JP2004266181A

JP2004266181A - Semiconductor substrate storage container

Info

Publication number: JP2004266181A
Application number: JP2003056661A
Authority: JP
Inventors: Sadao Matai; 定男又井
Original assignee: NEC Electronics Corp
Current assignee: NEC Electronics Corp
Priority date: 2003-03-04
Filing date: 2003-03-04
Publication date: 2004-09-24

Abstract

PROBLEM TO BE SOLVED: To prevent breakage of a semiconductor substrate even when a shock is applied to a semiconductor substrate storage container for some reason. SOLUTION: The semiconductor substrate storage container 10 comprises a container main body 1 provided with a first cylindrical part 4 for accommodating a semiconductor substrate 8, the cylindrical part 4 being provided with a slit 5 extended from an upper end 4A to a lower end 4B and having a predetermined width W1; and a cover 2 provided with a second cylindrical part 6 for covering the first cylindrical part 4 and also provided with a projection 7 which is provided at a position corresponding to the slit 5 of the first cylindrical part 4 on an inner surface 6C of the second cylindrical part 6. The projection 7 is extended from an upper end 6A to a lower end 6B and has such a predetermined width as to allow the projection to fit in the slit 5. A top surface 7A of the projection 7 of the cover 2 is formed so as to be in the same plane as an extension plane of the inner surface 4C of the first cylindrical part 4 when the projection 7 fits in the slit 5. COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
この発明は、半導体基板収納容器に係り、詳しくは、ウエハ状の半導体基板の運搬、保管等を行う用途に用いられる半導体基板収納容器に関する。
【０００２】
【従来の技術】
例えばメモリやマイクロプロセッサ等のＬＳＩ（大規模集積回路）で代表される半導体装置が、各種の電子機器に広く利用されている。そのような半導体装置の製造にあたっては、最初の段階として半導体インゴットからウエハ状にスライスした半導体基板を用意することが必要になる。次に、この半導体基板を複数の製造プロセス工程に順次に運搬（移動）して、各工程において所望のプロセス処理を施すことが行われる。このように半導体基板を各工程間を運搬する場合には、あるいは半導体基板を一時的に保管する場合には半導体基板収納容器が用いられる。
【０００３】
上述したような用途に用いられる半導体基板収納容器が開示されている。（例えば、特許文献１参照。）。図１４は、同半導体基板収納容器を示す分解斜視図である。同半導体基板収納容器１００は、同図に示すように、半導体基板を多数枚重ねて収納可能な有底円筒状の容器本体１０１と、この容器本体１０１を覆う蓋体１０２とを備え、容器本体１０１及び蓋体１０２は共に導電性プラスチックスから成る素材が用いられている。容器本体１０１は、正方形状の基底部１０１Ａ上に円筒部１０１Ｂが設けられ、この円筒部１０１Ｂには所定幅の複数のスリット１０１Ｃ及び複数の突状体１０１Ｄが設けられている。一方、蓋体１０２は、全体が正四角柱状をなし、円筒部１０２Ａに外接する角筒部１０２Ｂが設けられ、この角筒部１０２Ｂの上面には円形台状の突起から成る着脱用凸部１０２Ｃが設けられ、この着脱用凸部３Ｃの周囲にはリング状突起１０２Ｄが同心状に設けられている。
【０００４】
上述したような構成の半導体基板収納容器１００を用いて、容器本体１０１の円筒部１０１Ｂ内に、半導体基板をクッションシートを介在させて多数枚重ねて収納した後、円筒部１０１Ｂを蓋体１０２の円筒部１０２Ａにより覆い、次に両円筒部１０１Ｂ、１０２Ａを相対的に回動させて、蓋体１０２を容器本体１０１に固定する。この状態で、作業員が着脱用凸部３Ｃを把持することにより、あるいは着脱用凸部３Ｃ、リング状突起１０２Ｄ等を利用して複数の半導体基板収納容器１００を上下方向に積み重ねて一体化させることにより、半導体基板を運搬、あるいは保管することができる。一方、半導体基板を半導体基板収納容器１００から取り出す場合は、両円筒部１０１Ｂ、１０２Ａを上述の収納の場合とは逆方向に回動させることにより蓋体１０２と容器本体１０１との固定状態を解除して、円筒部１０２Ａを円筒部１０１Ｂから取り外すようにする。このように半導体基板を収納あるいは取り出しするに際しては、真空吸着具等を用いて容器本体１０１のスリット１０１Ｃを通じて半導体基板を取り扱うことにより、着脱作業が容易になるように構成されている。
【０００５】
【特許文献１参照】
特開平６−６９３２８号公報（第３〜５頁、図１〜６）
【０００６】
【発明が解決しようとする課題】
ところで、特許文献１に開示された従来の半導体基板収納容器では、半導体基板を収納した状態で半導体基板収納容器に何らかの原因で衝撃が加わった際に、半導体基板が破損し易くなる、という問題がある。
すなわち、図１４に示したような半導体基板収納容器１００では、容器本体１０１の円筒部１０１Ｂ内に半導体基板を収納した状態で、例えば運搬中に作業員の不注意等により半導体基板収納容器１００が落下してしまった場合は、半導体基板収納容器１００に衝撃が加わることになるが、図１５に示すように、特にスリット１０１Ｃが下方を向いた向きで落下した場合には、スリット１０１Ｃの両端部１０１Ｅに集中的に衝撃が加わるようになる。そして、この衝撃はスリット１０１Ｃの両端部１０１Ｅに点接触している半導体基板１０３に瞬間的に加わるようになる。例えば、直径が２００ｍｍの半導体基板１０３を収納した半導体基板収納容器１０３を約７０ｃｍの高さから落下した例で説明すると、落下時の衝撃は３０〜４０Ｇ（Ｇｒａｖｉｔｙ：重力加速度）にもなり、この値の衝撃がほとんどそのまま半導体基板１０３に加わるようになる。このような衝撃力はかなり大きいので、機械的に脆い性質の半導体基板はその衝撃に耐えられずに破損に至たるようになる。
【０００７】
また、前述したように電子機器に実装されるＬＳＩは、電子機器の小型化を図るために、その実装スペースはますます狭くなってきており、これに伴って半導体基板の厚さは略１００μｍ前後まで薄型化されているので、機械的強度が低下しているため、半導体基板が破損される傾向はより一層高くなっている。
【０００８】
この発明は、上述の事情に鑑みてなされたもので、何らかの原因で衝撃が加わっても半導体基板の破損を防止することができるようにした半導体基板収納容器を提供することを目的としている。
【０００９】
【課題を解決するための手段】
上記課題を解決するために、請求項１記載の発明は、半導体基板を多数枚重ねて収納可能な半導体基板収納容器に係り、上端から下端に向かって所定の幅のスリットが設けられ、上記半導体基板を収納するための上端開口及び下端閉塞の円筒状の容器本体と、上記容器本体の上記スリットに対応して内面に、上端から下端に向かって上記スリットに嵌合可能な所定の幅の凸部が設けられ、上記容器本体を覆う上端閉塞及び下端開口の円筒状の蓋体とを備えることを特徴としている。
【００１０】
また、請求項２記載の発明は、請求項１記載の半導体基板収納容器に係り、上記蓋体の上記凸部の頂面は、該凸部が上記スリットに嵌合された際に、上記容器本体の内面が延長される面と同一面となるように形成されていることを特徴としている。
【００１１】
また、請求項３記載の発明は、請求項１又は２記載の半導体基板収納容器に係り、上記スリットを形成している上記容器本体の端部及び上記蓋体の上記凸部の端部が面取りされた形状に形成されていることを特徴としている。
【００１２】
また、請求項４記載の発明は、半導体基板を多数枚重ねて収納可能な半導体基板収納容器に係り、円周方向に沿って複数の側壁部が設けられ、上記半導体基板を収納するための上端開口及び下端閉塞の円筒状の容器本体と、上記容器本体の上記側壁部に対応して内面に、該側壁部と同数の係合部が上記側壁部に係合可能に設けられ、上記容器本体を覆う回動可能な上端閉塞及び下端開口の円筒状の蓋体とを備えることを特徴としている。
【００１３】
また、請求項５記載の発明は、請求項４記載の半導体基板収納容器に係り、上記第２の円筒部の回動方向は、上記半導体基板の収納時と上記半導体基板の取り出し時とでは異なることを特徴としている。
【００１４】
また、請求項６記載の発明は、請求項４又は５記載の半導体基板収納容器に係り、上記容器本体には上端から下端に向かって、上記側壁部に隣接して複数のスリットが設けられていることを特徴としている。
【００１５】
また、請求項７記載の発明は、半導体基板を多数枚重ねて収納可能な半導体基板収納容器に係り、円周方向に沿って複数のスリットが設けられ、上記半導体基板を収納するための上端開口及び下端閉塞の円筒状の容器本体と、上記容器本体を覆う上端閉塞及び下端開口の円筒状の蓋体と、上記容器本体と上記蓋体との間に配置され、上記容器本体内に上記半導体基板が収納された際に上記スリットを通じて上記半導体基板の側縁を押圧する流体収納部とを備えることを特徴としている。
【００１６】
また、請求項８記載の発明は、請求項７記載の半導体基板収納容器に係り、上記半導体基板を上記容器本体内に収納する際に、上記流体収納部に流体を供給することを特徴としている。
【００１７】
【発明の実施の形態】
以下、図面を参照して、この発明の実施の形態について説明する。説明は実施例を用いて具体的に行う。
◇第１実施例
図１は、この発明の第１実施例である半導体基板収納容器の構成を示す分解斜視図、図２は図１のＡ−Ａ矢視断面図、図３は図１のＢ−Ｂ矢視断面図、図４は同半導体基板収納容器の構成を示す平面図、図５は図４のＣ−Ｃ矢視断面図、図６は同半導体基板収納容器に半導体基板を収納した状態を示す平面図である。
この例の半導体基板収納容器１０は、図１に示すように、半導体基板を多数枚重ねて収納可能な上端開口及び下端閉塞の円筒状の容器本体１と、この容器本体１を覆う上端閉塞及び下端開口の円筒状の蓋体２とを備えている。容器本体１及び蓋体２は共にプラスチックが用いられて射出成形により形成されている。
【００１８】
容器本体１は、図１及び図２に示すように、例えば円形状の基底部３上に半導体基板を収納するための第１の円筒部４が設けられ、この第１の円筒部４には、この上端４Ａから下端４Ｂに向かって所定の幅Ｗ１のスリット５が設けられている。一例として、直径が２００ｍｍの半導体基板を第１の円筒部４内に収納する場合には、スリット５の幅Ｗ１は１８〜２２ｍｍに選ばれる。このスリット５は、第１の円筒部４内に半導体基板を収納する場合、あるいは第１の円筒部４内から半導体基板を取り出す場合に、半導体基板を吸着する真空吸着具等の吸着具を挿入して半導体基板の着脱作業を容易にするためのものである。
【００１９】
一方、蓋体２は、図１及び図３に示すように、容器本体１の第１の円筒部４を覆う第２の円筒部６が設けられ、この第２の円筒部６の内面６Ｃにおける第１の円筒部４のスリット５に対応した位置には、その上端６Ａから下端６Ｂへ向かってスリット５に嵌合可能な幅Ｗ２（Ｗ１＞Ｗ２）の凸部７が設けられている。一例として、凸部７の幅Ｗ２は、上述したスリット５の幅Ｗ１よりも２〜３ｍｍ小さく選ばれる。ここで、第２の円筒部６の凸部７の頂面７Ａは、凸部が第１の円筒部４のスリット５に嵌合された際に、第１の円筒部４の内面４Ｃが延長される面と同一面となるように形成される。これによって、後述するように、第１の円筒部４内に半導体基板が収納された際に、半導体基板が第１の円筒部４の内面４Ｃと点接触するのを回避している。また、蓋体２の第２の円筒部６は容器本体１の第１の円筒部４を覆うことができるようにその内径Ｄ２は、第１の円筒部４の外径Ｄ１よりもやや大きく（Ｄ１＜Ｄ２）なるように選ばれている。
【００２０】
後述するように、第２の円筒部６の凸部７を第１の円筒部４のスリット５に嵌合することにより蓋体２が容器本体１を覆って、半導体基板を第１の円筒部４内に収納したときに、半導体基板と第１の円筒部４の端部４Ｄ及び第２の円筒部６の凸部７の端部７Ｂとが接触して、半導体基板が破損するのをさらに防止するために、図２及び図３に示すように、スリット５を形成している第１の円筒部４の端部４Ｄ及び第２の円筒部６の凸部７の端部７Ｂは、面取りされた形状に形成されている。
【００２１】
図４は、容器本体１を蓋体２により覆って組み立てた半導体基板収納容器１０の構成を示すもので、蓋体２の第２の円筒部６の凸部７を容器本体１の第１の円筒部４のスリット５に位置決めした後、その凸部７をスリット５に沿って摺動させながら第２の円筒部６を第１の円筒部４に対して下降させることにより、凸部７をスリット５に嵌合させる。このとき、前述したように、第２の円筒部６の凸部７の頂面７Ａは、第１の円筒部４の内面４Ｃが延長される面と同一面となる。
【００２２】
次に、この例の半導体基板収納容器１０を用いて半導体基板を収納する操作について説明する。
先ず、真空吸着具等により半導体基板８を吸着した状態で、図１及び図２に示したような容器本体１の第１の円筒部４のスリット５を通じて、容器本体１の第１の円筒部４内に半導体基板８をクッションシートを介在させて多数枚重ねて収納する。次に、図１及び図３に示したような蓋体２を、上述したようにその第２の円筒部６の凸部７を容器本体１の第１の円筒部４のスリット５に位置決めした後、その凸部７をスリット５に沿って摺動させながら第２の円筒部６を第１の円筒部４に対して下降させることにより、凸部７をスリット５に嵌合させる。以上により、容器本体１と蓋体２とにより半導体基板収納容器１０が構成されて、図６に示すように、半導体基板８は半導体基板収納容器１０に収納された状態で、運搬あるいは保管に供されることになる。
【００２３】
次に、半導体基板８を半導体基板収納容器１０から取り出す場合は、図６の状態から蓋体２を把持して、その第２の円筒部６の凸部７をスリット５に沿って摺動させながら第２の円筒部６を第１の円筒部４に対して上昇させることにより、凸部７とスリット５との嵌合状態を解除して蓋体２を取り外す。次に、真空吸着具等により半導体基板８を吸着した状態で、容器本体１の第１の円筒部４のスリット５を通じて容器本体１から半導体基板８を取り出す。
【００２４】
上述したように、この例によれば、容器本体１と蓋体２とから構成される半導体基板収納容器１０において、容器本体１のスリット５を形成している第１の円筒部４の内面４Ｃと、蓋体２の第２の円筒部６の内面６Ｃに設けられた凸部７とは、凸部７がスリット５に嵌合された際にその凸部７の頂面７Ａが第１の円筒部４の内面４Ｃが延長される面と同一面となるように形成されている。したがって、容器本体１の第１の円筒部４内に半導体基板１０が収納されたとき、半導体基板８が第１の円筒部４の内面４Ｃと点接触するのを回避することができる。それゆえ、例えば運搬中に作業員の不注意等により半導体基板収納容器１０を落下させてしまった場合に、半導体基板収納容器１０に衝撃が加わっても、スリット５の両端部が実質的に存在しない状態になっているので、半導体基板８に加わる衝撃を大幅に緩和することができ、同様な理由で、半導体基板８が薄膜型されても衝撃を緩和することができる。よって、半導体基板収納容器１０に収納中の半導体基板８の破損を防止することができる。
【００２５】
なお、半導体基板収納容器１０を構成する容器本体１及び蓋体２は共にプラスチックを用いて射出成形により形成するが、容器本体１の第１の円筒部４ににスリット５を設けることにより、容器本体１自身に反りが発生し易くなる。この反りは、射出成形後の冷却時に成形品の部分的な形状の違い等により全体が均一に冷却されないので、部分的に収縮差が生ずることに基づいて発生する。しかしながら、発生する反りの大きさを予め予測してこれを見込んで射出成形時に用いる金型を設計することにより、あるいは反りを防止するリブを容器本体１に設けることにより、反りの発生に対処することができるので、結果的に反りの発生を抑えることができる。
【００２６】
このように、この例の半導体基板収納容器１０の構成によれば、半導体基板８を収納する第１の円筒部４が設けられ、第１の円筒部４には上端４Ａから下端４Ｂに向かって所定の幅Ｗ１ののスリット５が設けられている容器本体１と、第１の円筒部４を覆う第２の円筒部６が設けられ、第２の円筒部６の内面６Ｃにおける第１の円筒部４のスリット５に対応した位置に、上端６Ａから下端６Ｂに向かってスリット５に嵌合可能な所定の幅Ｗ２の凸部７が設けられている蓋体２とを備え、蓋体２の第２の円筒部６の凸部７の頂面７Ａは、凸部７がスリット５に嵌合された際に、第１の円筒部４の内面４Ｃが延長される面と同一面となるように形成されているので、半導体基板８が第１の円筒部４の内面４Ｃと点接触するのを回避することができる。
したがって、何らかの原因で半導体基板収納容器に衝撃が加わっても半導体基板の破損を防止することができる。
【００２７】
◇第２実施例
図７は、この発明の第２実施例である半導体基板収納容器の構成を示す分解平面図、図８は同半導体基板収納容器の構成を示す平面図、図９は同半導体基板収納容器に半導体基板を収納する準備段階の状態を示す平面図、図１０は同半導体基板収納容器に半導体基板を収納した状態を示す平面図である。この例の半導体基板収納容器の構成が、上述した第１実施例の構成と大きく異なるところは、収納中は半導体基板を常時固定するようにした点である。
この例の半導体基板収納容器２０は、図７に示すように、半導体基板を多数枚重ねて収納可能な上端開口及び下端閉塞の円筒状の容器本体１１と、この容器本体１１を覆う回動可能な上端閉塞及び下端開口の円筒状の蓋体１２とを備えている。容器本体１１及び蓋体１２は共にプラスチックが用いられて射出成形により形成されている。
【００２８】
容器本体１１は、図７に示すように、例えば円形状の基底部１３上に半導体基板を収納するための第１の円筒部１４が設けられ、この第１の円筒部１４には、この上端１４Ａから下端１４Ｂに向かって、所定の幅のスリット１５が円周方向に沿って複数設けられている。このスリット１５は、第１の円筒部１４内に半導体基板を収納する場合、あるいは第１の円筒部１４内から半導体基板を取り出す場合に、半導体基板を吸着する真空吸着具等の吸着具を挿入して半導体基板の着脱作業を容易にするためのものである。また、各スリット１５に隣接して複数の側壁部１６が設けられている。この側壁部１６は変形可能に形成されて、第１の円筒部１４内に半導体基板を収納する場合、後述するように、変形して半導体基板の側縁を部分的に押圧するように作用する。
【００２９】
一方、蓋体１２は、図７に示すように、容器本体１１の第１の円筒部１４を覆う第２の円筒部１７が設けられ、この第２の円筒部１７の内面１７Ａには、第１の円筒部１４の側壁部１６に対応してこれと同数の係合部１８が、側壁部１６に係合可能に設けられている。係合部１８は弾力性を有するように形成され、第１の円筒部１４内に半導体基板を収納する場合、後述するように、係合部１７は第２の円筒部１７と一体になって第１の円筒部１４の外周を回動して、第１の円筒部１４の側壁部１６と係合することにより側壁部１６を変形させて半導体基板の側縁を部分的に押圧させるように作用する。これによって、後述するように、第１の円筒部１４内に半導体基板が収納された際に、半導体基板が第１の円筒部１４の内面１４Ｃと点接触するのを回避している。
【００３０】
図８は、容器本体１１を蓋体１２により覆って組み立てた半導体基板収納容器２０の構成を示すもので、蓋体１２の第２の円筒部６により容器本体１１の第１の円筒部１４を覆って、第１の円筒部１４の側壁部１６と第２の円筒部１７の内面１７Ａの係合部１８とを対向させる。この場合、係合部１８を第２の円筒部１７と一体に回動することにより、側壁部１６に対する係合部１６の相対的位置は変化し、半導体基板を収納するときと、半導体基板を取り出しするときとでは、第２の円筒部１７を逆方向に回動する。
【００３１】
次に、図９及び図１０を参照して、この例の半導体基板収納容器２０を用いて半導体基板を収納する操作について説明する。
先ず、真空吸着具等により半導体基板１９を吸着した状態で、図７に示したような容器本体１１の第１の円筒部１４のスリット１５を通じて、容器本体１１の第１の円筒部１４内に半導体基板１９をクッションシートを介在させて多数枚重ねて収納する。次に、図７に示したような蓋体１２により容器本体１１を覆う。
この場合、第１の円筒部１４の側壁部１６と第２の係合部１８とが対向しないように、両者の位置をずらした状態で、図９に示すように、蓋体１２の第２の円筒部１７により容器本体１１の第１の円筒部１４を覆うようにする。
【００３２】
次に、図９の状態から、蓋体１２の第２の円筒部１６を矢印方向（例えば反時計回り方向）に回動することにより一体に係合部１８を回動させて、図１０に示すように、係合部１８を隣接した側壁部１７と係合させる。前述したように、係合部１８は弾力性を有すると共に側壁部１７は変形可能に形成されているので、係合部１８が側壁部１６に接触した瞬間に、側壁部１６は変形して半導体基板１９の側縁を押圧するように作用する。複数の係合部１８及び複数の側壁部１６の対応するもの同士が係合することにより、半導体基板１９は側縁が部分的に押圧されるため容器本体１１の第１の円筒部１４内に固定される。以上により、容器本体１１と蓋体１２とにより半導体基板収納容器２０が構成されて、図１０に示すように、半導体基板１９は半導体基板収納容器２０に収納された状態で、運搬あるいは保管に供されることになる。
【００３３】
次に、半導体基板１９を半導体基板収納容器２０から取り出す場合は、図１０の状態から、蓋体１２の第２の円筒部１６を逆の方向（時計回り方向）に回動することにより一体に係合部１８を回動させて、係合部１８と側壁部１７との係合状態を解除する。この結果、半導体基板１９の側縁は側壁部１６から開放されるので、真空吸着具等により半導体基板１９を吸着した状態で、容器本体１１の第１の円筒部１４のスリット１５を通じて容器本体１１から半導体基板１９を取り出す。
【００３４】
上述したように、この例によれば、容器本体１１と蓋体１２とから構成される半導体基板収納容器１０において、半導体基板１９が第１の円筒部１４内に収納されたときは、第２の円筒部１７と一体に回動する係合部１８により係合された第１の円筒部１４の側壁部１６によって、半導体基板１９はその側縁が固定される。したがって、容器本体１１の第１の円筒部１４内に半導体基板１０が収納されたとき、半導体基板１９が第１の円筒部１４の内面と点接触するのを回避することができる。それゆえ、例えば運搬中に作業員の不注意等により半導体基板収納容器２０を落下させてしまった場合に、半導体基板収納容器２０に衝撃が加わっても、スリット１５の両端部が実質的に存在しない状態になっているので、半導体基板１９に加わる衝撃を大幅に緩和することができ、同様な理由で、半導体基板１９が薄膜型されても衝撃を緩和することができる。よって、半導体基板収納容器２０に収納中の半導体基板１９の破損を防止することができる。
【００３５】
このように、この例の半導体基板収納容器２０の構成によれば、半導体基板１９を収納する第１の円筒部１４が設けられ、第１の円筒部１４には円周方向に沿って複数の側壁部１６が設けられている容器本体１１と、第１の円筒部１４を覆う第２の円筒部１７が回動可能に設けられ、第２の円筒部１７の内面１７Ａには側壁部１６に対応して同数の係合部１８が側壁部１６に係合可能に設けられている蓋体１２とを備え、半導体基板１９が第１の円筒部１４内に収納されたときは、第２の円筒部１７と一体に回動する係合部１８と係合する側壁部１６により半導体基板１９はその側縁が部分的に固定される。
したがって、何らかの原因で半導体基板収納容器に衝撃が加わっても半導体基板の破損を防止することができる。
【００３６】
◇第３実施例
図１１は、この発明の第３実施例である半導体基板収納容器の構成を示す分解平面図、図１２は同半導体基板収納容器の構成を示す平面図、図１３は図１２の側面図である。この例の半導体基板収納容器の構成が、上述した第２実施例の構成と大きく異なるところは、収納中は半導体基板を常時固定するようにした構成において、固定手段として流体を用いるようにした点である。
この例の半導体基板収納容器３０は、図１１に示すように、半導体基板を多数枚重ねて収納可能な上端開口及び下端閉塞の円筒状の容器本体２１と、この容器本体２１を覆う上端閉塞及び下端開口の円筒状の蓋体２２と、容器本体２１と蓋体２２との間に配置される流体収納部２３とを備えている。容器本体２１及び蓋体２２は共にプラスチックが用いられて射出成形により形成されている。
【００３７】
容器本体２１は、図１１に示すように、例えば円形状の基底部２４上に半導体基板を収納するための第１の円筒部２５が設けられ、この第１の円筒部２５には、この上端から下端に向かって、所定の幅のスリット２６が円周方向に沿って複数設けられている。このスリット２６は、第１の円筒部２５内に半導体基板を収納する場合、あるいは第１の円筒部２５内から半導体基板を取り出す場合に、半導体基板を吸着する真空吸着具等の吸着具を挿入して半導体基板の着脱作業を容易にするためのものである。また、各スリット２６に隣接して複数の側壁部２７が設けられている。
【００３８】
一方、蓋体２２は、図１１に示すように、容器本体２１の第１の円筒部２５を覆う第２の円筒部２８が設けられている。また、水のような液体、空気、窒素ガスのような気体等の流体を袋に密閉した流体収納部２３が、容器本体１と蓋体２との間の空間部に配置される。第１の円筒部２５内に半導体基板を収納する場合、後述するように、流体収納部２３を複数のスリット２６を通じて半導体基板の側縁に接触させることにより、半導体基板の側縁が部分的に押圧されて固定される。これによって、第１の円筒部２５内に半導体基板が収納された際に、半導体基板が第１の円筒部２５の内面２５Ｃと点接触するのを回避している。
【００３９】
次に、図１２及び図１３を参照して、この例の半導体基板収納容器３０を用いて半導体基板を収納する操作について説明する。
先ず、真空吸着具等により半導体基板２９を吸着した状態で、図１１に示したような容器本体２１の第１の円筒部２５のスリット２６を通じて、容器本体２１の第１の円筒部２５内に半導体基板２９をクッションシートを介在させて多数枚重ねて収納する。次に、図１１に示したような蓋体２２により、流体収納部２３を介して容器本体２１を覆う。次に、流体を供給して膨らませた流体収納部２３を複数のスリット２６を通じて半導体基板２９の側縁に接触させる。これによって、半導体基板２９の側縁は流体収納部２３により押圧されることにより固定される。以上により、容器本体２１と蓋体２２と流体収納部２３とにより半導体基板収納容器３０が構成されて、図１２に示すように、半導体基板２９は半導体基板収納容器３０に収納された状態で、運搬あるいは保管に供されることになる。
【００４０】
次に、半導体基板２９を半導体基板収納容器３０から取り出す場合は、図１２の状態から、蓋体２２の第２の円筒部２８を容器本体２１の第１の円筒部２５から取り外した後、流体収納部２３から流体を排出させて、半導体基板２９の側縁の押圧状態を解除する。この結果、半導体基板２９の側縁は流体収納部２３から開放されるので、真空吸着具等により半導体基板２９を吸着した状態で、容器本体２１の第１の円筒部２５のスリット２６を通じて容器本体２１から半導体基板２９を取り出す。
【００４１】
上述したように、この例によれば、容器本体２１と蓋体２２と流体収納部２３とから構成される半導体基板収納容器３０において、半導体基板２９が第１の円筒部２５内に収納されたときは、流体収納部２３により押圧することによって、半導体基板２９はその側縁が固定される。したがって、容器本体２１の第１の円筒部２５内に半導体基板２９が収納されたとき、半導体基板２９が第１の円筒部２５の内面と点接触するのを回避することができる。それゆえ、例えば運搬中に作業員の不注意等により半導体基板収納容器３０を落下させてしまった場合に、半導体基板収納容器３０に衝撃が加わっても、スリット２６の両端部が実質的に存在しない状態になっているので、半導体基板２９に加わる衝撃を大幅に緩和することができ、同様な理由で、半導体基板２９が薄膜型されても衝撃を緩和することができる。よって、半導体基板収納容器３０に収納中の半導体基板２９の破損を防止することができる。
【００４２】
このように、この例の半導体基板収納容器３０の構成によれば、半導体基板３１を収納する第１の円筒部２５が設けられ、第１の円筒部２５には円周方向に沿って複数のスリット２６が設けられている容器本体２１と、第１の円筒部２５を覆う第２の円筒部２８が設けられている蓋体２２と、容器本体２１と蓋体２２との間に配置された流体収納部２３とを備え、半導体基板２９が第１の円筒部２５内に収納されたときは流体収納部２３により半導体基板２９はその側縁が部分的に固定される。
したがって、何らかの原因で半導体基板収納容器に衝撃が加わっても半導体基板の破損を防止することができる。
【００４３】
以上、この発明の実施例を図面により詳述してきたが、具体的な構成はこの実施例に限られるものではなく、この発明の要旨を逸脱しない範囲の設計の変更等があってもこの発明に含まれる。例えば、第１実施例では第１及び第２の円筒部にそれぞれ１つのスリット及び凸部を設けた例で説明したが、これに限らずにスリット及び凸部はそれぞれ複数設けるようにしてもよい。また、第２実施例あるいは第３実施例で示した複数の側壁部、スリットの数等は一例を示したものであり、目的、用途等に応じて適宜変更することができる。
【００４４】
【発明の効果】
以上説明したように、この発明の半導体基板収納容器の構成によれば、上端から下端に向かって所定の幅のスリットが設けられ、半導体基板を収納するための上端開口及び下端閉塞の円筒状の容器本体と、容器本体のスリットに対応して内面に、上端から下端に向かって前記スリットに嵌合可能な所定の幅の凸部が設けられ、容器本体を覆う上端閉塞及び下端開口の円筒状の蓋体とを備え、蓋体の凸部の頂面は、凸部がスリットに嵌合された際に、容器本体の内面が延長される面と同一面となるように形成されているので、半導体基板が容器本体の内面と点接触するのを回避することができる。
また、この発明の半導体基板収納容器の構成によれば、円周方向に沿って複数の側壁部が設けられ、半導体基板を収納するための上端開口及び下端閉塞の円筒状の容器本体と、容器本体の側壁部に対応して内面に、側壁部と同数の係合部が側壁部に係合可能に設けられ、容器本体を覆う回動可能な上端閉塞及び下端開口の円筒状の蓋体とを備え、半導体基板が容器本体内に収納されたときは、蓋体と一体に回動する係合部と係合する側壁部により半導体基板はその側縁が部分的に固定される。
また、この発明の半導体基板収納容器の構成によれば、円周方向に沿って複数のスリットが設けられ、半導体基板を収納するための上端開口及び下端閉塞の円筒状の容器本体と、容器本体を覆う上端閉塞及び下端開口の円筒状の蓋体と、容器本体と蓋体との間に配置され、容器本体内に半導体基板が収納された際にスリットを通じて半導体基板の側縁を押圧する流体収納部とを備え、半導体基板が容器本体内に収納されたときは流体収納部により半導体基板はその側縁が部分的に固定される。
したがって、何らかの原因で半導体基板収納容器に衝撃が加わっても半導体基板の破損を防止することができる。
【図面の簡単な説明】
【図１】この発明の第１実施例である半導体基板収納容器の構成を示す分解斜視図である。
【図２】図１のＡ−Ａ矢視断面図である。
【図３】図１のＢ−Ｂ矢視断面図である。
【図４】同半導体基板収納容器の構成を示す平面図である。
【図５】図４のＣ−Ｃ矢視断面図である。
【図６】同半導体基板収納容器に半導体基板を収納した状態を示す平面図である。
【図７】この発明の第２実施例である半導体基板収納容器の構成を示す分解平面図である。
【図８】同半導体基板収納容器の構成を示す平面図である。
【図９】同半導体基板収納容器に半導体基板を収納する準備段階の状態を示す平面図である。
【図１０】同半導体基板収納容器に半導体基板を収納した状態を示す平面図である。
【図１１】この発明の第３実施例である半導体基板収納容器の構成を示す分解平面図である。
【図１２】同半導体基板収納容器の構成を示す平面図である。
【図１３】図１２の側面図である。
【図１４】従来の半導体基板収納容器の構成を示す分解斜視図である。
【図１５】従来の半導体基板収納容器の欠点を示す平面図である。
【符号の説明】
１、１１、２１容器本体
２、２１、２２蓋体
３、１３、２４基底部
４、１４、２５第１の円筒部
４Ａ、６Ａ、１４Ａ、２５Ａ円筒部の上端
４Ｂ、６Ｂ、１４Ｂ、２５Ｂ円筒部の下端
４Ｃ、６Ｃ、１４Ｃ、１７Ａ、２５Ｃ、２８Ａ円筒部の内面
４Ｄ円筒部の端部
５、１５、２６スリット
６、１７、２８第２の円筒部
７凸部
７Ａ凸部の頂面
７Ｂ凸部の端部
８、１９、２９半導体基板
１０、２０、３０半導体基板収納容器
１６、２７側壁部
１８係合部
２３流体収納部[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor substrate storage container, and more particularly, to a semiconductor substrate storage container used for transporting and storing a wafer-like semiconductor substrate.
[0002]
[Prior art]
2. Description of the Related Art For example, semiconductor devices typified by LSIs (large-scale integrated circuits) such as memories and microprocessors are widely used in various electronic devices. In manufacturing such a semiconductor device, it is necessary to prepare a semiconductor substrate sliced from a semiconductor ingot into a wafer as an initial step. Next, the semiconductor substrate is sequentially transported (moved) to a plurality of manufacturing process steps, and a desired process is performed in each step. As described above, a semiconductor substrate storage container is used when the semiconductor substrate is transported between processes or when the semiconductor substrate is temporarily stored.
[0003]
A semiconductor substrate storage container used for the above-mentioned applications is disclosed. (For example, refer to Patent Document 1). FIG. 14 is an exploded perspective view showing the semiconductor substrate storage container. As shown in the figure, the semiconductor substrate storage container 100 includes a bottomed cylindrical container body 101 capable of stacking and storing a large number of semiconductor substrates, and a lid 102 covering the container body 101. The material 101 and the lid 102 are both made of conductive plastics. The container body 101 is provided with a cylindrical portion 101B on a square base portion 101A, and the cylindrical portion 101B is provided with a plurality of slits 101C having a predetermined width and a plurality of protrusions 101D. On the other hand, the lid body 102 has a square quadrangular prism shape as a whole, and is provided with a rectangular cylindrical part 102B circumscribing the cylindrical part 102A. And a ring-shaped projection 102D is provided concentrically around the detachable projection 3C.
[0004]
Using the semiconductor substrate storage container 100 having the above-described configuration, a large number of semiconductor substrates are stacked and stored in the cylindrical portion 101B of the container body 101 with a cushion sheet interposed therebetween. The cover 102 is fixed to the container main body 101 by covering with the cylindrical portion 102A and then rotating the two cylindrical portions 101B and 102A relatively. In this state, a plurality of semiconductor substrate storage containers 100 are vertically stacked and integrated by gripping the detachable projection 3C or using the detachable projection 3C and the ring-shaped protrusion 102D in this state. Thus, the semiconductor substrate can be transported or stored. On the other hand, when the semiconductor substrate is taken out of the semiconductor substrate storage container 100, the fixed state between the lid 102 and the container main body 101 is released by rotating the two cylindrical portions 101B and 102A in the opposite direction to the above-mentioned case. Then, the cylindrical portion 102A is detached from the cylindrical portion 101B. As described above, when the semiconductor substrate is stored or taken out, the semiconductor substrate is handled through the slit 101C of the container body 101 using a vacuum suction tool or the like, so that the attaching / detaching operation is facilitated.
[0005]
[See Patent Document 1]
JP-A-6-69328 (pages 3 to 5, FIGS. 1 to 6)
[0006]
[Problems to be solved by the invention]
Incidentally, the conventional semiconductor substrate storage container disclosed in Patent Document 1 has a problem that the semiconductor substrate is easily damaged when an impact is applied to the semiconductor substrate storage container for some reason in a state where the semiconductor substrate is stored. is there.
That is, in the semiconductor substrate storage container 100 as shown in FIG. 14, in a state where the semiconductor substrate is stored in the cylindrical portion 101B of the container main body 101, for example, the semiconductor substrate storage container 100 is inadvertently disturbed during transportation. When the semiconductor substrate storage container 100 falls, an impact is applied to the semiconductor substrate storage container 100. As shown in FIG. 15, particularly when the slit 101C falls in a downward direction, both ends of the slit 101C are turned off. The impact is intensively applied to 101E. Then, the impact instantaneously acts on the semiconductor substrate 103 which is in point contact with both ends 101E of the slit 101C. For example, when an example in which the semiconductor substrate storage container 103 storing the semiconductor substrate 103 having a diameter of 200 mm is dropped from a height of about 70 cm is described, the impact at the time of drop is 30 to 40 G (Gravity: gravitational acceleration). The impact of the value is applied to the semiconductor substrate 103 almost as it is. Since such an impact force is considerably large, a semiconductor substrate having a mechanically fragile property cannot withstand the impact and may be damaged.
[0007]
In addition, as described above, the mounting space of an LSI mounted on an electronic device is becoming narrower in order to reduce the size of the electronic device, and accordingly, the thickness of the semiconductor substrate is about 100 μm. Since the thickness has been reduced, the mechanical strength has been reduced, and the tendency of the semiconductor substrate to be damaged has been further increased.
[0008]
The present invention has been made in view of the above circumstances, and has as its object to provide a semiconductor substrate storage container that can prevent damage to a semiconductor substrate even if an impact is applied for some reason.
[0009]
[Means for Solving the Problems]
In order to solve the above problem, the invention according to claim 1 relates to a semiconductor substrate storage container capable of storing a plurality of semiconductor substrates in a stacked manner, wherein a slit having a predetermined width is provided from an upper end to a lower end, and A cylindrical container main body with an upper end opening and a lower end closed for accommodating a substrate, and a convex having a predetermined width that can be fitted into the slit from the upper end to the lower end on the inner surface corresponding to the slit of the container main body. And a cylindrical lid having an upper end closed and a lower end opened to cover the container body.
[0010]
According to a second aspect of the present invention, there is provided the semiconductor substrate storage container according to the first aspect, wherein a top surface of the convex portion of the lid is provided when the convex portion is fitted into the slit. It is characterized in that the inner surface of the main body is formed so as to be flush with the extended surface.
[0011]
According to a third aspect of the present invention, there is provided the semiconductor substrate storage container according to the first or second aspect, wherein an end of the container body forming the slit and an end of the convex portion of the lid are chamfered. It is characterized in that it is formed in a shaped shape.
[0012]
According to a fourth aspect of the present invention, there is provided a semiconductor substrate storage container capable of storing a plurality of semiconductor substrates in a stacked manner, wherein a plurality of side walls are provided along a circumferential direction, and an upper end for storing the semiconductor substrate is provided. A cylindrical container body having an opening and a lower end closed, and the same number of engaging portions as the side wall portions are provided on the inner surface corresponding to the side wall portions of the container body so as to be engageable with the side wall portions; And a cylindrical lid having a rotatable upper end closure and lower end opening that covers the cover.
[0013]
The invention according to claim 5 relates to the semiconductor substrate storage container according to claim 4, wherein the rotation direction of the second cylindrical portion is different between when the semiconductor substrate is stored and when the semiconductor substrate is taken out. It is characterized by:
[0014]
According to a sixth aspect of the present invention, there is provided the semiconductor substrate storage container according to the fourth or fifth aspect, wherein the container body is provided with a plurality of slits from the upper end to the lower end adjacent to the side wall portion. It is characterized by having.
[0015]
According to a seventh aspect of the present invention, there is provided a semiconductor substrate storage container capable of storing a plurality of semiconductor substrates in a stacked manner, wherein a plurality of slits are provided along a circumferential direction, and an upper end opening for storing the semiconductor substrate. And a cylindrical container body with a lower end closed, a cylindrical lid with an upper end closed and a lower end opening covering the container main body, and a semiconductor lid disposed between the container main body and the lid, and the semiconductor inside the container main body. A fluid accommodating portion for pressing a side edge of the semiconductor substrate through the slit when the substrate is accommodated.
[0016]
An eighth aspect of the present invention is directed to the semiconductor substrate storage container according to the seventh aspect, wherein a fluid is supplied to the fluid storage portion when the semiconductor substrate is stored in the container body. .
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. The description will be made specifically using an embodiment.
◇ First embodiment
FIG. 1 is an exploded perspective view showing a configuration of a semiconductor substrate storage container according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. FIG. 4 is a cross-sectional view, FIG. 4 is a plan view showing the configuration of the semiconductor substrate storage container, FIG. 5 is a cross-sectional view taken along line CC of FIG. 4, and FIG. FIG.
As shown in FIG. 1, a semiconductor substrate storage container 10 of this example has a cylindrical container main body 1 having an upper end opening and a lower end closing capable of stacking and storing a large number of semiconductor substrates, and an upper end closing and covering the container main body 1. And a cylindrical lid 2 having a lower end opening. Both the container body 1 and the lid 2 are formed by injection molding using plastic.
[0018]
As shown in FIGS. 1 and 2, the container body 1 is provided with a first cylindrical portion 4 for accommodating a semiconductor substrate, for example, on a circular base portion 3. A slit 5 having a predetermined width W1 is provided from the upper end 4A to the lower end 4B. As an example, when a semiconductor substrate having a diameter of 200 mm is accommodated in the first cylindrical portion 4, the width W1 of the slit 5 is selected to be 18 to 22 mm. When the semiconductor substrate is stored in the first cylindrical portion 4 or when the semiconductor substrate is taken out from the first cylindrical portion 4, the slit 5 is used to insert a suction tool such as a vacuum suction tool for suctioning the semiconductor substrate. This facilitates the work of attaching and detaching the semiconductor substrate.
[0019]
On the other hand, as shown in FIGS. 1 and 3, the lid 2 is provided with a second cylindrical portion 6 that covers the first cylindrical portion 4 of the container main body 1, and an inner surface 6 C of the second cylindrical portion 6 is provided. At a position corresponding to the slit 5 of the first cylindrical portion 4, a convex portion 7 having a width W2 (W1> W2) that can be fitted to the slit 5 from the upper end 6A to the lower end 6B is provided. As an example, the width W2 of the protrusion 7 is selected to be smaller by 2 to 3 mm than the width W1 of the slit 5 described above. Here, the top surface 7A of the convex portion 7 of the second cylindrical portion 6 is such that the inner surface 4C of the first cylindrical portion 4 extends when the convex portion is fitted into the slit 5 of the first cylindrical portion 4. It is formed so as to be the same as the surface to be formed. This prevents the semiconductor substrate from being in point contact with the inner surface 4C of the first cylindrical portion 4 when the semiconductor substrate is stored in the first cylindrical portion 4 as described later. The inner diameter D2 is slightly larger than the outer diameter D1 of the first cylindrical portion 4 so that the second cylindrical portion 6 of the lid 2 can cover the first cylindrical portion 4 of the container body 1 ( D1 <D2).
[0020]
As will be described later, the lid 2 covers the container body 1 by fitting the projection 7 of the second cylindrical portion 6 into the slit 5 of the first cylindrical portion 4 so that the semiconductor substrate can be connected to the first cylindrical portion. When the semiconductor substrate is housed in the semiconductor device, the semiconductor substrate and the end portion 4D of the first cylindrical portion 4 and the end portion 7B of the convex portion 7 of the second cylindrical portion 6 come into contact with each other, thereby further damaging the semiconductor substrate. In order to prevent this, as shown in FIGS. 2 and 3, the end 4D of the first cylindrical portion 4 forming the slit 5 and the end 7B of the convex portion 7 of the second cylindrical portion 6 are chamfered. It is formed in a shaped shape.
[0021]
FIG. 4 shows a configuration of the semiconductor substrate storage container 10 assembled by covering the container body 1 with the lid 2, and the convex portion 7 of the second cylindrical portion 6 of the lid 2 is replaced with the first portion of the container main body 1. After positioning in the slit 5 of the cylindrical part 4, the convex part 7 is lowered by lowering the second cylindrical part 6 with respect to the first cylindrical part 4 while sliding the convex part 7 along the slit 5. The slit 5 is fitted. At this time, as described above, the top surface 7A of the convex portion 7 of the second cylindrical portion 6 is flush with the surface on which the inner surface 4C of the first cylindrical portion 4 is extended.
[0022]
Next, an operation of storing a semiconductor substrate using the semiconductor substrate storage container 10 of this example will be described.
First, in a state where the semiconductor substrate 8 is sucked by a vacuum suction tool or the like, the first cylindrical portion of the container body 1 is passed through the slit 5 of the first cylindrical portion 4 of the container body 1 as shown in FIGS. A large number of semiconductor substrates 8 are housed in a stack 4 with a cushion sheet interposed therebetween. Next, as described above, the convex portion 7 of the second cylindrical portion 6 of the lid 2 as shown in FIGS. 1 and 3 was positioned in the slit 5 of the first cylindrical portion 4 of the container body 1. Thereafter, the second cylindrical portion 6 is lowered with respect to the first cylindrical portion 4 while sliding the convex portion 7 along the slit 5, so that the convex portion 7 is fitted into the slit 5. As described above, the semiconductor substrate storage container 10 is constituted by the container main body 1 and the lid 2, and the semiconductor substrate 8 is stored in the semiconductor substrate storage container 10 for transportation or storage as shown in FIG. Will be done.
[0023]
Next, when the semiconductor substrate 8 is taken out of the semiconductor substrate storage container 10, the lid 2 is gripped from the state shown in FIG. 6 and the convex portion 7 of the second cylindrical portion 6 is slid along the slit 5. By raising the second cylindrical portion 6 with respect to the first cylindrical portion 4, the fitting state between the convex portion 7 and the slit 5 is released, and the lid 2 is removed. Next, the semiconductor substrate 8 is taken out of the container main body 1 through the slit 5 of the first cylindrical portion 4 of the container main body 1 while the semiconductor substrate 8 is being adsorbed by the vacuum suction tool or the like.
[0024]
As described above, according to this example, in the semiconductor substrate storage container 10 including the container body 1 and the lid 2, the inner surface 4 C of the first cylindrical portion 4 forming the slit 5 of the container body 1. And the convex portion 7 provided on the inner surface 6C of the second cylindrical portion 6 of the lid 2, when the convex portion 7 is fitted into the slit 5, the top surface 7A of the convex portion 7 is the first surface. The inner surface 4C of the cylindrical portion 4 is formed so as to be flush with the surface on which it is extended. Therefore, when the semiconductor substrate 10 is stored in the first cylindrical portion 4 of the container main body 1, it is possible to avoid the semiconductor substrate 8 from making point contact with the inner surface 4C of the first cylindrical portion 4. Therefore, for example, when the semiconductor substrate storage container 10 is dropped due to carelessness of an operator during transportation, even if an impact is applied to the semiconductor substrate storage container 10, both ends of the slit 5 substantially exist. Since it is not in the state, the impact applied to the semiconductor substrate 8 can be remarkably reduced. For the same reason, the impact can be reduced even if the semiconductor substrate 8 is formed into a thin film type. Therefore, damage of the semiconductor substrate 8 being stored in the semiconductor substrate storage container 10 can be prevented.
[0025]
The container main body 1 and the lid 2 constituting the semiconductor substrate storage container 10 are both formed by injection molding using plastic, but by providing a slit 5 in the first cylindrical portion 4 of the container main body 1, the container Warpage is likely to occur in the main body 1 itself. This warpage occurs because the entire product is not uniformly cooled due to a difference in the partial shape of the molded product or the like at the time of cooling after injection molding. However, it is possible to cope with the occurrence of the warpage by predicting the size of the generated warpage in advance and designing the mold used in the injection molding in consideration of this, or by providing the container body 1 with a rib for preventing the warpage. As a result, warpage can be suppressed.
[0026]
As described above, according to the configuration of the semiconductor substrate storage container 10 of this example, the first cylindrical portion 4 that stores the semiconductor substrate 8 is provided, and the first cylindrical portion 4 is moved from the upper end 4A toward the lower end 4B. A container main body 1 provided with a slit 5 having a predetermined width W1 and a second cylindrical portion 6 covering the first cylindrical portion 4 are provided, and a first cylindrical portion on an inner surface 6C of the second cylindrical portion 6 is provided. A lid 2 provided at a position corresponding to the slit 5 of the portion 4 with a convex portion 7 having a predetermined width W2 that can be fitted into the slit 5 from the upper end 6A to the lower end 6B; The top surface 7A of the convex portion 7 of the second cylindrical portion 6 is flush with the surface on which the inner surface 4C of the first cylindrical portion 4 extends when the convex portion 7 is fitted into the slit 5. Therefore, the semiconductor substrate 8 can be prevented from making point contact with the inner surface 4C of the first cylindrical portion 4. .
Therefore, even if an impact is applied to the semiconductor substrate storage container for some reason, damage to the semiconductor substrate can be prevented.
[0027]
◇ Second embodiment
FIG. 7 is an exploded plan view showing a configuration of a semiconductor substrate storage container according to a second embodiment of the present invention, FIG. 8 is a plan view showing a configuration of the semiconductor substrate storage container, and FIG. FIG. 10 is a plan view showing a state of a preparation stage for storing a substrate, and FIG. 10 is a plan view showing a state where a semiconductor substrate is stored in the semiconductor substrate storage container. The configuration of the semiconductor substrate storage container of this example is significantly different from the configuration of the first embodiment described above in that the semiconductor substrate is always fixed during storage.
As shown in FIG. 7, a semiconductor substrate storage container 20 of this example has a cylindrical container main body 11 with an upper end opening and a lower end closed, which can store a plurality of semiconductor substrates in a stack, and a rotatable cover that covers the container main body 11. And a cylindrical lid 12 having a closed upper end and an opened lower end. Both the container body 11 and the lid 12 are formed by injection molding using plastic.
[0028]
As shown in FIG. 7, the container body 11 is provided with a first cylindrical portion 14 for accommodating a semiconductor substrate, for example, on a circular base portion 13, and the first cylindrical portion 14 has an upper end. A plurality of slits 15 having a predetermined width are provided in the circumferential direction from the lower end 14B toward the lower end 14B. The slit 15 is used to insert a suction tool such as a vacuum suction tool for sucking the semiconductor substrate when the semiconductor substrate is stored in the first cylindrical portion 14 or when the semiconductor substrate is taken out from the first cylindrical portion 14. This facilitates the work of attaching and detaching the semiconductor substrate. Also, a plurality of side wall portions 16 are provided adjacent to each slit 15. The side wall portion 16 is formed so as to be deformable, and when storing the semiconductor substrate in the first cylindrical portion 14, acts to deform and partially press the side edge of the semiconductor substrate as described later. .
[0029]
On the other hand, as shown in FIG. 7, the lid 12 is provided with a second cylindrical portion 17 that covers the first cylindrical portion 14 of the container main body 11, and an inner surface 17 A of the second cylindrical portion 17 has The same number of engaging portions 18 are provided so as to be able to engage with the side wall portions 16 corresponding to the side wall portions 16 of the one cylindrical portion 14. The engaging portion 18 is formed to have elasticity, and when the semiconductor substrate is housed in the first cylindrical portion 14, the engaging portion 17 is integrated with the second cylindrical portion 17 as described later. By rotating the outer periphery of the first cylindrical portion 14 and engaging with the side wall portion 16 of the first cylindrical portion 14, the side wall portion 16 is deformed so as to partially press the side edge of the semiconductor substrate. Works. This prevents the semiconductor substrate from being in point contact with the inner surface 14C of the first cylindrical portion 14 when the semiconductor substrate is stored in the first cylindrical portion 14, as described later.
[0030]
FIG. 8 shows a configuration of a semiconductor substrate storage container 20 assembled by covering the container main body 11 with the lid 12, and the first cylindrical part 14 of the container main body 11 is formed by the second cylindrical part 6 of the lid 12. The side wall portion 16 of the first cylindrical portion 14 and the engaging portion 18 of the inner surface 17A of the second cylindrical portion 17 face each other. In this case, by rotating the engaging portion 18 integrally with the second cylindrical portion 17, the relative position of the engaging portion 16 with respect to the side wall portion 16 changes. At the time of removal, the second cylindrical portion 17 is rotated in the opposite direction.
[0031]
Next, an operation of storing a semiconductor substrate using the semiconductor substrate storage container 20 of this example will be described with reference to FIGS.
First, in a state where the semiconductor substrate 19 is suctioned by a vacuum suction tool or the like, the semiconductor substrate 19 is inserted into the first cylindrical portion 14 of the container main body 11 through the slit 15 of the first cylindrical portion 14 of the container main body 11 as shown in FIG. A large number of semiconductor substrates 19 are stored with a cushion sheet interposed therebetween. Next, the container body 11 is covered with the lid 12 as shown in FIG.
In this case, as shown in FIG. 9, the side wall 16 of the first cylindrical portion 14 and the second engaging portion 18 are shifted from each other so that they do not face each other. The first cylindrical portion 14 of the container main body 11 is covered with the cylindrical portion 17 of FIG.
[0032]
Next, from the state of FIG. 9, the second cylindrical portion 16 of the lid 12 is rotated in the direction of the arrow (for example, counterclockwise) to integrally rotate the engaging portion 18. As shown, the engaging portion 18 is engaged with the adjacent side wall portion 17. As described above, since the engaging portion 18 has elasticity and the side wall portion 17 is formed to be deformable, the side wall portion 16 deforms and It acts to press the side edge of the substrate 19. When the corresponding ones of the plurality of engaging portions 18 and the plurality of side wall portions 16 are engaged with each other, the side edge of the semiconductor substrate 19 is partially pressed, so that the semiconductor substrate 19 is in the first cylindrical portion 14 of the container body 11. Fixed. As described above, the semiconductor substrate storage container 20 is constituted by the container body 11 and the lid 12, and the semiconductor substrate 19 is stored in the semiconductor substrate storage container 20 and is transported or stored as shown in FIG. Will be done.
[0033]
Next, when removing the semiconductor substrate 19 from the semiconductor substrate storage container 20, the second cylindrical portion 16 of the lid 12 is rotated in the opposite direction (clockwise) from the state of FIG. By rotating the engaging portion 18, the engagement between the engaging portion 18 and the side wall portion 17 is released. As a result, the side edge of the semiconductor substrate 19 is opened from the side wall portion 16, so that the semiconductor substrate 19 is sucked by the vacuum suction tool or the like, and the container body 11 is cut through the slit 15 of the first cylindrical portion 14 of the container body 11. The semiconductor substrate 19 is taken out.
[0034]
As described above, according to this example, in the semiconductor substrate storage container 10 including the container body 11 and the lid 12, when the semiconductor substrate 19 is stored in the first cylindrical portion 14, the second The side edge of the semiconductor substrate 19 is fixed by the side wall portion 16 of the first cylindrical portion 14 engaged by the engaging portion 18 which rotates integrally with the cylindrical portion 17 of the semiconductor substrate 19. Therefore, when the semiconductor substrate 10 is stored in the first cylindrical portion 14 of the container body 11, it is possible to prevent the semiconductor substrate 19 from coming into point contact with the inner surface of the first cylindrical portion 14. Therefore, for example, when the semiconductor substrate storage container 20 is dropped due to carelessness of an operator during transportation, both ends of the slit 15 substantially exist even if an impact is applied to the semiconductor substrate storage container 20. In this state, the shock applied to the semiconductor substrate 19 can be significantly reduced. For the same reason, the shock can be reduced even if the semiconductor substrate 19 is formed into a thin film type. Therefore, the semiconductor substrate 19 stored in the semiconductor substrate storage container 20 can be prevented from being damaged.
[0035]
As described above, according to the configuration of the semiconductor substrate storage container 20 of this example, the first cylindrical portion 14 that stores the semiconductor substrate 19 is provided, and the first cylindrical portion 14 is provided with a plurality of circumferential portions. The container main body 11 provided with the side wall portion 16 and the second cylindrical portion 17 covering the first cylindrical portion 14 are provided rotatably, and the inner surface 17A of the second cylindrical portion 17 is provided on the side wall portion 16. And a lid body in which the same number of engagement portions are provided so as to be able to engage with the side wall portion, and when the semiconductor substrate is stored in the first cylindrical portion, the second portion is provided. The side edge of the semiconductor substrate 19 is partially fixed by the side wall portion 16 engaged with the engaging portion 18 which rotates integrally with the cylindrical portion 17.
Therefore, even if an impact is applied to the semiconductor substrate storage container for some reason, damage to the semiconductor substrate can be prevented.
[0036]
◇ Third embodiment
FIG. 11 is an exploded plan view showing the configuration of a semiconductor substrate storage container according to a third embodiment of the present invention, FIG. 12 is a plan view showing the configuration of the semiconductor substrate storage container, and FIG. 13 is a side view of FIG. . The configuration of the semiconductor substrate storage container of this example is significantly different from the configuration of the above-described second embodiment in that a fluid is used as a fixing means in the configuration in which the semiconductor substrate is always fixed during storage. It is.
As shown in FIG. 11, a semiconductor substrate storage container 30 of this example has a cylindrical container main body 21 having an upper end opening and a lower end closing capable of stacking and storing a large number of semiconductor substrates, and an upper end closing and covering the container main body 21. The container includes a cylindrical lid 22 having a lower end opening, and a fluid storage portion 23 disposed between the container body 21 and the lid 22. Both the container body 21 and the lid 22 are formed by injection molding using plastic.
[0037]
As shown in FIG. 11, the container body 21 is provided with a first cylindrical portion 25 for accommodating a semiconductor substrate on a circular base portion 24, for example. A plurality of slits 26 having a predetermined width are provided along the circumferential direction from the bottom to the bottom. The slit 26 is used for inserting a suction tool such as a vacuum suction tool for sucking the semiconductor substrate when the semiconductor substrate is stored in the first cylindrical portion 25 or when the semiconductor substrate is taken out from the first cylindrical portion 25. This facilitates the work of attaching and detaching the semiconductor substrate. Also, a plurality of side wall portions 27 are provided adjacent to each slit 26.
[0038]
On the other hand, the lid 22 is provided with a second cylindrical portion 28 that covers the first cylindrical portion 25 of the container body 21, as shown in FIG. In addition, a fluid storage unit 23 in which a fluid such as a liquid such as water, a gas such as air, or nitrogen gas is sealed in a bag is disposed in a space between the container body 1 and the lid 2. When the semiconductor substrate is housed in the first cylindrical portion 25, as described later, the fluid housing 23 is brought into contact with the side edge of the semiconductor substrate through the plurality of slits 26, so that the side edge of the semiconductor substrate is partially It is pressed and fixed. This prevents the semiconductor substrate from being in point contact with the inner surface 25C of the first cylindrical portion 25 when the semiconductor substrate is stored in the first cylindrical portion 25.
[0039]
Next, with reference to FIGS. 12 and 13, an operation of storing a semiconductor substrate using the semiconductor substrate storage container 30 of this example will be described.
First, in a state where the semiconductor substrate 29 is suctioned by a vacuum suction tool or the like, the semiconductor substrate 29 is inserted into the first cylindrical portion 25 of the container main body 21 through the slit 26 of the first cylindrical portion 25 of the container main body 21 as shown in FIG. A large number of semiconductor substrates 29 are stored with a cushion sheet interposed therebetween. Next, the container body 21 is covered by the lid 22 as shown in FIG. Next, the fluid storage portion 23 that has been expanded by supplying the fluid is brought into contact with the side edge of the semiconductor substrate 29 through the plurality of slits 26. Thereby, the side edge of the semiconductor substrate 29 is fixed by being pressed by the fluid accommodating portion 23. As described above, the semiconductor substrate storage container 30 is configured by the container body 21, the lid 22, and the fluid storage unit 23, and the semiconductor substrate 29 is stored in the semiconductor substrate storage container 30 as shown in FIG. It will be transported or stored.
[0040]
Next, when the semiconductor substrate 29 is taken out of the semiconductor substrate storage container 30, after removing the second cylindrical portion 28 of the lid 22 from the first cylindrical portion 25 of the container body 21 from the state of FIG. The fluid is discharged from the storage section 23, and the pressed state of the side edge of the semiconductor substrate 29 is released. As a result, the side edge of the semiconductor substrate 29 is released from the fluid storage portion 23, so that the semiconductor substrate 29 is sucked by a vacuum suction tool or the like, and the container body 21 is passed through the slit 26 of the first cylindrical portion 25 of the container body 21. The semiconductor substrate 29 is taken out from 21.
[0041]
As described above, according to this example, in the semiconductor substrate storage container 30 including the container body 21, the lid 22, and the fluid storage unit 23, the semiconductor substrate 29 is stored in the first cylindrical portion 25. At this time, the side edge of the semiconductor substrate 29 is fixed by being pressed by the fluid storage portion 23. Therefore, when the semiconductor substrate 29 is stored in the first cylindrical portion 25 of the container body 21, it is possible to prevent the semiconductor substrate 29 from making point contact with the inner surface of the first cylindrical portion 25. Therefore, for example, when the semiconductor substrate storage container 30 is dropped due to carelessness of an operator during transportation, even if an impact is applied to the semiconductor substrate storage container 30, both ends of the slit 26 substantially exist. In this state, the impact applied to the semiconductor substrate 29 can be greatly reduced. For the same reason, the impact can be reduced even if the semiconductor substrate 29 is formed into a thin film type. Therefore, the semiconductor substrate 29 stored in the semiconductor substrate storage container 30 can be prevented from being damaged.
[0042]
As described above, according to the configuration of the semiconductor substrate storage container 30 of this example, the first cylindrical portion 25 that stores the semiconductor substrate 31 is provided, and the first cylindrical portion 25 is provided with a plurality of circumferential portions. A container body 21 provided with a slit 26, a lid 22 provided with a second cylindrical portion 28 covering the first cylindrical portion 25, and a container 22 disposed between the container body 21 and the lid 22. When the semiconductor substrate 29 is accommodated in the first cylindrical portion 25, the side edge of the semiconductor substrate 29 is partially fixed by the fluid accommodation portion.
Therefore, even if an impact is applied to the semiconductor substrate storage container for some reason, damage to the semiconductor substrate can be prevented.
[0043]
Although the embodiment of the present invention has been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and the present invention is applicable even if there is a design change or the like without departing from the gist of the present invention. include. For example, in the first embodiment, an example in which one slit and one convex portion are provided in each of the first and second cylindrical portions has been described. However, the present invention is not limited to this, and a plurality of slits and convex portions may be provided. . Further, the number of the plurality of side walls, the number of slits, and the like shown in the second embodiment or the third embodiment are merely examples, and can be appropriately changed according to the purpose, application, and the like.
[0044]
【The invention's effect】
As described above, according to the configuration of the semiconductor substrate storage container of the present invention, a slit having a predetermined width is provided from the upper end to the lower end, and a cylindrical opening having an upper end opening and a lower end closed for housing a semiconductor substrate. On the inner surface corresponding to the slit of the container body, a convex portion having a predetermined width capable of being fitted into the slit from the upper end to the lower end is provided on the inner surface, and an upper end closing and a lower end opening cylindrical shape covering the container body are provided. Since the top surface of the convex portion of the lid is formed so as to be flush with the surface on which the inner surface of the container body is extended when the convex portion is fitted into the slit. In addition, it is possible to prevent the semiconductor substrate from making point contact with the inner surface of the container body.
Further, according to the configuration of the semiconductor substrate storage container of the present invention, a plurality of side walls are provided along the circumferential direction, and a cylindrical container main body with an upper end opening and a lower end closed for storing a semiconductor substrate; On the inner surface corresponding to the side wall portion of the main body, the same number of engaging portions as the side wall portion are provided so as to be engageable with the side wall portion, and a cylindrical lid body with a rotatable upper end closing and lower end opening covering the container main body. When the semiconductor substrate is stored in the container main body, the side edge of the semiconductor substrate is partially fixed by the side wall portion that engages with the engagement portion that rotates integrally with the lid.
Further, according to the configuration of the semiconductor substrate storage container of the present invention, a plurality of slits are provided along the circumferential direction, and a cylindrical container main body with an upper end opening and a lower end closed for storing a semiconductor substrate; A fluid that is disposed between the container body and the lid body, and that presses the side edge of the semiconductor substrate through the slit when the semiconductor substrate is housed in the container body. When the semiconductor substrate is accommodated in the container body, the side edge of the semiconductor substrate is partially fixed by the fluid accommodating portion.
Therefore, even if an impact is applied to the semiconductor substrate storage container for some reason, damage to the semiconductor substrate can be prevented.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a configuration of a semiconductor substrate storage container according to a first embodiment of the present invention.
FIG. 2 is a sectional view taken along the line AA of FIG. 1;
FIG. 3 is a sectional view taken along line BB of FIG. 1;
FIG. 4 is a plan view showing a configuration of the semiconductor substrate storage container.
FIG. 5 is a sectional view taken along the line CC of FIG. 4;
FIG. 6 is a plan view showing a state where a semiconductor substrate is stored in the semiconductor substrate storage container.
FIG. 7 is an exploded plan view showing a configuration of a semiconductor substrate storage container according to a second embodiment of the present invention.
FIG. 8 is a plan view showing a configuration of the semiconductor substrate storage container.
FIG. 9 is a plan view showing a state of a preparation stage for housing the semiconductor substrate in the semiconductor substrate housing container.
FIG. 10 is a plan view showing a state where a semiconductor substrate is stored in the semiconductor substrate storage container.
FIG. 11 is an exploded plan view showing a configuration of a semiconductor substrate storage container according to a third embodiment of the present invention.
FIG. 12 is a plan view showing a configuration of the semiconductor substrate storage container.
FIG. 13 is a side view of FIG.
FIG. 14 is an exploded perspective view showing a configuration of a conventional semiconductor substrate storage container.
FIG. 15 is a plan view showing a defect of a conventional semiconductor substrate storage container.
[Explanation of symbols]
1,11,21 Container body
2,21,22 Lid
3, 13, 24 Base
4, 14, 25 First cylindrical part
4A, 6A, 14A, 25A Upper end of cylindrical part
4B, 6B, 14B, 25B Lower end of cylindrical part
4C, 6C, 14C, 17A, 25C, 28A Inner surface of cylindrical part
4D End of cylindrical part
5, 15, 26 slits
6, 17, 28 Second cylindrical part
7 convex part
7A Top of convex part
7B End of convex part
8, 19, 29 Semiconductor substrate
10, 20, 30 Semiconductor substrate storage container
16, 27 Side wall
18 Engagement part
23 Fluid storage unit

Claims

A semiconductor substrate storage container capable of storing a number of semiconductor substrates stacked,
A slit of a predetermined width is provided from the upper end to the lower end, and a cylindrical container body with an upper end opening and a lower end closed for housing the semiconductor substrate,
On the inner surface corresponding to the slit of the container main body, a convex portion having a predetermined width that can be fitted into the slit from the upper end to the lower end is provided, and a cylindrical upper end closed and a lower end opening covering the container main body are provided. A semiconductor substrate storage container, comprising: a lid;

The top surface of the convex portion of the lid is formed so that when the convex portion is fitted into the slit, the inner surface of the container body is flush with the extended surface. The semiconductor substrate storage container according to claim 1, wherein

3. The semiconductor substrate storage container according to claim 1, wherein an end of the container main body forming the slit and an end of the convex portion of the lid are chamfered. .

A semiconductor substrate storage container capable of storing a number of semiconductor substrates stacked,
A plurality of side walls are provided along the circumferential direction, and a cylindrical container body with an upper end opening and a lower end closed for housing the semiconductor substrate,
On the inner surface corresponding to the side wall portion of the container main body, the same number of engaging portions as the side wall portion are provided so as to be engageable with the side wall portion, and the rotatable upper end closing and lower end opening for covering the container main body are provided. A semiconductor substrate storage container, comprising: a cylindrical lid.

5. The semiconductor substrate storage container according to claim 4, wherein the rotation direction of the lid is different between when the semiconductor substrate is stored and when the semiconductor substrate is taken out.

6. The semiconductor substrate storage container according to claim 4, wherein the container main body is provided with a plurality of slits from the upper end to the lower end adjacent to the side wall portion.

A semiconductor substrate storage container capable of storing a number of semiconductor substrates stacked,
A plurality of slits are provided along the circumferential direction, and a cylindrical container body with an upper end opening and a lower end closed for housing the semiconductor substrate,
A cylindrical lid with an upper end closed and a lower end opening covering the container body,
A fluid storage unit disposed between the container body and the lid, and pressing a side edge of the semiconductor substrate through the slit when the semiconductor substrate is stored in the container body. Semiconductor substrate container.

The semiconductor substrate storage container according to claim 7, wherein a fluid is supplied to the fluid storage portion when the semiconductor substrate is stored in the container main body.