JP4905290B2 - Temperature measuring device for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus equipped with the same - Google Patents

Description

  The present invention relates to a temperature measuring device mounted on a semiconductor manufacturing apparatus, and more particularly to a temperature measuring apparatus used as a standard for measuring the temperature of a temperature measuring object such as a susceptor mounted in the apparatus, and a semiconductor manufacturing apparatus using the same. Is.

  In a semiconductor manufacturing apparatus, for example, various processes such as film formation and etching are performed while holding and heating a wafer on a susceptor. At that time, since various gases for film formation, ashing, etching, cleaning, etc. are used, these gases are introduced after exhausting the atmosphere in the chamber. Therefore, it is necessary to accurately measure the temperature of the susceptor or the like holding the wafer.

  Conventionally, in a semiconductor manufacturing process, in order to control the temperature of an object to be heated such as a wafer, a temperature measuring device including a sheath type thermocouple attached to a chamber of a semiconductor manufacturing apparatus has been used. In a conventional general temperature measuring device, for example, as shown in FIG. 1, the tip 1a of a thermocouple 1 is brought into contact with a heated body 2 such as a susceptor on which a wafer or the like is placed, and a chamber 1 In order to ensure airtightness between the two, an airtight structure in which an O-ring 4 is arranged on the sheath portion 1b is provided.

  However, the temperature measurement in the chamber of the semiconductor manufacturing apparatus is affected by the heat transfer caused by the gas around the temperature measurement element due to pressure fluctuations caused by the reaction gas being charged or exhausted. Due to the difference in expansion coefficient from the sheath material of the temperature device, the contact environment of the temperature measuring unit is subject to change, making accurate temperature measurement difficult. Further, since the temperature control of the susceptor and the like is controlled based on the temperature of the thermocouple, the temperature measurement error of the thermocouple may cause abnormal heat generation and possibly cause the susceptor or the like to be damaged.

  Moreover, in recent years, as the diameter of the wafer becomes larger, temperature control of the wafer heating surface of the susceptor has been strictly demanded in order to improve the yield of products manufactured by the semiconductor manufacturing apparatus. For this purpose, it is necessary to uniformly and accurately control the temperature of the wafer heating surface, and the temperature measurement accuracy of the temperature measuring device that controls the output of the resistance heating element of the susceptor has become important.

  Therefore, as a measure for improving the temperature measurement accuracy of the temperature measuring device, for example, in JP-A-4-84722, the thermocouple tip sheath portion is glass-bonded to a susceptor, so that the response speed and temperature measurement of the temperature measuring device are measured. Methods for improving accuracy have been proposed. Japanese Patent Application Laid-Open No. 2004-132702 proposes a measure for forming a screw at the tip of a thermocouple element and for reliably pressing the thermocouple element against the temperature-measured body by screwing in order to improve temperature measurement accuracy.

  However, in the temperature measuring device described in Japanese Patent Laid-Open No. 4-84722, the sheath tip at the tip of the thermocouple is bonded and fixed by the temperature sensing element (susceptor) and glass, so that the temperature measuring element or the sheath thermocouple itself When the battery is damaged, or when a failure or the like occurs due to long-term use, it is necessary to replace all parts such as the susceptor to which the thermocouple is joined. There was a problem to say.

  Moreover, in the temperature measuring device described in the above Japanese Patent Application Laid-Open No. 2004-132702, as shown in FIG. 2, for example, an airtight structure by an O-ring 4 is used to ensure airtightness between the thermocouple 1 and the chamber wall 3. In addition, the tip 1a of the thermocouple 1 is fixed to the temperature-measuring body 2 with a screw. However, if the temperature-measuring body 2 is a brittle material such as ceramics, the screw tends to be loosened. There was a problem with the measurement accuracy of temperature and temperature

JP-A-4-84722 JP 2004-132702 A

  In view of such a conventional situation, the present invention can be easily replaced even if a thermocouple is broken or deteriorated, and the measurement is performed by ensuring that the contact with the temperature-measured body is reliable and stable. An object of the present invention is to provide a highly reliable temperature measuring device and a semiconductor manufacturing apparatus equipped with the temperature measuring device, which can increase the accuracy of temperature and shorten the time required to reach a stable state.

  In order to achieve the above object, a temperature measuring device for a semiconductor manufacturing apparatus provided by the present invention includes a sheathed thermocouple attached to a chamber of the semiconductor manufacturing apparatus, and the sheathed thermocouple is vacuumed from outside the atmospheric environment. Or it has a sealing structure with respect to the inside of the chamber of pressure reduction environment, and has the pressing structure which presses the front-end | tip part of a thermocouple reliably to a to-be-measured part using the spring property of a bellows.

That is, a temperature measuring device for a semiconductor manufacturing apparatus according to the present invention includes a sheath-type thermocouple to be mounted in a chamber of the semiconductor manufacturing apparatus, and a spring for pressing the tip of the sheath-type thermocouple against a temperature-measured body in the chamber. The bellows is installed on the outside of the chamber and has flange portions at both ends, and the flange portion has a flange portion opposite to the distal end side of the sheathed thermocouple. with the rear end flange portion is hermetically connected to the sheath-type thermocouple, the tip flange of the front end portion is provided with a chamber fixed member, the chamber fixing member is formed on the tip portion of the chamber stationary member has been provided a fixing flange with a plurality of screws are mechanically fixed to the chamber wall by fixing to the chamber walls, and distribution of the O-ring between the chamber stationary member and the chamber wall And it is characterized in hermetically sealed to Rukoto between the chamber stationary member and the chamber walls by. In the temperature measuring device for a semiconductor manufacturing apparatus according to the present invention, the chamber fixing member is provided with a ring-shaped metal fitting on the outer periphery of a pipe portion of the chamber fixing member, and the male screw provided on the ring-shaped metal fitting is connected to the chamber wall. It is mechanically fixed to the chamber wall by being screwed into a female screw formed on the portion, and the flange-like portion formed at the tip of the chamber fixing member is pressed by the ring-shaped metal fitting during the screwing. Therefore, an O-ring disposed between the flange-like portion and the chamber wall portion is tightly sealed to the flange-like portion and the chamber wall portion, thereby hermetically sealing between the chamber fixing member and the chamber wall portion. Good. Furthermore, in the temperature measuring device for a semiconductor manufacturing apparatus according to the present invention, the chamber fixing member is engaged with the chamber wall portion by screwing a male screw provided on the chamber fixing member with a female screw formed on the chamber wall portion. A taper surface that is mechanically fixed and that is formed at the tip of the chamber fixing member is pressure-bonded to a taper surface that is formed at the bottom of the chamber wall portion so that the space between the chamber fixing member and the chamber wall portion is It may be hermetically sealed.

  The temperature measuring device for semiconductor manufacturing apparatus provided by the present invention protects at least the bellows of the thermocouple against an external force, and further ensures the high reliability by preventing the deformation of the sheath portion. Further, a protective plate and / or a cylindrical protective cover for protecting at least the bellows of the sheath type thermocouple can be provided.

  According to the present invention, even if the deformation of the thermocouple sheath due to changes over time and the length change due to the difference in expansion coefficient between the chamber constituent material and the thermocouple sheath material occur, they are compensated by the spring property of the bellows. Therefore, highly accurate and always stable temperature measurement is possible. Further, since the thermocouple can be detached, it can be easily replaced even if it is damaged. Furthermore, since the heat from the temperature measurement part of the temperature measurement object is easily transmitted to the temperature measurement contact of the thermocouple, the time until the measurement temperature is stabilized can be shortened.

  Further, by providing a protective cover and a protective plate, at least the bellows of the thermocouple, preferably the sheath portion, can be protected from external stress. Therefore, for example, when a tensile stress is applied to the thermocouple compensating lead wire due to carelessness during maintenance of the device, or when stress is applied due to vibration of the device, etc., the bellows and sheath of the thermocouple are deformed. Can be prevented from being damaged or damaged.

  Therefore, by mounting the temperature measuring device of the present invention, it is easy to replace the sheath type thermocouple, and at the same time, while maintaining excellent thermal uniformity, temperature is measured in a short time to control the output of the resistance heating element. A semiconductor manufacturing apparatus capable of maintaining an accurate temperature can be provided.

  A temperature measuring device for a semiconductor manufacturing apparatus of the present invention includes a sheath type thermocouple to be mounted in a chamber of a semiconductor manufacturing apparatus, and has a sealing structure between the sheath type thermocouple and a chamber wall, and a sheath type thermocouple. By using the spring property of the bellows provided in the pair, a pressing structure is provided that always presses the distal end portion having the temperature measuring contact of the sheath type thermocouple against the measured portion of the temperature measuring body with a predetermined pressure.

  Therefore, airtightness can be ensured with respect to the chamber, and the tip of the thermocouple can always be pressed against the temperature-measuring body at a predetermined pressure, so that accurate temperature measurement is possible. In addition, the temperature and temperature of the object to be measured can be absorbed using the spring property of the bellows because of changes in length and thickness due to differences in the coefficient of thermal expansion of each component, making the tip of the thermocouple flexible. Thus, the temperature can be measured in a state where the temperature object is always pressed with a predetermined pressure.

  The temperature measuring device of the present invention will be specifically described with reference to FIG. 3 showing a state in which the temperature measuring device is mounted on a semiconductor manufacturing apparatus equipped with a temperature-measured body. In the sheath type thermocouple 1 of the temperature measuring device, the sheath portion 1b is inserted into the chamber from the atmospheric environment outside the chamber, and the tip portion 1a comes into contact with the temperature measuring portion of the temperature measuring body 2 to be measured. Measure the temperature of 2. Usually, a hole having a depth of about 10 mm is provided in the temperature-measured body 2, and the tip portion 1a of the thermocouple 1 is inserted into this hole and brought into contact with the bottom of the hole.

  This sheath type thermocouple 1 is provided with a bellows 5 having a spring property. The bellows 5 has flange portions 6 a and 6 b through which the sheath portion 1 b can be inserted at both ends, and the rear end flange portion 6 b opposite to the distal end portion side of the sheath type thermocouple 1 is connected to the sheath portion 1 b of the sheath type thermocouple 1. It is airtightly connected by welding or brazing. On the other hand, a distal end flange portion 6a on the distal end side of the sheath-type thermocouple 1 is provided with a chamber fixing member 7, which is mechanically fixed to the chamber wall portion 2 using screws or the like and O The ring 4 is hermetically sealed. The chamber fixing member 7 and the chamber wall 3 have a through hole larger than the diameter of the sheath portion 1b of the thermocouple 1, and the sheath portion 1b can be slid in the same time.

  At the contact portion between the sheath-type thermocouple 1 and the temperature object 2, the tip 1 a of the thermocouple 1 is always pressed against the temperature object 2 with a stable pressure by the spring pressure of the bellows 5. . Further, since the bellows 5 of the sheath type thermocouple 1 is installed outside the chamber, the atmospheric pressure presses the lower portion of the bellows 5 by reducing the pressure in the chamber or evacuating the chamber. The pressure pressing on the body 2 increases.

  Due to the pressing structure between the sheath-type thermocouple and the temperature-measured body, the sheath portion of the thermocouple is distorted due to changes over time, or the length depends on the expansion coefficient difference between the material constituting the chamber and the sheath material of the thermocouple. Even if this change occurs, the bellows having a spring property can be absorbed and compensated. Therefore, the temperature measuring device of the present invention can perform temperature measurement with high accuracy, and at the same time, can stably measure temperature even with respect to temperature changes in the chamber.

  As a specific example of the sealing structure of the sheath type thermocouple and the chamber, as shown in FIGS. 3 and 4, the chamber fixing member 7 joined to the distal end flange portion 6a is attached to the chamber wall portion 2 by a plurality of screws or the like. Airtightness is maintained by an O-ring 4 that is mechanically fixed and disposed between the chamber fixing member 7 and the chamber wall 2. Further, the rear end flange portion 6b joined to the bellows 5 is airtightly joined to the sheath portion 1b of the thermocouple 1 by welding or brazing. The structure of the rear end flange portion 6b is the same in all sealing structures described later, including the cases shown in FIGS.

  As another sealing structure, a male screw provided on the chamber fixing member is screwed into a female screw formed on the chamber wall portion, and an O-ring is disposed between the chamber fixing member and the chamber wall portion. Can do. This sealing structure has an advantage that it can be mounted within the range of the outer diameter of the bellows even when space is required.

  Specifically, for example, as shown in FIG. 5, a male screw is provided on the ring-shaped metal fitting 8 arranged on the outer periphery of the pipe portion of the chamber fixing member 7 and is screwed with the female screw of the chamber wall 3. The chamber fixing member 7 has a flange-like portion at the tip, and is fixed to the chamber wall 3 by the ring-shaped metal fitting 8 being pushed when the flange-like portion is screwed. At this time, the O-ring 4 is disposed between the bottom of the female screw hole of the chamber wall 3 and the flange-shaped portion of the chamber fixing member 7 and is brought into close contact with the pressure of screwing to ensure airtightness in the chamber.

  As another sealing structure, a male screw provided on the chamber fixing member is screwed into a female screw formed on the chamber wall portion, and a tapered surface formed on the tip portion of the chamber fixing member is formed on the chamber wall portion. It is possible to seal between the chamber fixing member and the chamber wall by pressure-bonding to a tapered surface formed at the bottom. Since this sealing structure does not require the use of an O-ring, it is suitable when the temperature of the chamber rises above the heat resistance temperature of the O-ring.

  Specifically, for example, as shown in FIG. 6, a mounting hole is provided in the chamber wall 3, a female screw is processed on the side surface, and a tapered surface inclined at a predetermined angle is formed at the bottom of the mounting hole. In addition, a tapered surface that is inclined at the same angle as the above is also formed at the tip of the chamber fixing member 7. Then, the ring-shaped metal fitting 8 provided with an external thread on the outer peripheral surface is arranged on the outer circumference of the chamber fixing member 7, and the ring-shaped metal fitting 8 is screwed into the mounting hole of the chamber wall 3, thereby The tapered surface on the chamber fixing member 7 side is in close contact with each other to ensure airtightness.

  In the temperature measuring device of the present invention, the sheath-type thermocouple and the chamber wall are fixed by screwing, so that they can be easily attached and detached. Therefore, when the sheath type thermocouple is deteriorated, broken or broken, it can be easily removed and replaced, and the loss of repair time can be reduced, so that the throughput is hardly lowered. In addition, since only the sheath type thermocouple can be replaced, it is not necessary to replace the entire temperature-measured body such as the susceptor.

  Also, in conventional temperature measuring devices, when external force is applied to the thermocouple, for example carelessness during maintenance of the device, wires such as thermocouple compensating lead wires are pulled, or stress is applied due to vibration of the device, etc. Often, the sheath portion was curved or bent. For example, there are many thermocouple terminals, connectors, electrode parts, vacuum exhaust valves, gas inlets, and lift lift machinery in the lower part of the chamber. In many cases, the sheath and the sheath were bent. When it was actually estimated from the degree of deformation of the sheath portion of the thermocouple, it was found that a lateral force of about 3 to 5N was applied.

  Therefore, in the temperature measuring device of the present invention, at least the bellows portion, preferably the entire sheath portion, can be protected by attaching a protective plate or a protective cover to a portion existing outside the chamber of the sheath type thermocouple.

  For example, as shown in FIG. 7, a protective plate 9 having a hole through which the sheath portion 1b is inserted is arranged in a direction perpendicular to the sheath portion 1b of the sheath type thermocouple 1 and at least at a position on the rear end side from the bellows 5. The protective plate 9 is fixed to the chamber wall 3 with a plurality of support columns 10 or long screws. The entire sheath portion of the sheathed thermocouple 1 can be protected by extending the protection cylinder portion 11 to the rear end side of the protection plate 9.

  Further, for example, as shown in FIG. 8, the protective plate 9 is positioned in a direction perpendicular to the sheath portion 1b of the sheath-type thermocouple 1 and at least on the rear end side from the bellows 5, as shown in FIG. A cylindrical protective cover 12 that houses at least the bellows 5 of the sheath type thermocouple 1 is fixed with a plurality of screws. Then, the upper end of the protective cover 12 is fixed to the chamber wall 3 or the chamber fixing member 7 fixed to the chamber wall 3 with a plurality of screws.

  Further, as shown in FIG. 9, a cylindrical protective cover 13 that houses at least the bellows 5 of the sheath type thermocouple 1 is provided, and the female screw formed on the upper end side of the protective cover 13 is connected to the chamber wall 3 or the chamber. It fixes by screwing in the external thread formed in the chamber fixing member 7 currently fixed to the wall part 3. FIG. In FIG. 9, a male screw is provided on the ring-shaped metal fitting 8 disposed on the outer periphery of the chamber fixing member 7, and the female screw of the protective cover 13 is screwed into the male screw.

  According to the temperature measuring device of the present invention, it becomes possible to constantly apply a constant pressure to the contact portion between a thermocouple and a temperature-measured body such as a susceptor, thereby improving temperature measurement response and measurement accuracy. Can be achieved. By controlling the output to the resistance heating element based on this excellent temperature measurement, the temperature control of the temperature measuring object can be stabilized. Further, by mounting the temperature measuring device according to the present invention, it is possible to provide a semiconductor manufacturing apparatus with high temperature measurement accuracy and excellent throughput and yield.

[Example 1]
To 100 parts by weight of aluminum nitride (AlN) powder, 0.5 part by weight of yttria (Y ₂ O ₃ ) is added as a sintering aid, and a predetermined amount of an organic binder for extrusion is added, followed by mixing by a ball mill mixing method. And granulated with a spray dryer. Two pieces of the obtained granulated powder were molded by a uniaxial molding press so that the size after sintering was a disk shape having a diameter of 350 mm and a thickness of 20 mm. The two disc shaped compacts were degreased in a nitrogen atmosphere at a temperature of 900 ° C., and further sintered in a nitrogen atmosphere at a temperature of 1900 ° C. for 5 hours. The heat conduction of the obtained AlN sintered body was 170 W / mK.

After the resistance heating element circuit is printed on the surface of one disc-like AlN sintered body using a slurry obtained by adding and kneading a sintering aid and an ethylcellulose binder to W powder and degreasing in a nitrogen atmosphere at 900 ° C. And baked at 1850 ° C. for 1 hour. On another disk-shaped AlN sintered body, a slurry obtained by adding and kneading an ethylcellulose binder to glass for bonding was applied and degreased in a nitrogen atmosphere at 900 ° C. The two AlN sintered body bonding glass surfaces and the resistance heating element surfaces are overlapped and heated at 1800 ° C. for 2 hours in a state where a load of 5 kg / cm ² is applied, thereby generating resistance heating inside. A ceramic heater with an embedded body was fabricated.

A W electrode terminal connected to the resistance heating element was joined to the opposite side (back side) of the heating surface of the ceramic heater, and a lead wire for power supply was connected to connect to a power supply outside the system. These electrode terminals and lead wires are housed in a cylindrical member made of a mullite sintered body having a thermal conductivity of 1 W / mK, and then a B-Si glass for bonding is applied to one end face thereof to form a ceramic heater. In a state where a load of 50 g / cm ² was applied, bonding was performed by heating at 800 ° C. for 1 hour. The obtained AlN ceramic heater was processed to be installed in the chamber to obtain a temperature-measuring body capable of generating heat.

  Moreover, the sheath type | mold thermocouple provided with the bellows which have a spring property between two flange parts was prepared as a sheath type | mold thermocouple used for a temperature measuring device. A hole larger than the sheath diameter was formed in the temperature-measured body in order to insert the distal end portion of the sheath type thermocouple into the diameter of 50 mm from the center. On the other hand, in order to attach the chamber fixing member of the sheath type thermocouple to the chamber wall, four counterbores with a diameter of 3.4 mm and a depth of 10 mm are provided, or one M8 tapped hole with a depth of 10 mm is processed. .

  First, the chamber fixing member 7 joined to the distal end flange portion 6a of the sheath type thermocouple was connected to the chamber wall portion 3 with the O-ring 4 sandwiched by four screws so as to have the sealing structure of FIG. . Further, the ring-shaped metal fitting 8 disposed on the outer periphery of the chamber fixing member 7 was screwed into the counterbore hole of the chamber wall 3 so as to have the sealing structure of FIGS. 5 and 6. In the sealing structure of FIG. 5, the O-ring 4 is used, and in the sealing structure of FIG. 6, the chamber fixing member 7 and the taper surface of the chamber wall 3 are hermetically sealed.

  In the case of the sealing structure shown in FIGS. 4 to 6, the tip of the sheath-type thermocouple is inserted into the hole of the temperature-measured body and pressed, and further attached so that the spring pressure of the bellows is applied reliably. Each comprised the temperature measuring device by this invention. For comparison, a sealing structure using only a conventional general O-ring shown in FIG. 1 and a sealing structure using tightening with screws as shown in FIG. 2 (see Japanese Patent Application Laid-Open No. 2004-132702). A temperature measuring device was also prepared.

  With respect to the above five types of temperature measuring devices, the temperature-measured body was heated by energizing the resistance heating element, and temperature changes due to heat cycles of 200 ° C. and 500 ° C. were repeated. In this case, the temperature was raised at a rate of 20 ° C./min, and kept at 200 ° C. and 500 ° C. for 30 minutes. Table 1 below shows the results obtained by measuring the temperature of the temperature-measuring body with each temperature-measuring device during each heat cycle at 500 ° C.

  In each temperature measuring device having the sealing structure shown in FIGS. 4 to 6 according to the present invention, no change with time was observed in the temperature measurement data. On the other hand, in the sealing structure using only the conventional general O-ring in FIG. 1 and the sealing structure using the conventional screw tightening in FIG. 2, the measured temperature was displayed gradually from about 50 times.

  The reason why accurate temperature measurement cannot be performed with the sealing structure of FIGS. 1 and 2 can be considered as follows. In the case of FIG. 1, the sheath of the sheath type thermocouple is made of metal such as SUS. Therefore, when the temperature rises, the length of the sheath expands due to the expansion, and the bottom of the hole of the measured temperature body is pushed. The portion that extends without being absorbed can slide at the O-ring sealing portion of the chamber wall. When the temperature is lowered due to the heat cycle, the sheath contracts, and a gap is formed between the temperature measuring unit at the tip and the temperature measuring object, and accurate temperature measurement cannot be performed. Further, when the sheath is expanded by thermal expansion due to temperature rise, the sheath may be bent if the fixing with the O-ring is strong. Further, in FIG. 2, since the screw portion is made of a brittle material, it is assumed that the screw is loosened due to the expansion and contraction due to the heat cycle, and accurate measurement cannot be performed.

[Example 2]
Using the temperature measuring device having the same five types of sealing structure as in Example 1 above, the inside of the chamber was evacuated (10 ⁻³ Pa or less), and the temperature of the temperature measurement object was heated to 500 ° C. In this state, the operation of injecting N ₂ gas into the chamber to an internal pressure of 1 atm and evacuating again to vacuum was repeated 10 times.

  When each gas was introduced and exhausted, the time (average) until the temperature indicated by each temperature measuring device was stabilized was measured. In this case, a disk-shaped block made of a material having a large heat capacity was placed on the wafer heating surface in order to eliminate the temperature change of the temperature-measured body itself. The obtained measurement results are shown in Table 2 below.

  As can be seen from this result, the temperature measuring device of FIGS. 4 to 6 according to the present invention and the temperature measuring device tightened with the screw of FIG. The average) was 2 to 3 seconds, and the reaction rate was faster than that of the conventional temperature measuring device of FIG. 1, and it was proved that it was effective for accurate temperature measurement.

[Example 3]
A temperature measuring device having the same sealing structure as in FIG. 4 or 5 of Example 1 and further including the protective plate and / or the protective ring (both made of SUS304) of FIGS.

  For each temperature measuring device, the sheath of the thermocouple is exposed to the atmosphere side from the chamber wall, and the wire is hooked from the lateral direction to the compensating lead wire connecting portion and pulled in the lateral direction with a force of 5 N. The bending state was confirmed, and the results are shown in Table 3 below. For comparison, a similar experiment was performed on a thermocouple having the same structure as described above except that the protective plate and / or the protective ring were not provided.

  An unprotected rose thermocouple has an extremely deformed sheath at the welded portion of the bellows and sheath, the deformation extends to the sheath inside the bellows, and the bent sheath comes into contact with the flange portion of the bellows so It became a situation that can not convey the pressure of. On the other hand, in the structure equipped with the protective plate and the protective ring shown in FIGS. 7 to 9 according to the present invention, the deformation of the sheath portion of the thermocouple could be minimized as much as possible even when pressure was applied from the outside.

It is a schematic sectional drawing which shows the conventional general temperature measuring apparatus. It is a schematic sectional drawing which shows the conventional temperature measuring apparatus which fixed the front-end | tip part of the thermocouple to the to-be-measured body with the screw. It is a schematic sectional drawing which shows one specific example of the temperature measuring device by this invention. It is general | schematic sectional drawing which shows an example of the sealing structure of the temperature measuring device by this invention. It is general | schematic sectional drawing which shows the other example of the sealing structure of the temperature measuring device by this invention. It is general | schematic sectional drawing which shows another example of the sealing structure of the temperature measuring device by this invention. It is general | schematic sectional drawing which shows an example of the protection structure of the temperature measuring device by this invention. It is general | schematic sectional drawing which shows the other example of the protection structure of the temperature measuring device by this invention. It is general | schematic sectional drawing which shows another example of the protection structure of the temperature measuring device by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thermocouple 1a Tip part 1b Sheath part 2 Temperature measuring object 3 Chamber wall part 4 O-ring 5 Bellows 6a Upper end flange 6b Bearing flange 7 Chamber fixing member 8 Ring-shaped metal fitting 9 Protection plate 10 Prop 11 Protection cylinder part 12, 13 Protection cover

Claims (7)

A temperature measuring device comprising a sheath-type thermocouple to be mounted in a chamber of a semiconductor manufacturing apparatus, and a bellows having a spring property for pressing the tip of the sheath-type thermocouple against a temperature-measured body in the chamber. The bellows is installed outside the chamber and has flange portions at both ends, and the rear end flange portion of the flange portion opposite to the distal end side of the sheath type thermocouple is airtight to the sheath type thermocouple. A chamber fixing member is provided at the distal end flange portion on the distal end side, and the chamber fixing member is formed by fixing the fixing flange portion formed at the distal end portion of the chamber fixing member with a plurality of screws. parts are mechanically fixed to the chamber wall by fixing to, and the chamber fixing member and more the chamber fixing member and the chamber wall to place the O-ring between the chamber wall Semiconductors manufacturing device temperature measuring device you characterized by hermetically sealing between. A temperature measuring device comprising a sheath-type thermocouple to be mounted in a chamber of a semiconductor manufacturing apparatus, and a bellows having a spring property for pressing the tip of the sheath-type thermocouple against a temperature-measured body in the chamber. The bellows is installed outside the chamber and has flange portions at both ends, and the rear end flange portion of the flange portion opposite to the distal end side of the sheath type thermocouple is airtight to the sheath type thermocouple. A chamber fixing member is provided at the tip flange portion on the tip side, and the chamber fixing member is provided with a ring-shaped metal fitting on the outer periphery of the pipe portion of the chamber fixing member. provided is mechanically fixed to the chamber wall by a male screw is screwed into the female screw formed in the chamber wall portions, and flange-like portion formed at the tip portion of the chamber fixing member said By being pushed by the case when the ring-shaped metal fitting, flange-shaped portion and more the chamber fixing member and the chamber wall an O-ring arranged to be in close contact with these flange-shaped portion and the chamber wall between the chamber walls during semi-conductor manufacturing equipment temperature measuring device characterized by hermetically sealing the. A temperature measuring device comprising a sheath-type thermocouple to be mounted in a chamber of a semiconductor manufacturing apparatus, and a bellows having a spring property for pressing the tip of the sheath-type thermocouple against a temperature-measured body in the chamber. The bellows is installed outside the chamber and has flange portions at both ends, and the rear end flange portion of the flange portion opposite to the distal end side of the sheath type thermocouple is airtight to the sheath type thermocouple. A chamber fixing member is provided at the front end flange portion on the front end side, and the chamber fixing member is screwed with a male screw provided on the chamber fixing member to a female screw formed on the chamber wall portion. It is mechanically secured to the chamber wall by, and a tapered surface formed on the tip portion of the chamber fixing member by crimping a tapered surface formed on the bottom of the chamber wall Semiconductors manufacturing device temperature measuring device shall be the features that you airtight seal between the chamber stationary member and the chamber wall. The sheath-type thermocouple has a protective plate disposed at a position perpendicular to the sheath of the sheath-type thermocouple at a position at least on the rear end side of the bellows, and the protective plate has a plurality of columns or long lengths on the chamber wall. characterized in that it is fixed by a screw, the temperature measuring device for a semiconductor manufacturing apparatus according to any of claims 1-3. A protective plate arranged at right angles to the sheath of the sheathed thermocouple; and a cylindrical protective cover that houses at least the bellows of the sheathed thermocouple, and one end of the protective cover is a chamber wall or chamber The measurement for a semiconductor manufacturing apparatus according to any one of claims 1 to 3 , wherein the chamber fixing member fixed to the wall is fixed with a screw, and the other end is fixed to the protective plate with a screw. Temperature device. A cylindrical protective cover for housing at least the bellows of the sheath type thermocouple is provided, and the protective cover is provided on a chamber wall or a chamber fixing member fixed to the chamber wall by a female screw formed on one end side. characterized in that it is fixed screwed to the male screw, the temperature measuring device for a semiconductor manufacturing apparatus according to any of claims 1-3. The semiconductor manufacturing apparatus characterized by a semiconductor manufacturing device for temperature measuring device according to any one of claims 1 to 6 is mounted.

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