JP2017067594A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device that can adequately change a direction of conveying an electronic component.SOLUTION: The electronic component conveyance device includes: a first conveyance part, which can arrange and convey an IC device 90 as an electronic component; a device recovery part 18 as a second conveyance part, which can arrange and convey the IC device 90; and an inspection region A3 where an inspection part 16 for inspecting the IC device 90 can be arranged, the first and second conveyance parts being movable to the inspection region A3 and away from the inspection region A3.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus for inspecting electrical characteristics of electronic components such as semiconductor elements has been known. This electronic component inspection apparatus is configured to classify electronic components according to the inspection result in an inspection unit. Has been. The classification includes “examination result good”, “examination result defect”, “re-examination required (see, for example, Patent Document 1)” and the like.

JP 2000-258507 A

  The transport direction of the electronic component around the inspection unit is normally restricted to one direction. However, depending on the user who uses the electronic component inspection apparatus, there is a case where it is desired to change the transport direction. However, it was impossible to change the transport direction.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport apparatus of the present invention includes a first transport unit capable of arranging and transporting electronic components,
A second transport unit capable of arranging and transporting the electronic component;
An inspection area where an inspection unit for inspecting the electronic component can be arranged, and
The first transport unit is arranged to move the electronic component in a direction toward the inspection area and a direction away from the inspection area,
The second transport unit may be arranged to move the electronic component in a direction toward the inspection area and a direction away from the inspection area.

  Thereby, the conveyance direction of the electronic component with respect to the inspection region can be changed as appropriate, and, for example, a plurality of conveyance modes (conveyance modes) according to the electronic component can be set, and one of these can be selected. And can be executed.

  In the electronic component transport apparatus according to the present invention, it is preferable that the first transport unit and the second transport unit have opposite directions to transport the electronic component.

  Thus, for example, when the inspection is performed in the inspection unit, the electronic components can be made to enter from opposite directions. Therefore, the operator of the electronic component transport apparatus can confirm in which transport mode the inspection apparatus is currently operating among the plurality of transport modes by visually checking the direction toward the inspection area of the electronic component. it can.

In the electronic component conveying apparatus of the present invention, it is preferable that the first conveying unit and the second conveying unit are capable of adjusting the temperature of the electronic component.
Thereby, the electronic component can be adjusted to a temperature suitable for inspection.

  In the electronic component transport apparatus of the present invention, it is preferable that a plurality of the first transport unit and the second transport unit are provided.

  Thereby, the throughput (the number of electronic components transported per unit time) can be improved.

  In the electronic component transport apparatus of the present invention, it is preferable that the first transport unit and the second transport unit have the same timing toward the inspection region.

  Thereby, the inspection for the electronic component conveyed by the first conveyance unit and the inspection for the electronic component conveyed by the second conveyance unit can be simultaneously performed by the inspection unit.

  In the electronic component transport apparatus according to the present invention, it is preferable that the first transport unit and the second transport unit have different timings toward the inspection region.

  Thereby, it is possible to place and inspect as many electronic components as possible transported by the first transport unit in the inspection unit, and before and after the inspection, the electronic components transported by the second transport unit can be It is possible to place and inspect as much as possible in the inspection unit.

  In the electronic component transport apparatus of the present invention, it is preferable that the electronic component is inspected at least once by the inspection unit.

  As a result, the inspection unit can reinspect the electronic component that has been inspected at least once.

In the electronic component transport apparatus according to the present invention, it is preferable that the electronic component transport apparatus further includes a placement unit that places the electronic component inspected at least once by the inspection unit.
Thereby, an electronic component can be classified according to a test result.

In the electronic component transport apparatus according to the present invention, it is preferable that the mounting portion does not move.
As a result, even if the placement unit is located in a region where a relatively large number of various movable parts are arranged, the tested electronic component is stably placed on the placement unit.

In the electronic component conveying device of the present invention, the electronic component conveying apparatus includes a conveying robot that conveys the plurality of electronic components from the placement unit to the second conveying unit,
It is preferable that the transfer robot can change the interval between the plurality of electronic components.

  As a result, even when the interval between the electronic components at the loading unit as the transfer source and the interval between the electronic components at the second transfer unit as the transfer destination are different, the electronic components can be quickly and smoothly moved. It can be transported from the transport source to the transport destination.

  In the electronic component transport apparatus of the present invention, it is preferable that the electronic component is not inspected by the inspection unit.

  Thereby, the electronic component conveyed by the 1st conveyance part and the electronic component conveyed by the 2nd conveyance part can be inspected on mutually different inspection conditions.

In the electronic component conveying apparatus of the present invention, it is preferable that the first conveying unit or the second conveying unit can adjust the temperature of the electronic component.
Thereby, the electronic component can be adjusted to a temperature suitable for inspection.

The electronic component inspection apparatus of the present invention includes a first transport unit capable of arranging and transporting electronic components,
A second transport unit capable of arranging and transporting the electronic component;
An inspection unit for inspecting the electronic component;
An inspection area where the inspection unit can be arranged, and
The first transport unit is arranged to move the electronic component in a direction toward the inspection area and a direction away from the inspection area,
The second transport unit may be arranged to move the electronic component in a direction toward the inspection area and a direction away from the inspection area.

  Thereby, the conveyance direction of the electronic component with respect to the inspection region can be changed as appropriate, and, for example, a plurality of conveyance modes (conveyance modes) according to the electronic component can be set, and one of these can be selected. And can be executed.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing a normal operation state (normal transport mode) of the electronic component inspection apparatus shown in FIG. FIG. 3 is a schematic plan view sequentially illustrating a retest operation state (reinspection transfer mode) of the electronic component inspection apparatus shown in FIG. FIG. 4 is a schematic plan view sequentially illustrating the retest operation state (reinspection transport mode) of the electronic component inspection apparatus shown in FIG. FIG. 5 is a schematic plan view sequentially illustrating the retest operation state (reinspection transport mode) of the electronic component inspection apparatus shown in FIG. FIG. 6 is a schematic plan view sequentially illustrating the retest operation state (reinspection transport mode) of the electronic component inspection apparatus shown in FIG. FIG. 7 is a schematic plan view sequentially illustrating the retest operation state (reinspection transport mode) of the electronic component inspection apparatus shown in FIG. FIG. 8 is a schematic plan view sequentially illustrating the retest operation state (reinspection transport mode) of the electronic component inspection apparatus shown in FIG. FIG. 9 is a schematic plan view sequentially illustrating the retest operation state (reinspection transfer mode) of the electronic component inspection apparatus shown in FIG. FIG. 10 is a schematic plan view sequentially illustrating the retest operation state (reinspection transport mode) of the electronic component inspection apparatus shown in FIG. FIG. 11 is a diagram illustrating an operation state of the device transport head included in the electronic component inspection apparatus illustrated in FIG. 1. FIG. 12 is a diagram illustrating an operating state of the device transport head included in the electronic component inspection apparatus illustrated in FIG. 1. FIG. 13 is a schematic plan view sequentially illustrating an operation state (parallel transport mode) different from that of FIG. 2 of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 14 is a schematic plan view sequentially illustrating an operation state (parallel transport mode) different from FIG. 2 of the electronic component inspection apparatus (second embodiment) of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing a normal operation state (normal transport mode) of the electronic component inspection apparatus shown in FIG. 3 to 10 are schematic plan views sequentially illustrating the retest operation state (reinspection transport mode) of the electronic component inspection apparatus shown in FIG. FIG. 11 and FIG. 12 are diagrams each showing an operating state of the device transport head included in the electronic component inspection apparatus shown in FIG. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIGS. 1 and 2 includes, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), a CIS (CMOS It is an apparatus that transports electronic components such as image sensors and inspects and tests electrical characteristics (hereinafter simply referred to as “inspection”) during the transport process. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  Further, the inspection apparatus 1 can carry the IC device 90 in various carrying modes. In the present embodiment, as the transport mode, a normal transport mode for transporting an uninspected IC device 90 as shown in FIG. 2 and a re-inspection for transporting an IC device 90 to be re-inspected as shown in FIGS. There is a transfer mode.

  As shown in FIG. 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. For example, in the normal transport mode, the IC device 90 passes through the respective regions in order from the tray supply region A1 to the tray removal region A5, and the inspection is performed in the intermediate inspection region A3. As described above, the inspection apparatus 1 includes the electronic component conveyance device (handler) that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 800. . In addition, the inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged (the lower side in FIG. 2) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is arranged (FIG. 2 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (mounting member) 200 in which a plurality of uninspected IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11 </ b> A is a moving unit that can move the tray 200 to the positive side in the Y direction together with the IC device 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, from the supply area A2 to the tray supply area A1.

  In the supply area A2, a temperature adjusting unit 12, a device transport head 13, and a tray transport mechanism 15 are provided.

  The temperature adjustment unit 12 is a member that can collectively cool and heat a plurality of IC devices 90 and is sometimes referred to as a “soak plate”. With the soak plate, the IC device 90 before being inspected by the inspection unit 16 can be cooled or heated in advance and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the tray transport mechanism 11A is transported to one of the temperature adjustment units 12.

  The device transport head 13 is supported so as to be movable in the X and Y directions and further in the Z direction within the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports the empty tray 200 from which all IC devices 90 have been removed to the positive side in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 and a device transport head 17 are provided. In addition, a device supply unit 14 that moves so as to straddle the supply region A2 and the inspection region A3 and a device recovery unit 18 that moves so as to straddle the inspection region A3 and the recovery region A4 are also provided.

  The device supply unit 14 is provided with an IC device 90 whose temperature is adjusted, and is supported so as to be movable in the X direction between the supply region A2 and the inspection region A3. As a result, the device supply unit 14 can approach and separate from the inspection unit 16, and thus can transport the IC device 90 to the vicinity of the inspection unit 16. Thus, the device supply unit 14 is a transfer unit (first transfer unit) that transfers the IC device 90 in the X direction, and is sometimes referred to as a “supply shuttle plate”. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. Then, the IC device 90 on the temperature adjustment unit 12 is transported to any one of the device supply units 14 waiting in the supply region A2. By providing the two device supply units 14 in this way, the throughput (the number of IC devices 90 transported per unit time) can be improved. In the device supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be cooled or heated to adjust the IC device 90 to a temperature suitable for inspection.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be cooled or heated to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the Y direction within the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. The device transport head 17 can also cool or heat the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

  The device collection unit 18 includes an IC device 90 that has been inspected by the inspection unit 16, and is supported so as to be movable between the inspection region A3 and the collection region A4 in the X direction. Thereby, the device collection | recovery part 18 can approach and leave | separate with respect to the test | inspection part 16, Therefore The IC device 90 from the test | inspection part 16 can be conveyed to collection | recovery area | region A4. Thus, the device collection unit 18 is a conveyance unit (second conveyance unit) that conveys the IC device 90 in the X direction, and may be referred to as a “collection shuttle plate”. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14. Then, the IC device 90 on the inspection unit 16 is transported to and placed on any one of the device collection units 18 waiting in the inspection region A3. This transport is performed by the device transport head 17. Note that the device collection unit 18 may also be configured to be able to adjust the temperature of the IC device 90, similarly to the temperature adjustment unit 12 and the device supply unit 14. Further, since the two device collection units 18 are provided, the throughput can be improved.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device transport head (transport robot) 20, and a tray transport mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4 in the normal transport mode.

  The collection tray 19 is a placement unit on which the IC device 90 that has been inspected at least once by the inspection unit 16 is placed, and is fixed so as not to move within the collection region A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. Become. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. In the normal transport mode, the empty tray 200 serves as a placement unit on which the IC device 90 that has been inspected at least once by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

  The device transport head 20 is supported so as to be movable in the X and Y directions and further in the Z direction within the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200 in, for example, the normal transport mode.

  As shown in FIGS. 11 and 12, the device transport head 20 has a plurality of suction units 201 that are connected to an ejector (not shown) and suck IC devices 90 one by one by the operation of the ejector. As a result, the plurality of IC devices 90 can be held and transported collectively. In addition, the device transport head 20 is configured such that the suction units 201 approach and separate from each other in the X direction and the Y direction. Thereby, the space | interval of IC devices 90 adsorbed by each adsorption | suction part 201 can be changed and adjusted. Since such adjustment is possible, the interval between the IC devices 90 at the transport source (for example, the device collection unit 18) is different from the interval between the IC devices 90 at the transport destination (for example, the collection tray 19). Even in this case, the IC device 90 can be quickly and smoothly transferred from the transfer source to the transfer destination.

  The device transport head 13 and the device transport head 17 are also preferably configured to be able to change and adjust the interval between the gripped IC devices 90, as with the device transport head 20.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried in from the tray removal area A5 in the X direction in the recovery area A4 in the normal transport mode. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput can be improved as compared with the case where the empty tray 200 is transported in the X direction by a single transport mechanism.

  In the normal transport mode, the tray removal area A5 is a material removal unit that collects and removes the tray 200 on which a plurality of inspected IC devices 90 are arranged. In the tray removal area A5, a large number of trays 200 can be stacked.

  Further, tray transport mechanisms 22A and 22B for transporting the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving unit that can move the tray 200 in the Y direction. Thereby, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5, for example, in the normal transport mode. The tray transport mechanism 22B is a moving unit that can move an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4 in the normal conveyance mode.

  The control unit 800 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  The operator can set or confirm the operating conditions of the inspection apparatus 1 via the monitor 300. The monitor 300 includes a display screen (display unit) 301 configured by, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the inspection apparatus 1. As shown in FIG. 1, on the right side of the tray removal area A5 in the figure, there is provided a mouse table 600 on which a mouse used for operating a screen displayed on the monitor 300 is placed.

  An operation panel 700 is disposed on the lower right side in FIG. The operation panel 700 commands the inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state or the like of the inspection apparatus 1 by a combination of colors that emit light. The signal lamp 400 is arranged on the upper part of the inspection apparatus 1. Note that the inspection device 1 has a built-in speaker 500, and the operation state of the inspection device 1 can also be notified by the speaker 500.

  As shown in FIG. 2, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by the first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each region. Furthermore, the outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74.

  As described above, the inspection apparatus 1 can transfer the IC device 90 in the normal transfer mode (see FIG. 2) and can transfer the IC device 90 in the re-inspection transfer mode (see FIGS. 3 to 10). Device.

  The normal transport mode is a mode in which the uninspected IC device 90 is transported and classified according to the inspection result in the inspection unit 16.

  As shown in FIG. 2, in the normal transport mode, first, the IC device 90 is arranged on the tray 200 in the tray supply area A1. From this state, the IC device 90 is transported into the supply area A2 together with the tray 200 by the operation of the tray transport mechanism 11A.

  In the supply area A <b> 2, the IC device 90 is transported to the device supply unit 14 via the temperature adjustment unit 12 by the operation of the device transport head 13.

  Next, the IC device 90 on the device supply unit 14 is transported into the inspection area A3 by the operation of the device supply unit 14.

  In the inspection area A <b> 3, the IC device 90 is placed on the inspection unit 16 by the operation of the device transport head 17, and the inspection unit 16 performs the inspection. After the inspection is completed, the IC device 90 is transported to the device collection unit 18 located in the inspection area A3 by the operation of the device transport head 17.

  Next, the IC device 90 on the device collection unit 18 is transported into the collection area A4 by the operation of the device collection unit 18.

  In the collection area A4, the IC device 90 is conveyed to one of the three collection trays 19 and the three empty trays 200 by the operation of the device conveyance head 20 according to the inspection result in the inspection unit 16. Is done. Thereby, the normal transport mode for one IC device 90 is completed. In the configuration shown in FIG. 2, the IC device 90 is conveyed and placed on the rightmost collection tray 19 among the three collection trays 19.

  As described above, in the inspection apparatus 1, the IC devices 90 are classified by the collection area A <b> 4 for each inspection result in the inspection unit 16. The classification includes, for example, “good inspection result”, “bad inspection result”, and “re-examination required”. In the present embodiment, the left two trays 200 of the three empty trays 200 in FIGS. 3 to 10 are allocated as the “inspection result good” tray 200a, and the right one tray is “inspection result bad”. The tray 200b is allocated. The three collection trays 19 are all assigned to the collection tray 19 for “re-examination required”. The reason for requiring re-inspection (retest) is, for example, that the inspection result cannot be judged as “good” or “bad” due to poor contact between the terminals of the inspection unit 16 and the IC device 90 at the time of inspection.

Next, the reinspection transport mode will be described with reference to FIGS.
In the re-inspection transfer mode, the inspection is once completed in the normal transfer mode, but the IC device 90 to be inspected again (hereinafter referred to as “IC device 90a”) among the IC devices 90 in which the inspection has been completed is transferred, In this mode, classification is performed according to the re-inspection result in the inspection unit 16. By selecting the re-inspection transport mode on the monitor 300, for example, the normal transport mode is automatically switched to the re-inspection transport mode, so that the IC device 90a can be re-inspected.

  FIG. 3 shows a state where the normal conveyance mode for the IC devices 90 for one lot is completed. In FIG. 3, a plurality of IC devices 90 are placed on the left tray 200a, but there is still a space in which the IC devices 90 can be placed. Further, the IC device 90 a is placed on the rightmost collection tray 19.

  When the device transport head 20 operates from the state shown in FIG. 3, as shown in FIG. 4, the IC device 90a is moved from the collection tray 19 to one of the two device collection units 18 located in the collection area A4. It is transported to one (upper side in FIG. 4) device collection unit 18. Hereinafter, the one device collection unit 18 may be referred to as a “device collection unit 18a”, and the other device collection unit 18 (the lower side in FIG. 4) may be referred to as a “device collection unit 18b”.

  Next, as shown in FIG. 5, the device collection unit 18a moves toward the inspection area A3 and stops in a state where the IC device 90a is arranged. Thus, the IC device 90a is transported to the vicinity of the inspection unit 16.

  When the device transport head 17 is operated, the IC device 90a is transported to and placed on the inspection unit 16 as shown in FIG. As a result, the IC device 90a is re-inspected.

  When the device transport head 17 operates after completion of the re-inspection, as shown in FIG. 7, the IC device 90a is transported to the device collection unit 18a that is stopped in the inspection area A3.

  Next, as shown in FIG. 8, the device collection unit 18a moves away from the inspection area A3 toward the collection area A4 with the IC device 90a disposed, and stops. Further, when the inspection result of the IC device 90a is determined to be “good”, for example, as shown in FIG. 8, the left tray 200a in the drawing is recovered from the tray removal area A5 by the operation of the tray transport mechanism 22A. It moves to area A4.

  Next, when the device transport head 20 operates, as shown in FIG. 9, the IC device 90a is transported from the device recovery unit 18a to the tray 200a that has moved into the recovery region A4. As a result, the IC device 90a is classified as an IC device 90 having a “test result good”.

  Next, as shown in FIG. 10, the tray 200a on which the IC device 90a is placed moves from the collection area A4 to the tray removal area A5 by the operation of the tray transport mechanism 22A. Thereby, the re-inspection conveyance mode for the IC device 90a is completed.

  In addition, as described above, the device supply unit 14 and the device collection unit 18 have the directions in which the IC device 90 is conveyed while facing the inspection area A3 (see FIGS. 2 and 5). The directions away from the inspection area A3 are also opposite to each other. Thus, for example, when the inspection unit 16 performs an inspection, the IC devices 90 can be entered from opposite directions. Therefore, the operator visually confirms the direction toward the inspection area A3 of the IC device 90 to confirm whether the inspection apparatus 1 is currently operating in the normal transport mode or in the re-inspection transport mode. can do.

  As described above, the inspection apparatus 1 is configured so that the conveyance direction of the IC device 90 can be changed as appropriate, so that the reinspection conveyance mode can be performed in addition to the normal conveyance mode.

  In the re-inspection transport mode in the present embodiment, the collection tray 19 is allocated for “re-inspection required” as described above. However, the present invention is not limited to this. For example, among the three empty trays 200 One tray 200 may be allocated for “re-examination required”.

Second Embodiment
FIG. 13 and FIG. 14 are schematic plan views sequentially showing operation states (parallel transport mode) different from FIG. 2 of the electronic component inspection apparatus (second embodiment) of the present invention.

  Hereinafter, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to these drawings. However, the difference from the above-described embodiment will be mainly described, Description is omitted.

  This embodiment is the same as the first embodiment except that the transport mode for the IC device is different.

  In the present embodiment, the inspection apparatus 1 is configured to be capable of the parallel conveyance mode. As shown in FIGS. 13 and 14, in the parallel conveyance mode, supply of an uninspected IC device 90 (hereinafter referred to as “IC device 90b”) is started from the tray supply area A1, and the IC device 90b is inspected. 16, and the supply of uninspected IC devices 90 (hereinafter referred to as “IC devices 90 c”) is also started from the tray removal area A 5, and the IC devices 90 c are transported toward the inspection unit 16. Mode. Both the IC device 90b and the IC device 90c are classified into predetermined positions according to the inspection result in the inspection unit 16. The classification destination is any one of the collection trays 19 in the present embodiment.

  Such a parallel transport mode is effective when the inspection for the IC device 90b is different from the inspection for the IC device 90c. For example, the inspection of the IC device 90c can be a so-called “normal temperature inspection (normal temperature test)”, and the inspection of the IC device 90b can be a so-called “high temperature inspection (high temperature test)” or “low temperature inspection (low temperature test)”. Hereinafter, the parallel transport mode applied in this case will be described with reference to FIGS. 13 and 14.

  In the parallel transport mode, of the device recovery unit 18a and the device recovery unit 18b, the device recovery unit 18a is used for transporting the IC device 90b, and the device recovery unit 18b is used for transporting the IC device 90c.

  In the present embodiment, at least the device collection unit 18b out of the device collection unit 18a and the device collection unit 18b can adjust the temperature of the IC device 90c in the same manner as the device supply unit 14. As a result, the IC recovery device 18b can adjust the IC device 90c to a temperature suitable for inspection.

  As shown in FIG. 13, the IC device 90b is transported from the tray supply area A1 to the collection area A4, as in the normal transport mode (see FIG. 2). In the recovery area A4, the IC device 90b is transported and placed on the rightmost recovery tray 19 in FIG. 13 of the three recovery trays 19 by the operation of the device transport head 20.

  On the other hand, the IC device 90c placed on the tray 200 in the tray removal area A5 is transported together with the tray 200 into the collection area A4 by the operation of the tray transport mechanism 22A. Thereafter, the IC device 90c is transported to the device recovery unit 18b in the recovery region A4 by the operation of the device transport head 20. Next, the IC device 90c on the device collection unit 18b is transported into the inspection area A3 by the operation of the device collection unit 18b. The temperature of the IC device 90c is adjusted on the device collection unit 18b. In the inspection area A3, the IC device 90c is placed on the inspection unit 16 by the operation of the device transport head 17, and the inspection unit 16 performs the inspection.

After completion of the inspection, as shown in FIG. 14, the IC device 90c is transported to the device collection unit 18b located in the inspection area A3 by the operation of the device transport head 17. Next, the IC device 90c on the device collection unit 18b is transported again into the collection area A4 by the operation of the device collection unit 18b. In the collection area A4, the IC device 90c is conveyed and placed on the rightmost collection tray 19 in FIG. 14 by the operation of the device conveyance head 20 according to the inspection result in the inspection unit 16.
The parallel transport mode is completed by the operation in the inspection apparatus 1 as described above.

  As described above, also in the present embodiment, the inspection apparatus 1 can appropriately change the transport direction of the IC device 90, and thus can perform the parallel transport mode. Then, with this parallel transport mode, inspections of different conditions can be performed in parallel by one inspection apparatus 1 according to the type of IC device 90 handled by the user of the inspection apparatus 1, that is, needs.

  In the parallel transfer mode, the device supply unit 14 and the device collection unit 18 may have the same timing or different timings toward the inspection area A3 depending on various conditions. The various conditions include, for example, the type of the IC device 90b and the IC device 90c, the size of the operation speed of the device transport head 13 and the device transport head 20, the size of the movement distance of the device transport head 13 and the device transport head 20, and device supply For example, the operation speed of the unit 14 or the device collection unit 18 is large or small.

  When the device supply unit 14 and the device collection unit 18 go to the inspection area A3 at the same timing, the inspection unit 16 can perform the inspection on the IC device 90b and the inspection on the IC device 90c at the same time.

  In addition, when the device supply unit 14 and the device collection unit 18 head for the inspection area A3 at different timings, as many IC devices 90b as possible can be mounted on the inspection unit 16 and inspected. As many IC devices 90c as possible can be mounted on the inspection unit 16 before and after the inspection.

  In the parallel conveyance mode in the present embodiment, the collection tray 19 is the classification destination of the IC device 90 after the inspection as described above, but is not limited to this. For example, in the collection area A4, the X direction Of the three trays 200 arranged in the right side, the rightmost tray 200 in FIGS. 13 and 14 may be the classification destination of the IC device 90 after the inspection.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus (electronic component inspection apparatus), 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 14 ... Device supply part, 15 ... Tray conveyance mechanism, 16 ... Inspection , 17 ... Device transport head, 18 ... Device recovery section, 18a ... Device recovery section, 18b ... Device recovery section, 19 ... Collection tray, 20 ... Device transport head (transport robot), 201 ... Suction section, 21 ... Tray Transport mechanism, 22A ... Tray transport mechanism, 22B ... Tray transport mechanism, 61 ... First partition, 62 ... Second partition, 63 ... Third partition, 64 ... Fourth partition, 65 ... Fifth partition, 70 ... Front cover, 71 ... Side cover 72 ... Side cover 73 ... Rear cover 74 ... Top cover 90 ... IC device 90a ... IC device 90b ... IC device 90c ... IC device 200 ... tray (mounting member) 200a ... tray 200b ... tray 300 ... monitor 301 ... display screen 400 ... signal lamp 500 ... speaker 600 ... mouse table 700 ... operation Panel, 800 ... control unit, A1 ... tray supply area, A2 ... device supply area (supply area), A3 ... inspection area, A4 ... device collection area (collection area), A5 ... tray removal area

Claims (13)

A first transport unit capable of arranging and transporting electronic components;
A second transport unit capable of arranging and transporting the electronic component;
An inspection area where an inspection unit for inspecting the electronic component can be arranged, and
The first transport unit is arranged to move the electronic component in a direction toward the inspection area and a direction away from the inspection area,
The electronic component conveying apparatus, wherein the second conveying unit is arranged to move the electronic component in a direction toward the inspection region and a direction away from the inspection region.   The electronic component transport apparatus according to claim 1, wherein the first transport unit and the second transport unit have opposite directions to transport the electronic component.   The electronic component transport apparatus according to claim 1, wherein the first transport unit and the second transport unit are capable of adjusting the temperature of the electronic component.   4. The electronic component transport apparatus according to claim 1, wherein a plurality of the first transport unit and the second transport unit are provided. 5.   The electronic component transport apparatus according to claim 4, wherein the first transport unit and the second transport unit have the same timing toward the inspection area.   The electronic component transport apparatus according to claim 4, wherein the first transport unit and the second transport unit have different timings toward the inspection area.   The electronic component conveying apparatus according to claim 1, wherein the electronic component is inspected at least once by the inspection unit.   The electronic component transport apparatus according to claim 7, further comprising a placement unit that places the electronic component inspected at least once by the inspection unit.   The electronic component carrying device according to claim 8, wherein the placement unit does not move. A transport robot that transports the plurality of electronic components from the placement unit to the second transport unit;
The electronic component transport apparatus according to claim 1, wherein the transport robot is capable of changing an interval between the plurality of electronic components.   The electronic component conveying apparatus according to claim 1, wherein the electronic component is not inspected by the inspection unit.   The electronic component conveyance device according to claim 11, wherein the first conveyance unit or the second conveyance unit is capable of adjusting a temperature of the electronic component. A first transport unit capable of arranging and transporting electronic components;
A second transport unit capable of arranging and transporting the electronic component;
An inspection unit for inspecting the electronic component;
An inspection area where the inspection unit can be arranged, and
The first transport unit is arranged to move the electronic component in a direction toward the inspection area and a direction away from the inspection area,
The electronic component inspection apparatus, wherein the second transport unit is arranged to move the electronic component in a direction toward the inspection region and a direction away from the inspection region.

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