JP2017032375A - Electronic component conveyance apparatus and electronic component inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance apparatus and an electronic component inspection apparatus capable of preventing dew condensation outside an inspection apparatus.SOLUTION: An inspection apparatus 1 includes: a cooling part 30 capable of cooling an IC device 90; a conveying part capable of conveying the IC device 90; a device supply area A2 for storing the cooling part 30 and the conveying part; and a temperature/humidity sensor 31 capable of detecting at least temperature or humidity outside the device supply area A2. The inspection apparatus 1 determines whether or not the cooling part 30 is allowed to cool based on the detection results of the temperature/humidity sensor 31. The inspection apparatus 1 has a display device 40 for notifying when cooling by the cooling part 30 is not allowed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects electrical characteristics of electronic components such as IC devices is known, and an electronic component conveyance apparatus for conveying an IC device is incorporated in the electronic component inspection apparatus. (For example, refer to Patent Document 1).
Further, the inspection using the electronic component inspection apparatus may be performed while the IC device is cooled to a predetermined temperature. In this case, the IC device is cooled by cooling the inside of the apparatus.

JP 2000-74996 A

  However, in such an electronic component inspection apparatus, since the inside of the apparatus is at a low temperature, the wall portion separating the inside of the apparatus from the outside of the apparatus is at a low temperature. For this reason, depending on the temperature and humidity of the atmosphere outside the apparatus, condensation may occur on the outside of the wall portion.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport device of the present invention includes a cooling unit capable of cooling the electronic component,
A transport unit capable of transporting the electronic component;
A chamber for storing the cooling section and the transport section;
A first detection unit capable of detecting at least one of temperature and humidity outside the chamber;
Whether or not the cooling unit can be cooled is determined based on a detection result of the first detection unit.

  According to the present invention, it is possible to determine whether or not to cool the room based on either the temperature or the humidity outside the room. This prevents the room from being cooled when either the temperature or humidity outside the room is high enough to cause condensation on the outside of the electronic component transport apparatus when the room is cooled. Therefore, it is possible to prevent dew condensation from occurring on the outside of the electronic component transport apparatus.

  In the electronic component transport apparatus of the present invention, it is preferable that the first detection unit is disposed outside the chamber.

  Thereby, the temperature outside the chamber can be accurately detected. In addition, maintenance of the first detection unit can be easily performed.

In the electronic component transport device of the present invention, it is preferable that the first detection unit can detect both temperature and humidity.
Thereby, the above determination can be made more accurately.

In the electronic component transport device of the present invention, the electronic component transport device has a second detection unit capable of detecting at least the temperature and the humidity inside the chamber,
It is preferable to determine whether the cooling unit can be cooled based on detection results of the first detection unit and the second detection unit.

  Thus, the above determination can be made based on the conditions inside the apparatus and the conditions outside. Therefore, the above determination can be made more accurately.

In the electronic component transport apparatus according to the present invention, it is preferable that the electronic component transport apparatus includes a determination unit that determines whether the cooling unit can be cooled based on the detection result.
Thereby, the above determination can be made.

In the electronic component transport device of the present invention, the electronic component transport apparatus includes a storage unit that stores a determination criterion that is a determination criterion of the determination unit.
Preferably, the criterion includes information on temperature and humidity.

  Thus, the above determination can be made based on the determination criteria, and the occurrence of condensation on the outside can be more effectively prevented.

  In the electronic component conveying apparatus of the present invention, it is preferable to have a notification unit that notifies when it is determined that the cooling unit is not cooled.

  Accordingly, it is possible to notify an operator or the like that condensation occurs on the outside of the apparatus when the cooling unit is cooled.

An electronic component inspection apparatus of the present invention includes a cooling unit capable of cooling an electronic component,
A transport unit capable of transporting the electronic component;
A chamber for storing the cooling section and the transport section;
A first detector capable of detecting at least one of temperature and humidity outside the chamber;
An inspection unit for inspecting the electronic component,
Whether or not the cooling unit can be cooled is determined based on a detection result of the first detection unit.

  According to the present invention, it is possible to determine whether or not to cool the room based on either the temperature or the humidity outside the room. This prevents the room from being cooled when either the temperature or humidity outside the room is high enough to cause condensation on the outside of the electronic component inspection apparatus when the room is cooled. Therefore, it is possible to prevent dew condensation from occurring outside the electronic component inspection apparatus.

It is a schematic perspective view which shows the electronic component inspection apparatus of this invention. It is a schematic plan view of the inspection apparatus (electronic component inspection apparatus) shown in FIG. It is a block diagram which shows a part of test | inspection apparatus shown in FIG. It is an expanded sectional view of the top plate shown in FIG. It is a flowchart for demonstrating the control action of the control part shown in FIG. It is a graph which shows the calibration curve memorize | stored in the memory | storage part of the control part shown in FIG. It is a top view which shows the monitor of the display apparatus shown in FIG.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic perspective view showing an electronic component inspection apparatus of the present invention. FIG. 2 is a schematic plan view of the inspection apparatus (electronic component inspection apparatus) shown in FIG. FIG. 3 is a block diagram showing a part of the inspection apparatus shown in FIG. FIG. 4 is an enlarged cross-sectional view of the top plate shown in FIG. FIG. 5 is a flowchart for explaining the control operation of the control unit shown in FIG. FIG. 6 is a graph showing a calibration curve stored in the storage unit of the control unit shown in FIG. FIG. 7 is a plan view showing a monitor of the display device shown in FIG.

  In the following, for convenience of explanation, as shown in FIG. 2, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  As shown in FIG. 1 and FIG. 2, the inspection apparatus 1 includes an electronic component transport apparatus 10 that transports the IC device 90, an inspection section 16, a setting display section (display section (notification section) 40, and operation device 50). Display unit) 60.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes an electronic component conveyance apparatus that conveys the IC device 90 in each region, an inspection unit 16 that is provided in the middle of the conveyance path of the IC device 90, and inspects within the inspection area A3, and a display device. 40 and a setting display unit (display unit) 60 having an operation device 50 and a control unit 80. In the inspection apparatus 1, from the tray supply area A1 to the tray removal area A5, the area from the supply area A2 to which the IC device 90 is conveyed to the collection area A4 can also be referred to as “convey area (convey area)”.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged (the lower side in FIG. 2) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is arranged (FIG. 2 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (arrangement member) 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjusting unit (soak plate) 12, a device transport head (transport unit) 13, and a tray transport mechanism (transport unit) 15 are provided.

  The temperature adjustment unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and can heat or cool the plurality of IC devices 90. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided.

  The device supply unit 14 is a mounting unit on which the temperature-adjusted IC device 90 is mounted, and can transport the IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. The

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  In the present embodiment, the inspection unit 16 is provided with four pockets 161 to 164 each formed of a recess. These four pockets 161 to 164 are arranged in a matrix of 2 rows and 2 columns.

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16.

  In the inspection apparatus 1, the device transport head 17 has two arms 171 and 172. The IC device 90 is arranged on the inspection unit 16 by either the arm 171 or 172.

  The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and can transport the IC device 90 to the collection region A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the collection area A4. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction. The empty trays 200 are also placement units on which the IC devices 90 are placed, and three empty trays 200 are arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

  The configurations of the tray transport mechanisms 15 and 21 are not particularly limited. For example, the tray transport mechanisms 15 and 21 include a suction member that sucks the tray 200 and a support mechanism such as a ball screw that supports the suction member so as to be movable in the X direction. Is mentioned.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  In the inspection apparatus 1 as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. Thereby, the temperature of the IC device 90 is kept constant while being transported. In the following, a case will be described in which the cooling is performed in the heating and cooling, and the inspection is performed in a low temperature environment within a range of, for example, -60 ° C to -40 ° C.

  Further, as shown in FIG. 2, in the inspection apparatus 1, the supply region A <b> 2 and the inspection region A <b> 3 are each provided with a gas supply unit 23 that supplies a cooling gas, and the inside of the supply region A <b> 2 and the inspection region A <b> 3. The air is also cooled.

  Hereinafter, the temperature adjustment unit 12, the inspection unit 16, the device transport head 13, the device supply unit 14, the device transport head 17, and the gas supply unit 23 are collectively referred to as a “cooling unit 30” (see FIG. 3). In the inspection apparatus 1, the device transport head 13 and the device transport head 17 function as a “transport unit”, but can also function as a “cooling unit” because of the cooling ability.

  As shown in FIG. 2, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by the first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region. Furthermore, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, side covers 71 and 72, a rear cover 73, and a top plate 74.

  The supply area A2 is a first chamber R1 defined by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear cover 73. A plurality of IC devices 90 in an uninspected state are carried into the first chamber R1 together with the tray 200.

  The inspection area A3 is a second chamber R2 defined by the second partition wall 62, the third partition wall 63, and the rear cover 73. In the second chamber R2, an inner partition 66 is disposed on the inner side of the rear cover 73.

  The collection area A4 is a third chamber R3 defined by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the rear cover 73. A plurality of IC devices 90 that have been inspected are carried into the third chamber R3 from the second chamber R2.

  As shown in FIG. 2, the side cover 71 is provided with a first door (left first door) 711 and a second door (left second door) 712. By opening the first door 711 and the second door 712, for example, maintenance in the first chamber R1, release of jam in the IC device 90, and the like (hereinafter collectively referred to as “work”) can be performed. The first door 711 and the second door 712 are so-called “folding doors” that open and close in opposite directions. In addition, when working in the first chamber R1, movable parts such as the device transport head 13 in the first chamber R1 are stopped.

  Similarly, the side cover 72 is provided with a first door (right first door) 721 and a second door (right second door) 722. By opening the first door 721 and the second door 722, for example, work in the third chamber R3 can be performed. The first door 721 and the second door 722 are also so-called “folding doors” that open and close in opposite directions. Further, during the work in the third chamber R3, the movable part such as the device transport head 20 in the third chamber R3 stops.

  The rear cover 73 is also provided with a first door (back side first door) 731, a second door (back side second door) 732, and a third door (back side third door) 733. By opening the first door 731, for example, work in the first chamber R <b> 1 can be performed. By opening the third door 733, for example, work in the third chamber R3 can be performed. Further, the inner partition 66 is provided with a fourth door 75. Then, by opening the second door 732 and the fourth door 75, for example, work in the second chamber R2 can be performed. The first door 731, the second door 732, and the fourth door 75 open and close in the same direction, and the third door 733 opens and closes in the opposite direction to these doors. Further, during the work in the second chamber R2, the movable parts such as the device transport head 17 in the second chamber R2 are stopped.

  And by closing each door, the airtightness and heat insulation in each room | chamber corresponding can be ensured.

  The display device 40 includes a monitor 41 that displays driving of each unit, inspection results, and the like. The monitor 41 can be composed of, for example, a liquid crystal display panel that emits light or a display panel such as an organic EL. The operator can set or confirm various processes, conditions, and the like of the inspection apparatus 1 via the monitor 41. As shown in FIG. 1, the display device 40 is disposed above the inspection device 1 in the drawing.

  The operation device 50 is an input device such as a mouse 51 and outputs an operation signal corresponding to the operation by the worker to the control unit 80. Therefore, the operator can use the mouse 51 to instruct the control unit 80 for various processes. As shown in FIG. 1, the mouse 51 (operation device 50) is arranged at a position close to the display device 40 on the right side of the inspection device 1 in the drawing. In the present embodiment, the mouse 51 is used as the operation device 50. However, the operation device 50 is not limited to this, and may be an input device such as a keyboard, a trackball, or a touch panel.

  As illustrated in FIG. 3, the control unit 80 includes a drive control unit 81, an inspection control unit 82, a storage unit 83, a calculation unit 84, and a determination unit 85.

  The drive control unit 81 includes a tray transport mechanism 11A, 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, a device transport head 17, and a device. The drive of each part of the collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  The inspection control unit 82 inspects the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on the program stored in the storage unit 83.

  The storage unit 83 is a semiconductor memory (IC memory) such as a volatile memory such as a RAM, a nonvolatile memory such as a ROM, a rewritable (erasable and rewritable) nonvolatile memory such as an EPROM, an EEPROM, or a flash memory. Etc.

  The calculation unit 84 calculates the temperature difference ΔT in the description of the control operation described later (see step S102 and step S108 in the flowchart shown in FIG. 5). The determination unit 85 determines whether or not the cooling unit 30 can be cooled in the description of the control operation described later (see step S103 and step S109 in the flowchart illustrated in FIG. 5).

  In such an inspection apparatus 1, as described above, the supply region A2 and the inspection region A3 are in a low temperature state. For this reason, the wall part which defines supply area | region A2 and test | inspection area | region A3, especially the side cover 71, the rear cover 73, and the top plate 74 becomes low temperature.

  FIG. 4 is an enlarged cross-sectional view representatively showing the top plate 74 among the wall portions that partition the supply region A2 and the outer region A6. As shown in FIG. 4, the temperature Ta of the air 300 in the supply area A2 is in a low temperature state. For this reason, the temperature Tb of the top plate 74 in contact with the air 300 is also in a low temperature state (the same applies to the side cover 71 and the rear cover 73).

  The top plate 74 is also in contact with the air 400 (temperature Tc, humidity H) in the outer region A6. For this reason, the air 400 around the top plate 74 is cooled by the top plate 74. At this time, depending on the temperature difference ΔT between the temperature Tb and the temperature Tc and the humidity H of the air 400, condensation or icing (hereinafter simply referred to as “condensation”) occurs when the water vapor S in the air 400 becomes saturated. .

  Depending on the degree of condensation, water droplets may drip from the side cover 71, the rear cover 73, and the top plate 74 and hang down on the floor on which the inspection apparatus 1 is installed. In this case, the floor becomes slippery. Further, the occurrence of dew condensation makes it difficult to visually recognize the inside from the outside of the inspection apparatus 1 and hinders work.

  The inspection apparatus 1 has a configuration effective for solving the above problems. This will be described below.

  As shown in FIGS. 1 to 4, the inspection device 1 includes a temperature / humidity sensor (first detection unit) 31 that detects the temperature Tc and the humidity H of the air 400 outside the inspection device 1, and the inside of the inspection device 1. And a temperature sensor (second detection unit) 32 that detects the temperature Ta of the air 300.

  The temperature / humidity sensor 31 is provided on the outer surface (upper surface) of the top plate 74, and detects the temperature Tc and the humidity H of the air 400 in the outer region A6. By installing the temperature / humidity sensor 31 in a place where condensation actually occurs, the temperature Tc and the humidity H of the air 400 can be accurately detected. Furthermore, since the temperature / humidity sensor 31 is installed on the outer surface, maintenance of the temperature / humidity sensor 31 can be easily performed.

  In addition, the temperature / humidity sensor 31 can be installed on the side cover 71, the rear cover 73, etc. In this case, in order to avoid the ventilation and the accumulation of heat, other devices are placed around the inspection apparatus 1 (sideways). ) Must be avoided. On the other hand, by installing the temperature / humidity sensor 31 on the top plate 74, other devices can be freely arranged around (side) the inspection apparatus 1. Therefore, the freedom degree of the arrangement | positioning location of another apparatus and the test | inspection apparatus 1 increases.

  Such a temperature / humidity sensor 31 is electrically connected to the control unit 80 through a wiring (not shown). As a result, information on the detected temperature Tc and humidity H is transmitted to the control unit 80.

  As shown in FIGS. 1-4, the temperature sensor 32 is provided in the inner surface (lower surface) of the top plate 74, and detects temperature Ta of the air 300 of supply area | region A2. Further, the temperature sensor 32 is electrically connected to the control unit 80, and information on the detected temperature is transmitted to the control unit 80.

  The control unit 80 performs the following control based on the detection result of the temperature / humidity sensor 31 and the detection result of the temperature sensor 32. Next, the control operation of the control unit 80 will be described based on the flowchart shown in FIG.

  In the following, when the temperature (set temperature) Ta of the air 300 in the supply area A2 after cooling is T1, the temperature Tc of the air 400 in the outer area A6 is higher than the temperature T1, and the humidity H = H2. Is described as an example. The environment where the temperature Ta = temperature T1, the temperature Tc = temperature T2, and the humidity H = humidity H2 as described above is an environment where condensation occurs outside. Hereinafter, the temperature Ta of the air 300 and the temperature Tb of the top plate 74 are considered to be the same.

  In step S101, the temperature Tc (= T2) and humidity H (= H2) of the air 400 in the outer area A6 are detected (see FIG. 4).

  In step S102, the temperature difference ΔT is calculated by subtracting the temperature Ta of the air 300 after the cooling and the temperature Tc of the air 400, that is, by calculating Ta−Tc.

  In step S103, it is determined whether or not the cooling unit 30 is to be operated. This determination is made based on a calibration curve (determination criterion) K stored in advance in the storage unit 83, as shown in FIG. FIG. 6 is a graph in which the horizontal axis represents the temperature difference ΔT and the vertical axis represents the humidity H. This graph shows how much the humidity H is with respect to the temperature difference ΔT when condensation occurs. For example, as shown in FIG. 6, it can be seen that condensation occurs when the temperature difference is ΔT0 and the humidity is equal to or higher than H0. In this way, condensation occurs in the upper region with the calibration curve K as a boundary.

  When the calculation result of step S102 is temperature T2−temperature T1 = ΔT1, in step S103, whether or not condensation occurs from the calibration curve K based on the temperature difference ΔT1 and the humidity H1 detected in step S101. to decide. In this case, as shown in FIG. 6, since the coordinates (temperature difference ΔT1, humidity H1) are located in a region above the calibration curve K, if the cooling unit 30 is operated as it is, dew condensation may occur on the outside. Judge that there is sex.

  And in step S104, if the cooling part 30 is operated, it will alert | report that condensation may arise outside. In the inspection apparatus 1, as shown in FIG. 7, the characters “the humidity around the apparatus is high and the apparatus cover may be condensed” are displayed on the monitor 41 of the display apparatus 40. Also, at the bottom of this screen, characters “Do you want to move to / continue to low temperature mode?” And characters “Do you want to stop and move to room temperature recovery mode?” Are displayed.

  When the operator selects the “YES” button, the operation of the cooling unit 30 continues. On the other hand, when the operator selects the “NO” button, the operation of the cooling unit 30 can be stopped.

  Note that the inspection apparatus 1 may include a buzzer that sounds a warning sound in accordance with the display on the monitor.

  By notifying that there is a possibility that condensation may occur in this way, for example, an operator can lower the temperature Tc of the outer region A6 or dehumidify the air 400 by any method. Thereby, even if the cooling unit 30 is operated, it is possible to create in advance an environment that can prevent the occurrence of condensation on the outside.

  In Step S103, when it is determined that no condensation occurs outside even if the cooling unit 30 is cooled, cooling of the cooling unit 30 is started (Step S105). When the temperature Ta of the air 300 is cooled to the target temperature T1, the inspection of the IC device 90 is started.

  During this inspection, the inner temperature Ta is detected in step S106, and the outer temperature Tc and humidity H are detected in step S107.

  Then, a temperature difference ΔT between the outer temperature Tc and the inner temperature Ta is calculated (step S108).

  Next, in step S109, it is determined whether or not condensation will occur even if the inspection is continued in the cooling state as it is. This determination is made based on the calibration curve K shown in FIG.

  If it is determined in step S109 that condensation will occur outside when cooling is continued, in step S110, the fact that condensation will occur is notified. This notification is performed in the same manner as in step S104.

  If it is determined in step S109 that condensation does not occur even if the cooling is continued, that is, it is determined that the cooling can be continued, it is determined in step S111 whether or not the inspection is completed.

  If it is determined in step S111 that the inspection has not been completed, the process returns to step S106 and the following steps are repeated.

  As described above, the inspection apparatus 1 can determine whether or not dew condensation occurs on the outside when the cooling of the cooling unit 30 is started. Therefore, it is possible to prevent condensation from occurring outside the inspection apparatus 1 by improving the environment of the outer region A6 according to the determination result. Therefore, it is possible to prevent the floor from becoming slippery and the inner visibility from being lowered due to dew condensation outside the inspection apparatus 1. As a result, it is possible to ensure the safety of the worker of the inspection apparatus 1 and to prevent the work efficiency from being lowered.

  Further, the inspection apparatus 1 detects the inner temperature Ta, the outer temperature Tc, and the humidity H even during the inspection, and dew condensation occurs outside the inspection apparatus 1 based on the detection results. Whether the environment is present is monitored (see steps S106 to S109). And even if any of the inner temperature Ta, the outer temperature Tc, and the humidity H changes during the inspection, it can be notified that an environment in which dew condensation occurs (step S110). According to such a configuration, if condensation easily occurs due to a change in the environment during the inspection, the worker can adjust the outside temperature Tc. Therefore, it is possible to prevent condensation from occurring outside the inspection apparatus 1 during the inspection.

  Although the control in the supply area A2 has been described above, the inspection apparatus 1 can perform the same control as above in the inspection area A3.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Moreover, in the said embodiment, although the 1st detection part detected both temperature and humidity, it is not limited to this in this invention, You may detect one of temperature and humidity. .

  Moreover, in the said embodiment, although the 1st detection part is provided in the top plate, it is not limited to this in this invention, For example, you may provide in any of a rear cover, a front cover, and a side cover.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 14 ... Device supply part, 15 ...... Tray transport mechanism, 16 ...... Inspection section, 161 ...... Pocket, 162 ...... Pocket, 163 ...... Pocket, 164 ...... Pocket, 17 …… Device transport head, 171 …… Arm, 172 …… Arm 18 ...... Device recovery unit, 19 ... Tray for recovery, 20 ... Device transfer head, 21 ... Tray transfer mechanism, 22A ... Tray transfer mechanism, 22B ... Tray transfer mechanism, 23 ... Gas supply unit, 30 ... ... Cooling part 31 ... Temperature / humidity sensor (first detection part) 32 ... Temperature sensor (second detection part) 40 ... Display device 41 ... Monitor 50 ... Operating device 5 …… Mouse, 60 …… Setting display section, 61 …… First partition, 62 …… Second partition, 63 …… Third partition, 64 …… Fourth partition, 65 …… Fifth partition, 66 …… Inside Bulkhead, 70 ... Front cover, 71 ... Side cover, 711 ... First door, 712 ... Second door, 72 ... Side cover, 721 ... First door, 722 ... Second door, 73 ... ... rear cover, 731 ... first door, 732 ... second door, 733 ... third door, 74 ... top plate, 75 ... fourth door, 80 ... control part, 81 ... drive control part, 82: Inspection control unit, 83: Storage unit, 84: Calculation unit, 85: Judgment unit, 90: IC device, 200 ... Tray, 300 ... Air, 400 ... Air, A1 ... Tray Supply area, A2: Device supply area (supply area), A3: Inspection area, A4: Device collection area A5: Tray removal area, A6: Outer area, R1: First chamber, R2: Second chamber, R3: Third chamber, Ta: Temperature, Tb: Temperature, Tc: Temperature, T1 ... Temperature, T2 ... Temperature, H ... Humidity, H0 ... Humidity, H1 ... Humidity, H2 ... Humidity, K ... Calibration curve, ΔT ... Temperature difference, ΔT0 ... Temperature difference, ΔT1 ... Temperature difference, S ... water vapor, S101 ... step, S102 ... step, S103 ... step, S104 ... step, S105 ... step, S106 ... step, S107 ... step, S108 ... step, S109 ... ... Step, S110 ... Step, S111 ... Step

Claims (8)

A cooling unit capable of cooling electronic components;
A transport unit capable of transporting the electronic component;
A chamber for storing the cooling section and the transport section;
A first detection unit capable of detecting at least one of temperature and humidity outside the chamber;
An electronic component transport apparatus that determines whether or not the cooling section can be cooled based on a detection result of the first detection section.   The electronic component transport apparatus according to claim 1, wherein the first detection unit is disposed outside the chamber.   The electronic component transport apparatus according to claim 1, wherein the first detection unit is capable of detecting both temperature and humidity. A second detection unit capable of detecting at least the temperature of the inside temperature and humidity of the chamber;
4. The electronic component transport device according to claim 1, wherein whether or not the cooling unit can be cooled is determined based on detection results of the first detection unit and the second detection unit. 5.   5. The electronic component transport device according to claim 1, further comprising a determination unit configured to determine whether the cooling unit can be cooled based on the detection result. A storage unit for storing a determination criterion that is a criterion for determination by the determination unit;
The electronic component conveying apparatus according to claim 1, wherein the determination criterion includes temperature and humidity information.   The electronic component conveying apparatus according to any one of claims 1 to 6, further comprising a notification unit that notifies when it is determined that the cooling unit is not cooled. A cooling unit capable of cooling electronic components;
A transport unit capable of transporting the electronic component;
A chamber for storing the cooling section and the transport section;
A first detector capable of detecting at least one of temperature and humidity outside the chamber;
An inspection unit for inspecting the electronic component,
An electronic component inspection apparatus that determines whether or not the cooling unit can be cooled based on a detection result of the first detection unit.

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