JP5894825B2 - Probe apparatus and wafer transfer unit - Google Patents

Probe apparatus and wafer transfer unit Download PDF

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JP5894825B2
JP5894825B2 JP2012063864A JP2012063864A JP5894825B2 JP 5894825 B2 JP5894825 B2 JP 5894825B2 JP 2012063864 A JP2012063864 A JP 2012063864A JP 2012063864 A JP2012063864 A JP 2012063864A JP 5894825 B2 JP5894825 B2 JP 5894825B2
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semiconductor wafer
lid
latch
opening
closing
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JP2013197375A (en
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秋山　収司
収司 秋山
浩 雨宮
浩 雨宮
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

本発明は、プローブ装置及びウエハ搬送ユニットに関する。   The present invention relates to a probe apparatus and a wafer transfer unit.

半導体デバイスの製造工程では、半導体ウエハ上に形成された半導体デバイスの電気的な検査を行うためのプローブ装置が用いられている。このようなプローブ装置としては、載置台に載置された半導体ウエハの半導体デバイスにプローブを接触させて電気的な測定を行う測定部と、ウエハ収納容器（ＦＯＵＰ）を載置するロードポート及びウエハ収納容器と載置台との間で半導体ウエハを搬送する搬送機構等を備えた搬送ユニットとを組み合わせた構成とされているものが知られている（例えば、特許文献１参照。）。   In the manufacturing process of a semiconductor device, a probe apparatus for performing an electrical inspection of a semiconductor device formed on a semiconductor wafer is used. As such a probe apparatus, there are a measurement unit that performs electrical measurement by bringing a probe into contact with a semiconductor device of a semiconductor wafer mounted on a mounting table, a load port and a wafer on which a wafer storage container (FOUP) is mounted. 2. Description of the Related Art There is known a configuration in which a transfer unit including a transfer mechanism that transfers a semiconductor wafer between a storage container and a mounting table is combined (for example, see Patent Document 1).

また、上記プローブ装置及びウエハ搬送ユニットにおいては、ウエハ収納容器（ＦＯＵＰ）の蓋の開け閉めを行う蓋開閉機構を具備したものが知られている。この蓋開閉機構は、蓋を保持するとともに、蓋に配設されたラッチを開閉するためのラッチ開閉用駆動機構を具備した保持部と、この保持部を上下動させる上下駆動機構と、保持部と蓋とを近接離間させる水平駆動機構とを具備した構成となっている。   Further, the probe apparatus and the wafer transfer unit are known to have a lid opening / closing mechanism for opening and closing the lid of the wafer storage container (FOUP). The lid opening / closing mechanism includes a holding unit having a latch opening / closing driving mechanism for holding the lid and opening / closing a latch disposed on the lid, a vertical driving mechanism for moving the holding unit up and down, and a holding unit And a horizontal drive mechanism that brings the lid close to and away from the lid.

特開２００８−２３５８４５号公報JP 2008-235845 A

上記のとおり、プローブ装置及びウエハ搬送ユニットにおいては、ウエハ収納容器（ＦＯＵＰ）の蓋の開け閉めを行う蓋開閉機構を具備したものが知られており、蓋開閉機構は、蓋に配設されたラッチを開閉するためのラッチ開閉用駆動機構、蓋を移動させて開閉するための上下動機構、蓋開閉機構と蓋とを近接及び離間させるための水平駆動機構等の駆動機構を有した構成となっている。   As described above, the probe device and the wafer transfer unit are known to have a lid opening / closing mechanism for opening and closing the lid of the wafer storage container (FOUP), and the lid opening / closing mechanism is disposed on the lid. A structure having a drive mechanism such as a latch opening / closing drive mechanism for opening / closing the latch, a vertical movement mechanism for moving the lid to open / close, a horizontal drive mechanism for moving the lid opening / closing mechanism and the lid close to each other, and the like. It has become.

しかしながら、上記のプローブ装置及びウエハ搬送ユニットにおいても、省資源化を図り、製造コストを削減することが求められている。   However, in the above probe apparatus and wafer transfer unit, it is required to save resources and reduce manufacturing costs.

本発明は、上記従来の事情に対処してなされたものであり、従来に比べてウエハ搬送、スループット向上と省資源化を図り、かつ蓋を移動させて開閉するための上下動機構の共有化における削減と製造コストを削減することのできるプローブ装置及びウエハ搬送ユニットを提供することを目的とする。   The present invention has been made in response to the above-described conventional circumstances, and is capable of transferring wafers, improving throughput and saving resources, and sharing a vertical movement mechanism for opening and closing by moving the lid. It is an object of the present invention to provide a probe apparatus and a wafer transfer unit that can reduce the manufacturing cost and the manufacturing cost.

本発明のプローブ装置の一態様は、半導体ウエハに形成された半導体デバイスの電気的な検査を行うプローブ装置であって、載置台上に載置された前記半導体ウエハの前記半導体デバイスにプローブを接触させて電気的な測定を行う測定部と、半導体ウエハ収納容器が載置されるロードポートと、上下駆動機構と、回転駆動機構と、水平駆動機構とを有し、前記半導体ウエハ収納容器と前記載置台との間で前記半導体ウエハを搬送可能とされたウエハ搬送機構と、前記ウエハ搬送機構の前記上下駆動機構によって上下動可能とされ、前記半導体ウエハ収納容器の蓋を開閉する蓋開閉機構と、を具備し、前記蓋開閉機構は、前記蓋を吸着する吸着機構と、前記蓋の複数のラッチ機構を開閉するラッチ開閉機構とを具備し、前記ラッチ開閉機構は、１つの駆動機構と当該駆動機構に接続されたリンク機構によって、複数の前記ラッチ機構を開閉するよう構成されるとともに、前記ラッチ開閉機構の動きを検出して、前記ラッチ機構の開位置を検出する１つの開位置センサ及び閉位置を検出する１つの閉位置センサを有することを特徴とする。 One aspect of the probe apparatus of the present invention is a probe apparatus that performs an electrical inspection of a semiconductor device formed on a semiconductor wafer, and the probe is brought into contact with the semiconductor device of the semiconductor wafer mounted on a mounting table. A measurement unit that performs electrical measurement, a load port on which the semiconductor wafer storage container is placed, a vertical drive mechanism, a rotation drive mechanism, and a horizontal drive mechanism. A wafer transfer mechanism capable of transferring the semiconductor wafer to and from the mounting table; and a lid opening / closing mechanism configured to move up and down by the vertical drive mechanism of the wafer transfer mechanism and open and close the lid of the semiconductor wafer storage container; , comprising a, the cover opening and closing mechanism includes a suction mechanism for sucking the lid, comprising a latch closing mechanism for opening and closing a plurality of latching mechanisms of the lid, the latch closing mechanism A plurality of latch mechanisms are configured to be opened and closed by one drive mechanism and a link mechanism connected to the drive mechanism, and the movement of the latch open / close mechanism is detected to detect the open position of the latch mechanism. It has one open position sensor and one closed position sensor for detecting a closed position .

本発明のウエハ搬送システムの一態様は、半導体ウエハ収納容器が載置されるロードポートと、上下駆動機構と、回転駆動機構と、水平駆動機構とを有し、前記半導体ウエハ収納容器内内の前記半導体ウエハを出し入れするウエハ搬送機構と、前記ウエハ搬送機構の前記上下駆動機構によって上下動可能とされ、前記半導体ウエハ収納容器の蓋を開閉する蓋開閉機構と、を具備し、前記蓋開閉機構は、前記蓋を吸着する吸着機構と、前記蓋の複数のラッチ機構を開閉するラッチ開閉機構とを具備し、前記ラッチ開閉機構は、１つの駆動機構と当該駆動機構に接続されたリンク機構によって、複数の前記ラッチ機構を開閉するよう構成されるとともに、前記ラッチ開閉機構の動きを検出して、前記ラッチ機構の開位置を検出する１つの開位置センサ及び閉位置を検出する１つの閉位置センサを有することを特徴とする。 One aspect of the wafer transfer system of the present invention includes a load port on which a semiconductor wafer storage container is placed, a vertical drive mechanism, a rotation drive mechanism, and a horizontal drive mechanism. a wafer transfer mechanism for loading and unloading the semiconductor wafer, said by the vertical drive mechanism of the wafer transfer mechanism is vertically movable, anda lid opening and closing mechanism for opening and closing the lid of the semiconductor wafer storage container, the lid opening and closing mechanism Comprises a suction mechanism for sucking the lid and a latch opening / closing mechanism for opening / closing a plurality of latch mechanisms of the lid, and the latch opening / closing mechanism is constituted by one drive mechanism and a link mechanism connected to the drive mechanism. A plurality of latch mechanisms configured to open and close, and a movement of the latch opening / closing mechanism to detect an open position of the latch mechanism. And having one closed position sensor for detecting the support and a closed position.

本発明によれば、従来に比べてウエハ搬送、スループット向上と省資源化を図り、製造コストを削減することのできるプローブ装置及びウエハ搬送ユニットを提供することができる。   According to the present invention, it is possible to provide a probe apparatus and a wafer transfer unit capable of reducing the manufacturing cost by improving the wafer transfer, throughput, and resource saving as compared with the prior art.

本発明の一実施形態に係るプローブ装置の全体構成を模式的に示す図。The figure which shows typically the whole structure of the probe apparatus which concerns on one Embodiment of this invention. 図１のプローブ装置の搬送ユニットの構成を模式的に示す図。The figure which shows typically the structure of the conveyance unit of the probe apparatus of FIG. 図２の搬送ユニットの要部構成を模式的に示す図。The figure which shows typically the principal part structure of the conveyance unit of FIG. 図２の搬送ユニットの要部構成を模式的に示す図。The figure which shows typically the principal part structure of the conveyance unit of FIG. 図２の搬送ユニットの要部構成を模式的に示す図。The figure which shows typically the principal part structure of the conveyance unit of FIG. 図２の搬送ユニットの要部構成を模式的に示す図。The figure which shows typically the principal part structure of the conveyance unit of FIG.

以下、本発明の実施形態を、図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１は、本発明の一実施形態に係るプローブ装置１００の全体構成を模式的に示す図である。図１に示すように、プローブ装置１００は、測定部１１０と、搬送ユニットであるローダー部１５０とからその主要部が構成されている。測定部１１０には、ｘ−ｙ−ｚ方向に移動可能とされ半導体ウエハＷが載置される載置台１１１が設けられており、図示しないプローブカードに配設されたプローブと、半導体ウエハＷの半導体デバイスの電極とを接触させて、半導体デバイスの電気的特性を測定するよう構成されている。   FIG. 1 is a diagram schematically showing an overall configuration of a probe apparatus 100 according to an embodiment of the present invention. As shown in FIG. 1, the probe apparatus 100 includes a measuring unit 110 and a loader unit 150 that is a transport unit. The measurement unit 110 is provided with a mounting table 111 that is movable in the xyz direction and on which the semiconductor wafer W is mounted. The probe disposed on a probe card (not shown) and the semiconductor wafer W An electrical characteristic of the semiconductor device is measured by contacting the electrode of the semiconductor device.

ローダー部１５０には、半導体ウエハ収納容器（ＦＯＵＰ）１５１が載置されるロードポート１５２が配設されており、このロードポート１５２に隣接してウエハ搬送機構１６０が配設されている。また、図２にも示すように、ウエハ搬送機構１６０のロードポート１５２とは反対側には、バッファテーブル１７０及び位置合わせ機構１７１が上下に重ねて配設されている。なお、バッファテーブル１７０は、プローブの針先を研磨するためのウエハ等を収容しておくためのものである。また、位置合わせ機構１７１は、半導体ウエハＷを回転させてノッチの位置と半導体ウエハＷの偏芯の状態を検出するよう構成されている。   The loader unit 150 is provided with a load port 152 on which a semiconductor wafer storage container (FOUP) 151 is placed. A wafer transfer mechanism 160 is provided adjacent to the load port 152. As shown in FIG. 2, a buffer table 170 and an alignment mechanism 171 are arranged on the opposite side of the wafer transfer mechanism 160 from the load port 152 so as to overlap each other. The buffer table 170 is for storing a wafer or the like for polishing the probe tip. The alignment mechanism 171 is configured to detect the position of the notch and the eccentric state of the semiconductor wafer W by rotating the semiconductor wafer W.

ウエハ搬送機構１６０は、図３に示すようなアームユニット１６１を具備している。アームユニット１６１は、上側アーム１８１と下側アーム１８２の上下二段に配設された半導体ウエハ保持用アームを具備している。これらの上側アーム１８１と下側アーム１８２は、その長手方向に沿って上側アーム１８１と下側アーム１８２とを夫々独立に水平方向に移動させる水平駆動機構としての上側アーム駆動機構１８３、下側アーム駆動機１８４を具備している。   The wafer transfer mechanism 160 includes an arm unit 161 as shown in FIG. The arm unit 161 includes a semiconductor wafer holding arm arranged in two upper and lower stages, an upper arm 181 and a lower arm 182. The upper arm 181 and the lower arm 182 include an upper arm drive mechanism 183 as a horizontal drive mechanism that moves the upper arm 181 and the lower arm 182 in the horizontal direction independently along the longitudinal direction, and a lower arm. A drive 184 is provided.

また、アームユニット１６１の上側アーム１８１及び下側アーム１８２の先端側には、半導体ウエハ収納容器１５１内の半導体ウエハＷの有無を検出するためのウエハセンサ１８５が配設されている。   A wafer sensor 185 for detecting the presence / absence of the semiconductor wafer W in the semiconductor wafer storage container 151 is disposed on the distal ends of the upper arm 181 and the lower arm 182 of the arm unit 161.

図２に示すように、上記アームユニット１６１は、このアームユニット１６１を回転させる回転駆動機構１６２の上に配設されており、回転駆動機構１６２によってアームユニット１６１全体が例えば１８０°の範囲で回転されるよう構成されている。また、回転駆動機構１６２は、この回転駆動機構１６２をＺ軸方向（上下方向）に移動させる上下駆動機構１６３の上に配設されている。   As shown in FIG. 2, the arm unit 161 is disposed on a rotation drive mechanism 162 that rotates the arm unit 161, and the entire arm unit 161 is rotated within a range of 180 °, for example, by the rotation drive mechanism 162. It is configured to be. The rotation drive mechanism 162 is disposed on a vertical drive mechanism 163 that moves the rotary drive mechanism 162 in the Z-axis direction (vertical direction).

また、ウエハ搬送機構１６０の上下駆動機構１６３には、半導体ウエハ収納容器（ＦＯＵＰ）１５１の蓋を開閉するための蓋開閉機構１９０が固定されており、この蓋開閉機構１９０は、ウエハ搬送機構１６０の上下駆動機構１６３によって上下動されるようになっている。   Further, a lid opening / closing mechanism 190 for opening and closing the lid of the semiconductor wafer storage container (FOUP) 151 is fixed to the vertical drive mechanism 163 of the wafer conveyance mechanism 160, and the lid opening / closing mechanism 190 is connected to the wafer conveyance mechanism 160. The vertical drive mechanism 163 moves up and down.

蓋開閉機構１９０は、蓋保持部１９１を備えている。図４に示すように、この蓋保持部１９１は、半導体ウエハ収納容器１５１の蓋を吸着保持するための２つの吸着保持部１９２と、半導体ウエハ収納容器１５１のラッチ機構を開閉して蓋を着脱するための２つのラッチ開閉機構１９３とを具備している。   The lid opening / closing mechanism 190 includes a lid holding portion 191. As shown in FIG. 4, the lid holding portion 191 opens and closes the two suction holding portions 192 for sucking and holding the lid of the semiconductor wafer storage container 151 and the latch mechanism of the semiconductor wafer storage container 151 to attach and detach the lid. And two latch opening / closing mechanisms 193 for performing the above.

これらのラッチ開閉機構１９３は、１つのシリンダ１９４と、このシリンダ１９４に接続されたリンク機構１９５によって、同時に回転される構成となっている。また、ラッチ開閉機構１９３の動きに応じてラッチ開閉機構１９３の動きを検出するための２つの位置センサ１９６、１９７が配設されている。これらの位置センサ１９６、１９７のうちの一方は、ラッチ機構の開位置を検出し、他方は、ラッチ機構の閉位置を検出するようになっている。   These latch opening / closing mechanisms 193 are configured to be simultaneously rotated by one cylinder 194 and a link mechanism 195 connected to the cylinder 194. Further, two position sensors 196 and 197 for detecting the movement of the latch opening / closing mechanism 193 according to the movement of the latch opening / closing mechanism 193 are provided. One of these position sensors 196, 197 detects the open position of the latch mechanism, and the other detects the closed position of the latch mechanism.

上記のように、１つのシリンダ１９４によって、２つのラッチ開閉機構１９３を回転させるよう構成されているので、２つのラッチ開閉機構１９３を夫々別のシリンダによって回転させる場合に比べて駆動機構としてのシリンダの数を削減することができる。また、２つのラッチ開閉機構１９３を夫々別のシリンダによって回転させる場合、夫々のラッチ開閉機構１９３について、開位置と閉位置とを検出するための位置センサを２つずつ合計４つ設ける必要があるが、本実施形態では、このような位置センサの数を２つとすることができ、位置センサの数も削減することができる。これによって、従来に比べて省資源化することができ、製造コストを削減することができる。   As described above, since the two latch opening / closing mechanisms 193 are rotated by one cylinder 194, the cylinder as a driving mechanism is compared with the case where the two latch opening / closing mechanisms 193 are rotated by different cylinders. The number of can be reduced. When the two latch opening / closing mechanisms 193 are rotated by different cylinders, it is necessary to provide a total of four position sensors for detecting the open position and the closed position for each latch opening / closing mechanism 193. However, in this embodiment, the number of such position sensors can be two, and the number of position sensors can also be reduced. As a result, resources can be saved as compared with the conventional case, and the manufacturing cost can be reduced.

上記蓋保持部１９１は、図５に示す水平方向駆動機構１９６を介して、図６に示すウエハ搬送機構１６０の上下駆動機構１６３の台座部１６３ａに固定されている。水平方向駆動機構１９６は、略垂直に固定された板状部材からなる固定部１９６ａを有しており、この固定部１９６ａに蓋保持部１９１が固定される。また、水平方向駆動機構１９６は、シリンダを具備しており、図５中矢印で示すように、固定部１９６ａ及びここに固定された蓋保持部１９１を水平方向に移動可能とされている。   The lid holding portion 191 is fixed to the base portion 163a of the vertical drive mechanism 163 of the wafer transfer mechanism 160 shown in FIG. 6 via the horizontal direction drive mechanism 196 shown in FIG. The horizontal driving mechanism 196 has a fixing portion 196a made of a plate-like member fixed substantially vertically, and the lid holding portion 191 is fixed to the fixing portion 196a. Further, the horizontal driving mechanism 196 includes a cylinder, and as shown by an arrow in FIG. 5, the fixing portion 196a and the lid holding portion 191 fixed thereto can be moved in the horizontal direction.

上記構成のプローブ装置１００では、蓋開閉機構１９０をウエハ搬送機構１６０の上下駆動機構１６３によって上下動させるようになっている。したがって、蓋開閉機構１９０を上下動させるための上下駆動機構を別途に設ける必要がなく、駆動機構を削減することができる。これによって、従来に比べて省資源化することができ、製造コストを削減することができる。   In the probe apparatus 100 configured as described above, the lid opening / closing mechanism 190 is moved up and down by the vertical drive mechanism 163 of the wafer transfer mechanism 160. Therefore, it is not necessary to separately provide a vertical drive mechanism for moving the lid opening / closing mechanism 190 up and down, and the drive mechanism can be reduced. As a result, resources can be saved as compared with the conventional case, and the manufacturing cost can be reduced.

上記構成のプローブ装置１００では、ローダー部１５０のロードポート１５２に半導体ウエハＷを収容した半導体ウエハ収納容器（ＦＯＵＰ）１５１が載置されると、まず、ウエハ搬送機構１６０の上下駆動機構１６３によって蓋開閉機構１９０を上昇させ、半導体ウエハ収納容器１５１の前方に蓋保持部１９１を位置させる。   In the probe apparatus 100 configured as described above, when the semiconductor wafer storage container (FOUP) 151 containing the semiconductor wafer W is placed on the load port 152 of the loader unit 150, first, the lid is moved by the vertical drive mechanism 163 of the wafer transfer mechanism 160. The opening / closing mechanism 190 is raised, and the lid holding part 191 is positioned in front of the semiconductor wafer storage container 151.

次に、水平方向駆動機構１９６によって、蓋保持部１９１を水平方向に移動させて半導体ウエハ収納容器１５１の蓋に当接させ、２つの吸着保持部１９２によって蓋を吸着するとともに、ラッチ開閉機構１９３を半導体ウエハ収納容器１５１のラッチ機構と嵌合させる。   Next, the lid holding portion 191 is moved in the horizontal direction by the horizontal driving mechanism 196 and brought into contact with the lid of the semiconductor wafer storage container 151, and the lid is adsorbed by the two adsorption holding portions 192, and the latch opening / closing mechanism 193. Is fitted to the latch mechanism of the semiconductor wafer storage container 151.

次に、蓋保持部１９１に配設されたシリンダ１９４を駆動してラッチ開閉機構１９３により、半導体ウエハ収納容器１５１のラッチ機構を回転させ、ラッチ機構を開けた状態とする。   Next, the cylinder 194 disposed in the lid holding portion 191 is driven, and the latch mechanism of the semiconductor wafer storage container 151 is rotated by the latch opening / closing mechanism 193 so that the latch mechanism is opened.

次に、水平方向駆動機構１９６によって、蓋保持部１９１を後退させて半導体ウエハ収納容器１５１の蓋を外し、この後、ウエハ搬送機構１６０の上下駆動機構１６３によって蓋開閉機構１９０を下降させ、半導体ウエハ収納容器１５１の蓋を下方に移動させる。   Next, the lid holding portion 191 is retracted by the horizontal driving mechanism 196 to remove the lid of the semiconductor wafer storage container 151, and then the lid opening / closing mechanism 190 is lowered by the vertical driving mechanism 163 of the wafer transfer mechanism 160, The lid of the wafer storage container 151 is moved downward.

この後、ウエハ搬送機構１６０のウエハセンサ１８５を、半導体ウエハ収納容器１５１の入口部分に挿入し、例えば上側から下側にウエハセンサ１８５を移動させることにより、半導体ウエハ収納容器１５１内のどのスロットに半導体ウエハＷが収容されているかを検出する。   Thereafter, the wafer sensor 185 of the wafer transfer mechanism 160 is inserted into the entrance portion of the semiconductor wafer storage container 151, and the wafer sensor 185 is moved from the upper side to the lower side, for example, so that the slot in the semiconductor wafer storage container 151 is moved to which slot. Detect whether W is accommodated.

次に、ウエハ搬送機構１６０の上側アーム１８１又は下側アーム１８２のいずれか一方、本実施形態では上側アーム１８１によって、半導体ウエハ収納容器１５１内の半導体ウエハＷを取り出し、位置合わせ機構１７１に搬送する。そして、位置合わせ機構１７１によって半導体ウエハＷのノッチを検出して半導体ウエハＷの位置を検知する。   Next, in this embodiment, either the upper arm 181 or the lower arm 182 of the wafer transfer mechanism 160, or the upper arm 181 in this embodiment, takes out the semiconductor wafer W in the semiconductor wafer storage container 151 and transfers it to the alignment mechanism 171. . Then, the position of the semiconductor wafer W is detected by detecting the notch of the semiconductor wafer W by the alignment mechanism 171.

次に、位置合わせ機構１７１による位置検出の終了した半導体ウエハＷを、ウエハ搬送機構１６０の上側アーム１８１によって、位置合わせ機構１７１から取り出し、測定部１１０の載置台１１１上に半導体ウエハＷを載置する。   Next, the semiconductor wafer W whose position has been detected by the alignment mechanism 171 is taken out from the alignment mechanism 171 by the upper arm 181 of the wafer transfer mechanism 160, and the semiconductor wafer W is mounted on the mounting table 111 of the measurement unit 110. To do.

そして、載置台１１１上の半導体ウエハＷの半導体デバイスにプローブカードのプローブを当接させて電気的導通を得、図示しないテスタからテスト信号を供給するとともに、半導体デバイスからの出力信号を測定することによって、半導体デバイスの電気的な特性の検査を行う。   Then, the probe of the probe card is brought into contact with the semiconductor device on the semiconductor wafer W on the mounting table 111 to obtain electrical continuity, a test signal is supplied from a tester (not shown), and an output signal from the semiconductor device is measured. Thus, the electrical characteristics of the semiconductor device are inspected.

上記の測定部１１０における半導体ウエハＷの検査中に、次に検査を行う半導体ウエハＷを、ウエハ搬送機構１６０の上側アーム１８１によって取り出し、位置合わせ機構１７１によって半導体ウエハＷのノッチを検出して半導体ウエハＷの位置を検知した後、再度上側アーム１８１によって半導体ウエハＷを保持し、この状態で待機する。   During the inspection of the semiconductor wafer W in the measurement unit 110, the semiconductor wafer W to be inspected next is taken out by the upper arm 181 of the wafer transfer mechanism 160, and the notch of the semiconductor wafer W is detected by the alignment mechanism 171 to detect the semiconductor. After the position of the wafer W is detected, the semiconductor wafer W is again held by the upper arm 181 and waits in this state.

半導体ウエハＷの半導体デバイスの電気的な状態の検査が終了すると、載置台１１１上の半導体ウエハＷを、次に検査を行う半導体ウエハＷを保持していない方のアーム、本実施形態では下側アーム１８２によって取り出し、上側アーム１８１上に保持していた次に検査を行う半導体ウエハＷを載置台１１１上に載置する。   When the inspection of the electrical state of the semiconductor device of the semiconductor wafer W is completed, the semiconductor wafer W on the mounting table 111 is placed on the arm that is not holding the semiconductor wafer W to be inspected next, in this embodiment, the lower side The semiconductor wafer W to be inspected next, which has been taken out by the arm 182 and held on the upper arm 181, is mounted on the mounting table 111.

そして、検査が終了した半導体ウエハＷを、下側アーム１８２によって一旦位置合わせ機構１７１に搬送する。そして、位置合わせ機構１７１によって半導体ウエハＷのノッチを検出して半導体ウエハＷの位置を検知する。   Then, the semiconductor wafer W that has been inspected is once transferred to the alignment mechanism 171 by the lower arm 182. Then, the position of the semiconductor wafer W is detected by detecting the notch of the semiconductor wafer W by the alignment mechanism 171.

この後、位置を検知した半導体ウエハＷを、再度ウエハ搬送機構１６０の下側アーム１８２によって保持し、半導体ウエハ収納容器１５１の前方まで搬送する。   Thereafter, the semiconductor wafer W whose position has been detected is again held by the lower arm 182 of the wafer transfer mechanism 160 and transferred to the front of the semiconductor wafer storage container 151.

次に、ウエハセンサ１８５によって、半導体ウエハ収納容器１５１のスロットに半導体ウエハＷが収容されていないことを確認した後、半導体ウエハＷを保持した下側アーム１８２を半導体ウエハ収納容器１５１内に挿入して、半導体ウエハＷを半導体ウエハ収納容器１５１のスロット上に載置する。   Next, after the wafer sensor 185 confirms that the semiconductor wafer W is not received in the slot of the semiconductor wafer storage container 151, the lower arm 182 holding the semiconductor wafer W is inserted into the semiconductor wafer storage container 151. Then, the semiconductor wafer W is placed on the slot of the semiconductor wafer storage container 151.

この後、上側アーム１８１によって次に検査を行う半導体ウエハＷを半導体ウエハ収納容器１５１内から取り出し、上述した工程を繰り返し行うことによって、半導体ウエハ収納容器１５１内に収容された半導体ウエハＷの検査を行う。   Thereafter, the semiconductor wafer W to be inspected next by the upper arm 181 is taken out from the semiconductor wafer storage container 151, and the above-described steps are repeated to inspect the semiconductor wafer W stored in the semiconductor wafer storage container 151. Do.

そして、半導体ウエハ収納容器１５１内に収容された検査を行うべき半導体ウエハＷを全て検査した後、ウエハ搬送機構１６０の上下駆動機構１６３によって蓋開閉機構１９０を上昇させ、半導体ウエハ収納容器１５１の前方に、蓋を保持した蓋保持部１９１を位置させる。   After inspecting all the semiconductor wafers W to be inspected stored in the semiconductor wafer storage container 151, the lid opening / closing mechanism 190 is raised by the vertical drive mechanism 163 of the wafer transfer mechanism 160, and the front of the semiconductor wafer storage container 151 is moved forward. Then, the lid holding part 191 holding the lid is positioned.

次に、水平方向駆動機構１９６によって、蓋保持部１９１を水平方向に移動させ、蓋保持部１９１に保持された蓋を半導体ウエハ収納容器１５１に当接させる。そして、シリンダ１９４を駆動してラッチ開閉機構１９３により半導体ウエハ収納容器１５１のラッチ機構を回転させ、ラッチ機構を閉じた状態とし、蓋を半導体ウエハ収納容器１５１に固定する。   Next, the lid holding unit 191 is moved in the horizontal direction by the horizontal driving mechanism 196, and the lid held by the lid holding unit 191 is brought into contact with the semiconductor wafer storage container 151. Then, the cylinder 194 is driven, the latch mechanism of the semiconductor wafer storage container 151 is rotated by the latch opening / closing mechanism 193, the latch mechanism is closed, and the lid is fixed to the semiconductor wafer storage container 151.

次に、２つの吸着保持部１９２による蓋の吸着を解除するとともに、水平方向駆動機構１９６によって、蓋保持部１９１を後退させた後、ウエハ搬送機構１６０の上下駆動機構１６３によって蓋開閉機構１９０を下降させる。   Next, the suction of the lid by the two suction holding units 192 is released, and the lid holding unit 191 is retracted by the horizontal driving mechanism 196, and then the lid opening / closing mechanism 190 is moved by the vertical driving mechanism 163 of the wafer transfer mechanism 160. Lower.

なお、上記の工程では、初めに半導体ウエハ収納容器１５１の蓋を開け、全ての半導体ウエハＷの検査が終了するまで蓋を開けた状態として半導体ウエハＷの検査を行い、最後に蓋を閉める場合について説明したが、１枚の半導体ウエハＷを取り出す毎に、半導体ウエハ収納容器１５１の蓋を開け閉めするようにしてもよい。   In the above steps, the semiconductor wafer storage container 151 is first opened, the semiconductor wafer W is inspected with the lid open until all the semiconductor wafers W have been inspected, and finally the lid is closed. However, every time one semiconductor wafer W is taken out, the lid of the semiconductor wafer storage container 151 may be opened and closed.

以上本発明を実施形態について説明したが、本発明は上述した実施形態に限定されるものではなく、各種の変形が可能であることは勿論である。   Although the present invention has been described above with reference to the embodiments, the present invention is not limited to the above-described embodiments, and various modifications are of course possible.

１００……プローブ装置、１１０……測定部、１１１……載置台、１５０……ローダー部、１５１……半導体ウエハ収納容器（ＦＯＵＰ）、１５２……ロードポート、１６０……ウエハ搬送機構、１６１……アームユニット、１６２……回転駆動機構、１６３……上下駆動機構、１７０……バッファテーブル、１７１……位置合わせ機構、１８１……上側アーム、１８２……下側アーム、１８３……上側アーム駆動機構、１８４……下側アーム駆動機構、１８５……ウエハセンサ、１９０……蓋開閉機構、１９１……蓋保持部、１９２……吸着保持部、１９３……ラッチ開閉機構。   DESCRIPTION OF SYMBOLS 100 ... Probe apparatus, 110 ... Measuring part, 111 ... Mounting stand, 150 ... Loader part, 151 ... Semiconductor wafer storage container (FOUP), 152 ... Load port, 160 ... Wafer conveyance mechanism, 161 ... ... arm unit, 162 ... rotary drive mechanism, 163 ... vertical drive mechanism, 170 ... buffer table, 171 ... positioning mechanism, 181 ... upper arm, 182 ... lower arm, 183 ... upper arm drive Mechanism: 184 ... Lower arm drive mechanism, 185 ... Wafer sensor, 190 ... Lid opening / closing mechanism, 191 ... Lid holding part, 192 ... Adsorption holding part, 193 ... Latch opening / closing mechanism.

Claims (3)

半導体ウエハに形成された半導体デバイスの電気的な検査を行うプローブ装置であって、
載置台上に載置された前記半導体ウエハの前記半導体デバイスにプローブを接触させて電気的な測定を行う測定部と、
半導体ウエハ収納容器が載置されるロードポートと、
上下駆動機構と、回転駆動機構と、水平駆動機構とを有し、前記半導体ウエハ収納容器と前記載置台との間で前記半導体ウエハを搬送可能とされたウエハ搬送機構と、
前記ウエハ搬送機構の前記上下駆動機構によって上下動可能とされ、前記半導体ウエハ収納容器の蓋を開閉する蓋開閉機構と、
を具備し、
前記蓋開閉機構は、前記蓋を吸着する吸着機構と、前記蓋の複数のラッチ機構を開閉するラッチ開閉機構とを具備し、前記ラッチ開閉機構は、１つの駆動機構と当該駆動機構に接続されたリンク機構によって、複数の前記ラッチ機構を開閉するよう構成されるとともに、前記ラッチ開閉機構の動きを検出して、前記ラッチ機構の開位置を検出する１つの開位置センサ及び閉位置を検出する１つの閉位置センサを有する
ことを特徴とするプローブ装置。 A probe apparatus for performing an electrical inspection of a semiconductor device formed on a semiconductor wafer,
A measurement unit that performs electrical measurement by bringing a probe into contact with the semiconductor device of the semiconductor wafer mounted on a mounting table;
A load port on which a semiconductor wafer storage container is placed;
A wafer transport mechanism having a vertical drive mechanism, a rotational drive mechanism, and a horizontal drive mechanism, and capable of transporting the semiconductor wafer between the semiconductor wafer storage container and the mounting table;
A lid opening / closing mechanism that is movable up and down by the vertical drive mechanism of the wafer transfer mechanism, and that opens and closes the lid of the semiconductor wafer storage container;
Equipped with,
The lid opening / closing mechanism includes an adsorption mechanism for adsorbing the lid, and a latch opening / closing mechanism for opening / closing a plurality of latch mechanisms of the lid, and the latch opening / closing mechanism is connected to one driving mechanism and the driving mechanism. The link mechanism is configured to open and close the plurality of latch mechanisms, and detects the open position of the latch mechanism by detecting the movement of the latch open / close mechanism and the closed position. A probe apparatus having one closed position sensor . 半導体ウエハ収納容器が載置されるロードポートと、
上下駆動機構と、回転駆動機構と、水平駆動機構とを有し、前記半導体ウエハ収納容器内内の前記半導体ウエハを出し入れするウエハ搬送機構と、
前記ウエハ搬送機構の前記上下駆動機構によって上下動可能とされ、前記半導体ウエハ収納容器の蓋を開閉する蓋開閉機構と、
を具備し、
前記蓋開閉機構は、前記蓋を吸着する吸着機構と、前記蓋の複数のラッチ機構を開閉するラッチ開閉機構とを具備し、前記ラッチ開閉機構は、１つの駆動機構と当該駆動機構に接続されたリンク機構によって、複数の前記ラッチ機構を開閉するよう構成されるとともに、前記ラッチ開閉機構の動きを検出して、前記ラッチ機構の開位置を検出する１つの開位置センサ及び閉位置を検出する１つの閉位置センサを有する
ことを特徴とするウエハ搬送システム。 A load port on which a semiconductor wafer storage container is placed;
A wafer transport mechanism having a vertical drive mechanism, a rotational drive mechanism, and a horizontal drive mechanism, and taking in and out the semiconductor wafer in the semiconductor wafer storage container;
A lid opening / closing mechanism that is movable up and down by the vertical drive mechanism of the wafer transfer mechanism, and that opens and closes the lid of the semiconductor wafer storage container;
Equipped with,
The lid opening / closing mechanism includes an adsorption mechanism for adsorbing the lid, and a latch opening / closing mechanism for opening / closing a plurality of latch mechanisms of the lid, and the latch opening / closing mechanism is connected to one driving mechanism and the driving mechanism. The link mechanism is configured to open and close the plurality of latch mechanisms, and detects the open position of the latch mechanism by detecting the movement of the latch open / close mechanism and the closed position. A wafer transfer system having one closed position sensor . 請求項２記載のウエハ搬送システムであって、
前記半導体ウエハの位置決めを行う位置決め機構を具備したことを特徴とするウエハ搬送システム。 The wafer transfer system according to claim 2 ,
A wafer transfer system comprising a positioning mechanism for positioning the semiconductor wafer.
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