JP6519780B2 - Probe card type temperature sensor - Google Patents

Description

  The present invention relates to a probe card type temperature sensor used in a prober for inspecting electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer, and more particularly to a probe card type provided with a plurality of pin type temperature sensors. It relates to a temperature sensor.

  Conventionally, in the field of a prober for inspecting the electrical characteristics of a plurality of semiconductor elements formed on a semiconductor wafer, a plurality of temperature sensors are disposed on the upper surface (surface) of a wafer chuck, and the detection temperature of each temperature sensor is detected. A prober configured to control the temperature of the wafer chuck based on it has been proposed (see, for example, Patent Document 1).

  Also, conventionally, there has been proposed a probe card which is provided with a temperature measurement probe in addition to the characteristic measurement probe and configured to measure the temperature of the wafer surface by this temperature measurement probe (see, for example, Patent Document 2) ).

JP, 2006-294873, A Japanese Patent Application Publication No. 2003-273176

  However, in the prober described in Patent Document 1 and the probe card described in Patent Document 2, it is desirable to make the contact pressure of each of the plurality of temperature sensors on the upper surface of the wafer chuck desirable, and also the desired contact pressure There is no suggestion on how to achieve

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a probe card type temperature sensor which can control the contact pressure of the plurality of temperature sensors with respect to the upper surface of each wafer chuck constant or substantially constant. To aim.

  In order to achieve the above object, a probe card type temperature sensor according to the present invention is provided on a probe card type card body and the card body, and abuts on the upper surface of the wafer chuck to measure the temperature of the wafer chuck And a plurality of pin type temperature sensors.

  In one aspect of the prober of the present invention, a plurality of pin-type temperature sensor through holes penetrating in the thickness direction are formed in the card body, and the plurality of pin-type temperature sensors include the plurality of pin-type temperatures. It is provided in the said card | curd main body in the state inserted in the through-hole for sensors.

  In one aspect of the prober of the present invention, a plurality of post pins provided on the card body and receiving a load by coming into contact with the upper surface of the wafer chuck in a state where the plurality of pin type temperature sensors are in contact with the upper surface of the wafer chuck Further comprising

  In one aspect of the prober of the present invention, a plurality of post pin through holes penetrating in the thickness direction are formed in the card body, and the plurality of post pins are inserted into the plurality of post pin through holes. In the card body.

  In one aspect of the prober of the present invention, each of the plurality of pin-type temperature sensors includes a metal protection tube in contact with the upper surface of the wafer chuck and a temperature sensor housed in the metal protection tube.

  In one aspect of the prober of the present invention, the plurality of pin-type temperature sensors each include a spherically shaped portion that abuts on the top surface of the wafer chuck.

  According to the present invention, it is possible to provide a probe card type temperature sensor capable of controlling the contact pressure of each of the plurality of temperature sensors on the upper surface of the wafer chuck constant or substantially constant.

The perspective view which shows schematic structure of the prober 10 of this embodiment Front view of each measurement unit 14 A perspective view of the transport unit 16 Longitudinal sectional view showing a schematic configuration of the transport unit 16 Perspective view of moving device 22 Partially enlarged perspective view of moving device 22 Longitudinal sectional view showing schematic structure of conveyance unit 16 and measurement part 14 A perspective view showing a schematic configuration of the prober 10 Front view of each measurement unit 14 (one vertical row) Schematic showing the positional relationship between the head stage 20, the pogo frame 46 and the test head 44 A partial enlarged perspective view of the measurement unit 14 Schematic showing how the test head 44 is pulled out Schematic diagram showing how the pogo frame 46 is pulled out Top view showing that the pull-out direction of the maintenance target device and the conveyance direction of the conveyance object are in a straight line Schematic diagram for explaining the enclosed space SS A diagram showing how the pin type temperature sensor 68b and the post pin 68c are in contact with the upper surface of the wafer chuck 18, etc. (A) Top view of probe card type temperature sensor 68, (b) Side view Schematic diagram for explaining the configuration of the pin type temperature sensor 68b

  Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings.

  FIG. 1 is a perspective view showing a schematic configuration of a prober 10 of the present embodiment.

  As shown in FIG. 1, the prober 10 according to the present embodiment moves between the transported item storage unit 12, the plurality of measurement units 14, the transported item storage unit 12, and the respective measurement units 14 to In the embodiment, a transport unit 16 for transporting at least one of the wafer, the probe card and the probe card type temperature sensor) into the transported product storage unit 12 or into each measuring unit 14, the transported unit 16 and the transported product storage unit 12 And a moving device 22 for moving between the measuring unit 14 and the moving unit.

  The conveyed product storage unit 12 and the measurement units 14 are arranged at regular intervals in the Y direction in a state in which the surfaces accessed by the conveyance unit 16 face each other (that is, facing each other).

  The transport unit 16 is disposed between the transported item storage unit 12 and each measuring unit 14.

  The transfer object storage unit 12 includes a wafer storage unit 12a for storing a plurality of wafers, a probe card storage unit 12b for storing a plurality of probe cards, and a probe card type temperature sensor storage unit for storing a probe card type temperature sensor. There are no particular limitations on the number and arrangement of the transported product storage units 12, and in the present embodiment, four transported product storage units 12 including the wafer storage unit 12 a, the probe card storage unit 12 b, and the probe card type temperature sensor storage unit It is arrange | positioned in the horizontal direction (X-axis direction) in the state which turned the surface (right side in FIG. 1) of the side accessed by the conveyance unit 16 in the same direction. The side (left side in FIG. 1) opposite to the side accessed by the transfer unit 16 is accessed by the operator at the time of wafer or probe card collection and the like.

  As shown in FIG. 8, the plurality of measurement units 14 are disposed between the transport area A1 and the maintenance area A2. As shown in FIG. 1, each of the plurality of measurement units 14 is a rectangular parallelepiped formed by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. In the measurement chamber (also referred to as a prober chamber) of a shape, as shown in FIGS. 9 and 10, the wafer chuck 18 for holding a wafer, the head stage 20, and the head stage 20 are mounted. A test head 44, a pogo frame 46 disposed between the head stage 20 and the test head 44, and a first probe card holding mechanism 36 (not shown in FIG. 9 and FIG. 10) for holding the probe card PC; Is arranged. Further, as shown in FIG. 11, a test head lifting mechanism 48, a test head pulling mechanism 50, a pogo frame lifting mechanism 52, and a pogo frame pulling mechanism 54 are disposed inside each measuring unit 14. .

  FIG. 2 is a front view of each measurement unit 14.

  The number and arrangement form of the measurement units 14 are not particularly limited, and in the present embodiment, as shown in FIGS. 1 and 2, a measurement unit group including four measurement units 14 arranged in the horizontal direction (X-axis direction) Are stacked in three stages in the vertical direction (Z-axis direction), and are arranged two-dimensionally with the surface on the side accessed by the transport unit 16 (the surface on the left side in FIG. 1) facing in the same direction.

  In each of the measurement units 14 (surface on the side accessed by the transfer unit 16), an opening 14a through which the wafer holding arm 16b and the probe card holding arm 16c of the transfer unit 16 enter and exit is formed. In addition, an opening 14 b (see FIG. 8) for drawing out the test head 44 and the pogo frame 46 is formed on the opposite side of the side where the opening 14 a is formed among the measurement parts 14. The surfaces other than the surfaces on which the openings 14a and 14b of each measurement unit 14 are formed may be closed or openings may be formed.

  The wafer chuck 18 is adjusted to a high or low temperature target temperature (inspection temperature) by a known temperature control device (for example, a heat plate or a chiller device built in the wafer chuck 18).

  The wafer chuck 18 is provided with a sealing mechanism. As shown in FIG. 15, the sealing mechanism includes an elastic ring-shaped seal member 74 provided in the vicinity of the outer periphery of the upper surface of the wafer chuck 18.

  The ring-shaped seal member 74 is a means for forming a sealed space SS between the probe card PC or the probe card type temperature sensor 68 held by the first probe card holding mechanism 36 and the wafer chuck 18.

  A suction port (not shown) communicating with the sealed space SS is formed on the upper surface of the wafer chuck 18, and a suction path (not shown) formed inside the wafer chuck 18 is formed in the suction port. The pressure reducing means 76 is connected.

  The pressure reducing means 76 is a means for evacuating the closed space SS, and is constituted by, for example, a vacuum pump. By operating the vacuum pump and suctioning through the suction port and the suction passage, the sealed space SS can be put into a vacuum state.

  When the probe card PC is held by the first probe card holding mechanism 36, the wafer chuck 18 is drawn toward the probe card PC by bringing the sealed space SS into a vacuum state, and the probe of the probe card PC and the wafer chuck The semiconductor element formed on the wafer held at 18 is electrically connected to be ready for inspection. On the other hand, when the probe card type temperature sensor 68 is held by the first probe card holding mechanism 36, the wafer chuck 18 is drawn toward the probe card type temperature sensor 68 by bringing the sealed space SS into a vacuum state. The plurality of pin type temperature sensors 68 b of the probe card type temperature sensor 68 abut on the upper surface of the wafer chuck 18 and the temperature measurement can be started.

  The environment in each measuring unit 14 is controlled as follows. For example, the temperature in each measurement unit 14 is controlled to a target temperature (inspection temperature) by the temperature of the wafer chuck 18 disposed in each measurement unit 14. Further, the humidity in each measuring unit 14 is controlled to a target humidity by purging dry air in each measuring unit 14 by a known mechanism. Further, the environment in each measurement unit 14 is controlled by purging a predetermined gas (nitrogen gas) in each measurement unit 14 by a known mechanism. In each measurement unit 14, a plurality of types of inspections such as a high temperature inspection, a low temperature inspection, and an inspection in a predetermined gas (for example, nitrogen gas) atmosphere described later are performed. The environment in each measuring unit 14 is controlled such that the environment in each measuring unit 14 corresponds to the inspection performed by each measuring unit 14. In addition, the test | inspection implemented by each measurement part 14 may be the same between each measurement part, and may mutually differ.

  The first probe card holding mechanism 36 is a means for detachably holding the probe card PC (see FIG. 3) or the probe card type temperature sensor 68 (see FIG. 17), and is above the wafer chuck 18, for example, a head stage. It is provided on the 20 side. The first probe card holding mechanism 36 has the same or substantially the same posture at the same or substantially the same position as the probe card PC or the probe card type temperature sensor 68 conveyed to the first probe card holding mechanism 36 by the probe card conveyance mechanism described later. Hold it in a detachable manner. The first probe card holding mechanism 36 is well known (see, for example, Japanese Patent Application Laid-Open No. 2000-150596), and thus further description is omitted.

  In each measurement unit group, an alignment device 38 and an alignment device 38 for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18 are measured four times. A moving device (not shown) is arranged to move between the units 14. The alignment device 38 is mutually moved among the four measurement units 14 included in the measurement unit group in which the alignment apparatus 38 is disposed, and shared among the four measurement units 14. As a moving device for moving the alignment device 38 between the four measurement units 14, for example, the one described in JP-A-2014-150168 can be applied.

  The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and is moved up and down in the Z-axis direction. The wafer chuck 18 such as the axis movable portion 38a, the Z axis fixed portion 38b, and the XY movable portion 38c is configured by a moving and rotating mechanism for moving the wafer chuck 18 in the X-Y-Z-θ direction. The alignment device 38 mainly moves the wafer W held by the wafer chuck 18 while moving in the X-Y-Z-θ direction in a known manner with respect to the probes of the probe card PC held above the wafer chuck 18. The wafer W is used for alignment, electrically contacting the wafer W with the probe, and performing an electrical property inspection of the wafer W through the test head.

  The alignment device 38 holds the wafer chuck 18 in the measuring unit 14 and receives the probe card receiving position P1 (see FIG. 7A) near the opening 14a and the position P2 below the first probe card holding mechanism 36 (see FIG. It moves between FIG. 7 (b)). That is, the alignment apparatus 38 moves between the transport area A1 side and the maintenance area A2 side in the measurement unit 14 of the movement destination. This movement is realized by a known alignment device movement device (not shown).

  The alignment device moving device moves the alignment device 38 holding the wafer chuck 18 heated to the target temperature to the probe card receiving position P1 when receiving the probe card PC, and the first probe card holding mechanism 36 of the probe card PC. The alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature is moved to the position P2 when being transported to the position.

  The alignment device 38 includes a second probe card holding mechanism 40 (also referred to as a card lifter).

  The second probe card holding mechanism 40 receives the probe card PC (or the probe card type temperature sensor 68) from the probe card holding arm 16c and holds the same by, for example, Z in a state surrounding the wafer chuck 18. A holding unit 40a (for example, a ring-shaped member or a plurality of pins) attached to the shaft movable unit 38a, and an elevating mechanism (not shown) that raises and lowers the holding unit 40a in the Z-axis direction with respect to the Z-axis movable unit 38a. And consists of.

  In order to receive and hold the probe card PC, with the alignment device 38 moved to the probe card receiving position P1, the holding portion 40a is raised in the Z axis direction with respect to the Z axis movable portion 38a to And the probe card PC is lifted from the probe card holding arm 16c by the holding unit 40a which rises in the Z-axis direction. The probe card PC is held directly above the wafer chuck 18. The same applies to the probe card type temperature sensor 68.

  The probe card transport mechanism transports the probe card PC (or the probe card type temperature sensor 68) held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36 and holds the probe card PC in the first probe card holding mechanism 36 For example, the alignment device 38 is constituted by an alignment device 38 (a Z-axis movable portion 38a which is moved up and down in the Z-axis direction). The alignment device 38 moves between the plurality of measurement units 14, and in the measurement unit 14 of the movement destination, the probe card PC transported by the transport unit 16 is transported to the first probe card holding mechanism 36 and the probe card The holding mechanism 36 is made to hold. The same applies to the probe card type temperature sensor 68.

  The conveyance of the probe card PC (or the probe card type temperature sensor 68) to the first probe card holding mechanism 36 raises the Z-axis movable portion 38a in the Z-axis direction with the alignment device 38 moved to the position P2. Is realized by

  FIG. 3 is a perspective view of the conveyance unit 16, and FIG. 4 is a longitudinal sectional view showing a schematic configuration of the conveyance unit 16.

  The transfer unit 16 moves in the X-axis direction and the Z-axis direction between the transfer object storage unit 12 and each measurement unit 14 to move the wafer W, the probe card PC or the probe card type temperature sensor 68 in the transfer object storage unit 12. Alternatively, as shown in FIG. 3 and FIG. 4, the case for housing the wafer W and the probe card PC (or the probe card type temperature sensor 68) by means for transporting the respective measurement units 14, the wafer W And a case 16a in which an opening 16f is formed in which the probe card PC (or the probe card type temperature sensor 68) enters and exits. The housing 16a has a rectangular parallelepiped shape, and the wafer holding arm 16b, the probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving the arms 16b and 16c, and the housing 16a. An environmental control means 16 d for controlling the internal environment and a sensor 16 e for detecting the environment in the housing 16 a are disposed. The number of the transport units 16 is not particularly limited, and one transport unit 16 is used in the present embodiment. Although two transport units 16 are illustrated in FIG. 1, this shows that one transport unit 16 is accessing the transported item storage unit 12 (the probe card storage unit 12b) (at the lower right in FIG. 1). It shows a state in which the drawn transport unit 16 is referred to) and a state in which the measurement unit 14 is accessed (see the transport unit 16 drawn in the upper left in FIG. 1).

  The wafer holding arm 16b is a means for holding the wafer W. For example, the wafer holding arm 16b is disposed in the housing 16a so as to be horizontally movable along a guide rail (not shown) provided in the housing 16a. There is. The wafer holding arm 16 b is housed in the housing 16 a together with the wafer W while holding the wafer W.

  The probe card holding arm 16c is a means for holding the probe card PC or the probe card type temperature sensor 68, and can be horizontally moved along a guide rail (not shown) provided in the housing 16a, for example. Are disposed in the housing 16a. The probe card holding arm 16 c is housed in the housing 16 a together with the probe card PC or the probe card type temperature sensor 68 while holding the probe card PC or the probe card type temperature sensor 68. The probe card PC and the probe card type temperature sensor 68 include a card holder CH. A seal ring may be included instead of the card holder CH.

  The number and arrangement of the arms 16b and 16c are not particularly limited. In the present embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged in upper and lower three stages. There is.

  The arm moving mechanism is constituted by a known mechanism, for example, a drive motor (not shown) provided in the housing 16a. By rotating the drive motor forward and reverse, the arms 16b and 16c individually reciprocate in the horizontal direction and move in and out through the opening 16f formed in the housing 16a.

  The transport unit 16 includes an air curtain forming means 42.

  The air curtain forming means 42 is a means for forming an air curtain for closing the opening 16f formed in the housing 16a to make the inside of the housing 16a a sealed or substantially sealed space, for example, by a known air jet port. It is configured.

  The number, shape, and arrangement of the air injection ports are not particularly limited, and in the present embodiment, as shown in FIG. It is arranged along the edge (in the direction perpendicular to the paper surface in FIG. 4).

  The environment in the housing 16a is controlled as follows. For example, the temperature and humidity in the housing 16 a are controlled to the target temperature and humidity by purging dry air (high temperature or low temperature dry air) or a predetermined gas (nitrogen gas) in each measurement unit 14. This is because the well-known environment control means 16d, for example, a temperature control gas supply source including a heater and a cooler (cooler), a blower, and a conduit connecting the blower (not shown) and the housing 16a (Not shown). The environment control means 16 d may include a dehumidifier. A gas (high-temperature or low-temperature dry air) whose temperature (and humidity) has been adjusted by a temperature adjustment gas supply source is supplied by a blower into the housing 16a via a conduit and is injected from an air injection port to the housing An air curtain is formed to close the opening 16f formed in 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. The supply source of the gas supplied into the housing 16a and the supply source of the gas injected from the air injection port may be the same or different. The surfaces other than the surface on which the opening 16f of the housing 16a is formed may be closed, or the opening may be formed. The environment control means 16 d may be attached to the housing 16 a or may be attached to the arms 16 b and 16 c.

  The sensor 16e is a sensor that detects the environment in the housing 16a, and is, for example, a temperature sensor or a humidity sensor. The sensor 16e may be included in the environment control means 16d.

  The environment control means 16 d controls the environment in the housing 16 a so as to be an environment according to the environment of the transfer destination of the transfer object. Specifically, the environment control means 16 d controls the inside of the housing 16 a to a target environment based on the detection result of the sensor 16 e. For example, based on the detection result of the sensor 16e, the environment control means 16d controls the temperature control gas supply source so that the temperature and humidity in the housing 16a become the target temperature and humidity. The function of the environment control means 16 d is realized, for example, by feedback control by a controller (not shown) to which the sensor 16 e and the temperature control gas source (heater and cooler) are electrically connected.

  FIG. 5 is a perspective view of the moving device 22, and FIG. 6 is a partially enlarged perspective view of the moving device 22.

  The moving device 22 is a means for moving the transport unit 16 between the conveyed product storage unit 12 and each of the measurement units 14 in the X-axis direction and the Z-axis direction, for example, as shown in FIG. The first movable body 24 and the first movable body 24 that move in the horizontal direction (X-axis direction), which is the arrangement direction of each measurement unit 14, between the conveyed product storage unit 12 and each measurement unit 14 are horizontally Moveable in the vertical direction (Z-axis direction), which is the arrangement direction of each measurement unit 14, to the first movable body moving mechanism (not shown) for moving in the A second movable body 26 rotatably supporting a second movable body 26 rotatably supporting a vertical axis (Z axis) 16 and a second movable body moving mechanism (not shown) for moving the second movable body 26 in the vertical direction (Z axis direction) , Attached to the second movable body 26, and the transfer unit 16 has a vertical axis It is constituted by the transport unit rotating mechanism 28 for rotating the rotating around the Z axis).

  The first movable body 24 is, for example, a frame body configured by connecting the four corners of each of a pair of upper and lower rectangular frames 24 a with four frames 24 b extending in the Z-axis direction, and the lower part thereof is It is movably connected to two guide rails 30 extending in the X-axis direction, which are disposed in parallel with each other on a base 34 between each of the measurement units 14.

  The first movable body moving mechanism is constituted by a known moving mechanism, for example, a ball screw connected to the first movable body 24, a drive motor (not shown) for rotating the same, or the like. The first movable body 24 (conveying unit 16) moves in the X-axis direction along the guide rail 30 by rotating the drive motor forward and reverse. Of course, the present invention is not limited to this, and the first movable body moving mechanism is a mechanism for causing the first movable body 24 to self-propelled, for example, a wheel provided to the first movable body 24 and a drive motor for rotating the same. It is also good.

  The second movable body 26 is movably connected to two guide rails 32 extending in the Z-axis direction, which are disposed in parallel to each other on the first movable body 24.

  The second movable body moving mechanism is constituted by a known moving mechanism, for example, a ball screw connected to the second movable body 26, a drive motor (not shown) for rotating the same, or the like. By rotating the drive motor forward and reverse, the second movable body 26 (conveying unit 16) moves in the Z-axis direction along the guide rail 32. Of course, the second movable body moving mechanism is not limited to this, and is a mechanism for causing the second movable body 26 to self-propelled, for example, a wheel provided to the second movable body 26 and a drive motor for rotating the same. It is also good.

  The transport unit rotation mechanism 28 is configured by a known rotation mechanism, for example, a rotation axis (vertical axis) provided to the second movable body 26 and a drive motor 28 a for rotating the same. The upper surface of the transport unit 16 is fixed to the rotation axis (vertical axis). By rotating the drive motor 28a forward and reverse, the transport unit 16 rotates 180 degrees about the vertical axis (Z axis) as a rotation center, and the openings 16f formed in the transport unit 16 through which the arms 16b and 16c move in and out It will be in the state facing the conveyed product storage part 12 or each measurement part 14.

  The test head 44 is a device to be maintained (a device whose maintenance is performed over time) used in the inspection of semiconductor elements formed on a wafer, and a plurality of the test heads 44 are electrically connected to the pogo pins 46 b of the pogo frame 46. Terminal (not shown).

  The test head 44 is held by a test head holding mechanism.

  As shown in FIG. 11, the test head holding mechanism is comprised of a base 56 and two test head guide rails 58 extending in the Y-axis direction fixed on the base 56. The test head 44 is slidably coupled to the test head guide rail 58. The test head holding mechanism (base 56) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 56 is provided with a lock mechanism (not shown) for locking the test head 44 relative to the base 56 (and the test head guide rail 58). The lock mechanism is constituted by, for example, an engaging portion such as a claw which is engaged with or released from the test head 44.

  The test head lifting mechanism 48 is a means for moving the test head 44 up and down, and is constituted by an actuator such as a test head cylinder (air or hydraulic cylinder). For example, one end of the cylinder is connected to the base 56 side, and the other end is connected to the head stage 20 side. The cylinder may be braked. The test head holding mechanism (base 56) is moved up and down in the Z-axis direction along the vertical guide rail by this actuator, whereby the test head 44 is locked with the test head guide rail 58 in the locked state by the lock mechanism. It is raised and lowered in the direction to move to the pogo pin connection position P3 (see FIG. 10) or the test head withdrawal position P4 (see FIG. 12A).

  The pogo pin connection position P3 is a position where the terminal of the test head 44 and the pogo pin 46b of the pogo frame 46 are electrically connected. The test head pulling out position P4 prevents the test head 44 from contacting the pogo pin 46b (and the positioning pin 60a described later) of the pogo frame 46 when drawing out the test head 44 (and the rising space of the pogo frame 46 described later) Position to be taken into account.

  The test head pullout mechanism 50 (test head slide mechanism) is a means for pulling out the test head 44 raised to the test head pullout position P4 to the maintenance area A2 side, and is constituted by the test head guide rail 58, for example. .

  The test head 44 raised to the test head withdrawal position P4 slides in the Y-axis direction along the test head guide rail 58 by the operator releasing the lock by the lock mechanism and pulling the lock toward the front. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 12 (b)). This enables maintenance of the test head 44 (for example, substrate exchange inside the test head).

  After maintenance is completed, the test head 44 slides along the test head guide rail 58 to the test head withdrawal position P4 in the Y-axis direction, and then descends to the pogo pin connection position P3 along the vertical guide rail . At this time, the test head 44 is disposed above the pogo frame 46, that is, at the pogo pin connection position P3, with the test head positioning mechanism 60 positioned with respect to the pogo frame 46, as shown in FIG.

  The test head positioning mechanism 60 is a means for positioning the test head 44 with respect to the pogo frame 46, and includes, for example, a positioning pin 60a and a recess 60b with which the positioning pin 60a abuts. The positioning pin 60 a may be provided on the pogo frame 46 side or may be provided on the test head 44 side. When the positioning pin 60a is provided on the pogo frame 46 side, the recess 60b with which the positioning pin 60a abuts is provided on the test head 44 side. On the other hand, when the positioning pin 60a is provided on the test head 44 side, on the other hand, the recess 60b with which the positioning pin 60a abuts is provided on the pogo frame 46 side.

  The pogo frame 46 (corresponding to the first pogo frame of the present invention) is a device to be maintained (a device for which maintenance is performed over time) used in the inspection of semiconductor elements formed on a wafer. As shown, it is composed of a pogo frame main body 46a and a plurality of pogo pins 46b held by the pogo frame main body 46a. The upper end portion of the pogo pin 46b protrudes from the upper surface of the pogo frame main body 46a, and the lower end portion of the pogo pin 46b protrudes from the lower surface of the pogo frame main body 46a. The pogo pins 46 b are electrically connected to the terminals of the test head 44 and also electrically connected to the probes of the probe card PC held by the first probe card holding mechanism 36.

  The pogo frame 46 is held by a pogo frame holding mechanism.

  As shown in FIG. 11, the pogo frame holding mechanism is constituted by a base 62 and two pogo frame guide rails 64 extending in the Y-axis direction fixed on the base 62. The pogo frame 46 is slidably coupled to the pogo frame guide rail 64. The pogo frame holding mechanism (base 62) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 62 is provided with a locking mechanism (not shown) for locking the pogo frame 46 to the base 62 (and the pogo frame guide rail 64). The locking mechanism is constituted by, for example, an engaging portion such as a claw which is engaged with or released from the pogo frame 46.

  The pogo frame 46 is exchanged with the dedicated pogo frame 70 by the pogo frame exchange holding mechanism. The pogo frame replacement and holding mechanism is a means for replacing and holding the pogo frame 46 or the dedicated pogo frame 70, and is mainly composed of the pogo frame holding mechanism, the pogo frame lifting mechanism 52, and the pogo frame pullout mechanism 54.

  The pogo frame raising and lowering mechanism 52 is a means for raising and lowering the pogo frame 46, and is constituted by an actuator such as a pogo frame cylinder (air or hydraulic cylinder). For example, one end of the cylinder is connected to the base 62 side, and the other end is connected to the head stage 20 side. The cylinder may be braked. The pogo frame holding mechanism (base 62) is moved up and down in the Z-axis direction along the vertical guide rail by this actuator, and the pogo frame 46 is locked with the pogo frame guide rail 64 in the locked state by the lock mechanism. It is raised and lowered in the direction to move to the probe connection position P5 (see FIG. 12 (a)) or the pogo frame lead-out position P6 (see FIG. 13 (a)).

  The probe connection position P5 is a position where the pogo pin 46b of the pogo frame 46 and the probe (not shown) of the probe card held by the first probe card holding mechanism 36 are electrically connected. The pogo frame pulling out position P6 is a position considered so that the pogo frame 46 (pogo pin 46b) does not contact the probe of the probe card (and the positioning pin 66a described later) when the pogo frame 46 is pulled out.

  The pogo frame pulling out mechanism 54 (pogo frame sliding mechanism) is a means for pulling out the pogo frame 46 raised to the pogo frame pulling out position P6 to the maintenance area A2 side, and is constituted by, for example, a pogo frame guide rail 64. .

  The pogo frame 46 raised to the pogo frame pullout position P6 is slid in the Y axis direction along the pogo frame guide rail 64 by the operator releasing the lock by the lock mechanism and pulling it toward the front. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 13 (b)). Thereby, maintenance of the pogo frame 46 (for example, pogo pin replacement etc.) becomes possible. Also, the pogo frame 46 can be removed from the pogo frame guide rail 64, and the dedicated pogo frame 70 can be attached (replaced) to the pogo frame guide rail 64.

  The dedicated pogo frame 70 (corresponding to the second pogo frame of the present invention) is exchanged with the pogo frame 46. As shown in FIG. 16, the dedicated pogo frame 70 is a dedicated pogo frame having the same or substantially the same shape as the pogo frame 46, and is composed of a pogo frame main body 70a and a plurality of pogo blocks 70b held by the pogo frame main body 70a. It is done. The plurality of pogo blocks 70b are provided in the same number as the plurality of pin type temperature sensors 68b. Each of the plurality of pogo blocks 70b includes four pogo pins (not shown). The four pogo pins are electrically connected to the plurality of pin type temperature sensors 68b (four lead wires 68b4 (see FIG. 18A)) of the probe card type temperature sensor 68 held by the first probe card holding mechanism 36. Be done.

  A plurality of pogo blocks 70b (pogo pins) of the dedicated pogo frame 70 are electrically connected to a detector 72 for recording information (temperature data) representing the temperature of the wafer chuck 18 measured by the plurality of pin type temperature sensors 68b. ing. The temperature of the wafer chuck 18 is adjusted (calibrated) based on the recorded contents of the detector 72. The function of adjusting the temperature of the wafer chuck 18 is realized, for example, by controlling a heat plate (not shown) incorporated in the wafer chuck 18 by a heat controller (not shown).

  The POGO frame 46 (or the replaced POGO frame 70) after the maintenance is slid by the operator along the pogo frame guide rail 64 to the pogo frame drawing position P6 in the Y-axis direction, and then the vertical guide rail , And descend to the probe connection position P5. At that time, as shown in FIG. 12A, the pogo frame 46 (or the replaced special pogo frame 70) is positioned with respect to the head stage 20 by the pogo frame positioning mechanism 66. It is disposed at the upper side, ie, at the probe connection position P5.

  The pogo frame positioning mechanism 66 is a means for positioning the pogo frame 46 (or the replaced special pogo frame 70) with respect to the head stage 20, for example, by a positioning pin 66a and a recess 66b against which the positioning pin 66a abuts. It is configured. The positioning pin 66a may be provided on the pogo frame 46 side or may be provided on the head stage 20 side. When the positioning pin 66a is provided on the pogo frame 46 side, the recess 66b with which the positioning pin 66a abuts is provided on the head stage 20 side. On the other hand, conversely to this, when the positioning pin 66a is provided on the head stage 20 side, the recess 66b with which the positioning pin 66a abuts is provided on the pogo frame 46 side.

  FIG. 17 (a) is a top view of the probe card type temperature sensor 68, and FIG. 17 (b) is a side view.

  The probe card type temperature sensor 68 is replaced with a probe card PC. As shown in FIG. 17, the probe card type temperature sensor 68 is a probe card type temperature sensor having the same or substantially the same shape as the probe card PC, and includes a probe card type card body 68a and a plurality of pin type temperature sensors 68b. And a plurality of post pins 68c and a printed circuit board 68d.

  The card body 68a is a card body having the same or substantially the same shape (in the present embodiment, a disk shape) as the probe card PC, and a card body of a size (diameter) corresponding to the size (diameter) of the wafer chuck 18 is used. The material of the card body 68a is preferably similar to that of the probe card PC from the viewpoint of measuring the upper surface temperature of the wafer chuck 18 under the same or substantially the same environment as the original inspection environment.

  The card body 68a is provided with a plurality of pin type temperature sensor through holes 68a1 and a plurality of post pin through holes 68a2 penetrating in the thickness direction. The number and arrangement of the pin type temperature sensor through holes 68a1 and the post pin through holes 68a2 are not particularly limited. In the present embodiment, as shown in FIG. 17, a total of 29 pin type temperature sensor through holes 68a1 and A total of 28 post pin through holes 68a2 are arranged concentrically between the center and the outer periphery of the card body 68a. The number and arrangement form of the pin type temperature sensor through holes 68a1 and the post pin through holes 68a2 may be an appropriate number and arrangement form according to the size (diameter) of the probe card type temperature sensor 68 (card body 68a). it can.

  The plurality of pin type temperature sensors 68b are means for contacting the upper surface of the wafer chuck 18 (see FIG. 16) to measure the temperature of the wafer chuck 18 as shown in FIG. 18A. A metal protection pipe 68b1 in contact with the upper surface 18 and a temperature sensor 68b2 accommodated in the metal protection pipe 68b1 are provided.

  The metal protection tube 68b1 includes a lower end portion 68b3 that abuts on the upper surface of the wafer chuck 18. The material of the metal protective tube 68b1 is not particularly limited, and, for example, SUS316 can be used. The shape of the lower end portion 68b3 is not particularly limited, and in the present embodiment, the shape is spherical from the viewpoint of reducing the contact thermal resistance.

  The temperature sensor 68b2 is, for example, a platinum temperature measuring resistor (for example, a platinum resistor Pt100). Of course, not limited to this, the temperature sensor 68b2 may be a temperature sensor other than a platinum temperature measuring resistor, for example, a thermocouple. The lead wire 68b4 is electrically connected to the temperature sensor 68b2, and the lead wire 68b4 is drawn to the outside from the upper end 68b5 of the metal protective tube 68b1.

  The number and arrangement of the pin-type temperature sensors 68b are not particularly limited. In the present embodiment, as shown in FIG. 17, a total of 29 pin-type temperature sensors 68b are formed on the card body 68a. The card main body 68a is provided with the temperature sensor through hole 68a1 inserted (press-fit). Specifically, each pin type temperature sensor 68b is fixed to the card body 68a by an adhesive such as a resin in a state of being inserted into the pin type temperature sensor through hole 68a1. Of course, not limited to this, each pin type temperature sensor 68b may be fixed to the card main body 68a by mechanical means (for example, an engagement claw) in a state of being inserted into the pin type temperature sensor through hole 68a1. . The upper end portion of each pin type temperature sensor 68b protrudes the same or substantially the same amount from the upper surface of the card body 68a, and the lower end portion of each pin type temperature sensor 68b protrudes from the lower surface of the same or substantially the same amount card body 68a.

  The plurality of post pins 68c are means for coming into contact with the upper surface of the wafer chuck 18 (see FIG. 16) in a state where the plurality of pin type temperature sensors 68b abut on the upper surface of the wafer chuck 18 (see FIG. 16).

  The material or structure of the post pin 68c is not particularly limited, but from the viewpoint of contact with the upper surface of the wafer chuck 18 and receiving a load, a material or structure (for example, It is desirable that the structure is not hollow but solid as in a metallic protective tube. The number and arrangement of the post pins 68c are not particularly limited, and in the present embodiment, a total of 28 post pins 68c are inserted into the plurality of post pin through holes 68a2 formed in the card body 68a as shown in FIG. The card main body 68a is provided in a state of being press-fitted. Specifically, each post pin 68c is fixed to the card body 68a by an adhesive such as resin in a state of being inserted into the post pin through hole 68a2. Of course, the present invention is not limited to this, and each post pin 68c may be fixed to the card body 68a by mechanical means (for example, an engagement claw) in a state of being inserted into the post pin through hole 68a2. The upper end portion of each post pin 68c protrudes from the upper surface of the card body 68a, and the lower end portion of each post pin 68c protrudes from the lower surface of the card body 68a.

  The length (protrusion amount) of each pin type temperature sensor 68 b and the length (protrusion amount) of each post pin 68 c are equal (identical or substantially the same). Further, the variation in the length of each pin type temperature sensor 68 b and each post pin 68 c is suppressed to 30 μm or less. The flatness of the upper surface of the wafer chuck 18 is set to 15 μm or less. Thereby, when each pin type temperature sensor 68b abuts on the upper surface of the wafer chuck 18, parallel accuracy can be maintained.

  The printed circuit board 68d includes a region (wiring, an electrode pad, a pogo seat, etc.) to which four pogo pins of the pogo block 70 are electrically connected, and the four regions of the pin type temperature sensor 68b shown in FIG. The lead wire 68b4 is electrically connected in a bent state. As shown in FIG. 18 (b), four pogo seats 68b6 are used corresponding to four pogo pins. FIG. 18 (b) shows an example of the electrical connection between the pogo block 70 (pogo pin) and the pin type temperature sensor 68 b.

  The alignment device 38, arm moving mechanism, environment control means 16d, moving device 22 (first movable body moving mechanism, second movable body moving mechanism, transport unit rotating mechanism 28), test head lifting mechanism 48, pogo frame lifting mechanism Each device and mechanism such as 52 is driven by control by control means (controller etc.) not shown.

  Next, an operation example of the transport unit 16 in the prober 10 of the present embodiment will be described.

<Example of wafer transfer operation>
First, an operation example in which the transfer unit 16 transfers the wafer W from the wafer storage unit 12a into the measurement unit 14 in which an inspection (for example, a high temperature inspection or a low temperature inspection) is performed will be described.

  First, the transfer unit 16 is moved to a position where the wafer storage unit 12a can be accessed (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c move in and out. The opening 16f formed in the is opposed to the wafer storage portion 12a.

  Next, the wafer holding arm 16b is advanced into the wafer storage unit 12a, one wafer W is taken out from the wafer storage unit 12a, and stored in the housing 16a. At the same time, the environment in the case 16 a is controlled so as to be an environment according to the environment of the measurement unit 14 of the transfer destination. Specifically, the gas whose temperature is adjusted by the temperature control gas supply source is supplied into the housing 16a, and an air curtain is formed which is injected from the air injection port and closes the opening 16f formed in the housing 16a. Be done. As a result, the inside of the housing 16a is sealed or substantially sealed.

  Next, the transfer unit 16 is moved to a position where the measurement unit 14 at the transfer destination can be accessed (a position where the wafer W can be transferred), and the transfer unit 16 is rotated by 180 ° to move the arms 16 b and 16 c in and out. The opening 16 f formed in the conveyance unit 16 is made to face the measurement unit 14 of the conveyance destination.

  Next, the wafer holding arm 16b is advanced in the Y axis direction into the measuring unit 14 through the opening 16f on the side of the transfer unit 16 where the air curtain is formed and the opening 14a on the measuring unit 14 side, Load The arrow on the right side in FIG. 14 represents the transfer direction of the transfer object (here, the wafer W). While holding the wafer W, the wafer holding arm 16 b passes through the opening 16 f closed by the air curtain and advances into the measurement unit 14.

  The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, the wafer W stands by until the inspection temperature is reached by the wafer chuck 18. When the inspection temperature is reached, the wafer W held by the wafer chuck 18 is moved to the wafer while the alignment device 38 moves in the X-Y-Z-.theta. Direction. Align the probe card PC probe held above the chuck 18 in a well-known manner, and then move the wafer chuck 18 in the Z-axis direction by the action of the alignment device 38 to electrically connect the wafer W and the probe By contacting them, the electrical property inspection of the wafer W is performed via the pogo frame 46 (pogo pin 46 b) and the test head 44.

  As described above, the environment in the transfer unit 16 is controlled using the time until the wafer is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination, and the inspection temperature at the measurement unit 14 at the transfer destination is controlled. By reducing the difference, it is possible to shorten (or eliminate) the waiting time for bringing the wafer close to the inspection temperature in the measuring unit 14 of the transfer destination as compared with the prior art. Thereby, the throughput in the measurement unit 14 can be improved.

<Probe card transport operation example>
Next, an operation example in the case where the transport unit 16 transports the probe card PC from the probe card storage unit 12b into the measurement unit 14 in which an inspection (for example, a high temperature inspection or a low temperature inspection) is performed will be described.

  First, the transfer unit 16 is moved to a position where the probe card storage unit 12b can be accessed (a position where the probe card PC can be removed), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c move in and out. The opening 16 f formed in the unit 16 is opposed to the probe card storage unit 12 b.

  Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b, one probe card PC is taken out from the probe card storage unit 12b, and is stored in the housing 16a. At the same time, the environment in the case 16 a is controlled so as to be an environment according to the environment of the measurement unit 14 of the transfer destination. Specifically, the gas whose temperature is adjusted by the temperature control gas supply source is supplied into the housing 16a, and an air curtain is formed which is injected from the air injection port and closes the opening 16f formed in the housing 16a. Be done. As a result, the inside of the housing 16a is sealed or substantially sealed.

  Next, the transfer unit 16 is moved to a position where the measurement unit 14 at the transfer destination can be accessed (a position at which the probe card PC can be transferred), and the transfer unit 16 is rotated by 180 ° to move the arms 16b and 16c in and out. The opening 16 f formed in the conveyance unit 16 is made to face the measurement unit 14 of the conveyance destination.

  Next, the probe card holding arm 16c is advanced in the Y axis direction into the measuring unit 14 through the opening 16f on the side of the transport unit 16 where the air curtain is formed and the opening 14a on the measuring unit 14 side (FIG. 7A) reference). While holding the probe card PC, the probe card holding arm 16 c passes through the opening 16 f blocked by the air curtain and advances into the measurement unit 14 in the Y-axis direction. The arrow on the right side in FIG. 14 indicates the transport direction of the transported item (here, the probe card PC).

  Next, the probe card PC is received from the probe card holding arm 16c by the holding portion 40a of the second probe card holding mechanism 40 and held. Specifically, with the alignment device 38 holding the wafer chuck 18 moved to the probe card receiving position P1, the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a to set the probe card PC. The probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a which abuts on the lower surface outer peripheral edge and is raised in the Z-axis direction. As a result, the probe card PC is delivered to the holding unit 40 a and held by the holding unit 40 a immediately above the wafer chuck 18.

  Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 is moved to the position P2 (see FIG. 7B).

  Next, the probe card PC is transported to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, with the alignment device 38 holding the wafer chuck 18 moved to the position P2, the Z axis movable portion 38a (the second probe card holding mechanism 40) is raised in the Z axis direction. 2) The probe card PC held by the probe card holding mechanism 40 is transported to the first probe card holding mechanism 36. The probe card PC transported to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36.

<Example of test head withdrawal operation>
Next, an operation example in the case where the test head 44 is pulled out to the maintenance area A2 will be described.

  First, as shown in FIG. 12A, the test head elevating mechanism 48 raises the test head holding mechanism (base 56) from the pogo pin connection position P3 to the test head pulling out position P4. As a result, the test head 44 moves to the test head pulling out position P4 together with the test head guide rail 58 fixed to the base 56 in the locked state by the lock mechanism.

  Next, after the operator releases the lock by the lock mechanism, the operator pulls the test head 44 raised to the test head withdrawal position P4 forward. As a result, as shown in FIG. 12B, the test head 44 slides along the test head guide rail 58 in the Y-axis direction and is pulled out to the maintenance area A2 through the opening 14b. This enables maintenance of the test head 44 (for example, substrate exchange inside the test head). The arrow on the left side in FIG. 14 indicates the drawing direction (and the pushing direction) of the device to be maintained (here, the test head 44).

  Next, an operation example in which the test head 44 whose maintenance has been completed is returned to the pogo pin connection position P3 will be described.

  First, the operator pushes the test head 44 whose maintenance has been completed along the test head guide rail 58 to slide it in the Y-axis direction to the test head withdrawal position P4, and performs locking by the lock mechanism at that position. .

  Next, the test head elevating mechanism 48 lowers the test head holding mechanism (base 56) from the test head withdrawal position P4 to the pogo pin connection position P3. As a result, the test head 44 moves to the pogo pin connection position P3 together with the test head guide rail 58 fixed to the base 56 in the locked state by the lock mechanism. At this time, the test head 44 is disposed above the pogo frame 46, that is, at the pogo pin connection position P3, with the test head positioning mechanism 60 positioned with respect to the pogo frame 46, as shown in FIG. As a result, the terminals of the test head 44 and the pogo pins 46 b of the pogo frame 46 are aligned, so that both can be electrically connected with high accuracy.

  As described above, the withdrawal direction (refer to the arrow on the left side in FIG. 14) of the maintenance target device (here, the test head 44) and the transport direction (the right side arrow in FIG. 14) of the transported object (wafer W or probe card PC). Since the reference is straight in the Y-axis direction, it is possible to suppress (or eliminate) the Abbe error which must be taken into consideration when positioning the test head 44 with respect to the pogo frame 46 which requires high accuracy. . In particular, when the test head 44 whose maintenance has been completed is returned to the pogo pin connection position P3, it is possible to suppress a decrease in positioning accuracy in the X-axis direction.

<Example of pogo frame withdrawal operation>
Next, an operation example in the case where the pogo frame 46 is pulled out to the maintenance area A2 side will be described.

  First, as shown in FIG. 12A, the test head elevating mechanism 48 raises the test head holding mechanism (base 56) from the pogo pin connection position P3 to the test head pulling out position P4. As a result, the test head 44 moves to the test head pulling out position P4 together with the test head guide rail 58 fixed to the base 56 in the locked state by the lock mechanism. Thereby, the ascending space S of the pogo frame 46 is secured.

  Next, as shown in FIG. 13A, the pogo frame lifting mechanism 52 lifts the pogo frame holding mechanism (base 62) from the probe connection position P5 to the pogo frame pulling out position P6. As a result, the pogo frame 46 moves to the pogo frame pulling out position P6 together with the pogo frame guide rail 64 fixed to the base 62 in the locked state by the lock mechanism.

  Next, the operator releases the lock by the lock mechanism, and then pulls the pogo frame 46 raised to the pogo frame pulling out position P6 toward the front. As a result, as shown in FIG. 13B, the pogo frame 46 slides along the pogo frame guide rail 64 in the Y-axis direction and is pulled out to the maintenance area A2 through the opening 14b. Thereby, maintenance of the pogo frame 46 (for example, pogo pin replacement etc.) becomes possible. The arrow on the left side in FIG. 14 represents the pulling-out direction (and the pushing-in direction) of the device to be maintained (here, the pogo frame 46).

  Next, an operation example in which the pogo frame 46 whose maintenance has been completed is returned to the probe connection position P5 will be described.

  First, the operator pushes the pogo frame 46 whose maintenance has been completed along the pogo frame guide rails 64 to slide it in the Y-axis direction to the pogo frame pullout position P6, and performs locking by the lock mechanism at that position. .

  Next, the pogo frame elevating mechanism 52 lowers the pogo frame holding mechanism (base 62) from the pogo frame pulling out position P6 to the probe connection position P5. As a result, the pogo frame 46 is moved to the probe connection position P5 together with the pogo frame guide rail 64 fixed to the base 62 in the locked state by the lock mechanism. At that time, as shown in FIG. 12A, the pogo frame 46 is disposed above the head stage 20, that is, at the probe connection position P5, with the pogo frame positioning mechanism 66 positioned relative to the head stage 20. Be done. Thereby, since the pogo pin 46b of the pogo frame 46 and the alignment of the probe of the probe card are implemented, both can be electrically connected accurately.

  As described above, the pull-out direction (refer to the arrow on the left side in FIG. 14) of the maintenance target device (here, the pogo frame 46) and the transfer direction (arrow on the right side in FIG. 143) of the transported object (wafer W or probe card PC). Since the reference is straight in the Y-axis direction, it is possible to suppress (or eliminate) the Abbe error that must be taken into consideration when positioning the pogo frame 46 with respect to the head stage 20 where high accuracy is required. . In particular, when the pogo frame 46 whose maintenance has been completed is returned to the probe connection position P5, it is possible to suppress a decrease in positioning accuracy in the X-axis direction.

  Further, in the prior art, since the pogo frame is pulled out without raising the pogo frame, the probe card has to be taken out of the measuring unit (cell) before the pogo frame is pulled out. In this embodiment, after the pogo frame 46 is lifted to the pogo frame pulling out position P6 and separated from the probe card, the pogo frame 46 lifted up to the pogo frame pulling out position P6 is pulled out, so the probe card The pogo frame 46 can be pulled out without carrying out the PC from the measuring unit 14.

<Wafer chuck temperature measurement method>
Next, an operation example in the case of measuring the temperature of the wafer chuck 18 will be described.

  First, the pogo frame 46 is pulled out to the maintenance area A2 side according to the procedure of the above pogo frame pulling out operation example, and this is replaced with the dedicated pogo frame 70. Specifically, the pogo frame 46 pulled out to the maintenance area A2 side is removed from the pogo frame guide rail 64, and the dedicated pogo frame 70 is attached to the pogo frame guide rail 64. Then, the dedicated pogo frame 70 is returned to the probe connection position P5 according to the procedure of the pogo frame pushing operation example. The pogo frame replacement holding mechanism (pogo frame holding mechanism, pogo frame lifting mechanism 52, pogo frame pullout mechanism 54) has the same or substantially the same position as the pogo frame 46 before replacement (probe connection position). P5) Hold in the same or substantially the same posture.

  Next, the probe card type temperature sensor 68 is transported into the measurement unit 14 where the temperature measurement of the wafer chuck 18 is performed by the transport unit 16 according to the procedure of the probe card transport operation example, and the alignment device 38 performs the first probe It is transported to the card holding mechanism 36 and held by the first probe card holding mechanism 36. The first probe card holding mechanism 36 holds the probe card type temperature sensor 68 after replacement at the same or substantially the same position as the probe card PC before replacement in the same or substantially the same posture. The probe card type temperature sensor 68 is held in a state where each pin type temperature sensor 68 b is in electrical contact with a plurality of pogo blocks 70 b (pogo pins) of the dedicated pogo frame 70.

  Next, the wafer chuck 18 is moved mainly in the Z-axis direction by the alignment device 38 to form a sealed space SS between the probe card type temperature sensor 68 and the wafer chuck 18. Then, by operating the decompression unit 76, the enclosed space SS is put into a vacuum state. As a result, the wafer chuck 18 is pulled toward the probe card type temperature sensor 68, and the plurality of pin type temperature sensors 68b of the probe card type temperature sensor 68 abut on the upper surface of the wafer chuck 18 to start temperature measurement. It becomes. At this time, the post pins 68c contact the upper surface of the wafer chuck 18 to receive a load, and the pin temperature sensors 68b in contact with the upper surface of the wafer chuck 18 bend. Thereby, the contact pressure of each pin type temperature sensor 68 b is controlled to be constant or substantially constant. As a result, the contact state between each pin-type temperature sensor 68 b and the upper surface of the wafer chuck 18 becomes constant or substantially constant, and the temperature of the wafer chuck 18 can be measured with high accuracy. In other words, when the pin-type temperature sensors 68b abut on the upper surface of the wafer chuck 18, parallel accuracy is maintained by the action of the post pins 68c. Then, when each pin type temperature sensor 68 b abuts on the upper surface of the wafer chuck 18, the load can be uniformly transmitted to each pin type temperature sensor 68 b because each post pin 68 c receives the load of the contact. Thereby, the influence on the temperature measurement by each pin type temperature sensor 68b is suppressed. As a result, the temperature of the wafer chuck 18 can be measured accurately.

  Further, each pin-type temperature sensor 68b has its spherical lower end 68b3 in contact with the upper surface of the wafer chuck 18 in a form close to a point contact, so the contact thermal resistance is reduced compared to the case of contact in a form close to surface contact. Be done. As a result, the contact state between each pin-type temperature sensor 68 b and the upper surface of the wafer chuck 18 becomes constant or substantially constant, and the temperature of the wafer chuck 18 can be measured with high accuracy.

  Information representing the temperature measured by each pin-type temperature sensor 68 b is transmitted via the plurality of pogo blocks 70 b (pogo pins) of the dedicated pogo frame 70 and recorded in the detector 72. Then, the temperature of the wafer chuck 18 is adjusted (calibrated) based on the recorded contents of the detector 72.

  As described above, according to the present embodiment, it is possible to provide a probe card type temperature sensor which can control the contact pressure of the plurality of temperature sensors with respect to the upper surface of the wafer chuck constant or substantially constant.

  This is because, as a result of using a plurality of pin type temperature sensors 68b as a plurality of temperature sensors, each pin type temperature sensor 68b in contact with the upper surface of the wafer chuck 18 is similar (in the thickness direction of the probe card type temperature sensor 68). It is due to bending in form.

  Further, each post pin 68c abuts on the upper surface of the wafer chuck 18 to receive a load, whereby the probe card type temperature sensor 68 and the upper surface of the wafer chuck 18 are maintained parallel or substantially parallel. This also makes it possible to control the contact pressure of each of the plurality of temperature sensors on the top surface of the wafer chuck constant or substantially constant. Each post pin 68c may be omitted as appropriate.

  As described above, the contact pressure of each of the plurality of temperature sensors on the upper surface of the wafer chuck is controlled to be constant or substantially constant. As a result, the contact state between each pin type temperature sensor 68b and the upper surface of wafer chuck 18 is constant or substantially constant. The temperature becomes constant, and the temperature of the wafer chuck 18 can be measured accurately.

  Further, according to the present embodiment, it is possible to provide the prober 10 and the wafer chuck temperature measurement method capable of measuring the upper surface temperature of the wafer chuck 18 under the same or substantially the same environment as the original inspection.

  First, the probe card PC and the probe card type temperature sensor 68 are held by the first probe card holding mechanism 36 at the same or substantially the same position in the same or substantially the same posture. The inspection and the measurement of the upper surface (surface) temperature of the wafer chuck 18 are all performed in an environment where the enclosed space SS is in a vacuum state.

  Further, according to the present embodiment, the measurement of the upper surface temperature of the wafer chuck 18 is performed under an environment where the sealed space SS formed between the probe card type temperature sensor 68 and the wafer chuck 18 is in a vacuum state. The measurement of the upper surface temperature of the wafer chuck 18 can be carried out accurately without being affected by the thermal convection.

  Next, a modification is described.

  Although the example which comprises pin type temperature sensor 68b with temperature sensor 68b2 accommodated in metal protection pipe 68b1 and metal protection pipe 68b1 was illustrated in this embodiment, it is not restricted to this, for example, pin type temperature sensor 68b is a lower end portion (or other than the metallic protective tube 68b1 (or a hollow or solid pin-like member corresponding thereto) and the metallic protective tube 68b1 (or a hollow or solid pin-like member corresponding thereto) Of the temperature sensor 68 b 2 attached to the In this case, various temperature sensors such as a plurality of temperature sensors disclosed in JP-A-2006-294873 can be used as the temperature sensor 68b2, for example.

  Although the configuration using the dedicated pogo frame 70 and the detectors 72 electrically connected to the plurality of pogo blocks 70 b (pogo pins) of the dedicated pogo frame 70 has been illustrated in the present embodiment, the present invention is not limited thereto. Using transmission means for wirelessly transmitting information representing the temperature of the wafer chuck 18 measured by the temperature sensor 68b, and receiving means for receiving information representing the temperature of the wafer chuck 18 wirelessly transmitted by the transmission means, the reception means The detector 72 may be configured to record information representative of the temperature of the wafer chuck 18 received by the sensor 72. In this way, the dedicated pogo frame 70 can be omitted. The transmitting means may be provided on the pin type temperature sensor 68 b and the receiving means may be provided on the detector 72.

  Further, in the present embodiment, although a configuration in which the probe card type temperature sensor 68 is not provided in the dedicated pogo frame 70 has been illustrated, the present invention is not limited to this, the probe card type temperature sensor 68 is provided in the dedicated pogo frame 70 The pogo frame 46 may be replaced with a dedicated pogo frame 70 (for example, fixed) provided with a probe card type temperature sensor 68 by a pogo frame replacement holding mechanism after removing the probe card PC. In this case, the pogo frame replacement holding mechanism holds the dedicated pogo frame 70 after replacement in the same or substantially the same position as the pogo frame 46 before replacement in the same or substantially the same posture. Further, the probe card type temperature sensor 68 is held in the same or substantially the same position as the probe card PC before removal in the same or substantially the same posture. In this way, the transfer of the probe card type temperature sensor 68 by the transfer unit 16 can be omitted, so the temperature of the wafer chuck 18 is immediately changed after replacing with the dedicated pogo frame 70 provided with the probe card type temperature sensor 68. Measurement can be started.

  Further, in the present embodiment, the sealing mechanism (ring seal member 74) is used to operate the pressure reducing means 76 so that the sealed space SS formed between the probe card type temperature sensor 68 and the wafer chuck 18 is evacuated. In this example, the wafer chuck 18 is pulled toward the probe card type temperature sensor 68, and the plurality of pin type temperature sensors 68b of the probe card type temperature sensor 68 are brought into contact with the upper surface of the wafer chuck 18 The sealing mechanism (ring seal member 74) and the pressure reducing means 76 are omitted, and the plurality of pins of the probe card type temperature sensor 68 are raised by raising the alignment device 38 holding the wafer chuck 18 in the Z axis direction. The mold temperature sensor 68 b may be in contact with the upper surface of the wafer chuck 18.

  Moreover, although the example which used the pin-type temperature sensor 68b was illustrated in this embodiment, not only this but the temperature sensor of various shapes, such as a sheet form, a box shape, spherical shape, can be used.

  Further, in the present embodiment, an example in which the temperature of the upper surface of the wafer chuck 18 is measured by bringing the plurality of pin type temperature sensors 68 b of the probe card type temperature sensor 68 into contact with the upper surface of the wafer chuck 18 has been described. Not limited to this, for example, the temperature of the wafer itself may be measured by bringing a plurality of pin type temperature sensors 68b of the probe card type temperature sensor 68 into contact with the upper surface of the wafer held by the wafer chuck 18. it can.

  Further, in the present embodiment, the pogo frame lifting mechanism 52 is used to extract the pogo frame 46 in a raised state. However, the present invention is not limited to this, and the pogo frame lifting mechanism 52 may be omitted. In other words, the pogo frame 46 may be drawn out without raising the pogo frame 46 using the same pogo frame drawing mechanism as the prior art.

  Further, although the present embodiment exemplifies a configuration in which the arms 16b and 16c of the transport unit 16 move in and out through the opening 16f formed in the housing 16a, the invention is not limited thereto. For example, the housing of the transport unit 16 A similar opening (not shown) is formed on the surface of the side 16a opposite to the side where the opening 16f is formed, and the arms 16b and 16c are separately reciprocated in the horizontal direction to form the opening 16f and the opposite thereof. It may be configured to enter and exit through the side opening. In this way, the transport unit rotation mechanism 28 can be omitted. And although the conveyance unit rotation mechanism 28 is abbreviate | omitted, that is, access to the conveyed product storage part 12 or each measurement part 14 by each arm 16b, 16c is realizable, without rotating the conveyance unit 16. In this case, in addition to the air curtain forming means 42 for forming an air curtain for closing the opening 16f formed in the housing 16a of the transport unit 16, an air curtain for closing the opening formed on the opposite side of the opening 16f is used. By providing the same air curtain forming means to be formed in the transport unit 16, the inside of the housing 16a can be sealed or a substantially sealed space, and the same effect as that of the above embodiment can be obtained.

  Further, in the present embodiment, the configuration in which the respective measurement units 14 are two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) is illustrated, but the present invention is not limited thereto. May be disposed only in a line in the horizontal direction (X-axis direction), or may be disposed only in a line in the vertical direction (Z-axis direction). The second movable body moving mechanism can be omitted by arranging the respective measurement units 14 only in one row in the horizontal direction (X-axis direction). In addition, the first movable body moving mechanism can be omitted by arranging the respective measurement units 14 only in one line in the vertical direction (Z-axis direction).

  Moreover, although the structure which used one conveyance unit 16 and one moving apparatus 22 was illustrated in this embodiment, you may use not only this but several conveyance units 16 and several moving apparatuses 22. FIG. By so doing, the throughput in each measurement unit 14 can be further improved.

  Further, although the configuration using the wafer holding arm 16b and the probe card holding arm 16c is exemplified in the present embodiment, the present invention is not limited to this, and only the probe card holding arm 16c may be used.

  Further, although the configuration in which the arms 16b and 16c are provided in the transport unit 16 is illustrated in the present embodiment, the present invention is not limited to this, the arms 16b and 16c (or the transport object storage unit 12 side and the measurement units 14 side) An arm corresponding to this may be provided. Also by this, it is possible to take out the conveyed product from the conveyed product storage unit 12 or the measurement unit 14 by each arm and store it in the conveyance unit 16 and to take out the conveyed product from the conveyance unit 16 to carry the conveyed product storage unit 12 or It can be delivered to the measuring unit 14.

  Moreover, although the structure which obstruct | occludes the opening 16f formed in the housing | casing 16a with the air curtain was illustrated in this embodiment, it opens at the time of taking-out of a conveyed product, or not only this but the conveyed material The transfer unit 16 may be provided with opening and closing means such as a shutter and a door which are closed during transfer, and the opening and closing means may be configured to open and close the opening 16f. Further, the openings 14a formed in the respective measurement portions 14 may be configured to be closed by the same air curtain, or the openings 14a may be configured to be opened and closed by the same opening and closing means.

  As described above, the concept of controlling the contact pressure of each of the plurality of temperature sensors on the upper surface of the wafer chuck constant or substantially constant by using the probe card type temperature sensor including the plurality of pin type temperature sensors is as follows: Not only the prober of the above embodiment, but any kind of prober provided with a probe card holding mechanism for detachably holding the probe card (for example, JP 2007-294665 A, JP 2000-150596 A, JP 2003 No. JP-A-177158 and JP-A-2008-16676) can be applied.

  As mentioned above, although the prober of the present invention has been described in detail, the present invention is not limited to the above examples, and it goes without saying that various improvements and modifications may be made without departing from the scope of the present invention. is there.

DESCRIPTION OF SYMBOLS 10 ... Prober, 12 ... Transported object storage part, 12a ... Wafer storage part, 12b ... Probe card storage part, 14 ... Measurement part, 14a ... Opening, 16 ... Transport unit, 16a ... Housing | casing, 16b ... Wafer holding arm, 16c ... probe card holding arm, 16d ... environment control means, 16e ... sensor, 16f ... opening, 18 ... wafer chuck, 20 ... head stage, 22 ... moving device, 24 ... first movable body, 26 ... second movable body, 28 ... Transport unit rotating mechanism, 28a ... Drive motor, 30, 32 ... Guide rail, 34 ... Base, 36 ... First probe card holding mechanism, 38 ... Alignment device, 40 ... Second probe card holding mechanism, 40a ... Holding portion, 42: Air curtain forming means, 44: Test head, 46: Pogo frame (first pogo frame), 46a: Pogo frame main body 46b: Pogo pin, 48: test head lifting mechanism, 50: test head pulling mechanism, 52: pogo frame lifting mechanism, 54: pogo frame pulling mechanism, 56: base, 58: test head guide rail, 60: test head positioning mechanism , 60a: positioning pin, 60b: recess, 62: base, 64: pogo frame guide rail, 66: pogo frame positioning mechanism, 66a: positioning pin, 66b: recess, 68: probe card type temperature sensor, 70: pogo frame (Second pogo frame), 72: detector, CH: card holder, PC: probe card, W: wafer

Claims (6)

A probe card type card body disposed above the wafer chuck;
A plurality of pin-type temperature sensors provided on the card body and in contact with the upper surface of the wafer chuck to measure the temperature of the wafer chuck;
Probe card type temperature sensor provided with The card body is formed with a plurality of pin-type temperature sensor through holes penetrating in the thickness direction,
The probe card type temperature sensor according to claim 1, wherein the plurality of pin type temperature sensors are provided on the card body in a state of being inserted into the plurality of pin type temperature sensor through holes.   3. The apparatus according to claim 1, further comprising: a plurality of post pins provided on the card body, the plurality of post-type temperature sensors being in contact with the upper surface of the wafer chuck and receiving the load in contact with the upper surface of the wafer chuck. Probe card type temperature sensor as described. A plurality of post pin through holes penetrating in the thickness direction are formed in the card body,
The probe card type temperature sensor according to claim 3, wherein the plurality of post pins are provided on the card body in a state of being inserted into the plurality of post pin through holes.   The plurality of pin type temperature sensors according to any one of claims 1 to 4, each of which includes a metal protection tube in contact with the upper surface of the wafer chuck and a temperature sensor housed in the metal protection tube. Probe card type temperature sensor.   The probe card type temperature sensor according to any one of claims 1 to 5, wherein each of the plurality of pin type temperature sensors includes a spherically shaped portion abutting on the upper surface of the wafer chuck.

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