TW201604107A - Conveyance device of electronic parts and inspection device of electronic parts - Google Patents

Abstract

The present invention provides an inspection device of electronic parts that comprises: a component recovery section for accommodating IC components; a recovery tray, which is arranged at a site that is different from the component recovery section for accommodating IC components; a base, which is movable between the component recovery section and the recovery tray; a first gripping section, which is supported on the base for gripping IC components; and a second gripping section supported on the base for gripping IC components. When the electronic parts inspection device is in a condition of moving IC components from the component recovery section to the recovery tray, after the first gripping section releases the IC components, the second gripping section is used to grip the IC component.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

Conventionally, it has been known to use a transfer device that transports the component from the first region to the second region in the manufacturing process of manufacturing various components such as an electronic component or a wafer.

For example, Patent Document 1 discloses a transfer system in which a transfer robot is provided between a first transfer station and a second transfer table, and the transfer robot has a hand that grips a substrate as the component.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-83700

However, in the invention described in Patent Document 1, there is a case where the movable range of the transfer robot has a limit depending on the mutual positional relationship between the first transfer table, the second transfer table, and the transfer robot. In this case, for example, when the substrate transported by the first transfer station is transported and placed on the second transfer station, there is a problem in that the arrangement position on the second transfer stage is limited, that is, the second transfer stage is generated. Unable to configure the part.

An object of the present invention is to provide an electronic component transport apparatus and an electronic component inspection capable of arranging electronic components regardless of the arrangement position of the second placement portion when the electronic component is transported from the first placement portion and disposed in the second placement portion. Device.

This object is achieved by the present invention described below.

[Application Example 1]

The electronic component conveying apparatus according to the present invention includes: a first arrangement portion for arranging electronic components; and a second arrangement portion provided at a position different from the first arrangement portion, and arranging the electronic component; the base portion; The first grip portion supports the base portion and grips the electronic component; and the second grip portion supports the base portion to grip the electronic component; and the electronic component is from the above When the arrangement portion is transported to the second arrangement portion, the electronic component is grasped by the second grip portion after the first grip portion is released from the electronic component.

By this means, when the electronic component is transported from the first arrangement portion and placed in the second arrangement portion, the electronic component can be switched from the first grip portion to the second grip portion during the transfer. Whether or not to perform the switching gripping operation can be selected based on the arrangement position of the second placement unit as the transfer destination. Thereby, the electronic component can be disposed regardless of the arrangement position of the second arrangement portion.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component is disposed in the second gripping portion so that the second gripping portion cannot be disposed at an arrangement position of the second placement portion of the electronic component.

Thereby, it is possible to select whether or not to perform the switching operation of the electronic component based on the arrangement portion of the electronic component of the second placement portion.

[Application Example 3]

In the electronic component conveying device of the present invention, preferably, the first gripping portion and the upper portion The arrangement direction of the second grip portion is the same as the arrangement direction of the first arrangement portion and the second arrangement portion.

Therefore, for example, when the direction of the former is orthogonal to the direction of the latter, it is preferable to rotate one of the electronic components by 90 degrees with respect to the other in the middle of the conveyance of the electronic component, but the mechanism for such rotation can be omitted.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, it is preferable that a plurality of the second arrangement portions are disposed in the same direction as the direction, and the electronic component is disposed in the plurality of second arrangement portions. The 1 placement unit is the second placement unit at the far end.

As a result, there is a case where the movement limit of the distal end base portion is restricted, and the configuration of the electronic component in the second arrangement portion having such a restriction is formed.

[Application 5]

In the electronic component conveying apparatus of the present invention, it is preferable that the third component is provided in a position different from the first placement portion and the second placement portion, and the electronic component is disposed. When the electronic component is placed in the first grip portion, the electronic component is placed in the third placement portion, and the electronic component disposed in the third placement portion is gripped by the second grip portion. .

With this configuration, the electronic component can be switched and gripped while the electronic component is placed in the third placement portion. Therefore, the operation can be performed accurately and stably.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, preferably, the plurality of first placement portions are disposed, and the third placement portion is disposed between the first placement portion and the other first placement portion. .

Since the third arrangement portion is disposed equidistant from any of the first arrangement portions, the time from the first arrangement portion to the third arrangement portion can be shortened, which contributes to an improvement in the amount of processing.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, preferably, after the at least one inspection of the electronic component is completed, the electronic component is transferred from the first placement portion to the second placement portion.

After the inspection, there are cases where there are multiple parts for the classification of the inspection results. In this case, there is a case where the second arrangement portion that is also a portion where the movement limit of the base is restricted is also effective.

[Application Example 8]

An electronic component inspection apparatus according to the present invention includes: a first arrangement portion for arranging electronic components; and a second arrangement portion provided at a position different from the first arrangement portion, and arranging the electronic component; the base portion; The first gripping portion supports the base portion and grips the electronic component; the second gripping portion supports the base portion to grip the electronic component; and the inspection portion checks the electronic component; In the electronic component inspection device, when the electronic component is transferred from the first placement portion to the second placement portion, the electronic component can be switched from the first grip portion to the second grip portion. Hold the department.

By this means, when the electronic component is transported from the first arrangement portion and placed in the second arrangement portion, the electronic component can be switched from the first grip portion to the second grip portion during the transfer. Whether or not to perform the switching gripping operation can be selected based on the arrangement position of the second placement portion as the transport destination. Thereby, the electric power can be configured regardless of the arrangement position of the second arrangement portion. Subparts.

1‧‧‧Inspection device (electronic parts inspection device)

11A, 11B‧‧‧Tray transport mechanism

12‧‧‧ Temperature adjustment section (soaking plate)

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department (Supply Shuttle)

15‧‧‧Tray transport mechanism

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18, 18A‧‧‧Device Recycling Department (Recycling Shuttle)

19, 19A‧‧‧Recycling tray

20‧‧‧Device Transfer Head

21‧‧‧Tray transport mechanism

22A, 22B‧‧‧Tray transport mechanism

23‧‧‧ Temporary Configuration Department (Pending Department)

70‧‧‧ front cover

71‧‧‧ side cover

72‧‧‧ side cover

73‧‧‧ Rear cover

80‧‧‧Control Department

90‧‧‧IC devices

181, 181a‧‧ recesses (dents)

191, 191a‧‧ ‧ recesses (dents)

200‧‧‧Tray

201‧‧‧ base

202, 202a, 202b, 202c, 202d‧‧‧ gripping department

231‧‧‧ recess (dent)

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

Fig. 1 is a schematic plan view showing an embodiment of an electronic component inspection device according to the present invention.

FIG. 2 is a conceptual diagram for explaining an operation of transporting an electronic component from the first arrangement portion to the second arrangement portion in the electronic component inspection device shown in FIG. 1 in order.

FIG. 3 is a conceptual diagram for explaining an operation of transporting electronic components from the first arrangement portion to the second arrangement portion in the electronic component inspection device shown in FIG. 1 in order.

FIG. 4 is a conceptual diagram for explaining an operation of transporting an electronic component from the first arrangement portion to the second arrangement portion in the electronic component inspection device shown in FIG. 1 in order.

FIG. 5 is a conceptual diagram for explaining an operation of transporting electronic components from the first arrangement portion to the second arrangement portion in the electronic component inspection device shown in FIG. 1 in order.

FIG. 6 is a conceptual diagram for explaining an operation of transporting electronic components from the first arrangement portion to the second arrangement portion in the electronic component inspection device shown in FIG. 1 in order.

FIG. 7 is a conceptual diagram for explaining an operation of transporting an electronic component from the first arrangement portion to the second arrangement portion in the electronic component inspection device shown in FIG. 1 in order.

FIG. 8 is a conceptual diagram for explaining an operation of transporting an electronic component from the first arrangement portion to the second arrangement portion in the electronic component inspection device shown in FIG. 1 in order.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.

Fig. 1 is a schematic plan view showing an embodiment of an electronic component inspection device according to the present invention. FIG. 2 to FIG. 8 are conceptual diagrams for explaining the operation of transporting the electronic component from the first arrangement portion to the second arrangement portion in the electronic component inspection device shown in FIG. 1 in order. In the following description, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis (first axis), a Y-axis (second axis), and a Z-axis (third axis). Also, the XY plane including the X-axis and the Y-axis becomes horizontal, Z The shaft becomes plumb. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". In addition, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side of the conveyance direction of the electronic component is also simply referred to as "downstream side". Further, the "level" in the specification of the present invention is not limited to a complete level, and includes a state in which the level is slightly inclined (for example, less than 5 degrees) as long as it does not interfere with the conveyance of the electronic component.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used, for example, for an IC such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package ( Electrical characteristics of electronic components such as integrated circuit, integrated circuit display device, LCD (Liquid Crystal Display), CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, CMOS image sensor) checking. Test (hereinafter referred to as "inspection") device. In the following, for the sake of convenience of explanation, a case where an IC device is used as the above-described electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 90".

As shown in Fig. 1, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter simply referred to as "recycling area") A4, and a tray. Area A5 is removed. Further, the IC device 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5 via the above-described respective areas and in the inspection area A3 in the middle. In this way, the inspection apparatus 1 is an electronic component transport apparatus including the IC transport unit 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 80.

Further, the side of the inspection apparatus 1 in which the tray supply area A1 and the tray removal area A5 are disposed (the lower side in FIG. 1) is used as the front side, and the side opposite to the inspection area A3 is disposed on the opposite side (Fig. The upper side of 1 is used as the back side.

The tray supply area A1 supplies a plurality of IC devices 90 arranged in an unchecked state. The area of the tray 200. A plurality of trays 200 can be stacked in the tray supply area A1.

The supply area A2 supplies a plurality of IC devices 90 disposed on the tray 200 from the tray supply area A1 to the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

A temperature adjustment unit (soak plate) 12, a device transfer head 13, and a tray transfer mechanism (first transfer device) 15 are provided in the supply region A2.

The temperature adjustment unit 12 is a device that heats or cools a plurality of IC devices 90 to adjust the IC device 90 to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjustment portions 12 are disposed and fixed in the Y direction. Further, the IC device 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed on any of the temperature adjustment units 12.

The device transfer head 13 is supported to be movable within the supply area A2. Thereby, the device transfer head 13 can be responsible for the transfer of the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 described below. The transfer.

The tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in the X direction in a state where all of the IC devices 90 are removed. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

The inspection area A3 is an area in which the IC device 90 is inspected. A device supply unit (supply shuttle) 14, an inspection unit 16, a device transfer head 17, and a device collection unit (recycling shuttle) 18 are provided in the inspection area A3.

The device supply unit 14 transports the temperature-adjusted IC device 90 to a device in the vicinity of the inspection unit 16. The device supply portion 14 is supported to be movable between the supply region A2 and the inspection region A3 in the X direction. Further, in the configuration shown in Fig. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported and placed on either device supply. Part 14.

Inspection Department 16 is inspected. A unit that tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 while holding the IC device 90. Each of the probe pins is electrically connected to an inspection circuit portion of the tester connected to the inspection unit 16. Moreover, the terminals of the IC device 90 are electrically connected (contacted) to the probe pins, and the IC device 90 is inspected via the probe pins. The inspection of the IC device 90 is performed based on the program stored in the above-described inspection control unit. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to control the IC device 90 to a temperature suitable for inspection.

The device transfer head 17 is supported to be movable within the inspection area A3. Thereby, the device transfer head 17 can transport and mount the IC device 90 on the device supply unit 14 carried in from the supply region A2 to the inspection unit 16.

The device recovery unit 18 is a device that transports the IC device 90 that has finished the inspection of the inspection unit 16 to the collection area A4. The device recovery portion 18 is supported to be movable between the inspection region A3 and the recovery region A4 in the X direction. Further, in the configuration shown in FIG. 1, in the same manner as the device supply unit 14, two device collection units 18 are arranged in the Y direction, and the IC device 90 on the inspection unit 16 is transported and placed in any device recovery unit. 18. This transfer is performed by the device transfer head 17.

The recovery area A4 is an area of the IC device 90 for recycling inspection. A collection tray 19, a device transfer head 20, and a tray conveyance mechanism 21 are provided in the collection area A4. Further, an empty tray 200 is also prepared in the collection area A4.

The recovery tray 19 is fixed in the collection area A4. In the configuration shown in Fig. 1, three recovery trays 19 are arranged in the X direction. Further, three empty trays 200 are also arranged along the X direction. Then, the IC device 90 moved to the device recovery unit 18 of the recovery area A4 is transported and placed on any of the recovery trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified for each inspection result.

The device transfer head 20 is supported to be movable within the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X direction. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be one of the above three empty trays 200.

The tray removal area A5 collects and removes the area of the tray 200 of the plurality of IC devices 90 in which the inspection state is arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

Further, the tray transport mechanisms 22A and 22B that transport the trays 200 one by one are provided so as to span the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, the tray transport mechanisms 11A and 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, the device transport head 17, the device recovery unit 18, and the device transport head 20. Driving of each of the tray transport mechanism 21 and the tray transport mechanisms 22A and 22B.

In addition, the inspection control unit of the tester checks the electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

Further, the outermost portion of the inspection device 1 is covered by a cover (wall portion) having, for example, a front cover 70, side covers 71 and 72, and a rear cover 73.

In addition, the present invention is characterized in that the IC device 90 is transported from the first arrangement portion and placed in the second arrangement portion. In the present embodiment, the case where the IC device 90 is transported from the device collecting portion 18 and disposed in the collecting tray 19 in the recovery area A4 will be described as an example. In this case, the device collection unit 18 becomes the "first placement unit". The collection tray 19 serves as a "second arrangement portion". In addition, the device recovery unit 18 (hereinafter referred to as "device recovery unit 18A") on the positive side of the Y-axis in the device recovery unit 18 is used. On the other hand, although three collection trays 19 are provided, the collection tray 19 (hereinafter referred to as "recycling tray 19A") located on the most X-axis positive side of the collection trays 19 is used.

As shown in FIG. 2 to FIG. 8, in the present embodiment, the device collecting portion 18 has four recesses (pits) 181 arranged in the X direction (the horizontal direction in the drawing). The IC device 90 can be disposed and housed in the recess 181.

In the present embodiment, the recovery tray 19 has a matrix (recess) 191 arranged in a matrix of three rows in the X direction and five rows in the Y direction. The IC device 90 can also be disposed and housed in the recess 191.

Moreover, when the IC device 90 is transferred from the device collection unit 18 to the collection tray 19, the device transfer head 20 is used. In the present embodiment, the device transport head 20 includes a base 201 that is movable between the device recovery portion 18 and the recovery tray 19, and four grip portions 202 that are supported by the base 201 to grasp the IC device. 90. The four gripping portions 202 are arranged along the X-axis direction, and are referred to as "grip portion 202a", "grip portion 202b", "grip portion 202c", and "grip" in order from the negative side to the positive side. Part 202d".

As will be described later, in the inspection apparatus 1, one of the grip portions 202a to 202d grips the IC device 90 first. The grip portion 202 can be referred to as a "first grip portion". Further, among the grip portions 202a to 202d, the remaining grip portions 202 other than the first grip portion may be referred to as "second grip portions".

Furthermore, the device transfer head 20 is preferably configured such that the adjacent grip portions 202 are spaced apart from each other. Moreover, the configuration of each grip portion 202 is not particularly limited, and for example, it may be configured to have a suction pad that can be gripped by suction.

In this description, attention is paid to one IC device 90. As shown in FIG. 2, the IC device 90 is housed in a concave portion 181 of the device recovery portion 18A on the negative side of the X-axis (hereinafter referred to as "concave". Part 181a"). Further, the IC device 90 is housed in the remaining concave portion 181 excluding the concave portion 181a. Further, as shown in FIG. 3 or FIG. 8, the IC device 90 in the concave portion 181a faces the concave portion 191 on the positive side of the most positive X-axis and the most positive side of the Y-axis of the collection tray 19A (hereinafter referred to as "the concave portion 191a". ") and moved.

As shown in FIG. 2, the grip portion 202a of the device transfer head 20 is brought close to and abuts on the IC device 90 in a state of being housed in the recess portion 181a of the device recovery portion 18A. Thereby, the IC device 90 is grasped. Further, the movement of the device recovery portion 18A toward the recovery area A4 has a limit at which the IC device 90 is gripped by the device transfer head 20.

Thereafter, as shown in FIG. 3, the grip portion 202a of the device transfer head 20 conveys the IC device 90 toward the positive side of the X-axis, that is, the concave portion 191a of the recovery tray 19A, while gripping the IC device 90. However, the movement of the device transfer head 20 toward the positive side of the X-axis has a limit, and even if it is moved to the movement limit, the IC device 90 cannot be disposed in the concave portion 191a. The term "movement limit" as used herein refers to the extreme position at which the collision of the device transfer head 20 with the side cover 72 is avoided.

In such normal transportation, it is difficult to arrange the IC device 90 based on the arrangement portion of the IC device 90 on the recovery tray 19A. Further, if the IC device 90 is to be placed in the concave portion 191a by normal transportation, the device transfer head 20 must be moved to a position where the grip portion 202a reaches the concave portion 191a, and the width of the inspection device 1 in the X direction is It increases correspondingly to the amount of movement. Therefore, the size of the inspection apparatus 1 is increased.

Therefore, in the inspection apparatus 1, in order to prevent the IC device 90 from being difficult to be placed at the transfer destination, a temporary placement unit (temporary portion) 23 is provided in the middle of the transfer of the IC device 90, and the temporary placement unit 23 is temporarily provided. The third configuration portion of the IC device 90 is configured. The temporary placement unit 23 is provided at a position different from the device collection unit 18A and the recovery tray 19A. In particular, it is preferably provided between the two device collection units 18 adjacent in the Y direction. Thereby, since the temporary placement unit 23 is disposed equidistant from any of the device collection units 18, the transfer time from the device collection unit 18 to the temporary placement unit 23 can be shortened. The shortening of the transfer time contributes to an improvement in the throughput of the inspection apparatus 1.

Further, the temporary placement portion 23 has a matrix (cavity) 231 arranged in a matrix of two rows in the X direction and two rows in the Y direction. The IC device 90 can be disposed and housed in the recess 231.

Next, the order in which the temporary placement unit 23 is transported will be described.

As shown in FIG. 2, as shown in FIG. 4, the device transfer head 20 conveys and arranges the IC device 90 in a state where the grip portion 202a (first grip portion) grips the IC device 90. The specific concave portion 231 of the portion 23 is temporarily disposed.

Then, as shown in FIG. 5, the grip portion 202a releases the grip on the IC device 90.

Then, as shown in FIG. 6, the device transfer head 20 is moved to the negative side of the X-axis so that the grip portion 202d faces the directly above the IC device 90.

As shown in FIG. 7, the device transfer head 20 brings the grip portion 202d (second grip portion) of the device transfer head 20 close to and abuts against the IC device 90. Thereby, the IC device 90 is gripped by the grip portion 202d.

Then, as shown in FIG. 8, the device transfer head 20 conveys the IC device 90 toward the positive side of the X-axis, that is, the concave portion 191a of the recovery tray 19A in a state where the grip portion 202d grips the IC device 90. Similarly to the moving direction of the device transport head 20, the grip portion 202d is the one closest to the X-axis of the grip portions 202a to 202d. Thereby, even if the device transfer head 20 is not moved to the movement limit, the IC device 90 gripped by the grip portion 202d can be opposed to the upper side of the concave portion 191a. Thereafter, the device transfer head 20 disposes the IC device 90 in the concave portion 191a, and the grip portion 202d releases the grip on the IC device 90.

When the IC device 90 is transferred from the recessed portion 181a of the device collecting portion 18A to the recessed portion 191a of the collecting tray 19A by the above-described transporting sequence, the IC device 90 can be gripped from the gripping portion of the device transporting head 20 202a is switched to be grasped by the grip portion 202d. Here, the term "capable" means determining whether or not to perform the handover grip based on the status of the destination of the transfer, and based on the result of the determination, switching the grip when the grip is required to be switched.

As described above, the IC device 90 cannot be transported from the concave portion 181a of the device collecting portion 18A to the concave portion 191a of the collecting tray 19A by using only the grip portion 202a of the device transfer head 20. This is because the concave portion 191a is a position where the grip portion 202a cannot be placed with the IC device 90, that is, the grip The position where the holding portion 202a cannot reach. The IC device 90 can be placed at such a position by the grip portion 202d. Therefore, in the inspection apparatus 1, when it is determined that the IC device 90 is disposed at a position where the one grip portion 202 cannot be disposed, the transport sequence in which the arrangement can be performed is implemented. Of course, if the IC device 90 can be placed at the transfer destination using only one grip portion 202, the execution of the transfer sequence can be omitted. Thereby, the IC device 90 can be disposed regardless of the arrangement position of the IC device 90 of the recovery tray 19A.

When the IC device 90 is switched, the IC device 90 is temporarily placed in the temporary placement portion 23, and the gripping portion 202a is switched to the grip portion 202d. Thereby, the switching operation of the IC device 90 can be performed accurately and stably.

Moreover, the arrangement direction of the grip portion 202a and the grip portion 202d is the same as the arrangement direction of the device collection portion 18A and the recovery tray 19A. Therefore, for example, when the direction of the former is orthogonal to the direction of the latter, it is preferable to rotate one of the ones in the middle of the conveyance by 90 degrees with respect to the other, but the mechanism for such rotation can be omitted.

Further, in the inspection apparatus 1, the IC device 90 is disposed in the collection tray 19A on the distal end side of the three collection trays 19 from the device collection portion 18A. In general industrial machinery, in most cases, the mobile limit is limited in such a way that the farther away from the center is within the drive system. Similarly to the inspection apparatus 1, the IC device 90 is disposed in the recovery tray 19A whose movement limit of the device transfer head 20 is limited. The transfer order is valid for this configuration.

Moreover, the transport order is used at the time of transport of the IC device 90 after the inspection. After the inspection, there are cases where the classification of the inspection result has a plurality of parts (six in the configuration shown in FIG. 1). In this case, the sorting tray 19A, which is a portion where the movement limit of the device transport head 20 is restricted, is also classified, so that the transport order is effective.

As described above, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described with reference to the embodiments shown in the drawings. However, the present invention is not limited thereto, and each of the electronic component conveying apparatus and the electronic component inspection apparatus can be configured and Play the same function Each part of the composition is replaced. Further, any constituent may be added.

In the case where the IC device is transferred from the first arrangement portion to the second arrangement portion, the operation of switching the IC device from the first grip portion to the second grip portion is described in the above embodiment. Although it is carried out in the collection area, it is not limited to this, and it can carry out, for example, in a supply area or an inspection area.

In the above-described embodiment, the IC device is temporarily placed in the third arrangement portion. However, the present invention is not limited thereto, and the first grip portion may be used without the third arrangement portion. The switching gripping operation is directly performed between the second gripping portions.

Further, the temporary arrangement portion may be configured to be movable in at least one of the X direction, the Y direction, and the Z direction.

1‧‧‧Inspection device (electronic parts inspection device)

18, 18A‧‧‧Device Recycling Department (Recycling Shuttle)

19, 19A‧‧‧Recycling tray

20‧‧‧Device Transfer Head

23‧‧‧ Temporary Configuration Department (Pending Department)

72‧‧‧ side cover

90‧‧‧IC devices

181, 181a‧‧ recesses (dents)

191, 191a‧‧ ‧ recesses (dents)

201‧‧‧ base

202, 202a‧‧‧ gripping department

231‧‧‧ recess (dent)

A4‧‧‧Device recycling area (recycling area)

Claims (8)

An electronic component conveying apparatus comprising: a first arrangement portion for arranging electronic components; and a second arrangement portion provided at a position different from the first arrangement portion, wherein the electronic component is disposed; and a base portion is provided Movable; a first gripping portion supported by the base portion to grip the electronic component; and a second gripping portion supported by the base portion to grip the electronic component; and the electronic component from the first When the arranging unit is transported to the second arranging unit, the electronic component is gripped by the first gripping unit, and the electronic component is gripped by the second gripping unit. The electronic component transporting apparatus according to claim 1, wherein the electronic component is disposed at an arrangement position of the second placement portion in which the electronic component cannot be disposed in the first gripping portion by the second gripping portion. The electronic component transport apparatus according to claim 1 or 2, wherein an arrangement direction of the first grip portion and the second grip portion is the same as an arrangement direction of the first placement portion and the second arrangement portion. The electronic component conveying apparatus according to claim 3, wherein the plurality of second arrangement portions are disposed in the same direction as the direction, and the electronic component is disposed in the plurality of second arrangement portions from the first arrangement portion It is the second configuration part of the remote end. The electronic component conveying apparatus according to any one of claims 1 to 4, further comprising: a third arrangement unit, wherein the third arrangement unit is provided at a position different from the first arrangement unit and the second arrangement unit, and is disposed An electronic component, and when switching to grasp the electronic component, the electronic component is removed in the first grip portion After being placed in the third arrangement portion, the second grip portion grips the electronic component disposed in the third placement portion. The electronic component transport apparatus according to claim 5, wherein the plurality of first arrangement portions are disposed, and the third arrangement portion is disposed between the first arrangement portion and the other first arrangement portion. The electronic component conveying apparatus according to any one of claims 1 to 6, wherein the electronic component is transferred from the first placement portion to the second placement portion after at least one inspection of the electronic component is completed. An electronic component inspection apparatus comprising: a first arrangement portion for arranging electronic components; and a second arrangement portion provided at a position different from the first arrangement portion, wherein the electronic component is disposed; and a base portion is provided a movable portion; the first grip portion supports the electronic component; the second grip portion supports the electronic component; and the inspection portion checks the electronic component; and The electronic component inspection device is configured to switch the electronic component from the first gripping unit to the second gripping unit when the electronic component is transferred from the first placement portion to the second placement portion. The department is holding.