JP2017032374A - Electronic component conveyance apparatus and electronic component inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance apparatus and an electronic component inspection apparatus capable of setting cooling conditions for each of a plurality of units (members) for cooling electronic components.SOLUTION: An electronic component conveyance apparatus includes a first mounting part for mounting an electronic component and capable of cooling the electronic component, and a second mounting part for mounting the electronic component and capable of cooling the electronic component, and can separately set cooling conditions for the first mounting part and cooling conditions for the second mounting part. The electronic component conveyance apparatus includes a first arm capable of gripping the electronic component and cooling the electronic component and a second arm capable of gripping the electronic component and cooling the electronic component, and can separately set cooling conditions for the first arm and cooling conditions for the second arm.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

  The electronic component transport device cools the IC device in advance and adjusts the temperature of the IC device to a temperature suitable for inspection, and transports the IC device whose temperature is adjusted by the soak plate to the vicinity of the inspection unit. Supply shuttle, supply device transfer head for transferring the IC device between the tray on which the IC device is arranged and the soak plate, and the IC device between the soak plate and the supply shuttle, and the IC device after the inspection Shuttle for transporting, IC device transport head for transporting the IC device between the supply shuttle and the inspection unit, and IC device transport between the inspection unit and the recovery shuttle, and the IC recovered from the recovery shuttle Having a recovery device transport head that transports IC devices to and from the tray where the devices are placed That.

  Patent Document 1 and Patent Document 2 disclose an electronic component transport device having a display unit that displays each setting condition such as temperature.

JP 2009-97899 A JP 2010-27791 A

  In the electronic component transport apparatus described in Patent Literature 1 and Patent Literature 2, it is not possible to set cooling conditions for a plurality of units (members) that cool the electronic components.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

The electronic component transport device of the present invention, the electronic component is mounted, a first mounting portion capable of cooling the electronic component,
A second mounting portion on which the electronic component is mounted and capable of cooling the electronic component;
The cooling condition of the first mounting part and the cooling condition of the second mounting part can be set respectively.

  Thereby, the cooling condition of the 1st mounting part and the cooling condition of the 2nd mounting part can each be set up, and, thereby, for example, it is not used among the 1st mounting part and the 2nd mounting part. By not cooling the mounting part, the consumption amount (consumed energy) of the refrigerant or the like can be reduced.

In the electronic component transport device of the present invention, a first arm capable of gripping the electronic component and cooling the electronic component;
A second arm capable of gripping the electronic component and cooling the electronic component;
It is preferable that the cooling condition of the first arm and the cooling condition of the second arm can be set respectively.

  Thereby, it is possible to set the cooling condition of the first arm and the cooling condition of the second arm, respectively. For example, by not cooling the unused arm of the first arm and the second arm, In addition, consumption of refrigerant and the like can be reduced.

  In the electronic component transport apparatus according to the present invention, it is preferable that the cooling conditions for the first mounting part and the second mounting part and the cooling conditions for the first arm and the second arm can be set simultaneously.

  Thereby, the setting of the cooling condition of each unit (member) capable of cooling the electronic component can be easily and quickly performed.

  In the electronic component transport apparatus according to the present invention, it is preferable that each of the first placement unit and the second placement unit is a transport unit capable of transporting the electronic component before inspection.

  Thereby, while conveying an electronic component by a conveyance part, the temperature of an electronic component can be maintained at the temperature suitable for a test | inspection.

  In the electronic component transport device of the present invention, it is preferable that the first placement unit and the second placement unit are temperature adjustment units that adjust the temperature of the electronic component before inspection.

  Thereby, the temperature of the electronic component can be adjusted to a temperature suitable for inspection by the temperature adjusting unit.

The electronic component transport apparatus of the present invention is capable of gripping an electronic component and a first arm capable of cooling the electronic component;
A second arm capable of gripping the electronic component and cooling the electronic component;
The cooling condition of the first arm and the cooling condition of the second arm can be set respectively.

  Thereby, it is possible to set the cooling condition of the first arm and the cooling condition of the second arm, respectively. For example, by not cooling the unused arm of the first arm and the second arm, In addition, consumption of refrigerant and the like can be reduced.

In the electronic component transport device of the present invention, it has a flow path,
The electronic component is preferably cooled by flowing a coolant through the flow path.
Thereby, an electronic component can be easily cooled with a simple configuration.

In the electronic component transport device of the present invention, it is preferable that the flow path meanders.
Thereby, a cooling capability can be increased and an electronic component can be cooled more easily.

In the electronic component conveying apparatus of the present invention, it is preferable to have a valve capable of adjusting the flow rate of the refrigerant according to the cooling condition.
Thereby, an electronic component can be easily cooled according to cooling conditions.

In the electronic component conveying apparatus of the present invention, it is preferable to have an operation unit that performs an operation of setting the cooling condition.
Thereby, the cooling condition can be easily set by the operation unit.

In the electronic component conveying apparatus of the present invention, the electronic component conveying device has a temperature detection unit that detects the temperature of the electronic component,
It is preferable that the cooling condition can be set based on a detection result of the temperature detection unit.
Thereby, a cooling condition can be set easily and appropriately.

In the electronic component transport device of the present invention, it has a storage unit,
It is preferable that the cooling condition can be set based on data stored in the storage unit in advance.
Thereby, a cooling condition can be set easily and appropriately.

In the electronic component conveying apparatus of the present invention, it is preferable to have a display unit that displays the cooling condition.
Thereby, the cooling conditions can be easily confirmed.

The electronic component inspection apparatus according to the present invention includes an electronic component placed thereon, a first placement unit capable of cooling the electronic component,
A second mounting portion on which the electronic component is mounted and capable of cooling the electronic component;
An inspection unit for inspecting the electronic component,
The cooling condition of the first mounting part and the cooling condition of the second mounting part can be set respectively.

  Thereby, the cooling condition of the 1st mounting part and the cooling condition of the 2nd mounting part can each be set up, and, thereby, for example, it is not used among the 1st mounting part and the 2nd mounting part. By not cooling the mounting part, the consumption amount of the refrigerant and the like can be reduced.

It is a schematic plan view which shows embodiment of the electronic component inspection apparatus of this invention. It is sectional drawing which shows the device supply part main body of the 1st device supply part of the electronic component inspection apparatus shown in FIG. It is a block diagram of the electronic component inspection apparatus shown in FIG. It is a figure which shows the structural example of the image displayed on the display part of the electronic component inspection apparatus shown in FIG. It is a figure which shows the structural example of the image displayed on the display part of the electronic component inspection apparatus shown in FIG. It is a figure which shows the structural example of the image displayed on the display part of the electronic component inspection apparatus shown in FIG. It is a figure which shows the structural example of the image displayed on the display part of the electronic component inspection apparatus shown in FIG. It is a figure which shows the structural example of the image displayed on the display part of the electronic component inspection apparatus shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

  FIG. 1 is a schematic plan view showing an embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a cross-sectional view showing a device supply unit body of the first device supply unit of the electronic component inspection apparatus shown in FIG. FIG. 3 is a block diagram of the electronic component inspection apparatus shown in FIG. 4 to 8 are diagrams each illustrating an exemplary configuration of an image displayed on the display unit of the electronic component inspection apparatus illustrated in FIG. 1.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. The direction of the arrow of each axis of the X axis, the Y axis, and the Z axis is referred to as a plus side, and the direction opposite to the arrow is referred to as a minus side. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Each of these regions is partitioned from each other by a wall portion, a shutter, or the like (not shown). The supply area A2 is a first chamber R1 defined by walls and shutters, and the inspection area A3 is a second chamber R2 defined by walls and shutters. In addition, the collection area A4 is a third chamber R3 defined by walls and shutters. The first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (collection region A4) are each configured to ensure airtightness and heat insulation. ing. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. The interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively.

  The IC device 90 is inspected in the intermediate inspection area A3 through the respective areas in order from the tray supply area A1 to the tray removal area A5. As described above, the inspection apparatus 1 includes the electronic component transport apparatus that transports the IC device 90 in each region and has the control unit 80, the inspection unit 16 that performs inspection in the inspection region A3, and the inspection control unit (not shown). It has become. In the inspection apparatus 1, an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. A first tray transport mechanism 11A and a second tray transport mechanism 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  The supply region A2 includes a first temperature adjustment unit (first soak plate) 12a that is a first placement unit on which the IC device 90 is placed, and a second placement unit on which the IC device 90 is placed. A second temperature adjusting unit (second soak plate) 12b, a supply device transport head 13, and a third tray transport mechanism 15 are provided.

  The first temperature adjustment unit 12a and the second temperature adjustment unit 12b each cool a plurality of IC devices 90 and adjust (control) the temperature of the IC devices 90 to a temperature suitable for inspection (temperature control member). ). The first temperature adjusting unit 12a and the second temperature adjusting unit 12b are arranged and fixed along the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the first tray conveyance mechanism 11A is conveyed to the first temperature adjustment unit 12a or the second temperature adjustment unit 12b, Placed.

  The supply device transport head 13 is supported so as to be movable in the X direction, the Y direction, and the Z direction within the supply region A2. Thereby, the supply device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply region A1 and the first temperature adjustment unit 12a or the second temperature adjustment unit 12b, and the first temperature adjustment. The IC device 90 can be transported between the unit 12a or the second temperature adjustment unit 12b and the first device supply unit 14a or the second device supply unit 14b described later. The supply device transport head 13 has a plurality of hand units 131 as arms (grip units) capable of gripping the IC device 90, and each hand unit 131 includes a first hand unit described later. As in the case of 171a, a suction nozzle is provided and the IC device 90 is gripped by suction. In addition, in each hand unit 131 of the supply device transport head 13, the IC device 90 is cooled and the temperature of the IC device 90 is suitable for inspection, similarly to the first temperature adjustment unit 12 a and the second temperature adjustment unit 12 b. It may be configured to be able to adjust to a different temperature.

  The third tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state where all the IC devices 90 are removed in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a first device supply unit (first supply shuttle) 14a which is a first mounting unit (first transport unit) capable of mounting (arranging) and transporting the IC device 90, and an IC device Second device supply unit (second supply shuttle) 14b, which is a second mounting unit (second transport unit) capable of mounting (arranging) 90 and transporting, inspection unit 16, and first inspection device transport A head 17a, a second inspection device transport head 17b, a first device recovery section (first recovery shuttle) 18a which is a mounting section (transport section) on which the IC device 90 can be mounted and transported, and an IC device A second device recovery unit (second recovery shuttle) 18b, which is a mounting unit (transport unit) capable of mounting and transporting 90, is provided.

  Each of the first device supply unit 14a and the second device supply unit 14b is a device that transports the IC device 90 that has been subjected to temperature adjustment (temperature control) before inspection to the vicinity of the inspection unit 16.

  Each of the first device supply unit 14a and the second device supply unit 14b includes a placement plate 142 on which the IC device 90 is placed (placed), and a device supply unit main body 141 movable in the X direction. A plurality of pockets (not shown), which are recesses for accommodating (holding) the IC device 90, are provided on the upper surface of the arrangement plate 142. The arrangement plate 142 is detachably installed on the device supply unit main body 141. The first device supply unit 14a and the second device supply unit 14b are supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. The first device supply unit 14a and the second device supply unit 14b are arranged along the Y direction, and the IC device 90 on the first temperature adjustment unit 12a or the second temperature adjustment unit 12b is used for supply. The device transport head 13 transports and places the device on the first device supply unit 14a or the second device supply unit 14b. In addition, in the 1st device supply part 14a and the 2nd device supply part 14b, respectively, similarly to the 1st temperature adjustment part 12a and the 2nd temperature adjustment part 12b, the IC device 90 is cooled and the temperature of the said IC device 90 is concerned. Can be adjusted to a temperature suitable for inspection.

  The inspection unit 16 is a unit that inspects / tests (electrically inspects) the electrical characteristics of the IC device 90, that is, a member that holds the IC device 90 when the IC device 90 is inspected.

  The inspection unit 16 includes a holding member 162 that holds the IC device 90 and an inspection unit main body 161 that supports the holding member 162. The holding member 162 is detachably installed on the inspection unit main body 161.

  On the upper surface of the holding member 162 of the inspection unit 16, a plurality of holding units 163 that are concave portions that house (hold) the IC device 90 are provided. The IC device 90 is accommodated in the holding unit 163, thereby being arranged (placed) on the inspection unit 16.

  In addition, probe pins that are electrically connected to the terminals of the IC device 90 in a state where the IC device 90 is held by the holding unit 163 are provided at positions corresponding to the holding units 163 of the inspection unit 16. Yes. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit provided in a tester (not shown) connected to the inspection unit 16. Note that the inspection unit 16 can cool the IC device 90 and adjust the temperature of the IC device 90 to a temperature suitable for the inspection, like the first temperature adjustment unit 12a and the second temperature adjustment unit 12b. It is.

  The first inspection device transport head 17a and the second inspection device transport head 17b are supported so as to be movable in the Y direction and the Z direction, respectively, in the inspection area A3. The first inspection device transport head 17a and the second inspection device transport head 17b are arranged along the Y direction. The first inspection device transport head 17a can transport and place the IC device 90 on the first device supply unit 14a carried in from the supply area A2 onto the inspection unit 16, and also on the inspection unit 16. The IC device 90 can be transported and placed on the first device collection unit 18a. Similarly, the second inspection device transport head 17b can transport and place the IC device 90 on the second device supply unit 14b carried in from the supply area A2 onto the inspection unit 16, and can also perform inspection. The IC device 90 on the unit 16 can be transported and placed on the second device collection unit 18b. Further, when inspecting the IC device 90, the first inspection device transport head 17a and the second inspection device transport head 17b respectively press the IC device 90 toward the inspection unit 16, thereby the IC device 90 90 is brought into contact with the inspection unit 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected.

  The first inspection device transport head 17a includes a plurality of first hand units 171a as first arms (first gripping portions) capable of gripping the IC device 90. Similarly, the second inspection device transport head 17b includes a plurality of second hand units 171b as second arms (second gripping portions) capable of gripping the IC device 90.

  Since the configuration of each first hand unit 171a and each second hand unit 171b is the same, a description will be given below of one first hand unit 171a as a representative. The first hand unit 171 a includes a gripping member 173 that holds the IC device 90 and a hand unit main body 172 that supports the gripping member 173. The grip member 173 is detachably installed on the hand unit main body 172. The first hand unit 171a includes a suction nozzle and grips the IC device 90 by suction. Further, in each first hand unit 171a of the first inspection device transport head 17a and each second hand unit 171b of the second inspection device transport head 17b, the first temperature adjustment unit 12a and the second temperature adjustment unit 12b, respectively. Similarly, it is possible to cool the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection.

  The first device collection unit 18a and the second device collection unit 18b are apparatuses that transport the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4.

  Each of the first device collection unit 18a and the second device collection unit 18b includes a placement plate 182 on which the IC device 90 is placed (placed) and a device collection unit main body 181 movable in the X direction. A plurality of pockets (not shown), which are concave portions for accommodating (holding) the IC device 90, are provided on the upper surface of the arrangement plate 182. The arrangement plate 182 is detachably installed on the device collection unit main body 181. The first device recovery unit 18a and the second device recovery unit 18b are supported so as to be movable along the X direction between the inspection region A3 and the recovery region A4. Further, the first device collection unit 18a and the second device collection unit 18b are arranged along the Y direction. The IC device 90 on the inspection unit 16 is transported to and placed on the first device collection unit 18a by the first inspection device transport head 17a, or the second device by the second inspection device transport head 17b. It is transported to and placed on the device collection unit 18b.

  In the present embodiment, the first device collection unit 18a and the first device supply unit 14a are configured to move independently of each other. However, the present invention is not limited to this. For example, the first device collection unit 18a and the first device collection unit 18a The first device supply unit 14a may be connected or integrated, and the first device collection unit 18a and the first device supply unit 14a may be configured to move integrally. Similarly, in the present embodiment, the second device collection unit 18b and the second device supply unit 14b are configured to move independently of each other. However, the present invention is not limited to this, for example, the second device collection unit 18b. And the second device supply unit 14b may be connected or integrated, and the second device collection unit 18b and the second device supply unit 14b may be configured to move integrally.

  The collection area A4 is an area where the IC device 90 that has been inspected is collected. In the collection area A4, a collection tray 19, a collection device conveyance head 20, and a sixth tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the present embodiment, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the first device recovery unit 18a or the second device recovery unit 18b that has moved to the recovery area A4 is transported to one of the recovery tray 19 and the empty tray 200 and loaded. Placed. As a result, the IC device 90 is collected and classified for each inspection result.

  The collection device transport head 20 is supported so as to be movable in the X direction, the Y direction, and the Z direction within the collection area A4. Thereby, the recovery device transport head 20 can transport the IC device 90 from the first device recovery unit 18a or the second device recovery unit 18b to the recovery tray 19 or the empty tray 200. The collection device transport head 20 has a plurality of hand units 201 as arms (grip portions) capable of gripping the IC device 90, and each hand unit 201 has the inspection device transport head. As in the case of 17, the suction nozzle is provided, and the IC device 90 is gripped by suction.

  The sixth tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, a fourth tray transport mechanism 22A and a fifth tray transport mechanism 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism for transporting an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The test control unit of the tester performs (electrical) test of the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a storage unit (not shown), for example.

  As shown in FIGS. 1 and 3, the inspection apparatus 1 is electrically connected to the control unit 80 and the control unit 80, and detects the temperatures of the operation device 5, the display device 6, and the IC device 90. A plurality of temperature detection units 31 and a cooling mechanism 4 for cooling the IC device 90 are provided.

  The temperature detection unit 31 includes a first temperature adjustment unit 12a, a second temperature adjustment unit 12b, a first device supply unit 14a, a second device supply unit 14b, and first hand units 171a of the first inspection device transport head 17a, IC devices 90 provided in each of the second hand units 171b and the inspection unit 16 of the second inspection device transport head 17b and mounted, held, or held by detecting the respective temperatures. The temperature of the is detected indirectly. The detection result of each temperature detection unit 31 is input to the control unit 80.

  The temperature detector 31 is not particularly limited as long as the temperature of the IC device 90 can be detected. For example, various temperature sensors such as a platinum (Pt) sensor, a thermocouple, and a thermistor can be used. .

  The control unit 80 includes a storage unit 801 that stores each piece of information (data). For example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the first temperature adjustment unit 12a, and the first 2 temperature adjustment section 12b, supply device transport head 13, first device supply section 14a, second device supply section 14b, third tray transport mechanism 15, first inspection device transport head 17a, Second inspection device transport head 17b, first device recovery unit 18a, second device recovery unit 18b, recovery device transport head 20, sixth tray transport mechanism 21, and fourth tray transport mechanism 22A And the drive of each part such as the fifth tray transport mechanism 22B, the display device 6, and the cooling mechanism 4.

  The operation device 5 has a function of performing each operation of the inspection device 1 such as input. The operating device 5 is not particularly limited, and examples thereof include a keyboard and a mouse.

  The display device 6 has a function of displaying information (data) such as images. The display unit 62 of the display device 6 displays, for example, an operation unit for performing an operation for setting a cooling condition, a cooling condition, and the like. The display device 6 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel.

  For each operation of the operator (operator), for example, the operation device 5 is operated, and a predetermined button of a predetermined check box which is an operation unit displayed on the display unit 62 of the display device 6 is checked and selected. Or by moving the cursor to the position of a predetermined button (icon) that is an operation unit and clicking (selecting) it.

  The operation device 5 and the display device 6 are not limited to those having the above-described configuration, for example, a mechanical operation button such as a push button, a device such as a touch panel that can input and display information, and the like. Is mentioned.

  The cooling mechanism 4 includes a refrigerant source 41 that supplies a cooling gas (low-temperature gas) as a refrigerant, and a pipe body (flow channel) 42 that is branched into a plurality of flows through which the cooling gas supplied from the refrigerant source 41 flows. doing. Each of the branched tubes 42 includes a first temperature adjustment unit 12a, a second temperature adjustment unit 12b, a first device supply unit 14a, a second device supply unit 14b, a first inspection device transport head 17a, and a second temperature control unit 12a. It is connected to the inspection device transport head 17 b and the inspection unit 16. In addition, each of the branched pipe bodies 42 is provided with valves 71, 72, 73, 74, 75, 76, and 77 that can adjust the flow rate of the flowing cooling gas. In addition, as cooling gas, the nitrogen gas etc. which vaporize liquid nitrogen are mentioned, for example.

  As shown in FIG. 2, a tube body (flow channel) 45 connected to the tube body 42 is disposed in the device supply section main body 141 of the first device supply section 14a. The tube 45 is meandering. Thereby, the cooling capacity can be increased, and the IC device 90 can be easily cooled. The cooling gas supplied from the refrigerant source 41 flows in the tube body 42, flows in the tube body 45 in the first device supply unit 14a, further flows in the tube body (not shown), and is discharged or reused. The first device supply unit 14a is cooled by the cooling gas flowing in the tube body 45, and the IC device 90 placed on the first device supply unit 14a is cooled by the first device supply unit 14a.

  The first temperature adjustment unit 12a, the second temperature adjustment unit 12b, the second device supply unit 14b, the first inspection device transfer head 17a, the second inspection device transfer head 17b, and the inspection unit 16 are the same as those described above. Since it is the same as that of the device supply unit 14a, the description is omitted.

  The cooling mechanism 4 controls the opening and closing of the valves 71, 72, 73, 74, 75, 76, and 77, so that the first temperature adjustment unit 12a, the second temperature adjustment unit 12b, the first device supply unit 14a, A state in which the IC device 90 can be cooled by supplying cooling gas to the two-device supply unit 14b, the first inspection device transfer head 17a, the second inspection device transfer head 17b, and the inspection unit 16, and supply of the cooling gas Without the IC device 90 being cooled. Further, by adjusting the opening degree of the valves 71, 72, 73, 74, 75, 76 and 77, the first temperature adjustment unit 12a, the second temperature adjustment unit 12b, the first device supply unit 14a, and the second device supply The flow rate of the cooling gas supplied to the unit 14b, the first inspection device transport head 17a, the second inspection device transport head 17b, and the inspection unit 16, that is, the cooling capacity can be adjusted. The opening and closing of the valves 71 to 77 and the adjustment of the opening degree are respectively performed for the first temperature adjustment unit 12a, the second temperature adjustment unit 12b, the second device supply unit 14b, the first inspection device transport head 17a, and the second inspection. This is done according to the cooling conditions of the device transport head 17b and the inspection unit 16.

  The inspection apparatus 1 also includes a mode (specification) in which only the first temperature adjustment unit 12a is used among the first temperature adjustment unit 12a and the second temperature adjustment unit 12b, and the second temperature adjustment unit 12b. An arbitrary mode can be selected from the three modes of using only and the mode using both.

  The inspection apparatus 1 uses only the first device supply unit 14a out of the first device supply unit 14a and the second device supply unit 14b for the device supply unit, the inspection device transport head, and the device collection unit. Of the first inspection device transfer head 17a and the second inspection device transfer head 17b, only the first inspection device transfer head 17a is used, and the first device recovery unit 18a and the second device recovery unit 18b have the first A mode in which only the device collection unit 18a is used, a mode in which only the second device supply unit 14b, the second inspection device transport head 17b, and the second device collection unit 18b are used, and the first device supply unit 14a and the second device. Supply unit 14b, first inspection device transport head 17a, second inspection device transport head 17b And it is configured to allow selection of any mode among the three modes of mode using all of the first device recovery portion 18a and the second device recovery section 18b.

  In the present embodiment, the device supply unit, the inspection device transport head, and the device collection unit are configured such that setting of which of the first unit and the second unit is used is performed in conjunction with each other. However, the present invention is not limited to this, and the device supply unit, the inspection device transport head, and the device collection unit may be configured so that the setting can be performed separately.

  Moreover, the inspection apparatus 1 has a consumption reduction mode (first mode) and a temperature priority mode (second mode) as operation modes.

  In the consumption reduction mode, a cooling gas (refrigerant) is supplied to a unit (member) used for transporting the IC device 90 to cool the unit, but a cooling gas is supplied to a unit not used for transporting the IC device 90. do not do.

  For this reason, in the consumption reduction mode, the consumption (energy consumption) of the cooling gas can be reduced as compared with the temperature priority mode. For example, when the inspection temperature of the IC device 90 is set to be relatively high, even if there is a unit that is not cooled, the influence thereof is small. Therefore, by setting the operation mode to the consumption reduction mode, the consumption amount of the cooling gas Can be reduced.

  In the temperature priority mode, the cooling gas is supplied not only to the unit used for transporting the IC device 90 but also to the unit not used for transporting the IC device 90 to cool the unit.

  For this reason, in the temperature priority mode, when the temperature of the IC device 90 is maintained at a predetermined temperature, the temperature of the IC device 90 can be stabilized and the accuracy of the temperature can be improved. For example, when the inspection temperature of the IC device 90 is set to be relatively low, there is a possibility that the influence may occur if there is a unit that is not cooled. Therefore, by setting the operation mode to the temperature priority mode, temperature stability and The temperature accuracy can be improved.

  In the present embodiment, when the consumption reduction mode is set, the cooling gas is not supplied to a unit that is not used for transporting the IC device 90. However, the present invention is not limited to this. When the mode is set, the cooling gas is supplied also to the unit not used for transporting the IC device 90, and the flow rate of the cooling gas is less than the flow rate of the cooling gas supplied to the unit used for transporting the IC device 90. You may comprise.

  Next, the operation procedure when the operation mode of the inspection apparatus 1 is set to one of the consumption reduction mode and the temperature priority mode, or the unit to be used is selected from the first unit and the second unit; An image displayed on the display unit 62 during operation will be described.

First, an image 621 shown in FIG. 4 is displayed on the screen of the display unit 62.
Then, a button (operation unit) 651 displayed as “DeviceSet” disposed in the upper central portion of the image 621 is selected (pressed). Thereby, the task bar, that is, the image 622 shown in FIG. 5 is displayed on the screen of the display unit 62.

  When a button (operation unit) 663 displayed as “Temp.Offset” in the image 622 is selected, an image 625 shown in FIG. 8 is displayed on the screen of the display unit 62.

  Then, in the image 625, when the button (operation unit) 691 displayed as “Cool both at the single shuttle mode” arranged at the lower left is selected, the operation mode is set to the temperature priority mode.

  When the button 691 displayed as “Cool both at the single shuttle mode.” Is not selected in the image 625, the operation mode is set to the consumption reduction mode.

  Further, in the image 625, the first temperature adjustment unit 12a, the second temperature adjustment unit 12b, the first device supply unit 14a, the second device supply unit 14b, the first hand units 171a of the first inspection device transport head 17a, The temperature (cooling temperature) can be set for each of the second hand units 171b of the second inspection device transport head 17b.

  Regarding the temperature, “soak plate 1” arranged in the right region of image 625 corresponds to “first temperature adjustment unit 12a”, and “soak plate 2” corresponds to “second temperature adjustment unit 12b”. "Shuttle 1" corresponds to "first device supply unit 14a", "Shuttle 2" corresponds to "second device supply unit 14b", Arm1- "1-A-a, 1-A" -B, 1-Ac, 1-Ad "correspond to" four first hand units 171a "of the first inspection device transport head 17a, respectively, and" 2-A-a, 2- "of Arm2 “Ab, 2-Ac, 2-Ad” correspond to “four second hand units 171b” of the second inspection device transport head 17b.

  In addition, when a button (operation unit) 661 displayed as “Setup” in the image 622 is selected, an image 623 shown in FIG. 6 is displayed on the screen of the display unit 62.

  When the button (operation unit) 671 displayed as “Nomal” is selected in the upper right area of the image 623, both the first device supply unit 14a and the second device supply unit 14b are used for the device supply unit. Similarly, the second inspection device transport head is set to a mode (specification) in which both the first inspection device transport head 17a and the second inspection device transport head 17b are used. The device supply unit and the inspection device transport head are configured so that the setting is performed in conjunction (cooling conditions can be set simultaneously). However, the device supply unit and the inspection device transport head are not limited to this. The device transport head for use may be configured so that the setting can be performed separately.

  In this case, even if the operation mode is set to either the consumption reduction mode or the temperature priority mode, the cooling gas (refrigerant) flows through both the first device supply unit 14a and the second device supply unit 14b. The IC device 90 can be cooled in each of the first device supply unit 14a and the second device supply unit 14b. Similarly, the first inspection device transport head 17a and the second inspection device The cooling gas flows through both of the transport heads 17b, both of which are cooled, and the IC device 90 can be cooled in each of the first inspection device transport head 17a and the second inspection device transport head 17b.

  Further, in the upper right area of the image 623, when a button (operation unit) 672 displayed as “One Side” is selected and a button (operation unit) 673 displayed as “Use Shuttle 1” is selected, a device supply unit About the first device supply unit 14a and the second device supply unit 14b, only the first device supply unit 14a is used. Similarly, for the second inspection device transfer head, the first inspection device transfer head 17a and Of the second inspection device transport head 17b, the mode is set to use only the first inspection device transport head 17a.

  In this case, when the operation mode is set to the temperature priority mode, the cooling gas flows through both the first device supply unit 14a and the second device supply unit 14b, both of them are cooled, and the first device supply unit In each of 14a and the second device supply unit 14b, the IC device 90 can be cooled. Similarly, the cooling gas is supplied to both the first inspection device transfer head 17a and the second inspection device transfer head 17b. Both of the flows are cooled, and the IC device 90 can be cooled in each of the first inspection device transport head 17a and the second inspection device transport head 17b.

  Further, when the operation mode is set to the consumption reduction mode, the cooling gas flows only in the first device supply unit 14a out of the first device supply unit 14a and the second device supply unit 14b. Of the inspection device transfer head 17a and the second inspection device transfer head 17b, the cooling gas flows only in the first inspection device transfer head 17a.

  In the upper right area of the image 623, the button 672 displayed as “One Side” is selected, and the button (operation unit) 674 displayed as “Use Shuttle 2” is selected. Of the device supply unit 14a and the second device supply unit 14b, only the second device supply unit 14b is used. Similarly, for the second inspection device transport head, the first inspection device transport head 17a and the second inspection device transport head 17a. Of the device transport heads 17b, the mode is set to use only the second inspection device transport head 17b.

  In this case, when the operation mode is set to the temperature priority mode, the cooling gas flows through both the first device supply unit 14a and the second device supply unit 14b, and similarly, the first inspection device transport head 17a. The cooling gas flows through both the second inspection device transfer head 17b.

  Further, when the operation mode is set to the consumption reduction mode, the cooling gas flows only in the second device supply unit 14b out of the first device supply unit 14a and the second device supply unit 14b. Of the inspection device transfer head 17a and the second inspection device transfer head 17b, the cooling gas flows only in the second inspection device transfer head 17b.

  When a button (operation unit) 662 displayed as “Plate Form” in the image 622 is selected, an image 624 shown in FIG. 7 is displayed on the screen of the display unit 62.

  When both the button (operation unit) 681 displayed as “Plate 1” and the button (operation unit) 682 displayed as “Plate 2” are selected in the left area of the image 624, the temperature adjustment unit The mode is set to use both the first temperature adjustment unit 12a and the second temperature adjustment unit 12b.

  In this case, even if the operation mode is set to either the consumption reduction mode or the temperature priority mode, the cooling gas flows through both the first temperature adjustment unit 12a and the second temperature adjustment unit 12b, and both of them are cooled. In each of the first temperature adjustment unit 12a and the second temperature adjustment unit 12b, the IC device 90 can be cooled and the temperature of the IC device 90 can be adjusted.

  Further, when the button 681 displayed as “Plate 1” is selected in the left region of the image 624, the first temperature adjustment unit of the first temperature adjustment unit 12a and the second temperature adjustment unit 12b is selected as the temperature adjustment unit. The mode is set to use only 12a.

  In this case, when the operation mode is set to the temperature priority mode, the cooling gas flows through both the first temperature adjustment unit 12a and the second temperature adjustment unit 12b, both of which are cooled, and the first temperature adjustment unit In each of 12a and the second temperature adjusting unit 12b, the IC device 90 can be cooled and the temperature of the IC device 90 can be adjusted.

  When the operation mode is set to the consumption reduction mode, the cooling gas flows only in the first temperature adjustment unit 12a out of the first temperature adjustment unit 12a and the second temperature adjustment unit 12b, Only the first temperature adjustment unit 12a is cooled, and the IC device 90 can be cooled and the temperature of the IC device 90 can be adjusted only by the first temperature adjustment unit 12a.

  Further, when the button 682 displayed as “Plate 2” is selected in the left region of the image 624, the second temperature adjustment unit of the first temperature adjustment unit 12a and the second temperature adjustment unit 12b is selected as the temperature adjustment unit. The mode is set to use only 12b.

  In this case, when the operation mode is set to the temperature priority mode, the cooling gas flows through both the first temperature adjustment unit 12a and the second temperature adjustment unit 12b, both of which are cooled, and the first temperature adjustment unit In each of 12a and the second temperature adjusting unit 12b, the IC device 90 can be cooled and the temperature of the IC device 90 can be adjusted.

  Further, when the operation mode is set to the consumption reduction mode, the cooling gas flows only in the second temperature adjustment unit 12b among the first temperature adjustment unit 12a and the second temperature adjustment unit 12b in the temperature adjustment unit, Only the second temperature adjustment unit 12b is cooled, and the IC device 90 can be cooled and the temperature of the IC device 90 can be adjusted only by the second temperature adjustment unit 12b.

  Here, in the inspection apparatus 1, the cooling condition, that is, the operation mode may be set based on the detection result of the temperature detection unit 31. An example will be described below.

  First, as a premise, as described above, when the inspection temperature of the IC device 90 is relatively high, even if there is a unit that is not cooled, the influence is small. Therefore, the cooling is performed by setting the operation mode to the consumption reduction mode. Gas consumption can be reduced. On the other hand, when the inspection temperature of the IC device 90 is relatively low, there is a possibility that the influence may occur if there is a unit that is not cooled. Therefore, by setting the operation mode to the temperature priority mode, temperature stability and temperature accuracy are improved Can be achieved. Therefore, the detection result of the temperature detection unit 31 is used as follows.

  First, the temperature detected by the temperature detection unit 31 is displayed on the display unit 62, and the operator grasps the temperature by looking at the display.

  When the temperature detected by the temperature detector 31 is relatively high, that is, when the inspection temperature of the IC device 90 is relatively high, the operator has little influence even if there is a unit that is not cooled. Set the mode to consumption reduction mode. Thereby, the consumption of cooling gas can be reduced.

  In addition, when the temperature detected by the temperature detector 31 is relatively low, that is, when the inspection temperature of the IC device 90 is relatively low, the operator may have an influence if there is a unit that is not cooled. Set the operation mode to temperature priority mode. Thereby, temperature stability and temperature accuracy can be improved.

  In the inspection apparatus 1, the cooling condition, that is, the operation mode may be set based on data stored in the storage unit 801 of the control unit 80 in advance. Hereinafter, Configuration 1 and Configuration 2 will be described. The premise is the same as described above.

(Configuration 1)
A predetermined threshold A is stored in the storage unit 801 in advance, and the control unit 80 determines whether or not the temperature detected by the temperature detection unit 31 is higher than the threshold A, and displays the result on the display unit 62. To do.

  Then, when the operator looks at the display and the temperature detected by the temperature detection unit 31 is higher than the threshold A (corresponding to the case where the inspection temperature of the IC device 90 is relatively high), the operation mode is reduced. When the temperature detected by the temperature detection unit 31 is equal to or lower than the threshold A value (corresponding to the case where the inspection temperature of the IC device 90 is relatively low), the operation mode is set to the temperature priority mode.

(Configuration 2)
A predetermined threshold B is stored in the storage unit 801 in advance, and the control unit 80 determines whether the inspection temperature is higher than the threshold B and displays the result on the display unit 62.

  Then, the operator looks at the display, and when the inspection temperature is higher than the threshold B (corresponding to the case where the inspection temperature of the IC device 90 is relatively high), the operator sets the operation mode to the consumption reduction mode, and the inspection temperature Is equal to or less than the threshold value B (corresponding to the case where the inspection temperature of the IC device 90 is relatively low), the operation mode is set to the temperature priority mode.

  In the configurations 1 and 2, the information displayed on the display unit 62 is not the result of the determination, but, for example, “Please set the operation mode to the consumption reduction mode”, “ “Please set the mode” or the like.

  Further, the setting of the operation mode may be automatically performed by the control unit 80 instead of the manual operation of the operator.

  As described above, according to the inspection apparatus 1, the cooling conditions of the plurality of units that cool the IC device 90, that is, the first temperature adjustment unit 12a, the second temperature adjustment unit 12b, the first device supply unit 14a, The cooling conditions of the second device supply unit 14b, the first hand unit 171a of the first inspection device transport head 17a, and the second hand unit 171b of the second inspection device transport head 17b can be set. Specifically, a consumption reduction mode and a temperature priority mode can be selected as the operation mode. By setting the consumption reduction mode, the consumption amount of the cooling gas can be reduced. Also, by setting the temperature priority mode, the temperature of the IC device 90 can be stabilized and the accuracy of the temperature can be improved when the temperature of the IC device 90 is maintained at a predetermined temperature. .

Moreover, the inspection apparatus 1 has the following advantages.
Originally, since the inspection unit 16 continuously inspects the IC device 90, high transport efficiency of the IC device 90 is required. In this case, if the conveyance of the next IC device 90 is completed before the inspection of the IC device 90 is completed, the maximum production efficiency (inspection efficiency) can be obtained. That is, “inspection time> conveyance time” is a condition for obtaining high inspection efficiency.

  On the other hand, in the low temperature inspection, the inspection time tends to be longer. Therefore, even if the transfer efficiency is lowered by setting one of the first unit and the second unit to be used, if the condition “inspection time> transfer time” is satisfied as a result, the production efficiency is affected. Becomes smaller. Under such conditions, it is effective to set the mode in which one of the above is used and operate in the consumption reduction mode.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. Any configuration can be substituted. Moreover, other arbitrary components may be added.

  DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus (electronic component inspection apparatus) 11A ... 1st tray conveyance mechanism 11B ... 2nd tray conveyance mechanism 12a ... 1st temperature adjustment part (1st soak plate) 12b ... 2nd temperature adjustment part (2nd soak) Plate) 13 ... Device transport head for supply 131 ... Hand unit 14a ... First device supply unit (first supply shuttle) 14b ... Second device supply unit (second supply shuttle) 141 ... Device supply unit main body 142 ... Arrangement plate 15 ... Third tray transport mechanism 16 ... Inspection part 161 ... Inspection part body 162 ... Holding member 163 ... Holding part 17a ... First inspection device transport head 17b ... Second inspection device transport head 171a ... First hand unit 171b ... Second hand unit 172 ... Hand unit body 173 ... Holding member 18a ... First device Collection unit (first collection shuttle) 18b ... second device collection unit (second collection shuttle) 181 ... device collection unit body 182 ... placement plate 19 ... collection tray 20 ... collection device transport head 201 ... hand unit 21 ... first 6 tray transport mechanism 22A ... 4th tray transport mechanism 22B ... 5th tray transport mechanism 31 ... temperature detection unit 4 ... cooling mechanism 41 ... refrigerant source 42, 45 ... tube 5 ... operation device 6 ... display device 62 ... Display units 621 to 625 ... Images 651, 661 to 663, 671 to 674, 681, 682, 691 ... Buttons 71 to 76 ... Valves 80 ... Control unit 801 ... Storage unit 90 ... IC device 200 ... Tray A1 ... Tray supply area A2 ... Device supply area (supply area) A3 ... Inspection area A4 ... Device collection area (collection area) A5 ... Ray removal region R1 ... first chamber R2 ... second chamber R3 ... third chamber

Claims (14)

A first placement portion on which an electronic component is placed and capable of cooling the electronic component;
A second mounting portion on which the electronic component is mounted and capable of cooling the electronic component;
An electronic component conveying apparatus, wherein a cooling condition for the first placement part and a cooling condition for the second placement part can be set respectively. A first arm capable of gripping the electronic component and cooling the electronic component;
A second arm capable of gripping the electronic component and cooling the electronic component;
The electronic component transport apparatus according to claim 1, wherein a cooling condition for the first arm and a cooling condition for the second arm can be set.   The electronic component transport apparatus according to claim 2, wherein a cooling condition for the first placement part and the second placement part and a cooling condition for the first arm and the second arm can be set simultaneously.   4. The electronic component transport apparatus according to claim 1, wherein each of the first mounting unit and the second mounting unit is a transport unit capable of transporting the electronic component before inspection. 5.   4. The electronic component transport apparatus according to claim 1, wherein each of the first placement unit and the second placement unit is a temperature adjustment unit that adjusts a temperature of the electronic component before inspection. 5. . A first arm capable of gripping an electronic component and capable of cooling the electronic component;
A second arm capable of gripping the electronic component and cooling the electronic component;
An electronic component conveying apparatus, wherein a cooling condition for the first arm and a cooling condition for the second arm can be set respectively. Having a flow path,
The electronic component conveying apparatus according to claim 1, wherein the cooling of the electronic component is performed by flowing a coolant through the flow path.   The electronic component conveying apparatus according to claim 7, wherein the flow path is meandering.   The electronic component transport apparatus according to claim 7, further comprising a valve capable of adjusting a flow rate of the refrigerant according to the cooling condition.   The electronic component conveying apparatus according to claim 1, further comprising an operation unit that performs an operation of setting the cooling condition. A temperature detection unit for detecting the temperature of the electronic component;
The electronic component conveying apparatus according to claim 1, wherein the cooling condition can be set based on a detection result of the temperature detection unit. Having a storage unit,
The electronic component conveying apparatus according to claim 1, wherein the cooling condition can be set based on data stored in the storage unit in advance.   The electronic component conveying apparatus according to claim 1, further comprising a display unit that displays the cooling condition. A first placement portion on which an electronic component is placed and capable of cooling the electronic component;
A second mounting portion on which the electronic component is mounted and capable of cooling the electronic component;
An inspection unit for inspecting the electronic component,
An electronic component inspection apparatus, wherein a cooling condition for the first placement part and a cooling condition for the second placement part can be set respectively.

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