TWI603094B - Electronic parts conveying apparatus and electronic parts inspection apparatus - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

In the past, for example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC device has been known, and an electronic component transportation device for transporting an IC device to a holding portion of an inspection portion is incorporated in the electronic component inspection device. When the IC device is inspected, the IC device is disposed in the holding portion such that a plurality of probe pins provided in the holding portion are in contact with respective terminals of the IC device.

Inspection of such IC devices is sometimes performed after cooling the IC device to a specific temperature. In this case, cooling the IC device with the configuration member of the IC device and cooling the IC device, and avoiding the occurrence of condensation or frost (icing or ice accretion), the humidity of the atmosphere around the above-mentioned arrangement member (in the device) Humidity) is reduced.

Patent Document 1 discloses an IC processor including: a slide rail that carries an IC device; and a thermostatic chamber that cools the IC device that is transported by the slide rail to a specific temperature. In the IC processor, a heater is provided to prevent frost from being generated near the entrance of the constant temperature bath.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 62-80571

However, in the invention described in Patent Document 1, the inspection unit of the IC device is inspected and added. Since the positional relationship of the heat exchanger is not clear, although the frost can be prevented from being generated in the vicinity of the inlet by the heater, there is a concern that the inspection portion generates frost. The configuration for preventing the occurrence of the frost when the hypothesis inspection unit may generate a frost is not disclosed or suggested in Patent Document 1.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which are capable of preventing condensation from dripping around the inspection portion or dropping water droplets.

This object is achieved by the present invention described below.

[Application Example 1]

An electronic component transport apparatus according to the present invention includes: a cooling unit that cools an electronic component; a bottom plate that houses the cooling unit; and a heat generating portion that heats the bottom plate.

When the cooling unit is actuated, depending on the degree of humidity at this time, condensation or dripping of water droplets may occur around the inspection portion. However, since the periphery of the inspection portion can be heated by the heat generating portion, it is possible to prevent the occurrence of condensation or dripping.

[Application Example 2]

In the electronic component transporting apparatus of the present invention, preferably, the base plate is provided with a connecting portion that connects the inspection portion for inspecting the electronic component.

In this way, a part of the inspection unit is housed inside the opening, and the electronic component conveying device can be downsized in accordance with the degree of storage.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat generating portion is disposed to surround the connecting portion.

Thereby, the periphery of the opening including the inspection portion can be preferentially heated (emphasis), so that dew condensation around the inspection portion or prevention of dripping of water droplets can be prevented with high efficiency.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, preferably, the test head including the inspection unit is disposed at a lower portion in the vertical direction of the bottom plate.

Thereby, the work of connecting the test head can be easily performed, and therefore, the electronic parts after the work can be quickly inspected.

[Application 5]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat generating portion is a cord heater.

Thereby, the traction (wiring) of the heat generating portion can be easily performed in the electronic component conveying device.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, it is preferable that the electric wire heater is disposed in a meandering shape.

Thereby, it is possible to ensure that the heating area corresponding to the heating target portion is as wide as possible, and therefore it is possible to shorten the time during which the heating target portion is heated to a temperature at which dew condensation can be prevented. Further, the heating target portion can be uniformly heated.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat generating portion is disposed at least on one surface or the other surface of the bottom plate.

Thereby, the arrangement portion of the heat generating portion can be selected in accordance with the positional relationship between the cooling portion and the inspection portion.

[Application Example 8]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat generating portion is disposed in the groove portion of the plate member in which the groove portion is formed, and the plate member is attached to the bottom plate.

Thereby, since the posture of the heat generating portion is restricted, the portion to be heated can be favorably heated by the heat generating portion.

[Application Example 9]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat generating portion has a linear linear body.

Thereby, the traction (wiring) of the heat generating portion can be easily performed in the electronic component conveying device.

[Application Example 10]

An electronic component inspection apparatus according to the present invention includes: a cooling portion that cools an electronic component; a bottom plate that houses the cooling portion; a heat generating portion that heats the bottom plate; and an inspection portion that inspects the electronic component.

When the cooling unit is actuated, depending on the degree of humidity at this time, condensation or dripping of water droplets may occur around the inspection portion. However, since the periphery of the inspection portion can be heated by the heat generating portion, condensation or dripping can be prevented.

1‧‧‧Inspection device (electronic parts inspection device)

11A, 11B‧‧‧Tray transport mechanism

12‧‧‧ Temperature adjustment section (soaking plate)

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department (Supply Shuttle)

15‧‧‧Tray transport mechanism (first transport device)

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧Device Transfer Head

21‧‧‧Tray transport mechanism (second transport device)

22A, 22B‧‧‧Tray transport mechanism

29‧‧‧ Inspection Department Configuration Department

30‧‧‧ Cooling Department

31‧‧‧floor

32‧‧‧Auxiliary board (board member)

70‧‧‧ front cover

71‧‧‧ side cover

72‧‧‧ side cover

73‧‧‧ Rear cover

74‧‧‧Top cover

80‧‧‧Control Department

90‧‧‧IC devices

200‧‧‧Tray (configuration component)

320‧‧‧ openings

321‧‧‧1st groove

322‧‧‧2nd groove

331‧‧‧1st wire heater

332‧‧‧2nd wire heater

333‧‧‧蜿蜒

600‧‧‧Tester

601‧‧‧ test head

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

A6‧‧‧Tester configuration space

t ₁ , t ₂ ‧‧‧ thickness

Fig. 1 is a schematic perspective view showing a preferred embodiment of the electronic component conveying apparatus of the present invention as seen from the front side.

Fig. 2 is a schematic perspective view of the electronic component conveying device shown in Fig. 1 as seen from the back side.

Fig. 3 is a schematic plan view of the electronic component conveying device shown in Fig. 1;

4 is a schematic plan view of the electronic component conveying device shown in FIG. 1.

Fig. 5 is an exploded view (a) and an assembled view (b) of the cross section taken along the line A-A in Fig. 4.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the drawings.

Fig. 1 is a schematic perspective view showing a preferred embodiment of the electronic component conveying apparatus of the present invention as seen from the front side. Figure 2 is an overview of the electronic component transporting apparatus shown in Figure 1 from the back side. Slightly perspective view. 3 and 4 are schematic plan views of the electronic component conveying device shown in Fig. 1, respectively. Fig. 5 is an exploded view (a) and an assembled view (b) of the cross section taken along the line A-A in Fig. 4. In the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". In addition, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side of the conveyance direction of the electronic component is also simply referred to as "downstream side". Further, the "level" in the specification of the present invention is not limited to a complete level, and includes a state in which the level is slightly inclined (for example, less than 5 degrees) as long as it does not interfere with the conveyance of the electronic component.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used, for example, for an IC such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package ( Electrical characteristics of electronic components such as integrated circuit, integrated circuit display device, LCD (Liquid Crystal Display), CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, CMOS image sensor) checking. Test (hereinafter referred to as "inspection") device. In the following, for the sake of convenience of explanation, a case where an IC device is used as the above-described electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 90".

Further, the outermost portion of the inspection device 1 is covered with a cover body having, for example, a front cover 70, side covers 71 and 72, a rear cover 73, and a top cover 74.

As shown in FIG. 3, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter simply referred to as "recovery area") A4, and a tray. Area A5 is removed. Further, the IC device 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5 via the above-described respective areas and in the inspection area A3 in the middle. In this way, the inspection apparatus 1 is provided in each area to transport the IC device 90. The electronic component transport device, the inspection unit 16 that performs inspection in the inspection area A3, and the control unit 80.

In addition, the side of the inspection apparatus 1 in which the tray supply area A1 and the tray removal area A5 are disposed is used as the front side (see FIG. 1), and the side opposite to the inspection apparatus A3 is used as the back side (refer to the side). Figure 2) Use.

The tray supply area A1 supplies a material supply unit of a tray (arrangement member) 200 in which a plurality of IC devices 90 in an unchecked state are arranged. A plurality of trays 200 can be stacked in the tray supply area A1.

The supply area A2 supplies a plurality of IC devices 90 disposed on the tray 200 from the tray supply area A1 to the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

A temperature adjustment unit (soak plate) 12, a device transfer head 13, and a tray transfer mechanism (first transfer device) 15 are provided in the supply region A2.

The temperature adjustment unit 12 is a device that heats or cools a plurality of IC devices 90 to adjust the IC device 90 to a temperature suitable for inspection. In the configuration shown in FIG. 3, two temperature adjustment portions 12 are disposed and fixed in the Y direction. Further, the IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed on any of the temperature adjustment units 12.

The device transfer head 13 is supported to be movable within the supply area A2. Thereby, the device transfer head 13 can be responsible for the transfer of the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 described below. The transfer.

The tray transport mechanism 15 is a mechanism for transporting the tray 200 in the state in which all the IC devices 90 are removed and in the X direction in the supply region A2. Further, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray by the tray transport mechanism 11B. Give area A1.

The inspection area A3 is an area in which the IC device 90 is inspected. A device supply unit (supply shuttle) 14, an inspection unit 16, a device transfer head 17, and a device collection unit (recycling shuttle) 18 are provided in the inspection area A3.

The device supply unit 14 transports the temperature-adjusted IC device 90 to a device in the vicinity of the inspection unit 16. The device supply portion 14 is supported to be movable between the supply region A2 and the inspection region A3 in the X direction. Further, in the configuration shown in FIG. 3, two device supply portions 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment portion 12 is transported and placed on any of the device supply portions 14.

Inspection Department 16 is inspected. A unit that tests the electrical characteristics of the IC device 90. Further, the inspection unit 16 is disposed in a socket (see FIG. 4) of the inspection unit arrangement unit 29, and is detachably attachable to the inspection unit arrangement unit 29. Thereby, the inspection unit 16 can be replaced in accordance with the type of the IC device 90 or the like. Further, the inspection unit 16 is provided with a circuit having a plurality of probe pins electrically connected to the terminals of the IC device 90 while holding the IC device 90. Moreover, the terminals of the IC device 90 are electrically connected (contacted) to the probe pins, and the inspection of the IC device 90 is performed via the probe pins. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit provided in the tester 600 connected to the inspection unit 16. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

The device transfer head 17 is supported to be movable within the inspection area A3. Thereby, the device transfer head 17 can transport and mount the IC device 90 on the device supply unit 14 carried in from the supply region A2 to the inspection unit 16.

The device recovery unit 18 is a device that transports the IC device 90 that has finished the inspection of the inspection unit 16 to the collection area A4. The device recovery portion 18 is supported to be movable between the inspection region A3 and the recovery region A4 in the X direction. Further, in the configuration shown in FIG. 3, in the same manner as the device supply unit 14, two device collection portions 18 are arranged in the Y direction, and the IC device 90 on the inspection portion 16 is provided. It is transported and placed in any device recovery unit 18. This transfer is performed by the device transfer head 17.

The recovery area A4 is an area of a plurality of IC devices 90 for recycling inspection. A collection tray 19, a device transfer head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided in the collection area A4. Further, an empty tray 200 is also prepared in the collection area A4.

The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in FIG. 3, three collection trays 19 are arranged in the X direction. Further, three empty trays 200 are also arranged along the X direction. Then, the IC device 90 moved to the device recovery unit 18 of the recovery area A4 is transported and placed on any of the recovery trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified for each inspection result.

The device transfer head 20 is supported to be movable within the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction in the collection area A4. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be any one of the above three empty trays 200. As described above, in the inspection apparatus 1, the tray conveyance mechanism 21 is provided in the collection area A4, and the tray conveyance mechanism 15 is provided in the supply area A2. As a result, the amount of processing (the number of transports of the IC device 90 per unit time) can be improved as compared with the case where the empty tray 200 is transported in the X direction by one transport mechanism.

The tray removing area A5 collects and removes the material removing portion of the tray 200 in which the plurality of IC devices 90 in the inspection state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

Further, the tray transport mechanisms 22A and 22B that transport the trays 200 one by one are provided so as to span the collection area A4 and the tray removal area A5. The tray transport mechanism 22A transports the tray 200 on which the inspected IC device 90 is placed, from the recovery area A4 to the tray removal area A5. Agency. The tray transport mechanism 22B is a mechanism that transports the tray 200 for collecting the empty space of the IC device 90 from the tray removal area A5 to the collection area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, the tray transport mechanisms 11A and 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, the device transport head 17, the device recovery unit 18, and the device transport head 20. Driving of each of the tray transport mechanism 21 and the tray transport mechanisms 22A and 22B.

Further, the inspection control unit of the tester 600 checks the electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

In the inspection apparatus 1 as described above, the device transfer head 13, the device supply unit 14, and the device transfer head 17 can heat or cool the IC device 90 in addition to the temperature adjustment unit 12 or the inspection unit 16. Thereby, the IC device 90 can maintain the temperature constant during the transfer. In the following, a case will be described in which the IC device 90 is cooled, for example, in a low temperature environment within a range of -60 ° C to -40 ° C. In this case, the temperature adjustment unit 12 or the like is a part of the cooling IC device 90, and may be collectively referred to as a "cooling unit 30". The cooling configuration by the cooling unit 30 can be, for example, a configuration in which a flow path through which a refrigerant obtained by vaporizing liquid is passed is provided.

As shown in FIGS. 2 and 4, a tester arrangement space A6 for inserting and arranging the tester 600 is formed on the back side of the inspection apparatus 1. The tester configuration space A6 is located on the lower side of the supply area A2 and the inspection area A3. Further, the tester 600 has a test head 601 that is connected to the inspection unit 16 of the inspection area A3 in a state of being disposed in the tester arrangement space A6. Moreover, the IC device 90 on the inspection unit 16 can be inspected in this connected state. Furthermore, the test head 601 has a plurality of circuit boards for inspection for performing inspection of the IC device 90.

As shown in FIGS. 2 and 5, the inspection apparatus 1 includes a bottom plate 31 and an auxiliary plate (plate member) 32 that is disposed to be disposed below the bottom plate 31. Further, a first electric wire heater 331 and a second electric wire heater 332 as heat generating portions are disposed between the bottom plate 31 and the auxiliary plate 32.

As shown in FIG. 4, the bottom plate 31 is provided with a plate-like shape in which the cooling unit 30 such as the temperature adjustment unit 12 and the other device collection unit 18, the recovery tray 19, and the tray 200 are supported by the lower side. member. Further, the bottom plate 31 has an inspection portion arranging portion 29 for arranging and connecting the inspection portion 16. The inspection portion arrangement portion 29 is configured by an opening portion formed to penetrate the bottom plate 31 in the thickness direction (see FIG. 5). As a result, a part of the inspection unit 16 is housed inside the opening, and the amount of protrusion of the inspection unit 16 into the inspection area A3 can be suppressed in accordance with the degree of accommodation. Therefore, the degree of freedom of movement of the device transfer head 17 in the inspection area A3 is improved.

As described above, the tester 600 is inserted in the tester configuration space A6. Further, in this state, the test head 601 of the tester 600 is disposed on the lower portion of the bottom plate 31 in the vertical direction, and is electrically connected to the inspection portion 16. This connection from the lower side makes it easy to connect. Further, in the field of the semiconductor test apparatus, there is a case where the test head 601 connected to the inspection unit 16 includes the inspection unit 16.

As shown in FIG. 5, an auxiliary plate 32 is mounted on the lower surface of the bottom plate 31. The mounting method is not particularly limited, and examples thereof include a method of fixing a screw. Further, in the auxiliary plate 32, an opening portion 320 formed to penetrate the thickness direction is formed in a portion facing the inspection portion arranging portion 29 of the bottom plate 31.

The auxiliary plate 32 is a plate-shaped member that sandwiches the first electric wire heater 331 and the second electric wire heater 332 between the bottom plate 31 and the bottom plate 31. Thereby, the first electric wire heater 331 and the second electric wire heater 332 are fixed to the respective plates.

The constituent material of the bottom plate 31 and the auxiliary plate 32 is not particularly limited, and for example, a metal material such as aluminum can be used. The aluminum-based material which is easy to be machined is preferable in the manufacture of the bottom plate 31 or the auxiliary plate 32.

The thickness t _{1 of the} bottom plate 31 is not particularly limited, and is, for example, preferably 6 mm or more and 20 mm or less, and more preferably 10 mm or more and 16 mm or less. Thereby, the bottom plate 31 has strength to the extent that it can support the cooling portion 30.

As the thickness of the auxiliary plate 32 is t _2, the thickness t ₁ is preferably the same as or thinner than a thickness t _1. For example, the thickness t _{2 is} preferably 0.4 times or more and 1 time or less, more preferably 0.4 times or more and 0.8 times or less the thickness t ₁ . Thereby, the auxiliary plate 32 can sufficiently support the first electric wire heater 331 and the second electric wire heater 332, and also functions as a reinforcing material for the reinforcing bottom plate 31.

As shown in FIG. 4, the first electric wire heater 331 is disposed so as to surround the inspection portion arrangement portion 29 in plan view. Thereby, it is possible to preferentially (focus) the periphery of the inspection portion arranging portion 29 including the inspection portion 16.

As described above, in the inspection apparatus 1, the IC device 90 is inspected in a low temperature environment. In this case, although the inspection unit 16 is cooled, depending on the degree of humidity of the inspection area A3 at this time, condensation occurs in the inspection unit 16, or water droplets due to dew condensation drip up to the test head 601. This phenomenon sometimes causes the IC device 90 or the inspection portion 16 and the test head 601 to malfunction.

However, in the inspection apparatus 1, since the first electric wire heater 331 can be actuated during the cooling process of the inspection unit 16, the periphery of the inspection unit 16 can be heated to a temperature at which dew condensation can be prevented. Thereby, it is possible to prevent dew condensation from occurring around the inspection portion 16, and it is also possible to prevent water droplets from dripping onto the test head 601. Therefore, it is possible to prevent the inspection portion 16 or the test head 601 from malfunctioning.

In addition, the heating temperature of the first electric wire heater 331 is not particularly limited, and is preferably, for example, 15° C. or higher and 40° C. or lower, and more preferably 20° C. or higher and 30° C. or lower.

Moreover, as shown in FIG. 4, the second electric wire heater 332 is pulled straight below the temperature adjustment unit 12, the device supply unit 14, and the device recovery unit 18 as the cooling unit 30 in a plan view. Thereby, the periphery of the portion of the bottom plate 31 where the temperature adjustment portion 12 or the like is disposed can be preferentially heated.

When the inspection is performed in a low-temperature environment, the temperature adjustment unit 12 or the device supply unit 14 is also cooled as in the inspection unit 16, but condensation occurs at the temperature adjustment unit 12 or the like depending on the degree of humidity at this time. After that. This phenomenon sometimes causes the IC device 90 to malfunction.

However, in the inspection apparatus 1, the second electric wire heater 332 can be actuated during the cooling process by the temperature adjustment unit 12 or the like, whereby condensation can be prevented from occurring. Therefore, the malfunction of the IC device 90 can also be prevented.

In addition, the heating temperature of the second electric wire heater 332 can be set as the heating temperature of the first electric wire heater 331, but the first electric wire heater 331 and the second electric wire heater 332 are different from each other. It is set to be different from the heating temperature of the first electric wire heater 331. When the heating temperature of the second electric wire heater 332 is different from the heating temperature of the first electric wire heater 331, the heating temperature is preferably 20° C. or higher and 40° C. or lower, and more preferably 20° C. or higher and 30° C. or lower. .

The second electric wire heater 332 is a crotch portion 333 which is disposed in a meandering shape immediately below the temperature adjusting portion 12. Thereby, it is possible to ensure that the heating area corresponding to the temperature adjustment unit 12 is as wide as possible, and therefore, it is possible to shorten the time during which the heating can be prevented from occurring at the temperature at which the temperature adjustment unit 12 generates dew condensation. Further, the temperature adjustment unit 12 can be uniformly heated.

The first electric wire heater 331 and the second electric wire heater 332 are not particularly limited, and for example, a nickel-chromium alloy wire having a spiral shape and a polyoxynitride rubber coated with a nichrome wire can be used. With this configuration, the first electric wire heater 331 and the second electric wire heater 332 can generate heat by energization.

In addition, the electric wire heater having such a configuration is used as a heat generating portion, and the heat generating portion is a linear body having flexibility and a linear shape. Thereby, the traction (wiring) of each of the first electric wire heater 331 and the second electric wire heater 332 can be easily performed in the inspection apparatus 1.

As shown in FIG. 5, a first groove portion 321 into which the first electric wire heater 331 is inserted and a second groove into which the second electric wire heater 332 is inserted are formed on the upper surface of the auxiliary plate 32, that is, the surface on the bottom plate 31 side. Part 322. Thereby, the shape of the first electric wire heater 331 and the second electric wire heater 332, that is, the traction is restricted, and deformation with time can be prevented. Therefore, it is possible to favorably heat the portion to be heated by the respective wire heaters.

Further, the first electric wire heater 331 and the second electric wire heater 332 are disposed on the bottom plate 31. Lower surface side. Thereby, each of the electric wire heaters is blocked by the bottom plate 31, and therefore, for example, the device transfer head 17 can be prevented from being caught by the electric wire heater.

As described above, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described with reference to the embodiments shown in the drawings. However, the present invention is not limited thereto, and each of the electronic component conveying apparatus and the electronic component inspection apparatus can be configured and Each part of the arbitrary configuration that performs the same function is replaced. Further, any constituent may be added.

Further, in the above embodiment, the auxiliary plate is attached from the lower surface side of the bottom plate. However, the present invention is not limited thereto, and the auxiliary plate may be attached from the upper surface side of the bottom plate.

Further, in the above embodiment, the auxiliary plate in the bottom plate and the auxiliary plate is formed with a groove portion for arranging the heat generating portion. However, the present invention is not limited thereto, and the groove portion may be formed in the bottom plate.

Further, in the above embodiment, the heat generating portion is disposed on the lower surface of the bottom plate. However, the heat generating portion is not limited thereto, and may be disposed on the upper surface of the bottom plate or may be disposed on both surfaces of the bottom plate.

In the above embodiment, the first electric wire heater and the second electric wire heater are different from each other. However, the present invention is not limited thereto, and may be one continuous electric wire heater.

Further, in the above-described embodiment, the electric wire heater is used as the heat generating portion. However, the electric wire heater is not limited thereto, and may be, for example, a planar heater or a rod heater, or may be a hot air heater.

1‧‧‧Inspection device (electronic parts inspection device)

12‧‧‧ Temperature adjustment section (soaking plate)

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department (Supply Shuttle)

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧Device Transfer Head

29‧‧‧ Inspection Department Configuration Department

30‧‧‧ Cooling Department

31‧‧‧floor

80‧‧‧Control Department

200‧‧‧Tray (configuration component)

321‧‧‧1st groove

322‧‧‧2nd groove

331‧‧‧1st wire heater

332‧‧‧2nd wire heater

333‧‧‧蜿蜒

600‧‧‧Tester

601‧‧‧ test head

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

A6‧‧‧Tester configuration space

Claims (7)

An electronic component conveying apparatus comprising: a cooling unit that cools an electronic component; a bottom plate that houses the cooling unit; and a heat generating portion that heats the bottom plate; and the heat generating portion is disposed on a plate in which the groove portion is formed In the groove portion of the member, the plate member is attached to the bottom plate. The electronic component transporting apparatus of claim 1, wherein the bottom plate is provided with a connecting portion that connects the inspection portion for inspecting the electronic component. The electronic component transport apparatus of claim 2, wherein the heat generating portion is disposed to surround the connecting portion. The electronic component transport apparatus according to any one of claims 1 to 3, wherein the test head including the inspection unit is disposed at a lower portion of the bottom plate in the vertical direction. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the heat generating portion is a wire heater. The electronic component transporting apparatus of claim 5, wherein the electric wire heater is disposed in a meandering shape. An electronic component inspection apparatus characterized by comprising: a cooling portion that cools an electronic component; a bottom plate for arranging the cooling portion; a heat generating portion that heats the bottom plate; and an inspection portion that inspects the electronic component; and the heat generation The portion is disposed in the groove portion of the plate member in which the groove portion is formed, and the plate member is attached to the bottom plate.