TWI696234B - Electronic parts conveying device and electronic parts inspection device - Google Patents

Electronic parts conveying device and electronic parts inspection device Download PDF

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TWI696234B
TWI696234B TW107105516A TW107105516A TWI696234B TW I696234 B TWI696234 B TW I696234B TW 107105516 A TW107105516 A TW 107105516A TW 107105516 A TW107105516 A TW 107105516A TW I696234 B TWI696234 B TW I696234B
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information
conveying
button
electronic
electronic component
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TW107105516A
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TW201834127A (en
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山崎孝
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日商精工愛普生股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • User Interface Of Digital Computer (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

本發明提供一種於設定搬送部之動作時，可容易且正確地進行該設定之電子零件搬送裝置及電子零件檢查裝置。 一種電子零件搬送裝置，其特徵在於具備：搬送部，其搬送電子零件；及顯示部，其可選擇於顯示第1設定畫面之後，顯示第2設定畫面之依序設定模式；上述第1設定畫面可受理用以藉由上述搬送部搬送上述電子零件之第1資訊，上述第2設定畫面可受理用以藉由上述搬送部搬送上述電子零件之與上述第1資訊不同之第2資訊。The present invention provides an electronic component conveying device and an electronic component inspection device that can easily and accurately perform the setting when setting the operation of the conveying section. An electronic parts conveying device, characterized by comprising: a conveying part which conveys electronic parts; and a display part which can select the sequential setting mode of displaying the second setting screen after displaying the first setting screen; the first setting screen The first information for conveying the electronic component by the conveying unit can be accepted, and the second setting screen can accept the second information different from the first information for conveying the electronic component by the conveying unit.

Description

電子零件搬送裝置及電子零件檢查裝置Electronic parts conveying device and electronic parts inspection device

本發明係關於電子零件搬送裝置及電子零件檢查裝置。The invention relates to an electronic parts conveying device and an electronic parts inspection device.

自先前以來，已知有一種檢查例如IC(integrated circuit，積體電路)器件等電子零件之電氣特性之電子零件檢查裝置，於該電子零件檢查裝置，組裝有用以搬送IC器件之IC處理機，即電子零件搬送裝置(例如參照專利文獻1)。 專利文獻1記載之電子零件搬送裝置中，各種資料之輸入或各種動作指示之輸入係於顯示於平板顯示器之操作畫面上進行。又，於對操作畫面操作時，視需要可將幫助畫面顯示於平板顯示器。幫助畫面包含關於操作畫面中所包含之項目之內容解說之詳細資訊。 [先前技術文獻] [專利文獻] [專利文獻1] 日本專利特開平11-38084號公報From the past, there has been known an electronic component inspection device for inspecting the electrical characteristics of electronic components such as IC (integrated circuit) devices, etc. In this electronic component inspection device, an IC processor for transporting IC devices is assembled, That is, an electronic parts conveying device (for example, refer to Patent Document 1). In the electronic component conveying device described in Patent Document 1, the input of various data or the input of various operation instructions is performed on the operation screen displayed on the flat panel display. In addition, when operating the operation screen, the help screen can be displayed on the flat panel display as necessary. The help screen contains detailed information about the content of the items contained in the operation screen. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 11-38084

[發明所欲解決之問題] 然而，專利文獻1記載之電子零件檢查裝置中，存在如下情況：即使顯示有幫助畫面，對操作畫面不熟悉之操作員，即新手操作員亦無法以正確之順序將各種資料等輸入至操作畫面中所包含之項目。 [解決問題之技術手段] 此種目的係藉由下述之本發明而達成。 本發明係為解決上述問題之至少一部分而完成者，可作為以下形態實現。 本發明之電子零件搬送裝置之特徵在於具備：搬送部，其搬送電子零件；及 顯示部，其可選擇於顯示第1設定畫面之後，顯示第2設定畫面之依序設定模式， 上述第1設定畫面可受理用以藉由上述搬送部搬送上述電子零件之第1資訊， 上述第2設定畫面可受理用以藉由上述搬送部搬送上述電子零件之與上述第1資訊不同之第2資訊。 藉此，於對搬送部設定搬送電子零件之動作之情形時，可選擇依序設定模式。該依序設定模式中，依序顯示搬送部之動作設定用第1設定畫面與第2設定畫面。例如於操作員為新手之情形時，該操作員可按照依序顯示於顯示部之第1設定畫面、第2設定畫面，即逐一確認第1設定畫面、第2設定畫面，而確認或輸入第1資訊、第2資訊。藉此，可以正確之順序不遺漏地進行搬送部之動作設定。 本發明之電子零件搬送裝置中，較佳為設置有載置上述電子零件之載置部，且具備可攝像上述載置部之圖像之攝像部。 藉此，可於搬送電子零件之前，藉由攝像部預先攝像載置部之圖像。可基於該攝像圖像而使搬送部正確地移動至目標位置(例如搬送對象即電子零件)。而且，搬送部可於該移動目的地自載置部上正確地固持電子零件。或相反地，搬送部可將電子零件正確地釋放至載置部上。 本發明之電子零件搬送裝置中，上述攝像部較佳為搭載於上述搬送部。 藉此，可於搬送電子零件之前，藉由攝像部預先攝像載置部之圖像。可基於該攝像圖像而使搬送部正確地移動至目標位置(例如搬送對象即電子零件)。而且，搬送部可於該移動目的地自載置部上正確地固持電子零件。或相反地，搬送部可將電子零件正確地釋放至載置部上。 本發明之電子零件搬送裝置中，較佳為上述第1資訊及上述第2資訊中之至少一者為用以基於上述載置部之圖像而藉由上述搬送部搬送上述電子零件之資訊。 藉此，可基於載置部之圖像而順暢地進行電子零件之搬送。 本發明之電子零件搬送裝置中，上述載置部具有收納上述電子零件，且陣列狀配置之複數個凹部， 上述第1資訊及上述第2資訊中之至少一者較佳為如下資訊中之任一者： 用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定於俯視時成為基準之上述凹部之資訊； 用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時顯示成為基準之上述凹部之攝像圖像之資訊； 用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定成為相對於載置部之高度基準之上述凹部之資訊； 用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定成為高度基準之上述載置部之面的資訊。 此種第1資訊或第2資訊成為相鄰之凹部彼此之間距間距離愈小，則迅速且正確地進行電子零件之固持或釋放所越需要之資訊。藉此，可迅速且正確地進行電子零件之固持或釋放。 本發明之電子零件搬送裝置中，較佳為上述第1資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定於俯視時成為基準之上述凹部之資訊， 上述第2資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時顯示成為基準之上述凹部之攝像圖像之資訊。 若未指定凹部，則難以獲得凹部之攝像圖像，故此種資訊之順序有效。 本發明之電子零件搬送裝置中，較佳為上述第1資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時顯示成為基準之上述凹部之資訊， 上述第2資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定成為高度基準之上述載置部之面之資訊。 若未獲得凹部之攝像圖像，則難以掌握載置部之凹部附近，即難以掌握載置部之上表面存在於何處，故此種資訊之順序有效。 本發明之電子零件搬送裝置中，較佳為上述第1資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定俯視時成為相對於載置部之高度基準之上述凹部之資訊， 上述第2資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定成為高度基準之上述載置部之面之資訊。 若未指定成為高度基準之凹部，則難以掌握該指定凹部與成為高度基準之載置部之上表面之指定部位的位置關係，故此種資訊之順序有效。 本發明之電子零件搬送裝置中，上述第1設定畫面較佳為包含使上述第2設定畫面顯示之第2設定畫面顯示操作部。 藉此，於操作第2設定畫面顯示操作部之前，保持於顯示部顯示第1設定畫面之狀態，藉此，例如可充分確保充分確認或輸入第1資訊之時間。 本發明之電子零件搬送裝置中，上述第1設定畫面至少包含1個核取方塊，於核取所有上述核取方塊之情形時，較佳為可對上述第2設定畫面顯示操作部進行操作。 藉此，可防止遺漏對核取方塊之核取。 本發明之電子零件搬送裝置中，上述依序設定模式較佳為包含第3設定畫面。 藉此，例如可將第3設定畫面設為具有與第1設定畫面或第2設定畫面不同之功能之圖像。 本發明之電子零件搬送裝置中，較佳為於上述顯示部省略上述第1設定畫面或上述第2設定畫面之顯示，而顯示使上述第3設定畫面顯示之第3設定畫面顯示操作部。 藉此，可省略第1資訊或第2資訊之確認或輸入。 本發明之電子零件搬送裝置中，較佳為可選擇為並列顯示上述第1設定畫面與上述第2設定畫面之一併設定模式。 藉此，例如於操作員為熟練者之情形時，認為相比依序設定模式，選擇一併設定模式可更迅速進行搬送部之動作設定。 本發明之電子零件搬送裝置中，較佳為於上述顯示部顯示可選擇上述依序設定模式與上述一併設定模式之任一者之模式選擇操作部。 藉此，電子零件搬送裝置之操作員可根據操作電子零件檢查裝置之熟練度，而選擇依序設定模式與一併設定模式之任一者。例如，較佳為例如於操作員為熟練者之情形時，可選擇一併設定模式，相反地，於操作員為新手之情形時，選擇依序設定模式。 本發明之電子零件搬送裝置中，較佳為上述依序設定模式包含可自上述依序設定模式之中途轉移至上述一併設定模式之一併設定模式轉移操作部。 藉此，可於中途停止依序設定模式，於一併設定模式重新進行第1資訊或第2資訊之輸入等。 本發明之電子零件搬送裝置中，較佳為上述一併設定模式包含可自上述一併設定模式轉移至上述依序設定模式之依序設定模式轉移操作部。 藉此，可停止一併設定模式，於依序設定模式重新進行第1資訊或第2資訊等之輸入等。 本發明之電子零件搬送裝置中，較佳為可連接於檢查上述電子零件之檢查部，且具備： 供給區域，其供將檢查前之上述電子零件搬送並供給至上述檢查部；及 回收區域，其供自上述檢查部搬送並回收檢查後之上述電子零件；且 上述依序設定模式係對上述供給區域及上述回收區域設定。 藉此，可於供給區域以正確順序不遺漏地進行搬送部之動作所需要之各種條件之設定。同樣地，可於回收區域以正確順序不遺漏地進行搬送部之動作所需要之各種條件之設定。 本發明之電子零件檢查裝置之特徵在於具備：搬送部，其搬送電子零件； 顯示部，其可選擇於顯示第1設定畫面之後，顯示第2設定畫面之依序設定模式；及 檢查部，其檢查上述電子零件； 上述第1設定畫面可受理用以藉由上述搬送部搬送上述電子零件之第1資訊， 上述第2設定畫面可受理用以藉由上述搬送部搬送上述電子零件之與上述第1資訊不同之第2資訊。 藉此，於對搬送部設定搬送電子零件之動作之情形時，可選擇依序設定模式。該依序設定模式中，依序顯示搬送部之動作設定用第1設定畫面與第2設定畫面。例如於操作員為新手之情形時，該操作員可按照依序顯示於顯示部之第1設定畫面、第2設定畫面，即逐一確認第1設定畫面、第2設定畫面而確認或輸入第1資訊、第2資訊。藉此，可以正確順序不遺漏地進行搬送部之動作設定。 又，可將電子零件搬送至檢查部，藉此，可於檢查部對該電子零件進行檢查。又，可自檢查部搬送檢查後之電子零件。[Problems to be Solved by the Invention] However, in the electronic part inspection device described in Patent Document 1, there are cases where even if a help screen is displayed, an operator who is not familiar with the operation screen, that is, a novice operator cannot be in the correct order Input various data, etc. to the items included in the operation screen. [Technical Means for Solving the Problem] This object is achieved by the present invention described below. The present invention has been completed to solve at least a part of the above problems, and can be implemented as the following forms. The electronic part conveying device of the present invention is characterized by comprising: a conveying part which conveys electronic parts; and a display part which can select the sequential setting mode in which the second setting screen is displayed after displaying the first setting screen, the first setting The screen can accept the first information for conveying the electronic component by the conveying unit, and the second setting screen can accept the second information that is different from the first information for conveying the electronic component by the conveying unit. Thereby, when setting the movement of conveying the electronic parts to the conveying part, the sequential setting mode can be selected. In this sequential setting mode, the first setting screen and the second setting screen for the operation setting of the transport unit are displayed in order. For example, when the operator is a novice, the operator can sequentially display the first setting screen and the second setting screen on the display section, that is, confirm the first setting screen and the second setting screen one by one, and confirm or enter the first 1 information, 2nd information. Thereby, the operation setting of the conveying unit can be performed in the correct order without omission. In the electronic component conveying device of the present invention, it is preferable to provide a mounting portion for mounting the electronic component, and an imaging portion capable of capturing an image of the mounting portion. With this, the image of the placement unit can be imaged in advance by the imaging unit before the electronic parts are transported. Based on the captured image, the transport unit can be accurately moved to the target position (for example, an electronic component to be transported). In addition, the transport unit can accurately hold the electronic component on the moving destination self-mounting unit. Or on the contrary, the conveying part can correctly release the electronic parts onto the placing part. In the electronic component conveying device of the present invention, the imaging unit is preferably mounted on the conveying unit. With this, the image of the placement unit can be imaged in advance by the imaging unit before the electronic parts are transported. Based on the captured image, the transport unit can be accurately moved to the target position (for example, an electronic component to be transported). In addition, the transport unit can accurately hold the electronic component on the moving destination self-mounting unit. Or on the contrary, the conveying part can correctly release the electronic parts onto the placing part. In the electronic component conveying device of the present invention, it is preferable that at least one of the first information and the second information is information for conveying the electronic component by the conveying unit based on the image of the placement unit. With this, the electronic parts can be smoothly transported based on the image of the placement portion. In the electronic component conveying device of the present invention, the mounting portion has a plurality of concave portions that accommodate the electronic components and are arranged in an array, and at least one of the first information and the second information is preferably any of the following information One: used to hold the electronic part in the conveying part, or release the information of the concave part that becomes the reference when viewed from above when releasing the held electronic part; used to hold the electronic part in the conveying part, or release the held part The electronic part displays the information of the captured image of the concave part as a reference; it is used to hold the electronic part in the conveying part or release the held electronic part and designate the information of the concave part as the height reference relative to the mounting part ; Information used to designate the surface of the placement part that becomes the height reference when the conveying part holds the electronic part or releases the held electronic part. Such first information or second information becomes the information required for the holding and release of electronic parts quickly and correctly as the distance between adjacent recesses becomes smaller. With this, the electronic parts can be held or released quickly and correctly. In the electronic component conveying device of the present invention, it is preferable that the first information is used to hold the electronic component in the conveying portion or to release the held electronic component and specify the information of the concave portion that becomes the reference when viewed from above. 2 The information is information for displaying the captured image of the concave portion as a reference when the conveying portion holds the electronic component or releases the held electronic component. If the recess is not specified, it is difficult to obtain the captured image of the recess, so the order of this information is valid. In the electronic component conveying device of the present invention, it is preferable that the first information is used to display the information of the concave portion as a reference when the conveying portion holds the electronic component or releases the held electronic component, and the second information is It is used to designate the information of the surface of the placing part that becomes the height reference when the conveying part holds the electronic part or releases the held electronic part. If the captured image of the concave portion is not obtained, it is difficult to grasp the vicinity of the concave portion of the mounting portion, that is, it is difficult to grasp where the upper surface of the mounting portion exists, so the order of such information is effective. In the electronic component conveying device of the present invention, it is preferable that the first information is used to hold the electronic component in the conveying portion or release the held electronic component to specify the height reference relative to the mounting portion when viewed from above. For the information of the concave portion, the second information is information for specifying the surface of the placement portion that becomes the height reference when the conveying portion holds the electronic component or releases the held electronic component. If the recessed portion to be the height reference is not specified, it is difficult to grasp the positional relationship between the designated recessed portion and the designated portion on the upper surface of the placement portion to be the height reference, so the order of such information is valid. In the electronic component conveying device of the present invention, the first setting screen preferably includes a second setting screen display operation unit that displays the second setting screen. With this, the state where the first setting screen is displayed on the display section is maintained until the second setting screen display operating section is operated, thereby, for example, sufficient time for sufficiently confirming or inputting the first information can be ensured. In the electronic component conveying device of the present invention, the first setting screen includes at least one check box. When checking all the check boxes, it is preferable to operate the second setting screen display operation unit. By this, it is possible to prevent the omission of the check of the check block. In the electronic component conveying device of the present invention, the aforementioned sequential setting mode preferably includes a third setting screen. With this, for example, the third setting screen can be set to an image having a different function from the first setting screen or the second setting screen. In the electronic component conveying device of the present invention, it is preferable that the display unit omits the display of the first setting screen or the second setting screen and displays the third setting screen display operation unit that displays the third setting screen. With this, the confirmation or input of the first information or the second information can be omitted. In the electronic component conveying device of the present invention, it is preferable that one of the first setting screen and the second setting screen can be displayed in parallel to set the mode. By this, for example, when the operator is a skilled person, it is considered that the operation setting of the conveying unit can be set more quickly than selecting the setting mode in sequence compared to the sequential setting mode. In the electronic component conveying device of the present invention, it is preferable that a mode selection operation unit that can select any one of the sequential setting mode and the collective setting mode is displayed on the display unit. Thereby, the operator of the electronic component conveying device can select either the sequential setting mode or the collective setting mode according to the proficiency in operating the electronic component inspection device. For example, it is preferable to select the setting mode together when the operator is a skilled person, and conversely, to select the sequential setting mode when the operator is a novice. In the electronic component conveying device of the present invention, it is preferable that the sequential setting mode includes a mode transfer operation portion that can be transferred from one of the sequential setting modes to one of the collective setting modes. In this way, the sequential setting mode can be stopped halfway, and the first information or the second information can be input again in the collective setting mode. In the electronic component conveying device of the present invention, it is preferable that the collective setting mode includes a sequential setting mode transfer operation section that can be transferred from the collective setting mode to the sequential setting mode. With this, the collective setting mode can be stopped, and the input of the first information or the second information, etc. can be re-entered in the sequential setting mode. The electronic component conveying device of the present invention is preferably connectable to an inspection section for inspecting the electronic components, and further includes: a supply area for conveying and supplying the electronic components before inspection to the inspection section; and a collection area, It is supplied from the inspection unit and the electronic parts after inspection are recovered; and the sequential setting mode is set for the supply area and the recovery area. Thereby, various conditions required for the operation of the conveying section can be set in the supply area in the correct order without omission. Similarly, the various conditions required for the operation of the conveying unit can be set in the correct order without omission in the collection area. The electronic part inspection device of the present invention is characterized by comprising: a conveying part which conveys electronic parts; a display part which can select a sequential setting mode in which the second setting screen is displayed after displaying the first setting screen; and an inspection part which Check the electronic parts; the first setting screen can accept the first information for conveying the electronic parts by the conveying part, and the second setting screen can accept the first information for conveying the electronic parts by the conveying part and the first 1 The second information with different information. Thereby, when setting the movement of conveying the electronic parts to the conveying part, the sequential setting mode can be selected. In this sequential setting mode, the first setting screen and the second setting screen for the operation setting of the transport unit are displayed in order. For example, when the operator is a novice, the operator can sequentially display the first setting screen and the second setting screen on the display section, that is, confirm the first setting screen and the second setting screen one by one to confirm or enter the first Information, the second information. Thereby, the operation setting of the conveying section can be performed in the correct order without omission. In addition, the electronic component can be transported to the inspection section, whereby the electronic component can be inspected at the inspection section. In addition, the electronic parts after inspection can be transported from the inspection department.

以下，基於隨附圖式所示之較佳實施形態，詳細說明本發明之電子零件搬送裝置及電子零件檢查裝置。 以下，參照圖1～圖24，對本發明之電子零件搬送裝置及電子零件檢查裝置之第1實施形態進行說明。再者，於以下，為了便於說明，如圖1所示，將相互正交之3軸設為X軸、Y軸及Z軸。又，包含X軸與Y軸之XY平面成為水平，Z軸成為鉛直。又，亦將平行於X軸之方向稱為「X方向(第1方向)」，將平行於Y軸之方向稱為「Y方向(第2方向)」，將平行於Z軸之方向稱為「Z方向(第3方向)」。又，將各方向之箭頭朝向之方向稱為「正」，將其相反方向稱為「負」。又，於本案說明書言及之「水平」並非限定於完全水平，只要不阻礙電子零件之搬送，則亦包含相對於水平略微(例如小於5°左右)傾斜之狀態。 本發明之電子零件搬送裝置10具有圖1所示之外觀，成為圖2所示之配置(構成)。該電子零件搬送裝置10為處理機，具備：器件搬送頭13(搬送部25)，其搬送電子零件；及監視器300(顯示部)，其可選擇於顯示第1設定畫面之後，顯示第2設定畫面之依序設定模式。而且，顯示於監視器300之第1設定畫面可受理用以藉由器件搬送頭13(搬送部25)搬送電子零件之第1資訊，第2設定畫面可受理用以藉由搬送部25搬送電子零件之與第1資訊不同之第2資訊。 藉此，如後述，對搭載有攝像部131之器件搬送頭13(搬送部25)，於一面進行利用攝像部131之攝像一面設定搬送電子零件之動作之情形時，可選擇依序設定模式。該依序設定模式中，依序顯示器件搬送頭13之動作設定用第1設定畫面與第2設定畫面。例如於操作員為新手之情形時，該操作員可按照依序顯示於監視器300之第1設定畫面、第2設定畫面，即逐一確認第1設定畫面、第2設定畫面而確認或輸入第1資訊、第2資訊。藉此，可以正確順序不遺漏地進行器件搬送頭13之動作設定。 又，如圖2所示，本實施形態之電子零件檢查裝置1具有電子零件搬送裝置10，進而具有檢查電子零件之檢測部16。即，本發明之電子零件檢查裝置1具備：器件搬送頭13(搬送部25)，其搬送電子零件；監視器300(顯示部)，其可選擇於顯示第1設定畫面之後，顯示第2設定畫面之依序設定模式；及檢查部16，其檢查電子零件。而且，顯示於監視器300之第1設定畫面可受理用以藉由器件搬送頭13(搬送部25)搬送電子零件之第1資訊，第2設定畫面可受理用以藉由器件搬送頭13(搬送部25)搬送電子零件之與第1資訊不同之第2資訊。 藉此，可獲得具備上述電子零件搬送裝置10之優點之電子零件檢查裝置1。又，可將電子零件搬送至檢查部16，藉此，可於檢查部16對該電子零件進行檢查。又，可自檢查部16搬送檢查後之電子零件。 以下，對於各部之構成詳細說明。 如圖1、圖2所示，內置電子零件搬送裝置10之電子零件檢查裝置1例如為如下裝置，即，搬送BGA(Ball Grid Array：球狀柵格陣列)封裝即IC器件等電子零件，於其搬送過程中檢查/測試(以下簡稱為「檢查」)電子零件之電氣特性。再者，於以下，為了便於說明，針對使用IC器件作為上述電子零件之情形作為代表進行說明，且將該IC器件設為「IC器件90」。IC器件90於本實施形態中成為形成平板狀者。 再者，作為IC器件，除上述者以外，列舉例如「LSI(Large Scale Integration：大型積體電路)」、「CMOS(Complementary Metal Oxide Semiconductor：互補金屬氧化物半導體)」、「CCD(Charge Coupled Device：電荷耦合裝置)」、或將IC器件複數個模組化而成之「模組IC」、又「晶體器件」、「壓力感測器」、「慣性感測器(加速度感測器)」、「陀螺感測器」、以及「指紋感測器」等。 電子零件檢查裝置1(電子零件搬送裝置10)具備托盤供給區域A1、器件供給區域A2(供給區域)、檢查區域A3、器件回收區域A4(回收區域)、及托盤去除區域A5，該等區域如後述係以各壁部分隔。而且，IC器件90係自托盤供給區域A1至托盤去除區域A5按箭頭α90 方向依序經由上述各區域，且於中途之檢查區域A3進行檢查。如此，電子零件檢查裝置1成為如下者，即，具備：電子零件搬送裝置10，其具有以經由各區域之方式搬送IC器件90(電子零件)之搬送部25；檢查部16，其於檢查區域A3內進行檢查；及控制部800。又，此外，電子零件檢查裝置1具備監視器300、信號燈400、及操作面板700。 再者，電子零件檢查裝置1為配置有托盤供給區域A1及托盤去除區域A5之方，即圖2中之下側成為正面側，且配置有檢查區域A3之方，即圖2中之上側作為背面側使用。 又，電子零件檢查裝置1係預先搭載(設置)有針對IC器件90之每一種類而進行更換之稱為「變更套件(Change Kit(亦會記作「C/K」)」者而使用。該變更套件有載置IC器件90(電子零件)之載置構件(載置部)，於該載置構件，有配置於器件供給區域A2之第1載置構件、及配置於器件回收區域A4之第2載置構件。作為第1載置構件，例如有後述之溫度調整部12、器件供給部14、及旋轉台27。作為第2載置構件，例如有後述之器件回收部18、及旋轉台28。又，於載置IC器件90之載置構件，除如上述之變更套件外，亦有使用者準備之托盤200、回收托盤19,，此外檢查部16。配置於器件供給區域A2之托盤200亦可稱為第1載置構件，配置於器件回收區域A4之托盤200及回收用托盤19亦可稱為第2載置構件。 托盤供給區域A1係被供給排列有未檢查狀態之複數個IC器件90之托盤200之供材部。托盤供給區域A1亦可稱為可重疊搭載複數個托盤200之搭載區域。再者，本實施形態中，於各托盤200陣列狀配置有複數個凹部(凹槽)。可將IC器件90逐一收納於各凹部。 器件供給區域A2係供將自托盤供給區域A1搬送而來之托盤200上之檢查前之各IC器件90(電子零件)搬送並供給至檢查區域A3(檢查部16)之區域。再者，以跨托盤供給區域A1與器件供給區域A2之方式，設置有於水平方向逐片搬送托盤200之托盤搬送機構11A、11B。托盤搬送機構11A為搬送部25之一部分，可使托盤200連同載置於該托盤200之IC器件90向Y方向正側，即向圖2中之箭頭α11A 方向移動。藉此，可將IC器件90穩定地送入至器件供給區域A2。又，托盤搬送機構11B係可使空的托盤200向Y方向負側，即向圖2中之箭頭α11B 方向移動之移動部。藉此，可使空的托盤200自器件供給區域A2移動至托盤供給區域A1。 於器件供給區域A2，設置有溫度調整部(均熱板(英語記作：soak plate，中文記作(一例)：均溫板))12、器件搬送頭13、托盤搬送機構15、及旋轉台27。又，亦設置有以跨器件供給區域A2與檢查區域A3之方式移動之器件供給部14。 溫度調整部12為載置複數個IC器件90之載置構件，稱為可將該載置之IC器件90一併加熱或冷卻之「均熱板」。藉由該均熱板，可將利用檢查部16檢查之前之IC器件90預先加熱或冷卻，調整至適於該檢查(高溫檢查或低溫檢查)之溫度。於圖2所示之構成中，溫度調整部12係於Y方向上配置並固定有2個。而且，藉由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90被搬送至任一溫度調整部12。再者，藉由作為該載置部之溫度調整部12被固定，而可對該溫度調整部12上之IC器件90穩定地調整溫度。溫度調整部12接地(接地)。 器件搬送頭13具有固持IC器件90之固持部，在器件供給區域A2內可於X方向及Y方向移動地被支持，進而亦於Z方向可移動地被支持。該器件搬送頭13亦為搬送部25之一部分，可承擔自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與後述之器件供給部14之間的IC器件90之搬送。再者，於圖2中，將器件搬送頭13之X方向之移動以箭頭α13X 表示，將器件搬送頭13之Y方向之移動以箭頭α13Y 表示。 器件供給部14為載置經溫度調整部12溫度調整之IC器件90之載置構件，係可將該IC器件90搬送至檢查部16附近之被稱為「供給用梭板」或簡稱為「供給梭」者。該器件供給部14亦可成為搬送部25之一部分。 又，作為載置構件之器件供給部14可沿X方向，即α14 方向往返移動於器件供給區域A2與檢查區域A3之間地被支持。藉此，器件供給部14可將IC器件90自器件供給區域A2穩定地搬送至檢查區域A3之檢查部16附近，又，器件供給部14可將IC器件90於檢查區域A3藉由器件搬送頭17取走之後再次返回至器件供給區域A2。 又，圖2所示之構成中，器件供給部14於Y方向配置有2個，將Y方向負側之器件供給部14稱為「器件供給部14A」，將Y方向正側之器件供給部14稱為「器件供給部14B」。而且，溫度調整部12上之IC器件90於器件供給區域A2內被搬送至器件供給部14A或器件供給部14B。又，器件供給部14與溫度調整部12同樣地，構成為可加熱或冷卻載置於該器件供給部14之IC器件90。藉此，可對經溫度調整部12溫度調整之IC器件90，維持其溫度調整狀態而搬送至檢查區域A3之檢查部16附近。器件供給部器14亦與溫度調整部12同樣地接地。 在器件供給部14A與器件供給部14B之間配置有旋轉台27。旋轉台27可繞Z軸向箭頭α27 方向旋動地被支持。而且，將IC器件90載置於器件供給部14時，於欲變更(改變)IC器件90之姿勢，即IC器件90繞Z軸之朝向而載置之情形時，可將IC器件90暫時載置於旋轉台27。於該載置狀態下旋轉台27旋動，藉此可變更IC器件90之姿勢。經姿勢變更之IC器件90於保持該姿勢之狀態下，藉由器件搬送頭13被搬送至器件供給部14。 托盤搬送機構15係將已去除所有IC器件90之狀態之空的托盤200於供給區域A2內，向X方向正側，即箭頭α15 方向搬送之機構。而且，於該搬送後，空的托盤200係藉由托盤搬送機構11B自器件供給區域A2返回至托盤供給區域A1。 檢查區域A3係檢查IC器件90之區域。於該檢查區域A3設置有對IC器件90進行檢查之檢查部16、及器件搬送頭17。 器件搬送頭17為搬送部25之一部分，可固持維持著上述溫度調整狀態之IC器件90，於檢查區域A3內搬送該IC器件90。該器件搬送頭17於檢查區域A3內可於Y方向及Z方向往返移動地被支持，成為稱為「指壁」之機構之一部分。藉此，器件搬送頭17可將自器件供給區域A2搬入之器件供給部14上之IC器件90搬送並載置於檢查部16上。再者，於圖2中，將器件搬送頭17之Y方向之往返移動以箭頭α17X 表示。又，器件搬送頭17可於Y方向往返移動地被支持，但並非限定於此，亦可為亦能於X方向往返移動地被支持。又，圖2所示之構成中，器件搬送頭17於Y方向配置有2個，有將Y方向負側之器件搬送頭17稱為「器件搬送頭17A」，將Y方向正側之器件搬送頭17稱為「器件搬送頭17B」之情形。器件搬送頭17A可於檢查區域A3內擔負IC器件90自器件供給部14A向檢查部16之搬送，器件搬送頭17B可於檢查區域A3內擔負IC器件90自器件供給部14B向檢查部16之搬送。 又，器件搬送頭17與溫度調整部12同樣地，構成為可加熱或冷卻所固持之IC器件90。藉此，可自器件供給部14至檢查部16持續維持IC器件90之溫度調整狀態。 檢查部16係如下者，其可與電子零件搬送裝置10連接，於該連接狀態下，載置電子零件即IC器件90而檢查該IC器件90之電氣特性。於檢查部16，設置有與該IC器件90之端子電性連接之複數個探針。而且，藉由將IC器件90之端子與探針電性連接，即觸點，而可進行IC器件90之檢查。IC器件90之檢查係基於與檢查部16連接之測試器具備之檢查控制部中所記憶之程式而進行。再者，於檢查部16中，亦可與溫度調整部12同樣地，將IC器件90加熱或冷卻而將該IC器件90調整為適於檢查之溫度。 器件回收區域A4係將於檢查區域A3檢查且該檢查結束即檢查後之複數個IC器件90(電子零件)自檢查部16搬送並回收之區域。於該器件回收區域A4，設置有回收用托盤19、器件搬送頭20、托盤搬送機構21、及旋轉台28。又，亦設置有以跨檢查區域A3與器件回收區域A4之方式移動之器件回收部18。又，亦於器件回收區域A4準備有空的托盤200。 器件回收部18為載置已結束於檢查部16之檢查之IC器件90，且可將該IC器件90搬送至器件回收區域A4之載置構件，稱為「回收用梭板」或簡稱為「回收梭」。該器件回收部18亦可成為搬送部25之一部分。 又，器件回收部18可沿X方向，即箭頭α18 方向往返移動於檢查區域A3與回收區域A4之間。又，圖2所示之構成中，器件回收部18與器件供給部14同樣地，於Y方向配置有2個，有將Y方向負側之器件回收部18稱為「器件回收部18A」，將Y方向正側之器件回收部18稱為「器件回收部18B」之情形。而且，將檢查部16上之IC器件90搬送並載置於器件回收部18A或器件回收部18B。再者，IC器件90自檢查部16向器件回收部18A之搬送係由器件搬送頭17A承擔，自檢查部16向器件回收部18B之搬送係由器件搬送頭17B承擔。又，器件回收部18亦與溫度調整部12或器件供給部14同樣地接地。 回收用托盤19係載置經檢查部16檢查之IC器件90之載置部，以不於器件回收區域A4內移動之方式固定。藉此，即使為配置有較多器件搬送頭20等各種可動部之器件回收區域A4，亦可於回收用托盤19上穩定地載置完成檢查之IC器件90。再者，於圖2所示之構成中，回收用托盤19沿X方向配置有3個。 又，空的托盤200亦沿X方向配置有3個。該空的托盤200亦成為載置經檢查部16檢查之IC器件90之載置構件。而且，移動至器件回收區域A4之器件回收部18上之IC器件90被搬送並載置至回收用托盤19及空的托盤200中之任一者。藉此，IC器件90依每一檢查結果分類並回收。 器件搬送頭20具有於器件回收區域A4內可於X方向及Y方向移動地被支持，進而亦可於Z方向移動之部分。該器件搬送頭20係搬送部25之一部分，可將IC器件90自器件回收部18搬送至回收用托盤29或空的托盤200。再者，於圖2中，將器件搬送頭20之X方向之移動以箭頭α20X 表示，將器件搬送頭20之Y方向之移動以箭頭α20Y 表示。 托盤搬送機構21係將自托盤去除區域A5搬入之空的托盤200於器件回收區域A4內，向X方向即箭頭α21 方向搬送之機構。而且，於該搬送後，空的托盤200會被配置於回收IC器件90之位置，即，可成為上述3個空的托盤200中之任一者。 托盤去除區域A5係將排列有完成檢查狀態之複數個IC器件90之托盤200回收並去除之除材部。於托盤去除區域A5中，可堆疊多個托盤200。 在器件回收部18A與器件回收部18B之間配置有旋轉台28。旋轉台28可繞Z軸向箭頭α28 方向旋動地被支持。而且，於將IC器件90載置於例如空的托盤200時，於欲使IC器件90之姿勢回復至原來狀態，即利用旋轉台27變更姿勢前之狀態之情形時，可將IC器件90暫時載置於旋轉台28。該載置狀態下旋轉台28旋動，藉此可變更IC器件90之姿勢。已回復姿勢之IC器件90於保持該姿勢之狀態下，藉由器件搬送頭20被搬送至空的托盤200。 又，以跨器件回收區域A4與托盤去除區域A5之方式，設置有於Y方向逐片搬送托盤200之托盤搬送機構22A、托盤搬送機構22B。托盤搬送機構22A係搬送部25之一部分，係可使托盤200於Y方向即箭頭α22A 方向往返移動之移動部。藉此，可將完成檢查之IC器件90自器件回收區域A4搬送至托盤去除區域A5。又，托盤搬送機構22B可將用以回收IC器件90之空的托盤200向Y方向正側，即箭頭α22B 方向移動。藉此，可將空的托盤200自托盤去除區域A5移動至器件回收區域A4。 控制部800例如可控制如下各部之作動，即，各部為托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、器件供給部14、器件搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、托盤搬送機構22B、旋轉台27、及旋轉台28等。 操作者可經由監視器300設定或確認電子零件檢查裝置1之動作條件等。該監視器300具有例如由液晶畫面構成之顯示畫面301，且配置於電子零件檢查裝置1之正面側上部。如圖1所示，於托盤去除區域A5之圖中右側，設置有載置滑鼠之滑鼠台600。該滑鼠係於操作顯示於監視器300之畫面時使用。 又，於圖1之右下方，相對監視器300配置有操作面板700。操作面板700係與監視器300不同地對電子零件檢查裝置1命令期望之動作者。 又，信號燈400可藉由發光之顏色之組合而報知電子零件檢查裝置1之作動狀態等。信號燈400配置於電子零件檢查裝置1之上部。再者，於電子零件檢查裝置1內置有揚聲器500，亦可藉由該揚聲器500而報知電子零件檢查裝置1之作動狀態等。 電子零件檢查裝置1中，托盤供給區域A1與器件供給區域A2之間由第1隔板231區隔，器件供給區域A2與檢查區域A3之間由第2隔板232區隔，檢查區域A3與器件回收區域A4之間由第3隔板233區隔，器件回收區域A4與托盤去除區域A5之間由第4隔板234區隔。又，器件供給區域A2與器件回收區域A4之間亦由第5隔板235區隔。 電子零件檢查裝置1之最外裝係由外殼覆蓋，該外殼有例如前外殼241、側外殼242、側外殼243、後外殼244及頂外殼245。 如上述，於器件供給區域A2設置有載置IC器件90(電子零件)之托盤200(載置部)。於托盤200陣列狀配置有複數個逐個收納IC器件之凹部。例如，根據IC器件90之大小，相鄰之凹部彼此之間距間距離有變得極其狹窄之情形。該情形時，有器件搬送頭13自托盤200固持IC器件90時損壞IC器件90之虞。因此，如圖2所示，電子零件檢查裝置1(電子零件搬送裝置10)具備攝像部131，該攝像部131係為了正確地自托盤200上固持IC器件90，而可攝像該托盤200(載置部)之凹部之圖像。攝像部131搭載於器件搬送頭13(搬送部25)。再者，攝像部131係以例如CCD(Charge Coupled Device：電荷耦合裝置)攝像機構成，並朝Z方向負側配置。 電子零件檢查裝置1中，於固持IC器件90之前，預先藉由攝像部131攝像托盤200之凹部之圖像。可基於該攝像圖像，使器件搬送頭13正確地移動至目標位置，即固持對象亦即IC器件90。而且，器件搬送頭13可於該移動目的地正確地固持IC器件90。 又，如上述，亦於器件回收區域A4設置有載置IC器件90(電子零件)之托盤200(載置部)。與上述同樣地，相鄰之凹部彼此之間距間距離極其狹窄之情形時，有器件搬送頭20將IC器件90正確地釋放至托盤200時損壞IC器件90之虞。因此，如圖2所示，電子零件檢查裝置1(電子零件搬送裝置10)具備攝像部201，該攝像部201係為了自托盤200上正確地釋放IC器件90，而可攝像該托盤200(載置部)之凹部之圖像。攝像部201搭載於器件搬送頭20(搬送部25)。再者，攝像部201亦與攝像部131同樣地，例如以CCD(Charge Coupled Device：電荷耦合裝置)攝像機構成，並朝Z方向負側配置。 電子零件檢查裝置1中，於釋放IC器件90前，預先藉由攝像部201攝像托盤200之凹部之圖像。可基於該攝像圖像，使器件搬送頭20正確地移動至目標位置，即應收納IC器件90之凹部。而且，器件搬送頭20可於該移動目的地釋放IC器件90。 電子零件檢查裝置1中，如上述，於使用攝像部131或攝像部201之情形時，需要對電子零件檢查裝置1設定各種條件。該設定係選擇使用依序設定模式(第1模式)與一併設定模式(第2模式)之任一者。依序設定模式係於監視器300依序顯示各種條件之設定，即可以向導形式(對話形式)進行之模式。一併設定模式係可於監視器300一併顯示並進行各種條件之設定之模式。 如上述，電子零件搬送裝置10可連接於檢查IC器件90(電子零件)之檢查部16。又，電子零件搬送裝置10具備：器件供給區域A2(供給區域)，其將檢查前之IC器件90(電子零件)搬送並供給至檢查部16；及器件回收區域A4(回收區域)，其自檢查部16搬送並回收檢查後之IC器件90(電子零件)。而且，依序設定模式係對器件供給區域A2(供給區域)及器件回收區域A4(回收區域)設定。藉此，可以正確順序不遺漏地於器件供給區域A2進行使用攝像部131時之各種條件之設定。又，可以正確順序不遺漏地於器件回收區域A4進行使用攝像部201時之各種條件之設定。與依序設定模式同樣地，一併設定模式亦對器件供給區域A2及器件回收區域A4設定。 以下，代表性地針對器件供給區域A2中之依序設定模式與一併設定模式進行說明。於依序設定模式、一併設定模式之執行前、執行中、執行後之任一者，圖3～圖24所示之各表單適當地顯示於監視器300。再者，亦有將「表單」稱為「畫面」、「對話」、「窗口」等之情形。 首先，於監視器30顯示圖3所示之表單FM1。表單FM1為主畫面。該表單FM1中包含按鈕群BT100、第1項目群IT110、第2項目群IT120、第3項目群IT130、第4項目群IT140、及第5項目群IT150。 按鈕群BT100包含「結束」用按鈕BT101、「關閉」用按鈕BT102、「品種設定」用按鈕BT103、「單元設定」用按鈕BT104、「維護」用按鈕BT105、「用戶定義」用按鈕BT106、及「計算器」用按鈕BT107。 第1項目群IT100包含「用戶選擇」設定用項目IT111、「溫度模式」設定用項目IT112、「測試器連接」設定用項目IT113、「搬送模式」設定用項目IT114、「開始模式」設定用項目IT115、「接腳設定」設定用項目IT116、「器件旋轉」設定用項目IT117、「設定資料」設定用項目IT118、及「測試地點」設定用項目IT119。 第2項目群IT120包含「供給梭」設定用項目IT121、「熱板(溫度調整部)」設定用項目IT122、「臂2」設定用項目IT123、「臂1」設定用項目IT124、「插座加熱器」設定用項目IT125、及「插座空氣」設定用項目IT126。 第3項目群IT130作為「供給/收納計數器」，包含「供給」確認用項目IT131、「合計」確認用項目IT132、「良品/不良品」用項目IT133、「收納1～收納3/固定1～固定3」確認用項目IT134。 第4項目群IT140作為「觸點計數器」，包含「綜合」設定用項目IT141、「分品種」設定用項目IT142、「分品種%」設定用項目IT143、「臂1/臂2」確認用項目IT144。 第5項目群IT150作為「測試器類別」，包含「插座」確認用項目IT151。 其次，若操作按鈕群BT100之按鈕BT103，則如圖4所示，表單FM2與表單FM1重疊顯示。表單FM2為圖標菜單。該表單FM2中包含「設置」用按鈕BT201、「托盤表單」用按鈕BT202、「板表單」用按鈕BT203、「托盤分配」用按鈕BT204、「溫度補償」用按鈕BT205、「觸點」用按鈕BT206、「測試器I/F」用按鈕BT207、「Bin設定」用按鈕BT208、「雙器件」用按鈕BT209、「清潔」用按鈕BT210、「成品率」用按鈕BT211、「QA取樣」用按鈕BT212、「FIFO功能」用按鈕BT213、「供給修正」用按鈕BT214、「回收修正」用按鈕BT215、及「Exit」用按鈕BT216。 其次，若操作表單FM2之按鈕BT214，則於監視器300顯示可選擇依序設定模式與一併設定模式之任一者之選擇畫面，即圖5所示之表單FM3(模式選擇操作部)。藉此，操作員可根據操作電子零件檢查裝置1之熟練度，而選擇依序設定模式與一併設定模式之任一者。例如，較佳為於操作員為熟練者之情形時，可選擇一併設定模式，相反地，於操作員為新手之情形時，選擇依序設定模式。 表單FM3中包含「依序設定」用按鈕BT301與「通常設定(一併設定)」用按鈕BT302。於按鈕BT301之右側，顯示「按照指示依序進行設定。」之說明EX311。於按鈕BT302之右側，顯示「顯示通常的設定畫面。」之說明EX312。而且，若選擇按鈕BT301，即若操作，則前進至依序設定模式(參照圖6～圖23)。另一方面，若選擇按鈕BT302，則前進至一併設定模式(參照圖24)。又，表單FM3亦包含「結束」用按鈕BT303。 此處，首先針對選擇按鈕BT301之情形進行說明。 若選擇按鈕BT301，則顯示圖6所示之表單FM4。表單FM4為確認進行依序設定模式之畫面，顯示「利用以下構成進行設定。」之說明EX401。 該表單FM4中包含「器件尺寸」確認用項目IT411、「處理」確認用項目IT412、「托盤表單」確認用項目IT413、「板表單」確認用項目IT414、「旋轉台」確認用項目IT415。 又，表單FM4中包含「向下一」用按鈕BT421、「取消」用按鈕BT422。 其次，若確認表單FM4之項目IT411～項目IT415之內容而操作按鈕BT421，則顯示圖7所示之表單FM5。表單FM5為確認利用攝像部131所攝像之部位之畫面，顯示「請選擇進行設定的托盤、C/K」之說明EX501。 該表單FM5中包含「供給托盤(器件供給區域A2內的托盤200)」選擇用核取方塊CB511、其「高度檢測」選擇用核取方塊CB512、「供給梭」選擇用核取方塊CB513、其「高度檢測」選擇用核取方塊CB514、「熱板」選擇用核取方塊CB515、及其「高度檢測」選擇用核取方塊CB516。圖7中，作為一例，核取所有核取方塊。 又，表單FM5中包含「向下一」用按鈕BT521、「取消」用按鈕BT522。 其次，若操作表單FM5之按鈕BT521，則顯示圖8所示之表單FM6。表單FM6為指示於器件供給區域A2內需要之構件之準備的畫面，顯示「請準備托盤、C/K、器件，並核取」之說明EX601。 該表單FM6中包含「供給托盤」選擇用核取方塊CB611、「供給梭」選擇用核取方塊CB612、及「熱板」選擇用核取方塊CB613。於核取方塊CB611之下側，顯示「請將托盤放置在載入器。請將器件納入托盤的凹槽[列,行]。：凹槽[2、2](從左上)」之說明EX602。於核取方塊CB612之下側，顯示「請安裝供給梭1。請向供給梭1的指定[凹槽]插入器件：凹槽[Aa]」之說明EX603。於核取方塊CB613之下側，顯示「請安裝熱板1。請將器件納入熱板1的凹槽[列,行]：凹槽[4，1](從左上)」之說明EX604。 又，表單FM6中包含「向前」用按鈕BT621、「向下一」用按鈕BT622、及「取消」用按鈕BT623。 其次，按照說明EX602、說明EX603、說明EX604之指示進行準備，如圖9所示，核取核取方塊CB611、核取方塊CB612、及核取方塊CB613。再者，圖9所示之狀態，即核取所有核取方塊之狀態為一例。 其次，若操作表單FM6之按鈕BT622，則顯示圖10所示之表單FM7。表單FM7為確認以攝像部131攝像之供給托盤之位置檢測的開始之畫面，顯示「登錄「供給托盤」的「位置檢測」。」之說明EX701。又，表單FM7中包含「跳躍」用按鈕BT721、「向下一」用按鈕BT722、及「結束」用按鈕BT723。 其次，若操作表單FM7之按鈕BT722，則顯示圖11所示之表單FM8。表單FM8為選擇以攝像部131攝像之供給托盤之凹槽(托盤200之凹部)之畫面。 表單FM8中包含模仿供給托盤之模型圖式MD801、「4凹槽」選擇用按鈕BT811、「6凹槽」選擇用按鈕BT812、「9凹槽」選擇用按鈕BT813、「12凹槽」選擇用按鈕BT814、「15凹槽」選擇用按鈕BT815。圖11中之模型圖式MD801中，塗黑之凹槽為被選擇之凹槽，作為一例，操作按鈕BT812而選擇6個凹槽。 又，表單FM8中包含「向下一」用按鈕BT816、「結束」用按鈕BT817。 其次，若操作表單FM8之按鈕BT816，則顯示圖12所示之表單FM9。表單FM9為對電子零件檢查裝置1進行供給托盤之凹槽在何處的教導之畫面，顯示「請以包圍供給托盤、凹槽及其周圍的形狀之方式指定區域。」之說明EX901。 於該表單FM9中顯示攝像部131實際(即時)攝像之實際圖像IM911。操作員操作滑鼠台600上之滑鼠，於實際圖像IM911中之凹槽IM912重疊標記IM913。而且，於該狀態下，操作表單FM9中所含之「向下一」用按鈕BT921。藉此進行教導。再者，表單FM9中亦包含「取消」用按鈕BT922。 又，表單FM9中亦包含「切出之區域(包圍凹槽及其周圍的形狀的區域)」設定用項目IT931、「快門速度」設定用項目IT932。 而且，若操作表單FM9之按鈕BT921，則顯示圖13所示之表單FM10。表單FM10為確認已進行教導之凹槽是否為合適者之畫面，顯示「登錄該圖像嗎？」之說明EX1001。 又，表單FM10中顯示1個代表性凹槽之模型圖像IM1011。該模型圖像IM1011係被於表單FM8中選擇，且將藉由攝像部131攝像之6個凹槽之攝像圖像合成所得之基準圖像。電子零件檢查裝置1中，可將該基準圖像與藉由攝像部131攝像之托盤200之凹部的實際圖像進行比較，正確地檢測收納有IC器件90之凹部。藉此，可使器件搬送頭13正確地移動至收納於凹部之IC器件90。 又，表單FM10中包含「好的(OK)」用按鈕BT1021、「取消」用按鈕BT1022。於已進行教導之凹槽為合適者之情形時，操作按鈕BT1021。 操作按鈕BT1021後，顯示圖14所示之表單FM11。表單FM11為確認以攝像部131攝像之供給托盤之高度檢測之開始的畫面，顯示「登錄「供給托盤」的「高度檢測」。」之說明EX1101。又，表單FM11中包含「跳躍」用按鈕BT1121、「向下一」用按鈕BT1122、及「取消」用按鈕BT1123。 其次，若操作表單FM11之按鈕BT1122，則顯示圖15所示之表單FM12。表單FM12為選擇用以檢測以攝像部131攝像之供給托盤之高度之凹槽(托盤200之凹部)之畫面。 表單FM12中包含模仿供給托盤之模型圖式MD1201、「4凹槽」選擇用按鈕BT1211、「6凹槽」選擇用按鈕BT1212、「9凹槽」選擇用按鈕BT1213、「12凹槽」選擇用按鈕BT1214、「15凹槽」選擇用按鈕BT1215。圖15中之模型圖式MD1201中，塗黑之凹槽為被選擇之凹槽，作為一例，操作按鈕BT1213而選擇9個凹槽。 又，表單FM12中包含「向下一」用按鈕BT1216、「取消」用按鈕BT1217。 其次，若操作表單FM12之按鈕BT1216，則顯示圖16所示之表單FM13。表單FM13為對電子零件檢查裝置1進行於供給托盤之何處檢測高度之教導之畫面，顯示「請指定供給托盤、吸附噴嘴可下降之平面。」之說明EX1301。 該表單FM13中顯示攝像部131實際(即時)攝像之實際圖像IM1311。操作員操作滑鼠台600上之滑鼠，於實際圖像IM1311中移動標記IM1313，藉由該標記IM1313指示供給托盤之高度檢測位置。而且，該狀態下，操作表單FM13中所含之「向下一」用按鈕BT1321。藉此進行教導。電子零件檢查裝置1中，將該供給托盤之高度檢測位置作為器件搬送頭13固持(吸附)IC器件90時之高度基準而使用。藉此，器件搬送頭13可正確地固持收納於凹部之IC器件90。 再者，表單FM13中亦包含「取消」用按鈕BT1322、「高度檢測位置」用項目IT1331。 而且，若操作表單FM13之按鈕BT1321，則顯示圖17所示之表單FM14。表單FM14為確認已進行教導之供給托盤之高度檢測位置是否為合適者之畫面，顯示「可以更新高度嗎？」之說明EX1401。 又，表單FM14中包含「是(YES)」用按鈕BT1421、「否(NO)」用按鈕BT1422。於已進行教導之供給托盤之高度檢測位置為合適者之情形時，操作按鈕BT1421。 操作按鈕BT1421後，顯示圖18所示之表單FM15。表單FM15為確認以攝像部131攝像之供給托盤之位置檢測之開始的畫面，顯示「登錄「供給梭」的「位置檢測」。」之說明EX1501。又，表單FM15中包含「跳躍」用按鈕BT1521、「向下一」用按鈕BT1522、及「取消」用按鈕BT1523。此處，作為一例，操作按鈕BT1521。再者，於操作按鈕BT1522之情形時，以適於供給梭之方式，依序顯示與表單FM8之後相同之表單。 操作按鈕BT1521後，顯示圖19所示之表單FM16。表單FM16為確認以攝像部131攝像之熱板之位置檢測之開始的畫面，顯示「登錄「熱板」的「位置檢測」。」之說明EX1601。又，表單FM16中包含「跳躍」用按鈕BT1621、「向下一」用按鈕BT1622、及「取消」用按鈕BT1623。此處，作為一例，操作按鈕BT1621。再者，於操作按鈕BT1622之情形時，以適於熱板之方式，依序顯示與表單FM8之後相同之表單。 操作按鈕BT1621後，顯示圖20所示之表單FM17。表單FM17係選擇對1個1個IC器件90進行、亦或對複數個IC器件90一併進行基於上述攝像圖像之IC器件90之固持之畫面，顯示「請選擇「修正模式」。」之說明EX1701。 表單FM17中包含「個別修正」用按鈕BT1711、「一併修正」用按鈕BT1712。於按鈕BT1711之右側，顯示「對各凹槽個別計算位置修正量並搬送。可獲得高精度的修正效果。」之說明EX1702。於按鈕BT1712之右側，顯示「對每個托盤或C/K計算1個修正量並搬送。抑制產能的大幅降低。」之說明EX1703。 又，表單FM17中亦包含「向下一」用按鈕BT1713、「取消」用按鈕BT1714。此處，作為一例，操作按鈕BT1711，其後操作按鈕BT1713。 操作按鈕BT1713後，顯示圖21所示之表單FM18。表單FM18為選擇由攝像部131進行攝像之時序之畫面，顯示「請選擇檢測時序。」之說明EX1801。 表單FM18中包含對於「托盤」之攝像時序選擇用項目IT1821、及對於「C/K」之攝像時序選擇用項目IT1822。 又，表單FM18中亦包含攝像時序之說明EX1802。圖21中，作為說明EX1802，顯示有「僅運轉開始時：運轉開始時僅執行一次。一定時間間隔：於開始運轉時、及其後以指定時間間隔定期執行。每當托盤載入時：於開始運轉時，及其後每當載入托盤時執行。」 又，表單FM18中亦包含「向下一」用按鈕BT1811、「取消」用按鈕BT1812。 操作按鈕BT1811後，顯示圖22所示之表單FM19。表單FM19為指定器件搬送頭13固持IC器件90時之與IC器件之間隔之畫面，顯示「請指定拾取/釋放時與噴嘴的間隙。」之說明EX1901。 表單FM19中包含與「托盤」上之IC器件90之間隔設定用項目IT1921、與「梭」上之IC器件90之間隔設定用項目IT1922、與「熱板」上之IC器件90之間隔設定用項目IT1923、及與「旋轉台」上之IC器件90之間隔設定用項目IT1924。 又，表單FM19中亦包含描述器件搬送頭13與IC器件90之位置關係之映像圖像IM1931。 又，表單FM19中亦包含「向下一」用按鈕BT1911、「取消」用按鈕BT1912。 操作按鈕BT1911後，顯示圖23所示之表單FM20。表單FM20為依序設定模式結束之畫面，顯示「設定已結束。請去除使用的托盤、器件。」之說明EX2001。表單FM20中包含「關閉」用按鈕BT2011。可按照說明EX2011之指示而去除托盤或器件，操作按鈕BT2011。 如上，於對搭載有攝像部131之器件搬送頭13(搬送部25)一面藉由攝像部131進行攝像，一面設定搬送IC器件90之動作時，可選擇依序設定模式。該依序設定模式中，依序顯示器件搬送頭13之動作設定用各表單(表單FM4～表單FM20)。例如於操作員為新手之情形時，該操作員可按照依序顯示於監視器300之表單，即逐一確認表單而確認或輸入各種條件。藉此，可以正確順序不遺漏地進行器件搬送頭13之動作設定。 又，於在圖5所示之表單FM3操作「通常設定(一併設定)」用按鈕BT302之情形時，顯示圖24所示之表單FM21。表單21為進行一併設定模式之畫面。 表單FM21中包含選擇是否使用攝像部131之核取方塊CB2102、對於「供給托盤」之各種條件設定用標籤TB2102、對於「供給梭」之各種條件設定用標籤TB2103、對於「熱板」之各種條件設定用標籤TB2104。 若核取核取方塊CB2101，則攝像部131成為可使用狀態。於核取方塊CB2101之右側，顯示「使搬送修正有效」之說明EX2105。 標籤TB2102中包含相當於表單FM8、表單FM9及表單FM10之內容之項目IT2111、相當於表單FM12及表單FM13之內容之項目IT2112。而且，藉由進行對項目IT2111及項目IT2112之設定或選擇，可對使用攝像部131之情形之電子零件檢查裝置1一併設定各種條件。再者，選擇標籤TB2103之情形時，可對「供給梭」進行與「供給托盤」相同之設定，選擇標籤TB2104之情形時，可對「熱板」進行與「供給托盤」相同之設定。 又，表單FM21中包含相當於表單FM17之內容之項目IT2113、相當於表單FM18之內容之項目IT2114、及相當於表單FM19之內容之項目IT2115。 又，表單FM21中包含「依序設定」用按鈕BT2121、「好的」用按鈕BT2122、「取消」用按鈕BT2123、及「應用」用按鈕BT2124。 而且，於對搭載有攝像部131之器件搬送頭13(搬送部25)一面藉由攝像部131進行攝像，一面設定搬送IC器件90之動作時，除上述依序設定模式外，可選擇一併設定模式。該一併設定模式中，可於表單FM21上進行所有器件搬送頭13之動作設定。例如於操作員為熟練者之情形時，認為相比依序設定模式，選擇一併設定模式可更迅速進行器件搬送頭13之動作設定。 此外，於依序設定模式中，例如將圖7所示之表單FM5作為「第1設定畫面」之情形時，可將於第1設定畫面之顯示後顯示的圖8(圖9)所示之表單FM6稱為「第2設定畫面」。以下，有將設第1設定畫面為表單FM5，且設第2設定畫面為表單FM6之情形稱為「情形1」之情況。 第1設定畫面即表單FM5可受理、即為可輸入用以藉由器件搬送頭13(搬送部25)搬送IC器件90(電子零件)之資訊(以下稱為「第1資訊」)。作為第1資訊，列舉表單FM5所含之核取方塊CB511、核取方塊CB512、核取方塊CB513、核取方塊CB514、核取方塊CB515、及核取方塊CB516。 第2設定畫面即表單FM6可受理用以藉由器件搬送頭13(搬送部25)搬送IC器件90(電子零件)之與第1資訊不同之資訊資訊(以下稱為「第2資訊」)。作為第2資訊，列舉表單FM6中所含之核取方塊CB611、核取方塊CB612、及核取方塊CB613。 又，情形1中，第1設定畫面即表單FM5中包含作為使第2設定畫面即表單FM6顯示之第2設定畫面顯示操作部之按鈕BT521。藉此，於操作按鈕BT521之前，保持於監視器300顯示表單FM5之狀態，藉此，例如可充分確保充分確認或輸入第1資訊之時間。 又，情形1中，第1設定畫面即表單FM5中包含至少1個核取方塊(圖7之構成中為核取方塊CB511、核取方塊CB512、核取方塊CB513、核取方塊CB514、核取方塊CB515、核取方塊CB516之合計6個)，核取所有核取方塊之情形時，可對第2設定畫面顯示操作部即按鈕BT521操作。藉此，可防止遺漏對核取方塊之核取。 又，例如於將圖8(圖9)所示之表單FM6設為「第1設定畫面」之情形時，亦可將於第1設定畫面之顯示後顯示之圖11所示之表單FM8稱為「第2設定畫面」。以下，有將設第1設定畫面為表單FM6，且設第2設定畫面為表單FM8之情形稱為「情形2」之情況。 作為第1設定畫面即表單FM6中之第1資訊，列舉表單FM6中所含之核取方塊CB611、核取方塊CB612、及核取方塊CB613。 作為第2設定畫面即表單FM8中之第2資訊，列舉表單FM8中所含之模型圖式MD801、按鈕BT811、按鈕BT812、按鈕BT813、按鈕BT814、及按鈕BT815。 又，例如於將(圖11)所示之表單FM8設為「第1設定畫面」之情形時，亦可將於第1設定畫面之顯示後顯示之圖12所示之表單FM9稱為「第2設定畫面」。以下，有將設第1設定畫面為表單FM8，且設第2設定畫面為表單FM9之情形稱為「情形3」之情況。 作為第1設定畫面即表單FM8中之第1資訊，列舉表單FM8中所含之模型圖式MD801、按鈕BT811、按鈕BT812、按鈕BT813、按鈕BT814、及按鈕BT815。 作為第2設定畫面即表單FM9中之第2資訊，列舉表單FM9中所含之標記IM913、項目IT931、及項目IT932。 又，情形3中，第1設定畫面即表單FM8包含作為使第2設定畫面即表單FM9顯示之第2設定畫面顯示操作部之按鈕BT816。藉此，於操作按鈕BT816之前，保持於監視器300顯示表單FM8之狀態，藉此，例如可充分確保充分確認或輸入第1資訊之時間。 又，例如於將圖12所示之表單FM9設為「第1設定畫面」之情形時，亦可將於第1設定畫面之顯示後顯示之圖15所示之表單FM12稱為「第2設定畫面」。以下，有將設第1設定畫面為表單FM9，且設第2設定畫面為表單FM12之情形稱為「情形4」之情況。 作為第1設定畫面即表單FM9中之第1資訊，列舉表單FM9中所含之標記IM913、項目IT931、及項目IT932。 作為第2設定畫面即表單FM12中之第2資訊，列舉表單FM12中所含之模型圖式MD1201、按鈕BT1211、按鈕BT1212、按鈕BT1213、按鈕BT1214、及按鈕BT1215。 又，例如於將圖15所示之表單FM12設為「第1設定畫面」之情形時，可將於第1設定畫面之顯示後顯示之圖16所示之表單FM13稱為「第2設定畫面」。以下，有將設第1設定畫面為表單FM12，且設第2設定畫面為表單FM13之情形稱為「情形5」之情況。 作為第1設定畫面即表單FM12中之第1資訊，列舉表單FM12中所含之模型圖式MD1201、按鈕BT1211、按鈕BT1212、按鈕BT1213、按鈕BT1214、及按鈕BT1215。 作為第2設定畫面即表單FM13中之第2資訊，列舉表單FM13中所含之標記IM1313、項目IT1331。 又，情形5中，第1設定畫面即表單FM12包含作為使第2設定畫面即表單FM13顯示之第2設定畫面顯示操作部之按鈕BT1216。藉此，於操作按鈕BT1216之前，保持於監視器300顯示表單FM12之狀態，藉此，例如可充分確保充分確認或輸入第1資訊之時間。 又，例如於將圖12所示之表單FM9設為「第1設定畫面」之情形時，可將於第1設定畫面之顯示後顯示之圖16所示之表單FM13稱為「第2設定畫面」。以下，有將設第1設定畫面為表單FM9，且設第2設定畫面為表單FM13之情形稱為「情形6」之情況。 作為第1設定畫面即表單FM9中之第1資訊，列舉表單FM9中所含之標記IM913、項目IT931、及項目IT932。 作為第2設定畫面即表單FM13中之第2資訊，列舉表單FM13中所含之標記IM1313、項目IT1331。 又，例如於將圖20所示之表單FM17設為「第1設定畫面」之情形時，亦可將於第1設定畫面之顯示後顯示之圖21所示之表單FM18稱為「第2設定畫面」。以下，有將設第1設定畫面為表單FM17，且設第2設定畫面為表單FM18之情形稱為「情形7」之情況。 作為第1設定畫面即表單FM17中之第1資訊，列舉表單FM17中所含之按鈕BT1711、按鈕BT1712。 作為第2設定畫面即表單FM18中之第2資訊，列舉表單FM18中所含之項目IT1821、項目IT1822。 又，情形7中，第1設定畫面即表單FM17包含作為使第2設定畫面即表單FM18顯示之第2設定畫面顯示操作部之按鈕BT1713。藉此，於操作按鈕BT1713之前，保持於監視器300顯示表單FM17之狀態，藉此，例如可充分確保充分確認或輸入第1資訊之時間。 又，例如於將圖21所示之表單FM18設為「第1設定畫面」之情形時，可將於第1設定畫面之顯示後顯示之圖22所示之表單FM19稱為「第2設定畫面」。以下，有將設第1設定畫面為表單FM18，且設第2設定畫面為表單FM19之情形稱為「情形8」之情況。 作為第1設定畫面即表單FM18中之第1資訊，列舉表單FM18中所含之項目IT1821、項目IT1822。 作為第2設定畫面即表單FM19中之第2資訊，列舉表單FM19中所含之項目IT1921、項目IT1922、項目IT1923、及項目IT1924。 又，情形8中，第1設定畫面即表單FM18包含作為使第2設定畫面即表單FM19顯示之第2設定畫面顯示操作部之按鈕BT1811。藉此，於操作按鈕BT1811之前，保持於監視器300顯示表單FM18之狀態，藉此，例如可充分確保充分確認或輸入第1資訊之時間。 而且，藉由第1設定畫面與第2設定畫面成為例如情形1～情形8，於對搭載有攝像部131之器件搬送頭13一面藉由攝像部131進行攝像，一面設定搬送IC器件90之動作時，可容易且正確地進行該動作設定。 又，如上之第1資訊及第2資訊中之至少一者係用以基於利用攝像部131所獲得之托盤200(載置部)之攝像圖像(圖像)，而藉由器件搬送頭13(搬送部25)搬送IC器件90(電子零件)之資訊，即搬送中所需要之資訊。再者，本實施形態中，第1資訊及第2資訊兩者之資訊任一者皆為該搬送中所需要之資訊，但並非限定於此，第1資訊及第2資訊中之一者亦可為該搬送中所需要之資訊。而且，藉由該資訊，可順暢地進行基於攝像圖像之IC器件90之搬送。 托盤200(載置部)具有收納IC器件90(電子零件)，且陣列狀配置之複數個凹部。又，第1資訊及第2資訊中之至少一者係如上述基於攝像圖像之IC器件90之搬送中所需要之資訊，尤其較佳為如下資訊中之任一者： ·資訊A：用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時指定於俯視時成為(XY座標之)基準之凹部的資訊； ·資訊B：用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時顯示成為基準之凹部的攝像圖像之資訊； ·資訊C：用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時指定成為相對於托盤200(載置部)之高度基準之凹部之資訊； ·資訊D：用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時指定成為高度基準之托盤200(載置面)之面，即本實施形態中為上表面(表側之面)之資訊。此種資訊A、資訊B、資訊C、資訊D成為相鄰之凹部彼此之間距間距離愈小，迅速且正確地進行IC器件90之固持或釋放所越需要之資訊。藉此，可迅速且正確地進行IC器件90之固持或釋放。 而且，作為將資訊A、資訊B、資訊C、資訊D中之任一者設為「第1資訊」、「第2資訊」之組合，以下之組合較佳。 第1資訊係資訊A，即用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時指定於俯視時成為(XY座標之)基準之托盤200的凹部之資訊。第2資訊係資訊B，即用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時顯示成為基準之托盤200的凹部之攝像圖像之資訊。此種組合可為將第1設定畫面設為表單FM8，且設第2設定畫面為表單FM9之「情形3」。若未指定托盤200之凹部，則難以獲得托盤200之凹部之攝像圖像，故稱為此種第1資訊「資訊A」→第2資訊「資訊B」之順序有效。 第1資訊係資訊B，即用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時顯示成為基準之托盤200的凹部之攝像圖像之資訊。第2資訊係資訊D，即用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時指定成為高度基準之托盤200(載置部)之面，即本實施形態中為上表面(表側之面)之資訊。此種組合可為將第1設定畫面設為表單FM9，且設第2設定畫面為表單FM13之「情形6」。若未獲得凹部之攝像圖像，則難以掌握載置部之凹部附近，即托盤200之上表面存在於何處，故此種稱為第1資訊「資訊B」→第2資訊「資訊D」之順序有效。 第1資訊係資訊C，即用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時指定成為相對於托盤200(載置部)之高度基準之托盤200的凹部之資訊。第2資訊係資訊D，即用以於器件搬送頭13(搬送部25)固持IC器件90(電子零件)，或釋放固持之IC器件90(電子零件)時指定成為高度基準之托盤200(載置部)之面，即本實施形態中為上表面(表側之面)之資訊。此種組合可為將第1設定畫面設為表單FM12，且設第2設定畫面為表單FM13之「情形5」。若未指定成為高度基準之托盤200之凹部，則難以掌握其指定凹部與成為高度基準之托盤200之上表面的指定部位之關係，故此種稱為第1資訊「資訊C」→第2資訊「資訊D」之順序有效。 又，依序設定模式包含第3設定畫面。作為該第3設定畫面，並未特別限定，例如可設為圖10所示之表單FM7、圖14所示之表面FM11、圖18所示之表單FM15、及圖19所示之表面FM16。表單FM7中包含「跳躍」用按鈕BT721，表單FM11中包含「跳躍」用按鈕BT1121，表單FM15中包含「跳躍」用按鈕BT1521，表單FM16中包含「跳躍」用按鈕BT1621。例如，藉由操作表單FM7之按鈕BT721，可於情形3中省略第1設定畫面即表單FM8、及第2設定畫面即表單FM9之顯示而跳至表單FM11。如此，於監視器300(顯示部)省略第1設定畫面或第2設定畫面之顯示，顯示作為使第3設定畫面顯示之第3設定畫面顯示操作部之按鈕BT721。藉此，可省略第1資訊或第2資訊之確認或輸入。 如上述，圖6所示之表單FM4中包含「取消」用按鈕BT422。圖7所示之表單FM5中包含「取消」用按鈕BT522。圖8(9)所示之表單FM6中包含「取消」用按鈕BT623。圖10所示之表單FM7中包含「結束」用按鈕BT723。圖11所示之表單FM8中包含「結束」用按鈕BT817。圖12所示之表單FM9中包含「取消」用按鈕BT922。圖13所示之表單FM10中包含「取消」用按鈕BT1022。圖14所示之表單FM11中包含「取消」用按鈕BT1123。圖15所示之表單FM12中包含「取消」用按鈕BT1217。圖16所示之表單FM13中包含「取消」用按鈕BT1322。圖18所示之表單FM15中包含「取消」用按鈕BT1523。圖19所示之表單FM16中包含「取消」用按鈕BT1623。圖20所示之表單FM17中包含「取消」用按鈕BT1714。圖21所示之表單FM18中包含「取消」用按鈕BT1812。圖22所示之表單FM19中包含「取消」用按鈕BT1912。而且，操作任一「取消」用按鈕，皆可自依序設定模式之中途轉移至一併設定模式，即轉移至圖24所示之表單FM21。如此，依序設定模式包含作為可自依序設定模式之中途轉移至一併設定模式之一併設定模式轉移操作部之「取消」用按鈕。藉此，操作員可於中途停止依序設定模式，以一併設定模式重新進行第1資訊或第2資訊等之輸入等。再者，以依序設定模式操作「取消」用按鈕前之第1資訊或第2資訊等可記憶於控制部800，亦可不記憶。 如圖24所示，如上述，一併設定模式即表單FM21中包含項目IT2111、項目IT2112、項目IT2113、項目IT2114、及項目IT2115。而且，可將該等項目之任一者任意地稱為「第1設定畫面」與「第2設定畫面」。又，表單FM21中，第1設定畫面與第2設定畫面係並列顯示。如此，電子零件檢查裝置1中，可選擇並列顯示第1設定畫面與第2設定畫面之一併設定模式。例如於操作員為熟練者之情形時，認為相比依序設定模式，選擇一併設定模式可更迅速進行器件搬送頭13之動作設定。 又，一併設定模式即表單FM21中包含作為可自一併設定模式轉移至依序設定模式之依序設定模式轉移操作部之按鈕BT2121。藉此，操作員可停止一併設定模式，以依序設定模式重新進行第1資訊或第2資訊等之輸入等。再者，以一併設定模式操作按鈕BT2121前之第1資訊或第2資訊等可記憶於控制部800，亦可不記憶。 以上，基於圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置加以說明，但本發明並非限定於此，構成電子零件搬送裝置及電子零件檢查裝置之各部可置換成可發揮相同功能之任意構成者。又，亦可附加任意之構成物。 又，本發明之電子零件搬送裝置及電子零件檢查裝置亦可為組合有上述各實施形態中之任意2個以上之構成(特徵)者。 又，依序設定模式、一併設定模式於上述實施形態中以於器件供給區域內，基於攝像部之攝像結果而自托盤固持IC器件作為一例，但亦可自供給梭、溫度調整部或旋轉台固持IC器件。此於器件回收區域亦可同樣適用。Hereinafter, based on the preferred embodiments shown in the accompanying drawings, the electronic component conveying device and the electronic component inspection device of the present invention will be described in detail. Hereinafter, the first embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described with reference to FIGS. 1 to 24. In addition, in the following, for convenience of description, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. In addition, the XY plane including the X axis and the Y axis becomes horizontal, and the Z axis becomes vertical. Also, the direction parallel to the X axis is called "X direction (first direction)", the direction parallel to the Y axis is called "Y direction (second direction)", and the direction parallel to the Z axis is called "Z direction (third direction)". Also, the direction in which the arrows of each direction are directed is called "positive", and the direction opposite to it is called "negative". In addition, the "horizontal" mentioned in the specification of this case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state of being slightly inclined (for example, less than about 5°) relative to the horizontal. The electronic component conveying device 10 of the present invention has the appearance shown in FIG. 1 and has the arrangement (configuration) shown in FIG. 2. The electronic component conveying apparatus 10 is a processing machine, and includes: a device conveying head 13 (transporting section 25) that conveys electronic components; and a monitor 300 (display section), which can be selected to display the second after displaying the first setting screen Setting mode in order of setting screen. Moreover, the first setting screen displayed on the monitor 300 can accept the first information for conveying the electronic parts by the device conveying head 13 (transporting section 25), and the second setting screen can accept the first information for conveying the electronic by the conveying section 25 The second information of the part is different from the first information. Therefore, as will be described later, when the device transporting head 13 (transporting unit 25) equipped with the imaging unit 131 is set to carry out the operation of transporting electronic parts while imaging by the imaging unit 131, a sequential setting mode can be selected. In this sequential setting mode, the first setting screen and the second setting screen for operation setting of the device transfer head 13 are displayed in order. For example, when the operator is a novice, the operator can sequentially display the first setting screen and the second setting screen of the monitor 300, that is, confirm the first setting screen and the second setting screen one by one to confirm or enter the first 1 information, 2nd information. Thereby, the operation setting of the device transfer head 13 can be performed in the correct order without omission. As shown in FIG. 2, the electronic component inspection device 1 of the present embodiment includes an electronic component conveying device 10 and further includes a detection unit 16 for inspecting electronic components. That is, the electronic component inspection apparatus 1 of the present invention includes: a device transfer head 13 (transfer unit 25) that transfers electronic components; and a monitor 300 (display unit) that can select to display the second setting after displaying the first setting screen The sequence setting mode of the screen; and the inspection section 16, which inspects the electronic parts. Moreover, the first setting screen displayed on the monitor 300 can accept the first information for conveying the electronic component by the device conveying head 13 (transporting section 25), and the second setting screen can accept the first information for conveying the device by the device conveying head 13 ( The conveying unit 25) conveys the second information different from the first information of the electronic parts. Thereby, the electronic component inspection device 1 having the advantages of the electronic component transfer device 10 described above can be obtained. In addition, the electronic component can be transported to the inspection unit 16, whereby the electronic component can be inspected in the inspection unit 16. Moreover, the electronic parts after the inspection can be transferred from the inspection unit 16. Hereinafter, the configuration of each part will be described in detail. As shown in FIGS. 1 and 2, the electronic component inspection device 1 incorporating the electronic component conveying device 10 is, for example, a device that conveys electronic components such as BGA (Ball Grid Array) packages, that is, IC devices, in Inspect/test (hereinafter referred to as "inspection") the electrical characteristics of electronic parts during the transportation process. In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component will be described as a representative, and this IC device will be referred to as "IC device 90". The IC device 90 is formed into a flat plate shape in this embodiment. In addition, as the IC device, in addition to the above, for example, "LSI (Large Scale Integration: large integrated circuit)", "CMOS (Complementary Metal Oxide Semiconductor: complementary metal oxide semiconductor)", "CCD (Charge Coupled Device : Charge-coupled device)", or a "module IC", a "crystal device", a "pressure sensor", and an "inertial sensor (acceleration sensor)" formed by modularizing a plurality of IC devices , "Gyro Sensor", "Fingerprint Sensor", etc. The electronic parts inspection apparatus 1 (electronic parts conveying apparatus 10) includes a tray supply area A1, a device supply area A2 (supply area), an inspection area A3, a device collection area A4 (recovery area), and a tray removal area A5, such as The latter part is divided by each wall. Moreover, the IC device 90 is moved from the tray supply area A1 to the tray removal area A5 by the arrow α 90 The direction passes through the above-mentioned areas in sequence, and the inspection is performed in the inspection area A3 in the middle. In this way, the electronic component inspection device 1 is provided with the electronic component conveying device 10 having the conveying section 25 that conveys the IC device 90 (electronic components) through each area, and the inspection section 16 in the inspection area Check within A3; and Control Department 800. In addition, the electronic component inspection device 1 includes a monitor 300, a signal lamp 400, and an operation panel 700. Furthermore, the electronic component inspection device 1 is a side where the tray supply area A1 and a tray removal area A5 are arranged, that is, the lower side in FIG. 2 becomes the front side, and a side where the inspection area A3 is arranged, that is, the upper side in FIG. 2 serves as Use on the back side. In addition, the electronic component inspection apparatus 1 is pre-installed (installed) and used as a replacement kit (change kit (also referred to as "C/K")) for each type of IC device 90. The change kit includes a mounting member (mounting portion) for mounting an IC device 90 (electronic component), and the mounting member includes a first mounting member disposed in the device supply area A2 and a device collection area A4 The second placement member. As the first placement member, there are, for example, the temperature adjustment section 12, the device supply section 14, and the turntable 27 described later. As the second placement member, there are, for example, the device recovery section 18, described later, and Rotary table 28. In addition to the change kit as described above, the mounting member on which the IC device 90 is mounted also has a tray 200 prepared by the user, a recovery tray 19, and an inspection section 16. It is arranged in the device supply area A2 The tray 200 may also be referred to as a first placement member, and the tray 200 and the recovery tray 19 disposed in the device collection area A4 may also be referred to as a second placement member. The tray supply area A1 is supplied in an unchecked state The material supply part of the tray 200 of a plurality of IC devices 90. The tray supply area A1 may also be referred to as a loading area on which a plurality of trays 200 can be superimposedly mounted. Furthermore, in this embodiment, a plurality of trays 200 are arranged in an array Recesses (grooves). IC devices 90 can be housed in each of the recesses one by one. The device supply area A2 is for transporting and inspecting each IC device 90 (electronic parts) on the tray 200 from the tray supply area A1 before inspection It is supplied to the area of the inspection area A3 (inspection unit 16). Furthermore, tray transport mechanisms 11A and 11B that transport the tray 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the device supply area A2. The mechanism 11A is a part of the conveying part 25, and can make the tray 200 and the IC device 90 placed on the tray 200 to the positive side in the Y direction, that is, to the arrow α in FIG. 2 11A Direction of movement. With this, the IC device 90 can be stably fed into the device supply area A2. Also, the tray transport mechanism 11B can make the empty tray 200 to the negative side in the Y direction, that is, to the arrow α in FIG. 2 11B Moving part moving in the direction. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1. In the device supply area A2, a temperature adjustment section (soaking plate (soak plate (English: soak plate, Chinese example (one example): soaking plate)) 12, a device transfer head 13, a tray transfer mechanism 15, and a rotary table are provided 27. In addition, a device supply unit 14 that moves across the device supply area A2 and the inspection area A3 is also provided. The temperature adjustment unit 12 is a mounting member on which a plurality of IC devices 90 are mounted, and is called a “soaking plate” that can heat or cool the mounted IC devices 90 together. With the soaking plate, the IC device 90 before the inspection by the inspection unit 16 can be heated or cooled in advance and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray conveying mechanism 11A is conveyed to any temperature adjusting section 12. Furthermore, by fixing the temperature adjustment part 12 as the mounting part, the temperature of the IC device 90 on the temperature adjustment part 12 can be adjusted stably. The temperature adjustment unit 12 is grounded (grounded). The device transfer head 13 has a holding portion that holds the IC device 90 and is supported movably in the X direction and Y direction in the device supply area A2, and is also movably supported in the Z direction. The device transfer head 13 is also a part of the transfer section 25, and can bear the transfer of the IC device 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the temperature adjustment section 12 and the device supply section 14 described later Transfer between the IC devices 90. Furthermore, in FIG. 2, the movement of the device transfer head 13 in the X direction is indicated by the arrow α 13X Indicates that the movement of the device transfer head 13 in the Y direction is indicated by the arrow α 13Y Said. The device supply unit 14 is a mounting member for mounting the IC device 90 temperature-adjusted by the temperature adjustment unit 12, and is called "supply shuttle" or simply " Supply shuttle". The device supply unit 14 may also be a part of the transport unit 25. In addition, the device supply portion 14 as the mounting member may be along the X direction, that is, α 14 The direction moves back and forth between the device supply area A2 and the inspection area A3 and is supported. Thereby, the device supply section 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection section 16 of the inspection area A3, and the device supply section 14 can transfer the IC device 90 in the inspection area A3 by the device transport head 17 After taking away, return to the device supply area A2 again. In addition, in the configuration shown in FIG. 2, two device supply sections 14 are arranged in the Y direction, and the device supply section 14 on the negative side in the Y direction is called “device supply section 14A”, and the device supply section on the positive side in the Y direction is called 14 is called "device supply part 14B." Furthermore, the IC device 90 on the temperature adjustment part 12 is conveyed to the device supply part 14A or the device supply part 14B in the device supply area A2. In addition, the device supply unit 14 is configured to heat or cool the IC device 90 placed on the device supply unit 14 similarly to the temperature adjustment unit 12. As a result, the temperature-adjusted IC device 90 of the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 in the inspection area A3 while maintaining its temperature-adjusted state. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12. A rotating table 27 is arranged between the device supply unit 14A and the device supply unit 14B. Rotary table 27 can turn around Z axis arrow α 27 The direction is rotatably supported. Furthermore, when the IC device 90 is placed on the device supply section 14, when the posture of the IC device 90 is to be changed (changed), that is, the IC device 90 is placed around the Z-axis, the IC device 90 may be temporarily loaded放转台27. In this mounting state, the turntable 27 rotates, whereby the posture of the IC device 90 can be changed. The IC device 90 whose posture has been changed is transferred to the device supply unit 14 by the device transfer head 13 while maintaining the posture. The tray transport mechanism 15 places the empty tray 200 from which all IC devices 90 have been removed in the supply area A2, toward the positive side in the X direction, that is, the arrow α 15 Directional transport mechanism. After the transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transfer head 17 are provided. The device transfer head 17 is a part of the transfer section 25, and can hold the IC device 90 that maintains the temperature adjustment state described above, and transfer the IC device 90 in the inspection area A3. The device transfer head 17 is supported in the inspection area A3 so as to be able to reciprocate in the Y direction and the Z direction, and becomes a part of a mechanism called "finger wall". As a result, the device transfer head 17 can transfer and place the IC device 90 on the device supply section 14 carried in from the device supply area A2 on the inspection section 16. Furthermore, in FIG. 2, the reciprocating movement of the device transfer head 17 in the Y direction is indicated by the arrow α 17X Said. In addition, the device transfer head 17 may be supported to reciprocate in the Y direction, but it is not limited to this, and may be supported to reciprocate in the X direction. In addition, in the configuration shown in FIG. 2, two device transfer heads 17 are arranged in the Y direction, and the device transfer head 17 on the negative side in the Y direction is called a “device transfer head 17A”, and the device on the positive side in the Y direction is transferred. The head 17 is called a "device transfer head 17B". The device transfer head 17A can carry the IC device 90 from the device supply section 14A to the inspection section 16 in the inspection area A3, and the device transfer head 17B can carry the IC device 90 from the device supply section 14B to the inspection section 16 in the inspection area A3. Transport. In addition, the device transfer head 17 is configured to be able to heat or cool the IC device 90 held by it, similar to the temperature adjustment unit 12. As a result, the temperature adjustment state of the IC device 90 can be continuously maintained from the device supply unit 14 to the inspection unit 16. The inspection unit 16 is one that can be connected to the electronic component conveying device 10, and in this connected state, the IC device 90 that is an electronic component is placed to inspect the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probes electrically connected to the terminals of the IC device 90. Moreover, the IC device 90 can be inspected by electrically connecting the terminals of the IC device 90 and the probes, that is, the contacts. The inspection of the IC device 90 is performed based on the program memorized in the inspection control unit provided in the tester connected to the inspection unit 16. In addition, in the inspection unit 16, the IC device 90 may be heated or cooled in the same manner as the temperature adjustment unit 12 to adjust the IC device 90 to a temperature suitable for inspection. The device recovery area A4 is an area where a plurality of IC devices 90 (electronic parts) will be transported and recovered from the inspection section 16 after the inspection in the inspection area A3 and the inspection is completed. In the device collection area A4, a collection tray 19, a device transfer head 20, a tray transfer mechanism 21, and a turntable 28 are provided. In addition, a device collecting part 18 that moves across the inspection area A3 and the device collecting area A4 is also provided. In addition, an empty tray 200 is also prepared in the device collection area A4. The device collection section 18 is a mounting member that places the IC device 90 that has been inspected by the inspection section 16 and can transport the IC device 90 to the device collection area A4, which is called "recycling shuttle" or simply " Recycling shuttle". The device recovery unit 18 may also be a part of the transport unit 25. Also, the device recovery section 18 may be along the X direction, that is, the arrow α 18 The direction moves back and forth between the inspection area A3 and the recovery area A4. In addition, in the configuration shown in FIG. 2, the device recovery unit 18 is arranged in the Y direction in the same manner as the device supply unit 14, and the device recovery unit 18 on the negative side in the Y direction is called “device recovery unit 18A”. A case where the device recovery section 18 on the positive side in the Y direction is referred to as a "device recovery section 18B". Then, the IC device 90 on the inspection unit 16 is transported and placed on the device recovery unit 18A or the device recovery unit 18B. Furthermore, the transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18A is borne by the device transfer head 17A, and the transfer of the IC device 90 to the device recovery unit 18B is borne by the device transfer head 17B. In addition, the device recovery unit 18 is also grounded in the same manner as the temperature adjustment unit 12 or the device supply unit 14. The collection tray 19 is a mounting portion on which the IC device 90 inspected by the inspection portion 16 is mounted, and is fixed so as not to move in the device collection area A4. As a result, even in the device collection area A4 in which various movable parts such as the device transfer head 20 are arranged, the IC device 90 that has been inspected can be stably placed on the collection tray 19. In addition, in the configuration shown in FIG. 2, three collection trays 19 are arranged in the X direction. In addition, three empty trays 200 are also arranged along the X direction. The empty tray 200 also becomes a mounting member for mounting the IC device 90 inspected by the inspection unit 16. Furthermore, the IC device 90 moved to the device collection section 18 of the device collection area A4 is transported and placed on any one of the collection tray 19 and the empty tray 200. With this, the IC device 90 is sorted and collected according to each inspection result. The device transfer head 20 has a part supported in the device collection area A4 so as to be movable in the X direction and the Y direction, and can also be moved in the Z direction. The device transfer head 20 is a part of the transfer section 25, and can transfer the IC device 90 from the device collection section 18 to the collection tray 29 or the empty tray 200. Furthermore, in FIG. 2, the movement of the device transfer head 20 in the X direction is indicated by the arrow α 20X Indicates that the movement of the device transfer head 20 in the Y direction is indicated by the arrow α 20Y Said. The tray conveying mechanism 21 places the empty tray 200 carried in from the tray removal area A5 in the device collection area A4, which is the arrow α in the X direction twenty one Directional transport mechanism. Furthermore, after this transfer, the empty tray 200 will be arranged at the position where the IC device 90 is recovered, that is, it may be any of the three empty trays 200 described above. The tray removal area A5 is a material removal portion that collects and removes the tray 200 in which a plurality of IC devices 90 in the completed inspection state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked. A turntable 28 is arranged between the device collecting part 18A and the device collecting part 18B. Rotary table 28 can turn around Z axis arrow α 28 The direction is rotatably supported. Furthermore, when the IC device 90 is placed on, for example, an empty tray 200, the IC device 90 may be temporarily restored when the posture of the IC device 90 is to be restored to the original state, that is, the state before the posture is changed by the turntable 27.载放转台28. In this mounted state, the turntable 28 rotates, whereby the posture of the IC device 90 can be changed. The IC device 90 having returned to the posture is transferred to the empty tray 200 by the device transfer head 20 while maintaining the posture. Also, a tray transport mechanism 22A and a tray transport mechanism 22B that transport the tray 200 one by one in the Y direction are provided so as to straddle the device collection area A4 and the tray removal area A5. The tray conveying mechanism 22A is a part of the conveying part 25, and it can make the tray 200 be the arrow α in the Y direction 22A The moving part moves back and forth. Thereby, the IC device 90 that has completed the inspection can be transferred from the device collection area A4 to the tray removal area A5. In addition, the tray transport mechanism 22B can move the tray 200 for collecting the empty IC device 90 to the positive side in the Y direction, that is, the arrow α 22B Direction of movement. With this, The empty tray 200 can be moved from the tray removal area A5 to the device collection area A4. The control unit 800 can control the actions of the following units, for example, which is, Each part is the pallet transport mechanism 11A, Pallet transport mechanism 11B, Temperature adjustment section 12, Device transfer head 13, Device supply section 14, Device transport mechanism 15. Inspection Department 16, Device transfer head 17, Device Recycling Department 18, Device transfer head 20, Pallet transport mechanism 21, Pallet transport mechanism 22A, Pallet transport mechanism 22B, Turntable 27, And rotary table 28 and so on. The operator can set or confirm the operating conditions of the electronic component inspection device 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, And it is arranged on the upper part of the front side of the electronic component inspection device 1. As shown in Figure 1, On the right side of the picture in the tray removal area A5, A mouse table 600 equipped with a mouse is provided. The mouse is used when operating the screen displayed on the monitor 300. also, At the bottom right of Figure 1, The operation panel 700 is arranged relative to the monitor 300. Unlike the monitor 300, the operation panel 700 commands the electronic component inspection apparatus 1 to a desired action. also, The signal lamp 400 can report the operating state of the electronic component inspection device 1 by the combination of the luminous colors. The signal lamp 400 is arranged above the electronic component inspection device 1. Furthermore, The electronic component inspection device 1 has a built-in speaker 500, The operation state of the electronic component inspection device 1 can also be notified through the speaker 500. In the electronic parts inspection device 1, The tray supply area A1 and the device supply area A2 are separated by a first partition 231, The device supply area A2 and the inspection area A3 are separated by a second separator 232, The inspection area A3 and the device recovery area A4 are separated by a third separator 233, The device collection area A4 and the tray removal area A5 are separated by a fourth separator 234. also, The device supply area A2 and the device recovery area A4 are also separated by the fifth separator 235. The outermost part of the electronic parts inspection device 1 is covered by the housing, The housing has, for example, a front housing 241, Side shell 242, Side shell 243, Rear shell 244 and top shell 245. As above, In the device supply area A2, a tray 200 (placement section) on which the IC device 90 (electronic parts) is placed is provided. A plurality of recesses for accommodating IC devices one by one are arranged in an array on the tray 200. E.g, According to the size of the IC device 90, The distance between adjacent recesses may become extremely narrow. In this case, The device transport head 13 may damage the IC device 90 when holding the IC device 90 from the tray 200. therefore, as shown in picture 2, The electronic component inspection device 1 (electronic component conveying device 10) includes an imaging unit 131, The imaging unit 131 is for holding the IC device 90 from the tray 200 correctly, The image of the concave portion of the tray 200 (the mounting portion) can be imaged. The imaging unit 131 is mounted on the device transfer head 13 (transfer unit 25). Furthermore, The imaging unit 131 is, for example, a CCD (Charge Coupled Device: Charge-coupled device) camera configuration, They are arranged toward the negative side in the Z direction. In the electronic parts inspection device 1, Before holding the IC device 90, The image of the concave portion of the tray 200 is imaged by the image pickup unit 131 in advance. Based on the camera image, The device transfer head 13 is correctly moved to the target position, That is, the IC device 90 is the object to be held. and, The device transfer head 13 can accurately hold the IC device 90 at the movement destination. also, As above, A tray 200 (placement part) on which the IC device 90 (electronic parts) is placed is also provided in the device collection area A4. Same as above, When the distance between adjacent recesses is extremely narrow, When the device transfer head 20 correctly releases the IC device 90 to the tray 200, the IC device 90 may be damaged. therefore, as shown in picture 2, The electronic component inspection device 1 (electronic component transfer device 10) includes an imaging unit 201, The imaging unit 201 is to release the IC device 90 from the tray 200 correctly, The image of the concave portion of the tray 200 (the mounting portion) can be imaged. The imaging unit 201 is mounted on the device transfer head 20 (transfer unit 25). Furthermore, The imaging unit 201 is also similar to the imaging unit 131, For example, CCD (Charge Coupled Device: Charge-coupled device) camera configuration, They are arranged toward the negative side in the Z direction. In the electronic parts inspection device 1, Before releasing the IC device 90, The image of the concave portion of the tray 200 is imaged by the image pickup unit 201 in advance. Based on the camera image, The device transfer head 20 is correctly moved to the target position, That is, the recess of the IC device 90 should be stored. and, The device transfer head 20 can release the IC device 90 at the movement destination. In the electronic parts inspection device 1, As above, When using the imaging unit 131 or the imaging unit 201, Various conditions need to be set for the electronic component inspection device 1. For this setting, either the sequential setting mode (first mode) or the collective setting mode (second mode) is used. The sequential setting mode is the setting in which the monitor 300 sequentially displays various conditions, That is, a mode that can be conducted in a wizard form (dialog form). The collective setting mode is a mode that can display and set various conditions on the monitor 300 at the same time. As above, The electronic component conveying device 10 can be connected to the inspection unit 16 for inspecting the IC device 90 (electronic component). also, The electronic parts conveying device 10 includes: Device supply area A2 (supply area), It transports and supplies the IC device 90 (electronic parts) before inspection to the inspection section 16; And device recycling area A4 (recycling area), The IC device 90 (electronic parts) after inspection is transported and collected from the inspection unit 16. and, The sequential setting mode sets the device supply area A2 (supply area) and the device recovery area A4 (recovery area). With this, Various conditions when using the imaging unit 131 can be set in the device supply area A2 in the correct order without omission. also, The various conditions when using the imaging unit 201 can be set in the device recovery area A4 in the correct order without omission. Same as the sequential setting mode, The collective setting mode is also set for the device supply area A2 and the device recovery area A4. the following, Typically, the sequential setting mode and the collective setting mode in the device supply area A2 will be described. In order setting mode, Before the execution of the setting mode, Executing, Any one after execution, The forms shown in FIGS. 3 to 24 are appropriately displayed on the monitor 300. Furthermore, There are also "forms" called "screens", "dialogue", "Window" etc. First of all, The form FM1 shown in FIG. 3 is displayed on the monitor 30. Form FM1 is the main screen. The form FM1 contains the button group BT100, The first project group IT110, The second project group IT120, The third project group IT130, The fourth project group IT140, And IT150 of the fifth project group. The button group BT100 includes a button BT101 for "end", "Close" button BT102, "Type setting" button BT103, "Unit setting" button BT104, "Maintenance" button BT105, "User-defined" button BT106, And "Calculator" button BT107. The first item group IT100 includes an item IT111 for "user selection" setting, "Temperature mode" setting items IT112, "Tester connection" setting item IT113, "Transport mode" setting items IT114, "Start mode" setting items IT115, "Pin setting" setting item IT116, "Device rotation" setting items IT117, "Setting data" setting item IT118, And IT119 for setting "test location". The second item group IT120 includes the item IT121 for "supply shuttle" setting, "Hot plate (temperature adjustment unit)" setting item IT122, IT123 for setting "arm 2" IT124 for setting item "arm 1""Socketheater" setting items IT125, And IT126 for setting "socket air". The third item group IT130 serves as a "supply/storage counter", Including IT131 for "supply" confirmation, "Total" confirmation item IT132, IT133 for "good product/bad product""Storage 1-Storage 3/Fixed 1-Fixed 3" Confirmation item IT134. The fourth project group IT140 as "contact counter", Contains "141" setting items IT141, IT142 for setting items by type "Items %" setting item IT143, IT144 for confirmation of "arm 1/arm 2". The fifth project group IT150 as "tester type", Includes IT151 for "Socket" confirmation. Secondly, If the button BT103 of the button group BT100 is operated, As shown in Figure 4, Form FM2 and form FM1 are displayed overlapping. Form FM2 is an icon menu. This form FM2 contains buttons BT201 for "Settings", Button BT202 for "Tray Form", "Board Form" button BT203, Button BT204 for "Tray Allocation", "Temperature compensation" button BT205, "Contact" button BT206, Button BT207 for "Tester I/F", "Bin setting" button BT208, "Dual device" button BT209, "Cleaning" button BT210, "Yield" button BT211, "QA Sampling" button BT212, "FIFO function" button BT213, "Supply correction" button BT214, BT215 button for "recovery correction" And "Exit" button BT216. Secondly, If you operate button BT214 of form FM2, Then, the monitor 300 displays a selection screen for selecting either the sequential setting mode and the collective setting mode, That is, the form FM3 (mode selection operation section) shown in FIG. 5. With this, The operator can check the proficiency of the electronic parts inspection device 1, Choose either the sequential setting mode or the collective setting mode. E.g, Preferably, when the operator is a skilled person, Can choose to set the mode together, On the contrary, When the operator is a novice, Select the sequential setting mode. The form FM3 includes a button BT301 for "sequential setting" and a button BT302 for "normal setting (set together)". To the right of the button BT301, It displays "Set in order according to the instructions. "Explanation EX311." To the right of the button BT302, "Display the normal setting screen is displayed. "Explained EX312." and, If button BT301 is selected, If you operate, Then proceed to the sequential setting mode (refer to Figure 6 to Figure 23). on the other hand, If button BT302 is selected, Then advance to the collective setting mode (see Figure 24). also, The form FM3 also includes a button BT303 for "end". Here, First, the case of selecting the button BT301 will be described. If button BT301 is selected, The form FM4 shown in Figure 6 is displayed. Form FM4 is the screen for confirming the sequential setting mode, "It is set by the following configuration. "Explained EX401. This form FM4 contains items IT411 for "device size" confirmation, "Processing" confirmation item IT412, "Tray form" confirmation item IT413, "Board form" confirmation item IT414, "Turntable" confirmation item IT415. also, The form FM4 contains the button BT421 for "Next", "Cancel" button BT422. Secondly, If you confirm the contents of item IT411 to item IT415 of form FM4 and operate button BT421, The form FM5 shown in Figure 7 is displayed. Form FM5 is a screen for confirming the location of the image captured by the imaging unit 131, "Please select the tray to be set, C501 description EX501. This form FM5 includes "Supply Tray (Tray 200 in Device Supply Area A2)" selection check box CB511, The "height detection" option uses the check box CB512, "Supply Shuttle" selection check box CB513, The "height detection" option uses the check box CB514, "Hot plate" select check box CB515, And its "height detection" selection check box CB516. In Figure 7, As an example, Check all check boxes. also, The form FM5 contains the button BT521 for "Next", "Cancel" button BT522. Secondly, If you operate the button BT521 of the form FM5, The form FM6 shown in Figure 8 is displayed. Form FM6 is a screen indicating the preparation of required components in the device supply area A2, "Please prepare tray, C/K, Device, And check the description EX601. This form FM6 contains the check box CB611 for selecting the "Supply Tray", "Supply Shuttle" selection check box CB612, And "Hot Plate" selection check box CB613. Under the check box CB611, "Please place the tray on the loader." Please put the device into the groove of the tray [column, Row]. : Groove [2, 2] (From the upper left)" EX602 description. Under the check box CB612, "Please install supply shuttle 1." is displayed. Please insert the device into the designated [groove] of feed shuttle 1: Description of groove [Aa]" EX603. Under the check box CB613, "Please install hot plate 1." Please put the device into the groove of the hot plate 1 [column, Row]: Notch [4, 1] (From the upper left)" EX604 description. also, The form FM6 contains the button BT621 for "forward", "Next" button BT622, And "Cancel" button BT623. Secondly, Follow the instructions EX602, Description EX603, Explain the instructions of EX604 to prepare, As shown in Figure 9, Check box CB611, Check box CB612, And check box CB613. Furthermore, The state shown in Figure 9, That is, the state of checking all check boxes is an example. Secondly, If you operate the button BT622 of the form FM6, The form FM7 shown in Figure 10 is displayed. The form FM7 is a screen for confirming the start of detection of the position of the supply tray imaged by the imaging unit 131, "Position detection" of "registration "supply tray" is displayed. "Explained EX701. also, The form FM7 contains the button BT721 for "jump", "Next" button BT722, And "End" button BT723. Secondly, If you operate the button BT722 of the form FM7, The form FM8 shown in Figure 11 is displayed. The form FM8 is a screen for selecting the groove of the supply tray (recess of the tray 200) imaged by the imaging unit 131. The form FM8 contains the model diagram MD801 which imitates the supply tray, "4 groove" selection button BT811, "6 groove" selection button BT812, "9 groove" selection button BT813, "12 groove" selection button BT814, "15 notch" selection button BT815. In the model diagram MD801 in Figure 11, The blackened groove is the selected groove, As an example, Six grooves are selected by operating the button BT812. also, The form FM8 contains the button BT816 for "Next", "End" button BT817. Secondly, If you operate the button BT816 of the form FM8, The form FM9 shown in Figure 12 is displayed. Form FM9 is a screen for teaching the electronic parts inspection device 1 where the groove of the supply tray is, "Please surround the supply tray, The shape of the groove and its surroundings specifies the area. ”Explained EX901. In this form FM9, the actual image IM911 actually (real-time) captured by the imaging unit 131 is displayed. The operator operates the mouse on the mouse table 600, The groove IM912 in the actual image IM911 overlaps the mark IM913. and, In this state, The button BT921 for "Next" included in the operation form FM9. Take this to teach. Furthermore, The form FM9 also contains a button BT922 for "cancel". also, The form FM9 also includes the setting items IT931, "Cut out area (area surrounding the groove and its surrounding shape)""Shutterspeed" setting item IT932. and, If you operate the button BT921 of the form FM9, The form FM10 shown in Figure 13 is displayed. Form FM10 is a picture to confirm whether the groove that has been taught is suitable, "Do you want to register this image?""Explanation EX1001. also, A model image IM1011 of a representative groove is displayed in the form FM10. The model image IM1011 was selected in the form FM8, And the reference image obtained by synthesizing the captured images of the six grooves captured by the imaging unit 131 is synthesized. In the electronic parts inspection device 1, The reference image can be compared with the actual image of the concave portion of the tray 200 captured by the imaging unit 131, Accurately detect the concave portion in which the IC device 90 is housed. With this, The device transfer head 13 can be accurately moved to the IC device 90 housed in the recess. also, Form FM10 contains button BT1021 for "OK""Cancel" button BT1022. When the groove that has been taught is suitable, Operate the button BT1021. After operating button BT1021, The form FM11 shown in Figure 14 is displayed. The form FM11 is a screen to confirm the start of the height detection of the supply tray imaged by the imaging unit 131, "Height detection" of "Registration "Supply tray" is displayed. "Explanation EX1101. also, The form FM11 contains the button BT1121. "Next" button BT1122, And "Cancel" button BT1123. Secondly, If you operate the button BT1122 of the form FM11, The form FM12 shown in Figure 15 is displayed. The form FM12 is a screen for selecting a groove (recess of the tray 200) for detecting the height of the supply tray imaged by the imaging unit 131. The form FM12 contains the model diagram MD1201 which imitates the supply tray "4 notch" selection button BT1211 "6 groove" selection button BT1212, "9 groove" selection button BT1213, "12 groove" selection button BT1214, "15 notch" selection button BT1215. In the model diagram MD1201 in Figure 15, The blackened groove is the selected groove, As an example, Nine grooves are selected by operating the button BT1213. also, The form FM12 contains the button BT1216 for "Next", "Cancel" button BT1217. Secondly, If you operate the button BT1216 of the form FM12, The form FM13 shown in Figure 16 is displayed. The form FM13 is a screen for teaching the electronic part inspection device 1 where to detect the height of the supply tray, "Please specify the supply tray, The plane on which the suction nozzle can be lowered. "Explanation EX1301. The form FM13 displays the actual image IM1311 actually (real-time) captured by the imaging unit 131. The operator operates the mouse on the mouse table 600, Move the marker IM1313 in the actual image IM1311, The height detection position of the supply tray is indicated by the mark IM1313. and, In this state, The button BT1321 for "Next" included in the operation form FM13. Take this to teach. In the electronic parts inspection device 1, The height detection position of the supply tray is used as a height reference when the device transfer head 13 holds (absorbs) the IC device 90. With this, The device transfer head 13 can accurately hold the IC device 90 housed in the recess. Furthermore, The form FM13 also contains the button BT1322 for "Cancel", Item IT1331 for "height detection position". and, If you operate the button BT1321 of the form FM13, The form FM14 shown in Fig. 17 is displayed. Form FM14 is a screen to confirm whether the height detection position of the supply tray that has been taught is appropriate, "Can I update the height?" Description of EX1401. also, The form FM14 includes a button BT1421 for "YES""NO" button BT1422. When the height detection position of the supply tray that has been taught is appropriate, Operate the button BT1421. After operating button BT1421, The form FM15 shown in Figure 18 is displayed. Form FM15 is a screen for confirming the start of detection of the position of the supply tray imaged by the imaging unit 131, The "position detection" of "registration "supply shuttle" is displayed. "Explanation EX1501. also, The form FM15 contains a button BT1521 for "jump""Next" button BT1522, And "Cancel" button BT1523. Here, As an example, Operate the button BT1521. Furthermore, In the case of operating button BT1522, In a manner suitable for supplying shuttles, The same forms as the form after FM8 are displayed in order. After operating button BT1521, The form FM16 shown in Figure 19 is displayed. Form FM16 is a screen to confirm the start of detection of the position of the hot plate imaged by the imaging unit 131, The "position detection" of "registration "hot plate" is displayed. "Explanation EX1601. also, Form FM16 contains button BT1621 for "jump""Next" button BT1622, And "Cancel" button BT1623. Here, As an example, Operate the button BT1621. Furthermore, When the button BT1622 is operated, In a way suitable for hot plates, The same forms as the form after FM8 are displayed in order. After operating button BT1621, The form FM17 shown in Figure 20 is displayed. Form FM17 series chooses to carry on one IC device 90, Alternatively, a plurality of IC devices 90 may be held together based on the captured image of the IC device 90, "Please select "correction mode" is displayed. "Explanation EX1701. Form FM17 contains button BT1711 for "Individual Correction" Use "BT1712" button to "correct together". To the right of the button BT1711, "The position correction amount is calculated for each groove individually and displayed." A high-precision correction effect can be obtained. Description of EX1702. To the right of the button BT1712, It displays "Calculate and correct one correction amount per pallet or C/K. Suppress a significant reduction in production capacity. "Explanation EX1703. also, The form FM17 also contains the button BT1713 for "Next", "Cancel" button BT1714. Here, As an example, Operation button BT1711, Thereafter, the button BT1713 is operated. After operating button BT1713, The form FM18 shown in Figure 21 is displayed. Form FM18 is a screen for selecting the timing of imaging by the imaging unit 131, "Please select the detection timing.""Explanation EX1801. The form FM18 contains the item IT1821 for the timing selection of the "pallet" And the item IT1822 for "C/K" imaging timing selection. also, The form FM18 also contains the EX1802 description of the camera timing. In Figure 21, As an illustration EX1802, The message "Only when the operation starts: It is executed only once when the operation starts. At certain intervals: At the start of operation, After that, it will be executed regularly at specified time intervals. Whenever the tray is loaded: At the start of operation, Executed every time after loading the tray. '' Again, Form FM18 also contains a button BT1811 for "Next""Cancel" button BT1812. After operating button BT1811, The form FM19 shown in Figure 22 is displayed. Form FM19 is a screen specifying the distance between the IC device 90 and the IC device when the device transport head 13 holds the IC device 90, "Please specify the gap with the nozzle during pickup/release." ”Description EX1901. The form FM19 contains items IT1921 for setting the distance from the IC device 90 on the "tray" IT1922 for setting the distance from the IC device 90 on the shuttle IT1923 for setting the distance from the IC device 90 on the "hot plate", And the item IT1924 for setting the distance from the IC device 90 on the "rotating table". also, The form FM19 also contains the image image IM1931 describing the positional relationship between the device transfer head 13 and the IC device 90. also, The form FM19 also contains the button BT1911 for "Next""Cancel" button BT1912. After operating button BT1911, The form FM20 shown in Figure 23 is displayed. The form FM20 is the screen where the setting mode ends in sequence, "Setting is finished." Please remove the used tray, Device. "Explanation EX2001. The form FM20 contains a button BT2011 for "Close". The tray or device can be removed according to the instructions of the instructions EX2011, Operation button BT2011. As above, The image is captured by the imaging unit 131 on the device transfer head 13 (transport unit 25) on which the imaging unit 131 is mounted, When setting the movement of the IC device 90 on one side, You can choose the sequential setting mode. In this sequential setting mode, Each form (form FM4 to form FM20) for setting the operation of the device transfer head 13 is sequentially displayed. For example, when the operator is a novice, The operator can display the forms on the monitor 300 in sequence, That is, confirm the forms one by one and confirm or enter various conditions. With this, The operation setting of the device transfer head 13 can be performed in the correct order without omission. also, When the button BT302 for "normal setting (set together)" is operated in the form FM3 shown in FIG. 5, The form FM21 shown in Figure 24 is displayed. Form 21 is a screen for setting the mode together. The form FM21 contains a check box CB2102 for selecting whether to use the camera section 131, Tabs TB2102 for setting various conditions of "Supply Tray", Tabs TB2103 for setting various conditions of "Supply Shuttle", Tab TB2104 for setting various conditions of "hot plate". If check box CB2101 is checked, The imaging unit 131 becomes usable. On the right side of check box CB2101, The explanation of "Enable Conveyance Correction" is displayed EX2105. The label TB2102 contains the equivalent of form FM8, Items IT2111 of the contents of Form FM9 and Form FM10 The item IT2112 is equivalent to the contents of Form FM12 and Form FM13. and, By setting or selecting item IT2111 and item IT2112, Various conditions can be set for the electronic component inspection device 1 when the imaging unit 131 is used. Furthermore, When selecting the label TB2103, The "supply shuttle" can be set the same as the "supply tray", When selecting the label TB2104, The "hot plate" can be set the same as the "supply tray". also, Form FM21 contains items IT2113 equivalent to the contents of form FM17, IT2114 equivalent to the content of the form FM18, And the item IT2115 equivalent to the content of the form FM19. also, Form FM21 contains buttons BT2121 for "Sequential Settings""OK" button BT2122, "Cancel" button BT2123, And "Apply" button BT2124. and, The image is captured by the imaging unit 131 on the device transfer head 13 (transport unit 25) on which the imaging unit 131 is mounted, When setting the movement of the IC device 90 on one side, In addition to the above sequential setting mode, You can select the setting mode together. In the collective setting mode, The operation settings of all device transfer heads 13 can be set on the form FM21. For example, when the operator is a skilled person, Think that compared to setting the mode in order, By selecting the collective setting mode, the operation setting of the device transfer head 13 can be performed more quickly. In addition, In the sequential setting mode, For example, when the form FM5 shown in FIG. 7 is used as the "first setting screen", The form FM6 shown in FIG. 8 (FIG. 9) displayed after the display of the first setting screen may be referred to as the “second setting screen”. the following, The first setting screen will be set to form FM5, The case where the second setting screen is the form FM6 is called "case 1". The first setting screen, form FM5, can be accepted, That is, information that can be input to transport the IC device 90 (electronic parts) by the device transport head 13 (transport unit 25) (hereinafter referred to as "first information") can be input. As the first information, List the check boxes CB511 included in the form FM5, Check box CB512, Check box CB513, Check box CB514, Check box CB515, And check box CB516. The second setting screen, the form FM6, can accept information information different from the first information (hereinafter referred to as "second information") for transferring the IC device 90 (electronic parts) by the device transfer head 13 (transfer section 25). As the second information, List the check boxes CB611 included in the form FM6, Check box CB612, And check box CB613. also, In case 1, The form FM5 that is the first setting screen includes a button BT521 as a second setting screen display operation unit that displays the form FM6 that is the second setting screen. With this, Before operating button BT521, Maintain the status of the form FM5 displayed on the monitor 300, With this, For example, it can fully ensure the time for confirming or entering the first information. also, In case 1, The first setting screen, the form FM5, contains at least one check box (check box CB511, Check box CB512, Check box CB513, Check box CB514, Check box CB515, Check the total of 6 blocks CB516), When checking all the check boxes, The button BT521, which is the second setting screen display operation part, can be operated. With this, It can prevent omission of the check of the check box. also, For example, when the form FM6 shown in FIG. 8 (FIG. 9) is set as the "first setting screen", The form FM8 shown in FIG. 11 displayed after the display of the first setting screen may also be referred to as the "second setting screen". the following, The first setting screen will be set to form FM6, And the case where the second setting screen is the form FM8 is called "case 2". As the first setting screen, the first information in the form FM6, List the check boxes CB611 included in the form FM6, Check box CB612, And check box CB613. As the second setting screen, the second information in the form FM8, List the model diagram MD801 included in the form FM8, Button BT811, Button BT812, Button BT813, Button BT814, And button BT815. also, For example, when the form FM8 shown in (Figure 11) is set as the "first setting screen", The form FM9 shown in FIG. 12 displayed after the display of the first setting screen may also be referred to as the "second setting screen". the following, The first setting screen will be set to form FM8, And the case where the second setting screen is the form FM9 is called "case 3". As the first setting screen, the first information in the form FM8, List the model diagram MD801 included in the form FM8, Button BT811, Button BT812, Button BT813, Button BT814, And button BT815. As the second setting screen, the second information in the form FM9, List the marks IM913 included in the form FM9, Project IT931, And project IT932. also, In case 3, The form FM8 that is the first setting screen includes a button BT816 that is a second setting screen display operation unit that displays the form FM9 that is the second setting screen. With this, Before operating button BT816, Maintain the status that the monitor 300 displays the form FM8, With this, For example, it can fully ensure the time for confirming or entering the first information. also, For example, when the form FM9 shown in FIG. 12 is set to the "first setting screen", The form FM12 shown in FIG. 15 displayed after the display of the first setting screen may also be referred to as the "second setting screen". the following, The first setting screen will be set to form FM9, The case where the second setting screen is the form FM12 is called "case 4". As the first setting screen, the first information in the form FM9, List the marks IM913 included in the form FM9, Project IT931, And project IT932. As the second setting screen, the second information in the form FM12, List the model diagram MD1201 included in the form FM12 Button BT1211 Button BT1212, Button BT1213, Button BT1214, And button BT1215. also, For example, when the form FM12 shown in FIG. 15 is set to the "first setting screen", The form FM13 shown in FIG. 16 that is displayed after the display of the first setting screen can be referred to as the "second setting screen". the following, The first setting screen will be set to form FM12, The case where the second setting screen is the form FM13 is called "case 5". As the first setting screen, the first information in the form FM12, List the model diagram MD1201 included in the form FM12 Button BT1211 Button BT1212, Button BT1213, Button BT1214, And button BT1215. As the second setting screen, the second information in the form FM13, List the marks IM1313 contained in the form FM13, Project IT1331. also, In case 5, The form FM12 that is the first setting screen includes a button BT1216 that is a second setting screen display operation unit that displays the form FM13 that is the second setting screen. With this, Before operating button BT1216, Maintain the status that the monitor 300 displays the form FM12, With this, For example, it can fully ensure the time for confirming or entering the first information. also, For example, when the form FM9 shown in FIG. 12 is set to the "first setting screen", The form FM13 shown in FIG. 16 that is displayed after the display of the first setting screen can be referred to as the "second setting screen". the following, The first setting screen will be set to form FM9, The case where the second setting screen is the form FM13 is called "case 6". As the first setting screen, the first information in the form FM9, List the marks IM913 included in the form FM9, Project IT931, And project IT932. As the second setting screen, the second information in the form FM13, List the marks IM1313 contained in the form FM13, Project IT1331. also, For example, when the form FM17 shown in FIG. 20 is set to the "first setting screen", The form FM18 shown in FIG. 21 displayed after the display of the first setting screen may also be referred to as the "second setting screen". the following, The first setting screen will be set to form FM17, The case where the second setting screen is the form FM18 is called "case 7". As the first setting screen, the first information in the form FM17, List the buttons BT1711 included in the form FM17 Button BT1712. As the second setting screen, the second information in the form FM18, List the items IT1821 included in the form FM18 Project IT1822. also, In case 7, The form FM17, which is the first setting screen, includes a button BT1713 as a second setting screen display operation unit that displays the form FM18, which is the second setting screen. With this, Before operating button BT1713, Maintain the status that the monitor 300 displays the form FM17, With this, For example, it can fully ensure the time for confirming or entering the first information. also, For example, when the form FM18 shown in FIG. 21 is set to the "first setting screen", The form FM19 shown in FIG. 22 displayed after the display of the first setting screen may be referred to as the "second setting screen". the following, The first setting screen will be set to form FM18, The case where the second setting screen is the form FM19 is called "case 8". As the first setting screen, the first information in the form FM18, List the items IT1821 included in the form FM18 Project IT1822. As the second setting screen, the second information in the form FM19, List the items IT1921 included in the form FM19 Project IT1922, Project IT1923, And project IT1924. also, In case 8, The form FM18 which is the first setting screen includes a button BT1811 which is a second setting screen display operation part which displays the form FM19 which is the second setting screen. With this, Before the operation button BT1811, Maintain the state that the monitor 300 displays the form FM18, With this, For example, it can fully ensure the time for confirming or entering the first information. and, The first setting screen and the second setting screen become, for example, case 1 to case 8, In the device transfer head 13 on which the imaging unit 131 is mounted, the imaging unit 131 performs imaging, When setting the movement of the IC device 90 on one side, This action setting can be easily and correctly performed. also, At least one of the first information and the second information as described above is used to capture images (images) based on the tray 200 (mounting portion) obtained by the imaging portion 131, And the information of the IC device 90 (electronic parts) is transferred by the device transfer head 13 (transfer part 25), That is the information needed in the transportation. Furthermore, In this embodiment, Either the information of the first information and the second information is the information required for the transportation, But it is not limited to this, One of the first information and the second information can also be the information required for the transportation. and, With this information, The IC device 90 based on the captured image can be smoothly transferred. The tray 200 (placement part) has an IC device 90 (electronic parts) stored therein, And a plurality of concave portions arranged in an array. also, At least one of the first information and the second information is the information required for the transportation of the IC device 90 based on the captured image as described above, Particularly preferred is any of the following information: ·Information A: For holding the IC device 90 (electronic parts) with the device transfer head 13 (transfer part 25), Or the information of the recessed part that becomes the reference (of the XY coordinates) when viewed from above when releasing the IC device 90 (electronic parts) that is held; ·Information B: For holding the IC device 90 (electronic parts) with the device transfer head 13 (transfer part 25), Or, when releasing the IC device 90 (electronic parts) held, display the information of the captured image of the concave part as a reference; ·Information C: For holding the IC device 90 (electronic parts) with the device transfer head 13 (transfer part 25), Or, when releasing the IC device 90 (electronic part) held, it is designated as the concave part relative to the height reference of the tray 200 (placement part); ·Information D: For holding the IC device 90 (electronic parts) with the device transfer head 13 (transfer part 25), Or the surface of the tray 200 (placement surface) designated as the height reference when releasing the held IC device 90 (electronic component), That is, in this embodiment, it is information on the upper surface (surface on the front side). Such information A, Information B, Information C, Information D becomes the distance between the adjacent concave parts is smaller, The information needed for holding or releasing the IC device 90 quickly and correctly. With this, The IC device 90 can be held or released quickly and correctly. and, As the information A, Information B, Information C, Any one of the information D is set to "the first information", The combination of "second information", The following combination is preferred. The first information is information A, That is, it is used to hold the IC device 90 (electronic parts) by the device transfer head 13 (transfer part 25), Or, when releasing the IC device 90 (electronic part) held, the information specified in the concave portion of the tray 200 that becomes the reference (of the XY coordinates) when viewed from above. The second information is information B, That is, it is used to hold the IC device 90 (electronic parts) by the device transfer head 13 (transfer part 25), When releasing or holding the IC device 90 (electronic part), the information of the captured image of the concave portion of the tray 200 as a reference is displayed. This combination can be set to form FM8 on the first setting screen, And suppose the second setting screen is "Case 3" of the form FM9. If the recess of the tray 200 is not specified, It is difficult to obtain the captured image of the concave portion of the tray 200, Therefore, the order of such first information "information A" → second information "information B" is valid. The first information is information B, That is, it is used to hold the IC device 90 (electronic parts) by the device transfer head 13 (transfer part 25), When releasing or holding the IC device 90 (electronic part), the information of the captured image of the concave portion of the tray 200 as a reference is displayed. The second information is information D, That is, it is used to hold the IC device 90 (electronic parts) by the device transfer head 13 (transfer part 25), Or the surface of the tray 200 (placement part) designated as the height reference when releasing the IC device 90 (electronic part) held, That is, in this embodiment, it is information on the upper surface (surface on the front side). This combination can be set as the first setting screen form FM9, And set the second setting screen as "case 6" of the form FM13. If the camera image of the recess is not obtained, It is difficult to grasp the vicinity of the concave portion of the mounting portion, That is where the upper surface of the tray 200 exists, Therefore, the sequence called first information "information B" → second information "information D" is valid. The first information is information C, That is, it is used to hold the IC device 90 (electronic parts) by the device transfer head 13 (transfer part 25), When releasing the IC device 90 (electronic part) held, the information of the recessed part of the tray 200 designated as the height reference with respect to the tray 200 (placement part). The second information is information D, That is, it is used to hold the IC device 90 (electronic parts) by the device transfer head 13 (transfer part 25), Or the surface of the tray 200 (placement part) designated as the height reference when releasing the IC device 90 (electronic part) held, That is, in this embodiment, it is information on the upper surface (surface on the front side). This combination can be set to form FM12 in the first setting screen, And suppose the second setting screen is "case 5" of the form FM13. If the recess of the tray 200 to be the height reference is not specified, It is difficult to grasp the relationship between the designated recess and the designated part of the upper surface of the tray 200 that becomes the height reference, Therefore, the sequence called first information "information C" → second information "information D" is valid. also, The sequential setting mode includes the third setting screen. As this third setting screen, Not specifically limited, For example, it can be set to the form FM7 shown in Figure 10, Surface FM11 shown in Figure 14, The form FM15 shown in Figure 18, And the surface FM16 shown in FIG. 19. The form FM7 contains a button BT721 for "jump", The form FM11 contains a button BT1121 for "jump", The form FM15 contains a button BT1521 for "jump", The form FM16 includes a button BT1621 for "jump". E.g, By operating the button BT721 of the form FM7, In case 3, the first setting screen, form FM8, can be omitted. And the second setting screen is the display of form FM9 and jump to form FM11. in this way, The display of the first setting screen or the second setting screen is omitted on the monitor 300 (display section), A button BT721 which is a third setting screen display operation part for displaying the third setting screen is displayed. With this, The confirmation or input of the first information or the second information can be omitted. As above, The form FM4 shown in FIG. 6 includes a button BT422 for "cancel". The form FM5 shown in FIG. 7 includes a button BT522 for "cancel". The form FM6 shown in FIG. 8(9) includes a button BT623 for "cancel". The form FM7 shown in FIG. 10 includes a button BT723 for "end". The form FM8 shown in FIG. 11 includes a button BT817 for "end". The form FM9 shown in FIG. 12 includes a button BT922 for "cancel". The form FM10 shown in FIG. 13 includes a button BT1022 for "cancel". The form FM11 shown in FIG. 14 includes a button BT1123 for "cancel". The form FM12 shown in FIG. 15 includes a button BT1217 for "cancel". The form FM13 shown in FIG. 16 includes a button BT1322 for "cancel". The form FM15 shown in FIG. 18 includes a button BT1523 for "cancel". The form FM16 shown in FIG. 19 includes a button BT1623 for "cancel". The form FM17 shown in FIG. 20 includes a button BT1714 for "cancel". The form FM18 shown in FIG. 21 includes a button BT1812 for "cancel". The form FM19 shown in FIG. 22 includes a button BT1912 for "cancel". and, Operate any "Cancel" button, All can be transferred from the sequential setting mode to the collective setting mode, That is, transfer to the form FM21 shown in FIG. 24. in this way, The sequential setting mode includes a button for "cancel" which is one of the collective setting modes that can be transferred from the sequential setting mode to the collective setting mode and the setting mode transfer operation part. With this, The operator can stop the sequence setting mode in the middle, Re-enter the first information, second information, etc. in the collective setting mode. Furthermore, The first information or the second information before operating the "Cancel" button in the sequential setting mode can be stored in the control unit 800, Or don't remember. As shown in Figure 24, As above, Set the mode together, that is, the form FM21 contains item IT2111 Project IT2112, Project IT2113, Project IT2114, And project IT2115. and, Any of these items can be arbitrarily called "first setting screen" and "second setting screen". also, Form FM21, The first setting screen and the second setting screen are displayed in parallel. in this way, In the electronic parts inspection device 1, You can choose to display one of the first setting screen and the second setting screen side by side and set the mode. For example, when the operator is a skilled person, Think that compared to setting the mode in order, By selecting the collective setting mode, the operation setting of the device transfer head 13 can be performed more quickly. also, The collective setting mode, that is, the form FM21 includes a button BT2121 as a sequential setting mode transfer operation part that can be transferred from the collective setting mode to the sequential setting mode. With this, The operator can stop and set the mode together, Re-enter the first information or second information etc. in the sequential setting mode. Furthermore, The first information or the second information before operating the button BT2121 in the collective setting mode can be stored in the control unit 800, Or don't remember. the above, The electronic component conveying device and electronic component inspection device of the present invention will be described based on the illustrated embodiment. But the invention is not limited to this, The components constituting the electronic component conveying device and the electronic component inspection device can be replaced with any components that can perform the same function. also, Arbitrary components can also be added. also, The electronic component conveying device and the electronic component inspection device of the present invention may be any combination (characteristic) of any two or more of the above embodiments. also, Set the mode in sequence, The mode is set together in the above-mentioned embodiment to be in the device supply area, The IC device is held from the tray as an example based on the imaging result of the imaging unit, But you can also supply the shuttle, The temperature adjustment section or the rotating table holds the IC device. This is also applicable in the device recycling area.

1‧‧‧電子零件檢查裝置10‧‧‧電子零件搬送裝置11A‧‧‧托盤搬送機構11B‧‧‧托盤搬送機構12‧‧‧溫度調整部13‧‧‧器件搬送頭14‧‧‧器件供給部14A‧‧‧器件供給部14B‧‧‧器件供給部15‧‧‧托盤搬送機構16‧‧‧檢查部17‧‧‧器件搬送頭17A‧‧‧器件搬送頭17B‧‧‧器件搬送頭18‧‧‧器件回收部18A‧‧‧器件回收部18B‧‧‧器件回收部19‧‧‧回收用托盤20‧‧‧器件搬送頭21‧‧‧托盤搬送機構22A‧‧‧托盤搬送機構22B‧‧‧托盤搬送機構25‧‧‧搬送部27‧‧‧旋轉台28‧‧‧旋轉台90‧‧‧IC器件131‧‧‧攝像部200‧‧‧托盤201‧‧‧攝像部231‧‧‧第1隔板232‧‧‧第2隔板233‧‧‧第3隔板234‧‧‧第4隔板235‧‧‧第5隔板241‧‧‧前外殼242‧‧‧側外殼243‧‧‧側外殼244‧‧‧後外殼245‧‧‧頂外殼300‧‧‧監視器301‧‧‧顯示畫面400‧‧‧信號燈500‧‧‧揚聲器600‧‧‧滑鼠台700‧‧‧操作面板800‧‧‧控制部A1‧‧‧托盤供給區域A2‧‧‧器件供給區域A3‧‧‧檢查區域A4‧‧‧器件回收區域A5‧‧‧托盤去除區域BT100‧‧‧按鈕群BT101‧‧‧按鈕BT102‧‧‧按鈕BT103‧‧‧按鈕BT104‧‧‧按鈕BT105‧‧‧按鈕BT106‧‧‧按鈕BT107‧‧‧按鈕BT201‧‧‧按鈕BT202‧‧‧按鈕BT203‧‧‧按鈕BT204‧‧‧按鈕BT205‧‧‧按鈕BT206‧‧‧按鈕BT207‧‧‧按鈕BT208‧‧‧按鈕BT209‧‧‧按鈕BT210‧‧‧按鈕BT211‧‧‧按鈕BT212‧‧‧按鈕BT213‧‧‧按鈕BT214‧‧‧按鈕BT215‧‧‧按鈕BT216‧‧‧按鈕BT301‧‧‧按鈕BT302‧‧‧按鈕BT303‧‧‧按鈕BT421‧‧‧按鈕BT422‧‧‧按鈕BT521‧‧‧按鈕BT522‧‧‧按鈕BT621‧‧‧按鈕BT622‧‧‧按鈕BT623‧‧‧按鈕BT811‧‧‧按鈕BT812‧‧‧按鈕BT813‧‧‧按鈕BT814‧‧‧按鈕BT815‧‧‧按鈕BT816‧‧‧按鈕BT817‧‧‧按鈕BT921‧‧‧按鈕BT922‧‧‧按鈕BT1021‧‧‧按鈕BT1022‧‧‧按鈕BT1121‧‧‧按鈕BT1122‧‧‧按鈕BT1123‧‧‧按鈕BT1211‧‧‧按鈕BT1212‧‧‧按鈕BT1213‧‧‧按鈕BT1214‧‧‧按鈕BT1215‧‧‧按鈕BT1216‧‧‧按鈕BT1217‧‧‧按鈕BT1321‧‧‧按鈕BT1322‧‧‧按鈕BT1421‧‧‧按鈕BT1422‧‧‧按鈕BT1521‧‧‧按鈕BT1522‧‧‧按鈕BT1523‧‧‧按鈕BT1621‧‧‧按鈕BT1622‧‧‧按鈕BT1623‧‧‧按鈕BT1711‧‧‧按鈕BT1712‧‧‧按鈕BT1713‧‧‧按鈕BT1714‧‧‧按鈕BT1811‧‧‧按鈕BT1812‧‧‧按鈕BT1911‧‧‧按鈕BT1912‧‧‧按鈕BT2011‧‧‧按鈕BT2121‧‧‧按鈕BT2122‧‧‧按鈕BT2123‧‧‧按鈕BT2124‧‧‧按鈕CB511‧‧‧核取方塊CB512‧‧‧核取方塊CB513‧‧‧核取方塊CB514‧‧‧核取方塊CB515‧‧‧核取方塊CB516‧‧‧核取方塊CB611‧‧‧核取方塊CB612‧‧‧核取方塊CB613‧‧‧核取方塊CB2101‧‧‧核取方塊EX311‧‧‧說明EX312‧‧‧說明EX401‧‧‧說明EX501‧‧‧說明EX601‧‧‧說明EX602‧‧‧說明EX603‧‧‧說明EX604‧‧‧說明EX701‧‧‧說明EX901‧‧‧說明EX1001‧‧‧說明EX1101‧‧‧說明EX1301‧‧‧說明EX1501‧‧‧說明EX1601‧‧‧說明EX1701‧‧‧說明EX1702‧‧‧說明EX1703‧‧‧說明EX1801‧‧‧說明EX1802‧‧‧說明EX1901‧‧‧說明EX2001‧‧‧說明EX2105‧‧‧說明FM1‧‧‧表單FM2‧‧‧表單FM3‧‧‧表單FM4‧‧‧表單FM5‧‧‧表單FM6‧‧‧表單FM7‧‧‧表單FM8‧‧‧表單FM9‧‧‧表單FM10‧‧‧表單FM11‧‧‧表單FM12‧‧‧表單FM13‧‧‧表單FM14‧‧‧表單FM15‧‧‧表單FM16‧‧‧表單FM17‧‧‧表單FM18‧‧‧表單FM19‧‧‧表單FM20‧‧‧表單FM21‧‧‧表單IM911‧‧‧實際圖像IM912‧‧‧凹槽IM913‧‧‧標記IM1011‧‧‧模型圖像IM1311‧‧‧實際圖像IM1313‧‧‧標記IM1931‧‧‧映像圖像IT110‧‧‧第1項目群IT111‧‧‧項目IT112‧‧‧項目IT113‧‧‧項目IT114‧‧‧項目IT115‧‧‧項目IT116‧‧‧項目IT117‧‧‧項目IT118‧‧‧項目IT119‧‧‧項目IT120‧‧‧第2項目群IT121‧‧‧項目IT122‧‧‧項目IT123‧‧‧項目IT124‧‧‧項目IT125‧‧‧項目IT126‧‧‧項目IT130‧‧‧第3項目群IT131‧‧‧項目IT132‧‧‧項目IT133‧‧‧項目IT134‧‧‧項目IT140‧‧‧第4項目群IT141‧‧‧項目IT142‧‧‧項目IT143‧‧‧項目IT144‧‧‧項目IT150‧‧‧第5項目群IT151‧‧‧項目IT411‧‧‧項目IT412‧‧‧項目IT413‧‧‧項目IT414‧‧‧項目IT415‧‧‧項目IT931‧‧‧項目IT932‧‧‧項目IT1331‧‧‧項目IT1821‧‧‧項目IT1822‧‧‧項目IT1921‧‧‧項目IT1922‧‧‧項目IT1923‧‧‧項目IT1924‧‧‧項目IT2111‧‧‧項目IT2112‧‧‧項目IT2113‧‧‧項目IT2114‧‧‧項目IT2115‧‧‧項目MD801‧‧‧模型圖式MD1201‧‧‧模型圖式TB2102‧‧‧標籤TB2103‧‧‧標籤TB2104‧‧‧標籤α11A‧‧‧箭頭α11B‧‧‧箭頭α13X‧‧‧箭頭α13Y‧‧‧箭頭α14‧‧‧箭頭α15‧‧‧箭頭α17Y‧‧‧箭頭α18‧‧‧箭頭α20X‧‧‧箭頭α20Y‧‧‧箭頭α21‧‧‧箭頭α22A‧‧‧箭頭α22B‧‧‧箭頭α27‧‧‧箭頭α28‧‧‧箭頭α90‧‧‧箭頭1‧‧‧Electronic parts inspection device 10‧‧‧Electronic parts transfer device 11A‧‧‧Tray transfer mechanism 11B‧‧‧Tray transfer mechanism 12‧‧‧Temperature adjustment unit 13‧‧‧Device transfer head 14‧‧‧Device supply 14A‧‧‧Device supply unit 14B‧‧‧Device supply unit 15‧‧‧Tray transport mechanism 16‧‧‧ Inspection unit 17‧‧‧Device transport head 17A‧‧‧Device transport head 17B‧‧‧Device transport head 18 ‧‧‧Device recycling department 18A‧‧‧Device recycling department 18B‧‧‧Device recycling department 19‧‧‧Recycling tray 20‧‧‧Device transport head 21‧‧‧Tray transport mechanism 22A‧‧‧Tray transport mechanism 22B‧ ‧‧Tray conveying mechanism 25‧‧‧Transporting section 27‧‧‧Rotating table 28‧‧‧Rotating table 90‧‧‧IC device 131‧‧‧Imaging section 200‧‧‧Tray 201‧‧‧‧Imaging section 231‧‧‧ 1st separator 232 ‧‧‧ 2nd separator 233 ‧‧‧ 3rd separator 234 ‧ ‧‧ 4th separator 235 ‧ ‧‧ 5th separator 241 ‧ ‧‧Side case 244‧‧‧Rear case 245‧‧‧Top case 300‧‧‧Monitor 301‧‧‧Display screen 400‧‧‧Signal lamp 500‧‧‧Speaker 600‧‧‧Mouse table 700‧‧‧Operation Panel 800‧‧‧Control part A1‧‧‧Tray supply area A2‧‧‧Device supply area A3‧‧‧ Inspection area A4‧‧‧Device recovery area A5‧‧‧Tray removal area BT100‧‧‧ Button group BT101‧‧ ‧Button BT102‧‧‧Button BT103‧‧‧Button BT104‧‧‧Button BT105‧‧‧Button BT106‧‧‧Button BT107‧‧‧Button BT201‧‧‧Button BT202‧‧‧Button BT203‧‧‧Button BT204‧‧ ‧Button BT205‧‧‧Button BT206‧‧‧Button BT207‧‧‧Button BT208‧‧‧Button BT209‧‧‧Button BT210‧‧‧Button BT211‧‧‧Button BT212‧‧‧Button BT213‧‧‧Button BT214‧‧ ‧Button BT215‧‧‧Button BT216‧‧‧Button BT301‧‧‧Button BT302‧‧‧Button BT303‧‧‧Button BT421‧‧‧Button BT422‧‧‧Button BT521‧‧‧Button BT522‧‧‧Button BT621‧‧ ‧Button BT622‧‧‧Button BT623‧‧‧Button BT811‧‧‧Button BT812‧‧‧Button BT813‧‧‧Button BT814‧‧‧Button BT815‧‧‧Button BT816‧‧‧Button BT817‧‧‧Button BT921‧‧ ‧Button BT922‧‧‧Button BT1021‧‧‧Button BT1022‧‧‧‧Button BT1121‧‧‧Button BT1122‧‧‧Button BT1123‧‧‧Button BT1 211‧‧‧button BT1212‧‧‧button BT1213‧‧‧button BT1214‧‧‧button BT1215‧‧‧button BT1216‧‧‧button BT1217‧‧‧button BT1321‧‧‧button BT1322‧‧‧button BT1421‧‧‧button BT1422 ‧‧‧ button BT1521‧‧‧ button BT1522 BT1714‧‧‧ button BT1811‧‧‧ button BT1812‧‧‧ button BT1911‧‧‧ button BT1912‧‧‧ button BT2011‧‧‧ button BT2121‧‧‧ button BT2122‧‧‧ button BT2123‧‧‧ button BT2124‧‧‧ button CB511‧‧‧ check block CB512‧‧‧ check block CB513‧‧‧ check block CB514‧‧‧ check block CB515‧‧‧ check block CB516‧‧‧ check block CB611‧‧‧ check block CB612 ‧‧‧ Check box CB613‧‧‧ Check box CB2101‧‧‧Check box EX311‧‧‧Help EX312‧‧‧Help EX401‧‧‧Help EX501‧‧‧Help EX601‧‧‧Help EX602‧‧‧Help EX603‧‧‧Help EX604‧‧‧Help EX701‧‧‧ Help EX901‧‧‧ Help EX1001‧‧‧ Help EX1101‧‧‧ Help EX1301‧‧‧ Help EX1501‧‧‧ Help EX1601‧‧‧ Help EX1701‧‧‧ Help EX1702‧‧‧Help EX1703‧‧‧Help EX1801‧‧‧Help EX1802‧‧‧Help EX1901‧‧‧Help EX2001‧‧‧Help EX2105‧‧‧Help FM1‧‧‧Form FM2‧‧‧Form FM3‧‧‧Form FM4‧‧‧Form FM5‧‧‧Form FM6‧‧‧Form FM7‧‧‧Form FM8‧‧‧Form FM9‧‧‧Form FM10‧‧‧Form FM11‧‧‧Form FM12‧‧‧Form FM13‧‧‧Form FM14‧‧‧form FM15‧‧‧form FM16‧‧‧form FM17‧‧‧form FM18‧‧‧form FM19‧‧‧form FM20‧‧‧form FM21‧‧‧form IM911‧‧‧actual image IM912‧‧ ‧Groove IM913‧‧‧Mark IM1011‧‧‧Model image IM1311‧‧‧Real image IM1313‧‧‧Mark IM1931‧‧‧Image image IT110‧‧‧The first project group IT111‧‧‧Project IT112‧‧ ‧Project IT113‧‧‧Project IT11 4‧‧‧Project IT115‧‧‧Project IT116‧‧‧Project IT117‧‧‧Project IT118‧‧‧Project IT119‧‧‧Project IT120‧‧‧The second project group IT121‧‧‧Project IT122‧‧‧Project IT123‧ ‧‧Project IT124‧‧‧Project IT125‧‧‧Project IT126‧‧‧Project IT130‧‧‧Project 3 IT131‧‧‧Project IT132‧‧‧Project IT133‧‧‧Project IT134‧‧‧Project IT140‧‧‧ 4th Project Group IT141‧‧‧Project IT142‧‧‧Project IT143‧‧‧Project IT144‧‧‧Project IT150‧‧‧ 5th Project Group IT151‧‧‧Project IT411‧‧‧Project IT412‧‧‧Project IT413‧‧ ‧Project IT414‧‧‧Project IT415‧‧‧Project IT931‧‧‧Project IT932‧‧‧Project IT1331‧‧‧Project IT1821‧‧‧Project IT1822‧‧‧Project IT1921‧‧‧Project IT1922‧‧‧Project IT1923‧‧ ‧Project IT1924‧‧‧Project IT2111‧‧‧Project IT2112‧‧‧Project IT2113‧‧‧Project IT2114‧‧‧Project IT2115‧‧‧Project MD801‧‧‧Model diagram MD1201‧‧‧Model diagram TB2102‧‧‧ Tag TB2103‧‧‧Tag TB2104‧‧‧Tag α 11A ‧‧‧Arrow α 11B ‧‧‧Arrow α 13X ‧‧‧Arrow α 13Y ‧‧‧Arrow α 14 ‧‧‧Arrow α 15 ‧‧‧Arrow α 17Y ‧ ‧‧Arrow alpha 18 ‧‧‧arrow alpha 20X ‧‧‧arrow alpha 20Y ‧‧‧arrow alpha 21 ‧‧‧arrow alpha 22A ‧‧‧arrow alpha 22B ‧‧‧arrow alpha 27 ‧‧‧arrow alpha 28 ‧‧‧ Arrow α 90 ‧‧‧arrow

圖1係自正面側觀察本發明之電子零件檢查裝置之第1實施形態之概略立體圖。 圖2係表示圖1所示之電子零件檢查裝置之動作狀態之概略俯視圖。 圖3係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖4係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖5係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖6係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖7係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖8係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖9係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖10係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖11係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖12係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖13係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖14係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖15係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖16係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖17係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖18係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖19係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖20係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖21係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖22係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖23係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。 圖24係顯示於圖1所示之電子零件檢查裝置之監視器之表單(一例)。FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection device of the present invention viewed from the front. FIG. 2 is a schematic plan view showing the operating state of the electronic component inspection device shown in FIG. 1. FIG. 3 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 4 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 5 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 6 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 7 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 8 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 9 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 10 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 11 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 12 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 13 is a form (an example) displayed on the monitor of the electronic parts inspection device shown in FIG. 1. FIG. 14 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 15 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 16 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 17 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 18 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 19 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 20 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 21 is a form (an example) displayed on the monitor of the electronic parts inspection device shown in FIG. 1. FIG. 22 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 23 is a form (an example) displayed on the monitor of the electronic component inspection device shown in FIG. 1. FIG. 24 is a form (an example) displayed on the monitor of the electronic parts inspection device shown in FIG. 1.

BT301‧‧‧按鈕 BT301‧‧‧ button

BT302‧‧‧按鈕 BT302‧‧‧ button

BT303‧‧‧按鈕 BT303‧‧‧ button

EX311‧‧‧說明 EX311‧‧‧Description

EX312‧‧‧說明 EX312‧‧‧Description

FM3‧‧‧表單 FM3‧‧‧Form

Claims (18)

一種電子零件搬送裝置，其特徵在於具備：搬送部，其搬送電子零件；及顯示部，其可選擇於顯示第1設定畫面之後，顯示第2設定畫面之依序設定模式；且上述第1設定畫面可受理用以藉由上述搬送部搬送上述電子零件之第1資訊，上述第2設定畫面可受理用以藉由上述搬送部搬送上述電子零件之與上述第1資訊不同之第2資訊。 An electronic parts conveying device, characterized by comprising: a conveying part which conveys electronic parts; and a display part which can select the sequential setting mode of displaying the second setting screen after displaying the first setting screen; and the above-mentioned first setting The screen can accept the first information for conveying the electronic component by the conveying unit, and the second setting screen can accept the second information that is different from the first information for conveying the electronic component by the conveying unit. 如請求項1之電子零件搬送裝置，其設置有載置上述電子零件之載置部，且具備可攝像上述載置部之圖像之攝像部。 The electronic component conveying device according to claim 1 is provided with a mounting portion for mounting the electronic component, and an imaging portion capable of capturing an image of the mounting portion. 如請求項2之電子零件搬送裝置，其中上述攝像部搭載於上述搬送部。 The electronic component conveying device according to claim 2, wherein the imaging unit is mounted on the conveying unit. 如請求項2之電子零件搬送裝置，其中上述第1資訊及上述第2資訊中之任一者為用以基於上述載置部之圖像，而藉由上述搬送部搬送上述電子零件之資訊。 The electronic part conveying device according to claim 2, wherein any one of the first information and the second information is information for conveying the electronic part by the conveying part based on the image of the placement part. 如請求項2之電子零件搬送裝置，其中上述載置部具有收納上述電子 零件，且陣列狀配置之複數個凹部，上述第1資訊及上述第2資訊之至少一者為如下資訊中之任一者：用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定於俯視時成為基準之上述凹部之資訊；用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時顯示成為基準之上述凹部之攝像圖像之資訊；用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定成為相對於載置部之高度基準之上述凹部之資訊；用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定成為高度基準之上述載置部之面的資訊。 The electronic component conveying device according to claim 2, wherein the placing portion has the Parts, and a plurality of recesses arranged in an array, at least one of the first information and the second information is any one of the following information: used to hold the electronic part in the conveying part, or release the held electronic The information of the concave part that becomes the reference when viewed from above when used as a part; used to display the captured image of the concave part that becomes the reference when the conveying part holds the electronic part or releases the held electronic part; used in the above When the conveying part holds the electronic part, or releases the held electronic part, the information of the concave part specified as a height reference relative to the mounting part; used to hold the electronic part in the conveying part, or release the held electronic part Specify the information of the surface of the above-mentioned placement part that becomes the height reference. 如請求項5之電子零件搬送裝置，其中上述第1資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定於俯視時成為基準之上述凹部之資訊，上述第2資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時顯示成為基準之上述凹部之攝像圖像之資訊。 The electronic part conveying device according to claim 5, wherein the first information is used to hold the electronic part in the conveying part or release the held electronic part to specify the information of the concave part that becomes the reference when viewed from above, the second The information is used to display the captured image of the concave portion that becomes the reference when the conveying portion holds the electronic component or releases the held electronic component. 如請求項5之電子零件搬送裝置，其中上述第1資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時顯示成為基準之上述凹部之攝像圖像的資訊，上述第2資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定成為高度基準之上述載置部之面的資訊。 The electronic component conveying device according to claim 5, wherein the first information is used to display the captured image information of the concave portion as a reference when the conveying portion holds the electronic component or releases the held electronic component, the first 2 The information is information used to designate the surface of the placement part that becomes the height reference when the conveying part holds the electronic part or releases the held electronic part. 如請求項5之電子零件搬送裝置，其中上述第1資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定成為相對於載置部之高度基準之上述凹部的資訊，上述第2資訊係用以於上述搬送部固持上述電子零件，或釋放固持之上述電子零件時指定成為高度基準之上述載置部的面之資訊。 The electronic part conveying device according to claim 5, wherein the first information is information for designating the concave part as a height reference relative to the mounting part when the conveying part holds the electronic part or releases the held electronic part The second information is information used to designate the surface of the placement part that becomes the height reference when the conveying part holds the electronic part or releases the held electronic part. 如請求項1之電子零件搬送裝置，其中上述第1設定畫面包含使上述第2設定畫面顯示之第2設定畫面顯示操作部。 The electronic component conveying device according to claim 1, wherein the first setting screen includes a second setting screen display operation unit that displays the second setting screen. 如請求項9之電子零件搬送裝置，其中上述第1設定畫面包含至少1個核取方塊，於核取所有上述核取方塊之情形時，可對上述第2設定畫面顯示操作部進行操作。 For example, in the electronic component conveying device of claim 9, the first setting screen includes at least one check box. When checking all the check boxes, the second setting screen display operation unit can be operated. 如請求項1之電子零件搬送裝置，其中上述依序設定模式包含第3設定畫面。 The electronic component conveying device according to claim 1, wherein the sequential setting mode includes a third setting screen. 如請求項11之電子零件搬送裝置，其中於上述顯示部省略上述第1設定畫面或上述第2設定畫面之顯示，而顯示使上述第3設定畫面顯示之第3設定畫面顯示操作部。 The electronic component conveying device according to claim 11, wherein the display unit omits the display of the first setting screen or the second setting screen, and displays the third setting screen display operation unit that displays the third setting screen. 如請求項1之電子零件搬送裝置，其中可選擇為並列顯示上述第1設定畫面與上述第2設定畫面之一併設定模式。 For example, in the electronic component conveying device of claim 1, one of the first setting screen and the second setting screen may be displayed in parallel to set the mode. 如請求項13之電子零件搬送裝置，其中於上述顯示部顯示可選擇上述依序設定模式與上述一併設定模式之任一者之模式選擇操作部。 The electronic component conveying device according to claim 13, wherein the display unit displays a mode selection operation unit that can select any one of the sequential setting mode and the collective setting mode. 如請求項13之電子零件搬送裝置，其中上述依序設定模式包含可自上述依序設定模式之中途轉移至上述一併設定模式之一併設定模式轉移操作部。 The electronic component conveying device according to claim 13, wherein the sequential setting mode includes a mode transfer operation portion that can be transferred from the sequential setting mode to one of the collective setting modes. 如請求項13之電子零件搬送裝置，其中上述一併設定模式包含可自上述一併設定模式轉移至上述依序設定模式之依序設定模式轉移操作部。 The electronic component conveying device according to claim 13, wherein the collective setting mode includes a sequential setting mode transfer operation portion that can be transferred from the collective setting mode to the sequential setting mode. 如請求項1之電子零件搬送裝置，其可連接於檢查上述電子零件之檢查部，且具備：供給區域，其供將檢查前之上述電子零件搬送並供給至上述檢查部；及回收區域，其供自上述檢查部搬送並回收檢查後之上述電子零件；且上述依序設定模式係對上述供給區域及上述回收區域設定。 The electronic component conveying device according to claim 1, which can be connected to an inspection section for inspecting the above electronic components, and includes: a supply area for conveying and supplying the electronic components before inspection to the inspection section; and a recovery area, which The electronic parts after the inspection are transported and recovered from the inspection section; and the sequential setting mode is set for the supply area and the recovery area. 一種電子零件檢查裝置，其特徵在於具備：搬送部，其搬送電子零件；顯示部，其可選擇於顯示第1設定畫面之後，顯示第2設定畫面之依序設定模式；及檢查部，其檢查上述電子零件；且 上述第1設定畫面可受理用以藉由上述搬送部搬送上述電子零件之第1資訊，上述第2設定畫面可受理用以藉由上述搬送部搬送上述電子零件之與上述第1資訊不同之第2資訊。 An electronic parts inspection device is characterized by comprising: a conveying part which conveys electronic parts; a display part which can select a sequential setting mode which displays a second setting screen after displaying the first setting screen; and an inspection part which inspects The above electronic parts; and The first setting screen may accept the first information for transporting the electronic component by the transport unit, and the second setting screen may accept the first information for transporting the electronic component by the transport unit, which is different from the first information 2 Information.
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