JP2016023993A - Electronic component transfer device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component transfer device and an electronic component inspection device, capable of preventing dew formation and the falling of drips especially around an inspection part.SOLUTION: An electronic component inspection device 1 includes: an inspection part 16 which inspects an electronic component; a base plate 31 in which a cooling part 30 including a temperature adjustment part 12 for cooling the electronic component and a device supply part 14 is arranged and to which the inspection part 16 can be connected; and a first cord heater 331 and a second cord heater 332 as a heating part, which are provided so as to be capable of heating the base plate 31.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

  Such an IC device inspection may be performed by cooling the IC device to a predetermined temperature. In that case, the IC device is cooled by cooling the placement member on which the IC device is placed, and at the same time, the humidity of the atmosphere around the placement member (inside of the apparatus) so that condensation and frost (freezing and icing) do not occur. The humidity).

  Patent Document 1 discloses an IC handler having a chute rail that conveys an IC device and a thermostatic bath that cools the IC device conveyed by the chute rail to a predetermined temperature. In this IC handler, a heater is installed in order to prevent frost from forming near the entrance of the thermostat.

JP-A-62-80571

  However, in the invention described in Patent Document 1, the positional relationship between the inspection unit for inspecting the IC device and the heater is unclear, and therefore, generation of frost near the entrance by the heater is prevented. There is concern about the generation of frost in the area. If frost can be generated at the inspection unit, Patent Document 1 neither discloses nor suggests a configuration for preventing the generation of frost.

  An object of the present invention is to provide an electronic component transport device and an electronic component inspection device capable of preventing condensation and dropping of drops around an inspection section.

Such an object is achieved by the present invention described below.
[Application Example 1]
The electronic component transport device of the present invention includes a cooling unit capable of cooling an electronic component,
A base plate on which the cooling unit is disposed;
And a heat generating part for heating the base plate.

  When the cooling unit is activated, condensation may occur around the inspection unit or drops may drop depending on the humidity level at that time. However, the vicinity of the inspection unit can be heated by the heat generating unit, and therefore, the occurrence of condensation and the drop of the droplet can be prevented.

[Application Example 2]
In the electronic component transport device of the present invention, it is preferable that the base plate is provided with a connection portion for connecting an inspection portion for inspecting the electronic component.

  As a result, a part of the inspection unit is stored inside the opening, and the electronic component transport apparatus is reduced in size by the storage.

[Application Example 3]
In the electronic component transport device according to the aspect of the invention, it is preferable that the heat generating portion is disposed so as to surround the connecting portion.

  Thereby, the periphery of the opening including the inspection part can be preferentially heated (preferentially), and therefore, it is possible to efficiently prevent the occurrence of condensation and the drop prevention around the inspection part.

[Application Example 4]
In the electronic component transport apparatus according to the present invention, it is preferable that the tester head including the inspection unit is disposed at a lower part in the vertical direction of the base plate.

  Thereby, the operation | work which connects a tester head can be performed easily, Therefore The test | inspection with respect to the electronic component after the operation | work can be performed rapidly.

[Application Example 5]
In the electronic component conveying apparatus of the present invention, it is preferable that the heat generating portion is a cord heater.

  Thereby, the heating part can be easily routed (wired) in the electronic component conveying apparatus.

[Application Example 6]
In the electronic component conveying apparatus of the present invention, it is preferable that the cord heater is arranged in a meandering shape.

  Thereby, the heating area with respect to the heating target part can be ensured as wide as possible, and thus the heating time to a temperature at which the generation of condensation is prevented at the heating target part can be shortened. In addition, the heating target portion can be heated evenly.

[Application Example 7]
In the electronic component transport apparatus according to the present invention, it is preferable that the heat generating portion is disposed at least on one surface or the other surface of the base plate.

  Thereby, the arrangement | positioning location of a heat generating part can be selected according to the positional relationship of a cooling part and a test | inspection part.

[Application Example 8]
In the electronic component conveying apparatus of the present invention, it is preferable that the heat generating portion is disposed in the groove portion of the plate member in which the groove portion is formed, and the plate member is attached to the base plate.

  Thereby, the attitude | position of a heat generating part is controlled, Therefore The site | part which should be heated by the said heat generating part can be heated suitably.

[Application Example 9]
In the electronic component conveying apparatus of the present invention, it is preferable that the heat generating portion is a single linear body having a linear shape.

  Thereby, the heating part can be easily routed (wired) in the electronic component conveying apparatus.

[Application Example 10]
An electronic component inspection apparatus according to the present invention includes a cooling unit capable of cooling an electronic component,
A base plate on which the cooling unit is disposed;
A heat generating portion for heating the base plate;
An inspection unit for inspecting the electronic component.

  When the cooling unit is activated, condensation may occur around the inspection unit or drops may drop depending on the humidity level at that time. However, the periphery of the inspection unit can be heated by the heat generating unit, and therefore, condensation and falling can be prevented.

FIG. 1 is a schematic perspective view of a preferred embodiment of an electronic component transport apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic perspective view of the electronic component transport device shown in FIG. 1 as viewed from the back side. FIG. 3 is a schematic plan view of the electronic component conveying apparatus shown in FIG. FIG. 4 is a schematic plan view of the electronic component conveying apparatus shown in FIG. FIG. 5 is an exploded view (a) and an assembled view (b) of the AA line cross section in FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
FIG. 1 is a schematic perspective view of a preferred embodiment of an electronic component transport apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic perspective view of the electronic component transport device shown in FIG. 1 as viewed from the back side. 3 and 4 are schematic plan views of the electronic component conveying apparatus shown in FIG. FIG. 5 is an exploded view (a) and an assembled view (b) of the AA line cross section in FIG. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  Further, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, side covers 71 and 72, a rear cover 73, and a top cover 74.

  As shown in FIG. 3, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component transport apparatus that transports the IC device 90 in each region, the inspection unit 16 that performs the inspection in the inspection region A3, and the control unit 80.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged is the front side (see FIG. 1), and the opposite side, that is, the direction in which the inspection area A3 is arranged is the back side (see FIG. 1). 2).

  The tray supply area A1 is a material supply unit to which a tray (arrangement member) 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjusting unit (soak plate) 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust the IC devices 90 to a temperature suitable for inspection. In the configuration shown in FIG. 3, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided.

  The device supply unit 14 is a device that transports the temperature-adjusted IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration illustrated in FIG. 3, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. .

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is a socket disposed in the inspection unit placement unit 29 (see FIG. 4), and is detachable from the inspection unit placement unit 29. Accordingly, the inspection unit 16 can be exchanged according to the type of the IC device 90 or the like. The inspection unit 16 is provided with an electric circuit having a plurality of probe pins that are electrically connected to the terminals of the IC device 90 in a state where the IC device 90 is held. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit provided in the tester 600 connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16.

  The device collection unit 18 is an apparatus that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 3, two device collection units 18 are arranged in the Y direction, like the device supply unit 14, and the IC device 90 on the inspection unit 16 is connected to any one of the device collection units 18. Transported and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 3, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The control unit 80 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  Note that the inspection control unit of the tester 600 performs, for example, an inspection of the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on a program stored in a memory (not shown).

  In the inspection apparatus 1 as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. Thereby, the temperature of the IC device 90 is kept constant while being transported. In the following, the case where the IC device 90 is cooled and inspected in a low temperature environment within a range of, for example, −60 ° C. to −40 ° C. will be described. In this case, the temperature adjustment unit 12 or the like is a part that cools the IC device 90, and these may be collectively referred to as the “cooling unit 30”. As a cooling structure in the cooling unit 30, for example, a structure having a flow path through which a refrigerant obtained by vaporizing liquid nitrogen passes can be used.

  As shown in FIGS. 2 and 4, a tester arrangement space A <b> 6 in which the tester 600 is inserted and arranged is formed on the back side of the inspection apparatus 1. The tester arrangement space A6 is located below the supply area A2 and the inspection area A3. The tester 600 includes a tester head 601 connected to the inspection unit 16 in the inspection area A3 in a state of being disposed in the tester arrangement space A6. In this connection state, the IC device 90 on the inspection unit 16 can be inspected. The tester head 601 has a plurality of inspection circuit boards for inspecting the IC device 90.

  As shown in FIGS. 2 and 5, the inspection apparatus 1 includes a base plate 31 and an auxiliary plate (plate member) 32 that is arranged below the base plate 31. Further, between the base plate 31 and the auxiliary plate 32, a first code heater 331 and a second code heater 332, which are heat generating portions, are disposed.

  As shown in FIG. 4, the base plate 31 is provided with a cooling unit 30 such as the temperature adjustment unit 12, and in addition, a device recovery unit 18, a recovery tray 19, and a tray 200, and collectively supports these from the lower side. It is a plate-shaped member. In addition, the base plate 31 includes an inspection unit arrangement unit 29 on which the inspection unit 16 is arranged and connected. The inspection unit placement unit 29 is configured by an opening formed through the base plate 31 in the thickness direction (see FIG. 5). Thereby, it will be in the state where a part of inspection part 16 was stored inside the opening, and the amount of protrusion which inspection part 16 protrudes in inspection field A3 can be controlled by this storage. Therefore, the degree of freedom of movement of the device transport head 17 in the inspection area A3 is increased.

  As described above, the tester 600 is inserted into the tester arrangement space A6. In this state, the tester head 601 of the tester 600 is disposed at the lower part of the base plate 31 in the vertical direction and is electrically connected to the inspection unit 16. Such a connection mode from the lower side can facilitate the connection work. In the field of semiconductor test equipment, the tester head 601 connected to the inspection unit 16 may include the inspection unit 16.

  As shown in FIG. 5, an auxiliary plate 32 is attached to the lower surface of the base plate 31. This attachment method is not particularly limited, and examples thereof include a screwing method. The auxiliary plate 32 has an opening 320 formed through the thickness direction in the portion of the base plate 31 that faces the inspection portion placement portion 29.

  The auxiliary plate 32 is a plate-like member that sandwiches the first code heater 331 and the second code heater 332 with the base plate 31. Thereby, the 1st code heater 331 and the 2nd code heater 332 are fixed to each plate.

  The constituent material of the base plate 31 and the auxiliary plate 32 is not particularly limited, and for example, a metal material such as aluminum can be used. Aluminum is a material that can be easily machined and is preferable in manufacturing the base plate 31 and the auxiliary plate 32.

The thickness t ₁ of the base plate 31 is not particularly limited, and is preferably 6 mm or more and 20 mm or less, for example, and more preferably 10 mm or more and 16 mm or less. As a result, the base plate 31 has sufficient strength to support the cooling unit 30.

The thickness t ₂ of the auxiliary plate 32 is preferably the same as the thickness t ₁ or thinner than the thickness t ₁ . For example, the thickness _{t 2} is 0.4 times or more the thickness _{t 1,} is preferably 1 times or less, 0.4 times or more, more preferably 0.8 times or less. Thereby, the auxiliary plate 32 can sufficiently support the first code heater 331 and the second code heater 332 and also functions as a reinforcing material for reinforcing the base plate 31.

  As shown in FIG. 4, the first code heater 331 is arranged so as to surround the inspection unit arrangement unit 29 in a plan view. Thereby, the circumference | surroundings of the test | inspection part arrangement | positioning part 29 containing the test | inspection part 16 can be heated preferentially (intensively).

  As described above, in the inspection apparatus 1, the IC device 90 is inspected in a low temperature environment. In this case, the inspection unit 16 is cooled, but depending on the degree of humidity in the inspection region A3 at that time, there is a possibility that condensation occurs in the inspection unit 16 or drops caused thereby fall on the tester head 601. Such a phenomenon may cause a failure of the IC device 90, the inspection unit 16, and the tester head 601.

  However, in the inspection apparatus 1, the first code heater 331 can be operated while the inspection unit 16 is being cooled, and thus the periphery of the inspection unit 16 can be heated to a temperature at which condensation is prevented. Thereby, it is possible to prevent dew condensation from occurring in the vicinity of the inspection unit 16, and it is also possible to prevent drops from dropping on the tester head 601. Therefore, it is possible to prevent the inspection unit 16 and the tester head 601 from failing.

  In addition, it does not specifically limit as heating temperature by the 1st cord heater 331, For example, it is preferable that it is 15 to 40 degreeC, and it is more preferable that it is 20 to 30 degreeC.

  As shown in FIG. 4, in plan view, the second code heater 332 passes directly under the temperature adjustment unit 12 and the device supply unit 14, which are the cooling unit 30, and the device collection unit 18, that is, I'm drawing around. Thereby, the periphery of the part in which the temperature adjustment part 12 grade | etc., Of the baseplate 31 is arrange | positioned can be heated preferentially.

  When the inspection is performed in a low temperature environment, the temperature adjustment unit 12 and the device supply unit 14 are also cooled in the same manner as the inspection unit 16, but depending on the degree of humidity at that time, condensation occurs in the temperature adjustment unit 12 and the like. There is a fear. Such a phenomenon may cause a failure of the IC device 90.

  However, in the inspection apparatus 1, the second cord heater 332 can be operated during cooling by the temperature adjustment unit 12 or the like, thereby preventing the occurrence of condensation. Therefore, failure of the IC device 90 can also be prevented.

  The heating temperature by the second cord heater 332 may be the heating temperature by the first cord heater 331. However, since the first cord heater 331 and the second cord heater 332 are separate members, the first cord heater It may be different from the heating temperature by 331. When the heating temperature by the second cord heater 332 is different from the heating temperature by the first cord heater 331, the heating temperature is preferably 20 ° C. or more and 40 ° C. or less, for example, 20 ° C. or more and 30 ° C. or less. Is more preferable.

  The second cord heater 332 is a meandering portion 333 arranged in a meandering shape immediately below the temperature adjusting portion 12. Thereby, the heating area with respect to the temperature adjustment part 12 can be ensured as wide as possible, and therefore the heating time to the temperature at which the temperature adjustment part 12 prevents the occurrence of condensation can be shortened. Moreover, the heating with respect to the temperature control part 12 can be performed equally.

  The first cord heater 331 and the second cord heater 332 are not particularly limited, and, for example, those composed of a spiral nichrome wire and a silicone rubber covering the nichrome wire can be used. With such a configuration, the first cord heater 331 and the second cord heater 332 can each generate heat when energized.

  Further, by using the cord heater having such a configuration as the heat generating portion, the heat generating portion becomes a single linear body having a flexible linear shape. Thereby, each wiring (wiring) of the 1st code heater 331 and the 2nd code heater 332 in the inspection apparatus 1 can be performed easily.

  As shown in FIG. 5, on the upper surface of the auxiliary plate 32, that is, the surface on the base plate 31 side, a first groove portion 321 into which the first code heater 331 is inserted and a second groove portion into which the second code heater 332 is inserted. 322 are formed. Thereby, the shape of the 1st cord heater 331 and the 2nd cord heater 332, ie, the routing, is controlled, and deformation with time is also prevented. Therefore, the site | part which should be heated by each cord heater can be heated suitably.

  Further, the first code heater 331 and the second code heater 332 are disposed on the lower surface side of the base plate 31. As a result, each code heater is hidden by the base plate 31, and therefore, for example, the device transport head 17 can be prevented from being caught by the code heater.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, although the auxiliary | assistant plate is attached from the lower surface side of the base plate in the said embodiment, it is not limited to this, You may attach from the upper surface side of a base plate.

  Moreover, although the groove part by which a heat-emitting part is arrange | positioned is formed in the auxiliary | assistant plate among the base plate and the auxiliary | assistant plate, it is not limited to this, The said groove part may be formed in the base plate.

  Moreover, although the heat generating portion is disposed on the lower surface of the base plate in the embodiment, the heat generating portion is not limited to this, and may be disposed on the upper surface of the base plate or may be disposed on both surfaces.

  In addition, the first code heater and the second code heater as the heat generating parts are separate from each other in the embodiment, but are not limited thereto, and may be one continuous code heater. .

  In addition, the code heater is used as the heat generating portion in the above embodiment, but is not limited to this. For example, a planar heater or a rod heater may be used, or a hot air heater may be used.

1 ... Inspection equipment (electronic parts inspection equipment)
11A, 11B ...... Tray transport mechanism 12 ... Temperature adjuster (soak plate)
13 …… Device transport head 14 …… Device supply unit (supply shuttle)
15. Tray transport mechanism (first transport device)
16 …… Inspection unit 17 …… Device transport head 18 …… Device recovery unit (recovery shuttle)
19 …… Tray for collection 20 …… Device transfer head 21 …… Tray transfer mechanism (second transfer device)
22A, 22B …… Tray transport mechanism 29 …… Inspection part placement part 30 …… Cooling part 31 …… Base plate 32 …… Auxiliary plate (plate member)
320 …… Opening portion 321 …… First groove portion 322 …… Second groove portion 331 …… First cord heater 332 …… Second cord heater 333 …… Meandering portion 70 …… Front cover 71 …… Side cover 72 …… Side Cover 73 …… Rear cover 74 …… Top cover 80 …… Control unit 90 …… IC device 200 …… Tray (arrangement member)
600 …… Tester 601 …… Tester head A1 …… Tray supply area A2 …… Device supply area (supply area)
A3: Inspection area A4: Device collection area (collection area)
A5 ...... tray removal area A6 ...... tester arrangement space _{t 1,} t ₂ ...... thickness

Claims (10)

Cooling unit that can cool electronic components,
A base plate on which the cooling unit is disposed;
An electronic component transport apparatus comprising: a heat generating unit that heats the base plate.   The electronic component transport apparatus according to claim 1, wherein the base plate is provided with a connection unit that connects an inspection unit that inspects the electronic component.   The electronic component conveying apparatus according to claim 2, wherein the heat generating portion is disposed so as to surround the connecting portion.   The electronic component transport apparatus according to claim 1, wherein a tester head including the inspection unit is disposed at a lower portion in the vertical direction of the base plate.   The electronic component conveying apparatus according to claim 1, wherein the heat generating unit is a cord heater.   The electronic component transport device according to claim 5, wherein the cord heater is arranged in a meandering shape.   The electronic component conveying apparatus according to claim 1, wherein the heat generating portion is disposed at least on one surface or the other surface of the base plate.   The electronic component conveying device according to claim 1, wherein the heat generating portion is disposed in the groove portion of a plate member in which the groove portion is formed, and the plate member is attached to the base plate.   The electronic component conveying apparatus according to any one of claims 1 to 8, wherein the heat generating portion is a single linear body having a linear shape. Cooling unit that can cool electronic components,
A base plate on which the cooling unit is disposed;
A heat generating portion for heating the base plate;
An electronic component inspection apparatus comprising: an inspection unit that inspects the electronic component.

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