9, when the IC device 90 is transported by the device transfer head 13 and placed on the recessed portion 141 of the device supply portion 14, the recessed portion 141 may be in a biased state near the left side in the figure. Such a biased state may also occur in the recessed portion 201 of the tray 200A, the recessed portion 121 of the temperature adjustment portion 12, the recessed portion 161 of the inspection portion 16, the recessed portion 181 of the device recovery portion 18, and the recessed portion 201 of the tray 200B. In addition, each of the above-mentioned positioning states is a state where the center of each recessed portion overlaps with the center of the IC device 90 in plan view, and the degree of overlap includes, of course, exactly the same, and includes, for example, an allowable error (for specifying the GP200A Gap GP12 Gap GP14 Gap GP16 Gap GP18 , And clearance GP200B Sufficiency). Moreover, the sizes of these gaps are different. For gap GP200A Gap GP12 Gap GP14 Gap GP16 Gap GP18 , And clearance GP200B The relationship between the magnitude and the effect and effect of satisfying the magnitude relationship will be described with reference to FIGS. 3 to 12. As shown in FIG. 3 and FIG. 5, a side wall portion of a recessed portion (first recessed portion) 201 when an IC device (electronic component) 90 is placed on a recessed portion (first recessed portion) 201 of a tray (first placing member) 200A. Gap between 123 and IC device (electronic component) 90 (first gap) GP200A And the side wall portion of the recessed portion (second recessed portion) 141 in the case where the IC device (electronic component) 90 is placed on the recessed portion (second recessed portion) 141 of the device supply portion (second mounting member) 14 shown in FIG. 5 Gap between 143 and IC device (electronic component) 90 (second interval) GP14 Gap between the two (second interval) GP14 Greater than the gap (1st interval) GP200A . In this way, "Gap GP14 > Clearance200A "Relationship. Therefore, when the IC device 90 is omitted from the tray 200A and transferred to the device supply section 14 through the temperature adjustment section 12, the IC device 90 originally located in the recess 201 of the tray 200A is transferred to an opening area larger than that of the recess 201. Since the recessed portion 141 of the device supply portion 14 can be easily entered into the recessed portion 141, jamming can be prevented. Therefore, when machining the recessed portion 141 of the device supply portion 14 by machining (such as cutting or laser processing), the machining accuracy can be set with the machining accuracy relaxed. Thereby, the device supply unit 14 can be manufactured and delivered with a short lead time as much as possible, and the manufacturing cost of the device supply unit 14 can be suppressed as much as possible, and the low-cost device supply unit 14 can be obtained. The term “clogged” refers to a state in which the IC device 90 cannot be removed from or inserted into the concave portion 141. In addition, the gap GP14 > Clearance200A Gap GP14 Gap, for example, is preferred200A 1.1 times to 10 times, more preferably 2 times to 5 times. Depth d of the recessed portion (second recessed portion) 141 of the device supply portion 1414 Less than the thickness (maximum thickness) t of the IC device (electronic parts) 9090 . Therefore, although it depends on the structure of the device transfer head 13, when the device transfer head 13 approaches the IC device 90 in the recess 141 of the device supply section 14 and holds the IC device 90, the device transfer head 13 and the device can be prevented. Interference from the supply unit 14. Also, the depth d14 It is not specifically limited, For example, thickness t is preferable90 0.2 times or more and 0.9 times or less, and more preferably 0.5 times or more and 0.7 times or less. As described above, the electronic component inspection device 1 (electronic component transfer device 10) includes a temperature adjustment section 12 having an IC device (electronic component) on which it is placed. The recessed portion (temperature adjustment recessed portion) 121 of 90 adjusts the temperature of the IC device (electronic component) 90. In addition, as shown in FIGS. 4 and 5, the gap (second interval) GP14 The gap (gap) between the side wall portion 123 of the recessed portion (temperature-adjusting recessed portion) 121 and the IC device (electronic component) 90 is larger than the recessed portion (temperature-adjusted recessed portion) 121 where the IC device (electronic component) 90 is placed12 . In this way, "Gap GP14 > Clearance GP12 "Relationship. Therefore, when the IC device 90 is transferred from the tray 200A to the device supply section 14 through the temperature adjustment section 12, the IC device 90 originally located in the recess 121 of the temperature adjustment section 12 is transported to a device having an opening area larger than the recess 121. The concave portion 141 of the supply portion 14 is easier to enter. In addition, the gap GP14 > Clearance GP12 Gap GP14 Gap is preferred, for example12 1.1 times to 5 times, more preferably 1.2 times to 2 times. As shown in FIGS. 3 and 4, the side wall portion 123 of the recessed portion (temperature-adjusting recessed portion) 121 and the IC device (electronic component) when the IC device (electronic component) 90 is placed on the recessed portion (temperature-adjusting recessed portion) 121. Gap (interval) of 90 GP12 Greater than the gap (1st interval) GP200A . In this way, "Gap GP12 > Clearance GP200A "Relationship. Therefore, when the IC device 90 is transferred from the tray 200A to the device supply section 14 through the temperature adjustment section 12, the IC device 90 originally located in the recess 201 of the tray 200A is transferred to the temperature adjustment section having an opening area larger than the recess 201. The recessed part 121 of 12 makes it easier to enter 121. Therefore, when machining the recessed portion 121 of the temperature adjustment portion 12 by machining (such as cutting or laser processing), it is possible to relax the setting and process the recessed portion 121 accurately. Thereby, the temperature adjustment part 12 can be manufactured and delivered with a short lead time as much as possible, and the manufacturing cost of the temperature adjustment part 12 can be suppressed as much as possible, and the low temperature temperature adjustment part 12 can be obtained. In addition, the gap GP12 > Clearance GP200A Gap GP12 Gap is preferred, for example200A 1.1 times to 5 times, more preferably 1.2 times to 3 times. The depth d of the recessed portion 12112 Preferably less than thickness t90 , For example thickness t90 0.2 times to 0.9 times, more preferably 0.5 times to 0.7 times. As described above, the inspection section 16 includes the recessed portion (inspection recessed portion) 161 on which the IC device (electronic component) 90 is placed. As shown in FIGS. 5 and 6, the gap (second interval) GP14 Gap (gap) larger than the side wall portion 163 of the recessed portion (inspection recessed portion) 161 when the IC device (electronic component) 90 is placed GP16 . In this way, "Gap GP14 > Clearance GP16 "Relationship. In addition, the gap GP14 Gap is preferred, for example16 1.1 times to 10 times, more preferably 5 times to 10 times. As shown in FIGS. 3 and 6, the gap (first interval) GP200A Gap (gap) larger than the side wall portion 163 of the recessed portion (inspection recessed portion) 161 when the IC device (electronic component) 90 is placed GP16 . In this way, "Gap GP200A > Clearance GP16 "Relationship. In addition, the gap GP200A Gap is preferred, for example16 1.1 times to 5 times, more preferably 2 times to 5 times. With this, the gap GP200A Gap GP12 Gap GP14 , And clearance GP16 Gap16 As a minimum, the IC device 90 can be accurately positioned in the recessed portion 161 when the IC device 90 is transported to the inspection portion 16. By this positioning, each terminal 909 of the IC device 90 can be brought into contact with each probe pin 169 disposed in the recessed portion 161, so that the inspection of the IC device 90 can be performed correctly. The depth d of the inspection section 1616 It is not specifically limited, For example, thickness t is preferable90 0.2 times to 0.9 times, more preferably 0.5 times to 0.7 times. As described above, the inspection section 16 for inspecting the IC device (electronic component) 90 mounted on the device supply section (second mounting member) 14 may be disposed in the inspection area A3. In addition, the electronic component inspection device 1 (electronic component transfer device 10) includes a device recovery section (third mounting member) 18, and includes a plurality of recessed sections (for mounting an IC device (electronic component) 90 inspected by the inspection section 16) Third concave portion) 181. In addition, a tray (fourth placement member) 200B is disposed in the device recovery area A4, and has a plurality of IC devices (electronic parts) 90 to be placed after being placed in the device recovery section (third placement member) 18. Recessed portions (fourth recessed portions) 201. As shown in FIGS. 7 and 8, the IC device (electronic component) 90 is placed on the recessed portion (third recessed portion) 181 of the device recovery portion 18 and the center of the recessed portion (third recessed portion) 181 and the IC device (electronics) are viewed in plan view. (Parts) 90 center position overlap state (3rd recessed part) 181 side wall part 183 and IC device (electronic part) 90 gap (third interval) GP18 And a recessed portion in a state where an IC device (electronic component) 90 is placed on the recessed portion (fourth recessed portion) 201 and the center of the recessed portion (fourth recessed portion) 201 overlaps with the center of the IC device (electronic component) 90 in plan view (Fourth recessed part) Gap (fourth interval) between side wall part 203 of 201 and IC device (electronic component) 90 GP200B Gap between the two (4th interval) GP200B Greater than the gap (3rd interval) GP18 . In this way, "Gap GP200B > Clearance GP18 "Relationship. Therefore, when the IC device 90 is transferred from the device recycling section 18 to the tray 200B, the IC device 90 originally located in the recess 181 of the device recycling section 18 is transferred to the recess 201 of the tray 200B having an opening area larger than the recess 181. Therefore, the recess 201 can be easily entered. The depth d of the device recovery section 1818 It is not specifically limited, For example, thickness t is preferable90 0.2 times to 0.9 times, more preferably 0.5 times to 0.7 times. As shown in FIGS. 6 and 7, the “gap GP18 > Clearance GP16 "Relationship. Accordingly, when the IC device 90 is transferred from the inspection section 16 to the device recovery section 18, the IC device 90 in the recessed section 161 of the inspection section 16 is transported to the recessed section 181 of the device recovery section 18 having an opening area larger than the recessed section 161. The recess 181 is easily accessible. Therefore, when machining the recessed portion 181 of the device recovery portion 18 by machining (such as cutting or laser processing), it is possible to relax and set the machining accuracy to perform the machining. Thereby, the device recycling part 18 can be manufactured and delivered with a short lead time as much as possible, and the manufacturing cost of the device recycling part 18 can be suppressed as much as possible, and the low-cost device recycling part 18 can be obtained. Gap (second interval) GP14 Clearance (1st interval) GP200A The difference is greater than the gap (4th interval) GP200B Clearance (3rd interval) GP18 Difference. With this, the gap GP200A With gap GP200B By setting the same size, the common tray 200 can be used as the tray 200A and the tray 200B. For example, when the device body 901 of the IC device 90 is a square with one side of 5 mm in plan view, the size relationship between the gaps is preferably the size relationship shown in FIG. 10. In the chart shown in Figure 10, GP200A 0.2 mm, GP12 0.6 mm, GP14 1.0 mm, GP16 0.1 mm, GP18 0.15 mm, GP200B 0.2 mm. For example, when the device body 901 of the IC device 90 is a square with a side of 10 mm in plan view, the size relationship between the gaps is preferably a size relationship as shown in FIG. 11. In the chart shown in Figure 11, GP200A 0.3 mm, GP12 0.6 mm, GP14 1.0 mm, GP16 0.1 mm, GP18 0.2 mm, GP200B 0.3 mm. For example, when the device body 901 of the IC device 90 is a square with one side being 20 mm in plan view, the size relationship between the gaps is preferably a size relationship as shown in FIG. 12. In the chart shown in Figure 12, GP200A 0.5 mm, GP12 0.8 mm, GP14 1.0 mm, GP16 0.1 mm, GP18 0.2 mm, GP200B Is 0.5 mm. <Second Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. Instructions. This embodiment is the same as the first embodiment except that the configuration of the temperature adjustment section is different. As shown in FIG. 13, in this embodiment, the temperature adjustment section 12 includes a plate-shaped base portion 124 and a thin plate portion 126 that is thinner than the base portion 124 and has a plurality of openings 125. The base 124 is a metal plate made of, for example, aluminum. A plurality of drilled holes 124 a are formed in the base portion 124. A bolt 128 can be inserted into each hole 124a. Thereby, the base portion 124 can be fixed via the bolt 128. In addition, two guide pins 127 are press-fitted into the base portion 124. The two guide pins 127 are arranged as far apart as possible in the Y direction. The thin plate portion 126 is a metal plate that is thinner than the base portion 124 and is made of, for example, stainless steel. As the thickness t of the thin plate portion 126126 It is not particularly limited, but it is preferably, for example, 1 mm or more and 2 mm or less, and more preferably 1 mm or more and 1.2 mm or less. A plurality of openings 125 are formed through the thin plate portion 126. These openings 125 are arranged in a matrix, and constitute a recess 121 for housing and placing the IC device 90 in a state where the thin plate portion 126 and the base portion 124 overlap. In addition, two guide holes 126a are formed through the thin plate portion 126. By inserting each guide hole 126a into each guide pin 127 on the base portion 124, the positioning of the base portion 124 and the thin plate portion 126 is completed in a state where the thin plate portion 126 and the base portion 124 overlap. As described above, in the temperature adjustment section 12, the guide pin 127 and the guide hole 126 a become positioning portions for positioning the base portion 124 and the thin plate portion 126. Moreover, the correct assembly of the base portion 124 and the thin plate portion 126 can be performed by this positioning. Such a thin plate portion 126 is prepared according to the type of the IC device 90, for example, the size of the plurality of openings 125 or the arrangement state of the openings 125 is different. The thin plate portion 126 can be attached to and detached from the base portion 124. Thereby, the thin-plate portion 126 can be replaced and used according to the type of the IC device 90. In addition, since the thin plate portion 126 is a thinner metal plate than the base portion 124, the processing of the opening 125 is facilitated, whereby a variety of thin plate portions 126 can be prepared according to the type of the IC device 90. <Third Embodiment> Hereinafter, this embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to Figs. Matters are omitted from the description. This embodiment is the same as the first embodiment except that the respective components of the device supply section and the device recovery section are different. Since the configuration of the device supply unit is the same as that of the device recovery unit, a representative configuration of the device supply unit will be described. As shown in FIG. 14, in this embodiment, the device supply section (second mounting member) 14 includes a plate-shaped base portion 3 and a thin plate portion 4 that is thinner than the base portion 3 and has an opening 41. Thereby, as described later, since the thin plate portion 4 is thinner than the base portion 3, the processing of the opening 41 is facilitated, whereby a plurality of types of thin plate portions 4 can be prepared according to the type of the IC device 90. In addition, as shown in FIGS. 16 to 18, the device supply unit 14 is disposed on a support substrate 28 supported by a linear guide 27 in a reciprocating manner in the Y direction. The base 3 is a metal plate made of, for example, aluminum. As shown in FIG. 16, a hole 31 is formed through the base 3. In addition, a bolt 32 can be inserted into each hole 31. Thereby, the base part 3 can be fixed to the support substrate 28 via the bolt 32. In addition, although two holes 31 are formed in the Y direction in the structure of FIG. 14, they are not limited to this. As shown in FIG. 18, two guide pins 33 are press-fitted into the base 3. The two guide pins 33 are arranged as far apart as possible in the X direction (see FIG. 14). The thin plate portion 4 is a metal plate made of, for example, stainless steel, which is thinner than the base portion 3. As the thickness t of the thin plate portion 44 It is not particularly limited, but it is preferably, for example, 0.2 mm or more and 2 mm or less, and more preferably 0.4 mm or more and 0.8 mm or less. As shown in FIG. 17, a plurality of openings 41 are formed through the thin plate portion 4. These openings 41 are arranged in a matrix (refer to FIGS. 14 and 15), and constitute a recessed portion 141 for accommodating and placing the IC device 90 in a state where the thin plate portion 4 and the base portion 3 overlap. In addition, as shown in FIG. 16, a hole 42 is formed in the thin plate portion 4 so that the head (screw head) 321 of the bolt 32 to which the base portion 3 is fixed to the support substrate 28 protrudes. This prevents the bolts 32 from interfering with the thin plate portion 4 in a state where the thin plate portion 4 is superposed on the base portion 3, thereby stably placing the thin plate portion 4 on the base portion 3. As shown in FIG. 18, two guide holes 43 are formed through the thin plate portion 4. By inserting each guide hole 43 into each guide pin 33 on the base portion 3, the positioning of the base portion 3 and the thin plate portion 4 is completed in a state where the thin plate portion 4 and the base portion 3 overlap. In this way, the device supply section (second mounting member) 14 becomes a person having a positioning section configured by the guide pin 33 and the guide pin 33 to perform positioning of the base portion 3 and the thin plate portion 4. Moreover, the correct assembly of the base portion 3 and the thin plate portion 4 can be performed by this positioning. Such a thin plate portion 4 is prepared, for example, depending on the type of the IC device 90, a plurality of openings 41 having different sizes or different arrangement states of the openings 41. The thin plate portion 4 can be attached to and detached from the base portion 3. Thereby, the thin plate portion 4 can be placed on the base portion 3 which is replaced and used according to the type of the IC device 90. In addition, since the thin plate portion 4 is a thinner metal plate than the base portion 3, the processing of the opening 41 becomes easy. Thereby, various types of thin plate portions 4 can be prepared according to the type of the IC device 90. The thin plate portion 4 is attached and detached by operating two knurled screws (bolts) 44. A small hole 45 (see FIG. 15) through which the male thread portion 441 of each knurled screw 44 is inserted is formed in the thin plate portion 4, and a large hole 46 (see FIG. 15) that communicates with the small hole 45, that is, is connected to the small hole 45. 15). The large hole 46 is located on the negative side in the X direction with respect to the small hole 45 and has a larger outer diameter than the head (screw head) 442 of the knurled screw 44. Thereby, the head 442 of the knurled screw 44 protrudes from the large hole 46. In addition, if the thin plate portion 4 is to be fixed to the base portion 3, the outer thread portion 441 of the knurled screw 44 may be inserted into the small hole 45, and the knurled screw 44 may be tightened (see FIG. 18). In order to detach the thin plate portion 4 from the base portion 3, for example, the knurled screw 44 only loosens the protruding amount of the guide pin 33, and the thin plate portion 4 is lifted by the above protruding amount, and in this state, it is directed to the positive side in the X direction. mobile. As a result, the head 442 of the knurled screw 44 is located in the large hole 46. Furthermore, the thin plate portion 4 can be detached from the base portion 3 by further lifting the thin plate portion 4. <Fourth Embodiment> Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 19 to 27. FIG. 19 is a plan view showing the structure of the IC processing machine 2 as an electronic component inspection device constituting the electronic component transfer device of the present embodiment. The IC processing machine 2 includes a base 5, a safety cover 6, a high-temperature chamber 7, a supply robot 8, a recovery robot 9, a first shuttle 47, a second shuttle 48, and a plurality of conveyor belts C1 to C6. Each element is mounted on the upper surface of the base 5. The safety cover surrounds a large area of the base 5, and a supply robot 8, a collection robot 9, a first shuttle 47, and a second shuttle 48 are housed inside the safety cover. The plurality of conveyor belts C1 to C6 are provided on the base 5 such that one end portion thereof is located outside the safety cover 6 and the other end is located inside the safety cover 6. Each of the conveyor belts C1 to C6 will carry the tray 200 containing IC devices T such as semiconductor wafers as electronic parts from the outside of the safety cover 6 to the inside of the safety cover 6. Conversely, the tray 200 will be moved from the inside of the safety cover 6. It is transported outside the safety cover 6. The supply robot 8 is composed of an X-axis frame FX, a first Y-axis frame FY1, and a supply-side robot unit 49. The collection robot 9 is composed of an X-axis frame FX, a second Y-axis frame FY2, and a collection-side robot unit 51. The X-axis frame FX is arranged in the X direction. The first Y-axis frame FY1 and the second Y-axis frame FY2 are arranged parallel to each other in the Y direction, and are supported to be movable in the X direction with respect to the X-axis frame FX. In addition, the first Y-axis frame FY1 and the second Y-axis frame FY2 are moved back and forth along the X-axis frame FX in the X direction by respective motors (not shown) provided in the X-axis frame FX. A supply-side robot unit 49 is supported below the first Y-axis frame FY1 so as to be movable in the Y direction. The supply-side robot arm unit 49 reciprocates in the Y direction along the first Y-axis frame FY1 by each motor (not shown) provided in the first Y-axis frame FY1. The supply-side robot unit 49 supplies, for example, the IC device T stored before the inspection of the tray 200 of the conveyor belt C1 to the first shuttle 47. A recovery-side robot unit 51 is supported below the second Y-axis frame FY2 so as to be movable in the Y direction. The recovery-side robot arm unit 51 reciprocates in the Y direction along the second Y-axis frame FY2 by each motor (not shown) provided in the second Y-axis frame FY2. Further, the collection-side robot unit 51 supplies, for example, the IC device T supplied to the first shuttle 47 after inspection to the tray 200 of the conveyor belt C6. A first guide rail 30A and a second guide rail 30B are arranged on the upper surface of the base 5 between the supply robot 8 and the recovery robot 9 in parallel with the X direction, respectively. A first shuttle 47 capable of reciprocating in the X direction is provided on the first guide rail 30A. A second shuttle 48 is provided on the second rail 30B so as to be capable of reciprocating in the X direction. The first shuttle 47 includes a substantially plate-shaped base member 47A that is long in the X direction. A rail bearing (not shown) is provided on the bottom surface of the base member 47A, and the rail bearing is in sliding contact with the first rail 30A. Then, the first shuttle motor M1 (see FIG. 26) provided on the first shuttle 47 moves back and forth along the first guide rail 39A. On the left side (supply robot 8 side) of the upper surface of the base member 47A, the supply-side mounting portion 57 is fixedly exchangeable with screws or the like. Further, on the right side of the upper surface of the base member 47A (the side of the recovery robot 9), a recovery side mounting portion 34 that is the same as the supply side mounting portion 57 is fixedly replaceable with screws or the like, and the recovery side mounting portion 34 and the supply side The mounting section 57 similarly mounts the IC device T. The second shuttle 48 includes a substantially plate-shaped base member 48A that is long in the X direction. A rail bearing (not shown) is provided on the bottom surface of the base member 48A, and the rail bearing is in sliding contact with the second rail 30B. Then, the second shuttle motor M2 (see FIG. 26) provided on the second shuttle 48 moves back and forth along the second guide rail 30B. On the left side (supply robot 8 side) of the upper surface of the base member 48A, the same supply-side mounting portions 57 as those provided on the base member 47A are exchangeably fixed with screws or the like, and ICs are mounted on the respective supply-side mounting portions 57. Device T. Further, on the right side of the upper surface of the base member 48A (the side of the recovery robot 9), the IC-side device T is mounted on the recovery-side mounting portion 34 which is the same as the supply-side mounting portion 57 by screws or the like. FIG. 20 is a plan view showing the structure of the shuttles 47 and 48 in this embodiment, and FIG. 21 is a front view showing the structure of the shuttles 47 and 48 in this embodiment. As shown in FIG. 20, in the center of the upper surface of each shuttle 47, 48, the first and second shuttle cameras 37 and 38 constituting the first camera are mounted on the upper side, respectively. Each of the shuttle cameras 37 and 38 shoots the IC device T held by the measuring robot 22 described above from below, and outputs the image data obtained by the shooting. The IC held by the measuring robot 22 can be captured at one time. The whole of device T and its surroundings. Although the shuttle cameras 37 and 38 are CCD cameras in this embodiment, the present invention is not limited to this. An inspection section 23 is provided on the upper surface of the base 5 and between the shuttles 47 and 48. The inspection section 23 is provided with an inspection socket 24 on which the IC device T is mounted. The inspection socket 24 is a socket for electrically inspecting the mounted IC device T. The inspection socket 24 is provided with a plurality of inspection terminals corresponding to each connection terminal (not shown) of the IC device T to be inspected. Contact terminal (not shown). In addition, the inspection socket 24 is electrically connected by contacting each connection terminal of the IC device T with each contact terminal, and inspection can be performed. A guide rail (not shown) arranged in the Y direction is provided inside the high-temperature chamber 7 so as to span over each of the shuttles 47 and 48 and the inspection socket 24. The lower part of the guide rail supports the measurement robot 22 so as to be able to move back and forth in the Y direction, and is moved back and forth in the Y direction by a Y-axis motor MY (see FIG. 26) provided on the guide rail. That is, the measurement robot 22 moves along the guide rail to transfer the IC devices T between the shuttles 47 and 48 and the inspection socket 24. As described in detail below, the measurement robot 22 obtains the IC device T supplied from each of the shuttles 47 and 48, and arranges the IC device T directly above the inspection socket 24. Then, the measurement robot 22 moves the IC device T to the lower side so that each connection terminal of the IC device T comes into contact with the contact terminal of the inspection socket 24 from above and presses the spring pin downward to install the inspection socket. twenty four. When the electrical inspection of the IC device T installed in the inspection socket 24 is completed, the measurement robot 22 pulls out the IC device T installed in each inspection socket 24 and arranges it directly above the collection-side placement portion 34. position. In addition, the measurement robot 22 moves the IC device T to a position directly above the collection-side placement portion 34 and stores the IC device T in the specific collection-side placement portion 34. 22 and 24 are perspective views showing the structure of the mounting sections 57 and 34 in this embodiment, and FIGS. 23 and 25 are front views showing the structure of the mounting sections 57 and 34 in this embodiment. 22 and 23 show the mounting surface 36 of the mounting portions 57 and 34 in an inclined state, and FIGS. 24 and 25 show the mounting surface 36 of the mounting portions 57 and 34 in a horizontal state. Each of the mounting portions 57 and 34 in this embodiment includes a device mounting plate 58 including a mounting surface 36 on which the IC device T can be mounted, and a first rotation mechanism for rotating the device mounting plate 58 in the X direction. 1 spring spring 53, rotary shaft 55, and first pressing piston 56; second spring spring 54, guide 66, and second pressing piston 29 as a sliding mechanism that slides the device mounting plate 58 in the Y direction ; The first abutment portion 59 that the IC device T that can restrict the movement in the X direction of the IC device T can abut; and the second abutment portion 35 that the IC device T that can restrict the movement of the IC device T in the Y direction can abut. A reference position P serving as a reference for a position on which the IC device is placed is provided in each of the placement portions 57 and 34. A first contact portion 59 and a second contact portion 35 are provided on an end side of the device mounting plate 58 across the reference position P. The device mounting plate 58 is formed into a flat rectangular parallelepiped so that the IC device T can be mounted thereon. The device mounting plate 58 is a rectangular plate-shaped member made of resin. The device mounting board 58 is formed in a shape larger than the outer shape of the IC device. The base members 47A and 17A include a plurality of placement portions 57 and 34. One IC device T is mounted on each of the plurality of mounting portions 57 and 34. Thereby, each IC device T placed on the mounting portions 57 and 34 can be positioned. The mounting portions 57 and 34 include a rotation shaft 55. The mounting portions 57 and 34 can be provided to be rotatable with respect to the base members 47A and 17A around the rotation shaft 55. Thereby, since the rotation is centered on the rotation shaft 55, the angle setting accuracy of the mounting portions 57 and 34 can be further improved. The device mounting plate 58 is fixed to the mounting portions 57 and 34 via a rotation shaft 55 provided at a lower portion thereof. The device mounting plate 58 can be rotated around the rotation shaft 55 as a center. The rotation shaft 55 is a center when the mounting portions 57 and 34 are rotated in the X direction. The mounting surface 36 is inclined with respect to a horizontal plane. The normal direction H of the mounting surface 36 is different from the direction of gravity G. The normal direction H of the mounting surface 36 is inclined with respect to the vertical direction. The mounting surface 36 is inclined with respect to a horizontal plane, for example, 5 to 10 degrees. The inclination of the mounting portions 57 and 34 is maintained by the elastic urging force of the first elastic spring 53. One end of the first spring spring 53 is provided on the lower surface of the device mounting plate 58, and the other end is provided on the upper surfaces of the base members 47A and 17A. As a result, the device mounting plate 58 is always urged by the first urging spring 53 so that the mounting portions 57 and 34 are inclined with respect to the horizontal plane. Although the number of the first springs 53 is one in this embodiment, a plurality of first springs 53 may be provided, for example. The device mounting plate 58 can be operated such that the mounting surface 36 is inclined and horizontal. The normal direction H of the mounting surface 36 includes a component in the direction of transporting the IC device and a component in the direction of gravity. This allows the inertial force acting on the IC device to be used for the movement of the IC device T when the mounting portions 57 and 34 move. The mounting surface 36 is inclined in a direction opposite to the direction in which the IC device T is transported. The mounting surface 36 is inclined toward the reference position P. The device mounting plate 58 operates when the IC devices T are mounted, so that the mounting portions 57 and 34 are tilted by a rotating mechanism, and when the IC devices T are picked up, the mounting portions 57 and 34 become horizontal. Way action. In addition, when the IC mounting device T is transported, the device mounting plate 58 operates such that the mounting surface 36 is tilted by a rotation mechanism. The mounting parts 57 and 34 can mount an IC device and perform an inclination operation with respect to the base members 47A and 17A. This makes it easy to incline the mounting portions 57 and 34. The mounting portions 57 and 34 are rotated by a gas having a pressure higher than the atmospheric pressure. Thereby, the mounting parts 57 and 34 can be easily rotated. A gas having a pressure higher than the atmospheric pressure, for example, applies air pressure generated by an air pressure pump, and operates such that the mounting surface 36 of the device mounting plate 58 is inclined by the effect of the air pressure. According to the above embodiment, when the IC device T is transported, the inertial force acting on the IC device T when the shuttles 47 and 48 are moved from the stopped state to the transport state is set to be greater than that acting on the IC device T and the mounting surface 36. The IC device T can be moved to the first abutting portion 59 by the frictional force between the IC devices T, and the IC device T can be brought closer to the reference position P. Furthermore, by preventing the shuttle 47, 48 from moving due to the inertial force acting on the IC device T when the shuttle 47, 48 is displaced from the transported state to the stopped state, the IC device T can be held near the first contact portion 59 and the reference position P. When the IC device T is placed on the mounting surface 36, the IC device T can be moved to the first abutment portion 59 along the slope, and the IC device can be brought closer to the reference position P. In the case of picking up the IC device T, the picking operation can be easily performed by setting the mounting surface 36 horizontally. The guide part 66 is provided as a guide part which supports the mounting parts 57 and 34 so that the 2nd contact part 35 can move relatively. This makes it easy to incline the mounting portions 57 and 34. The device mounting plate 58 can slide in the Y direction using the guide portion 66 as a guide. The guide portion 66 is a guide portion when the placing portions 57 and 34 slide in the Y direction. The second contact portion 35 is provided so that the IC device T can contact. The mounting portions 57 and 34 can move the IC device T and relatively move the second contact portion 35. When the IC device T is disposed on the mounting surface 36, the mounting portions 57 and 34 can approach the second contact portion 35. Accordingly, the second contact portion 35 can be provided in the moving direction of the IC device T. Thereby, the second contact portion 35 can prevent the IC device T from moving. The device mounting plate 58 comes into contact with or approaches the second contact portion 35 by sliding. The device mounting plate 58 slides the mounted IC device T close to the reference position P. The device mounting plate 58 maintains a certain gap with the second abutting portion 35 by the elastic urging force of the second elastic spring 54. The gap between the device mounting plate 58 and the second contact portion 35 is, for example, 0.5 mm. The device mounting plate 58 can operate in a spaced state and a contact state with respect to the second contact portion 35. One end of the second spring spring 54 is provided on the side surface of the device mounting plate 58, and the other end is provided on the side surface of the second contact portion 35. As a result, the device mounting plate 58 is always urged by the second urging spring 54 so as to be spaced apart from the second contact portion 35. Although the number of the second springs 54 is two in this embodiment, one or a plurality of second springs 54 may be provided, for example. The device mounting plate 58 is moved to be separated from the second abutting portion 35 by a sliding mechanism when the IC device T is placed, and is in contact with the second abutting portion 35 when the IC device T is picked up or Approach in approach. An air pressure generated by an air pressure pump is applied to the slide mechanism, and the slide mounting plate 58 is slid by the effect of the air pressure. According to the above embodiment, when the IC device T is picked up, the IC device T can be brought closer to the reference position P by sliding the IC device T to the second contact portion 35 side. On the lower surface and side surfaces of the device mounting plate 58, each of the pressing pistons 56 and 29 configured to be slidable in the vertical and horizontal directions is stored. An air supply hole 39 is connected to the end faces of the shuttles 47 and 48 to the pressing pistons 56 and 29. A terminal of an air supply pipe 60 (see FIGS. 20 and 21) is tightly connected to the air supply hole 39 via shuttles 47 and 48. Then, the compressed air is supplied to the pressing pistons 56 and 29 from the outside through the air supply pipe 60. As shown in FIG. 26, the start end of the air supply pipe 60 is connected to an air pressure source 52 constituting the air pressure circuit 73 via a solenoid valve V1 constituting the air pressure circuit 73. When the solenoid valve V1 is opened, the solenoid valve V1 supplies compressed air to the air supply pipe 60. When the solenoid valve V1 is closed, the solenoid valve V1 opens the compressed air supplied to the air supply pipe 60 to the atmosphere. Therefore, when the solenoid valve V1 is closed and compressed air is supplied from the air supply pipe 60, the first pressing piston 56 is pressed upward by the air pressure of the compressed air. The first pressing piston 56 presses the lower surface of the device mounting plate 58. When the solenoid valve V1 is closed and compressed air is supplied from the air supply pipe 60, the second pressing piston 29 is pressed in the horizontal direction by the air pressure of the compressed air. The second pressing piston 29 presses the side surface of the device mounting plate 58. In this embodiment, the pressing pistons 56 and 29 are pistons whose pressing portions protrude at high speed when compressed air is supplied, such as tapped pistons. In the above embodiment, each of the pressing pistons 56 and 29 is provided. However, it is not limited to this, and each of the pressing pistons 56 and 29 may be plural. According to the above-mentioned embodiment, by reducing the force (inertial force) acting on the IC device T during transportation, for example, damage to the lead of the IC device T can be suppressed. FIG. 26 is a block diagram showing the electrical configuration of the IC processor 2 according to this embodiment. Next, the electrical configuration of the IC processor 2 for appropriately mounting the IC device T in the inspection socket 24 will be described with reference to FIG. 26. In FIG. 26, the control device 50 is provided with a CPU (Central Processing Unit) 61, ROM 62, RAM 63, image processor 64, image memory 65, and the like. In addition, the control device 50 (CPU 61) executes the adsorption and holding of the IC processing machine 2 from the supply-side mounting portion 57 according to various data and various control programs stored in the ROM 62 and the RAM 63, and installs the IC device T before the inspection to install it in the inspection. Use socket 24 for processing. In this embodiment, a memory for checking the number of inspection counters of the memory IC device T is secured in the RAM 63. The control device 50 is electrically connected to the input / output device 70. The input / output device 70 includes various switches and status displays, and outputs to the control device 50 an instruction signal for starting execution of each process and initial value data for executing each process. The control device 50 is electrically connected to the Y-axis motor driving circuit 71 and the Z-axis motor driving circuit 72, respectively. The Y-axis motor driving circuit 71 inputs a control signal CMY from the control device 50, and drives and controls the Y-axis motor MY by a driving signal DMY generated based on the control signal CMY. In addition, the control device 50 inputs the rotation amount SMY of the Y-axis motor MY detected by the Y-axis motor encoder EMY via the Y-axis motor drive circuit 71. Then, the control device 50 grasps the position of the measurement robot 22 from the rotation amount SMY. That is, the control device 50 drives and controls the Y-axis motor MY, and the measurement robot 22 is arranged above the inspection socket 24 and above the first or second shuttle 47, 48. The Z-axis motor driving circuit 72 inputs a control signal CMZ from the control device 50, and drives and controls the Y-axis motor MZ by a driving signal DMZ generated based on the control signal CMZ. In addition, the control device 50 inputs the rotation amount SMZ of the Z-axis motor MZ detected by the Z-axis motor encoder EMZ via the Z-axis motor driving circuit 72. In addition, the control device 50 grasps the position of the measurement robot 22 from the amount of rotation SMZ. The control device 50 is electrically connected to the air pressure circuit 73. The air pressure circuit 73 drives and controls the solenoid valve V1 based on a control signal CV1 input from the control device 50. In addition, the control device 50 drives and controls the solenoid valve V1 to switch the air supply hole 39 of the air supply pipe 60 to one of the air pressure source 52 and the atmosphere. When the air supply hole 39 is connected to the air pressure source 52, the device mounting plate 58 of each mounting portion 57, 34 is pressed by the first pressing piston 56, and the normal direction H and the direction of gravity G of each mounting surface 36 are the same. The device mounting plate 58 of each of the mounting portions 57 and 34 is pressed by the second pressing piston 29 and approaches the second contact portion 35. The control device 50 is electrically connected to the first shuttle driving circuit 75 and the second shuttle driving circuit 76, respectively. The first shuttle driving circuit 75 inputs a control signal CM1 from the control device 50, and drives and controls the first shuttle motor M1 by a driving signal DM1 generated based on the control signal CM1. Then, the control device 50 drives the first shuttle motor M1 to move the first shuttle 47 along the first guide rail 30A. In addition, the control device 50 inputs the rotation amount SM1 of the first shuttle motor M1 detected by the first shuttle encoder EM1 via the first shuttle driving circuit 75. In addition, the control device 50 grasps the position of the first shuttle 47 by the rotation amount SM1. The second shuttle driving circuit 76 inputs a control signal CM2 from the control device 50, and drives and controls the second shuttle motor M2 by a driving signal DM2 generated based on the control signal CM2. Then, the control device 50 drives the second shuttle motor M2 to move the second shuttle 48 along the second guide rail 30B. In addition, the control device 50 inputs the rotation amount SM2 of the second shuttle motor M2 detected by the second shuttle encoder EM2 via the second shuttle driving circuit 76. Then, the control device 50 grasps the position of the second shuttle 48 from the rotation amount SM2. The control device 50 is electrically connected to the first shuttle camera driving circuit 77, the second shuttle camera driving circuit 78, and the socket camera driving circuit 79, respectively. The first shuttle camera driving circuit 77 drives and controls the first shuttle camera 37 based on a control signal C37 from the control device 50. In addition, the control device 50 drives and controls the first shuttle camera 37 to obtain the image data GD1 for "device identification processing" captured by the first shuttle camera 37. The second shuttle camera driving circuit 78 drives and controls the second shuttle camera 38 based on a control signal C38 from the control device 50. Then, the control device 50 drives and controls the second shuttle camera 38 to obtain the image data GD1 for “device identification processing” captured by the second shuttle camera 38. The socket camera driving circuit 79 drives and controls the socket camera 67 based on a control signal C44 from the control device 50. Then, the control device 50 drives and controls the socket camera 67 to obtain the image data GD2 for "measurement robot position recognition processing" or the image data GD3 for "socket recognition processing" captured by the socket camera 67. The control device 50 matches the center position of the IC device T with the center position of the inspection socket 24, that is, corrects the position of the IC device T. The control device 50 and the imaging device driving circuit 80 are electrically connected to each other. The camera driving circuit 80 generates a driving signal D3X in the left-right direction (X direction) and a driving signal D3Z in the up-down direction (Z direction) based on the control signal C40 from the control device 50. Then, the horizontal motor M3X is driven and controlled based on the drive signal D3X to move the photographing device 40 (socket camera 67) in the left-right direction (X-direction). In addition, the vertical motor M3Z is driven and controlled based on the drive signal D3Z to move the imaging device 40 (socket camera 67) in the vertical direction. In addition, the control device 50 inputs the rotation amount S3X of the horizontal motor M3X detected by the horizontal motor encoder E3X via the imaging device drive circuit 80. In addition, the control device 50 grasps the position of the socket camera 67 in the left-right direction (X direction) from the rotation amount S3X. Furthermore, the control device 50 inputs the rotation amount S3Z of the vertical motor M3Z detected by the vertical motor encoder E3Z via the imaging device drive circuit 80. In addition, the control device 50 grasps the position of the socket camera 67 in the up-down direction (Z direction) from the rotation amount S3Z. FIG. 27 is a flowchart showing the transfer processing for inspecting the IC device T according to this embodiment. Next, the procedure for using the IC handler 2 to hold and hold the IC device T from the first shuttle 47 and to place the IC device T on the inspection socket 24 will be described with reference to FIG. 27. Here, it is assumed that the inspection of the IC device T is about to start, and that the IC device T is not adsorbed and held by the measurement robot 22. As shown in FIG. 27, first, if the inspection of the IC device T is started, in step S1, the control device 50 clears the memory of the inspection number counter that records the number of times the IC device T has been inspected to "0". If the memory of the counter is cleared to "0", in step S2, the control device 50 performs processing for socket identification. When the process for identifying the socket is completed, the control device 50 performs a process for measuring the position of the robot in step S3. When the processing for measuring the position of the robot is completed, in step S4, the normal direction H and the direction of gravity G of the control device 50 to the mounting surface 36 of the supply-side mounting portion 57 of the first shuttle 47 are different from the direction of gravity G (the mounting surface Each of the mounting portions 57 and 34 at 36 tilts) supplies the IC device T, and the measurement robot 22 transfers the IC device T to a position where the IC device T is held by suction. The mounting surface 36 is also maintained in a tilted state during transportation. When the measurement robot 22 transports the IC device T to the position of suction and holding, in step S5, the control device 50 controls the solenoid valve V1, and the normal direction H of the mounting surface 36 becomes the same as the direction of gravity G. In addition, the control device 50 controls the solenoid valve V1 so that each of the placement portions 57 and 34 approaches the second contact portion 35. The control device 50 performs processing for device identification. When the image data GD1 for device identification is obtained, the control device 50 performs device identification processing. In addition, the socket recognition process, the process for measuring the position of the measuring robot, and the device recognition process may detect respective relative coordinates and angular deviations from the image, for example. Each relative coordinate and angular deviation can use various well-known image processing techniques. When the processing for device identification is completed, in step S6, the control device 50 calculates the memory 63 stored in the RAM 63, for example, to make the center position of the IC device T coincide with the center position of the inspection socket 24 based on the relative coordinates and angular deviation. The amount of correction. When each correction amount is calculated, in step S7, the control device 50 transfers the IC device to the inspection socket 24 above the inspection socket 24 by the measurement robot 22. When the IC device T is transported above the inspection socket 24, the control device 50 moves the measurement robot 22 based on the calculated correction amounts in step S8, and moves the center position of the IC device T and the center of the inspection socket 24. The position is adjusted so that the inclination of the side of the IC device T matches the inclination of the side of the inspection socket 24. If the position of the IC device T is corrected, the control device 50 mounts the IC device T on the inspection socket 24 in step S9 to perform an electrical inspection of the IC device T. If the electrical inspection of the IC device T is completed, in step S10, the control device 50 sets the adsorption nozzle to a specific initial position and a specific initial angle with respect to the measurement robot 22, and then the IC device T The inspection socket 24 is pulled out, so that the IC device T is placed on each load where the normal direction H of the mounting surface 36 of the recovery side mounting portion 34 of the first shuttle 47 is different from the direction of gravity G (the mounting surface 36 is inclined)放 面 36。 Set surface 36. When the IC device T is recovered to the collection-side placing section 34, the control device 50 moves the first shuttle 47 in step S11, so that the collection robot 9 recovers the IC device T. At this time, the control device 50 controls the solenoid valve V1 so that the normal direction H of the mounting surface 36 and the direction of gravity G are the same. In addition, the control device 50 controls the solenoid valve V1 so that each of the placement portions 57 and 34 approaches the second contact portion 35. If the recovery robot 9 recovers the IC device T, in step S12, the control device 50 determines whether there is a next part to be inspected. If there is no next part to be inspected (NO in step S12), the control device 50 ends the inspection of the IC device T. On the other hand, if there is a part to be inspected next (YES in step S12), in step S13, the control device 50 adds 1 to the inspection number counter, and then determines in step S14 whether a specific inspection has been performed number. When a specific number is not checked (NO in step S14), the control device 50 returns to step S4 and repeats the transportation and inspection of the IC device T. In this case, the device recognition process, such as recalculating the relative coordinates and angular deviation, but since the socket recognition process and the measurement robot position recognition process are not performed, the previously calculated and stored in the RAM 63, such as the relative coordinates and angular deviation, are used Calculation on correction value. On the other hand, when a specific number of cases have been checked (YES in step S14), the control device 50 returns to step S1, performs socket recognition processing, measurement robot position recognition processing, and device recognition processing, and performs correction value calculations , Repeat the inspection of IC device T. The IC processor 2 is used to suck and hold the IC device T from the second shuttle 48 and place it on the inspection socket 24. However, this procedure is the same as the order of the first shuttle 47 to hold and hold the IC device T and place it on the inspection socket 24. The description is the same, so the description is omitted. According to this embodiment, the mounting surface 36 on which the IC device is mounted can be inclined with respect to the direction of gravity G. Thereby, the IC device mounted on the mounting surface 36 moves in a direction inclined with respect to the direction G of gravity. As a result, the IC device T can be positioned on the mounting surface 36. Moreover, there is no need to adjust the position of the IC device T in the groove as before. For detecting the posture of the IC device T, the previous optical sensor may not be provided. The mounting portions 57 and 34 are compatible with a plurality of types of IC devices T. <Fifth Embodiment> Fig. 28 is a perspective view showing the structure of the mounting portions 57A and 34A in this embodiment. Hereinafter, the structure of the mounting portions 57A and 34A of this embodiment will be described with reference to FIG. 28. The difference between the mounting portions 57A and 34A in this embodiment and the fourth embodiment is that a sliding mechanism is formed in the X direction and a rotating mechanism is formed in the Y direction. Hereinafter, the same components as those in the fourth embodiment are denoted by the same reference numerals, and descriptions thereof will be omitted or simplified here. The mounting portions 57A and 34A of this embodiment slide in the X direction and rotate in the Y direction. <Sixth Embodiment> Fig. 29 is a perspective view showing the structure of the mounting portions 57B and 34B in this embodiment. Hereinafter, the structure of the mounting portions 57B and 34B of this embodiment will be described with reference to FIG. 29. The difference between the mounting portions 57B and 34B in this embodiment and the fourth embodiment is that the rotation mechanism is formed in the Y-direction rotation. Hereinafter, the same components as those in the fourth embodiment are denoted by the same reference numerals, and descriptions thereof will be omitted or simplified here. The mounting portions 57B and 34B in this embodiment have a structure that rotates in the X direction and also rotates in the Y direction. The rotation shaft 55 is the center of the mounting portions 57B and 34B when they are rotated in the X direction and the Y direction. <Seventh Embodiment> Fig. 30 is a perspective view showing the structure of the mounting portions 57C and 34C in this embodiment. Hereinafter, the structures of the mounting portions 57C and 34C of this embodiment will be described with reference to FIG. 30. The difference between the mounting portions 57C and 34C in this embodiment and the fourth embodiment is that the rotating mechanism is formed in the X-direction rotation. Hereinafter, the same components as those in the fourth embodiment are denoted by the same reference numerals, and descriptions thereof will be omitted or simplified here. The mounting portions 57C and 34C in this embodiment are configured to slide in the X direction and also slide in the Y direction. The device mounting plate 58 can slide the guide portion 66 as a guide in the X direction and the Y direction. The guide portion 66 is a guide portion when the placing portions 57C and 34C slide in the X direction and the Y direction. The embodiment is not limited to the above, and may be implemented as follows. (Modification 1) In the fourth embodiment described above, the structure is provided with a rotation mechanism that rotates the device mounting plate 58 in the X direction and a slide mechanism that slides in the Y direction. The rotation mechanism of the parts 57 and 34 rotating in the X direction, and the structure which does not have the slide mechanism which slides the mounting parts 57 and 34 in the Y direction. (Modification 2) In the fourth embodiment described above, the structure is provided with a rotation mechanism that rotates the device mounting plate 58 in the X direction and a slide mechanism that slides in the Y direction. The sliding mechanism of the portions 57 and 34 sliding in the Y direction has no structure of a rotating mechanism that rotates the placing portions 57 and 34 in the X direction. (Modification 3) In the fifth embodiment described above, the structure is provided with a slide mechanism that slides the device mounting plate 58 in the X direction and a rotation mechanism that rotates in the Y direction. The sliding mechanism of the portions 57 and 34 sliding in the X direction has no structure of a rotating mechanism that rotates the placing portions 57 and 34 in the Y direction. (Modification 4) In the fifth embodiment described above, the structure is provided with a slide mechanism that slides the device mounting plate 58 in the X direction and a rotation mechanism that rotates in the Y direction. The rotation mechanism of the parts 57 and 34 rotating in the Y direction has no structure of the sliding mechanism which slides the mounting parts 57 and 34 in the X direction. (Variation 5) In the above-mentioned embodiment, the slide mounting plate 58 is made to slide, but the shuttles 47 and 48 including the placing portion may be tilted as a whole. The electronic component transfer device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and each part constituting the electronic component transfer device and the electronic component inspection device can be replaced to perform the same function Any of its constituents. Moreover, you may add another arbitrary structure. In addition, the electronic component transfer device and the electronic component inspection device of the present invention may be a combination (a feature) of any two or more of the embodiments described above. In this embodiment, a case where the shape of the device body of the IC device in a plan view is a square is described, but it is not limited to this. For example, when the shape of the device body in a plan view is rectangular or circular (including an ellipse), when the IC device is placed in the recessed portion of each mounting member, the front and back directions (Y and X directions) and the side wall portion The interval is set in the same manner as when the shape of the device body in plan view is square.

1‧‧‧電子零件檢查裝置 1‧‧‧Electronic parts inspection device

2‧‧‧IC處理機 2‧‧‧IC processor

3‧‧‧基部 3‧‧‧ base

4‧‧‧薄板部 4‧‧‧ Sheet

5‧‧‧基底 5‧‧‧ substrate

6‧‧‧安全外罩 6‧‧‧ safety cover

7‧‧‧高溫腔室 7‧‧‧ high temperature chamber

8‧‧‧供給機器人 8‧‧‧ supply robot

9‧‧‧回收機器人 9‧‧‧Recycling robot

10‧‧‧電子零件搬送裝置 10‧‧‧Electronic parts transfer device

11A、11B‧‧‧托盤搬送機構 11A, 11B‧‧‧Tray transfer mechanism

12‧‧‧溫度調整部 12‧‧‧Temperature Adjustment Department

13‧‧‧器件搬送頭 13‧‧‧ device transfer head

14、14A、14B‧‧‧器件供給部 14, 14A, 14B ‧‧‧ Device Supply Department

15‧‧‧托盤搬送機構 15‧‧‧pallet transfer mechanism

16‧‧‧檢查部 16‧‧‧ Inspection Department

17、17A、17B‧‧‧器件搬送頭 17, 17A, 17B‧‧‧ device transfer head

18、18A、18B‧‧‧器件回收部 18, 18A, 18B ‧‧‧ Device Recovery Department

19‧‧‧回收用托盤 19‧‧‧Recycling tray

20‧‧‧器件搬送頭 20‧‧‧ device transfer head

21‧‧‧托盤搬送機構 21‧‧‧Tray transfer mechanism

22‧‧‧測定機器人 22‧‧‧Determination robot

22A、22B‧‧‧托盤搬送機構 22A, 22B ‧ ‧ ‧ tray transfer mechanism

23‧‧‧檢查部 23‧‧‧ Inspection Department

24‧‧‧檢查用插座 24‧‧‧ Inspection socket

25‧‧‧搬送部 25‧‧‧Transportation Department

26‧‧‧攝像部 26‧‧‧ Camera Department

27‧‧‧線性導軌 27‧‧‧ linear guide

28‧‧‧支持基板 28‧‧‧Support substrate

29‧‧‧第2按壓活塞 29‧‧‧ 2nd pressing piston

30A‧‧‧第1導軌 30A‧‧‧1st rail

30B‧‧‧第2導軌 30B‧‧‧ 2nd rail

31‧‧‧孔 31‧‧‧hole

32‧‧‧螺栓 32‧‧‧ Bolt

33‧‧‧導銷 33‧‧‧Guide Pin

34‧‧‧回收側載置部 34‧‧‧Recycling side placement section

34A、34B、34C‧‧‧載置部 34A, 34B, 34C‧‧‧mounting section

35‧‧‧第2抵接部 35‧‧‧The second abutment

36‧‧‧載置面 36‧‧‧mounting surface

37‧‧‧第1梭攝像機 37‧‧‧The first shuttle camera

38‧‧‧第2梭攝像機 38‧‧‧Second shuttle camera

39‧‧‧供氣孔 39‧‧‧air supply hole

40‧‧‧攝影裝置 40‧‧‧Photographic installation

41‧‧‧開口 41‧‧‧ opening

42‧‧‧孔 42‧‧‧hole

43‧‧‧導孔 43‧‧‧ guide hole

44‧‧‧滾花螺釘(螺栓) 44‧‧‧Knurled screw (bolt)

45‧‧‧小孔 45‧‧‧ small hole

46‧‧‧大孔 46‧‧‧big hole

47‧‧‧第1梭 47‧‧‧ the first shuttle

47A‧‧‧基底構件 47A‧‧‧ Base member

48‧‧‧第2梭 48‧‧‧ 2nd shuttle

48A‧‧‧基底構件 48A‧‧‧ Base member

49‧‧‧供給側機械手單元 49‧‧‧ supply side robot unit

50‧‧‧控制裝置 50‧‧‧control device

51‧‧‧回收側機械手單元 51‧‧‧Recycling side robot unit

52‧‧‧空氣壓源 52‧‧‧Air pressure source

53‧‧‧第1彈推彈簧 53‧‧‧The first spring

54‧‧‧第2彈推彈簧 54‧‧‧ 2nd spring

55‧‧‧旋動軸 55‧‧‧rotating shaft

56‧‧‧第1按壓活塞 56‧‧‧ 1st pressing piston

57‧‧‧供給側載置部 57‧‧‧ Supply side mounting section

57A、57B、57C‧‧‧載置部 57A, 57B, 57C‧‧‧mounting section

58‧‧‧器件載置板 58‧‧‧device mounting board

59‧‧‧第1抵接部 59‧‧‧The first abutment

60‧‧‧供氣管 60‧‧‧Air supply pipe

61‧‧‧CPU 61‧‧‧CPU

62‧‧‧ROM 62‧‧‧ROM

63‧‧‧RAM 63‧‧‧RAM

64‧‧‧圖像處理器 64‧‧‧Image Processor

65‧‧‧圖像記憶體 65‧‧‧Image memory

66‧‧‧引導部 66‧‧‧Guide

67‧‧‧插座攝像機 67‧‧‧Socket Camera

70‧‧‧輸入輸出裝置 70‧‧‧I / O device

71‧‧‧Y軸馬達驅動電路 71‧‧‧Y-axis motor drive circuit

72‧‧‧Z軸馬達驅動電路 72‧‧‧Z-axis motor drive circuit

73‧‧‧空氣壓電路 73‧‧‧Air pressure circuit

75‧‧‧第1梭驅動電路 75‧‧‧The first shuttle drive circuit

76‧‧‧第2梭驅動電路 76‧‧‧Second shuttle drive circuit

77‧‧‧第1梭攝像機驅動電路 77‧‧‧The first shuttle camera driving circuit

78‧‧‧第2梭攝像機驅動電路 78‧‧‧Second shuttle camera driving circuit

79‧‧‧插座攝像機驅動電路 79‧‧‧Socket Camera Drive Circuit

80‧‧‧攝影裝置驅動電路 80‧‧‧ camera driving circuit

90‧‧‧IC器件(電子零件) 90‧‧‧IC devices (electronic parts)

121‧‧‧凹部 121‧‧‧ recess

122‧‧‧底部 122‧‧‧ bottom

123‧‧‧側壁部 123‧‧‧ sidewall

124‧‧‧基部 124‧‧‧ base

124a‧‧‧孔 124a‧‧‧hole

125‧‧‧開口 125‧‧‧ opening

126‧‧‧薄板部 126‧‧‧ Sheet

126a‧‧‧導孔 126a‧‧‧ guide hole

127‧‧‧導銷 127‧‧‧Guide Pin

128‧‧‧螺栓 128‧‧‧ Bolt

131‧‧‧吸引口 131‧‧‧ Attraction

141‧‧‧凹部 141‧‧‧concave

142‧‧‧底部 142‧‧‧ bottom

143‧‧‧側壁部 143‧‧‧ sidewall

161‧‧‧凹部 161‧‧‧concave

162‧‧‧底部 162‧‧‧ bottom

163‧‧‧側壁部 163‧‧‧Sidewall

169‧‧‧探針引腳 169‧‧‧ Probe pins

171‧‧‧吸引口 171‧‧‧ attractor

181‧‧‧凹部 181‧‧‧concave

182‧‧‧底部 182‧‧‧ bottom

183‧‧‧側壁部 183‧‧‧Sidewall

200‧‧‧托盤 200‧‧‧tray

200A‧‧‧托盤(供給托盤) 200A‧‧‧Tray (Supply Tray)

200B‧‧‧托盤(回收托盤) 200B‧‧‧Tray (Recycling Tray)

201‧‧‧凹部 201‧‧‧ Recess

202‧‧‧底部 202‧‧‧ bottom

203‧‧‧側壁部 203‧‧‧Sidewall

231‧‧‧第1隔板 231‧‧‧The first partition

232‧‧‧第2隔板 232‧‧‧Second partition

233‧‧‧第3隔板 233‧‧‧3rd partition

234‧‧‧第4隔板 234‧‧‧ 4th partition

235‧‧‧第5隔板 235‧‧‧5th partition

241‧‧‧前蓋 241‧‧‧Front cover

242‧‧‧側蓋 242‧‧‧side cover

243‧‧‧側蓋 243‧‧‧side cover

244‧‧‧後蓋 244‧‧‧back cover

245‧‧‧頂蓋 245‧‧‧Top cover

300‧‧‧監視器 300‧‧‧ monitor

301‧‧‧顯示畫面 301‧‧‧display

321‧‧‧頭部(螺釘頭) 321‧‧‧head (screw head)

400‧‧‧信號燈 400‧‧‧ signal light

441‧‧‧外螺紋部 441‧‧‧external thread

442‧‧‧頭部(螺釘頭) 442‧‧‧head (screw head)

500‧‧‧揚聲器 500‧‧‧Speaker

600‧‧‧滑鼠台 600‧‧‧Mouse Station

700‧‧‧操作面板 700‧‧‧ operation panel

800‧‧‧控制部 800‧‧‧ Control Department

901‧‧‧器件本體 901‧‧‧device body

902‧‧‧緣部(側面) 902‧‧‧Edge (side)

909‧‧‧端子 909‧‧‧terminal

2001‧‧‧吸引口 2001‧‧‧ attracted

A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area

A2‧‧‧器件供給區域 A2‧‧‧Device supply area

A3‧‧‧檢查區域 A3‧‧‧ Inspection area

A4‧‧‧器件回收區域 A4‧‧‧device recycling area

A5‧‧‧托盤去除區域 A5‧‧‧Tray removal area

C1~C6‧‧‧輸送帶 C1 ~ C6‧‧‧Conveyor belt

C37、C38、C40、C44、CM1、CM2、CMY、CMZ、CV1‧‧‧控制信號 C37, C38, C40, C44, CM1, CM2, CMY, CMZ, CV1‧‧‧ control signals

D12、d14、d16、d18‧‧‧深度D 12 , d 14 , d 16 , d 18 ‧‧‧ depth

D3X、D3Z、DM1、DM2、DMY、DMZ‧‧‧驅動信號 D3X, D3Z, DM1, DM2, DMY, DMZ‧‧‧Drive signal

E3X‧‧‧水平馬達編碼器 E3X‧‧‧Horizontal Motor Encoder

E3Z‧‧‧垂直馬達編碼器 E3Z‧‧‧Vertical Motor Encoder

EM1‧‧‧第1梭編碼器 EM1‧‧‧The first shuttle encoder

EM2‧‧‧第2梭編碼器 EM2‧‧‧Second shuttle encoder

EMY‧‧‧Y軸馬達編碼器 EMY‧‧‧Y-axis motor encoder

EMZ‧‧‧Z軸馬達編碼器 EMZ‧‧‧Z-axis motor encoder

FX‧‧‧X軸框 FX‧‧‧X axis frame

FY1‧‧‧第1Y軸框 FY1‧‧‧The first 1Y axis frame

FY2‧‧‧第2Y軸框 FY2‧‧‧2Y axis frame

G‧‧‧重力方向 G‧‧‧ Direction of gravity

GD1、GD2、GD3‧‧‧圖像資料 GD1, GD2, GD3‧‧‧ image data

GP12、GP14、GP16、GP18、GP200A、GP200B‧‧‧間隙GP 12 , GP 14 , GP 16 , GP 18 , GP 200A , GP 200B

H‧‧‧法線之方向 H‧‧‧ Direction of Normal

M1‧‧‧第1梭馬達 M1‧‧‧The first shuttle motor

M2‧‧‧第2梭馬達 M2‧‧‧ 2nd Shuttle Motor

M3X‧‧‧水平馬達 M3X‧‧‧Horizontal Motor

M3Z‧‧‧垂直馬達 M3Z‧‧‧Vertical Motor

MY‧‧‧Y軸馬達 MY‧‧‧Y-axis motor

MZ‧‧‧Z軸馬達 MZ‧‧‧Z axis motor

P‧‧‧基準位置 P‧‧‧ reference position

S3X、S3Z、SM1、SM2、SMY、SMZ‧‧‧旋轉量 S3X, S3Z, SM1, SM2, SMY, SMZ‧‧‧rotation

T4‧‧‧厚度T 4 ‧‧‧ thickness

T90‧‧‧厚度(最大厚度)T 90 ‧‧‧thickness (maximum thickness)

T126‧‧‧厚度T 126 ‧‧‧thickness

T‧‧‧IC器件 T‧‧‧IC device

V1‧‧‧電磁閥 V1‧‧‧ Solenoid Valve

α11A、α11B、α13X、α13Y、α14、α15、α17Y、α18、α20X、α20Y、α21、α22A、α22B、α90‧‧‧箭頭α 11A , α 11B , α 13X , α 13Y , α 14 , α 15 , α 17Y , α 18 , α 20X , α 20Y , α 21 , α 22A , α 22B , α 90 ‧‧‧ arrows

X、Y、Z‧‧‧方向 X, Y, Z‧‧‧ directions

圖1係自正面側觀察電子零件檢查裝置之第1實施形態之概略立體圖。 圖2係顯示圖1所示之電子零件檢查裝置之動作狀態之概略俯視圖。 圖3係顯示用以規定凹部之壁部與電子零件之間隔之電子零件之載置狀態之垂直部分剖視圖。 圖4係顯示用以規定凹部之壁部與電子零件之間隔之電子零件之載置狀態之垂直部分剖視圖。 圖5係顯示用以規定凹部之壁部與電子零件之間隔之電子零件之載置狀態之垂直部分剖視圖。 圖6係顯示用以規定凹部之壁部與電子零件之間隔之電子零件之載置狀態之垂直部分剖視圖。 圖7係顯示用以規定凹部之壁部與電子零件之間隔之電子零件之載置狀態之垂直部分剖視圖。 圖8係顯示用以規定凹部之壁部與電子零件之間隔之電子零件之載置狀態之垂直部分剖視圖。 圖9係顯示生產上之電子零件之載置狀態之垂直部分剖視圖。 圖10係顯示各載置構件與載置於該載置構件之電子零件之間隔(間隙)之關係之圖表。 圖11係顯示各載置構件與載置於該載置構件之電子零件之間隔(間隙)之關係之圖表。 圖12係顯示各載置構件與載置於該載置構件之電子零件之間隔(間隙)之關係之圖表。 圖13係顯示電子零件檢查裝置(第2實施形態)所具有之溫度調整部之垂直部分剖視圖。 圖14係顯示電子零件檢查裝置(第3實施形態)所具有之供給梭(第2載置構件)之垂直部分剖視圖。 圖15係顯示圖14所示之供給梭(第2載置構件)所具備之薄板部之俯視圖。 圖16係圖15中之A-A線剖視圖。 圖17係圖15中之B-B線剖視圖。 圖18係圖15中之C-C線剖視圖。 圖19係顯示第4實施形態之IC處理機之構造之俯視圖。 圖20係顯示第4實施形態之梭的構造之俯視圖。 圖21係顯示第4實施形態之梭的構造之前視圖。 圖22係顯示第4實施形態之載置部的構造之立體圖。 圖23係顯示第4實施形態之載置部的構造之前視圖。 圖24係顯示第4實施形態之載置部的構造之立體圖。 圖25係顯示第4實施形態之載置部的構造之前視圖。 圖26係顯示第4實施形態之IC處理機之電性構成之方塊圖。 圖27係顯示第4實施形態之為檢查IC器件而進行搬送的處理之流程圖。 圖28係顯示第5實施形態之載置部的構造之立體圖。 圖29係顯示第6實施形態之載置部的構造之立體圖。 圖30係顯示第7實施形態之載置部的構造之立體圖。FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection apparatus as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is a vertical partial cross-sectional view showing a mounting state of an electronic component for defining a space between a wall portion of the recessed portion and the electronic component. FIG. 4 is a vertical partial cross-sectional view showing a mounting state of an electronic component for defining a space between the wall portion of the recessed portion and the electronic component. FIG. 5 is a vertical partial cross-sectional view showing a mounting state of an electronic component for defining a space between a wall portion of the recessed portion and the electronic component. FIG. 6 is a vertical partial cross-sectional view showing a mounting state of an electronic component for defining a space between a wall portion of the recessed portion and the electronic component. FIG. 7 is a vertical partial cross-sectional view showing a mounting state of an electronic component for defining a space between the wall portion of the recessed portion and the electronic component. FIG. 8 is a vertical partial cross-sectional view showing a mounting state of an electronic component for defining a space between the wall portion of the recessed portion and the electronic component. FIG. 9 is a vertical partial cross-sectional view showing a mounted state of electronic parts in production. FIG. 10 is a graph showing a relationship between a distance (gap) between each mounting member and an electronic component placed on the mounting member. FIG. 11 is a graph showing a relationship between a distance (gap) between each mounting member and an electronic component placed on the mounting member. FIG. 12 is a graph showing a relationship between a distance (gap) between each mounting member and an electronic component placed on the mounting member. FIG. 13 is a vertical cross-sectional view showing a temperature adjustment section included in the electronic component inspection apparatus (second embodiment). FIG. 14 is a vertical partial cross-sectional view showing a supply shuttle (second mounting member) included in the electronic component inspection device (third embodiment). FIG. 15 is a plan view showing a thin plate portion provided in the supply shuttle (second placing member) shown in FIG. 14. Fig. 16 is a sectional view taken along the line A-A in Fig. 15. Fig. 17 is a sectional view taken along the line B-B in Fig. 15. Fig. 18 is a sectional view taken along the line C-C in Fig. 15. Fig. 19 is a plan view showing the structure of an IC processor of a fourth embodiment. Fig. 20 is a plan view showing the structure of a shuttle according to a fourth embodiment. Fig. 21 is a front view showing the structure of a shuttle according to a fourth embodiment. Fig. 22 is a perspective view showing a structure of a mounting portion according to a fourth embodiment. Fig. 23 is a front view showing a structure of a mounting portion according to a fourth embodiment. Fig. 24 is a perspective view showing a structure of a mounting portion of a fourth embodiment. Fig. 25 is a front view showing the structure of a mounting portion according to a fourth embodiment. Fig. 26 is a block diagram showing the electrical configuration of the IC processor of the fourth embodiment. FIG. 27 is a flowchart showing a process of carrying out the inspection of the IC device according to the fourth embodiment. Fig. 28 is a perspective view showing a structure of a mounting portion according to a fifth embodiment. Fig. 29 is a perspective view showing a structure of a mounting portion according to a sixth embodiment. Fig. 30 is a perspective view showing a structure of a mounting portion according to a seventh embodiment.

Claims (20)

一種電子零件搬送裝置,其特徵在於:可配置具有供載置電子零件之第1凹部之第1載置構件,且具有: 第2載置構件,其具有供載置上述電子零件之第2凹部,及 搬送部,其可將上述電子零件自上述第1載置構件搬送至上述第2載置構件; 於上述第1凹部載置上述電子零件且俯視時上述第1凹部之中心與上述電子零件之中心重疊之情形之上述第1凹部之側壁部與上述電子零件之第1間隔、及於上述第2凹部載置上述電子零件且俯視時上述第2凹部之中心與上述電子零件之中心重疊之情形之上述第2凹部之側壁部與上述電子零件之第2間隔兩者間,以上述第2間隔大於上述第1間隔。An electronic component transporting device, characterized in that a first mounting member having a first recessed portion on which electronic components can be placed can be arranged, and a second mounting member having a second recessed portion on which the electronic components are placed And a transporting unit that can transport the electronic component from the first mounting member to the second mounting member; the electronic component is mounted on the first recessed portion and the center of the first recessed portion and the electronic component are viewed in plan view. In a case where the centers of the first recessed part overlap with the first part of the electronic part, and when the electronic part is placed on the second recessed part and the center of the second recessed part overlaps with the center of the electronic part in a plan view In this case, between the side wall portion of the second recessed portion and the second interval of the electronic component, the second interval is larger than the first interval. 如請求項1之電子零件搬送裝置,其中具有可配置檢查上述電子零件之檢查部之檢查區域,及 將上述電子零件自上述第2載置構件搬送至上述檢查部之檢查用搬送部。For example, the electronic component transfer device of claim 1 includes an inspection area in which an inspection section for inspecting the electronic components can be arranged, and an inspection transport section for transporting the electronic components from the second mounting member to the inspection section. 如請求項2之電子零件搬送裝置,其中具有對固持於上述檢查用搬送部之上述電子零件進行拍攝之攝像部。For example, the electronic component transporting device according to claim 2 includes an imaging unit that images the electronic component held by the inspection transporting unit. 一種電子零件搬送裝置,其特徵在於:可配置具有供載置電子零件之第1凹部之第1載置構件,且具有: 第2載置構件,其具有供載置上述電子零件之第2凹部, 搬送部,其可將上述電子零件自上述第1載置構件搬送至上述第2載置構件, 檢查區域,其可配置檢查載置於上述第2載置構件後之上述電子零件之檢查部, 檢查用搬送部,其可將上述電子零件自上述第2載置構件搬送至上述檢查部, 攝像部,其對固持於上述檢查用搬送部之上述電子零件進行拍攝,及 第3載置構件,其具有供載置經上述檢查部檢查之上述電子零件之第3凹部;且, 配置第4載置構件,其具有供載置載置於上述第3載置構件後之上述電子零件之第4凹部; 於上述第1凹部載置上述電子零件且俯視時上述第1凹部之中心與上述電子零件之中心重疊之情形之上述第1凹部之側壁部與上述電子零件之第1間隔、及於上述第2凹部載置上述電子零件且俯視時上述第2凹部之中心與上述電子零件之中心重疊之情形之上述第2凹部之側壁部與上述電子零件之第2間隔兩者間,以上述第2間隔大於上述第1間隔; 於上述第3凹部載置上述電子零件而在俯視下上述第3凹部之中心與上述電子零件之中心重疊之情形之上述第3凹部之側壁部與上述電子零件之第3間隔、及於上述第4凹部載置上述電子零件而在俯視下上述第4凹部之中心與上述電子零件之中心重疊之情形之上述第4凹部之側壁部與上述電子零件之第4間隔兩者間,以上述第4間隔大於上述第3間隔。An electronic component transporting device, characterized in that a first mounting member having a first recessed portion on which electronic components can be placed can be arranged, and a second mounting member having a second recessed portion on which the electronic components are placed A transporting unit that can transport the electronic components from the first mounting member to the second mounting member, and an inspection area that can be configured with an inspection unit that inspects the electronic components mounted on the second mounting member. An inspection transfer unit may transport the electronic component from the second placement member to the inspection unit, and an imaging unit may photograph the electronic component held by the inspection transfer unit, and a third placement member. It has a third recess for mounting the above-mentioned electronic parts inspected by the inspection section; and a fourth mounting member is provided which has a third recess for mounting the electronic parts after the third mounting member is mounted. 4 recessed portion; the side wall portion of the first recessed portion and the electronic component in a case where the electronic component is placed on the first recessed portion and the center of the first recessed portion overlaps with the center of the electronic component in a plan view A first interval and a second interval between the side wall portion of the second recessed portion and the second interval of the electronic component when the electronic component is placed on the second recessed portion and the center of the second recessed portion and the center of the electronic component overlap in a plan view The second interval is larger than the first interval, and the side wall of the third recess is a case where the electronic component is placed on the third recess and the center of the third recess overlaps the center of the electronic component in a plan view. A third interval between the first and second electronic parts, and a case where the electronic part is placed on the fourth recessed part and the center of the fourth recessed part overlaps with the center of the electronic part in plan view The fourth interval between the electronic parts is larger than the third interval by the fourth interval. 如請求項3或4之電子零件搬送裝置,其中可基於上述攝像部之拍攝結果,於上述檢查部載置上述電子零件。For example, if the electronic component transfer device of item 3 or 4 is requested, the electronic component may be placed in the inspection section based on the imaging result of the imaging section. 如請求項2之電子零件搬送裝置,其中上述檢查部具有載置上述電子零件之檢查用凹部, 上述第2間隔大於載置有上述電子零件之情形之上述檢查用凹部之側壁部與上述電子零件之間隔。For example, in the electronic component transporting device of claim 2, wherein the inspection section has a recess for inspecting the electronic component, and the second interval is larger than a side wall portion of the inspection recess for the case where the electronic component is disposed and the electronic component. Interval. 如請求項6之電子零件搬送裝置,其中上述第1間隔大於載置有上述電子零件之情形之上述檢查用凹部之側壁部與上述電子零件之間隔。In the electronic component transporting device according to claim 6, wherein the first interval is larger than the interval between the side wall portion of the inspection recessed portion and the electronic component when the electronic component is placed. 如請求項2之電子零件搬送裝置,其中上述第2載置構件可移動至上述檢查區域。For example, in the electronic component transfer device of claim 2, the second mounting member can be moved to the inspection area. 如請求項1之電子零件搬送裝置,其中上述第2凹部之深度小於上述電子零件之厚度。For example, the electronic component transfer device of claim 1, wherein the depth of the second recessed portion is smaller than the thickness of the electronic component. 如請求項1之電子零件搬送裝置,其中上述第1載置構件係預先載置有上述電子零件之供給托盤,上述第2載置構件係可移動地被支持之供給梭。For example, in the electronic component transfer device of claim 1, the first placing member is a supply tray on which the electronic components are placed in advance, and the second placing member is a supply shuttle movably supported. 如請求項10之電子零件搬送裝置,其中具備溫度調整部,其具有供載置上述電子零件之溫度調整用凹部,調整上述電子零件之溫度, 上述第2間隔大於上述溫度調整用凹部中載置有上述電子零件之情形之上述溫度調整用凹部之側壁部與上述電子零件之間隔。For example, the electronic component transporting device of claim 10 includes a temperature adjustment section having a temperature adjustment recess for mounting the electronic component and adjusting the temperature of the electronic component. The second interval is larger than the temperature adjustment recess. In the case of the electronic component, a distance between a side wall portion of the temperature adjustment recessed portion and the electronic component. 如請求項11之電子零件搬送裝置,其中於上述溫度調整用凹部載置有上述電子零件之情形之上述溫度調整用凹部之側壁部與上述電子零件之間隔大於上述第1間隔。In the electronic component transporting device according to claim 11, wherein a distance between the side wall portion of the temperature adjustment recessed portion and the electronic component is larger than the first interval when the electronic component is placed in the temperature adjustment recessed portion. 如請求項1之電子零件搬送裝置,其中可配置檢查載置於上述第2載置構件後之上述電子零件之檢查部, 具有第3載置構件,其具有供載置經上述檢查部檢查之上述電子零件之第3凹部; 配置第4載置構件,其具有供載置載置於上述第3載置構件後之上述電子零件之第4凹部; 於上述第3凹部載置上述電子零件而在俯視下上述第3凹部之中心與上述電子零件之中心重疊之情形之上述第3凹部之側壁部與上述電子零件之第3間隔、及於上述第4凹部載置上述電子零件而在俯視下上述第4凹部之中心與上述電子零件之中心重疊之情形之上述第4凹部之側壁部與上述電子零件之第4間隔兩者間,以上述第4間隔大於上述第3間隔。For example, the electronic component transfer device of claim 1 may be provided with an inspection unit for inspecting the above-mentioned electronic component placed after the second placement member, and a third placement member having a placement unit for inspection by the inspection section. A third recessed portion of the electronic component; a fourth mounting member is disposed, and the fourth recessed portion has a fourth recessed portion for mounting the electronic component placed on the third mounting member; and the electronic component is mounted on the third recessed portion, When the center of the third recessed portion overlaps the center of the electronic component in a plan view, a third interval between the sidewall portion of the third recessed portion and the electronic component, and the electronic component is placed on the fourth recessed portion in a plan view. When the center of the fourth recessed portion overlaps the center of the electronic component, the fourth interval is larger than the third interval between the sidewall portion of the fourth recessed portion and the fourth interval of the electronic component. 如請求項4或13之電子零件搬送裝置,其中上述第3載置構件係可移動地被支持之回收梭,上述第4載置構件係最終載置上述電子零件之回收托盤。For example, the electronic component transfer device of claim 4 or 13, wherein the third placing member is a collection shuttle movably supported, and the fourth placing member is a collection tray on which the electronic components are finally placed. 如請求項13之電子零件搬送裝置,其中上述第2間隔與上述第1間隔之差大於上述第4間隔與上述第3間隔之差。For example, in the electronic component transfer device of claim 13, the difference between the second interval and the first interval is greater than the difference between the fourth interval and the third interval. 如請求項1之電子零件搬送裝置,其中上述第2載置構件具備板狀之基部、及較上述基部更薄且具有開口之薄板部。The electronic component conveying device according to claim 1, wherein the second placing member includes a plate-shaped base portion and a thin plate portion that is thinner than the base portion and has an opening. 如請求項16之電子零件搬送裝置,其中上述第2載置構件具備進行上述基部與上述薄板部之定位之定位部。The electronic component conveying device according to claim 16, wherein the second placing member includes a positioning portion that positions the base portion and the thin plate portion. 如請求項16之電子零件搬送裝置,其中上述薄板部可相對上述基部裝卸。According to the electronic component transfer device of claim 16, wherein the thin plate portion is attachable to and detachable from the base portion. 一種電子零件搬送裝置,其特徵在於:可配置具有供載置電子零件之第1凹部之第1載置構件,且具有: 第2載置構件,其具有供載置上述電子零件之第2凹部,及 搬送部,其可將上述電子零件自上述第1載置構件搬送至上述第2載置構件; 自與俯視上述電子零件時之方向正交之方向觀察上述電子零件之情形之上述電子零件之長度,小於自與俯視上述第1載置構件時之方向正交之方向觀察上述第1載置構件之情形之上述第1凹部之長度, 自與俯視上述第1載置構件之方向正交之方向觀察上述第1載置構件之情形之上述第1凹部之長度,小於自與俯視上述第2載置構件時之方向正交之方向觀察上述第2載置構件之情形之上述第2凹部之長度。An electronic component transporting device, characterized in that a first mounting member having a first recessed portion on which electronic components can be placed can be arranged, and a second mounting member having a second recessed portion on which the electronic components are placed And a transporting unit that can transport the electronic component from the first mounting member to the second mounting member; and the electronic component when the electronic component is viewed from a direction orthogonal to a direction when the electronic component is viewed from above. The length is shorter than the length of the first recess when the first placing member is viewed from a direction orthogonal to the direction when the first placing member is viewed from above. The length of the first recessed portion when the first mounting member is viewed from the direction is shorter than the second recessed portion when the second mounting member is viewed from a direction orthogonal to the direction when the second mounting member is viewed from above. Its length. 一種電子零件檢查裝置,其特徵在於:可配置具有供載置電子零件之第1凹部之第1載置構件,且具有: 第2載置構件,其具有供載置上述電子零件之第2凹部, 搬送部,其可將上述電子零件自上述第1載置構件搬送至上述第2載置構件;及 可檢查上述電子零件之檢查部; 於上述第1凹部載置上述電子零件且俯視時上述第1凹部之中心與上述電子零件之中心重疊之情形之上述第1凹部之側壁部與上述電子零件之第1間隔、及於上述第2凹部載置上述電子零件且俯視時上述第2凹部之中心與上述電子零件之中心重疊之情形之上述第2凹部之側壁部與上述電子零件之第2間隔兩者間,以上述第2間隔大於上述第1間隔。An electronic component inspection device, characterized in that a first mounting member having a first recessed portion on which electronic components can be placed can be arranged, and a second mounting member having a second recessed portion on which electronic components are placed A transporting unit that can transport the electronic component from the first mounting member to the second mounting member; and an inspection unit that can inspect the electronic component; and mount the electronic component in the first recessed portion and view the above when viewed from above When the center of the first recessed portion overlaps with the center of the electronic component, a first interval between the side wall portion of the first recessed portion and the electronic component, and a position of the second recessed portion when the electronic component is placed on the second recessed portion and viewed from above. In a case where the center and the center of the electronic component overlap with each other, the side wall portion of the second recessed portion and the second interval of the electronic component are larger than the first interval by the second interval.
TW107103047A 2017-01-30 2018-01-29 Electronic component conveying device and electronic component inspection device comprising a first carrying member with a first recessed portion, a second carrying member with a second recessed portion, and a conveying portion TW201827838A (en)

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