JP6543958B2 - Electronic component conveying apparatus and electronic component inspection apparatus - Google Patents

Description

  The present invention relates to an electronic component conveyance device and an electronic component inspection device.

  Conventionally, an electronic component inspection apparatus for inspecting the electrical characteristics of an electronic component such as an IC device is known, and in this electronic component inspection apparatus, an electronic component for conveying the IC device to the holding unit of the inspection unit A transport device is incorporated. The IC devices are placed on the tray both before and after the inspection. The tray has a plurality of recesses arranged in a matrix. And one IC device is accommodated in each one recessed part (for example, refer to patent documents 1).

JP-A-8-97262

  However, there are also users of electronic component inspection apparatuses who do not need to arrange IC devices after inspection in an orderly manner, that is, in a matrix, on the tray. , Could not respond to such a request.

  An object of the present invention is to provide an electronic component transfer device and an electronic component inspection device which can be accommodated without concern for the arrangement of a plurality of electronic components.

Such an object is achieved by the present invention described below.
Application Example 1
The electronic component transfer apparatus according to the present invention is an arrangement part capable of arranging a receiving member having a recess capable of receiving a plurality of electronic components after inspection ;
And a gripping portion capable of gripping a plurality of the electronic components and transporting the electronic components to the recess.
The housing member is open at one side and has an opening through which the plurality of electronic components can be inserted, and a bottom closing the other.
When the gripping portion grips the first electronic component and the second electronic component among the plurality of electronic components to be stored in the housing member, the first electronic component and the second electronic component may be positioned on the recess. (2) When releasing the electronic component, the first electronic component and the second electronic component are released in this order, and the second electronic component is located at a position different from the position on the first electronic component when viewed from vertically above It is characterized by releasing parts .
Thus, the arrangement of the plurality of electronic components can be accommodated without concern.

Application Example 2
In the electronic component transfer apparatus according to the present invention, the holding portion is configured to be able to change the pitch of the held electronic components, and when releasing the electronic components on the housing member, the pitch is minimized. It is preferred to do .

Application Example 3
In the electronic component transfer apparatus according to the present invention, the size of the surface of the opening preferably includes the position of each of the electronic components when the plurality of electronic components are gripped by the gripping unit.
Thereby, the time which accommodates a plurality of electronic parts can be shortened.

Application Example 4
In the electronic component transfer apparatus of the present invention, the opening is preferably rectangular.
Thereby, the downsizing of the storage member can be achieved.

Application Example 5
In the electronic component transfer apparatus according to the present invention, it is preferable that at least the closed portion of the housing member is formed of an elastic member.

  As a result, when the electronic component falls into the recess, the impact on the electronic component can be alleviated, thereby preventing damage or failure of the electronic component.

Application Example 6
In the electronic component transfer apparatus of the present invention, it is preferable that it can be counted whether or not the number of the electronic components stored in the storage member has reached a predetermined number.

Thus, the storage member in which the predetermined number of electronic components are stored can be replaced with the empty storage member.
Application Example 7
In the electronic component transport apparatus according to the present invention, the counting is performed by comparing the first image of the gripping portion immediately before releasing the electronic component with the second image of the gripping portion immediately after releasing the electronic component. Preferably, the difference can be obtained by calculating the difference between the number of electronic components of the first image and the number of electronic components in the second image.

Application Example 8
In the electronic component transfer apparatus of the present invention, it is preferable that at least a part of the electronic components of the plurality of electronic components overlap with each other in the housing member.
Thus, the arrangement of the plurality of electronic components can be accommodated without concern.

Application Example 9
In the electronic component transfer apparatus of the present invention, it is preferable that the presence or absence of the placement member can be detected.
Thus, the electronic component can be accommodated using the accommodating member.

Application Example 10
In the electronic component transporting apparatus of the present invention, prior Sharing, ABS part preferably has a recess portion enters the accommodating member.

  Thereby, the positional deviation of the housing member can be prevented, and the electronic component can be dropped toward the housing member.

Application Example 11
In the electronic component transfer apparatus of the present invention, it is preferable that the height at which the electronic component is released be changeable when the electronic component is housed in the housing member.
This can prevent damage or the like due to the drop of the electronic component.

Application Example 12
In the electronic component transfer apparatus according to the present invention, it is preferable that, when arranging the accommodating member, the electronic component conveying device further includes a central position setting unit capable of setting a central position of the accommodating member from a reference position when viewed from above vertically.
Thereby, the electronic component transfer apparatus becomes operable according to the size of the housing member.

Application Example 13
In the electronic component transfer apparatus according to the present invention, it is preferable that the electronic component transfer apparatus further includes a storage number setting unit capable of setting the number of the electronic components that can be stored in the storage member.
Thereby, the electronic component transfer apparatus becomes operable according to the size of the housing member.
Application Example 14
In the electronic component transport apparatus of the present invention, two types of housing members having different outer shapes are prepared in advance as the housing members,
It is preferable that the two types of accommodation members are exchangeably arranged in the arrangement portion.

Application Example 15
An electronic component inspection apparatus according to the present invention comprises an inspection unit that inspects an electronic component ;
An arrangement unit capable of arranging a housing member having a recess capable of housing a plurality of electronic components after inspection inspected by the inspection unit;
And a gripping portion capable of gripping a plurality of the electronic components and transporting the electronic components to the recess.
The housing member is open at one side and has an opening through which the plurality of electronic components can be inserted, and a bottom closing the other.
When the gripping portion grips the first electronic component and the second electronic component among the plurality of electronic components to be stored in the housing member, the first electronic component and the second electronic component may be positioned on the recess. (2) When releasing the electronic component, the first electronic component and the second electronic component are released in this order, and the second electronic component is located at a position different from the position on the first electronic component when viewed from vertically above It is characterized by releasing parts .
Thus, the arrangement of the plurality of electronic components can be accommodated without concern.

FIG. 1 is a schematic perspective view of the electronic component conveyance device (first embodiment) of the present invention as viewed from the front side. FIG. 2 is a schematic plan view of the electronic component inspection device shown in FIG. FIG. 3 is a perspective view of a recovery box provided in the electronic component inspection device shown in FIG. 1 and the periphery thereof. FIG. 4 is a view seen from the direction of arrow A in FIG. FIG. 5 is a cross-sectional view taken along the line B-B in FIG. FIG. 6 is a view showing information on trays displayed on a monitor provided in the electronic component inspection device shown in FIG. FIG. 7 is a view showing information on a collection box displayed on a monitor provided in the electronic component inspection device shown in FIG. FIG. 8 is a view of a recovery box displayed on a monitor provided in the electronic component inspection device (second embodiment) of the present invention. FIG. 9 is a five-sided view showing the state when the IC device is housed in the recovery box in the electronic component inspection device (third embodiment) of the present invention. FIG. 10 is a cross-sectional view of a recovery box provided in the electronic component inspection device (the fourth embodiment) of the present invention and the periphery thereof. FIG. 11 is a view showing information on a collection box displayed on a monitor provided in the electronic component inspection device (fifth embodiment) of the present invention.

  Hereinafter, an electronic component conveyance device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the attached drawings.

First Embodiment
FIG. 1 is a schematic perspective view of the electronic component conveyance device (first embodiment) of the present invention as viewed from the front side. FIG. 2 is a schematic plan view of the electronic component inspection device shown in FIG. FIG. 3 is a perspective view of a recovery box provided in the electronic component inspection device shown in FIG. 1 and the periphery thereof. FIG. 4 is a view seen from the direction of arrow A in FIG. FIG. 5 is a cross-sectional view taken along the line B-B in FIG. FIG. 6 is a view showing information on trays displayed on a monitor provided in the electronic component inspection device shown in FIG. FIG. 7 is a view showing information on a collection box displayed on a monitor provided in the electronic component inspection device shown in FIG. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are taken as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". Further, the upstream side in the transport direction of the electronic component is simply referred to as "upstream side", and the downstream side is simply referred to as "downstream side". In addition, “horizontal” referred to in the specification of the present application is not limited to perfect horizontal, and includes a state of being slightly inclined (for example, less than about 5 °) with respect to horizontal unless transport of electronic components is inhibited.

  The inspection apparatus (electronic component inspection apparatus) 1 shown in FIGS. 1 and 2 is, for example, an IC device such as a BGA (Ball grid array) package or LGA (Land grid array) package, LCD (Liquid Crystal Display), CIS (CMOS) This is a device for inspecting and testing the electrical characteristics of electronic components such as Image Sensor (hereinafter simply referred to as “inspection”). In the following, for convenience of explanation, the case of using an IC device as the electronic component to be inspected will be representatively described, and this will be referred to as “IC device 90”.

  As shown in FIG. 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a device recovery area (hereinafter simply "recovery area"). It is divided into A4 and tray removal area A5. Then, the IC device 90 performs inspections in the inspection area A3 halfway through the above-described areas in order from the tray supply area A1 to the tray removal area A5. As described above, the inspection apparatus 1 includes the electronic component conveyance apparatus for conveying the IC device 90 in each area, the inspection unit 16 for inspecting in the inspection area A3, the control unit 80, the monitor 300, and the signal lamp 400. It has been prepared. In the inspection apparatus 1, in the tray supply area A1 to the tray removal area A5, the device supply area A2 to the collection area A4 in which the IC device 90 is transported can also be referred to as a "transport area (transport area)".

  In the inspection apparatus 1, the side where the tray supply area A1 and the tray removal area A5 are disposed (lower side in FIG. 2) is the front side, and the opposite side, that is, the side where the inspection area A3 is disposed (figure The upper side in 2) is used as the back side.

  The tray supply area A1 is a feeding unit to which a tray (arrangement member) 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Tray conveyance mechanisms 11A and 11B for conveying the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature control unit (soak plate) 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature control unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and can heat or cool the plurality of IC devices 90. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 2, two temperature adjustment units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in (conveyed) from the tray supply area A1 by the tray conveyance mechanism 11A is conveyed to any one of the temperature adjustment units 12 and placed.

  The device transport head 13 is movably supported in the supply area A2. Thus, the device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and the device supply unit 14 described later. The transfer of the IC device 90 can be performed.

  The tray transport mechanism 15 transports the empty tray 200 in a state in which all the IC devices 90 have been removed in the X direction in the supply area A2. Then, after this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area for inspecting the IC device 90. A device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided in the inspection area A3.

  The device supply unit 14 is a placement unit on which the temperature-controlled IC device 90 is placed, and can transport the IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply area A2 and the inspection area A3. Further, in the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment unit 12 are transported to and mounted on one of the device supply units 14. Ru.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminals of the IC device 90 and the probe pins are electrically connected (contacted), and the inspection of the IC device 90 is performed via the probe pins. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, as in the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The device transport head 17 is movably supported in the inspection area A3. As a result, the device transfer head 17 can transfer the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16 and place it.

  The device recovery unit 18 is a placement unit on which the IC device 90 for which the inspection in the inspection unit 16 has been completed is placed, and can transport the IC device 90 to the recovery area A4. The device recovery unit 18 is supported movably along the X direction between the inspection region A3 and the recovery region A4. Further, in the configuration shown in FIG. 2, two device recovery units 18 are arranged in the Y direction as in the device supply unit 14, and the IC devices 90 on the inspection unit 16 are either device recovery units 18. Transported and placed. This transfer is performed by the device transfer head 17.

  The recovery area A4 is an area in which the plurality of IC devices 90 for which the inspection has been completed are recovered. In the recovery area A4, a recovery tray 19, a recovery box (housing member) 23, a device transport head 20, and a tray transport mechanism (second transport device) 21 are provided. In addition, an empty tray 200 is also prepared in the collection area A4.

  The recovery tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the recovery area A4. In the configuration shown in FIG. 2, two recovery trays 19 are arranged along the X direction. The recovery box 23 is disposed adjacent to the right of the right recovery tray 19 in FIG. 2 among the two recovery trays 19. Further, the empty tray 200 is also a mounting portion on which the IC device 90 is mounted, and three are arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported to and placed on any of the recovery tray 19, the recovery box 23, and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is movably supported in the recovery area A4. As a result, the device transfer head 20 can transfer the IC device 90 from the device recovery unit 18 to the recovery tray 19, the recovery box 23, and the empty tray 200.

  The tray transport mechanism 21 transports the empty tray 200 carried in from the tray removal area A5 in the collection area A4 in the X direction. Then, after this conveyance, the empty tray 200 will be disposed at a position where the IC device 90 is collected, that is, it can be any of the three empty trays 200. As described above, in the inspection apparatus 1, the tray conveyance mechanism 21 is provided in the collection area A4, and in addition, the tray conveyance mechanism 15 is provided in the supply area A2. As a result, for example, throughput (the number of transported IC devices 90 per unit time) can be improved as compared with the case where the transport of the empty tray 200 in the X direction is performed by one transport mechanism.

  The configuration of the tray transport mechanisms 15 and 21 is not particularly limited. For example, the configuration includes a suction member that suctions the tray 200, and a support mechanism such as a ball screw that supports the suction member movably in the X direction. Can be mentioned.

  The tray removal area A5 is a removing unit from which the tray 200 in which the plurality of IC devices 90 in the inspected state are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  Further, tray conveyance mechanisms 22A and 22B for conveying the trays 200 one by one are provided so as to straddle the recovery area A4 and the tray removal area A5. The tray transport mechanism 22A transports the tray 200 on which the tested IC device 90 is placed from the recovery area A4 to the tray removal area A5. The tray transport mechanism 22B transports an empty tray 200 for recovering the IC device 90 from the tray removal area A5 to the recovery area A4.

  The control unit 80 has, for example, a drive control unit. The drive control unit includes, for example, tray conveyance mechanisms 11A and 11B, a temperature adjustment unit 12, a device conveyance head 13, a device supply unit 14, a tray conveyance mechanism 15, an inspection unit 16, and a device conveyance head 17. The drive of each part of the device recovery unit 18, the device conveyance head 20, the tray conveyance mechanism 21, and the tray conveyance mechanisms 22A and 22B is controlled.

  The inspection control unit of the tester performs, for example, an inspection of the electrical characteristics of the IC device 90 disposed in the inspection unit 16 based on a program stored in a memory (not shown).

  In the inspection apparatus 1 as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. Thus, the temperature of the IC device 90 is maintained constant while being transported.

  Then, the operator can set or confirm the temperature condition and the like at the time of operation of the inspection apparatus 1 through the monitor 300. The monitor 300 is disposed on the front upper side of the inspection apparatus 1. As shown in FIGS. 1 and 2, on the right side of the tray removal area A5 in the figure, a mouse stand 600 for placing a mouse used when operating the screen displayed on the monitor 300 is provided.

  In addition, the signal lamp 400 can notify of the operation state of the inspection apparatus 1 and the like by the combination of the light emitting colors. The signal lamp 400 is disposed on the top cover 74. In addition, the speaker 500 is incorporated in the test | inspection apparatus 1, and the operation state etc. of the test | inspection apparatus 1 can also be alert | reported also by this speaker 500. FIG.

  As shown in FIG. 2, in the inspection apparatus 1, the space between the tray supply area A1 and the supply area A2 is divided (partitioned) by the first partition wall 61, and the space between the supply area A2 and the inspection area A3 is The second partition 62 divides the space between the inspection area A3 and the recovery area A4 between the third partition 63 and the fourth area 64 between the recovery area A4 and the tray removal area A5. ing. Further, the fifth partition wall 65 also divides between the supply area A2 and the recovery area A4. These partitions have a function to keep the airtightness of each area. Furthermore, the inspection apparatus 1 is covered with a cover at the outermost part, and the cover includes, for example, a front cover 70, side covers 71 and 72, a rear cover 73, and a top cover 74.

  The supply area A2 is a first chamber R1 defined by the first partition 61, the second partition 62, the fifth partition 65, the side cover 71, and the rear cover 73. A plurality of IC devices 90 in an uninspected state are carried into the first chamber R1 together with the tray 200.

  The inspection area A3 is a second chamber R2 defined by the second partition wall 62, the third partition wall 63, and the rear cover 73. In the second chamber R2, an inner partition wall 66 is disposed on the inner side of the rear cover 73.

  The recovery area A4 is a third chamber R3 defined by the third partition 63, the fourth partition 64, the fifth partition 65, the side cover 72, and the rear cover 73. A plurality of IC devices 90 for which inspection has been completed are carried into the third chamber R3 from the second chamber R2.

  As shown in FIG. 2, the side cover 71 is provided with a first door (first left door) 711 and a second door (second left door) 712. By opening the first door 711 and the second door 712, for example, maintenance in the first chamber R1, release of jamming in the IC device 90, and the like (hereinafter, these may be generically referred to as "work") can be performed. In addition, the 1st door 711 and the 2nd door 712 become what is called "a door open" which opens and closes in a mutually opposite direction. Further, at the time of work in the first chamber R1, the movable portion of the device transport head 13 or the like in the first chamber R1 is stopped. The first door 711 and the second door 712 can be locked and unlocked collectively (collectively) by the operation of the cylinder 740.

  Similarly, the side cover 72 is provided with a first door (first right door) 721 and a second door (second right door) 722. By opening the first door 721 and the second door 722, for example, work in the third chamber R3 can be performed. Note that the first door 721 and the second door 722 are also so-called "open doors" that open and close in opposite directions. Further, at the time of work in the third chamber R3, the movable portion of the device transport head 20 or the like in the third chamber R3 is stopped. The first door 721 and the second door 722 can be locked and unlocked collectively (collectively) by the operation of the cylinder 745.

  Further, the rear cover 73 is also provided with a first door (rear side first door) 731, a second door (rear side second door) 732 and a third door (rear side third door) 733. By opening the first door 731, for example, work in the first chamber R <b> 1 can be performed. By opening the third door 733, for example, work in the third chamber R3 can be performed. Furthermore, a fourth door 75 is provided on the inner partition wall 66. Then, by opening the second door 732 and the fourth door 75, for example, work in the second chamber R2 can be performed. The first door 731, the second door 732 and the fourth door 75 open and close in the same direction, and the third door 733 opens and closes in the opposite direction to these doors. Further, at the time of work in the second chamber R2, the movable portion of the device transport head 17 or the like in the second chamber R2 is stopped. The first door 731 can be locked and unlocked by the operation of the cylinder 741, the second door 732 can be locked and unlocked by the operation of the cylinder 742, and the third door 733 is the actuation of the cylinder 744. Thus, the fourth door 75 can be locked and unlocked by the operation of the cylinder 743.

  And by closing each door, the airtightness and heat insulation in each corresponding room can be secured.

  As described above, the IC devices 90 after inspection are collected and classified into any one of the collection tray 19, the collection box 23, and the empty tray 200 for each inspection result. On the collection tray 19 and the tray 200, the IC devices 90 are arranged in a matrix.

  By the way, depending on the user of the inspection apparatus 1, the IC devices 90 after inspection may not be arranged in order, that is, may not be arranged in a matrix. The inspection apparatus 1 is configured to be able to respond to such a request, and uses the recovery box 23. Hereinafter, this configuration will be described.

  As shown in FIGS. 3 to 5, in the collection area A <b> 4, an arrangement portion 24 on which the collection box 23 can be arranged is provided. When the position where the collection box 23 is arranged on the placement unit 24 is selected from the screen, the collection box 23 can be used. In the inspection apparatus 1, when the recovery box 23 is not used, the recovery tray 19 can be replaced and arranged on the placement unit 24 instead of the recovery box 23.

  In addition, as shown in FIG. 3, it is detected whether or not the recovery box 23 is placed on the placement unit 24 in the recovery area A4, that is, the presence or absence of the recovery box 23 on the placement unit 24. A detection unit 25 for detecting The detection unit 25 is a light transmission type sensor electrically connected to the control unit 80, and includes a light emitting unit 251 and a light receiving unit 252. The light emitting unit 251 is a light emitting diode that emits light 253, and the light receiving unit 252 is a photodiode that receives the light 253. In addition, the light emitting unit 251 and the light receiving unit 252 are disposed opposite to each other via the collection box 23 on the arrangement unit 24.

  Then, in a state where the recovery box 23 is not disposed on the placement unit 24, the light 253 from the light emitting unit 251 reaches the light receiving unit 252 and is received. In this case, the control unit 80 determines that the collection box 23 is not disposed on the placement unit 24. On the other hand, when the recovery box 23 is disposed on the placement unit 24, the light 253 from the light emitting unit 251 is blocked by the recovery box 23 and does not reach the light receiving unit 252 (see FIG. 3) . In this case, the control unit 80 determines that the collection box 23 is disposed on the placement unit 24. Thereby, the recovery box 23 can be used, that is, the IC device 90 can be accommodated in the recovery box 23.

  In addition, the arrangement | positioning location of the collection | recovery box is not limited to the location shown in FIG. 2, For example, it can also be set as the location where the recovery tray 19 is arrange | positioned, and the location where the empty tray 200 is arrange | positioned.

  The recovery box 23 has a bottom portion (closed portion) 231 having a rectangular shape (or a square) in a plan view, and a wall portion 232a, a wall portion 232b, a wall portion 232c and a wall portion 232d erected from the edge of the bottom portion 231 have. That is, the recovery box 23 has a bottomed cylindrical shape. And the one recessed part 233 is constituted by the bottom part 231, the wall part 232a, the wall part 232b, the wall part 232c, and the wall part 232d. As a result, the recovery box 23 can accommodate a plurality of IC devices 90 after inspection in the recess 233 (see FIG. 5). The recess 233 has an opening 234 opened upward (one side). The opening 234 serves as an inlet through which the IC device 90 is inserted when the IC device 90 is accommodated in the recess 233.

  The length in the X direction of the bottom portion 231 is preferably 5 cm or more and 20 cm or less, and more preferably 8 cm or more and 11 cm or less. The length of the bottom portion 231 in the Y direction is preferably 5 cm or more and 50 cm or less, and more preferably 10 cm or more and 30 cm or less. The length in the Z direction of the wall portions 232a to 232d, that is, the height is preferably, for example, 1 cm or more and 10 cm or less, and more preferably 2 cm or more and 4 cm or less.

  The constituent material of the recovery box 23 is not particularly limited. For example, various metal materials such as aluminum and various resin materials such as polyethylene can be used.

  As shown in FIG. 5, an elastic film 26 made of an elastic member is attached to the inside of the recovery box 23. The elastic film 26 covers a portion of the bottom 231 and the walls 232 a to 232 d facing the recess 233. As a result, when the IC device 90 falls into the recess 233, the impact on the IC device 90 can be mitigated, and thus the IC device 90 can be prevented from being damaged or broken. In the recovery box 23, the elastic film 26 can be omitted.

  In order to accommodate the IC device 90 in the collection box 23 as described above, as shown in FIG. 4, the device transfer head 20 in a state in which a plurality (eight in the drawing) of IC devices 90 are collectively gripped. It is positioned vertically above the recovery box 23 and stopped. Then, in this state, the gripping force on each IC device 90 is released. As a result, each IC device 90 falls, and as shown in FIG. 5, in the recess 233, a part or all of the IC devices 90 are accommodated so as to overlap each other. Then, by repeating such an operation, a large number of (plural) IC devices 90 can be accommodated in the collection box 23 without worrying about the arrangement.

  Further, in the inspection apparatus 1, the number of IC devices 90 accommodated in the recovery box 23 (hereinafter referred to as “accommodated number”) can be counted. This counting can be performed, for example, using image processing. In this case, the first image of the device transport head 20 immediately before opening the IC device 90 and the second image of the device transport head 20 immediately after opening the IC device 90 are compared, and the IC device in the first image is compared. This is possible by calculating the difference between the number of 90 and the number of IC devices 90 in the second image. In addition, the control unit 80 may count the IC devices 90 stored in the collection box 23.

  Then, the control unit 80 can determine whether the accommodated number has reached a predetermined number as a preset threshold. As a result of the determination, when the number of contained pieces reaches a predetermined number, that is notified, for example, by the monitor 300 or the like. Thereby, the operator can open the first door 721 and the second door 722 of the recovery area A4, take out the recovery box 23 from the recovery area A4, and replace it with the empty recovery box 23. In addition, the detection unit 25 can also detect replacement of the recovery box 23.

  As shown in FIG. 4, the shape of the opening 234 of the recovery box 23 is such that a plurality of (eight in the drawing) IC devices 90 can be introduced at one time, that is, a plurality of ICs in plan view It is shaped to encompass the device 90. In other words, the size of the surface of the opening 234 includes the position of each IC device 90 when the plurality of IC devices 90 are gripped by the device transport head 20 (gripping portion). Thus, for example, the time for housing the IC device 90 can be shortened as compared with the case where the IC devices 90 are housed one by one in order. The device transport head 20 is configured to be able to change the pitch (interval) of the held IC devices 90, and when the IC device 90 is opened, the pitch is minimized. Further, the timings of releasing the plurality of IC devices 90 may be simultaneous or there may be a time difference.

  In addition, the size of the recovery box 23 may differ depending on the user of the inspection apparatus 1 or the type of the IC device 90. Here, in accordance with the size of the recovery box 23, a setting screen for making the inspection apparatus 1 in an operable state will be described with reference to FIGS.

  In this setting, the form F1 shown in FIGS. 6 and 7 is displayed on the monitor 300. The form F1 has four tabs T1 to T4. The tab T1 is described as "Type 1", the tab T2 is described as "Type 2", and the tab T3 is described as "Type 3" The tab T4 describes "Bulk Box". In the lower part of the form F1, various operation buttons B such as "Store", "Recall", "OK", "Cancel" and "Apply" are displayed.

  Then, when the tab T1 is representatively selected from the tabs T1 to T3, information on the tray 200 can be input (set) in the form F1 as shown in FIG. 6 (Tray setting screen / Tray) Setting Display). This information includes the blank BL1 for “X-Dimension” which is the dimensions of the tray 200, the blank BL2 for “Y-Dimension”, the blank BL3 for “Thickness”, and the reference position of the concave portion of the tray 200 A blank BL4 for the distance “X-Start”, a blank BL5 for the “X-Pitch”, a blank BL6 for the “Y-Start”, and a blank BL7 for the “Y-Pitch”. In addition, there are blank BL 8 for “Pick Up” of the reference position when picking up the tray 200 and blank BL 9 for the name of the IC device 90.

  Further, when the tab T4 is selected, as shown in FIG. 7, information on the recovery box 23 can be input to the form F1. That is, the setting position of the collection box 23 can be set (setting display unit (Bulk Box presence / absence confirmation / Bulk Box Detect sensor)). In this information, a blank BL10 (center position setting unit) for the distance “X-Start” from the reference position (corner portion) of the tray 200 at the center of the recovery box 23 and a blank for “Y-Start” There are BL11 (center position setting unit), a blank BL15 for the length "X-Dimension" of the collection box 23 in the X direction, and a blank BL16 for the length "Y-Dimension" of the collection box 23 in the Y direction. In addition, there are blanks BL12 (accommodated number setting unit) for setting the number of IC devices 90 that can be accommodated in the recovery box 23, and blanks BL13 for the name of the recovery box 23.

  Then, by inputting numerical values and the like into these blanks BL1 to BL13, blanks BL15, and blanks BL16 appropriately, the inspection apparatus 1 becomes operable according to the size of the recovery box 23.

Second Embodiment
FIG. 8 is a view of a recovery box displayed on a monitor provided in the electronic component inspection device (second embodiment) of the present invention.

  Hereinafter, the second embodiment of the electronic component conveyance device and the electronic component inspection device of the present invention will be described with reference to this figure, and differences from the above-described embodiment will be mainly described, and the same matters will be described. Omit.

  The present embodiment is the same as the first embodiment except that the setting screen for collecting box replacement is displayed.

  As shown in FIG. 8, in the present embodiment, a cylindrical recovery box 23 (see FIG. 8 (b)) is a rectangular (rectangular) recovery box 23 (see FIG. 8 (a)) in plan view. Can be exchanged. Further, by making the recovery box 23 rectangular (rectangular), the recovery box 23 can be made as small as possible.

  When this replacement is performed, first, the recovery box 23 in the inspection apparatus 1 is replaced. Next, the form F2 of "storage box type 1" shown in FIG. 8A is displayed on the monitor 300. On the form F2, a recovery box 23 having a rectangular shape in a plan view is drawn.

  Next, a form F3 of "storage box type 2" shown in FIG. 8B to be replaced is displayed on the monitor 300. A cylindrical recovery box 23 is described in the form F3. Then, the form F2 is changed (selected) to the form F3.

  As a result, the cylindrical recovery box 23 becomes usable, that is, the IC device 90 can be accommodated in the cylindrical recovery box 23.

  In the inspection apparatus 1 of the present embodiment, the cylindrical recovery box 23 can be replaced with a recovery box 23 having a rectangular shape (or square) in plan view, contrary to the replacement.

Third Embodiment
FIG. 9 is a five-sided view showing the state when the IC device is housed in the recovery box in the electronic component inspection device (third embodiment) of the present invention.

  Hereinafter, although the third embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described with reference to this figure, differences from the above-described embodiment will be mainly described, and the same matters will be described. Omit.

  The present embodiment is the same as the first embodiment except that the release position of the IC device with respect to the recovery box is different.

  As shown in FIG. 9, in the present embodiment, the release position of the IC device 90 when the IC device 90 is accommodated in the recovery box 23 can be changed. The changed release positions are the position of the IC device 90 in plan view and the position of the height of the IC device 90.

  As shown in the central view in FIG. 9, the IC device 90 sequentially rotates counterclockwise from the vicinity of the corner 235a which is the boundary between the wall 232a and the wall 232d, between the wall 232a and the wall 232b. The corner 235a is around the corner 235b which is the border, around the corner 235c which is the border between the wall 232b and the wall 232c, and around the corner 235d which is the border between the wall 232c and the wall 232d. .About. Corners 235d are sequentially released.

  Further, along with this, the IC device 90 has the lowest height H from the elastic film 26 covering the bottom 231 in the vicinity of the corner 235 a. The height H from the elastic film 26 in the vicinity of the corner portion 235b, the height H from the elastic film 26 in the vicinity of the corner portion 235c, and the height H from the elastic film 26 in the vicinity of the corner portion 235d are It will increase in order.

  By changing the release position like this, the damage due to the drop of the IC device 90 is prevented, and the interference between the IC device 90 stacked in the recovery box 23 and the IC device 90 falling from these is prevented. Can. Further, the IC devices 90 can be stacked almost uniformly in the recovery box 23.

  In addition to the release mode of the IC device 90 as shown in FIG. 9, the IC device 90 may be released along the arrangement direction of the recesses (pockets) of the tray 200 on the tray 200.

Fourth Embodiment
FIG. 10 is a cross-sectional view of a recovery box provided in the electronic component inspection device (the fourth embodiment) of the present invention and the periphery thereof.

  Hereinafter, the fourth embodiment of the electronic component transfer apparatus and the electronic component inspection apparatus of the present invention will be described with reference to this figure, and differences from the above-described embodiments will be mainly described, and the same matters will be described. Omit.

  The present embodiment is the same as the first embodiment except that the shape of the arrangement portion where the recovery box is arranged is different.

  As shown in FIG. 10, in the present embodiment, the placement portion 24 in which the recovery box 23 is disposed has a recess 241. The bottom portion 231 of the recovery box 23 can be fitted (entered) in the recess 241. As a result, the position of the recovery box 23 is regulated, so that the recovery box 23 can be prevented from being displaced from the placement unit 24 during operation of the inspection apparatus 1. Thus, the IC device 90 can be dropped toward the recovery box 23.

Fifth Embodiment
FIG. 11 is a view showing information on a collection box displayed on a monitor provided in the electronic component inspection device (fifth embodiment) of the present invention.

  Hereinafter, the fifth embodiment of the electronic component conveyance device and the electronic component inspection device of the present invention will be described with reference to this figure, and differences from the above-described embodiments will be mainly described, and the same matters will be described Omit.

  The present embodiment is the same as the second embodiment except that the configuration of the setting screen for making the inspection apparatus operable according to the size of the collection box is different.

  As shown in FIG. 11, the recovery box 23 has a cylindrical shape. Then, when tab T4 of form F1 is selected, blank BL 14 for height "Height Dimension" of recovery box 23 and blank BL 16 for diameter "Diameter" of recovery box 23 are also added as displayed information. There is. This contributes to, for example, preventing interference of the device transport head 20 with the recovery box 23 and preventing damage to the IC device 90 due to a drop impact.

  The electronic component transfer apparatus and the electronic component inspection apparatus according to the present invention have been described above with reference to the illustrated embodiment, but the present invention is not limited to this, and each component constituting the electronic component transfer apparatus and the electronic component inspection apparatus Can be replaced with any configuration that can perform the same function. Also, any component may be added.

  Further, the electronic component conveyance device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) of the respective embodiments.

  Moreover, although the box for collection | recovery is what has one recessed part in each said embodiment, it is not limited to this, You may have several recessed parts. Also in this case, a plurality of IC devices can be accommodated in each recess.

  Further, the shape of the bottom portion of the recovery box in plan view is a quadrangle such as a rectangle or a square in the first embodiment, but may be a hexagon or the like as a rectangle.

  Further, although the elastic film of the recovery box covers the bottom and the walls in the first embodiment, the present invention is not limited to this, and it is sufficient to cover at least the bottom.

  Moreover, although the box for collection | recovery is a bottomed cylindrical shape in the said 1st Embodiment, it is not limited to this, A box shape may be sufficient.

1 ... Inspection device (Electronic component inspection device)
11A, 11B: tray conveyance mechanism 12: temperature control unit (soak plate)
13 ...... Device transfer head 14 ...... Device supply unit (supply shuttle)
15: Tray transport mechanism (first transport device)
16 ... inspection unit 17 ... device transport head 18 ... device recovery unit (recovery shuttle)
19: Collection tray 20: Device transfer head 21: Tray transfer mechanism (second transfer device)
22A, 22B ... tray transport mechanism 23 ... recovery box (housing member)
231: Bottom portion 232a, 232b, 232c, 232d: Wall portion 233: Recession portion 234: Opening portion 235a, 235b, 235c, 235d: Corner portion 24: Arrangement portion 241: Recession portion 25: Detection portion 251 ...... Light emitting part 252 受 光 Light receiving part 253 光 Light 26 弾 性 Elastic film 61 第 First partition 62 第 Second partition 63 第 Third partition 64 第 Fourth partition 65 第 Fifth partition 66 ... ... Inside partition wall 70 ... Front cover 71 ... Side cover 711 ... First door 712 ... Second door 72 ... Side cover 721 ... First door 722 ... Second door 73 ... Rear cover 731 ... First One door 732: second door 733: third door 74: top cover 740, 741, 742, 743, 744, 745: cylinder 75: fourth door 80: control section 90: IC Vice 200 ...... tray (locating member)
300 ... monitor 400 ... signal lamp 500 ... speaker 600 ... mouse stand A1 ... tray supply area A2 ... device supply area (supply area)
A3 ... inspection area A4 ... device collection area (collection area)
A5: Tray removal area B: Operation button BL1, BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL11, BL12, BL13, BL14, BL15, BL16: Blank F1, F2, F3 ...... Form H ... Height R 1 ... Room 1 R 2 ... Room 2 R 3 ... Room 3 T 1, T 2, T 3, T 4 ... Tabs

Claims (15)

An arrangement portion capable of arranging a housing member having a recess capable of housing a plurality of electronic components after inspection;
And a gripping portion capable of gripping a plurality of the electronic components and transporting the electronic components to the recess.
The housing member is open at one side and has an opening through which the plurality of electronic components can be inserted, and a bottom closing the other.
When the gripping portion grips the first electronic component and the second electronic component among the plurality of electronic components to be stored in the housing member, the first electronic component and the second electronic component may be positioned on the recess. (2) When releasing the electronic component, the first electronic component and the second electronic component are released in this order, and the second electronic component is located at a position different from the position on the first electronic component when viewed from vertically above An electronic component conveying apparatus characterized by releasing a component.   The electronic component according to claim 1, wherein the gripping portion is configured to be able to change the pitch of the held electronic components, and when releasing the electronic component on the housing member, the electronic component is performed with the pitch being minimized. Transport device.   The electronic component transfer apparatus according to claim 1, wherein the size of the surface of the opening includes the position of each of the electronic components when the plurality of electronic components are gripped by a gripping unit.   The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the opening is rectangular. The electronic component conveying apparatus according to any one of claims 1 to 4, wherein at least the bottom of the housing member is formed of an elastic member.   The electronic component transfer apparatus according to any one of claims 1 to 5, wherein whether or not the number of the electronic components stored in the storage member has reached a predetermined number can be counted.   The counting is performed by comparing the first image of the gripping portion immediately before releasing the electronic component with the second image of the gripping portion immediately after releasing the electronic component, and calculating the electronic component of the first image. The electronic component conveying apparatus according to claim 6, which is made possible by calculating the difference between the number of the electronic component and the number of the electronic component in the second image.   The electronic component conveying apparatus according to any one of claims 1 to 7, wherein at least a part of the electronic components of the plurality of electronic components overlap each other in the housing member.   The electronic component conveyance device according to any one of claims 1 to 8, wherein presence or absence of the placement member can be detected.   The electronic component conveying apparatus according to any one of claims 1 to 9, wherein the arrangement portion has a recess portion in which a part of the housing member is inserted.   The electronic component conveying apparatus according to any one of claims 1 to 10, wherein a height at which the electronic component is released when the electronic component is accommodated in the accommodating member is changeable.   The electronic component conveyance according to any one of claims 1 to 11, further comprising: a central position setting unit capable of setting a central position of the housing member from a reference position when viewed from vertically above when arranging the housing member. apparatus.   The electronic component transfer apparatus according to any one of claims 1 to 12, further comprising a storage number setting unit capable of setting the number of the electronic components that can be stored in the storage member. As the housing member, two types of housing members having different outer shapes are prepared in advance,
The electronic component transfer apparatus according to any one of claims 1 to 13, wherein the two types of storage members are exchangeably arranged in the arrangement portion. An inspection unit that inspects electronic components;
An arrangement unit capable of arranging a housing member having a recess capable of housing a plurality of electronic components after inspection inspected by the inspection unit;
And a gripping portion capable of gripping a plurality of the electronic components and transporting the electronic components to the recess.
The housing member is open at one side and has an opening through which the plurality of electronic components can be inserted, and a bottom closing the other.
When the gripping portion grips the first electronic component and the second electronic component among the plurality of electronic components to be stored in the housing member, the first electronic component and the second electronic component may be positioned on the recess. (2) When releasing the electronic component, the first electronic component and the second electronic component are released in this order, and the second electronic component is located at a position different from the position on the first electronic component when viewed from vertically above An electronic component inspection device characterized by releasing a component.

Images