JP2016188781A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device with which it is possible to position an electronic component grasping unit (or an electronic component) and an electronic component holding unit easily and quickly with high accuracy, and to save a space between the electronic component grasping unit and the electronic component holding unit.SOLUTION: The electronic component conveyance device comprises an electronic component grasping unit for grasping an electronic component, an electronic component holding unit for holding an electronic component, a first image-capturing unit capable of capturing the image of an electronic component grasped by the electronic component grasping unit, a second image-capturing unit capable of capturing the image of the electronic component holding unit and capable of capturing images in a direction different than does the first image-capturing unit, and a reflection unit disposable between the electronic component grasping unit and the electronic component holding unit and having a first reflection plane and a second reflection plane differing from the first reflection plane, the first image-capturing unit being capable of capturing the image of at least a portion of the electronic component reflected at the first reflection plane, and the second image-capturing unit being capable of capturing the image of at least a portion of the electronic component holding unit reflected at the second reflection plane.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

  The electronic component conveying apparatus heats or cools the IC device in advance to adjust the IC device to a temperature suitable for inspection, and conveys the IC device whose temperature is adjusted by the soak plate to the vicinity of the inspection unit. A supply shuttle, a first device transport head for transporting the IC device between the tray on which the IC device is disposed and the soak plate, and transporting the IC device between the soak plate and the supply shuttle, and the IC after the inspection A recovery shuttle that transports the device, a second device transport head that transports the IC device between the supply shuttle and the inspection unit, and an IC device between the inspection unit and the recovery shuttle, and the recovery shuttle There is a third device transport head that transports the IC device to and from the tray where the IC device is placed. To have.

  In Patent Document 1, a prism-shaped mirror is arranged between the hand and the IC socket, and the upper and lower images are reflected in one direction by the two reflecting surfaces of the mirror, taken by an electronic camera, and the IC. A handler for positioning a device in an IC socket is disclosed. This handler can efficiently capture an image.

JP-A-11-108990

  However, since the handler described in Patent Document 1 uses a prism-shaped mirror, there is a problem that a large space is required between the hand and the IC socket, and the apparatus becomes large.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
An electronic component transport apparatus according to the present invention includes an electronic component gripping unit that grips an electronic component,
An electronic component holding unit for holding the electronic component;
A first imaging unit capable of imaging an electronic component gripped by the electronic component gripping unit;
A second imaging unit capable of imaging the electronic component holding unit and capable of imaging in a direction different from the first imaging unit;
A reflective portion that can be disposed between the electronic component gripping portion and the electronic component holding portion and has a first reflective surface and a second reflective surface different from the first reflective surface;
The first imaging unit can capture an image of at least a part of the electronic component reflected by the first reflecting surface;
The second imaging unit can capture an image of at least a part of the electronic component holding unit reflected by the second reflecting surface.

  Thereby, in positioning of the electronic component gripping part (or electronic component) with respect to the electronic component holding part (or positioning of the electronic component gripping part and the electronic component holding part), the position information of the electronic component gripped by the electronic component gripping part and the electronic The position information of the component holding unit can be acquired at the same time, whereby the positioning can be performed easily, quickly and accurately, that is, teaching can be performed. Hereinafter, the positioning of the electronic component gripping part (or electronic component) with respect to the electronic component holding part (or positioning of the electronic component gripping part and the electronic component holding part) is also simply referred to as “positioning”.

  Moreover, a reflection part is made into the thing of the form which has a 1st reflection surface and the 2nd reflection surface arrange | positioned on the back surface of the 1st reflection surface, and is between an electronic component holding part and an electronic component holding part. The space can be saved, and the apparatus can be downsized.

[Application Example 2]
In the electronic component transport device of the present invention, it is preferable that the electronic component and the electronic component holding unit are positioned based on the imaging result of the first imaging unit and the imaging result of the second imaging unit.
As a result, positioning can be performed easily, quickly and accurately.

[Application Example 3]
In the electronic component transport apparatus according to the present invention, it is preferable that a plurality of the electronic component holding units are arranged, and the positioning is performed for each electronic component holding unit.
Thereby, positioning can be performed with high accuracy.

[Application Example 4]
In the electronic component transport device according to the aspect of the invention, it is preferable that an angle formed by the normal line of the first reflection surface and the normal line of the second reflection surface is 0 °.

  Thereby, a reflective part can be reduced in size and space saving between an electronic component holding part and an electronic component holding part can be achieved.

[Application Example 5]
In the electronic component transport device of the present invention, the first imaging unit and the second imaging unit are respectively configured such that the electronic component gripping unit and the electronic component gripping unit are in positions where the electronic component gripping unit and the electronic component holding unit abut. It is preferable that the direction between the component holding portions is arranged so as to be capable of imaging.

  Accordingly, the first imaging unit and the second imaging unit can be arranged at positions that do not interfere with the electronic component gripping unit and the electronic component holding unit, respectively, and the first imaging unit and the second imaging unit are prevented from becoming an obstacle. can do.

[Application Example 6]
In the electronic component transport device according to the aspect of the invention, the reflecting portion may be between a first position between the electronic component gripping portion and the electronic component holding portion and a second position different from the first position. It is preferably movable.
Thereby, it can prevent that a reflection part becomes obstructive after positioning.

[Application Example 7]
An electronic component inspection apparatus of the present invention includes an electronic component gripping unit that grips an electronic component,
An electronic component holding unit for holding the electronic component;
A first imaging unit capable of imaging an electronic component gripped by the electronic component gripping unit;
A second imaging unit capable of imaging the electronic component holding unit and capable of imaging in a direction different from the first imaging unit;
A reflective portion that can be disposed between the electronic component gripping portion and the electronic component holding portion and has a second reflective surface different from the first reflective surface and the first reflective surface;
An inspection unit for inspecting the electronic component,
The first imaging unit can capture an image of at least a part of the electronic component reflected by the first reflecting surface;
The second imaging unit can capture an image of at least a part of the electronic component holding unit reflected by the second reflecting surface.

  Thereby, in positioning, the position information of the electronic component gripped by the electronic component gripping part and the position information of the electronic part holding part can be acquired simultaneously, thereby performing positioning easily, quickly and accurately. That is, teaching can be performed.

  Moreover, a reflection part is made into the thing of the form which has a 1st reflection surface and the 2nd reflection surface arrange | positioned on the back surface of the 1st reflection surface, and is between an electronic component holding part and an electronic component holding part. The space can be saved, and the apparatus can be downsized.

It is a schematic plan view which shows embodiment of the electronic component inspection apparatus of this invention. It is a block diagram of the electronic component inspection apparatus shown in FIG. In the electronic component inspection apparatus shown in FIG. 1, it is a figure which shows typically the principal part of the component used for positioning. In the electronic component inspection apparatus shown in FIG. 1, it is a figure which shows typically the principal part of the component used for positioning.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

  FIG. 1 is a schematic plan view showing an embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. FIG. 3 and FIG. 4 are diagrams schematically showing main parts of components used for positioning in the electronic component inspection apparatus shown in FIG.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. The direction of the arrow of each axis of the X axis, the Y axis, and the Z axis is referred to as a plus side, and the direction opposite to the arrow is referred to as a minus side. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  In the following, for convenience of explanation, the upper side in FIGS. 3 and 4 is referred to as “upper” or “upper”, the lower side is referred to as “lower” or “lower”, the right side is referred to as “right”, and the left side is referred to as “left”. .

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, a case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”. The IC device 90 has a plurality of terminals 91 arranged in a matrix (see FIG. 3).

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Each of these regions is partitioned from each other by a wall portion, a shutter, or the like (not shown). The supply area A2 is a first chamber R1 defined by walls and shutters, and the inspection area A3 is a second chamber R2 defined by walls and shutters. In addition, the collection area A4 is a third chamber R3 defined by walls and shutters. The first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (collection region A4) are each configured to ensure airtightness and heat insulation. ing. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. The interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively.

  The IC device 90 is inspected in the intermediate inspection area A3 through the respective areas in order from the tray supply area A1 to the tray removal area A5. As described above, the inspection apparatus 1 conveys the IC device 90 in each region and includes an electronic component conveyance device having the control unit 80, an inspection unit (electronic component placement unit) 16 that performs inspection in the inspection region A3, and The inspection control unit is not provided. In the inspection apparatus 1, an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. A first tray transport mechanism 11A and a second tray transport mechanism 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjustment unit (soak plate) 12, which is an arrangement unit in which the IC device 90 is arranged, a first device conveyance head 13, and a third tray conveyance mechanism 15 are provided.

  The temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust (control) the IC devices 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a temperature control member (member) that can arrange the IC device 90 and can perform both heating and cooling of the IC device 90. In the present embodiment, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the first tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The first device transport head 13 is supported so as to be movable in the X direction, the Y direction, and the Z direction within the supply region A2. Thereby, the first device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device supply unit 14 to be described later. And the IC device 90 can be transported between them. Note that the first device transport head 13 includes a plurality of hand units 131 that grip the IC device 90, and each hand unit 131 includes a suction nozzle and grips the IC device 90 by suction.

  The third tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state where all the IC devices 90 are removed in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, which is a conveyance unit that can arrange and convey the IC device 90, an inspection unit 16, a second device conveyance head 17, and an IC device 90 are arranged. A device collection unit (collection shuttle) 18 that is a conveyance unit that can be conveyed is provided.

  The device supply unit (electronic component placement unit) 14 is an apparatus (conveyance unit) that conveys the temperature-adjusted (temperature controlled) IC device 90 to the vicinity of the inspection unit 16.

  The device supply unit 14 includes an arrangement plate on which the IC device 90 is arranged and a device supply unit main body movable in the X direction, and a concave portion that houses (holds) the IC device 90 on the upper surface of the arrangement plate. A plurality of pockets are provided. This arrangement | positioning board is installed in a device supply part main body so that attachment or detachment is possible. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the present embodiment, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is connected to one of the device supply units 14 by the first device transport head 13. Transported and placed. In the device supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, a member that holds the IC device 90 when the IC device 90 is inspected.

  The inspection unit 16 includes a holding member that holds the IC device 90 and an inspection unit main body that supports the holding member, and the holding member is detachably installed on the inspection unit main body.

  On the upper surface of the inspection unit 16 (holding member), a plurality of holding units (electronic component holding units) 163 that are concave portions that house (hold) the IC device 90 are provided. The number of holding units 163 is not particularly limited, but is 16 in the illustrated configuration, and the 16 holding units 163 are arranged in a matrix, with eight arranged in the X direction and two arranged in the Y direction. . The IC device 90 is accommodated in the holding unit 163, thereby being arranged (placed) on the inspection unit 16.

  In addition, a plurality of probes that are electrically connected to a plurality of terminals 91 of the IC device 90 in a state where the IC device 90 is held by the holding unit 163 at positions corresponding to the holding units 163 of the inspection unit 16, respectively. Pins 165 are provided (see FIG. 3). The plurality of probe pins 165 are arranged in a matrix so as to correspond to the plurality of terminals 91 of the IC device 90. Then, each terminal 91 of the IC device 90 and each probe pin 165 are electrically connected (contacted), and the IC device 90 is inspected via each probe pin 165. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit provided in a tester (not shown) connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The second device transport head 17 is supported so as to be movable in the Y direction and the Z direction within the inspection region A3. In the present embodiment, two second device transport heads 17 are arranged in the Y direction, and each of the second device transport heads 17 is on the device supply unit 14 carried in from the supply region A2. The IC device 90 can be transported and placed on the inspection unit 16, and the IC device 90 on the inspection unit 16 can be transported and placed on the device collection unit 18. When inspecting the IC device 90, the second device transport head 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. Accordingly, as described above, each terminal 91 of the IC device 90 and each probe pin 165 of the inspection unit 16 are electrically connected.

  The second device transport head 17 has a plurality of hand units 171 as an electronic component gripping part that grips the IC device 90. The number of hand units 171 is not particularly limited, but is 16 in the illustrated configuration, and the 16 hand units 171 are arranged in a matrix, with eight in the X direction and two in the Y direction. . Since the configuration of each hand unit 171 is the same, one hand unit 171 will be typically described below.

  As shown in FIG. 3, the hand unit 171 includes a gripping member 173 that holds the IC device 90 and a hand unit main body 172 that supports the gripping member 173. The grip member 173 is detachably installed on the hand unit main body 172. The hand unit 171 is configured so that the posture of the gripping member 173 can be changed with respect to the hand unit main body 172, and the gripping member 173 is moved in each of the X direction and the Y direction with respect to the hand unit main body 172. And an adjustment mechanism 175 that can be rotated around the Z-axis. The hand unit 171 includes a suction nozzle and grips the IC device 90 by suction. Further, in each hand unit 171 of the second device transport head 17, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The device collection unit (electronic component placement unit) 18 is an apparatus (conveyance unit) that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4.

  The device collection unit 18 includes an arrangement plate on which the IC device 90 is arranged and a device collection unit main body movable in the X direction, and a concave portion that accommodates (holds) the IC device 90 on the upper surface of the arrangement plate. A plurality of pockets are provided. This arrangement plate is detachably installed on the device recovery unit main body. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the present embodiment, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is moved by the second device transport head 17. It is transported to and placed on the device collection unit 18.

  The collection area A4 is an area where the IC device 90 that has been inspected is collected. In the collection area A4, a collection tray 19, a third device transport head 20, and a sixth tray transport mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the present embodiment, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The third device transport head 20 is supported so as to be movable in the X direction, the Y direction, and the Z direction within the collection region A4. Accordingly, the third device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. Note that the third device transport head 20 includes a plurality of hand units 201 that grip the IC device 90, and each hand unit 201 includes a suction nozzle and grips the IC device 90 by suction.

  The sixth tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, a fourth tray transport mechanism 22A and a fifth tray transport mechanism 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism for transporting an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The test control unit of the tester, for example, inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a storage unit (not shown).

  As shown in FIG. 2, the inspection apparatus 1 includes a control unit 80 and an operation unit 6 that is electrically connected to the control unit 80 and performs each operation of the inspection apparatus 1.

  The control unit 80 includes a storage unit 801 that stores information, and the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, and the first device transport head 13, for example. A device supply unit 14, a third tray transport mechanism 15, a second device transport head 17, a device recovery unit 18, a third device transport head 20, a sixth tray transport mechanism 21, The fourth tray transport mechanism 22A, the fifth tray transport mechanism 22B, the display unit 62, the first electronic camera 31, which will be described later, the second electronic camera 32, which will be described later, and the moving mechanism 4, which will be described later. Control the drive. Note that the storage unit 801 stores a program (software) used in positioning described later, and at the time of positioning, the control unit 80 executes the program and controls the positioning operation.

  Further, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays each information (data) such as an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. For example, the operator (operator) operates the operation unit 6 by operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking). Is made by

  The input unit 61 is not limited to the one having the above configuration, and examples thereof include mechanical operation buttons such as push buttons. In addition, the operation unit 6 is not limited to the above-described configuration, and examples thereof include a device such as a touch panel that can input and display information. The display unit 62 of the operation unit 6 constitutes a notification unit.

  The inspection apparatus 1 is configured such that teaching of the two second device transport heads 17 can be performed automatically. That is, the inspection apparatus 1 automatically positions each hand unit 171 (IC device 90 held by the hand unit 171) of the two second device transport heads 17 with respect to the inspection unit 16 in the X direction and the Y direction (horizontal direction). It is configured so that it can be performed automatically. Hereinafter, each of these positionings is also simply referred to as “positioning”. Since each positioning is the same, the positioning of one second device transport head 17 will be typically described below.

  As illustrated in FIG. 3, the inspection apparatus 1 includes a reflection unit 5 that can be disposed between the hand unit 171 of the second device transport head 17 and the holding unit 163 of the inspection unit 16, and the reflection unit 5 in the X direction. The moving mechanism 4 to be moved, a first electronic camera (first imaging unit) 31, and a second electronic camera (second imaging unit) 32 are provided. Moreover, the reflection part 5, the moving mechanism 4, the 1st electronic camera 31, and the 2nd electronic camera 32 are comprised so that a movement in the Y direction is integrally possible by the moving mechanism which is not shown in figure.

  The reflecting portion 5 is provided on the substrate (base material) 50, the first reflecting member 51 provided on one surface of the substrate 50, and the other surface of the substrate 50 (the surface opposite to the one surface). And a second reflecting member 52. The surface of the first reflecting member 51 opposite to the substrate 50 constitutes the first reflecting surface 511, and the surface of the second reflecting member 52 opposite to the substrate 50 is different from the first reflecting surface 511. 2 reflective surface 521 is comprised. It can also be said that the second reflecting surface 521 is disposed on the back surface of the first reflecting surface 511. One or more other layers may be provided between the substrate 50 and the first reflecting member 51. Similarly, between the substrate 50 and the second reflecting member 52, 1 One or more other layers may be provided.

  Further, in the present embodiment, each of the first reflecting surface 511 and the second reflecting surface 521 is a flat surface, and the angle formed between the normal line 512 of the first reflecting surface 511 and the normal line 522 of the second reflecting surface 521 is 0 °. That is, the first reflecting surface 511 and the second reflecting surface 521 are parallel. Thereby, the reflective part 5 can be reduced in size and the space saving between the hand unit 171 and the holding | maintenance part 163 can be achieved.

  The first reflecting member 51 and the second reflecting member 52 are not particularly limited as long as they have a function of reflecting light. For example, a metal film (including an alloy), a dielectric multilayer film, etc. Is mentioned.

  In addition, the shape and dimensions of the reflecting portion 5, that is, the shapes and dimensions of the substrate 50, the first reflecting member 51, and the second reflecting member 52 are not particularly limited, and are appropriately set according to various conditions.

  The first reflecting member 51 and the second reflecting member 52 may have the same configuration or different configurations. As a specific example in the case where the first reflecting member 51 and the second reflecting member 52 are configured differently, for example, the first reflecting member 51 is configured by a metal film, and the second reflecting member 52 is configured by a dielectric multilayer film. The first reflecting member 51 is composed of a dielectric multilayer film, the second reflecting member 52 is composed of a metal film, and the first reflecting member 51 and the second reflecting member 52 are each composed of a metal film. When the composition of the metal (including the alloy) is made different, and when the first reflecting member 51 and the second reflecting member 52 are each composed of a dielectric multilayer film, the number of layers and the composition of the dielectric are made different. The first reflecting member 51 and the second reflecting member 52 are made different in shape, the first reflecting member 51 and the second reflecting member 52 are made different in size, and the first reflecting member 51 and the second reflecting member 52 are different from each other. When different characteristics such as reflectance from the reflecting member 52 are used. And the like.

  The moving mechanism 4 includes a support member 41 that supports the reflection unit 5 and a drive unit (not shown) having a motor and the like that move the support member 41 together with the reflection unit 5 in the X direction.

  By this moving mechanism 4, the reflecting portion 5 is arranged between each hand unit 171 (the IC device 90 held by the hand unit 171) of the second device transport head 17 and each holding portion 163 of the inspection unit 16. Can be made.

  Moreover, the moving mechanism 4 causes the reflecting portion to be moved between a first position between the hand unit 171 and the holding portion 163 shown in FIG. 3 and a second position shown in FIG. 4 (a position different from the first position). Can be moved from one to the other.

  The first electronic camera 31 is an apparatus that images the IC device 90 held by the hand unit 171 via the reflecting unit 5, and the direction of the reflecting unit 5 disposed between the hand unit 171 and the holding unit 163, That is, it faces the positive side in the X direction. That is, it can be said that the first electronic camera 31 is arranged so as to be able to image the direction between the hand unit 171 and the holding unit 163 at a position where the hand unit 171 and the holding unit 163 abut. Image data obtained by imaging by the first electronic camera 31 is input to the control unit 80 and stored in the storage unit 801.

  Further, the first electronic camera 31 is disposed on the minus side (left side in FIG. 3) in the X direction from the inspection unit 16, and the second device transport head 17 and the inspection unit 16 are inspected when the IC device 90 is inspected. So that it does not interfere with.

  The first electronic camera 31 only needs to be able to capture at least a part of the image of the IC device 90 reflected by the first reflection surface 511 of the reflection unit 5, but can capture the entire image of the IC device 90. Preferably, the present embodiment is configured to be able to capture an entire image of the IC device 90.

  The second electronic camera 32 is a device that images in a direction 180 ° different from the first electronic camera 31, that is, a device that images the holding unit 163 via the reflecting unit 5, and is between the hand unit 171 and the holding unit 163. It faces the direction of the reflection part 5 arranged at the side, that is, the negative side of the X direction. That is, it can be said that the second electronic camera 32 is arranged so as to be able to image the direction between the hand unit 171 and the holding unit 163 at a position where the hand unit 171 and the holding unit 163 abut. Image data obtained by imaging by the second electronic camera 32 is input to the control unit 80 and stored in the storage unit 801.

  Further, the second electronic camera 32 is arranged on the plus side (right side in FIG. 3) in the X direction from the inspection unit 16, and the second device transport head 17 and the inspection unit 16 are inspected when the IC device 90 is inspected. So that it does not interfere with.

  The second electronic camera 32 only needs to be able to capture at least a part of the image of the holding unit 163 reflected by the second reflection surface 521 of the reflecting unit 5, but can capture the entire image of the holding unit 163. In some embodiments, the entire image of the holding unit 163 can be captured.

  Next, the procedure for positioning (teaching) and the operation of the inspection apparatus 1 will be described.

  First, an operator (user) operates the input unit 61 of the operation unit 6 to start positioning. The following positioning is automatically performed under the control of the control unit 80.

  As shown in FIG. 3, the inspection apparatus 1 holds the IC device 90 by each hand unit 171 of the second device transport head 17, and each IC device 90 is directly above each holding unit 163 of the inspection unit 16. The second device transport head 17 is moved so as to be positioned (above the Z direction).

  Next, the reflecting unit 5 is disposed between the predetermined hand unit 171 of the second device transport head 17 and the predetermined holding unit 163 of the inspection unit 16 (first position) by the moving mechanism 4. The predetermined hand unit 171 and the predetermined holding portion 163 may be any of a plurality of hand units 171 and a plurality of holding portions. For example, the predetermined hand unit 171 and the predetermined holding portion 163 may be, for example, the leftmost side in FIG. It is assumed that the hand unit 171 and the predetermined holding portion 163 are located on the lowest side (minus side in the Y direction) in FIG.

  Prior to the movement of the second device transport head 17, the reflection unit 5 may be arranged or may be performed simultaneously.

  Next, the first electronic camera 31 images the IC device 90 held by the hand unit 171, and the second electronic camera 32 images the IC device 90 and the holding unit 163 facing the Z direction. The imaging by the first electronic camera 31 and the imaging by the second electronic camera 32 are performed simultaneously. Thereby, the time required for positioning can be shortened. It should be noted that a time difference may be added to the image captured by the first electronic camera 31 and the image captured by the second electronic camera 32, and either one may be imaged first and the other imaged later.

  Here, the image of the IC device 90 is reflected by the first reflection surface 511 of the reflection unit 5 and is captured by the first electronic camera 31. Then, image data obtained by imaging by the first electronic camera 31 is input to the control unit 80 and stored in the storage unit 801.

  The image of the holding unit 163 is reflected by the second reflecting surface 521 of the reflecting unit 5 and captured by the second electronic camera 32. Then, image data obtained by imaging by the second electronic camera 32 is input to the control unit 80 and stored in the storage unit 801.

  Next, the IC device 90 is positioned with respect to the holding unit 163 based on the image data that is the imaging result of the first electronic camera 31 and the image data that is the imaging result of the second electronic camera 32.

  In this positioning, for example, first, the second device transport head 17 is moved in the Y direction so that the Y-direction positions of the probe pins 165 of the holding unit 163 and the terminals 91 of the IC device 90 match as much as possible. Move.

  Next, the posture of the gripping member 173 of the hand unit 171 is changed so that the position in the X direction and the position in the Y direction of each probe pin 165 of the holding unit 163 and each terminal 91 of the IC device 90 match. Here, the probe pins 165 of the holding part 163 and the terminals 91 of the IC device 90 may all be made to coincide with each other. However, the present invention is not limited to this. For example, typically, two probes positioned on a diagonal line The pin 165 and the two terminals 91 may be matched. The posture of the gripping member 173 can be changed by at least one of the movement of the gripping member 173 in the X direction, the movement in the Y direction, and the rotation around the Z axis by the adjustment mechanism 175. it can. Then, position information in the Y direction of the second device transport head 17 in a state where the position of the IC device 90 with respect to the holding unit 163 is determined, position information in the X direction of the gripping member 173 in the hand unit 171, and the Y direction And the position information around the Z axis are stored in the storage unit 801 as positioning information.

  Next, the reflecting unit 5 is moved to the plus side in the X direction by the moving mechanism 4 and is arranged between the hand unit 171 and the holding unit 163 adjacent to each other on the plus side in the X direction.

  Then, in the same manner as described above, the first electronic camera 31 and the second electronic camera 32 take an image, each image data is stored in the storage unit 801, and the IC device 90 with respect to the holding unit 163 is based on each image data. Perform positioning. In this positioning, the gripping member 173 is adjusted by the adjusting mechanism 175 in the hand unit 171 so that the position in the X direction and the position in the Y direction of each probe pin 165 of the holding unit 163 and each terminal 91 of the IC device 90 match. Change the posture. Then, the position information in the X direction, the position information in the Y direction, and the position information about the Z axis of the gripping member 173 in the hand unit 171 are stored in the storage unit 801 as positioning information.

  Thereafter, similarly, each IC device 90 is positioned with respect to each holding unit 163, and positioning information is stored in the storage unit 801.

  When positioning of all the holding units 163 and the IC devices 90 arranged in the X direction is completed, the entire first electronic camera 31, the second electronic camera 32, the reflecting unit 5, and the moving mechanism 4 are moved in the Y direction by a mechanism (not shown). The reflecting part 5 is arranged between the hand unit 171 and the holding part 163 adjacent to each other on the plus side in the Y direction. Subsequently, similarly, each IC device 90 is positioned with respect to each holding unit 163, and positioning information is stored in the storage unit 801. In this way, positioning is performed for each holding portion 163.

  Thus, the positioning of one second device transport head 17 with respect to the inspection unit 16 is completed.

  Although not described, positioning of the other second device transport head 17 with respect to the inspection unit 16 is performed in the same manner as described above. In this way, teaching of the two second device transport heads 17 is completed.

  Information obtained by the positioning (teaching) is used when the IC device 90 is inspected. That is, when the IC device 90 is inspected, each IC device 90 that is held by each hand unit 171 of the second device transport head 17 is stored in each holding unit 163 of the inspection unit 16 based on the position information. It is accurately placed in the proper position.

  As described above, according to the inspection apparatus 1, the position information of the IC device 90 held by the hand unit 171 at the time of positioning, that is, the position information of each terminal 91 and the holding unit 163 of the inspection unit 16. Position information, that is, position information of each probe pin 165 can be acquired simultaneously, and positioning can be performed easily, quickly and accurately. That is, teaching of the second device transport head 17 can be automatically performed, and labor and time of the operator can be reduced.

  Further, since the reflecting portion 5 has a plate shape, it is possible to save the space between the second device transport head 17 and the inspection portion 16, and to reduce the size of the apparatus.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. Any configuration can be substituted. Moreover, other arbitrary components may be added.

  Moreover, in the said embodiment, although the board | substrate (base material) was provided between the 1st reflective surface and the 2nd reflective surface as a reflection part, it was not limited to this in this invention. For example, the position of the substrate may be a position other than between the first reflecting surface and the second reflecting surface. As a specific example, for example, a transparent substrate (having light transmittance) is provided on at least one of the first reflecting surface and the second reflecting surface.

  In the present invention, for example, the substrate may not have a plate shape, and the substrate may be omitted.

  In the present invention, for example, one reflecting member (for example, a metal plate, a metal film, or the like) is provided as a component of the reflecting portion, and one surface of the reflecting member is used as the first reflecting surface, and the other surface ( The surface opposite to the one surface may be the second reflecting surface.

1 ... Inspection equipment (electronic parts inspection equipment)
11A... First tray transport mechanism 11B... Second tray transport mechanism 12... Temperature adjustment unit (soak plate)
13 …… First device transfer head 131 …… Hand unit 14 …… Device supply unit (supply shuttle)
15 …… Third tray transport mechanism 16 …… Inspection unit 163 …… Holding unit 165 …… Probe pin 17 …… Second device transport head 171 …… Hand unit 172 …… Hand unit body 173 …… Grip member 175 …… Adjustment mechanism 18 …… Device recovery unit (recovery shuttle)
19 …… Recovery tray 20 …… Third device transport head 201 …… Hand unit 21 …… Sixth tray transport mechanism 22A …… Fourth tray transport mechanism 22B …… Fifth tray transport mechanism 31 …… First electronic camera 32... Second electronic camera 4... Moving mechanism 41... Support member 5... Reflecting portion 50 .. Substrate 51... First reflecting member 52 ... Second reflecting member 511. Surface 521 …… Second reflecting surface 512, 522 …… Normal 6 …… Operation section 61 …… Input section 62 …… Display section 80 …… Control section 801 …… Storage section 90 …… IC device 91 …… Terminal 200 ... Tray A1 ... Tray supply area A2 ... Device supply area (supply area)
A3: Inspection area A4: Device collection area (collection area)
A5 …… Tray removal area R1 …… First chamber R2 …… Second chamber R3 …… Third chamber

Claims (7)

An electronic component gripper for gripping electronic components;
An electronic component holding unit for holding the electronic component;
A first imaging unit capable of imaging an electronic component gripped by the electronic component gripping unit;
A second imaging unit capable of imaging the electronic component holding unit and capable of imaging in a direction different from the first imaging unit;
A reflective portion that can be disposed between the electronic component gripping portion and the electronic component holding portion and has a first reflective surface and a second reflective surface different from the first reflective surface;
The first imaging unit can capture an image of at least a part of the electronic component reflected by the first reflecting surface;
The electronic component transport apparatus, wherein the second imaging unit is capable of capturing an image of at least a part of the electronic component holding unit reflected by the second reflecting surface.   The electronic component transport apparatus according to claim 1, wherein positioning of the electronic component and the electronic component holding unit is performed based on an imaging result of the first imaging unit and an imaging result of the second imaging unit.   The electronic component transport apparatus according to claim 2, wherein a plurality of the electronic component holding units are arranged, and the positioning is performed for each electronic component holding unit.   4. The electronic component carrying apparatus according to claim 1, wherein an angle formed between a normal line of the first reflection surface and a normal line of the second reflection surface is 0 °. 5.   Each of the first imaging unit and the second imaging unit captures the direction between the electronic component holding unit and the electronic component holding unit at a position where the electronic component holding unit and the electronic component holding unit are in contact with each other. The electronic component conveying device according to claim 1, wherein the electronic component conveying device is arranged in a possible manner.   6. The reflection unit is movable between a first position between the electronic component gripping unit and the electronic component holding unit and a second position different from the first position. The electronic component conveying apparatus according to any one of the above. An electronic component gripper for gripping electronic components;
An electronic component holding unit for holding the electronic component;
A first imaging unit capable of imaging an electronic component gripped by the electronic component gripping unit;
A second imaging unit capable of imaging the electronic component holding unit and capable of imaging in a direction different from the first imaging unit;
A reflective portion that can be disposed between the electronic component gripping portion and the electronic component holding portion and has a second reflective surface different from the first reflective surface and the first reflective surface;
An inspection unit for inspecting the electronic component,
The first imaging unit can capture an image of at least a part of the electronic component reflected by the first reflecting surface;
The electronic component inspection apparatus, wherein the second imaging unit can capture an image of at least a part of the electronic component holding unit reflected by the second reflecting surface.

Images