CN106483399A

CN106483399A - Electronic component handling apparatus and electronic component inspection device

Info

Publication number: CN106483399A
Application number: CN201610685326.1A
Authority: CN
Inventors: 桐原大辅; 前田政己; 下岛聪兴
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2015-08-31
Filing date: 2016-08-18
Publication date: 2017-03-08
Also published as: TW201812948A; TW201709378A; TWI618164B

Abstract

The present invention provides a kind of electronic component handling apparatus and electronic component inspection device, and electronic unit can be set as the first temperature and second temperature by respectively.Electronic component handling apparatus have：First delivery section, it can convey electronic unit and make described electronic unit become the first temperature；And second delivery section, it can convey described electronic unit and make described electronic unit become the second temperature different from described first temperature.

Description

Electronic component handling apparatus and electronic component inspection device

Technical field

The present invention relates to electronic component handling apparatus and electronic component inspection device.

Background technology

Since in the past, it has been known to the electronic unit inspection the dress for example electrical characteristics of the electronic units such as IC device being checked Put, this electronic component inspection device is assembled with the electronic unit conveying of the maintaining part for IC device is delivered to inspection portion Device.When carrying out the inspection of IC device, IC device is configured at maintaining part, makes to be arranged at multiple probes of maintaining part and IC Each termination contact of device.The inspection of this IC device exists：The low temperature that IC device is cooled to set point of temperature and executes is examined The high temperature inspection looked into and IC device is heated to set point of temperature and executes.

In addition, there being a kind of IC mechanical hand disclosed in patent documentation 1, this IC mechanical hand has in the inspection carrying out IC device In the case of adsorb and hold 2 of IC device conveying handss.

Patent documentation 1：Japanese Unexamined Patent Publication 8-105937 publication

However, in device described in patent documentation 1 it is impossible to carry out the low temperature inspection of IC device and high temperature check this two Side.

In addition, loading it is impossible to be held using conveying handss to IC device in device described in patent documentation 1 And the IC device that loads make this IC device be placed in this electronic unit on the assigned position of electronic unit mounting portion of conveying The other positions of mounting portion.

Content of the invention

The present invention is in order to solve at least a portion of above-mentioned problem and to complete, and as following mode or can answer Use-case is realizing.

Application examples 1

Should be characterised by having by electronic component handling apparatus involved by use-case：First delivery section, it can convey Electronic unit simultaneously makes above-mentioned electronic unit become the first temperature；And second delivery section, it can convey above-mentioned electronic unit simultaneously Above-mentioned electronic unit is made to become the second temperature different from above-mentioned first temperature.

Thus, in the case of the inspection carrying out electronic unit, can be under each of the first temperature and second temperature Carry out.In addition, when the temperature switching that can reduce the first temperature and second temperature sets man-hour, wait before temperature stabilization Between.

Application examples 2

In electronic component handling apparatus described in above-mentioned application examples, preferably above-mentioned first delivery section has：First electricity Subassembly mounting portion, it can load above-mentioned electronic unit and so that this electronic unit is moved, and above-mentioned electronic unit can be made to become For above-mentioned first temperature；And the first electronic unit handle part, it can hold above-mentioned electronic unit and so that this electronic unit is moved Dynamic, and above-mentioned electronic unit can be made to become above-mentioned first temperature, above-mentioned second delivery section has：Second electronic unit mounting Portion, it can load above-mentioned electronic unit and so that this electronic unit is moved, and above-mentioned electronic unit can be made to become above-mentioned second Temperature；And the second electronic unit handle part, it can hold above-mentioned electronic unit and so that this electronic unit is moved, and can make Above-mentioned electronic unit becomes above-mentioned second temperature.

Thus, in the case of the inspection carrying out electronic unit, can be under each of the first temperature and second temperature Carry out.

Application examples 3

In electronic component handling apparatus described in above-mentioned application examples, it is preferably provided with：Electronic unit mounting portion, it has Above-mentioned electronic unit can be made to become the first electronic unit mounting portion temperature setting portion of above-mentioned first temperature and can make Stating electronic unit becomes the second electronic unit mounting portion temperature setting portion of above-mentioned second temperature, and can load the above-mentioned ministry of electronics industry Part and make this electronic unit move；And electronic unit handle part, it has can make above-mentioned electronic unit become above-mentioned first First electronic unit handle part temperature setting portion of temperature and above-mentioned electronic unit can be made to become the of above-mentioned second temperature Two electronic unit handle part temperature setting portion, and above-mentioned electronic unit can be held and so that this electronic unit is moved, above-mentioned first Delivery section has above-mentioned first electronic unit mounting portion temperature setting portion and above-mentioned first electronic unit handle part temperature setting portion, Above-mentioned second delivery section has above-mentioned second electronic unit mounting portion temperature setting portion and above-mentioned second electronic unit handle part temperature Degree configuration part.

Thus, using electronic unit mounting portion and electronic unit handle part, electronic unit can be delivered to regulation Position.

In addition, being set using the first electronic unit handle part temperature setting portion and the first electronic unit mounting portion temperature Portion, can make electronic unit become the first temperature, using the second electronic unit handle part temperature setting portion and second ministry of electronics industry Part mounting portion temperature setting portion, can make electronic unit become second temperature.

Application examples 4

In electronic component handling apparatus described in above-mentioned application examples, preferably there are multiple above-mentioned electronic unit mountings Portion, has multiple above-mentioned electronic unit handle parts.

Application examples 5

In electronic component handling apparatus described in above-mentioned application examples, preferably using in above-mentioned first delivery section conveying After stating electronic unit, convey above-mentioned electronic unit using above-mentioned second delivery section.

Thus, in the case that the first temperature is lower than second temperature, electronic unit is being set to the state of second temperature Under be delivered to the position of regulation, thus, it is possible to prevent the condensation of electronic unit.

Application examples 6

In electronic component handling apparatus described in above-mentioned application examples, preferably above-mentioned first temperature is than above-mentioned second temperature Low.

Thus, after electronic unit is conveyed by the first delivery section, convey the situation of electronic unit using the second delivery section Under, electronic unit is delivered to the position of regulation in the state of being set to second temperature, thus, it is possible to prevent electronic unit Condensation.

Application examples 7

In electronic component handling apparatus described in above-mentioned application examples, preferably when above-mentioned electricity is carried out with above-mentioned first temperature The inspection of subassembly and qualified in above-mentioned inspection in the case of, carry out the inspection of above-mentioned electronic unit with above-mentioned second temperature Look into.

Thus, in the case that the first temperature is lower than second temperature, carry out the inspection of electronic unit afterwards with second temperature, So as to prevent the condensation of electronic unit in the case that electronic unit is delivered to assigned position.

Application examples 8

Electronic component inspection device described in above-mentioned application examples is characterised by having：First delivery section, it can be defeated Power transmission subassembly simultaneously makes above-mentioned electronic unit become the first temperature；Second delivery section, it can convey above-mentioned electronic unit and make Above-mentioned electronic unit becomes the second temperature different from above-mentioned first temperature；And inspection portion, it is carried out to above-mentioned electronic unit Check.

Thereby, it is possible to carry out the inspection of electronic unit under each of the first temperature and second temperature.In addition, can subtract Waiting time before the temperature switching setting man-hour of few first temperature and second temperature, temperature stabilization.

Application examples 9

Preferably should be provided with above-mentioned inspection portion in electronic component inspection device involved by use-case：Can make Stating electronic unit becomes the first temperature setting portion of above-mentioned first temperature；And above-mentioned electronic unit can be made to become above-mentioned second The second temperature configuration part of temperature.

Thereby, it is possible to carry out the inspection of electronic unit under each of the first temperature and second temperature.

Application examples 10

Should be characterised by possessing by electronic component handling apparatus involved by use-case：Electronic unit mounting portion, it has First mounting portion of mounting electronic unit and the second mounting portion loading above-mentioned electronic unit, and the above-mentioned ministry of electronics industry can be conveyed Part；And electronic unit handle part, it can carry from the above-mentioned first mounting portion above-mentioned electronic unit of holding and by this electronic unit It is placed in above-mentioned second mounting portion, above-mentioned second mounting portion is different from above-mentioned first mounting portion.

Thus, in the case of the inspection carrying out electronic unit, for instance, it is possible to be initially placed in the first mounting portion and Electronic unit after checking, under conditions of regulation, the inspection finishing is placed in the second mounting portion, and by another electricity before checking Subassembly is placed in the first mounting portion.

Therefore, it is possible to realize the raising of the inspection degree of freedom producing because the different setting of inspection condition can be carried out, special It is not situation to small lot etc. than advantageous.In addition, the setting man-hour that inspection condition is changed can be reduced, check bar Waiting time before part (for example, temperature conditionss etc.) is stable.

In addition, temporarily electronic unit can not being reclaimed and being checked under the conditions of different two, in addition, two can be made Individual electronic unit is checked under conditions of mutually different simultaneously.Thereby, it is possible to improve productivity ratio.

Application examples 11

In electronic component handling apparatus described in application examples 10, preferably above-mentioned first mounting portion loads with above-mentioned second Portion arranges on the direction of above-mentioned electronic unit mounting portion movement.

Thus, moved by making electronic unit mounting portion, electronic unit handle part can will be placed in the first mounting portion Electronic unit be placed in the second mounting portion.

Application examples 12

In electronic component handling apparatus described in application examples 10 or 11, preferably above-mentioned electronic unit mounting portion has Load the 3rd mounting portion of above-mentioned electronic unit, above-mentioned 3rd mounting portion and above-mentioned first mounting portion and above-mentioned second mounting portion Different.

Thus, electronic unit handle part can will be placed in the 3rd mounting by the electronic unit being placed in the second mounting portion Portion.Checked under the conditions of different 3 thereby, it is possible to temporarily not reclaim electronic unit, in addition, 3 electronics can be made Part is checked under conditions of mutually different simultaneously, thus, it is possible to improve productivity ratio.

Application examples 13

In electronic component handling apparatus described in application examples 12, preferably above-mentioned electronic unit handle part can be from above-mentioned Second mounting portion holds above-mentioned electronic unit and this electronic unit is placed in above-mentioned 3rd mounting portion.

Checked under the conditions of different 3 thereby, it is possible to temporarily not reclaim electronic unit, in addition, 3 can be made Electronic unit is checked under conditions of mutually different simultaneously, thus, it is possible to improve productivity ratio.

Application examples 14

In electronic component handling apparatus described in any one of application examples 10～13 example, the preferably above-mentioned ministry of electronics industry The second control section that part handle part has the first control section holding above-mentioned electronic unit and holds above-mentioned electronic unit, above-mentioned First control section is different from above-mentioned second control section.

Thus, electronic unit handle part can hold the ministry of electronics industry being placed in the first mounting portion using first control section Part, and the electronic unit being placed in the second mounting portion is held using second control section.

Application examples 15

In electronic component handling apparatus described in application examples 14, preferably above-mentioned first control section holds with above-mentioned second Portion arranges on the direction of above-mentioned electronic unit mounting portion movement.

Application examples 16

In electronic component handling apparatus described in application examples 14 or 15, the temperature of preferably above-mentioned first control section with The temperature of above-mentioned second control section is different.

Checked under two different temperature conditionss thereby, it is possible to temporarily not reclaim electronic unit, in addition, can So that two electronic units is checked under mutually different temperature conditionss simultaneously.

Application examples 17

In electronic component handling apparatus described in application examples 14 or 15, the temperature ratio of preferably above-mentioned first control section The temperature of above-mentioned second control section is low.

Application examples 18

In electronic component handling apparatus described in any one of application examples 14～17 example, the preferably above-mentioned ministry of electronics industry Part handle part has the 3rd handle part holding above-mentioned electronic unit, above-mentioned 3rd handle part and above-mentioned first control section and on State second control section different.

Checked under the conditions of different 3 thereby, it is possible to temporarily not reclaim electronic unit, in addition, 3 can be made Electronic unit is checked under conditions of mutually different simultaneously.

Application examples 19

In electronic component handling apparatus described in application examples 18, the temperature of preferably above-mentioned 3rd handle part and above-mentioned the The temperature of the temperature of one handle part and above-mentioned second control section is different.

Checked under 3 different temperature conditionss thereby, it is possible to temporarily not reclaim electronic unit, in addition, can So that 3 electronic units is checked under mutually different temperature conditionss simultaneously.

Application examples 20

In electronic component handling apparatus described in application examples 18, the temperature of preferably above-mentioned 3rd handle part is than above-mentioned The temperature of the temperature of one handle part and above-mentioned second control section is high.

Application examples 21

Electronic component inspection device involved by use-case should be characterised by possessing：Electronic unit mounting portion, it has First mounting portion of mounting electronic unit and the second mounting portion loading above-mentioned electronic unit, and the above-mentioned ministry of electronics industry can be conveyed Part；Electronic unit handle part, it can be placed in from the above-mentioned first mounting portion above-mentioned electronic unit of holding and by this electronic unit Above-mentioned second mounting portion；And inspection portion, it checks to above-mentioned electronic unit, and above-mentioned second mounting portion carries with above-mentioned first Put portion's difference, above-mentioned first mounting portion loads the above-mentioned electronic unit before being checked, above-mentioned second load using above-mentioned inspection portion Put the above-mentioned electronic unit after portion's mounting is checked using above-mentioned inspection portion.

Brief description

Figure 1A is the diagrammatic top view of the first embodiment of the electronic component inspection device representing the present invention.

Figure 1B is for being said with device delivery head and the second inspection device delivery head to first inspection of Figure 1A Bright top view.

Fig. 2 is the block diagram of the electronic component inspection device shown in Figure 1A.

Fig. 3 is the figure that the action for the second embodiment to electronic component inspection device illustrates.

Fig. 4 is the figure that the action for the second embodiment to electronic component inspection device illustrates.

Fig. 5 is the figure that the action for the second embodiment to electronic component inspection device illustrates.

Fig. 6 is the figure that the action for the second embodiment to electronic component inspection device illustrates.

Fig. 7 is the figure that the action for the second embodiment to electronic component inspection device illustrates.

Fig. 8 is the figure that the action for the second embodiment to electronic component inspection device illustrates.

Fig. 9 is the figure that the action for the second embodiment to electronic component inspection device illustrates.

Figure 10 is the figure that the action for the second embodiment to electronic component inspection device illustrates.

Figure 11 is the figure that the action for the second embodiment to electronic component inspection device illustrates.

Figure 12 A is the figure that the action for the 3rd embodiment to electronic component inspection device illustrates.

Figure 12 B is for being carried out with device delivery head and the second inspection device delivery head to first inspection of Figure 12 A The top view illustrating.

Figure 13 is the figure that the action for the 3rd embodiment to electronic component inspection device illustrates.

Figure 14 is the figure that the action for the 3rd embodiment to electronic component inspection device illustrates.

Figure 15 is the figure that the action for the 3rd embodiment to electronic component inspection device illustrates.

Figure 16 is the figure that the action for the 3rd embodiment to electronic component inspection device illustrates.

Figure 17 is the figure that the action for the 3rd embodiment to electronic component inspection device illustrates.

Figure 18 is the figure that the action for the 3rd embodiment to electronic component inspection device illustrates.

Figure 19 is the figure that the action for the 3rd embodiment to electronic component inspection device illustrates.

Figure 20 A is the diagrammatic top view of the 4th embodiment of the electronic component inspection device representing the present invention.

Figure 20 B is for being carried out with device delivery head and the second inspection device delivery head to first inspection of Figure 20 A The top view illustrating.

Figure 21 is the block diagram of the electronic component inspection device shown in Figure 20 A.

Figure 22 A is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 22 B is for being carried out with device delivery head and the second inspection device delivery head to first inspection of Figure 22 A The top view illustrating.

Figure 23 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 24 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 25 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 26 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 27 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 28 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 29 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 30 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 31 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 32 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 33 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 34 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 35 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 36 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 37 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 38 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 39 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 40 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 41 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 42 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 43 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 44 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 45 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 46 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 47 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 48 is the figure for illustrating to the action of the electronic component inspection device shown in Figure 20 A.

Figure 49 is that the first inspection in the 5th embodiment of the electronic component inspection device showing schematically the present invention is used Device delivery head and the top view in inspection portion.

Specific embodiment

Hereinafter, based on embodiment shown in the drawings to the electronic component handling apparatus of the present invention and electronic unit inspection Device is described in detail.

Additionally, following, for convenience of description, such as shown in Figure 1A and Figure 20 A, three mutually orthogonal axles are set to X-axis, Y-axis and Z axis.In addition, the X/Y plane including X-axis with Y-axis is level, Z axis are vertical.In addition, by the side parallel with X-axis To also referred to as " X-direction ", the direction parallel with Y-axis is also referred to as " Y-direction ", the direction parallel with Z axis is also referred to as " Z side To ".In addition, the direction of arrow of each axle of X-axis, Y-axis and Z axis is referred to as positive side, the direction contrary with arrow is referred to as minus side. In addition, the upstream side of the conveying direction of electronic unit is also referred to as " upstream side ", downstream is also referred to as " downstream ".Separately Outward, " level " described in present specification is not limited to completely level, as long as the conveying of without prejudice to electronic unit, Including the state tilting with respect to level somewhat (for example less than 5 ° about).

The check device (electronic component inspection device) 1 below illustrating, 1c are e.g. used for BGA (Ball grid array：BGA) packaging body, LGA (Land grid array：Grid matrix) IC device, the LCD (Liquid such as packaging body Crystal Display：Liquid crystal display), CIS (CMOS Image Sensor：Cmos image sensor) etc. electronic unit Electrical characteristics carry out checking/test the device of (hereinafter referred to as " checking ").Additionally, below for convenience of description, with using IC device Part to illustrate for representativeness as the situation of the above-mentioned electronic unit being checked, is set to " IC device 90 ".

First embodiment

Figure 1A is the diagrammatic top view of the first embodiment of the electronic component inspection device representing the present invention.Figure 1B is to use The top view illustrating in the first inspection device delivery head to Figure 1A and the second inspection device delivery head.Fig. 2 is The block diagram of the electronic component inspection device shown in Figure 1A.

Additionally, in figure ia, the first inspection with device delivery head and the second inspection device delivery head due to other Part is overlapping, so being recorded with double dot dash line.In addition, for the ease of to the first inspection device delivery head and second Inspection device delivery head illustrates, and describes the first inspection device delivery head and the second inspection device in fig. ib Delivery head.

As shown in Figure 1A, check device 1 is divided into：Pallet supply area A1, device supply area (hereinafter referred to as " supply To region ") A2, inspection area A3, device recovery zone (hereinafter referred to as " recovery zone ") A4 and pallet remove region A5.Above-mentioned each region is mutually separated by wall portion (not shown), gate etc..And, supply area A2 becomes by wall portion, gate etc. stroke The the first Room R1 dividing, in addition, inspection area A3 becomes by second Room R2 of the divisions such as wall portion, gate, in addition, recovery zone A4 becomes It is by the 3rd Room R3 of the divisions such as wall portion, gate.In addition, the first Room R1 (supply area A2), second Room R2 (inspection area A3) And the 3rd Room R3 (recovery zone A4) be respectively structured as being able to ensure that air-tightness, thermal insulation.Thus, the first Room R1, second Room R2 and the 3rd Room R3 is able to maintain humidity, temperature as much as possible.Additionally, in the first Room R1 and second Room R2 respectively by It is controlled to the humidity of regulation and the temperature of regulation.

IC device 90 sequentially passes through the above-mentioned each region removing region A5 from pallet supply area A1 to pallet, and in midway Inspection area A3 checked.So, check device 1 possesses：In each region, IC device 90 is conveyed and be there is control The electronic component handling apparatus in portion 80 processed；The inspection portion 16 being checked in the A3 of inspection area；And (not shown) check control Portion processed.Additionally, in check device 1, electronic unit conveying is constituted by the structure in addition to inspection portion 16 and inspection control unit Device.

The region of the pallet 200 of multiple IC devices 90 that pallet supply area A1 is supplied with being arranged with non-inspection state. In the A1 of pallet supply area, multiple pallets 200 can be laminated.

Supply area A2 is to be respectively fed to examine by the multiple IC devices 90 on the pallet 200 of pallet supply area A1 Look into the region of region A3.Additionally, in the way of across pallet supply area A1 and supply area A2, being provided with singly defeated Send the first conveyor pallet structure 11A, the second conveyor pallet structure 11B of pallet 200.

In supply area, A2 is provided with：First temperature adjustment portion (the first temperature-uniforming plate) 12a, it is for IC device 90 mounting First mounting portion；Second temperature adjustment portion (the second temperature-uniforming plate) 12b, it is the second mounting portion for IC device 90 mounting；Supply With device delivery head 13；And the 3rd conveyor pallet structure 15.

First temperature adjustment portion 12a is multiple IC devices 90 to be cooled down and the temperature adjustment (control by this IC device 90 System) for being suitable for the device (temperature control unit) of the temperature (the first temperature) checking (low temperature inspection).In addition, second temperature adjustment Portion 12b is multiple IC devices 90 are heated and to be to be suitable for inspection (high temperature detector by the temperature of this IC device 90 adjustment (control) Look into) temperature (second temperature) device (temperature control unit).First temperature adjustment portion 12a and second temperature adjustment portion 12b Configure along the Y direction and fixing.And, move into (conveying comes) by the first conveyor pallet structure 11A from pallet supply area A1 Pallet 200 on IC device 90 conveyed and be placed in the first temperature adjustment portion 12a or second temperature adjustment portion 12b.This Outward, above-mentioned first temperature is lower than above-mentioned second temperature (the first temperature is different from second temperature).

Supply device delivery head 13 be supported to can in the A2 of supply area in X direction, Y-direction and Z-direction move Dynamic.Thus, supply device delivery head 13 can undertake：The pallet 200 moved into from pallet supply area A1 and the first temperature are adjusted The conveying of IC device 90 between whole 12a or second temperature adjustment portion 12b and the first temperature adjustment portion 12a or IC device 90 between two temperature adjustment portions 12b and the first device supply unit 14a described later or the second device supply unit 14b Conveying.Additionally, supply device delivery head 13 has multiple hand unit 131 as the handle that IC device 90 can be held Hold portion, each hand unit 131 possesses adsorption nozzle in the same manner as aftermentioned first hand unit 171a, and IC is held by absorption Device 90.In addition, it is also possible to be configured to and the first temperature in each hand unit 131 of supply device delivery head 13 Adjustment portion 12a, second temperature adjustment portion 12b are similarly cooled down to IC device 90 or are heated, thus by this IC device 90 Temperature be adjusted to be suitable for inspection temperature.

3rd conveyor pallet structure 15 is to make to eliminate the pallet 200 of the sky in the state of whole IC devices 90 in X direction The mechanism of conveying.And, after this conveying, empty pallet 200 returns from supply area A2 by the second conveyor pallet structure 11B Return to pallet supply area A1.

Inspection area A3 is the region that IC device 90 is checked.In this inspection area, A3 is provided with：First device supplies To portion (the first electronic unit mounting portion) (first supply reciprocating apparatus) 14a, it is can to load (configuration) IC device 90 and right It is conveyed first mounting portion of (movement)；(the second supply is reciprocal for second device supply unit (the second electronic unit mounting portion) Device) 14b, it is to load (configuration) IC device 90 and it is conveyed with second mounting portion of (movement)；Inspection portion 16； First checks with device delivery head (the first electronic unit handle part) 17a；Second checks with device delivery head (the second electronic unit Handle part) 17b；First device recoverer (first recovery reciprocating apparatus) 18a, it is can to load IC device 90 and it is carried out The mounting portion of conveying；And the second device recoverer (the second recovery reciprocating apparatus) 18b, it is can to load IC device 90 and right Its mounting portion being conveyed.

First device supply unit 14a and the second device supply unit 14b is will to have carried out temperature adjustment (temperature control respectively System) inspection before IC device 90 be delivered to the device near inspection portion 16.

First device supply unit 14a and the second device supply unit 14b is respectively provided with：Load joining of (configuration) IC device 90 Put plate 142；And the device supply unit main body 141 that can move in X direction.It is provided with multiple in the upper surface of configuration plate 142 Pocket portion 145, above-mentioned multiple pocket portions 145 are the recesses housing (holding) IC device 90.Additionally, in the construction illustrated, pocket portion 145 It is arranged with 4 in X direction, is arranged with 2 along Y-direction, add up to and be arranged with 8 with rectangular.This configuration plate 142 is dismounting Mode be arranged at device supply unit main body 141.First device supply unit 14a and the second device supply unit 14b respectively by Support as can moving along the X direction between supply area A2 and inspection area A3.In addition, the first device supply unit 14a with Second device supply unit 14b configures along the Y direction, the IC device in the first temperature adjustment portion 12a or second temperature adjustment portion 12b Part 90 is supplied to and conveys and be placed in the first device supply unit 14a or the second device supply unit 14b with device delivery head 13.This Outward, in the first device supply unit 14a, in the same manner as the first temperature adjustment portion 12a, IC device 90 is cooled down such that it is able to It temperature adjustment (can set) of this IC device 90 is the temperature (the first temperature) being suitable for checking.In addition, supplying in the second device To in portion 14b, being heated such that it is able to by this IC device 90 in the same manner as second temperature adjustment portion 12b to IC device 90 Temperature adjustment (can set) is the temperature (second temperature) being suitable for checking.

Additionally, be made up of the (supply of electronic unit mounting portion the first device supply unit 14a and the second device supply unit 14b Reciprocating apparatus).

Inspection portion 16 is that the electrical characteristics to IC device 90 carry out checking/test the unit of (carrying out electric-examination to look into), are right IC device 90 keeps the part of this IC device 90 in the case of being checked.

Inspection portion 16 has：Keep the holding member 162 of IC device 90；And the inspection portion master of supporting holding member 162 Body 161.Holding member 162 is arranged at inspection portion main body 161 in a detachable manner.

The upper surface of the holding member 162 in inspection portion 16 is provided with multiple maintaining parts 163, above-mentioned multiple maintaining parts 163 It is the recess housing (holding) IC device 90.Additionally, in the construction illustrated, maintaining part 163 is arranged with 4 in X direction, along Y Direction is arranged with 2, adds up to and is arranged with 8 with rectangular.IC device 90 is accommodated in maintaining part 163, is thus configured (to carry Put) in inspection portion 16.

In addition, on the corresponding position of each maintaining part 163 with inspection portion 16, being respectively arranged with and keeping IC device 90 The probe electrically connecting with the terminal of this IC device 90 in the state of maintaining part 163.And, make terminal and the probe of IC device 90 Electrical connection (contact), thus carry out the inspection of IC device 90 via probe.The inspection of IC device 90 is based on program and carries out, this journey Sequence is stored in the storage part of the inspection control unit that the tester (not shown) being connected with inspection portion 16 is possessed.

In addition, 4 maintaining parts 163 of downside constitute the first temperature and set in Figure 1A in the 8 of inspection portion 16 maintaining parts 163 Determine portion 166, this first temperature setting portion 166 is cooled down to IC device 90 in the same manner as the first temperature adjustment portion 12a, so as to Enough temperature adjustment (can set) by this IC device 90 are the temperature (the first temperature) being suitable for checking.In addition, the 8 of inspection portion 16 In Figure 1A in individual maintaining part 163,4 maintaining parts 163 of upside constitute second temperature configuration part 167, this second temperature configuration part 167 are heated the temperature adjustment such that it is able to by this IC device 90 in the same manner as second temperature adjustment portion 12b to IC device 90 (can set) is the temperature (second temperature) being suitable for checking.

First inspection device delivery head 17a and the second inspection device delivery head 17b is supported to respectively can be Move along Y-direction and Z-direction in the A3 of inspection area.In addition, the first inspection device delivery head 17a and the second inspection device Delivery head 17b configures along the Y direction.First inspection device delivery head 17a can be by the first device moved into from supply area A2 IC device 90 on part supply unit 14a conveys and is positioned in inspection portion 16, in addition, can be by the IC device 90 in inspection portion 16 Convey and be positioned on the first device recoverer 18a.Similarly, the second inspection device delivery head 17b can be by from drainage area The IC device 90 on the second device supply unit 14b that domain A2 moves into conveys and is positioned in inspection portion 16, in addition, can will check IC device 90 in portion 16 conveys and is positioned on the second device recoverer 18b.In addition, in the feelings that IC device 90 is checked Under condition, the first inspection device delivery head 17a and the second inspection device delivery head 17b is respectively facing inspection portion 16 pressing IC Device 90, thus makes IC device 90 abut with inspection portion 16.Thus, as described above, by the terminal of IC device 90 and inspection portion 16 Probe electrical connection.

As shown in Figure 1B, the first inspection device delivery head 17a has multiple first hands that can hold IC device 90 Unit (first control section) 171a.Additionally, in the construction illustrated, the first hand unit 171a is arranged with 4 in X direction, along Y Direction is arranged with 2, adds up to and is arranged with 8 with rectangular.Similarly, have can be for the second inspection device delivery head 17b Hold multiple second hand unit (second control section) 171b of IC device 90.Additionally, in the construction illustrated, the second hand unit 171b is arranged with 4 in X direction, is arranged with 2 along Y-direction, adds up to and is arranged with 8 with rectangular.

The structure of each first hand unit 171a and each second hand unit 171b is identical, therefore following, typically One the first hand unit 171a is illustrated.First hand unit 171a has：Keep the holding part of IC device 90 173；And supporting holds the hand unit main body 172 of part 173.Hold part 173 to be arranged in a detachable manner Hand unit main body 172.This first hand unit 171a possesses adsorption nozzle, and to hold IC device 90 by absorption.

In addition, in the first inspection with, in each first hand unit 171a of device delivery head 17a, adjusting with the first temperature respectively Whole 12a is similarly cooled down to IC device 90 such that it is able to IC device 90 is adjusted (can set) is to be suitable for checking Temperature (the first temperature).

In addition, in the second inspection with, in each second hand unit 171b of device delivery head 17b, adjusting with second temperature respectively Whole 12b is similarly heated to IC device 90 such that it is able to IC device 90 is adjusted (can set) is to be suitable for checking Temperature (second temperature).

Additionally, electronic unit is constituted by the first inspection device delivery head 17a and the second inspection device delivery head 17b Handle part.

First device recoverer 18a and the second device recoverer 18b is to finish the inspection in inspection portion 16 respectively IC device 90 be delivered to the device of recovery zone A4.

First device recoverer 18a and the second device recoverer 18b is respectively provided with：Load joining of (configuration) IC device 90 Put plate 182；And the device recoverer main body 181 that can move in X direction.It is provided with multiple in the upper surface of configuration plate 182 Pocket portion 185, above-mentioned multiple pocket portions 185 are the recesses housing (holding) IC device 90.Additionally, in the construction illustrated, pocket portion 185 It is arranged with 4 in X direction, is arranged with 2 along Y-direction, add up to and be arranged with 8 with rectangular.This configuration plate 182 is dismounting Mode be arranged at device recoverer main body 181.First device recoverer 18a and the second device recoverer 18b respectively by Support as can moving along the X direction between inspection area A3 and recovery zone A4.In addition, the first device recoverer 18a with Second device recoverer 18b configures along the Y direction.IC device 90 in inspection portion 16 is by the first inspection device delivery head 17a Convey and be placed in the first device recoverer 18a, or conveyed and be placed in the second device by the second inspection device delivery head 17b Part recoverer 18b.

Additionally, in the present embodiment, it is configured to the first device recoverer 18a mutually only with the first device supply unit 14a On the spot move, but be not limited to this, for example, it is also possible to be configured to the first device recoverer 18a and the first device supply unit 14a Link or integrally-formed, thus the first device recoverer 18a and the first device supply unit 14a one is mobile.Similarly, exist In present embodiment, it is configured to the second device recoverer 18b and the second device supply unit 14b and moves independently of each other, but not It is defined in this, for example, it is also possible to be configured to the second device recoverer 18b link or integrated with the second device supply unit 14b Formed, thus the second device recoverer 18b and the second device supply unit 14b one is mobile.

Recovery zone A4 is to reclaim the region checking the IC device 90 finishing.This recovery zone A4 is provided with：Return Receive and use pallet 19；Reclaim and use device delivery head 20；And the 6th conveyor pallet structure 21.In addition, being ready in recovery zone A4 Free pallet 200.

Recovery pallet 19 is fixed in the A4 of recovery zone, and is configured with 3 in the present embodiment along the X direction. In addition, the pallet 200 of sky is configured with 3 also along X-direction.And, mobile the first device recoverer 18a to recovery zone A4 Or the IC device 90 on the second device recoverer 18b is conveyed and is placed in the pallet of above-mentioned recovery pallet 19 and sky Any one of 200.Thus, according to inspection result, IC device 90 is reclaimed and classified.

Recovery device delivery head 20 be supported to can in the A4 of recovery zone in X direction, Y-direction and Z-direction move Dynamic.Thus, recovery device delivery head 20 can be by IC device 90 from the first device recoverer 18a or the second device recoverer 18b is delivered to recovery pallet 19, empty pallet 200.Additionally, recovery device delivery head 20 has multiple hand unit 201 As the handle part that IC device 90 can be held, each hand unit 201 is in the same manner as above-mentioned first hand unit 171a Possess adsorption nozzle, and IC device 90 is held by absorption.

6th conveyor pallet structure 21 is so that the pallet 200 removing the sky that region A5 moves into from pallet is conveyed in X direction Mechanism.And, after this conveying, empty pallet 200 is configured in the position that IC device 90 is reclaimed, can become on State any one of 3 empty pallets 200.

It is to check that the pallet 200 finishing multiple IC devices 90 under state is carried out back to being arranged with that pallet removes region A5 The region received, remove.Remove in the A5 of region in pallet, multiple pallets 200 can be laminated.

In addition, in the way of removing region A5 across recovery zone A4 with pallet, being provided with singly conveying pallet 200 the 4th conveyor pallet structure 22A, the 5th conveyor pallet structure 22B.4th conveyor pallet structure 22A is will to be placed with inspection The pallet 200 looking into the IC device 90 finishing is delivered to, from recovery zone A4, the mechanism that pallet removes region A5.5th pallet conveying Mechanism 22B is to be delivered to recovery zone by being used for the pallet 200 to the sky that IC device 90 is reclaimed from pallet removing region A5 The mechanism of A4.

In addition, the inspection control unit of above-mentioned tester, for example based on the program being stored in storage part (not shown), is carried out It is configured in (electric) inspection of the electrical characteristics of IC device 90 in inspection portion 16 etc..

In addition, as shown in Fig. 2 check device 1 has：Control unit 80；Electrically connect with control unit 80 and carry out check device 1 Each operation operating portion 6；The cooling body 41,42,43 and 44 that IC device 90 is cooled down；And IC device 90 is entered The heating arrangements 51,52,53 and 54 of row heating.

Control unit 80 has the storage part 801 etc. storing each information (data), for example to the first conveyor pallet structure 11A, Second conveyor pallet structure 11B, the first temperature adjustment portion 12a, second temperature adjustment portion 12b, supply device delivery head 13, the One device supply unit 14a, the second device supply unit 14b, the 3rd conveyor pallet structure 15, first check with device delivery head 17a, Second checks with device delivery head 17b, the first device recoverer 18a, the second device recoverer 18b, reclaims and use device delivery head 20th, the 6th conveyor pallet structure 21, the 4th conveyor pallet structure 22A, the 5th conveyor pallet structure 22B, display part 62, cooler The driving in each portions such as structure 41～44, heating arrangements 51～54 is controlled.

In addition, operating portion 6 has：Carry out the input unit 61 of each input；And each information (data) shows to image etc. The display part 62 showing.As input unit 61, it is not particularly limited, for example, can enumerate keyboard, mouse etc..In addition, as display Portion 62, is not particularly limited, for example, can enumerate display panels, organic EL display panel etc..Operator's (operator) Operation inputting part 61 is for example passed through in the operation of operating portion 6, makes the mobile each operation button (figure to display on display part 62 of cursor Mark) position and selected (click) to realize.

Additionally, as input unit 61, being not limited to above-mentioned structure, for example, can enumerate the mechanical operation such as button and press Button etc..In addition, as operating portion 6, being not limited to above-mentioned structure, for example can enumerate touch panel etc. can be inputted with And the device of the display of information etc..

In addition, cooling body 41 cools down to the first temperature adjustment portion 12a, and via this first temperature adjustment portion 12a And IC device 90 is cooled down.In addition, cooling body 42 cools down to the first device supply unit 14a, and via this first Device supply unit 14a cools down to IC device 90.In addition, cooling body 43 is carried out with device delivery head 17a to the first inspection Cooling, and IC device 90 is cooled down with device delivery head 17a via this first inspection.In addition, cooling body 44 is to inspection In Figure 1A in 8 maintaining parts 163 in portion 16 downside 4 maintaining parts 163, the first temperature setting portion 166 is cooled down, And via this first temperature setting portion 166, IC device 90 is cooled down.

As cooling body 41～44, it is not particularly limited, for example can enumerate makes cold-producing medium (for example, by liquid nitrogen gasification The gas of low temperature such as nitrogen etc.) in cooling object or in the body that is configured near it flowing being cooled down Device, peltier element etc..

In addition, heating arrangements 51 heat to second temperature adjustment portion 12b, and via this second temperature adjustment portion 12b IC device 90 is heated.In addition, heating arrangements 52 heat to the second device supply unit 14b, and via this second device Part supply unit 14b heats to IC device 90.In addition, heating arrangements 53 are carried out with device delivery head 17b to the second inspection adding Heat, and IC device 90 is heated with device delivery head 17b via this second inspection.In addition, heating arrangements 54 are to inspection portion In Figure 1A in 16 8 maintaining parts 163 upside 4 maintaining parts 163, second temperature configuration part 167 is heated, and Via this second temperature configuration part 167, IC device 90 is heated.

As heating arrangements 51～54, it is not particularly limited, for example, include heater with heating wire etc..

In this check device 1, can concurrently enter to be about to IC device 90 and be cooled to set point of temperature come the low temperature to execute Check and IC device 90 is heated to specify the high temperature to execute of temperature checks each.

In the case of carrying out low temperature inspection, conveyed by the first temperature adjustment portion 12a using the first device supply unit 14a side IC device 90 after cooling, while cooling down to it, then, using the first inspection first hand list of device delivery head 17a First 171a side holds IC device 90, while cooling down to it.Then, convey IC using the first inspection with device delivery head 17a Device 90, IC device 90 is held in first temperature setting portion 166 in inspection portion 16, and carries out low temperature inspection.

In addition, in the case of carrying out high temperature inspection, being adjusted by second temperature using the second device supply unit 14b side conveying IC device 90 after portion 12b heating, while heating to it, then, using the second inspection with the second-hand of device delivery head 17b Portion unit 171b side holds IC device 90, while heating to it.Then, using the second inspection with device delivery head 17b Lai defeated Send IC device 90, IC device 90 is held in the second temperature configuration part 167 in inspection portion 16, and carries out high temperature inspection.

Additionally, the first delivery section is constituted by the first device supply unit 14a and the first inspection device delivery head 17a etc., This first delivery section can convey IC device 90 and IC device 90 is adjusted to the first temperature.In addition, by the second device supply unit 14b and second checks and constitutes the second delivery section with device delivery head 17b etc., this second delivery section can convey IC device 90 simultaneously IC device 90 is adjusted to second temperature.

As described above, according to this check device 1, the low temperature inspection of IC device 90 and high temperature detector can be carried out Each looked into, thus convenience is higher.

In addition, low temperature inspection and high temperature inspection can be carried out parallel, therefore, it is possible to improve productivity ratio.

Second embodiment

The action of the second embodiment namely for the electronic component inspection device to the present invention for Fig. 3～Figure 11 is carried out The figure illustrating.

Additionally, in Fig. 3～Figure 11, the first inspection with device delivery head and the second inspection device delivery head due to Miscellaneous part is overlapping, so being recorded with double dot dash line.

Hereinafter, second embodiment is illustrated, but by with the difference of above-mentioned first embodiment centered on carry out Illustrate, omit the explanation of identical item.

In the check device 1 of second embodiment, for IC device 90, carry out low temperature inspection first, then carry out height Temperature detector is looked into, and afterwards the IC device 90 that above-mentioned inspection finishes is conveyed (recovery) to recovery zone A4.Therefore, carrying out low temperature inspection Look into and high temperature check in the case of, it is possible to increase productivity ratio.Further, since IC device 90 be not state with low temperature but with The state of high temperature is transported to recovery zone A4, it is possible to preventing the condensation of IC device 90.Hereinafter, dynamic to check device 1 Illustrate.

First, as shown in figure 3, IC device 90 is configured at 4 pocket portions of upside in Fig. 3 of the first device supply unit 14a 145 and it is cooled down.In addition it is also possible to IC device 90 is configured at 4 of downside in Fig. 3 of the first device supply unit 14a Individual pocket portion 145.

Next, as shown in figure 4, cooling down IC device 90 using the first device supply unit 14a side, while being transported to and examining Look into the corresponding position in portion 16.

Next, as shown in figure 5, being held with first hand unit 171a of device delivery head 17a using the first inspection IC device 90, and it is cooled down.

Next, cooling down IC device 90 as shown in fig. 6, checking using first with device delivery head 17a side, while being conveyed To first temperature setting portion 166 in inspection portion 16, and carry out low temperature inspection.

After this low temperature checks, carry out high temperature inspection, but although the whole IC that low temperature inspection can be finished Device 90 carries out high temperature inspection, but preferably only carries out high temperature inspection to qualified IC device 90 in low temperature inspection, to unqualified IC device 90 do not carry out high temperature inspection.Thereby, it is possible to shorten the time required for high temperature checks.

Next, as shown in fig. 7, being held with second hand unit 171b of device delivery head 17b using the second inspection IC device 90, and it is heated.Additionally, here it is also possible to utilize the first inspection device delivery head 17a with keeping intact The first hand unit 171a holding IC device 90.In addition, the second device supply unit 14b is mobile extremely corresponding with inspection portion 16 Position.

Next, heating IC device 90 as shown in figure 8, checking using second with device delivery head 17b side, while being conveyed To position corresponding with the second device supply unit 14b, and it is configured at the pocket portion 145 of the second device supply unit 14b.Then, utilize IC device 90 is heated to the temperature specifying by the second device supply unit 14b.

Next, being held as shown in figure 9, checking using second with the second hand unit 171b side of device delivery head 17b And heat IC device 90, while being transported to the second temperature configuration part 167 in inspection portion 16, and carry out high temperature inspection.In addition, the The mobile extremely position corresponding with inspection portion 16 of two device recoverer 18b.

Next, as shown in Figure 10, IC device 90 is delivered to and the second device using the second inspection device delivery head 17b The corresponding position of part recoverer 18b, and it is configured at the pocket portion 185 of the second device recoverer 18b.Then, as shown in figure 11, utilize IC device 90 is delivered to recovery zone A4 by the second device recoverer 18b.Additionally, this IC device 90 towards recovery zone A4's Conveying can also be carried out by the first device recoverer 18a.

In addition, for an IC device 90, in the case of carrying out low temperature inspection and high temperature inspection, can not temporarily return Receive IC device 90 and carry out its low temperature inspection and high temperature inspection, thus, it is possible to improve productivity ratio.

3rd embodiment

Figure 12 A～Figure 19 enters namely for the action of the 3rd embodiment of the electronic component inspection device to the present invention The figure of row explanation.

Additionally, in Figure 12 A～Figure 19, the first inspection with device delivery head and the second inspection device delivery head due to Overlapping with miscellaneous part, so being recorded with double dot dash line.In addition, for the ease of to the first inspection device in Figure 12 A Delivery head and the second inspection device delivery head illustrate, recorded in Figure 12 B the first inspection device delivery head with And second check use device delivery head.

Hereinafter, the 3rd embodiment is illustrated, but by with the difference of above-mentioned first embodiment centered on carry out Illustrate, omit the explanation of identical item.

As shown in Figure 12 A and Figure 12 B, in the check device 1 of the 3rd embodiment, device delivery head is used in the first inspection In 8 first hand unit 171a of 17a, downside in Figure 12 A and Figure 12 B 4 the first hand unit 171a constitute device Part delivery head first temperature setting portion (the first electronic unit handle part temperature setting portion) 176, this device delivery head first temperature Configuration part 176 can cool down to IC device 90, thus temperature adjustment (can set) of this IC device 90 is to be suitable for inspection The temperature (the first temperature) looked into.In addition, first checks with 8 first hand unit 171a of device delivery head 17a, figure In 12A and Figure 12 B, 4 the first hand unit 171a of upside constitute device delivery head second temperature configuration part (the second electronics Part handle part temperature setting portion) 177, this device delivery head second temperature configuration part 177 can be heated to IC device 90, Thus temperature adjustment (can set) of this IC device 90 is the temperature (second temperature) being suitable for checking.

Similarly, second check with 8 second hand unit 171b of device delivery head 17b, Figure 12 A and figure In 12B, 4 the second hand unit 171b of downside constitute device delivery head first temperature setting portion (the first electronic unit handle part Temperature setting portion) 176, this device delivery head first temperature setting portion 176 can cool down to IC device 90, thus by this IC Temperature adjustment (can set) of device 90 is the temperature (the first temperature) being suitable for checking.In addition, the second inspection device conveys In 8 second hand unit 171b of head 17b, upside in Figure 12 A and Figure 12 B 4 the second hand unit 171b are constituted Device delivery head second temperature configuration part (the second electronic unit handle part temperature setting portion) 177, this device delivery head second temperature Degree configuration part 177 can be heated to IC device 90, thus temperature adjustment (can set) of this IC device 90 is suitable The temperature (second temperature) checking.

In addition, in 8 pocket portions 145 of the first device supply unit 14a, in Figure 12 A and Figure 12 B downside 4 pocket portions 145 constitute device supply unit first temperature setting portion (the first electronic unit mounting portion temperature setting portion) 146, this device supply unit First temperature setting portion 146 can be cooled down to IC device 90 such that it is able to (can set the temperature adjustment of this IC device 90 Fixed) it is the temperature (the first temperature) being suitable for checking.In addition, in 8 pocket portions 145 of the first device supply unit 14a, Figure 12 A with And 4 pocket portions 145 of upside constitute device supply unit second temperature configuration part (the second electronic unit mounting portion temperature in Figure 12 B Configuration part) 147, this device supply unit second temperature configuration part 147 can be heated to IC device 90, thus by this IC device 90 temperature adjustment (can set) is the temperature (second temperature) being suitable for checking.

Similarly, in 8 pocket portions 145 of the second device supply unit 14b, in Figure 12 A and Figure 12 B downside 4 pockets Portion 145 constitutes device supply unit first temperature setting portion (the first electronic unit mounting portion temperature setting portion) 146, and this device supplies Portion's the first temperature setting portion 146 can cool down to IC device 90, thus the temperature adjustment of this IC device 90 (can be set Fixed) it is the temperature (the first temperature) being suitable for checking.In addition, in 8 pocket portions 145 of the second device supply unit 14b, Figure 12 A with And 4 pocket portions 145 of upside constitute device supply unit second temperature configuration part (the second electronic unit mounting portion temperature in Figure 12 B Configuration part) 147, this device supply unit second temperature configuration part 147 can be heated to IC device 90, thus by this IC device 90 temperature adjustment (can set) is the temperature (second temperature) being suitable for checking.

Additionally, by the structure such as device supply unit the first temperature setting portion 146 and device delivery head the first temperature setting portion 176 Become the first delivery section, this first delivery section can convey IC device 90 and IC device 90 is set as the first temperature.In addition, by device Part supply unit second temperature configuration part 147 and device delivery head second temperature configuration part 177 etc. constitute the second delivery section, and this Two delivery section can convey IC device 90 and IC device 90 is set as second temperature.

In this check device 1, for IC device 90, carry out low temperature inspection first, then carry out high temperature inspection, afterwards will The IC device 90 that above-mentioned inspection finishes conveys (recovery) to recovery zone A4.Therefore, low temperature inspection and high temperature detector are being carried out In the case of looking into, it is possible to increase productivity ratio.Further, since IC device 90 is not the state with low temperature but the state quilt with high temperature It is delivered to recovery zone A4, it is possible to preventing the condensation of IC device 90.Hereinafter, the action to check device 1 illustrates, but It is here, typically above-mentioned low to being carried out with device delivery head 17a using the first device supply unit 14a and the first inspection Temperature detector look into and high temperature inspection in the situation of the conveying of IC device 90 etc. illustrate.

First, as shown in Figure 12 A and Figure 12 B, IC device 90 is configured at the device supply of the first device supply unit 14a Portion's the first temperature setting portion 146, and it is cooled down.

Next, as shown in figure 13, cool down IC device 90 using the first device supply unit 14a side, while be transported to The corresponding position in inspection portion 16.

Next, as shown in figure 14, set with device delivery head first temperature of device delivery head 17a using the first inspection Portion 176 side holds and cools down IC device 90, while being transported to first temperature setting portion 166 in inspection portion 16, and carries out low temperature Check.

After this low temperature checks, carry out high temperature inspection, but although the whole IC devices that low temperature inspection can be finished Part 90 carries out high temperature inspection, but preferably only carries out high temperature inspection to qualified IC device 90 in low temperature inspection, to underproof IC device 90 does not carry out high temperature inspection.Thereby, it is possible to shorten the time required for high temperature checks.

Next, as shown in figure 15, IC device 90 is delivered to and the first device using the first inspection device delivery head 17a The corresponding position of part supply unit 14a, and it is configured at the device supply unit second temperature configuration part 147 of the first device supply unit 14a. Then, using device supply unit second temperature configuration part 147, IC device 90 is heated to the temperature specifying.In addition it is also possible to save The heating of the IC device 90 slightly being carried out by this device supply unit second temperature configuration part 147, and check merely with aftermentioned first and use The device delivery head second temperature configuration part 177 of device delivery head 17a is heated to IC device 90.

Next, as shown in figure 16, set with the device delivery head second temperature of device delivery head 17a using the first inspection Portion 177, to hold and to heat IC device 90, this IC device 90 is delivered to the second temperature in inspection portion 16 simultaneously as shown in figure 17 Configuration part 167, and carry out high temperature inspection.In addition, the mobile extremely position corresponding with inspection portion 16 of the first device recoverer 18a.

Next, as shown in figure 18, IC device 90 is delivered to and the first device using the first inspection device delivery head 17a The corresponding position of part recoverer 18a, and it is configured at the pocket portion 185 of the first device recoverer 18a.Then, as shown in figure 19, utilize IC device 90 is delivered to recovery zone A4 by the first device recoverer 18a.

More than, carry out low temperature inspection to using the first device supply unit 14a and the first inspection with device delivery head 17a And the situation of the conveying of IC device 90 in high temperature inspection etc. is illustrated, but also can utilize the second device supply unit 14b and the second inspection similarly carry out the IC device 90 in low temperature inspection and high temperature inspection with device delivery head 17b Conveying etc..

In addition it is also possible to concurrently carry out：Using the first device supply unit 14a and the first inspection device delivery head 17a come to convey IC device 90 thus the low temperature inspection of execution and high temperature inspection and using the second device supply unit 14b and Second inspection convey IC device 90 with device delivery head 17b thus execution low temperature inspection and high temperature inspection.Thereby, it is possible to Improve productivity ratio.

Additionally, in second, third embodiment above-mentioned, first carrying out low temperature inspection, after carry out high temperature inspection, but at this Be not limited to this in bright it is also possible to first carry out high temperature inspection, after carry out low temperature inspection.

4th embodiment

Figure 20 A is the diagrammatic top view of the 4th embodiment of the electronic component inspection device representing the present invention.Figure 20 B is For the top view that the first inspection device delivery head and the second inspection device delivery head of Figure 20 A are illustrated.Figure 21 is the block diagram of the electronic component inspection device shown in Figure 20 A.Figure 22～Figure 48 is namely for the ministry of electronics industry shown in Figure 20 A The figure that the action of part check device illustrates.

Additionally, in Figure 20 A, the first inspection with device delivery head and the second inspection device delivery head due to other Part is overlapping, so recorded (being also same for Figure 22 A～Figure 48) with double dot dash line.In addition, in Figure 20 A, being It is easy to the first inspection device delivery head and the second inspection device delivery head are illustrated, thus remembering in Figure 20 B Carry the first inspection device delivery head and the second inspection device delivery head (for Figure 22 A, has similarly entered in Figure 22 B Go record).

In addition, in Figure 22 A～Figure 48, only describing the required part of the explanation of the action of electronic component inspection device.

In addition, check device 1c is configured to carry out：IC device 90 is cooled to set point of temperature (the first temperature) to hold The low temperature inspection of row, IC device 90 is heated to set point of temperature (the 3rd temperature) the high temperature inspection to execute and in room temperature (the Two temperature) under execution room temperature inspection.Additionally, above-mentioned first temperature is lower than above-mentioned second temperature, above-mentioned second temperature is than above-mentioned 3rd temperature is low.

As shown in Figure 20 A and Figure 20 B, check device 1c is divided into：Pallet supply area A1, device supply area (with A2, inspection area A3, device recovery zone (hereinafter referred to as " recovery zone ") A4 and support down referred to as " supply area ") Disk removes region A5.Above-mentioned each region is mutually separated by wall portion (not shown), gate etc..And, supply area A2 becomes by wall First Room R1 of the divisions such as portion, gate, in addition, inspection area A3 becomes by second Room R2 of the divisions such as wall portion, gate, in addition, Recovery zone A4 becomes by the 3rd Room R3 of the divisions such as wall portion, gate.In addition, the first Room R1 (supply area A2), second Room R2 (inspection area A3) and the 3rd Room R3 (recovery zone A4) are respectively structured as being able to ensure that air-tightness, thermal insulation.Thus, first Room R1, second Room R2 and the 3rd Room R3 are able to maintain humidity, temperature as much as possible.Additionally, the first Room R1 and second It is controlled as the temperature of the humidity and regulation specifying respectively in the R2 of room.

IC device 90 sequentially passes through the above-mentioned each region removing region A5 from pallet supply area A1 to pallet, and in midway Inspection area A3 checked.So, check device 1c possesses：In each region, IC device 90 is conveyed and be there is control The electronic component handling apparatus in portion 80；The inspection portion 16 being checked in the A3 of inspection area and (not shown) inspection control Portion.Additionally, in check device 1c, electronic unit conveying dress is constituted by the structure in addition to inspection portion 16 and inspection control unit Put.

In supply area, A2 is provided with：First temperature adjustment portion (the first temperature-uniforming plate) 12c, it is for IC device 90 mounting First mounting portion；Second temperature adjustment portion (the second temperature-uniforming plate) 12d, it is the second mounting portion for IC device 90 mounting；Supply With device delivery head 13；And the 3rd conveyor pallet structure 15.

First temperature adjustment portion 12c and second temperature adjustment portion 12d be respectively multiple IC devices 90 are cooled down or The device (temperature control unit) that person heats and is the temperature being suitable for checking by temperature adjustment (control) of this IC device 90.First Temperature adjustment portion 12c and second temperature adjustment portion 12d configure and fixing along the Y direction.And, by the first conveyor pallet structure The IC device 90 that 11A moves into the pallet 200 of (conveying comes) from pallet supply area A1 is conveyed and is placed in the first temperature to be adjusted Whole 12c or second temperature adjustment portion 12d.Additionally, in the present embodiment, to respectively by the first temperature adjustment portion 12c with And second temperature adjustment portion 12d is applied to cool down the situation of device of IC device 90 and illustrates.

Supply device delivery head 13 be supported to can in the A2 of supply area in X direction, Y-direction and Z-direction move Dynamic.Thus, supply device delivery head 13 can undertake：The pallet 200 moved into from pallet supply area A1 and the first temperature are adjusted The conveying of IC device 90 between whole 12c or second temperature adjustment portion 12d and the first temperature adjustment portion 12c or IC device 90 between two temperature adjustment portions 12d and the first device supply unit 14c described later or the second device supply unit 14d Conveying.Additionally, supply device delivery head 13 has multiple hand unit 131 as the arm that IC device 90 can be held (handle part), each hand unit 131 possesses adsorption nozzle in the same manner as the first hand unit 171c described later, and is come by absorption Hold IC device 90.In addition, it is also possible to be configured to IC in each hand unit 131 of supply device delivery head 13 Device 90 is cooled down or is heated, thus the temperature of this IC device 90 is adjusted to the temperature being suitable for inspection.

Inspection area A3 is the region that IC device 90 is checked.In this inspection area, A3 is provided with：First device supplies To portion (the first reciprocating apparatus) (first supply reciprocating apparatus) 14c, it is can to load (configuration) IC device 90 and it is carried out The first electronic unit mounting portion (electronic unit mounting portion) of conveying (movement)；Second device supply unit (the second reciprocating apparatus) (the second supply reciprocating apparatus) 14d, it is the second electricity that can load (configuration) IC device 90 and it is conveyed with (movement) Subassembly mounting portion (electronic unit mounting portion)；Inspection portion 16；First checks and uses device delivery head (the first arm) 17c, and it is the One electronic unit handle part (electronic unit handle part)；Second inspection device delivery head (the second arm) 17d, it is the second electronics Part handle part (electronic unit handle part)；First device recoverer (the first recovery reciprocating apparatus) 18c, it is to load IC Device 90 and mounting portion that it is conveyed；And the second device recoverer (the second recovery reciprocating apparatus) 18d, it is can The mounting portion loading IC device 90 and it being conveyed.

First device supply unit 14c and the second device supply unit 14d is to be delivered to the IC device 90 before checking respectively Device near inspection portion 16.

First device supply unit 14c and the second device supply unit 14d is respectively provided with：Load joining of (configuration) IC device 90 Put plate 142；And the device supply unit main body 141 that can move in X direction.It is provided with multiple in the upper surface of configuration plate 142 Pocket portion 145, above-mentioned multiple pocket portions 145 are the recesses housing (holding) IC device 90.Additionally, in the construction illustrated, pocket portion 145 It is arranged with 4 in X direction, is arranged with 2 along Y-direction, add up to and be arranged with 8 with rectangular.This configuration plate 142 is dismounting Mode be arranged at device supply unit main body 141.First device supply unit 14c and the second device supply unit 14d respectively by Support as can moving along the X direction between supply area A2 and inspection area A3.In addition, the first device supply unit 14c with Second device supply unit 14d configures along the Y direction, the IC device in the first temperature adjustment portion 12c or second temperature adjustment portion 12d Part 90 is supplied to and conveys and be placed in the first device supply unit 14c or the second device supply unit 14d with device delivery head 13.

Here, as shown in fig. 22, in 8 pocket portions 145 of the first device supply unit 14c, in Figure 22 A left side 2 pockets Portion 145 is the first mounting portion 261, and in Figure 22 A, second group of 2 pocket portions 145 are the second mounting portions 262 from left to right, in Figure 22 A from left to right 3rd group of 2 pocket portions 145 are the 3rd mounting portions 263, and in Figure 22 A, 2 pocket portions 145 on right side are the 4th mounting portions 264.This One mounting portion 261, the second mounting portion 262, the 3rd mounting portion 263 and the 4th mounting portion 264 arrange in X direction.For second Device supply unit 14d is also same.

Additionally, it is also possible to be configured to IC in the first device supply unit 14c and the second device supply unit 14d Device 90 is cooled down or is heated, thus temperature adjustment (can set) of this IC device 90 is the temperature being suitable for checking.

In this case, for example, first mounting portion 261 of the first device supply unit 14c constitutes device supply unit first temperature Degree configuration part, this device supply unit first temperature setting portion can cool down to IC device 90, thus by this IC device 90 Temperature adjustment (can set) is to be suitable for the temperature (the first temperature) that low temperature checks.

In addition, the second mounting portion 262 constitutes device supply unit second temperature configuration part, this device supply unit second temperature sets Determine portion IC device 90 is not cooled down and heated any one, and make the temperature (can set) of this IC device 90 be to be suitable for often The temperature (second temperature) that temperature detector is looked into.Additionally, the second mounting portion 262 for example can also be configured to IC device 90 is carried out cold And heating, and by this cooling, heating, the temperature of IC device 90 can be adjusted to the temperature of suitable room temperature inspection but.

In addition, the 3rd mounting portion 263 constitutes device supply unit the 3rd temperature setting portion, this device supply unit the 3rd temperature sets Determine portion IC device 90 can be heated, and temperature adjustment (can set) of this IC device 90 is to be suitable for high temperature to check Temperature (the 3rd temperature).In addition, in 8 mounting portions of the first device supply unit 14C, in Figure 22 A right side 2 the 4th mounting Portion 264 is not used by the present embodiment, but also can form the structure using them.

As shown in FIG. 20 A, inspection portion 16 has：Keep the holding member 162 of IC device 90；And supporting holding member 162 inspection portion main body 161.Holding member 162 is arranged at inspection portion main body 161 in a detachable manner.

In addition, as shown in fig. 22, in 8 maintaining parts 163 in inspection portion 16, left side in Figure 22 A 2 maintaining parts 163 Constitute the first temperature setting portion 166, this first temperature setting portion 166 can cool down to IC device 90, thus by this IC device Temperature adjustment (can set) of part 90 is to be suitable for the temperature (the first temperature) that low temperature checks.

In addition, in the 8 of inspection portion 16 maintaining parts 163, in Figure 22 A, second group of 2 maintaining parts 163 constitute the from left to right Two temperature setting portion 167, this second temperature configuration part 167 IC device 90 is not cooled down and heated any one, and make this The temperature (can set) of IC device 90 is to be suitable for the temperature (second temperature) that room temperature checks.Additionally, second temperature configuration part 167 For example can also be configured to IC device 90 be cooled down and heats, and this cooling can be passed through, heat IC device 90 temperature is adjusted to the temperature that suitable room temperature checks.

In addition, in the 8 of inspection portion 16 maintaining parts 163, in Figure 22 A, the 3rd group of 2 maintaining parts 163 constitute the from left to right Three temperature setting portion 168, the 3rd temperature setting portion 168 can heat to IC device 90, thus by this IC device 90 Temperature adjustment (can set) is to be suitable for the temperature (the 3rd temperature) that high temperature checks.

In addition, in the 8 of inspection portion 16 maintaining parts 163, in Figure 22 A right side 2 maintaining parts 163 in present embodiment In be not used by, but also can form the composition using them.

As shown in Figure 20 A and Figure 20 B, first checks that using device delivery head 17c and second to check uses device delivery head 17d is supported to move along Y-direction and Z-direction in the A3 of inspection area respectively.In addition, the first inspection device conveys Head 17c and the second inspection device delivery head 17d configures along the Y direction.First inspection device delivery head 17c can be by from confession The IC device 90 on the first device supply unit 14c moved into region A2 conveys and is positioned in inspection portion 16, in addition, can be by IC device 90 in inspection portion 16 conveys and is positioned on the first device recoverer 18c.Similarly, the second inspection device conveys IC device 90 on move into from supply area A2 second device supply unit 14d can be conveyed and be positioned in inspection portion by head 17d On 16, in addition, the IC device 90 in inspection portion 16 being conveyed and being positioned on the second device recoverer 18d.In addition, right In the case that IC device 90 is checked, the first inspection device delivery head 17c and the second inspection device delivery head 17d divide Do not press IC device 90 towards inspection portion 16, so that IC device 90 is abutted with inspection portion 16.Thus, as described above, by IC device The terminal of part 90 is electrically connected with the probe in inspection portion 16.

First inspection device delivery head 17c has multiple first hand unit that IC device 90 can be held 171c.Additionally, in the construction illustrated, the first hand unit 171c is arranged with 4 in X direction, is arranged with 2 along Y-direction, closes Meter is arranged with 8 with rectangular.Similarly, the second inspection is had and IC device 90 can be held with device delivery head 17d Multiple second hand unit 171d.Additionally, in the construction illustrated, the second hand unit 171d is arranged with 4 in X direction, It is arranged with 2 along Y-direction, add up to and be arranged with 8 with rectangular.

The structure of each first hand unit 171c and each second hand unit 171d is identical, therefore following, typically One the first hand unit 171c is illustrated.As shown in Figure 22 B, the first hand unit 171c has：Keep IC device 90 Holding part 173；And supporting holds the hand unit main body 172 of part 173.Hold the side dismounting for the part 173 Formula is arranged at hand unit main body 172.This first hand unit 171c possesses adsorption nozzle, and to hold IC device by absorption Part 90.

In addition, as shown in Figure 22 B, first checks with 8 first hand unit 171c of device delivery head 17c, figure In 22B, 2 first hand unit 171c in left side are first control sections 271, and constitute hand unit first temperature setting portion (the One arm temperature setting portion) 176c, this hand unit first temperature setting portion 176c can cool down to IC device 90, thus inciting somebody to action Temperature adjustment (can set) of this IC device 90 is to be suitable for the temperature (the first temperature) that low temperature checks.

In addition, first check with 8 first hand unit 171c of device delivery head 17c, from left to right second in Figure 22 B 2 the first hand unit 171c of group constitute hand unit second temperature configuration part 177c, and this hand unit second temperature sets Portion 177c is second control section 272, its IC device 90 is not cooled down and heated any one, and make the temperature of this IC device 90 Degree (can set) is to be suitable for the temperature (second temperature) that room temperature checks.Additionally, second control section 272 (hand unit second temperature Degree configuration part 177c) for example can also be configured to IC device 90 be cooled down and heats, and can by this cooling, The temperature of IC device 90 is adjusted to the temperature that suitable room temperature checks by heating.

In addition, first check with 8 first hand unit 171c of device delivery head 17c, from left to right the 3rd in Figure 22 B 2 the first hand unit 171c of group are the 3rd handle parts 273, and constitute hand unit the 3rd temperature setting portion (the 3rd arm temperature Degree configuration part) 178c, this hand unit the 3rd temperature setting portion 178c can heat to IC device 90, thus by this IC device Temperature adjustment (can set) of part 90 is to be suitable for the temperature (the 3rd temperature) that high temperature checks.

In addition, first check with 8 first hand unit 171c of device delivery head 17c, in Figure 22 B right side 2 Individual first hand unit 171c is the 4th handle part 274, and it is not used by the present embodiment, but also can be formed and use it Structure.

Above-mentioned first control section 271, second control section 272, the 3rd handle part 273 and the 4th handle part 274 are along X side To arrangement.

It is also same for the second inspection device delivery head 17d.

Additionally, in Figure 23～Figure 38, if record first control section 271 with "○", overlapping with miscellaneous part and become Must be difficult to see that, therefore be recorded using the double dot dash line sharing with hand unit first temperature setting portion 176c.For Second control section 272, the 3rd handle part 273 and the 4th handle part 274 are also same.

As shown in FIG. 20 A, the first device recoverer 18c and the second device recoverer 18d is by inspection portion 16 respectively The IC device 90 that finishes of inspection be delivered to the device of recovery zone A4.

First device recoverer 18c and the second device recoverer 18d is respectively provided with：Load joining of (configuration) IC device 90 Put plate 182；And the device recoverer main body 181 that can move in X direction.It is provided with multiple in the upper surface of configuration plate 182 Pocket portion 185, above-mentioned multiple pocket portions 185 are the recesses housing (holding) IC device 90.Additionally, in the construction illustrated, pocket portion 185 It is arranged with 4 in X direction, is arranged with 2 along Y-direction, add up to and be arranged with 8 with rectangular.This configuration plate 182 is dismounting Mode be arranged at device recoverer main body 181.First device recoverer 18c and the second device recoverer 18d respectively by Support as can moving along the X direction between inspection area A3 and recovery zone A4.In addition, the first device recoverer 18c with Second device recoverer 18d configures along the Y direction.IC device 90 in inspection portion 16 is by the first inspection device delivery head 17c Convey and be placed in the first device recoverer 18c, or conveyed and be placed in the second device by the second inspection device delivery head 17d Part recoverer 18d.

Additionally, in Figure 20 A, in order to easily differentiate the first device recoverer 18c and the first device supply unit 14c, so that Their separate modes are illustrated, but are configured to the first device recoverer 18c and the first device supply unit 14c such as This diagram moves independently of each other like that, furthermore it is also possible to be configured to the first device recoverer 18c and the first device supply unit 14c links or integrally-formed, thus the first device recoverer 18c and the first device supply unit 14c one is mobile.For Two device recoverer 18d and the second device supply unit 14d are also same.

Recovery zone A4 is to reclaim the region checking the IC device 90 finishing.In this recovery zone, A4 is provided with：Reclaim With pallet 19；Reclaim and use device delivery head 20；And the 6th conveyor pallet structure 21.In addition, being ready in recovery zone A4 Empty pallet 200.

Recovery pallet 19 is fixed in the A4 of recovery zone, and is configured with 3 in the present embodiment along the X direction Individual.In addition, the pallet 200 of sky is configured with 3 also along X-direction.And, mobile the first device recoverer to recovery zone A4 IC device 90 on 18c or the second device recoverer 18d is conveyed and is placed in the support of above-mentioned recovery pallet 19 and sky Any one of disk 200.Thus, according to inspection result, IC device 90 is reclaimed and classified.

Recovery device delivery head 20 be supported to can in the A4 of recovery zone in X direction, Y-direction and Z-direction move Dynamic.Thus, recovery device delivery head 20 can be by IC device 90 from the first device recoverer 18c or the second device recoverer 18d is delivered to recovery pallet 19, empty pallet 200.Additionally, recovery device delivery head 20 has multiple hand unit 201 As the arm (handle part) that IC device 90 can be held, each hand unit 201 is same with above-mentioned first hand unit 171c Possess adsorption nozzle sample, and IC device 90 is held by absorption.

In addition, as shown in figure 21, check device 1c has：Control unit 80；Electrically connect with control unit 80 and carry out to check dress Put the operating portion 6 of each operation of 1c；The cooling body 41,42,43,44 and 45 that IC device 90 is cooled down；And to IC The heating arrangements 51,52 and 53 that device 90 is heated.

Control unit 80 has storage part 801 storing each information (data) etc., and for example to the first conveyor pallet structure Device delivery head is used in 11A, the second conveyor pallet structure 11B, the first temperature adjustment portion 12c, second temperature adjustment portion 12d, supply 13rd, the first device supply unit 14c, the second device supply unit 14d, the 3rd conveyor pallet structure 15, the first inspection device convey Head 17c, the second inspection device delivery head 17d, the first device recoverer 18c, the second device recoverer 18d, recovery device Delivery head 20, the 6th conveyor pallet structure 21, the 4th conveyor pallet structure 22A, the 5th conveyor pallet structure 22B, display part 62, The driving in each portions such as cooling body 41～45, heating arrangements 51～53 is controlled.

In addition, cooling body 41 cools down to the first temperature adjustment portion 12c, and via this first temperature adjustment portion 12c And IC device 90 is cooled down.In addition, cooling body 42 cools down to second temperature adjustment portion 12d, and via this second Temperature adjustment portion 12d cools down to IC device 90.In addition, cooling body 43 to the first inspection with the of device delivery head 17c One handle part 271 (hand unit first temperature setting portion 176c) is cooled down, and via this first control section 271 to IC device 90 are cooled down.In addition, cooling body 44 is to the second inspection first control section 271 (hand unit of device delivery head 17d One temperature setting portion 176c) cooled down, and via this first control section 271, IC device 90 is cooled down.In addition, cooler Structure 45 in Figure 22 A in 8 maintaining parts 163 in inspection portion 16 left side 2 maintaining parts 163, i.e. to the first temperature setting portion 166 are cooled down, and via this first temperature setting portion 166, IC device 90 are cooled down.

As cooling body 41～45, it is not particularly limited, for example can enumerate makes cold-producing medium (for example, by liquid nitrogen gasification The gas of low temperature such as nitrogen etc.) in cooling object or in the body that is configured near it flowing being cooled down Device, peltier element etc..

In addition, heating arrangements 51 are to the first inspection the 3rd handle part 273 (hand unit the 3rd of device delivery head 17c Temperature setting portion 178c) heated, and via the 3rd handle part 273, IC device 90 is heated.In addition, heating arrangements 52 pairs second inspections are carried out with the 3rd handle part 273 (hand unit the 3rd temperature setting portion 178c) of device delivery head 17d adding Heat, and via the 3rd handle part 273, IC device 90 is heated.In addition, 8 holdings to inspection portion 16 for the heating arrangements 53 In Figure 22 A in portion 163 from left to right the 3rd group of 2 maintaining parts 163, the 3rd temperature setting portion 168 is heated, and via 3rd temperature setting portion 168 heats to IC device 90.

As heating arrangements 51～53, it is not particularly limited, for example, can enumerate heater with heating wire etc..

Next, the action to check device 1c illustrates, but here, typically supply to using the first device Portion 14c, the first inspection carry out the feelings of the conveying of IC device 90 etc. with device delivery head 17c and the first device recoverer 18c Condition illustrates.

Additionally, the IC device 90 being checked passes through the first device supply unit 14c and the first inspection device delivery head 17c And be transported to inspection portion 16 successively, but here, will initially (first) examined (conveying) IC device 90 referred to as " the One IC device 901 " or " IC device 901 ", by second checked IC device 90 be referred to as " second IC device 902 " or Person's " IC device 902 ", the 3rd checked IC device 90 is referred to as " the 3rd IC device 903 " or " IC device 903 ", will 4th checked IC device 90 is referred to as " the 4th IC device 904 " or " IC device 904 ", by the 5th checked IC Device 90 is referred to as " the 5th IC device 905 " or " IC device 905 ".In addition, do not carry out first, second, the 3rd, 4th, in the case of the difference of the 5th etc., referred to as " IC device 90 ".In addition, in Figure 22 A～Figure 48, representing IC with " I " Device 901, represents IC device 902 with " II ", represents IC device 903 with " III ", represents IC device 904 with " IV ", uses " V " table Show IC device 905.

First, as shown in Figure 22 A and Figure 22 B, first IC device 901 is supplied to be loaded with device delivery head 13 (joins Put) in first mounting portion 261 of the first device supply unit 14c.That is, the IC device before mounting checks in the first mounting portion 261 901.Preferably using the first temperature adjustment portion 12c or second temperature adjustment portion 12d, this IC device 901 is cooled down, But can not also be cooled down.Additionally, being also same for IC device 902 described later and IC device 903.

Next, as shown in figure 23, IC device 901 is delivered to and inspection portion 16 using the first device supply unit 14c The corresponding position of first temperature setting portion 166, that is, the first mounting portion 261 being delivered to the first device supply unit 14c and inspection portion The position that 16 the first temperature setting portion 166 arranges along Y-direction.

Next, hold IC device 901 using the first inspection with the first control section 271 of device delivery head 17c, and right It is cooled down.

Next, as shown in figure 24, cool down, using first control section 271 side, the IC device being held by this first control section 271 Part 901, while be transported to first temperature setting portion 166 in inspection portion 16.Then, low temperature inspection is carried out to IC device 901.

Additionally, being directed to IC device 901, being hereafter scheduled for room temperature inspection, but although low temperature inspection can be finished Whole IC devices 901 carry out room temperature inspection, but preferably only room temperature inspection is carried out to qualified IC device 901 in low temperature inspection Look into, room temperature inspection is not carried out to underproof IC device 901.Thereby, it is possible to omit unnecessary inspection.

On the other hand, as shown in figure 25, the first device supply unit 14c in order to accept second IC device 902 and to X-direction Minus side moves.

Next, as shown in figure 26, second IC device 902 is supplied to and is placed in the first device confession with device delivery head 13 The first mounting portion 261 to portion 14c.

Next, as shown in figure 27, the first device supply unit 14c to the positive side shifting of X-direction, and in the first device supply unit Stop on the position that second mounting portion 262 of 14c is arranged along Y-direction with first temperature setting portion 166 in inspection portion 16.

Next, as shown in figure 28, the IC device being held by the first control section 271 of the first inspection device delivery head 17c Part 901 is conveyed and is put to second mounting portion 262 of the first device supply unit 14c, and is placed in this second mounting portion 262.That is, upload, in the second mounting portion 262, the IC device 901 setting low after temperature detector is looked into.

Next, as shown in figure 29, the first device supply unit 14c is to the positive side shifting of X-direction, and supplies in the first device First mounting portion 261 of portion 14c and first temperature setting portion 166 in inspection portion 16 along Y-direction arrangement, the second mounting portion 262 with Stop on the position that second temperature configuration part 167 arranges along Y-direction.

Next, holding second IC device using the first inspection with the first control section 271 of device delivery head 17c 902, and it is cooled down, first IC device 901 is meanwhile held using second control section 272.

Next, as shown in figure 30, IC device 902 side being held by first control section 271 is cold by this first control section 271 But, while being delivered to first temperature setting portion 166 in inspection portion 16 by this first control section 271, meanwhile, by second control section The IC device 901 of 272 holdings is delivered to the second temperature configuration part 167 in inspection portion 16 by this second control section 272.Then, right IC device 901 carries out room temperature inspection, carries out low temperature inspection to IC device 902.

Additionally, for IC device 901, being hereafter scheduled for high temperature inspection, but although room temperature inspection can be finished Whole IC devices 901 carry out high temperature inspection, but preferably only high temperature detector is carried out to qualified IC device 901 in room temperature inspection Look into, high temperature inspection is not carried out to underproof IC device 901.In addition, for IC device 902, being hereafter scheduled for room temperature inspection, But although whole IC devices 902 that low temperature inspection can be finished carry out room temperature inspection, but preferably only in low temperature inspection Qualified IC device 902 carries out room temperature inspection, does not carry out room temperature inspection to underproof IC device 902.Thereby, it is possible to omit Unnecessary inspection.

On the other hand, as shown in figure 31, the first device supply unit 14c in order to accept the 3rd IC device 903 and to X-direction Minus side moves.

Next, as shown in figure 32, the 3rd IC device 903 is supplied to and is placed in the first device confession with device delivery head 13 The first mounting portion 261 to portion 14c.

Next, as shown in figure 33, the first device supply unit 14c to the positive side shifting of X-direction, and in the first device supply unit Stop on the position that second mounting portion 262 of 14c is arranged along Y-direction with first temperature setting portion 166 in inspection portion 16.

Next, as shown in figure 34, the IC device being held by the first control section 271 of the first inspection device delivery head 17c Part 902 is conveyed and is put to second mounting portion 262 of the first device supply unit 14c, and is placed in the second mounting portion 262, Similarly, the IC device 901 being held by second control section 272 is conveyed and is put to the 3rd mounting portion 263, and is placed in this 3rd mounting portion 263.That is, upload, in the second mounting portion 262, the IC device 902 setting low after temperature detector is looked into, in the 3rd mounting portion 263 IC device 901 after mounting room temperature inspection.

Next, as shown in figure 35, the first device supply unit 14c is to the positive side shifting of X-direction, and supplies in the first device First mounting portion 261 of portion 14c and first temperature setting portion 166 in inspection portion 16 along Y-direction arrangement, the second mounting portion 262 with The position that second temperature configuration part 167 arranges along Y-direction arrangement, the 3rd mounting portion 263 and the 3rd temperature setting portion 168 along Y-direction Put stopping.

Next, holding the 3rd IC device with the first control section 271 of device delivery head 17c using the first inspection 903, and it is cooled down, meanwhile hold second IC device 902 using second control section 272, utilize the simultaneously Three handle parts 273 are holding first IC device 901, and it is heated.

Next, as shown in figure 36, IC device 903 side being held by first control section 271 is cold by this first control section 271 But, while being delivered to first temperature setting portion 166 in inspection portion 16 by this first control section 271, meanwhile, by second control section The IC device 902 of 272 holdings is delivered to the second temperature configuration part 167 in inspection portion 16 by this second control section 272, meanwhile, by IC device 901 side that 3rd handle part 273 holds is heated by the 3rd handle part 273, while being delivered to by the 3rd handle part 273 3rd temperature setting portion 168.Then, high temperature inspection is carried out to IC device 901, room temperature inspection is carried out to IC device 902, to IC device Part 903 carries out low temperature inspection.

Additionally, for IC device 902, being hereafter scheduled for high temperature inspection, but although room temperature inspection can be finished Whole IC devices 902 carry out high temperature inspection, but preferably only high temperature detector is carried out to qualified IC device 902 in room temperature inspection Look into, high temperature inspection is not carried out to underproof IC device 902.In addition, for IC device 903, being hereafter scheduled for room temperature inspection, But although whole IC devices 903 that low temperature inspection can be finished carry out room temperature inspection, but preferably only in low temperature inspection Qualified IC device 903 carries out room temperature inspection, does not carry out room temperature inspection to underproof IC device 903.Thereby, it is possible to omit Unnecessary inspection.

On the other hand, as shown in figure 37, the first device recoverer 18c is in order to checking that the IC device 901 that finishes carries out Reclaim and to X-direction minus side, i.e. to position corresponding with inspection portion 16 move.

Next, as shown in figure 37, using the first inspection device delivery head 17c, IC device 901 is delivered to and first The corresponding position of device recoverer 18c, and it is placed in the Figure 37 in 8 pocket portions 185 of this first device recoverer 18c left Play the 3rd pocket portion 185.And, as shown in figure 38, using the first device recoverer 18c, IC device 901 is delivered to recovery area Domain A4.

As described above, the first device supply unit 14c then moves to X-direction minus side, accepts the 4th IC device 904, and then to the positive side shifting of X-direction, as shown in figure 39, by the first inspection first control section 271 of device delivery head 17c The IC device 903 holding is put the second mounting portion 262 to the first device supply unit 14c, and is placed in this second mounting portion 262, similarly, the IC device 902 being held by second control section 272 is put to the 3rd mounting portion 263, and is placed in the 3rd Mounting portion 263.

Next, as shown in figure 40, the first device supply unit 14c to the positive side shifting of X-direction, and in the first device supply unit Stop on the position that first mounting portion 261 of 14c is arranged along Y-direction with first temperature setting portion 166 in inspection portion 16.

Next, holding the 4th IC device with the first control section 271 of device delivery head 17c using the first inspection 904, and it is cooled down, meanwhile hold the 3rd IC device 903 using second control section 272, utilize the simultaneously Three handle parts 273 are holding second IC device 902, and it is heated.

Next, as shown in figure 41, IC device 904 side being held by first control section 271 is cold by this first control section 271 But, while being delivered to first temperature setting portion 166 in inspection portion 16 by this first control section 271, meanwhile, by second control section The IC device 903 of 272 holdings is delivered to the second temperature configuration part 167 in inspection portion 16 by this second control section 272, meanwhile, by IC device 902 side that 3rd handle part 273 holds is heated by the 3rd handle part 273, while being delivered to by the 3rd handle part 273 3rd temperature setting portion 168.Then, high temperature inspection is carried out to IC device 902, room temperature inspection is carried out to IC device 903, to IC device Part 904 carries out low temperature inspection.

On the other hand, as shown in figure 42, the first device recoverer 18c is in order to checking that the IC device 902 that finishes carries out Reclaim and to X-direction minus side, i.e. to position corresponding with inspection portion 16 move.

Next, as shown in figure 42, using the first inspection device delivery head 17c, IC device 902 is delivered to and first The corresponding position of device recoverer 18c, and it is placed in the Figure 42 in 8 pocket portions 185 of this first device recoverer 18c left Play the 3rd pocket portion 185.Then, as shown in figure 43, using the first device recoverer 18c, IC device 902 is delivered to recovery area Domain A4.

As described above, the first device supply unit 14c then moves to X-direction minus side, accepts the 5th IC device 905, and then to the positive side shifting of X-direction, as shown in figure 44, by the first inspection first control section 271 of device delivery head 17c The IC device 904 holding is put the second mounting portion 262 to the first device supply unit 14c, and is placed in this second mounting portion 262, similarly, the IC device 903 being held by second control section 272 is put to the 3rd mounting portion 263, and is placed in the 3rd Mounting portion 263.

Next, as shown in figure 45, the first device supply unit 14c to the positive side shifting of X-direction, and in the first device supply unit Stop on the position that first mounting portion 261 of 14c is arranged along Y-direction with first temperature setting portion 166 in inspection portion 16.

Next, holding the 5th IC device with the first control section 271 of device delivery head 17c using the first inspection 905, and it is cooled down, meanwhile, hold the 4th IC device 904 using second control section 272, utilize the simultaneously Three handle parts 273 are holding the 3rd IC device 903, and it is heated.

Next, as shown in figure 46, IC device 905 side being held by first control section 271 is cold by first control section 271 But, while being delivered to first temperature setting portion 166 in inspection portion 16 by this first control section 271, meanwhile, by second control section The IC device 904 of 272 holdings is delivered to the second temperature configuration part 167 in inspection portion 16 by this second control section 272, meanwhile, by IC device 903 side that 3rd handle part 273 holds is heated by the 3rd handle part 273, while being delivered to by the 3rd handle part 273 3rd temperature setting portion 168.Then, high temperature inspection is carried out to IC device 903, room temperature inspection is carried out to IC device 904, to IC device Part 905 carries out low temperature inspection.

On the other hand, as shown in figure 47, the first device recoverer 18c is in order to checking that the IC device 903 that finishes carries out Reclaim, to X-direction minus side, move to position corresponding with inspection portion 16.

Next, as shown in figure 47, using the first inspection device delivery head 17c, IC device 903 is delivered to and first The corresponding position of device recoverer 18c, and it is placed in the Figure 47 in 8 pocket portions 185 of this first device recoverer 18c left Play the 3rd pocket portion 185.Then, as shown in figure 48, using the first device recoverer 18c, IC device 903 is delivered to recovery area Domain A4.

Hereinafter repeat identical action.

Here, as described above, qualified IC device 90 in only to low temperature inspection carries out room temperature inspection, in addition only to low Temperature detector look into and room temperature inspection in qualified IC device 90 when carrying out high temperature and checking, such as when IC device 902 is in room temperature inspection In in the case of unqualified (low temperature check in qualified), this IC device 902 is placed in 8 pockets of the first device recoverer 18c Second pocket portion 185 from left to right in Figure 37 in portion 185, and recovery zone A4 is delivered to by the first device recoverer 18c.In addition, In the case of IC device 903 is underproof in low temperature inspection, this IC device 903 is placed in the 8 of the first device recoverer 18c The pocket portion 185 in left side in Figure 37 in individual pocket portion 185, and recovery zone A4 is delivered to by the first device recoverer 18c.In this feelings Under condition, the pocket portion 185 in left side in the Figure 37 in 8 pocket portions 185 of the first device recoverer 18c, in mounting low temperature inspection not Qualified IC device 90, second pocket portion 185 from left to right in Figure 37, mounting low temperature is unqualified during qualified and room temperature checks in checking IC device 90, the 3rd pocket portion 185 from left to right in Figure 37, mounting low temperature inspection and room temperature check in qualified and high temperature inspection In qualified or underproof IC device 90.

More than, reclaimed with device delivery head 17c and the first device to using the first device supply unit 14c, the first inspection Portion 18c is illustrated come the situation to execute the conveying of IC device 90 etc., but also can using the second device supply unit 14d, the Two inspections similarly execute conveying of IC device 90 etc. with device delivery head 17d and the second device recoverer 18d.

In addition it is also possible to concurrently carry out：Using the first device supply unit 14c, the first inspection with device delivery head 17c with And first device recoverer 18c come to convey IC device 90 thus execution inspection and using the second device supply unit 14d, the Two inspections convey IC device 90 with device delivery head 17d and the second device recoverer 18d thus execution inspection.Thus, Productivity ratio can be improved.

As described above, low temperature inspection, the room temperature inspection of IC device 90 can according to this check device 1c, be carried out And each of high temperature inspection, thus convenience is higher.

In addition, in the case that an IC device 90 is carried out with low temperature inspection, room temperature inspection and high temperature inspection, can not Temporarily reclaim IC device 90 and carry out its low temperature inspection, room temperature inspection and high temperature inspection, thus, it is possible to improve productivity ratio.

Further, since carry out the low temperature inspection of the room temperature inspection of first IC device 901, second IC device 902 simultaneously, In addition carry out the high temperature inspection of first IC device 901, the room temperature inspection of second IC device 902 and the 3rd IC simultaneously The low temperature inspection of device 903, it is possible to improve productivity ratio.

In addition, the order of the inspection of IC device 90 is initially to carry out low temperature inspection, second carries out room temperature inspection, the 3rd Carry out high temperature inspection, because IC device 90 is not state with low temperature but recovery zone A4 be transported to the state of high temperature, It is possible to preventing the condensation of IC device 90.

In addition, there is room temperature inspection between low temperature inspection and high temperature inspection, therefore, IC device 90 is not changed into high from low temperature Temperature but be changed into high temperature after being temporarily changed room temperature, therefore, it is possible to suppress the temperature change drastically of IC device 90.

Additionally, the order of low temperature inspection, room temperature inspection and high temperature inspection is not limited to the order of present embodiment, It can also be any order.

In addition, though the one of of low temperature inspection, room temperature inspection and high temperature inspection can also be omitted, but preferably enter Row low temperature checks.In other words, preferably do not omit low temperature inspection.

5th embodiment

Hereinafter, the 5th embodiment is illustrated, but by with the difference of above-mentioned 4th embodiment centered on carry out Illustrate, omit the explanation of identical item.

As shown in figure 49, the figure in check device 1c of the 5th embodiment, in 8 maintaining parts 163 in inspection portion 16 In 49,2 maintaining parts 163 in left side constitute the first temperature setting portion 281, and this first temperature setting portion 281 can be to IC device 90 Cooled down, thus temperature adjustment (can set) of this IC device 90 is to be suitable for the temperature (the first temperature) that low temperature checks.

In addition, second group of 2 maintaining parts 163 constitute second from left to right in Figure 49 in the 8 of inspection portion 16 maintaining parts 163 Temperature setting portion 282, this second temperature configuration part 282 can be heated to IC device 90, thus the temperature by this IC device 90 Degree adjustment (can set) is to be suitable for the temperature (second temperature) that high temperature checks.

In addition, the 3rd group of 2 maintaining parts 163 constitute first from left to right in Figure 49 in the 8 of inspection portion 16 maintaining parts 163 Temperature setting portion 283, this first temperature setting portion 283 can cool down to IC device 90, thus the temperature by this IC device 90 Degree adjustment (can set) is to be suitable for the temperature (the first temperature) that low temperature checks.

In addition, 2 maintaining parts 163 on right side constitute second temperatures and set in Figure 49 in the 8 of inspection portion 16 maintaining parts 163 Determine portion 284, this second temperature configuration part 284 can be heated to IC device 90, thus the temperature adjustment by this IC device 90 (can set) is to be suitable for the temperature (second temperature) that high temperature checks.

That is, in inspection portion 16, the first module that is made up of with second temperature configuration part 282 the first temperature setting portion 281 285 and arranged in X direction by the second unit 286 that the first temperature setting portion 283 is constituted with second temperature configuration part 284.

In addition, first check with 8 first hand unit 171c of device delivery head 17c, 2 of left side in Figure 49 First hand unit 171c is first control section 291, and (the first arm temperature sets to constitute hand unit first temperature setting portion Portion) 251, this hand unit first temperature setting portion 251 can cool down to IC device 90, thus the temperature by this IC device 90 Degree adjustment (can set) is to be suitable for the temperature (the first temperature) that low temperature checks.

In addition, first check with 8 first hand unit 171c of device delivery head 17c, from left to right second in Figure 49 2 the first hand unit 171c of group are second control sections 292, and constitute hand unit second temperature configuration part (the second arm temperature Degree configuration part) 252, this hand unit second temperature configuration part 252 can be heated to IC device 90, thus by this IC device 90 temperature adjustment (can set) is to be suitable for the temperature (second temperature) that high temperature checks.

In addition, first check with 8 first hand unit 171c of device delivery head 17c, from left to right the 3rd in Figure 49 2 the first hand unit 171c of group are first control sections 293, and constitute hand unit first temperature setting portion (the first arm temperature Degree configuration part) 253, this hand unit first temperature setting portion 253 can cool down to IC device 90, thus by this IC device 90 temperature adjustment (can set) is to be suitable for the temperature (the first temperature) that low temperature checks.

In addition, first check with 8 first hand unit 171c of device delivery head 17c, 2 of right side in Figure 49 First hand unit 171c is second control section 294, and (the second arm temperature sets to constitute hand unit second temperature configuration part Portion) 254, this hand unit second temperature configuration part 254 can be heated to IC device 90, thus the temperature by this IC device 90 Degree adjustment (can set) is to be suitable for the temperature (second temperature) that high temperature checks.

That is, in the first inspection with device delivery head 17c, by first control section 291 (hand unit first temperature setting portion 251) first module 295 that constitutes with second control section 292 (hand unit second temperature configuration part 252) and by the first Hold portion 293 (hand unit the first temperature setting portion 253) and second control section 294 (hand unit second temperature configuration part 254) The second unit 296 constituting arranges in X direction.

In this first module 295 with second unit 296, form identical action, in addition, this action and the 4th embodiment party The situation eliminating room temperature inspection in formula is identical.Thus, compared with the situation of a unit, productivity ratio can be made to be 2 times.

Additionally, being also same for the second inspection device delivery head 17d.

Check device 1c according to the 5th above embodiment is it is also possible to play and above-mentioned 4th embodiment identical Effect.

Additionally, in the present embodiment, for inspection portion 16, the first inspection device delivery head 17c and second inspection With device delivery head 17d, the quantity respectively two of said units is but it is also possible to be more than 3.

In addition, in the above-described 4th embodiment it is also possible in the same manner as present embodiment, for inspection portion 16, first Inspection device delivery head 17c and the second inspection device delivery head 17d is respectively provided with multiple units.

More than, based on embodiment illustrated to the electronic component handling apparatus of the present invention and electronic component inspection device It is illustrated, but the present invention is not limited to this, the structure replacing in each portion can be the arbitrary knot with identical function Structure.Alternatively, it is also possible to add other arbitrary works.

In addition, the structure (feature) of arbitrary more than 2 in the respective embodiments described above can also be carried out group by the present invention Close.

The explanation of reference

1 ... check device (electronic component inspection device)；11A ... the first conveyor pallet structure；11B ... second pallet conveys Mechanism；12a ... the first temperature adjustment portion (the first temperature-uniforming plate)；12b ... second temperature adjustment portion (the second temperature-uniforming plate)；13 ... supplies Use device delivery head；131 ... hand unit；14a ... the first device supply unit (the first supply reciprocating apparatus)；14b ... second device Part supply unit (the second supply reciprocating apparatus)；141 ... device supply unit main bodys；142 ... configuration plates；145 ... pocket portions；146 ... devices Part supply unit first temperature setting portion；147 ... device supply unit second temperature configuration parts；15 ... the 3rd conveyor pallet structures； 16 ... inspection portions；161 ... inspection portion main bodys；162 ... holding members；163 ... maintaining parts；166 ... first temperature setting portion； 167 ... second temperature configuration parts；17a ... first checks and uses device delivery head；17b ... second checks and uses device delivery head； 171a ... first hand unit；171b ... second hand unit；172 ... hand unit main bodys；173 ... holding parts；176 ... devices Part delivery head first temperature setting portion；177 ... device delivery head second temperature configuration parts；18a ... the first device recoverer (first Reclaim reciprocating apparatus)；18b ... the second device recoverer (the second recovery reciprocating apparatus)；181 ... device recoverer main bodys；182… Configuration plate；185 ... pocket portions；19 ... recovery pallets；Device delivery head is used in 20 ... recovery；201 ... hand unit；21 ... the 6th supports Disk carrying mechanism；22A ... the 4th conveyor pallet structure；22B ... the 5th conveyor pallet structure；41～45 ... cooling bodies；51～ 54 ... heating arrangements；6 ... operating portions；61 ... input units；62 ... display parts；80 ... control units；801 ... storage parts；90 ... IC devices Part；200 ... pallets；A1 ... pallet supply area；A2 ... device supply area (supply area)；A3 ... inspection area；A4 ... device Part recovery zone (recovery zone)；A5 ... pallet removes region；R1 ... first Room；R2 ... second Room；R3 ... the 3rd Room.

Claims

1. a kind of electronic component handling apparatus are it is characterised in that have：

First delivery section, it can convey electronic unit and make described electronic unit become the first temperature；And

Second delivery section, it can convey described electronic unit and make described electronic unit become different from described first temperature Second temperature.

2. electronic component handling apparatus according to claim 1 it is characterised in that

Described first delivery section has：First electronic unit mounting portion, it can load described electronic unit and make this ministry of electronics industry Part moves, and described electronic unit can be made to become described first temperature；And the first electronic unit handle part, it can hold Described electronic unit and so that this electronic unit is moved, and described electronic unit can be made to become described first temperature,

Described second delivery section has：Second electronic unit mounting portion, it can load described electronic unit and make this ministry of electronics industry Part moves, and described electronic unit can be made to become described second temperature；And the second electronic unit handle part, it can hold Described electronic unit and so that this electronic unit is moved, and described electronic unit can be made to become described second temperature.

3. electronic component handling apparatus according to claim 1 are it is characterised in that possess：

Electronic unit mounting portion, it has the first electronic unit mounting that described electronic unit can be made to become described first temperature Portion's temperature setting portion and the second electronic unit mounting portion temperature that described electronic unit becomes described second temperature can be made to set Determine portion, and described electronic unit can be loaded and so that this electronic unit is moved；And

Electronic unit handle part, it has the first electronic unit that described electronic unit can be made to become described first temperature and holds Portion's temperature setting portion and the second electronic unit handle part temperature that described electronic unit becomes described second temperature can be made to set Determine portion, and described electronic unit can be held and so that this electronic unit is moved,

Described first delivery section has described first electronic unit mounting portion temperature setting portion and described first electronic unit holds Portion's temperature setting portion,

Described second delivery section has described second electronic unit mounting portion temperature setting portion and described second electronic unit holds Portion's temperature setting portion.

4. electronic component handling apparatus according to claim 3 it is characterised in that

There are multiple described electronic unit mounting portions,

There are multiple described electronic unit handle parts.

5. the electronic component handling apparatus according to any one of Claims 1 to 4 it is characterised in that

After conveying described electronic unit using described first delivery section, convey the described ministry of electronics industry using described second delivery section Part.

6. the electronic component handling apparatus according to any one of Claims 1 to 5 it is characterised in that

Described first temperature is lower than described second temperature.

7. the electronic component handling apparatus according to any one of claim 1～6 it is characterised in that

When the inspection carrying out described electronic unit with described first temperature and described check in qualified in the case of, with described Second temperature carries out the inspection of described electronic unit.

8. a kind of electronic component inspection device is it is characterised in that have：

First delivery section, it can convey electronic unit and make described electronic unit become the first temperature；

Second delivery section, it can convey described electronic unit and make described electronic unit become different from described first temperature Second temperature；And

Inspection portion, it checks to described electronic unit.

9. electronic component inspection device according to claim 8 it is characterised in that

It is provided with described inspection portion：Described electronic unit can be made to become the first temperature setting portion of described first temperature；With And described electronic unit can be made to become the second temperature configuration part of described second temperature.