CN110308379A

CN110308379A - Electronic component transmission device and electronic component check device

Info

Publication number: CN110308379A
Application number: CN201910207651.0A
Authority: CN
Inventors: 荻原武彦
Original assignee: Seiko Epson Corp
Current assignee: North Star Technology Co.,Ltd.
Priority date: 2018-03-20
Filing date: 2019-03-18
Publication date: 2019-10-08
Also published as: JP2019164099A; TW201940398A

Abstract

The application provides electronic component transmission device and electronic component check device, can carry out at least two to electronic component in the transmission midway of electronic component and check.A kind of electronic component transmission device, electronic component is sent to, the first inspection portion and carry out the second inspection portion that second different from the first inspection check to electronic component that first checks are carried out to electronic component, which has: keeping the maintaining part of electronic component；Load the mobile mounting portion of electronic component；And the control unit of control maintaining part, control unit makes maintaining part that electronic component is sent to the first inspection portion from mobile mounting portion, make maintaining part that the electronic component after having carried out the first inspection is sent to mobile mounting portion from the first inspection portion, and makes maintaining part that electronic component is sent to the second inspection portion from mobile mounting portion.

Description

Electronic component transmission device and electronic component check device

Technical field

The present invention relates to electronic component transmission device and electronic component check devices.

Background technique

In the prior art, such as when carrying out the electric checking of the electronic components such as IC device, using transmission electricity The IC processor of sub- component (for example, referring to patent document 1).IC processor described in Patent Document 1 is to be provided with to be connected to The state of the socket for inspection of tester.In addition, electronic component is transmitted in this state, in its transmission halfway by electronics member device Part is configured at socket for inspection, carries out a kind of inspection to the electronic component.

Patent document 1: Japanese Patent Laid-Open 2000-088918 bulletin

IC processor described in Patent Document 1 can not carry out a variety of inspections to electronic component, complete a kind of inspection Later, it needs the electronic component for finishing the inspection to be placed in pallet again, which is transferred to and carries out other types The IC processor of inspection.

Summary of the invention

In order to solve the above-mentioned technical problem the present invention makes, can be used as following aspect to realize.

Electronic component transmission device of the invention is it is characterized in that, the mounting portion of mounting electronic component can be configured Part, the electronic component transmission device have: transport unit transmits the electronic component；First area, the configuration of the first inspection portion In the first area, which loads the electronic component, carries out first to the electronic component and checks；With And second area, the second inspection portion are configured at the second area, which loads the electronic component, to described Electronic component carries out second different from first inspection and checks, the transport unit includes maintaining part, keeps the electronics It is successively placed in first inspection portion and second inspection portion by component；And recoverer, described will have been carried out One checks that the electronic component after checking with described second is placed in the mounting component.

Electronic component check device of the invention is it is characterized in that, the mounting portion of mounting electronic component can be configured Part, the electronic component check device have: transport unit transmits the electronic component；First inspection portion, loads the electronics Component carries out first to the electronic component and checks；First area, first inspection portion are configured at firstth area Domain；Second inspection portion, loads the electronic component, carries out second different from first inspection to the electronic component It checks；And second area, second inspection portion are configured at the second area, the transport unit includes maintaining part, keeps It is successively placed in first inspection portion and second inspection portion by the electronic component；And recoverer, it will carry out Described first check and described second check after the electronic component be placed in the mounting component.

Detailed description of the invention

Fig. 1 is the diagrammatic perspective of the first embodiment of electronic component check device of the invention from face side Figure.

Fig. 2 is the general view for showing the action state of electronic component check device shown in FIG. 1.

Fig. 3 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Fig. 4 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Fig. 5 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Fig. 6 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Fig. 7 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Fig. 8 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Fig. 9 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 10 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 11 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 12 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 13 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 14 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 15 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 16 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 17 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 18 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 19 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 20 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 21 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 22 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 23 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 24 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 25 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 26 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 27 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 28 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 29 is the action state for successively showing the inspection area and its front and back of electronic component check device shown in FIG. 1 Amplification vertical cross-section diagram.

Figure 30 is the plan view of state shown in Fig. 3.

Figure 31 is the plan view of state shown in Fig. 5.

Figure 32 is the plan view of state shown in Fig. 6.

Figure 33 is the plan view of state shown in Fig. 9.

Figure 34 is the plan view of state shown in Figure 12.

Figure 35 is the plan view of state shown in Figure 15.

Figure 36 is the plan view of state shown in Figure 16.

Figure 37 is the plan view of state shown in Figure 17.

Figure 38 is the plan view of state shown in Figure 20.

Figure 39 is the plan view of state shown in Figure 24.

Figure 40 is the plan view of state shown in Figure 25.

Figure 41 is the plan view of state shown in Figure 27.

Figure 42 is the plan view of state shown in Figure 29.

Figure 43 is the amplification shown in the inspection area of electronic component check device (second embodiment) of the invention Plan view.

Figure 44 is the inspection area and its front and back for showing electronic component check device of the invention (third embodiment) Action state amplification vertical cross-section diagram.

Figure 45 is the inspection area and its front and back for showing electronic component check device of the invention (the 4th embodiment) Action state amplification vertical cross-section diagram.

Description of symbols

1 electronic component check device；10 electronic component transmission devices；11A tray delivery mechanism；The transmission of 11B pallet Mechanism；12 temperature adjustment sections；13 device transfer heads；131 maintaining parts；14 device supply units；14A device supply unit；14B device supplies To portion；141 recess portions (mobile mounting portion)；The first recess portion of 141A (first supplies mobile mounting portion)；(second supplies the second recess portion of 141B To mobile mounting portion)；15 tray delivery mechanisms；The first inspection of 16A portion；The second inspection of 16B portion；161 recess portions (pouch-shaped portion)；161A Recess portion；161B recess portion；161C recess portion；161D recess portion；17 device transfer heads；17A device transfer head；17B device transfer head；171 Maintaining part；The first maintaining part of 171A；The second maintaining part of 171B；18 device recoverers；18A device recoverer；The recycling of 18B device Portion；181 recess portions (pouch-shaped portion)；The first recess portion of 181A；The second recess portion of 181B；Pallet is used in 19 recycling；20 device transfer heads；201 protect Hold portion；21 tray delivery mechanisms；22A tray delivery mechanism；22B tray delivery mechanism；231 first spaced walls；232 second intervals Wall；233 third spaced walls；234 the 4th spaced walls；235 the 5th spaced walls；241 front covers；242 side covers；243 side covers；244 rear covers； 245 top covers；25 transport units；26 posture detecting parts；261 illumination regions；262 acceptance parts；27 linking parts；90IC device；90A IC device Part；90B IC device；200 pallets；300 monitors；301 display pictures；400 signal lamps；500 loudspeakers；600 Mouse tables；700 Operation panel；800 control units；801 processors；802 memories；The first tester of 900A；The second tester of 900B；A1 pallet supplies To region；A2 device supply area；The inspection area A3；The first area A3-1；A3-2 second area；A4 device recovery zone；A5 Pallet removes region；L26 light；α_11AArrow；α_11BArrow；α_13XArrow；α_13YArrow；α₁₄Arrow；α₁₅Arrow；α_17YArrow；α₁₈ Arrow；α_20XArrow；α_20YArrow；α₂₁Arrow；α_22AArrow；α_22BArrow；α₉₀Arrow.

Specific embodiment

In the following, preferred embodiment based on the figure is to electronic component transmission device of the invention and electronics member device Part check device is described in detail.

In the following, referring to Fig.1~Figure 42 is to electronic component transmission device and electronic component check device of the invention First embodiment is illustrated.It should be noted that in the following, for ease of description, as shown in Figure 1, by mutually orthogonal three A axis is set as X-axis (first axle), Y-axis (the second axis) and Z axis.In addition, the X/Y plane including X-axis and Y-axis is level, Z axis is lead Directly.In addition it is also possible to which the direction for being parallel to X-axis is known as " X-direction (first direction) ", the direction for being parallel to Y-axis is known as " Y The direction for being parallel to Z axis is known as " Z-direction (third direction) " by direction (second direction) ".In addition, the arrow of all directions is referred to To direction be known as " just ", by its opposite direction referred to as " negative ".In addition, "horizontal" described in present specification does not limit In complete horizontal, as long as do not hinder the transmission of electronic component, also include relative to it is horizontal how much (be, for example, less than 5 ° of left sides It is right) inclined state.In addition, " vertical " described in present specification be not limited to it is complete vertical, as long as not hindering Hinder the transmission of electronic component, also includes relative to how much vertical (being, for example, less than 5 ° or so) inclined state.I.e., the application is said " orthogonal " described in bright book is not limited to complete orthogonal, also includes phase as long as not hindering the transmission of electronic component For arbitrary axis, the how much inclined state of other axis.It intersects at a right angle for example, being not limited to X-axis with Y-axis, also includes Y Axis is relative to X-axis how much (being, for example, less than 5 ° or so) inclined states.In addition, (will be closed in Fig. 1 and Fig. 3~Figure 29 sometimes Be also same in Figure 44 and Figure 45) upside, i.e. Z-direction positive side be known as "upper" or top, by downside, i.e. Z-direction negative side Referred to as "lower" or " lower section ".In addition, the device transfer head in each region is omitted in Figure 30~Figure 42.

Electronic component transmission device 10 of the invention is the processor with appearance shown in FIG. 1.As shown in Fig. 2, should Electronic component transmission device 10 has: transport unit 25, transmits the IC device 90 as electronic component；First area A3-1, First inspection portion 16A is configured at first area A3-1, and first inspection portion 16A is loaded for IC device 90 (electronic component), right IC device 90 (electronic component) carries out first and checks；And second area A3-2, the second inspection portion 16B are configured at second area A3-2, second inspection portion 16B are loaded for IC device 90 (electronic component), are carried out and the to IC device 90 (electronic component) One checks that different second check.In addition, transport unit 25 has maintaining part 171 as shown in Fig. 3~Figure 29, maintaining part 171 is being examined It looks into the A3 of region and keeps IC device 90 (electronic component), it is successively placed in the first inspection portion 16A and the second inspection portion 16B。

Here, it first checks and for example preferred scope of examination of the second inspection, inspection item, inspection precision, inspection grade (conjunction Benchmark whether lattice), the review time, check at least one of number, the inspections condition such as inspection method (test mode) difference.

When carrying out the first inspection and the second inspection to IC device 90, consider to prepare two electronic component check devices. In this case, connection first checks in an electronic component check device in the two electronic component check devices Tester connects the tester of the second inspection in another electronic component check device.Then, once described one First in a electronic component check device has checked, then operator checks that the IC device 90 finished is placed in for first Pallet is transferred to another described electronic component check device from one electronic component check device, another at this A electronic component check device carries out second and checks.Therefore, many and diverse for the inspection operation of IC device 90, spend largely from First checks the time for starting to have checked to second.

In electronic component transmission device 10 of the invention, maintaining part 171 can keep IC device 90 by the IC device Part 90 is successively placed in the first inspection portion 16A and the second inspection portion 16B.As a result, without after completing a kind of inspection, by this It checks that the electronic component finished is placed in pallet again, and the pallet is moved to the electronics member device for the inspection for carrying out other types Part check device can carry out the first inspection and the second inspection to IC device 90 by an electronic component check device 1, because This, may be implemented the fast of the inspection operation for IC device 90.

It should be noted that in the present embodiment, as described later, device supply unit 14 (electronic component supply unit) exists Shift action in X-direction mutually works with shift action of the device transfer head 17 (maintaining part 171) in the Y direction and in Z-direction, Transfer of the IC device 90 from the first inspection portion 16A to the second inspection portion 16B is carried out, but not limited to this.For example, being passed in device In the case where sending first 17 and can also moving in X direction, the device transfer head 17 can also be combined in X-direction, Y-direction and Z-direction On shift action, transfer of the Lai Jinhang IC device 90 from the first inspection portion 16A to the second inspection portion 16B.In addition, being omitted It, can also be in the case that device supply unit 14 and the first inspection portion 16A and the second inspection portion 16B can be moved in X direction respectively IC device 90 is carried out by combining the shift action and shift action of the device transfer head 17 in the Y direction and in Z-direction from the Transfer of the one inspection portion 16A to the second inspection portion 16B.

In addition, as shown in Fig. 2, electronic component check device 1 of the invention be have electronic component transmission device 10, And it is also equipped with the first inspection portion 16A (the first socket) and the second inspection portion 16B (for checking IC device 90 (electronic component) Two sockets) test macro (test system).I.e., electronic component check device 1 of the invention has: transport unit 25, passes Send the IC device 90 as electronic component；First inspection portion 16A is loaded for IC device 90 (electronic component), to IC component 90 (electronic components) carry out first and check；First area A3-1, the first inspection portion 16A are configured at first area A3-1；Second Inspection portion 16B is loaded for IC device 90 (electronic component), carries out being different from the first inspection to IC device 90 (electronic component) Second check；And second area A3-2, the second inspection portion 16B are configured at second area A3-2.In addition, transport unit 25 has Maintaining part 171, maintaining part 171 keep IC device 90 (electronic component) in the A3 of inspection area, it are successively placed in first Inspection portion 16A and the second inspection portion 16B.

Thus, it is possible to obtain the electronic component check device with electronic component transmission device 10 above-mentioned 1.Furthermore, it is possible to IC device 90 is sent to the first inspection portion 16A and the second inspection portion 16B, it therefore, can be in the first inspection portion 16A check the first of the IC device 90, check the second of the IC device 90 in the second inspection portion 16B.In addition, IC device 90 after being checked from the first inspection portion 16A and the second inspection portion 16B transmission.

In the following, the composition about each portion is described in detail.

As shown in Figure 1 and Figure 2, the electronic component check device 1 with electronic component transmission device 10 is to transmit for example As BGA (Ball Grid Array: ball grid array) encapsulation the electronic components such as IC device and its transmit Half-Time Survey, Test the device of the electrical characteristic of (referred to as " checking " merely below) electronic component.It should be noted that in the following, for the ease of Illustrate, is typically illustrated to the case where IC device is used as electronic component above-mentioned, as " IC device 90 ". IC device 90 is in tabular in the present embodiment.

In addition, other than device above-mentioned, such as can also enumerate " LSI (Large Scale as IC device Integration: large scale integrated circuit) ", " CMOS (Complementary MOS: complementary metal oxide semiconductor) ", " CCD (Charge Coupled Device: charge-coupled device) ", by " module obtained by multiple IC device blocks encapsulations IC ", " crystal device ", " pressure sensor ", " inertial sensor (acceleration transducer) ", " gyrosensor ", " fingerprint sensing Device " etc..

Electronic component check device 1 (electronic component transmission device 10) has pallet supply area A1, device supply Region A2 (supply area), inspection area A3, device recovery zone A4 (recovery zone) and pallet remove region A5, such as rear institute It states, these regions are divided by each wall portion.Also, IC device 90 removes region A5 from pallet supply area A1 to pallet Along arrow α₉₀Each region above-mentioned is successively passed through in direction, and the inspection area A3 in midway is checked.In this way, electronic component The first inspection portion 16A and second that check device 1 has electronic component transmission device 10, checked in the A3 of inspection area Inspection portion 16B and the control unit 800 being made of industrial computer, wherein electronic component transmission device 10 has transmission IC device 90 and make it via the transport unit 25 in each region.In addition to this, electronic component check device 1 is also equipped with monitor 300, signal lamp 400 and operation panel 700.

It should be noted that electronic component check device 1 will remove region A5 configured with pallet supply area A1, pallet A side, i.e. downside in Fig. 2 as face side, using the side configured with inspection area A3, i.e. upside in Fig. 2 as the back side Side come carry out using.

In addition, electronic component check device 1 is pre-loaded with replaced corresponding to the various species of IC device 90, quilt Referred to as the component of " test loaded tool " come carry out using.In the test loaded tool, the mounting component as mounting IC device 90 is for example There are temperature adjustment section 12, device supply unit 14, device recoverer (recoverer or electronic component recoverer) 18.In addition, in addition to Except such test loaded tool, as the component that the various species for corresponding to IC device 90 are replaced, such as there is user's preparation Pallet 200, recycling use pallet 19, the first inspection portion 16A and the second inspection portion 16B.

Pallet supply area A1 is the component for being supplied to the pallet 200 for the multiple IC devices 90 for being arranged with non-inspection state Supply unit.Pallet supply area A1, which can also be referred to as, can be laminated the loading area for loading multiple pallets 200.It should be noted that In the present embodiment, multiple recess portions (pouch-shaped portion) is configured with ranks shape in each pallet 200.It can be received one by one in each recess portion It receives, load IC device 90.

Device supply area A2 is will to distinguish from multiple IC devices 90 on the pallet 200 that A1 transmission in pallet supply area comes Transmission is supplied to the region of inspection area A3.It should be noted that with across pallet supply area A1's and device supply area A2 Mode is provided with the tray delivery mechanism 11A for transmitting pallet 200 in the horizontal direction one by one, tray delivery mechanism 11B.Pallet passes Sending mechanism 11A is a part of transport unit 25, pallet 200 can be made to Y together with the IC device 90 for being placed in the pallet 200 The positive side in direction, the arrow α i.e. in Fig. 2_11ADirection is mobile.Thus, it is possible to which IC device 90 is steadily sent into device supply area A2.In addition, tray delivery mechanism 11B can make arrow α of the empty pallet 200 into the negative side of Y-direction, i.e. Fig. 2_11BDirection is moved It is dynamic.Thus, it is possible to which empty pallet 200 is made to be moved to pallet supply area A1 from device supply area A2.

Temperature adjustment section (ソー Network プレート (English statement: soak plate, the Chinese is provided in the A2 of device supply area Language states (an example): temperature-uniforming plate)) 12, device transfer head 13 (supply head) and tray delivery mechanism 15.In addition, also be provided with The mobile device supply unit 14 of the mode of across device supply area A2 and inspection area A3.

Temperature adjustment section 12 loads multiple IC devices 90, referred to as can the IC device 90 to the mounting heat together Or cooling " temperature-uniforming plate ".By the temperature-uniforming plate, can check in advance by the first inspection portion 16A, the second inspection portion 16B IC device 90 before is heated or cooled, and is adjusted to the temperature suitable for the inspection (high temperature inspection, low temperature inspection).

Such temperature adjustment section 12 as mounting component is fixed.Thus, it is possible to steadily to the temperature adjustment section IC device 90 on 12 carries out temperature adjustment.

In addition, temperature adjustment section 12 is grounded (ground).

In composition shown in Fig. 2, temperature adjustment section 12 is configured, in the Y direction there are two fixations.In addition, passing through pallet Transport mechanism 11A is transferred into any one temperature adjustment section from the IC device 90 on the pallet 200 that pallet supply area A1 is sent into 12。

Device transfer head 13 is supported to can be in the A2 of device supply area in X direction and Y-direction is mobile, and then also It is supported to also move in z-direction.The device transfer head 13 is also a part of transport unit 25, can be responsible for from pallet 12 and of transmission and temperature adjustment section of IC device 90 between the pallet 200 that supply area A1 is sent into and temperature adjustment section 12 The transmission of IC device 90 between aftermentioned device supply unit 14.It should be noted that passing through arrow α in Fig. 2_13XDevice is shown The movement of part transfer head 13 in the X direction, passes through arrow α_13YThe movement of device transfer head 13 in the Y direction is shown.

As shown in Fig. 3~Figure 29, in the present embodiment, device transfer head 13 has in its underpart to be kept by adsorbing The maintaining part 131 of IC device 90.It should be noted that total configuration number, configuration about the maintaining part 131 in device transfer head 13 Form (in the X direction configured with several, in the Y direction configured with several) is not limited to situation shown in Fig. 3~Figure 29.? In the case where configured with multiple maintaining parts 131, distance between centers, the i.e. pitch being preferably configured as between these maintaining parts 131 can Become.

The mounting of device supply unit 14 has carried out the IC device 90 of temperature adjustment by temperature adjustment section 12, can be by the IC Device 90 is sent near the first inspection portion 16A and the second inspection portion 16B, referred to as " supply shuttle plate " or simple title For " supply shuttle ".Device supply unit 14 is also supported to move, and is a part of transport unit 25.The device supply unit 14 have the recess portion (mobile mounting portion) 141 for accommodating, loading IC device 90.

In addition, device supply unit 14 be supported to can between device supply area A2 and inspection area A3 in X direction, That is arrow α₁₄Direction moves back and forth (can move).Device supply unit 14 can steadily supply IC device 90 from device as a result, It is sent near the first inspection portion 16A and the second inspection portion 16B of inspection area A3 to region A2, in addition, in inspection area After IC device 90 is taken away by device transfer head 17 in A3, device supply area A2 can be again returned to.

As shown in Figure 30~Figure 42, in the present embodiment, recess portion (mobile mounting portion) 141 have (including) supplied along device The first recess portion (first the supplies mobile mounting portion) 141A being arranged side-by-side to the moving direction in portion 14, i.e. X-direction and the second recess portion (second supplies mobile mounting portion) 141B.First recess portion 141A and the second recess portion 141B is that the first recess portion 141A is configured at X-direction Negative side and the second recess portion 141B is configured at X-direction positive side.It should be noted that about the recess portion 141 in device supply unit 14 Total configuration number, configuration (in the X direction configured with several, in the Y direction configured with several) are not limited to Figure 30~figure Situation shown in 42.

In composition shown in Fig. 2, along Y-direction configuration, there are two device supply units 14, sometimes by the device of Y-direction negative side Supply unit 14 is referred to as " device supply unit 14A ", and the device supply unit 14 of Y-direction positive side is referred to as " device supply unit 14B ".In It is that the IC device 90 in temperature adjustment section 12 is transferred into device supply unit 14A in the A2 of device supply area or device supplies Give portion 14B.In addition, be similarly configured to can be to being placed in the device supply unit 14 for device supply unit 14 and temperature adjustment section 12 IC device 90 be heated or cooled.It, can accordingly, for the IC device 90 for having carried out temperature adjustment by temperature adjustment section 12 To be sent to inspection area A3 with maintaining its temperature adjustment state.In addition, device supply unit 14 is also same as temperature adjustment section 12 Ground is grounded.

In this way, transport unit 25 has device supply unit 14, which is supported to be moved, and has and carry Set the recess portion (mobile mounting portion) 141 of IC device 90 (electronic component).Then, as described later, the device supply unit 14 is dynamic Make the movement with device transfer head 17 mutually to work, can swimmingly carry out IC device 90 and be examined from the first inspection portion 16A to second Look into the transfer (transhipment) (referring for example to Fig. 3~Figure 29) of portion 16B.

In addition, being provided with the stop position in device supply unit 14 in the A2 of device supply area as shown in Figure 30~Figure 42 Set the posture detecting part 26 for detecting the posture (hanging) for the IC device 90 for being placed in recess portion 141.Posture detecting part 26 has by energy Enough issue light L26 light emitting diode constitute illumination region 261 and relative to illumination region 261 be configured at Y-direction positive side, The acceptance part 262 that photodiode by that can receive light L26 is constituted, they are configured to and the first recess portion 141A and the second recess portion 141B is accordingly configured with two groups.

For example, as shown in figure 31, the IC device 90 in the first recess portion 141A is not put down relative to XY by accurately mounting, i.e. In the inclined situation in face, the light L26 from illumination region 261 can be received by acceptance part 262.Detecting acceptance part 262 In by light when, control unit 800 thinks that the posture of the IC device 90 in the first recess portion 141A is accurate, can make device supply unit 14 It is moved to inspection area A3.On the other hand, when the IC device 90 in the first recess portion 141A is tilted relative to X/Y plane, from The light L26 of illumination region 261 does not have light in acceptance part 262 by 90 shading of IC device.Be not detected in acceptance part 262 by Light time, control unit 800 think that the IC device 90 in the first recess portion 141A tilts, and can be somebody's turn to do for example, by reports such as monitors 300 Situation.In addition, in this case, the movement without device supply unit 14 to inspection area A3.

It, can be in addition, posture detecting part 26 is for example when IC device 90 is placed in recess portion 141 with appropriate posture It prevents from being further overlapped mounting others IC device 90 on the IC device 90.

Tray delivery mechanism 15 is the empty pallet 200 for the state that will eliminate whole IC devices 90 in device supply area To the positive side of X-direction, i.e. arrow α in A2₁₅The mechanism of direction transmission.Then, after the transmission, empty pallet 200 passes through support Disk transport mechanism 11B returns to pallet supply area A1 from device supply area A2.

Inspection area A3 is the region for checking IC device 90.It is provided in the A3 of the inspection area and IC device 90 is examined The the first inspection portion 16A and the second inspection portion 16B and device transfer head 17 looked into.

Device transfer head 17 is a part of transport unit 25, and being similarly configured to temperature adjustment section 12 can be to holding IC device 90 is heated or cooled.As shown in Fig. 3~Figure 29, device transfer head 17 has in its underpart to be kept by adsorbing The maintaining part 171 of IC device 90.In the present embodiment, maintaining part 171 have (including) along device supply unit 14 (recess portion (move Dynamic mounting portion) 141) moving direction, i.e. X-direction the first maintaining part 171A and the second maintaining part 171B that are arranged side-by-side.First Maintaining part 171A and the second maintaining part 171B is that the first maintaining part 171A is configured at X-direction negative side and the second maintaining part 171B matches It is placed in X-direction positive side.Then, the first maintaining part 171A and the second maintaining part 171B can keep maintaining the temperature adjustment shape The IC device 90 of state transmits IC device 90 in the case where maintaining the temperature adjustment state in the A3 of inspection area.

It should be noted that device transfer head 17 is preferably configured as in the first maintaining part 171A and the second maintaining part 171B Distance, i.e. pitch is variable in the heart.

In addition, (being configured in the X direction about total configuration number of the maintaining part 171 in device transfer head 17, configuration It is several, in the Y direction configured with several) be not limited to situation shown in Fig. 3~Figure 29.

Such device transfer head 17 is supported to move back and forth in the A3 of inspection area along Y-direction and Z-direction, It is known as a part of the mechanism of " index arm (index arm) ".Device transfer head 17 can be since device drainage area as a result, The device supply unit 14 that domain A2 is sent into picks up IC device 90, and transmits, is placed on the first inspection portion 16A or the second inspection portion 16B On.

It should be noted that passing through arrow α in Fig. 2_17YThe reciprocating movement of device transfer head 17 in the Y direction is shown. In addition, device transfer head 17 is supported to move back and forth along Y-direction, but not limited to this, can also be supported to also It can move back and forth in X direction.

In addition, in the present embodiment, along Y-direction configuration, there are two device transfer head 17 (referring to Fig. 2).In the following, sometimes The device transfer head 17 of Y-direction negative side is referred to as " device transfer head 17A ", the device transfer head 17 of Y-direction positive side is referred to as " device Part transfer head 17B ".Device transfer head 17A can be responsible for IC device 90 from device supply unit 14A to first in the A3 of inspection area The transmission of inspection portion 16A or the second inspection portion 16B, device transfer head 17B can be responsible in the A3 of inspection area IC device 90 from Transmission of the device supply unit 14B to the first inspection portion 16A or the second inspection portion 16B.In addition, device transfer head 17A can examined It looks into and is responsible for transmission of the IC device 90 from the second inspection portion 16B to device recoverer 18A in the A3 of region, device transfer head 17B can It is responsible for transmission of the IC device 90 from the second inspection portion 16B to device recoverer 18B in the A3 of inspection area.

First inspection portion 16A can be loaded for IC device 90 (electronic component), to the IC device 90 (electronic component) into Row checks that the first of electrical characteristic checks.First inspection portion 16A is configured at the first area A3- being arranged in the A3 of inspection area 1, it is fixed in the manner of easily disassemble.The dismounting can for example be realized by using bolt.In addition, the first inspection portion 16A is connect with the first tester 900A.Then, the program stored in the inspection control unit being had based on the first tester 900A come First is carried out to check.

Second inspection portion 16B can be loaded for IC device 90 (electronic component), be carried out to IC device 90 (electronic component) Check that the second of the electrical characteristic different from the first inspection checks.Second inspection portion 16B is configured to be set in the A3 of inspection area It is set to the second area A3-2 adjacent with the X-direction positive side of first area A3-1, is fixed in the manner of easily disassemble.This is torn open It fills also in the same manner as the dismounting of the first inspection portion 16A, such as can be carried out by using bolt.In addition, the second inspection portion 16B It is connect with the second tester 900B.Then, the program stored in the inspection control unit being had based on the second tester 900B come into Row second checks.

In addition, the first inspection portion 16A and the second inspection portion 16B can turn to a structural body and temperature adjustment section with unit 12 are similarly heated or cooled IC device 90, which is adjusted to the temperature suitable for checking.

As shown in Fig. 3~Figure 42, the first inspection portion 16A and the second inspection portion 16B are respectively provided with receiving, mounting IC device 90 recess portion (pouch-shaped portion) 161 is provided with multiple probes (not shown) in the inside of the recess portion 161.Then, pass through IC device 90 Terminal and probe by can it is conductive in a manner of connect, i.e. contact, so as to carry out the inspection for IC device 90.It needs Bright, the first inspection portion 16A and the second inspection portion 16B distinguish in the present embodiment with a recess portion 161, but about Total configuration number of recess portion 161, configuration (in the X direction configured with several, in the Y direction configured with several), do not limit Situation shown in Fig. 3~Figure 42.

The first inspection portion 16A and the second inspection portion 16B in this way can use an electronic component inspection dress It sets 1 pair of IC device 90 and carries out two kinds of inspections.

It should be noted that being checked as first, the second inspection is not particularly limited, such as can enumerate IC device The continuity test of circuit in part 90, resistance value inspection of circuit in IC device 90 etc..In this case, continuity test and Resistance value inspection is the inspection different from each other of the scope of examination, the inspection item.

In addition, electronic component check device 1 can also be also equipped with carry out check with first inspection, the second inspection it is different The part of the third inspection of electrical characteristic, the 4th inspection etc..

Device recovery zone A4 is to recycle multiple IC devices 90 that its inspection is examined and finished in the A3 of inspection area Region.Recycling pallet 19, device transfer head 20 (recycling head) and pallet is provided in the A4 of the device recovery zone to pass Send mechanism 21.In addition, being additionally provided with the device recoverer 18 moved in a manner of across inspection area A3 and device recovery zone A4.Separately Outside, free pallet 200 is also prepared in the A4 of device recovery zone.

Device recoverer 18 loads the IC device 90 for finishing to check, which is sent to device recovery zone A4 is referred to as " recycling shuttle plate " or is referred to simply as " recycling shuttle ".Device recoverer 18 is also transport unit 25 A part.The device recoverer 18 has the recess portion (pouch-shaped portion) 181 for accommodating, loading IC device 90.

In addition, device recoverer 18 be supported to can between inspection area A3 and device recovery zone A4 in X direction, That is arrow α₁₈Direction moves back and forth.IC device 90 can be steadily sent to by device recoverer 18 from inspection area A3 as a result, Device recovery zone A4, in addition, after IC device 90 is taken away by device transfer head 20 in the A4 of device recovery zone, it can be again Back to inspection area A3.

As shown in Figure 30~Figure 42, in the present embodiment, recess portion 181 has (including) moving along device recoverer 18 The the first recess portion 181A (first recycles mobile mounting portion) and the second recess portion 181B (the second recycling that direction, i.e. X-direction are arranged side-by-side Mobile mounting portion).First recess portion 181A and the second recess portion 181B is that the first recess portion 181A is configured at X-direction negative side and second is recessed Portion 181B is configured at X-direction positive side.It should be noted that total configuration number, configuration about the recess portion 181 in device recoverer 18 Form (in the X direction configured with several, in the Y direction configured with several) is not limited to situation shown in Figure 30~Figure 42.

In composition shown in Fig. 2 and device supply unit 14 similarly, along Y-direction configuration there are two device recycling 18, have When by the device recoverer 18 of Y-direction negative side be referred to as " device recoverer 18A ", the device recoverer 18 of Y-direction positive side is referred to as " device recoverer 18B ".Then, the IC device 90 on the second inspection portion 16B is transmitted, is placed in device recoverer 18A or device Part recoverer 18B.In addition, device recoverer 18 is also grounded in the same manner as temperature adjustment section 12, device supply unit 14.

In addition, device recoverer 18 is linked by linking part 27 and device supply unit 14.I.e., device recoverer 18A passes through Linking part 27 and device supply unit 14A link, and device recoverer 18B is linked by linking part 27 and device supply unit 14B.By This, device supply unit 14A and device recoverer 18A can be moved integrally in same direction, and device supply unit 14B and device return Receipts portion 18B can be moved integrally in same direction.

In addition, in the present embodiment, being supplied in the union body of device supply unit 14A and device recoverer 18A and device The first inspection above-mentioned portion 16A and the second inspection portion 16B is configured between portion 14B and the union body of device recoverer 18B.

Recycling pallet 19 loads the IC device 90 checked, with the side that will not be moved in the A4 of device recovery zone Formula and fix.Even the device recovery zone A4 as a result, more configured with various movable parts such as device transfer heads 20, It can be in recycling with steadily loading the IC device 90 checked on pallet 19.It should be noted that composition shown in Fig. 2 In, there are three recycling is configured in X direction with pallet 19.

In addition, empty pallet 200 is also there are three configurations in X direction.The pallet 200 of the sky also loads the IC checked Device 90.Then, the mobile IC device 90 come on the device recoverer 18 of device recovery zone A4 is transmitted, is placed in recycling On either in the pallet 200 of pallet 19 and sky.Each inspection result is corresponded to as a result, to classify to IC device 90, return It receives.

Device transfer head 20 is supported to can be in the A4 of device recovery zone in X direction and Y-direction is mobile, and also It is supported to also move along Z-direction.The device transfer head 20 is a part of transport unit 25, can be by IC device 90 from device Part recoverer 18 is sent to recycling pallet 19, empty pallet 200.It should be noted that passing through arrow α in Fig. 2_20XIt shows The movement of device transfer head 20 in the X direction, passes through arrow α_20YThe movement of device transfer head 20 in the Y direction is shown.

As shown in Fig. 3~Figure 29, in the present embodiment, device transfer head 20 has in its underpart to be kept by adsorbing The maintaining part 201 of IC device 90.It should be noted that total configuration number, configuration about the maintaining part 201 in device transfer head 20 Form (in the X direction configured with several, in the Y direction configured with several) is not limited to situation shown in Fig. 3~Figure 29.? In the case where configured with multiple maintaining parts 201, be preferably configured as these mutual distances between centers of maintaining part 201, i.e. pitch can Become.

Tray delivery mechanism 21 is the pallet 200 for the sky that will be sent into from pallet removal region A5 in the A4 of device recovery zone To X-direction, i.e. arrow α₂₁The mechanism of direction transmission.Then, after the transmission, empty pallet 200 is configured in recycling IC device That is, the position of part 90, can become any of three above-mentioned empty pallets 200.

Pallet removal region A5 is to be arranged with to check that the pallet 200 for the multiple IC devices 90 for finishing state is recovered, removes Removal portion.Multiple pallets 200 can have been piled up in pallet removal region A5.

In addition, being provided with pallet 200 in a manner of across device recovery zone A4 and pallet removal region A5 one by one along the side Y Tray delivery mechanism 22A, tray delivery mechanism 22B to transmission.Tray delivery mechanism 22A is a part of transport unit 25, can So that pallet 200 is along Y-direction, i.e. arrow α_22ADirection moves back and forth.Thus, it is possible to which the IC device 90 that finishes will be checked from device Recovery zone A4 is sent to pallet removal region A5.In addition, tray delivery mechanism 22B can be used in the sky of recycling IC device 90 Pallet 200 to the positive side of Y-direction, i.e. arrow α_22BDirection is mobile.Thus, it is possible to which empty pallet 200 is made to remove region from pallet A5 is moved to device recovery zone A4.

Control unit 800 for example can control tray delivery mechanism 11A, tray delivery mechanism 11B, temperature adjustment section 12, device Part transfer head 13, device supply unit 14, tray delivery mechanism 15, the first inspection portion 16A, the second inspection portion 16B, device transfer head 17, device recoverer 18, device transfer head 20, tray delivery mechanism 21, tray delivery mechanism 22A and tray delivery mechanism The movement in each portion such as 22B.

The control unit 800 can both be built in electronic component check device 1 (electronic component transmission device 10), can also To be set to the external equipments such as external computer.The external equipment for example exists to be filled by cable etc. and electronic component inspection The case where the case where setting 1 communication and electronic component check device 1 wirelessly communicate passes through network (such as internet) and electronics The case where component check device 1 connects etc..

It should be noted that as shown in Fig. 2, in the present embodiment, control unit 800 has at least one processor 801 (at least one processor) and at least one processor 802 (referring to Fig. 2).Processor 801 can read in storage In the various information (for example, judgement program, instruction/order program etc.) of memory 802, judgement, instruction (order) are executed.

Operator can pass through monitor 300 or setting or the operation condition etc. of confirmation electronic component check device 1. The monitor 300 is configured at electronic component check device 1 for example with the display picture 301 being made of liquid crystal panel Front upper lateral part.As shown in Figure 1, right side is provided with the Mouse table 600 of mounting mouse in the figure of pallet removal region A5.The mouse It is marked on use when operating to picture shown by monitor 300.

In addition, being configured with operation panel 700 in the lower right of Fig. 1 for monitor 300.Operation panel 700 with Order electronic component check device 1 carries out desired movement to monitor 300 respectively.

In addition, signal lamp 400 can report the movement of electronic component check device 1 by the combination of luminous color State etc..Signal lamp 400 is configured at the top of electronic component check device 1.It should be noted that loudspeaker 500 is built in In electronic component check device 1, the movement shape of electronic component check device 1 can also be reported by the loudspeaker 500 State etc..

In electronic component check device 1, supplied by 231 segmented tray supply area A1 of the first spaced walls and device Between the A2 of region, is separated between device supply area A2 and inspection area A3 by the second spaced walls 232, pass through third spaced walls 233 separate between inspection area A3 and device recovery zone A4, separate device recovery zone A4 and support by the 4th spaced walls 234 Disk removes between the A5 of region.In addition, between device supply area A2 and device recovery zone A4 also by the 5th spaced walls 235 every It opens.

The most external (most exterior) of electronic component check device 1 is covered by cover, the cover for example have front cover 241, Side cover 242, side cover 243, rear cover 244, top cover 245.

It is checked as previously mentioned, IC device 90 carries out first in the first inspection portion 16A, carries out second in the second inspection portion 16B It checks.At this point, IC device 90 is transferred (carrying) to the second inspection portion 16B from the first inspection portion 16A.Therefore, referring to Fig. 3~figure 42 pairs are illustrated IC device 90 from the movement that the first inspection portion 16A is transferred to the second inspection portion 16B.In the following, will first be turned The IC device 90 of shifting referred to as " IC device 90A ", the IC device 90 being transferred by after are known as " IC device 90B ".In addition, device transmits Head 17A, device supply unit 14A and device recoverer 18A and device transfer head 17B, device supply unit 14B and device recoverer 18B is identical composition, is able to carry out identical movement, therefore below with device transfer head other than configuration position is different 17B, device supply unit 14B and device recoverer 18B are as representative.

As shown in figure 3, IC device 90A is kept by the maintaining part 131 of device transfer head 13.In addition, device supply unit 14B exists Stop in the A2 of device supply area, is located at its whole, i.e. first recess portion 141A and the second recess portion 141B and exposes in device drainage area Position in the A2 of domain.Then, the IC device 90A that device transfer head 13 is kept, which becomes, is configured at the first of device supply unit 14B State above recess portion 141A.

In addition, device supply unit 14B, device recoverer 18B, first check as shown in Figure 30 (about Fig. 3 and same) It is the empty state for not loading IC device 90 on portion 16A, the second inspection portion 16B.

Then, as shown in figure 4, device transfer head 13 in the state of remain IC device 90A to device supply unit 14B's First recess portion 141A decline (mobile to Z-direction negative side).Thus, it is possible to by IC device 90A mounting (receiving) in the first recess portion In 141A.

Then, as shown in figure 5, device transfer head 13 decontrol for IC device 90A hold mode and rising (to Z-direction Positive side is mobile).Device transfer head 13 can be separated with IC device 90A as a result,.

In addition, as shown in figure 31, being placed in the first recess portion 141A as previously mentioned by the detection of posture detecting part 26 The posture of IC device 90A.In the state of shown in the Figure 31, acceptance part 262 receives the light L26 from illumination region 261.? In this case, it is believed that the posture of the IC device 90A in the first recess portion 141A is appropriate (accurate), can make device by next movement Part supply unit 14B is moved to inspection area A3.

Then, as shown in fig. 6, device supply unit 14B is moved to inspection area A3 (X-direction positive side), stop later.It needs Illustrate, the stop position of device supply unit 14B is the position of the first recess portion 141A of device supply unit 14B in the X direction The position of the recess portion 161 of (X-coordinate at the center of the first recess portion 141A) and the first inspection portion 16A in the X direction be (recess portion 161 The X-coordinate at center) identical position.As a result, as shown in figure 32, the IC device in the A3 of inspection area, in the first recess portion 141A 90A is the state for being located at Y-direction positive side relative to the recess portion 161 of the first inspection portion 16A.In addition, in the state of shown in Fig. 6, The first maintaining part 171A of device transfer head 17B is located at the top of the first recess portion 141A of device supply unit 14B, device transfer head The second maintaining part 171B of 17B is located at the top of the second recess portion 141B of device supply unit 14B.

Then, as shown in fig. 7, device transfer head 17B declines, stop later.It should be noted that device transfer head 17B Stop position be the position that is abutted with the IC device 90A in the first recess portion 141A of device supply unit 14B the first maintaining part 171A It sets.Then, in the state that device transfer head 17B stops, the first maintaining part 171A keeps the IC device in the first recess portion 141A 90A。

Then, as shown in figure 8, device transfer head 17B in the case where maintain the hold mode for IC device 90A on It rises.Device transfer head 17B can pick up IC device 90A as a result, keep the first of IC device 90A disengaging device supply unit 14B recessed Portion 141A.Moreover it is preferred that during this period, in the A2 of device supply area, device transfer head 13 is to next IC to be kept Device 90B is mobile.

Then, as shown in figure 9, device transfer head 17B in the state of remain IC device 90A to the first inspection portion 16A Recess portion 161 it is mobile.It then,, can be by IC device 90A in its mobile destination as shown in Figure 33 (about Fig. 9 and same) Compress, be placed in the recess portion 161 of the first inspection portion 16A.Thus, it is possible to checked for the first of IC device 90A.In addition, As shown in figure 9, in the A2 of device supply area, device transfer head 13 in the state of remain IC device 90B, with Fig. 3 institute It is standby on the identical position of device transfer head 13 shown.

Then, as shown in Figure 10, device supply unit 14B is returned to device supply area A2 (X-direction negative side) is mobile, later Stop.It should be noted that the stop position of device supply unit 14B is position identical with device supply unit 14B shown in Fig. 3 It sets.In addition, during this period, also continuing with and being checked for the first of IC device 90A.

Then, as shown in figure 11, device transfer head 13 is in the state of remain IC device 90B to device supply unit 14B The first recess portion 141A decline.Thus, it is possible to which IC device 90B is placed in the first recess portion 141A.

Then, as shown in figure 12, device transfer head 13 decontrols the hold mode for IC device 90B and rising.Device as a result, Part transfer head 13 can be separated with IC device 90B.

It should be noted that completing and being checked for the first of IC device 90A in the state of shown in Figure 12.Therefore, device Part transfer head 17B can leave the first inspection portion 16A in the state of remain IC device 90A.Then, the device transfer head 17B is standby on position identical with device transfer head 17B shown in fig. 6.

In addition, as shown in figure 34, the appearance for being placed in the IC device 90B of the first recess portion 141A is detected by posture detecting part 26 Gesture.In the state of shown in the Figure 34, the light L26 from illumination region 261 is received in acceptance part 262.In this case, Think that the posture of the IC device 90B in the first recess portion 141A is appropriate, device supply unit 14B can be made to be moved to by next movement Inspection area A3.

Then, as shown in figure 13, device supply unit 14B is moved to inspection area A3, stops later.It should be noted that The stop position of device supply unit 14B is position (the second recess portion of the second recess portion 141B of device supply unit 14B in the X direction The X-coordinate at the center of 141B) (X at the center of recess portion 161 is sat with the recess portion 161 of the first inspection portion 16A position in the X direction Mark) identical position.

Then, as shown in figure 14, device transfer head 17B declines, and stops later.It should be noted that device transfer head 17B Stop position be that the IC device 90A that the first maintaining part 171A is kept is placed in the second recess portion of device supply unit 14B Position in 141B.

Then, as shown in figure 15, device transfer head 17B decontrols the first maintaining part 171A for the holding shape of IC device 90A State simultaneously rises.Device transfer head 17B can be separated with IC device 90A as a result,.At this point, such as Figure 35 (about Figure 15 and same) Shown, device supply unit 14B is placed in the first recess portion 141A as IC device 90B and IC device 90A is placed in the second recess portion State in 141B.

Then, as shown in figure 16, the mobile return device supply area A2 of device supply unit 14B, stops later.It needs to illustrate , the stop position of device supply unit 14B is position identical with device supply unit 14B shown in Fig. 3.

In addition, as shown in figure 36, by posture detecting part 26 detect the first recess portion 141A in IC device 90B posture with And the posture of the second IC device 90A in recess portion 141B.In the state of shown in the Figure 36, receive to come in acceptance part 262 From in the light L26 of illumination region 261.In this case, the posture and the second recess portion of the IC device 90B in the first recess portion 141A The posture of IC device 90A in 141B is appropriate, device supply unit 14B can be made to be moved to inspection area by next movement A3。

Then, as shown in figure 17, device supply unit 14B is moved to inspection area A3, stops later.It should be noted that The stop position of device supply unit 14B is position identical with the position of device supply unit 14B shown in fig. 6.As a result, such as Figure 37 It is shown, become in the A3 of inspection area, recess portion 161 of the IC device 90B in the first recess portion 141A relative to the first inspection portion 16A IC device 90A in Y-direction positive side, the second recess portion 141B is located at Y-direction relative to the recess portion 161 of the second inspection portion 16B The state of positive side.

Then, as shown in figure 18, device transfer head 17B declines, and stops later.It should be noted that device transfer head 17B Stop position be that the first maintaining part 171A is abutted and with the IC device 90B in the first recess portion 141A of device supply unit 14B The position that two maintaining part 171B are abutted with the IC device 90A in the second recess portion 141B of device supply unit 14B.Then, in device In the state that transfer head 17B stops, the first maintaining part 171A keeps the IC device 90B in the first recess portion 141A, and second protects Hold the IC device 90A in the second recess portion 141B of portion 171B holding.

Then, as shown in figure 19, device transfer head 17B is maintaining the holding shape for IC device 90A and IC device 90B Rise in the case where state.Device transfer head 17B picks up IC device 90A and IC device 90B as a result, and IC device 90B can be made de- From the first recess portion 141A, and IC device 90A can be made to be detached from the second recess portion 141B.

Then, as shown in figure 20, device transfer head 17B is in the state of remain IC device 90A and IC device 90B, It is mobile to the first inspection portion 16A and the second inspection portion 16B.Then, in its mobile destination, as Figure 38 (about Figure 20 and Shown in equally), IC device 90B can be compressed to, is placed in the recess portion 161 of the first inspection portion 16A, and it is possible to by IC device 90A compresses, is placed in the recess portion 161 of the second inspection portion 16B.Thus, it is possible to carry out checking for the first of IC device 90B together And it is checked for the second of IC device 90A.

Then, after checking the first of IC device 90B and being respectively completed to the second inspection of IC device 90A, such as Shown in Figure 21, device recoverer 18B is carried out mobile and is located in the A3 of inspection area.On the position, in device recoverer 18B In, the position (X-coordinate at the center of the first recess portion 181A) of the first recess portion 181A in the X direction is recessed with the first inspection portion 16A's The position (X-coordinate at the center of recess portion 161) of portion 161 in the X direction is identical, the position (of the second recess portion 181B in the X direction The X-coordinate at the center of two recess portion 181B) position (center of recess portion 161 with the recess portion 161 of the second inspection portion 16B in the X direction X-coordinate) it is identical.

In addition, at this moment, device transfer head 17B keeps the recess portion 161 that IC device 90B is pressed against to the first inspection portion 16A, incites somebody to action IC device 90A is pressed against the recess portion 161 of the second inspection portion 16B.

Then, as shown in figure 22, device transfer head 17B in the state of remain IC device 90A and IC device 90B on It rises.IC device 90B is separated with the first inspection portion 16A as a result, and IC device 90A is separated with the second inspection portion 16B.Later, device Transfer head 17B is standby in position identical with device transfer head 17B shown in fig. 6.

Then, as shown in figure 23, device transfer head 17B declines, and stops later.It should be noted that device transfer head 17B Stop position be that the IC device 90B that the first maintaining part 171A is kept is placed in the first recess portion of device recoverer 18B The IC device 90A that 181A is interior, the second maintaining part 171B is kept is placed in the second recess portion 181B of device recoverer 18B Position.

Then, as shown in figure 24, device transfer head 17B is in the first maintaining part 171A of maintenance to the holding shape of IC device 90B Hold mode and rising of the second maintaining part 171B to IC device 90A are decontroled in the case where state.Device transfer head 17B can as a result, To be separated with IC device 90A.At this point, device recoverer 18B is IC device 90A as shown in Figure 39 (about Figure 24 and same) The state being placed in the second recess portion 181B.

Then, as shown in figure 25, device recoverer 18B is moved to device recovery zone A4 (X-direction positive side), Zhi Houting Only.On the position, its whole, i.e. first recess portion 181A and the second recess portion 181B of device recoverer 18B exposes recycles in device In the A4 of region.As a result, as shown in Figure 40 (about Figure 25 and same), the IC device 90A in the second recess portion 181B is configured in Device recovery zone A4.In addition, the maintaining part 201 of device transfer head 20 is located at the second recess portion in the A4 of device recovery zone The top of 181B (IC device 90A).

Then, as shown in figure 26, device transfer head 20 declines, and stops later.It should be noted that device transfer head 20 Stop position is to maintain the position that portion 201 is abutted with the IC device 90A in the second recess portion 181B of device recoverer 18B.Then, In the state that device transfer head 20 stops, maintaining part 201 keeps the IC device 90A in the second recess portion 181B.

Then, as shown in figure 27, device transfer head 20 in the case where maintain the hold mode for IC device 90A on It rises.Device transfer head 20 can pick up IC device 90A as a result, keep the second of IC device 90A disengaging device recoverer 18B recessed Portion 181B.At this point, device supply unit 14B, device recoverer 18B, first check as shown in Figure 41 (about Figure 27 and same) It is the state for not being placed with IC device 90A, IC device 90B in portion 16A, the second inspection portion 16B.

Then, as shown in figure 28, device supply unit 14B is moved, and is stopped later.It should be noted that device supplies The stop position of portion 14B is the position of the second recess portion 141B of device supply unit 14B in the X direction (in the second recess portion 141B The X-coordinate of the heart) it is identical with the position (X-coordinate at the center of recess portion 161) of the recess portion 161 of the first inspection portion 16A in the X direction Position.

Then, as shown in figure 29, device transfer head 17B declines, and stops later.It should be noted that device transfer head 17B Stop position be that the IC device 90B that the first maintaining part 171A is kept is placed in the second recess portion of device supply unit 14B Position in 141B.At this point, device supply unit 14B becomes IC device 90B and is carried as shown in Figure 42 (about Figure 29 and same) The state being placed in the second recess portion 141B.

Then, about for transfer action after IC device 90B and above-mentioned for after IC device 90A Transfer action (movement after Figure 15) is same.

However, in the prior art, when carrying out the first inspection and the second inspection to IC device 90, having prepared two electronics Component check device.First is connected in an electronic component check device in the two electronic component check devices The tester of inspection is connected with the tester of the second inspection in another electronic component check device.Then, operator Member in one electronic component check device first checked after, by first check the IC device 90 that finishes from One electronic component check device is moved to another described electronic component check device, in another electronics member Second is carried out in device inspection apparatus to check.Therefore, many and diverse for the inspection operation of IC device 90, to the since checking first Two have checked and have spent a large amount of time.

In view of this, in electronic component check device 1 (electronic component transmission device 10), device transfer head 17 Maintaining part 171 can keep IC device 90 and the IC device 90 is successively placed in the first inspection portion 16A and the second inspection portion 16B.It is checked thus, it is possible to carry out the first inspection and second to IC device 90 by an electronic component check device 1, because This, may be implemented the fast of the inspection operation to IC device 90.

In addition, the second inspection portion 16B is second as previously mentioned, the first inspection portion 16A is fixed in the A3-1 of first area It is fixed in the A3-2 of region.In addition, device transfer head 17 (maintaining part 171) is supported to, along device supply unit 14, (recess portion is (mobile Mounting portion) 141) moving direction, the Y-direction intersected with X-direction be mobile.Then, the maintaining part 171 of the device transfer head 17 IC device 90 (electronic component) can successively be loaded from moveable device supply unit 14 (recess portion (mobile mounting portion) 141) In fixed first inspection portion 16A, moveable device supply unit 14 (recess portion (mobile mounting portion) 141), fixed the Two inspection portion 16B.

In this way, the movement of device supply unit 14 and the movement of device transfer head 17 are mutual in electronic component check device 1 It works, can swimmingly carry out shifting (transhipment) IC device 90 from the first inspection portion 16A to the second inspection portion 16B.Though in addition, It so also depends on the mechanical of electronic component check device 1 to constitute, but is filled in the electronic component inspection for using existing composition In the case where setting 1, such as by changing software, can carry out IC device 90 from the first inspection portion 16A to the second inspection portion 16B Transfer action.

In addition, as previously mentioned, recess portion (mobile mounting portion) 141 includes along (the recess portion (mobile mounting portion) of device supply unit 14 141) (the second supply moves the first recess portion (first the supplies mobile mounting portion) 141A and the second recess portion that moving direction is arranged side-by-side Dynamic mounting portion) 141B.In addition, the maintaining part 171 of device transfer head 17 includes along (the recess portion (mobile mounting portion) of device supply unit 14 141) the first maintaining part 171A and the second maintaining part 171B that moving direction is arranged side-by-side.

As previously mentioned, the first maintaining part 171A can from the first recess portion, (first be supplied by IC device 90 (electronic component) Mobile mounting portion) 141A is successively placed in the first inspection portion 16A, the second recess portion (second supplies mobile mounting portion) 141B.

It on the other hand, can be then relative to the first maintaining part 171A the second maintaining part 171B for being configured at X-direction positive side The mounting of first maintaining part 171A acts, by IC device 90 (electronic component) from the second recess portion (the second mobile mounting portion) 141B It is placed in the second inspection portion 16B.

By such composition, device supply unit is rearranged in the A2 of device supply area with such as device transfer head 13 The configuration of IC device 90 (IC device 90A, IC device 90B) on 14 simultaneously makes the device supply unit 14 be moved to inspection area A3 Come carry out the first inspection with second check when compare, IC device 90 can be shortened from the first inspection portion 16A and be moved to the second inspection The time of portion 16B.It is checked thus, it is possible to promptly carry out first and check with second.

In addition, in the case where the first result checked of IC device 90A is judged as " no (bad) ", the IC device 90A can also be placed in the second inspection portion 16B, but omit and carry out the second inspection.It should be noted that the of IC device 90A In the case that one result checked is judged as "No", it also can be omitted to the second inspection portion 16B and load IC device 90A.

In addition, for IC device 90 above-mentioned from the first inspection portion 16A into the transfer action of the second inspection portion 16B The case where two IC device 90 (IC device 90A, IC device 90B) of transfer, is illustrated parallel, and but not limited to this, is turning It can also be applied when moving an IC device 90.In such a case, it is possible to omit the movement of the transfer about IC device 90B.Make For the movement of the transfer about IC device 90B, such as there is device supply unit 14 shown in Fig. 10 to be moved to device supply area A2 Movement, device transfer head 13 shown in Figure 11 IC device 90B is placed in movement and Figure 18~figure of device supply unit 14 The movement etc. that device transfer head 17 shown in 29 goes up and down IC device 90B.

In addition, detecting the posture of IC device 90 by posture detecting part 26 in Figure 31, Figure 34, Tu36Zhong, but do not limit In this, such as it also can be omitted the posture detection.In such a case, it is possible to omit to carry out posture detection and device supplies Portion 14B is back to device supply area A2.

In addition, device transfer head 13 can also be after being placed in device supply unit 14B for IC device 90B, i.e., in Figure 12 Shown in after state, also holding others IC device 90.In this case, other IC device 90 also successively carries out One checks, second checks.

In the following, referring to Figure 43 to the second of electronic component transmission device and electronic component check device of the invention Embodiment is illustrated, but is illustrated around the difference with aforementioned embodiments, and then the description thereof will be omitted for identical item.

Present embodiment in addition to the first inspection portion recess portion configuration number and the second inspection portion recess portion configuration number not It is identical as foregoing first embodiment with except.

As shown in figure 43, in the present embodiment, the first inspection portion 16A has two recess portions being arranged side-by-side along Y-direction 161.In the following, the recess portion 161 of Y-direction negative side is known as " recess portion 161A ", the recess portion 161 of Y-direction positive side is known as " recess portion 161B".Second inspection portion 16B also has two recess portions 161 being arranged side-by-side along Y-direction.In the following, by the recess portion of Y-direction negative side 161 are known as " recess portion 161C ", the recess portion 161 of Y-direction positive side are known as " recess portion 161D ".In this way, in the present embodiment, first There are four the recess portion 161 of the recess portion 161 of inspection portion 16A and the second inspection portion 16B configure in total.In this case, device Total configuration number, the configuration for the maintaining part 171 that transfer head 17 has are it is also preferred that the recess portion 161 with present embodiment is corresponding.

By constituting as described above, such as (the electronic component transmission device of electronic component check device 1 may be implemented 10) raising of handling capacity (the transmission number of IC device 90 per unit time).

It should be noted that the distance between centers (pitch) and recess portion 161C and recess portion of recess portion 161A and recess portion 161B The distance between centers (pitch) of 161D constituted shown in Figure 43 in be it is identical, but not limited to this, is also possible to difference 's.

In addition, recess portion 161A and the distance between centers (pitch) of recess portion 161C and the center of recess portion 161B and recess portion 161D Between distance (pitch) constituted shown in Figure 43 in be it is identical, but not limited to this, is also possible to different.

In addition, total configuration number of the recess portion 161 about the first inspection portion 16A, configuration are not limited to shown in Figure 43 The case where.

In addition, total configuration number of the recess portion 161 about the second inspection portion 16B, configuration are not limited to shown in Figure 43 The case where.

In the following, referring to Figure 44 to the third of electronic component transmission device and electronic component check device of the invention Embodiment is illustrated, but is illustrated around the difference with aforementioned embodiments, and then the description thereof will be omitted for identical item.

Present embodiment is in addition to movement difference when IC device to be placed in device supply unit in device supply area Outside, identical as foregoing first embodiment.

As shown in figure 44, in the present embodiment, in the A2 of device supply area, device transfer head 13 (supply head) is by IC When device 90A is placed in the first recess portion 141A of device supply unit 14B, device supply unit 14B is not as aforementioned first implements Mode is located at the first recess portion 141A and the second recess portion 141B like that and exposes the position in the A2 of device supply area, but is located at First recess portion 141A (first supplies mobile mounting portion) exposes in device supply area A2 (supply area) and the second recess portion 141B (second supplies mobile mounting portion) exposes the position in the A3 of inspection area.

State in this way, when can make mobile until entire device supply unit 14B is located in the A3 of inspection area Between and moving distance it is shorter than in foregoing first embodiment.Thus, it is possible to realize (the electronics member of electronic component check device 1 Device transmission device 10) handling capacity raising.

In the following, referring to Figure 45 to the 4th of electronic component transmission device and electronic component check device of the invention the Embodiment is illustrated, but is illustrated around the difference with aforementioned embodiments, and then the description thereof will be omitted for identical item.

Movement difference when present embodiment is in addition to removing IC device from device recoverer in device recovery zone Outside, identical as foregoing first embodiment.

As shown in figure 45, in the present embodiment, in the A4 of device recovery zone, device transfer head 20 (recycling head) is from device When the second recess portion 181B of part recoverer 18B recycles IC device 90A, device recoverer 18B is not such as foregoing first embodiment It is located at the first recess portion 181A and the second recess portion 181B like that and exposes the position in the A4 of device recovery zone, but is located at second Recess portion 181B (second recycles mobile mounting portion) exposes in device recovery zone A4 (recovery zone) and the first recess portion 181A (first recycles mobile mounting portion) exposes the position in the A3 of inspection area.

State in this way can make to be moved to device recovery zone A4 to device recoverer 18B from inspection area A3 And become the traveling time until the state that can recycle IC device 90A and moving distance than in foregoing first embodiment more It is short.Thus, it is possible to realize the raising of the handling capacity of electronic component check device 1 (electronic component transmission device 10).In addition, Since the first recess portion 181A does not expose in the A4 of device recovery zone, can prevent from being overlapped mounting in the first recess portion 181A Other IC devices 90.For example, can not vacuum breaking etc. it is certain due to, device transfer head 20 can not carry IC device 90A When being placed in recycling and being moved to device recoverer 18B in the state of keeping IC device 90A with pallet 19, it is possible to as described above The overlapping of other IC devices 90 is placed in the first recess portion 181A by ground.

Above, by embodiment illustrated to electronic component transmission device of the invention and electronic component inspection Device is illustrated, but the present invention is not limited to this, constitutes electronic component transmission device and electronic component inspection Each portion of device could alternatively be the arbitrary composition that can play said function.In addition it is also possible to increase arbitrary construct.

In addition, electronic component transmission device and electronic component check device of the invention be also possible to combine it is aforementioned each More than any two in embodiment composition (feature) and obtain.

Claims

1. a kind of electronic component transmission device, which is characterized in that by electronic component be sent to the electronic component into The the first inspection portion and what second different from first inspection checked is carried out to the electronic component that row first checks Second inspection portion, the electronic component transmission device have:

Maintaining part keeps the electronic component；

Mobile mounting portion, loads for the electronic component；And

Control unit controls the maintaining part,

The control unit makes the maintaining part that the electronic component is sent to first inspection from the mobile mounting portion Portion makes the maintaining part that the electronic component after having carried out first inspection is sent to institute from first inspection portion Mobile mounting portion is stated, and makes the maintaining part that the electronic component is sent to described second from the mobile mounting portion and checks Portion.

2. electronic component transmission device according to claim 1, which is characterized in that

When will the straight line extended to the mobile direction of the mobile mounting portion be set as first axle, will be orthogonal with the first axle straight When line is set as the second axis, the maintaining part is moved along second axis.

3. electronic component transmission device according to claim 2, which is characterized in that

The mobile mounting portion has the electronic component supply unit and electronic component recoverer configured along the first axle,

The control unit makes the maintaining part that the electronic component is sent to described from the electronic component supply unit One inspection portion, and make the maintaining part by carried out described first check after the electronic component from first inspection portion It is sent to the electronic component supply unit.

4. electronic component transmission device according to claim 3, which is characterized in that

The control unit makes the maintaining part that the electronic component is sent to described from the electronic component supply unit Two inspection portions, and make the maintaining part by carried out described second check after the electronic component from second inspection portion It is sent to the electronic component recoverer.

5. electronic component transmission device according to claim 3 or 4, which is characterized in that

The electronic component supply unit, which has, moves mounting portion and the second supply shifting along the first supply that the first axle configures Dynamic mounting portion,

The maintaining part has the first maintaining part and the second maintaining part configured along the first axle,

The control unit makes first maintaining part keep being placed in the described first electronics member for supplying mobile mounting portion Device makes second maintaining part keep being placed in the described second electronic component for supplying mobile mounting portion, makes institute It states the first maintaining part and the electronic component is sent to first inspection portion, and make second maintaining part by the electronics Component is sent to second inspection portion.

6. electronic component transmission device according to claim 5, which is characterized in that the electronic component transmission device Have:

Inspection area, first inspection portion and second inspection portion are configured at the inspection area；And

Supply area is arranged side by side along the first axle and the inspection area,

The supply area, which has, is placed in the described first supply head for supplying mobile mounting portion for the electronic component,

The control unit keeps the mobile mounting portion mobile, so that the mobile mounting portion of the first supply is located at the drainage area Domain and described second supplies mobile mounting portion and is located at the inspection area, and the control unit make the supply head will described in Electronic component is placed in described first and supplies mobile mounting portion.

7. electronic component transmission device according to claim 3 or 4, which is characterized in that

The electronic component recoverer, which has, moves mounting portion and the second recycling shifting along the first recycling that the first axle configures Dynamic mounting portion,

The control unit makes first maintaining part keep being placed in the described first electronics member for recycling mobile mounting portion Device makes second maintaining part keep being placed in the described second electronic component for recycling mobile mounting portion, makes institute It states the first maintaining part and the electronic component is sent to first inspection portion, and make second maintaining part by the electronics Component is sent to second inspection portion.

8. electronic component transmission device according to claim 7, which is characterized in that the electronic component transmission device Have:

Recovery zone is arranged side by side along the first axle and the inspection area,

The recovery zone has the recycling for keeping being placed in the electronic component that described second recycles mobile mounting portion Head,

The control unit keeps the mobile mounting portion mobile, so that the mobile mounting portion of the first recycling is located at the test zone Domain and described second recycles mobile mounting portion and is located at the recovery zone, and the control unit has made the recycling head holding It is placed in the described second electronic component for recycling mobile mounting portion.

9. a kind of electronic component transmission device, which is characterized in that by electronic component be sent to the electronic component into The the first inspection portion and what second different from first inspection checked is carried out to the electronic component that row first checks Second inspection portion, the electronic component transmission device have:

Maintaining part keeps the electronic component；

Mobile mounting portion, loads for the electronic component；And

Control unit controls the maintaining part,

The control unit makes the maintaining part that the electronic component is sent to first inspection from the mobile mounting portion Portion makes the maintaining part that the electronic component after having carried out first inspection is sent to institute from first inspection portion The second inspection portion is stated, and examine the maintaining part electronic component after having carried out second inspection from described second The portion of looking into is sent to the mobile mounting portion.

10. a kind of electronic component check device, which is characterized in that have:

First inspection portion carries out first to electronic component and checks；

Second inspection portion carries out second different from first inspection to the electronic component and checks；

Maintaining part keeps the electronic component, and the electronic component is sent to first inspection portion and described Two inspection portions；

Mobile mounting portion, loads for the electronic component；And

Control unit controls the maintaining part,

11. electronic component check device according to claim 10, which is characterized in that

12. electronic component check device according to claim 11, which is characterized in that

13. electronic component check device according to claim 12, which is characterized in that

14. electronic component check device according to claim 12 or 13, which is characterized in that

15. electronic component check device according to claim 14, which is characterized in that the electronic component inspection dress It sets and has:

16. electronic component check device according to claim 12 or 13, which is characterized in that

17. electronic component check device according to claim 16, which is characterized in that the electronic component inspection dress It sets and has:

18. a kind of electronic component check device, which is characterized in that by electronic component be sent to the electronic component into The the first inspection portion and what second different from first inspection checked is carried out to the electronic component that row first checks Second inspection portion, the electronic component check device have:

Maintaining part keeps the electronic component；

Mobile mounting portion, loads for the electronic component；And

Control unit controls the maintaining part,