TW201634942A - Electronic component transfer device and electronic component inspection device - Google Patents

Abstract

An object of the present invention is to provide an electronic component transfer device and an electronic component inspection device capable of easily, quickly and accurately positioning an electronic component gripping part (or an electronic component) and an electronic component holding part, and saving space between the electronic component gripping and the electronic component holding part. An electronic component transfer device of the present invention comprises: an electronic component gripping part for gripping an electronic component; an electronic component holding part for holding the electronic component; a first imaging part for shooting an image of the electronic component gripped by the electronic component gripping part; a second imaging part for shooting an image of the electronic component holding part and capable of shooting in a direction different from that of the first imaging part; and a reflection part arranged between the electronic component gripping part and the electronic component holding part and having a first reflective surface and a second reflective surface different from the first reflective surface. The first imaging part can shoot at least a portion of an image of the electronic component reflected by the first reflective surface. The second imaging part can shoot at least a portion of an image of the electronic component holding part reflected by the second reflective surface.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

An electronic component inspection apparatus for inspecting electrical characteristics of an electronic component such as an IC component has been known. In the electronic component inspection apparatus, an electronic component conveying apparatus for transporting an IC component to a holding portion of an inspection unit is assembled. At the time of inspection of the IC element, the IC element is placed in the holding portion, and the plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC element.

The electronic component transporting apparatus includes a heat equalizing plate that heats or cools the IC component beforehand to adjust the IC component to a temperature suitable for inspection, and a supply shuttle that transports the IC component adjusted by the heat equalizing plate to the inspection unit. In the vicinity of the first element transfer head, the IC element between the tray of the IC component and the heat equalizing plate is transported, and the IC component between the heat equalizing plate and the supply shuttle is transported; the shuttle is transported and inspected. The IC component, the second component transfer head, the IC component transfer between the supply shuttle and the inspection unit, and the transfer of the IC component between the inspection unit and the recovery shuttle, and the third component transfer head, etc., are collected. Transfer of the IC component between the shuttle and the tray of the IC component to be collected.

Further, Patent Document 1 discloses that a mirror having a meander shape is disposed between the grip member and the IC socket, and the upper and lower images are reflected in one direction by the two reflecting surfaces of the mirror, and the image is captured by an electronic camera. The component is positioned at the processor of the IC socket. In this processor, images can be efficiently obtained.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-108990

However, in the processor described in Patent Document 1, since a mirror having a meander shape is used, a large space must be provided between the grip member and the IC socket, which causes a problem of an increase in size of the device.

The present invention has been made to solve at least some of the above problems, and can be realized as the following aspects or application examples.

[Application Example 1]

An electronic component transporting apparatus according to the present invention includes an electronic component gripping portion that holds an electronic component, an electronic component holding portion that holds an electronic component, and a first imaging unit that can capture an electronic component held by the electronic component gripping portion a second imaging unit that can image the electronic component holding unit and capture a direction different from the first imaging unit, and a reflection unit that is disposed between the electronic component holding unit and the electronic component holding unit. a first reflecting surface and a second reflecting surface different from the first reflecting surface; wherein the first imaging unit can capture a small portion of the image of the electronic component reflected by the first reflecting surface; and the second imaging unit can capture the image An image of at least a part of the electronic component holding portion reflected by the second reflecting surface.

Thereby, in the positioning of the electronic component holding portion (or the electronic component) with respect to the electronic component holding portion (or the positioning of the electronic component holding portion and the electronic component holding portion), the electronic component held by the electronic component holding portion can be simultaneously obtained. Location information and location of the electronic parts retention department Information, whereby the above positioning can be performed simply, quickly and correctly, that is, the positioning can be performed. Hereinafter, the positioning of the electronic component holding portion (or the electronic component) with respect to the electronic component holding portion (or the positioning of the electronic component holding portion and the electronic component holding portion) is also simply referred to as "positioning".

In addition, the reflecting portion is formed to have a first reflecting surface and a second reflecting surface disposed on the back surface of the first reflecting surface, thereby saving space between the electronic component holding portion and the electronic component holding portion. Moreover, the device can be miniaturized.

[Application Example 2]

In the electronic component transport apparatus of the present invention, it is preferable that the electronic component and the electronic component holding portion are positioned based on an imaging result of the first imaging unit and an imaging result of the second imaging unit.

Thereby, positioning can be performed easily, quickly, and correctly.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, it is preferable that a plurality of the electronic component holding portions are disposed, and the positioning system is performed for each of the electronic component holding portions.

Thereby, positioning can be performed with high precision.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, it is preferable that an angle between a normal line of the first reflecting surface and a normal line of the second reflecting surface is 0°.

Thereby, the reflection portion can be downsized, and the space between the electronic component holding portion and the electronic component holding portion can be saved.

[Application 5]

In the electronic component transport apparatus of the present invention, it is preferable that the first imaging unit and the second imaging unit are disposed so that the electronic component gripping portion and the electronic component holding portion are in contact with each other, and the electronic component can be imaged. The direction between the grip portion and the electronic component holding portion.

Thereby, the first imaging unit and the second imaging unit can be disposed on the non-interference electronic component The position of the grip portion or the electronic component holding portion prevents the first imaging unit and the second imaging unit from becoming obstacles.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, preferably, the reflecting portion is movable between a first position between the electronic component gripping portion and the electronic component holding portion and a second position different from the first position. .

Thereby, after the positioning, the reflection portion can be prevented from becoming an obstacle.

[Application Example 7]

An electronic component inspection device according to the present invention includes an electronic component holding portion that holds an electronic component, an electronic component holding portion that holds an electronic component, and a first imaging portion that can capture an electronic component held by the electronic component holding portion a second imaging unit that can image the electronic component holding unit and capture a direction different from the first imaging unit, and a reflection unit that is disposed between the electronic component holding unit and the electronic component holding unit. a first reflecting surface and a second reflecting surface different from the first reflecting surface; and an inspection unit that inspects the electronic component; wherein the first imaging unit can capture a small portion of the electronic component reflected by the first reflecting surface The second imaging unit can image an image of at least a part of the electronic component holding portion reflected by the second reflecting surface.

Thereby, in the positioning, the position information of the electronic component held by the electronic component gripping portion and the position information of the electronic component holding portion can be simultaneously obtained, whereby the positioning can be performed simply, quickly and accurately, that is, the positioning can be performed. .

Further, the reflecting portion is formed to have a first reflecting surface and a second reflecting surface disposed on the back surface of the first reflecting surface, thereby saving the electronic component holding portion and the electronic component. The space between the holding portions can be reduced, and the size of the device can be reduced.

1‧‧‧Inspection device (electronic parts inspection device)

4‧‧‧Mobile agencies

5‧‧‧Reflection Department

6‧‧‧Operation Department

11A‧‧‧1st pallet transport mechanism

11B‧‧‧2nd tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧1st component transport head

14‧‧‧Component supply unit (supply shuttle)

15‧‧‧3rd pallet transport mechanism

16‧‧‧Inspection Department

17‧‧‧2nd component transport head

18‧‧‧Component Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧3rd component transport head

21‧‧‧6th tray transport mechanism

22A‧‧‧4th tray transport mechanism

22B‧‧‧5th pallet transport mechanism

31‧‧‧1st electronic camera

32‧‧‧2nd electronic camera

41‧‧‧Support components

50‧‧‧Substrate

51‧‧‧1st reflection member

52‧‧‧2nd reflection member

61‧‧‧ Input Department

62‧‧‧Display Department

80‧‧‧Control Department

90‧‧‧IC components

91‧‧‧terminal

131‧‧‧Control unit

163‧‧‧ Keeping Department

165‧‧‧ probe pin

171‧‧‧Control unit

172‧‧‧Handle unit body

173‧‧‧ Holding components

175‧‧‧Adjustment agency

200‧‧‧Tray

201‧‧‧Control unit

511‧‧‧1st reflecting surface

512‧‧‧ normal

521‧‧‧2nd reflecting surface

522‧‧‧ normal

801‧‧‧Memory Department

A1‧‧‧Tray supply area

A2‧‧‧Component supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Component recycling area (recycling area)

A5‧‧‧Tray removal area

Room R1‧‧‧

Room R2‧‧‧

Room R3‧‧‧3

X‧‧‧ axis

Y‧‧‧ axis

Z‧‧‧ axis

Fig. 1 is a schematic plan view showing an embodiment of an electronic component inspection device according to the present invention.

Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1.

Fig. 3 is a view schematically showing a main part of components for positioning in the electronic component inspection device shown in Fig. 1.

Fig. 4 is a view schematically showing a main part of components for positioning in the electronic component inspection apparatus shown in Fig. 1.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.

Fig. 1 is a schematic plan view showing an embodiment of an electronic component inspection device according to the present invention. Figure 2 is a block diagram of the electronic component inspection apparatus shown in Figure 1. 3 and 4 are diagrams each schematically showing a main part of components for positioning in the electronic component inspection apparatus shown in Fig. 1.

In addition, hereinafter, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are set to the X-axis, the Y-axis, and the Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is referred to as "X direction", the direction parallel to the Y-axis is referred to as "Y direction", and the direction parallel to the Z-axis is referred to as "Z direction". Further, the direction of the arrow of each of the X-axis, the Y-axis, and the Z-axis is referred to as a positive side, and the direction opposite to the arrow is referred to as a negative side. Moreover, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side is simply referred to as "downstream side". Further, the "level" as used in the specification of the present application is not limited to a complete level, and includes a state in which it can be slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as the electronic component is not prevented from being transported.

Further, in the following, for convenience of explanation, the upper side in FIGS. 3 and 4 will be referred to as "upper". Or "above", the lower side is called "lower" or "lower", the right side is called "right", and the left side is called "left".

The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 is used, for example, for inspection, testing (hereinafter referred to as "inspection") BGA (Ball grid array) package or LGA (Land grid array: plane) Grid array) A device such as an IC component such as a package, an electrical component such as an LCD (Liquid Crystal Display), or a CIS (CMOS Image Sensor: CMOS image sensor). Hereinafter, for convenience of explanation, a case where an IC component is used as the above-described electronic component to be inspected will be described as a representative, and this will be referred to as "IC component 90". Further, the IC element 90 has a plurality of terminals 91 (see FIG. 3) arranged in a matrix.

As shown in FIG. 1, the inspection apparatus 1 is divided into a tray supply area A1, a component supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a component collection area (hereinafter simply referred to as "recovery area") A4, and The tray removes the area A5. Each of these regions is separated from each other by a wall portion, a baffle or the like (not shown). Further, the supply region A2 is the first chamber R1 defined by the wall portion, the baffle plate, or the like, and the inspection region A3 is the second chamber R2 defined by the wall portion or the baffle plate, and the recovery region A4 is the wall. The third chamber R3 divided by a portion or a baffle. Moreover, each of the first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (recovery region A4) is configured to ensure airtightness or heat insulation. Thereby, the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity or temperature as much as possible. Further, the first chamber R1 and the second chamber R2 are controlled to have specific humidity and a specific temperature.

The IC element 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5 via the above-described respective areas, and in the inspection area A3 on the way. The inspection apparatus 1 includes an electronic component transport apparatus that transports the IC component 90 in each area, and has an inspection unit (electronic component mounting unit) 16 that performs inspection in the inspection area A3, and an unillustrated Check the control department. Further, in the inspection apparatus 1, the electronic component conveying apparatus is configured by a configuration other than the inspection unit 16 and the inspection control unit.

The tray supply area A1 supplies an area of the tray 200 in which a plurality of IC elements 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC elements 90 from the tray 200 of the tray supply area A1 to the area of the inspection area A3. Further, the first tray transport mechanism 11A and the second tray transport mechanism 11B of the sheet-by-sheet transport tray 200 are provided so as to straddle the tray supply area A1 and the supply area A2.

The supply area A2 is provided with a temperature adjustment unit (soaking plate) 12, which is an arrangement portion of the IC element 90, a first element transfer head 13, and a third tray transfer mechanism 15.

The temperature adjustment unit 12 heats or cools a plurality of IC elements 90, and adjusts (controls) the IC elements 90 to a temperature suitable for inspection. In other words, the temperature adjustment unit 12 is a temperature control member (member) that can dispose the IC element 90 and perform both heating and cooling of the IC element 90. In the present embodiment, the temperature adjustment unit 12 is disposed in the Y direction and is fixed to two. In addition, the IC element 90 on the tray 200 carried in (transferred) from the tray supply area A1 by the first tray transport mechanism 11A is transported and placed on any one of the temperature adjustment units 12.

The first element transfer head 13 is movably supported in the X direction, the Y direction, and the Z direction in the supply region A2. By this, the first element transfer head 13 can carry the IC element 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the IC between the temperature adjustment unit 12 and the component supply unit 14 which will be described later. Transfer of component 90. Further, the first element transfer head 13 has a plurality of gripper units 131 for holding the IC element 90, and each of the gripper units 131 is provided with a suction nozzle and is held by the suction IC element 90.

The third tray transport mechanism 15 is a mechanism that transports the empty tray 200 in the state in which all the IC elements 90 are removed in the X direction. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transfer mechanism 11B.

The inspection area A3 is an area in which the IC component 90 is inspected. In the inspection area A3, a component supply unit (supply shuttle) 14 that can transport and transport the IC component 90, an inspection unit 16, a second component transfer head 17, and a transport unit that can transport and transport the IC component 90 are provided. Component back Receiving department (recycling shuttle) 18.

The component supply unit (electronic component mounting unit) 14 is a device (transporting unit) that transports the IC element 90 after temperature adjustment (temperature control) to the vicinity of the inspection unit 16 .

The component supply unit 14 includes a layout plate on which the IC component 90 is disposed, and a component supply portion body that is movable in the X direction. The upper surface of the layout plate is provided with a plurality of pockets that accommodate (hold) the recessed portions of the IC component 90. The configuration plate is detachably provided to the component supply portion body. The component supply unit 14 is movably supported in the X direction between the supply region A2 and the inspection region A3. In the present embodiment, the element supply unit 14 is disposed in the Y direction, and the IC element 90 on the temperature adjustment unit 12 is transported and placed on any of the element supply units 14 by the first element transfer head 13. . Further, in the component supply unit 14, the IC element 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC element 90 can be adjusted to a temperature suitable for inspection.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC component 90, that is, holds the components of the IC component 90 in the case of inspecting the IC component 90.

The inspection unit 16 has a holding member that holds the IC element 90 and an inspection unit that supports the holding member, and the holding member is detachably provided to the inspection unit body.

A plurality of holding portions (electronic component holding portions) 163 which are recessed portions for housing (holding) the IC component 90 are provided on the upper surface of the inspection portion 16 (holding member). The number of the holding portions 163 is not particularly limited. In the illustrated configuration example, there are sixteen, and the six holding portions 163 are arranged in a matrix in eight in the X direction and two in the Y direction. The IC element 90 is housed in the holding portion 163 and placed (mounted) on the inspection portion 16 .

Further, at a position corresponding to each of the holding portions 163 of the inspection portion 16, a plurality of probe pins 165 electrically connected to the plurality of terminals 91 of the IC device 90 in a state in which the holding portion 163 holds the IC element 90 are provided. (Refer to Figure 3). The plurality of probe pins 165 are arranged in a matrix shape so as to correspond to the plurality of terminals 91 of the IC component 90. Further, each terminal 91 of the IC component 90 is electrically connected (contacted) to each probe pin 165, and the IC component 90 is inspected via each probe pin 165. The inspection of the IC component 90 is based on a test fixture (not shown) connected to the inspection unit 16 It is carried out by checking the program stored in the memory unit of the control unit. Further, in the inspection unit 16, the IC element 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC element 90 can be adjusted to a temperature suitable for inspection.

The second element transfer head 17 is movably supported in the Y direction and the Z direction in the inspection area A3. Further, in the present embodiment, the second element transfer heads 17 are disposed in the Y direction, and each of the second element transfer heads 17 can transport and carry the IC elements 90 on the component supply unit 14 carried in from the supply area A2. The IC unit 90 on the inspection unit 16 is placed on the inspection unit 16 and placed on the component recovery unit 18. Moreover, when the IC element 90 is inspected, the second element transfer head 17 presses the IC element 90 toward the inspection unit 16, whereby the IC element 90 abuts against the inspection unit 16. Thereby, as described above, the terminals 91 of the IC component 90 are electrically connected to the probe pins 165 of the inspection portion 16.

The second element transfer head 17 has a plurality of grip unit 171 as an electronic component gripping portion that grips the IC component 90. The number of the gripper units 171 is not particularly limited, and is 16 in the configuration shown in the figure. The 16 gripper units 171 are arranged in a matrix in eight in the X direction and two in the Y direction. The configuration of each of the gripper units 171 will be hereinafter schematically described for one gripper unit 171.

As shown in FIG. 3, the grip unit 171 has a grip member 173 that holds the IC member 90, and a grip unit body 172 that supports the grip member 173. The grip member 173 is detachably provided to the grip unit body 172. Further, the grip unit 171 has an adjustment mechanism 175 which is configured to change the posture of the grip member 173 with respect to the grip unit main body 172, and can hold the grip member 173 in the X direction with respect to the grip unit main body 172. The parties in the Y direction move up and can rotate around the Z axis. The grip unit 171 is provided with a suction nozzle and is held by suction of the IC element 90. Further, in each of the gripper units 171 of the second element transfer head 17, the IC element 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC element 90 can be adjusted to a temperature suitable for inspection.

The component recovery unit (electronic component mounting unit) 18 is an IC after the inspection of the inspection unit 16 is completed. The element 90 is transported to the apparatus (transport unit) of the collection area A4.

The component recovery unit 18 includes a layout plate on which the IC component 90 is disposed, and a component collection portion body that is movable in the X direction. The upper surface of the layout plate is provided with a plurality of pockets that accommodate (hold) the recessed portions of the IC component 90. The configuration plate is detachably disposed on the component recovery portion body. The component recovery unit 18 is movably supported in the X direction between the inspection region A3 and the recovery region A4. In the present embodiment, the component collection unit 18 is disposed in the Y direction in the same manner as the component supply unit 14, and the IC component 90 on the inspection unit 16 is transported and placed by the second component transfer head 17. A component recovery unit 18.

The recovery area A4 is a region where the IC component 90 at the end of the inspection is recovered. The collection tray 19, the third component transfer head 20, and the sixth tray conveyance mechanism 21 are provided in the collection area A4. Further, an empty tray 200 is also prepared in the collection area A4.

The recovery tray 19 is fixed in the collection area A4, and in the present embodiment, three are arranged in the X direction. Further, the empty trays 200 are also arranged in three in the X direction. Then, the IC element 90 moved to the component collection unit 18 of the collection area A4 is transported and placed on any of the recovery trays 19 and the empty trays 200. Thereby, the IC element 90 is recovered and classified for each inspection result.

The third element transfer head 20 is movably supported in the X direction, the Y direction, and the Z direction in the recovery area A4. Thereby, the third element transfer head 20 can transport the IC element 90 from the element recovery unit 18 to the collection tray 19 or the empty tray 200. Further, the third element transfer head 20 has a plurality of gripper units 201 for gripping the IC element 90, and each gripper unit 201 is provided with a suction nozzle and is held by the suction IC element 90.

The sixth tray transport mechanism 21 is a mechanism that transports the empty tray 200 after the tray removal area A5 is carried in the X direction. Further, after the transfer, the empty tray 200 can be disposed at the position where the IC element 90 is collected, and can be any of the above three empty trays 200.

The tray removal area A5 collects and removes the area of the tray 200 in which the plurality of IC elements 90 in the inspection state are arranged. In the tray removal area A5, a plurality of trays can be stacked 200.

Moreover, the fourth tray conveyance mechanism 22A and the fifth tray conveyance mechanism 22B of the sheet-by-sheet conveyance tray 200 are provided so as to span the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC element 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC component 90 from the tray removal area A5 to the collection area A4.

The inspection control unit of the tester performs inspection of electrical characteristics of the IC component 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory unit (not shown).

Further, as shown in FIG. 2, the inspection apparatus 1 includes a control unit 80 and an operation unit 6 that is electrically connected to the control unit 80 and performs each operation of the inspection apparatus 1.

The control unit 80 has a memory unit 801 that stores information, and controls, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, the first element transport head 13, the component supply unit 14, and the third tray transport mechanism. 15. The second component transfer head 17, the component collection unit 18, the third component transfer head 20, the sixth tray transport mechanism 21, the fourth tray transport mechanism 22A, the fifth tray transport mechanism 22B, the display unit 62, and the first to be described later The driving of each unit of the electronic camera 31, the second electronic camera 32 to be described later, and the moving mechanism 4 to be described later. Further, a program (software) for positioning described later is stored in the storage unit 801, and during positioning, the control unit 80 executes the above-described program to control the positioning operation.

Further, the operation unit 6 includes an input unit 61 for inputting each, and a display unit 62 for displaying information (data) such as an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard, a mouse, and the like. In addition, the display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel, an organic EL (Electroluminescence) display panel, and the like. The operation of the operation unit 6 of the worker (operator) is performed by, for example, operating the input unit 61 to move the cursor to the position of each operation button (icon) displayed on the display unit 62 and select (click).

Further, the input unit 61 is not limited to the above configuration, and for example, a mechanical operation button such as a button or the like can be cited. Further, the operation unit 6 is not limited to the above configuration, and examples thereof include an element that can input and display information such as a touch panel. Further, the display unit 62 of the operation unit 6 constitutes a notification unit.

The inspection apparatus 1 is configured to automatically perform the positioning of the two second element transfer heads 17 respectively. In other words, the inspection device 1 is configured to automatically perform the X direction and the Y direction (horizontal direction) of each of the grip unit 171 (the IC element 90 held by the grip unit 171) of the two second element transfer heads 17 of the inspection unit 16 Positioning. In the following, these positionings are also referred to as "positioning". Further, since the positioning is the same, the positioning of the second component transfer head 17 of one of the following will be representatively described.

As shown in FIG. 3, the inspection apparatus 1 has a reflection portion 5 that can be disposed between the grip unit 171 of the second element transfer head 17 and the holding portion 163 of the inspection portion 16, and moves the reflection portion 5 in the X direction. The mechanism 4, the first electronic camera (first imaging unit) 31, and the second electronic camera (second imaging unit) 32. Further, the reflection unit 5, the movement mechanism 4, the first electronic camera 31, and the second electronic camera 32 are integrally configured to be movable in the Y direction by a moving mechanism (not shown).

The reflection portion 5 includes a substrate (substrate) 50, a first reflection member 51 provided on one surface of the substrate 50, and a second reflection member 52 provided on the other surface of the substrate 50 (the surface opposite to the one surface). The surface of the first reflecting member 51 opposite to the substrate 50 constitutes the first reflecting surface 511, and the surface of the second reflecting member 52 opposite to the substrate 50 constitutes a second reflecting surface different from the first reflecting surface 511. 521. The second reflecting surface 521 may also be referred to as a rear surface disposed on the first reflecting surface 511. Further, one or a plurality of other layers may be provided between the substrate 50 and the first reflection member 51. Similarly, one or more other may be provided between the substrate 50 and the second reflection member 52. Floor.

Further, in the present embodiment, the first reflecting surface 511 and the second reflecting surface 521 are planes, and the normal line 512 of the first reflecting surface 511 and the normal line 522 of the second reflecting surface 521 form an angle of 0°. In other words, the first reflecting surface 511 is parallel to the second reflecting surface 521. Thereby, the reflecting portion 5 can be made small The space is formed, and the space between the grip unit 171 and the holding portion 163 can be saved.

In addition, the first reflecting member 51 and the second reflecting member 52 are not particularly limited as long as they have a function of reflecting light. For example, a metal film (including an alloy or the like) and a dielectric multilayer are exemplified. Membrane and the like.

Further, the shape or size of the reflection portion 5, that is, the shape or size of the substrate 50, the first reflection member 51, and the second reflection member 52 are not particularly limited thereto, and are appropriately set according to respective conditions.

Further, the first reflection member 51 and the second reflection member 52 may have the same configuration or different configurations. Specific examples of the case where the first reflection member 51 and the second reflection member 52 have different configurations include, for example, a first reflection member 51 formed of a metal film and a second reflection member formed of a dielectric multilayer film. In the case of the case where the first reflecting member 51 is formed of a dielectric multilayer film and the second reflecting member 52 is formed of a metal film, the first reflecting member 51 and the second reflecting member 52 are respectively formed of a metal film, and the first reflecting member 51 and the second reflecting member 52 are respectively formed. In the case where the composition of the metal (including the alloy or the like) is different, the first reflective member 51 and the second reflective member 52 are respectively formed by the dielectric multilayer film, and the number of layers or the composition of the dielectric is different. When the shape of the first reflecting member 51 and the second reflecting member 52 are different from each other, the reflectance of the first reflecting member 51 and the second reflecting member 52 is different, and the reflectance of the first reflecting member 51 and the second reflecting member 52 is equal. Different characteristics, etc.

The moving mechanism 4 has a supporting member 41 that supports the reflecting portion 5, and a driving portion (not shown) such as a motor that moves the supporting member 41 and the reflecting portion 5 together in the X direction.

By the moving mechanism 4, the reflection portion 5 can be disposed between the respective gripper units 171 of the second element transfer head 17 (the IC element 90 held by the grip unit 171) and the holding portions 163 of the inspection unit 16. .

Further, by the moving mechanism 4, the first position between the holder unit 171 and the holding portion 163 shown in FIG. 3 and the second position (the position different from the first position) shown in FIG. 4 can be made. One of them moves to the other.

The first electronic camera 31 is a device that images the IC device 90 held by the grip unit 171 via the reflecting unit 5, and faces the direction of the reflecting portion 5 disposed between the grip unit 171 and the holding portion 163, that is, the X direction. side. In other words, the first electronic camera 31 can be placed at a position where the grip unit 171 is in contact with the holding portion 163, and can be disposed in the direction between the grip unit 171 and the holding portion 163. The image data obtained by the first electronic camera 31 is input to the control unit 80 and stored in the memory unit 801.

In addition, the first electronic camera 31 is disposed on the negative side (the left side in FIG. 3) of the inspection unit 16 in the X direction, and does not interfere with the second element transfer head 17 and the inspection unit 16 during the inspection of the IC element 90.

In addition, the first electronic camera 31 is only required to image at least a part of the IC element 90 reflected by the first reflecting surface 511 of the reflecting portion 5, but it is preferable to capture an image of the entire IC device 90. In this case, an image of the entire IC element 90 can be imaged.

The second electronic camera 32 is a device that captures a direction in which the first electronic camera 31 is reversed by 180°, that is, a device that images the holding unit 163 via the reflection unit 5, and reflects toward the reflection between the holder unit 171 and the holding unit 163. The direction of the portion 5, that is, the negative side of the X direction. In other words, the second electronic camera 32 can be placed at a position where the grip unit 171 is in contact with the holding portion 163, and can be disposed in the direction between the grip unit 171 and the holding portion 163. The image data obtained by the second electronic camera 32 is input to the control unit 80 and stored in the memory unit 801.

In addition, the second electronic camera 32 is disposed on the positive side (the right side in FIG. 3) of the inspection unit 16 in the X direction, and does not interfere with the second element transfer head 17 and the inspection unit 16 during the inspection of the IC element 90.

In addition, the second electronic camera 32 may image at least a part of the holding portion 163 reflected by the second reflecting surface 521 of the reflecting portion 5, but it is preferable to image the entire image of the holding portion 163. In this case, the entire image of the holding unit 163 can be imaged.

Next, the sequence at the time of positioning (alignment) and the operation of the inspection apparatus 1 will be described.

First, the worker (user) starts the operation of the input unit 61 of the operation unit 6 Positioning. In addition, the following positioning is automatically performed by the control of the control unit 80.

As shown in FIG. 3, in the inspection apparatus 1, the IC elements 90 are respectively held by the respective gripper units 171 of the second element transfer head 17, so that the respective IC elements 90 are located directly above the respective holding portions 163 of the inspection unit 16 (Z). The second element transfer head 17 is moved in such a manner as to be above the direction.

Then, the moving unit 4 is disposed between the specific grip unit 171 of the second element transfer head 17 and the specific holding unit 163 of the inspection unit 16 (first position). The specific grip unit 171 and the specific holding portion 163 may be any one of the plurality of grip units 171 and the plurality of holding portions, and for example, located at the leftmost side in FIG. 1 (negative side in the X direction) In addition, the grip unit 171 and the specific holding portion 163 are the lowermost side (the negative side in the Y direction) in FIG.

Further, the arrangement of the reflection portions 5 may be performed earlier than the movement of the second element transfer head 17, and these may be simultaneously performed.

Next, the first electronic camera 31 captures the IC device 90 held by the grip unit 171, and the second electronic camera 32 captures the holding portion 163 that the IC device 90 faces in the Z direction. The imaging of the first electronic camera 31 is performed simultaneously with the imaging system of the second electronic camera 32. Thereby, the time required for positioning can be shortened. In addition, it is also possible to configure a time difference between the imaging of the first electronic camera 31 and the imaging of the second electronic camera 32, and either one of them is imaged first, and the other is imaged.

Here, the image of the IC element 90 is reflected by the first reflecting surface 511 of the reflecting portion 5, and is imaged by the first electronic camera 31. The image data obtained by the first electronic camera 31 is input to the control unit 80 and stored in the memory unit 801.

Further, the image of the holding portion 163 is reflected by the second reflecting surface 521 of the reflecting portion 5, and is imaged by the second electronic camera 32. The image data obtained by the second electronic camera 32 is input to the control unit 80 and stored in the memory unit 801.

Then, based on the image data of the first electronic camera 31, that is, the image data and the image data of the second electronic camera 32, that is, the image data, the IC component for the holding unit 163 is performed. 90 positioning.

In this positioning, for example, the second element transfer head 17 is moved in the Y direction so that the positions of the probe pins 165 of the holding portion 163 and the terminals 91 of the IC element 90 in the Y direction are as close as possible.

Next, the posture of the grip member 173 of the grip unit 171 is changed so that the probe pins 165 of the holding portion 163 and the positions of the respective terminals 91 of the IC component 90 in the X direction coincide with the positions in the Y direction. Here, the probe pins 165 of the holding portion 163 may be completely matched with the respective terminals 91 of the IC device 90. However, the present invention is not limited thereto. For example, two of the diagonal lines may be representatively located. The probe pin 165 is identical to the two terminals 91. The change of the posture of the grip member 173 can be performed by at least one of the movement of the grip member 173 in the X direction by the adjustment mechanism 175, the movement in the Y direction, and the rotation around the Z axis. The position information of the second element transfer head 17 in the Y direction in the state in which the IC element 90 is positioned relative to the holding portion 163, and the position information in the X direction of the grip member 173 in the grip unit 171, Y The position information of the direction and the position information around the Z axis are respectively stored as the positioning information, and are memorized in the memory unit 801.

Next, the moving mechanism 4 moves the reflection portion 5 to the positive side in the X direction, and is disposed between the adjacent grip unit 171 and the holding portion 163 on the positive side in the X direction.

In the same manner as described above, imaging is performed by the first electronic camera 31 and the second electronic camera 32, and each image data is stored in the storage unit 801, and the positioning of the IC element 90 for the holding unit 163 is performed based on each image data. . In this positioning, the adjustment mechanism 175 is used in the grip unit 171 by the probe pins 165 of the holding portion 163 and the positions of the respective terminals 91 of the IC component 90 in the X direction and the Y direction. The posture of the grip member 173 is changed. Further, position information in the X direction of the grip member 171, position information in the Y direction, and position information around the Z axis in the grip unit 171 are stored in the memory unit 801 as positioning information.

Hereinafter, in the same manner, the positioning of each IC element 90 is performed for each holding portion 163, and The positioning information is memorized in the memory unit 801.

When the positioning of all the holding portions 163 and the IC elements 90 arranged in the X direction is completed, the first electronic camera 31, the second electronic camera 32, the reflecting portion 5, and the moving mechanism 4 are caused by a mechanism (not shown). The whole is moved to the positive side in the Y direction, and the reflecting portion 5 is disposed between the adjacent gripper unit 171 and the holding portion 163 on the positive side in the Y direction. In the following, similarly, the positioning of each IC element 90 is performed for each holding unit 163, and the positioning information is stored in the memory unit 801. In this manner, positioning is performed for each of the holding portions 163.

As described above, the positioning of the second component transfer head 17 with respect to the inspection unit 16 is completed.

In addition, although the description is omitted, the positioning of the other second element transfer head 17 with respect to the inspection unit 16 is performed in the same manner as described above. In this way, the positioning of the two second element transfer heads 17 is completed.

The information obtained by the above positioning (alignment) is utilized in the inspection of the IC component 90. In other words, in the inspection of the IC device 90, the IC elements 90 held by the respective gripper units 171 of the second element transfer head 17 are accurately placed at appropriate positions of the respective holding portions 163 of the inspection unit 16 based on the position information.

As described above, according to the inspection apparatus 1, the positional information of the IC component 90 held by the gripper unit 171, that is, the positional information of each terminal 91 and the positional information of the holding portion 163 of the inspection unit 16 can be simultaneously obtained during positioning. That is, the position information of each probe pin 165 can be positioned simply, quickly and correctly. In other words, the positioning of the second component transfer head 17 can be automatically performed, and the labor and work time of the worker can be reduced.

Further, since the reflection portion 5 has a plate shape, it is possible to save space between the second element transfer head 17 and the inspection portion 16, and it is possible to reduce the size of the device.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced with any constituent having the same function. Further, any other constituents may be added.

Further, in the above-described embodiment, the substrate (substrate) is provided between the first reflecting surface and the second reflecting surface as the reflecting portion. However, the present invention is not limited thereto. For example, the position of the substrate may be a position other than between the first reflecting surface and the second reflecting surface. As a specific example, for example, a transparent (light transmissive) substrate is provided on at least one of the first reflecting surface and the second reflecting surface.

Further, in the present invention, for example, the substrate may not be in the form of a plate, and the substrate may be omitted.

Further, in the present invention, for example, one reflecting member (for example, a metal plate or a metal film) may be provided as a constituent element of the reflecting portion, and one surface of the reflecting member may be the first reflecting surface and the other surface (the one side may be provided). The opposite side is the second reflecting surface.

4‧‧‧Mobile agencies

5‧‧‧Reflection Department

16‧‧‧Inspection Department

17‧‧‧2nd component transport head

31‧‧‧1st electronic camera

32‧‧‧2nd electronic camera

41‧‧‧Support components

50‧‧‧Substrate

51‧‧‧1st reflection member

52‧‧‧2nd reflection member

90‧‧‧IC components

91‧‧‧terminal

163‧‧‧ Keeping Department

165‧‧‧ probe pin

171‧‧‧Control unit

172‧‧‧Handle unit body

173‧‧‧ Holding components

175‧‧‧Adjustment agency

511‧‧‧1st reflecting surface

512‧‧‧ normal

521‧‧‧2nd reflecting surface

522‧‧‧ normal

X‧‧‧ axis

Y‧‧‧ axis

Z‧‧‧ axis

Claims (7)

An electronic component conveying device comprising: an electronic component holding portion that holds an electronic component; an electronic component holding portion that holds an electronic component; and a first imaging portion that captures an electronic component held by the electronic component holding portion; a second imaging unit that can image the electronic component holding unit and that can capture a direction different from the first imaging unit; and a reflection unit that is disposed between the electronic component holding unit and the electronic component holding unit a first reflecting surface and a second reflecting surface different from the first reflecting surface; wherein the first imaging unit can capture a small portion of the image of the electronic component reflected by the first reflecting surface; and the second imaging unit can capture the image An image of at least a part of the electronic component holding portion reflected by the second reflecting surface. The electronic component transport apparatus according to claim 1, wherein the electronic component and the electronic component holding unit are positioned based on an imaging result of the first imaging unit and an imaging result of the second imaging unit. The electronic component transporting apparatus of claim 2, wherein the plurality of electronic component holding portions are disposed, and the positioning is performed for each of the electronic component holding portions. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein an angle between a normal line of the first reflecting surface and a normal line of the second reflecting surface is 0°. The electronic component transport apparatus according to any one of claims 1 to 4, wherein the first imaging unit and the second imaging unit are disposed at positions where the electronic component holding unit and the electronic component holding unit are in contact with each other. Camera the above electronic parts holding part and upper The direction between the electronic component holding portions. The electronic component conveying apparatus according to any one of claims 1 to 5, wherein the reflecting portion is at a first position between the electronic component gripping portion and the electronic component holding portion, and a second position different from the first position Move between positions. An electronic component inspection device comprising: an electronic component holding portion that holds an electronic component; an electronic component holding portion that holds an electronic component; and a first imaging portion that captures an electronic component held by the electronic component holding portion; The second imaging unit can image the electronic component holding unit and capture a direction different from the first imaging unit, and the reflection unit can be disposed between the electronic component holding unit and the electronic component holding unit. a reflection surface and a second reflection surface different from the first reflection surface; and an inspection unit that inspects the electronic component; wherein the first imaging unit images an image of a part of the electronic component reflected by the first reflection surface The second imaging unit can image an image of at least a part of the electronic component holding unit reflected by the second reflecting surface.