JP2003209862A - Inspection apparatus and inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection apparatus and inspection method for automatically inspecting the electric characteristics of CCDs since the CCD inspection apparatus is less automated than inspection apparatuses for semiconductor integrated circuits such as memory circuit elements. <P>SOLUTION: An inspection apparatus 10 of this invention includes: a moving mechanism 11 movable in X, Y, Z and θ directions; an inverting mechanism 12 fitted to the moving mechanism 11; a chuck 13 connected to the inverting mechanism 12 in a forward/reverse turnably manner and sucking and supporting a transparent substrate 1; a light source 14 for emitting light to the backside of the transparent substrate 2 supported by the chuck 13; and a contactor 15 with a plurality of probes 15A for detecting electric signals generated by the CCD 1 via a plurality of electrodes 1A on the basis of the light emitted from the light source 14. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection device and an inspection method, and more particularly, to an image pickup device (eg CCD).
The present invention relates to an inspection device capable of automatically inspecting electrical characteristics of elements.

[0002]

2. Description of the Related Art Semiconductor integrated circuits such as memory circuit elements and logic circuit elements are in great demand because they are in great demand. Then, the electrical characteristics of the semiconductor integrated circuit are inspected using various inspection devices to screen defective products. Further, since the inspection quantity is large and the inspection contents are diverse, the inspection apparatus is automated as much as other semiconductor manufacturing apparatuses.

Recently, for example, a CCD element used as an image pickup element has been remarkably popularized, and the demand thereof has been dramatically increased. However, in comparison with semiconductor integrated circuits such as memory circuit elements, the inspection device for CCD elements has been delayed in automation.

The present invention has been made to solve the above problems, and an object thereof is to provide an inspection apparatus and an inspection method capable of automatically inspecting the electrical characteristics of an image pickup device such as a CCD device. There is.

[0005]

The inspection apparatus according to claim 1 of the present invention is an inspection apparatus for inspecting the electrical characteristics of a plurality of image pickup devices arranged on the surface of a transparent substrate. A holding body for holding, a reversing mechanism for reversing the holding body so that the back surface of the transparent substrate faces upward, a light source for irradiating the back surface of the transparent substrate reversed through the reversing mechanism, and this light source And an inspection means for inspecting the electrical characteristics of the image pickup device under the condition that light is emitted from the image pickup device.

The inspection apparatus according to a second aspect of the present invention is characterized in that, in the invention according to the first aspect, a transport mechanism for transporting the transparent substrate is provided.

The inspection apparatus according to claim 3 of the present invention is the inspection apparatus according to claim 1 or 2, wherein the holder and the reversing mechanism are moved in at least X, Y and Z directions. It is characterized by having a mechanism.

The inspection device according to claim 4 of the present invention is the inspection device according to any one of claims 1 to 3, wherein the holding body supports the transparent substrate at its outer periphery. It is characterized by having a part.

Further, an inspection apparatus according to a fifth aspect of the present invention is characterized in that, in the invention according to the fourth aspect, the holding body has exhaust passages that open at a plurality of positions of the support portion. Is.

The inspection device according to claim 6 of the present invention is the inspection device according to any one of claims 2 to 5, wherein the holder is an entrance portion into which the arm of the transport mechanism enters. It is characterized by having.

The inspection apparatus according to claim 7 of the present invention is the inspection apparatus according to any one of claims 1 to 6, wherein the inspection means has a heating section for heating the image pickup device. It is characterized by.

The inspection device according to claim 8 of the present invention is the inspection device according to any one of claims 1 to 7, wherein the light source is arranged above the holder. It is characterized by.

The inspection device according to claim 9 of the present invention is the inspection device according to any one of claims 1 to 8, wherein the inspection means is arranged below the holder. It is characterized by that.

The inspection method according to a tenth aspect of the present invention is an inspection method for inspecting the electrical characteristics of a plurality of image pickup devices arranged on the surface of a transparent substrate, the step of transporting the transparent substrate. A step of holding the transparent substrate with a holder, a step of reversing the holder so that the back surface of the transparent substrate faces upward, a step of irradiating the back surface of the transparent substrate with light, and a step of irradiating with the light. And a step of inspecting the electrical characteristics of the image pickup device under the above condition.

[0015]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below based on the embodiments shown in FIGS. First, the principle of the electrical characteristic inspection of the CCD element as the image pickup element will be described with reference to FIG. The CCD element 1 is, for example, as shown in FIG.
As shown in (b), the transparent substrate 2 made of quartz glass or the like is arranged vertically and horizontally in a matrix. On the transparent substrate 2, a plurality of electrodes 1A corresponding to each CCD element 1 are provided.
Are formed, and each CCD element 1 is formed as shown in FIG.
Are connected to the plurality of electrodes 1A via bumps 1B. An underfill 3 is filled between the CCD element 1 and the transparent substrate 2, and C is inserted through the underfill 3.
The CD element 1, the electrode 1A and the transparent substrate 2 are in close contact with each other. Then, when the electrical characteristic inspection of the CCD element 1 is performed, the light L is applied to the CCD element 1 from the back surface side of the transparent substrate 2. An electric signal photoelectrically converted by a photoelectric conversion element (not shown) of the CCD element 1 is detected through a contactor (probe) P which is in electrical contact with each electrode 1A, and an electric signal of the CCD element 1 is detected by a tester (not shown). Characteristic test.

Thus, the inspection apparatus 10 of the present embodiment, as shown in FIGS. 2 (a), (b) and FIGS. 3 (a), (b), has X, Y, Z and θ directions. Moving mechanism 11
And the reversing mechanism 12 attached to the moving mechanism 11.
And a holder (chuck) 13 which is connected to the reversing mechanism 12 so as to be able to rotate in the forward and reverse directions and sucks and holds the transparent substrate 1, and light from the opening 13A to the back surface of the transparent substrate 2 held by the chuck 13. A light source 14 (see FIG. 3) for irradiating,
A contactor 15 (see FIG. 3) having a plurality of probes 15A for detecting an electric signal generated in the CCD element 1 based on the light emitted from the light source 14 through a plurality of electrodes 1A, The electrical characteristic inspection of the CCD element 1 (see FIG. 1) is automatically performed. In addition, the inspection device 10 includes a transport mechanism 16, and transfers the transparent substrate 2 between the chuck (not shown) and the chuck 13 via the arm 16A.

As shown in FIGS. 2 (a) and 2 (b), the moving mechanism 11 is arranged on a base 17 and is moved on the X stage 11A, and is arranged on this X stage 11A. The Y stage 11B that moves in the Y direction and this Y
A Z stage 11C, which is arranged on the stage 11B and moves up and down in the Z direction, and a θ stage 11D, which is arranged on this Z stage 11C and rotates forward and backward about a vertical axis, are provided. When inspecting each CCD element 1, the transparent substrate 2 held by the chuck 13 is index-fed in the X and Y directions via the X and Y stages 11A and 11B, and the Z stage 11 is moved at the inspection position.
The CCD element 1 and the probe 15A are brought into contact with each other via C.

The chuck 13 is reversed by the reversing mechanism 12 mounted on the θ stage 11D. That is, the transparent substrate 2
The surface supporting the transparent substrate 2 becomes the upper surface when the CCD is transferred, and the surface supporting the transparent substrate 2 becomes the lower surface when the CCD device 1 of the transparent substrate 2 is inspected. The opening 13A of the chuck 13 is formed on the tip side of the chuck 13 according to the shape and size of the transparent substrate 2, and the tip side is formed in a frame shape. In addition, on the upper surface of the chuck 13, a stepped portion is formed over the entire circumference of the opening portion 13A and a supporting portion 13B.
The support portion 13B supports the outer peripheral edge portion of the transparent substrate 2. An exhaust passage communicating with a vacuum exhaust device (not shown) is formed in the chuck 13, and the exhaust passage is opened as suction holes 13C at a plurality of positions at equal intervals in the circumferential direction of the support portion 13B. There is. Therefore, the transparent substrate 2 is vacuum-adsorbed and fixed on the supporting portion 13B by the vacuum exhaust of the vacuum exhaust device. Further, an entrance portion 13D into which the arm 16A of the transfer mechanism 16 enters is formed in the chuck 13 in accordance with the width of the arm 16A, and an arrow A in FIG.
As shown by, the arm 16A holding the transparent substrate 2 enters directly above the chuck 13, the chuck 13 moves upward in the Z direction, and the arm 16A is fitted into the entering portion 13D, so that the transparent substrate 2 is supported on the supporting portion 13B. hand over.

As shown in FIGS. 3 (a) and 3 (b), the light source 14 and the contactor 15 are arranged at a predetermined interval from each other, the light source 14 is located on the upper side, and the contactor 15 is located on the lower side. And are facing each other. The light source 14 is shown in FIG.
As shown in (b), the condenser lens 14A is provided so as to face the lower contactor 15 so that dust such as particles does not adhere to the condenser lens 14A. And
The chuck 13 with the surface of the transparent substrate 2 facing downward between these both 14 and 15 repeats index feed and elevation through the moving mechanism 11 to inspect the CCD element 1.

The contactor 15 is shown in FIGS. 3 (a) and 3 (b).
As shown in, it is fixed on the base 19 via the tester portion 18. A light source 14 is fixed above the contactor 15 with a predetermined space between the light source 14 and the contactor 15.
The chuck 13 can move in the X, Y, and Z directions between them. The contactor 15 includes a plurality of probes 15A arranged in two rows corresponding to the electrodes 1A of the CCD 1 and two rows of probes 15A as shown in FIG.
A heating unit 15B disposed between the heating unit 15B and the heating unit 15B for heating the CCD device 1 is provided, and at the time of inspection, the plurality of probes 15A electrically contact the respective electrodes 1A of the CCD device 1 and the heating unit 15B contacts the CCD device 1. It is like this.

Next, the operation will be described. First, with the supporting portion 13B of the chuck 13 facing upward as shown in FIGS.
When the transparent substrate 2 is taken out from the cassette (not shown) via 6A and is transported to a position right above the chuck 13, the Z stage 11C is raised and the transparent substrate 2 is supported by the supporting portion 1.
The arm 16A is fitted into the entrance portion 13D while being handed over to 3B. Subsequently, the vacuum evacuation device is driven to vacuum-adsorb the transparent substrate 2 on the supporting portion 13B, and the arm 16A retracts from the chuck 13.

Next, the chuck 13 is reversed through the reversing mechanism 12, and the CCD element 1 on the transparent substrate 2 is turned downward,
The back surface of the transparent substrate 2 faces upward. After that, when moving in the X and Y directions via the X and Y stages 11A and 11B and entering between the light source 14 and the contactor 15 as shown in FIG. 3A, the contactor 15 is moved through an alignment mechanism (not shown). After aligning the CCD element 1 with
First CCD device 1 via Y stage 11A, 11B
Is moved to the inspection position of the contactor 15. At this position, the chuck 13 descends in the Z direction via the Z stage 11C, the probe 15A of the contactor 15 and the electrode 1A of the CCD element 1 make electrical contact, and the heating unit 15B moves to CC.
Contact the D element 1. Then, by the heating unit 15B, C
The CD element 1 is heated to a predetermined temperature (for example, 50 ° C.) and the light source 14 emits light.

The CCD element 1 converts light into an electric signal through the photoelectric conversion element and outputs the electric signal through the electrode 1A. After the contactor 15 detects the electric signal via the probe 15A, the tester unit 18 analyzes the electric signal and ends the electric characteristic inspection of the CCD element 1. When the inspection of the first CCD element 1 is completed, the Z stage 11C
The chuck 13 ascends through and releases the contact between the CCD element 1 and the probe 15A. Then, X, Y stage 1
After the CCD element 1 is index-fed via 1A and 11B, it is lowered through the Z stage 11C to move to the next CCD.
The element 1, the probe 15A, and the heating unit 15B come into contact with each other as described above, and the irradiation light from the light source 14 causes the C
After the inspection of the CD element 1, the chuck 13 is raised via the Z stage 11C. X, Y stage 11A, 1
When the inspection of all the CCD elements 1 is completed by the index feed of 1B, the transparent substrate 2 held by the chuck 13
Moves backward from the light source 14 and the contactor 15 via the moving mechanism 11 and moves to the delivery position of the transparent substrate 2. At this position, the CCD element 1 after the inspection is returned to the original position of the cassette via the transport mechanism 16. Then, the new transparent substrate 2 is delivered to the chuck 13 and the inspection is performed in the same manner.

As described above, according to this embodiment,
A moving mechanism 11 capable of moving in the X, Y, Z, and θ directions, a reversing mechanism 12 mounted on a θ stage 11D of the moving mechanism 11, and a transparent substrate 2 connected to the reversing mechanism 12
, A light source 14 for irradiating the back surface of the transparent substrate 2 held by the chuck 13 with light, and an electric signal generated in the CCD element 1 based on the light emitted from the light source 14 for the plurality of electrodes 1A. And the contactor 15 having a plurality of probes 15A for detecting the transparent substrate 2 held by the chuck 13 are moved.
The electrical characteristics of the CCD element 1 on the transparent substrate 2 can be automatically inspected while the CCD element 1 is index-fed through the X and Y stages 11A and 11B.

Further, according to this embodiment, since the transfer mechanism 16 for transferring the transparent substrate 2 is provided, the transfer of the transparent substrate 2 between the cassette and the chuck 13 can be automated. Further, since the chuck 13 has the support portion 13B that supports the transparent substrate 2 at the outer peripheral edge portion thereof, it is possible to secure the opening portion 13A when the light source 14 irradiates the transparent substrate 2 with light. Further, since the chuck 13 has exhaust passages that open at a plurality of positions of the supporting portion 13B, the transparent substrate 2 can be reliably attracted and fixed to the supporting portion 13B.
Furthermore, since the chuck 13 has the entry portion 13D into which the arm 16A of the transport mechanism 16 enters, the transparent substrate 2 can be smoothly transferred between the arm 16A and the chuck 13. Further, since the contactor 15 has the heating unit 15B that heats the CCD element 1, the inspection can be performed while heating the CCD element 1. Further, since the light source 14 is arranged above the chuck 13 and the light source 14 is directed downward, dust such as particles does not adhere to the light source 14.

The present invention is not limited to the above embodiment. In the above embodiment, the CC is used as the image sensor.
Although the D element has been described as an example, the present invention can be applied to an image pickup element other than the CCD element, for example, a MOS type element.

[0027]

According to the first to tenth aspects of the present invention, the electrical characteristic inspection of the image pickup device such as the CCD device is automatically performed without adhering dust such as particles to the light source. An inspection apparatus and an inspection method that can be performed can be provided.

[Brief description of drawings]

FIG. 1 is a diagram showing a principle of a CCD device and its electrical characteristic inspection, (a) is a plan view showing a transparent substrate on which CCD devices are arranged, (b) is a side view of (a), and (c). FIG. 3 is a diagram showing the principle of inspection of a CCD element.

FIG. 2 is a diagram showing an embodiment of the inspection apparatus of the present invention,
(A) is the top view, (b) is the side view.

3A and 3B are diagrams showing a state in which a CCD device is inspected using the inspection apparatus shown in FIG. 1, in which FIG. 3A is a side view showing an inspection portion of the inspection apparatus, and FIG. It is sectional drawing which expands and shows.

[Explanation of symbols]

1 CCD element (imaging element) 1A electrode 2 transparent substrate 10 Inspection device 11 Moving mechanism 12 Inversion mechanism 13 Chuck (holding body) 13A opening 13B support Hole for 13C adsorption 13D entry section 14 Light source 15 Contactor (inspection means) 15A probe 15B heating part

Claims (10)

[Claims] 1. An inspection apparatus for inspecting electrical characteristics of a plurality of image pickup devices arranged on the surface of a transparent substrate, comprising: a holder for holding the transparent substrate; and the transparent substrate by reversing the holder. The reversing mechanism with the back surface facing upward, the light source that irradiates the back surface of the transparent substrate that is reversed through the reversing mechanism, and the electrical characteristics of the image pickup device in the state where the light is irradiated from the light source. An inspection device comprising an inspection means for inspecting. 2. The inspection apparatus according to claim 1, further comprising a transfer mechanism that transfers the transparent substrate. 3. The inspection apparatus according to claim 1, further comprising a moving mechanism that moves the holding body and the reversing mechanism in at least X, Y, and Z directions. 4. The inspection apparatus according to claim 1, wherein the holder has a supporting portion that holds the transparent substrate on its outer periphery. 5. The inspection apparatus according to claim 4, wherein the holding body has exhaust passages that open at a plurality of positions of the support portion. 6. The inspection apparatus according to claim 2, wherein the holder has an entrance portion into which an arm of the transport mechanism enters. 7. The inspection apparatus according to claim 1, wherein the inspection unit has a heating unit that heats the image pickup element. 8. The inspection apparatus according to claim 1, wherein the light source is arranged above the holder. 9. The inspection apparatus according to claim 1, wherein the inspection means is arranged below the holding body. 10. An inspection method for inspecting the electrical characteristics of a plurality of image pickup devices arranged on the surface of a transparent substrate, comprising the steps of transporting the transparent substrate and holding the transparent substrate with a holder. , A step of reversing the holding body so that the back surface of the transparent substrate faces upward, a step of irradiating the back surface of the transparent substrate with light, and an electrical characteristic of the imaging device in a state where the light is irradiated. An inspection method comprising: an inspection step.