TW201709378A - Electronic part conveying device and electronic part inspection device having no need to temporarily recycle electronic parts to perform inspection under different conditions - Google Patents

Abstract

The invention provides an electronic part conveying device and an electronic part inspection device capable of setting each electronic part at a first temperature and a second temperature. The electronic part conveying device comprises: a first conveying portion which conveys electronic parts and is capable of setting the electronic parts at the first temperature; and a second conveying portion which conveys the electronic parts and is capable of setting the electronic parts at the second temperature different from the first temperature.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component transporting apparatus and an electronic component inspection apparatus.

In the past, an electronic component inspection device for detecting electrical characteristics of an electronic component such as an IC device has been known, and an electronic component transportation device for transporting an IC device to a holding portion of an inspection portion is incorporated in the electronic component inspection device. At the time of inspection of the IC device, the IC device is placed in the holding portion, and a plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC device. The inspection of such an IC device includes a low temperature inspection for cooling the IC device to a specific temperature, and a high temperature inspection for heating the IC device to a specific temperature.

Further, Patent Document 1 discloses an IC classifier (IC Handler) having two transfer arms for holding and holding an IC device when performing an inspection of an IC device.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 8-105937

However, in the device described in Patent Document 1, both the low temperature inspection and the high temperature inspection of the IC device cannot be performed.

Further, in the device described in Patent Document 1, the transport robot holds the IC device placed at a specific position on the electronic component mounting portion on which the IC device is placed, but cannot be placed on the electronic component. Other locations of the placement unit.

The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples.

[Application Example 1] The electronic component transport apparatus according to the application example of the present invention includes a first transport unit that transports electronic components and can set the electronic component to a first temperature; The second transport unit transports the electronic component and sets the electronic component to a second temperature different from the first temperature.

Thereby, in the case of performing the inspection of the electronic component, each of the first temperature and the second temperature can be performed. Further, it is possible to reduce the number of temperature switching setting steps of the first temperature and the second temperature, or to reduce the waiting time required to stabilize the temperature.

[Application Example 2] In the electronic component conveying apparatus according to the application example of the invention, the first conveying unit includes a first electronic component mounting portion that can mount and move the electronic component, and the electronic component can be mounted And the first electronic component holding portion that holds and moves the electronic component, and the electronic component can be set to the first temperature; The second transport unit includes a second electronic component mounting unit that can mount and move the electronic component, and the electronic component can be the second temperature and the second electronic component holding portion that can be held and moved. In the electronic component, the electronic component may be set to the second temperature.

Thereby, in the case of performing the inspection of the electronic component, each of the first temperature and the second temperature can be performed.

[Application Example 3] The electronic component transport apparatus according to the application example described above preferably includes an electronic component mounting portion that can mount and move the electronic component, and has the electronic component set to be the first temperature a first electronic component mounting portion temperature setting unit, and a second electronic component mounting portion temperature setting unit that can set the electronic component to the second temperature; and an electronic component holding portion that can hold and move the electronic component. And have The electronic component is a first electronic component holding portion temperature setting unit of the first temperature, and a second electronic component holding portion temperature setting unit that can set the electronic component to the second temperature; the first conveying unit has the above-described The first electronic component mounting unit temperature setting unit and the first electronic component holding unit temperature setting unit; and the second conveying unit includes the second electronic component mounting unit temperature setting unit and the second electronic component holding unit Temperature setting unit.

Thereby, the electronic component can be transported to a specific position by the electronic component mounting portion and the electronic component holding portion.

In addition, the first electronic component holding portion temperature setting unit and the first electronic component mounting portion temperature setting unit can set the electronic component to the first temperature, and the second electronic component holding portion temperature setting unit and the second component can be used. The electronic component mounting unit temperature setting unit sets the electronic component to the second temperature.

[Application Example 4] The electronic component transport apparatus according to the application example described above preferably includes a plurality of the electronic component mounting portions, and includes a plurality of the electronic component holding portions.

Thereby, in the case of performing the inspection of the electronic component, each of the first temperature and the second temperature can be performed.

[Application Example 5] In the electronic component transport apparatus according to the application example described above, preferably, the electronic component is transported by the first transport unit after the electronic component is transported by the first transport unit.

Thereby, when the first temperature is lower than the second temperature, the electronic component is transported to the specific position in a state of being set to the second temperature, whereby dew condensation of the electronic component can be prevented.

[Application Example 6] In the electronic component conveying device according to the application example described above, preferably, the first temperature is lower than the second temperature.

Thereby, after the electronic component is transported by the first transport unit, the second transport unit transports the electronic In the case of a component, the electronic component is transported to a specific position in a state of being set to the second temperature, whereby condensation of the electronic component can be prevented.

[Application Example 7] In the electronic component transport apparatus according to the application example described above, preferably, when the electronic component is inspected at the first temperature and the inspection is performed, the electronic component is inspected at the second temperature. .

Therefore, when the first temperature is lower than the second temperature, the electronic component is inspected at the second temperature thereafter, and when the electronic component is transported to a specific position, dew condensation of the electronic component can be prevented.

[Application Example 8] The electronic component transport apparatus according to the application example of the present invention includes the first transport unit that transports the electronic component and that can set the electronic component to a first temperature, and the second transport unit that transports the electronic component And the electronic component may be set to a second temperature different from the first temperature; and the inspection unit may inspect the electronic component.

Thereby, the electronic component can be inspected for each of the first temperature and the second temperature. Further, it is possible to reduce the number of temperature switching setting steps of the first temperature and the second temperature, or to reduce the waiting time required for the temperature to stabilize.

[Application Example 9] In the electronic component conveying apparatus of the application example, it is preferable that the inspection unit includes a first temperature setting unit that can set the electronic component as the first temperature, and the electronic component can be used. The second temperature setting unit is the second temperature.

Thereby, the electronic component can be inspected for each of the first temperature and the second temperature.

[Application Example 10] The electronic component transport apparatus according to the application example of the present invention includes an electronic component mounting unit including a first mounting portion on which the electronic component is placed, and a second mounting portion on which the electronic component is placed. And the electronic component holding portion, wherein the electronic component is held by the first mounting portion and placed on the second mounting portion; and the second mounting portion is different from the first portion 1 mounting section.

Therefore, when the electronic component is inspected, for example, first, the electronic component placed on the first mounting portion after the inspection is completed under the specific conditions is placed on the second mounting portion, and the inspection is performed. The other electronic components before are placed on the first mounting portion.

Therefore, since the setting of different inspection conditions can be performed, the degree of freedom of inspection can be improved, and it is particularly advantageous for a small batch. Further, it is possible to reduce the number of setting steps for changing the inspection condition or to reduce the waiting time required to stabilize the inspection condition (for example, temperature condition).

Moreover, it is possible to perform inspection under two different conditions without temporarily recovering electronic components, and it is possible to simultaneously inspect two electronic components under mutually different conditions. Thereby, the output can be increased.

In the electronic component transport apparatus of the application example 10, preferably, the first mounting portion and the second placing portion are arranged in the moving direction of the electronic component mounting portion.

Thereby, the electronic component holding portion can carry the electronic component placed on the first mounting portion on the second placing portion by the movement of the electronic component mounting portion.

[Application Example 12] The electronic component mounting apparatus of the application example 10 or 11, wherein the electronic component mounting portion has a third mounting portion on which the electronic component is placed, and the third mounting portion is different from the above The first placement portion and the second placement portion.

Thereby, the electronic component holding portion can mount the electronic component placed on the second placing portion on the third placing portion. In this way, it is possible to perform inspection under three different conditions without temporarily recovering the electronic components, and it is possible to simultaneously inspect three electronic components under different conditions, thereby increasing the throughput.

In the electronic component transfer apparatus of the application example 12, preferably, the electronic component holding portion holds the electronic component from the second mounting portion and mounts the electronic component on the third mounting portion.

In this way, it is possible to perform inspection under three different conditions without temporarily recovering the electronic components, and it is possible to simultaneously inspect three electronic components under different conditions, thereby increasing the throughput.

In the electronic component conveying apparatus according to any one of the examples 10 to 13, the electronic component holding portion preferably has a first holding portion for holding the electronic component and a second holding portion for holding the electronic component a holding portion; and the first holding portion is different from the second holding portion.

Thereby, the electronic component holding portion can hold the electronic component placed on the first mounting portion by the first holding portion, and the electronic component placed on the second mounting portion can be held by the second holding portion.

[Application Example 15] In the electronic component conveying apparatus of the application example 14, it is preferable that the first holding portion and the second holding portion are arranged in parallel along a moving direction of the electronic component mounting portion.

Thereby, the electronic component holding portion can hold the electronic component placed on the first mounting portion by the first holding portion, and the electronic component placed on the second mounting portion can be held by the second holding portion.

[Application Example 16] In the electronic component conveying device according to Application Example 14 or 15, preferably, the temperature of the first holding portion is different from the temperature of the second holding portion.

Thereby, it is possible to perform inspection under two different temperature conditions without temporarily recovering the electronic components, and it is possible to simultaneously inspect two electronic components under mutually different temperature conditions.

[Application Example 17] In the electronic component conveying apparatus of Application Example 14 or 15, preferably, the temperature of the first holding portion is lower than the temperature of the second holding portion.

Thereby, it is possible to perform inspection under two different temperature conditions without temporarily recovering the electronic components, and it is possible to simultaneously inspect two electronic components under mutually different temperature conditions.

In the electronic component conveying apparatus according to any one of the examples 14 to 17, the electronic component holding unit preferably has a third holding portion for holding the electronic component, wherein the third holding portion is different from the above The first holding portion and the second holding portion.

Thereby, it is possible to perform inspection under three different temperature conditions without temporarily recovering the electronic components, and it is possible to simultaneously inspect three electronic components under mutually different temperature conditions.

In the electronic component conveying apparatus of the application example 18, preferably, the temperature of the third holding portion is different from the temperature of the first holding portion and the temperature of the second holding portion.

Thereby, it is possible to perform inspection under three different temperature conditions without temporarily recovering the electronic components, and it is possible to simultaneously inspect three electronic components under mutually different temperature conditions.

[Application Example 20] In the electronic component transport apparatus of the application example 18, preferably, the temperature of the third holding portion is higher than the temperature of the first holding portion and the temperature of the second holding portion.

Thereby, it is possible to perform inspection under three different temperature conditions without temporarily recovering the electronic components, and it is possible to simultaneously inspect three electronic components under mutually different temperature conditions.

[Application Example 21] The electronic component inspection device according to the application example of the present invention includes an electronic component mounting portion including a first mounting portion on which the electronic component is placed, and a second mounting portion on which the electronic component is placed. And the electronic component holding unit that holds the electronic component from the first mounting portion and mounts the electronic component on the second mounting portion; and the inspection portion that inspects the electronic component; The second placement portion is different from the first placement portion, and the first placement portion mounts the electronic component before the inspection by the inspection portion, and the second placement portion is placed after being inspected by the inspection portion. The above electronic parts.

Therefore, when the electronic component is inspected, for example, first, it is placed on the first mounting portion, and the electronic component after the inspection is completed under the specific conditions is placed on the second mounting portion. The other electronic components before the inspection are placed on the first mounting portion.

Therefore, since the inspection conditions can be set differently, it is possible to improve the degree of freedom of inspection, and it is particularly advantageous for a small batch. Further, it is possible to reduce the number of setting steps for changing the inspection condition or to reduce the waiting time required to stabilize the inspection condition (for example, temperature condition).

Moreover, it is possible to perform inspection under two different conditions without temporarily recovering electronic components, and it is possible to simultaneously inspect two electronic components under mutually different conditions. Thereby, the output can be increased.

1‧‧‧Inspection device (electronic parts inspection device)

1c‧‧‧Inspection device (electronic parts inspection device)

6‧‧‧Operation Department

11A‧‧‧1st pallet transport mechanism

11B‧‧‧2nd tray transport mechanism

12a‧‧‧1st temperature adjustment unit (1st soaking plate)

12b‧‧‧2nd temperature adjustment unit (2nd heat spreader)

12c‧‧‧1st temperature adjustment department

12d‧‧‧2nd temperature adjustment department

13‧‧‧Supply device transport head

14a‧‧‧1st device supply unit (1st supply shuttle)

14b‧‧‧2nd device supply unit (2nd supply shuttle)

14c‧‧‧1st Device Supply Department

14d‧‧‧2nd Device Supply Department

15‧‧‧3rd pallet transport mechanism

16‧‧‧Inspection Department

17a‧‧‧1st inspection device transport head (first electronic component holding unit)

17b‧‧‧Second inspection device transport head (second electronic component holding unit)

17c‧‧‧1st inspection device transport head

17d‧‧‧Second inspection device transport head

18a‧‧‧1st device recycling department (1st recycling shuttle)

18b‧‧‧2nd Device Recycling Department (2nd Recycling Shuttle)

18c‧‧‧1st Device Recycling Department

18d‧‧‧2nd Device Recycling Department

19‧‧‧Recycling tray

20‧‧‧Receiving device transport head

21‧‧‧6th tray transport mechanism

22A‧‧‧4th tray transport mechanism

22B‧‧‧5th pallet transport mechanism

41‧‧‧Cooling mechanism

42‧‧‧Cooling mechanism

43‧‧‧Cooling mechanism

44‧‧‧Cooling mechanism

45‧‧‧Cooling mechanism

51‧‧‧ heating mechanism

52‧‧‧heating mechanism

53‧‧‧ heating mechanism

54‧‧‧heating mechanism

61‧‧‧Display Department

62‧‧‧Display Department

80‧‧‧Control Department

90‧‧‧IC devices

131‧‧‧Hand unit

141‧‧‧Device Supply Unit Body

142‧‧‧Configuration Board

145‧‧ ‧ pocket

146‧‧‧Device supply unit first temperature setting unit

147‧‧‧Device supply unit second temperature setting unit

161‧‧‧Check Department Body

162‧‧‧Retaining components

163‧‧‧ Keeping Department

166‧‧‧1st temperature setting unit

167‧‧‧2nd temperature setting unit

171a‧‧‧1st unit

171b‧‧‧2nd unit

171c‧‧‧1st unit

171d‧‧‧2nd unit

172‧‧‧Hand unit body

173‧‧‧Retaining members

176‧‧‧Device Transfer Head 1st Temperature Setting Section

176c‧‧‧Hand unit first temperature setting unit (1st arm temperature setting unit)

177‧‧‧Device Transfer Head 2nd Temperature Setting Section

178c‧‧‧Hand unit third temperature setting unit (3rd arm temperature setting unit)

181‧‧‧Device Recycling Unit Body

182‧‧‧Configuration Board

185‧‧ ‧ pocket

200‧‧‧Tray

201‧‧‧Hand unit

261‧‧‧1st loading unit

262‧‧‧2nd Mounting Department

263‧‧‧3rd Mounting Department

264‧‧‧4th Mounting Department

271‧‧‧1st holding unit

272‧‧‧2nd holding unit

273‧‧‧3rd holding department

274‧‧‧4th holding department

801‧‧‧Memory Department

901‧‧‧1st IC device (IC device)

902‧‧‧2nd IC device (IC device)

903‧‧‧3rd IC device (IC device)

904‧‧‧4th IC device (IC device)

905‧‧‧5th IC device (IC device)

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Fig. 1A is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 1B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of Fig. 1A.

Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1A.

Fig. 3 is a view for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 4 is a view for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 5 is a view for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 6 is a view for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 7 is a view for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 8 is a view for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 9 is a view for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 10 is a view for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 11 is a view for explaining the operation of the second embodiment of the electronic component inspection device.

Fig. 12A is a view for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 12B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of Fig. 12A.

Fig. 13 is a view for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 14 is a view for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 15 is a view for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 16 is a view for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 17 is a view for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 18 is a view for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 19 is a view for explaining the operation of the third embodiment of the electronic component inspection device.

Fig. 20A is a schematic plan view showing a fourth embodiment of the electronic component inspection device of the present invention.

20B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of FIG. 20A.

Figure 21 is a block diagram of the electronic component inspection apparatus shown in Figure 20A.

Fig. 22A is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

22B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of FIG. 22A.

Fig. 23 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 24 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 25 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 26 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 27 is a view for explaining the operation of the electronic component inspection apparatus shown in Fig. 20A.

Fig. 28 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 29 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 30 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 31 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 32 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 33 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 34 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 35 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 36 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 37 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 38 is a view for explaining the operation of the electronic component inspection apparatus shown in Fig. 20A.

Fig. 39 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 40 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 41 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 42 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 43 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 44 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 45 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 46 is a view for explaining the operation of the electronic component inspection apparatus shown in Fig. 20A.

Fig. 47 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

Fig. 48 is a view for explaining the operation of the electronic component inspection device shown in Fig. 20A.

FIG. 49 is a plan view showing a first inspection device transfer head and an inspection unit according to a fifth embodiment of the electronic component inspection device of the present invention.

Hereinafter, the electronic component conveying device and the electronic component inspection device according to the present invention will be described in detail based on the embodiments shown in the additional drawings.

In the following, for convenience of explanation, for example, as shown in FIGS. 1A and 20A, three axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Further, the direction of the arrow symbol of each of the X-axis, the Y-axis, and the Z-axis is referred to as a positive side, and the direction opposite to the arrow symbol is referred to as a negative side. In addition, the upstream side of the conveyance direction of an electronic component is abbreviated as "upstream side", and the downstream side is abbreviated as "downstream side." Further, the "level" in the specification of the present invention is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component.

The inspection devices (electronic component inspection devices) 1, 1c described below are used for inspection/ The test (hereinafter referred to as "inspection") such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package IC device, or an LCD (Liquid Crystal Display), Device for electrical characteristics of electronic components such as CIS (CMOS Image Sensor). In the following, for convenience of explanation, a case where an IC device is used as the above-described electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 90".

<First embodiment>

Fig. 1A is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 1B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of Fig. 1A. Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1A.

In addition, in FIG. 1A, since the first inspection device transfer head and the second inspection device transfer head overlap with other members, they are indicated by two-dot chain lines. In the case of the first inspection device transfer head and the second inspection device transfer head, the first inspection device transfer head and the second inspection device transfer head are described in FIG. 1B.

As shown in FIG. 1A, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as "recycling area") A4, and a tray removal. Area A5. These regions are separated from each other by a wall portion, a partition or the like (not shown). Further, the supply region A2 is the first chamber R1 partitioned by a wall portion or a partition plate, and the inspection region A3 is the second chamber R2 partitioned by a wall portion or a partition plate, and the recovery region A4 is a wall portion or The third room R3 of the partition such as the partition. Further, the first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (recovery region A4) are configured to ensure airtightness or heat-insulating property, respectively. Thereby, the first chamber R1, the second chamber R2, and the third chamber R3 can each maintain humidity or temperature as much as possible. Further, the first chamber R1 and the second chamber R2 are controlled to have specific humidity and a specific temperature, respectively.

The IC device 90 is inspected from the tray supply area A1 to the tray removal area A5, sequentially passes through the above-described respective areas, and is inspected in the middle inspection area A3. Thus, the inspection device 1 includes The following is an electronic component transport apparatus that transports the IC device 90 in each area, and has a control unit 80; the inspection unit 16 performs inspection in the inspection area A3; and an inspection control unit (not shown). Further, in the inspection apparatus 1, the electronic component conveying apparatus is constituted by a configuration other than the inspection unit 16 and the inspection control unit.

The tray supply area A1 supplies an area of the tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In addition, in the tray supply area A1, a plurality of trays 200 may be stacked.

The supply area A2 supplies a plurality of IC devices 90 from the tray 200 of the tray supply area A1 to the area of the inspection area A3. Further, a first tray transport mechanism 11A and a second tray transport mechanism 11B that transport the trays 200 one by one across the tray supply area A1 and the supply area A2 are provided.

In the supply region A2, a first temperature adjustment unit (first heat equalizing plate) 12a that is a first mounting portion on which the IC device 90 is placed, and a second temperature adjustment unit that is a second mounting portion on which the IC device 90 is placed are provided. Part (second soaking plate) 12b, supply device transfer head 13, and third tray transfer mechanism 15.

The first temperature adjustment unit 12a cools a plurality of IC devices 90, and adjusts (controls) the temperature of the IC device 90 to a temperature (first temperature) suitable for inspection (low temperature inspection) (temperature control means). Further, the second temperature adjustment unit 12b heats (controls) the plurality of IC devices 90 to adjust (control) the temperature of the IC device 90 to a temperature (second temperature) suitable for inspection (high temperature inspection). The first temperature adjustment unit 12a and the second temperature adjustment unit 12b are arranged and fixed in the Y direction. In addition, the IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the first tray transport mechanism 11A is transported and placed on the first temperature adjustment unit 12a or the second temperature adjustment unit 12b. Further, the first temperature is lower than the second temperature (the first temperature is different from the second temperature).

The supply device transfer head 13 is supported in the supply region A2 so as to be movable in the X direction, the Y direction, and the Z direction. By this, the supply device transfer head 13 can carry the transfer of the IC device 90 between the tray 200 loaded from the tray supply area A1 and the first temperature adjustment unit 12a or the second temperature adjustment unit 12b, and the first temperature adjustment unit 12a. Or the second temperature adjustment unit 12b and the following The IC device 90 between the first device supply unit 14a or the second device supply unit 14b is transported. Further, the supply device transporting head 13 has a plurality of hand units 131 as holding portions for holding the IC device 90, and each of the hand units 131 is provided with a suction nozzle, similar to the first hand unit 171a, which will be described later, by means of an adsorption IC device. 90 and hold. Further, in each of the hand units 131 of the supply device transporting head 13, the temperature of the IC device 90 can be adjusted by cooling or heating the IC device 90 similarly to the first temperature adjusting unit 12a or the second temperature adjusting unit 12b. It is constructed in a manner suitable for the temperature to be inspected.

The third tray transport mechanism 15 is a mechanism that transports the empty trays 200 in the state in which all of the IC devices 90 have been removed in the X direction. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transport mechanism 11B.

The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, a first device supply unit (first electronic component mounting unit) (first supply shuttle) 14a that is placed on the IC device 90 can be placed and placed. (movable); a second device supply unit (second electronic component mounting unit) (second supply shuttle) 14b, which is a second mounting portion, which can carry (dispose) the IC device 90 and transport (movable); Inspection unit 16; first inspection device transfer head (first electronic component holding portion) 17a; second inspection device transfer head (second electronic component holding portion) 17b; and first device recovery unit (first device) The recovery shuttle 18a can mount and transport the IC device 90, and the second device collection unit (second recovery shuttle) 18b, which is a placement unit, can mount and transport the IC device 90.

The first device supply unit 14a and the second device supply unit 14b transport the IC device 90 before the temperature adjustment (temperature control) to the vicinity of the inspection unit 16, respectively.

Each of the first device supply unit 14a and the second device supply unit 14b has a placement plate 142 on which the IC device 90 is placed (arranged), and a device supply unit main body 141 that is movable in the X direction. On the upper surface of the arranging plate 142, a plurality of recesses 145 which are recessed portions for housing (holding) the IC device 90 are provided. Further, in the configuration shown in the drawing, the recess 145 is arranged in a matrix in a total of eight in the X direction and two in the Y direction. The configuration board 142 is detachably disposed in the device supply unit Body 141. The first device supply unit 14a and the second device supply unit 14b are respectively movably supported in the X direction between the supply area A2 and the inspection area A3. Further, the first device supply unit 14a and the second device supply unit 14b are arranged in the Y direction, and the IC device 90 on the first temperature adjustment unit 12a or the second temperature adjustment unit 12b is supplied by the supply device transfer head 13 The carrier is placed and placed on the first device supply unit 14a or the second device supply unit 14b. Similarly to the first temperature adjustment unit 12a, the first device supply unit 14a can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection (first temperature). Further, similarly to the second temperature adjustment unit 12b, the second device supply unit 14b can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection (second temperature).

Further, the first component supply unit 14a and the second device supply unit 14b constitute an electronic component mounting unit (supply shuttle).

The inspection unit 16 is a unit that inspects/tests the electrical characteristics (electrical inspection) of the IC device 90, that is, holds the components of the IC device 90 when the IC device 90 is inspected.

The inspection portion 16 has a holding member 162 that holds the IC device 90 and an inspection portion body 161 that supports the holding member 162. The holding member 162 is detachably provided to the inspection portion body 161.

On the upper surface of the holding member 162 of the inspection portion 16, a recess for accommodating (holding) the IC device 90, that is, a plurality of holding portions 163 is provided. In the configuration shown in the drawing, the holding portion 163 has four in total in the X direction and two in the Y direction, and is arranged in a matrix. The IC device 90 is housed in the holding portion 163, and is placed (mounted) on the inspection portion 16.

Further, probe pins that are electrically connected to the terminals of the IC device 90 in a state where the IC device 90 is held by the holding portion 163 are provided at positions corresponding to the respective holding portions 163 of the inspection portion 16. Moreover, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the memory unit of the inspection control unit provided in the test unit (not shown) connected to the inspection unit 16.

In the same manner as the first temperature adjustment unit 12a, the four holding portions 163 on the lower side in FIG. 1A among the eight holding portions 163 of the inspection unit 16 constitute the IC device 90 that can cool the IC device. The temperature adjustment of the member 90 (which can be set) is the first temperature setting unit 166 suitable for the temperature (first temperature) to be inspected. Further, in the eight holding portions 163 of the inspection unit 16, the four holding portions 163 on the upper side in FIG. 1A are configured to heat the IC device 90 and adjust the temperature of the IC device 90 in the same manner as the second temperature adjustment unit 12b. The second temperature setting unit 167 that is suitable for the temperature (second temperature) to be inspected can be set.

The first inspection device transport head 17a and the second inspection device transport head 17b are supported in the inspection region A3 so as to be movable in the Y direction and the Z direction. In addition, the first inspection device transport head 17a and the second inspection device transport head 17b are arranged in the Y direction. The first inspection device transfer head 17a can transport and mount the IC device 90 on the first device supply unit 14a carried in from the supply region A2 to the inspection unit 16, and can transport the IC device 90 on the inspection unit 16. And placed on the first device recovery unit 18a. In the same manner, the second inspection device transfer head 17b can transport and mount the IC device 90 on the second device supply unit 14b carried in from the supply region A2 to the inspection unit 16, and can be placed on the inspection unit 16 The device 90 is transported and placed on the second device recovery unit 18b. When the IC device 90 is inspected, the first inspection device transfer head 17a and the second inspection device transfer head 17b press the IC device 90 toward the inspection unit 16, whereby the IC device 90 is brought into contact with each other. Inspection unit 16. Thereby, as described above, the terminals of the IC device 90 are electrically connected to the probe pins of the inspection portion 16.

As shown in FIG. 1B, the first inspection device transfer head 17a has a plurality of first hand units (first holding portions) 171a that can hold the IC device 90. In addition, in the configuration shown in the figure, the first hand unit 171a is arranged in a matrix in a total of eight in the X direction and two in the Y direction. In the same manner, the second inspection device transport head 17b has a plurality of second hand units (second holding portions) 171b that can hold the IC device 90. Further, in the configuration shown in the drawing, the second hand unit 171b is arranged in a matrix in a total of eight in the X direction and two in the Y direction.

Since the configuration of each of the first hand unit 171a and each of the second hand units 171b is the same, the first hand unit 171a will be described below as a representative. The first hand unit 171a has a holding member 173 that holds the IC device 90, and a hand unit body 172 that supports the holding member 173. Holding member 173 It is detachably provided to the hand unit body 172. The first hand unit 171a includes a suction nozzle for holding the IC device 90 by suction.

In the same manner as the first temperature adjustment unit 12a, each of the first hand units 171a of the first inspection device transport head 17a can cool the IC device 90 (can be set) to a temperature suitable for inspection. (1st temperature).

In addition, each of the second hand units 171b of the second inspection device transport head 17b can heat the IC device 90 and adjust the IC device 90 (which can be set) to a temperature suitable for inspection, similarly to the second temperature adjustment unit 12b. (2nd temperature).

In addition, the first inspection device transport head 17a and the second inspection device transport head 17b constitute an electronic component holding portion.

The first device recovery unit 18a and the second device recovery unit 18b are devices that transport the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4.

Each of the first device recovery unit 18a and the second device recovery unit 18b has a placement plate 182 on which the IC device 90 is placed (arranged), and a device collection unit body 181 that is movable in the X direction. On the upper surface of the arranging plate 182, a recess for accommodating (holding) the IC device 90, that is, a plurality of recesses 185 is provided. Further, in the configuration shown in the drawing, the pockets 185 are arranged in a matrix in a total of eight in the X direction and two in the Y direction. The configuration plate 182 is detachably mounted to the device recovery portion body 181. The first device recovery unit 18a and the second device recovery unit 18b are supported to be movable between the inspection area A3 and the collection area A4 in the X direction. Further, the first device collecting portion 18a and the second device collecting portion 18b are arranged in the Y direction. The IC device 90 on the inspection unit 16 is transported and placed on the first device collection unit 18a by the first inspection device transport head 17a, or is transported and placed by the second inspection device transport head 17b. The second device recovery unit 18b.

In the present embodiment, the first device recovery unit 18a and the first device supply unit 14a are configured to move independently of each other. However, the present invention is not limited thereto. For example, the first device recovery unit 18a and the first device may be used. The device supply unit 14a is connected or integrated, and the first device collecting unit 18a and the first device supply unit 14a are integrally moved. Similarly, in this embodiment In the second device recovery unit 18b and the second device supply unit 14b, the second device storage unit 14b is configured to move independently of each other. However, the second device recovery unit 18b and the second device supply unit 14b may be connected to each other. Alternatively, the second device collecting portion 18b and the second device supply portion 14b are integrally moved.

The recovery area A4 is the area where the IC device 90 that has completed the inspection is recovered. In the collection area A4, a collection tray 19, a collection device transfer head 20, and a sixth tray transfer mechanism 21 are provided. Further, an empty tray 200 is also provided in the collection area A4.

The recovery tray 19 is fixed in the collection area A4, and in the present embodiment, three are arranged in the X direction. Further, three empty trays 200 are also arranged in the X direction. Then, the IC device 90 moved to the first device collecting portion 18a or the second device collecting portion 18b of the recovery area A4 is transported and placed on any of the collecting trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified according to the respective inspection results.

The device transfer head 20 for recycling can be supported in the X, Y, and Z directions in the recovery area A4. Thereby, the collecting device transfer head 20 can transport the IC device 90 from the first device collecting portion 18a or the second device collecting portion 18b to the collecting tray 19 or the empty tray 200. Further, the device transfer head 20 for recycling has a plurality of hand units 201 as holding portions for holding the IC device 90, and each of the hand units 201 includes a suction nozzle similar to the first hand unit 171a, and can hold the IC device by adsorption. 90.

The sixth tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction. Moreover, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is recovered, that is, it may become any of the above three empty trays 200.

The tray removal area A5 collects and removes the area of the tray 200 of the plurality of IC devices 90 arranged in the checked state. In addition, in the tray removing area A5, a plurality of trays 200 may be stacked.

Further, a fourth tray transport mechanism 22A and a fifth tray transport mechanism 22B that transport the trays 200 one by one across the collection area A4 and the tray removal area A5 are provided. 4th support The disk transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC device 90 is placed from the recovery area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism that transports the tray 200 for collecting the empty IC device 90 from the tray removal area A5 to the collection area A4.

Further, the inspection control unit of the tester performs an (electrical) inspection of the electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory unit (not shown).

Further, as shown in FIG. 2, the inspection apparatus 1 includes a control unit 80, an operation unit 6 electrically connected to the control unit 80 and performing each operation of the inspection apparatus 1, and cooling mechanisms 41, 42, 43 and 44 for cooling the IC device 90. And heating mechanisms 51, 52, 53 and 54 of the IC device 90.

The control unit 80 has a memory unit 801 and the like that store information (data), and controls, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the first temperature adjustment unit 12a, the second temperature adjustment unit 12b, and the supply device. The head 13, the first device supply unit 14a, the second device supply unit 14b, the third tray transport mechanism 15, the first inspection device transport head 17a, the second inspection device transport head 17b, the first device recovery unit 18a, and the first 2 device recovery unit 18b, collection device transfer head 20, sixth tray transfer mechanism 21, fourth tray transfer mechanism 22A, fifth tray transfer mechanism 22B, display unit 62, cooling mechanisms 41 to 44, heating mechanisms 51 to 54, and the like The drive of each department.

Further, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays information (data) such as an image. The input unit 61 is not particularly limited, and for example, a keyboard, a mouse, or the like can be enumerated. Further, the display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel, an organic EL display panel, and the like. The operation of the operation unit 6 by the worker (operator) is performed by, for example, operating the input unit 61 and moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking).

In addition, the input unit 61 is not limited to the above-described components, and for example, a mechanical operation button such as a push button may be cited. Moreover, the operation unit 6 is not limited to the upper one. For example, a component such as a touch panel that can display input and information can be enumerated.

Further, the cooling mechanism 41 cools the first temperature adjustment unit 12a, and the first temperature adjustment unit 12a cools the IC device 90. Further, the cooling mechanism 42 cools the first device supply portion 14a, and the first device supply portion 14a cools the IC device 90. Further, the cooling mechanism 43 cools the first inspection device transfer head 17a, and the IC device 90 is cooled by the first inspection device transfer head 17a. Further, the cooling mechanism 44 cools the four holding portions 163 on the lower side in FIG. 1A among the eight holding portions 163 of the inspection portion 16, that is, the first temperature setting portion 166, and the first temperature setting portion 166 cools the IC device. 90.

The cooling means 41 to 44 are not particularly limited, and for example, a refrigerant (for example, a low-temperature gas such as nitrogen gas obtained by nitrogenizing a liquid) is flown through a tube disposed in or near the object to be cooled. Cooling device, Peltier element, etc.

Further, the heating mechanism 51 heats the second temperature adjustment unit 12b, and the second temperature adjustment unit 12b heats the IC device 90. Further, the heating means 52 heats the second device supply portion 14b, and the second device supply portion 14b heats the IC device 90. Moreover, the heating means 53 heats the second inspection device transfer head 17b, and the second inspection device transfer head 17b heats the IC device 90. Further, the heating means 54 heats the four holding portions 163 on the upper side in FIG. 1A among the eight holding portions 163 of the inspection portion 16, that is, the second temperature setting portion 167, and the second temperature setting portion 167 heats the IC device 90. .

The heating means 51 to 54 are not particularly limited, and for example, a heater having a heating wire or the like can be cited.

In such an inspection apparatus 1, each of the low temperature inspection for cooling the IC device 90 to a specific temperature and the high temperature inspection for heating the IC device 90 to a specific temperature can be performed in parallel.

When the low temperature inspection is performed, the first device supply unit 14a transports the IC device 90 cooled by the first temperature adjustment unit 12a and cools it, and then holds the first hand unit 171a of the first inspection device transfer head 17a. The IC device 90 is cooled. Thereafter, with the first inspection device The transfer head 17a transports the IC device 90, and holds the IC device 90 in the first temperature setting unit 166 of the inspection unit 16 to perform low temperature inspection.

When the high temperature inspection is performed, the IC device 90 heated by the second temperature adjustment unit 12b is transported by the second device supply unit 14b and heated, and then the second hand unit of the second inspection device transport head 17b is transported. The 171b holds the IC device 90 and heats it. In addition, the IC device 90 is transported by the second inspection device transport head 17b, and the IC device 90 is held in the second temperature setting unit 167 of the inspection unit 16 to perform high temperature inspection.

In addition, the first device supply unit 14a and the first inspection device transfer head 17a constitute a first transport unit that can transport the IC device 90 and adjust the IC device 90 to the first temperature. In addition, the second device supply unit 14b and the second inspection device transfer head 17b constitute a second transfer unit that can transport the IC device 90 and adjust the IC device 90 to the second temperature.

As described above, according to the inspection apparatus 1, each of the low temperature inspection and the high temperature inspection of the IC device 90 can be performed, and the convenience is high.

Moreover, since the low temperature inspection and the high temperature inspection can be performed in parallel, the throughput can be increased.

<Second embodiment>

3 to 11 are views for explaining the operation of the second embodiment of the electronic component inspection device of the present invention.

In addition, in FIG. 3 to FIG. 11, since the first inspection device transport head and the second inspection device transport head overlap with other members, they are indicated by two-dot chain lines.

In the following, the second embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the description of the same items will be omitted.

In the inspection apparatus 1 of the second embodiment, the IC device 90 is first subjected to the low temperature inspection, and then the high temperature inspection is performed. Thereafter, the IC device 90 that has completed the inspection is transported (recovered) to the recovery area A4. Therefore, in the case of performing the low temperature inspection and the high temperature inspection, the throughput can be increased. Further, since the IC device 90 is transported to the recovery region A4 in a high temperature state not in a low temperature state, condensation of the IC device 90 can be prevented. The following describes the inspection equipment Set the action of 1.

First, as shown in FIG. 3, the IC device 90 is placed in the four pockets 145 on the upper side in FIG. 3 of the first device supply portion 14a to be cooled. Alternatively, the IC device 90 may be disposed in the four recesses 145 on the lower side of FIG. 3 of the first device supply portion 14a.

Next, as shown in FIG. 4, the IC device 90 is cooled by the first device supply portion 14a, and is transported to a position corresponding to the inspection portion 16.

Next, as shown in FIG. 5, the IC device 90 is held and cooled by the first hand unit 171a of the first inspection device transfer head 17a.

Then, as shown in FIG. 6, the IC device 90 is cooled by the first inspection device transfer head 17a, and is transported to the first temperature setting unit 166 of the inspection unit 16 to perform low temperature inspection.

After the low temperature inspection, the high temperature inspection is performed, and all the IC devices 90 that have completed the low temperature inspection are subjected to the high temperature inspection, but it is preferable to perform the high temperature inspection only on the IC device 90 that is qualified in the low temperature inspection, and the unqualified IC device 90 is not required. Perform a high temperature check. Thereby, the time required for the high temperature inspection can be shortened.

Next, as shown in FIG. 7, the IC device 90 is held and heated by the second hand unit 171b of the second inspection device transporting head 17b. In addition, the state in which the IC device 90 is held by the first hand unit 171a of the first inspection device transport head 17a can be maintained. Further, the second device supply unit 14b is moved to a position corresponding to the inspection unit 16.

Then, as shown in FIG. 8, the IC device 90 is heated by the second inspection device transfer head 17b, and is transported to the position corresponding to the second device supply portion 14b, and is placed in the recess 145. Then, the IC device 90 is heated to a specific temperature by the second device supply portion 14b.

Then, as shown in FIG. 9, the second hand unit 171b of the second inspection device transporting head 17b holds and heats the IC device 90, and transports it to the second temperature setting unit 167 of the inspection unit 16. High temperature inspection. Further, the second device recovery unit 18b moves to and checks The position of the part 16 corresponds.

Then, as shown in FIG. 10, the IC device 90 is transported to the position corresponding to the second device collecting portion 18b by the second inspection device transporting head 17b, and is placed in the recess 185. Further, as shown in FIG. 11, the IC device 90 is transported to the recovery area A4 by the second device collecting unit 18b. Further, the transfer of the IC device 90 to the recovery area A4 is performed by the first device recovery unit 18a.

As described above, according to the inspection apparatus 1, each of the low temperature inspection and the high temperature inspection of the IC device 90 can be performed, and the convenience is high.

Further, in the case where the low temperature inspection and the high temperature inspection are performed on one IC device 90, the low temperature inspection and the high temperature inspection can be performed without temporarily recovering the IC device 90, whereby the throughput can be improved.

<Third embodiment>

12A to 19 are views for explaining the operation of the third embodiment of the electronic component inspection device of the present invention.

In addition, in FIG. 12A to FIG. 19, since the first inspection device transport head and the second inspection device transport head overlap with other members, they are indicated by two-dot chain lines. In the case of the first inspection device transfer head and the second inspection device transfer head of FIG. 12A, the first inspection device transfer head and the second inspection device transfer head are described in FIG. 12B.

In the following, the third embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the description of the same items will be omitted.

As shown in FIG. 12A and FIG. 12B, in the inspection apparatus 1 of the third embodiment, four of the eight first hand units 171a of the first inspection device transport head 17a are the lower ones of FIGS. 12A and 12B. The one-hand unit 171a constitutes a device transfer head first temperature setting unit (first electronic component holding portion temperature setting unit) 176 that cools the IC device 90 and adjusts (can be set) the temperature of the IC device 90 to a temperature suitable for inspection. (1st temperature). Further, among the eight first hand units 171a of the first inspection device transport head 17a, the four first hand units 171a on the upper side in Figs. 12A and 12B constitute the first hand unit 171a. The device transport head second temperature setting unit (second electronic component holding unit temperature setting unit) 177 can heat the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection (second temperature). .

In the same manner, the four second hand units 171b in the lower side of FIGS. 12A and 12B of the eight second hand units 171b of the second inspection device transport head 17b constitute the device transport head first temperature setting unit (first electronic unit). A part holding portion temperature setting unit 176 that cools the IC device 90 and adjusts (can be set) the temperature of the IC device 90 to a temperature suitable for inspection (first temperature). Further, the four second hand units 171b on the upper side in FIGS. 12A and 12B of the eight second hand units 171b of the second inspection device transporting head 17b constitute the second transport unit of the second transport unit (second electronic component holding) The part temperature setting unit 177 can heat the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection (second temperature).

Further, among the eight pockets 145 of the first device supply portion 14a, the four recesses 145 on the lower side in FIGS. 12A and 12B constitute the device supply portion first temperature setting portion (the first electronic component mounting portion temperature setting portion). 146, which can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection (first temperature). Further, among the eight pockets 145 of the first device supply portion 14a, the four recesses 145 on the upper side in FIGS. 12A and 12B constitute the device supply portion second temperature setting portion (second electronic component mounting portion temperature setting portion). 147, which can heat the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection (second temperature).

Similarly, among the eight pockets 145 of the second device supply portion 14b, the four recesses 145 on the lower side in FIGS. 12A and 12B constitute the device supply portion first temperature setting portion (the first electronic component mounting portion temperature setting) a portion 146 that cools the IC device 90 and adjusts (settable) the temperature of the IC device 90 to a temperature suitable for inspection (first temperature). Further, among the eight pockets 145 of the second device supply portion 14b, four pockets 145 on the upper side in FIGS. 12A and 12B constitute a device supply portion second temperature setting portion (second electronic component mounting portion temperature setting portion). 147, which can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection (second temperature).

The device supply unit first temperature setting unit 146 and the device transfer head first temperature setting The unit 176 or the like constitutes the transport IC device 90, and the IC device 90 can be set as the first transport unit of the first temperature. In addition, the device supply unit second temperature setting unit 147, the device transfer head second temperature setting unit 177, and the like constitute the transport IC device 90, and the IC device 90 can be set as the second transport unit of the second temperature.

In the inspection apparatus 1, the IC device 90 is first subjected to low temperature inspection, and secondly, high temperature inspection is performed, and thereafter, the IC device 90 that has completed the inspection is transported (recovered) to the recovery area A4. Therefore, the output can be increased in the case of low temperature inspection and high temperature inspection. Further, since the IC device 90 is transported to the recovery region A4 in a high temperature state not in a low temperature state, condensation of the IC device 90 can be prevented. In the following, the operation of the inspection device 1 will be described. Here, the first device supply unit 14a and the first inspection device transfer head 17a perform the above-described low temperature inspection and the transfer of the IC device 90 during the high temperature inspection. Description.

First, as shown in FIG. 12A and FIG. 12B, the IC device 90 is placed in the device supply unit first temperature setting unit 146 of the first device supply unit 14a and cooled.

Next, as shown in FIG. 13, the IC device 90 is cooled by the first device supply unit 14a, and is transported to a position corresponding to the inspection unit 16.

Then, as shown in FIG. 14, the device transfer head first temperature setting unit 176 of the first inspection device transport head 17a holds and cools the IC device 90, and transports it to the first temperature setting unit of the inspection unit 16. At 166, a low temperature inspection was performed.

Although high temperature inspection can be performed after the low temperature inspection, all the IC devices 90 that have completed the low temperature inspection can be subjected to high temperature inspection, but it is preferable to perform high temperature inspection only on the IC device 90 that is qualified in the low temperature inspection, and it is not necessary to fail. The IC device 90 performs a high temperature inspection. Thereby, the time required for the high temperature inspection can be shortened.

Then, as shown in FIG. 15, the IC device 90 is transported to the position corresponding to the first device supply unit 14a by the first inspection device transport head 17a, and is placed in the device supply unit second temperature setting unit 147. Then, the device supply unit second temperature setting unit 147 heats the IC device 90 to a specific temperature. Alternatively, the second temperature of the supply portion of the device may be omitted. The setting unit 147 heats the IC device 90, and the IC device 90 is heated only by the device transfer head second temperature setting unit 177 of the first inspection device transport head 17a, which will be described later.

Then, as shown in FIG. 16, the device transfer head second temperature setting unit 177 of the first inspection device transport head 17a holds and heats the IC device 90, and as shown in FIG. 17, the IC device 90 is transported to The second temperature setting unit 167 of the inspection unit 16 performs a high temperature inspection. Further, the first device recovery unit 18a moves to a position corresponding to the inspection unit 16.

Then, as shown in FIG. 18, the IC device 90 is transported to the position corresponding to the first device collecting portion 18a by the first inspection device transporting head 17a, and is placed in the recess 185. Thereafter, as shown in FIG. 19, the IC device 90 is transported to the recovery area A4 by the first device recovery unit 18a.

In the above, the first device supply unit 14a and the first inspection device transfer head 17a are described as being subjected to the low temperature inspection and the transfer of the IC device 90 during the high temperature inspection. However, the second device transfer unit may be used. 14b and the second inspection device transfer head 17b are similarly executed.

In addition, the low temperature inspection and the high temperature inspection performed by the IC device 90 by the first device supply unit 14a and the first inspection device transfer head 17a, and the second device supply unit 14b and the second inspection are performed in parallel. The device transfer head 17b carries the IC device 90 to perform low temperature inspection and high temperature inspection. Thereby, the output can be increased.

As described above, according to the inspection apparatus 1, each of the low temperature inspection and the high temperature inspection of the IC device 90 can be performed, and the convenience is high.

Further, in the case where the low temperature inspection and the high temperature inspection are performed on one IC device 90, the low temperature inspection and the high temperature inspection can be performed without temporarily recovering the IC device 90, whereby the throughput can be improved.

Further, in the second and third embodiments described above, the low temperature inspection is first performed, and then the high temperature inspection is performed. However, the present invention is not limited thereto, and the high temperature inspection may be performed first, followed by the low temperature inspection.

<Fourth embodiment>

Fig. 20A is a schematic plan view showing a fourth embodiment of the electronic component inspection device of the present invention. 20B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of FIG. 20A. Figure 21 is a block diagram of the electronic component inspection apparatus shown in Figure 20A. 22 to 48 are views for explaining the operation of the electronic component inspection device shown in Fig. 20A.

In addition, in FIG. 20A, since the first inspection device transport head and the second inspection device transport head overlap with other members, they are indicated by two-dot chain lines (the same applies to FIGS. 22A to 48). In the case of the first inspection device transfer head and the second inspection device transfer head, the first inspection device transfer head and the second inspection device transfer head are shown in FIG. 20B (FIG. 22A) The same is true in Fig. 22B).

In addition, in FIGS. 22A to 48, only the necessary members for explaining the operation of the electronic component inspection device will be described.

Further, the inspection device 1c is configured to perform a low temperature inspection for cooling the IC device 90 to a specific temperature (first temperature), and to perform high temperature inspection by heating the IC device 90 to a specific temperature (third temperature). Normal temperature inspection at room temperature (second temperature). Further, the first temperature is lower than the second temperature, and the second temperature is lower than the third temperature.

As shown in FIG. 20A and FIG. 20B, the inspection apparatus 1c is divided into a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter referred to as "recovery area") A4, and The tray removes the area A5. These regions are separated from each other by a wall portion, a partition or the like (not shown). Further, the supply region A2 is the first chamber R1 partitioned by a wall portion or a partition plate, and the inspection region A3 is the second chamber R2 partitioned by a wall portion or a partition plate, and the recovery region A4 is a wall portion or The third room R3 of the partition such as the partition. In addition, the first chamber R1 (supply area A2), the second chamber R2 (inspection area A3), and the third chamber R3 (recovery area A4) are configured to ensure airtightness and heat insulation. Thereby, the first chamber R1, the second chamber R2, and the third chamber R3 can each maintain humidity or temperature as much as possible. Further, the first chamber R1 and the second chamber R2 are controlled to have specific humidity and a specific temperature, respectively.

The IC device 90 is inspected from the tray supply area A1 to the tray removal area A5, sequentially passes through the above-described respective areas, and is inspected in the middle inspection area A3. In this way, the inspection apparatus 1c includes an electronic component transport apparatus that transports the IC device 90 in each area, and has a control unit 80; the inspection unit 16 performs inspection in the inspection area A3; and an inspection (not shown) Control department. Further, in the inspection device 1c, an electronic component conveying device is configured by a configuration other than the inspection unit 16 and the inspection control unit.

The tray supply area A1 supplies an area of the tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In addition, in the tray supply area A1, a plurality of trays 200 may be stacked.

The supply area A2 supplies a plurality of IC devices 90 disposed on the tray 200 from the tray supply area A1 to the inspection area A3. Further, a first tray transport mechanism 11A and a second tray transport mechanism 11B that transport the trays 200 one by one across the tray supply area A1 and the supply area A2 are provided.

In the supply region A2, a first temperature adjustment unit (first heat equalizing plate) 12c that is a first mounting portion on which the IC device 90 is placed, and a second temperature adjustment unit that is a second mounting portion on which the IC device 90 is placed are provided. Part (second soaking plate) 12d, supply device transfer head 13, and third tray transfer mechanism 15.

The first temperature adjustment unit 12c and the second temperature adjustment unit 12d respectively cool or heat a plurality of IC devices 90, and adjust (control) the temperature of the IC device 90 to a device (temperature control member) suitable for the temperature to be inspected. The first temperature adjustment unit 12c and the second temperature adjustment unit 12d are arranged and fixed in the Y direction. In addition, the IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the first tray transport mechanism 11A is transported and placed on the first temperature adjustment unit 12c or the second temperature adjustment unit 12d. In the present embodiment, a case where the first temperature adjustment unit 12c and the second temperature adjustment unit 12d are applied to the apparatus for cooling the IC device 90 will be described.

The supply device transfer head 13 is supported in the supply region A2 so as to be movable in the X direction, the Y direction, and the Z direction. Thereby, the supply device transfer head 13 can be carried between the tray 200 loaded from the tray supply area A1 and the first temperature adjustment unit 12c or the second temperature adjustment unit 12d. The IC device 90 is transported, and the IC device 90 between the first temperature adjustment unit 12c or the second temperature adjustment unit 12d and the first device supply unit 14c or the second device supply unit 14d, which will be described later, is transported. Further, the supply device transporting head 13 has a plurality of hand units 131 as robot arms (holding portions) that can hold the IC device 90. Each of the hand units 131 is provided with a suction nozzle as in the first hand unit 171c to be described later. The IC device 90 is held by adsorption. Further, each of the hand units 131 of the supply device transfer head 13 may be configured to cool or heat the IC device 90, and adjust the temperature of the IC device 90 to a temperature suitable for inspection.

The third tray transport mechanism 15 is a mechanism that transports the empty trays 200 in the state in which all of the IC devices 90 have been removed in the X direction. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transport mechanism 11B.

The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, a first component supply unit (electronic component mounting unit), that is, a first device supply unit (first shuttle) (first supply shuttle) 14c, which can be placed (arranged) The IC device 90 is transported (movable); the second electronic component mounting portion (electronic component mounting portion), that is, the second device supply portion (second shuttle) (second supply shuttle) 14d, which can be placed (Arrangement) IC device 90 is transported (movable); inspection unit 16; first electronic component holding portion (electronic component holding portion), that is, first inspection device transfer head (first robot arm) 17c; second electron The component holding portion (electronic component holding portion), that is, the second inspection device transfer head (second arm) 17d, and the first device collecting portion (first recovery shuttle) 18c, which is a mounting portion, can mount and transport the IC The device 90 and the second device recovery unit (second recovery shuttle) 18d, which is a mounting portion, can mount and transport the IC device 90.

The first device supply unit 14c and the second device supply unit 14d transport the IC device 90 before inspection to the vicinity of the inspection unit 16, respectively.

Each of the first device supply unit 14c and the second device supply unit 14d has a placement plate 142 on which the IC device 90 is placed (arranged), and a device supply unit main body 141 that is movable in the X direction. On the upper surface of the arranging plate 142, a recess for accommodating (holding) the IC device 90, that is, a plurality of recesses 145 is provided. Further, in the configuration shown in the figure, the recess 145 is four in the X direction and two in the Y direction. The total of 8 are arranged in a matrix. The arrangement plate 142 is detachably provided to the device supply portion body 141. Each of the first device supply portion 14c and the second device supply portion 14d is supported to be movable in the X direction between the supply region A2 and the inspection region A3. Further, the first device supply unit 14c and the second device supply unit 14d are arranged in the Y direction, and the IC device 90 on the first temperature adjustment unit 12c or the second temperature adjustment unit 12d is supplied by the supply device transfer head 13 It is transported and placed on the first device supply unit 14c or the second device supply unit 14d.

Here, as shown in FIG. 22A, the two pockets 145 on the left side in FIG. 22A of the eight pockets 145 of the first device supply portion 14c are the first placement portion 261, and the second group from the left in FIG. 22A. The two pockets 145 are the second mounting portions 262. In FIG. 22A, the two pockets 145 of the third group from the left are the third mounting portions 263, and the two pockets 145 on the right side in FIG. 22A are the fourth. The placing unit 264. The first placement portion 261, the second placement portion 262, the third placement portion 263, and the fourth placement portion 264 are arranged side by side in the X direction. The same applies to the second device supply unit 14d.

Further, the first device supply unit 14c and the second device supply unit 14d may be configured to cool or heat the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection.

In this case, for example, the first mounting portion 261 of the first device supply portion 14c constitutes a device supply portion first temperature setting portion that cools the IC device 90 and adjusts (can be set) the temperature of the IC device 90 to Temperature suitable for low temperature inspection (1st temperature).

Further, the second placing unit 262 constitutes a second temperature setting unit of the device supply unit, and does not cool or heat the IC device 90, and sets the temperature of the IC device 90 to be settable for normal temperature inspection. Temperature (second temperature). Further, the second placing portion 262 may be configured to cool and heat the IC device 90, for example, and the temperature of the IC device 90 can be adjusted to a temperature suitable for normal temperature inspection by the cooling or heating.

Further, the third placing unit 263 constitutes a device supply unit third temperature setting unit that can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature suitable for high temperature inspection (third temperature). . Further, the right side of FIG. 22A among the eight mounting portions of the first device supply portion 14C Although the two fourth placing units 264 are not used in the present embodiment, they may be configured to be used.

The inspection portion 16 is a unit that inspects/tests the electrical characteristics (electrical inspection) of the IC device 90, that is, holds the components of the IC device 90 when the IC device 90 is inspected.

As shown in FIG. 20A, the inspection portion 16 has a holding member 162 that holds the IC device 90, and an inspection portion body 161 that supports the holding member 162. The holding member 162 is detachably provided to the inspection portion body 161.

On the upper surface of the holding member 162 of the inspection portion 16, a recess for accommodating (holding) the IC device 90, that is, a plurality of holding portions 163 is provided. In the configuration shown in the drawing, the holding portion 163 is arranged in a matrix of eight in total in the X direction and two in the Y direction. The IC device 90 is housed in the holding portion 163, and is placed (mounted) on the inspection portion 16.

Further, probe pins that are electrically connected to the terminals of the IC device 90 in a state where the IC device 90 is held by the holding portion 163 are provided at positions corresponding to the respective holding portions 163 of the inspection portion 16. Moreover, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the memory unit of the inspection control unit provided in the test unit (not shown) connected to the inspection unit 16.

Further, as shown in FIG. 22A, the two holding portions 163 on the left side in FIG. 22A among the eight holding portions 163 of the inspection portion 16 constitute a coolable IC device 90, and the temperature of the IC device 90 can be adjusted (configurable) to be suitable. The first temperature setting unit 166 of the temperature (first temperature) of the low temperature inspection.

Further, in the eight holding portions 163 of the inspection unit 16, the two holding portions 163 of the second group from the left in FIG. 22A constitute the second temperature setting unit 167, and the IC device 90 is not cooled or heated. The temperature of the IC device 90 is set to a temperature (second temperature) suitable for normal temperature inspection. Further, for example, the second temperature setting unit 167 may be configured to cool and heat the IC device 90, and the IC device 90 may be adjusted to a temperature suitable for normal temperature inspection by the cooling or heating.

Further, in the eight holding portions 163 of the inspection unit 16, the two holding portions 163 of the third group from the left in FIG. 22A constitute a third temperature setting portion 168 which can heat the IC device 90 and adjust the IC device 90 ( It can be set to a temperature suitable for high temperature inspection (third temperature).

Further, the two holding portions 163 on the right side in FIG. 22A of the eight holding portions 163 of the inspection unit 16 are not used in the present embodiment, but may be used.

As shown in FIG. 20A and FIG. 20B, the first inspection device transport head 17c and the second inspection device transport head 17d are supported in the inspection region A3 so as to be movable in the Y direction and the Z direction. In addition, the first inspection device transport head 17c and the second inspection device transport head 17d are arranged in the Y direction. The first inspection device transport head 17c can transport and mount the IC device 90 on the first device supply unit 14c carried in from the supply region A2 to the inspection unit 16, and can transport the IC device 90 on the inspection unit 16 And placed on the first device recovery unit 18c. Similarly, the second inspection device transport head 17d can transport and mount the IC device 90 on the second device supply unit 14d loaded from the supply region A2 to the inspection unit 16, and the IC on the inspection unit 16 can be placed. The device 90 is transported and placed on the second device recovery unit 18d. When the IC device 90 is inspected, the first inspection device transfer head 17c and the second inspection device transfer head 17d press the IC device 90 toward the inspection unit 16, thereby causing the IC device 90 to abut the inspection. Part 16. Thereby, as described above, the terminals of the IC device 90 are electrically connected to the probe pins of the inspection portion 16.

The first inspection device transfer head 17c has a plurality of first hand units 171c that can hold the IC device 90. In the configuration shown in the drawing, the first hand unit 171c is arranged in a matrix in a total of eight in the X direction and two in the Y direction. Similarly, the second inspection device transfer head 17d has a plurality of second hand units 171d that can hold the IC device 90. In addition, in the configuration shown in the figure, the second hand unit 171d has four in the X direction and two in the Y direction, and is arranged in a matrix.

Since the configuration of each of the first hand unit 171c and each of the second hand units 171d is the same, the first hand unit 171c will be described below as a representative. As shown in FIG. 22B, the first hand unit 171c has a holding member 173 for holding the IC device 90, and a processing unit body supporting the holding member 173. 172. The holding member 173 is detachably provided to the hand unit body 172. The first hand unit 171c is provided with a suction nozzle, and the IC device 90 can be held by adsorption.

Further, as shown in FIG. 22B, the first first hand unit 171c on the left side in FIG. 22B of the eight first hand units 171c of the first inspection device transport head 17c is the first holding unit 271, and constitutes the first unit of the hand unit. The temperature setting unit (first arm temperature setting unit) 176c cools the IC device 90 and adjusts (can be set) the temperature of the IC device 90 to a temperature suitable for low temperature inspection (first temperature).

In the first hand unit 171c of the first inspection device transport head 17c, the two first hand units 171c of the second group from the left in FIG. 22B are the second holding unit 272, and constitute the second temperature of the hand unit. The setting unit 177c does not cool or heat the IC device 90, and sets the temperature of the IC device 90 (which can be set) to a temperature suitable for normal temperature inspection (second temperature). Further, the second holding portion 272 (the hand unit second temperature setting unit 177c) may be configured to, for example, cool and heat the IC device 90, and adjust the temperature of the IC device 90 to a normal temperature check by the cooling or heating. The temperature.

In the first hand unit 171c of the first inspection device transport head 17c, the two first hand units 171c of the third group from the left in FIG. 22B are the third holding unit 273, and constitute the third temperature of the hand unit. The setting unit (third arm temperature setting unit) 178c heats the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature suitable for high temperature inspection (third temperature).

In addition, the two first hand units 171c on the right side in FIG. 22B of the eight first hand units 171c of the first inspection device transport head 17c are the fourth holding unit 274, and are not used in the present embodiment. But it can also be used as a component.

The first holding portion 271, the second holding portion 272, the third holding portion 273, and the fourth holding portion 274 are arranged side by side in the X direction.

The same applies to the second inspection device transfer head 17d.

In addition, in FIG. 23 to FIG. 38, when the first holding portion 271 is indicated by "○", it overlaps with other members and is difficult to visually recognize. Therefore, the two holding units 176c are shared with the hand unit first temperature setting unit 176c. The dotted line indicates. The same applies to the second holding portion 272, the third holding portion 273, and the fourth holding portion 274.

As shown in FIG. 20A, each of the first device recovery unit 18c and the second device recovery unit 18d is a device that transports the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4.

Each of the first device recovery unit 18c and the second device recovery unit 18d has a placement plate 182 on which the IC device 90 is placed (disposed), and a device collection unit body 181 that is movable in the X direction. On the upper surface of the arranging plate 182, a recess for accommodating (holding) the IC device 90, that is, a plurality of recesses 185 is provided. Further, in the configuration shown in the drawing, the pockets 185 are arranged in a matrix in a total of eight in the X direction and two in the Y direction. The configuration plate 182 is detachably mounted to the device recovery portion body 181. The first device recovery unit 18c and the second device recovery unit 18d are supported to be movable between the inspection area A3 and the collection area A4 in the X direction. Further, the first device collecting portion 18c and the second device collecting portion 18d are arranged in the Y direction. The IC device 90 on the inspection unit 16 is transported and placed on the first device collection unit 18c by the first inspection device transport head 17c, or is transported and placed by the second inspection device transport head 17d. The second device recovery unit 18d.

In FIG. 20A, the first device collecting portion 18c and the first device supplying portion 14c are independently illustrated in order to facilitate the distinction between the first device collecting portion 18c and the first device supplying portion 14c. As shown in the figure, the first device recovery unit 18c is connected or integrated with the first device supply unit 14c, and the first device recovery unit 18c and the first device supply unit 14c are integrally moved. The second device recovery unit 18d and the second device supply unit 14d are also the same.

The recovery area A4 is the area where the IC device 90 that has completed the inspection is recovered. In the collection area A4, a collection tray 19, a collection device transfer head 20, and a sixth tray transfer mechanism 21 are provided. Further, an empty tray 200 is also provided in the collection area A4.

The recovery tray 19 is fixed in the collection area A4, and in the present embodiment, three are arranged in the X direction. Further, three empty trays 200 are also arranged in the X direction. Further, the first device recovery portion 18c of the recovery area A4 or the IC device 90 on the second device recovery portion 18d is moved. It is transported and placed on any of the collection trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified according to the respective inspection results.

The device transfer head 20 for recycling can be supported in the X, Y, and Z directions in the recovery area A4. Thereby, the collecting device transfer head 20 can transport the IC device 90 from the first device collecting portion 18c or the second device collecting portion 18d to the collecting tray 19 or the empty tray 200. Further, the device transfer head 20 for recycling has a plurality of hand units 201 as robot arms (holding portions) for holding the IC device 90, and each of the hand units 201 is provided with a suction nozzle as in the case of the first hand unit 171c. The IC device 90 is held by adsorption.

The sixth tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is recovered, that is, it may become any of the above three empty trays 200.

The tray removal area A5 collects and removes the area of the tray 200 of the plurality of IC devices 90 arranged in the checked state. In the tray removal area A5, a plurality of trays 200 can be stacked.

Further, a fourth tray transport mechanism 22A and a fifth tray transport mechanism 22B that transport the trays 200 one by one across the collection area A4 and the tray removal area A5 are provided. The fourth tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism that transports the tray 200 for collecting the empty IC device 90 from the tray removal area A5 to the collection area A4.

In addition, the inspection control unit of the tester performs inspection of electrical characteristics (electrical) of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory unit (not shown).

Further, as shown in FIG. 21, the inspection apparatus 1c includes a control unit 80, an operation unit 6 electrically connected to the control unit 80 and performing each operation of the inspection apparatus 1c, and cooling mechanisms 41, 42, 43, 44 for cooling the IC device 90. And 45, and the heating mechanisms 51, 52, and 53 of the heating IC device 90.

The control unit 80 has a memory unit 801 and the like that store information (data), and controls, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the first temperature adjustment unit 12c, the second temperature adjustment unit 12d, and the supply device. The head 13, the first device supply unit 14c, the second device supply unit 14d, the third tray transport mechanism 15, the first inspection device transport head 17c, the second test device transport head 17d, the first device recovery unit 18c, and the first 2 device recovery unit 18d, collection device transfer head 20, sixth tray transfer mechanism 21, fourth tray transfer mechanism 22A, fifth tray transfer mechanism 22B, display unit 62, cooling mechanisms 41 to 45, heating mechanisms 51 to 53, and the like The drive of each department.

Further, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays information (data) such as an image. The input unit 61 is not particularly limited, and for example, a keyboard, a mouse, or the like can be enumerated. Further, the display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel, an organic EL display panel, and the like. The operator (operator) operates the operation unit 6 by, for example, operating the input unit 61 to move the cursor to the position of each operation button (icon) displayed on the display unit 62 and select (click).

In addition, the input unit 61 is not limited to the above-described components, and for example, a mechanical operation button such as a push button may be cited. Further, the operation unit 6 is not limited to the above-described components, and for example, a device such as a touch panel that can display input and information, or the like can be enumerated.

Further, the cooling mechanism 41 cools the first temperature adjustment unit 12c, and the first temperature adjustment unit 12c cools the IC device 90. Further, the cooling mechanism 42 cools the second temperature adjustment unit 12d, and the second temperature adjustment unit 12d cools the IC device 90. Further, the cooling mechanism 43 cools the first holding portion 271 (the hand unit first temperature setting portion 176c) of the first inspection device transfer head 17c, and the first holding portion 271 cools the IC device 90. Further, the cooling mechanism 44 cools the first holding portion 271 (the hand unit first temperature setting portion 176c) of the second inspection device transfer head 17d, and cools the IC device 90 by the first holding portion 271. Further, the cooling mechanism 45 cools the two holding portions 163 on the left side in FIG. 22A among the eight holding portions 163 of the inspection portion 16, that is, the first temperature setting portion 166, and the first temperature setting portion 166 cools the IC device 90. .

The cooling means 41 to 45 are not particularly limited, and for example, a refrigerant (for example, a low-temperature gas such as nitrogen gas obtained by nitrogenizing a liquid) is flown through a tube disposed in or near the object to be cooled. Cooling device, Peltier element, etc.

Further, the heating mechanism 51 heats the third holding portion 273 (the hand unit third temperature setting portion 178c) of the first inspection device transfer head 17c, and the third holding portion 273 heats the IC device 90. Further, the heating mechanism 52 heats the third holding portion 273 (the hand unit third temperature setting portion 178c) of the second inspection device transfer head 17d, and the third holding portion 273 heats the IC device 90. Further, the heating means 53 heats the two holding portions 163 of the third group from the left in the eight holding portions 163 of the inspection portion 16 in the eight holding portions 163, that is, the third temperature setting portion 168, by the third temperature setting portion. 168 heats the IC device 90.

The heating means 51 to 53 are not particularly limited, and for example, a heater having a heating wire or the like can be cited.

Next, the operation of the inspection device 1c will be described. The case where the IC device 90 is transported by the first device supply unit 14c, the first inspection device transfer head 17c, and the first device recovery unit 18c is representative. Be explained.

In addition, the IC device 90 to be inspected is sequentially transported to the inspection unit 16 by the first device supply unit 14c and the first inspection device transfer head 17c. Here, the first (first) is to be inspected (transferred). The IC device 90 is referred to as a "first IC device 901" or an "IC device 901", and the second IC device 90 to be inspected is referred to as a "second IC device 902" or an "IC device 902". The three IC devices 90 to be inspected are referred to as "third IC device 903" or "IC device 903", and the fourth IC device 90 to be inspected is referred to as "fourth IC device 904" or "IC device 904". The fifth IC device 90 to be inspected is referred to as "the fifth IC device 905" or "IC device 905". Further, when the first, second, third, fourth, fifth, etc. are not distinguished, it is called "IC device 90". Further, in FIGS. 22A to 48, the IC device 901 is indicated by "I", the IC device 902 is indicated by "II", the IC device 903 is indicated by "III", and the IC device 904 is indicated by "IV". The IC device 905 is represented by "V".

First, as shown in FIG. 22A and FIG. 22B, the first IC device 901 is placed (arranged) on the first placement portion 261 of the first device supply portion 14c by the supply device transfer head 13. In other words, in the first placing unit 261, the IC device 901 before the inspection is placed. Preferably, the IC device 901 is cooled in advance by the first temperature adjustment unit 12c or the second temperature adjustment unit 12d, but cooling may not be performed. The same applies to the IC device 902 and the IC device 903 which will be described later.

Next, as shown in FIG. 23, the IC device 901 is transported to the position corresponding to the first temperature setting unit 166 of the inspection unit 16 by the first device supply unit 14c, that is, the first load of the first device supply unit 14c. The placement portion 261 and the first temperature setting portion 166 of the inspection portion 16 are arranged in the Y direction.

Then, the IC holder 901 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c.

Next, as shown in FIG. 24, the IC device 901 held by the first holding portion 271 is cooled by the first holding portion 271, and is transported to the first temperature setting portion 166 of the inspection portion 16. Next, the IC device 901 is subjected to a low temperature inspection.

In addition, the IC device 901 is preset to perform the normal temperature inspection thereafter, and may also perform the normal temperature inspection on all the IC devices 901 that have completed the low temperature inspection, but it is preferable to perform only the normal temperature of the IC device 901 which is qualified in the low temperature inspection. Inspection, it is not necessary to perform normal temperature inspection on the unqualified IC device 901. Thereby, unnecessary inspection can be omitted.

On the other hand, as shown in FIG. 25, the first device supply unit 14c moves toward the negative side in the X direction in order to receive the second IC device 902.

Next, as shown in FIG. 26, the second IC device 902 is placed on the first placement portion 261 of the first device supply portion 14c by the supply device transfer head 13.

Next, as shown in FIG. 27, the first device supply portion 14c moves toward the positive side in the X direction, and stops at the second placement portion 262 of the first device supply portion 14c and the first temperature setting portion 166 of the inspection portion 16 along the Y. Directions side by side.

Then, as shown in FIG. 28, the IC device 901 held by the first holding portion 271 of the first inspection device transporting head 17c is transported and placed in the second placing portion 262 of the first device supply portion 14c, and It is placed on the second placing portion 262. In other words, in the second placing unit 262, the IC device 901 after the low temperature inspection is placed.

Then, as shown in FIG. 29, the first device supply unit 14c moves to the positive side in the X direction, and stops at the first placement unit 261 of the first device supply unit 14c and the first temperature setting unit 166 of the inspection unit 16 along the Y. The second mounting portion 262 and the second temperature setting portion 167 are arranged side by side in the Y direction.

Then, the first IC 902 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c, and the first IC device 901 is held by the second holding portion 272.

Then, as shown in FIG. 30, the IC device 902 held by the first holding portion 271 is cooled by the first holding portion 271 and transported to the first temperature setting unit 166 of the inspection unit 16, and at the same time. The IC device 901 held by the second holding portion 272 is transported to the second temperature setting unit 167 of the inspection unit 16 by the second holding portion 272. Thereafter, the IC device 901 is subjected to a normal temperature inspection, and the IC device 902 is subjected to a low temperature inspection.

In addition, the IC device 901 is preset to perform high temperature inspection thereafter, and may also perform high temperature inspection on all IC devices 901 that have completed the normal temperature inspection, but it is preferable to perform high temperature inspection only on the IC device 901 that has passed the normal temperature inspection. There is no need to perform high temperature inspection on the unqualified IC device 901. Further, the IC device 902 is preset to perform the normal temperature inspection thereafter, and may also perform the normal temperature inspection on all the IC devices 902 that have completed the low temperature inspection, but it is preferable to perform only the normal temperature of the IC device 902 which is qualified in the low temperature inspection. Inspection, it is not necessary to perform normal temperature inspection on the unqualified IC device 902. Thereby, unnecessary inspection can be omitted.

On the other hand, as shown in FIG. 31, the first device supply unit 14c moves toward the negative side in the X direction in order to receive the third IC device 903.

Next, as shown in FIG. 32, the third IC device 903 carries the head by the supply device. 13 is placed on the first placing portion 261 of the first device supply portion 14c.

Then, as shown in FIG. 33, the first device supply unit 14c moves to the positive side in the X direction, and stops at the second placement unit 262 of the first device supply unit 14c and the first temperature setting unit 166 of the inspection unit 16 along the Y. Directions side by side.

Then, as shown in FIG. 34, the IC device 902 held by the first holding portion 271 of the first inspection device transporting head 17c is transported and placed in the second placing portion 262 of the first device supply portion 14c, and is In the second mounting portion 262, the IC device 901 held by the second holding portion 272 is transported, placed in the third mounting portion 263, and placed on the third loading portion 263. . In other words, the IC device 902 after the low temperature inspection is placed in the second mounting portion 262, and the IC device 901 after the normal temperature inspection is placed in the third mounting portion 263.

Then, as shown in FIG. 35, the first device supply unit 14c moves to the positive side in the X direction, and stops at the first placement unit 261 of the first device supply unit 14c and the first temperature setting unit 166 of the inspection unit 16 along the Y. The second mounting portion 262 and the second temperature setting portion 167 are arranged side by side in the Y direction, and the third mounting portion 263 and the third temperature setting portion 168 are arranged in the Y direction.

Then, the first holding unit 271 of the first inspection device transporting head 17c holds and cools the third IC device 903, and at the same time, the second holding unit 272 holds the second IC device 902 while the second holding unit 272 holds the second IC device 902. The first IC device 901 is held and heated by the third holding portion 273.

Then, as shown in FIG. 36, the IC device 903 held by the first holding portion 271 is cooled by the first holding portion 271 and transported to the first temperature setting unit 166 of the inspection unit 16, and at the same time. The IC device 902 held by the second holding portion 272 is transported to the second temperature setting portion 167 of the inspection portion 16 by the second holding portion 272, and is held by the third holding portion 273. The IC device 901 is heated by the third holding portion 273 and transported to the third temperature setting unit 168. Thereafter, the IC device 901 is subjected to a normal temperature inspection, the IC device 902 is subjected to a low temperature inspection, and the IC device 903 is subjected to a low temperature inspection.

In addition, for the IC device 902, the high temperature inspection is performed after the preset, and all the IC devices 902 that have completed the normal temperature inspection may be subjected to the high temperature inspection, but it is preferably only for the normal temperature inspection. The qualified IC device 902 is inspected for high temperature, and it is not necessary to perform high temperature inspection on the unqualified IC device 902. Further, although the IC device 903 is preset to perform the normal temperature inspection later, and all the IC devices 903 that have completed the low temperature inspection can be subjected to the normal temperature inspection, it is preferable to perform the normal temperature only for the IC device 903 which is qualified in the low temperature inspection. Inspection, it is not necessary to perform normal temperature inspection on the unqualified IC device 903. Thereby, unnecessary inspection can be omitted.

On the other hand, as shown in FIG. 37, the first device recovery unit 18c moves to a position corresponding to the inspection unit 16 on the negative side in the X direction in order to receive the IC device 901 that has finished the inspection.

Then, as shown in FIG. 37, the IC device 901 is transported to the position corresponding to the first device collecting portion 18c by the first inspection device transporting head 17c, and is placed in the first device collecting portion 18c. The third recess 185 from the left in Fig. 37 of the pockets 185. Thereafter, as shown in FIG. 38, the IC device 901 is transported to the recovery area A4 by the first device recovery unit 18c.

In the same manner as described above, the first device supply unit 14c moves to the negative side in the X direction to receive the fourth IC device 904, and then moves to the positive side in the X direction, and is transported by the first inspection device as shown in FIG. The IC device 903 held by the first holding portion 271 of the head 17c is placed on the second placing portion 262 of the first device supply portion 14c and placed on the second placing portion 262. Similarly, the second holding portion 262 is held by the second holding portion 262. The IC device 902 held by the portion 272 is placed on the third placement portion 263 and placed on the third placement portion 263.

Next, as shown in FIG. 40, the first device supply unit 14c moves to the positive side in the X direction, and stops at the first placement unit 261 of the first device supply unit 14c and the first temperature setting unit 166 of the inspection unit 16 along the Y. Directions side by side.

Then, the first holding unit 271 of the first inspection device transporting head 17c holds and cools the fourth IC device 904, and at the same time, the third holding unit 272 holds the third IC device 903. The second IC device 902 is held and heated by the third holding portion 273.

Then, as shown in FIG. 41, the IC device 904 held by the first holding portion 271 is cooled by the first holding portion 271 and transported to the first temperature setting unit 166 of the inspection unit 16, and at the same time. The IC device 903 held by the second holding portion 272 is supported by the second holding portion 272 is transported to the second temperature setting unit 167 of the inspection unit 16, and at the same time, the IC device 902 held by the third holding unit 273 is heated by the third holding unit 273, and is transported to the third Temperature setting unit 168. Thereafter, the IC device 902 is subjected to a high temperature inspection, the IC device 903 is subjected to a normal temperature inspection, and the IC device 904 is subjected to a low temperature inspection.

On the other hand, as shown in FIG. 42, the first device recovery unit 18c moves toward the negative side in the X direction, that is, the position corresponding to the inspection unit 16 in order to receive the IC device 902 that has completed the inspection.

Then, as shown in FIG. 42, the IC device 902 is transported to the position corresponding to the first device collecting portion 18c by the first inspection device transporting head 17c, and is placed in the first device collecting portion 18c. The third recess 185 from the left in Fig. 42 of the pockets 185. Thereafter, as shown in FIG. 43, the IC device 902 is transported to the recovery area A4 by the first device recovery unit 18c.

In the same manner as described above, the first device supply unit 14c moves to the negative side in the X direction to receive the fifth IC device 905, and then moves to the positive side in the X direction, and is transported by the first inspection device as shown in FIG. The IC device 904 held by the first holding portion 271 of the head 17c is placed on the second placing portion 262 of the first device supply portion 14c and placed on the second placing portion 262; similarly, the second holding portion is held by the second holding portion 262. The IC device 903 held by the portion 272 is placed on the third placement portion 263 and placed on the third placement portion 263.

Then, as shown in FIG. 45, the first device supply unit 14c moves to the positive side in the X direction, and stops at the first placement unit 261 of the first device supply unit 14c and the first temperature setting unit 166 of the inspection unit 16 along the Y. Directions side by side.

Then, the first holding portion 271 of the first inspection device transfer head 17c holds and cools the fifth IC device 905, and at the same time, the second holding portion 272 holds the fourth IC device 904 while the fourth holding device 272 holds the fourth IC device 904. The third IC device 903 is held and heated by the third holding portion 273.

Then, as shown in FIG. 46, the IC device 905 held by the first holding portion 271 is cooled by the first holding portion 271 and transported to the first temperature setting unit 166 of the inspection unit 16, and at the same time. The IC device 904 held by the second holding portion 272 is transported to the second temperature setting unit 167 of the inspection unit 16 by the second holding unit 272, and at the same time, by the third solid The IC device 903 held by the holding portion 273 is heated by the third holding portion 273 and transported to the third temperature setting portion 168. Thereafter, the IC device 903 is subjected to a high temperature inspection, the IC device 904 is subjected to a normal temperature inspection, and the IC device 905 is subjected to a low temperature inspection.

On the other hand, as shown in FIG. 47, in order to receive the IC device 903 that has completed the inspection, the first device recovery unit 18c moves toward the negative side in the X direction, that is, the position corresponding to the inspection unit 16.

Then, as shown in FIG. 47, the IC device 903 is transported to the position corresponding to the first device collecting portion 18c by the first inspection device transporting head 17c, and is placed in the first device collecting portion 18c. The third recess 185 from the left in Fig. 47 of the pockets 185. Thereafter, as shown in FIG. 48, the IC device 903 is transported to the recovery area A4 by the first device collecting unit 18c.

Repeat the same action later.

Here, as described above, only the IC device 90 that has passed the low temperature inspection is subjected to the normal temperature inspection, and only in the case where the high temperature inspection is performed on the IC device 90 that has passed the low temperature inspection and the normal temperature inspection, for example, in the IC device. When the 902 is unsatisfactory in the normal temperature inspection (passed in the low temperature inspection), the IC device 902 is placed in the eight pockets 185 of the first device recovery portion 18c, and the second from the left in Fig. 37. The pocket 185 is transported to the recovery area A4 by the first device recovery unit 18c. Further, when the IC device 903 fails in the low temperature inspection, the IC device 903 is placed in the recess 185 on the left side in FIG. 37 among the eight pockets 185 of the first device recovery portion 18c. The first device recovery unit 18c is transported to the collection area A4. In this case, in the recess 185 on the left side in FIG. 37 among the eight pockets 185 of the first device recovery portion 18c, the IC device 90 that failed in the low temperature inspection is placed; from FIG. 37, from the left The second recess 185 is provided with an IC device 90 that has passed the low temperature inspection and failed in the normal temperature inspection; in the third recess 185 from the left in Fig. 37, the cryogenic inspection is placed. And the IC device 90 that is qualified in the normal temperature inspection and failed in the high temperature inspection.

In the above, the first device supply unit 14c, the first inspection device transfer head 17c, and the first device recovery unit 18c are described as being transported by the IC device 90, but may be recovered by the second device. Part 14d, second inspection device transport head 17d, and second device recovery unit 18d is executed in the same way.

In addition, the inspection performed by the first device supply unit 14c, the first inspection device transfer head 17c, and the first device recovery unit 18c to transport the IC device 90 and the second device supply unit 14d may be performed in parallel. The second inspection device transfer head 17d and the second device recovery unit 18d carry out inspections by transporting the IC device 90. According to this, the output can be increased.

As described above, according to the inspection apparatus 1c, each of the low temperature inspection, the normal temperature inspection, and the high temperature inspection of the IC device 90 can be performed, and the convenience is high.

Further, when the IC device 90 is subjected to the low temperature inspection, the normal temperature inspection, and the high temperature inspection, the low temperature inspection, the normal temperature inspection, and the high temperature inspection can be performed without temporarily recovering the IC device 90, thereby increasing the throughput. .

Furthermore, the normal temperature inspection of the first IC device 901 and the low temperature inspection of the second IC device 902 are simultaneously performed, and the high temperature inspection of the first IC device 901 and the normal temperature inspection of the second IC device 902 are simultaneously performed. The low temperature inspection of the third IC device 903 can increase the throughput.

Moreover, the inspection sequence of the IC device 90 is firstly a low temperature inspection, the second item is a normal temperature inspection, and the third item is a high temperature inspection. Since the IC device 90 is not in a low temperature state, but is transported to the recovery area A4 at a high temperature state, Condensation of the IC device 90 can be prevented.

Further, since there is a normal temperature check between the low temperature inspection and the high temperature inspection, the IC device 90 is raised to a high temperature after being temporarily turned to a normal temperature, and is not raised from a low temperature to a high temperature, so that an excessively rapid temperature change of the IC device 90 can be suppressed.

Further, the order of the low temperature inspection, the normal temperature inspection, and the high temperature inspection is not limited to the embodiment, and may be any order.

Further, although any of the low temperature inspection, the normal temperature inspection, and the high temperature inspection may be omitted, it is preferable to perform the low temperature inspection. In other words, it is desirable to not omit the low temperature inspection.

<Fifth Embodiment>

Figure 49 is a view schematically showing a fifth embodiment of the electronic component transporting apparatus of the present invention; A plan view of the first inspection device transfer head and the inspection unit.

In the following, the fifth embodiment will be described, but the differences from the fourth embodiment will be mainly described, and the description of the same items will be omitted.

As shown in FIG. 49, in the inspection apparatus 1c of the fifth embodiment, the two holding portions 163 on the left side in FIG. 49 among the eight holding portions 163 of the inspection portion 16 constitute the first temperature setting portion 281, which cools the IC device. The temperature of the IC device 90 can be adjusted (settable) to a temperature suitable for low temperature inspection (first temperature).

Further, in the eight holding portions 163 of the inspection unit 16, the two holding portions 163 of the second group from the left in FIG. 49 constitute the second temperature setting portion 282, and the IC device 90 is heated to heat the IC device 90. Adjust (can be set) to a temperature suitable for high temperature inspection (second temperature).

Further, among the eight holding portions 163 of the inspection unit 16, the two holding portions 163 of the third group from the left in FIG. 49 constitute the first temperature setting unit 283, which cools the IC device 90 and adjusts the temperature of the IC device 90. (Settable) is a temperature suitable for low temperature inspection (first temperature).

Further, the two holding portions 163 on the right side in FIG. 49 among the eight holding portions 163 of the inspection portion 16 constitute a second temperature setting portion 284 that heats the IC device 90 to adjust (settable) the temperature of the IC device 90 to Suitable for high temperature inspection temperature (second temperature).

In the inspection unit 16, the first unit 285 including the first temperature setting unit 281 and the second temperature setting unit 282 and the second unit 286 including the first temperature setting unit 283 and the second temperature setting unit 284 are provided. The lines are side by side in the X direction.

In the first hand unit 171c of the first inspection device transport head 17c, the two first hand units 171c on the left side in FIG. 49 are the first holding unit 291, and constitute the first unit temperature setting unit (the first unit). 1 arm temperature setting unit 251, which cools the IC device 90 and adjusts (can be set) the temperature of the IC device 90 to a temperature suitable for low temperature inspection (first temperature).

In the eight first hand units 171c of the first inspection device transport head 17c, the two first hand units 171c of the second group from the left in FIG. 49 are the second holding unit 292, and constitute the second temperature of the hand unit. Setting unit 252 (second arm temperature setting unit) that heats IC device 90 to enable the IC device The temperature adjustment of 90 (can be set) is the temperature suitable for high temperature inspection (second temperature).

In the eight first hand units 171c of the first inspection device transport head 17c, the two first processing units 171c of the third group from the left in FIG. 49 are the first holding unit 293, and constitute the first temperature of the hand unit. The setting unit (first arm temperature setting unit) 253 cools the IC device 90, and can adjust (settable) the temperature of the IC device 90 to a temperature suitable for low temperature inspection (first temperature).

In addition, the two first hand units 171c on the right side in FIG. 49 among the eight first hand units 171c of the first inspection device transport head 17c are the second holding unit 294, and constitute the second unit temperature setting unit of the hand unit. 2 arm temperature setting unit 254, which heats the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature suitable for high temperature inspection (second temperature).

In the first inspection device transport head 17c, the first holding unit 291 (the hand unit first temperature setting unit 251) and the second holding unit 292 (the hand unit second temperature setting unit 252) are the first. The unit 295 and the second unit 296 including the first holding unit 293 (the hand unit first temperature setting unit 253) and the second holding unit 294 (the hand unit second temperature setting unit 254) are arranged side by side in the X direction.

The first unit 295 performs the same operation as the second unit 296, and the operation is the same as in the case where the normal temperature inspection is omitted in the fourth embodiment. Thereby, the output can be doubled compared to the case of one unit.

The same applies to the second inspection device transfer head 17d.

According to the inspection apparatus 1c of the fifth embodiment described above, the same effects as those of the fourth embodiment can be exhibited.

In the present embodiment, the number of the units of the inspection unit 16, the first inspection device transport head 17c, and the second inspection device transport head 17d is two, but three or more.

Further, in the above-described fourth embodiment, a plurality of units may be provided for each of the inspection unit 16, the first inspection device transport head 17c, and the second inspection device transport head 17d.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and each part is The configuration can be replaced with any configuration that can perform the same function. Further, any other constituents may be added.

Furthermore, the present invention may be a combination of any two or more of the above-described configurations (features).

1‧‧‧Inspection device (electronic parts inspection device)

11A‧‧‧1st pallet transport mechanism

11B‧‧‧2nd tray transport mechanism

12a‧‧‧1st temperature adjustment unit (1st soaking plate)

12b‧‧‧2nd temperature adjustment unit (2nd heat spreader)

13‧‧‧Supply device transport head

14a‧‧‧1st device supply unit (1st supply shuttle)

14b‧‧‧2nd device supply unit (2nd supply shuttle)

15‧‧‧3rd pallet transport mechanism

16‧‧‧Inspection Department

17a‧‧‧1st inspection device transport head

17b‧‧‧Second inspection device transport head

18a‧‧‧1st device recycling department (1st recycling shuttle)

18b‧‧‧2nd Device Recycling Department (2nd Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧Receiving device transport head

21‧‧‧6th tray transport mechanism

22A‧‧‧4th tray transport mechanism

22B‧‧‧5th pallet transport mechanism

80‧‧‧Control Department

90‧‧‧IC devices

131‧‧‧Hand unit

141‧‧‧Device Supply Unit Body

142‧‧‧Configuration Board

145‧‧ ‧ pocket

161‧‧‧Check Department Body

162‧‧‧Retaining components

163‧‧‧ Keeping Department

166‧‧‧1st temperature setting unit

167‧‧‧2nd temperature setting unit

181‧‧‧Device Recycling Unit Body

182‧‧‧Configuration Board

185‧‧ ‧ pocket

200‧‧‧Tray

201‧‧‧Hand unit

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Claims (9)

An electronic component transporting apparatus comprising: a first transporting unit that transports an electronic component, wherein the electronic component is a first temperature; and a second transporting unit that transports the electronic component and the electronic component The part is set to a second temperature different from the first temperature described above. The electronic component transporting apparatus according to claim 1, wherein the first transporting unit includes: a first electronic component mounting unit that can mount and move the electronic component, and the electronic component can be set to the first temperature; The first electronic component holding portion can hold and move the electronic component, and the electronic component can be the first temperature; and the second transporting portion can have a second electronic component mounting portion that can be placed thereon. The electronic component may be moved, and the electronic component may be the second temperature; and the second electronic component holding portion may hold and move the electronic component, and the electronic component may be the second temperature. The electronic component carrying device according to claim 1, comprising: an electronic component mounting portion that can mount and move the electronic component, and a first electronic component mounting portion that can set the electronic component to the first temperature a temperature setting unit, and a second electronic component mounting unit temperature setting unit that can set the electronic component to the second temperature; and an electronic component holding unit that can hold and move the electronic component and have the electronic component a first electronic component holding portion temperature setting unit that is the first temperature, and a second electronic component holding portion temperature setting unit that can set the electronic component to the second temperature; the first conveying unit includes the first electron Part placement temperature setting unit and In the first electronic component holding portion temperature setting unit, the second electronic component mounting portion temperature setting unit and the second electronic component holding portion temperature setting unit are provided. The electronic component transport apparatus according to claim 3, comprising: a plurality of the electronic component mounting portions; and a plurality of the electronic component holding portions. The electronic component transporting apparatus according to any one of claims 1 to 4, wherein the electronic component is transported by the second transporting unit after the electronic component is transported by the first transporting unit. The electronic component conveying apparatus according to any one of claims 1 to 5, wherein the first temperature is lower than the second temperature. The electronic component transporting apparatus according to any one of claims 1 to 6, wherein when the electronic component is inspected at the first temperature and the inspection is passed, the electronic component is inspected at the second temperature. An electronic component inspection apparatus comprising: a first conveyance unit that conveys an electronic component, wherein the electronic component is a first temperature; and a second conveyance unit that conveys the electronic component and the electronic component a second temperature different from the first temperature; and an inspection unit that inspects the electronic component. The electronic component inspection device according to claim 8, wherein the inspection unit is provided with a first temperature setting unit that can set the electronic component to the first temperature, and the electronic component can be set to a second temperature of the second temperature. Temperature setting unit.