JPH10144761A - Wafer processing device system, wafer processing device, and use of wafer processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a wafer processing device which is high enough in general- purpose properties to process a lot of wafers in a short time, wherein the test other than a loader can be effectively used when one of the loaders is out of order. SOLUTION: A wafer processing device system is composed of wafer processing devices each composed of stages 34a and 34b, wafer transfer sections 31a and 31b which take out wafers from the cassettes 131a and 131b capable of housing wafers and transferring them to the stages 34a and 34b, and control means 38a and 38b which control the stages 34a and 34b and the wafer transfer sections 31a and 31b in movement, wherein a positioning means 51 to fix the wafer processing device in such a positional relation that a wafer transfer section is capable of delivering a wafer to another wafer processing device and a communication means between the control means 38a and 38b are provided. The control means 38a and 38b control a wafer processing device loaded with cassettes so as to transfer wafers to another wafer processing device loaded with no cassettes if a wafer processing device loaded with no cassettes is present.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer processing apparatus for performing processing such as measurement and dicing of a semiconductor wafer and a method of using the same.
Wafer processing apparatus system capable of processing a plurality of wafers stored in one wafer cassette and supplied to one wafer processing apparatus in parallel by a plurality of wafer processing apparatuses, and a wafer processing apparatus and wafer processing used therein It relates to how to use the device.

[0002]

2. Description of the Related Art Various apparatuses for processing semiconductor wafers are used. For example, when testing whether a large number of chips formed on a wafer operate normally, the wafer is set in a device called a prober, and a stylus (needle) is brought into contact with an electrode pad of the chip, and then an IC tester is used. To apply an electric signal to a predetermined needle, and detect an electric signal output to another needle. The wafer inspected in this way is cut off by a dicing device. The present invention can be applied to any apparatus that processes wafers. Here, a wafer inspection apparatus combining a prober and a tester used for inspection will be described as an example.

FIG. 1 is a diagram showing a schematic configuration of a conventional example of the most general wafer inspection apparatus. In FIG. 1, reference numeral 10 denotes a prober, 100 denotes a wafer to be inspected, and a plurality of wafers 100 are stored and supplied in a wafer cassette 101, and are returned to the wafer cassette 101 again after the inspection and collected. . Reference numeral 11 denotes a driving unit of the transfer arm 12, which has a mechanism for extending and contracting and rotating the transfer arm 12. Generally, the mechanism 11 and the transfer arm 12 are collectively called a loader. Further, the distal end portion of the transfer arm 12 can suck and fix the placed wafer 100. Reference numeral 13 denotes a moving mechanism that moves the mounted wafer cassette 101 up and down. Reference numeral 14 denotes a stage for holding a wafer during inspection, which is movable in a three-dimensional direction by a moving mechanism, and is similarly provided with a mechanism for sucking the wafer. Reference numeral 15 denotes a probe card, on which needles 16 arranged in accordance with the electrode pads of the chip are provided, and electrodes connected to the needles 16 are provided on the upper surface. Reference numeral 17 denotes a tester, which rotates around a rotation shaft 18 at the time of inspection and contacts an electrode of the probe card.

When performing an inspection, the arm driving unit 11 is driven to move the transfer arm 12 to a position below the wafer 100 accommodated in the wafer cassette 101. In this state, when the wafer cassette 101 is moved downward by the moving mechanism 13, the wafer 100 is placed on the transfer arm 12. In this state, the wafer 100 is sucked, and the transfer arm 1
After pulling out the wafer 2, the wafer is rotated to move the wafer onto the stage 14. As will be described later, since the projecting pins come out from the stage 14 and the wafer 100 is placed thereon, the transfer arm 12 is returned, and then the wafer is placed on the stage 14 by returning the projecting pins downward. It will be adsorbed. In this state or under the probe card 15, the positioning is precisely performed by an image system (not shown), and the probe card 15 is moved upward from the under state to contact the needle 16 with the electrode pad of the chip. Then, the tester 17 is rotated to the measurement position, and the test is performed with the tester connected to the electrode pads of the chip. After all the chips have been inspected, the inspected wafers pass through the reverse path to the wafer cassette 10.
Returned to 1. The wafer cassette 10 is moved by the moving mechanism 13.
1 is moved to inspect the next wafer, inspection of all wafers is completed, and when all wafers are returned to wafer cassette 101, wafer cassette 101 is collected.
In some cases, a plurality of wafer cassettes 101 can be set.

[0005] As shown in FIG.
Generally, one tester is provided with one stage and one transfer arm, and all the wafers in the set wafer cassette 101 are processed by the prober. When the loader takes out the wafer from the wafer cassette 101 and returns the wafer, the moving mechanism 13 moves the wafer cassette 101, and the stage can also move up and down. Move in the direction. Therefore, it is common that the loader is not provided with a vertical moving mechanism.

In a semiconductor wafer manufacturing process, production is performed in lot units. Generally, wafers of a certain lot are housed in the same wafer cassette and supplied to each prober. Therefore, in the inspection process in which many probers are operated, inspection of wafers of different lots is performed in parallel. Here, there is a case where it is necessary to preferentially process a certain lot due to a problem of management of a manufacturing process. In order to perform such processing, the wafers of the lot are distributed to a plurality of wafer cassettes, and they are supplied to a plurality of probers for inspection in parallel. It is not preferable from the aspect of sex.

Japanese Patent Publication No. Hei 5-37496 has a combination of a plurality of processing sections and stages, and a common loader.
It discloses a configuration in which a plurality of wafers housed in one wafer cassette are distributed to each set of a processing portion and a stage for processing. FIG. 2 is a view showing a wafer inspection apparatus having such a configuration, in which a wafer is taken out from one wafer cassette 101 by a common loader 21 and two stages 24 and 2
Distribute to 4 '. Although the tester part is omitted,
Two are provided on both sides. With such a configuration,
Since a plurality of wafers in the wafer cassette are processed in parallel, wafers in the wafer cassette, that is, wafers of one lot, can be processed in a short time. In addition, since the loader is shared, there is an advantage that the installation area is reduced.

[0008]

In the wafer processing apparatus having the structure shown in FIG. 2, since the loader is shared, if the loader fails, two processing apparatuses cannot be used, and the influence of the failure increases. There is a problem. At present, there are many failures in the loader part of the prober, and this is a major problem.

In the apparatus shown in FIG. 2, the loader part is shared, but the other parts are equivalent to two units.
The size of the whole device becomes very large. Therefore, there is a problem that installation and movement are difficult, and the degree of freedom during installation is limited. Further, the apparatus shown in FIG. 2 is suitable for the above purpose, but conversely cannot be used as an individual processing apparatus and has a problem of lack of versatility.
For example, it was not possible to change the program of one tester and use it as a separate inspection device.

According to the present invention, wafers of one lot can be processed in a short time, and even if one of the loaders fails, the parts other than the loader part can be effectively used, so that they can be used as small and individual devices. The purpose is to:

[0011]

FIG. 3 is a diagram showing a basic configuration of a wafer processing apparatus system according to the present invention. In the present invention, as shown, a system is constructed by combining a plurality of individually usable wafer processing apparatuses (two in the figure) 30a and 30b, and the wafers of one wafer cassette are concurrently processed by the plurality of wafer processing apparatuses. So that it can be processed. In order to realize such a system, a means 51 for fixing the positional relationship between a plurality of wafer processing apparatuses and a communication means 39 between the control units 38a and 38b for controlling the loaders of different apparatuses in cooperation with each other. Is necessary.

That is, the wafer processing system according to the present invention comprises a stage 34a, 34b for holding a wafer and a wafer cassette 131a, 131b capable of accommodating a plurality of wafers during processing such as inspection of the wafer. Transfer units 31a and 31b for taking out the wafer and transferring them to stages 34a and 34b, and stages 34a and 34
b and a wafer processing apparatus system constructed by combining a plurality of wafer processing apparatuses each including control means 38a and 38b for controlling the movement of the wafer transfer sections 31a and 31b.
In this system, in order to achieve the above object, a positioning means 5 for fixing a plurality of wafer processing apparatuses to be combined so that the wafers can be transferred to another wafer processing apparatus by the wafer transfer units 31a and 31b.
And communication means 39 for performing communication between the control means 38a and 38b of a plurality of wafer processing apparatuses to be combined.
The control means 38a and 38b include a wafer cassette 131 in a plurality of wafer processing apparatuses to be combined.
When there is a wafer processing apparatus in which the wafer cassettes 131a and 131b are not set, the wafer cassettes 131a and 131b are moved from the wafer processing apparatus in which the wafer cassettes 131a and 131b are set.
The wafer transfer units 31a and 31b are controlled so as to transfer a wafer to a wafer processing apparatus in which 31b is not set.

As described above, each wafer processing apparatus constituting the wafer processing apparatus system of the present invention has the same configuration as the conventional apparatus shown in FIG. 1 and can be used individually. That is, it is versatile. Since such a general-purpose wafer processing apparatus is fixed in a predetermined positional relationship by the positioning means 51, it is possible to transfer a wafer. Each wafer processing apparatus has a control unit for controlling a wafer transfer unit (loader). However, in order to transfer a wafer, loaders of different apparatuses need to operate in cooperation. The communication means enables control units of different apparatuses to perform control operations in cooperation with each other, so that wafer transfer is possible. Therefore, even if the loader of one wafer processing apparatus fails, it is possible to use the loader of another wafer processing apparatus that operates normally to supply wafers to the failed wafer processing apparatus for processing. become.
In the conventional example shown in FIGS. 1 and 2, since there is only one loader in one device, if the loader fails, the device cannot be used. On the other hand, with the wafer processing apparatus system of the present invention, even if one loader fails, the operation of both apparatuses can be maintained, and the failed loader can be repaired during that time. In addition, the operation rate of the device can be increased.

In the wafer processing apparatus system according to the present invention, it is possible to process a wafer in a wafer cassette set in one apparatus by a plurality of wafer processing apparatuses. If there is no
It is also possible to set a wafer cassette accommodating a wafer to be processed in each wafer processing apparatus and perform the processing. In this case, the method of use is the same as the conventional method in which each wafer processing apparatus is used independently. Further, when the wafer processing apparatuses are installed, each of the wafer processing apparatuses can be installed, fixed by the positioning means 51 and connected by the communication means 39, so that the installation is easy.

The wafers taken out of the wafer cassettes 131a and 131b are generally collected in the same wafer cassette after processing, but different wafer cassettes may be used for supply and recovery. Although the wafer processing apparatus is fixed in a positional relationship as shown in FIG. 3, in order to arrange the wafer processing apparatus in such a positional relationship, the combined wafer processing apparatus may have a symmetric shape with respect to an adjacent surface at the time of arrangement. desirable.

[0016]

FIG. 4 is a top view of a first embodiment of a wafer inspection system comprising a prober and a tester to which the present invention is applied, and shows an example in which two wafer inspection apparatuses are combined. is there. In FIG. 4, reference numerals 30a and 30b denote two probers to be combined. Prober 30a
Is a loader 31a, a stage 34a, and a control unit 38a.
And a wafer holding mechanism 40a, and a tester 37a is attached. The prober 30b has a similar configuration, but is symmetrical to the prober 30a as shown in the figure. The control units 38a and 38b are provided with communication ports 41a and 41b, respectively, and are connected by a communication cable 39.
In addition, the control units 38a and 38b
a and 37b, but are not shown here. 131a and 131b are wafer cassettes.
51 is a member for fixing the probers 30a and 30b,
Thus, the probers 30a and 30b have a predetermined positional relationship.

The transfer of the wafer between the probers 30a and 30b is performed using the wafer holding mechanisms 40a and 40b. FIG. 5 is a diagram showing the structure of the wafer holding mechanisms 40a and 40b. In FIG. 5, reference numeral 61 denotes a rotating member rotatable with respect to the base 64, which is rotated by a driving member (not shown). The rotating member 61 is provided with a protruding pin 62 that moves up and down by a motor 63, and the wafer 100 is mounted on the protruding pin 62.

Referring to FIG. 4, a case where a wafer is transferred from the right prober 30b to the left prober 30a will be described. First, after the loader 31a is retracted to the state shown in FIG. 4, the loader 31b moves the tip of the arm below the wafer stored in the wafer cassette 131b, and the wafer cassette 131b is moved downward by a vertical movement mechanism (not shown). To place the wafer on the tip of the arm. The loader sucks and pulls out the wafer, and rotates in the counterclockwise direction to move the wafer onto the wafer holding mechanism 40a. In this state,
When the suction is released and the protruding pins 42 protrude upward, the wafer separates from the loader 31b and is placed on the protruding pins 62. The loader 31b retracts the arm and rotates to return to a position where it does not protrude to the left. Next, the wafer holding mechanism 40a rotates by a predetermined angle. This rotation is performed so that the arm does not hit the protruding pin 62 when the arm is extended from the loader 31a, and to rotate the wafer in a desired direction.
Next, the loader 31a rotates to extend the tip of the arm between the projecting pins 62 of the wafer holding mechanism 40a. When the protruding pins 62 move downward in this state, the wafer is loaded into the loader 31a.
Since it is placed on the tip of the arm, it is sucked. Then, the loader 31a rotates to transfer the wafer to the stage 34a. The rest is the same as before. When returning the inspected wafer from the prober 30a on the left side to the wafer cassette 131b of the prober 30b on the right side, the operation reverse to the above is performed. If the adjustment of the rotation direction of the wafer is performed on the stage and the tip of the arm does not hit the protruding pin 62 without rotating, the rotation mechanism of the wafer holding mechanism is not necessary. Further, in FIG. 4, the wafer holding mechanisms 40a and 40b are provided in both the probers 30a and 30b. However, as described above, it is possible to transfer the wafer by only one of them.

In the wafer inspection system according to the first embodiment, when the wafer cassette is set to only one of the wafer cassettes and the wafer in the wafer cassette is instructed to be processed in parallel by a prober without the wafer cassette,
Perform processing in parallel. FIGS. 6 and 7 are flowcharts showing the processing operation of the control unit of each prober in the wafer inspection system of the first embodiment.

In step 201, it is detected whether or not the wafer cassette has been set. If the wafer cassette has not been set, in step 231 the control unit of the other apparatus is notified that the cassette has not been set. Then, in step 232, a notification is received as to whether a cassette is set in the other apparatus and processing is performed in parallel. This processing is called double processing. If it is not a double process, the process returns to step 201. At the time of double processing, this apparatus receives and processes a wafer from the other apparatus, and delivers the processed wafer. The process in this case is Step 2
41 and below.

When it is detected in step 201 that a cassette has been set, a notification is sent in step 202 as to whether the cassette has been set in the other device. Since this is a normal process for processing the wafers in the cassette, the normal process is performed, and if not set, the wafer is transferred from this device to the other device, and the double process for receiving the processed wafer is performed. In step 204, the other device is notified of the double process. Step 2
In step 04, a register is set which indicates that the wafer is empty in this apparatus and the other apparatus, that is, the wafer is not inspected, that is, the wafer is not set on the stage.

In step 205, it is determined whether untested wafers remain in the cassette. If not, it is determined in step 220 whether both devices are empty, and if empty, the completion of the inspection of this cassette is displayed in step 221 and the process returns to step 201.
If any one is under inspection, the process proceeds to step 206.
The process also proceeds to step 206 when untested wafers remain in the cassette.

In step 206, it is determined whether a new wafer can be inspected while the apparatus is empty. If it is empty, regardless of the other device, the loading process is performed in step 207, the register is reset in step 208 to indicate that this device is not empty, and the process returns to step 205. If it is determined in step 206 that this device is not empty, it is determined in step 209 whether the other device is empty. If empty, step 216
In order to transfer the wafer to the other device, the wafer holding mechanism 4
A process for loading a wafer into either 0a or 40b is performed, and the process returns to a predetermined position in step 217. in this way,
The reason for returning to the predetermined position after the loading process to the wafer holding mechanism is to prevent the loaders of the other apparatus from hitting each other when receiving the wafer held by the wafer holding mechanism. In step 218, the other device is notified that the loading process to the wafer holding mechanism has been completed, and in step 219, the register is reset to indicate that the other device is not empty, and the process returns to step 205.

If it is determined in step 209 that the other device is not empty, in step 210, the inspection by this device is completed and the stage on which the inspected wafer is mounted has returned to a predetermined position. Is determined. If the inspection has been completed, the process of collecting the wafer is performed in step 211, and a register is set in step 212 to indicate that the apparatus is empty, and the process returns to step 205.

If the inspection in this apparatus has not been completed in step 210, the inspection in the other apparatus has been completed in step 213, and it is determined whether the inspected wafer has been transferred to the wafer holding mechanism. This information is sent from the other device. If the inspection in the other device has not been completed, the process returns to step 205;
The collecting process from the wafer holding mechanism is performed in step 21.
The register is set to indicate that the other device is empty at 5, and the process returns to step 205.

The above is the processing when the cassette is set on the side where the cassette is set in the double processing. When the cassette is not set and the wafer is received,
At step 240, a register indicating whether the device is empty is set to indicate an empty state, and step 241 is executed.
Then, it is determined whether or not it is empty. If empty, the loader is moved to the reset position (retreat position) in step 242,
It waits for a notification indicating that the loading from the other device to the wafer holding mechanism has been completed. If it is detected in step 243 that this notification has been received, loading processing from the wafer holding mechanism to the stage is performed in step 244, and the register is reset to indicate that it is not empty in step 245, and the process returns to step 241.

If it is determined in step 241 that the inspection is not empty, it is determined in step 246 whether the inspection is completed, and the process waits until the inspection is completed. When the inspection is completed, a recovery process is performed in step 247, and the inspected wafer is transferred to the wafer holding mechanism. In step 248, the process returns to the retreat position, and in step 249, the register is set to indicate that it is empty, and the process returns to step 241.

As described above, the transfer of the wafer is performed by the two devices performing the load processing in cooperation with each other while performing the communication by the communication means. In the first embodiment, the wafer holding mechanism is provided for transferring the wafer. However, depending on the arrangement on the apparatus, the wafer can be transferred without providing such a wafer holding mechanism. The second and third embodiments are such embodiments.

FIG. 8 is a top view of the wafer processing apparatus system of the second embodiment. In the figure, the control unit, the communication cable, and the like are omitted, but these are provided similarly to FIG. The difference from the first embodiment is that the stage 34a is configured to be movable to a position where the wafer can be transferred to and from the other loader 31b. Similarly, the stage 34b can be moved to a position where the wafer can be transferred to and from the other loader 31a. The stage is provided with protruding pins as shown in FIG. 5 for transferring the wafer to and from the loader. This is as usual. In the figure, the loader 31b transfers the wafer taken out of the wafer cassette 131b directly to the stage 34a. Therefore, the left loader 31a is always in the retracted state. This means that even if the loader 31a breaks down, wafers can be supplied to both devices from the cassette 131b. In the wafer processing system of the second embodiment as well, in order to transfer a wafer, the stage needs to operate in cooperation with the other loader. Since this operation can be easily understood from the description of the first embodiment, the description is omitted here.

FIG. 9 is a diagram showing a wafer processing apparatus system according to the third embodiment, and (1) is a top view thereof. In the figure,
Although a control unit, a communication cable and the like are omitted, these are provided similarly to FIG. The difference from the first embodiment and the second embodiment is that the transfer of the wafer between the loaders 31a and 31b is enabled. The arms 32a and 32b of the loaders 31a and 32a are shaped as shown in FIG. 9 (2) in order to enable the transfer of wafers between the loaders. The arms 32a and 32b are vertically movable as shown in FIG. 9 (3). With such a shape, the wafer can be placed on any of the arms in the state shown in FIG. 9 (2). When transferring the wafer, as shown in FIG. 9C, the receiving arm 32b is moved to a position below the transferring arm 32a. At this time, when viewed from above, the state is as shown in FIG. 9 (2). When the arm 32b is raised above the arm 32a, the wafer is placed on the arm 32b and is delivered.

[0031]

As described above, according to the present invention,
Combining versatile and independently usable wafer processing equipment, one lot of wafers can be processed in a short time,
Further, even if one of the loaders fails, a wafer processing apparatus system that can effectively use portions other than the loader portion can be easily realized.

[Brief description of the drawings]

FIG. 1 is a diagram showing a basic configuration of a conventional general wafer inspection apparatus.

FIG. 2 is a diagram showing a configuration of a conventional wafer inspection apparatus capable of processing wafers of one lot in a short time.

FIG. 3 is a diagram showing a basic configuration of a wafer processing apparatus system according to the present invention.

FIG. 4 is a top view of the wafer processing apparatus system according to the first embodiment.

FIG. 5 is a diagram showing a structure of a wafer holding mechanism of the first embodiment.

FIG. 6 is a flowchart illustrating a processing operation of each apparatus in the wafer processing apparatus system according to the first embodiment.

FIG. 7 is a flowchart illustrating a processing operation of each apparatus in the wafer processing apparatus system according to the first embodiment.

FIG. 8 is a top view of a wafer processing apparatus system according to a second embodiment.

FIG. 9 is a top view of a wafer processing apparatus system according to a third embodiment.

[Explanation of symbols]

 31a, 31b: Wafer transfer section (loader) 34a, 34b: Stage 37a, 37b: Tester 38a, 38b: Control means 39: Communication means 40a, 40b: Wafer holding mechanism 41a, 41b: Communication port 51: Positioning means

Claims (15)

[Claims] 1. A stage (34a, 34b) for holding a wafer and a wafer cassette (131) capable of accommodating a plurality of wafers during a process such as inspection of the wafer.
a, 131b) to take out the wafer and transport it to the stage (34a, 34b).
a, 31b), and control means (38) for controlling the movement of the stage (34a, 34b) and the wafer transfer section (31a, 31b).
a, 38b), wherein the plurality of combined wafer processing apparatuses are transferred to another wafer processing apparatus by the wafer transfer units (31a, 31b). Positioning means (51) for fixing the wafer processing apparatus so that the wafers can be transferred, and communication means (39) for performing communication between the control means (38a, 38b) of the plurality of wafer processing apparatuses to be combined. The control means (38a, 38b) is configured to control the wafer cassette (131) when the wafer cassette (131a, 131b) is not set in the plurality of wafer processing apparatuses to be combined. 131a,
The wafer transfer unit (31a, 31b) is controlled so as to transfer a wafer from the wafer processing apparatus in which the wafer cassette (131b) is set to a wafer processing apparatus in which the wafer cassette (131a, 131b) is not set. Processing equipment system. 2. The wafer processing system according to claim 1, wherein the wafer taken out of the wafer cassettes (131a, 131b) is processed and then processed by the wafer cassette (131).
a, 131b), and after the processing of the wafer transported to the wafer processing apparatus in which the wafer cassette (131a, 131b) is not set is completed, the control means (38a, 38b) removes the wafer. The wafer cassettes (131a, 131b) are transported from the wafer processing apparatus in which the wafer cassettes (131a, 131b) are not set to the wafer processing apparatus in which the wafer cassettes (131a, 131b) are set.
b) so as to be collected in the wafer transfer section (31a,
31b) a wafer processing apparatus system for controlling 3. The wafer processing apparatus system according to claim 1, wherein the plurality of wafer processing apparatuses to be combined have a symmetrical shape with respect to an adjacent surface at the time of arrangement. 4. The wafer processing apparatus system according to claim 1, wherein at least one of the two adjacent wafer processing apparatuses includes a wafer transfer unit (31a) of both of the wafer processing apparatuses. , 31b)
The wafer transfer section (31)
a, a wafer processing apparatus system including a wafer holding means (40a, 40b) capable of transferring a wafer to and from the wafer processing apparatus. 5. The wafer processing apparatus system according to claim 4, wherein said wafer holding means (40a, 40b) includes a vertical moving means for vertically moving said wafer. 6. The wafer processing apparatus system according to claim 4, wherein said wafer holding means (40a, 40b) includes rotation means for rotating said wafer. 7. The wafer processing system according to claim 4, wherein the control means on the side for transferring the wafer receives the wafer from the control means on the side for receiving the wafer. After being notified via the communication means (39) that the wafer transfer section has been retracted, the wafer transfer section on the side for transferring the wafer is controlled to transfer the wafer to the wafer holding means, and receives the wafer. Via the communication means that the transfer of the wafer from the control means on the wafer transfer side to the wafer holding means has been completed and the wafer transfer unit on the wafer transfer side has been retracted through the communication means A wafer processing apparatus system that controls the wafer transfer unit on the side that receives a wafer to receive a wafer from the wafer holding unit after being notified. 8. The wafer processing apparatus system according to claim 1, wherein the stage (34a, 34b) is a wafer transfer unit (31a, 31b) of another adjacent wafer processing apparatus. ) Is movable within a range in which the wafer can be transferred, and the control means of the wafer processing apparatus having the stage retracts the wafer transfer section to a position away from the stage during transfer of the wafer. 9. The wafer processing apparatus system according to claim 1, wherein the wafer transfer section (31a, 31b) is vertically movable and a wafer of another adjacent wafer processing apparatus. Transport unit (31
a, 31b) in a range in which a wafer can be transferred, and transfer of a wafer between adjacent wafer processing apparatuses is performed between the wafer transfer units (31a, 31b). 10. A stage (34a, 34b) for holding a wafer while processing such as inspection on the wafer is performed.
And a wafer cassette (131) capable of accommodating a plurality of wafers.
a, 131b) to take out the wafer and transport it to the stage (34a, 34b).
a, 31b), and control means (38) for controlling the movement of the stage (34a, 34b) and the wafer transfer section (31a, 31b).
a, 38b), a communication port (41) for communicating with another wafer processing apparatus.
a, 41b), and the control means (38a, 38b) communicates with the communication port (41a, 41b) with another wafer processing apparatus arranged adjacently.
b) so as to transfer a wafer to and from another wafer processing apparatus while communicating via the wafer transfer unit (31).
a, 31b) is controlled. 11. The wafer processing apparatus according to claim 10, wherein the wafers taken out of the wafer cassettes (131a, 131b) are processed and the wafer cassettes (131) are processed.
a, 131b). 12. The wafer processing apparatus according to claim 10, wherein a wafer holding unit (40a, 40b) for transferring a wafer to and from another wafer processing apparatus is provided in the wafer transfer unit (40). 31a) and 31b) are provided in a range in which a wafer can be transferred. 13. The wafer processing apparatus according to claim 12, wherein the wafer holding means (40a, 40b) includes a vertical movement means for vertically moving the wafer. 14. The wafer processing apparatus according to claim 12, wherein said wafer holding means (40a, 40b) includes rotation means for rotating said wafer. 15. A stage (34a, 34b) for holding a wafer while processing such as inspection of the wafer is performed, and a wafer cassette (131) capable of accommodating a plurality of wafers.
a, 131b) to take out the wafer and transport it to the stage (34a, 34b).
a, 31b) when using a plurality of wafer processing apparatuses in combination, wherein the wafer transfer unit (31a, 31b) can transfer the wafer to another wafer processing apparatus. When the processing apparatuses are arranged adjacent to each other, and there is a wafer processing apparatus in which the wafer cassettes (131a, 131b) are not set, the wafer processing apparatus in which the wafer cassettes (131a, 131b) are set is connected to the wafer cassettes (131a, 131b). The method of using a wafer processing apparatus, wherein the wafer in () is processed by the wafer processing apparatus, and the wafer is transferred so as to be transferred to a wafer processing apparatus in which the wafer cassette is not set.