JP2017022404A - Prober - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a prober suppressing an Abbe error which must be taken into consideration at the time of positioning a device to be maintained, which requires high accuracy.SOLUTION: A prober includes: a probe card in which a plurality of probes are arranged on the surface opposite to a wafer; a test head 44 which is arranged on the side opposite to the wafer with respect to the probe card; a test head elevating mechanism 48 for elevating the test head 44 relative to the probe card and loading the test head; and a test head draw-out mechanism 50 for drawing out the test head 44 in a direction vertical to the elevation direction of the test head 44.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a prober for inspecting electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer, and more particularly to a prober having a drawing mechanism for pulling out a maintenance target device to the maintenance area side.

  Conventionally, a plurality of measurement units (cells), a transport mechanism (loader) for transporting a transported object (wafer) to each measurement unit, a pulling mechanism (moving mechanism) for pulling out a pogo frame (maintenance target device) in a lateral direction, There has been proposed a prober (wafer inspection apparatus) provided with (see, for example, Patent Document 1). According to the prober described in Patent Document 1, since the test head disposed above the pogo frame is lifted by the moving mechanism and separated from the pogo frame, the pogo frame is pulled out in the lateral direction. When pulling out the frame in the lateral direction, it is possible to prevent breakage of the pogo pin caused by rubbing the pogo pin of the pogo frame with the test head.

JP 2014-179379 A

  However, in the prober described in Patent Document 1, there is no proposal regarding what relationship is desired between the drawing-out direction of the maintenance target apparatus and the conveyance direction of the conveyed object.

  The present invention has been made in view of such circumstances, up to a position where a plurality of measuring units provided with a maintenance target device and a pull-out mechanism for pulling out the maintenance target device, and a position where the measurement unit at the transport destination of the transported object can be accessed. In a prober equipped with a transport unit that moves and transports a transported object into a measurement unit of a transport destination, it suppresses Abbe error that must be taken into account when positioning a maintenance target device that requires high accuracy ( Or to eliminate).

  In order to achieve the above object, a prober according to the present invention is a plurality of measurement units arranged between a transfer area and a maintenance area, and is used for inspecting a semiconductor element formed on a wafer. A plurality of measuring units provided with a maintenance device and a drawing mechanism for pulling out the device to be maintained to the maintenance area side, and a housing for storing a transported object, and a transport destination of the transported object in the transport area A transport unit that moves to a position where the measurement unit can be accessed and transports the transported object into the measurement unit of the transport destination, and the pull-out direction of the maintenance target device and the transport direction of the transported object are in a straight line is there.

  In one aspect of the prober of the present invention, the prober further includes an elevating mechanism for elevating and lowering the maintenance target device, and the pulling mechanism pulls the maintenance target device raised to a predetermined position by the elevating mechanism to the maintenance area side. It is configured.

  In one aspect of the prober of the present invention, the maintenance target device is at least one of a test head and a pogo frame disposed below the test head.

  In one aspect of the prober of the present invention, the maintenance target device is at least one of a test head and a pogo frame disposed below the test head, and the lifting mechanism is electrically connected to a pogo pin of the pogo frame. A test head lifting mechanism that lifts and lowers the test head between a pogo pin connection position and a test head pull-out position above it, and a probe connection position to which the probe of the probe card is electrically connected and a pogo frame pull-out position above it A test head pulling mechanism that pulls the test head raised to the test head pulling position to the maintenance area side, at least one of pogo frame lifting mechanisms that lift and lower the pogo frame between And the pogo raised to the pogo frame extraction position At least one of the pogo frame out mechanism drawing out the frame to the maintenance area side.

  In one aspect of the prober of the present invention, the test head lifting mechanism includes a test head cylinder for lifting and lowering the test head, and the pogo frame lifting mechanism includes a pogo frame cylinder for lifting and lowering the pogo frame.

  In one aspect of the prober of the present invention, the test head drawing mechanism includes a test head guide rail that guides the drawing of the test head raised to the test head drawing position, and the pogo frame drawing mechanism includes the pogo frame drawing mechanism. And a pogo frame guide rail for guiding the drawer of the pogo frame raised to the frame drawing position.

  In one aspect of the prober of the present invention, the test head elevating mechanism elevates the test head together with the test head guide rail, and the pogo frame elevating mechanism elevates the pogo frame together with the pogo frame guide rail. .

  In one aspect of the prober of the present invention, the plurality of measurement units further include a probe card holding unit disposed below the pogo frame and a wafer chuck, and the wafer and the probe held by the wafer chuck An alignment apparatus for performing relative alignment with a probe card held by a card holding unit, wherein the alignment device moves between the plurality of measurement units, and in the measurement unit at the movement destination, the transfer area side and the maintenance An alignment apparatus that moves between the area side is further provided.

  In one aspect of the prober of the present invention, a head stage provided in each of the plurality of measurement units and disposed below the pogo frame, a test head positioning mechanism for positioning the test head with respect to the pogo frame, A pogo frame positioning mechanism for positioning the pogo frame with respect to the head stage.

  In one aspect of the prober of the present invention, the prober further includes a transported object holding arm that holds the transported object that is provided in the transport unit and enters and exits from an opening formed in the housing. The transported object includes a wafer and a probe. The carrier holding arm is at least one of a wafer arm for holding the wafer and a probe card arm for holding the probe card.

  In one aspect of the prober of the present invention, each measuring unit is two-dimensionally arranged in the horizontal direction and the vertical direction.

  In one aspect of the prober of the present invention, the transported object is loaded into the measurement unit.

  In one aspect of the prober of the present invention, the prober includes a loading unit that loads the conveyed product from the maintenance area side to the measurement unit.

  According to the present invention, a plurality of measuring units equipped with a maintenance target device and a pull-out mechanism for pulling out the maintenance target device, and a measurement unit of the transport destination by moving to a position where the measurement unit of the transport destination of the transported object can be accessed. In a prober equipped with a transport unit for transporting into a section, Abbe errors that must be taken into account when positioning a maintenance target device that requires high accuracy can be suppressed (or eliminated).

The perspective view which shows schematic structure of the prober of this embodiment Front view of each measuring unit Perspective view of transport unit Longitudinal sectional view showing schematic configuration of transport unit Perspective view of moving device Partial enlarged perspective view of moving device Longitudinal sectional view showing schematic configuration of transport unit and measuring unit The perspective view which shows schematic structure of a prober Front view of each measuring unit (vertical row) Schematic showing the positional relationship between the head stage, pogo frame and test head Partial enlarged perspective view of the measurement unit Schematic showing how the test head is pulled out Schematic showing how the pogo frame is pulled out A top view showing that the pull-out direction of the maintenance target device and the transport direction of the transported object are in a straight line Top view showing transported material loaded from the maintenance area side to the measurement unit Conceptual diagram showing an example of a calibration probe card

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a perspective view showing a schematic configuration of a prober 10 of the present embodiment.

  As shown in FIG. 1, the prober 10 according to the present embodiment moves between a transported object storage unit 12, a plurality of measurement units 14, a transported object storage unit 12, and each measurement unit 14, In the embodiment, at least one of the wafer and the probe card) is transported into the transported object storage unit 12 or into each measurement unit 14, and the transport unit 16 is disposed between the transported object storage unit 12 and each measurement unit 14. And a moving device 22 that is moved at the same time.

  The transported object storage unit 12 and each measuring unit 14 are arranged at a constant interval in the Y direction in a state where the surfaces accessed by the transport unit 16 face each other (that is, face to face).

  The transport unit 16 is disposed between the transported object storage unit 12 and each measurement unit 14.

  The conveyed product storage unit 12 includes a wafer storage unit 12a that stores a plurality of wafers and a probe card storage unit 12b that stores a plurality of probe cards. The number and arrangement of the transported object storage units 12 are not particularly limited. In this embodiment, four transported object storage units 12 including the wafer storage unit 12a and the probe card storage unit 12b are accessed by the transport unit 16. Are arranged in the horizontal direction (X-axis direction) with their surfaces (the right-side surface in FIG. 1) oriented in the same direction. Note that the side opposite to the side accessed by the transfer unit 16 (the left side in FIG. 1) is accessed by an operator when collecting a wafer or a probe card.

  As shown in FIG. 8, the plurality of measuring units 14 are arranged between the transport area A1 and the maintenance area A2. As shown in FIG. 1, each of the plurality of measurement units 14 is a rectangular parallelepiped configured by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. A shape measurement chamber (also referred to as a prober chamber), as shown in FIGS. 9 and 10, is mounted on a wafer chuck 18 for holding a wafer, a head stage 20, and the head stage 20. First probe card holding mechanism (probe card holding unit) 36 for holding the probe card PC, and the pogo frame 46 disposed between the head stage 20 and the test head 44 (FIG. 9, FIG. 9). 10 is omitted). In addition, as shown in FIG. 11, a test head lifting mechanism 48, a test head pulling mechanism 50, a pogo frame lifting mechanism 52, and a pogo frame pulling mechanism 54 are disposed inside each measurement unit 14. .

  FIG. 2 is a front view of each measurement unit 14.

  The number and arrangement form of the measurement units 14 are not particularly limited. In this embodiment, as shown in FIGS. 1 and 2, a measurement unit group including four measurement units 14 arranged in the horizontal direction (X-axis direction). Are stacked in three stages in the vertical direction (Z-axis direction), and are arranged two-dimensionally with the surface (the left surface in FIG. 1) accessed by the transport unit 16 facing the same direction.

  On each measurement unit 14 (surface accessed by the transfer unit 16), there are a wafer holding arm 16b (wafer arm: transfer object holding arm) and a probe card holding arm 16c (probe card arm) of the transfer unit 16. An entrance / exit 14a is formed. Moreover, the opening 14b (refer FIG. 8) for drawing out the test head 44 and the pogo frame 46 is formed in the opposite side to the side in which the opening 14a was formed among each measurement part 14. FIG. Surfaces other than the surface on which the openings 14a and 14b of each measurement unit 14 are formed may be closed or an opening may be formed.

  The wafer chuck 18 is adjusted to a high or low target temperature (inspection temperature) by a known temperature adjusting device (for example, a heat plate or a chiller device built in the wafer chuck 18).

  The environment in each measurement unit 14 is controlled as follows. For example, the temperature in each measurement unit 14 is controlled to the target temperature (inspection temperature) by the temperature of the wafer chuck 18 disposed in each measurement unit 14. The humidity in each measurement unit 14 is controlled to the target humidity by purging dry air into each measurement unit 14 by a known mechanism. The environment in each measurement unit 14 is controlled by purging a predetermined gas (for example, nitrogen gas) into each measurement unit 14 by a known mechanism. Each measurement unit 14 performs a plurality of types of inspections such as a high temperature inspection, a low temperature inspection, and an inspection under a predetermined gas (for example, nitrogen gas) atmosphere. The environment in each measurement unit 14 is controlled so that the environment in each measurement unit 14 becomes an environment according to the inspection performed in each measurement unit 14. In addition, the test | inspection implemented by each measurement part 14 may be the same between each measurement part, and may mutually differ.

  The first probe card holding mechanism 36 is a means for detachably holding the probe card PC, and is provided above the wafer chuck 18, for example, on the head stage 20 side. The first probe card holding mechanism 36 detachably holds the probe card PC transported to the first probe card holding mechanism 36 by a probe card transport mechanism described later. Since the first probe card holding mechanism 36 is well known (see, for example, Japanese Patent Application Laid-Open No. 2000-150596), further explanation is omitted.

  Each measurement unit group includes four alignment devices 38 and alignment devices 38 that perform relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18. A moving device (not shown) that moves between the units 14 is arranged. The alignment device 38 is moved between the four measurement units 14 included in the measurement unit group in which the alignment device 38 is arranged, and is shared among the four measurement units 14. As the moving device that moves the alignment device 38 between the four measuring units 14, for example, a device described in Japanese Patent Application Laid-Open No. 2014-150168 can be applied.

  The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18 and is moved up and down in the Z-axis direction. It is composed of a moving / rotating mechanism for moving the wafer chuck 18 in the XYZ-θ directions such as the shaft movable portion 38a, the Z-axis fixed portion 38b, and the XY movable portion 38c. The alignment device 38 mainly moves the wafer W held on the wafer chuck 18 while moving in the XYZ-θ direction to the probe of the probe card PC held above the wafer chuck 18 by a known method. Alignment is performed, the wafer W and the probe are brought into electrical contact, and the wafer W is used to inspect the electrical characteristics through the test head.

  The alignment device 38 holds the wafer chuck 18 in the measurement unit 14, and the probe card receiving position P1 (see FIG. 7A) near the opening 14a and the position P2 below the first probe card holding mechanism 36 (see FIG. 7A). (See FIG. 7B). That is, the alignment device 38 moves between the transport area A1 side and the maintenance area A2 side in the measurement unit 14 at the movement destination. This movement is realized by a known alignment apparatus moving device (not shown).

  The alignment device moving device moves the alignment device 38 holding the wafer chuck 18 heated to the target temperature when receiving the probe card PC to the probe card receiving position P1, and the first probe card holding mechanism 36 of the probe card PC. During the transfer to the position, the alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature is moved to the position P2.

  The alignment device 38 includes a second probe card holding mechanism 40 (also referred to as a card lifter).

  The second probe card holding mechanism 40 is a means for receiving the probe card PC from the probe card holding arm 16c and holding it, for example, a holding attached to the Z-axis movable portion 38a in a state of surrounding the wafer chuck 18. The part 40a (for example, a ring-shaped member or a plurality of pins) and an elevating mechanism (not shown) that raises and lowers the holding part 40a in the Z-axis direction with respect to the Z-axis movable part 38a.

  To receive and hold the probe card PC, the holding unit 40a is lifted in the Z-axis direction with respect to the Z-axis movable unit 38a while the alignment device 38 is moved to the probe card receiving position P1, and the probe card PC ) And the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. The probe card PC is held immediately above the wafer chuck 18.

  The probe card transport mechanism is a means for transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36. For example, the probe card transport mechanism is provided in the alignment device 38 in the Z-axis direction. It is comprised by the Z-axis movable part 38a moved up and down.

  The conveyance of the probe card PC to the first probe card holding mechanism 36 is realized by raising the Z-axis movable portion 38a in the Z-axis direction while the alignment device 38 is moved to the position P2.

  FIG. 3 is a perspective view of the transport unit 16, and FIG. 4 is a longitudinal sectional view illustrating a schematic configuration of the transport unit 16.

  The transfer unit 16 moves between the transfer object storage unit 12 and each measurement unit 14 in the X-axis direction and the Z-axis direction to place the wafer W or the probe card PC in the transfer object storage unit 12 or in each measurement unit 14. As shown in FIG. 3 and FIG. 4, a means for transporting and loading is a housing for storing the wafer W and the probe card PC, and the wafer W and the probe card PC (the wafer holding arm 16b and the probe card holding arm). 16c) is provided with a housing 16a in which an opening 16f is formed. The housing 16a has a rectangular parallelepiped shape, and includes a wafer holding arm 16b, a probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving the arms 16b and 16c, and the housing 16a. An environmental control means 16d for controlling the internal environment and a sensor 16e for detecting the internal environment of the housing 16a are arranged. The number of transport units 16 is not particularly limited, and one transport unit 16 is used in the present embodiment. In FIG. 1, two transport units 16 are depicted. This is because one transport unit 16 is accessing the transport object storage unit 12 (probe card storage unit 12 b) (in the lower right in FIG. 1). The drawing shows the state of accessing the measurement unit 14 and the measurement unit 14 (see the conveyance unit 16 drawn on the upper left in FIG. 1).

  The wafer holding arm 16b is a means for holding the wafer W. For example, the wafer holding arm 16b is arranged in the casing 16a so as to be movable in the horizontal direction along a guide rail (not shown) provided in the casing 16a. Yes. The wafer holding arm 16b is housed in the housing 16a together with the wafer W while holding the wafer W.

  The probe card holding arm 16c is a means for holding the probe card PC. For example, the probe card holding arm 16c is arranged in the casing 16a so as to be movable in the horizontal direction along a guide rail (not shown) provided in the casing 16a. Has been. The probe card holding arm 16c is housed in the housing 16a together with the probe card PC while holding the probe card PC. The probe card PC includes a card holder CH. A seal ring may be included instead of the card holder CH.

  The number and arrangement form of the arms 16b and 16c are not particularly limited. In this embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged in three upper and lower stages. Yes. Further, after the transport unit 16 transports the transported object to the measurement unit 14, the transport unit 16 loads the transported object into the measurement unit 14 using the arms 16 b and 16 c.

  The arm moving mechanism is configured by a known mechanism, for example, a drive motor (not shown) provided in the housing 16a. By rotating the drive motor forward and backward, the arms 16b and 16c individually move back and forth in the horizontal direction and enter and exit through an opening 16f formed in the housing 16a.

  The transport unit 16 includes air curtain forming means 42.

  The air curtain forming means 42 is a means for forming an air curtain that closes the opening 16f formed in the housing 16a to make the inside of the housing 16a sealed or substantially sealed space. It is configured.

  The number, shape, and arrangement of the air injection ports are not particularly limited. In the present embodiment, as shown in FIG. 4, the upper end is located near the upper end edge of the opening 16 f in a posture in which a plurality of air injection ports inject downward. It is arranged along the edge (in a direction perpendicular to the paper surface in FIG. 4).

  The environment in the housing 16a is controlled as follows. For example, the temperature and humidity in the housing 16a are controlled to a target temperature and humidity in a predetermined gas atmosphere by purging dry air (high temperature or low temperature dry air) or a predetermined gas (nitrogen gas) into each measurement unit 14. Is done. This is a known environment control means 16d, for example, a temperature control gas supply source including a heater and a cooler (cooler), a blower, and a pipe line (not shown) and a pipe line (not shown) connected to the casing 16a. (Not shown). The environment control means 16d may include a dehumidifier. A gas (high-temperature or low-temperature dry air) whose temperature (and humidity) has been adjusted by a temperature-controlled gas supply source is supplied into the housing 16a through a duct by a blower, and is jetted from an air injection port. An air curtain that closes the opening 16f formed in 16a is formed. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. The gas supply source supplied into the housing 16a and the gas supply source injected from the air injection port may be the same or different. Surfaces other than the surface on which the opening 16f of the housing 16a is formed may be closed or an opening may be formed. The environment control means 16d may be attached to the housing 16a or may be attached to the arms 16b and 16c.

  The sensor 16e is a sensor that detects the environment inside the housing 16a, and is, for example, a temperature sensor or a humidity sensor. The sensor 16e may be included in the environment control unit 16d.

  The environment control unit 16d controls the environment in the housing 16a so as to be an environment according to the environment of the transport destination of the transported object. Specifically, the environment control means 16d controls the inside of the housing 16a to a target environment based on the detection result of the sensor 16e. For example, the environment control unit 16d controls the temperature control gas supply source based on the detection result of the sensor 16e so that the temperature and humidity in the housing 16a become the target temperature and humidity. The function of the environmental control means 16d is realized by feedback control by a controller (not shown) to which the sensor 16e and a temperature control gas supply source (heater and cooler) are electrically connected, for example. The environment control means 16d and the air curtain forming means 42 may be integrated. That is, in one apparatus, an air injection port may be provided downward so as to close the opening 16f, and a dry air air injection port for controlling the environment in the housing 16a may be provided. Here, it is preferable that the air injection port of the dry air for controlling the environment in the housing 16a is provided in such a direction that the dry air to be injected circulates well in the housing 16a. By integrating the environment control means 16d and the air curtain forming means 42, a space for providing the environment control means 16d and the air curtain forming means 42 is reduced, and the space of the housing 16a can be used effectively. . Further, by integrating the environmental control means 16d and the air curtain forming means 42, a temperature control gas supply source including a heater and a cooler (cooler) between the environmental control means 16d and the air curtain forming means 42, and A blower or the like can be used in common.

  FIG. 5 is a perspective view of the moving device 22, and FIG. 6 is a partially enlarged perspective view of the moving device 22.

  The moving device 22 is a means for moving the transport unit 16 in the X-axis direction and the Z-axis direction between the transport object storage unit 12 and each measurement unit 14, for example, as shown in FIGS. The first movable body 24 and the first movable body 24 that move in the horizontal direction (X-axis direction) that is the arrangement direction of each measurement unit 14 between the transported object storage unit 12 and each measurement unit 14 are arranged in the horizontal direction (X-axis). A first movable body moving mechanism (not shown) that is moved in the direction), and is attached to the first movable body 24 so as to be movable in the vertical direction (Z-axis direction), which is the arrangement direction of each measuring unit 14, and a transport unit A second movable body 26 that rotatably supports 16 around a vertical axis (Z axis) as a rotation center, and a second movable body moving mechanism (not shown) that moves the second movable body 26 in the vertical direction (Z-axis direction). , Attached to the second movable body 26, and the transport unit 16 is It is constituted by the transport unit rotating mechanism 28 for rotating the rotating around the Z axis).

  The first movable body 24 is, for example, a frame body configured by connecting four corners of each of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction, and a lower portion thereof is connected to the transported object storage unit 12. It is movably connected to two guide rails 30 extending in the X-axis direction and arranged in parallel to each other on a base 34 between each measurement unit 14.

  The first movable body moving mechanism is configured by a known moving mechanism, for example, a ball screw connected to the first movable body 24, a drive motor (none of which is shown), or the like that rotates the ball screw. By rotating the drive motor forward and backward, the first movable body 24 (conveyance unit 16) moves along the guide rail 30 in the X-axis direction. Of course, not limited to this, the first movable body moving mechanism is a mechanism for causing the first movable body 24 to self-run, for example, a wheel provided on the first movable body 24 and a drive motor for rotating the wheel. Also good.

  The second movable body 26 is movably connected to two guide rails 32 that extend in the Z-axis direction and are arranged in parallel to the first movable body 24.

  The second movable body moving mechanism includes a known moving mechanism, for example, a ball screw connected to the second movable body 26, a drive motor (none of which is shown) that rotates the same, and the like. By rotating the drive motor forward and reverse, the second movable body 26 (conveyance unit 16) moves along the guide rail 32 in the Z-axis direction. Of course, not limited to this, the second movable body moving mechanism is a mechanism for causing the second movable body 26 to self-run, for example, a wheel provided on the second movable body 26 and a drive motor for rotating the wheel. Also good.

  The transport unit rotation mechanism 28 includes a known rotation mechanism, for example, a rotation shaft (vertical shaft) provided on the second movable body 26, a drive motor 28a for rotating the rotation shaft, and the like. The upper surface of the transport unit 16 is fixed to a rotation axis (vertical axis). By rotating the drive motor 28a forward and backward, the transport unit 16 rotates 180 ° about the vertical axis (Z axis), and an opening 16f formed in the transport unit 16 through which the arms 16b and 16c enter and exit is provided. It will be in the state which opposes the conveyed product storage part 12 or each measurement part 14. FIG.

  The test head 44 is a maintenance target device (a device that performs maintenance over time) used when inspecting a semiconductor element formed on a wafer, and a plurality of test heads 44 are electrically connected to the pogo pins 46 b of the pogo frame 46. Terminal (not shown).

  The test head 44 is held by a test head holding mechanism.

  As shown in FIG. 11, the test head holding mechanism includes a base 56 and two test head guide rails 58 that are fixed on the base 56 and extend in the Y-axis direction. The test head 44 is slidably connected to the test head guide rail 58. The test head holding mechanism (base 56) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 56 is provided with a lock mechanism (not shown) for locking (fixing) the test head 44 to the base 56 (and the test head guide rail 58). The locking mechanism is configured by an engaging portion such as a claw portion that is engaged with or released from the test head 44, for example.

  The test head elevating mechanism 48 is a means for elevating the test head 44, and is configured by an actuator such as a test head cylinder (air or hydraulic cylinder), for example. For example, one end of the cylinder is connected to the base 56 side, and the other end is connected to the head stage 20 side. The cylinder may be equipped with a brake. By this actuator, the test head holding mechanism (base 56) is moved up and down along the vertical guide rail in the Z-axis direction, so that the test head 44 is locked together with the test head guide rail 58 and the Z-axis in a locked state by the lock mechanism. It moves up and down in the direction and moves to the pogo pin connection position P3 (see FIG. 10) or the test head lead-out position P4 (see FIG. 12A).

  The pogo pin connection position P3 is a position where the terminal of the test head 44 and the pogo pin 46b of the pogo frame 46 are electrically connected. The test head lead-out position P4 is such that when the test head 44 is pulled out, the test head 44 does not come into contact with the pogo pin 46b (and the positioning pin 60a described later) of the pogo frame 46 (and there is a rising space of the pogo frame 46 described later). This is a considered position (as ensured).

  The test head pull-out mechanism 50 (test head slide mechanism) is a means for pulling out the test head 44 raised to the test head pull-out position P4 to the maintenance area A2 side, and is constituted by, for example, a test head guide rail 58. .

  The test head 44 raised to the test head pull-out position P4 is slid in the Y-axis direction along the test head guide rail 58 by the operator releasing the lock by the lock mechanism and pulling it forward. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 12B). Thereby, maintenance of the test head 44 (for example, replacement of the substrate inside the test head, etc.) becomes possible.

  After completion of the maintenance, the test head 44 is slid in the Y-axis direction along the test head guide rail 58 to the test head pull-out position P4, and then lowered to the pogo pin connection position P3 along the vertical guide rail. . At that time, as shown in FIG. 10, the test head 44 is positioned above the pogo frame 46, that is, at the pogo pin connection position P <b> 3 while being positioned with respect to the pogo frame 46 by the test head positioning mechanism 60.

  The test head positioning mechanism 60 is a means for positioning the test head 44 with respect to the pogo frame 46, and includes, for example, a positioning pin 60a and a recess 60b with which the positioning pin 60a abuts. The positioning pin 60a may be provided on the pogo frame 46 side, or may be provided on the test head 44 side. When the positioning pin 60a is provided on the pogo frame 46 side, the recess 60b with which the positioning pin 60a abuts is provided on the test head 44 side. On the other hand, when the positioning pin 60a is provided on the test head 44 side, the recess 60b with which the positioning pin 60a abuts is provided on the pogo frame 46 side.

  The pogo frame 46 is a maintenance target apparatus (an apparatus that performs maintenance over time) used when inspecting a semiconductor element formed on a wafer. As shown in FIG. 10, the pogo frame main body 46a and the pogo frame 46 are arranged. The frame body 46a includes a plurality of pogo pins 46b. The upper end portion of the pogo pin 46b protrudes from the upper surface of the pogo frame main body 46a, and the lower end portion of the pogo pin 46b protrudes from the lower surface of the pogo frame main body 46a. The pogo pin 46 b is electrically connected to the terminal of the test head 44 and is also electrically connected to the probe of the probe card PC held by the first probe card holding mechanism 36.

  The pogo frame 46 is held by a pogo frame holding mechanism.

  As shown in FIG. 11, the pogo frame holding mechanism includes a base 62 and two pogo frame guide rails 64 that are fixed on the base 62 and extend in the Y-axis direction. The pogo frame 46 is slidably connected to the pogo frame guide rail 64. The pogo frame holding mechanism (base 62) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 62 is provided with a lock mechanism (not shown) that locks (fixes) the pogo frame 46 to the base 62 (and the pogo frame guide rail 64). The lock mechanism is configured by an engaging portion such as a claw portion that is engaged with or released from the pogo frame 46, for example.

  The pogo frame elevating mechanism 52 is a means for elevating and lowering the pogo frame 46, and is constituted by an actuator such as a pogo frame cylinder (air or hydraulic cylinder), for example. For example, one end of the cylinder is connected to the base 62 side, and the other end is connected to the head stage 20 side. The cylinder may be equipped with a brake. By this actuator, the pogo frame holding mechanism (base 62) is moved up and down in the Z-axis direction along the vertical guide rail, so that the pogo frame 46 is locked together with the pogo frame guide rail 64 in the Z-axis direction while being locked by the locking mechanism. It moves up and down in the direction and moves to the probe connection position P5 (see FIG. 12A) or the pogo frame drawing position P6 (see FIG. 13A).

  The probe connection position P5 is a position where the pogo pin 46b of the pogo frame 46 and the probe (not shown) of the probe card held by the first probe card holding mechanism 36 are electrically connected. The pogo frame drawing position P6 is a position that is considered so that the pogo frame 46 (pogo pin 46b) does not come into contact with a probe (and a positioning pin 66a described later) of the probe card when the pogo frame 46 is pulled out.

  The pogo frame pull-out mechanism 54 (pogo frame slide mechanism) is a means for pulling out the pogo frame 46 raised to the pogo frame pull-out position P6 toward the maintenance area A2, and is constituted by, for example, a pogo frame guide rail 64. .

  The pogo frame 46 raised to the pogo frame pull-out position P6 is slid in the Y-axis direction along the pogo frame guide rail 64 by the operator releasing the lock by the lock mechanism and pulling it forward. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 13B). Thereby, maintenance of the pogo frame 46 (for example, pogo pin replacement etc.) becomes possible.

  After completion of the maintenance, the pogo frame 46 is slid in the Y-axis direction along the pogo frame guide rail 64 to the pogo frame pull-out position P6 by the operator, and then descends to the probe connection position P5 along the vertical guide rail. . At that time, as shown in FIG. 12A, the pogo frame 46 is positioned above the head stage 20, that is, at the probe connection position P5 while being positioned with respect to the head stage 20 by the pogo frame positioning mechanism 66. Is done.

  The pogo frame positioning mechanism 66 is a means for positioning the pogo frame 46 with respect to the head stage 20, and includes, for example, a positioning pin 66a and a recess 66b with which the positioning pin 66a abuts. The positioning pin 66a may be provided on the pogo frame 46 side, or may be provided on the head stage 20 side. When the positioning pin 66a is provided on the pogo frame 46 side, the recess 66b with which the positioning pin 66a abuts is provided on the head stage 20 side. On the other hand, when the positioning pin 66a is provided on the head stage 20 side, the recess 66b with which the positioning pin 66a abuts is provided on the pogo frame 46 side.

  The alignment device 38, arm moving mechanism, environment control means 16d, moving device 22 (first movable body moving mechanism, second movable body moving mechanism, transport unit rotating mechanism 28), test head lifting mechanism 48, pogo frame lifting mechanism. Each device and mechanism such as 52 is driven by control by a control means (controller or the like) (not shown).

  Next, an operation example of the transport unit 16 in the prober 10 of the present embodiment will be described.

<Example of wafer transfer operation>
First, an operation example when the transfer unit 16 transfers the wafer W from the wafer storage unit 12a to the measurement unit 14 where inspection (for example, high temperature inspection or low temperature inspection) is performed will be described.

  First, the transfer unit 16 is moved to a position where the wafer storage unit 12a can be accessed (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed on the wafer is opposed to the wafer storage portion 12a.

  Next, the wafer holding arm 16b is advanced into the wafer storage unit 12a, and one wafer W is taken out from the wafer storage unit 12a and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment according to the environment of the measurement unit 14 at the transport destination. Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source is supplied into the housing 16a, and an air curtain is formed that closes the opening 16f formed in the housing 16a by being injected from the air injection port. Is done. As a result, the inside of the housing 16a is sealed or substantially sealed.

  Next, the transfer unit 16 is moved to a position where the measurement unit 14 at the transfer destination can be accessed (position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 is opposed to the measurement unit 14 at the transport destination.

  Next, the wafer holding arm 16b is advanced in the Y-axis direction into the measurement unit 14 through the opening 16f on the transfer unit 16 side on which the air curtain is formed and the opening 14a on the measurement unit 14 side, and the wafer W is moved to the wafer chuck 18. Is loaded. The arrow on the right side in FIG. 14 represents the transfer direction of the transfer object (wafer W here). The wafer holding arm 16b advances into the measurement unit 14 through the opening 16f closed by the air curtain while holding the wafer W.

  The loaded wafer W is held on the wafer chuck 18 by vacuum suction. Then, the wafer W waits until the wafer chuck 18 reaches the inspection temperature. When the wafer W reaches the inspection temperature, the alignment device 38 moves in the XYZ-θ direction, and the wafer W held on the wafer chuck 18 is moved to the wafer. The probe of the probe card PC held above the chuck 18 is aligned by a known method, and then the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38 to electrically connect the wafer W and the probe. By bringing them into contact, the electrical characteristics of the wafer W are inspected via the pogo frame 46 (pogo pins 46b) and the test head 44.

  In this way, the environment in the transfer unit 16 is controlled using the time until the wafer is transferred from the wafer storage unit 12a to the transfer destination measurement unit 14, and the inspection temperature at the transfer destination measurement unit 14 is controlled. By reducing the difference, it is possible to shorten (or eliminate) the waiting time for bringing the wafer close to the inspection temperature in the measurement unit 14 at the transfer destination as compared with the conventional technique. Thereby, the throughput (processing capacity per unit time) in the measurement unit 14 can be improved.

<Example of probe card transport operation>
Next, an operation example when the transport unit 16 transports the probe card PC from the probe card storage unit 12b to the measurement unit 14 where inspection (for example, high temperature inspection or low temperature inspection) is performed will be described.

  First, the transport unit 16 is moved to a position where the probe card storage unit 12b can be accessed (position where the probe card PC can be taken out), and the transport unit 16 is rotated by 180 ° to transport the arms 16b and 16c in and out. The opening 16f formed in the unit 16 is opposed to the probe card storage portion 12b.

  Next, the probe card holding arm 16c is advanced into the probe card storage portion 12b, and one probe card PC is taken out from the probe card storage portion 12b and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment according to the environment of the measurement unit 14 at the transport destination. Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source is supplied into the housing 16a, and an air curtain is formed that closes the opening 16f formed in the housing 16a by being injected from the air injection port. Is done. As a result, the inside of the housing 16a is sealed or substantially sealed.

  Next, the conveyance unit 16 is moved to a position where the measurement unit 14 at the conveyance destination can be accessed (position where the probe card PC can be handed over), and the conveyance unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 to be transported is opposed to the measurement unit 14 at the transport destination.

  Next, the probe card holding arm 16c is advanced in the Y-axis direction into the measurement unit 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measurement unit 14 side (FIG. 7A). reference). While holding the probe card PC, the probe card holding arm 16c advances into the measurement unit 14 in the Y-axis direction through the opening 16f closed by the air curtain. The arrow on the right side in FIG. 14 represents the transport direction of the transported object (here, probe card PC).

  Next, the probe card PC is received from the probe card holding arm 16c and held by the holding portion 40a of the second probe card holding mechanism 40. Specifically, with the alignment device 38 holding the wafer chuck 18 moved to the probe card receiving position P1, the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a to thereby move the probe card PC. The probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a that is brought into contact with the outer peripheral edge of the lower surface and is raised in the Z-axis direction. As a result, the probe card PC is delivered to the holding unit 40a, and held by the holding unit 40a directly above the wafer chuck 18.

  Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 is moved to the position P2 (see FIG. 7B).

  Next, the probe card PC is transported to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, by moving the Z-axis movable portion 38a (second probe card holding mechanism 40) in the Z-axis direction while the alignment device 38 holding the wafer chuck 18 is moved to the position P2, The probe card PC held by the two-probe card holding mechanism 40 is conveyed to the first probe card holding mechanism 36. The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36.

<Example of test head pull-out operation>
Next, an operation example when the test head 44 is pulled out to the maintenance area A2 side will be described.

  First, as shown in FIG. 12A, the test head lifting mechanism 48 raises the test head holding mechanism (base 56) from the pogo pin connection position P3 to the test head drawing position P4. As a result, the test head 44 moves to the test head drawing position P4 together with the test head guide rail 58 fixed to the base 56 while being locked by the locking mechanism.

  Next, after the operator releases the lock by the lock mechanism, the operator pulls the test head 44 raised to the test head pull-out position P4 to the near side. Thereby, as shown in FIG. 12B, the test head 44 slides in the Y-axis direction along the test head guide rail 58 and is pulled out to the maintenance area A2 side through the opening 14b. Thereby, maintenance of the test head 44 (for example, replacement of the substrate inside the test head, etc.) becomes possible. The arrow on the left side in FIG. 14 represents the pull-out direction (and push-in direction) of the maintenance target apparatus (here, the test head 44).

  Next, an operation example in the case where the test head 44 for which maintenance has been completed is returned to the pogo pin connection position P3 will be described.

  First, the operator pushes the test head 44 for which maintenance has been completed along the test head guide rail 58 and slides the test head 44 to the test head pull-out position P4 in the Y-axis direction, and locks by the lock mechanism at that position. .

  Next, the test head lifting mechanism 48 lowers the test head holding mechanism (base 56) from the test head pull-out position P4 to the pogo pin connection position P3. As a result, the test head 44 moves to the pogo pin connection position P3 together with the test head guide rail 58 fixed to the base 56 in a locked state by the lock mechanism. At that time, as shown in FIG. 10, the test head 44 is positioned above the pogo frame 46, that is, at the pogo pin connection position P <b> 3 while being positioned with respect to the pogo frame 46 by the test head positioning mechanism 60. As a result, the terminals of the test head 44 and the pogo pins 46b of the pogo frame 46 are aligned, so that both can be electrically connected with high accuracy.

  As described above, the pull-out direction of the maintenance target apparatus (here, the test head 44) (see the left arrow in FIG. 14) and the transfer direction of the transfer object (wafer W or probe card PC) (right arrow in FIG. 14). Therefore, the Abbe error that must be taken into account when positioning the test head 44 with respect to the pogo frame 46, which requires high accuracy, can be suppressed (or eliminated). . In particular, when the test head 44 for which maintenance has been completed is returned to the pogo pin connection position P3, it is possible to suppress a decrease in positioning accuracy in the X-axis direction.

<Pogo frame extraction operation example>
Next, an operation example when the pogo frame 46 is pulled out to the maintenance area A2 side will be described.

  First, as shown in FIG. 12A, the test head lifting mechanism 48 raises the test head holding mechanism (base 56) from the pogo pin connection position P3 to the test head drawing position P4. As a result, the test head 44 moves to the test head drawing position P4 together with the test head guide rail 58 fixed to the base 56 while being locked by the locking mechanism. Thereby, the rising space S of the pogo frame 46 is ensured.

  Next, as shown in FIG. 13A, the pogo frame lifting mechanism 52 raises the pogo frame holding mechanism (base 62) from the probe connection position P5 to the pogo frame drawing position P6. As a result, the pogo frame 46 is moved to the pogo frame drawing position P6 together with the pogo frame guide rail 64 fixed to the base 62 while being locked by the locking mechanism.

  Next, after the operator releases the lock by the lock mechanism, the operator pulls the pogo frame 46 raised to the pogo frame pull-out position P6 toward the front. As a result, the pogo frame 46 is slid in the Y-axis direction along the pogo frame guide rail 64 and pulled out to the maintenance area A2 side through the opening 14b, as shown in FIG. 13B. Thereby, maintenance of the pogo frame 46 (for example, pogo pin replacement etc.) becomes possible. The left arrow in FIG. 14 represents the pulling direction (and the pushing direction) of the maintenance target device (here, the pogo frame 46).

  Next, an operation example in the case where the pogo frame 46 for which maintenance has been completed is returned to the probe connection position P5 will be described.

  First, the operator pushes the pogo frame 46 for which maintenance has been completed along the pogo frame guide rail 64 and slides the pogo frame 46 to the pogo frame pull-out position P6 in the Y-axis direction, and locks by the lock mechanism at that position. .

  Next, the pogo frame lifting mechanism 52 lowers the pogo frame holding mechanism (base 62) from the pogo frame pull-out position P6 to the probe connection position P5. As a result, the pogo frame 46 is moved to the probe connection position P5 together with the pogo frame guide rail 64 fixed to the base 62 while being locked by the locking mechanism. At that time, as shown in FIG. 12A, the pogo frame 46 is positioned above the head stage 20, that is, at the probe connection position P5 while being positioned with respect to the head stage 20 by the pogo frame positioning mechanism 66. Is done. Thereby, since the pogo pin 46b of the pogo frame 46 and the probe of the probe card are aligned, both can be electrically connected with high accuracy.

  As described above, the pull-out direction of the maintenance target apparatus (here, the pogo frame 46) (see the arrow on the left side in FIG. 14) and the transfer direction of the transfer object (wafer W or probe card PC) (the arrow on the right side in FIG. 14). Therefore, it is possible to suppress (or eliminate) an Abbe error that must be taken into account when positioning the pogo frame 46 with respect to the head stage 20 for which high accuracy is required. . In particular, when the pogo frame 46 for which maintenance has been completed is returned to the probe connection position P5, it is possible to suppress a decrease in positioning accuracy in the X-axis direction.

  In the prior art, the pogo frame is pulled out without raising the pogo frame, so the probe card had to be carried out of the measuring unit (cell) before pulling out the pogo frame. In the present embodiment, the pogo frame 46 is raised to the pogo frame drawing position P6 and separated from the probe card, and then the pogo frame 46 raised to the pogo frame drawing position P6 is pulled out. The pogo frame 46 can be pulled out without unloading the PC from the measuring unit 14.

  As described above, according to the present embodiment, a plurality of measurement units 14 including a maintenance target device (for example, at least one of a test head and a pogo frame) and a drawer mechanism that pulls out the maintenance target device, For example, the prober 10 includes a transfer unit 16 that moves to a position where the measurement unit of the transfer destination of at least one of the wafer and the probe card can be accessed and transfers the transferred object into the measurement unit 14 of the transfer destination. In addition, by making the pull-out direction of the maintenance target device and the conveyance direction of the transported object straight (see FIG. 14), the Abbe error that must be taken into consideration when positioning the maintenance target device that requires high accuracy is suppressed. You can do (or eliminate).

  That is, in a state where the test head 44 is disposed at the pogo pin connection position P3 and the pogo frame 46 is disposed at the probe connection position P5, the probe card PC is disposed on the pogo frame 46 and the wafer W is disposed on the probe card PC. However, the Abbe error can be suppressed by conveying these components that require positioning in a straight line. Moreover, in this embodiment, since the structure which needs these positioning is conveyed in a straight line, since the positioning in a straight line can be abbreviate | omitted, positioning becomes easier. Further, in this embodiment, since the drawing direction of the maintenance target device and the conveyance direction of the conveyed object are in a straight line, the test head is rotated to expose the pogo pin under the test head to perform a maintenance test. Space is saved because there is no space for rotating the head.

  In the prior art, the test head cannot be pulled out because the test head is not provided, and in the present embodiment, the test head lifting mechanism 48 and the test head pulling mechanism 50 are not provided. Thus, the test head 44 can be pulled out.

  Next, another mode in which the measurement unit 14 is loaded (loaded) will be described. In the above-described example, it has been described that the transfer object (wafer W or probe card PC) loaded in the measurement unit 14 is loaded from the transfer area A1 side by the transfer unit 16 (see FIG. 14). In the other aspect loaded in 14, the conveyed product loaded into the measurement unit 14 is loaded from the maintenance area A2 side by the loading unit 70.

  FIG. 15 is a top view showing that a measurement object 14 is loaded with a conveyed product (wafer W and probe card PC) from the maintenance area A2 side. As shown in FIG. 15, when a conveyed product is loaded into the measurement unit 14 from the maintenance area A2 side, the loaded unit 70 loads the conveyed product into the measurement unit 14. The loading unit 70 may be provided with a conveyance unit such as the conveyance unit 16 described above to convey the conveyed product, or the user or the installer of the prober 10 manually conveys the conveyed item to the loading unit 70. Then, the measuring unit 14 may be loaded by the loading unit 70. The loading unit 70 is not particularly limited, and a known loading unit can be employed. For example, the loading unit 70 may load the conveyed product into the measurement unit by using a drawing mechanism, or may load the conveyed product into the measurement unit by using an arm like the conveyance unit 16.

  As described above, the measurement unit 14 can be loaded with a conveyed product from the conveyance area A1 side and from the maintenance area A2 side. For example, when loading the probe card PC into the measuring unit 14, the transport unit 16 loads the transported object into the measuring unit 14 when the transported object is for inspection of a semiconductor element, and the loading unit 70 When an object is used for calibration of the position of the measuring unit 14, the conveyed object is loaded into the measuring unit 14.

  In addition, for example, when the loaded object is frequently loaded into the measuring unit 14, the loaded object is loaded from the conveying area A1 side to the measuring unit 14, and when the loaded object is loaded into the measuring unit 14 at a low frequency, the conveyed object is loaded on the maintenance area side. To the measuring unit 14. Here, the high frequency and the low frequency are different depending on how the user uses the prober 10. For example, the high frequency is a transported object that needs to be replaced every time the wafer W is measured. This is a transported object that needs to be loaded at the time of installation (starting up) 10.

  Further, for example, the transport unit 16 loads the transported object into the measuring unit 14 when the transported object needs to control the environment, and the loading unit 70 loads the transported object when the transported object does not need environmental control. Load into measurement unit 14. As described above, since environmental adjustment is performed by the environmental control means 16d of the transport unit 16 in the transport area A1, when a transported object that requires temperature adjustment or humidity adjustment is loaded into the measurement unit 14, the transported object is The measurement unit 14 is loaded from the conveyance area A1 side.

  Further, for example, loading by the transport unit 16 or loading by the loading unit 70 may be divided according to the type of the transported object. That is, since the wafer W and the probe card PC, which are the objects to be conveyed, have various uses and types, the loading unit 70 by the transfer unit 16 or the loading unit 70 depends on the uses and types of the wafer W and the probe card PC. The loading by may be divided.

  For example, the probe card PC includes a measurement probe card for inspecting and measuring the wafer W and a calibration probe card for calibrating the position of the wafer W and the like. For example, the calibration probe card is loaded by the loading unit 70, and the measurement probe card is loaded by the transport unit 16.

  Thus, a more efficient inspection can be performed by changing the loading side of the transported object to the measurement unit 14 according to the state of use of the transported object and the prober 10.

  Here, the loading of the present application is to install the probe card PC or the wafer W in the measuring unit 14. Moreover, it is preferable that the loading by the conveyance unit 16 and the loading by the loading unit 70 are arranged in a straight line with respect to the pulling-out direction of the maintenance target apparatus and the conveyance direction of the conveyed object. In addition, the arrow in FIG. 15 represents the loading direction which the loading part 70 performs.

  FIG. 16 is a conceptual diagram showing an example of a calibration probe card. FIG. 16A is a top view of the calibration probe card 72 on the probe side, and FIG. 16B is a side view of the calibration probe card 72. The calibration probe card 72 shown in FIG. 16 includes a calibration probe card main body 72a and a probe 72b. The calibration probe card 72 has a total of 18 probes 72b, and two pairs form a pair (one set), one set at the center along the outer periphery of the calibration probe card 72, and one set at 45 ° intervals. It is arranged one by one. The calibration probe card 72 is used for alignment and alignment of the measurement unit 14. Therefore, for example, when the prober 10 is started up or installed, the calibration probe card 72 is used to align the measuring unit 14.

  Next, a modified example will be described.

  In the present embodiment, the configuration using the test head lifting mechanism 48, the test head pulling mechanism 50, the pogo frame lifting mechanism 52, and the pogo frame pulling mechanism 54 is illustrated, but the present invention is not limited thereto, and the test head lifting mechanism 48 and Only the test head pulling mechanism 50 may be used, or only the pogo frame lifting mechanism 52 and the pogo frame pulling mechanism 54 may be used.

  In the present embodiment, the pogo frame elevating mechanism 52 is used and the pogo frame 46 that has been raised by the pogo frame 46 is drawn out. However, the present invention is not limited to this, and the pogo frame elevating mechanism 52 may be omitted. In other words, a pogo frame pulling mechanism similar to that of the prior art may be used, and the pogo frame 46 may be pulled out without raising the pogo frame 46.

  Further, in the present embodiment, the configuration in which the arms 16b and 16c of the transport unit 16 enter and exit through the opening 16f formed in the housing 16a is illustrated, but the present invention is not limited thereto, and for example, the housing of the transport unit 16 A similar opening (not shown) is formed on the surface of 16a opposite to the side on which opening 16f is formed, and arms 16b and 16c individually reciprocate in the horizontal direction to open opening 16f and its opposite side. You may comprise so that it may come in and out through the opening of the side. In this way, the transport unit rotation mechanism 28 can be omitted. Even though the transport unit rotation mechanism 28 is omitted, that is, without the transport unit 16 being rotated, access to the transport object storage unit 12 or each measurement unit 14 by the arms 16b and 16c can be realized. In this case, in addition to the air curtain forming means 42 that forms an air curtain that closes the opening 16f formed in the housing 16a of the transport unit 16, an air curtain that closes the opening formed on the opposite side of the opening 16f is provided. By providing the air curtain forming means to be formed in the transport unit 16, the inside of the housing 16a can be sealed or substantially sealed space, and the same effect as in the above embodiment can be obtained.

  Further, in the present embodiment, the configuration in which each measurement unit 14 is two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) is illustrated, but the measurement unit 14 is not limited thereto. May be arranged only in a line in the horizontal direction (X-axis direction), or may be arranged only in a line in the vertical direction (Z-axis direction). The second movable body moving mechanism can be omitted by arranging the measuring units 14 in only one row in the horizontal direction (X-axis direction). Also, the first movable body moving mechanism can be omitted by arranging the measuring units 14 in only one line in the vertical direction (Z-axis direction).

  Further, in the present embodiment, the configuration using one transport unit 16 and one moving device 22 is illustrated, but the present invention is not limited to this, and a plurality of transport units 16 and a plurality of moving devices 22 may be used. In this way, the throughput in each measurement unit 14 can be further improved.

  In the present embodiment, the configuration using the wafer holding arm 16b and the probe card holding arm 16c has been exemplified. However, the configuration is not limited thereto, and only the wafer holding arm 16b may be used, or only the probe card holding arm 16c may be used. It may be used.

  Further, in the present embodiment, the configuration in which the arms 16b and 16c are provided in the transport unit 16 is illustrated, but not limited thereto, the arms 16b and 16c (or the transport unit storage unit 12 side and the measurement unit 14 side) are provided. An arm corresponding to this may be provided. Also by this, it is possible to take out the conveyed product from the conveyed product storage unit 12 or the measurement unit 14 by each arm and store it in the conveyance unit 16, and to take out the conveyed product from the conveyance unit 16 and to store the conveyed product storage unit 12 or It can be delivered to the measurement unit 14.

  Further, in the present embodiment, the configuration in which the opening 16f formed in the casing 16a is closed with an air curtain is illustrated, but the present invention is not limited thereto, and the opening is opened when the transported object is taken out or delivered, and An opening / closing means such as a shutter or a door that is closed during the conveyance may be provided in the conveyance unit 16, and the opening 16f may be opened / closed by the opening / closing means. Moreover, you may comprise so that the opening 14a formed in each measurement part 14 may be obstruct | occluded with the same air curtain, or you may comprise so that the opening 14a may be opened and closed with the same opening opening / closing means.

  As described above, a plurality of measuring units equipped with a maintenance target device and a pull-out mechanism for pulling out the maintenance target device and a measurement unit of the transport destination by moving to a position accessible to the measurement unit of the transport destination of the transported material In a prober equipped with a transport unit for transporting into the unit, the pulling direction of the maintenance target device and the transport direction of the transported object are aligned so that it can be considered when positioning the maintenance target device that requires high accuracy. The concept of suppressing the Abbe error that must be provided is not only the prober of the above embodiment, but also a plurality of measuring units equipped with a maintenance target device and a drawer mechanism for pulling out the maintenance target device, and a measurement unit for a destination of the transported object All types of probers equipped with a transport unit that moves to a position where it can be accessed It is possible to use.

  Although the prober of the present invention has been described in detail above, the present invention is not limited to the above examples, and various improvements and modifications may be made without departing from the scope of the present invention. is there.

  DESCRIPTION OF SYMBOLS 10 ... Prober, 12 ... Conveyed object storage part, 12a ... Wafer storage part, 12b ... Probe card storage part, 14 ... Measurement part, 14a ... Opening, 16 ... Conveyance unit, 16a ... Case, 16b ... Wafer holding arm, 16c DESCRIPTION OF SYMBOLS ... Probe card holding arm, 16d ... Environmental control means, 16e ... Sensor, 16f ... Opening, 18 ... Wafer chuck, 20 ... Head stage, 22 ... Moving device, 24 ... First movable body, 26 ... Second movable body, 28 ... transport unit rotation mechanism, 28a ... drive motor, 30, 32 ... guide rail, 34 ... base, 36 ... first probe card holding mechanism, 38 ... alignment device, 40 ... second probe card holding mechanism, 40a ... holding section, 42 ... Air curtain forming means, 44 ... Test head, 46 ... Pogo frame, 46a ... Pogo frame body, 46b ... Pogo pin, DESCRIPTION OF SYMBOLS 8 ... Test head raising / lowering mechanism, 50 ... Test head drawing mechanism, 52 ... Pogo frame raising / lowering mechanism, 54 ... Pogo frame drawing mechanism, 56 ... Base, 58 ... Test head guide rail, 60 ... Test head positioning mechanism, 60a ... Positioning Pin, 60b ... recess, 62 ... base, 64 ... guide rail for pogo frame, 66 ... pogo frame positioning mechanism, 66a ... positioning pin, 66b ... recess, CH ... card holder, PC ... probe card, W ... wafer

Claims (2)

A prober for inspecting electrical characteristics of a semiconductor element formed on a wafer,
A probe card in which a plurality of probes are arranged on a surface facing the wafer;
A test head disposed on the opposite side of the wafer from the probe card;
A test head lifting mechanism for lifting and mounting the test head relative to the probe card;
A test head pulling mechanism for pulling out the test head in a direction perpendicular to the raising and lowering direction of the test head;
Prober equipped with. A pogo frame interposed between the probe card and the test head;
A pogo frame raising / lowering mechanism for raising and lowering the pogo frame relative to the probe card;
A pogo frame pulling mechanism for pulling out the pogo frame in a direction perpendicular to the raising and lowering direction of the test head;
The prober according to claim 1, comprising:

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