JP7324992B2 - prober - Google Patents

Description

The present invention relates to a prober for inspecting the electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer, and more particularly to a prober with a pullout mechanism for pulling out a device to be maintained to the maintenance area side.

Conventionally, a plurality of measurement units (cells), a transport mechanism (loader) for transporting objects (wafers) to each measurement unit, a pull-out mechanism (moving mechanism) for pulling out a pogo frame (apparatus to be maintained) in a lateral direction, A prober (wafer inspection apparatus) has been proposed (see, for example, Patent Document 1). According to the prober described in Patent Document 1, the pogo frame is pulled out sideways in a state in which the test head arranged above the pogo frame is lifted by the moving mechanism to be separated from the pogo frame. It is possible to prevent the pogo pins of the pogo frame from being damaged due to rubbing against the test head when the frame is pulled out sideways.

JP 2014-179379 A

However, in the prober described in Patent Document 1, no proposal is made as to what kind of relationship is desirable between the pull-out direction of the device to be maintained and the conveying direction of the conveyed object.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances. To suppress an Abbe error that must be taken into consideration when positioning a device to be maintained, which requires high accuracy, in a prober equipped with a transport unit that moves and transports a transported object into a measurement part at a transport destination ( or eliminate it).

In order to achieve the above object, the prober of the present invention comprises a plurality of measurement units arranged between a transfer area and a maintenance area, and is used when inspecting semiconductor devices formed on a wafer. a plurality of measuring units each having a maintenance device and a pull-out mechanism for pulling out the device to be maintained to the maintenance area side; a transport unit that moves to a position accessible to a measuring unit and transports the transported object into the measuring unit at the transport destination, wherein a direction in which the device to be maintained is pulled out and a transporting direction of the transported object are in a straight line. be.

In one aspect of the prober of the present invention, an elevating mechanism for elevating the device to be maintained is further provided, and the pull-out mechanism pulls out the device to be maintained, which has been lifted to a predetermined position by the elevating mechanism, to the maintenance area side. It is configured.

In one aspect of the prober of the present invention, the device to be maintained is at least one of a test head and a pogo frame arranged below it.

In one aspect of the prober of the present invention, the device to be maintained is at least one of a test head and a pogo frame arranged below it, and the elevating mechanism is electrically connected to pogo pins of the pogo frame. A test head elevating mechanism for elevating the test head between a pogo pin connection position and a test head extraction position above it, and a probe connection position where the probes of the probe card are electrically connected and a pogo frame extraction position above it. at least one of a pogo frame elevating mechanism for elevating the pogo frame between the and at least one of a pogo frame pull-out mechanism for pulling out the pogo frame raised to the pogo frame pull-out position to the maintenance area side.

In one aspect of the prober of the present invention, the test head elevating mechanism includes a test head cylinder that elevates the test head, and the pogo frame elevating mechanism includes a pogo frame cylinder that elevates the pogo frame.

In one aspect of the prober of the present invention, the test head pull-out mechanism includes a test head guide rail that guides the pull-out of the test head raised to the test head pull-out position, and the pogo frame pull-out mechanism includes the pogo frame pull-out mechanism. It includes a pogo frame guide rail for guiding the pulling out of the pogo frame raised to the frame pulling out position.

In one aspect of the prober of the present invention, the test head elevating mechanism elevates the test head together with the test head guide rails, and the pogo frame elevating mechanism elevates the pogo frame together with the pogo frame guide rails. .

In one aspect of the prober of the present invention, the plurality of measurement units further include a probe card holder arranged below the pogo frame and a wafer chuck, and the wafer held by the wafer chuck and the probe An alignment device that performs relative alignment with a probe card held in a card holding unit, the alignment device moving between the plurality of measuring units, and moving between the transport area side and the maintenance unit in the measuring unit at the destination. It further comprises an alignment device that moves to and from the area side.

In one aspect of the prober of the present invention, a head stage provided in each of the plurality of measurement units and arranged below the pogo frame; a test head positioning mechanism that positions the test head with respect to the pogo frame; a pogo frame positioning mechanism for positioning the pogo frame with respect to the head stage.

In one aspect of the prober of the present invention, the transfer unit further includes a transfer object holding arm that holds the transfer object and moves in and out through an opening formed in the housing, wherein the transfer object includes a wafer and a probe. At least one of the cards, and the transfer object holding arm is at least one of a wafer arm that holds the wafer and a probe card arm that holds the probe card.

In one aspect of the prober of the present invention, each measuring section is two-dimensionally arranged in the horizontal direction and the vertical direction.

In one aspect of the prober of the present invention, the transported object is loaded into the measuring section.

In one aspect of the prober of the present invention, the prober includes a loading section that loads the conveyed object into the measuring section from the maintenance area side.

According to the present invention, a plurality of measuring units having a device to be maintained and a pull-out mechanism for pulling out the device to be maintained and a measuring unit at the destination of the transported object can be accessed to measure the destination of the transported object. In a prober equipped with a transport unit that transports a device into a department, it is possible to suppress (or eliminate) Abbe errors that must be taken into account when positioning a device to be maintained that requires high accuracy.

FIG. 2 is a perspective view showing a schematic configuration of the prober of this embodiment; Front view of each measuring section Perspective view of transport unit Longitudinal cross-sectional view showing a schematic configuration of the transport unit Perspective view of moving device Partially enlarged perspective view of the moving device Longitudinal cross-sectional view showing the schematic configuration of the transport unit and the measuring section A perspective view showing a schematic configuration of a prober. Front view of each measurement part (vertical line) Schematic showing the positional relationship between the headstage, pogo frame and test head Partially enlarged perspective view of the measuring part Schematic showing how the test head is pulled out Schematic showing how the pogo frame is pulled out A top view showing that the pull-out direction of the device to be maintained and the transport direction of the transported object are in a straight line. A top view showing that a transported object is loaded into the measuring unit from the maintenance area side. Conceptual diagram showing an example of a calibration probe card

Preferred embodiments of the present invention will now be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a schematic configuration of the prober 10 of this embodiment.

As shown in FIG. 1, the prober 10 of the present embodiment moves between a transported article storage section 12, a plurality of measuring sections 14, and the transported articles (books) between the transported article storage section 12 and each measuring section 14. In the embodiment, at least one of a wafer and a probe card) is transported into the transported object storage unit 12 or into each measurement unit 14, and the transport unit 16 is provided between the transported object storage unit 12 and each measurement unit 14. and a moving device 22 for moving with.

The conveyed object storage section 12 and the measuring sections 14 are arranged at a constant interval in the Y direction with the surfaces on the side accessed by the conveying unit 16 facing each other (that is, facing each other).

The transport unit 16 is arranged between the transported article storage section 12 and each measuring section 14 .

The transported object storage unit 12 includes a wafer storage unit 12a that stores a plurality of wafers and a probe card storage unit 12b that stores a plurality of probe cards. There are no particular restrictions on the number or layout of the object storage units 12. In this embodiment, four object storage units 12, including the wafer storage unit 12a and the probe card storage unit 12b, are accessed by the transport unit 16. (the right side in FIG. 1) are arranged in the horizontal direction (X-axis direction). The side opposite to the side accessed by the transfer unit 16 (the left side in FIG. 1) is accessed by an operator when collecting wafers or probe cards.

The plurality of measuring units 14 are arranged between the transport area A1 and the maintenance area A2, as shown in FIG. As shown in FIG. 1, each of the plurality of measurement units 14 is a rectangular parallelepiped formed by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. A shape measurement chamber (also called a prober chamber), in which, as shown in FIGS. a test head 44, a pogo frame 46 arranged between the head stage 20 and the test head 44, and a first probe card holding mechanism (probe card holding section) 36 (FIG. 9, FIG. 9) for holding the probe card PC. 10 omitted) and are arranged. Further, as shown in FIG. 11, a test head elevating mechanism 48, a test head withdrawal mechanism 50, a pogo frame elevating mechanism 52, and a pogo frame withdrawal mechanism 54 are arranged inside each measuring section 14. .

FIG. 2 is a front view of each measuring section 14. FIG.

The number and layout of the measurement units 14 are not particularly limited, and in the present embodiment, as shown in FIGS. are stacked in three stages in the vertical direction (Z-axis direction), and are arranged two-dimensionally with the surface of the side accessed by the transport unit 16 (the left surface in FIG. 1) facing in the same direction.

A wafer holding arm 16b (wafer arm: transfer object holding arm) and a probe card holding arm 16c (probe card arm) of the transfer unit 16 are provided on each measuring section 14 (the side accessed by the transfer unit 16). An opening 14a for entering and exiting is formed. Further, an opening 14b (see FIG. 8) for pulling out the test head 44 and the pogo frame 46 is formed on the side opposite to the side where the opening 14a is formed in each measuring section 14. As shown in FIG. The surfaces other than the surfaces on which the openings 14a and 14b of each measuring section 14 are formed may be closed, or may be formed with openings.

The wafer chuck 18 is adjusted to a high or low target temperature (inspection temperature) by a well-known temperature control device (for example, a heat plate, a chiller device, etc. built into the wafer chuck 18).

The environment inside each measurement unit 14 is controlled as follows. For example, the temperature inside each measurement unit 14 is controlled to a target temperature (inspection temperature) by the temperature of the wafer chuck 18 arranged inside each measurement unit 14 . Also, the humidity in each measuring section 14 is controlled to a target humidity by purging dry air into each measuring section 14 by a well-known mechanism. Further, the environment inside each measuring section 14 is controlled by purging a predetermined gas (for example, nitrogen gas) inside each measuring section 14 by a well-known mechanism. Each measurement unit 14 performs a plurality of types of inspection, such as a high-temperature inspection, a low-temperature inspection, and an inspection under a predetermined gas (for example, nitrogen gas) atmosphere, which will be described later. The environment inside each measuring unit 14 is controlled so that the environment inside each measuring unit 14 corresponds to the inspection performed by each measuring unit 14 . It should be noted that the inspection performed by each measurement unit 14 may be the same or different between the measurement units.

The first probe card holding mechanism 36 is means for detachably holding the probe card PC, and is provided above the wafer chuck 18, for example, on the head stage 20 side. The first probe card holding mechanism 36 detachably holds the probe card PC conveyed to the first probe card holding mechanism 36 by a probe card conveying mechanism described later. Since the first probe card holding mechanism 36 is well known (see, for example, Japanese Unexamined Patent Application Publication No. 2000-150596), further explanation will be omitted.

Each measurement unit group includes an alignment device 38 for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and an alignment device 38 for four measurements. A movement device (not shown) is arranged for mutual movement between the sections 14 . The alignment device 38 is mutually moved among the four measurement units 14 included in the measurement unit group in which it is arranged, and is shared among the four measurement units 14 . As for the moving device for moving the alignment device 38 between the four measurement units 14, for example, the device described in JP-A-2014-150168 can be applied.

The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and is raised and lowered in the Z-axis direction. It is composed of a moving/rotating mechanism for moving the wafer chuck 18 in the XYZ-θ directions, such as the axial movable portion 38a, the Z-axis fixed portion 38b, and the XY movable portion 38c. The alignment device 38 moves the wafer W held by the wafer chuck 18 while mainly moving in the XYZ-.theta. It is used for alignment, electrical contact between the wafer W and the probes, and inspection of the electrical characteristics of the wafer W through the test head.

The alignment device 38 holds the wafer chuck 18 in the measurement unit 14 and moves between the probe card receiving position P1 (see FIG. 7A) near the opening 14a and the position P2 below the first probe card holding mechanism 36 (see FIG. 7A). (see FIG. 7(b)). That is, the alignment device 38 moves between the transport area A1 side and the maintenance area A2 side in the measuring section 14 to which it moves. This movement is accomplished by a well-known alignment device movement device (not shown).

The alignment device moving device moves the alignment device 38 holding the wafer chuck 18 heated to the target temperature when receiving the probe card PC to the probe card receiving position P1, and moves the first probe card holding mechanism 36 of the probe card PC. The alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature is moved to the position P2.

The alignment device 38 includes a second probe card holding mechanism 40 (also called a card lifter).

The second probe card holding mechanism 40 is means for receiving and holding the probe card PC from the probe card holding arm 16c. It is composed of a portion 40a (for example, a ring-shaped member or a plurality of pins) and an elevating mechanism (not shown) that elevates the holding portion 40a in the Z-axis direction with respect to the Z-axis movable portion 38a.

To receive and hold the probe card PC, the alignment device 38 is moved to the probe card receiving position P1, and the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a to receive the probe card PC (lower surface outer peripheral edge). ), and the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. The probe card PC is held directly above the wafer chuck 18 .

The probe card transport mechanism is means for transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36, and is provided in the alignment device 38, for example, in the Z-axis direction. It is configured by a Z-axis movable portion 38a that moves up and down.

The probe card PC is conveyed to the first probe card holding mechanism 36 by raising the Z-axis movable portion 38a in the Z-axis direction while the alignment device 38 is moved to the position P2.

3 is a perspective view of the transport unit 16, and FIG. 4 is a longitudinal sectional view showing a schematic configuration of the transport unit 16. As shown in FIG.

The transfer unit 16 moves in the X-axis direction and the Z-axis direction between the transfer object storage unit 12 and each measurement unit 14 to transfer the wafer W or the probe card PC into the transfer object storage unit 12 or each measurement unit 14 . As shown in FIGS. 3 and 4, a housing for housing the wafer W and the probe card PC, which is means for carrying and loading the wafer W and the probe card PC (wafer holding arm 16b and probe card holding arm 16b). 16c) has a housing 16a formed with an opening 16f for entering and exiting. The housing 16a has a rectangular parallelepiped shape, and contains a wafer holding arm 16b, a probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving the arms 16b and 16c, and a housing 16a. An environment control means 16d for controlling the environment inside the housing 16a and a sensor 16e for detecting the environment inside the housing 16a are arranged. The number of transport units 16 is not particularly limited, and one transport unit 16 is used in this embodiment. Two transport units 16 are depicted in FIG. 1, and this is a state in which one transport unit 16 accesses the transported article storage section 12 (probe card storage section 12b) (lower right in FIG. 1). (see transport unit 16 drawn) and access to the measurement unit 14 (see transport unit 16 drawn at the upper left in FIG. 1).

The wafer holding arm 16b is means for holding the wafer W, and is arranged in the housing 16a so as to be horizontally movable along a guide rail (not shown) provided in the housing 16a. there is The wafer holding arm 16b is housed in the housing 16a together with the wafer W while holding the wafer W. As shown in FIG.

The probe card holding arm 16c is means for holding the probe card PC, and is arranged in the housing 16a so as to be horizontally movable along guide rails (not shown) provided in the housing 16a. It is The probe card holding arm 16c is accommodated in the housing 16a together with the probe card PC while holding the probe card PC. The probe card PC includes a card holder CH. A seal ring may be included instead of the card holder CH.

The number and arrangement of the arms 16b and 16c are not particularly limited. In this embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged vertically in three stages. there is Further, after transporting the transported object to the measuring section 14, the transporting unit 16 uses the arms 16b and 16c to load the transported object into the measuring part 14. As shown in FIG.

The arm moving mechanism is composed of a well-known mechanism such as a drive motor (not shown) provided in the housing 16a. By rotating the drive motor in forward and reverse directions, the arms 16b and 16c are reciprocated individually in the horizontal direction to enter and exit through an opening 16f formed in the housing 16a.

The transport unit 16 is provided with air curtain forming means 42 .

The air curtain forming means 42 is a means for forming an air curtain that closes the opening 16f formed in the housing 16a to make the inside of the housing 16a a sealed or substantially sealed space. It is configured.

The number, shape, and arrangement of the air injection ports are not particularly limited. In this embodiment, as shown in FIG. They are arranged along the edge (perpendicular to the plane of the paper in FIG. 4).

The environment inside the housing 16a is controlled as follows. For example, the temperature and humidity in the housing 16a are controlled to the target temperature and humidity in a predetermined gas atmosphere by purging dry air (high temperature or low temperature dry air) or a predetermined gas (nitrogen gas) into each measuring unit 14. be done. This includes well-known environmental control means 16d, for example, a temperature-controlled gas supply source including a heater and a cooler (cooler), a blower, and a pipe ( not shown). Environmental control means 16d may include a dehumidifier. The gas (high temperature or low temperature dry air) whose temperature (and humidity) has been adjusted by the temperature-controlled gas supply source is supplied into the housing 16a through the pipe line by the blower, and is jetted from the air injection port to the housing. An air curtain is formed that closes the opening 16f formed in 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. The supply source of the gas supplied into the housing 16a and the supply source of the gas injected from the air injection port may be the same or different. The surface of the housing 16a other than the surface on which the opening 16f is formed may be closed, or an opening may be formed. The environment control means 16d may be attached to the housing 16a or may be attached to the arms 16b and 16c.

The sensor 16e is a sensor that detects the environment inside the housing 16a, and is, for example, a temperature sensor or a humidity sensor. Sensor 16e may be included in environmental control means 16d.

The environment control means 16d controls the environment inside the housing 16a so as to correspond to the environment of the destination of the transported article. Specifically, the environment control means 16d controls the inside of the housing 16a to the target environment based on the detection result of the sensor 16e. For example, the environment control means 16d controls the temperature control gas supply source based on the detection result of the sensor 16e so that the temperature and humidity inside the housing 16a reach the target temperature and humidity. The function of the environment control means 16d is realized, for example, by feedback control by a controller (not shown) to which the sensor 16e and temperature control gas supply source (heater and cooler) are electrically connected. Incidentally, the environment control means 16d and the air curtain forming means 42 may be integrated. That is, in one device, a downward air ejection port may be provided to block the opening 16f, and an air ejection port for dry air may be provided to control the environment inside the housing 16a. Here, it is preferable that the air injection port for the dry air for controlling the environment inside the housing 16a is provided in such a direction that the dry air to be injected is well circulated inside the housing 16a. By integrating the environment control means 16d and the air curtain forming means 42, the space for installing the environment control means 16d and the air curtain forming means 42 is reduced, and the space of the housing 16a can be used effectively. . Further, by integrating the environment control means 16d and the air curtain forming means 42, a temperature control gas supply source including a heater and a cooler (cooler), and A blower or the like can be shared.

5 is a perspective view of the moving device 22, and FIG. 6 is a partially enlarged perspective view of the moving device 22. FIG.

The moving device 22 is means for moving the transport unit 16 in the X-axis direction and the Z-axis direction between the transported article storage unit 12 and each measuring unit 14. For example, as shown in FIGS. The first movable body 24 moves in the horizontal direction (X-axis direction), which is the arrangement direction of each measuring section 14, between the transported object storage section 12 and each measuring section 14, and the first movable body 24 moves in the horizontal direction (X-axis direction). A first movable body moving mechanism (not shown) that moves in the direction), is attached to the first movable body 24 so as to be movable in the vertical direction (Z-axis direction), which is the arrangement direction of each measurement unit 14, and the transport unit A second movable body 26 that rotatably supports 16 about a vertical axis (Z-axis), and a second movable body moving mechanism (not shown) that moves the second movable body 26 in the vertical direction (Z-axis direction). , and the second movable body 26 and configured by a transport unit rotation mechanism 28 that rotates the transport unit 16 about the vertical axis (Z-axis).

The first movable body 24 is, for example, a frame body configured by connecting four corners of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction. It is movably connected to two guide rails 30 extending in the X-axis direction and arranged parallel to each other on a base 34 between each measuring section 14 .

The first movable body moving mechanism is composed of a well-known moving mechanism, such as a ball screw connected to the first movable body 24 and a drive motor (none of which is shown) that rotates the ball screw. By rotating the drive motor forward and backward, the first movable body 24 (transport unit 16) moves along the guide rail 30 in the X-axis direction. Of course, not limited to this, the first movable body moving mechanism is a mechanism for making the first movable body 24 self-propelled, for example, a wheel provided on the first movable body 24 and a drive motor for rotating the wheel. good too.

The second movable body 26 is movably connected to two guide rails 32 arranged parallel to each other on the first movable body 24 and extending in the Z-axis direction.

The second movable body moving mechanism is composed of a well-known moving mechanism, such as a ball screw connected to the second movable body 26 and a drive motor (none of which is shown) that rotates the ball screw. By rotating the drive motor forward and backward, the second movable body 26 (transport unit 16) moves along the guide rail 32 in the Z-axis direction. Of course, not limited to this, the second movable body moving mechanism is a mechanism for self-running the second movable body 26, for example, a wheel provided on the second movable body 26 and a drive motor for rotating the wheel. good too.

The transfer unit rotating mechanism 28 is composed of a known rotating mechanism, for example, a rotating shaft (vertical shaft) provided on the second movable body 26 and a drive motor 28a for rotating the same. The transport unit 16 has its upper surface fixed to a rotating shaft (vertical shaft). By rotating the drive motor 28a forward and backward, the transport unit 16 rotates 180° about the vertical axis (Z-axis), and the opening 16f formed in the transport unit 16 through which the arms 16b and 16c enter and exit is opened. It will be in a state of facing the conveyed object storage unit 12 or each measuring unit 14 .

The test head 44 is a device to be maintained (a device to be maintained over time) used when inspecting semiconductor devices formed on a wafer. terminals (not shown).

The test head 44 is held by a test head holding mechanism.

As shown in FIG. 11, the test head holding mechanism comprises a base 56 and two test head guide rails 58 fixed on the base 56 and extending in the Y-axis direction. The test head 44 is slidably connected to a test head guide rail 58 . The test head holding mechanism (base 56) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 56 is provided with a locking mechanism (not shown) that locks (fixes) the test head 44 to the base 56 (and the test head guide rails 58). The lock mechanism is composed of, for example, an engaging portion such as a pawl that engages or disengages from the test head 44 .

The test head elevating mechanism 48 is means for elevating the test head 44, and is composed of an actuator such as a test head cylinder (air or hydraulic cylinder). For example, one end of the cylinder is connected to the base 56 side and the other end is connected to the head stage 20 side. The cylinder may be braked. This actuator moves the test head holding mechanism (base 56) up and down along the vertical guide rails in the Z-axis direction, so that the test head 44 moves along the Z-axis with the test head guide rails 58 in a locked state by the lock mechanism. direction to move to the pogo pin connection position P3 (see FIG. 10) or the test head extraction position P4 (see FIG. 12(a)).

The pogo pin connection position P3 is a position where the terminal of the test head 44 and the pogo pin 46b of the pogo frame 46 are electrically connected. The test head extraction position P4 is set so that the test head 44 does not come into contact with the pogo pins 46b of the pogo frame 46 (and the positioning pins 60a, which will be described later) when the test head 44 is pulled out (and there is a space for raising the pogo frame 46, which will be described later). (so as to be reserved).

The test head pull-out mechanism 50 (test head slide mechanism) is means for pulling out the test head 44 raised to the test head pull-out position P4 to the maintenance area A2 side, and is composed of, for example, a test head guide rail 58. .

The test head 44 raised to the test head extraction position P4 is slid in the Y-axis direction along the test head guide rails 58 when the operator unlocks the lock mechanism and pulls it forward. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 12(b)). This enables maintenance of the test head 44 (for example, replacement of the board inside the test head).

The test head 44 for which maintenance has been completed is slid in the Y-axis direction along the test head guide rails 58 to the test head extraction position P4 by the operator, and then descends along the vertical guide rails to the pogo pin connection position P3. . At this time, as shown in FIG. 10, the test head 44 is positioned above the pogo frame 46 by the test head positioning mechanism 60, that is, at the pogo pin connection position P3.

The test head positioning mechanism 60 is means for positioning the test head 44 with respect to the pogo frame 46, and includes, for example, a positioning pin 60a and a recess 60b with which the positioning pin 60a abuts. The positioning pin 60a may be provided on the pogo frame 46 side, or may be provided on the test head 44 side. When the positioning pin 60a is provided on the pogo frame 46 side, the concave portion 60b with which the positioning pin 60a abuts is provided on the test head 44 side. Conversely, when the positioning pin 60a is provided on the test head 44 side, the concave portion 60b with which the positioning pin 60a abuts is provided on the pogo frame 46 side.

The pogo frame 46 is a device to be maintained (a device to be maintained over time) used when inspecting semiconductor devices formed on a wafer. As shown in FIG. It is composed of a plurality of pogo pins 46b held by the frame body 46a. The upper end of the pogo pin 46b protrudes from the upper surface of the pogo frame main body 46a, and the lower end of the pogo pin 46b protrudes from the lower surface of the pogo frame main body 46a. The pogo pins 46 b are electrically connected to the terminals of the test head 44 and to the probes of the probe card PC held by the first probe card holding mechanism 36 .

The pogo frame 46 is held by a pogo frame holding mechanism.

As shown in FIG. 11, the pogo frame holding mechanism comprises a base 62 and two pogo frame guide rails 64 fixed on the base 62 and extending in the Y-axis direction. The pogo frame 46 is slidably connected to the pogo frame guide rail 64 . The pogo frame holding mechanism (base 62) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 62 is provided with a lock mechanism (not shown) that locks (fixes) the pogo frame 46 to the base 62 (and the pogo frame guide rail 64). The locking mechanism is composed of, for example, an engaging portion such as a pawl that engages or disengages from the pogo frame 46 .

The pogo frame elevating mechanism 52 is means for elevating the pogo frame 46, and is composed of an actuator such as a pogo frame cylinder (air or hydraulic cylinder). For example, one end of the cylinder is connected to the base 62 side and the other end is connected to the head stage 20 side. The cylinder may be braked. This actuator moves the pogo frame holding mechanism (base 62) up and down in the Z-axis direction along the vertical guide rails, so that the pogo frame 46 moves along the Z-axis with the pogo frame guide rails 64 in a locked state by the lock mechanism. direction to move to the probe connection position P5 (see FIG. 12(a)) or the pogo frame extraction position P6 (see FIG. 13(a)).

The probe connection position P5 is a position where the pogo pins 46b of the pogo frame 46 and the probes (not shown) of the probe card held by the first probe card holding mechanism 36 are electrically connected. The pogo frame pull-out position P6 is a position designed so that the pogo frame 46 (pogo pin 46b) does not come into contact with the probes of the probe card (and positioning pins 66a described below) when the pogo frame 46 is pulled out.

The pogo frame pull-out mechanism 54 (pogo frame slide mechanism) is means for pulling out the pogo frame 46 raised to the pogo frame pull-out position P6 to the maintenance area A2 side, and is composed of, for example, a pogo frame guide rail 64. .

The pogo frame 46 raised to the pogo frame pull-out position P6 is slid in the Y-axis direction along the pogo frame guide rails 64 when the operator unlocks the lock mechanism and pulls it forward. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 13(b)). This enables maintenance of the pogo frame 46 (for example, pogo pin replacement, etc.).

The pogo frame 46 for which maintenance has been completed is slid in the Y-axis direction along the pogo frame guide rails 64 to the pogo frame pull-out position P6 by the operator, and then descends along the vertical guide rails to the probe connection position P5. . At this time, as shown in FIG. 12A, the pogo frame 46 is positioned above the head stage 20 by the pogo frame positioning mechanism 66, that is, at the probe connection position P5. be done.

The pogo frame positioning mechanism 66 is a means for positioning the pogo frame 46 with respect to the head stage 20, and includes, for example, a positioning pin 66a and a concave portion 66b with which the positioning pin 66a abuts. The positioning pin 66a may be provided on the pogo frame 46 side, or may be provided on the head stage 20 side. When the positioning pin 66a is provided on the pogo frame 46 side, the concave portion 66b with which the positioning pin 66a abuts is provided on the head stage 20 side. Conversely, when the positioning pin 66a is provided on the head stage 20 side, the concave portion 66b with which the positioning pin 66a abuts is provided on the pogo frame 46 side.

Alignment device 38, arm moving mechanism, environment control means 16d, moving device 22 (first movable body moving mechanism, second movable body moving mechanism, transport unit rotating mechanism 28), test head lifting mechanism 48, pogo frame lifting mechanism Each device and mechanism such as 52 is driven under the control of control means (controller or the like) not shown.

Next, an operation example of the transport unit 16 in the prober 10 of this embodiment will be described.

<Wafer transfer operation example>
First, an operation example when the transport unit 16 transports the wafer W from the wafer storage part 12a into the measuring part 14 where an inspection (for example, a high temperature inspection or a low temperature inspection) is performed will be described.

First, the transfer unit 16 is moved to a position where the wafer housing part 12a can be accessed (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180° so that the arms 16b and 16c enter and exit the transfer unit 16. The opening 16f formed in .theta. is opposed to the wafer housing portion 12a.

Next, the wafer holding arm 16b is advanced into the wafer storage portion 12a to take out one wafer W from the wafer storage portion 12a and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment of the measurement unit 14 to which the measurement device is transferred. Specifically, gas temperature-controlled by the temperature-controlled gas supply source is supplied into the housing 16a, and is jetted from the air injection port to form an air curtain that closes the opening 16f formed in the housing 16a. be done. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space.

Next, the transfer unit 16 is moved to a position where the measurement unit 14 of the transfer destination can be accessed (a position where the wafer W can be handed over), and the transfer unit 16 is rotated by 180° to move the arms 16b and 16c in and out. The opening 16f formed in the transport unit 16 is made to face the measurement section 14, which is the transport destination.

Next, the wafer holding arm 16b is advanced in the Y-axis direction into the measurement section 14 through the opening 16f on the transfer unit 16 side and the opening 14a on the measurement section 14 side, where the air curtain is formed, and the wafer W is placed on the wafer chuck 18. to load. The arrow on the right side of FIG. 14 indicates the direction of transfer of the object (wafer W in this case). The wafer holding arm 16b advances into the measuring section 14 while holding the wafer W through the opening 16f closed by the air curtain.

The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, it waits until the wafer W reaches the inspection temperature by the wafer chuck 18, and when the inspection temperature is reached, the alignment device 38 moves in the XYZ-θ direction to move the wafer W held by the wafer chuck 18 to the wafer. The probes of the probe card PC held above the chuck 18 are aligned by a well-known method, and then the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38 to electrically connect the wafer W and the probes. By bringing them into contact with each other, the electrical characteristics of the wafer W are inspected via the pogo frame 46 (pogo pins 46 b ) and the test head 44 .

In this manner, the environment in the transfer unit 16 is controlled by utilizing the time until the wafer is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination, and the inspection temperature at the measurement unit 14 at the transfer destination is adjusted. By reducing the difference, it is possible to shorten (or eliminate) the waiting time for bringing the wafer closer to the inspection temperature in the measurement unit 14 at the transfer destination, compared to the conventional technology. Thereby, the throughput (processing capacity per unit time) in the measurement unit 14 can be improved.

<Example of probe card transport operation>
Next, an operation example in which the transport unit 16 transports the probe card PC from the probe card storage part 12b into the measuring part 14 where an inspection (for example, a high temperature inspection or a low temperature inspection) is performed will be described.

First, the transport unit 16 is moved to a position where the probe card storage part 12b can be accessed (a position where the probe card PC can be taken out), and the transport unit 16 is rotated 180° to move the arms 16b and 16c in and out. An opening 16f formed in the unit 16 is made to face the probe card storage section 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage section 12b to take out one probe card PC from the probe card storage section 12b and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to correspond to the environment of the measurement unit 14 to which the measurement device is transferred. Specifically, gas temperature-controlled by the temperature-controlled gas supply source is supplied into the housing 16a, and is jetted from the air injection port to form an air curtain that closes the opening 16f formed in the housing 16a. be done. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space.

Next, the transport unit 16 is moved to a position where the measuring section 14 of the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180° to move the arms 16b and 16c in and out. The opening 16f formed in the conveying unit 16 is made to face the measuring section 14 of the conveying destination.

Next, the probe card holding arm 16c is advanced in the Y-axis direction into the measurement section 14 through the opening 16f on the side of the transport unit 16 where the air curtain is formed and the opening 14a on the side of the measurement section 14 (FIG. 7A). reference). While holding the probe card PC, the probe card holding arm 16c passes through the opening 16f closed by the air curtain and advances into the measuring section 14 in the Y-axis direction. The arrow on the right side in FIG. 14 represents the transport direction of the transported object (here, the probe card PC).

Next, the holding portion 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds it. Specifically, in a state in which the alignment device 38 holding the wafer chuck 18 is moved to the probe card receiving position P1, the holder 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a to move the probe card PC. (lower surface outer periphery), and the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. As a result, the probe card PC is transferred to the holding portion 40a and held directly above the wafer chuck 18 by the holding portion 40a.

Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 is moved to the position P2 (see FIG. 7B).

Next, the probe card PC is conveyed to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, while the alignment device 38 holding the wafer chuck 18 is moved to the position P2, the Z-axis movable portion 38a (the second probe card holding mechanism 40) is raised in the Z-axis direction. 2 The probe card PC held by the probe card holding mechanism 40 is transported to the first probe card holding mechanism 36 . The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36 .

<Example of test head pull-out operation>
Next, an operation example when the test head 44 is pulled out to the maintenance area A2 side will be described.

First, as shown in FIG. 12A, the test head lifting mechanism 48 lifts the test head holding mechanism (base 56) from the pogo pin connection position P3 to the test head extraction position P4. As a result, the test head 44 is moved to the test head extraction position P4 together with the test head guide rails 58 fixed to the base 56 while being locked by the lock mechanism.

Next, after releasing the lock by the lock mechanism, the operator pulls the test head 44 raised to the test head withdrawal position P4 to the front. As a result, the test head 44 slides in the Y-axis direction along the test head guide rail 58 and is pulled out to the maintenance area A2 side through the opening 14b, as shown in FIG. 12(b). This enables maintenance of the test head 44 (for example, replacement of the board inside the test head). The arrow on the left side in FIG. 14 indicates the pull-out direction (and the push-in direction) of the device to be maintained (here, the test head 44).

Next, an operation example of returning the test head 44 for which maintenance has been completed to the pogo pin connection position P3 will be described.

First, the operator pushes the test head 44 for which maintenance has been completed along the test head guide rails 58 and slides it in the Y-axis direction to the test head pull-out position P4, where it is locked by the lock mechanism. .

Next, the test head lifting mechanism 48 lowers the test head holding mechanism (base 56) from the test head extraction position P4 to the pogo pin connection position P3. As a result, the test head 44 is moved to the pogo pin connection position P3 together with the test head guide rails 58 fixed to the base 56 while being locked by the lock mechanism. At this time, as shown in FIG. 10, the test head 44 is positioned above the pogo frame 46 by the test head positioning mechanism 60, that is, at the pogo pin connection position P3. As a result, the terminals of the test head 44 and the pogo pins 46b of the pogo frame 46 are aligned, so that they can be electrically connected with high accuracy.

As described above, the extraction direction of the device to be maintained (here, the test head 44) (see the arrow on the left side in FIG. 14) and the transfer direction of the object (wafer W or probe card PC) (see the arrow on the right side in FIG. 14) ) are aligned in the Y-axis direction, it is possible to suppress (or eliminate) the Abbe error that must be considered when positioning the test head 44 with respect to the pogo frame 46, which requires high accuracy. . In particular, when the test head 44 for which maintenance has been completed is returned to the pogo pin connection position P3, it is possible to suppress the deterioration of the positioning accuracy in the X-axis direction.

<Pogo frame pull-out operation example>
Next, an operation example when pulling out the pogo frame 46 to the maintenance area A2 side will be described.

First, as shown in FIG. 12A, the test head lifting mechanism 48 lifts the test head holding mechanism (base 56) from the pogo pin connection position P3 to the test head extraction position P4. As a result, the test head 44 is moved to the test head extraction position P4 together with the test head guide rails 58 fixed to the base 56 while being locked by the lock mechanism. As a result, a rising space S for the pogo frame 46 is secured.

Next, as shown in FIG. 13A, the pogo frame lifting mechanism 52 raises the pogo frame holding mechanism (base 62) from the probe connection position P5 to the pogo frame extraction position P6. As a result, the pogo frame 46 moves to the pogo frame pulled-out position P6 together with the pogo frame guide rails 64 fixed to the base 62 while being locked by the locking mechanism.

Next, the operator pulls forward the pogo frame 46 that has been raised to the pogo frame pull-out position P6 after releasing the lock by the lock mechanism. As a result, as shown in FIG. 13B, the pogo frame 46 slides in the Y-axis direction along the pogo frame guide rail 64 and is pulled out to the maintenance area A2 side through the opening 14b. This enables maintenance of the pogo frame 46 (for example, pogo pin replacement, etc.). The arrow on the left side in FIG. 14 indicates the pull-out direction (and push-in direction) of the device to be maintained (here, the pogo frame 46).

Next, an operation example of returning the pogo frame 46 for which maintenance has been completed to the probe connection position P5 will be described.

First, the operator pushes the pogo frame 46 for which maintenance has been completed along the pogo frame guide rails 64 and slides it in the Y-axis direction to the pogo frame pull-out position P6, where it is locked by the lock mechanism. .

Next, the pogo frame lifting mechanism 52 lowers the pogo frame holding mechanism (base 62) from the pogo frame pull-out position P6 to the probe connection position P5. As a result, the pogo frame 46 moves to the probe connection position P5 together with the pogo frame guide rail 64 fixed to the base 62 while being locked by the locking mechanism. At this time, as shown in FIG. 12A, the pogo frame 46 is positioned above the head stage 20 by the pogo frame positioning mechanism 66, that is, at the probe connection position P5. be done. As a result, the pogo pins 46b of the pogo frame 46 and the probes of the probe card are aligned, so that they can be electrically connected with high accuracy.

As described above, the pull-out direction of the device to be maintained (here, the pogo frame 46) (see the arrow on the left side in FIG. 14) and the transfer direction of the object (wafer W or probe card PC) (see the arrow on the right side in FIG. 14) ) are aligned in the Y-axis direction, it is possible to suppress (or eliminate) the Abbe error that must be considered when positioning the pogo frame 46 with respect to the head stage 20, which requires high accuracy. . In particular, when the pogo frame 46 for which maintenance has been completed is returned to the probe connection position P5, it is possible to suppress the deterioration of the positioning accuracy in the X-axis direction.

In addition, in the prior art, since the pogo frame is pulled out without raising the pogo frame, the probe card had to be carried out from the measurement unit (cell) before pulling out the pogo frame. In the present embodiment, after the pogo frame 46 is raised to the pogo frame extraction position P6 and separated from the probe card, the pogo frame 46 raised to the pogo frame extraction position P6 is pulled out. The pogo frame 46 can be pulled out without carrying out the PC from the measuring section 14 .

As described above, according to the present embodiment, a plurality of measurement units 14 each having a device to be maintained (for example, at least one of a test head and a pogo frame) and a pull-out mechanism for pulling out the device to be maintained; For example, at least one of a wafer and a probe card) is moved to a position accessible to a measurement section of the transfer destination, and the transfer unit 16 transfers the transferred object into the measurement section 14 of the transfer destination. By aligning the pull-out direction of the device to be maintained and the conveying direction of the transported object (see Fig. 14), Abbe errors that must be considered when positioning the device to be maintained, which requires high accuracy, are suppressed. can be (or be eliminated).

That is, in a state where the test head 44 is arranged at the pogo pin connection position P3 and the pogo frame 46 is arranged at the probe connection position P5, the probe card PC is connected to the pogo frame 46, and the wafer W is connected to the probe card PC. However, the Abbe error can be suppressed by conveying the components that need to be positioned in a straight line. In addition, in the present embodiment, by linearly conveying the components that require positioning, positioning in a straight line can be omitted, so positioning becomes easier. In this embodiment, since the direction in which the device to be maintained is pulled out and the direction in which the transported object is transported are aligned, the test head is rotated to expose the pogo pins under the test head for maintenance. Space is saved because there is no space for rotating the head.

Further, in the prior art, the test head was not provided with a pull-out mechanism for pulling out the test head, and thus the test head could not be pulled out. by which the test head 44 can be pulled out.

Next, another aspect of loading in the measuring section 14 will be described. In the above-described example, it has been described that the object (wafer W or probe card PC) to be loaded into the measurement unit 14 is loaded from the transportation area A1 side by the transportation unit 16 (see FIG. 14). 14 , the conveyed object to be loaded into the measuring section 14 is loaded from the maintenance area A 2 side by the loading section 70 .

FIG. 15 is a top view showing that the objects to be transferred (wafer W and probe card PC) are loaded into the measuring section 14 from the maintenance area A2 side. As shown in FIG. 15 , when the measuring section 14 is loaded with a transported article from the maintenance area A2 side, the loading section 70 loads the measuring section 14 with the transported article. The loading section 70 may be provided with a transport means such as the transport unit 16 described above to transport the article, or the user or installer of the prober 10 may manually transport the article to the loading section 70 . , and then loaded into the measurement unit 14 by the loading unit 70 . The loading unit 70 is not particularly limited, and known loading means can be adopted. For example, the loading unit 70 may load the object to be conveyed into the measuring unit by a pullout mechanism, or may load the object to be conveyed into the measuring unit by an arm like the conveying unit 16 .

In this way, the measurement unit 14 can be loaded with a transported object from the transport area A1 side and from the maintenance area A2 side. For example, when the probe card PC is loaded into the measuring section 14, the transport unit 16 loads the transported object into the measuring part 14 if the transported object is for inspection of a semiconductor element, and the loading unit 70 transports the object. If the object is to be used for calibrating the position of the measuring section 14, the conveyed article is loaded into the measuring section 14. FIG.

Also, for example, when the frequency of loading the measuring unit 14 is high, the transported object is loaded from the transport area A1 side to the measuring unit 14, and when the frequency of loading the measuring unit 14 is low, the transported object is loaded from the maintenance area side. is loaded into the measurement unit 14 from the Here, high frequency and low frequency differ depending on the mode of use of the prober 10 by the user. 10, which must be loaded at the time of installation (at the time of start-up).

Further, for example, the transport unit 16 loads the transported object into the measurement unit 14 when the transported object requires environmental control, and the loading unit 70 loads the transported object when the transported object does not require environmental control. Load the measurement unit 14 . As described above, in the transport area A1, the environment control means 16d of the transport unit 16 performs environmental adjustment. The measurement unit 14 is loaded from the transport area A1 side.

Further, for example, the loading by the transport unit 16 or the loading by the loading unit 70 may be divided according to the type of the transported object. That is, since wafers W and probe cards PC, which are objects to be transferred, are used for various purposes and types, loading by the transport unit 16 or loading section 70 is performed according to the purposes and types of the wafers W and probe cards PC. You can split the loading by

For example, the probe card PC includes a measurement probe card for inspecting and measuring the wafer W and a calibration probe card for calibrating the position of the wafer W and the like. Then, for example, the calibration probe card is loaded by the loading section 70 and the measurement probe card is loaded by the transport unit 16 .

In this way, by changing the loading side of the transported object to the measuring unit 14 according to the transported object and the use condition of the prober 10, more efficient inspection can be performed.

Here, loading in the present application means mounting the probe card PC or the wafer W on the measurement unit 14 . Moreover, it is preferable that the loading by the transport unit 16 and the loading by the loading unit 70 are arranged in a straight line with respect to the direction of pulling out the maintenance device and the direction of transporting the article. Note that the arrows in FIG. 15 indicate the loading direction performed by the loading unit 70 .

FIG. 16 is a conceptual diagram showing an example of a calibration probe card. 16(a) is a top view of the calibration probe card 72 on the probe side, and FIG. 16(b) is a side view of the calibration probe card 72. FIG. The calibration probe card 72 shown in FIG. 16 is composed of a calibration probe card body 72a and probes 72b. The calibration probe card 72 has a total of 18 probes 72b, two of which form a pair (one set), one set in the center along the outer periphery of the calibration probe card 72, and one set at 45° intervals. are placed one by one. The calibration probe card 72 is used for positioning and alignment of the measuring section 14 . Therefore, for example, when the prober 10 is started up or installed, the calibration probe card 72 is used to align the measuring section 14 .

Next, a modified example will be described.

In the present embodiment, the configuration using the test head lifting mechanism 48, the test head pull-out mechanism 50, the pogo frame lifting mechanism 52, and the pogo frame pull-out mechanism 54 was exemplified. Only the test head pull-out mechanism 50 may be used, or only the pogo frame lifting mechanism 52 and the pogo frame pull-out mechanism 54 may be used.

In the present embodiment, the pogo frame lifting mechanism 52 is used to pull out the raised pogo frame 46. However, the pogo frame lifting mechanism 52 may be omitted. That is, the pogo frame 46 may be pulled out without raising the pogo frame 46 by using a pogo frame pull-out mechanism similar to that of the prior art.

In the present embodiment, the arms 16b and 16c of the transport unit 16 move in and out through the opening 16f formed in the housing 16a. A similar opening (not shown) is formed in the surface of 16a opposite to the side on which opening 16f is formed, and each arm 16b, 16c moves independently in the horizontal direction to open opening 16f and its opposite side. It may be configured to enter and exit through a side opening. In this way, the transport unit rotation mechanism 28 can be omitted. Even though the transport unit rotating mechanism 28 is omitted, that is, without rotating the transport unit 16, the arms 16b and 16c can access the transported article storage section 12 or the measuring sections 14. FIG. In this case, in addition to the air curtain forming means 42 that forms an air curtain that closes the opening 16f formed in the housing 16a of the transfer unit 16, an air curtain that closes the opening formed on the opposite side of the opening 16f is formed. By providing the conveying unit 16 with a similar air curtain forming means, the inside of the housing 16a can be made into a sealed or substantially sealed space, and the same effect as the above embodiment can be achieved.

Further, in the present embodiment, the configuration in which the measurement units 14 are two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) was exemplified. may be arranged in only one row in the horizontal direction (X-axis direction), or may be arranged in only one row in the vertical direction (Z-axis direction). By arranging the measurement units 14 in only one row in the horizontal direction (X-axis direction), the second movable body moving mechanism can be omitted. In addition, by arranging the measurement units 14 in only one row in the vertical direction (Z-axis direction), the first movable body moving mechanism can be omitted.

Also, in the present embodiment, the configuration using one transport unit 16 and one moving device 22 is illustrated, but the configuration is not limited to this, and multiple transport units 16 and multiple moving devices 22 may be used. By doing so, the throughput in each measurement unit 14 can be further improved.

Further, in the present embodiment, the configuration using the wafer holding arm 16b and the probe card holding arm 16c was exemplified. may be used.

In this embodiment, the arms 16b and 16c are provided in the transport unit 16. However, the arms 16b and 16c (or A corresponding arm) may be provided. With this configuration as well, it is possible to pick up an article to be transferred from the article storage section 12 or the measurement section 14 and store it in the transfer unit 16 by each arm, and to pick up the article from the transfer unit 16 to the transfer article storage section 12 or the measurement section 14 . It can be handed over to the measurement unit 14 .

In the present embodiment, the opening 16f formed in the housing 16a is closed with an air curtain. The conveying unit 16 may be provided with opening opening/closing means such as a shutter or a door that is closed during transportation, and the opening 16f may be opened and closed by this opening opening/closing means. Further, the opening 14a formed in each measuring section 14 may be closed with a similar air curtain, or the opening 14a may be opened and closed with a similar opening opening/closing means.

As described above, a plurality of measuring units having a device to be maintained and a pull-out mechanism for pulling out the device to be maintained and a measuring unit at the destination of the transported object can be accessed to measure the transported object. In the prober equipped with a transport unit that transports the equipment inside the department, the pull-out direction of the device to be maintained and the transport direction of the transported object are aligned in a straight line. The idea of suppressing the indispensable Abbe error is not only the prober of the above embodiment, but also a plurality of measurement units equipped with a device to be maintained and a pullout mechanism for pulling out the device to be maintained, and a measurement unit at the destination of the transported object. and a transport unit that moves to a position accessible to the transported object and transports the transported object into the measurement section of the transport destination.

Although the prober of the present invention has been described in detail above, the present invention is not limited to the above examples, and of course various improvements and modifications may be made without departing from the gist of the present invention. be.

DESCRIPTION OF SYMBOLS 10... Prober 12... Transferred article storage part 12a... Wafer storage part 12b... Probe card storage part 14... Measurement part 14a... Opening 16... Transfer unit 16a... Housing 16b... Wafer holding arm 16c ...probe card holding arm 16d...environment control means 16e...sensor 16f...opening 18...wafer chuck 20...head stage 22...moving device 24...first movable body 26...second movable body 28 Transport unit rotation mechanism 28a Drive motor 30, 32 Guide rail 34 Base 36 First probe card holding mechanism 38 Alignment device 40 Second probe card holding mechanism 40a Holding section 42... Air curtain forming means 44... Test head 46... Pogo frame 46a... Pogo frame main body 46b... Pogo pin 48... Test head elevating mechanism 50... Test head drawing mechanism 52... Pogo frame elevating mechanism 54... Pogo frame drawing mechanism 56 Base 58 Test head guide rail 60 Test head positioning mechanism 60a Positioning pin 60b Recess 62 Base 64 Pogo frame guide rail 66 Pogo frame positioning Mechanism 66a Positioning pin 66b Recess CH Card holder PC Probe card W Wafer

Claims (3)

A prober for testing electrical characteristics of semiconductor elements formed on a wafer,
a probe card having a plurality of probes arranged on a surface facing the wafer;
a test head arranged on the side opposite to the wafer with respect to the probe card;
a pogo frame interposed between the probe card and the test head;
with
The pogo frame can move up and down with respect to the probe card, and can be pulled out to a maintenance area opposite to the side where the wafer is loaded and unloaded.
prober . The test head can be pulled out to the maintenance area,
The prober according to claim 1 . The test head can be raised and lowered with respect to the pogo frame and can be pulled out to the maintenance area.
3. The prober according to claim 1 or 2 .

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