KR101218507B1 - Probe apparatus - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention provides a probe device capable of reducing the cost per footprint and footprint and suppressing a decrease in throughput. The wafer chucks 4A, 4B (4C, 4D), probe cards 6A, 6B, and an inspection unit 21A (21B) having an upper imaging unit 5 are used to make the upper imaging unit 5 common. At the same time, the moving regions of the wafer chucks 4A and 4B (4C and 4D) are set to overlap. The wafer W in the order of the wafer chuck 4A of the inspection unit 21A, the wafer chuck 4C of the inspection unit 21B, the wafer chuck 4B of the inspection unit 21A, and the wafer chuck 4D of the inspection unit 21B. ) Is taken and the wafer W is imaged by one upper imaging unit 5. As a result, the upper imaging unit 5 can be used in common to reduce costs, and the housing 22a and 22b can be downsized by reducing the footprint by overlapping the moving regions of the wafer chucks 4A, 4B (4C, 4D). Can be.

Description

Probe Device {PROBE APPARATUS}

The present invention relates to a probe device for performing electrical measurement of a chip under test by bringing the probe pad of the probe card into contact with the electrode pad of the chip under test.

Conventionally, a probe device for inspecting the electrical characteristics of an IC chip, which is an inspection chip formed on a semiconductor wafer (hereinafter referred to as a wafer), includes a probe device main body (inspection unit), a loader chamber, a carrier such as a FOUP in the loader chamber, and a inspection unit wafer. The board | substrate conveying means for conveying a board | substrate between chucks is provided.

The inspection unit captures the pads on the substrate surface on the lower wafer chuck with the upper imaging unit which can move the lower side of the probe card, and simultaneously captures the probes of the upper probe card with the lower imaging unit on the wafer chuck side. Based on the imaging result, the coordinates (contact coordinates) at which each pad on the substrate contacts the corresponding probe are calculated, the wafer chuck is raised to contact the pad and the probe, and the inspection of the IC chip is performed. In order to improve the throughput, a probe apparatus for connecting two inspection units to each other and carrying a wafer between the wafer chucks of the inspection units and the FOUP of the load port by a common substrate transfer arm has also been studied.

By the way, during the imaging of the probe by the lower imaging unit and the imaging of the wafer surface by the upper imaging unit, the wafer chuck is moved in a wide range, and when the wafer size is enlarged, the moving range of the wafer chuck is widened, so that the inspection portion is enlarged. do. When the plurality of inspection units are connected, the loader chamber is common, so the footprint of the loader chamber and the inspection unit is smaller than that of the one-to-one probe device, but the inspection unit itself is large, so that the entire probe device is large. Throw it away.

On the other hand, Patent Document 1 describes a probe device provided with one probe card, two mounting tables, and a dedicated imaging unit in each mounting table in one housing. This probe apparatus is intended to reduce costs by sharing expensive probe cards, but while testing wafers on one mount, wafers on the other mount cannot be tested. Falls.

Patent Document 1: Japanese Patent Application Laid-Open No. 2008-117897 (paragraph number [0029], [0030])

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a probe device capable of miniaturization, to reduce the occupied area of the probe device, and to obtain a high throughput.

In the probe device of the present invention,

The substrate is taken out from the substrate storage portion by the substrate transfer means and transferred to the mounting table in the inspection portion, while imaging the surface of the substrate by the upper side imaging unit having a downward field of view, and provided on the side of the mounting table, and having an upward field of view. The imaging unit probes the probe of the probe card, and the control unit obtains the coordinate position where the electrode pad of the chip under test and the probe of the probe card contact with each other on the basis of the imaging result, and makes the electrode pad and the probe contact each other. In the device for checking the electrical characteristics of the chip,

The inspection unit,

Two probe cards spaced apart from each other in a plane direction,

Two mounting bases which are received by the substrate transfer means and which are movable in the longitudinal and horizontal directions on the plane and movable in the height direction;

An upper imaging unit which is configured to be movable in an arrangement direction of the two probe cards, and which is commonly used for substrates mounted on the two mounting tables,

In at least one of the imaging of the substrate surface and the imaging of the probe, a part of the moving area of one mounting table and a part of the moving area of the other mounting table overlap each other.

The controller is provided with a function of controlling the mounting table and the imaging unit to perform imaging on the substrate on the other mounting table while the inspection by the probe card is performed on the substrate on the one mounting table. .

Moreover, the probe apparatus of this invention is provided with the 1st test | inspection part and a 2nd test | inspection part as said test | inspection part, for example, The said control part is one mounting table of the 1st test | inspection part, one mounting table of the 2nd test | inspection part, 1st test | inspection part. The board | substrate conveying means may be provided so that a board | substrate may be conveyed from a board | substrate accommodating part in order of the other mounting table of the other mounting stage, and the other mounting table of a 2nd inspection part. In the probe apparatus of the present invention, for example, the first and second inspection units are arranged such that two probe cards of the first inspection unit and two probe cards of the second inspection unit are aligned, and the substrate conveying means It is preferable to be common to these inspection parts. In addition, in the probe apparatus of the present invention, for example, when one mounting table is performing an imaging operation in which part of the moving region overlaps with each other in the inspection section, movement of the other mounting table in the inspection section is prohibited. good.

According to the present invention, since the upper imaging unit is shared for two mounts, the number of parts can be reduced. In addition, since at least one of the moving areas of the mounting table overlaps at least one of the imaging time of the substrate surface by the upper imaging unit and the imaging of the probe of the probe card by the lower imaging unit provided on the mounting table side, the probe card and the mounting table are overlapped. The occupied area of the apparatus is narrowed compared to the case of arranging two inspection units provided. Moreover, the 1st test | inspection part and 2nd test | inspection part provided with two mounting bases, respectively, respectively are provided, the mounting table of the 1st test | inspection part, the mounting table of one of the 2nd test | inspection parts, the other mounting base of the 1st test | inspection part, and 2nd By conveying a board | substrate from the board | substrate accommodation part in order of the other mounting stand of a test | inspection part, the fall of a throughput can be suppressed, even if the movement of the other mounting stand is restrict | limited when carrying out imaging operation using one mounting stand.

The probe apparatus which is 1st Embodiment of this invention is demonstrated with reference to FIGS. As shown in Figs. 1 to 3, the probe apparatus inspects the loader unit 1 and the wafer W for carrying out the wafer W, which is a substrate on which a plurality of inspected chips are arranged. The probe apparatus main body 2 corresponding to the inspection part of this invention which performs a probe test) is provided. First, the overall layout of the loader section 1 and the probe device main body 2 will be briefly described.

The loader part 1 is made of a FOUP 100 which is a hermetically sealed conveyance container (substrate storage part) in which a plurality of wafers W are accommodated, is carried in, and is spaced apart from each other in the Y direction (left and right direction in the figure) and is disposed to face each other. The 1st load port 11 and the 2nd load port 12, and the conveyance chamber 10 arrange | positioned between these load ports 11 and 12 are provided. The load port 11 (12) has a casing 11a (12a), respectively, and the FOUP 100 has a casing from an inlet 11b (12b) provided in the X direction of the load port 11 (12). It is carried in [11a (12a)]. The brought-in FOUP 100 has a cover that is peeled off by a cover opening / closing means (not shown) provided in the load port 11 (12) so that the cover is held on the side wall in the load port 11 (12). The FOUP 100 having been removed is rotated so that the opening portion faces the conveyance chamber 10 side.

As shown to FIG. 2, FIG. 3, the conveyance chamber 10 is equipped with the wafer conveyance arm 3 which is a board | substrate conveying means. The wafer conveyance arm 3 is comprised by the two arm bodies 35 which can be rotated about a vertical axis | shaft, and can move up and down to the conveyance base 30 which can move to the Y direction of illustration. Here, "33" is an expectation moving part that moves along the rail extending in the Y direction, "32" is an expectation lifting part 32 that is lifting relative to the expectation moving part 33, and "31" is an expectation lifting part 32 It is a rotating unit provided in). In addition, pre-alignment is performed on the conveyance base 30 with respect to the wafer W in the state mounted on the arm body 35, and the direction of the wafer W is adjusted and the center position is carried out. The pre-alignment mechanism 36 (refer FIG. 4) which detects this is provided.

The pre-alignment mechanism 36 has the chuck | zipper part 37, the shaft part 37a, and the optical sensor 38, as shown in FIG. 4, These members are mounted on the conveyance base 30. As shown in FIG. The chuck portion 37 is provided at the top of the shaft portion 37a rotatable through the conveyance base 30 and is rotatable, and normally fits into the concave portion of the surface of the conveyance base 30 so as to face the surface. It is a rotation stage to be done. The chuck portion 37 is set at a position corresponding to the center of the wafer W on the arm body 35 withdrawn on the transfer base 30, and slightly lifts the wafer W from the arm body 35 to rotate. It is configured to do so. The optical sensor 38 is a detection part which consists of a light emitting sensor and a light receiving sensor which detect the periphery of the wafer W rotated by the chuck | zipper part 37. As shown in FIG. The optical sensor 38 is fixed via the conveyance base 30 at a position transversely away from the moving region of the arm body 35, and is an edge of the periphery of the wafer W lifted by the chuck 37, Moreover, it arrange | positions in the position which does not interfere with the wafer W at the time of the wafer W access. In addition, in this embodiment, prealignment is performed only in the lower arm body 35 among the two arm bodies 35 arrange | positioned up and down.

The prealignment of the prealignment mechanism 36 is performed as follows. First, the wafer W on the arm body 35 is slightly lifted by the chuck 37 to rotate the wafer W, and the peripheral edge (end) of the wafer W from the light emitting part of the optical sensor 38. Irradiate light to the area containing. Then, the controller 15 described later detects the center position of the direction reference portion such as the notch of the wafer W, the orientation flat, and the center of the wafer W based on the detection signal of the optical sensor 38. Based on the detection result, the notch or the like is rotated so that the chuck portion 37 is in a predetermined direction on the arm body 35 to adjust the direction of the wafer W. FIG. Thereafter, the position of the arm body 35 is adjusted so that the eccentricity of the wafer W is corrected, and the wafer W is received from the chuck portion 37 to the arm body 35. Thereby, adjustment of the direction and eccentricity of the wafer W is performed. In addition, although the prealignment mechanism 36 is not limited to connecting to the wafer conveyance arm 3, you may provide in the conveyance path | route of the wafer conveyance arm 3, However, the prealignment mechanism is carried out every prealignment. The transfer of the wafer W must be carried out between the stage of the pre-alignment and the arm 3, and thus the configuration of the present example is the best.

Moreover, the control part 15 which controls the probe apparatus main body 2 is provided in the upper part of the loader part 1 as shown in FIG. The control part 15 consists of a computer, for example, and is provided with the data processing part which consists of a program, a memory, and a CPU. In the program, the FOUP 100 is loaded into the load port 11 (12), the wafer W is loaded into the probe apparatus main body 2 from the FOUP 100, and the probe test is executed, and then the wafer W The group of steps is arranged to control the operation of each part of the series until the return to the FOUP 100 and the FOUP 100 is taken out. This program (including a program relating to input operation and display of processing parameters) is stored in a storage medium such as a flexible disk, a compact disk, a magneto-optical disk, a hard disk, and installed in the controller 15, for example. .

Next, the probe apparatus main body 2 which is an essential part of the present invention will be described in detail. As shown in FIG. 2, the probe apparatus main body 2 is disposed adjacent to the loader portion 1 so as to be arranged in the X direction with the loader portion 1, and the first inspection portion 21A arranged in the Y direction. And the second inspection unit 21B. 2, the inspection part 21A (21B) has shown the state in which the head plate 7 mentioned later was removed. In addition, since the inspection part 21A (21B) has the same structure, only the inspection part 21A is shown in FIG. In addition, the inspection part 21A is shown typically in FIG. 6 for convenience of description.

The inspection part 21A has one housing 22a which corresponds to the exterior body which partitions each unit, as shown to FIG. 2, FIG. 3, and FIG. 5, and has two inside the housing 22a. The table unit 24a, the table unit 24b, and the upper imaging unit 5 are disposed. The table units 24a (24b) are arranged so as to be arranged in the Y direction, and are movable in the X, Y, Z (up and down) directions, that is, vertically and horizontally movable in the plane, and also movable in the height direction, and the upper part. Rotate around the vertical axis. Above the table unit 24a (24b), two wafer chucks 4A, 4B having a vacuum suction function are mounted as mounting tables for mounting the wafers W. As shown in FIG. The lower imaging unit 40A and the lower imaging unit 40B are combined in the wafer chuck 4A (4B), and the delivery for carrying out the transfer of the wafer W between the wafer transfer arms 3 is performed. The position, the imaging position of the wafer surface mentioned later, and the contact position (inspection position) which contacts the wafer W to the probe 60 of the probe card 6A (6B) are made to be movable.

The lower imaging unit 40A (40B) is provided on the side opposite to the center line CL of the housing 22a as seen from the wafer chuck 4A (4B) (see Figs. 5 and 6). As shown in Fig. 5, the lower imaging unit 40A (40B) includes a lower camera 41, a macro camera 42, a target 43, and a retractor mechanism 44, which are micro cameras. It moves along with [24a (24b)] to image the probe 60 of the probe card 6A (6B) described later. The target 43 is a member for matching the focus and the optical axis of both cameras in order to set the origin of the lower camera 41 and the upper camera 51 to be described later during alignment, and the target 43 is a retraction mechanism ( 44), it moves forward and backward to the position which performs origin setting of both cameras.

Moreover, the upper side imaging unit 5 which moves to a Y direction is arrange | positioned above the movement area | region of wafer chuck 4A (4B). The upper imaging unit 5 is configured to be guided by guide rails 52 formed at both ends in the X-direction of the housing 22a over the entire region in the Y-direction of the housing 22a, and the wafer chuck 4A (4B). )] Of the straight line which moves the image freely in the Y direction and connects the center line CL of the Y direction of the housing 22a shown in FIG. 5 (the center points of the probe cards 6A and 6B described later in FIG. 6). The center region including the straight line perpendicular to the middle point is set as the reference standby position of the upper imaging unit 5. In addition, the upper camera 51 is mounted on the upper imaging unit 5, and the upper imaging unit 5 has a function as a moving support of the upper camera 51. The upper camera 51 is equipped with a CCD camera and the like, and is moved upward by the upper imaging unit 5 above the wafer chuck 4A (4B) at the imaging position to photograph the surface of the wafer W. FIG.

Above the moving region of the wafer chuck 4A (4B) and the upper imaging unit 5, the probe card 6A (6B) mounted on the head plate 7 forming the ceiling of the housing 22a as shown in FIG. )] Is provided. The probe card 6A (6B) is mounted and held on the head plate 7. On the upper surface side of this probe card 6A (6B), a test head 8 is disposed via a pogo pin unit (not shown). Further, on the lower surface side of the probe card 6A (6B), a vertical needle (wire probe needle) extending perpendicular to the surface of the probe, for example, the wafer W, electrically connected to the electrode group on the upper surface side, respectively. The probe 60 is provided in front of the probe card 6A (6B), for example, corresponding to the arrangement of the electrode pads of the wafer W. As shown in FIG. As shown in FIG. 2, the inspection unit 21B includes the table units 24c and 24d, the wafer chucks 4C and 4D, the lower imaging units 40C and 40D, the upper imaging unit 5, and a probe not shown. It is provided with a card etc., and is comprised similarly to the inspection part 21A.

Next, the operation of the above-described embodiment will be described with reference to FIGS. 2, 3, and 7 to 13. 7, 8, and 10 to 13 indicate W1 to W5, where W1 is the first conveyed wafer and W2 is the second conveyed wafer. It shows whether it is a wafer. In addition, the time required for the probe test performed in the wafer chucks 4A to 4D is assumed to be equivalent.

In this embodiment, as shown in FIG. 2, the standby position (home position) of the wafer chucks 4A to 4D is directly below the probe card 6A (6B). First, as shown in FIG. 7, the wafer W1 is carried out from the FOUP 100 by the wafer transfer arm 3, and the prealignment is performed by the prealignment mechanism 36 to determine the direction of the wafer W1. Adjustment and detection of the center position are performed. In addition, one wafer chuck 4A of the first inspection unit 21A moves to a receiving position that receives the wafer W1 from the wafer transfer arm 3. And the wafer conveyance arm 3 enters into the housing 22a from the delivery opening 23a (refer FIG. 3), and receives the wafer W1 to the wafer chuck 4A.

After receiving the wafer W1, as shown in FIG. 8, the wafer transfer arm 3 takes out the next wafer W2 from the FOUP 100, and frees the wafer W2 in the same manner as the wafer W1. Run the alignment. Moreover, one wafer chuck 4C of the 2nd inspection part 21B moves to the receiving position which receives the wafer W2 from the wafer conveyance arm 3. And the wafer conveyance arm 3 enters into the housing 22b from the delivery opening 23c (refer FIG. 3), and receives the wafer W2 to the wafer chuck 4C. On the other hand, after the wafer W1 is received by the wafer chuck 4A, the electrode pad and the probe card 6A on the surface of the wafer W1 called an alignment operation as a pretreatment for contacting the wafer W1 to the probe card 6A. The acquisition operation of the coordinate position of the probe 60 of () is performed. This alignment operation is executed as follows.

First, the upper imaging unit 5 of the first inspection unit 21A is moved to an imaging position for imaging the wafer W on the wafer chuck 4A, and the upper camera 51 and the wafer of the upper imaging unit 5 are moved. The origin setting of the lower camera 41 of the lower imaging unit 40A provided in the table unit 24a (in detail, the portion moving in the Z direction) of the chuck 4A is executed. This origin setting places the target 43 in the area between the lower camera 41 and the upper camera 51, as shown in FIG. 9A, to focus the lower camera 41 and the upper camera 51. FIG. And an operation of reading the X, Y, and Z coordinates after the movement of the wafer chuck 4A at this time. This imaging position is moved to the Y direction in the wafer W1 by the upper camera 51 when the wafer chuck 4A moves toward the outer side of the Y direction of the housing 22a, and moves to the limit of the movement area. It is a position which can image the edge part of an inner side (wafer chuck 4B side). In this embodiment, for example, as illustrated in FIG. 8, a position at which the position of the probe card 6A is moved 185 mm from the center point of the probe card 6A (see FIG. 6) to the center line CL is picked up. It is set as a position.

Subsequently, as shown in Fig. 9B, in the state where the upper imaging unit 5 is fixed at the imaging position, one wafer chuck 4A is moved away from the other wafer chuck 4B, and the upper camera ( In 51), for example, four points and the center point of the peripheral portion of the wafer W1 are imaged, and position data of the electrode pad on the wafer W1 is acquired. When the imaging of the wafer W1 is completed, the upper imaging unit 5, as shown in FIG. 9C, has an area between the side wall of each side (see FIG. 5) of the housing 22a and the probe card 6A. Evacuate to the evacuation position set in. Then, the wafer chuck 4A is raised in the Z direction by the table unit 24a, the focus of the lower camera 41 is aligned with the tip of the probe 60 of the probe card 6A, and the wafer chuck 4A is placed on the wafer. The probe 60 is imaged by moving toward the chuck 4B side to acquire position data of the tip of the probe 60.

Since origin setting of the lower camera 41 and the upper camera 51 is performed, the imaging data of the surface of the wafer W1 and the imaging data of the probe 60 are performed by the lower camera 41 and the upper camera 51. Is obtained, the same result as that of acquiring the imaging data of the surface of the wafer W1 and the imaging data of the probe 60 by the common imaging device. Therefore, the exact contact position of the probe 60 and an electrode pad can be calculated | required based on the imaging data of the probe 60 and the imaging data of the electrode pad of the wafer W1. Thereby, in the probe apparatus of this embodiment, the electrode pad and the probe 60 are contacted and the probe test of the wafer W1 is performed.

In addition, in this embodiment, when imaging the probe 60 with the lower camera 41, the wafer chuck 4A raises and reaches the height position of the upper imaging unit 5. As shown in FIG. And the wafer chuck 4A moves toward the wafer chuck 4B side in the state which is at the height position, passes through the center line CL, and enters the area | region on the wafer chuck 4B side. Therefore, if the upper imaging unit 5 stops at the imaging position and the reference | standard standby position (the center area | region containing the center line CL of the Y direction of the housing 22a shown in FIG. 5), the wafer chuck 4A and Because of interference, imaging of the probe 60 cannot be performed. Therefore, in this embodiment, before performing imaging of the probe 60 by the lower camera 41, the area | region (recovery) between the side wall of each side of the housing 22a, and the probe card 6A is carried out before the image pickup unit 5 is performed. Position). As a result, the wafer chuck 4A can perform imaging of the probe 60 by the lower camera 41 without interfering with the upper imaging unit 5.

When the alignment operation is completed through the above-described steps, the wafer chuck 4A moves to the contact position obtained by the alignment operation as shown in FIG. 10. At this time, the wafer chuck 4A first descends from the height level of the upper imaging unit 5, and then the upper imaging unit 5 passes through the upper region of the wafer chuck 4A and moves to the reference standby position. In the present embodiment, when the probe test is executed while the upper imaging unit 5 is retracted to the retracted position, when the wafer chuck 4A is moved to the contact position, it interferes with the upper imaging unit 5, so that the upper imaging unit ( 5) is moved to the reference | standard standby position which is a center area | region containing the center line CL of the Y direction of the housing | casing 22a shown in FIG. Then, when the wafer chuck 4A reaches the region below the contact position, and the upper imaging unit 5 reaches the reference standby position, the wafer chuck 4A rises and based on the contact coordinates obtained at the time of alignment operation, The electrode pad of the wafer W1 and the probe 60 are contacted to start a probe test using the test head 8. In this example, all the pads and the probes 60 on the wafer W1 are collectively contacted.

On the other hand, after receiving the wafer W2, the wafer transfer arm 3 takes out the next wafer W3 from the FOUP 100, and performs prealignment with respect to the wafer W3 as with the wafer W1. After the probe test is started for the wafer W1, the wafer chuck 4B moves to the receiving position receiving the wafer W3 from the wafer transfer arm 3, and receives the wafer W3 into the wafer chuck 4B. do. On the other hand, when receiving the third wafer W3 from the wafer transfer arm 3 to the wafer chuck 4B of the first inspection unit 21A, the wafer W3 on the wafer chuck 4C of the second inspection unit 21B. ), The alignment operation is started. This alignment operation is performed similarly to the wafer W1 described above, and the contact positions of the probe card of the second inspection unit 21B and the electrode pad of the wafer W2 are obtained. After that, the wafer chuck 4C moves to the region below the obtained contact position, and the upper imaging unit 5 moves to the reference standby position through the region above the wafer chuck 4C (see FIG. 11). After that, the probe test is started similarly to the first inspection unit 21A.

In addition, in the second inspection unit 21B, the reference waiting position, the imaging position, and the retracted position of the upper imaging unit 5 are set similarly to the first inspection unit 21A. In the second inspection unit 21B, for example, the center line CL2 in the Y direction (the straight line in the X direction passing through the center point of two probe cards not shown in the housing 22b) of the housing 22b shown in FIG. The containing central area is set as the reference standby position, and the position moved 185 mm to each probe card side from the center point of the probe card and the center line CL2 is set as the imaging position, and the side wall of each side of the housing 22b is set. The area between the probe card and the probe card is set as the retracted position.

Then, the wafer transfer arm 3 receives the wafer W3 into the wafer chuck 4B of the first inspection unit 21A, and then the next (fourth) wafer W4 from the FOUP 100 as shown in FIG. 11. ) Is taken out and prealigned to the wafer W4 in the same manner as the wafer W1. In addition, when a probe test is started with respect to the wafer W2 mounted in one wafer chuck 4C of the 2nd inspection part 21B, the other wafer chuck 4D of the 2nd inspection part 21B is a wafer conveyance arm ( It moves to the receiving position which receives the wafer W4 from 3). The wafer transfer arm 3 receives the wafer W4 into the wafer chuck 4D.

Referring to the operation in the first inspection unit 21A, the first inspection unit 21A is used when receiving the wafer W4 from the wafer transfer arm 3 to the other wafer chuck 4D of the second inspection unit 21B. Alignment operation | movement is started with respect to the wafer W3 on the other wafer chuck 4B of (), and by this alignment operation of the wafer W3 on the wafer chuck 4B and the probe 60 of the probe card 6B. Contact position is obtained. After that, the probe test is similarly started.

In addition, in the other wafer chuck 4B of the first inspection unit 21A, since the positional relationship in the Y direction between the upper imaging unit 5 and the wafer chuck 4B is reversed, when performing the alignment operation, the upper imaging unit Although the movement direction of 5 and the wafer chuck 4B is reversed compared with the case of the one wafer chuck 4A, the basic movement is the same as that of the one wafer chuck 4A.

When the probe test is started on the wafer W3 mounted on the other wafer chuck 4B of the first inspection unit 21A, the wafer chuck 4D has the same shape as the wafer W1 in the wafer chuck 4D. The alignment operation is performed on, and the contact position is obtained. Thereafter, the wafer chuck 4D moves to the region below the obtained contact position, and the upper imaging unit 5 moves to the reference standby position through the region above the wafer chuck 4D, and the wafer chuck 4D. When the upper imaging unit 5 reaches the reference standby position (see FIG. 13) in the region below the contact position, the probe test is started similarly to the wafer chuck 4A.

After that, when the probe test of the wafer W1 of the wafer chuck 4A is finished as soon as possible, the wafer transfer arm 3 moves from the FOUP 100 to the next (5th) wafer (as shown in FIG. 13). W5) is taken out and prealigned to wafer W5 in the same manner as wafer W1. Then, the wafer chuck 4A moves to the receiving position of the wafer as shown in FIG. 7, receives the inspected wafer W1 into the wafer conveyance arm 3, and the wafer conveyance arm 3 is uninspected. The wafer W5 is received. Subsequently, the wafer transfer arm 3 carries the inspected wafer W1 into the FOUP 100, and when there is an uninspected next wafer W in the FOUP 100, the next wafer W is loaded. Export and perform prealignment. Thereafter, the above-described process is repeated, and inspection by the inspection unit 21A (21B) is performed on the wafer W in the FOUP 100 until the uninspected wafer W in the FOUP 100 disappears. Is executed.

In the probe apparatus of the present embodiment, the second inspection unit further includes a portion of each moving region of the one wafer chuck 4A of the first inspection unit 21A and the other wafer chuck 4B of the first inspection unit 21A. A portion of each moving region of one wafer chuck 4C of 21B and the other wafer chuck 4D is set to overlap each other. Therefore, in the present embodiment, when performing the alignment operation using one of the wafer chucks 4A and 4C, the other wafer chucks 4B and 4D are further prevented from moving the other wafer chucks 4B and 4D. When performing the alignment operation by using the control unit, the control unit 15 controls the movement of one of the wafer chucks 4A and 4C.

In the probe apparatus of the present embodiment described above, two wafer chucks 4A, 4B (4C, 4D) are provided in each inspection unit 21A (21B), and these wafer chucks 4A, 4B (4C, 4D) are provided. ] The upper side imaging unit 5 is common to the wafer W. For this reason, cost can be kept low compared with the case where the upper imaging unit 5 is provided for each wafer chuck 4A, 4B (4C, 4D). The wafer chucks 4A, 4B (4C, 4D) are set so that the moving regions overlap within the housing 22a (22b), and in the first inspection unit 21A, one of the wafer chucks 4A, 4B is disposed. When moving, the other movement is prohibited. Moreover, also in the 2nd inspection part 21B, when one of the wafer chucks 4C and 4D is moving, the other movement is prohibited. For this reason, as compared with the case where two probe devices including one probe card, a wafer chuck, and an upper imaging unit are connected as much as the region where the moving regions of the wafer chucks 4A and 4B (4C, 4D) overlap, the housing [ 22a (22b)] can be made small.

In addition, since the two inspection units 21A (21B) configured as described above are connected, additional cost reduction effect and footprint reduction of the probe device can be obtained. One wafer chuck 4A or 4B in the first inspection unit 21A, one wafer chuck 4C or 4D in the second inspection unit 21B, and the other wafer chuck 4B or 4A in the first inspection unit 21A. ), The wafer W is conveyed in the order of the other wafer chuck 4D or 4C in the second inspection unit 21B, so that the alignment operation is executed in the first inspection unit 21A and the other inspection unit 21B. The timing of conveyance of the wafer W to the furnace overlaps. For this reason, when it is going to convey the next wafer W to the 1st inspection part 21A after that, since the above-mentioned alignment operation in the said 1st inspection part 21A is complete | finished or the remaining time is short, the next wafer is (W) can be handed over to the 1st inspection part 21A as soon as possible, and preparation for alignment can be carried out. For this reason, there is no waiting time in each operation or it is suppressed shortly, and high throughput is obtained, while being restricted by the operation by the moving area of two wafer chucks 4A, 4B (4C, 4D) overlapping.

In addition, since the characteristic part of this invention exists in the point which conveys a board | substrate alternately to one mounting board of the 1st test | inspection part, a 2nd test | inspection part, and the other, the embodiment of this invention is a wafer chuck 4A-> wafer chuck 4D. The wafer W may be conveyed in the order of? → wafer chuck 4B → wafer chuck 4C, and the wafer chuck 4B → wafer chuck 4C → wafer chuck 4A → wafer chuck 4D. You may convey the wafer W in order.

In addition, embodiment of this invention is not limited to what comprised the probe apparatus main body by combining two or more test | inspection parts, For example, the probe apparatus provided with one test part of embodiment mentioned above may be sufficient. Also in such a probe apparatus, a probe test can be performed only by providing one upper imaging unit with respect to two mounting boards. Therefore, the cost can be reduced by reducing the number of the upper imaging units compared to the probe device provided with the upper imaging unit for each mount, and it is also possible to set the moving area of the mount so that the housing footprint can be reduced. . In addition, in this embodiment, although the probe test is performed by collective contact, this invention is applicable also to the probe apparatus which performs the probe test by split contact. When performing the probe test using the divided contacts, the range where the mounting table moves when the probe test is executed is set as the test area, and the standby position of the mounting table is set at the center of the test area, and the test area and the mounting table are moved. What is necessary is just to set the moving area of a mounting board so that an area may not overlap.

[Other Embodiments]

As mentioned above, although embodiment of this invention was described, this invention is not limited to embodiment mentioned above. For example, in carrying out the present invention, it is also possible to configure the probe apparatus main body as shown in FIG. In the probe apparatus shown in FIG. 14, the transfer chamber 110 including the wafer transfer arm 103 is disposed in the center of the apparatus, and the load ports 111 and 112 are provided at both ends in the Y direction of the transfer chamber 110. Is placed. And the inspection part 21A, 21B of the structure similar to 1st Embodiment is arrange | positioned at the both ends of the conveyance chamber 110 in the X direction of illustration. That is, in the probe apparatus shown in FIG. 14, the probe apparatus main body 121 is configured by arranging the inspection units 21A and 21B in parallel with the transfer chamber 110 interposed therebetween. Also in such a probe apparatus, the FOUP 100 which accommodated the wafer W is mounted in the load ports 111 and 112, and the wafers W1 to W4 are mounted on the inspection units 21A and 21B to the wafer transfer arm 103. ), It can be transported in the same manner as in the above-described embodiment, and the cost and footprint can be reduced.

In the probe apparatus of the present invention, a part of the moving regions of the two mounting tables at the time of alignment work overlap, but this overlap is performed by the upper imaging unit and the lower imaging unit by the upper imaging unit as in the above-described embodiment. It is not limited to what happens in both cases at the time of imaging of a probe, and the case where the moving area of both mounting boards at the time of imaging of any one may overlap. The overlapping moving areas of the mounting table include not only the mounting table but also the case where the moving areas of the table for moving the mounting table overlap.

Moreover, the embodiment of this invention includes what comprised the probe apparatus main body by arranging three or more test | inspection parts of embodiment mentioned above, for example, three test | inspection parts in series. In the probe apparatus provided with such a probe apparatus main body, the order of conveying the substrate is one of the mounting stages of the first inspection unit → one of the mounting stages of the second inspection unit → one of the mounting stages of the third inspection unit → the other of the first inspection unit. It becomes the mounting table of the → the other mounting stage of the 2nd inspection part → the other mounting stand of the 3rd inspection part. Also in such a probe device, in the 1st inspection part and the 2nd inspection part, one mounting stand of the 1st inspection part → one mounting stand of the 2nd inspection part → the other mounting stand → the other mounting stand of the 1st inspection part The substrate is conveyed in the same order as the above. That is, a board | substrate is conveyed by the conveyance method of the characteristic board | substrate of this invention. Therefore, the scope of the present invention includes a probe device having a probe device main body having three or more inspection units.

In addition, in this invention, you may control the movement control of two mounting boards using coordinates as shown, for example in FIG. Here, 15A of FIG. 15A shows the coordinate range for performing the movement control of the wafer chuck 4A, and 15B of FIG. 15B shows the coordinate range for executing the movement control of the wafer chuck 4B. It is shown. As shown in FIG. 15, in this embodiment, the origin G10 of the coordinate 15A for performing the movement control of the wafer chuck 4A and the coordinate 15B for performing the movement control of the wafer chuck 4B. The origin G20 of is set at another position. In addition, the origin G20 is an imaginary point set at a position outside the housing 22a. Thus, for the purpose of changing the positions of the origins G10 and G20 of the coordinates 15A and 15B and setting the origin of the coordinates 15B for controlling the wafer chuck 4B to the outside of the housing 22a, each coordinate ( The distance L from the center point SA to the origin G10 when the wafer chuck 4A is stopped at the center of the test area when the movement control of the wafer chuck 4A (4B) is performed at 15A and 15B. ) And the distance L from the center point SB to the origin G20 when the wafer chuck 4B is stopped at the center of the test area. That is, in the wafer chuck 4A (4B), both test regions exist at the same coordinate positions when viewed from the origins G10 and G20. This makes it possible to shorten the step during the movement control of the wafer chuck 4A (4B), thereby improving the control throughput of the wafer chuck 4A (4B).

1 is a perspective view showing an outline of a probe device of the present embodiment;

2 is a plan view showing an outline of a probe device of the present embodiment;

3 is a side view showing an outline of a probe device of the present embodiment;

4 is an explanatory diagram for illustrating an outline of the wafer transfer arm 3 of the present embodiment;

5 is a plan view showing an outline of an inspection unit 21A of the present embodiment;

6 is a side view showing the outline of the inspection unit 21A according to the present embodiment;

7 is a first explanatory diagram for explaining the probe test of the present embodiment;

8 is a second explanatory diagram for explaining the probe test of the present embodiment;

9 is an explanatory diagram for explaining the alignment operation of the present embodiment;

10 is a third explanatory diagram for explaining the probe test of the present embodiment;

11 is a fourth explanatory diagram for explaining the probe test of the present embodiment;

12 is a fifth explanatory diagram for explaining the probe test of the present embodiment;

13 is a sixth explanatory diagram for explaining the probe test of the present embodiment;

14 is a plan view showing an outline of a probe device of another embodiment according to the present invention;

15 is an explanatory diagram for explaining a control method of another embodiment according to the present invention;

[Description of Reference Numerals]

2… Probe unit body

3 ... Wafer conveyance arm (substrate conveying means),

4A, 4B, 4C, 4D... Wafer chuck 5. Upper imaging unit

6A, 6B... Probe card 10.. Return room

11, 12... Load port 15... Control

21A, 21B... Inspection unit 22a, 22b. housing

24a, 24b, 24c, 24d... Table unit 35.. Armature

36... Pre-alignment mechanism 40A, 40B, 40C, 40D... Lower imaging unit

41... Lower camera 43. target

51... Top camera 52... Guide rail

60... Probe 10... FOUP

W… wafer

Claims (4)

The substrate is taken out from the substrate storage unit by the substrate transfer means, is taken to the mounting table in the inspection unit, and the image is taken on the mounting table side by imaging the surface of the substrate by the upper imaging unit having a downward field of view. The probe of the probe card is imaged by the lower imaging unit, and the control unit obtains the coordinate position where the electrode pad of the chip under test on the substrate contacts the probe of the probe card based on the imaging result, and makes contact with the electrode pad and the probe. An apparatus for inspecting electrical characteristics of an inspection chip, The inspection unit, Two probe cards spaced apart from each other in a plane direction, The board | substrate is received by the said board | substrate conveyance means, and has two mounting boards which are movable in the longitudinal direction on a plane, and are movable in a height direction, The upper imaging unit is configured to be movable in the arrangement direction of the two probe cards, and is commonly used for substrates mounted on the two mounting tables. In at least one of the imaging of the substrate surface and the imaging of the probe, a part of the moving area of one mounting table and a part of the moving area of the other mounting table overlap each other. The control unit has a function of controlling the mounting table and the imaging unit to perform imaging on the substrate on the other mounting table while the inspection by the probe card is performed on the substrate on the one mounting table. Probe device. The method of claim 1, As the inspection unit, a first inspection unit and a second inspection unit are provided, The said control part conveys a board | substrate so that a board | substrate may be conveyed from a board | substrate accommodating part in order of one mounting stand of the 1st test | inspection part, one mounting stand of the 2nd test | inspection part, the other mounting stand of the 1st test | inspection part, and the other mounting stand of the 2nd test | inspection part. Characterized in that it has a function to control the means Probe device. The method of claim 2, The first and second inspection sections are arranged such that two probe cards of the first inspection section and two probe cards of the second inspection section are arranged in a line, and the substrate conveying means is shared for these inspection sections. Probe device. 4. The method according to any one of claims 1 to 3, In the inspection section, when one mounting table is performing an imaging operation in which part of the moving regions overlap each other, movement of the other mounting table of the inspection section is prohibited. Probe device.

Images